[{"_id":"9967","language":[{"iso":"eng"}],"page":"1-11","user_id":"55222","author":[{"last_name":"Schulze","first_name":"Sebastian","full_name":"Schulze, Sebastian"},{"id":"21220","first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter"},{"full_name":"Kohl, Sergej","last_name":"Kohl","first_name":"Sergej"}],"title":"Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems","year":"2016","status":"public","date_updated":"2019-05-27T09:19:49Z","date_created":"2019-05-27T09:19:20Z","department":[{"_id":"151"}],"type":"conference","keyword":["model reduction","modal description","flexible multibody systems"],"citation":{"chicago":"Schulze, Sebastian, Walter Sextro, and Sergej Kohl. “Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems.” In <i>2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016</i>, 1–11, 2016.","short":"S. Schulze, W. Sextro, S. Kohl, in: 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, 2016, pp. 1–11.","ieee":"S. Schulze, W. Sextro, and S. Kohl, “Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems,” in <i>2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016</i>, 2016, pp. 1–11.","apa":"Schulze, S., Sextro, W., &#38; Kohl, S. (2016). Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems. In <i>2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016</i> (pp. 1–11).","bibtex":"@inproceedings{Schulze_Sextro_Kohl_2016, title={Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems}, booktitle={2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016}, author={Schulze, Sebastian and Sextro, Walter and Kohl, Sergej}, year={2016}, pages={1–11} }","ama":"Schulze S, Sextro W, Kohl S. Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems. In: <i>2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016</i>. ; 2016:1-11.","mla":"Schulze, Sebastian, et al. “Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems.” <i>2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016</i>, 2016, pp. 1–11."},"publication":"2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016","abstract":[{"text":"Multibody models of mechatronic systems are usually interdisciplinary and are continuously gaining complexity, due to a growing demand for comprehensive models of systems including effects of electro mechanics, elastic bodies, contacts and friction. To be capable of simulating large models with subassemblies and contact between bodies, reduction techniques are required, which need certain experience in the choice of parameters. This publication discusses different possibilities for the modal description of structures in flexible multibody models with application to an Adaptive Frontlighting System in ADAMS. It will be shown that mode count, assembling of structures before and after modal reduction and influence of damping parameters of particular structures and subassemblies affect the behavior of the entire system. A common reduction technique for flexible structures in multibody models is the component mode synthesis, which uses a certain number of modes for description of the modal behavior of a structure. The influence of the mode count will be shown by means of different modal descriptions of one structure that contributes to a comprehensive model. Another study will prove that modal data of subassemblies and assemblies of modal reduced single structures lead to different models. The definition of damping parameters depends on the number of structures that have been added to an assembly before modal reduction and on the number of modal reduced structures. The comparison of subassemblies and the entire model to experimental data will highlight the accuracy, computational overhead, complexity of models and modeling efficiency of the comprehensive model for the frontlighting system.","lang":"eng"}]},{"date_updated":"2020-05-07T05:33:53Z","status":"public","title":"Validated Simulation of the Ultrasonic Wire Bonding Process","year":"2016","author":[{"full_name":"Unger, Andreas","first_name":"Andreas","last_name":"Unger"},{"id":"28647","full_name":"Schemmel, Reinhard","first_name":"Reinhard","last_name":"Schemmel"},{"last_name":"Meyer","first_name":"Tobias","full_name":"Meyer, Tobias"},{"last_name":"Eacock","first_name":"Florian","full_name":"Eacock, Florian"},{"full_name":"Eichwald, Paul","first_name":"Paul","last_name":"Eichwald"},{"full_name":"Althoff, Simon","first_name":"Simon","last_name":"Althoff"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"},{"full_name":"Brökelmann, Michael","first_name":"Michael","last_name":"Brökelmann"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"},{"first_name":"Karsten","last_name":"Guth","full_name":"Guth, Karsten"}],"user_id":"210","page":"251-254","language":[{"iso":"eng"}],"_id":"9968","abstract":[{"lang":"eng","text":"To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tooltip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard’s wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage."}],"quality_controlled":"1","project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210","_id":"92"}],"publication":"Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016","citation":{"mla":"Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–54.","apa":"Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S., … Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i> (pp. 251–254). IEEE CPMT Symposium Japan.","ieee":"A. Unger <i>et al.</i>, “Validated Simulation of the Ultrasonic Wire Bonding Process,” in <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–254.","chicago":"Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 251–54. IEEE CPMT Symposium Japan, 2016.","short":"A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.","ama":"Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>. IEEE CPMT Symposium Japan; 2016:251-254.","bibtex":"@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }"},"type":"conference","keyword":["the Ultrasonic Wire Bonding Process"],"department":[{"_id":"151"}],"place":"IEEE CPMT Symposium Japan","date_created":"2019-05-27T09:20:10Z"},{"date_created":"2019-05-27T08:10:43Z","department":[{"_id":"151"}],"type":"conference","citation":{"ieee":"S. Althoff, A. Unger, W. Sextro, and F. Eacock, “Improving the cleaning process in copper wire bonding by adapting bonding parameters,” in <i>2015 17th Electronics Packaging Technology Conference</i>, 2015, pp. 1–6.","apa":"Althoff, S., Unger, A., Sextro, W., &#38; Eacock, F. (2015). Improving the cleaning process in copper wire bonding by adapting bonding parameters. In <i>2015 17th Electronics Packaging Technology Conference</i> (pp. 1–6). <a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">https://doi.org/10.1109/EPTC.2015.7412402</a>","chicago":"Althoff, Simon, Andreas Unger, Walter Sextro, and Florian Eacock. “Improving the Cleaning Process in Copper Wire Bonding by Adapting Bonding Parameters.” In <i>2015 17th Electronics Packaging Technology Conference</i>, 1–6, 2015. <a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">https://doi.org/10.1109/EPTC.2015.7412402</a>.","short":"S. Althoff, A. Unger, W. Sextro, F. Eacock, in: 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6.","mla":"Althoff, Simon, et al. “Improving the Cleaning Process in Copper Wire Bonding by Adapting Bonding Parameters.” <i>2015 17th Electronics Packaging Technology Conference</i>, 2015, pp. 1–6, doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">10.1109/EPTC.2015.7412402</a>.","bibtex":"@inproceedings{Althoff_Unger_Sextro_Eacock_2015, title={Improving the cleaning process in copper wire bonding by adapting bonding parameters}, DOI={<a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">10.1109/EPTC.2015.7412402</a>}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Althoff, Simon and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2015}, pages={1–6} }","ama":"Althoff S, Unger A, Sextro W, Eacock F. Improving the cleaning process in copper wire bonding by adapting bonding parameters. In: <i>2015 17th Electronics Packaging Technology Conference</i>. ; 2015:1-6. doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">10.1109/EPTC.2015.7412402</a>"},"publication":"2015 17th Electronics Packaging Technology Conference","project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"quality_controlled":"1","abstract":[{"lang":"eng","text":"Changing manufacturing technologies or material in well-known processes has to be followed by an adaption of process parameters. In case of the transition from aluminum wire to copper wire in heavy wire bonding, the adaption effort is high due to the strongly different mechanical properties of the wire. One of these adaption aspects, apart from wire material, is the existent oxide layers on wire and substrate. The ductile aluminum oxide is not influencing the bonding process much, because it is supposed to break apart in case of plastic deformation. The lubricating copper oxide layer has to be removed before micro welds can develop. Therefore, in this paper, experiments are carried out at low frequency to determine the friction energy needed to abrade the copper oxide layer of wire and substrate, which is indicated by an increase in the resulting friction coefficient. The friction energy per contact area to remove the interfering layers at low frequency is compared to the real bonding process working at 58 kHz. In addition, a theoretical concept is being described to get a grasp of the occurring mechanism. In the end a proposal is given how to set bonding parameters to get the cleanest surfaces with the installed bond tool."