---
_id: '13461'
abstract:
- lang: eng
text: As the emerging digitalization of technical systems offers immense opportunities
to be exploited by means of bigdata analysis, ubiquitous computing and largely
networked systems, the digital twin comes into focus to combineall these aspects
to an attendant model of an individual system during design phase as well as during
operation.Since state-of-art technical systems are growing increasingly complex
due to inherent intelligence and increasingfunctionality, i. e. autonomous behavior
so far, it becomes considerably challenging to ensure reliability for thosesystems.
Many methods were developed to support a reliability focused design or reliability-by-design
approachesto tackle this challenge during design process. In field, data-based
methods, i. e. condition monitoring enabled bythe rise of machine learning approaches,
are exploited to ensure a reliable operation based on the current conditionof
the monitored system. In order to take advantage of existing models of system
reliability during design phaseand condition monitoring systems during operation,
a method is proposed to combine both approaches in order toset up a digital twin
with focus on system reliability. The base model of the digital twin is taken
from the systemreliability model from the design phase and is used during operation
and therein updated to the current reliabilitybased on the state estimation of
the condition monitoring system. The approach is illustrated with a case study
of arolling bearing test rig.
author:
- first_name: Thorben
full_name: Kaul, Thorben
id: '14802'
last_name: Kaul
- first_name: Amelie
full_name: Bender, Amelie
id: '54290'
last_name: Bender
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Kaul T, Bender A, Sextro W. Digital Twin for Reliability Analysis During Design
and Operation of Mechatronic Systems. In: Beer M, Zio E, eds. Proceedings of
the 29th European Safety and Reliability Conference (ESREL2019). ; 2019:2340-2347.'
apa: Kaul, T., Bender, A., & Sextro, W. (2019). Digital Twin for Reliability
Analysis During Design and Operation of Mechatronic Systems. In M. Beer &
E. Zio (Eds.), Proceedings of the 29th European Safety and Reliability Conference
(ESREL2019) (Issue 29, pp. 2340–2347).
bibtex: '@inproceedings{Kaul_Bender_Sextro_2019, title={Digital Twin for Reliability
Analysis During Design and Operation of Mechatronic Systems}, number={29}, booktitle={Proceedings
of the 29th European Safety and Reliability Conference (ESREL2019)}, author={Kaul,
Thorben and Bender, Amelie and Sextro, Walter}, editor={Beer, Michael and Zio,
Enrico}, year={2019}, pages={2340–2347} }'
chicago: Kaul, Thorben, Amelie Bender, and Walter Sextro. “Digital Twin for Reliability
Analysis During Design and Operation of Mechatronic Systems.” In Proceedings
of the 29th European Safety and Reliability Conference (ESREL2019), edited
by Michael Beer and Enrico Zio, 2340–47, 2019.
ieee: T. Kaul, A. Bender, and W. Sextro, “Digital Twin for Reliability Analysis
During Design and Operation of Mechatronic Systems,” in Proceedings of the
29th European Safety and Reliability Conference (ESREL2019), Hannover, 2019,
no. 29, pp. 2340–2347.
mla: Kaul, Thorben, et al. “Digital Twin for Reliability Analysis During Design
and Operation of Mechatronic Systems.” Proceedings of the 29th European Safety
and Reliability Conference (ESREL2019), edited by Michael Beer and Enrico
Zio, no. 29, 2019, pp. 2340–47.
short: 'T. Kaul, A. Bender, W. Sextro, in: M. Beer, E. Zio (Eds.), Proceedings of
the 29th European Safety and Reliability Conference (ESREL2019), 2019, pp. 2340–2347.'
conference:
end_date: 2019.09.26
location: Hannover
name: Proceedings of the European Safety and Reliability Conference (ESREL2019)
start_date: 2019.09.22
date_created: 2019-09-30T09:16:16Z
date_updated: 2023-09-28T08:49:27Z
department:
- _id: '151'
editor:
- first_name: Michael
full_name: Beer, Michael
last_name: Beer
- first_name: Enrico
full_name: Zio, Enrico
last_name: Zio
issue: '29'
language:
- iso: eng
main_file_link:
- open_access: '1'
url: http://rpsonline.com.sg/proceedings/9789811127243/pdf/0876.pdf
oa: '1'
page: 2340-2347
publication: Proceedings of the 29th European Safety and Reliability Conference (ESREL2019)
publication_identifier:
isbn:
- ' 978-981-11-2724-3'
publication_status: published
quality_controlled: '1'
status: public
title: Digital Twin for Reliability Analysis During Design and Operation of Mechatronic
Systems
type: conference
user_id: '210'
year: '2019'
...
---
_id: '9987'
abstract:
- lang: eng
text: Rubber-metal-elements are used in a wide range of applications for vibration
and sound isola- tion. Nowadays it is state of the art to calculate the lifetimes
of these elements under mechanical stress prior to their service life. To establish
more reliable and safer rubber-metal-elements, continuous monitoring by dif- ferent
sensors can be used. Especially prognostics enable a rise in reliability, availability
and safety. To estab- lish these advantages, estimating the remaining useful lifetime
of rubber-metal-elements should be realized during its service life based on current
information on its condition. Therefore a suitable measure to monitor the condition
of the element is necessary. This work focuses on temperature signals. This approach
allows in- cluding the ambient temperature and thereby involving changing operating
conditions. For estimating the RUL of rubber-metal-elements a model-based prognostics
approach based on particle filtering is proposed. Its performance is analyzed
regarding relevant parameters to enable the best performance for the applied data.
author:
- first_name: Amelie
full_name: Bender, Amelie
id: '54290'
last_name: Bender
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Bender A, Sextro W. A particle filtering approach for temperature based prognostics.
In: Safety and Reliability – Safe Societies in a Changing World. Trondheim,
Norway; 2018:1025-1033.'
apa: Bender, A., & Sextro, W. (2018). A particle filtering approach for temperature
based prognostics. In Safety and Reliability – Safe Societies in a Changing
World (pp. 1025–1033). Trondheim, Norway.
bibtex: '@inproceedings{Bender_Sextro_2018, place={Trondheim, Norway}, title={A
particle filtering approach for temperature based prognostics}, booktitle={Safety
and Reliability – Safe Societies in a Changing World}, author={Bender, Amelie
and Sextro, Walter}, year={2018}, pages={1025–1033} }'
chicago: Bender, Amelie, and Walter Sextro. “A Particle Filtering Approach for Temperature
Based Prognostics.” In Safety and Reliability – Safe Societies in a Changing
World, 1025–33. Trondheim, Norway, 2018.
ieee: A. Bender and W. Sextro, “A particle filtering approach for temperature based
prognostics,” in Safety and Reliability – Safe Societies in a Changing World,
2018, pp. 1025–1033.
mla: Bender, Amelie, and Walter Sextro. “A Particle Filtering Approach for Temperature
Based Prognostics.” Safety and Reliability – Safe Societies in a Changing World,
2018, pp. 1025–33.
short: 'A. Bender, W. Sextro, in: Safety and Reliability – Safe Societies in a Changing
World, Trondheim, Norway, 2018, pp. 1025–1033.'
date_created: 2019-05-27T09:56:44Z
date_updated: 2019-09-30T08:01:18Z
department:
- _id: '151'
language:
- iso: eng
page: 1025-1033
place: Trondheim, Norway
publication: Safety and Reliability – Safe Societies in a Changing World
quality_controlled: '1'
status: public
title: A particle filtering approach for temperature based prognostics
type: conference
user_id: '55222'
year: '2018'
...
---
_id: '9990'
abstract:
- lang: eng
text: The handling of fine powders is an important task in modern production processes.
However, as fine powders strongly tend to adhesion and agglomeration, their processing
with conventional methods is difficult or impossible. Especially when processing
small amounts of highly sensitive fine powders, conventional methods reach their
technical limits. In process steps such as dosing, transport, and especially mixing
of fine powders new methods are required. Apart from the well-known method of
manipulating powder properties by adding chemical additives, this contribution
aims at improving the handling of dry fine powders by using vibrations at different
frequencies. Modules are presented, which enable the continuous dosing, the homogeneous
mixing and the transport of dry fine powders. Finally, these modules are combined
for the production of a homogeneous mixture of two dry fine powders.
author:
- first_name: Paul
full_name: Dunst, Paul
id: '22130'
last_name: Dunst
- first_name: Peter
full_name: Bornmann, Peter
last_name: Bornmann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter.
full_name: Littmann, Walter.
last_name: Littmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Dunst P, Bornmann P, Hemsel T, Littmann W, Sextro W. Vibration Assisted Dosing,
Mixing and Transport of Dry Fine Powders. ACTUATOR 2018; 16th International
Conference on New Actuators. 2018:142-145.
apa: Dunst, P., Bornmann, P., Hemsel, T., Littmann, W., & Sextro, W. (2018).
Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders. ACTUATOR
2018; 16th International Conference on New Actuators, 142–145.
bibtex: '@article{Dunst_Bornmann_Hemsel_Littmann_Sextro_2018, title={Vibration Assisted
Dosing, Mixing and Transport of Dry Fine Powders}, journal={ACTUATOR 2018; 16th
International Conference on New Actuators}, author={Dunst, Paul and Bornmann,
Peter and Hemsel, Tobias and Littmann, Walter. and Sextro, Walter}, year={2018},
pages={142–145} }'
chicago: Dunst, Paul, Peter Bornmann, Tobias Hemsel, Walter. Littmann, and Walter
Sextro. “Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders.”
ACTUATOR 2018; 16th International Conference on New Actuators, 2018, 142–45.
ieee: P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, and W. Sextro, “Vibration Assisted
Dosing, Mixing and Transport of Dry Fine Powders,” ACTUATOR 2018; 16th International
Conference on New Actuators, pp. 142–145, 2018.
mla: Dunst, Paul, et al. “Vibration Assisted Dosing, Mixing and Transport of Dry
Fine Powders.” ACTUATOR 2018; 16th International Conference on New Actuators,
2018, pp. 142–45.
short: P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, W. Sextro, ACTUATOR 2018;
16th International Conference on New Actuators (2018) 142–145.
date_created: 2019-05-27T10:13:10Z
date_updated: 2019-09-16T09:45:13Z
department:
- _id: '151'
language:
- iso: eng
page: 142-145
publication: ACTUATOR 2018; 16th International Conference on New Actuators
quality_controlled: '1'
status: public
title: Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders
type: journal_article
user_id: '55222'
year: '2018'
...
---
_id: '9991'
abstract:
- lang: eng
text: Abstract:Since fine powders tend strongly to adhesion and agglomeration, their
processing withconventional methods is difficult or impossible. Typically, in order
to enable the handling of finepowders, chemicals are added to increase the flowability
and reduce adhesion. This contributionshows that instead of additives also vibrations
can be used to increase the flowability, to reduceadhesion and cohesion, and thus
to enable or improve processes such as precision dosing, mixing,and transport
of very fine powders. The methods for manipulating powder properties are describedin
detail and prototypes for experimental studies are presented. It is shown that
the handling of finepowders can be improved by using low-frequency, high-frequency
or a combination of low- andhigh-frequency vibration.
author:
- first_name: Paul
full_name: Dunst, Paul
id: '22130'
last_name: Dunst
- first_name: Peter
full_name: Bornmann, Peter
last_name: Bornmann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Dunst P, Bornmann P, Hemsel T, Sextro W. Vibration-Assisted Handling of Dry
Fine Powders. Actuators 2018, 7(2). 2018:1-11. doi:10.3390/act7020018
apa: Dunst, P., Bornmann, P., Hemsel, T., & Sextro, W. (2018). Vibration-Assisted
Handling of Dry Fine Powders. Actuators 2018, 7(2)., 1–11. https://doi.org/10.3390/act7020018
bibtex: '@article{Dunst_Bornmann_Hemsel_Sextro_2018, title={Vibration-Assisted Handling
of Dry Fine Powders}, DOI={10.3390/act7020018},
journal={Actuators 2018, 7(2).}, author={Dunst, Paul and Bornmann, Peter and Hemsel,
Tobias and Sextro, Walter}, year={2018}, pages={1–11} }'
chicago: Dunst, Paul, Peter Bornmann, Tobias Hemsel, and Walter Sextro. “Vibration-Assisted
Handling of Dry Fine Powders.” Actuators 2018, 7(2)., 2018, 1–11. https://doi.org/10.3390/act7020018.
ieee: P. Dunst, P. Bornmann, T. Hemsel, and W. Sextro, “Vibration-Assisted Handling
of Dry Fine Powders,” Actuators 2018, 7(2)., pp. 1–11, 2018.
mla: Dunst, Paul, et al. “Vibration-Assisted Handling of Dry Fine Powders.” Actuators
2018, 7(2)., 2018, pp. 1–11, doi:10.3390/act7020018.
short: P. Dunst, P. Bornmann, T. Hemsel, W. Sextro, Actuators 2018, 7(2). (2018)
1–11.
date_created: 2019-05-27T10:16:16Z
date_updated: 2019-09-16T09:44:54Z
department:
- _id: '151'
doi: 10.3390/act7020018
keyword:
- powder handling
- flowability
- dosing
- transport
- mixing
- dispersion
- piezoelectricactuators
- vibrations
language:
- iso: eng
page: 1-11
publication: Actuators 2018, 7(2).
quality_controlled: '1'
status: public
title: Vibration-Assisted Handling of Dry Fine Powders
type: journal_article
user_id: '55222'
year: '2018'
...
---
_id: '9992'
abstract:
- lang: eng
text: State-of-the-art industrial compact high power electronic packages require
copper-copper interconnections with larger cross sections made by ultrasonic bonding.
In comparison to aluminium-copper, copper-copper interconnections require increased
normal forces and ultrasonic power, which might lead to substrate damage due to
increased mechanical stresses. One option to raise friction energy without increasing
vibration amplitude between wire and substrate or bonding force is the use of
two-dimensional vibration. The first part of this contribution reports on the
development of a novel bonding system that executes two-dimensional vibrations
of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic
bonds only form properly when surfaces are clean, oxide free and activated, the
geometries of tool-tip and pin were optimised using finite element analysis. To
maximize the area of the bonded annulus the distribution of normal pressure was
optimized by varying the convexity of the bottom side of the pin. Second, a statistical
model obtained from an experimental parameter study shows the influence of different
bonding parameters on the bond result. To find bonding parameters with the minimum
number of tests, the experiments have been planned using a D-optimal experimental
design approach.
author:
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation
of weld formation in a novel two-dimensional copper-copper bonding process. In:
(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
Germany). ; 2018:1-6.'
apa: Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig,
M., & Sextro, W. (2018). Numerical and statistical investigation of weld formation
in a novel two-dimensional copper-copper bonding process. In (Proceedings of
7th Electronics System-Integration Technology Conference, Dresden, Germany)
(pp. 1–6).
bibtex: '@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018,
title={Numerical and statistical investigation of weld formation in a novel two-dimensional
copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration
Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald,
Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig,
Matthias and Sextro, Walter}, year={2018}, pages={1–6} }'
chicago: Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael
Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation
of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In
(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
Germany), 1–6, 2018.
ieee: C. Dymel et al., “Numerical and statistical investigation of weld formation
in a novel two-dimensional copper-copper bonding process,” in (Proceedings
of 7th Electronics System-Integration Technology Conference, Dresden, Germany),
2018, pp. 1–6.
mla: Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation
in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of
7th Electronics System-Integration Technology Conference, Dresden, Germany),
2018, pp. 1–6.
short: 'C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig,
W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference,
Dresden, Germany), 2018, pp. 1–6.'
date_created: 2019-05-27T10:18:10Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic wire-bonding
- bond-tool design
- parameter identification
- statistical engineering
language:
- iso: eng
page: 1-6
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 7th Electronics System-Integration Technology Conference,
Dresden, Germany)
quality_controlled: '1'
status: public
title: Numerical and statistical investigation of weld formation in a novel two-dimensional
copper-copper bonding process
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9993'
abstract:
- lang: eng
text: Ultrasonic bonding and welding are common friction based approaches in the
assembly of power electronics. Interconnections with cross-sections of 0.3 mm²
up to 12 mm² made from copper are well suited in high power applications. For
increasing friction energy, which is responsible for bond formation, a two-dimensional
vibration approach is applied to newly developed interconnection pins. Using two-dimensional
vibration for bonding requires identification of suitable bonding parameters.
Even though simulation models of wire bonding processes exist, parameters for
the two-dimensional pin-bonding process cannot be derived accurately yet. Within
this contribution, a methodology and workflow for experimental studies identifying
a suitable bond parameter space are presented. The results of a pre-study are
used to set up an extensive statistical parameter study, which gives insights
about the bond strength change due to bond process parameter variation. By evaluation
of electrical data captured during bonding, errors biasing the resulting shear
forces are identified. All data obtained during the experimental study is used
to build a statistical regression model suitable for predicting shear forces.
The accuracy of the regression model’s predictions is determined and the applicability
to predict process parameters or validate simulation models is assessed. Finally,
the influence of the tool trajectory on the bond formation is determined, comparing
one dimensional, elliptic and circular trajectories.
author:
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: 'Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental
investigations on the impact of bond process parameters in two-dimensional ultrasonic
copper bonding. In: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan
(ICSJ 2018), Kyoto, Japan). ; 2018:41-44.'
apa: Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., & Hunstig,
M. (2018). Experimental investigations on the impact of bond process parameters
in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics
IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
bibtex: '@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental
investigations on the impact of bond process parameters in two-dimensional ultrasonic
copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium
Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard
and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias},
year={2018}, pages={41–44} }'
chicago: Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael
Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of
Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings
of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44,
2018.
ieee: C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig,
“Experimental investigations on the impact of bond process parameters in two-dimensional
ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium
Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
mla: Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process
Parameters in Two-Dimensional Ultrasonic Copper Bonding.” (Proceedings of 8th
Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp.
