---
_id: '9947'
abstract:
- lang: eng
text: This paper presents a comparison of a number of prognostic methods with regard
to algorithm complexity and performance based on prognostic metrics. This information
serves as a guide for selection and design of prognostic systems for real-time
condition monitoring of technical systems. The methods are evaluated on ability
to estimate the remaining useful life of rolling element bearing. Run-to failure
vibration and temperature data is used in the analysis. The sampled prognostic
methods include wear-temperature correlation method, health state estimation using
temperature measurement, a multi-model particle filter approach with model parameter
adaptation utilizing temperature measurements, prognostics through health state
estimation and mapping extracted features to the remaining useful life through
regression approach. Although the performance of the methods utilizing the vibration
measurements is much better than the methods using temperature measurements, the
methods using temperature measurements are quite promising in terms of reducing
the overall cost of the condition monitoring system as well as the computational
time. An ensemble of the presented methods through weighted average is also introduced.
The results show that the methods are able to estimate the remaining useful life
within error bounds of +-15\%, which can be further reduced to +-5\% with the
ensemble approach.
author:
- first_name: James Kuria
full_name: Kimotho, James Kuria
last_name: Kimotho
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Kimotho JK, Sextro W. Comparison and ensemble of temperature-based and vibration-based
methods for machinery prognostics. In: Annual Conference of the Prognostics
and Health Management Society 2015. Vol 6. ; 2015.'
apa: Kimotho, J. K., & Sextro, W. (2015). Comparison and ensemble of temperature-based
and vibration-based methods for machinery prognostics. In Annual Conference
of the Prognostics and Health Management Society 2015 (Vol. 6).
bibtex: '@inproceedings{Kimotho_Sextro_2015, title={Comparison and ensemble of temperature-based
and vibration-based methods for machinery prognostics}, volume={6}, booktitle={Annual
Conference of the Prognostics and Health Management Society 2015}, author={Kimotho,
James Kuria and Sextro, Walter}, year={2015} }'
chicago: Kimotho, James Kuria, and Walter Sextro. “Comparison and Ensemble of Temperature-Based
and Vibration-Based Methods for Machinery Prognostics.” In Annual Conference
of the Prognostics and Health Management Society 2015, Vol. 6, 2015.
ieee: J. K. Kimotho and W. Sextro, “Comparison and ensemble of temperature-based
and vibration-based methods for machinery prognostics,” in Annual Conference
of the Prognostics and Health Management Society 2015, 2015, vol. 6.
mla: Kimotho, James Kuria, and Walter Sextro. “Comparison and Ensemble of Temperature-Based
and Vibration-Based Methods for Machinery Prognostics.” Annual Conference of
the Prognostics and Health Management Society 2015, vol. 6, 2015.
short: 'J.K. Kimotho, W. Sextro, in: Annual Conference of the Prognostics and Health
Management Society 2015, 2015.'
date_created: 2019-05-27T08:24:50Z
date_updated: 2019-05-27T08:25:44Z
department:
- _id: '151'
intvolume: ' 6'
keyword:
- ensemble methods
- combined prognostics
- data fusion
language:
- iso: eng
publication: Annual Conference of the Prognostics and Health Management Society 2015
status: public
title: Comparison and ensemble of temperature-based and vibration-based methods for
machinery prognostics
type: conference
user_id: '55222'
volume: 6
year: '2015'
...
---
_id: '9949'
abstract:
- lang: eng
text: Intelligent mechatronic systems other the possibility to adapt system behavior
to current dependability. This can be used to assure reliability by controlling
system behavior to reach a pre-defined lifetime. By using such closed loop control,
the margin of error of useful lifetime of an individual system is lowered. It
is also possible to change the pre-defined lifetime during operation, by adapting
system behavior to derate component usage. When planning maintenance actions,
the remaining useful lifetime of each individual system has to be taken into account.
Usually, stochastic properties of a fleet of systems are analyzed to create maintenance
plans. Among these, the main factor is the probability of an individual system
to last until maintenance. If condition-based maintenance is used, this is updated
for each individual system using available information about its current state.
By lowering the margin of error of useful lifetime, which directly corresponds
to the time until maintenance, extended maintenance periods are made possible.
Also using reliability-adaptive operation, a reversal of degradation driven maintenance
planning is possible where a maintenance plan is setup not only according to system
properties, but mainly to requirements imposed by maintenance personnel or infrastructure.
Each system then adapts its behavior accordingly and fails according to the maintenance
plan, making better use of maintenance personnel and system capabilities at the
same time. In this contribution, the potential of maintenance plan driven system
behavior adaptation is shown. A model including adaptation process and maintenance
actions is simulated over full system lifetime to assess the advantages gained.
author:
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Thorben
full_name: Kaul, Thorben
id: '14802'
last_name: Kaul
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Meyer T, Kaul T, Sextro W. Advantages of reliability-adaptive system operation
for maintenance planning. In: Proceedings of the 9th IFAC Symposium on Fault
Detection, Supervision and Safety for Technical Processes. ; 2015:940-945.
doi:10.1016/j.ifacol.2015.09.647'
apa: Meyer, T., Kaul, T., & Sextro, W. (2015). Advantages of reliability-adaptive
system operation for maintenance planning. In Proceedings of the 9th IFAC Symposium
on Fault Detection, Supervision and Safety for Technical Processes (pp. 940–945).
https://doi.org/10.1016/j.ifacol.2015.09.647
bibtex: '@inproceedings{Meyer_Kaul_Sextro_2015, title={Advantages of reliability-adaptive
system operation for maintenance planning}, DOI={10.1016/j.ifacol.2015.09.647},
booktitle={Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision
and Safety for Technical Processes}, author={Meyer, Tobias and Kaul, Thorben and
Sextro, Walter}, year={2015}, pages={940–945} }'
chicago: Meyer, Tobias, Thorben Kaul, and Walter Sextro. “Advantages of Reliability-Adaptive
System Operation for Maintenance Planning.” In Proceedings of the 9th IFAC
Symposium on Fault Detection, Supervision and Safety for Technical Processes,
940–45, 2015. https://doi.org/10.1016/j.ifacol.2015.09.647.
ieee: T. Meyer, T. Kaul, and W. Sextro, “Advantages of reliability-adaptive system
operation for maintenance planning,” in Proceedings of the 9th IFAC Symposium
on Fault Detection, Supervision and Safety for Technical Processes, 2015,
pp. 940–945.
mla: Meyer, Tobias, et al. “Advantages of Reliability-Adaptive System Operation
for Maintenance Planning.” Proceedings of the 9th IFAC Symposium on Fault Detection,
Supervision and Safety for Technical Processes, 2015, pp. 940–45, doi:10.1016/j.ifacol.2015.09.647.
short: 'T. Meyer, T. Kaul, W. Sextro, in: Proceedings of the 9th IFAC Symposium
on Fault Detection, Supervision and Safety for Technical Processes, 2015, pp.
940–945.'
date_created: 2019-05-27T08:29:40Z
date_updated: 2019-09-16T10:43:42Z
department:
- _id: '151'
doi: 10.1016/j.ifacol.2015.09.647
keyword:
- Adaptive systems
- Reliability analysis
- Availability
- Adaptive control
- Maintenance
- Self-optimizing systems
- Self-optimizing control
- Stochastic Petri-nets
language:
- iso: eng
page: 940-945
publication: Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision
and Safety for Technical Processes
quality_controlled: '1'
status: public
title: Advantages of reliability-adaptive system operation for maintenance planning
type: conference
user_id: '55222'
year: '2015'
...
---
_id: '9950'
abstract:
- lang: eng
text: Intelligente technische Systeme, die in der Lage sind, sich an geänderte Umgebungsbedingungen
anzupassen, ermöglichen eine Adaption anhand der aktuell erreichten Zuverlässigkeit.
Zu diesem Zwecke kann ein geschlossener Regelkreis formuliert werden, der dazu
geeignet ist, den Betriebspunkt des Systems während der gesamten Lebensdauer anzupassen.
