[{"citation":{"apa":"Hentze, J., Kaul, T., Gräßler, I., &#38; Sextro, W. (2017). Integrated modeling of behavior and reliability in system development. In A. Maier, S. Skec, C. McKesson, &#38; M. Van der Loos (Eds.), <i>ICED17, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN, Nr. DS 87-USB</i> (pp. 385–394). Vancouver, Kanada, 21. - 25. Aug. 2017: Design Society.","ieee":"J. Hentze, T. Kaul, I. Gräßler, and W. Sextro, “Integrated modeling of behavior and reliability in system development,” in <i>ICED17, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN, Nr. DS 87-USB</i>, Vancouver, Kanada, 21. - 25. Aug. 2017, 2017, pp. 385–394.","chicago":"Hentze, Julian, Thorben Kaul, Iris Gräßler, and Walter Sextro. “Integrated Modeling of Behavior and Reliability in System Development.” In <i>ICED17, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN, Nr. DS 87-USB</i>, edited by Anja Maier, Stanko Skec, Chris McKesson, and Mike Van der Loos, 385–94. Design Society, 2017.","short":"J. Hentze, T. Kaul, I. Gräßler, W. Sextro, in: A. Maier, S. Skec, C. McKesson, M. Van der Loos (Eds.), ICED17, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN, Nr. DS 87-USB, Design Society, 2017, pp. 385–394.","mla":"Hentze, Julian, et al. “Integrated Modeling of Behavior and Reliability in System Development.” <i>ICED17, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN, Nr. DS 87-USB</i>, edited by Anja Maier et al., Design Society, 2017, pp. 385–94.","ama":"Hentze J, Kaul T, Gräßler I, Sextro W. Integrated modeling of behavior and reliability in system development. In: Maier A, Skec S, McKesson C, Van der Loos M, eds. <i>ICED17, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN, Nr. DS 87-USB</i>. Design Society; 2017:385-394.","bibtex":"@inproceedings{Hentze_Kaul_Gräßler_Sextro_2017, title={Integrated modeling of behavior and reliability in system development}, booktitle={ICED17, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN, Nr. DS 87-USB}, publisher={Design Society}, author={Hentze, Julian and Kaul, Thorben and Gräßler, Iris and Sextro, Walter}, editor={Maier, Anja and Skec, Stanko and McKesson, Chris and Van der Loos, MikeEditors}, year={2017}, pages={385–394} }"},"publication":"ICED17, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN, Nr. DS 87-USB","department":[{"_id":"152"}],"type":"conference","date_created":"2021-08-30T09:10:27Z","date_updated":"2022-01-06T06:55:56Z","author":[{"id":"13342","first_name":"Julian","last_name":"Hentze","full_name":"Hentze, Julian"},{"id":"14802","first_name":"Thorben","last_name":"Kaul","full_name":"Kaul, Thorben"},{"full_name":"Gräßler, Iris","orcid":"0000-0001-5765-971X","last_name":"Gräßler","first_name":"Iris","id":"47565"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"}],"conference":{"end_date":"2017-08-25","location":"Vancouver, Kanada, 21. - 25. Aug. 2017","start_date":"2017-08-21"},"status":"public","title":"Integrated modeling of behavior and reliability in system development","year":"2017","editor":[{"last_name":"Maier","first_name":"Anja","full_name":"Maier, Anja"},{"first_name":"Stanko","last_name":"Skec","full_name":"Skec, Stanko"},{"last_name":"McKesson","first_name":"Chris","full_name":"McKesson, Chris"},{"last_name":"Van der Loos","first_name":"Mike","full_name":"Van der Loos, Mike"}],"user_id":"21240","_id":"23560","language":[{"iso":"eng"}],"publisher":"Design Society","page":"385-394"},{"_id":"9969","language":[{"iso":"eng"}],"page":"347-358","user_id":"55222","author":[{"first_name":"Amelie","last_name":"Bender","full_name":"Bender, Amelie","id":"54290"},{"full_name":"Kaul, Thorben","last_name":"Kaul","first_name":"Thorben","id":"14802"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"}],"status":"public","title":"Entwicklung eines Condition Monitoring Systems für Gummi-Metall-Elemente","year":"2017","date_updated":"2019-09-30T08:02:40Z","place":"Wissenschaftsforum Intelligente Technische Systeme (WInTeSys) 2017","date_created":"2019-05-27T09:25:42Z","department":[{"_id":"151"}],"keyword":["Zustandsüberwachung","Condition Monitoring","Prognose","Gummi-Metall-Elemente","Restlebensdauerschätzung"],"type":"conference","citation":{"ama":"Bender A, Kaul T, Sextro W. Entwicklung eines Condition Monitoring Systems für Gummi-Metall-Elemente. In: <i>Verlagsschriftenreihe Des Heinz Nixdorf Instituts Band 369, Paderborn, 2017</i>. Wissenschaftsforum Intelligente Technische Systeme (WInTeSys) 2017; 2017:347-358.","bibtex":"@inproceedings{Bender_Kaul_Sextro_2017, place={Wissenschaftsforum Intelligente Technische Systeme (WInTeSys) 2017}, title={Entwicklung eines Condition Monitoring Systems für Gummi-Metall-Elemente}, booktitle={Verlagsschriftenreihe des Heinz Nixdorf Instituts Band 369, Paderborn, 2017}, author={Bender, Amelie and Kaul, Thorben and Sextro, Walter}, year={2017}, pages={347–358} }","mla":"Bender, Amelie, et al. “Entwicklung Eines Condition Monitoring Systems Für Gummi-Metall-Elemente.” <i>Verlagsschriftenreihe Des Heinz Nixdorf Instituts Band 369, Paderborn, 2017</i>, 2017, pp. 347–58.","short":"A. Bender, T. Kaul, W. Sextro, in: Verlagsschriftenreihe Des Heinz Nixdorf Instituts Band 369, Paderborn, 2017, Wissenschaftsforum Intelligente Technische Systeme (WInTeSys) 2017, 2017, pp. 347–358.","chicago":"Bender, Amelie, Thorben Kaul, and Walter Sextro. “Entwicklung Eines Condition Monitoring Systems Für Gummi-Metall-Elemente.” In <i>Verlagsschriftenreihe Des Heinz Nixdorf Instituts Band 369, Paderborn, 2017</i>, 347–58. Wissenschaftsforum Intelligente Technische Systeme (WInTeSys) 2017, 2017.","apa":"Bender, A., Kaul, T., &#38; Sextro, W. (2017). Entwicklung eines Condition Monitoring Systems für Gummi-Metall-Elemente. In <i>Verlagsschriftenreihe des Heinz Nixdorf Instituts Band 369, Paderborn, 2017</i> (pp. 347–358). Wissenschaftsforum Intelligente Technische Systeme (WInTeSys) 2017.","ieee":"A. Bender, T. Kaul, and W. Sextro, “Entwicklung eines Condition Monitoring Systems für Gummi-Metall-Elemente,” in <i>Verlagsschriftenreihe des Heinz Nixdorf Instituts Band 369, Paderborn, 2017</i>, 2017, pp. 347–358."},"publication":"Verlagsschriftenreihe des Heinz Nixdorf Instituts Band 369, Paderborn, 2017","abstract":[{"text":"Zuverlässigkeit, Sicherheit und Verfügbarkeit gewinnen bei der Anwendung von technischen Systemen eine immer größere Bedeutung. Aus diesem Grund hat sich Condition Monitoring, die Zustandsüberwachung eines technischen Produkts, in verschiedenen Industriebranchen etabliert. Die sensorbasierte Überwachung eines Produkts während seiner Betriebsdauer in Kombination mit Condition Monitoring Methoden ermöglichen die Bestimmung des aktuellen Zustands des Produkts und somit eine Diagnose, ob das Produkt seine ihm zugeschriebene Funktion zum aktuellen Zeitpunkt erfüllt. Neben Diagnosen bietet Condition Monitoring auch die Möglichkeit Prognosen aufzustellen, dabei wird die restliche Nutzungsdauer des Produkts aufbauend auf geeigneten Sensordaten geschätzt. So kann eine intelligente Wartungsplanung umgesetzt werden, die im Gegensatz zu klassischen Ansätzen keine festen Wartungsintervalle benötigt und die Nachteile einer rein reaktiven Wartung kompensiert. Stattdessen ist es möglich ein Element bis vor das Ende seiner Lebensdauer zu nutzen und erst dann zu warten, um eine optimale Nutzung zu gewährleisten. Durch eine Bestimmung der verbleibenden Restlebensdauer während des Betriebs ist eine optimale Wartungsplanung möglich, wodurch die Verfügbarkeit und die Auslastung der überwachten Produkte signifikant gesteigert werden kann. In dieser Arbeit soll ein produktspezifisches Condition Monitoring System für Gummi-Metall-Elemente entwickelt werden. Diese Elemente werden zur Federung, Geräusch- und/oder Schwingungsisolation in vielen verschiedenen Anwendungen eingesetzt, wie bspw. in Nutz- und Schienenfahrzeugen oder Windenergieanlagen. In Industrie und Forschung werden bereits Zustandsüberwachungen von Systemen mit integrierten Gummi-Metall-Elementen eingesetzt, allerdings noch keine Condition Monitoring Systeme zur alleinigen Zustandsüberwachung dieser Elemente. Aktuell ist es üblich die Lebensdauer dieser Elemente aufbauend auf beschleunigten Lebensdauerversuchen und Erfahrungswerten abzuschätzen. Mit dem Ziel die Lebensdauer des fokussierten Produkts präziser vorherzusagen und damit eine intelligente Wartungsplanung zu ermöglichen, wird die Entwicklung eines Condition Monitoring Systems für Gummi-Metall-Elemente angestrebt und in dieser Arbeit erläutert.","lang":"eng"}],"quality_controlled":"1"},{"user_id":"55222","page":"123-125","language":[{"iso":"eng"}],"_id":"9970","date_updated":"2019-05-27T09:29:18Z","status":"public","year":"2017","title":"Modellbasierte Prognose der nutzbaren Restlebensdauer von Gummi-Metall-Elementen","author":[{"id":"54290","last_name":"Bender","first_name":"Amelie","full_name":"Bender, Amelie"},{"full_name":"Kimotho, James Kuria","last_name":"Kimotho","first_name":"James Kuria"},{"first_name":"Sergej","last_name":"Kohl","full_name":"Kohl, Sergej"},{"full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro","id":"21220"},{"full_name":"Reinke, Kai","last_name":"Reinke","first_name":"Kai"}],"type":"conference","department":[{"_id":"151"}],"date_created":"2019-05-27T09:27:19Z","abstract":[{"text":"In vielen verschiedenen Industriezweigen hat sich Condition Monitoring aufgrund seiner finanziellen und sicherheitstechnischen Vorteile bereits etabliert. Um die Verlässlichkeit und die Auslastung zu steigern, sowie um die Lebenszykluskosten zu reduzieren, steigt auch im Schienenfahrzeugbereich