41–44.
short: 'C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig,
in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto,
Japan), 2018, pp. 41–44.'
date_created: 2019-05-27T10:19:18Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic two-dimensional bonding
- electrical interconnection
- process parameters
language:
- iso: eng
page: 41-44
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018),
Kyoto, Japan)
quality_controlled: '1'
status: public
title: Experimental investigations on the impact of bond process parameters in two-dimensional
ultrasonic copper bonding
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9995'
abstract:
- lang: ger
text: Selbstoptimierung bietet die Möglichkeit der autonomen Anpassung des Systemverhaltens
an veränderliche Ziele. Dabei ist vor allem der Aspekt Zuverlässigkeit von maßgeblicher
Bedeutung, da über einen an die aktuelle Systemzuverlässigkeit angepassten Betriebspunkt
die Leistungsfähigkeit verbessert wird, während das Ausfallverhalten besser vorhersehbar
wird. Zur Anpassung des Systemverhaltens an die aktuelle Zuverlässigkeit mittels
Selbstoptimierung müssen die ersten beiden Schritte des Selbstoptimierungsprozesses
unterstützt werden. Für die Analyse der Ist-Situation ist eine Erkennung des aktuellen
Degradationszustands mittels Condition Monitoring notwendig. Zur Auswahl geeigneter
Verfahren werden bestehende Ansätze hinsichtlich ihrer Eignung klassifiziert.
Der zweite Schritt, die Bestimmung der Systemziele, wird durch eine strukturierte
Methode zum Finden verlässlichkeitsrelevanter Zielfunktionen ergänzt. Dabei werden
kritische Komponenten identifiziert, Optimierungsparameter festgelegt und die
Verlässlichkeit in Abhängigkeit des Systemverhaltens quantifiziert. Entwickler
selbstoptimierender Systeme werden somit durch geeignete Mittel bei der Implementierung
beider Schritte unterstützt. Abschließend wird der praktische Einsatz der vorgestellten
Methoden anhand zweier Beispiele gezeigt.
author:
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Thorben
full_name: Kaul, Thorben
id: '14802'
last_name: Kaul
- first_name: James Kuria
full_name: Kimotho, James Kuria
last_name: Kimotho
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Meyer T, Kaul T, Kimotho JK, Sextro W. Steigerung Der Intelligenz Mechatronischer
Systeme. Vol Steigerung der Verlässlichkeit technischer Systeme. Springer
Nature Switzerland AG. Part of Springer Nature.; 2018:193-213.
apa: Meyer, T., Kaul, T., Kimotho, J. K., & Sextro, W. (2018). Steigerung
der Intelligenz mechatronischer Systeme (Vol. Steigerung der Verlässlichkeit
technischer Systeme, pp. 193–213). Springer Nature Switzerland AG. Part of Springer
Nature.
bibtex: '@book{Meyer_Kaul_Kimotho_Sextro_2018, title={Steigerung der Intelligenz
mechatronischer Systeme}, volume={Steigerung der Verlässlichkeit technischer Systeme},
publisher={Springer Nature Switzerland AG. Part of Springer Nature.}, author={Meyer,
Tobias and Kaul, Thorben and Kimotho, James Kuria and Sextro, Walter}, year={2018},
pages={193–213} }'
chicago: Meyer, Tobias, Thorben Kaul, James Kuria Kimotho, and Walter Sextro. Steigerung
Der Intelligenz Mechatronischer Systeme. Vol. Steigerung der Verlässlichkeit
technischer Systeme. Springer Nature Switzerland AG. Part of Springer Nature.,
2018.
ieee: T. Meyer, T. Kaul, J. K. Kimotho, and W. Sextro, Steigerung der Intelligenz
mechatronischer Systeme, vol. Steigerung der Verlässlichkeit technischer Systeme.
Springer Nature Switzerland AG. Part of Springer Nature., 2018, pp. 193–213.
mla: Meyer, Tobias, et al. Steigerung Der Intelligenz Mechatronischer Systeme.
Vol. Steigerung der Verlässlichkeit technischer Systeme, Springer Nature Switzerland
AG. Part of Springer Nature., 2018, pp. 193–213.
short: T. Meyer, T. Kaul, J.K. Kimotho, W. Sextro, Steigerung Der Intelligenz Mechatronischer
Systeme, Springer Nature Switzerland AG. Part of Springer Nature., 2018.
date_created: 2019-05-27T10:22:20Z
date_updated: 2019-05-27T10:23:51Z
department:
- _id: '151'
language:
- iso: eng
page: 193-213
publisher: Springer Nature Switzerland AG. Part of Springer Nature.
status: public
title: Steigerung der Intelligenz mechatronischer Systeme
type: book
user_id: '55222'
volume: Steigerung der Verlässlichkeit technischer Systeme
year: '2018'
...
---
_id: '9997'
abstract:
- lang: eng
text: Ultrasonic wire bonding is used to connect the electrical terminals of semiconductor
modules in power electronics. Mul- tiple influencing factors in wedge/wedge bonding
are known and extensively investigated. A constructively settable but rarely examined
parameter is the bonding frequency. In case of bonding on challenging substrates,
e.g. supple substruc- tures, a high influence of the working frequency is observed.
The choice of the working frequency is typically based on experimental investigations
for a certain component or substrate and needs to be evaluated anew for new applications.
A profound understanding of the influence of the working frequency is required
to achieve a reliable bond process and a short process development. Here a generalized
model for the numerical simulation of the bond formation with respect to the dynamics
of the substructure is presented. The simulation results are compared to experiments
using 300 µm copper wire at different working frequencies and geometries of the
substructure.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: 'Schemmel R, Althoff S, Sextro W, Unger A, Brökelmann M, Hunstig M. Effects
of different working frequencies on the joint formation in copper wire bonding.
In: CIPS 2018 - 10th International Conference on Integrated Power Electronics
Systems (CIPS 2018). Stuttgart, Germany; 2018:230-235.'
apa: Schemmel, R., Althoff, S., Sextro, W., Unger, A., Brökelmann, M., & Hunstig,
M. (2018). Effects of different working frequencies on the joint formation in
copper wire bonding. In CIPS 2018 - 10th International Conference on Integrated
Power Electronics Systems (CIPS 2018) (pp. 230–235). Stuttgart, Germany.
bibtex: '@inproceedings{Schemmel_Althoff_Sextro_Unger_Brökelmann_Hunstig_2018, place={Stuttgart,
Germany}, title={Effects of different working frequencies on the joint formation
in copper wire bonding}, booktitle={CIPS 2018 - 10th International Conference
on Integrated Power Electronics Systems (CIPS 2018)}, author={Schemmel, Reinhard
and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael
and Hunstig, Matthias}, year={2018}, pages={230–235} }'
chicago: Schemmel, Reinhard, Simon Althoff, Walter Sextro, Andreas Unger, Michael
Brökelmann, and Matthias Hunstig. “Effects of Different Working Frequencies on
the Joint Formation in Copper Wire Bonding.” In CIPS 2018 - 10th International
Conference on Integrated Power Electronics Systems (CIPS 2018), 230–35. Stuttgart,
Germany, 2018.
ieee: R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig,
“Effects of different working frequencies on the joint formation in copper wire
bonding,” in CIPS 2018 - 10th International Conference on Integrated Power
Electronics Systems (CIPS 2018), 2018, pp. 230–235.
mla: Schemmel, Reinhard, et al. “Effects of Different Working Frequencies on the
Joint Formation in Copper Wire Bonding.” CIPS 2018 - 10th International Conference
on Integrated Power Electronics Systems (CIPS 2018), 2018, pp. 230–35.
short: 'R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig,
in: CIPS 2018 - 10th International Conference on Integrated Power Electronics
Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.'
date_created: 2019-05-27T10:24:37Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
language:
- iso: eng
page: 230-235
place: Stuttgart, Germany
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: CIPS 2018 - 10th International Conference on Integrated Power Electronics
Systems (CIPS 2018)
quality_controlled: '1'
status: public
title: Effects of different working frequencies on the joint formation in copper wire
bonding
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9998'
abstract:
- lang: eng
text: Ultrasonic wedge/wedge-wire bonding is used to connect electrical terminals
of semiconductor modules in power electronics. The wire is clamped with a tool
by a normal force and ultrasonic vibration is transmitted through the wire into
the interface between wire and substrate. Due to frictional processes contaminations
like oxide layers are removed from the contact zone and the surface roughness
is reduced, thus the real contact area is increased. In the next step of bond
formation, thermomechanical forces create micro-junctions between the wire and
substrate and the bond strength increases. The bond parameters like the bond normal
force, the ultrasonic vibration amplitude and the geometry of the clamping tool
show a high influence on the strength and reliability of the wire bond and need
to be investigated in detail. Therefore, in this contribution the dynamical behaviour
of the ultrasonic system, the wire and the substrate are modeled in form of substructures,
which are connected by the friction contacts between tool and wire and between
wire and substrate. Approaches for modelling the time variant contact behaviour,
the substrate dynamics, and the model order reduction for a time efficient simulation
are described to simulate the full bonding process.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Hemsel T, Sextro W. Numerical and experimental investigations
in ultrasonic heavy wire bonding. In: 6th European Conference on Computational
Mechanics (ECCM 6). Glasgow, UK; 2018:1-12.'