Dadurch wird eine harte Umschaltung während des Betriebs vermieden und die Verhaltensanpassung
ist vom Nutzer weitgehend unbemerkt möglich. Dazu wird die aktuelle Restlebensdauer
mit einer vorgegebenen Restlebensdauer verglichen. Durch Änderung der vorgegebenen
Restlebensdauer lässt sich auch eine Anpassung der gewünschten Nutzungsdauer erreichen,
beispielsweise um veränderte Wartungsintervalle einzuhalten. Zu diesem Zwecke
ist es allerdings notwendig, die aktuell erreichte Zuverlässigkeit zu schätzen.
Für die Regelung ist dabei die aktuelle Restlebensdauer der wichtigste Parameter,
da er als Istwert direkt mit der gewünschten Restlebensdauer als Sollwert verglichen
wird und als Reglereingang dient. Für die Genauigkeit der Regelung ist daher die
Bestimmung der Restlebensdauer von entscheidender Bedeutung. Es wird ein Modell
des Regelkreises vorgestellt, das auch den Einfluss einer fehlerhaften Restlebensdauerschätzung
auf die Verhaltensanpassung abbildet. Dadurch ist es möglich, Grenzen der Verhaltensanpassung
und die zur Einhaltung notwendige Genauigkeit der Restlebensdauerschätzung zu
bestimmen. Es gibt zahlreiche Ansätze, die Restlebensdauer zu schätzen, die aufgeteilt
werden in modellbasierte Verfahren und datengetriebene Verfahren. Die individuelle
Eignung eines jeden Verfahrens sowie die Modellbildung oder die Nutzung geeigneter
Algorithmen ist stark systemabhängig. Um die Auswahl von Verfahren und Modellen
oder Algorithmen zu ermöglichen, werden zunächst die Anforderungen an die Restlebensdauerschätzung
zur Nutzung als Regelungs-Istwert bestimmt. Verschiedene Verfahren werden sodann
hinsichtlich ihrer Eignung evaluiert und Anwendungsgrenzen aufgezeigt.
author:
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: James Kuria
full_name: Kimotho, James Kuria
last_name: Kimotho
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Meyer T, Kimotho JK, Sextro W. Anforderungen an Condition-Monitoring-Verfahren
zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme. In: 27.
Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger
Produkte. Leonberg; 2015:111-122.'
apa: Meyer, T., Kimotho, J. K., & Sextro, W. (2015). Anforderungen an Condition-Monitoring-Verfahren
zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme. In 27.
Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger
Produkte (pp. 111–122). Leonberg.
bibtex: '@inproceedings{Meyer_Kimotho_Sextro_2015, place={Leonberg}, title={Anforderungen
an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb
adaptiver Systeme}, number={2260}, booktitle={27. Tagung Technische Zuverlässigkeit
(TTZ 2015) - Entwicklung und Betrieb zuverlässiger Produkte}, author={Meyer, Tobias
and Kimotho, James Kuria and Sextro, Walter}, year={2015}, pages={111–122} }'
chicago: Meyer, Tobias, James Kuria Kimotho, and Walter Sextro. “Anforderungen an
Condition-Monitoring-Verfahren Zur Nutzung Im Zuverläsigkeitsgeregelten Betrieb
Adaptiver Systeme.” In 27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung
Und Betrieb Zuverlässiger Produkte, 111–22. Leonberg, 2015.
ieee: T. Meyer, J. K. Kimotho, and W. Sextro, “Anforderungen an Condition-Monitoring-Verfahren
zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme,” in 27.
Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger
Produkte, 2015, no. 2260, pp. 111–122.
mla: Meyer, Tobias, et al. “Anforderungen an Condition-Monitoring-Verfahren Zur
Nutzung Im Zuverläsigkeitsgeregelten Betrieb Adaptiver Systeme.” 27. Tagung
Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger
Produkte, no. 2260, 2015, pp. 111–22.
short: 'T. Meyer, J.K. Kimotho, W. Sextro, in: 27. Tagung Technische Zuverlässigkeit
(TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte, Leonberg, 2015, pp.
111–122.'
date_created: 2019-05-27T08:31:38Z
date_updated: 2019-09-30T08:09:22Z
department:
- _id: '151'
issue: '2260'
language:
- iso: eng
page: 111-122
place: Leonberg
publication: 27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb
zuverlässiger Produkte
quality_controlled: '1'
status: public
title: Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten
Betrieb adaptiver Systeme
type: conference
user_id: '55222'
year: '2015'
...
---
_id: '9951'
abstract:
- lang: eng
text: Ultrasonic wire bonding is an indispensable process in the manufacturing of
semiconductor components. It is used for interconnecting the silicon die to e.g.
connectors in the housing or to other semiconductors in complex components. In
high power applications, such as wind turbines, locomotives or electric vehicles,
the thermal and mechanical limits of interconnects made from aluminum are nearing.
The limits could be overcome using copper wire bonds, but their manufacturing
poses challenges due to the harder material, which leads to increased wear of
the bond tools and to less reliable production. To overcome these drawbacks, adaptation
of process parameters at runtime is employed. However, the range of parameter
values for which a stable process can be maintained is very small, making it necessary
to compute suitable parameters beforehand. To this end, and to gain insights into
the process itself, the ultrasonic bonding process is modeled. The full model
is composed of several partial models, some of which were introduced before. This
paper focuses on the modularization of the full model and on the interaction of
partial models. All partial models are presented, their interaction is shown and
the general outline of the simulation process is given.
author:
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Meyer T, Unger A, Althoff S, et al. Modeling and simulation of the ultrasonic
wire bonding process. In: 2015 17th Electronics Packaging Technology Conference.
; 2015. doi:10.1109/EPTC.2015.7412377'
apa: Meyer, T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M.,
& Guth, K. (2015). Modeling and simulation of the ultrasonic wire bonding
process. In 2015 17th Electronics Packaging Technology Conference. https://doi.org/10.1109/EPTC.2015.7412377
bibtex: '@inproceedings{Meyer_Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2015,
title={Modeling and simulation of the ultrasonic wire bonding process}, DOI={10.1109/EPTC.2015.7412377},
booktitle={2015 17th Electronics Packaging Technology Conference}, author={Meyer,
Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann,
Michael and Hunstig, Matthias and Guth, Karsten}, year={2015} }'
chicago: Meyer, Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann,
Matthias Hunstig, and Karsten Guth. “Modeling and Simulation of the Ultrasonic
Wire Bonding Process.” In 2015 17th Electronics Packaging Technology Conference,
2015. https://doi.org/10.1109/EPTC.2015.7412377.
ieee: T. Meyer et al., “Modeling and simulation of the ultrasonic wire bonding
process,” in 2015 17th Electronics Packaging Technology Conference, 2015.
mla: Meyer, Tobias, et al. “Modeling and Simulation of the Ultrasonic Wire Bonding
Process.” 2015 17th Electronics Packaging Technology Conference, 2015,
doi:10.1109/EPTC.2015.7412377.
short: 'T. Meyer, A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K.
Guth, in: 2015 17th Electronics Packaging Technology Conference, 2015.'
date_created: 2019-05-27T08:34:21Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
doi: 10.1109/EPTC.2015.7412377
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: 2015 17th Electronics Packaging Technology Conference
quality_controlled: '1'
status: public
title: Modeling and simulation of the ultrasonic wire bonding process
type: conference
user_id: '210'
year: '2015'
...
---
_id: '9952'
abstract:
- lang: eng
text: The contact between viscoelastic materials e.g. elastomers and a rough surface
leads to a special friction characteristic, which differs greatly in its properties
comparing to other materials like metals. In practice, this friction combination
occurs for example in the tire-road contact, or in the use of rubber gaskets.
Due to the frictional forces a system is significantly influenced in its vibrational
properties. The friction force is composed of two main components adhesion and
hysteresis. The adhesion results from molecular bounds between the contact partners,
while the deformation of the viscoelastic material by the roughness of the counter
body leads to power loss. This internal friction results in an additional frictional
force, which is described by the hysteresis. To simulate the frictional behaviour
of elastomers on rough surfaces and thus to determine the energy dissipation in
contact, it is necessary to develop a mechanical model which considers the roughness
of the contact partners, as well as dynamic effects and the dependence on normal
pressure and sliding speed. The viscoelastic material behaviour must also be considered.