die Anzahl an eingesetzten Condition Monitoring Systemen. Studien zu Versagensmodi von Schienenfahrzeugen haben gezeigt, dass Versagensursachen meistens in den Radprofilen oder im Fahrwerk liegen [1]. Wird das Fahrwerk heute mittels Condition Monitoring überwacht, werden hierfür häufig Sensoren an den Wagons angebracht, um bspw. deren Schwingungen zu kontrollieren [2, 3]. In dieser Arbeit liegt der Fokus auf Gummi-Metall-Elementen (GM-Elementen) der Jörn GmbH.; als elastische Lager im Drehgestell sind diese Teil des Fahrwerks eines Schienenfahrzeugs. Mit dem Ziel die Wartungsplanung dieser Elemente zu optimieren, ist untersucht worden, ob diese Elemente einzeln mittels Condition Monitoring überwacht werden können. Die hierfür durchgeführten beschleunigten Lebensdauertests werden im nächsten Abschnitt erläutert. Anschließend werden die modellbasierten Methoden dargestellt, die aufbauend auf den im Versuch aufgezeichneten Daten eine Prognose der nutzbaren Restlebensdauer (RUL, remaining useful lifetime) der GM-Elemente aufstellen. Im letzten Abschnitt folgen eine kurze Zusammenfassung und ein Ausblick.","lang":"eng"}],"publication":"15. Internationale Schienenfahrzeugtagung","citation":{"chicago":"Bender, Amelie, James Kuria Kimotho, Sergej Kohl, Walter Sextro, and Kai Reinke. “Modellbasierte Prognose Der Nutzbaren Restlebensdauer von Gummi-Metall-Elementen.” In <i>15. Internationale Schienenfahrzeugtagung</i>, 123–25, 2017.","short":"A. Bender, J.K. Kimotho, S. Kohl, W. Sextro, K. Reinke, in: 15. Internationale Schienenfahrzeugtagung, 2017, pp. 123–125.","ieee":"A. Bender, J. K. Kimotho, S. Kohl, W. Sextro, and K. Reinke, “Modellbasierte Prognose der nutzbaren Restlebensdauer von Gummi-Metall-Elementen,” in <i>15. Internationale Schienenfahrzeugtagung</i>, 2017, pp. 123–125.","apa":"Bender, A., Kimotho, J. K., Kohl, S., Sextro, W., &#38; Reinke, K. (2017). Modellbasierte Prognose der nutzbaren Restlebensdauer von Gummi-Metall-Elementen. In <i>15. Internationale Schienenfahrzeugtagung</i> (pp. 123–125).","bibtex":"@inproceedings{Bender_Kimotho_Kohl_Sextro_Reinke_2017, title={Modellbasierte Prognose der nutzbaren Restlebensdauer von Gummi-Metall-Elementen}, booktitle={15. Internationale Schienenfahrzeugtagung}, author={Bender, Amelie and Kimotho, James Kuria and Kohl, Sergej and Sextro, Walter and Reinke, Kai}, year={2017}, pages={123–125} }","ama":"Bender A, Kimotho JK, Kohl S, Sextro W, Reinke K. Modellbasierte Prognose der nutzbaren Restlebensdauer von Gummi-Metall-Elementen. In: <i>15. Internationale Schienenfahrzeugtagung</i>. ; 2017:123-125.","mla":"Bender, Amelie, et al. “Modellbasierte Prognose Der Nutzbaren Restlebensdauer von Gummi-Metall-Elementen.” <i>15. Internationale Schienenfahrzeugtagung</i>, 2017, pp. 123–25."}},{"department":[{"_id":"151"}],"type":"conference","date_created":"2019-05-27T09:29:37Z","abstract":[{"text":"In der Windenergieindustrie haben die Größen Zuverlässigkeit, Sicherheit und Verfügbarkeit eine enorme Bedeutung erlangt aufgrund des Trends Windenergieanlagen zur optimalen Windausnutzung an schwer zugänglichen Positionen aufzustellen, wie bspw. Offshore. Dies führt zu erschwerten Wartungsbedingungen und damit zu höheren Kosten. Der Einsatz von Condition Monitoring hat sich in dieser Industrie etabliert, denn diese Technik ermöglicht eine Zustandsdiagnose des überwachten Systems und eine Prognose seiner nutzbaren Restlebensdauer (remaining useful life: RUL), jeweils basierend auf geeigneten Sensordaten. In dieser Arbeit wird ein Konzept für ein produktspezifisches Condition-Monitoring-System für Gummi-Metall-Elemente (GM-Elemente) vorgestellt, welches den Schwerpunkt auf die Prognose der RUL dieser Elemente setzt. In Windenergieanlagen werden zahlreiche GM-Elemente zur Geräusch- und Schwingungsisolation verwendet. Der Einsatz des hier vorgestellten produktspezifischen Condition-Monitoring-Systems kann somit einen erheblichen Beitrag zum verlässlichen Betrieb von Windenergieanlagen liefern, da die Überwachung einzelner Komponenten in die Zustandsüberwachung der gesamten Anlage integriert und dadurch der Betrieb der Anlage optimiert werden kann. In dieser Arbeit werden einige Herausforderungen diskutiert, die sich bei der Entwicklung eines Condition-Monitoring-Systems für GM-Elemente ergeben. So wird evaluiert, welche Größen sich zur Beschreibung der Alterung eines spezifischen Elements eignen und wie diese gemessen werden können. Temperaturen werden bereits in einigen technischen Systemen, wie auch in Windenergieanlagen, aufgezeichnet und ausgewertet, aber ihr Potential für die Bestimmung der RUL der überwachten Komponente ist noch nicht ausgeschöpft. Hier wird eine Lösungsmöglichkeit vorgestellt, die auf Temperatursensoren aufbaut. Als Grundlage für die Entwicklung des Condition-Monitoring-Systems wurden beschleunigte Lebensdauerversuche der GM-Elemente auf einem Versuchsstand zur Schwingungsanalyse durchgeführt. In diesen Lebensdauerversuchen wird die mechanische Alterung eines GM-Elements über einen kraftgeregelten Hydraulikzylinder erzielt. Dabei wird das Ende der Lebensdauerversuche in einem ersten Schritt über die Wegamplitude des Zylinders bestimmt. Während dieser Versuche wurden diverse Sensoren eingesetzt. Die aufgezeichneten Temperaturdaten zeigen, dass sich Temperaturmessungen eignen die Lebensdauer von GM-Elementen mittels Condition Monitoring Prognosemethoden zu schätzen.","lang":"eng"}],"citation":{"short":"A. Bender, W. Sextro, K. Reinke, in: VDI-Berichte 2301, 2017, pp. 49–60.","chicago":"Bender, Amelie, Walter Sextro, and Kai Reinke. “Neuartiges Konzept Zur Lebensdauerprognose von Gummi-Metall-Elementen.” In <i>VDI-Berichte 2301</i>, 49–60, 2017.","ieee":"A. Bender, W. Sextro, and K. Reinke, “Neuartiges Konzept zur Lebensdauerprognose von Gummi-Metall-Elementen,” in <i>VDI-Berichte 2301</i>, 2017, pp. 49–60.","apa":"Bender, A., Sextro, W., &#38; Reinke, K. (2017). Neuartiges Konzept zur Lebensdauerprognose von Gummi-Metall-Elementen. In <i>VDI-Berichte 2301</i> (pp. 49–60).","bibtex":"@inproceedings{Bender_Sextro_Reinke_2017, title={Neuartiges Konzept zur Lebensdauerprognose von Gummi-Metall-Elementen}, booktitle={VDI-Berichte 2301}, author={Bender, Amelie and Sextro, Walter and Reinke, Kai}, year={2017}, pages={49–60} }","ama":"Bender A, Sextro W, Reinke K. Neuartiges Konzept zur Lebensdauerprognose von Gummi-Metall-Elementen. In: <i>VDI-Berichte 2301</i>. ; 2017:49-60.","mla":"Bender, Amelie, et al. “Neuartiges Konzept Zur Lebensdauerprognose von Gummi-Metall-Elementen.” <i>VDI-Berichte 2301</i>, 2017, pp. 49–60."},"publication":"VDI-Berichte 2301","user_id":"55222","language":[{"iso":"eng"}],"_id":"9971","page":"49-60","date_updated":"2019-05-27T09:30:41Z","author":[{"last_name":"Bender","first_name":"Amelie","full_name":"Bender, Amelie","id":"54290"},{"id":"21220","last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter"},{"last_name":"Reinke","first_name":"Kai","full_name":"Reinke, Kai"}],"status":"public","year":"2017","title":"Neuartiges Konzept zur Lebensdauerprognose von Gummi-Metall-Elementen"},{"year":"2017","title":"Analysis of pipe vibration in an ultrasonic powder transportationsystem","status":"public","author":[{"last_name":"Dunst","first_name":"Paul","full_name":"Dunst, Paul","id":"22130"},{"id":"210","first_name":"Tobias","last_name":"Hemsel","full_name":"Hemsel, Tobias"},{"full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter","id":"21220"}],"date_updated":"2019-09-16T10:23:40Z","page":"733-736","language":[{"iso":"eng"}],"_id":"9972","user_id":"55222","volume":"Sensors and Actuators A 263","publication":"elsevier","citation":{"bibtex":"@article{Dunst_Hemsel_Sextro_2017, title={Analysis of pipe vibration in an ultrasonic powder transportationsystem}, volume={Sensors and Actuators A 263}, journal={elsevier}, author={Dunst, Paul and Hemsel, Tobias and Sextro, Walter}, year={2017}, pages={733–736} }","ama":"Dunst P, Hemsel T, Sextro W. Analysis of pipe vibration in an ultrasonic powder transportationsystem. <i>elsevier</i>. 2017;Sensors and Actuators A 263:733-736.","mla":"Dunst, Paul, et al. “Analysis of Pipe Vibration in an Ultrasonic Powder Transportationsystem.” <i>Elsevier</i>, vol. Sensors and Actuators A 263, 2017, pp. 733–36.","chicago":"Dunst, Paul, Tobias Hemsel, and Walter Sextro. “Analysis of Pipe Vibration in an Ultrasonic Powder Transportationsystem.” <i>Elsevier</i> Sensors and Actuators A 263 (2017): 733–36.","short":"P. Dunst, T. Hemsel, W. Sextro, Elsevier Sensors and Actuators A 263 (2017) 733–736.","ieee":"P. Dunst, T. Hemsel, and W. Sextro, “Analysis of pipe vibration in an ultrasonic powder transportationsystem,” <i>elsevier</i>, vol. Sensors and Actuators A 263, pp. 733–736, 2017.","apa":"Dunst, P., Hemsel, T., &#38; Sextro, W. (2017). Analysis of pipe vibration in an ultrasonic powder transportationsystem. <i>Elsevier</i>, <i>Sensors and Actuators A 263</i>, 733–736."