}],"_id":"9943","language":[{"iso":"eng"}],"page":"1-6","doi":"10.1109/EPTC.2015.7412402","user_id":"210","author":[{"first_name":"Simon","last_name":"Althoff","full_name":"Althoff, Simon"},{"full_name":"Unger, Andreas","last_name":"Unger","first_name":"Andreas"},{"id":"21220","last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter"},{"last_name":"Eacock","first_name":"Florian","full_name":"Eacock, Florian"}],"status":"public","title":"Improving the cleaning process in copper wire bonding by adapting bonding parameters","year":"2015","date_updated":"2020-05-07T05:33:51Z"},{"issue":"2","publication":"tm - Technisches Messen","abstract":[{"text":"Eine Vielzahl von Prozessen in der Chemie und Verfahrenstechnik kann durch Ultraschall positiv beeinflusst werden. Oftmals ist ultraschallinduzierte Kavitation der Hauptwirkmechanismus für die positiven Effekte der Beschallung. Daher ist es notwendig die Kavitationsaktivität während des Prozesses zu quantifizieren um die Beschallung für den jeweiligen Prozess optimal gestalten und überwachen zu können. Eine Möglichkeit der prozessbegleitenden Kavitationsdetektion ist die Auswertung der akustischen Emissionen von oszillierenden und kollabierenden Kavitationsblasen mittels Drucksensoren in der Flüssigkeit. Raue Prozessrandbedingungen wie hohe Temperaturen oder aggressive Flüssigkeiten erschweren es jedoch geeignete Sensoren zu finden. Als Alternative wurde daher die Nutzbarkeit der Rückwirkung von Kavitationsereignissen auf das elektrische Eingansgssignal des Ultraschallwandlers zur Quantifizierung von Kavitation untersucht. Die experimentelle Analyse hat ergeben, dass das Einsetzen und in einigen Fällen auch die Art der Kavitation auf Basis der Rückwirkung auf das Stromsignal des Ultraschallwandlers bestimmt werden kann. Die Stärke der Kavitation war hingegen nicht aus den Stromsignalen abzuleiten.","lang":"eng"}],"date_created":"2019-05-27T08:13:40Z","keyword":["Kavitationsdetektion","Self-Sensing","So- nochemie","Ultraschallwandler"],"type":"journal_article","department":[{"_id":"151"}],"year":"2015","title":"Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler","author":[{"full_name":"Bornmann, Peter","first_name":"Peter","last_name":"Bornmann"},{"full_name":"Hemsel, Tobias","first_name":"Tobias","last_name":"Hemsel","id":"210"},{"id":"21220","full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro"},{"full_name":"Memoli, Gianluca","last_name":"Memoli","first_name":"Gianluca"},{"full_name":"Hodnett, Mark","last_name":"Hodnett","first_name":"Mark"},{"full_name":"Zeqiri, Bajram","last_name":"Zeqiri","first_name":"Bajram"}],"date_updated":"2019-09-16T10:44:38Z","intvolume":"        82","language":[{"iso":"eng"}],"doi":"10.1515/teme-2015-0017","popular_science":"1","citation":{"mla":"Bornmann, Peter, et al. “Kavitationsdetektion Mittels Self-Sensing-Ultraschallwandler.” <i>Tm - Technisches Messen</i>, vol. 82, no. 2, 2015, pp. 73–84, doi:<a href=\"https://doi.org/10.1515/teme-2015-0017\">10.1515/teme-2015-0017</a>.","ama":"Bornmann P, Hemsel T, Sextro W, Memoli G, Hodnett M, Zeqiri B. Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler. <i>tm - Technisches Messen</i>. 2015;82(2):73-84. doi:<a href=\"https://doi.org/10.1515/teme-2015-0017\">10.1515/teme-2015-0017</a>","bibtex":"@article{Bornmann_Hemsel_Sextro_Memoli_Hodnett_Zeqiri_2015, title={Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler}, volume={82}, DOI={<a href=\"https://doi.org/10.1515/teme-2015-0017\">10.1515/teme-2015-0017</a>}, number={2}, journal={tm - Technisches Messen}, author={Bornmann, Peter and Hemsel, Tobias and Sextro, Walter and Memoli, Gianluca and Hodnett, Mark and Zeqiri, Bajram}, year={2015}, pages={73–84} }","apa":"Bornmann, P., Hemsel, T., Sextro, W., Memoli, G., Hodnett, M., &#38; Zeqiri, B. (2015). Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler. <i>Tm - Technisches Messen</i>, <i>82</i>(2), 73–84. <a href=\"https://doi.org/10.1515/teme-2015-0017\">https://doi.org/10.1515/teme-2015-0017</a>","ieee":"P. Bornmann, T. Hemsel, W. Sextro, G. Memoli, M. Hodnett, and B. Zeqiri, “Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler,” <i>tm - Technisches Messen</i>, vol. 82, no. 2, pp. 73–84, 2015.","chicago":"Bornmann, Peter, Tobias Hemsel, Walter Sextro, Gianluca Memoli, Mark Hodnett, and Bajram Zeqiri. “Kavitationsdetektion Mittels Self-Sensing-Ultraschallwandler.” <i>Tm - Technisches Messen</i> 82, no. 2 (2015): 73–84. <a href=\"https://doi.org/10.1515/teme-2015-0017\">https://doi.org/10.1515/teme-2015-0017</a>.","short":"P. Bornmann, T. Hemsel, W. Sextro, G. Memoli, M. Hodnett, B. Zeqiri, Tm - Technisches Messen 82 (2015) 73–84."},"status":"public","page":"73-84","_id":"9944","user_id":"55222","volume":82},{"page":"101-112","_id":"9945","publisher":"Heinz Nixdorf Institut, Universität Paderborn","user_id":"55222","editor":[{"last_name":"Gausemeier","first_name":"Jürgen","full_name":"Gausemeier, Jürgen"},{"last_name":"Dumitrescu","first_name":"Roman","full_name":"Dumitrescu, Roman"},{"full_name":"Rammig, Franz","last_name":"Rammig","first_name":"Franz"},{"full_name":"Schäfer, Wilhelm","last_name":"Schäfer","first_name":"Wilhelm"},{"first_name":"Ansgar","last_name":"Trächtler","full_name":"Trächtler, Ansgar"}],"status":"public","place":"Paderborn","citation":{"chicago":"Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Integrierte Modellierung Der Dynamik Und Der Verlässlichkeit Komplexer Mechatronischer Systeme.” In <i>10. Paderborner Workshop Entwurf Mechatronischer Systeme</i>, edited by Jürgen Gausemeier, Roman Dumitrescu, Franz Rammig, Wilhelm Schäfer, and Ansgar Trächtler, 101–12. HNI-Verlagsschriftenreihe. Paderborn: Heinz Nixdorf Institut, Universität Paderborn, 2015.","short":"T. Kaul, T. Meyer, W. Sextro, in: J. Gausemeier, R. Dumitrescu, F. Rammig, W. Schäfer, A. Trächtler (Eds.), 10. Paderborner Workshop Entwurf Mechatronischer Systeme, Heinz Nixdorf Institut, Universität Paderborn, Paderborn, 2015, pp. 101–112.","ieee":"T. Kaul, T. Meyer, and W. Sextro, “Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme,” in <i>10. Paderborner Workshop Entwurf mechatronischer Systeme</i>, 2015, pp. 101–112.","apa":"Kaul, T., Meyer, T., &#38; Sextro, W. (2015). Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme. In J. Gausemeier, R. Dumitrescu, F. Rammig, W. Schäfer, &#38; A. Trächtler (Eds.), <i>10. Paderborner Workshop Entwurf mechatronischer Systeme</i> (pp. 101–112). Paderborn: Heinz Nixdorf Institut, Universität Paderborn.","bibtex":"@inproceedings{Kaul_Meyer_Sextro_2015, place={Paderborn}, series={HNI-Verlagsschriftenreihe}, title={Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme}, booktitle={10. Paderborner Workshop Entwurf mechatronischer Systeme}, publisher={Heinz Nixdorf Institut, Universität Paderborn}, author={Kaul, Thorben and Meyer, Tobias and Sextro, Walter}, editor={Gausemeier, Jürgen and Dumitrescu, Roman and Rammig, Franz and Schäfer, Wilhelm and Trächtler, AnsgarEditors}, year={2015}, pages={101–112}, collection={HNI-Verlagsschriftenreihe} }","ama":"Kaul T, Meyer T, Sextro W. Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme. In: Gausemeier J, Dumitrescu R, Rammig F, Schäfer W, Trächtler A, eds. <i>10. Paderborner Workshop Entwurf Mechatronischer Systeme</i>. HNI-Verlagsschriftenreihe. Paderborn: Heinz Nixdorf Institut, Universität Paderborn; 2015:101-112.","mla":"Kaul, Thorben, et al. “Integrierte Modellierung Der Dynamik Und Der Verlässlichkeit Komplexer Mechatronischer Systeme.” <i>10. Paderborner Workshop Entwurf Mechatronischer Systeme</i>, edited by Jürgen Gausemeier et al., Heinz Nixdorf Institut, Universität Paderborn, 2015, pp. 101–12."