The contact between two rough surfaces is modelled as a rough rigid layer contacting
a rough elas- tic layer. The elastic layer is modelled by point masses connected
by Maxwell-elements. This allows the viscoelastic properties of the elastomer
to be considered. The behaviour of whole system can be described by equations
of motion with integrated constraints. The degrees of freedom of the model depends
on the varying contact conditions. A point mass not in contact has two degrees
of freedom. A point mass in contact moving along the roughness path can be described
by only one degree of freedom. For each Maxwell-Element also an inner coordinate
and thus a further degree of freedom is needed. Because of varying contact conditions
dur- ing the simulation, the simulation interrupts in case the contact conditions
change. Then the equations of motions are adapted with respect to the contact
constraints. As a result of the simulation one obtain the energy dissipation and
thus the friction char- acteristic during the friction process. It is possible
to use these results in three dimensional point-contact elements in order to model
contact surfaces on lager length scales.
author:
- first_name: Frank
full_name: Schulte, Frank
last_name: Schulte
- first_name: Jan
full_name: Neuhaus, Jan
last_name: Neuhaus
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schulte F, Neuhaus J, Sextro W. A Mechanical Model for the Dynamical Contact
of Elastic Rough Bodies with Viscoelastic Properties. In: Proceedings of ICoEV
2015 International Conference on Engineering Vibration. ; 2015:1109-1117.'
apa: Schulte, F., Neuhaus, J., & Sextro, W. (2015). A Mechanical Model for the
Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In Proceedings
of ICoEV 2015 International Conference on Engineering Vibration (pp. 1109–1117).
bibtex: '@inproceedings{Schulte_Neuhaus_Sextro_2015, title={A Mechanical Model for
the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties}, booktitle={Proceedings
of ICoEV 2015 International Conference on Engineering Vibration}, author={Schulte,
Frank and Neuhaus, Jan and Sextro, Walter}, year={2015}, pages={1109–1117} }'
chicago: Schulte, Frank, Jan Neuhaus, and Walter Sextro. “A Mechanical Model for
the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties.” In
Proceedings of ICoEV 2015 International Conference on Engineering Vibration,
1109–17, 2015.
ieee: F. Schulte, J. Neuhaus, and W. Sextro, “A Mechanical Model for the Dynamical
Contact of Elastic Rough Bodies with Viscoelastic Properties,” in Proceedings
of ICoEV 2015 International Conference on Engineering Vibration, 2015, pp.
1109–1117.
mla: Schulte, Frank, et al. “A Mechanical Model for the Dynamical Contact of Elastic
Rough Bodies with Viscoelastic Properties.” Proceedings of ICoEV 2015 International
Conference on Engineering Vibration, 2015, pp. 1109–17.
short: 'F. Schulte, J. Neuhaus, W. Sextro, in: Proceedings of ICoEV 2015 International
Conference on Engineering Vibration, 2015, pp. 1109–1117.'
date_created: 2019-05-27T08:37:22Z
date_updated: 2019-09-16T10:47:53Z
department:
- _id: '151'
keyword:
- Contact Mechanics
- Viscoelastic Material
- Adhesive Friction
- Hysteresis Friction
- Energy Dissipation
- Vibration
language:
- iso: eng
page: 1109-1117
publication: Proceedings of ICoEV 2015 International Conference on Engineering Vibration
quality_controlled: '1'
status: public
title: A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic
Properties
type: conference
user_id: '55222'
year: '2015'
...
---
_id: '9954'
abstract:
- lang: eng
text: To increase quality and reliability of copper wire bonds, self-optimization
is a promising technique. For the implementation of self-optimization for ultrasonic
heavy copper wire bonding machines, a model of stick-slip motion between tool
and wire and between wire and substrate during the bonding process is essential.
Investigations confirm that both of these contacts do indeed show stick-slip movement
in each period oscillation. In a first step, this paper shows the importance of
modeling the stick-slip effect by determining, monitoring and analyzing amplitudes
and phase angles of tool tip, wire and substrate experimentally during bonding
via laser measurements. In a second step, the paper presents a dynamic model which
has been parameterized using an iterative numerical parameter identification method.
This model includes Archard's wear approach in order to compute the lost volume
of tool tip due to wear over the entire process time. A validation of the model
by comparing measured and calculated amplitudes of tool tip and wire reveals high
model quality. Then it is then possible to calculate the lifetime of the tool
for different process parameters, i.e. values of normal force and ultrasonic voltage.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
citation:
ama: 'Unger A, Sextro W, Meyer T, et al. Modeling of the Stick-Slip Effect in Heavy
Copper Wire Bonding to Determine and Reduce Tool Wear. In: 2015 17th Electronics
Packaging Technology Conference. ; 2015. doi:10.1109/EPTC.2015.7412375'
apa: Unger, A., Sextro, W., Meyer, T., Eichwald, P., Althoff, S., Eacock, F., &
Brökelmann, M. (2015). Modeling of the Stick-Slip Effect in Heavy Copper Wire
Bonding to Determine and Reduce Tool Wear. In 2015 17th Electronics Packaging
Technology Conference. https://doi.org/10.1109/EPTC.2015.7412375
bibtex: '@inproceedings{Unger_Sextro_Meyer_Eichwald_Althoff_Eacock_Brökelmann_2015,
title={Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine
and Reduce Tool Wear}, DOI={10.1109/EPTC.2015.7412375},
booktitle={2015 17th Electronics Packaging Technology Conference}, author={Unger,
Andreas and Sextro, Walter and Meyer, Tobias and Eichwald, Paul and Althoff, Simon
and Eacock, Florian and Brökelmann, Michael}, year={2015} }'
chicago: Unger, Andreas, Walter Sextro, Tobias Meyer, Paul Eichwald, Simon Althoff,
Florian Eacock, and Michael Brökelmann. “Modeling of the Stick-Slip Effect in
Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” In 2015 17th
Electronics Packaging Technology Conference, 2015. https://doi.org/10.1109/EPTC.2015.7412375.
ieee: A. Unger et al., “Modeling of the Stick-Slip Effect in Heavy Copper
Wire Bonding to Determine and Reduce Tool Wear,” in 2015 17th Electronics Packaging
Technology Conference, 2015.
mla: Unger, Andreas, et al. “Modeling of the Stick-Slip Effect in Heavy Copper Wire
Bonding to Determine and Reduce Tool Wear.” 2015 17th Electronics Packaging
Technology Conference, 2015, doi:10.1109/EPTC.2015.7412375.
short: 'A. Unger, W. Sextro, T. Meyer, P. Eichwald, S. Althoff, F. Eacock, M. Brökelmann,
in: 2015 17th Electronics Packaging Technology Conference, 2015.'
date_created: 2019-05-27T08:43:55Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
doi: 10.1109/EPTC.2015.7412375
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: 2015 17th Electronics Packaging Technology Conference
quality_controlled: '1'
status: public
title: Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine
and Reduce Tool Wear
type: conference
user_id: '210'
year: '2015'
...
---
_id: '25168'
author:
- first_name: Jürgen
full_name: Gausemeier, Jürgen
last_name: Gausemeier
- first_name: Franz-Josef
full_name: Rammig, Franz-Josef
last_name: Rammig
- first_name: Wilhelm
full_name: Schäfer, Wilhelm
last_name: Schäfer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Gausemeier J, Rammig F-J, Schäfer W, Sextro W. Dependability of Self-Optimizing
Mechatronic Systems. Springer-Verlag; 2014.
apa: Gausemeier, J., Rammig, F.-J., Schäfer, W., & Sextro, W. (2014). Dependability
of Self-Optimizing Mechatronic Systems. Springer-Verlag.
bibtex: '@book{Gausemeier_Rammig_Schäfer_Sextro_2014, place={ Heidelberg, Germany},
title={Dependability of Self-Optimizing Mechatronic Systems}, publisher={Springer-Verlag},
author={Gausemeier, Jürgen and Rammig, Franz-Josef and Schäfer, Wilhelm and Sextro,
Walter}, year={2014} }'
chicago: 'Gausemeier, Jürgen, Franz-Josef Rammig, Wilhelm Schäfer, and Walter Sextro.