},"abstract":[{"text":"The transportation of dry fine powders is an emerging technologic task, as in biotechnology, pharmaceu-tical and coatings industry the particle sizes of processed powders get smaller and smaller. Fine powdersare primarily defined by the fact that adhesive and cohesive forces outweigh the weight forces, leadingto mostly unwanted agglomeration (clumping) and adhesion to surfaces. Thereby it gets more difficult touse conventional conveyor systems (e.g. pneumatic or vibratory conveyors) for transport. A rather newmethod for transporting these fine powders is based on ultrasonic vibrations, which are used to reducefriction between powder and substrate. Within this contribution an experimental set-up consisting of apipe, a solenoid actuator for axial vibration and an annular piezoelectric actuator for the high frequencyradial vibration of the pipe is described. Since amplitudes of the radial pipe vibration should be as large aspossible to get high effects of friction reduction, the pipe is excited to vibrate in resonance. To determinethe optimum excitation frequency and actuator position the vibration modes and resonance frequenciesof the pipe are calculated and measured. Results are in good accordance.","lang":"eng"}],"quality_controlled":"1","date_created":"2019-05-27T09:31:13Z","keyword":["Powder transport Piezoelectrics Ultrasonics Pipe vibration Finite element simulation Fine powder"],"type":"journal_article","department":[{"_id":"151"}]},{"department":[{"_id":"151"}],"type":"journal_article","keyword":["International Symposium on Microelectronics"],"date_created":"2019-05-27T09:32:42Z","project":[{"grant_number":"MP-1-1-015","_id":"93","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen"}],"abstract":[{"text":"In power electronics, copper connector pins are e.g. used to connect control boards with power modules. The new chip generation based on SiC and GaN technology increase the power density of semiconductor modules significantly with junction temperatures reaching 200°C. To enable reliable operation at such high temperature, the soldering of these connector pins should be substituted by a multi-dimensional copper-copper bonding technology. A copper pin welded directly on DBC substrate also simplifies the assembly. With this aim, a proper bond tool and a suitable connector pin geometry are designed. This paper presents a two-dimensional trajectory approach for ultrasonic bonding of copper pieces, e.g. connector pins, with the intention to minimize mechanical stresses exposed to the substrate. This is achieved using a multi-dimensional vibration system with multiple transducers known from flip chip bonding. Applying a planar relative motion between the bonding piece and the substrate increases the induced frictional power compared to one-dimensional excitation. The core of this work is the development of a new tool design which enables a reliable and effective transmission of the multidimensional vibration into the contact area between nail-shaped bonding piece and substrate. For this purpose, different bonding tool as well as bonding piece designs are discussed. A proper bonding tool design is selected based on the simulated alternatives. This tool is examined in bonding experiments and the results are presented. In addition, different grades of hardness for bonding piece and substrate are examined as well as different bonding parameters. Optical inspection of the bonded area shows the emergence of initial micro welds in form of a ring which is growing in direction of the interface boundaries with increasing bonding duration.","lang":"eng"}],"quality_controlled":"1","citation":{"mla":"Eichwald, Paul, et al. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” <i>IMAPSource</i>, vol. Vol. 2017, No. 1, 2017.","bibtex":"@article{Eichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017, title={Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design}, volume={Vol. 2017, No. 1}, journal={IMAPSource}, author={Eichwald, Paul and Althoff, Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}, year={2017} }","ama":"Eichwald P, Althoff S, Schemmel R, et al. Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. <i>IMAPSource</i>. 2017;Vol. 2017, No. 1.","ieee":"P. Eichwald <i>et al.</i>, “Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design,” <i>IMAPSource</i>, vol. Vol. 2017, No. 1, 2017.","apa":"Eichwald, P., Althoff, S., Schemmel, R., Sextro, W., Unger, A., Brökelmann, M., &#38; Hunstig, M. (2017). Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. <i>IMAPSource</i>, <i>Vol. 2017</i>, <i>No. 1</i>.","chicago":"Eichwald, Paul, Simon Althoff, Reinhard Schemmel, Walter Sextro, Andreas Unger, Michael Brökelmann, and Matthias Hunstig. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” <i>IMAPSource</i> Vol. 2017, No. 1 (2017).","short":"P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017)."},"publication":"IMAPSource","volume":"Vol. 2017, No. 1","user_id":"210","_id":"9973","language":[{"iso":"eng"}],"date_updated":"2020-05-07T05:33:54Z","author":[{"full_name":"Eichwald, Paul","first_name":"Paul","last_name":"Eichwald"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"id":"28647","last_name":"Schemmel","first_name":"Reinhard","full_name":"Schemmel, Reinhard"},{"id":"21220","last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter"},{"last_name":"Unger","first_name":"Andreas","full_name":"Unger, Andreas"},{"full_name":"Brökelmann, Michael","first_name":"Michael","last_name":"Brökelmann"},{"full_name":"Hunstig, Matthias","first_name":"Matthias","last_name":"Hunstig"}],"status":"public","title":"Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design","year":"2017"},{"author":[{"id":"13342","first_name":"Julian","last_name":"Hentze","full_name":"Hentze, Julian"},{"last_name":"Kaul","first_name":"Thorben","full_name":"Kaul, Thorben","id":"14802"},{"full_name":"Grässler, Iris","first_name":"Iris","last_name":"Grässler"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"}],"title":"Integrated modeling og behavior and reliability in system development","year":"2017","status":"public","date_updated":"2019-09-30T08:04:38Z","language":[{"iso":"eng"}],"_id":"9974","page":"385-394","user_id":"55222","citation":{"ama":"Hentze J, Kaul T, Grässler I, Sextro W. Integrated modeling og behavior and reliability in system development. In: <i>ICED17, 21st International Conference on Enginieering Design</i>. ; 2017:385-394.","bibtex":"@inproceedings{Hentze_Kaul_Grässler_Sextro_2017, title={Integrated modeling og behavior and reliability in system development}, booktitle={ICED17, 21st International conference on enginieering design}, author={Hentze, Julian and Kaul, Thorben and Grässler, Iris and Sextro, Walter}, year={2017}, pages={385–394} }","mla":"Hentze, Julian, et al. “Integrated Modeling Og Behavior and Reliability in System Development.” <i>ICED17, 21st International Conference on Enginieering Design</i>, 2017, pp. 385–94.","short":"J. Hentze, T. Kaul, I. Grässler, W. Sextro, in: ICED17, 21st International Conference on Enginieering Design, 2017, pp. 385–394.","chicago":"Hentze, Julian, Thorben Kaul, Iris Grässler, and Walter Sextro. “Integrated Modeling Og Behavior and Reliability in System Development.” In <i>ICED17, 21st International Conference on Enginieering Design</i>, 385–94, 2017.","apa":"Hentze, J., Kaul, T., Grässler, I., &#38; Sextro, W. (2017). Integrated modeling og behavior and reliability in system development. In <i>ICED17, 21st International conference on enginieering design</i> (pp. 385–394).","ieee":"J. Hentze, T. Kaul, I. Grässler, and W. Sextro, “Integrated modeling og behavior and reliability in system development,” in <i>ICED17, 21st International conference on enginieering design</i>, 2017, pp. 385–394."},"publication":"ICED17, 21st International conference on enginieering design","abstract":[{"lang":"eng","text":"The integrated modeling of behavior and reliability in system development delivers a model-based approach for reliability investigation by taking into account the dynamic system behavior as well as the system architecture at different phases of the development process. This approach features an automated synthesis of a reliability model out of a behavior model enabling for the closed loop modeling of degradation of the system and its (dynamic) behavior. The approach is integrated into the development process following Systems Engineering. It is based on standard models used in model-based development methodologies i.e. SysML or Matlab/Simulink. In addition to the theoretical description of the necessary steps the procedure is validated by an application example at two stages of the development process."}],"quality_controlled":"1","date_created":"2019-05-27T09:35:48Z","department":[{"_id":"151"}],"type":"conference","keyword":["Design for X (DfX)","Product modelling / models","Robust design","Systems Engineering (SE)","Reliability"]},{"citation":{"chicago":"Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Formulation of Reliability-Related Objective Functions for Design of Intelligent Mechatronic Systems.” <i>SAGE Journals</i> Vol. 231(4) (2017): 390–99. <a href=\"https://doi.org/10.1177/1748006X17709376\">https://doi.org/10.1177/1748006X17709376</a>.","short":"T. Kaul, T. Meyer, W. Sextro, SAGE Journals Vol. 231(4) (2017) 390–399.","ieee":"T. Kaul, T. Meyer, and W. Sextro, “Formulation of reliability-related objective functions for design of intelligent mechatronic systems,” <i>SAGE Journals</i>, vol. Vol. 231(4), pp. 390–399, 2017.","apa":"Kaul, T., Meyer, T., &#38; Sextro, W. (2017). Formulation of reliability-related objective functions for design of intelligent mechatronic systems. <i>SAGE Journals</i>, <i>Vol. 231(4)</i>, 390–399. <a href=\"https://doi.org/10.1177/1748006X17709376\">https://doi.org/10.1177/1748006X17709376</a>","bibtex":"@article{Kaul_Meyer_Sextro_2017, title={Formulation of reliability-related objective functions for design of intelligent mechatronic systems}, volume={Vol. 231(4)}, DOI={<a href=\"https://doi.org/10.1177/1748006X17709376\">10.1177/1748006X17709376</a>}, journal={SAGE Journals}, author={Kaul, Thorben and Meyer, Tobias and Sextro, Walter}, year={2017}, pages={390–399} }","ama":"Kaul T, Meyer T, Sextro W. Formulation of reliability-related objective functions for design of intelligent mechatronic systems. <i>SAGE Journals</i>. 