},"quality_controlled":"1","language":[{"iso":"eng"}],"series_title":"HNI-Verlagsschriftenreihe","title":"Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme","year":"2015","author":[{"id":"14802","first_name":"Thorben","last_name":"Kaul","full_name":"Kaul, Thorben"},{"full_name":"Meyer, Tobias","first_name":"Tobias","last_name":"Meyer"},{"full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro","id":"21220"}],"date_updated":"2019-09-30T08:06:51Z","date_created":"2019-05-27T08:17:18Z","keyword":["Verlässlichkeit","Zuverlässigkeit","Dynamik","integrierte Modellierung"],"type":"conference","department":[{"_id":"151"}],"publication":"10. Paderborner Workshop Entwurf mechatronischer Systeme","abstract":[{"text":"Die starke Integration von Sensorik, Aktorik, Hard- und Software stellt Herausforderungen an die Verlässlichkeit intelligenter mechatronischer Systeme dar. Diese Systeme verfügen aber auch über großes Potential zur Verbesserung ihrer Verlässlichkeit durch eine Anpassung des Systemverhaltens an den aktuellen Zustand. Um den Umfang der Systemmodelle zu reduzieren und die Anpassung des Systemverhaltens zu ermöglichen, sind fortschrittliche Modellierungsmethoden notwendig, mit denen die Verlässlichkeit in frühen Phasen des Entwicklungsprozesses sichergestellt und evaluiert werden kann. Von den Attributen der Verlässlichkeit ist insbesondere die Zuverlässigkeit in hohem Maße von den auftretenden Belastungen an den Komponenten und damit vom dynamischen Systemverhalten abhängig. Bisherige Modellierungsansätze bilden diese Abhängigkeit nur unzureichend ab. Es wird daher ein Ansatz zur integrierten Modellierung mechatronischer Systeme vorgestellt. Dieser ist in der Lage, sowohl die Dynamik als auch die Zuverlässigkeit des Systems abzubilden. Die Transformation eines Modells des dynamischen Systemverhaltens generiert dabei ein Zuverlässigkeitsmodell. Für typischerweise konkurrierende Ziele können mit Hilfe von Mehrzieloptimierungsverfahren Betriebspunkte eines Systems bestimmt werden. Das integrierte Modell kann zur Erzeugung von Zielfunktionen für die Dynamik als auch für die Zuverlässigkeit genutzt werden. Die Ergebnisse ermöglichen eine Verhaltensanpassung durch Wahl eines paretooptimalen Betriebspunkts während des Betriebs. Das vorgeschlagene Konzept zur integrierten Modellierung mechatronischer Systeme bietet aufgrund des modellbasierten Entwicklungsansatzes und der automatisierten Transformation eines Verlässlichkeitsmodells eine Reduktion der Benutzereingaben und eine Entlastung des Benutzers. Dadurch wird die Wahrscheinlichkeit von Benutzerfehlern gesenkt und die Verlässlichkeit bereits während der Entwicklung erhöht. Somit können Iterationsschleifen vermieden und die Entwicklungskosten gesenkt werden.","lang":"eng"}]},{"date_created":"2019-05-27T08:20:55Z","place":"London","type":"conference","department":[{"_id":"151"}],"publication":"European Safety and Reliability Conference (ESREL2015)","citation":{"short":"T. Kaul, T. Meyer, W. Sextro, in: P. et al.} (Ed.), European Safety and Reliability Conference (ESREL2015), Taylor and Francis, London, 2015.","chicago":"Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems.” In <i>European Safety and Reliability Conference (ESREL2015)</i>, edited by Podofillini et al.}. London: Taylor and Francis, 2015. <a href=\"https://doi.org/10.1201/b19094-290\">https://doi.org/10.1201/b19094-290</a>.","ieee":"T. Kaul, T. Meyer, and W. Sextro, “Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems,” in <i>European Safety and Reliability Conference (ESREL2015)</i>, 2015.","apa":"Kaul, T., Meyer, T., &#38; Sextro, W. (2015). Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems. In P. et al.} (Ed.), <i>European Safety and Reliability Conference (ESREL2015)</i>. London: Taylor and Francis. <a href=\"https://doi.org/10.1201/b19094-290\">https://doi.org/10.1201/b19094-290</a>","bibtex":"@inproceedings{Kaul_Meyer_Sextro_2015, place={London}, title={Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems}, DOI={<a href=\"https://doi.org/10.1201/b19094-290\">10.1201/b19094-290</a>}, booktitle={European Safety and Reliability Conference (ESREL2015)}, publisher={Taylor and Francis}, author={Kaul, Thorben and Meyer, Tobias and Sextro, Walter}, editor={et al.}, PodofilliniEditor}, year={2015} }","ama":"Kaul T, Meyer T, Sextro W. Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems. In: et al.} P, ed. <i>European Safety and Reliability Conference (ESREL2015)</i>. London: Taylor and Francis; 2015. doi:<a href=\"https://doi.org/10.1201/b19094-290\">10.1201/b19094-290</a>","mla":"Kaul, Thorben, et al. “Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems.” <i>European Safety and Reliability Conference (ESREL2015)</i>, edited by Podofillini et al.}, Taylor and Francis, 2015, doi:<a href=\"https://doi.org/10.1201/b19094-290\">10.1201/b19094-290</a>."},"abstract":[{"lang":"eng","text":"Intelligent mechatronic systems are able to autonomously adapt system behavior to current environmental conditions and to system states. To allow for such reactions, complex sensor and actuator systems as well as sophisticated information processing are required, making these systems increasingly complex. However, with the risk of increased system complexity also comes the chance to adapt system behavior based on current reliability and in turn to increase reliability. The adaptation is based on switching selecting an appropriate working point at runtime. Multiple suitable working points can be found using multi-objective optimization techniques, which require an accurate system model including system reliability. At present, modeling of system reliability is a laborious manual task performed by reliability modelling experts. Despite actual system reliability being highly dependent on system dynamics, pre-existing system dynamics models and the resulting reliability model are at best loosely coupled. To allow for closer interaction among dynamics and reliability model and to ensure these are always synchronized, advanced modeling techniques are required. Therefore, an integrated model is introduced that reduces user input to a minimum and that integrates system dynamics and system reliability."}],"quality_controlled":"1","publisher":"Taylor and Francis","_id":"9946","language":[{"iso":"eng"}],"user_id":"55222","doi":"10.1201/b19094-290","editor":[{"last_name":"et al.}","first_name":"Podofillini","full_name":"et al.}, Podofillini"}],"title":"Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems","year":"2015","status":"public","author":[{"full_name":"Kaul, Thorben","last_name":"Kaul","first_name":"Thorben","id":"14802"},{"last_name":"Meyer","first_name":"Tobias","full_name":"Meyer, Tobias"},{"id":"21220","last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter"}],"date_updated":"2019-09-30T08:07:29Z"},{"user_id":"55222","volume":6,"_id":"9947","language":[{"iso":"eng"}],"date_updated":"2019-05-27T08:25:44Z","intvolume":"         6","title":"Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics","status":"public","year":"2015","author":[{"first_name":"James Kuria","last_name":"Kimotho","full_name":"Kimotho, James Kuria"},{"full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter","id":"21220"}],"keyword":["ensemble methods","combined prognostics","data fusion"],"type":"conference","department":[{"_id":"151"}],"date_created":"2019-05-27T08:24:50Z","abstract":[{"text":"This paper presents a comparison of a number of prognostic methods with regard to algorithm complexity and performance based on prognostic metrics. This information serves as a guide for selection and design of prognostic systems for real-time condition monitoring of technical systems. The methods are evaluated on ability to estimate the remaining useful life of rolling element bearing. Run-to failure vibration and temperature data is used in the analysis. The sampled prognostic methods include wear-temperature correlation method, health state estimation using temperature measurement, a multi-model particle filter approach with model parameter adaptation utilizing temperature measurements, prognostics through health state estimation and mapping extracted features to the remaining useful life through regression approach. Although the performance of the methods utilizing the vibration measurements is much better than the methods using temperature measurements, the methods using temperature measurements are quite promising in terms of reducing the overall cost of the condition monitoring system as well as the computational time. An ensemble of the presented methods through weighted average is also introduced. The results show that the methods are able to estimate the remaining useful life within error bounds of +-15\\%, which can be further reduced to +-5\\% with the ensemble approach.","lang":"eng"}],"publication":"Annual Conference of the Prognostics and Health Management Society 2015","citation":{"mla":"Kimotho, James Kuria, and Walter Sextro. “Comparison and Ensemble of Temperature-Based and Vibration-Based Methods for Machinery Prognostics.” <i>Annual Conference of the Prognostics and Health Management Society 2015</i>, vol. 6, 2015.","ama":"Kimotho JK, Sextro W. Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics. In: <i>Annual Conference of the Prognostics and Health Management Society 2015</i>. Vol 6. ; 2015.","bibtex":"@inproceedings{Kimotho_Sextro_2015, title={Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics}, volume={6}, booktitle={Annual Conference of the Prognostics and Health Management Society 2015}, author={Kimotho, James Kuria and Sextro, Walter}, year={2015} }","apa":"Kimotho, J. K., &#38; Sextro, W. (2015). Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics. In <i>Annual Conference of the Prognostics and Health Management Society 2015</i> (Vol. 6).","ieee":"J. K. Kimotho and W. Sextro, “Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics,” in <i>Annual Conference of the Prognostics and Health Management Society 2015</i>, 2015, vol. 6.","chicago":"Kimotho, James Kuria, and Walter Sextro. “Comparison and Ensemble of Temperature-Based and Vibration-Based Methods for Machinery Prognostics.” In <i>Annual Conference of the Prognostics and Health Management Society 2015</i>, Vol. 6, 2015.","short":"J.K. Kimotho, W. Sextro, in: Annual Conference of the Prognostics and Health Management Society 2015, 2015."}},{"page":"940-945","language":[{"iso":"eng"}],"_id":"9949","doi":"10.1016/j.ifacol.2015.09.647","user_id":"55222","year":"2015","title":"Advantages of reliability-adaptive system operation for maintenance planning","status":"public","author":[{"last_name":"Meyer","first_name":"Tobias","full_name":"Meyer, Tobias"},{"id":"14802","full_name":"Kaul, Thorben","last_name":"Kaul","first_name":"Thorben"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"}],"date_updated":"2019-09-16T10:43:42Z","date_created":"2019-05-27T08:29:40Z","keyword":["Adaptive systems","Reliability analysis","Availability","Adaptive control","Maintenance","Self-optimizing systems","Self-optimizing control","Stochastic Petri-nets"],"type":"conference","department":[{"_id":"151"}],"publication":"Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes","citation":{"mla":"Meyer, Tobias, et al. “Advantages of Reliability-Adaptive System Operation for Maintenance Planning.” <i>Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes</i>, 2015, pp. 940–45, doi:<a href=\"https://doi.org/10.1016/j.ifacol.2015.09.647\">10.1016/j.ifacol.2015.09.647</a>.","ama":"Meyer T, Kaul T, Sextro W. Advantages of reliability-adaptive system operation for maintenance planning. In: <i>Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes</i>. ; 2015:940-945. doi:<a href=\"https://doi.org/10.1016/j.ifacol.2015.09.647\">10.1016/j.ifacol.2015.09.647</a>","bibtex":"@inproceedings{Meyer_Kaul_Sextro_2015, title={Advantages of reliability-adaptive system operation for maintenance planning}, DOI={<a href=\"https://doi.org/10.1016/j.ifacol.2015.09.647\">10.1016/j.ifacol.2015.09.647</a>}, booktitle={Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes}, author={Meyer, Tobias and Kaul, Thorben and Sextro, Walter}, year={2015}, pages={940–945} }","apa":"Meyer, T., Kaul, T., &#38; Sextro, W. (2015). Advantages of reliability-adaptive system operation for maintenance planning. In <i>Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes</i> (pp. 940–945). <a href=\"https://doi.org/10.1016/j.ifacol.2015.09.647\">https://doi.org/10.1016/j.ifacol.2015.09.647</a>","ieee":"T. Meyer, T. Kaul, and W. Sextro, “Advantages of reliability-adaptive system operation for maintenance planning,” in <i>Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes</i>, 2015, pp. 940–945.","short":"T. Meyer, T. Kaul, W. Sextro, in: Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes, 2015, pp. 940–945.","chicago":"Meyer, Tobias, Thorben Kaul, and Walter Sextro. “Advantages of Reliability-Adaptive System Operation for Maintenance Planning.” In <i>Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes</i>, 940–45, 2015. <a href=\"https://doi.org/10.1016/j.ifacol.2015.09.647\">https://doi.org/10.1016/j.ifacol.2015.09.647</a>."},"abstract":[{"text":"Intelligent mechatronic systems other the possibility to adapt system behavior to current dependability. This can be used to assure reliability by controlling system behavior to reach a pre-defined lifetime. By using such closed loop control, the margin of error of useful lifetime of an individual system is lowered. It is also possible to change the pre-defined lifetime during operation, by adapting system behavior to derate component usage. When planning maintenance actions, the remaining useful lifetime of each individual system has to be taken into account. Usually, stochastic properties of a fleet of systems are analyzed to create maintenance plans. Among these, the main factor is the probability of an individual system to last until maintenance. If condition-based maintenance is used, this is updated for each individual system using available information about its current state. By lowering the margin of error of useful lifetime, which directly corresponds to the time until maintenance, extended maintenance periods are made possible. Also using reliability-adaptive operation, a reversal of degradation driven maintenance planning is possible where a maintenance plan is setup not only according to system properties, but mainly to requirements imposed by maintenance personnel or infrastructure. Each system then adapts its behavior accordingly and fails according to the maintenance plan, making better use of maintenance personnel and system capabilities at the same time. In this contribution, the potential of maintenance plan driven system behavior adaptation is shown. A model including adaptation process and maintenance actions is simulated over full system lifetime to assess the advantages gained.","lang":"eng"}],"quality_controlled":"1"},{"year":"2015","status":"public","title":"Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme","author":[{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"full_name":"Kimotho, James Kuria","last_name":"Kimotho","first_name":"James Kuria"},{"last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter","id":"21220"}],"date_updated":"2019-09-30T08:09:22Z","page":"111-122","language":[{"iso":"eng"}],"_id":"9950","user_id":"55222","issue":"2260","publication":"27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger Produkte","citation":{"ieee":"T. Meyer, J. K. Kimotho, and W. Sextro, “Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme,” in <i>27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger Produkte</i>, 2015, no. 2260, pp. 111–122.","apa":"Meyer, T., Kimotho, J. K., &#38; Sextro, W. (2015). Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme. In <i>27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger Produkte</i> (pp. 111–122). Leonberg.","mla":"Meyer, Tobias, et al. “Anforderungen an Condition-Monitoring-Verfahren Zur Nutzung Im Zuverläsigkeitsgeregelten Betrieb Adaptiver Systeme.” <i>27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte</i>, no. 2260, 2015, pp. 111–22.","bibtex":"@inproceedings{Meyer_Kimotho_Sextro_2015, place={Leonberg}, title={Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme}, number={2260}, booktitle={27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger Produkte}, author={Meyer, Tobias and Kimotho, James Kuria and Sextro, Walter}, year={2015}, pages={111–122} }","chicago":"Meyer, Tobias, James Kuria Kimotho, and Walter Sextro. “Anforderungen an Condition-Monitoring-Verfahren Zur Nutzung Im Zuverläsigkeitsgeregelten Betrieb Adaptiver Systeme.” In <i>27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte</i>, 111–22. Leonberg, 2015.","short":"T. Meyer, J.K. Kimotho, W. Sextro, in: 27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte, Leonberg, 2015, pp. 111–122.","ama":"Meyer T, Kimotho JK, Sextro W. Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme. In: <i>27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte</i>. Leonberg; 2015:111-122."