Dependability of Self-Optimizing Mechatronic Systems. Heidelberg, Germany:
Springer-Verlag, 2014.'
ieee: 'J. Gausemeier, F.-J. Rammig, W. Schäfer, and W. Sextro, Dependability
of Self-Optimizing Mechatronic Systems. Heidelberg, Germany: Springer-Verlag,
2014.'
mla: Gausemeier, Jürgen, et al. Dependability of Self-Optimizing Mechatronic
Systems. Springer-Verlag, 2014.
short: J. Gausemeier, F.-J. Rammig, W. Schäfer, W. Sextro, Dependability of Self-Optimizing
Mechatronic Systems, Springer-Verlag, Heidelberg, Germany, 2014.
date_created: 2021-09-30T10:57:30Z
date_updated: 2022-01-06T06:56:53Z
department:
- _id: '672'
language:
- iso: eng
place: ' Heidelberg, Germany'
publisher: Springer-Verlag
status: public
title: Dependability of Self-Optimizing Mechatronic Systems
type: book
user_id: '21240'
year: '2014'
...
---
_id: '25173'
author:
- first_name: Michael
full_name: Dellnitz, Michael
last_name: Dellnitz
- first_name: Kathrin
full_name: Flaßkamp, Kathrin
last_name: Flaßkamp
- first_name: Philip
full_name: Hartmann, Philip
last_name: Hartmann
- first_name: Martin
full_name: Krüger, Martin
last_name: Krüger
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Claudia
full_name: Priesterjahn, Claudia
last_name: Priesterjahn
- first_name: Sina
full_name: Ober-Blöbaum, Sina
id: '16494'
last_name: Ober-Blöbaum
- first_name: Christoph
full_name: Rasche, Christoph
last_name: Rasche
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Katharina
full_name: Stahl, Katharina
last_name: Stahl
- first_name: Ansgar
full_name: Trächtler, Ansgar
id: '552'
last_name: Trächtler
citation:
ama: 'Dellnitz M, Flaßkamp K, Hartmann P, et al. Self-optimizing Mechatronic Systems.
In: Dependability of Self-Optimizing Mechatronic Systems, Kapitel: 1.1.
Springer-Verlag; 2014:3-12.'
apa: 'Dellnitz, M., Flaßkamp, K., Hartmann, P., Krüger, M., Meyer, T., Priesterjahn,
C., Ober-Blöbaum, S., Rasche, C., Sextro, W., Stahl, K., & Trächtler, A. (2014).
Self-optimizing Mechatronic Systems. In Dependability of Self-optimizing Mechatronic
Systems, Kapitel: 1.1 (pp. 3–12). Springer-Verlag.'
bibtex: '@inbook{Dellnitz_Flaßkamp_Hartmann_Krüger_Meyer_Priesterjahn_Ober-Blöbaum_Rasche_Sextro_Stahl_et
al._2014, place={Heidelberg, Germany}, title={Self-optimizing Mechatronic Systems},
booktitle={Dependability of Self-optimizing Mechatronic Systems, Kapitel: 1.1},
publisher={Springer-Verlag}, author={Dellnitz, Michael and Flaßkamp, Kathrin and
Hartmann, Philip and Krüger, Martin and Meyer, Tobias and Priesterjahn, Claudia
and Ober-Blöbaum, Sina and Rasche, Christoph and Sextro, Walter and Stahl, Katharina
and et al.}, year={2014}, pages={3–12} }'
chicago: 'Dellnitz, Michael, Kathrin Flaßkamp, Philip Hartmann, Martin Krüger, Tobias
Meyer, Claudia Priesterjahn, Sina Ober-Blöbaum, et al. “Self-Optimizing Mechatronic
Systems.” In Dependability of Self-Optimizing Mechatronic Systems, Kapitel:
1.1, 3–12. Heidelberg, Germany: Springer-Verlag, 2014.'
ieee: 'M. Dellnitz et al., “Self-optimizing Mechatronic Systems,” in Dependability
of Self-optimizing Mechatronic Systems, Kapitel: 1.1, Heidelberg, Germany:
Springer-Verlag, 2014, pp. 3–12.'
mla: 'Dellnitz, Michael, et al. “Self-Optimizing Mechatronic Systems.” Dependability
of Self-Optimizing Mechatronic Systems, Kapitel: 1.1, Springer-Verlag, 2014,
pp. 3–12.'
short: 'M. Dellnitz, K. Flaßkamp, P. Hartmann, M. Krüger, T. Meyer, C. Priesterjahn,
S. Ober-Blöbaum, C. Rasche, W. Sextro, K. Stahl, A. Trächtler, in: Dependability
of Self-Optimizing Mechatronic Systems, Kapitel: 1.1, Springer-Verlag, Heidelberg,
Germany, 2014, pp. 3–12.'
date_created: 2021-09-30T12:17:07Z
date_updated: 2022-01-06T06:56:53Z
department:
- _id: '672'
language:
- iso: eng
page: 3-12
place: Heidelberg, Germany
publication: 'Dependability of Self-optimizing Mechatronic Systems, Kapitel: 1.1'
publisher: Springer-Verlag
status: public
title: Self-optimizing Mechatronic Systems
type: book_chapter
user_id: '21240'
year: '2014'
...
---
_id: '28394'
author:
- first_name: 'Rafal '
full_name: 'Dorociak, Rafal '
last_name: Dorociak
- first_name: J{\"u}rgen
full_name: Gausemeier, J{\"u}rgen
last_name: Gausemeier
- first_name: Peter
full_name: Iwanek, Peter
last_name: Iwanek
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Christoph
full_name: Sondermann-W{\"o}lke, Christoph
last_name: Sondermann-W{\"o}lke
citation:
ama: 'Dorociak R, Gausemeier J, Iwanek P, Meyer T, Sextro W, Sondermann-W{\"o}lke
C. Development of the Active Guidance Module. In: Dependability of Self-Optimizing
Mechatronic Systems. AACE Press; 2014:178-182.'
apa: Dorociak, R., Gausemeier, J., Iwanek, P., Meyer, T., Sextro, W., & Sondermann-W{\"o}lke,
C. (2014). Development of the Active Guidance Module. In Dependability of Self-optimizing
Mechatronic Systems (pp. 178–182). AACE Press.
bibtex: '@inbook{Dorociak_Gausemeier_Iwanek_Meyer_Sextro_Sondermann-W{\"o}lke_2014,
title={Development of the Active Guidance Module}, booktitle={Dependability of
Self-optimizing Mechatronic Systems}, publisher={AACE Press}, author={Dorociak,
Rafal and Gausemeier, J{\"u}rgen and Iwanek, Peter and Meyer, Tobias and Sextro,
Walter and Sondermann-W{\"o}lke, Christoph}, year={2014}, pages={178–182} }'
chicago: Dorociak, Rafal , J{\"u}rgen Gausemeier, Peter Iwanek, Tobias Meyer, Walter
Sextro, and Christoph Sondermann-W{\"o}lke. “Development of the Active Guidance
Module.” In Dependability of Self-Optimizing Mechatronic Systems, 178–82.
AACE Press, 2014.
ieee: R. Dorociak, J. Gausemeier, P. Iwanek, T. Meyer, W. Sextro, and C. Sondermann-W{\"o}lke,
“Development of the Active Guidance Module,” in Dependability of Self-optimizing
Mechatronic Systems, AACE Press, 2014, pp. 178–182.
mla: Dorociak, Rafal, et al. “Development of the Active Guidance Module.” Dependability
of Self-Optimizing Mechatronic Systems, AACE Press, 2014, pp. 178–82.
short: 'R. Dorociak, J. Gausemeier, P. Iwanek, T. Meyer, W. Sextro, C. Sondermann-W{\"o}lke,
in: Dependability of Self-Optimizing Mechatronic Systems, AACE Press, 2014, pp.
178–182.'
date_created: 2021-12-07T19:19:41Z
date_updated: 2022-01-06T06:58:02Z
department:
- _id: '676'
language:
- iso: eng
page: 178-182
publication: Dependability of Self-optimizing Mechatronic Systems
publication_status: published
publisher: AACE Press
status: public
title: Development of the Active Guidance Module
type: book_chapter
user_id: '71124'
year: '2014'
...