2017;Vol. 231(4):390-399. doi:<a href=\"https://doi.org/10.1177/1748006X17709376\">10.1177/1748006X17709376</a>","mla":"Kaul, Thorben, et al. “Formulation of Reliability-Related Objective Functions for Design of Intelligent Mechatronic Systems.” <i>SAGE Journals</i>, vol. Vol. 231(4), 2017, pp. 390–99, doi:<a href=\"https://doi.org/10.1177/1748006X17709376\">10.1177/1748006X17709376</a>."},"publication":"SAGE Journals","abstract":[{"text":"State-of-the-art mechatronic systems offer inherent intelligence that enables them to autonomously adapt their behavior to current environmental conditions and to their own system state. This autonomous behavior adaptation is made possible by software in combination with complex sensor and actuator systems and by sophisticated information processing, all of which make these systems increasingly complex. This increasing complexity makes the design process a challenging task and brings new complex possibilities for operation and maintenance. However, with the risk of increased system complexity also comes the chance to adapt system behavior based on current reliability, which in turn increases reliability. The development of such an adaption strategy requires appropriate methods to evaluate reliability based on currently selected system behavior. A common approach to implement such adaptivity is to base system behavior on different working points that are obtained using multiobjective optimization. During operation, selection among these allows a changed operating strategy. To allow for multiobjective optimization, an accurate system model including system reliability is required. This model is repeatedly evaluated by the optimization algorithm. At present, modeling of system reliability and synchronization of the models of behavior and reliability is a laborious manual task and thus very error-prone. Since system behavior is crucial for system reliability, an integrated model is introduced that integrates system behavior and system reliability. The proposed approach is used to formulate reliability-related objective functions for a clutch test rig that are used to compute feasible working points using multiobjective optimization.","lang":"eng"}],"quality_controlled":"1","date_created":"2019-05-27T09:37:46Z","department":[{"_id":"151"}],"type":"journal_article","keyword":["Integrated model","reliability","system behavior","Bayesian network","multiobjective optimization"],"author":[{"first_name":"Thorben","last_name":"Kaul","full_name":"Kaul, Thorben","id":"14802"},{"last_name":"Meyer","first_name":"Tobias","full_name":"Meyer, Tobias"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"}],"title":"Formulation of reliability-related objective functions for design of intelligent mechatronic systems","year":"2017","status":"public","date_updated":"2019-09-16T10:20:49Z","_id":"9976","language":[{"iso":"eng"}],"page":"390 - 399","volume":"Vol. 231(4)","doi":"10.1177/1748006X17709376","user_id":"55222"},{"quality_controlled":"1","abstract":[{"lang":"eng","text":"Piezoelectric transducers are used in a wide range of applications. Reliability of these transducers is an important aspect in their application. Prognostics, which involve continuous monitoring of the health of technical systems and using this information to estimate the current health state and consequently predict the remaining useful lifetime (RUL), can be used to increase the reliability, safety, and availability of the transducers. This is achieved by utilizing the health state and RUL predictions to adaptively control the usage of the components or to schedule appropriate maintenance without interrupting operation. In this work, a prognostic approach utilizing self-sensing, where electric signals of a piezoelectric transducer are used as the condition monitoring data, is proposed. The approach involves training machine learning algorithms to model the degradation of the transducers through a health index and the use of the learned model to estimate the health index of similar transducers. The current health index is then used to estimate RUL of test components. The feasibility of the approach is demonstrated using piezoelectric bimorphs and the results show that the method is accurate in predicting the health index and RUL."}],"publication":"IEEE Transactions on Reliability","citation":{"ieee":"J. K. Kimotho, W. Sextro, and T. Hemsel, “Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing,” in <i>IEEE Transactions on Reliability</i>, 2017, pp. 1–10.","apa":"Kimotho, J. K., Sextro, W., &#38; Hemsel, T. (2017). Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing. In <i>IEEE Transactions on Reliability</i> (pp. 1–10). <a href=\"https://doi.org/10.1109/TR.2017.2710260\">https://doi.org/10.1109/TR.2017.2710260</a>","short":"J.K. Kimotho, W. Sextro, T. Hemsel, in: IEEE Transactions on Reliability, 2017, pp. 1–10.","chicago":"Kimotho, James Kuria, Walter Sextro, and Tobias Hemsel. “Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing.” In <i>IEEE Transactions on Reliability</i>, 1–10, 2017. <a href=\"https://doi.org/10.1109/TR.2017.2710260\">https://doi.org/10.1109/TR.2017.2710260</a>.","mla":"Kimotho, James Kuria, et al. “Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing.” <i>IEEE Transactions on Reliability</i>, 2017, pp. 1–10, doi:<a href=\"https://doi.org/10.1109/TR.2017.2710260\">10.1109/TR.2017.2710260</a>.","bibtex":"@inproceedings{Kimotho_Sextro_Hemsel_2017, title={Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing}, DOI={<a href=\"https://doi.org/10.1109/TR.2017.2710260\">10.1109/TR.2017.2710260</a>}, booktitle={IEEE Transactions on Reliability}, author={Kimotho, James Kuria and Sextro, Walter and Hemsel, Tobias}, year={2017}, pages={1–10} }","ama":"Kimotho JK, Sextro W, Hemsel T. Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing. In: <i>IEEE Transactions on Reliability</i>. ; 2017:1-10. doi:<a href=\"https://doi.org/10.1109/TR.2017.2710260\">10.1109/TR.2017.2710260</a>"},"keyword":["Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing"],"type":"conference","department":[{"_id":"151"}],"date_created":"2019-05-27T09:41:06Z","date_updated":"2019-09-16T10:32:05Z","year":"2017","title":"Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing","status":"public","author":[{"full_name":"Kimotho, James Kuria","first_name":"James Kuria","last_name":"Kimotho"},{"id":"21220","full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro"},{"id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel","first_name":"Tobias"}],"doi":"10.1109/TR.2017.2710260","user_id":"55222","page":"1 - 10","_id":"9978","language":[{"iso":"eng"}]},{"date_updated":"2019-05-27T09:49:49Z","status":"public","title":"MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall","year":"2017","author":[{"id":"28647","first_name":"Reinhard","last_name":"Schemmel","full_name":"Schemmel, Reinhard"},{"id":"210","full_name":"Hemsel, Tobias","first_name":"Tobias","last_name":"Hemsel"},{"full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter","id":"21220"}],"user_id":"55222","page":"611-614","language":[{"iso":"eng"}],"_id":"9982","abstract":[{"lang":"ger","text":"ln der industriellen Fertigung werden zum Transport von Bauteilen häufig Förderketten genutzt. Obwohl die Förderketten meist nicht direkt mit den Arbeitsmedien in Berührung kommen, werden sie indirekt durch vagabundierende Stäube und Pulver, die an der geölten Kette anhaften, im Laufe der Zeit stark verschmutzt. Ein derart im Betrieb verschmutztes Kettenglied ist in Abbildung 1 dargestellt. Um die Lebensdauer der Ketten zu erhöhen und das Herunterfallen von Schmutzpartikel auf die Produkte zu vermeiden, muss die Kette regelmäßig gereinigt werden. Ziel des hier beschriebenen Forschungsvorhabens ist die Entwicklung eines Systems, das in der Lage ist, ein einzelnes Kettenglied in unter 60 s mittels Ultraschall zu reinigen. In [1] wurde in ersten Versuchen nachgewiesen, dass Stabschwinger in Abhängigkeit des Sonotrodenabstands zum Reinigungsobjekt und der Ultraschallamplitude eine intensive Reinigungswirkung entfalten. Das Konzept der Reinigungsanlage sieht deshalb vor, im ersten Schritt die stark verschmutzten Kettenglieder durch ein hochintensives Kavitationsfeld von direkt eingetauchten Stabschwingern vorzureinigen und anschließend schwer zugängliche Be- reiche wie Hinterschneidungen oder Bohrungen mittels konventioneller Tauchschwinger von Verschmutzungen zu befreien. Für den Stabschwinger wird die sogenannte - Sonotrode untersucht; diese wird unter anderem auch in der Sonochemie verwendet. Ein wesentliches Merkmal der Sonotrode ist eine hohe Amplitudenübersetzung bei einer gleichzeitig großen Abstrahlfläche. Neben dem Entwurf mittels der L /2 -Synthese wird die Reinigungswirkung der Sonotrode in Abhängigkeit der Ultraschallamplitude und dem Abstand zum Reinigungsobjekt in einer Versuchsreihe untersucht. Zur genaueren Betrachtung der Reinigungs- mechanismen eines Stabschwingers werden abschließend Hochgeschwindigkeitsaufnahmen vorgestellt und analysieren."