apa: Schemmel, R., Hemsel, T., & Sextro, W. (2018). Numerical and experimental
investigations in ultrasonic heavy wire bonding. In 6th European Conference
on Computational Mechanics (ECCM 6) (pp. 1–12). Glasgow, UK.
bibtex: '@inproceedings{Schemmel_Hemsel_Sextro_2018, place={Glasgow, UK}, title={Numerical
and experimental investigations in ultrasonic heavy wire bonding}, booktitle={6th
European Conference on Computational Mechanics (ECCM 6)}, author={Schemmel, Reinhard
and Hemsel, Tobias and Sextro, Walter}, year={2018}, pages={1–12} }'
chicago: Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “Numerical and Experimental
Investigations in Ultrasonic Heavy Wire Bonding.” In 6th European Conference
on Computational Mechanics (ECCM 6), 1–12. Glasgow, UK, 2018.
ieee: R. Schemmel, T. Hemsel, and W. Sextro, “Numerical and experimental investigations
in ultrasonic heavy wire bonding,” in 6th European Conference on Computational
Mechanics (ECCM 6), 2018, pp. 1–12.
mla: Schemmel, Reinhard, et al. “Numerical and Experimental Investigations in Ultrasonic
Heavy Wire Bonding.” 6th European Conference on Computational Mechanics (ECCM
6), 2018, pp. 1–12.
short: 'R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational
Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.'
date_created: 2019-05-27T10:24:38Z
date_updated: 2019-09-23T08:48:04Z
department:
- _id: '151'
language:
- iso: eng
page: 1-12
place: Glasgow, UK
publication: 6th European Conference on Computational Mechanics (ECCM 6)
status: public
title: Numerical and experimental investigations in ultrasonic heavy wire bonding
type: conference
user_id: '55222'
year: '2018'
...
---
_id: '9999'
abstract:
- lang: eng
text: Ultrasonic wire bonding is an indispensable process in the industrial manufacturing
of semiconductor devices. Copper wire is increasingly replacing the well-established
aluminium wire because of its superior electrical, thermal and mechanical properties.
Copper wire processes differ significantly from aluminium processes and are more
sensitive to disturbances, which reduces the range of parameter values suitable
for a stable process. Disturbances can be compensated by an adaption of process
parameters, but finding suitable parameters manually is difficult and time-consuming.
This paper presents a physical model of the ultrasonic wire bonding process including
the friction contact between tool and wire. This model yields novel insights into
the process. A prototype of a multi-objective optimizing bonding machine (MOBM)
is presented. It uses multi-objective optimization, based on the complete process
model, to automatically select the best operating point as a compromise of concurrent
objectives.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production
of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and
Challenges. In: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:10.4071/2380-4505-2018.1.000572'
apa: Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., & Sextro, W. (2018).
Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges. In In Proceedings of IMAPS 2018 – 51st Symposium
on Microelectronics, Pasadena, CA, 2018 (Vol. Vol. 2018, No. 1, pp. 000572-000577.).
https://doi.org/10.4071/2380-4505-2018.1.000572
bibtex: '@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={10.4071/2380-4505-2018.1.000572},
booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias
and Brökelmann, Michael and Sextro, Walter}, year={2018} }'
chicago: Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and
Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization
– Insights, Opportunities and Challenges.” In In Proceedings of IMAPS 2018
– 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018. https://doi.org/10.4071/2380-4505-2018.1.000572.
ieee: A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
mla: Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective
Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS
2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.
short: 'A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings
of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.'
date_created: 2019-05-27T10:27:45Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
doi: 10.4071/2380-4505-2018.1.000572
keyword:
- wire bonding
- multi-objective optimization
- process model
- copper wire
- self-optimization
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena,
CA, 2018
quality_controlled: '1'
status: public
title: Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges
type: conference
user_id: '210'
volume: Vol. 2018, No. 1, pp. 000572-000577.
year: '2018'
...
---
_id: '23560'
author:
- first_name: Julian
full_name: Hentze, Julian
id: '13342'
last_name: Hentze
- first_name: Thorben
full_name: Kaul, Thorben
id: '14802'
last_name: Kaul
- first_name: Iris
full_name: Gräßler, Iris
id: '47565'
last_name: Gräßler
orcid: 0000-0001-5765-971X
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Hentze J, Kaul T, Gräßler I, Sextro W. Integrated modeling of behavior and
reliability in system development. In: Maier A, Skec S, McKesson C, Van der Loos
M, eds. ICED17, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN, Nr. DS
87-USB. Design Society; 2017:385-394.'
apa: 'Hentze, J., Kaul, T., Gräßler, I., & Sextro, W. (2017). Integrated modeling
of behavior and reliability in system development. In A. Maier, S. Skec, C. McKesson,
& M. Van der Loos (Eds.), ICED17, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING
DESIGN, Nr. DS 87-USB (pp. 385–394). Vancouver, Kanada, 21. - 25. Aug. 2017:
Design Society.'
bibtex: '@inproceedings{Hentze_Kaul_Gräßler_Sextro_2017, title={Integrated modeling
of behavior and reliability in system development}, booktitle={ICED17, 21ST INTERNATIONAL
CONFERENCE ON ENGINEERING DESIGN, Nr. DS 87-USB}, publisher={Design Society},
author={Hentze, Julian and Kaul, Thorben and Gräßler, Iris and Sextro, Walter},
editor={Maier, Anja and Skec, Stanko and McKesson, Chris and Van der Loos, MikeEditors},
year={2017}, pages={385–394} }'
chicago: Hentze, Julian, Thorben Kaul, Iris Gräßler, and Walter Sextro. “Integrated
Modeling of Behavior and Reliability in System Development.” In ICED17, 21ST
INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN, Nr. DS 87-USB, edited by Anja
Maier, Stanko Skec, Chris McKesson, and Mike Van der Loos, 385–94. Design Society,
2017.
ieee: J. Hentze, T. Kaul, I. Gräßler, and W. Sextro, “Integrated modeling of behavior
and reliability in system development,” in ICED17, 21ST INTERNATIONAL CONFERENCE
ON ENGINEERING DESIGN, Nr. DS 87-USB, Vancouver, Kanada, 21. - 25. Aug. 2017,
2017, pp. 385–394.
mla: Hentze, Julian, et al. “Integrated Modeling of Behavior and Reliability in
System Development.” ICED17, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN,
Nr. DS 87-USB, edited by Anja Maier et al., Design Society, 2017, pp. 385–94.
short: 'J. Hentze, T. Kaul, I. Gräßler, W. Sextro, in: A. Maier, S. Skec, C. McKesson,
M. Van der Loos (Eds.), ICED17, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN,
Nr. DS 87-USB, Design Society, 2017, pp. 385–394.'
conference:
end_date: 2017-08-25
location: Vancouver, Kanada, 21. - 25. Aug. 2017
start_date: 2017-08-21
date_created: 2021-08-30T09:10:27Z
date_updated: 2022-01-06T06:55:56Z
department:
- _id: '152'
editor:
- first_name: Anja
full_name: Maier, Anja
last_name: Maier
- first_name: Stanko
full_name: Skec, Stanko
last_name: Skec
- first_name: Chris
full_name: McKesson, Chris
last_name: McKesson
- first_name: Mike
full_name: Van der Loos, Mike
last_name: Van der Loos
language:
- iso: eng
page: 385-394
publication: ICED17, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN, Nr. DS 87-USB
publisher: Design Society
status: public
title: Integrated modeling of behavior and reliability in system development
type: conference
user_id: '21240'
year: '2017'
...
---
_id: '9969'
abstract:
- lang: eng
text: Zuverlässigkeit, Sicherheit und Verfügbarkeit gewinnen bei der Anwendung von
technischen Systemen eine immer größere Bedeutung. Aus diesem Grund hat sich Condition
Monitoring, die Zustandsüberwachung eines technischen Produkts, in verschiedenen
Industriebranchen etabliert. Die sensorbasierte Überwachung eines Produkts während
seiner Betriebsdauer in Kombination mit Condition Monitoring Methoden ermöglichen
die Bestimmung des aktuellen Zustands des Produkts und somit eine Diagnose, ob
das Produkt seine ihm zugeschriebene Funktion zum aktuellen Zeitpunkt erfüllt.