---
_id: '28396'
author:
- first_name: J{\"u}rgen
full_name: Gausemeier, J{\"u}rgen
last_name: Gausemeier
- first_name: Franz-Josef
full_name: Rammig, Franz-Josef
last_name: Rammig
- first_name: ' Wilhelm'
full_name: Sch{\"a}fer, Wilhelm
last_name: Sch{\"a}fer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Gausemeier J, Rammig F-J, Sch{\"a}fer Wilhelm, Sextro W. Dependability
of Self-Optimizing Mechatronic Systems. Springer-Verlag, Heidelberg, Germany;
2014.
apa: Gausemeier, J., Rammig, F.-J., Sch{\"a}fer, Wilhelm, & Sextro, W. (2014).
Dependability of Self-Optimizing Mechatronic Systems. Springer-Verlag,
Heidelberg, Germany.
bibtex: '@book{Gausemeier_Rammig_Sch{\"a}fer_Sextro_2014, title={Dependability of
Self-Optimizing Mechatronic Systems}, publisher={Springer-Verlag, Heidelberg,
Germany}, author={Gausemeier, J{\"u}rgen and Rammig, Franz-Josef and Sch{\"a}fer, Wilhelm
and Sextro, Walter}, year={2014} }'
chicago: Gausemeier, J{\"u}rgen, Franz-Josef Rammig, Wilhelm Sch{\"a}fer, and Walter
Sextro. Dependability of Self-Optimizing Mechatronic Systems. Springer-Verlag,
Heidelberg, Germany, 2014.
ieee: J. Gausemeier, F.-J. Rammig, Wilhelm Sch{\"a}fer, and W. Sextro, Dependability
of Self-Optimizing Mechatronic Systems. Springer-Verlag, Heidelberg, Germany,
2014.
mla: Gausemeier, J{\"u}rgen, et al. Dependability of Self-Optimizing Mechatronic
Systems. Springer-Verlag, Heidelberg, Germany, 2014.
short: J. Gausemeier, F.-J. Rammig, Wilhelm Sch{\"a}fer, W. Sextro, Dependability
of Self-Optimizing Mechatronic Systems, Springer-Verlag, Heidelberg, Germany,
2014.
date_created: 2021-12-07T19:28:28Z
date_updated: 2022-01-06T06:58:02Z
department:
- _id: '676'
language:
- iso: eng
publication_status: published
publisher: Springer-Verlag, Heidelberg, Germany
status: public
title: Dependability of Self-Optimizing Mechatronic Systems
type: book
user_id: '71124'
year: '2014'
...
---
_id: '28399'
author:
- first_name: Rafal
full_name: Dorociak, Rafal
last_name: Dorociak
- first_name: ' J{\"u}rgen'
full_name: Gausemeier, J{\"u}rgen
last_name: Gausemeier
- first_name: ' Peter'
full_name: Iwanek, Peter
last_name: Iwanek
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Dorociak R, Gausemeier J{\"u}rgen, Iwanek Peter, Meyer T, Sextro W. Selecting
Suitable Methods Using the Methodology. In: Dependability of Self-Optimizing
Mechatronic Systems. Springer-Verlag Berlin Heidelberg; 2014:174-178.'
apa: Dorociak, R., Gausemeier, J{\"u}rgen, Iwanek, Peter, Meyer, T., & Sextro,
W. (2014). Selecting Suitable Methods Using the Methodology. In Dependability
of Self-optimizing Mechatronic Systems (pp. 174–178). Springer-Verlag Berlin
Heidelberg.
bibtex: '@inbook{Dorociak_Gausemeier_Iwanek_Meyer_Sextro_2014, title={Selecting
Suitable Methods Using the Methodology}, booktitle={Dependability of Self-optimizing
Mechatronic Systems}, publisher={Springer-Verlag Berlin Heidelberg}, author={Dorociak,
Rafal and Gausemeier, J{\"u}rgen and Iwanek, Peter and Meyer, Tobias and Sextro,
Walter}, year={2014}, pages={174–178} }'
chicago: Dorociak, Rafal, J{\"u}rgen Gausemeier, Peter Iwanek, Tobias Meyer, and
Walter Sextro. “Selecting Suitable Methods Using the Methodology.” In Dependability
of Self-Optimizing Mechatronic Systems, 174–78. Springer-Verlag Berlin Heidelberg,
2014.
ieee: R. Dorociak, J{\"u}rgen Gausemeier, Peter Iwanek, T. Meyer, and W. Sextro,
“Selecting Suitable Methods Using the Methodology,” in Dependability of Self-optimizing
Mechatronic Systems, Springer-Verlag Berlin Heidelberg, 2014, pp. 174–178.
mla: Dorociak, Rafal, et al. “Selecting Suitable Methods Using the Methodology.”
Dependability of Self-Optimizing Mechatronic Systems, Springer-Verlag Berlin
Heidelberg, 2014, pp. 174–78.
short: 'R. Dorociak, J{\"u}rgen Gausemeier, Peter Iwanek, T. Meyer, W. Sextro,
in: Dependability of Self-Optimizing Mechatronic Systems, Springer-Verlag Berlin
Heidelberg, 2014, pp. 174–178.'
date_created: 2021-12-07T19:50:25Z
date_updated: 2022-01-06T06:58:02Z
department:
- _id: '676'
language:
- iso: eng
page: 174-178
publication: Dependability of Self-optimizing Mechatronic Systems
publication_status: published
publisher: Springer-Verlag Berlin Heidelberg
status: public
title: Selecting Suitable Methods Using the Methodology
type: book_chapter
user_id: '71124'
year: '2014'
...
---
_id: '28400'
author:
- first_name: Rafal
full_name: Dorociak, Rafal
last_name: Dorociak
- first_name: 'J{\"u}rgen '
full_name: 'Gausemeier, J{\"u}rgen '
last_name: Gausemeier
- first_name: Peter
full_name: Iwanek, Peter
last_name: Iwanek
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Dorociak R, Gausemeier J, Iwanek P, Meyer T, Sextro W. Selecting Suitable
Methods Using the Methodology. In: Dependability of Self-Optimizing Mechatronic
Systems. Springer-Verlag Berlin Heidelberg; 2014:174-178.'
apa: Dorociak, R., Gausemeier, J., Iwanek, P., Meyer, T., & Sextro, W. (2014).
Selecting Suitable Methods Using the Methodology. In Dependability of Self-optimizing
Mechatronic Systems (pp. 174–178). Springer-Verlag Berlin Heidelberg.
bibtex: '@inbook{Dorociak_Gausemeier_Iwanek_Meyer_Sextro_2014, title={Selecting
Suitable Methods Using the Methodology}, booktitle={Dependability of Self-optimizing
Mechatronic Systems}, publisher={Springer-Verlag Berlin Heidelberg}, author={Dorociak,
Rafal and Gausemeier, J{\"u}rgen and Iwanek, Peter and Meyer, Tobias and Sextro,
Walter}, year={2014}, pages={174–178} }'
chicago: Dorociak, Rafal, J{\"u}rgen Gausemeier, Peter Iwanek, Tobias Meyer, and
Walter Sextro. “Selecting Suitable Methods Using the Methodology.” In Dependability
of Self-Optimizing Mechatronic Systems, 174–78. Springer-Verlag Berlin Heidelberg,
2014.
ieee: R. Dorociak, J. Gausemeier, P. Iwanek, T. Meyer, and W. Sextro, “Selecting
Suitable Methods Using the Methodology,” in Dependability of Self-optimizing
Mechatronic Systems, Springer-Verlag Berlin Heidelberg, 2014, pp. 174–178.
mla: Dorociak, Rafal, et al. “Selecting Suitable Methods Using the Methodology.”
Dependability of Self-Optimizing Mechatronic Systems, Springer-Verlag Berlin
Heidelberg, 2014, pp. 174–78.
short: 'R. Dorociak, J. Gausemeier, P. Iwanek, T. Meyer, W. Sextro, in: Dependability
of Self-Optimizing Mechatronic Systems, Springer-Verlag Berlin Heidelberg, 2014,
pp. 174–178.'
date_created: 2021-12-07T19:54:27Z
date_updated: 2022-01-06T06:58:03Z
department:
- _id: '676'
language:
- iso: eng
page: 174-178
publication: Dependability of Self-optimizing Mechatronic Systems
publication_status: published
publisher: Springer-Verlag Berlin Heidelberg
status: public
title: Selecting Suitable Methods Using the Methodology
type: book_chapter
user_id: '71124'
year: '2014'
...
