---
_id: '23716'
abstract:
- lang: eng
  text: In der Entwicklung mechatronischer Systeme spielt die Steigerung der Verlässlichkeit
    und somit auch der Zuverlässigkeit und der funktionalen Sicherheit eine entscheidende
    Rolle. Die modellbasierte Entwicklung liefert in Kombination mit unterstützender
    Software einen wichtigen Beitrag zur Absicherung der Verlässlichkeit mechatronischer
    Systeme in frühen Entwicklungsphasen. In der Nutzungsphase ermöglichen aktuelle
    Verfahren der Zustandsüberwachung und moderne Methoden der Regelungstechnik eine
    effektive Absicherung. Modelle aus der Entwicklung mechatronischer Systeme enthalten
    weitreichende Informationen über die Architektur, das Verhalten und die Verlässlichkeit
    eines Systems. Diese Modelle können als Grundlage für die Erstellung eines Digitalen
    Zwillings für die vorausschauende Instandhaltung verwendet und mit Zustandsdaten
    des realen Systems kombiniert werden. Die Nutzung der Modelle für den Digitalen
    Zwilling bietet weitreichende Potenziale und vereinfacht dessen Erzeugung. Die
    Veröffentlichung beschreibt Rahmenbedingungen der Integration und stellt die Potenziale
    des Digitalen Zwillings zur vorausschauenden Instandhaltung dar.
author:
- first_name: Thorben
  full_name: Kaul, Thorben
  id: '14802'
  last_name: Kaul
- first_name: Julian
  full_name: Hentze, Julian
  id: '13342'
  last_name: Hentze
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Iris
  full_name: Gräßler, Iris
  id: '47565'
  last_name: Gräßler
  orcid: 0000-0001-5765-971X
citation:
  ama: 'Kaul T, Hentze J, Sextro W, Gräßler I. Integration von Verlässlichkeitsmodellen
    der Entwicklung in einen Digitalen Zwilling zur Umsetzung einer vorausschauenden
    Instandhaltung. In: Bertram T, Corves B, Gräßler I, Janschek K, eds. <i>Fachtagung
    Mechatronik 2019 Paderborn</i>. ; 2019:19-24.'
  apa: Kaul, T., Hentze, J., Sextro, W., &#38; Gräßler, I. (2019). Integration von
    Verlässlichkeitsmodellen der Entwicklung in einen Digitalen Zwilling zur Umsetzung
    einer vorausschauenden Instandhaltung. In T. Bertram, B. Corves, I. Gräßler, &#38;
    K. Janschek (Eds.), <i>Fachtagung Mechatronik 2019 Paderborn</i> (pp. 19–24).
  bibtex: '@inproceedings{Kaul_Hentze_Sextro_Gräßler_2019, title={Integration von
    Verlässlichkeitsmodellen der Entwicklung in einen Digitalen Zwilling zur Umsetzung
    einer vorausschauenden Instandhaltung}, booktitle={Fachtagung Mechatronik 2019
    Paderborn}, author={Kaul, Thorben and Hentze, Julian and Sextro, Walter and Gräßler,
    Iris}, editor={Bertram, Torsten and Corves, Burkhard and Gräßler, Iris and Janschek,
    KlausEditors}, year={2019}, pages={19–24} }'
  chicago: Kaul, Thorben, Julian Hentze, Walter Sextro, and Iris Gräßler. “Integration
    von Verlässlichkeitsmodellen der Entwicklung in einen Digitalen Zwilling zur Umsetzung
    einer vorausschauenden Instandhaltung.” In <i>Fachtagung Mechatronik 2019 Paderborn</i>,
    edited by Torsten Bertram, Burkhard Corves, Iris Gräßler, and Klaus Janschek,
    19–24, 2019.
  ieee: T. Kaul, J. Hentze, W. Sextro, and I. Gräßler, “Integration von Verlässlichkeitsmodellen
    der Entwicklung in einen Digitalen Zwilling zur Umsetzung einer vorausschauenden
    Instandhaltung,” in <i>Fachtagung Mechatronik 2019 Paderborn</i>, 2019, pp. 19–24.
  mla: Kaul, Thorben, et al. “Integration von Verlässlichkeitsmodellen der Entwicklung
    in einen Digitalen Zwilling zur Umsetzung einer vorausschauenden Instandhaltung.”
    <i>Fachtagung Mechatronik 2019 Paderborn</i>, edited by Torsten Bertram et al.,
    2019, pp. 19–24.
  short: 'T. Kaul, J. Hentze, W. Sextro, I. Gräßler, in: T. Bertram, B. Corves, I.
    Gräßler, K. Janschek (Eds.), Fachtagung Mechatronik 2019 Paderborn, 2019, pp.
    19–24.'
conference:
  end_date: 2019-03-28
  start_date: 2019-03-27
date_created: 2021-09-03T05:58:32Z
date_updated: 2022-01-06T06:55:58Z
department:
- _id: '152'
editor:
- first_name: Torsten
  full_name: Bertram, Torsten
  last_name: Bertram
- first_name: Burkhard
  full_name: Corves, Burkhard
  last_name: Corves
- first_name: Iris
  full_name: Gräßler, Iris
  last_name: Gräßler
- first_name: Klaus
  full_name: Janschek, Klaus
  last_name: Janschek
language:
- iso: ger
page: 19-24
publication: Fachtagung Mechatronik 2019 Paderborn
status: public
title: Integration von Verlässlichkeitsmodellen der Entwicklung in einen Digitalen
  Zwilling zur Umsetzung einer vorausschauenden Instandhaltung
type: conference
user_id: '21240'
year: '2019'
...
---
_id: '14852'
abstract:
- lang: eng
  text: In a variety of industrial applications, liquids are atomized to produce aerosols
    for further processing. Example applications are the coating of surfaces with
    paints, the application of ultra-thin adhesive layers and the atomization of fuels
    for the production of combustible dispersions. In this publication different atomizing
    principles (standing-wave, capillary-wave, vibrating-mesh) are examined and discussed.
    Using an optimized standing-wave system, tough liquids with viscosities of up
    to about 100 Pas could be successfully atomized.
author:
- first_name: Paul
  full_name: Dunst, Paul
  id: '22130'
  last_name: Dunst
- first_name: Peter
  full_name: Bornmann, Peter
  last_name: Bornmann
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: 'Walter '
  full_name: 'Littmann, Walter '
  last_name: Littmann
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Dunst P, Bornmann P, Hemsel T, Littmann W, Sextro W. Atomization of Fluids
    with Ultrasound. In: Lötters J, Urban G, eds. <i>Conference Proceedings - The
    4th Conference on MicroFluidic Handling Systems (MFHS2019)</i>. Enschede, The
    Netherlands; 2019:140-143.'
  apa: Dunst, P., Bornmann, P., Hemsel, T., Littmann, W., &#38; Sextro, W. (2019).
    Atomization of Fluids with Ultrasound. In J. Lötters &#38; G. Urban (Eds.), <i>Conference
    Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019)</i>
    (pp. 140–143). Enschede, The Netherlands.
  bibtex: '@inproceedings{Dunst_Bornmann_Hemsel_Littmann_Sextro_2019, place={Enschede,
    The Netherlands}, title={Atomization of Fluids with Ultrasound}, booktitle={Conference
    Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019)},
    author={Dunst, Paul and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter  and
    Sextro, Walter}, editor={Lötters, Joost and Urban, GeraldEditors}, year={2019},
    pages={140–143} }'
  chicago: Dunst, Paul, Peter Bornmann, Tobias Hemsel, Walter  Littmann, and Walter
    Sextro. “Atomization of Fluids with Ultrasound.” In <i>Conference Proceedings
    - The 4th Conference on MicroFluidic Handling Systems (MFHS2019)</i>, edited by
    Joost Lötters and Gerald Urban, 140–43. Enschede, The Netherlands, 2019.
  ieee: P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, and W. Sextro, “Atomization
    of Fluids with Ultrasound,” in <i>Conference Proceedings - The 4th Conference
    on MicroFluidic Handling Systems (MFHS2019)</i>, Enschede, The Netherlands, 2019,
    pp. 140–143.
  mla: Dunst, Paul, et al. “Atomization of Fluids with Ultrasound.” <i>Conference
    Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019)</i>,
    edited by Joost Lötters and Gerald Urban, 2019, pp. 140–43.
  short: 'P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, W. Sextro, in: J. Lötters,
    G. Urban (Eds.), Conference Proceedings - The 4th Conference on MicroFluidic Handling
    Systems (MFHS2019), Enschede, The Netherlands, 2019, pp. 140–143.'
conference:
  end_date: 2019-10-04
  location: Enschede, The Netherlands
  name: 4th Conference on MicroFluidic Handling Systems
  start_date: 2019-10-02
date_created: 2019-11-07T15:25:30Z
date_updated: 2022-01-06T06:52:08Z
ddc:
- '620'
department:
- _id: '151'
editor:
- first_name: Joost
  full_name: Lötters, Joost
  last_name: Lötters
- first_name: Gerald
  full_name: Urban, Gerald
  last_name: Urban
file:
- access_level: closed
  content_type: application/pdf
  creator: pdunst
  date_created: 2019-11-07T15:22:56Z
  date_updated: 2019-11-07T15:22:56Z
  file_id: '14853'
  file_name: Dunst_MFHS_2019.pdf
  file_size: 3850591
  relation: main_file
  success: 1
file_date_updated: 2019-11-07T15:22:56Z
has_accepted_license: '1'
keyword:
- atomization
- ultrasound
- standing-wave
- capillarywave
- vibrating-mesh
language:
- iso: eng
page: 140-143
place: Enschede, The Netherlands
publication: Conference Proceedings - The 4th Conference on MicroFluidic Handling
  Systems (MFHS2019)
publication_status: published
quality_controlled: '1'
status: public
title: Atomization of Fluids with Ultrasound
type: conference
user_id: '22130'
year: '2019'
...