}],"publication":"43. Deutsche Jahrestagung für Akustik","citation":{"apa":"Schemmel, R., Hemsel, T., &#38; Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In <i>43. Deutsche Jahrestagung für Akustik</i> (pp. 611–614). Kiel 2017.","ieee":"R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall,” in <i>43. Deutsche Jahrestagung für Akustik</i>, 2017, pp. 611–614.","chicago":"Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” In <i>43. Deutsche Jahrestagung Für Akustik</i>, 611–14. Kiel 2017, 2017.","short":"R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.","mla":"Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” <i>43. Deutsche Jahrestagung Für Akustik</i>, 2017, pp. 611–14.","ama":"Schemmel R, Hemsel T, Sextro W. MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In: <i>43. Deutsche Jahrestagung Für Akustik</i>. Kiel 2017; 2017:611-614.","bibtex":"@inproceedings{Schemmel_Hemsel_Sextro_2017, place={Kiel 2017}, title={MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}, booktitle={43. Deutsche Jahrestagung für Akustik}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2017}, pages={611–614} }"},"type":"conference","keyword":["wire bonding","dynamic behavior","modeling"],"department":[{"_id":"151"}],"date_created":"2019-05-27T09:48:10Z","place":"Kiel 2017"},{"department":[{"_id":"151"}],"type":"conference","date_created":"2019-05-27T09:50:09Z","citation":{"short":"S. Schulze, W. Sextro, K. Kister, in: Proceedings of the 12th International Symposium on Automotive Lighting 2017, 2017.","chicago":"Schulze, Sebastian, Walter Sextro, and K. Kister. “Model Based Optimization of Dynamics in Adaptive Headlamps.” In <i>Proceedings of the 12th International Symposium on Automotive Lighting 2017</i>, 2017.","ieee":"S. Schulze, W. Sextro, and K. Kister, “Model based optimization of dynamics in adaptive headlamps,” in <i>Proceedings of the 12th International Symposium on Automotive Lighting 2017</i>, 2017.","apa":"Schulze, S., Sextro, W., &#38; Kister, K. (2017). Model based optimization of dynamics in adaptive headlamps. In <i>Proceedings of the 12th International Symposium on Automotive Lighting 2017</i>.","bibtex":"@inproceedings{Schulze_Sextro_Kister_2017, title={Model based optimization of dynamics in adaptive headlamps}, booktitle={Proceedings of the 12th International Symposium on Automotive Lighting 2017}, author={Schulze, Sebastian and Sextro, Walter and Kister, K.}, year={2017} }","ama":"Schulze S, Sextro W, Kister K. Model based optimization of dynamics in adaptive headlamps. In: <i>Proceedings of the 12th International Symposium on Automotive Lighting 2017</i>. ; 2017.","mla":"Schulze, Sebastian, et al. “Model Based Optimization of Dynamics in Adaptive Headlamps.” <i>Proceedings of the 12th International Symposium on Automotive Lighting 2017</i>, 2017."},"publication":"Proceedings of the 12th International Symposium on Automotive Lighting 2017","user_id":"55222","_id":"9983","language":[{"iso":"eng"}],"date_updated":"2019-05-27T09:52:17Z","author":[{"full_name":"Schulze, Sebastian","first_name":"Sebastian","last_name":"Schulze"},{"last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter","id":"21220"},{"full_name":"Kister, K.","first_name":"K.","last_name":"Kister"}],"year":"2017","status":"public","title":"Model based optimization of dynamics in adaptive headlamps"},{"user_id":"55222","page":"17–30","_id":"9985","language":[{"iso":"eng"}],"date_updated":"2019-09-30T09:03:57Z","year":"2017","title":"Entwicklung verlässlicher, intelligenter Systeme","status":"public","author":[{"id":"21220","full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"full_name":"Kaul, Thorben","last_name":"Kaul","first_name":"Thorben","id":"14802"},{"full_name":"Kimotho, James Kuria","last_name":"Kimotho","first_name":"James Kuria"}],"type":"conference","keyword":["intelligente Systeme"],"department":[{"_id":"151"}],"date_created":"2019-05-27T09:52:37Z","place":"Leonberg","quality_controlled":"1","abstract":[{"lang":"ger","text":"Intelligente technische Systeme sind durch einen erhöhten Funktionsumfang charakterisiert, der diese dazu befähigt, autonom auf wechselnde Umgebungsbedingungen, Anforderungen und inhärente Systemzustände zu reagieren. Dies kann mit den Methoden der Selbstoptimie-rung erreicht werden. Hier werden mit Verfahren der Mehrzieloptimierung mögliche Betriebs-punkte des Systems bestimmt zwischen denen das System im Betrieb autonom auswählt und somit eine Verhaltensadaption erwirkt. Zur Berechnung der Betriebspunkte ist es notwendig ein Modell des Systemverhaltens aufzustellen und das Verhalten hinsichtlich verschiedener, meist konfliktärer, Ziele zu quantifizieren. Bei der Modellierung des Systemverhaltens und der Formulierung der Ziele stellt die Absiche-rung der Verlässlichkeit auf Grund der zunehmenden Systemkomplexität eine große Heraus-forderung dar, der im Entwicklungsprozess begegnet werden muss. Die Implementierung von Selbstoptimierung bietet darüber hinaus in Kombination mit einer Zustandsüberwachung im Betrieb die Möglichkeit einer zuverlässigkeitsbasierten Verhaltensanpassung, deren Potential zu einer Steigerung der Verlässlichkeit genutzt werden kann. In dieser Arbeit werden die Entwicklung intelligenter technischer Systeme und die damit ver-bundenen notwendigen Entwicklungsschritte zur Absicherung der Verlässlichkeit anhand von selbstoptimierenden Systemen betrachtet. Dazu gehören die Formulierung verlässlichkeitsre-levanter Ziele und die Implementierung einer Zustandsüberwachung als Basis für eine zuver-lässigkeitsbasierte Verhaltensanpassung. Es werden auf Grundlage einer Beschreibung der Entwicklungsschritte, Potentiale zur Steigerung der Verlässlichkeit sowie Chancen und zukünf-tige Herausforderungen herausgestellt und diskutiert."}],"publication":"VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung und Betrieb zuverlässiger Produkte.","citation":{"chicago":"Sextro, Walter, Tobias Meyer, Thorben Kaul, and James Kuria Kimotho. “Entwicklung Verlässlicher, Intelligenter Systeme.” In <i>VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung Und Betrieb Zuverlässiger Produkte.</i>, 17–30. Leonberg, 2017.","short":"W. Sextro, T. Meyer, T. Kaul, J.K. Kimotho, in: VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung Und Betrieb Zuverlässiger Produkte., Leonberg, 2017, pp. 17–30.","ama":"Sextro W, Meyer T, Kaul T, Kimotho JK. Entwicklung verlässlicher, intelligenter Systeme. In: <i>VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung Und Betrieb Zuverlässiger Produkte.</i> Leonberg; 2017:17–30.","bibtex":"@inproceedings{Sextro_Meyer_Kaul_Kimotho_2017, place={Leonberg}, title={Entwicklung verlässlicher, intelligenter Systeme}, booktitle={VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung und Betrieb zuverlässiger Produkte.}, author={Sextro, Walter and Meyer, Tobias and Kaul, Thorben and Kimotho, James Kuria}, year={2017}, pages={17–30} }","apa":"Sextro, W., Meyer, T., Kaul, T., &#38; Kimotho, J. K. (2017). Entwicklung verlässlicher, intelligenter Systeme. In <i>VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung und Betrieb zuverlässiger Produkte.</i> (pp. 17–30). Leonberg.","mla":"Sextro, Walter, et al. “Entwicklung Verlässlicher, Intelligenter Systeme.” <i>VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung Und Betrieb Zuverlässiger Produkte.</i>, 2017, pp. 17–30.","ieee":"W. Sextro, T. Meyer, T. Kaul, and J. K. Kimotho, “Entwicklung verlässlicher, intelligenter Systeme,” in <i>VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung und Betrieb zuverlässiger Produkte.</i>, 2017, pp. 17–30."}},{"date_created":"2019-05-27T08:47:52Z","keyword":["finite element simulation","wire bonding","tool geometry"],"type":"conference","department":[{"_id":"151"}],"publication":"IEEE 66th Electronic Components and Technology Conference","citation":{"mla":"Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2103–10, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>.","apa":"Althoff, S., Meyer, T., Unger, A., Sextro, W., &#38; Eacock, F. (2016). Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 2103–2110). <a href=\"https://doi.org/10.1109/ECTC.2016.234\">https://doi.org/10.1109/ECTC.2016.234</a>","ieee":"S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2103–2110.","chicago":"Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 2103–10, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.234\">https://doi.org/10.1109/ECTC.2016.234</a>.","short":"S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.","ama":"Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:2103-2110. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>","bibtex":"@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent Transmittable Tangential Force of Wire Bond Tools}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2016}, pages={2103–2110} }"},"quality_controlled":"1","abstract":[{"lang":"eng","text":"Wire bonding has been an established packaging technology for decades. When introducing copper as wire material for high power applications, adaptations to the bonding process and to machines became necessary. Here, challenges occur due to the stiffer wire material and changing oxide layers on the contact partners. To achieve sufficient process stability, a clean bond area is required, which can only be achieved with high shear stresses in the contact partners surfaces. These necessitate high normal forces to plastically deform the wire and substrate. To achieve such high stresses in the contact area, the bonding tool needs to be able to transmit the needed tangential forces to the top side of the wire. The wire itself performs a shear movement and transmits the force into the contact area to clean the contaminant and oxide layers and to level the desired bond surfaces. The main function of the tool is to transmit these forces. If the bond tool can only transmit low forces in the direction of excitation, the parameter space for a stable bond process is severely restricted. Here, a modeling approach to estimate how well different tool shapes meet the demand of transmitting high tangential forces is presented. The model depends on wire deformation and thus on the ultrasonic softening effect."