Neben Diagnosen bietet Condition Monitoring auch die Möglichkeit Prognosen aufzustellen,
dabei wird die restliche Nutzungsdauer des Produkts aufbauend auf geeigneten Sensordaten
geschätzt. So kann eine intelligente Wartungsplanung umgesetzt werden, die im
Gegensatz zu klassischen Ansätzen keine festen Wartungsintervalle benötigt und
die Nachteile einer rein reaktiven Wartung kompensiert. Stattdessen ist es möglich
ein Element bis vor das Ende seiner Lebensdauer zu nutzen und erst dann zu warten,
um eine optimale Nutzung zu gewährleisten. Durch eine Bestimmung der verbleibenden
Restlebensdauer während des Betriebs ist eine optimale Wartungsplanung möglich,
wodurch die Verfügbarkeit und die Auslastung der überwachten Produkte signifikant
gesteigert werden kann. In dieser Arbeit soll ein produktspezifisches Condition
Monitoring System für Gummi-Metall-Elemente entwickelt werden. Diese Elemente
werden zur Federung, Geräusch- und/oder Schwingungsisolation in vielen verschiedenen
Anwendungen eingesetzt, wie bspw. in Nutz- und Schienenfahrzeugen oder Windenergieanlagen.
In Industrie und Forschung werden bereits Zustandsüberwachungen von Systemen mit
integrierten Gummi-Metall-Elementen eingesetzt, allerdings noch keine Condition
Monitoring Systeme zur alleinigen Zustandsüberwachung dieser Elemente. Aktuell
ist es üblich die Lebensdauer dieser Elemente aufbauend auf beschleunigten Lebensdauerversuchen
und Erfahrungswerten abzuschätzen. Mit dem Ziel die Lebensdauer des fokussierten
Produkts präziser vorherzusagen und damit eine intelligente Wartungsplanung zu
ermöglichen, wird die Entwicklung eines Condition Monitoring Systems für Gummi-Metall-Elemente
angestrebt und in dieser Arbeit erläutert.
author:
- first_name: Amelie
full_name: Bender, Amelie
id: '54290'
last_name: Bender
- first_name: Thorben
full_name: Kaul, Thorben
id: '14802'
last_name: Kaul
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Bender A, Kaul T, Sextro W. Entwicklung eines Condition Monitoring Systems
für Gummi-Metall-Elemente. In: Verlagsschriftenreihe Des Heinz Nixdorf Instituts
Band 369, Paderborn, 2017. Wissenschaftsforum Intelligente Technische Systeme
(WInTeSys) 2017; 2017:347-358.'
apa: Bender, A., Kaul, T., & Sextro, W. (2017). Entwicklung eines Condition
Monitoring Systems für Gummi-Metall-Elemente. In Verlagsschriftenreihe des
Heinz Nixdorf Instituts Band 369, Paderborn, 2017 (pp. 347–358). Wissenschaftsforum
Intelligente Technische Systeme (WInTeSys) 2017.
bibtex: '@inproceedings{Bender_Kaul_Sextro_2017, place={Wissenschaftsforum Intelligente
Technische Systeme (WInTeSys) 2017}, title={Entwicklung eines Condition Monitoring
Systems für Gummi-Metall-Elemente}, booktitle={Verlagsschriftenreihe des Heinz
Nixdorf Instituts Band 369, Paderborn, 2017}, author={Bender, Amelie and Kaul,
Thorben and Sextro, Walter}, year={2017}, pages={347–358} }'
chicago: Bender, Amelie, Thorben Kaul, and Walter Sextro. “Entwicklung Eines Condition
Monitoring Systems Für Gummi-Metall-Elemente.” In Verlagsschriftenreihe Des
Heinz Nixdorf Instituts Band 369, Paderborn, 2017, 347–58. Wissenschaftsforum
Intelligente Technische Systeme (WInTeSys) 2017, 2017.
ieee: A. Bender, T. Kaul, and W. Sextro, “Entwicklung eines Condition Monitoring
Systems für Gummi-Metall-Elemente,” in Verlagsschriftenreihe des Heinz Nixdorf
Instituts Band 369, Paderborn, 2017, 2017, pp. 347–358.
mla: Bender, Amelie, et al. “Entwicklung Eines Condition Monitoring Systems Für
Gummi-Metall-Elemente.” Verlagsschriftenreihe Des Heinz Nixdorf Instituts Band
369, Paderborn, 2017, 2017, pp. 347–58.
short: 'A. Bender, T. Kaul, W. Sextro, in: Verlagsschriftenreihe Des Heinz Nixdorf
Instituts Band 369, Paderborn, 2017, Wissenschaftsforum Intelligente Technische
Systeme (WInTeSys) 2017, 2017, pp. 347–358.'
date_created: 2019-05-27T09:25:42Z
date_updated: 2019-09-30T08:02:40Z
department:
- _id: '151'
keyword:
- Zustandsüberwachung
- Condition Monitoring
- Prognose
- Gummi-Metall-Elemente
- Restlebensdauerschätzung
language:
- iso: eng
page: 347-358
place: Wissenschaftsforum Intelligente Technische Systeme (WInTeSys) 2017
publication: Verlagsschriftenreihe des Heinz Nixdorf Instituts Band 369, Paderborn,
2017
quality_controlled: '1'
status: public
title: Entwicklung eines Condition Monitoring Systems für Gummi-Metall-Elemente
type: conference
user_id: '55222'
year: '2017'
...
---
_id: '9970'
abstract:
- lang: eng
text: In vielen verschiedenen Industriezweigen hat sich Condition Monitoring aufgrund
seiner finanziellen und sicherheitstechnischen Vorteile bereits etabliert. Um
die Verlässlichkeit und die Auslastung zu steigern, sowie um die Lebenszykluskosten
zu reduzieren, steigt auch im Schienenfahrzeugbereich die Anzahl an eingesetzten
Condition Monitoring Systemen. Studien zu Versagensmodi von Schienenfahrzeugen
haben gezeigt, dass Versagensursachen meistens in den Radprofilen oder im Fahrwerk
liegen [1]. Wird das Fahrwerk heute mittels Condition Monitoring überwacht, werden
hierfür häufig Sensoren an den Wagons angebracht, um bspw. deren Schwingungen
zu kontrollieren [2, 3]. In dieser Arbeit liegt der Fokus auf Gummi-Metall-Elementen
(GM-Elementen) der Jörn GmbH.; als elastische Lager im Drehgestell sind diese
Teil des Fahrwerks eines Schienenfahrzeugs. Mit dem Ziel die Wartungsplanung dieser
Elemente zu optimieren, ist untersucht worden, ob diese Elemente einzeln mittels
Condition Monitoring überwacht werden können. Die hierfür durchgeführten beschleunigten
Lebensdauertests werden im nächsten Abschnitt erläutert. Anschließend werden die
modellbasierten Methoden dargestellt, die aufbauend auf den im Versuch aufgezeichneten
Daten eine Prognose der nutzbaren Restlebensdauer (RUL, remaining useful lifetime)
der GM-Elemente aufstellen. Im letzten Abschnitt folgen eine kurze Zusammenfassung
und ein Ausblick.
author:
- first_name: Amelie
full_name: Bender, Amelie
id: '54290'
last_name: Bender
- first_name: James Kuria
full_name: Kimotho, James Kuria
last_name: Kimotho
- first_name: Sergej
full_name: Kohl, Sergej
last_name: Kohl
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Kai
full_name: Reinke, Kai
last_name: Reinke
citation:
ama: 'Bender A, Kimotho JK, Kohl S, Sextro W, Reinke K. Modellbasierte Prognose
der nutzbaren Restlebensdauer von Gummi-Metall-Elementen. In: 15. Internationale
Schienenfahrzeugtagung. ; 2017:123-125.'
apa: Bender, A., Kimotho, J. K., Kohl, S., Sextro, W., & Reinke, K. (2017).
Modellbasierte Prognose der nutzbaren Restlebensdauer von Gummi-Metall-Elementen.
In 15. Internationale Schienenfahrzeugtagung (pp. 123–125).
bibtex: '@inproceedings{Bender_Kimotho_Kohl_Sextro_Reinke_2017, title={Modellbasierte
Prognose der nutzbaren Restlebensdauer von Gummi-Metall-Elementen}, booktitle={15.
Internationale Schienenfahrzeugtagung}, author={Bender, Amelie and Kimotho, James
Kuria and Kohl, Sergej and Sextro, Walter and Reinke, Kai}, year={2017}, pages={123–125}
}'
chicago: Bender, Amelie, James Kuria Kimotho, Sergej Kohl, Walter Sextro, and Kai
Reinke. “Modellbasierte Prognose Der Nutzbaren Restlebensdauer von Gummi-Metall-Elementen.”