---
_id: '15244'
author:
- first_name: Oliver Ernst Caspar
  full_name: Hagedorn, Oliver Ernst Caspar
  id: '53321'
  last_name: Hagedorn
- first_name: Daniel
  full_name: Pielsticker, Daniel
  id: '76966'
  last_name: Pielsticker
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Hagedorn OEC, Pielsticker D, Hemsel T, Sextro W. Messung hochfrequenter In-Plane-Schwingungen
    mittels Laservibrometrie in räumlich eingeschränkten Umgebungen. In: <i>2. VDI-Fachtagung
    Schwingungen 2019</i>. VDI Verlag GmbH · Düsseldorf 2019; 2019.'
  apa: Hagedorn, O. E. C., Pielsticker, D., Hemsel, T., &#38; Sextro, W. (2019). Messung
    hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten
    Umgebungen. In <i>2. VDI-Fachtagung Schwingungen 2019</i>. VDI Verlag GmbH · Düsseldorf
    2019.
  bibtex: '@inproceedings{Hagedorn_Pielsticker_Hemsel_Sextro_2019, title={Messung
    hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten
    Umgebungen}, booktitle={2. VDI-Fachtagung Schwingungen 2019}, publisher={VDI Verlag
    GmbH · Düsseldorf 2019}, author={Hagedorn, Oliver Ernst Caspar and Pielsticker,
    Daniel and Hemsel, Tobias and Sextro, Walter}, year={2019} }'
  chicago: Hagedorn, Oliver Ernst Caspar, Daniel Pielsticker, Tobias Hemsel, and Walter
    Sextro. “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie
    in räumlich eingeschränkten Umgebungen.” In <i>2. VDI-Fachtagung Schwingungen
    2019</i>. VDI Verlag GmbH · Düsseldorf 2019, 2019.
  ieee: O. E. C. Hagedorn, D. Pielsticker, T. Hemsel, and W. Sextro, “Messung hochfrequenter
    In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen,”
    in <i>2. VDI-Fachtagung Schwingungen 2019</i>, 2019.
  mla: Hagedorn, Oliver Ernst Caspar, et al. “Messung hochfrequenter In-Plane-Schwingungen
    mittels Laservibrometrie in räumlich eingeschränkten Umgebungen.” <i>2. VDI-Fachtagung
    Schwingungen 2019</i>, VDI Verlag GmbH · Düsseldorf 2019, 2019.
  short: 'O.E.C. Hagedorn, D. Pielsticker, T. Hemsel, W. Sextro, in: 2. VDI-Fachtagung
    Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.'
date_created: 2019-12-04T11:59:52Z
date_updated: 2022-01-06T06:52:19Z
department:
- _id: '151'
language:
- iso: ger
publication: 2. VDI-Fachtagung Schwingungen 2019
publication_identifier:
  isbn:
  - 978-3-18-092366-6
publisher: VDI Verlag GmbH · Düsseldorf 2019
status: public
title: Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich
  eingeschränkten Umgebungen
type: conference
user_id: '53321'
year: '2019'
...
---
_id: '10002'
abstract:
- lang: ger
  text: Dieses Buch beschreibt basierend auf dem gleichnamigen Innovationsprojekt
    im Spitzencluster it’s OWL die Entwicklung intelligenter Verfahren und Systeme,
    um auch unter variablen Produktionsbedingungen eine zuverlässige Massenfertigung
    von Kupferbondverbindungen sicherzustellen.Dabei wird der gesamte Prozess der
    Ultraschall-Verbindungsbildung modelliert. Dies beinhaltet u. a. ein Reibmodell
    mit gekoppeltem Anbindungsmodell, den Ultraschall-Erweichungseffekt und den Verschleiß
    des Bondwerkzeugs. Zudem wird das Konzept einer selbstoptimierenden Bondmaschine
    vorgestellt, welche Prozessparameter in Abhängigkeit von Störgrößen wie Verschleiß
    anpasst.Das Ultraschallbonden mit Aluminiumdraht ist ein etabliertes Fertigungsverfahren
    zur Kontaktierung von Leistungshalbleitern. Zukünftige Leistungshalbleiterchips
    erfordern jedoch einen Technologiewechsel zu Kupferdraht. Die Prozessparameter
    unterscheiden sich dabei deutlich von den bekannten Aluminiumprozessen, ihre Wechselwirkungen
    sind weitestgehend unbekannt.
author:
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
citation:
  ama: Sextro W, Brökelmann M. <i>Intelligente Herstellung Zuverlässiger Kupferbondverbindungen</i>.
    Vol VIII. Springer Verlag; 2019. doi:<a href="https://doi.org/10.1007/978-3-662-55146-2">10.1007/978-3-662-55146-2</a>
  apa: Sextro, W., &#38; Brökelmann, M. (2019). <i>Intelligente Herstellung zuverlässiger
    Kupferbondverbindungen</i> (Vol. VIII). Springer Verlag. <a href="https://doi.org/10.1007/978-3-662-55146-2">https://doi.org/10.1007/978-3-662-55146-2</a>
  bibtex: '@book{Sextro_Brökelmann_2019, title={Intelligente Herstellung zuverlässiger
    Kupferbondverbindungen}, volume={VIII}, DOI={<a href="https://doi.org/10.1007/978-3-662-55146-2">10.1007/978-3-662-55146-2</a>},
    publisher={Springer Verlag}, author={Sextro, Walter and Brökelmann, Michael},
    year={2019} }'
  chicago: Sextro, Walter, and Michael Brökelmann. <i>Intelligente Herstellung Zuverlässiger
    Kupferbondverbindungen</i>. Vol. VIII. Springer Verlag, 2019. <a href="https://doi.org/10.1007/978-3-662-55146-2">https://doi.org/10.1007/978-3-662-55146-2</a>.
  ieee: W. Sextro and M. Brökelmann, <i>Intelligente Herstellung zuverlässiger Kupferbondverbindungen</i>,
    vol. VIII. Springer Verlag, 2019.
  mla: Sextro, Walter, and Michael Brökelmann. <i>Intelligente Herstellung Zuverlässiger
    Kupferbondverbindungen</i>. Vol. VIII, Springer Verlag, 2019, doi:<a href="https://doi.org/10.1007/978-3-662-55146-2">10.1007/978-3-662-55146-2</a>.
  short: W. Sextro, M. Brökelmann, Intelligente Herstellung Zuverlässiger Kupferbondverbindungen,
    Springer Verlag, 2019.
date_created: 2019-05-27T10:31:35Z
date_updated: 2022-01-06T06:50:22Z
department:
- _id: '151'
doi: 10.1007/978-3-662-55146-2
keyword:
- Abschlussbericht zum Spitzenclusterprojekt InCuB
language:
- iso: eng
page: '67'
publisher: Springer Verlag
status: public
title: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
type: book
user_id: '55222'
volume: VIII
year: '2019'
...
---
_id: '10255'
abstract:
- lang: eng
  text: Gummi-Metall-Teile (GM-Teile) werden zur Schwingungsreduktion u. a. in Windenergieanlagen
    eingesetzt. Mögliche Anwendungen der Teile liegen in Wellen-, Generator- und Getriebelagerungen,
    Lagern für die Gondel und ihre Komponenten sowie in Drehmomentstützen. Mit dem
    Ziel eine prädiktive Instandhaltung zu realisieren, soll eine Zustandsüberwachung
    für die GM-Teile entwickelt werden. Diese Entwicklung basiert auf der Umsetzung
    diverser Schritte. Neben der funktionalen Betrachtung wird zwingend auch die konstruktive
    Integration der Sensoren in das überwachte Teil berücksichtigt. Der Schwerpunkt
    dieser Arbeit liegt auf der verwendeten Messgröße Temperatur, die mittels ausgewählter
    Sensorik detektiert wird. Dabei werden Lebensdauerversuche unter instationären
    Betriebsbedingungen durchgeführt, um diese Messdaten zu generieren. In der Datenauswertung
    werden sie hinsichtlich der Degradierung des GM-Teils analysiert und für die Ermittlung
    der nutzbaren Restlebensdauer verwendet. Rubber-metal-elements are used for isolation
    of vibrations e. g. in wind turbines. Possible applications of the elements are
    shaft bearings, generator bearings, gearbox bearings, bearings for the nacelle
    and its components and torque supports. In order to realize predictive maintenance,
    an accurate condition monitoring system for rubber-metal-elements should be developed.
    During that development different aspects have to be implemented. Additionally
    to the functional analysis, the constructive integration of the sensors into the
    monitored part is mandatory. The focus of this work is on the measured variable
    temperature, which is detected by means of appropriate sensors. Thereby lifetime
    tests are run under non-stationary operating conditions to generate temperature
    measurements. During data analysis, the measured data is analyzed regarding the
    degradation of the rubber-metal-elements and remaining useful lifetimes are estimated.
author:
- first_name: Amelie
  full_name: Bender, Amelie
  id: '54290'
  last_name: Bender
- first_name: Kai
  full_name: Reinke, Kai
  last_name: Reinke
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Bender A, Reinke K, Sextro W. Konstruktion und Zustandsüberwachung eines Gummi-Metall-Teils
    mit integriertem Thermoelement. In: <i>10. VDI-Fachtagung Schwingungen von Windenergieanlagen
    2019</i>. Vol VDI-Berichte 2346. Bremen 2019; 2019:241-248.'
  apa: Bender, A., Reinke, K., &#38; Sextro, W. (2019). Konstruktion und Zustandsüberwachung
    eines Gummi-Metall-Teils mit integriertem Thermoelement. In <i>10. VDI-Fachtagung
    Schwingungen von Windenergieanlagen 2019</i> (Vol. VDI-Berichte 2346, pp. 241–248).
    Bremen 2019.
  bibtex: '@inproceedings{Bender_Reinke_Sextro_2019, place={Bremen 2019}, title={Konstruktion
    und Zustandsüberwachung eines Gummi-Metall-Teils mit integriertem Thermoelement},
    volume={VDI-Berichte 2346}, booktitle={10. VDI-Fachtagung Schwingungen von Windenergieanlagen
    2019}, author={Bender, Amelie and Reinke, Kai and Sextro, Walter}, year={2019},
    pages={241–248} }'
  chicago: Bender, Amelie, Kai Reinke, and Walter Sextro. “Konstruktion Und Zustandsüberwachung
    Eines Gummi-Metall-Teils Mit Integriertem Thermoelement.” In <i>10. VDI-Fachtagung
    Schwingungen von Windenergieanlagen 2019</i>, VDI-Berichte 2346:241–48. Bremen
    2019, 2019.
  ieee: A. Bender, K. Reinke, and W. Sextro, “Konstruktion und Zustandsüberwachung
    eines Gummi-Metall-Teils mit integriertem Thermoelement,” in <i>10. VDI-Fachtagung
    Schwingungen von Windenergieanlagen 2019</i>, 2019, vol. VDI-Berichte 2346, pp.