---
_id: '28410'
author:
- first_name: 'Peter '
full_name: 'Iwanek, Peter '
last_name: Iwanek
- first_name: Tobias
full_name: ' Meyer, Tobias'
last_name: ' Meyer'
- first_name: Claudia
full_name: Priesterjahn, Claudia
last_name: Priesterjahn
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Mareen
full_name: Va{\ss}holz, Mareen
last_name: Va{\ss}holz
citation:
ama: 'Iwanek P, Meyer T, Priesterjahn C, Sextro W, Va{\ss}holz M. Challenges. In:
Dependability of Self-Optimizing Mechatronic Systems. Springer-Verlag,
Heidelberg, Germany; 2014:12-15.'
apa: Iwanek, P., Meyer, T., Priesterjahn, C., Sextro, W., & Va{\ss}holz, M.
(2014). Challenges. In Dependability of Self-optimizing Mechatronic Systems
(pp. 12–15). Springer-Verlag, Heidelberg, Germany.
bibtex: '@inbook{Iwanek_ Meyer_Priesterjahn_Sextro_Va{\ss}holz_2014, title={Challenges},
booktitle={Dependability of Self-optimizing Mechatronic Systems}, publisher={Springer-Verlag,
Heidelberg, Germany}, author={Iwanek, Peter and Meyer, Tobias and Priesterjahn,
Claudia and Sextro, Walter and Va{\ss}holz, Mareen}, year={2014}, pages={12–15}
}'
chicago: Iwanek, Peter , Tobias Meyer, Claudia Priesterjahn, Walter Sextro, and
Mareen Va{\ss}holz. “Challenges.” In Dependability of Self-Optimizing Mechatronic
Systems, 12–15. Springer-Verlag, Heidelberg, Germany, 2014.
ieee: P. Iwanek, T. Meyer, C. Priesterjahn, W. Sextro, and M. Va{\ss}holz, “Challenges,”
in Dependability of Self-optimizing Mechatronic Systems, Springer-Verlag,
Heidelberg, Germany, 2014, pp. 12–15.
mla: Iwanek, Peter, et al. “Challenges.” Dependability of Self-Optimizing Mechatronic
Systems, Springer-Verlag, Heidelberg, Germany, 2014, pp. 12–15.
short: 'P. Iwanek, T. Meyer, C. Priesterjahn, W. Sextro, M. Va{\ss}holz, in: Dependability
of Self-Optimizing Mechatronic Systems, Springer-Verlag, Heidelberg, Germany,
2014, pp. 12–15.'
date_created: 2021-12-07T21:22:10Z
date_updated: 2022-01-06T06:58:03Z
department:
- _id: '676'
language:
- iso: eng
page: 12-15
publication: Dependability of Self-optimizing Mechatronic Systems
publication_status: published
publisher: Springer-Verlag, Heidelberg, Germany
status: public
title: Challenges
type: book_chapter
user_id: '71124'
year: '2014'
...
---
_id: '9868'
abstract:
- lang: eng
text: In order to increase mechanical strength, heat dissipation and ampacity and
to decrease failure through fatigue fracture, wedge copper wire bonding is being
introduced as a standard interconnection method for mass production. To achieve
the same process stability when using copper wire instead of aluminum wire a profound
understanding of the bonding process is needed. Due to the higher hardness of
copper compared to aluminum wire it is more difficult to approach the surfaces
of wire and substrate to a level where van der Waals forces are able to arise
between atoms. Also, enough friction energy referred to the total contact area
has to be generated to activate the surfaces. Therefore, a friction model is used
to simulate the joining process. This model calculates the resulting energy of
partial areas in the contact surface and provides information about the adhesion
process of each area. The focus here is on the arising of micro joints in the
contact area depending on the location in the contact and time. To validate the
model, different touchdown forces are used to vary the initial contact areas of
wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built
up to identify the known phases of pre-deforming, cleaning, adhering and diffusing
for the real bonding process to map with the model. Test substrates as DBC and
copper plate are used to show the different formations of a wedge bond connection
due to hardness and reaction propensity. The experiments were done by using 500
$\mu$m copper wire and a standard V-groove tool.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Jan
full_name: Neuhaus, Jan
last_name: Neuhaus
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper
wire bonds using a friction model approach. In: Electronic Components and Technology
Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500'
apa: Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2014). Improving the
bond quality of copper wire bonds using a friction model approach. In Electronic
Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555).
https://doi.org/10.1109/ECTC.2014.6897500
bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the
bond quality of copper wire bonds using a friction model approach}, DOI={10.1109/ECTC.2014.6897500},
booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th},
author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter},
year={2014}, pages={1549–1555} }'
chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving
the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In Electronic
Components and Technology Conference (ECTC), 2014 IEEE 64th, 1549–55, 2014.
https://doi.org/10.1109/ECTC.2014.6897500.
ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality
of copper wire bonds using a friction model approach,” in Electronic Components
and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
mla: Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using
a Friction Model Approach.” Electronic Components and Technology Conference
(ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components
and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.'
date_created: 2019-05-20T12:11:44Z
date_updated: 2019-09-16T10:57:58Z
department:
- _id: '151'
doi: 10.1109/ECTC.2014.6897500
keyword:
- adhesion
- circuit reliability
- deformation
- diffusion
- fatigue cracks
- friction
- interconnections
- lead bonding
- van der Waals forces
- Cu
- adhering process
- adhesion process
- ampacity improvement
- bond quality improvement
- cleaning process
- diffusing process
- fatigue fracture failure
- friction energy
- friction model
- heat dissipation
- mechanical strength
- piezoelectric triaxial force sensor
- predeforming process
- size 500 mum
- total contact area
- van der Waals forces
- wedge copper wire bonding
- Bonding
- Copper
- Finite element analysis
- Force
- Friction
- Substrates
- Wires
language:
- iso: eng
page: 1549-1555
publication: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
quality_controlled: '1'
status: public
title: Improving the bond quality of copper wire bonds using a friction model approach
type: conference
user_id: '55222'
year: '2014'
...
---
_id: '9869'
abstract:
- lang: eng
text: Cavitation monitoring is desired to optimize the sonication for diverse sonochemical
processes and to detect changes or malfunctions during operation. In situ cavitation
measurements can be carried out by detection of the acoustic emissions of cavitation
bubbles by sensors in the liquid. However, in harsh environments sensors might
not be applicable. Thus, the impact of cavitation on the electrical signals of
a piezoelectric transducer has been analyzed as alternative method to measure
the threshold, strength and type of cavitation. The applicability has been tested
in three different setups to evaluate the general- izability of extracted indicators.
In all setups indicators for the cavitation thresholds could be derived from the
current signal. In two setups features showed two thresholds that may be linked
to the types of cavitation. However, only one feature derived from the current
signal in one particular setup correlated to the strength of cavitation. Cavitation
detection based on the current signal of the transducer is a useful method to
detect cavitation in harsh environments and without perturbing the sound field.