In 15. Internationale Schienenfahrzeugtagung, 123–25, 2017.
ieee: A. Bender, J. K. Kimotho, S. Kohl, W. Sextro, and K. Reinke, “Modellbasierte
Prognose der nutzbaren Restlebensdauer von Gummi-Metall-Elementen,” in 15.
Internationale Schienenfahrzeugtagung, 2017, pp. 123–125.
mla: Bender, Amelie, et al. “Modellbasierte Prognose Der Nutzbaren Restlebensdauer
von Gummi-Metall-Elementen.” 15. Internationale Schienenfahrzeugtagung,
2017, pp. 123–25.
short: 'A. Bender, J.K. Kimotho, S. Kohl, W. Sextro, K. Reinke, in: 15. Internationale
Schienenfahrzeugtagung, 2017, pp. 123–125.'
date_created: 2019-05-27T09:27:19Z
date_updated: 2019-05-27T09:29:18Z
department:
- _id: '151'
language:
- iso: eng
page: 123-125
publication: 15. Internationale Schienenfahrzeugtagung
status: public
title: Modellbasierte Prognose der nutzbaren Restlebensdauer von Gummi-Metall-Elementen
type: conference
user_id: '55222'
year: '2017'
...
---
_id: '9971'
abstract:
- lang: eng
text: 'In der Windenergieindustrie haben die Größen Zuverlässigkeit, Sicherheit
und Verfügbarkeit eine enorme Bedeutung erlangt aufgrund des Trends Windenergieanlagen
zur optimalen Windausnutzung an schwer zugänglichen Positionen aufzustellen, wie
bspw. Offshore. Dies führt zu erschwerten Wartungsbedingungen und damit zu höheren
Kosten. Der Einsatz von Condition Monitoring hat sich in dieser Industrie etabliert,
denn diese Technik ermöglicht eine Zustandsdiagnose des überwachten Systems und
eine Prognose seiner nutzbaren Restlebensdauer (remaining useful life: RUL), jeweils
basierend auf geeigneten Sensordaten. In dieser Arbeit wird ein Konzept für ein
produktspezifisches Condition-Monitoring-System für Gummi-Metall-Elemente (GM-Elemente)
vorgestellt, welches den Schwerpunkt auf die Prognose der RUL dieser Elemente
setzt. In Windenergieanlagen werden zahlreiche GM-Elemente zur Geräusch- und Schwingungsisolation
verwendet. Der Einsatz des hier vorgestellten produktspezifischen Condition-Monitoring-Systems
kann somit einen erheblichen Beitrag zum verlässlichen Betrieb von Windenergieanlagen
liefern, da die Überwachung einzelner Komponenten in die Zustandsüberwachung der
gesamten Anlage integriert und dadurch der Betrieb der Anlage optimiert werden
kann. In dieser Arbeit werden einige Herausforderungen diskutiert, die sich bei
der Entwicklung eines Condition-Monitoring-Systems für GM-Elemente ergeben. So
wird evaluiert, welche Größen sich zur Beschreibung der Alterung eines spezifischen
Elements eignen und wie diese gemessen werden können. Temperaturen werden bereits
in einigen technischen Systemen, wie auch in Windenergieanlagen, aufgezeichnet
und ausgewertet, aber ihr Potential für die Bestimmung der RUL der überwachten
Komponente ist noch nicht ausgeschöpft. Hier wird eine Lösungsmöglichkeit vorgestellt,
die auf Temperatursensoren aufbaut. Als Grundlage für die Entwicklung des Condition-Monitoring-Systems
wurden beschleunigte Lebensdauerversuche der GM-Elemente auf einem Versuchsstand
zur Schwingungsanalyse durchgeführt. In diesen Lebensdauerversuchen wird die mechanische
Alterung eines GM-Elements über einen kraftgeregelten Hydraulikzylinder erzielt.
Dabei wird das Ende der Lebensdauerversuche in einem ersten Schritt über die Wegamplitude
des Zylinders bestimmt. Während dieser Versuche wurden diverse Sensoren eingesetzt.
Die aufgezeichneten Temperaturdaten zeigen, dass sich Temperaturmessungen eignen
die Lebensdauer von GM-Elementen mittels Condition Monitoring Prognosemethoden
zu schätzen.'
author:
- first_name: Amelie
full_name: Bender, Amelie
id: '54290'
last_name: Bender
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Kai
full_name: Reinke, Kai
last_name: Reinke
citation:
ama: 'Bender A, Sextro W, Reinke K. Neuartiges Konzept zur Lebensdauerprognose von
Gummi-Metall-Elementen. In: VDI-Berichte 2301. ; 2017:49-60.'
apa: Bender, A., Sextro, W., & Reinke, K. (2017). Neuartiges Konzept zur Lebensdauerprognose
von Gummi-Metall-Elementen. In VDI-Berichte 2301 (pp. 49–60).
bibtex: '@inproceedings{Bender_Sextro_Reinke_2017, title={Neuartiges Konzept zur
Lebensdauerprognose von Gummi-Metall-Elementen}, booktitle={VDI-Berichte 2301},
author={Bender, Amelie and Sextro, Walter and Reinke, Kai}, year={2017}, pages={49–60}
}'
chicago: Bender, Amelie, Walter Sextro, and Kai Reinke. “Neuartiges Konzept Zur
Lebensdauerprognose von Gummi-Metall-Elementen.” In VDI-Berichte 2301,
49–60, 2017.
ieee: A. Bender, W. Sextro, and K. Reinke, “Neuartiges Konzept zur Lebensdauerprognose
von Gummi-Metall-Elementen,” in VDI-Berichte 2301, 2017, pp. 49–60.
mla: Bender, Amelie, et al. “Neuartiges Konzept Zur Lebensdauerprognose von Gummi-Metall-Elementen.”
VDI-Berichte 2301, 2017, pp. 49–60.
short: 'A. Bender, W. Sextro, K. Reinke, in: VDI-Berichte 2301, 2017, pp. 49–60.'
date_created: 2019-05-27T09:29:37Z
date_updated: 2019-05-27T09:30:41Z
department:
- _id: '151'
language:
- iso: eng
page: 49-60
publication: VDI-Berichte 2301
status: public
title: Neuartiges Konzept zur Lebensdauerprognose von Gummi-Metall-Elementen
type: conference
user_id: '55222'
year: '2017'
...
---
_id: '9972'
abstract:
- lang: eng
text: The transportation of dry fine powders is an emerging technologic task, as
in biotechnology, pharmaceu-tical and coatings industry the particle sizes of
processed powders get smaller and smaller. Fine powdersare primarily defined by
the fact that adhesive and cohesive forces outweigh the weight forces, leadingto
mostly unwanted agglomeration (clumping) and adhesion to surfaces. Thereby it
gets more difficult touse conventional conveyor systems (e.g. pneumatic or vibratory
conveyors) for transport. A rather newmethod for transporting these fine powders
is based on ultrasonic vibrations, which are used to reducefriction between powder
and substrate. Within this contribution an experimental set-up consisting of apipe,
a solenoid actuator for axial vibration and an annular piezoelectric actuator
for the high frequencyradial vibration of the pipe is described. Since amplitudes
of the radial pipe vibration should be as large aspossible to get high effects
of friction reduction, the pipe is excited to vibrate in resonance. To determinethe
optimum excitation frequency and actuator position the vibration modes and resonance
frequenciesof the pipe are calculated and measured. Results are in good accordance.
author:
- first_name: Paul
full_name: Dunst, Paul
id: '22130'
last_name: Dunst
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Dunst P, Hemsel T, Sextro W. Analysis of pipe vibration in an ultrasonic powder
transportationsystem. elsevier. 2017;Sensors and Actuators A 263:733-736.
apa: Dunst, P., Hemsel, T., & Sextro, W. (2017). Analysis of pipe vibration
in an ultrasonic powder transportationsystem. Elsevier, Sensors and
Actuators A 263, 733–736.
bibtex: '@article{Dunst_Hemsel_Sextro_2017, title={Analysis of pipe vibration in
an ultrasonic powder transportationsystem}, volume={Sensors and Actuators A 263},
journal={elsevier}, author={Dunst, Paul and Hemsel, Tobias and Sextro, Walter},
year={2017}, pages={733–736} }'
chicago: 'Dunst, Paul, Tobias Hemsel, and Walter Sextro. “Analysis of Pipe Vibration
in an Ultrasonic Powder Transportationsystem.” Elsevier Sensors and Actuators
A 263 (2017): 733–36.'
ieee: P. Dunst, T. Hemsel, and W. Sextro, “Analysis of pipe vibration in an ultrasonic
powder transportationsystem,” elsevier, vol. Sensors and Actuators A 263,
pp. 733–736, 2017.
mla: Dunst, Paul, et al. “Analysis of Pipe Vibration in an Ultrasonic Powder Transportationsystem.”