},"quality_controlled":"1","abstract":[{"lang":"eng","text":"Intelligente technische Systeme, die in der Lage sind, sich an geänderte Umgebungsbedingungen anzupassen, ermöglichen eine Adaption anhand der aktuell erreichten Zuverlässigkeit. Zu diesem Zwecke kann ein geschlossener Regelkreis formuliert werden, der dazu geeignet ist, den Betriebspunkt des Systems während der gesamten Lebensdauer anzupassen. Dadurch wird eine harte Umschaltung während des Betriebs vermieden und die Verhaltensanpassung ist vom Nutzer weitgehend unbemerkt möglich. Dazu wird die aktuelle Restlebensdauer mit einer vorgegebenen Restlebensdauer verglichen. Durch Änderung der vorgegebenen Restlebensdauer lässt sich auch eine Anpassung der gewünschten Nutzungsdauer erreichen, beispielsweise um veränderte Wartungsintervalle einzuhalten. Zu diesem Zwecke ist es allerdings notwendig, die aktuell erreichte Zuverlässigkeit zu schätzen. Für die Regelung ist dabei die aktuelle Restlebensdauer der wichtigste Parameter, da er als Istwert direkt mit der gewünschten Restlebensdauer als Sollwert verglichen wird und als Reglereingang dient. Für die Genauigkeit der Regelung ist daher die Bestimmung der Restlebensdauer von entscheidender Bedeutung. Es wird ein Modell des Regelkreises vorgestellt, das auch den Einfluss einer fehlerhaften Restlebensdauerschätzung auf die Verhaltensanpassung abbildet. Dadurch ist es möglich, Grenzen der Verhaltensanpassung und die zur Einhaltung notwendige Genauigkeit der Restlebensdauerschätzung zu bestimmen. Es gibt zahlreiche Ansätze, die Restlebensdauer zu schätzen, die aufgeteilt werden in modellbasierte Verfahren und datengetriebene Verfahren. Die individuelle Eignung eines jeden Verfahrens sowie die Modellbildung oder die Nutzung geeigneter Algorithmen ist stark systemabhängig. Um die Auswahl von Verfahren und Modellen oder Algorithmen zu ermöglichen, werden zunächst die Anforderungen an die Restlebensdauerschätzung zur Nutzung als Regelungs-Istwert bestimmt. Verschiedene Verfahren werden sodann hinsichtlich ihrer Eignung evaluiert und Anwendungsgrenzen aufgezeigt."}],"place":"Leonberg","date_created":"2019-05-27T08:31:38Z","type":"conference","department":[{"_id":"151"}]},{"date_updated":"2020-05-07T05:33:52Z","author":[{"last_name":"Meyer","first_name":"Tobias","full_name":"Meyer, Tobias"},{"full_name":"Unger, Andreas","last_name":"Unger","first_name":"Andreas"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"},{"last_name":"Brökelmann","first_name":"Michael","full_name":"Brökelmann, Michael"},{"last_name":"Hunstig","first_name":"Matthias","full_name":"Hunstig, Matthias"},{"full_name":"Guth, Karsten","first_name":"Karsten","last_name":"Guth"}],"status":"public","year":"2015","title":"Modeling and simulation of the ultrasonic wire bonding process","user_id":"210","doi":"10.1109/EPTC.2015.7412377","_id":"9951","language":[{"iso":"eng"}],"project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"quality_controlled":"1","abstract":[{"text":"Ultrasonic wire bonding is an indispensable process in the manufacturing of semiconductor components. It is used for interconnecting the silicon die to e.g. connectors in the housing or to other semiconductors in complex components. In high power applications, such as wind turbines, locomotives or electric vehicles, the thermal and mechanical limits of interconnects made from aluminum are nearing. The limits could be overcome using copper wire bonds, but their manufacturing poses challenges due to the harder material, which leads to increased wear of the bond tools and to less reliable production. To overcome these drawbacks, adaptation of process parameters at runtime is employed. However, the range of parameter values for which a stable process can be maintained is very small, making it necessary to compute suitable parameters beforehand. To this end, and to gain insights into the process itself, the ultrasonic bonding process is modeled. The full model is composed of several partial models, some of which were introduced before. This paper focuses on the modularization of the full model and on the interaction of partial models. All partial models are presented, their interaction is shown and the general outline of the simulation process is given.","lang":"eng"}],"citation":{"apa":"Meyer, T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., &#38; Guth, K. (2015). Modeling and simulation of the ultrasonic wire bonding process. In <i>2015 17th Electronics Packaging Technology Conference</i>. <a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">https://doi.org/10.1109/EPTC.2015.7412377</a>","ieee":"T. Meyer <i>et al.</i>, “Modeling and simulation of the ultrasonic wire bonding process,” in <i>2015 17th Electronics Packaging Technology Conference</i>, 2015.","short":"T. Meyer, A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: 2015 17th Electronics Packaging Technology Conference, 2015.","chicago":"Meyer, Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” In <i>2015 17th Electronics Packaging Technology Conference</i>, 2015. <a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">https://doi.org/10.1109/EPTC.2015.7412377</a>.","mla":"Meyer, Tobias, et al. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” <i>2015 17th Electronics Packaging Technology Conference</i>, 2015, doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">10.1109/EPTC.2015.7412377</a>.","ama":"Meyer T, Unger A, Althoff S, et al. Modeling and simulation of the ultrasonic wire bonding process. In: <i>2015 17th Electronics Packaging Technology Conference</i>. ; 2015. doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">10.1109/EPTC.2015.7412377</a>","bibtex":"@inproceedings{Meyer_Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2015, title={Modeling and simulation of the ultrasonic wire bonding process}, DOI={<a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">10.1109/EPTC.2015.7412377</a>}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Meyer, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2015} }"},"publication":"2015 17th Electronics Packaging Technology Conference","department":[{"_id":"151"}],"type":"conference","date_created":"2019-05-27T08:34:21Z"},{"language":[{"iso":"eng"}],"_id":"9952","page":"1109-1117","user_id":"55222","author":[{"last_name":"Schulte","first_name":"Frank","full_name":"Schulte, Frank"},{"last_name":"Neuhaus","first_name":"Jan","full_name":"Neuhaus, Jan"},{"id":"21220","full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro"}],"title":"A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties","status":"public","year":"2015","date_updated":"2019-09-16T10:47:53Z","date_created":"2019-05-27T08:37:22Z","department":[{"_id":"151"}],"keyword":["Contact Mechanics","Viscoelastic Material","Adhesive Friction","Hysteresis Friction","Energy Dissipation","Vibration"],"type":"conference","citation":{"ieee":"F. Schulte, J. Neuhaus, and W. Sextro, “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties,” in <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>, 2015, pp. 1109–1117.","apa":"Schulte, F., Neuhaus, J., &#38; Sextro, W. (2015). A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i> (pp. 1109–1117).","chicago":"Schulte, Frank, Jan Neuhaus, and Walter Sextro. “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties.” In <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>, 1109–17, 2015.","short":"F. Schulte, J. Neuhaus, W. Sextro, in: Proceedings of ICoEV 2015 International Conference on Engineering Vibration, 2015, pp. 1109–1117.","mla":"Schulte, Frank, et al. “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties.” <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>, 2015, pp. 1109–17.","bibtex":"@inproceedings{Schulte_Neuhaus_Sextro_2015, title={A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties}, booktitle={Proceedings of ICoEV 2015 International Conference on Engineering Vibration}, author={Schulte, Frank and Neuhaus, Jan and Sextro, Walter}, year={2015}, pages={1109–1117} }","ama":"Schulte F, Neuhaus J, Sextro W. A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In: <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>. ; 2015:1109-1117."