    241–248.
  mla: Bender, Amelie, et al. “Konstruktion Und Zustandsüberwachung Eines Gummi-Metall-Teils
    Mit Integriertem Thermoelement.” <i>10. VDI-Fachtagung Schwingungen von Windenergieanlagen
    2019</i>, vol. VDI-Berichte 2346, 2019, pp. 241–48.
  short: 'A. Bender, K. Reinke, W. Sextro, in: 10. VDI-Fachtagung Schwingungen von
    Windenergieanlagen 2019, Bremen 2019, 2019, pp. 241–248.'
date_created: 2019-06-17T09:36:23Z
date_updated: 2022-01-06T06:50:33Z
department:
- _id: '151'
language:
- iso: eng
page: 241-248
place: Bremen 2019
publication: 10. VDI-Fachtagung Schwingungen von Windenergieanlagen 2019
status: public
title: Konstruktion und Zustandsüberwachung eines Gummi-Metall-Teils mit integriertem
  Thermoelement
type: conference
user_id: '55222'
volume: VDI-Berichte 2346
year: '2019'
...
---
_id: '10257'
abstract:
- lang: eng
  text: In der Entwicklung mechatronischer Systeme spielt die Steigerung der Verlässlichkeit
    und somit auch der Zuverlässigkeit und der funktionalen Sicherheit eine entscheidende
    Rolle. Die modellbasierte Entwicklung liefert in Kombination mit unterstützender
    Software einen wichtigen Beitrag zur Absicherung der Verlässlichkeit mechatronischer
    Systeme in frühen Entwicklungsphasen. In der Nutzungsphase ermöglichen aktuelle
    Verfahren der Zustandsüberwachung und moderne Methoden der Regelungstechnik eine
    effektive Absicherung. Modelle aus der Entwicklung mechatronischer Systeme enthalten
    weitreichende Informationen über die Architektur, das Verhalten und die Verlässlichkeit
    eines Systems. Diese Modelle können als Grundlage für die Erstellung eines Digitalen
    Zwillings für die vorausschauende Instandhaltung verwendet und mit Zustandsdaten
    des realen Systems kombiniert werden. Die Nutzung der Modelle für den Digitalen
    Zwilling bietet weitreichende Potenziale und vereinfacht dessen Erzeugung. Die
    Veröffentlichung beschreibt Rahmenbedingungen der Integration und stellt die Potenziale
    des Digitalen Zwillings zur vorausschauenden Instandhaltung dar.
author:
- first_name: Thorben
  full_name: Kaul, Thorben
  id: '14802'
  last_name: Kaul
- first_name: Julian
  full_name: Hentze, Julian
  id: '13342'
  last_name: Hentze
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Iris
  full_name: Gräßler, Iris
  last_name: Gräßler
citation:
  ama: 'Kaul T, Hentze J, Sextro W, Gräßler I. Integration von Verlässlichkeitsmodellen
    der Entwicklung in einen Digitalen Zwilling zur Umsetzung einer vorausschauenden
    Instandhaltung. In: <i>Fachtagung Mechatronik 2019 Paderborn</i>. ; 2019.'
  apa: Kaul, T., Hentze, J., Sextro, W., &#38; Gräßler, I. (2019). Integration von
    Verlässlichkeitsmodellen der Entwicklung in einen Digitalen Zwilling zur Umsetzung
    einer vorausschauenden Instandhaltung. In <i>Fachtagung Mechatronik 2019 Paderborn</i>.
  bibtex: '@inproceedings{Kaul_Hentze_Sextro_Gräßler_2019, title={Integration von
    Verlässlichkeitsmodellen der Entwicklung in einen Digitalen Zwilling zur Umsetzung
    einer vorausschauenden Instandhaltung}, booktitle={Fachtagung Mechatronik 2019
    Paderborn}, author={Kaul, Thorben and Hentze, Julian and Sextro, Walter and Gräßler,
    Iris}, year={2019} }'
  chicago: Kaul, Thorben, Julian Hentze, Walter Sextro, and Iris Gräßler. “Integration
    von Verlässlichkeitsmodellen Der Entwicklung in Einen Digitalen Zwilling Zur Umsetzung
    Einer Vorausschauenden Instandhaltung.” In <i>Fachtagung Mechatronik 2019 Paderborn</i>,
    2019.
  ieee: T. Kaul, J. Hentze, W. Sextro, and I. Gräßler, “Integration von Verlässlichkeitsmodellen
    der Entwicklung in einen Digitalen Zwilling zur Umsetzung einer vorausschauenden
    Instandhaltung,” in <i>Fachtagung Mechatronik 2019 Paderborn</i>, 2019.
  mla: Kaul, Thorben, et al. “Integration von Verlässlichkeitsmodellen Der Entwicklung
    in Einen Digitalen Zwilling Zur Umsetzung Einer Vorausschauenden Instandhaltung.”
    <i>Fachtagung Mechatronik 2019 Paderborn</i>, 2019.
  short: 'T. Kaul, J. Hentze, W. Sextro, I. Gräßler, in: Fachtagung Mechatronik 2019
    Paderborn, 2019.'
date_created: 2019-06-17T12:43:10Z
date_updated: 2022-01-06T06:50:33Z
department:
- _id: '151'
language:
- iso: eng
publication: Fachtagung Mechatronik 2019 Paderborn
status: public
title: Integration von Verlässlichkeitsmodellen der Entwicklung in einen Digitalen
  Zwilling zur Umsetzung einer vorausschauenden Instandhaltung
type: conference
user_id: '55222'
year: '2019'
...
---
_id: '10258'
abstract:
- lang: eng
  text: Für die Zerstäubung hochviskoser Flüssigkeiten werden neben Düsenzerstäubern
    vor allem UltraschallStehwellenzerstäuber angewendet [1]. Diese ermöglichen ohne
    weitere Maßnahmen zwar keine gerichtete Zerstäubung, benötigen jedoch im Gegensatz
    zu Düsenzerstäubern keine hohen Drücke und haben keine hohen Austrittsgeschwindigkeiten.
    Zur Erzeugung der Ultraschallwellen werden typischerweise piezoelektrische, mit
    Bolzen verschraubte LangevinWandler verwendet [1-4], die eine starke Schallabstrahlung
    bei einer elektrischen Eingangsleistung von bis zu einigen Kilowatt erzeugen können.
    Wie bei jedem anderen schwingenden System emittiert der Ultraschallwandler zunächst
    eine Wanderwelle. Mit einem Reflektor, der gegenüber der Sonotrode angeordnet
    ist, wird eine stehende Welle erzeugt. Im Resonanzabstand zwischen Reflektor und
    Wandler werden abgestrahlte und reflektierte Wellen so überlagert, dass höhere
    Schalldruckamplituden erzielt werden. Ein einfacher Ansatz zur Maximierung des
    Schallpegels im Stehwellenfeld ist die Erhöhung der Schwingungsamplituden des
    Wandlers, die jedoch zu Schäden oder zumindest zu einer Verringerung der Lebensdauer
    führen kann. Hohe Schalldrücke werden auch bei geringen Abständen zwischen Wandler
    und Reflektor erreicht. Das Volumen des Schallfeldes ist in diesem Fall jedoch
    für die meisten Prozesse zu klein. Ein weiterer Ansatz ist die Verwendung zweier
    entgegengesetzt angeordneter Wandler [5]. In diesem Fall erfordert jedoch die
    Erzeugung einer stehenden Welle eine genaue Abstimmung von Frequenz und Phase
    beider Wandler, was eine komplexe Steuerung erfordert. Ebenso ist es möglich,
    geometrische Randbedingungen des Stehwellensystems zu optimieren, sodass es zu
    optimaler Interferenz der Wellen kommt. Im Folgenden wird der Anschaulichkeit
    halber vereinfachend angenommen, dass der Wandler an seiner Sonotrodenoberfläche
    einzelne Schallstrahlen aussendet, die in Nähe des Wandlers nahezu parallel verlaufen
    und sich mit zunehmender Entfernung vom Wandler auffächern. Ein einfaches Stehwellensystem,
    bestehend aus ebener Sonotrode und ebenem Reflektor, erzeugt bei kleinem Abstand
    zwischen Sonotrode und Reflektor sehr hohe Schallpegel, da nahezu sämtliche ausgesandten
    Schallstrahlen in Richtung der Sonotrode reflektiert werden positive Interferenz
    entsteht. Erhöht man jedoch den Abstand zwischen Sonotrode und Reflektor, so nehmen
    die Verluste durch Schallstrahlen, die den Prozessraum verlassen, zu. Wie Abbildung
    1 gezeigt, werden nur Schallstrahlen, die in etwa parallel zur Rotationsachse
    verlaufen, zum Wandler zurück reflektiert und tragen zum Stehwellenfeld bei. Die
    Strahlen haben zudem abhängig vom Abstrahlwinkel unterschiedliche Weglängen. Die
    Stehwellenbedingung ist demnach nur für Strahlen in der Nähe der Rotationsachse
    exakt erfüllt. Um dies zu vermeiden, müssen die Geometrien von Wandler und Reflektor
    optimiert werden. In den folgenden Abschnitten wird zunächst ein Optimierungsansatz
    vorgestellt. Mithilfe eines FiniteElemente-Modells werden die Auswirkungen einer
    optimierten Geometrie auf den maximalen Schalldruckpegel untersucht. Ergebnisse
    werden durch Messungen an einem experimentellen Aufbau eines Stehwellensystems
    validiert. Es wird gezeigt, wie sich die Optimierung der geometrischen Randbedingungen
    auf die Zerstäubung hochviskoser Flüssigkeiten auswirkt.
author:
- first_name: Paul
  full_name: Dunst, Paul
  id: '22130'
  last_name: Dunst
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Peter
  full_name: Bornmann, Peter
  last_name: Bornmann
- first_name: 'Walter '
  full_name: 'Littmann, Walter '
  last_name: Littmann
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Dunst P, Hemsel T, Bornmann P, Littmann W, Sextro W. Modellbasierte und experimentelle
    Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung
    hochviskoser Flüssigkeiten. In: <i>DAGA 2019</i>. ; 2019.'
  apa: Dunst, P., Hemsel, T., Bornmann, P., Littmann, W., &#38; Sextro, W. (2019).
    Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern
    für die Zerstäubung hochviskoser Flüssigkeiten. In <i>DAGA 2019</i>. Rostock.
  bibtex: '@inproceedings{Dunst_Hemsel_Bornmann_Littmann_Sextro_2019, title={Modellbasierte
    und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern
    für die Zerstäubung hochviskoser Flüssigkeiten}, booktitle={DAGA 2019}, author={Dunst,
    Paul and Hemsel, Tobias and Bornmann, Peter and Littmann, Walter  and Sextro,
    Walter}, year={2019} }'
  chicago: Dunst, Paul, Tobias Hemsel, Peter Bornmann, Walter  Littmann, and Walter
    Sextro. “Modellbasierte Und Experimentelle Charakterisierung von Intensiven Ultraschall-Stehwellenfeldern
    Für Die Zerstäubung Hochviskoser Flüssigkeiten.” In <i>DAGA 2019</i>, 2019.
  ieee: P. Dunst, T. Hemsel, P. Bornmann, W. Littmann, and W. Sextro, “Modellbasierte
    und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern
    für die Zerstäubung hochviskoser Flüssigkeiten,” in <i>DAGA 2019</i>, Rostock,
    2019.
  mla: Dunst, Paul, et al. “Modellbasierte Und Experimentelle Charakterisierung von
    Intensiven Ultraschall-Stehwellenfeldern Für Die Zerstäubung Hochviskoser Flüssigkeiten.”
    <i>DAGA 2019</i>, 2019.
  short: 'P. Dunst, T. Hemsel, P. Bornmann, W. Littmann, W. Sextro, in: DAGA 2019,
    2019.'
conference:
  end_date: 2019-03-21
  location: Rostock
  name: Deutsche Jahrestagung für Akustik - DAGA 2019
  start_date: 2019-03-18
date_created: 2019-06-17T13:01:47Z
date_updated: 2022-01-06T06:50:33Z
department:
- _id: '151'
language:
- iso: eng
publication: DAGA 2019
status: public
title: Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern
  für die Zerstäubung hochviskoser Flüssigkeiten
type: conference
user_id: '22130'
year: '2019'
...
---
_id: '15475'
abstract:
- lang: ger
  text: Die Achse als einzige Verbindung zwischen Fahrzeugaufbau und Rad hat die Hauptaufgabe
    das Rad auf der Straße zuführen. Kinematisch betrachtet übernimmt die Radaufhängung,
    als Teil der Achse, die Funktion, zwischen Rad und Fahrzeugaufbaueinen vertikalen
    Freiheitsgrad zur Aufnahme von Fahrbahnunebenheiten zu realisieren. Die aus der
    RadhubundElastokinematik resultierenden Radstellungsänderungen bestimmen dabei
    maßgeblich die Fahrdynamik. Zur objektivenBeurteilung von Radaufhängungen ist
    eine genaue Charakterisierung der Radhub- und Elastokinematik erforderlich.Daher
    wurde zur Identifikation der kinematischen, elastokinematischen und dynamischen
    Radaufhängungseigenschaftenam Lehrstuhl für Dynamik und Mechatronik der Universität
    Paderborn ein Halbachsprüfstand entwickelt. Bei der Auslegungwurde Wert auf ein
    möglichst breites Einsatzspektrum gelegt. Es können verschiedene Typen von Einzelradaufhängungenin
    Serien- oder Prototypenkonfiguration am Prüfstand analysiert werden. Er ermöglicht
    eine Identifikation derdynamischen Radstellungsänderungen unter verschiedenen
    fahrdynamischen Lastfällen und regellosen Anregungen.
author:
- first_name: Jan
  full_name: Schütte, Jan
  id: '22109'
  last_name: Schütte
  orcid: 0000-0001-9025-9742
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Sergej
  full_name: Kohl, Sergej
  last_name: Kohl
citation:
  ama: 'Schütte J, Sextro W, Kohl S. Halbachsprüfstand zur kinematischen, elastokinematischen
    und dynamischen Charakterisierung von Radaufhängungen. In: <i>Fachtagung Mechatronik
    2019</i>. Universitätsbibliothek Paderborn, 2019; 2019. doi:<a href="https://doi.org/10.17619/UNIPB/1-777">10.17619/UNIPB/1-777</a>'
  apa: Schütte, J., Sextro, W., &#38; Kohl, S. (2019). Halbachsprüfstand zur kinematischen,
    elastokinematischen und dynamischen Charakterisierung von Radaufhängungen. <i>Fachtagung
    Mechatronik 2019</i>. Fachtagung Mechatronik 2019, Paderborn. <a href="https://doi.org/10.17619/UNIPB/1-777">https://doi.org/10.17619/UNIPB/1-777</a>
  bibtex: '@inproceedings{Schütte_Sextro_Kohl_2019, place={Paderborn}, title={Halbachsprüfstand
    zur kinematischen, elastokinematischen und dynamischen Charakterisierung von Radaufhängungen},
    DOI={<a href="https://doi.org/10.17619/UNIPB/1-777">10.17619/UNIPB/1-777</a>},
    booktitle={Fachtagung Mechatronik 2019}, publisher={Universitätsbibliothek Paderborn,
    2019}, author={Schütte, Jan and Sextro, Walter and Kohl, Sergej}, year={2019}
    }'
  chicago: 'Schütte, Jan, Walter Sextro, and Sergej Kohl. “Halbachsprüfstand zur kinematischen,
    elastokinematischen und dynamischen Charakterisierung von Radaufhängungen.” In
    <i>Fachtagung Mechatronik 2019</i>. Paderborn: Universitätsbibliothek Paderborn,
    2019, 2019. <a href="https://doi.org/10.17619/UNIPB/1-777">https://doi.org/10.17619/UNIPB/1-777</a>.'
  ieee: 'J. Schütte, W. Sextro, and S. Kohl, “Halbachsprüfstand zur kinematischen,
    elastokinematischen und dynamischen Charakterisierung von Radaufhängungen,” presented
    at the Fachtagung Mechatronik 2019, Paderborn, 2019, doi: <a href="https://doi.org/10.17619/UNIPB/1-777">10.17619/UNIPB/1-777</a>.'
  mla: Schütte, Jan, et al. “Halbachsprüfstand zur kinematischen, elastokinematischen
    und dynamischen Charakterisierung von Radaufhängungen.” <i>Fachtagung Mechatronik
    2019</i>, Universitätsbibliothek Paderborn, 2019, 2019, doi:<a href="https://doi.org/10.17619/UNIPB/1-777">10.17619/UNIPB/1-777</a>.
  short: 'J. Schütte, W. Sextro, S. Kohl, in: Fachtagung Mechatronik 2019, Universitätsbibliothek
    Paderborn, 2019, Paderborn, 2019.'
conference:
  end_date: 28.03.2019
  location: Paderborn
  name: Fachtagung Mechatronik 2019
  start_date: 27.03.2019
date_created: 2020-01-09T10:00:32Z
date_updated: 2024-05-27T07:49:25Z
department:
- _id: '151'
doi: 10.17619/UNIPB/1-777
language:
- iso: ger
place: Paderborn
publication: Fachtagung Mechatronik 2019
publication_status: published
publisher: Universitätsbibliothek Paderborn, 2019
status: public
title: Halbachsprüfstand zur kinematischen, elastokinematischen und dynamischen Charakterisierung
  von Radaufhängungen
type: conference
user_id: '22109'
year: '2019'
...
---
_id: '10334'
abstract:
- lang: eng
  text: Ultrasonic joining is a common industrial process. In the electronics industry
    it is used to form electrical connections, including those of dissimilar materials.
    Multiple influencing factors in ultrasonic joining are known and extensively investigated;
    process parameters like ultrasonic power, bond force, and bonding frequency of
    the ultrasonic vibration are known to have a high impact on a reliable joining
    process and need to be adapted for each new application with different geometry
    or materials. This contribution is focused on increasing ultrasonic power transmitted
    to the interface and keeping mechanical stresses during ultrasonic bonding low
    by using a multi-dimensional ultrasonic transducer concept. Bonding results for
    a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional
    bonding are discussed.
author:
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Collin
  full_name: Dymel, Collin
  id: '66833'
  last_name: Dymel
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex
    multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors
    and Actuators A: Physical</i>. 2019;295:653-662. doi:<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>'
  apa: 'Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &#38; Sextro,
    W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic
    bonding and welding. <i>Sensors and Actuators A: Physical</i>, <i>295</i>, 653–662.
    <a href="https://doi.org/10.1016/j.sna.2019.04.025">https://doi.org/10.1016/j.sna.2019.04.025</a>'
  bibtex: '@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using
    complex multi-dimensional vibration trajectories in ultrasonic bonding and welding},
    volume={295}, DOI={<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>},
    journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel,
    Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro,
    Walter}, year={2019}, pages={653–662} }'
  chicago: 'Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael
    Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories
    in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i> 295
    (2019): 653–62. <a href="https://doi.org/10.1016/j.sna.2019.04.025">https://doi.org/10.1016/j.sna.2019.04.025</a>.'
  ieee: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro,
    “Using complex multi-dimensional vibration trajectories in ultrasonic bonding
    and welding,” <i>Sensors and Actuators A: Physical</i>, vol. 295, pp. 653–662,
    2019, doi: <a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>.'
  mla: 'Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories
    in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i>,
    vol. 295, 2019, pp. 653–62, doi:<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>.'
  short: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro,
    Sensors and Actuators A: Physical 295 (2019) 653–662.'
date_created: 2019-07-01T07:32:07Z
date_updated: 2023-09-21T14:12:15Z
department:
- _id: '151'
doi: 10.1016/j.sna.2019.04.025
intvolume: '       295'
keyword:
- Ultrasonic bonding
- Ultrasonic welding
- Multi-dimensional bonding
- Complex vibration
- Multi-frequent
- Two-dimensional friction model
language:
- iso: eng
page: 653 - 662
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: 'Sensors and Actuators A: Physical'
publication_identifier:
  issn:
  - 0924-4247
quality_controlled: '1'
status: public
title: Using complex multi-dimensional vibration trajectories in ultrasonic bonding
  and welding
type: journal_article
user_id: '210'
volume: 295
year: '2019'
...