Once appli- cable indicators have been identified, they may easily be tracked
during the process. However, for more detailed studies about the cavitation activity
and its spatial distribution, measurements with in situ sensors are recommended.
author:
- first_name: Peter
full_name: Bornmann, Peter
last_name: Bornmann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Gianluca
full_name: Memoli, Gianluca
last_name: Memoli
- first_name: Mark
full_name: Hodnett, Mark
last_name: Hodnett
- first_name: Bajram
full_name: Zeqiri, Bajram
last_name: Zeqiri
citation:
ama: 'Bornmann P, Hemsel T, Sextro W, Memoli G, Hodnett M, Zeqiri B. Self-Sensing
Ultrasound Transducer for Cavitation Detection. In: 2014 IEEE International
Ultrasonics Symposium Proceedings. ; 2014:663-666. doi:10.1109/ULTSYM.2014.0163'
apa: Bornmann, P., Hemsel, T., Sextro, W., Memoli, G., Hodnett, M., & Zeqiri,
B. (2014). Self-Sensing Ultrasound Transducer for Cavitation Detection. In 2014
IEEE International Ultrasonics Symposium Proceedings (pp. 663–666). https://doi.org/10.1109/ULTSYM.2014.0163
bibtex: '@inproceedings{Bornmann_Hemsel_Sextro_Memoli_Hodnett_Zeqiri_2014, title={Self-Sensing
Ultrasound Transducer for Cavitation Detection}, DOI={10.1109/ULTSYM.2014.0163},
booktitle={2014 IEEE International Ultrasonics Symposium Proceedings}, author={Bornmann,
Peter and Hemsel, Tobias and Sextro, Walter and Memoli, Gianluca and Hodnett,
Mark and Zeqiri, Bajram}, year={2014}, pages={663–666} }'
chicago: Bornmann, Peter, Tobias Hemsel, Walter Sextro, Gianluca Memoli, Mark Hodnett,
and Bajram Zeqiri. “Self-Sensing Ultrasound Transducer for Cavitation Detection.”
In 2014 IEEE International Ultrasonics Symposium Proceedings, 663–66, 2014.
https://doi.org/10.1109/ULTSYM.2014.0163.
ieee: P. Bornmann, T. Hemsel, W. Sextro, G. Memoli, M. Hodnett, and B. Zeqiri, “Self-Sensing
Ultrasound Transducer for Cavitation Detection,” in 2014 IEEE International
Ultrasonics Symposium Proceedings, 2014, pp. 663–666.
mla: Bornmann, Peter, et al. “Self-Sensing Ultrasound Transducer for Cavitation
Detection.” 2014 IEEE International Ultrasonics Symposium Proceedings,
2014, pp. 663–66, doi:10.1109/ULTSYM.2014.0163.
short: 'P. Bornmann, T. Hemsel, W. Sextro, G. Memoli, M. Hodnett, B. Zeqiri, in:
2014 IEEE International Ultrasonics Symposium Proceedings, 2014, pp. 663–666.'
date_created: 2019-05-20T12:13:02Z
date_updated: 2019-05-20T12:13:41Z
department:
- _id: '151'
doi: 10.1109/ULTSYM.2014.0163
language:
- iso: eng
page: 663-666
publication: 2014 IEEE International Ultrasonics Symposium Proceedings
publication_identifier:
isbn:
- '9781479970490'
status: public
title: Self-Sensing Ultrasound Transducer for Cavitation Detection
type: conference
user_id: '55222'
year: '2014'
...
---
_id: '9871'
abstract:
- lang: eng
text: 'Wire bonding is the most common technology for connecting electronic components.
Due to their efficiency bond interconnections made of copper wire are used for
example in the aerospace and medical technology as well as in the fields of renewable
energies. One of the main cost factors in the manufacturing process is the consumables
like bonding tools. The technological transition to copper as wire material causes
significant wear on the millimeter large effective contact area of the bonding
tool. This wear leads to a loss by a factor of 30 of the number of reliable interconnections
which can be produced by a single tool. To reduce setting-up time in the production
and minimizing costs, an enlarged bonding tool lifetime is desirable. Consequently
a better understanding of wear and recognition of wear pattern is required. Therefore,
the paper presents an analyzing method of the tool topography change of a heavy
wire bonding tool by using a confocal microscope. Furthermore, the paper discusses
the identification of the main wear indicators by the help of the named topography
change for different bond parameters, like ultrasonic power and tool geometry.
Reference topography has been carried out by choosing typical parameters of the
production line. To judge whether the quality requirement of the bond connections
made by a single tool cannot be fulfilled shear test of the source bond have been
carried out after a defined number of produced bond connections. Main steps of
analysis: (I)Topography of the tool surface is sampled after a defined number
of bonds by means of a confocal microscope to detect the wear progress.(II)The
recorded data is filtered using Matlab. So, measurement errors can be eliminated
and the topography can be overlaid more easy to identify differences between diverse
tools or differences in wear stages of the same tool.(III)The subsequent discretization
of the topography into sub volumes allows to (IV)describe the loss of volume depending
on the position in the groove. Thereby, intermediate status of wear of one tool
can be used to obtain a persistent description of the topography change over the
number of produced bonds by interpolating the confocal data. Afterwards the persistent
change of the groove flank has been analyzed for the named test series to identify
the main wear indicators and their effect on shear forces. All worn tools show
dominant areas for volume loss especially for plastic deformation and accordingly
abrasion. These wear mechanism can be referred to the change of main parts of
the groove geometry like the rounding of the front and back radius. The most volume
loss was identified in the upper part of the tool flanks or rather at the transition
from the groove flank to the front or back radius. Furthermore the observation
of the center of the groove flank shows just a little change in volume. All in
all, the identification of the wear indicators will be discussed with the objective
of increasing the tool lifetime by optimizing the tool geometry without losses
in bond quality and reliability.'
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Simon
full_name: Althof, Simon
last_name: Althof
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography
Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.
In: Proceedings of the 47th International Symposium on Microelectronics.
; 2014:856-861. doi:10.4071/isom-THP34'
apa: Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., &
Guth, K. (2014). Analysis Method of Tool Topography Change and Identification
of Wear Indicators for Heavy Copper Wire Wedge Bonding. In Proceedings of the
47th International Symposium on Microelectronics (pp. 856–861). https://doi.org/10.4071/isom-THP34
bibtex: '@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis
Method of Tool Topography Change and Identification of Wear Indicators for Heavy
Copper Wire Wedge Bonding}, DOI={10.4071/isom-THP34},
booktitle={Proceedings of the 47th International Symposium on Microelectronics},
author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian
and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861}
}'
chicago: Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger,
Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and
Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In Proceedings
of the 47th International Symposium on Microelectronics, 856–61, 2014. https://doi.org/10.4071/isom-THP34.
ieee: P. Eichwald et al., “Analysis Method of Tool Topography Change and
Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in Proceedings
of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
mla: Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification
of Wear Indicators for Heavy Copper Wire Wedge Bonding.” Proceedings of the
47th International Symposium on Microelectronics, 2014, pp. 856–61, doi:10.4071/isom-THP34.
short: 'P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth,
in: Proceedings of the 47th International Symposium on Microelectronics, 2014,
pp. 856–861.'
date_created: 2019-05-20T12:18:55Z
date_updated: 2020-05-07T05:33:45Z
department:
- _id: '151'
doi: 10.4071/isom-THP34
keyword:
- wedge/wedge bonding
- copper wire
- tool wear
language:
- iso: eng
page: 856-861
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of the 47th International Symposium on Microelectronics
status: public
title: Analysis Method of Tool Topography Change and Identification of Wear Indicators
for Heavy Copper Wire Wedge Bonding
type: conference
user_id: '210'
year: '2014'
...
---
_id: '9873'
abstract:
- lang: eng
text: Intelligent technical systems, which combine mechanical, electrical and software
engineering with methods from control engineering and advanced mathematics, go
far beyond the state of the art in mechatronics and open up fascinating perspectives.
Among these systems are so-called self-optimizing systems, which are able to adapt
their behavior autonomously and flexibly to changing operating conditions. The
Collaborative Research Center 614 "Self-optimizing concepts and structures in
mechanical engineering" pursued the long-term aim to enable others to develop
dependable self-optimizing systems. Assuring their dependability poses new challenges.
However, self-optimization also offers the possibility to adapt the system's behavior
to improve dependability during operation. The aim of this book is to provide
methods and techniques to master the challenges and to exploit the possibilities
given by self-optimization. The reader will be able to develop self-optimizing
systems that fulfill and surpass today’s dependability requirements easily. This
book is directed to researchers and practitioners alike. It gives a brief introduction
to the holistic development approach for self-optimizing mechatronic systems and
the steps required to assure a dependable product design starting with the very
early conceptual design phase. A guideline to select suitable methods for each
step and the methods themselves are included. Each method is individually introduced,
many examples and full references are given.
author:
- first_name: Jürgen
full_name: Gausemeier, Jürgen
last_name: Gausemeier
- first_name: Franz
full_name: Josef Rammig, Franz
last_name: Josef Rammig
- first_name: Wilhelm
full_name: Schäfer, Wilhelm
last_name: Schäfer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Gausemeier J, Josef Rammig F, Schäfer W, Sextro W. Dependability of Self-Optimizing
Mechatronic Systems. Vol Lecture Notes in Mechanical Engineering. Springer
Berlin Heidelberg; 2014.
apa: Gausemeier, J., Josef Rammig, F., Schäfer, W., & Sextro, W. (2014). Dependability
of Self-Optimizing Mechatronic Systems (Vol. Lecture Notes in Mechanical Engineering).