},"publication":"Proceedings of ICoEV 2015 International Conference on Engineering Vibration","quality_controlled":"1","abstract":[{"text":"The contact between viscoelastic materials e.g. elastomers and a rough surface leads to a special friction characteristic, which differs greatly in its properties comparing to other materials like metals. In practice, this friction combination occurs for example in the tire-road contact, or in the use of rubber gaskets. Due to the frictional forces a system is significantly influenced in its vibrational properties. The friction force is composed of two main components adhesion and hysteresis. The adhesion results from molecular bounds between the contact partners, while the deformation of the viscoelastic material by the roughness of the counter body leads to power loss. This internal friction results in an additional frictional force, which is described by the hysteresis. To simulate the frictional behaviour of elastomers on rough surfaces and thus to determine the energy dissipation in contact, it is necessary to develop a mechanical model which considers the roughness of the contact partners, as well as dynamic effects and the dependence on normal pressure and sliding speed. The viscoelastic material behaviour must also be considered. The contact between two rough surfaces is modelled as a rough rigid layer contacting a rough elas- tic layer. The elastic layer is modelled by point masses connected by Maxwell-elements. This allows the viscoelastic properties of the elastomer to be considered. The behaviour of whole system can be described by equations of motion with integrated constraints. The degrees of freedom of the model depends on the varying contact conditions. A point mass not in contact has two degrees of freedom. A point mass in contact moving along the roughness path can be described by only one degree of freedom. For each Maxwell-Element also an inner coordinate and thus a further degree of freedom is needed. Because of varying contact conditions dur- ing the simulation, the simulation interrupts in case the contact conditions change. Then the equations of motions are adapted with respect to the contact constraints. As a result of the simulation one obtain the energy dissipation and thus the friction char- acteristic during the friction process. It is possible to use these results in three dimensional point-contact elements in order to model contact surfaces on lager length scales.","lang":"eng"}]},{"type":"conference","department":[{"_id":"151"}],"date_created":"2019-05-27T08:43:55Z","abstract":[{"text":"To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tool tip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard's wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage.","lang":"eng"}],"quality_controlled":"1","project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"publication":"2015 17th Electronics Packaging Technology Conference","citation":{"mla":"Unger, Andreas, et al. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” <i>2015 17th Electronics Packaging Technology Conference</i>, 2015, doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">10.1109/EPTC.2015.7412375</a>.","bibtex":"@inproceedings{Unger_Sextro_Meyer_Eichwald_Althoff_Eacock_Brökelmann_2015, title={Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear}, DOI={<a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">10.1109/EPTC.2015.7412375</a>}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Unger, Andreas and Sextro, Walter and Meyer, Tobias and Eichwald, Paul and Althoff, Simon and Eacock, Florian and Brökelmann, Michael}, year={2015} }","ama":"Unger A, Sextro W, Meyer T, et al. Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In: <i>2015 17th Electronics Packaging Technology Conference</i>. ; 2015. doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">10.1109/EPTC.2015.7412375</a>","ieee":"A. Unger <i>et al.</i>, “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear,” in <i>2015 17th Electronics Packaging Technology Conference</i>, 2015.","apa":"Unger, A., Sextro, W., Meyer, T., Eichwald, P., Althoff, S., Eacock, F., &#38; Brökelmann, M. (2015). Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In <i>2015 17th Electronics Packaging Technology Conference</i>. <a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">https://doi.org/10.1109/EPTC.2015.7412375</a>","chicago":"Unger, Andreas, Walter Sextro, Tobias Meyer, Paul Eichwald, Simon Althoff, Florian Eacock, and Michael Brökelmann. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” In <i>2015 17th Electronics Packaging Technology Conference</i>, 2015. <a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">https://doi.org/10.1109/EPTC.2015.7412375</a>.","short":"A. Unger, W. Sextro, T. Meyer, P. Eichwald, S. Althoff, F. Eacock, M. Brökelmann, in: 2015 17th Electronics Packaging Technology Conference, 2015."},"user_id":"210","doi":"10.1109/EPTC.2015.7412375","_id":"9954","language":[{"iso":"eng"}],"date_updated":"2020-05-07T05:33:52Z","status":"public","title":"Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear","year":"2015","author":[{"full_name":"Unger, Andreas","last_name":"Unger","first_name":"Andreas"},{"id":"21220","full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro"},{"full_name":"Meyer, Tobias","first_name":"Tobias","last_name":"Meyer"},{"full_name":"Eichwald, Paul","first_name":"Paul","last_name":"Eichwald"},{"full_name":"Althoff, Simon","first_name":"Simon","last_name":"Althoff"},{"full_name":"Eacock, Florian","last_name":"Eacock","first_name":"Florian"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"}]},{"_id":"25168","publisher":"Springer-Verlag","language":[{"iso":"eng"}],"user_id":"21240","author":[{"full_name":"Gausemeier, Jürgen","last_name":"Gausemeier","first_name":"Jürgen"},{"full_name":"Rammig, Franz-Josef","last_name":"Rammig","first_name":"Franz-Josef"},{"full_name":"Schäfer, Wilhelm","last_name":"Schäfer","first_name":"Wilhelm"},{"id":"21220","full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro"}],"title":"Dependability of Self-Optimizing Mechatronic Systems","status":"public","year":"2014","date_updated":"2022-01-06T06:56:53Z","date_created":"2021-09-30T10:57:30Z","place":" Heidelberg, Germany","department":[{"_id":"672"}],"type":"book","citation":{"chicago":"Gausemeier, Jürgen, Franz-Josef Rammig, Wilhelm Schäfer, and Walter Sextro. <i>Dependability of Self-Optimizing Mechatronic Systems</i>.  Heidelberg, Germany: Springer-Verlag, 2014.","ama":"Gausemeier J, Rammig F-J, Schäfer W, Sextro W. <i>Dependability of Self-Optimizing Mechatronic Systems</i>. Springer-Verlag; 2014.","short":"J. Gausemeier, F.-J. Rammig, W. Schäfer, W. Sextro, Dependability of Self-Optimizing Mechatronic Systems, Springer-Verlag,  Heidelberg, Germany, 2014.","bibtex":"@book{Gausemeier_Rammig_Schäfer_Sextro_2014, place={ Heidelberg, Germany}, title={Dependability of Self-Optimizing Mechatronic Systems}, publisher={Springer-Verlag}, author={Gausemeier, Jürgen and Rammig, Franz-Josef and Schäfer, Wilhelm and Sextro, Walter}, year={2014} }","mla":"Gausemeier, Jürgen, et al. <i>Dependability of Self-Optimizing Mechatronic Systems</i>. Springer-Verlag, 2014.","apa":"Gausemeier, J., Rammig, F.-J., Schäfer, W., &#38; Sextro, W. (2014). <i>Dependability of Self-Optimizing Mechatronic Systems</i>. Springer-Verlag.","ieee":"J. Gausemeier, F.-J. Rammig, W. Schäfer, and W. Sextro, <i>Dependability of Self-Optimizing Mechatronic Systems</i>.  Heidelberg, Germany: Springer-Verlag, 2014."}},{"date_created":"2021-09-30T12:17:07Z","place":"Heidelberg, Germany","type":"book_chapter","department":[{"_id":"672"}],"publication":"Dependability of Self-optimizing Mechatronic Systems, Kapitel: 1.1","citation":{"chicago":"Dellnitz, Michael, Kathrin Flaßkamp, Philip Hartmann, Martin Krüger, Tobias Meyer, Claudia Priesterjahn, Sina Ober-Blöbaum, et al. “Self-Optimizing Mechatronic Systems.” In <i>Dependability of Self-Optimizing Mechatronic Systems, Kapitel: 1.1</i>, 3–12. Heidelberg, Germany: Springer-Verlag, 2014.","short":"M. Dellnitz, K. Flaßkamp, P. Hartmann, M. Krüger, T. Meyer, C. Priesterjahn, S. Ober-Blöbaum, C. Rasche, W. Sextro, K. Stahl, A. Trächtler, in: Dependability of Self-Optimizing Mechatronic Systems, Kapitel: 1.1, Springer-Verlag, Heidelberg, Germany, 2014, pp. 3–12.","ama":"Dellnitz M, Flaßkamp K, Hartmann P, et al. Self-optimizing Mechatronic Systems. In: <i>Dependability of Self-Optimizing Mechatronic Systems, Kapitel: 1.1</i>. Springer-Verlag; 2014:3-12.","bibtex":"@inbook{Dellnitz_Flaßkamp_Hartmann_Krüger_Meyer_Priesterjahn_Ober-Blöbaum_Rasche_Sextro_Stahl_et al._2014, place={Heidelberg, Germany}, title={Self-optimizing Mechatronic Systems}, booktitle={Dependability of Self-optimizing Mechatronic Systems, Kapitel: 1.1}, publisher={Springer-Verlag}, author={Dellnitz, Michael and Flaßkamp, Kathrin and Hartmann, Philip and Krüger, Martin and Meyer, Tobias and Priesterjahn, Claudia and Ober-Blöbaum, Sina and Rasche, Christoph and Sextro, Walter and Stahl, Katharina and et al.}, year={2014}, pages={3–12} }","apa":"Dellnitz, M., Flaßkamp, K., Hartmann, P., Krüger, M., Meyer, T., Priesterjahn, C., Ober-Blöbaum, S., Rasche, C., Sextro, W., Stahl, K., &#38; Trächtler, A. (2014). Self-optimizing Mechatronic Systems. In <i>Dependability of Self-optimizing Mechatronic Systems, Kapitel: 1.1</i> (pp. 3–12). Springer-Verlag.","mla":"Dellnitz, Michael, et al. “Self-Optimizing Mechatronic Systems.” <i>Dependability of Self-Optimizing Mechatronic Systems, Kapitel: 1.1</i>, Springer-Verlag, 2014, pp. 3–12.","ieee":"M. Dellnitz <i>et al.</i>, “Self-optimizing Mechatronic Systems,” in <i>Dependability of Self-optimizing Mechatronic Systems, Kapitel: 1.1</i>, Heidelberg, Germany: Springer-Verlag, 2014, pp. 3–12."