}],"project":[{"_id":"92","grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"page":"2103-2110","_id":"9955","language":[{"iso":"eng"}],"doi":"10.1109/ECTC.2016.234","user_id":"210","year":"2016","title":"Shape-Dependent Transmittable Tangential Force of Wire Bond Tools","status":"public","author":[{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"last_name":"Meyer","first_name":"Tobias","full_name":"Meyer, Tobias"},{"last_name":"Unger","first_name":"Andreas","full_name":"Unger, Andreas"},{"id":"21220","full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro"},{"first_name":"Florian","last_name":"Eacock","full_name":"Eacock, Florian"}],"date_updated":"2020-05-07T05:33:52Z"},{"type":"journal_article","department":[{"_id":"151"}],"date_created":"2019-05-27T08:53:18Z","abstract":[{"text":"Leistungshalbleitermodule werden leistungsfähiger, effizienter, kompakter und haltbarer Ziel dieses Innovationsprojekts des Spitzenclusters „it’s OWL – Intelligente Technische Systeme OstWestfalen-Lippe“ ist die Entwicklung von selbstoptimierenden Verfahren, um unter variablen Produktionsbedingungen zuverlässige Kupferbondverbindungen herstellen zu können. Die Ultraschall-Drahtbondmaschine erhält die Fähigkeit, sich automatisch an veränderte Bedingungen anzupassen. Hierzu wird der gesamte Prozess der Ultraschall-Verbindungsbildung modelliert und neueste Verfahren der Selbstoptimierung angewandt. Die Evaluierung erfolgt anhand eines Prototypen in Form einer modifizierten Bondmaschine. Intelligent production of heavy copper wire bonds It is the aim of this innovation-project to develop a self-optimization system for ultrasonic copper wire bonding. It is part of the leading edge cluster “it’s OWL”. The bonding machine will be able to react autonomously to changing boundary conditions to ensure constant and reliable bonding results. For this, the hole bonding process is modeled in great detail and newest self-optimization techniques are utilized. A prototype-system incorporated in a serial machine is used for evaluation.","lang":"eng"}],"project":[{"grant_number":"02 PQ2210","_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"publication":"wt-online","popular_science":"1","citation":{"ama":"Brökelmann M, Unger A, Meyer T, et al. Kupferbondverbindungen intelligent herstellen. <i>wt-online</i>. 2016;7/8:512-519.","bibtex":"@article{Brökelmann_Unger_Meyer_Althoff_Sextro_Hunstig_Biermann_Guth_2016, title={Kupferbondverbindungen intelligent herstellen}, volume={7/8}, journal={wt-online}, author={Brökelmann, Michael and Unger, Andreas and Meyer, Tobias and Althoff, Simon and Sextro, Walter and Hunstig, Matthias and Biermann, Florian and Guth, Karsten}, year={2016}, pages={512–519} }","mla":"Brökelmann, Michael, et al. “Kupferbondverbindungen Intelligent Herstellen.” <i>Wt-Online</i>, vol. 7/8, 2016, pp. 512–19.","short":"M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F. Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.","chicago":"Brökelmann, Michael, Andreas Unger, Tobias Meyer, Simon Althoff, Walter Sextro, Matthias Hunstig, Florian Biermann, and Karsten Guth. “Kupferbondverbindungen Intelligent Herstellen.” <i>Wt-Online</i> 7/8 (2016): 512–19.","apa":"Brökelmann, M., Unger, A., Meyer, T., Althoff, S., Sextro, W., Hunstig, M., … Guth, K. (2016). Kupferbondverbindungen intelligent herstellen. <i>Wt-Online</i>, <i>7/8</i>, 512–519.","ieee":"M. Brökelmann <i>et al.</i>, “Kupferbondverbindungen intelligent herstellen,” <i>wt-online</i>, vol. 7/8, pp. 512–519, 2016."},"user_id":"210","volume":"7/8","page":"512-519","language":[{"iso":"eng"}],"_id":"9957","date_updated":"2020-05-07T05:33:52Z","status":"public","title":"Kupferbondverbindungen intelligent herstellen","year":"2016","author":[{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"full_name":"Unger, Andreas","first_name":"Andreas","last_name":"Unger"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro","id":"21220"},{"full_name":"Hunstig, Matthias","first_name":"Matthias","last_name":"Hunstig"},{"first_name":"Florian","last_name":"Biermann","full_name":"Biermann, Florian"},{"full_name":"Guth, Karsten","last_name":"Guth","first_name":"Karsten"}]},{"abstract":[{"text":"The transportation of dry fine powders is an emerging technologic task, as in biotechnology, pharmaceutical or coatings industry particle sizes of processed powders are getting smaller and smaller. Fine powders are primarily defined by the fact that adhesive and cohesive forces outweigh the weight forces. This leads to mostly unwanted agglomeration (clumping) and adhesion to surfaces, what makes it more difficult to use conventional conveyor systems (e. g. pneumatic or vibratory conveyors) for transport. A rather new method for transporting these fine powders is based on ultrasonic vibrations, which are used to reduce friction and adhesion between powder and the substrate. One very effective set-up consists of a pipe, which vibrates harmoniously in axial direction at low frequency combined with a pulsed radial high frequency vibration. The high frequency vibration accelerates the particles perpendicular to the surface of the pipe, which in average leads to lower normal and thereby smaller friction force. With coordinated friction manipulation the powder acceleration can be varied so that the powder may be greatly accelerated and only slightly decelerated in each excitation period of the low frequency axial vibration of the pipe. The amount of powder flow is adjustable by vibration amplitudes, frequencies, and pulse rate, which makes the device versatile for comparable high volume and fine dosing using one setup. Within this contribution an experimental set-up consisting of a pipe, a solenoid actuator for axial vibration and a piezoelectric actuator for the radial high frequency vibration is described. An analytical model is shown, that simulates the powder velocity. Finally, simulation results are validated by experimental data for different driving parameters such as amplitude of low frequency vibration, pipe material and inclination angle.","lang":"eng"}],"publication":"PAMM Proc. Appl. Math. Mech. 16","citation":{"short":"P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, W. Littmann, in: PAMM Proc. Appl. Math. Mech. 16, Braunschweig, 2016, pp. 635–636.","chicago":"Dunst, Paul, Walter Sextro, Peter Bornmann, Tobias Hemsel, and Walter Littmann. “Transportation of Dry Fine Powders by Coordinated Friction Manipulation.” In <i>PAMM Proc. Appl. Math. Mech. 16</i>, 635–36. Braunschweig, 2016. <a href=\"https://doi.org/10.1002/pamm.201610306\">https://doi.org/10.1002/pamm.201610306</a>.","apa":"Dunst, P., Sextro, W., Bornmann, P., Hemsel, T., &#38; Littmann, W. (2016). Transportation of dry fine powders by coordinated friction manipulation. In <i>PAMM Proc. Appl. Math. Mech. 16</i> (pp. 635–636). Braunschweig. <a href=\"https://doi.org/10.1002/pamm.201610306\">https://doi.org/10.1002/pamm.201610306</a>","ieee":"P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, and W. Littmann, “Transportation of dry fine powders by coordinated friction manipulation,” in <i>PAMM Proc. Appl. Math. Mech. 16</i>, 2016, pp. 635–636.","ama":"Dunst P, Sextro W, Bornmann P, Hemsel T, Littmann W. Transportation of dry fine powders by coordinated friction manipulation. In: <i>PAMM Proc. Appl. Math. Mech. 16</i>. Braunschweig; 2016:635-636. doi:<a href=\"https://doi.org/10.1002/pamm.201610306\">10.1002/pamm.201610306</a>","bibtex":"@inproceedings{Dunst_Sextro_Bornmann_Hemsel_Littmann_2016, place={Braunschweig}, title={Transportation of dry fine powders by coordinated friction manipulation}, DOI={<a href=\"https://doi.org/10.1002/pamm.201610306\">10.1002/pamm.201610306</a>}, booktitle={PAMM Proc. Appl. Math. Mech. 16}, author={Dunst, Paul and Sextro, Walter and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter}, year={2016}, pages={635–636} }","mla":"Dunst, Paul, et al. “Transportation of Dry Fine Powders by Coordinated Friction Manipulation.” <i>PAMM Proc. Appl. Math. Mech. 16</i>, 2016, pp. 635–36, doi:<a href=\"https://doi.org/10.1002/pamm.201610306\">10.1002/pamm.201610306</a>."},"type":"conference","department":[{"_id":"151"}],"place":"Braunschweig","date_created":"2019-05-27T08:57:25Z","date_updated":"2019-05-27T08:59:25Z","year":"2016","status":"public","title":"Transportation of dry fine powders by coordinated friction manipulation","author":[{"full_name":"Dunst, Paul","last_name":"Dunst","first_name":"Paul","id":"22130"},{"full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro","id":"21220"},{"first_name":"Peter","last_name":"Bornmann","full_name":"Bornmann, Peter"},{"id":"210","first_name":"Tobias","last_name":"Hemsel","full_name":"Hemsel, Tobias"},{"first_name":"Walter","last_name":"Littmann","full_name":"Littmann, Walter"}],"doi":"10.1002/pamm.201610306","user_id":"55222","page":"635-636","_id":"9958","language":[{"iso":"eng"}]},{"date_created":"2019-05-27T09:07:19Z","department":[{"_id":"151"}],"type":"conference","citation":{"short":"P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann, in: IEEE CPMT Symposium Japan, 2016, 2016.","chicago":"Eichwald, Paul, Andreas Unger, Florian Eacock, Simon Althoff, Walter Sextro, Karsten Guth, and Michael Brökelmann. “Micro Wear Modeling in Copper Wire Wedge Bonding.” In <i>IEEE CPMT Symposium Japan, 2016</i>, 2016.","ieee":"P. Eichwald <i>et al.