---
_id: '13460'
abstract:
- lang: eng
  text: 'Remaining useful lifetime (RUL) predictions as part of a condition monitoring
    system are focused in more and more research and industrial applications. To establish
    an efficient and precise estimate of the RUL of a technical product, different  uncertainties  have  to  be  handled.  To  minimize  the  uncertainties  of  the  RUL  estimation,  a  reliable
    and accurate prognostic approach as well as a good failure threshold are important.
    Regarding the failure threshold, most often  an  expert  sets  a  fixed  failure  threshold.  However,  neither  the  a  priori  known  failure  threshold  nor  a  fixedthreshold
    value are feasible in every application. Especially in the case of varying characteristics
    of the monitored system, an adaptive failure threshold is of great importance
    concerning the accuracy of the RUL estimation.  Rubber-metal-elements, which are
    used in a wide range of applications for vibration and sound isolation, are mon-itored
    by thermocouples to allow for lifetime predictions. Therefore, the element’s state
    is described by its temper-ature during its service life. Aiming to establish
    accurate RUL predictions of a rubber-metal-element, uncertainties due to nonlinear
    material characteristics and changing operational conditions have to be considered.
    Consequently, different temperature-based failure threshold definitions are implemented
    and compared within a particle filtering approach. '
author:
- first_name: Amelie
  full_name: Bender, Amelie
  id: '54290'
  last_name: Bender
- first_name: Lennart
  full_name: Schinke, Lennart
  last_name: Schinke
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Bender A, Schinke L, Sextro W. Remaining useful lifetime prediction based
    on adaptive failure thresholds. In: Beer M, Zio E, eds. <i>Proceedings of the
    29th European Safety and Reliability Conference (ESREL2019)</i>. ; 2019:1262-1269.'
  apa: Bender, A., Schinke, L., &#38; Sextro, W. (2019). Remaining useful lifetime
    prediction based on adaptive failure thresholds. In M. Beer &#38; E. Zio (Eds.),
    <i>Proceedings of the 29th European Safety and Reliability Conference (ESREL2019)</i>
    (Issue 29, pp. 1262–1269).
  bibtex: '@inproceedings{Bender_Schinke_Sextro_2019, title={Remaining useful lifetime
    prediction based on adaptive failure thresholds}, number={29}, booktitle={Proceedings
    of the 29th European Safety and Reliability Conference (ESREL2019)}, author={Bender,
    Amelie and Schinke, Lennart and Sextro, Walter}, editor={Beer, Michael and Zio,
    Enrico}, year={2019}, pages={1262–1269} }'
  chicago: Bender, Amelie, Lennart Schinke, and Walter Sextro. “Remaining Useful Lifetime
    Prediction Based on Adaptive Failure Thresholds.” In <i>Proceedings of the 29th
    European Safety and Reliability Conference (ESREL2019)</i>, edited by Michael
    Beer and Enrico Zio, 1262–69, 2019.
  ieee: A. Bender, L. Schinke, and W. Sextro, “Remaining useful lifetime prediction
    based on adaptive failure thresholds,” in <i>Proceedings of the 29th European
    Safety and Reliability Conference (ESREL2019)</i>, Hannover, 2019, no. 29, pp.
    1262–1269.
  mla: Bender, Amelie, et al. “Remaining Useful Lifetime Prediction Based on Adaptive
    Failure Thresholds.” <i>Proceedings of the 29th European Safety and Reliability
    Conference (ESREL2019)</i>, edited by Michael Beer and Enrico Zio, no. 29, 2019,
    pp. 1262–69.
  short: 'A. Bender, L. Schinke, W. Sextro, in: M. Beer, E. Zio (Eds.), Proceedings
    of the 29th European Safety and Reliability Conference (ESREL2019), 2019, pp.
    1262–1269.'
conference:
  end_date: 2019.09.26
  location: Hannover
  name: '29th European Safety and Reliability Conference '
  start_date: 2019.09.22
date_created: 2019-09-30T08:49:19Z
date_updated: 2023-09-22T07:31:53Z
department:
- _id: '151'
editor:
- first_name: Michael
  full_name: Beer, Michael
  last_name: Beer
- first_name: Enrico
  full_name: Zio, Enrico
  last_name: Zio
issue: '29'
keyword:
- RUL prediction
- adaptive threshold
- prognostics
- condition monitoring
language:
- iso: eng
main_file_link:
- open_access: '1'
  url: http://rpsonline.com.sg/proceedings/9789811127243/html/0445.xml
oa: '1'
page: 1262-1269
publication: Proceedings of the 29th European Safety and Reliability Conference (ESREL2019)
publication_identifier:
  isbn:
  - 978-981-11-2724-3
publication_status: published
quality_controlled: '1'
status: public
title: Remaining useful lifetime prediction based on adaptive failure thresholds
type: conference
user_id: '54290'
year: '2019'
...
---
_id: '13461'
abstract:
- lang: eng
  text: As the emerging digitalization of technical systems offers immense opportunities
    to be exploited by means of bigdata analysis, ubiquitous computing and largely
    networked systems, the digital twin comes into focus to combineall these aspects
    to an attendant model of an individual system during design phase as well as during
    operation.Since state-of-art technical systems are growing increasingly complex
    due to inherent intelligence and increasingfunctionality, i. e. autonomous behavior
    so far, it becomes considerably challenging to ensure reliability for thosesystems.
    Many methods were developed to support a reliability focused design or reliability-by-design
    approachesto tackle this challenge during design process. In field, data-based
    methods, i. e. condition monitoring enabled bythe rise of machine learning approaches,
    are exploited to ensure a reliable operation based on the current conditionof
    the monitored system. In order to take advantage of existing models of system
    reliability during design phaseand condition monitoring systems during operation,
    a method is proposed to combine both approaches in order toset up a digital twin
    with focus on system reliability. The base model of the digital twin is taken
    from the systemreliability model from the design phase and is used during operation
    and therein updated to the current reliabilitybased on the state estimation of
    the condition monitoring system. The approach is illustrated with a case study
    of arolling bearing test rig.
author:
- first_name: Thorben
  full_name: Kaul, Thorben
  id: '14802'
  last_name: Kaul
- first_name: Amelie
  full_name: Bender, Amelie
  id: '54290'
  last_name: Bender
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Kaul T, Bender A, Sextro W. Digital Twin for Reliability Analysis During Design
    and Operation of Mechatronic Systems. In: Beer M, Zio E, eds. <i>Proceedings of
    the 29th European Safety and Reliability Conference (ESREL2019)</i>. ; 2019:2340-2347.'
  apa: Kaul, T., Bender, A., &#38; Sextro, W. (2019). Digital Twin for Reliability
    Analysis During Design and Operation of Mechatronic Systems. In M. Beer &#38;
    E. Zio (Eds.), <i>Proceedings of the 29th European Safety and Reliability Conference
    (ESREL2019)</i> (Issue 29, pp. 2340–2347).
  bibtex: '@inproceedings{Kaul_Bender_Sextro_2019, title={Digital Twin for Reliability
    Analysis During Design and Operation of Mechatronic Systems}, number={29}, booktitle={Proceedings
    of the 29th European Safety and Reliability Conference (ESREL2019)}, author={Kaul,
    Thorben and Bender, Amelie and Sextro, Walter}, editor={Beer, Michael and Zio,
    Enrico}, year={2019}, pages={2340–2347} }'
  chicago: Kaul, Thorben, Amelie Bender, and Walter Sextro. “Digital Twin for Reliability
    Analysis During Design and Operation of Mechatronic Systems.” In <i>Proceedings
    of the 29th European Safety and Reliability Conference (ESREL2019)</i>, edited
    by Michael Beer and Enrico Zio, 2340–47, 2019.
  ieee: T. Kaul, A. Bender, and W. Sextro, “Digital Twin for Reliability Analysis
    During Design and Operation of Mechatronic Systems,” in <i>Proceedings of the
    29th European Safety and Reliability Conference (ESREL2019)</i>, Hannover, 2019,
    no. 29, pp. 2340–2347.
  mla: Kaul, Thorben, et al. “Digital Twin for Reliability Analysis During Design
    and Operation of Mechatronic Systems.” <i>Proceedings of the 29th European Safety
    and Reliability Conference (ESREL2019)</i>, edited by Michael Beer and Enrico
    Zio, no. 29, 2019, pp. 2340–47.
  short: 'T. Kaul, A. Bender, W. Sextro, in: M. Beer, E. Zio (Eds.), Proceedings of
    the 29th European Safety and Reliability Conference (ESREL2019), 2019, pp. 2340–2347.'
conference:
  end_date: 2019.09.26
  location: Hannover
  name: Proceedings of the European Safety and Reliability Conference (ESREL2019)
  start_date: 2019.09.22
date_created: 2019-09-30T09:16:16Z
date_updated: 2023-09-28T08:49:27Z
department:
- _id: '151'
editor:
- first_name: Michael
  full_name: Beer, Michael
  last_name: Beer
- first_name: Enrico
  full_name: Zio, Enrico
  last_name: Zio
issue: '29'
language:
- iso: eng
main_file_link:
- open_access: '1'
  url: http://rpsonline.com.sg/proceedings/9789811127243/pdf/0876.pdf
oa: '1'
page: 2340-2347
publication: Proceedings of the 29th European Safety and Reliability Conference (ESREL2019)
publication_identifier:
  isbn:
  - ' 978-981-11-2724-3'
publication_status: published
quality_controlled: '1'
status: public
title: Digital Twin for Reliability Analysis During Design and Operation of Mechatronic
  Systems
type: conference
user_id: '210'
year: '2019'
...