},"page":"3-12","_id":"25173","publisher":"Springer-Verlag","language":[{"iso":"eng"}],"user_id":"21240","title":"Self-optimizing Mechatronic Systems","year":"2014","status":"public","author":[{"first_name":"Michael","last_name":"Dellnitz","full_name":"Dellnitz, Michael"},{"full_name":"Flaßkamp, Kathrin","first_name":"Kathrin","last_name":"Flaßkamp"},{"full_name":"Hartmann, Philip","first_name":"Philip","last_name":"Hartmann"},{"full_name":"Krüger, Martin","first_name":"Martin","last_name":"Krüger"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"last_name":"Priesterjahn","first_name":"Claudia","full_name":"Priesterjahn, Claudia"},{"id":"16494","first_name":"Sina","last_name":"Ober-Blöbaum","full_name":"Ober-Blöbaum, Sina"},{"full_name":"Rasche, Christoph","first_name":"Christoph","last_name":"Rasche"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"},{"full_name":"Stahl, Katharina","first_name":"Katharina","last_name":"Stahl"},{"first_name":"Ansgar","last_name":"Trächtler","full_name":"Trächtler, Ansgar","id":"552"}],"date_updated":"2022-01-06T06:56:53Z"},{"author":[{"first_name":"Rafal ","last_name":"Dorociak","full_name":"Dorociak, Rafal "},{"last_name":"Gausemeier","first_name":"J{\\\"u}rgen","full_name":"Gausemeier, J{\\\"u}rgen"},{"full_name":"Iwanek, Peter","last_name":"Iwanek","first_name":"Peter"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"id":"21220","full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro"},{"first_name":"Christoph","last_name":"Sondermann-W{\\\"o}lke","full_name":"Sondermann-W{\\\"o}lke, Christoph"}],"title":"Development of the Active Guidance Module","status":"public","year":"2014","publication_status":"published","date_updated":"2022-01-06T06:58:02Z","language":[{"iso":"eng"}],"_id":"28394","publisher":"AACE Press","page":"178-182","user_id":"71124","citation":{"apa":"Dorociak, R., Gausemeier, J., Iwanek, P., Meyer, T., Sextro, W., &#38; Sondermann-W{\\\"o}lke, C. (2014). Development of the Active Guidance Module. In <i>Dependability of Self-optimizing Mechatronic Systems</i> (pp. 178–182). AACE Press.","ieee":"R. Dorociak, J. Gausemeier, P. Iwanek, T. Meyer, W. Sextro, and C. Sondermann-W{\\\"o}lke, “Development of the Active Guidance Module,” in <i>Dependability of Self-optimizing Mechatronic Systems</i>, AACE Press, 2014, pp. 178–182.","chicago":"Dorociak, Rafal , J{\\\"u}rgen Gausemeier, Peter Iwanek, Tobias Meyer, Walter Sextro, and Christoph Sondermann-W{\\\"o}lke. “Development of the Active Guidance Module.” In <i>Dependability of Self-Optimizing Mechatronic Systems</i>, 178–82. AACE Press, 2014.","short":"R. Dorociak, J. Gausemeier, P. Iwanek, T. Meyer, W. Sextro, C. Sondermann-W{\\\"o}lke, in: Dependability of Self-Optimizing Mechatronic Systems, AACE Press, 2014, pp. 178–182.","mla":"Dorociak, Rafal, et al. “Development of the Active Guidance Module.” <i>Dependability of Self-Optimizing Mechatronic Systems</i>, AACE Press, 2014, pp. 178–82.","ama":"Dorociak R, Gausemeier J, Iwanek P, Meyer T, Sextro W, Sondermann-W{\\\"o}lke C. Development of the Active Guidance Module. In: <i>Dependability of Self-Optimizing Mechatronic Systems</i>. AACE Press; 2014:178-182.","bibtex":"@inbook{Dorociak_Gausemeier_Iwanek_Meyer_Sextro_Sondermann-W{\\\"o}lke_2014, title={Development of the Active Guidance Module}, booktitle={Dependability of Self-optimizing Mechatronic Systems}, publisher={AACE Press}, author={Dorociak, Rafal  and Gausemeier, J{\\\"u}rgen and Iwanek, Peter and Meyer, Tobias and Sextro, Walter and Sondermann-W{\\\"o}lke, Christoph}, year={2014}, pages={178–182} }"},"publication":"Dependability of Self-optimizing Mechatronic Systems","date_created":"2021-12-07T19:19:41Z","department":[{"_id":"676"}],"type":"book_chapter"},{"publication_status":"published","date_updated":"2022-01-06T06:58:02Z","year":"2014","status":"public","title":"Dependability of Self-Optimizing Mechatronic Systems","author":[{"first_name":"J{\\\"u}rgen","last_name":"Gausemeier","full_name":"Gausemeier, J{\\\"u}rgen"},{"full_name":"Rammig, Franz-Josef","last_name":"Rammig","first_name":"Franz-Josef"},{"last_name":"Sch{\\\"a}fer","first_name":" Wilhelm","full_name":"Sch{\\\"a}fer,  Wilhelm"},{"full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter","id":"21220"}],"user_id":"71124","_id":"28396","publisher":"Springer-Verlag, Heidelberg, Germany","language":[{"iso":"eng"}],"citation":{"short":"J. Gausemeier, F.-J. Rammig,  Wilhelm Sch{\\\"a}fer, W. Sextro, Dependability of Self-Optimizing Mechatronic Systems, Springer-Verlag, Heidelberg, Germany, 2014.","chicago":"Gausemeier, J{\\\"u}rgen, Franz-Josef Rammig,  Wilhelm Sch{\\\"a}fer, and Walter Sextro. <i>Dependability of Self-Optimizing Mechatronic Systems</i>. Springer-Verlag, Heidelberg, Germany, 2014.","ieee":"J. Gausemeier, F.-J. Rammig,  Wilhelm Sch{\\\"a}fer, and W. Sextro, <i>Dependability of Self-Optimizing Mechatronic Systems</i>. Springer-Verlag, Heidelberg, Germany, 2014.","apa":"Gausemeier, J., Rammig, F.-J., Sch{\\\"a}fer,  Wilhelm, &#38; Sextro, W. (2014). <i>Dependability of Self-Optimizing Mechatronic Systems</i>. Springer-Verlag, Heidelberg, Germany.","bibtex":"@book{Gausemeier_Rammig_Sch{\\\"a}fer_Sextro_2014, title={Dependability of Self-Optimizing Mechatronic Systems}, publisher={Springer-Verlag, Heidelberg, Germany}, author={Gausemeier, J{\\\"u}rgen and Rammig, Franz-Josef and Sch{\\\"a}fer,  Wilhelm and Sextro, Walter}, year={2014} }","ama":"Gausemeier J, Rammig F-J, Sch{\\\"a}fer  Wilhelm, Sextro W. <i>Dependability of Self-Optimizing Mechatronic Systems</i>. Springer-Verlag, Heidelberg, Germany; 2014.","mla":"Gausemeier, J{\\\"u}rgen, et al. <i>Dependability of Self-Optimizing Mechatronic Systems</i>. Springer-Verlag, Heidelberg, Germany, 2014."},"type":"book","department":[{"_id":"676"}],"date_created":"2021-12-07T19:28:28Z"},{"publication":"Dependability of Self-optimizing Mechatronic Systems","citation":{"mla":"Dorociak, Rafal, et al. “Selecting Suitable Methods Using the Methodology.” <i>Dependability of Self-Optimizing Mechatronic Systems</i>, Springer-Verlag Berlin Heidelberg, 2014, pp. 174–78.","apa":"Dorociak, R., Gausemeier,  J{\\\"u}rgen, Iwanek,  Peter, Meyer, T., &#38; Sextro, W. (2014). Selecting Suitable Methods Using the Methodology. In <i>Dependability of Self-optimizing Mechatronic Systems</i> (pp. 174–178). Springer-Verlag Berlin Heidelberg.","ieee":"R. Dorociak,  J{\\\"u}rgen Gausemeier,  Peter Iwanek, T. Meyer, and W. Sextro, “Selecting Suitable Methods Using the Methodology,” in <i>Dependability of Self-optimizing Mechatronic Systems</i>, Springer-Verlag Berlin Heidelberg, 2014, pp. 174–178.","chicago":"Dorociak, Rafal,  J{\\\"u}rgen Gausemeier,  Peter Iwanek, Tobias Meyer, and Walter Sextro. “Selecting Suitable Methods Using the Methodology.” In <i>Dependability of Self-Optimizing Mechatronic Systems</i>, 174–78. Springer-Verlag Berlin Heidelberg, 2014.","ama":"Dorociak R, Gausemeier  J{\\\"u}rgen, Iwanek  Peter, Meyer T, Sextro W. Selecting Suitable Methods Using the Methodology. In: <i>Dependability of Self-Optimizing Mechatronic Systems</i>. Springer-Verlag Berlin Heidelberg; 2014:174-178.","short":"R. Dorociak,  J{\\\"u}rgen Gausemeier,  Peter Iwanek, T. Meyer, W. Sextro, in: Dependability of Self-Optimizing Mechatronic Systems, Springer-Verlag Berlin Heidelberg, 2014, pp. 174–178.","bibtex":"@inbook{Dorociak_Gausemeier_Iwanek_Meyer_Sextro_2014, title={Selecting Suitable Methods Using the Methodology}, booktitle={Dependability of Self-optimizing Mechatronic Systems}, publisher={Springer-Verlag Berlin Heidelberg}, author={Dorociak, Rafal and Gausemeier,  J{\\\"u}rgen and Iwanek,  Peter and Meyer, Tobias and Sextro, Walter}, year={2014}, pages={174–178} }"},"type":"book_chapter","department":[{"_id":"676"}],"date_created":"2021-12-07T19:50:25Z","date_updated":"2022-01-06T06:58:02Z","publication_status":"published","year":"2014","title":"Selecting Suitable Methods Using the Methodology","status":"public","author":[{"first_name":"Rafal","last_name":"Dorociak","full_name":"Dorociak, Rafal"},{"full_name":"Gausemeier,  J{\\\"u}rgen","last_name":"Gausemeier","first_name":" J{\\\"u}rgen"},{"full_name":"Iwanek,  Peter","first_name":" Peter","last_name":"Iwanek"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"id":"21220","full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro"}],"user_id":"71124","page":"174-178","_id":"28399","publisher":"Springer-Verlag Berlin Heidelberg","language":[{"iso":"eng"}]},{"date_created":"2021-12-07T19:54:27Z","type":"book_chapter","department":[{"_id":"676"}],"publication":"Dependability of Self-optimizing Mechatronic Systems","citation":{"ama":"Dorociak R, Gausemeier J, Iwanek P, Meyer T, Sextro W. Selecting Suitable Methods Using the Methodology. In: <i>Dependability of Self-Optimizing Mechatronic Systems</i>. Springer-Verlag Berlin Heidelberg; 2014:174-178.","bibtex":"@inbook{Dorociak_Gausemeier_Iwanek_Meyer_Sextro_2014, title={Selecting Suitable Methods Using the Methodology}, booktitle={Dependability of Self-optimizing Mechatronic Systems}, publisher={Springer-Verlag Berlin Heidelberg}, author={Dorociak, Rafal and Gausemeier, J{\\\"u}rgen  and Iwanek, Peter and Meyer, Tobias and Sextro, Walter}, year={2014}, pages={174–178} }","mla":"Dorociak, Rafal, et al. “Selecting Suitable Methods Using the Methodology.” <i>Dependability of Self-Optimizing Mechatronic Systems</i>, Springer-Verlag Berlin Heidelberg, 2014, pp. 174–78.","chicago":"Dorociak, Rafal, J{\\\"u}rgen  Gausemeier, Peter Iwanek, Tobias Meyer, and Walter Sextro. “Selecting Suitable Methods Using the Methodology.” In <i>Dependability of Self-Optimizing Mechatronic Systems</i>, 174–78. Springer-Verlag Berlin Heidelberg, 2014.","short":"R. Dorociak, J. Gausemeier, P. Iwanek, T. Meyer, W. Sextro, in: Dependability of Self-Optimizing Mechatronic Systems, Springer-Verlag Berlin Heidelberg, 2014, pp. 174–178.","apa":"Dorociak, R., Gausemeier, J., Iwanek, P., Meyer, T., &#38; Sextro, W. (2014). Selecting Suitable Methods Using the Methodology. In <i>Dependability of Self-optimizing Mechatronic Systems</i> (pp. 174–178). Springer-Verlag Berlin Heidelberg.","ieee":"R. Dorociak, J. Gausemeier, P. Iwanek, T. Meyer, and W. Sextro, “Selecting Suitable Methods Using the Methodology,” in <i>Dependability of Self-optimizing Mechatronic Systems</i>, Springer-Verlag Berlin Heidelberg, 2014, pp. 174–178."},"page":"174-178","_id":"28400","publisher":"Springer-Verlag Berlin Heidelberg","language":[{"iso":"eng"}],"user_id":"71124","status":"public","title":"Selecting Suitable Methods Using the Methodology","year":"2014","author":[{"first_name":"Rafal","last_name":"Dorociak","full_name":"Dorociak, Rafal"},{"full_name":"Gausemeier, J{\\\"u}rgen ","first_name":"J{\\\"u}rgen ","last_name":"Gausemeier"},{"last_name":"Iwanek","first_name":"Peter","full_name":"Iwanek, Peter"},{"full_name":"Meyer, Tobias","first_name":"Tobias","last_name":"Meyer"},{"last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter","id":"21220"}],"date_updated":"2022-01-06T06:58:03Z","publication_status":"published"},{"publication":"Dependability of Self-optimizing Mechatronic Systems","citation":{"mla":"Iwanek, Peter, et al. “Challenges.” <i>Dependability of Self-Optimizing Mechatronic Systems</i>, Springer-Verlag, Heidelberg, Germany, 2014, pp. 12–15.","ama":"Iwanek P,  Meyer T, Priesterjahn C, Sextro W, Va{\\ss}holz M. Challenges. In: <i>Dependability of Self-Optimizing Mechatronic Systems</i>. Springer-Verlag, Heidelberg, Germany; 2014:12-15.","bibtex":"@inbook{Iwanek_ Meyer_Priesterjahn_Sextro_Va{\\ss}holz_2014, title={Challenges}, booktitle={Dependability of Self-optimizing Mechatronic Systems}, publisher={Springer-Verlag, Heidelberg, Germany}, author={Iwanek, Peter  and  Meyer, Tobias and Priesterjahn, Claudia and Sextro, Walter and Va{\\ss}holz, Mareen}, year={2014}, pages={12–15} }","apa":"Iwanek, P.,  Meyer, T., Priesterjahn, C., Sextro, W., &#38; Va{\\ss}holz, M. (2014). Challenges. In <i>Dependability of Self-optimizing Mechatronic Systems</i> (pp. 12–15). Springer-Verlag, Heidelberg, Germany.","ieee":"P. Iwanek, T.  Meyer, C. Priesterjahn, W. Sextro, and M. Va{\\ss}holz, “Challenges,” in <i>Dependability of Self-optimizing Mechatronic Systems</i>, Springer-Verlag, Heidelberg, Germany, 2014, pp. 12–15.","chicago":"Iwanek, Peter , Tobias  Meyer, Claudia Priesterjahn, Walter Sextro, and Mareen Va{\\ss}holz. “Challenges.” In <i>Dependability of Self-Optimizing Mechatronic Systems</i>, 12–15. Springer-Verlag, Heidelberg, Germany, 2014.","short":"P. Iwanek, T.  Meyer, C. Priesterjahn, W. Sextro, M. Va{\\ss}holz, in: Dependability of Self-Optimizing Mechatronic Systems, Springer-Verlag, Heidelberg, Germany, 2014, pp. 12–15."},"type":"book_chapter","department":[{"_id":"676"}],"date_created":"2021-12-07T21:22:10Z","date_updated":"2022-01-06T06:58:03Z","publication_status":"published","title":"Challenges","status":"public","year":"2014","author":[{"full_name":"Iwanek, Peter ","first_name":"Peter ","last_name":"Iwanek"},{"first_name":"Tobias","last_name":" Meyer","full_name":" Meyer, Tobias"},{"first_name":"Claudia","last_name":"Priesterjahn","full_name":"Priesterjahn, Claudia"},{"id":"21220","full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro"},{"first_name":"Mareen","last_name":"Va{\\ss}holz","full_name":"Va{\\ss}holz, Mareen"}],"user_id":"71124","page":"12-15","_id":"28410","language":[{"iso":"eng"}],"publisher":"Springer-Verlag, Heidelberg, Germany"},{"date_created":"2019-05-20T12:11:44Z","department":[{"_id":"151"}],"keyword":["adhesion","circuit reliability","deformation","diffusion","fatigue cracks","friction","interconnections","lead bonding","van der Waals forces","Cu","adhering process","adhesion process","ampacity improvement","bond quality improvement","cleaning process","diffusing process","fatigue fracture failure","friction energy","friction model","heat dissipation","mechanical strength","piezoelectric triaxial force sensor","predeforming process","size 500 mum","total contact area","van der Waals forces","wedge copper wire bonding","Bonding","Copper","Finite element analysis","Force","Friction","Substrates","Wires"],"type":"conference","citation":{"ama":"Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>. ; 2014:1549-1555. doi:<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>","bibtex":"@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the bond quality of copper wire bonds using a friction model approach}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>}, booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2014}, pages={1549–1555} }","mla":"Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–55, doi:<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>.","chicago":"Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 1549–55, 2014. <a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">https://doi.org/10.1109/ECTC.2014.6897500</a>.","short":"S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.","apa":"Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i> (pp. 1549–1555). <a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">https://doi.org/10.1109/ECTC.2014.6897500</a>","ieee":"S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–1555."},"publication":"Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th","quality_controlled":"1","abstract":[{"text":"In order to increase mechanical strength, heat dissipation and ampacity and to decrease failure through fatigue fracture, wedge copper wire bonding is being introduced as a standard interconnection method for mass production. To achieve the same process stability when using copper wire instead of aluminum wire a profound understanding of the bonding process is needed. Due to the higher hardness of copper compared to aluminum wire it is more difficult to approach the surfaces of wire and substrate to a level where van der Waals forces are able to arise between atoms. Also, enough friction energy referred to the total contact area has to be generated to activate the surfaces. Therefore, a friction model is used to simulate the joining process. This model calculates the resulting energy of partial areas in the contact surface and provides information about the adhesion process of each area. The focus here is on the arising of micro joints in the contact area depending on the location in the contact and time. To validate the model, different touchdown forces are used to vary the initial contact areas of wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built up to identify the known phases of pre-deforming, cleaning, adhering and diffusing for the real bonding process to map with the model. Test substrates as DBC and copper plate are used to show the different formations of a wedge bond connection due to hardness and reaction propensity. The experiments were done by using 500 $\\mu$m copper wire and a standard V-groove tool.","lang":"eng"}],"_id":"9868","language":[{"iso":"eng"}],"page":"1549-1555","doi":"10.1109/ECTC.2014.6897500","user_id":"55222","author":[{"full_name":"Althoff, Simon","first_name":"Simon","last_name":"Althoff"},{"last_name":"Neuhaus","first_name":"Jan","full_name":"Neuhaus, Jan"},{"id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel","first_name":"Tobias"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"}],"status":"public","title":"Improving the bond quality of copper wire bonds using a friction model approach","year":"2014","date_updated":"2019-09-16T10:57:58Z"}]