</i>, “Micro Wear Modeling in Copper Wire Wedge Bonding,” in <i>IEEE CPMT Symposium Japan, 2016</i>, 2016.","apa":"Eichwald, P., Unger, A., Eacock, F., Althoff, S., Sextro, W., Guth, K., &#38; Brökelmann, M. (2016). Micro Wear Modeling in Copper Wire Wedge Bonding. In <i>IEEE CPMT Symposium Japan, 2016</i>.","bibtex":"@inproceedings{Eichwald_Unger_Eacock_Althoff_Sextro_Guth_Brökelmann_2016, title={Micro Wear Modeling in Copper Wire Wedge Bonding}, booktitle={IEEE CPMT Symposium Japan, 2016}, author={Eichwald, Paul and Unger, Andreas and Eacock, Florian and Althoff, Simon and Sextro, Walter and Guth, Karsten and Brökelmann, Michael}, year={2016} }","ama":"Eichwald P, Unger A, Eacock F, et al. Micro Wear Modeling in Copper Wire Wedge Bonding. In: <i>IEEE CPMT Symposium Japan, 2016</i>. ; 2016.","mla":"Eichwald, Paul, et al. “Micro Wear Modeling in Copper Wire Wedge Bonding.” <i>IEEE CPMT Symposium Japan, 2016</i>, 2016."},"publication":"IEEE CPMT Symposium Japan, 2016","project":[{"grant_number":"02 PQ2210","_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is a common technology for connecting electrodes of electronic components like power modules. Nowadays, bond connections are often made of copper instead of aluminum due to its thermal and mechanical assets. One of the main cost factors in the wire bonding process is the acquisition cost of consumables such as bonding tools. For copper wire bonding tool lifetime is much lower than for aluminium bonding. This paper presents a micro wear model for wedge/wedge bonding tools that was validated by observing wear patterns with a scanning electron microscope. The wear coefficient is determined in long-term bonding tests. The application of Fleischer´s wear approach incorporating frictional power to a finite element simulation of the bonding processes is used to shift element nodes depending on the rising frictional power for finite element modeling. The presented simulation method can be used to take tool wear into consideration for creating tools with increased lifetime. This enables the production of reliable bond connections using heavy as well as thin wire of any material. The paper discusses the predominant influences of wear on the main tool functions and their changes over tool life. Furthermore, the influence of the tool groove angle on the tool wear was investigated. One of the main results is that the wear is largest during the last phase of each bonding process, when the contact area between tool and wire is largest."}],"quality_controlled":"1","_id":"9960","language":[{"iso":"eng"}],"user_id":"210","author":[{"full_name":"Eichwald, Paul","last_name":"Eichwald","first_name":"Paul"},{"first_name":"Andreas","last_name":"Unger","full_name":"Unger, Andreas"},{"full_name":"Eacock, Florian","last_name":"Eacock","first_name":"Florian"},{"full_name":"Althoff, Simon","first_name":"Simon","last_name":"Althoff"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"},{"full_name":"Guth, Karsten","last_name":"Guth","first_name":"Karsten"},{"last_name":"Brökelmann","first_name":"Michael","full_name":"Brökelmann, Michael"}],"title":"Micro Wear Modeling in Copper Wire Wedge Bonding","status":"public","year":"2016","date_updated":"2020-05-07T05:33:53Z"},{"date_created":"2019-05-27T09:10:07Z","department":[{"_id":"151"}],"type":"conference","citation":{"mla":"Kaul, Thorben, et al. “Modeling of Complex Redundancy in Technical Systems with Bayesian Networks.” <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>, 2016.","ama":"Kaul T, Meyer T, Sextro W. Modeling of Complex Redundancy in Technical Systems with Bayesian Networks. In: <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>. ; 2016.","bibtex":"@inproceedings{Kaul_Meyer_Sextro_2016, title={Modeling of Complex Redundancy in Technical Systems with Bayesian Networks}, booktitle={Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016}, author={Kaul, Thorben and Meyer, Tobias and Sextro, Walter}, year={2016} }","apa":"Kaul, T., Meyer, T., &#38; Sextro, W. (2016). Modeling of Complex Redundancy in Technical Systems with Bayesian Networks. In <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>.","ieee":"T. Kaul, T. Meyer, and W. Sextro, “Modeling of Complex Redundancy in Technical Systems with Bayesian Networks,” in <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>, 2016.","chicago":"Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Modeling of Complex Redundancy in Technical Systems with Bayesian Networks.” In <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>, 2016.","short":"T. Kaul, T. Meyer, W. Sextro, in: Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016, 2016."},"publication":"Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016","abstract":[{"text":"Redundancy is a common approach to improve system reliability, availability and safety in technical systems. It is achieved by adding functionally equivalent elements that enable the system to remain operational even though one or more of those elements fail. This paper begins with an overview on the various terminologies and methods for redundancy concepts that can be modeled sufficiently using established reliability analysis methods. However, these approaches yield very complex system models, which limits their applicability. In current research, Bayesian Networks (BNs), especially Dynamic Bayesian Networks (DBNs) have been successfully used for reliability analysis because of their benefits in modeling complex systems and in representing multi-state variables. However, these approaches lack appropriate methods to model all commonly used redundancy concepts. To overcome this limitation, three different modeling approaches based on BNs and DBNs are described in this paper. Addressing those approaches, the benefits and limitations of BNs and DBNs for modeling reliability of redundant technical systems are discussed and evaluated.","lang":"eng"}],"quality_controlled":"1","language":[{"iso":"eng"}],"_id":"9961","user_id":"55222","author":[{"last_name":"Kaul","first_name":"Thorben","full_name":"Kaul, Thorben","id":"14802"},{"last_name":"Meyer","first_name":"Tobias","full_name":"Meyer, Tobias"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"}],"title":"Modeling of Complex Redundancy in Technical Systems with Bayesian Networks","status":"public","year":"2016","date_updated":"2019-09-30T08:05:55Z"},{"date_updated":"2019-05-27T09:13:54Z","author":[{"last_name":"Kohl","first_name":"Sergej","full_name":"Kohl, Sergej"},{"id":"21220","last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter"},{"full_name":"Schulze, Sebastian","last_name":"Schulze","first_name":"Sebastian"}],"year":"2016","title":"Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS","status":"public","user_id":"55222","_id":"9963","language":[{"iso":"eng"}],"page":"1-12","abstract":[{"lang":"eng","text":"Tire-wheel assembly is the only connection between road and vehicle. Contacting directly with road within postcard size of contact area, it is mounted and guided by the suspension system. Therefore kinematics and compliances of suspension system greatly influence the frictional coupling of tire tread elements and road surface asperities by affecting pressure and sliding velocity distribution in the contact zone. This study emphasizes the development of a numerical methodology for frictional rolling contact analysis with focus on interaction of suspension system dynamics and tire-road contact using ADAMS. For this purpose a comprehensive flexible multibody system of the multi-link rear suspension is established, where both flexible and rigid bodies are modeled to allow large displacements with included elastic effects. To meet accuracy requirements for the high frequency applications, such as road excitations, the amplitude- and frequency-dependency of rubber-metal bushings is included. Furthermore the proposed flexible viscoelastic suspension model is enhanced by a Flexible Ring Tire Model (FTire), which describes a 3D tire dynamic response and covers any road excitations by tread submodel connected to road surface model. Concerning the verification and validation procedure numerous experiments are carried out to confirm the validity and the accuracy of both the developed submodels and the entire model. The devised approach makes it possible to investigate the influence of suspension system design on dynamical rolling contact and to evaluate tire tread wear. Therefore it can be a useful tool to predict frictional power distribution within the contact area under more realistic conditions."}],"citation":{"short":"S. Kohl, W. Sextro, S. Schulze, in: The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016., Cyberjaya, Malaysia, 2016, 2016, pp. 1–12.","chicago":"Kohl, Sergej, Walter Sextro, and Sebastian Schulze. “Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis Using ADAMS.” In <i>The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.</i>, 1–12. Cyberjaya, Malaysia, 2016, 2016.","ieee":"S. Kohl, W. Sextro, and S. Schulze, “Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS,” in <i>The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.</i>, 2016, pp. 1–12.","apa":"Kohl, S., Sextro, W., &#38; Schulze, S. (2016). Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS. In <i>The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.