Elsevier, vol. Sensors and Actuators A 263, 2017, pp. 733–36.
short: P. Dunst, T. Hemsel, W. Sextro, Elsevier Sensors and Actuators A 263 (2017)
733–736.
date_created: 2019-05-27T09:31:13Z
date_updated: 2019-09-16T10:23:40Z
department:
- _id: '151'
keyword:
- Powder transport Piezoelectrics Ultrasonics Pipe vibration Finite element simulation
Fine powder
language:
- iso: eng
page: 733-736
publication: elsevier
quality_controlled: '1'
status: public
title: Analysis of pipe vibration in an ultrasonic powder transportationsystem
type: journal_article
user_id: '55222'
volume: Sensors and Actuators A 263
year: '2017'
...
---
_id: '9973'
abstract:
- lang: eng
text: In power electronics, copper connector pins are e.g. used to connect control
boards with power modules. The new chip generation based on SiC and GaN technology
increase the power density of semiconductor modules significantly with junction
temperatures reaching 200°C. To enable reliable operation at such high temperature,
the soldering of these connector pins should be substituted by a multi-dimensional
copper-copper bonding technology. A copper pin welded directly on DBC substrate
also simplifies the assembly. With this aim, a proper bond tool and a suitable
connector pin geometry are designed. This paper presents a two-dimensional trajectory
approach for ultrasonic bonding of copper pieces, e.g. connector pins, with the
intention to minimize mechanical stresses exposed to the substrate. This is achieved
using a multi-dimensional vibration system with multiple transducers known from
flip chip bonding. Applying a planar relative motion between the bonding piece
and the substrate increases the induced frictional power compared to one-dimensional
excitation. The core of this work is the development of a new tool design which
enables a reliable and effective transmission of the multidimensional vibration
into the contact area between nail-shaped bonding piece and substrate. For this
purpose, different bonding tool as well as bonding piece designs are discussed.
A proper bonding tool design is selected based on the simulated alternatives.
This tool is examined in bonding experiments and the results are presented. In
addition, different grades of hardness for bonding piece and substrate are examined
as well as different bonding parameters. Optical inspection of the bonded area
shows the emergence of initial micro welds in form of a ring which is growing
in direction of the interface boundaries with increasing bonding duration.
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: Eichwald P, Althoff S, Schemmel R, et al. Multi-dimensional Ultrasonic Copper
Bonding – New Challenges for Tool Design. IMAPSource. 2017;Vol. 2017, No.
1.
apa: Eichwald, P., Althoff, S., Schemmel, R., Sextro, W., Unger, A., Brökelmann,
M., & Hunstig, M. (2017). Multi-dimensional Ultrasonic Copper Bonding – New
Challenges for Tool Design. IMAPSource, Vol. 2017, No. 1.
bibtex: '@article{Eichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017,
title={Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design},
volume={Vol. 2017, No. 1}, journal={IMAPSource}, author={Eichwald, Paul and Althoff,
Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann,
Michael and Hunstig, Matthias}, year={2017} }'
chicago: Eichwald, Paul, Simon Althoff, Reinhard Schemmel, Walter Sextro, Andreas
Unger, Michael Brökelmann, and Matthias Hunstig. “Multi-Dimensional Ultrasonic
Copper Bonding – New Challenges for Tool Design.” IMAPSource Vol. 2017,
No. 1 (2017).
ieee: P. Eichwald et al., “Multi-dimensional Ultrasonic Copper Bonding –
New Challenges for Tool Design,” IMAPSource, vol. Vol. 2017, No. 1, 2017.
mla: Eichwald, Paul, et al. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges
for Tool Design.” IMAPSource, vol. Vol. 2017, No. 1, 2017.
short: P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann,
M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).
date_created: 2019-05-27T09:32:42Z
date_updated: 2020-05-07T05:33:54Z
department:
- _id: '151'
keyword:
- International Symposium on Microelectronics
language:
- iso: eng
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: IMAPSource
quality_controlled: '1'
status: public
title: Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
type: journal_article
user_id: '210'
volume: Vol. 2017, No. 1
year: '2017'
...
---
_id: '9974'
abstract:
- lang: eng
text: The integrated modeling of behavior and reliability in system development
delivers a model-based approach for reliability investigation by taking into account
the dynamic system behavior as well as the system architecture at different phases
of the development process. This approach features an automated synthesis of a
reliability model out of a behavior model enabling for the closed loop modeling
of degradation of the system and its (dynamic) behavior. The approach is integrated
into the development process following Systems Engineering. It is based on standard
models used in model-based development methodologies i.e. SysML or Matlab/Simulink.
In addition to the theoretical description of the necessary steps the procedure
is validated by an application example at two stages of the development process.
author:
- first_name: Julian
full_name: Hentze, Julian
id: '13342'
last_name: Hentze
- first_name: Thorben
full_name: Kaul, Thorben
id: '14802'
last_name: Kaul
- first_name: Iris
full_name: Grässler, Iris
last_name: Grässler
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Hentze J, Kaul T, Grässler I, Sextro W. Integrated modeling og behavior and
reliability in system development. In: ICED17, 21st International Conference
on Enginieering Design. ; 2017:385-394.'
apa: Hentze, J., Kaul, T., Grässler, I., & Sextro, W. (2017). Integrated modeling
og behavior and reliability in system development. In ICED17, 21st International
conference on enginieering design (pp. 385–394).
bibtex: '@inproceedings{Hentze_Kaul_Grässler_Sextro_2017, title={Integrated modeling
og behavior and reliability in system development}, booktitle={ICED17, 21st International
conference on enginieering design}, author={Hentze, Julian and Kaul, Thorben and
Grässler, Iris and Sextro, Walter}, year={2017}, pages={385–394} }'
chicago: Hentze, Julian, Thorben Kaul, Iris Grässler, and Walter Sextro. “Integrated
Modeling Og Behavior and Reliability in System Development.” In ICED17, 21st
International Conference on Enginieering Design, 385–94, 2017.
ieee: J. Hentze, T. Kaul, I. Grässler, and W. Sextro, “Integrated modeling og behavior
and reliability in system development,” in ICED17, 21st International conference
on enginieering design, 2017, pp. 385–394.
mla: Hentze, Julian, et al. “Integrated Modeling Og Behavior and Reliability in
System Development.” ICED17, 21st International Conference on Enginieering
Design, 2017, pp. 385–94.
short: 'J. Hentze, T. Kaul, I. Grässler, W. Sextro, in: ICED17, 21st International
Conference on Enginieering Design, 2017, pp. 385–394.'
date_created: 2019-05-27T09:35:48Z
date_updated: 2019-09-30T08:04:38Z
department:
- _id: '151'
keyword:
- Design for X (DfX)
- Product modelling / models
- Robust design
- Systems Engineering (SE)
- Reliability
language:
- iso: eng
page: 385-394
publication: ICED17, 21st International conference on enginieering design
quality_controlled: '1'
status: public
title: Integrated modeling og behavior and reliability in system development
type: conference
user_id: '55222'
year: '2017'
...
---
_id: '9976'
abstract:
- lang: eng
text: State-of-the-art mechatronic systems offer inherent intelligence that enables
them to autonomously adapt their behavior to current environmental conditions
and to their own system state. This autonomous behavior adaptation is made possible
by software in combination with complex sensor and actuator systems and by sophisticated
information processing, all of which make these systems increasingly complex.
This increasing complexity makes the design process a challenging task and brings
new complex possibilities for operation and maintenance. However, with the risk
of increased system complexity also comes the chance to adapt system behavior
based on current reliability, which in turn increases reliability. The development
of such an adaption strategy requires appropriate methods to evaluate reliability
based on currently selected system behavior. A common approach to implement such
adaptivity is to base system behavior on different working points that are obtained
using multiobjective optimization. During operation, selection among these allows
a changed operating strategy. To allow for multiobjective optimization, an accurate
system model including system reliability is required. This model is repeatedly
evaluated by the optimization algorithm. At present, modeling of system reliability
and synchronization of the models of behavior and reliability is a laborious manual
task and thus very error-prone. Since system behavior is crucial for system reliability,
an integrated model is introduced that integrates system behavior and system reliability.
The proposed approach is used to formulate reliability-related objective functions
for a clutch test rig that are used to compute feasible working points using multiobjective
optimization.
author:
- first_name: Thorben
full_name: Kaul, Thorben
id: '14802'
last_name: Kaul
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Kaul T, Meyer T, Sextro W. Formulation of reliability-related objective functions
for design of intelligent mechatronic systems. SAGE Journals. 2017;Vol.
231(4):390-399. doi:10.1177/1748006X17709376
apa: Kaul, T., Meyer, T., & Sextro, W. (2017). Formulation of reliability-related
objective functions for design of intelligent mechatronic systems. SAGE Journals,
Vol. 231(4), 390–399. https://doi.org/10.1177/1748006X17709376
bibtex: '@article{Kaul_Meyer_Sextro_2017, title={Formulation of reliability-related
objective functions for design of intelligent mechatronic systems}, volume={Vol.