---
_id: '9987'
abstract:
- lang: eng
  text: Rubber-metal-elements are used in a wide range of applications for vibration
    and sound isola- tion. Nowadays it is state of the art to calculate the lifetimes
    of these elements under mechanical stress prior to their service life. To establish
    more reliable and safer rubber-metal-elements, continuous monitoring by dif- ferent
    sensors can be used. Especially prognostics enable a rise in reliability, availability
    and safety. To estab- lish these advantages, estimating the remaining useful lifetime
    of rubber-metal-elements should be realized during its service life based on current
    information on its condition. Therefore a suitable measure to monitor the condition
    of the element is necessary. This work focuses on temperature signals. This approach
    allows in- cluding the ambient temperature and thereby involving changing operating
    conditions. For estimating the RUL of rubber-metal-elements a model-based prognostics
    approach based on particle filtering is proposed. Its performance is analyzed
    regarding relevant parameters to enable the best performance for the applied data.
author:
- first_name: Amelie
  full_name: Bender, Amelie
  id: '54290'
  last_name: Bender
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Bender A, Sextro W. A particle filtering approach for temperature based prognostics.
    In: <i>Safety and Reliability – Safe Societies in a Changing World</i>. Trondheim,
    Norway; 2018:1025-1033.'
  apa: Bender, A., &#38; Sextro, W. (2018). A particle filtering approach for temperature
    based prognostics. In <i>Safety and Reliability – Safe Societies in a Changing
    World</i> (pp. 1025–1033). Trondheim, Norway.
  bibtex: '@inproceedings{Bender_Sextro_2018, place={Trondheim, Norway}, title={A
    particle filtering approach for temperature based prognostics}, booktitle={Safety
    and Reliability – Safe Societies in a Changing World}, author={Bender, Amelie
    and Sextro, Walter}, year={2018}, pages={1025–1033} }'
  chicago: Bender, Amelie, and Walter Sextro. “A Particle Filtering Approach for Temperature
    Based Prognostics.” In <i>Safety and Reliability – Safe Societies in a Changing
    World</i>, 1025–33. Trondheim, Norway, 2018.
  ieee: A. Bender and W. Sextro, “A particle filtering approach for temperature based
    prognostics,” in <i>Safety and Reliability – Safe Societies in a Changing World</i>,
    2018, pp. 1025–1033.
  mla: Bender, Amelie, and Walter Sextro. “A Particle Filtering Approach for Temperature
    Based Prognostics.” <i>Safety and Reliability – Safe Societies in a Changing World</i>,
    2018, pp. 1025–33.
  short: 'A. Bender, W. Sextro, in: Safety and Reliability – Safe Societies in a Changing
    World, Trondheim, Norway, 2018, pp. 1025–1033.'
date_created: 2019-05-27T09:56:44Z
date_updated: 2019-09-30T08:01:18Z
department:
- _id: '151'
language:
- iso: eng
page: 1025-1033
place: Trondheim, Norway
publication: Safety and Reliability – Safe Societies in a Changing World
quality_controlled: '1'
status: public
title: A particle filtering approach for temperature based prognostics
type: conference
user_id: '55222'
year: '2018'
...
---
_id: '9990'
abstract:
- lang: eng
  text: The handling of fine powders is an important task in modern production processes.
    However, as fine powders strongly tend to adhesion and agglomeration, their processing
    with conventional methods is difficult or impossible. Especially when processing
    small amounts of highly sensitive fine powders, conventional methods reach their
    technical limits. In process steps such as dosing, transport, and especially mixing
    of fine powders new methods are required. Apart from the well-known method of
    manipulating powder properties by adding chemical additives, this contribution
    aims at improving the handling of dry fine powders by using vibrations at different
    frequencies. Modules are presented, which enable the continuous dosing, the homogeneous
    mixing and the transport of dry fine powders. Finally, these modules are combined
    for the production of a homogeneous mixture of two dry fine powders.
author:
- first_name: Paul
  full_name: Dunst, Paul
  id: '22130'
  last_name: Dunst
- first_name: Peter
  full_name: Bornmann, Peter
  last_name: Bornmann
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter.
  full_name: Littmann, Walter.
  last_name: Littmann
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: Dunst P, Bornmann P, Hemsel T, Littmann W, Sextro W. Vibration Assisted Dosing,
    Mixing and Transport of Dry Fine Powders. <i>ACTUATOR 2018; 16th International
    Conference on New Actuators</i>. 2018:142-145.
  apa: Dunst, P., Bornmann, P., Hemsel, T., Littmann, W., &#38; Sextro, W. (2018).
    Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders. <i>ACTUATOR
    2018; 16th International Conference on New Actuators</i>, 142–145.
  bibtex: '@article{Dunst_Bornmann_Hemsel_Littmann_Sextro_2018, title={Vibration Assisted
    Dosing, Mixing and Transport of Dry Fine Powders}, journal={ACTUATOR 2018; 16th
    International Conference on New Actuators}, author={Dunst, Paul and Bornmann,
    Peter and Hemsel, Tobias and Littmann, Walter. and Sextro, Walter}, year={2018},
    pages={142–145} }'
  chicago: Dunst, Paul, Peter Bornmann, Tobias Hemsel, Walter. Littmann, and Walter
    Sextro. “Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders.”
    <i>ACTUATOR 2018; 16th International Conference on New Actuators</i>, 2018, 142–45.
  ieee: P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, and W. Sextro, “Vibration Assisted
    Dosing, Mixing and Transport of Dry Fine Powders,” <i>ACTUATOR 2018; 16th International
    Conference on New Actuators</i>, pp. 142–145, 2018.
  mla: Dunst, Paul, et al. “Vibration Assisted Dosing, Mixing and Transport of Dry
    Fine Powders.” <i>ACTUATOR 2018; 16th International Conference on New Actuators</i>,
    2018, pp. 142–45.
  short: P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, W. Sextro, ACTUATOR 2018;
    16th International Conference on New Actuators (2018) 142–145.
date_created: 2019-05-27T10:13:10Z
date_updated: 2019-09-16T09:45:13Z
department:
- _id: '151'
language:
- iso: eng
page: 142-145
publication: ACTUATOR 2018; 16th International Conference on New Actuators
quality_controlled: '1'
status: public
title: Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders
type: journal_article
user_id: '55222'
year: '2018'
...
---
_id: '9991'
abstract:
- lang: eng
  text: Abstract:Since ﬁne powders tend strongly to adhesion and agglomeration, their
    processing withconventional methods is difﬁcult or impossible. Typically, in order
    to enable the handling of ﬁnepowders, chemicals are added to increase the ﬂowability
    and reduce adhesion. This contributionshows that instead of additives also vibrations
    can be used to increase the ﬂowability, to reduceadhesion and cohesion, and thus
    to enable or improve processes such as precision dosing, mixing,and transport
    of very ﬁne powders. The methods for manipulating powder properties are describedin
    detail and prototypes for experimental studies are presented. It is shown that
    the handling of ﬁnepowders can be improved by using low-frequency, high-frequency
    or a combination of low- andhigh-frequency vibration.
author:
- first_name: Paul
  full_name: Dunst, Paul
  id: '22130'
  last_name: Dunst
- first_name: Peter
  full_name: Bornmann, Peter
  last_name: Bornmann
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: Dunst P, Bornmann P, Hemsel T, Sextro W. Vibration-Assisted Handling of Dry
    Fine Powders. <i>Actuators 2018, 7(2)</i>. 2018:1-11. doi:<a href="https://doi.org/10.3390/act7020018">10.3390/act7020018</a>
  apa: Dunst, P., Bornmann, P., Hemsel, T., &#38; Sextro, W. (2018). Vibration-Assisted
    Handling of Dry Fine Powders. <i>Actuators 2018, 7(2).</i>, 1–11. <a href="https://doi.org/10.3390/act7020018">https://doi.org/10.3390/act7020018</a>
  bibtex: '@article{Dunst_Bornmann_Hemsel_Sextro_2018, title={Vibration-Assisted Handling
    of Dry Fine Powders}, DOI={<a href="https://doi.org/10.3390/act7020018">10.3390/act7020018</a>},
    journal={Actuators 2018, 7(2).}, author={Dunst, Paul and Bornmann, Peter and Hemsel,
    Tobias and Sextro, Walter}, year={2018}, pages={1–11} }'
  chicago: Dunst, Paul, Peter Bornmann, Tobias Hemsel, and Walter Sextro. “Vibration-Assisted
    Handling of Dry Fine Powders.” <i>Actuators 2018, 7(2).</i>, 2018, 1–11. <a href="https://doi.org/10.3390/act7020018">https://doi.org/10.3390/act7020018</a>.
  ieee: P. Dunst, P. Bornmann, T. Hemsel, and W. Sextro, “Vibration-Assisted Handling
    of Dry Fine Powders,” <i>Actuators 2018, 7(2).</i>, pp. 1–11, 2018.
  mla: Dunst, Paul, et al. “Vibration-Assisted Handling of Dry Fine Powders.” <i>Actuators
    2018, 7(2).</i>, 2018, pp. 1–11, doi:<a href="https://doi.org/10.3390/act7020018">10.3390/act7020018</a>.
  short: P. Dunst, P. Bornmann, T. Hemsel, W. Sextro, Actuators 2018, 7(2). (2018)
    1–11.
date_created: 2019-05-27T10:16:16Z
date_updated: 2019-09-16T09:44:54Z
department:
- _id: '151'
doi: 10.3390/act7020018
keyword:
- powder handling
- ﬂowability
- dosing
- transport
- mixing
- dispersion
- piezoelectricactuators
- vibrations
language:
- iso: eng
page: 1-11
publication: Actuators 2018, 7(2).
quality_controlled: '1'
status: public
title: Vibration-Assisted Handling of Dry Fine Powders
type: journal_article
user_id: '55222'
year: '2018'
...