</i> (pp. 1–12). Cyberjaya, Malaysia, 2016.","bibtex":"@inproceedings{Kohl_Sextro_Schulze_2016, place={Cyberjaya, Malaysia, 2016}, title={Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS}, booktitle={The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.}, author={Kohl, Sergej and Sextro, Walter and Schulze, Sebastian}, year={2016}, pages={1–12} }","ama":"Kohl S, Sextro W, Schulze S. Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS. In: <i>The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.</i> Cyberjaya, Malaysia, 2016; 2016:1-12.","mla":"Kohl, Sergej, et al. “Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis Using ADAMS.” <i>The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.</i>, 2016, pp. 1–12."},"publication":"The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.","department":[{"_id":"151"}],"type":"conference","keyword":["Kinematics and compliances","flexible viscoelastic suspension model","frictional rolling contact analysis","frictional power distribution."],"place":"Cyberjaya, Malaysia, 2016","date_created":"2019-05-27T09:13:14Z"},{"type":"conference","department":[{"_id":"151"}],"date_created":"2019-05-27T09:14:22Z","quality_controlled":"1","abstract":[{"lang":"eng","text":"This paper presents a benchmark data set for condition monitoring of rolling bearings in combination with an extensive description of the corresponding bearing damage, the data set generation by experiments and results of datadriven classifications used as a diagnostic method. The diagnostic method uses the motor current signal of an electromechanical drive system for bearing diagnostic. The advantage of this approach in general is that no additional sensors are required, as current measurements can be performed in existing frequency inverters. This will help to reduce the cost of future condition monitoring systems. A particular novelty of the present approach is the monitoring of damage in external bearings which are installed in the drive system but outside the electric motor. Nevertheless, the motor current signal is used as input for the detection of the damage. Moreover, a wide distribution of bearing damage is considered for the benchmark data set. The results of the classifications show that the motor current signal can be used to identify and classify bearing damage within the drive system. However, the classification accuracy is still low compared to classifications based on vibration signals. Further, dependency on properties of those bearing damage that were used for the generation of training data are observed, because training with data of artificially generated and real bearing damages lead to different accuracies. Altogether a verified and systematically generated data set is presented and published online for further research"}],"publication":"European Conference of the Prognostics and Health Management Society","citation":{"chicago":"Lessmeier, Christian, James Kuria Kimotho, Detmar Zimmer, and Walter Sextro. “Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification.” In <i>European Conference of the Prognostics and Health Management Society</i>, 2016.","short":"C. Lessmeier, J.K. Kimotho, D. Zimmer, W. Sextro, in: European Conference of the Prognostics and Health Management Society, 2016.","apa":"Lessmeier, C., Kimotho, J. K., Zimmer, D., &#38; Sextro, W. (2016). Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification. In <i>European Conference of the Prognostics and Health Management Society</i>.","ieee":"C. Lessmeier, J. K. Kimotho, D. Zimmer, and W. Sextro, “Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification,” in <i>European Conference of the Prognostics and Health Management Society</i>, 2016.","ama":"Lessmeier C, Kimotho JK, Zimmer D, Sextro W. Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification. In: <i>European Conference of the Prognostics and Health Management Society</i>. ; 2016.","bibtex":"@inproceedings{Lessmeier_Kimotho_Zimmer_Sextro_2016, title={Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification}, booktitle={European Conference of the Prognostics and Health Management Society}, author={Lessmeier, Christian and Kimotho, James Kuria and Zimmer, Detmar and Sextro, Walter}, year={2016} }","mla":"Lessmeier, Christian, et al. “Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification.” <i>European Conference of the Prognostics and Health Management Society</i>, 2016."},"user_id":"55222","_id":"9964","language":[{"iso":"eng"}],"date_updated":"2019-09-16T10:35:40Z","status":"public","title":"Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification","year":"2016","author":[{"first_name":"Christian","last_name":"Lessmeier","full_name":"Lessmeier, Christian"},{"full_name":"Kimotho, James Kuria","last_name":"Kimotho","first_name":"James Kuria"},{"full_name":"Zimmer, Detmar","first_name":"Detmar","last_name":"Zimmer"},{"last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter","id":"21220"}]},{"title":"Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation","year":"2016","status":"public","author":[{"full_name":"Meyer , Tobias","first_name":"Tobias","last_name":"Meyer "},{"full_name":"Unger, Andreas","first_name":"Andreas","last_name":"Unger"},{"full_name":"Althoff, Simon","first_name":"Simon","last_name":"Althoff"},{"id":"21220","last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter"},{"full_name":"Brökelmann, Michael","first_name":"Michael","last_name":"Brökelmann"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"last_name":"Guth","first_name":"Karsten","full_name":"Guth, Karsten"}],"date_updated":"2020-05-07T05:33:53Z","page":"622-628","_id":"9966","language":[{"iso":"eng"}],"doi":"10.1109/ECTC.2016.215","user_id":"210","publication":"IEEE 66th Electronic Components and Technology Conference","citation":{"ama":"Meyer  T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:622-628. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>","bibtex":"@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628} }","mla":"Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 622–28, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>.","chicago":"Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 622–28, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.215\">https://doi.org/10.1109/ECTC.2016.215</a>.","short":"T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.","apa":"Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., &#38; Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 622–628). <a href=\"https://doi.org/10.1109/ECTC.2016.215\">https://doi.org/10.1109/ECTC.2016.215</a>","ieee":"T. Meyer  <i>et al.</i>, “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 622–628."},"quality_controlled":"1","abstract":[{"lang":"eng","text":"Usage of copper wire bonds allows to push power boundaries imposed by aluminum wire bonds. Copper allows higher electrical, thermal and mechanical loads than aluminum, which currently is the most commonly used material in heavy wire bonding. This is the main driving factor for increased usage of copper in high power applications such as wind turbines, locomotives or electric vehicles. At the same time, usage of copper also increases tool wear and reduces the range of parameter values for a stable process, making the process more challenging. To overcome these drawbacks, parameter adaptation at runtime using self-optimization is desired. A self-optimizing system is based on system objectives that evaluate and quantify system performance. System parameters can be changed at runtime such that pre-selected objective values are reached. For adaptation of bond process parameters, model-based self-optimization is employed. Since it is based on a model of the system, the bond process was modeled. In addition to static model parameters such as wire and substrate material properties and vibration characteristics of transducer and tool, variable model inputs are process parameters. Main simulation result is bonded area in the wiresubstrate contact. This model is then used to find valid and optimal working points before operation. The working point is composed of normal force and ultrasonic voltage trajectories, which are usually determined experimentally. Instead, multiobjective optimalization is used to compute trajectories that simultaneously optimize bond quality, process duration, tool wear and probability of tool-substrate contacts. The values of these objectives are computed using the process model. At runtime, selection among pre-determined optimal working points is sufficient to prioritize individual objectives. This way, the computationally expensive process of numerically solving a multiobjective optimal control problem and the demanding high speed bonding process are separated. To evaluate to what extent the pre-defined goals of self-optimization are met, an offthe- shelf heavy wire bonding machine was modified to allow for parameter adaptation and for transmitting of measurement data at runtime. This data is received by an external computer system and evaluated to select a new working point. Then, new process parameters are sent to the modified bonding machine for use for subsequent bonds. With these components, a full self-optimizing system has been implemented."}],"project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210","_id":"92"}],"date_created":"2019-05-27T09:17:26Z","keyword":["Self-optimization","adaptive system","bond process","copper wire"],"type":"conference","department":[{"_id":"151"}]}]