231(4)}, DOI={10.1177/1748006X17709376},
journal={SAGE Journals}, author={Kaul, Thorben and Meyer, Tobias and Sextro, Walter},
year={2017}, pages={390–399} }'
chicago: 'Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Formulation of Reliability-Related
Objective Functions for Design of Intelligent Mechatronic Systems.” SAGE Journals
Vol. 231(4) (2017): 390–99. https://doi.org/10.1177/1748006X17709376.'
ieee: T. Kaul, T. Meyer, and W. Sextro, “Formulation of reliability-related objective
functions for design of intelligent mechatronic systems,” SAGE Journals,
vol. Vol. 231(4), pp. 390–399, 2017.
mla: Kaul, Thorben, et al. “Formulation of Reliability-Related Objective Functions
for Design of Intelligent Mechatronic Systems.” SAGE Journals, vol. Vol.
231(4), 2017, pp. 390–99, doi:10.1177/1748006X17709376.
short: T. Kaul, T. Meyer, W. Sextro, SAGE Journals Vol. 231(4) (2017) 390–399.
date_created: 2019-05-27T09:37:46Z
date_updated: 2019-09-16T10:20:49Z
department:
- _id: '151'
doi: 10.1177/1748006X17709376
keyword:
- Integrated model
- reliability
- system behavior
- Bayesian network
- multiobjective optimization
language:
- iso: eng
page: 390 - 399
publication: SAGE Journals
quality_controlled: '1'
status: public
title: Formulation of reliability-related objective functions for design of intelligent
mechatronic systems
type: journal_article
user_id: '55222'
volume: Vol. 231(4)
year: '2017'
...
---
_id: '9978'
abstract:
- lang: eng
text: Piezoelectric transducers are used in a wide range of applications. Reliability
of these transducers is an important aspect in their application. Prognostics,
which involve continuous monitoring of the health of technical systems and using
this information to estimate the current health state and consequently predict
the remaining useful lifetime (RUL), can be used to increase the reliability,
safety, and availability of the transducers. This is achieved by utilizing the
health state and RUL predictions to adaptively control the usage of the components
or to schedule appropriate maintenance without interrupting operation. In this
work, a prognostic approach utilizing self-sensing, where electric signals of
a piezoelectric transducer are used as the condition monitoring data, is proposed.
The approach involves training machine learning algorithms to model the degradation
of the transducers through a health index and the use of the learned model to
estimate the health index of similar transducers. The current health index is
then used to estimate RUL of test components. The feasibility of the approach
is demonstrated using piezoelectric bimorphs and the results show that the method
is accurate in predicting the health index and RUL.
author:
- first_name: James Kuria
full_name: Kimotho, James Kuria
last_name: Kimotho
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
citation:
ama: 'Kimotho JK, Sextro W, Hemsel T. Estimation of Remaining Useful Lifetime of
Piezoelectric Transducers Based on Self-Sensing. In: IEEE Transactions on Reliability.
; 2017:1-10. doi:10.1109/TR.2017.2710260'
apa: Kimotho, J. K., Sextro, W., & Hemsel, T. (2017). Estimation of Remaining
Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing. In IEEE
Transactions on Reliability (pp. 1–10). https://doi.org/10.1109/TR.2017.2710260
bibtex: '@inproceedings{Kimotho_Sextro_Hemsel_2017, title={Estimation of Remaining
Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing}, DOI={10.1109/TR.2017.2710260},
booktitle={IEEE Transactions on Reliability}, author={Kimotho, James Kuria and
Sextro, Walter and Hemsel, Tobias}, year={2017}, pages={1–10} }'
chicago: Kimotho, James Kuria, Walter Sextro, and Tobias Hemsel. “Estimation of
Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing.”
In IEEE Transactions on Reliability, 1–10, 2017. https://doi.org/10.1109/TR.2017.2710260.
ieee: J. K. Kimotho, W. Sextro, and T. Hemsel, “Estimation of Remaining Useful Lifetime
of Piezoelectric Transducers Based on Self-Sensing,” in IEEE Transactions on
Reliability, 2017, pp. 1–10.
mla: Kimotho, James Kuria, et al. “Estimation of Remaining Useful Lifetime of Piezoelectric
Transducers Based on Self-Sensing.” IEEE Transactions on Reliability, 2017,
pp. 1–10, doi:10.1109/TR.2017.2710260.
short: 'J.K. Kimotho, W. Sextro, T. Hemsel, in: IEEE Transactions on Reliability,
2017, pp. 1–10.'
date_created: 2019-05-27T09:41:06Z
date_updated: 2019-09-16T10:32:05Z
department:
- _id: '151'
doi: 10.1109/TR.2017.2710260
keyword:
- Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing
language:
- iso: eng
page: 1 - 10
publication: IEEE Transactions on Reliability
quality_controlled: '1'
status: public
title: Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based
on Self-Sensing
type: conference
user_id: '55222'
year: '2017'
...
---
_id: '9982'
abstract:
- lang: ger
text: ln der industriellen Fertigung werden zum Transport von Bauteilen häufig Förderketten
genutzt. Obwohl die Förderketten meist nicht direkt mit den Arbeitsmedien in Berührung
kommen, werden sie indirekt durch vagabundierende Stäube und Pulver, die an der
geölten Kette anhaften, im Laufe der Zeit stark verschmutzt. Ein derart im Betrieb
verschmutztes Kettenglied ist in Abbildung 1 dargestellt. Um die Lebensdauer der
Ketten zu erhöhen und das Herunterfallen von Schmutzpartikel auf die Produkte
zu vermeiden, muss die Kette regelmäßig gereinigt werden. Ziel des hier beschriebenen
Forschungsvorhabens ist die Entwicklung eines Systems, das in der Lage ist, ein
einzelnes Kettenglied in unter 60 s mittels Ultraschall zu reinigen. In [1] wurde
in ersten Versuchen nachgewiesen, dass Stabschwinger in Abhängigkeit des Sonotrodenabstands
zum Reinigungsobjekt und der Ultraschallamplitude eine intensive Reinigungswirkung
entfalten. Das Konzept der Reinigungsanlage sieht deshalb vor, im ersten Schritt
die stark verschmutzten Kettenglieder durch ein hochintensives Kavitationsfeld
von direkt eingetauchten Stabschwingern vorzureinigen und anschließend schwer
zugängliche Be- reiche wie Hinterschneidungen oder Bohrungen mittels konventioneller
Tauchschwinger von Verschmutzungen zu befreien. Für den Stabschwinger wird die
sogenannte - Sonotrode untersucht; diese wird unter anderem auch in der Sonochemie
verwendet. Ein wesentliches Merkmal der Sonotrode ist eine hohe Amplitudenübersetzung
bei einer gleichzeitig großen Abstrahlfläche. Neben dem Entwurf mittels der L
/2 -Synthese wird die Reinigungswirkung der Sonotrode in Abhängigkeit der Ultraschallamplitude
und dem Abstand zum Reinigungsobjekt in einer Versuchsreihe untersucht. Zur genaueren
Betrachtung der Reinigungs- mechanismen eines Stabschwingers werden abschließend
Hochgeschwindigkeitsaufnahmen vorgestellt und analysieren.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Hemsel T, Sextro W. MoRFUS: Mobile Reinigungseinheit für Förderketten
basierend auf Ultraschall. In: 43. Deutsche Jahrestagung Für Akustik. Kiel
2017; 2017:611-614.'
apa: 'Schemmel, R., Hemsel, T., & Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit
für Förderketten basierend auf Ultraschall. In 43. Deutsche Jahrestagung für
Akustik (pp. 611–614). Kiel 2017.'
bibtex: '@inproceedings{Schemmel_Hemsel_Sextro_2017, place={Kiel 2017}, title={MoRFUS:
Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}, booktitle={43.
Deutsche Jahrestagung für Akustik}, author={Schemmel, Reinhard and Hemsel, Tobias
and Sextro, Walter}, year={2017}, pages={611–614} }'
chicago: 'Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “MoRFUS: Mobile
Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” In 43. Deutsche
Jahrestagung Für Akustik, 611–14. Kiel 2017, 2017.'
ieee: 'R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit
für Förderketten basierend auf Ultraschall,” in 43. Deutsche Jahrestagung für
Akustik, 2017, pp. 611–614.'
mla: 'Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten
Basierend Auf Ultraschall.” 43. Deutsche Jahrestagung Für Akustik, 2017,
pp. 611–14.'
short: 'R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik,
Kiel 2017, 2017, pp. 611–614.'
date_created: 2019-05-27T09:48:10Z
date_updated: 2019-05-27T09:49:49Z
department:
- _id: '151'
keyword:
- wire bonding
- dynamic behavior
- modeling
language:
- iso: eng
page: 611-614
place: Kiel 2017
publication: 43. Deutsche Jahrestagung für Akustik
status: public
title: 'MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall'
type: conference
user_id: '55222'
year: '2017'
...