---
_id: '9992'
abstract:
- lang: eng
  text: State-of-the-art industrial compact high power electronic packages require
    copper-copper interconnections with larger cross sections made by ultrasonic bonding.
    In comparison to aluminium-copper, copper-copper interconnections require increased
    normal forces and ultrasonic power, which might lead to substrate damage due to
    increased mechanical stresses. One option to raise friction energy without increasing
    vibration amplitude between wire and substrate or bonding force is the use of
    two-dimensional vibration. The first part of this contribution reports on the
    development of a novel bonding system that executes two-dimensional vibrations
    of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic
    bonds only form properly when surfaces are clean, oxide free and activated, the
    geometries of tool-tip and pin were optimised using finite element analysis. To
    maximize the area of the bonded annulus the distribution of normal pressure was
    optimized by varying the convexity of the bottom side of the pin. Second, a statistical
    model obtained from an experimental parameter study shows the influence of different
    bonding parameters on the bond result. To find bonding parameters with the minimum
    number of tests, the experiments have been planned using a D-optimal experimental
    design approach.
author:
- first_name: Collin
  full_name: Dymel, Collin
  id: '66833'
  last_name: Dymel
- first_name: Paul
  full_name: Eichwald, Paul
  last_name: Eichwald
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation
    of weld formation in a novel two-dimensional copper-copper bonding process. In:
    <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
    Germany)</i>. ; 2018:1-6.'
  apa: Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig,
    M., &#38; Sextro, W. (2018). Numerical and statistical investigation of weld formation
    in a novel two-dimensional copper-copper bonding process. In <i>(Proceedings of
    7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>
    (pp. 1–6).
  bibtex: '@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018,
    title={Numerical and statistical investigation of weld formation in a novel two-dimensional
    copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration
    Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald,
    Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig,
    Matthias and Sextro, Walter}, year={2018}, pages={1–6} }'
  chicago: Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael
    Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation
    of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In
    <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
    Germany)</i>, 1–6, 2018.
  ieee: C. Dymel <i>et al.</i>, “Numerical and statistical investigation of weld formation
    in a novel two-dimensional copper-copper bonding process,” in <i>(Proceedings
    of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>,
    2018, pp. 1–6.
  mla: Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation
    in a Novel Two-Dimensional Copper-Copper Bonding Process.” <i>(Proceedings of
    7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>,
    2018, pp. 1–6.
  short: 'C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig,
    W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference,
    Dresden, Germany), 2018, pp. 1–6.'
date_created: 2019-05-27T10:18:10Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic wire-bonding
- bond-tool design
- parameter identification
- statistical engineering
language:
- iso: eng
page: 1-6
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 7th Electronics System-Integration Technology Conference,
  Dresden, Germany)
quality_controlled: '1'
status: public
title: Numerical and statistical investigation of weld formation in a novel two-dimensional
  copper-copper bonding process
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9993'
abstract:
- lang: eng
  text: Ultrasonic bonding and welding are common friction based approaches in the
    assembly of power electronics. Interconnections with cross-sections of 0.3 mm²
    up to 12 mm² made from copper are well suited in high power applications. For
    increasing friction energy, which is responsible for bond formation, a two-dimensional
    vibration approach is applied to newly developed interconnection pins. Using two-dimensional
    vibration for bonding requires identification of suitable bonding parameters.
    Even though simulation models of wire bonding processes exist, parameters for
    the two-dimensional pin-bonding process cannot be derived accurately yet. Within
    this contribution, a methodology and workflow for experimental studies identifying
    a suitable bond parameter space are presented. The results of a pre-study are
    used to set up an extensive statistical parameter study, which gives insights
    about the bond strength change due to bond process parameter variation. By evaluation
    of electrical data captured during bonding, errors biasing the resulting shear
    forces are identified. All data obtained during the experimental study is used
    to build a statistical regression model suitable for predicting shear forces.
    The accuracy of the regression model’s predictions is determined and the applicability
    to predict process parameters or validate simulation models is assessed. Finally,
    the influence of the tool trajectory on the bond formation is determined, comparing
    one dimensional, elliptic and circular trajectories.
author:
- first_name: Collin
  full_name: Dymel, Collin
  id: '66833'
  last_name: Dymel
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
citation:
  ama: 'Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental
    investigations on the impact of bond process parameters in two-dimensional ultrasonic
    copper bonding. In: <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan
    (ICSJ 2018), Kyoto, Japan)</i>. ; 2018:41-44.'
  apa: Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., &#38; Hunstig,
    M. (2018). Experimental investigations on the impact of bond process parameters
    in two-dimensional ultrasonic copper bonding. In <i>(Proceedings of 8th Electronics
    IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i> (pp. 41–44).
  bibtex: '@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental
    investigations on the impact of bond process parameters in two-dimensional ultrasonic
    copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium
    Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard
    and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias},
    year={2018}, pages={41–44} }'
  chicago: Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael
    Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of
    Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In <i>(Proceedings
    of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 41–44,
    2018.
  ieee: C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig,
    “Experimental investigations on the impact of bond process parameters in two-dimensional
    ultrasonic copper bonding,” in <i>(Proceedings of 8th Electronics IEEE CPMT Symposium
    Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp. 41–44.
  mla: Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process
    Parameters in Two-Dimensional Ultrasonic Copper Bonding.” <i>(Proceedings of 8th
    Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp.
    41–44.
  short: 'C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig,
    in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto,
    Japan), 2018, pp. 41–44.'
date_created: 2019-05-27T10:19:18Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic two-dimensional bonding
- electrical interconnection
- process parameters
language:
- iso: eng
page: 41-44
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018),
  Kyoto, Japan)
quality_controlled: '1'
status: public
title: Experimental investigations on the impact of bond process parameters in two-dimensional
  ultrasonic copper bonding
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9995'
abstract:
- lang: ger
  text: Selbstoptimierung bietet die Möglichkeit der autonomen Anpassung des Systemverhaltens
    an veränderliche Ziele. Dabei ist vor allem der Aspekt Zuverlässigkeit von maßgeblicher
    Bedeutung, da über einen an die aktuelle Systemzuverlässigkeit angepassten Betriebspunkt
    die Leistungsfähigkeit verbessert wird, während das Ausfallverhalten besser vorhersehbar
    wird. Zur Anpassung des Systemverhaltens an die aktuelle Zuverlässigkeit mittels
    Selbstoptimierung müssen die ersten beiden Schritte des Selbstoptimierungsprozesses
    unterstützt werden. Für die Analyse der Ist-Situation ist eine Erkennung des aktuellen
    Degradationszustands mittels Condition Monitoring notwendig. Zur Auswahl geeigneter
    Verfahren werden bestehende Ansätze hinsichtlich ihrer Eignung klassifiziert.
    Der zweite Schritt, die Bestimmung der Systemziele, wird durch eine strukturierte
    Methode zum Finden verlässlichkeitsrelevanter Zielfunktionen ergänzt. Dabei werden
    kritische Komponenten identifiziert, Optimierungsparameter festgelegt und die
    Verlässlichkeit in Abhängigkeit des Systemverhaltens quantifiziert. Entwickler
    selbstoptimierender Systeme werden somit durch geeignete Mittel bei der Implementierung
    beider Schritte unterstützt. Abschließend wird der praktische Einsatz der vorgestellten
    Methoden anhand zweier Beispiele gezeigt.
author:
- first_name: Tobias
  full_name: Meyer, Tobias
  last_name: Meyer
- first_name: Thorben
  full_name: Kaul, Thorben
  id: '14802'
  last_name: Kaul
- first_name: James Kuria
  full_name: Kimotho, James Kuria
  last_name: Kimotho
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: Meyer T, Kaul T, Kimotho JK, Sextro W. <i>Steigerung Der Intelligenz Mechatronischer
    Systeme</i>. Vol Steigerung der Verlässlichkeit technischer Systeme. Springer
    Nature Switzerland AG. Part of Springer Nature.; 2018:193-213.
  apa: Meyer, T., Kaul, T., Kimotho, J. K., &#38; Sextro, W. (2018). <i>Steigerung
    der Intelligenz mechatronischer Systeme</i> (Vol. Steigerung der Verlässlichkeit
    technischer Systeme, pp. 193–213). Springer Nature Switzerland AG. Part of Springer
    Nature.
  bibtex: '@book{Meyer_Kaul_Kimotho_Sextro_2018, title={Steigerung der Intelligenz
    mechatronischer Systeme}, volume={Steigerung der Verlässlichkeit technischer Systeme},
    publisher={Springer Nature Switzerland AG. Part of Springer Nature.}, author={Meyer,
    Tobias and Kaul, Thorben and Kimotho, James Kuria and Sextro, Walter}, year={2018},
    pages={193–213} }'
  chicago: Meyer, Tobias, Thorben Kaul, James Kuria Kimotho, and Walter Sextro. <i>Steigerung
    Der Intelligenz Mechatronischer Systeme</i>. Vol. Steigerung der Verlässlichkeit
    technischer Systeme. Springer Nature Switzerland AG. Part of Springer Nature.,
    2018.
  ieee: T. Meyer, T. Kaul, J. K. Kimotho, and W. Sextro, <i>Steigerung der Intelligenz
    mechatronischer Systeme</i>, vol. Steigerung der Verlässlichkeit technischer Systeme.
    Springer Nature Switzerland AG. Part of Springer Nature., 2018, pp. 193–213.
  mla: Meyer, Tobias, et al. <i>Steigerung Der Intelligenz Mechatronischer Systeme</i>.
    Vol. Steigerung der Verlässlichkeit technischer Systeme, Springer Nature Switzerland
    AG. Part of Springer Nature., 2018, pp. 193–213.
  short: T. Meyer, T. Kaul, J.K. Kimotho, W. Sextro, Steigerung Der Intelligenz Mechatronischer
    Systeme, Springer Nature Switzerland AG. Part of Springer Nature., 2018.
date_created: 2019-05-27T10:22:20Z
date_updated: 2019-05-27T10:23:51Z
department:
- _id: '151'
language:
- iso: eng
page: 193-213
publisher: Springer Nature Switzerland AG. Part of Springer Nature.
status: public
title: Steigerung der Intelligenz mechatronischer Systeme
type: book
user_id: '55222'
volume: Steigerung der Verlässlichkeit technischer Systeme
year: '2018'
...
---
_id: '9997'
abstract:
- lang: eng
  text: Ultrasonic wire bonding is used to connect the electrical terminals of semiconductor
    modules in power electronics. Mul- tiple inﬂuencing factors in wedge/wedge bonding
    are known and extensively investigated. A constructively settable but rarely examined
    parameter is the bonding frequency. In case of bonding on challenging substrates,
    e.g. supple substruc- tures, a high inﬂuence of the working frequency is observed.
    The choice of the working frequency is typically based on experimental investigations
    for a certain component or substrate and needs to be evaluated anew for new applications.
    A profound understanding of the inﬂuence of the working frequency is required
    to achieve a reliable bond process and a short process development. Here a generalized
    model for the numerical simulation of the bond formation with respect to the dynamics
    of the substructure is presented. The simulation results are compared to experiments
    using 300 µm copper wire at different working frequencies and geometries of the
    substructure.
author:
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
citation:
  ama: 'Schemmel R, Althoff S, Sextro W, Unger A, Brökelmann M, Hunstig M. Effects
    of different working frequencies on the joint formation in copper wire bonding.
    In: <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics
    Systems (CIPS 2018)</i>. Stuttgart, Germany; 2018:230-235.'
  apa: Schemmel, R., Althoff, S., Sextro, W., Unger, A., Brökelmann, M., &#38; Hunstig,
    M. (2018). Effects of different working frequencies on the joint formation in
    copper wire bonding. In <i>CIPS 2018 - 10th International Conference on Integrated
    Power Electronics Systems (CIPS 2018)</i> (pp. 230–235). Stuttgart, Germany.
  bibtex: '@inproceedings{Schemmel_Althoff_Sextro_Unger_Brökelmann_Hunstig_2018, place={Stuttgart,
    Germany}, title={Effects of different working frequencies on the joint formation
    in copper wire bonding}, booktitle={CIPS 2018 - 10th International Conference
    on Integrated Power Electronics Systems (CIPS 2018)}, author={Schemmel, Reinhard
    and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael
    and Hunstig, Matthias}, year={2018}, pages={230–235} }'
  chicago: Schemmel, Reinhard, Simon Althoff, Walter Sextro, Andreas Unger, Michael
    Brökelmann, and Matthias Hunstig. “Effects of Different Working Frequencies on
    the Joint Formation in Copper Wire Bonding.” In <i>CIPS 2018 - 10th International
    Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 230–35. Stuttgart,
    Germany, 2018.
  ieee: R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig,
    “Effects of different working frequencies on the joint formation in copper wire
    bonding,” in <i>CIPS 2018 - 10th International Conference on Integrated Power
    Electronics Systems (CIPS 2018)</i>, 2018, pp. 230–235.
  mla: Schemmel, Reinhard, et al. “Effects of Different Working Frequencies on the
    Joint Formation in Copper Wire Bonding.” <i>CIPS 2018 - 10th International Conference
    on Integrated Power Electronics Systems (CIPS 2018)</i>, 2018, pp. 230–35.
  short: 'R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig,
    in: CIPS 2018 - 10th International Conference on Integrated Power Electronics
    Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.'
date_created: 2019-05-27T10:24:37Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
language:
- iso: eng
page: 230-235
place: Stuttgart, Germany
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: CIPS 2018 - 10th International Conference on Integrated Power Electronics
  Systems (CIPS 2018)
quality_controlled: '1'
status: public
title: Effects of different working frequencies on the joint formation in copper wire
  bonding
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9998'
abstract:
- lang: eng
  text: Ultrasonic wedge/wedge-wire bonding is used to connect electrical terminals
    of semiconductor modules in power electronics. The wire is clamped with a tool
    by a normal force and ultrasonic vibration is transmitted through the wire into
    the interface between wire and substrate. Due to frictional processes contaminations
    like oxide layers are removed from the contact zone and the surface roughness
    is reduced, thus the real contact area is increased. In the next step of bond
    formation, thermomechanical forces create micro-junctions between the wire and
    substrate and the bond strength increases. The bond parameters like the bond normal
    force, the ultrasonic vibration amplitude and the geometry of the clamping tool
    show a high influence on the strength and reliability of the wire bond and need
    to be investigated in detail. Therefore, in this contribution the dynamical behaviour
    of the ultrasonic system, the wire and the substrate are modeled in form of substructures,
    which are connected by the friction contacts between tool and wire and between
    wire and substrate. Approaches for modelling the time variant contact behaviour,
    the substrate dynamics, and the model order reduction for a time efficient simulation
    are described to simulate the full bonding process.
author:
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Schemmel R, Hemsel T, Sextro W. Numerical and experimental investigations
    in ultrasonic heavy wire bonding. In: <i>6th European Conference on Computational
    Mechanics (ECCM 6)</i>. Glasgow, UK; 2018:1-12.'
  apa: Schemmel, R., Hemsel, T., &#38; Sextro, W. (2018). Numerical and experimental
    investigations in ultrasonic heavy wire bonding. In <i>6th European Conference
    on Computational Mechanics (ECCM 6)</i> (pp. 1–12). Glasgow, UK.
  bibtex: '@inproceedings{Schemmel_Hemsel_Sextro_2018, place={Glasgow, UK}, title={Numerical
    and experimental investigations in ultrasonic heavy wire bonding}, booktitle={6th
    European Conference on Computational Mechanics (ECCM 6)}, author={Schemmel, Reinhard
    and Hemsel, Tobias and Sextro, Walter}, year={2018}, pages={1–12} }'
  chicago: Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “Numerical and Experimental
    Investigations in Ultrasonic Heavy Wire Bonding.” In <i>6th European Conference
    on Computational Mechanics (ECCM 6)</i>, 1–12. Glasgow, UK, 2018.
  ieee: R. Schemmel, T. Hemsel, and W. Sextro, “Numerical and experimental investigations
    in ultrasonic heavy wire bonding,” in <i>6th European Conference on Computational
    Mechanics (ECCM 6)</i>, 2018, pp. 1–12.
  mla: Schemmel, Reinhard, et al. “Numerical and Experimental Investigations in Ultrasonic
    Heavy Wire Bonding.” <i>6th European Conference on Computational Mechanics (ECCM
    6)</i>, 2018, pp. 1–12.
  short: 'R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational
    Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.'
date_created: 2019-05-27T10:24:38Z
date_updated: 2019-09-23T08:48:04Z
department:
- _id: '151'
language:
- iso: eng
page: 1-12
place: Glasgow, UK
publication: 6th European Conference on Computational Mechanics (ECCM 6)
status: public
title: Numerical and experimental investigations in ultrasonic heavy wire bonding
type: conference
user_id: '55222'
year: '2018'
...
---
_id: '9999'
abstract:
- lang: eng
  text: Ultrasonic wire bonding is an indispensable process in the industrial manufacturing
    of semiconductor devices. Copper wire is increasingly replacing the well-established
    aluminium wire because of its superior electrical, thermal and mechanical properties.
    Copper wire processes differ significantly from aluminium processes and are more
    sensitive to disturbances, which reduces the range of parameter values suitable
    for a stable process. Disturbances can be compensated by an adaption of process
    parameters, but finding suitable parameters manually is difficult and time-consuming.
    This paper presents a physical model of the ultrasonic wire bonding process including
    the friction contact between tool and wire. This model yields novel insights into
    the process. A prototype of a multi-objective optimizing bonding machine (MOBM)
    is presented. It uses multi-objective optimization, based on the complete process
    model, to automatically select the best operating point as a compromise of concurrent
    objectives.
author:
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
- first_name: Tobias
  full_name: Meyer, Tobias
  last_name: Meyer
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production
    of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and
    Challenges. In: <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
    Pasadena, CA, 2018</i>. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:<a
    href="https://doi.org/10.4071/2380-4505-2018.1.000572">10.4071/2380-4505-2018.1.000572</a>'
  apa: Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., &#38; Sextro, W. (2018).
    Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
    Opportunities and Challenges. In <i>In Proceedings of IMAPS 2018 – 51st Symposium
    on Microelectronics, Pasadena, CA, 2018</i> (Vol. Vol. 2018, No. 1, pp. 000572-000577.).
    <a href="https://doi.org/10.4071/2380-4505-2018.1.000572">https://doi.org/10.4071/2380-4505-2018.1.000572</a>
  bibtex: '@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent
    Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
    and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={<a href="https://doi.org/10.4071/2380-4505-2018.1.000572">10.4071/2380-4505-2018.1.000572</a>},
    booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
    Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias
    and Brökelmann, Michael and Sextro, Walter}, year={2018} }'
  chicago: Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and
    Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization
    – Insights, Opportunities and Challenges.” In <i>In Proceedings of IMAPS 2018
    – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, Vol. Vol. 2018,
    No. 1, pp. 000572-000577., 2018. <a href="https://doi.org/10.4071/2380-4505-2018.1.000572">https://doi.org/10.4071/2380-4505-2018.1.000572</a>.
  ieee: A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent
    Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
    and Challenges,” in <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
    Pasadena, CA, 2018</i>, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
  mla: Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective
    Optimization – Insights, Opportunities and Challenges.” <i>In Proceedings of IMAPS
    2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, vol. Vol. 2018,
    No. 1, pp. 000572-000577., 2018, doi:<a href="https://doi.org/10.4071/2380-4505-2018.1.000572">10.4071/2380-4505-2018.1.000572</a>.
  short: 'A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings
    of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.'
date_created: 2019-05-27T10:27:45Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
doi: 10.4071/2380-4505-2018.1.000572
keyword:
- wire bonding
- multi-objective optimization
- process model
- copper wire
- self-optimization
language:
- iso: eng
project:
- _id: '92'
  grant_number: 02 PQ2210
  name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena,
  CA, 2018
quality_controlled: '1'
status: public
title: Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
  Opportunities and Challenges
type: conference
user_id: '210'
volume: Vol. 2018, No. 1, pp. 000572-000577.
year: '2018'
...