Springer Berlin Heidelberg.
bibtex: '@book{Gausemeier_Josef Rammig_Schäfer_Sextro_2014, title={Dependability
of Self-Optimizing Mechatronic Systems}, volume={Lecture Notes in Mechanical Engineering},
publisher={Springer Berlin Heidelberg}, author={Gausemeier, Jürgen and Josef Rammig,
Franz and Schäfer, Wilhelm and Sextro, Walter}, year={2014} }'
chicago: Gausemeier, Jürgen, Franz Josef Rammig, Wilhelm Schäfer, and Walter Sextro.
Dependability of Self-Optimizing Mechatronic Systems. Vol. Lecture Notes
in Mechanical Engineering. Springer Berlin Heidelberg, 2014.
ieee: J. Gausemeier, F. Josef Rammig, W. Schäfer, and W. Sextro, Dependability
of Self-Optimizing Mechatronic Systems, vol. Lecture Notes in Mechanical Engineering.
Springer Berlin Heidelberg, 2014.
mla: Gausemeier, Jürgen, et al. Dependability of Self-Optimizing Mechatronic
Systems. Vol. Lecture Notes in Mechanical Engineering, Springer Berlin Heidelberg,
2014.
short: J. Gausemeier, F. Josef Rammig, W. Schäfer, W. Sextro, Dependability of Self-Optimizing
Mechatronic Systems, Springer Berlin Heidelberg, 2014.
date_created: 2019-05-20T12:57:54Z
date_updated: 2019-05-20T13:00:58Z
department:
- _id: '151'
language:
- iso: eng
publisher: Springer Berlin Heidelberg
status: public
title: Dependability of Self-Optimizing Mechatronic Systems
type: book
user_id: '55222'
volume: Lecture Notes in Mechanical Engineering
year: '2014'
...
---
_id: '9874'
author:
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Peter
full_name: Bornmann, Peter
last_name: Bornmann
- first_name: Takeshi
full_name: Morita, Takeshi
last_name: Morita
- first_name: Christoph
full_name: Sondermann-Wölke, Christoph
last_name: Sondermann-Wölke
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Hemsel T, Bornmann P, Morita T, Sondermann-Wölke C, Sextro W. Reliability analysis
of ultrasonic power transducers. Archive of Applied Mechanics. 2014:1-7.
doi:10.1007/s00419-014-0965-4
apa: Hemsel, T., Bornmann, P., Morita, T., Sondermann-Wölke, C., & Sextro, W.
(2014). Reliability analysis of ultrasonic power transducers. Archive of Applied
Mechanics, 1–7. https://doi.org/10.1007/s00419-014-0965-4
bibtex: '@article{Hemsel_Bornmann_Morita_Sondermann-Wölke_Sextro_2014, title={Reliability
analysis of ultrasonic power transducers}, DOI={10.1007/s00419-014-0965-4},
journal={Archive of Applied Mechanics}, publisher={Springer Berlin Heidelberg},
author={Hemsel, Tobias and Bornmann, Peter and Morita, Takeshi and Sondermann-Wölke,
Christoph and Sextro, Walter}, year={2014}, pages={1–7} }'
chicago: Hemsel, Tobias, Peter Bornmann, Takeshi Morita, Christoph Sondermann-Wölke,
and Walter Sextro. “Reliability Analysis of Ultrasonic Power Transducers.” Archive
of Applied Mechanics, 2014, 1–7. https://doi.org/10.1007/s00419-014-0965-4.
ieee: T. Hemsel, P. Bornmann, T. Morita, C. Sondermann-Wölke, and W. Sextro, “Reliability
analysis of ultrasonic power transducers,” Archive of Applied Mechanics,
pp. 1–7, 2014.
mla: Hemsel, Tobias, et al. “Reliability Analysis of Ultrasonic Power Transducers.”
Archive of Applied Mechanics, Springer Berlin Heidelberg, 2014, pp. 1–7,
doi:10.1007/s00419-014-0965-4.
short: T. Hemsel, P. Bornmann, T. Morita, C. Sondermann-Wölke, W. Sextro, Archive
of Applied Mechanics (2014) 1–7.
date_created: 2019-05-20T13:01:25Z
date_updated: 2019-09-16T10:57:23Z
department:
- _id: '151'
doi: 10.1007/s00419-014-0965-4
keyword:
- Reliability
- Ultrasonic power transducers
- FMEA
language:
- iso: eng
page: 1-7
publication: Archive of Applied Mechanics
publication_identifier:
issn:
- 0939-1533
publisher: Springer Berlin Heidelberg
quality_controlled: '1'
status: public
title: Reliability analysis of ultrasonic power transducers
type: journal_article
user_id: '55222'
year: '2014'
...
---
_id: '9876'
abstract:
- lang: eng
text: Piezoelectric inertia motors use the inertia of a body to drive it by means
of a friction contact in a series of small steps. It has been shown previously
in theoretical investigations that higher velocities and smoother movements can
be obtained if these steps do not contain phases of stiction (''stick-slip`` operation),
but use sliding friction only (''slip-slip`` operation). One very promising driving
option for such motors is the superposition of multiple sinusoidal signals or
harmonics. In this contribution, the theoretical results are validated experimentally.
In this context, a quick and reliable identification process for parameters describing
the friction contact is proposed. Additionally, the force generation potential
of inertia motors is investigated theoretically and experimentally. The experimental
results confirm the theoretical result that for a given maximum frequency, a signal
with a high fundamental frequency and consisting of two superposed sine waves
leads to the highest velocity and the smoothest motion, while the maximum motor
force is obtained with signals containing more harmonics. These results are of
fundamental importance for the further development of high-velocity piezoelectric
inertia motors.
author:
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Hunstig M, Hemsel T, Sextro W. High-velocity operation of piezoelectric inertia
motors: experimental validation. Archive of Applied Mechanics. 2014:1-9.
doi:10.1007/s00419-014-0940-0'
apa: 'Hunstig, M., Hemsel, T., & Sextro, W. (2014). High-velocity operation
of piezoelectric inertia motors: experimental validation. Archive of Applied
Mechanics, 1–9. https://doi.org/10.1007/s00419-014-0940-0'
bibtex: '@article{Hunstig_Hemsel_Sextro_2014, title={High-velocity operation of
piezoelectric inertia motors: experimental validation}, DOI={10.1007/s00419-014-0940-0},
journal={Archive of Applied Mechanics}, publisher={Springer Berlin Heidelberg},
author={Hunstig, Matthias and Hemsel, Tobias and Sextro, Walter}, year={2014},
pages={1–9} }'
chicago: 'Hunstig, Matthias, Tobias Hemsel, and Walter Sextro. “High-Velocity Operation
of Piezoelectric Inertia Motors: Experimental Validation.” Archive of Applied
Mechanics, 2014, 1–9. https://doi.org/10.1007/s00419-014-0940-0.'
ieee: 'M. Hunstig, T. Hemsel, and W. Sextro, “High-velocity operation of piezoelectric
inertia motors: experimental validation,” Archive of Applied Mechanics,
pp. 1–9, 2014.'
mla: 'Hunstig, Matthias, et al. “High-Velocity Operation of Piezoelectric Inertia
Motors: Experimental Validation.” Archive of Applied Mechanics, Springer
Berlin Heidelberg, 2014, pp. 1–9, doi:10.1007/s00419-014-0940-0.'
short: M. Hunstig, T. Hemsel, W. Sextro, Archive of Applied Mechanics (2014) 1–9.
date_created: 2019-05-20T13:08:08Z
date_updated: 2019-05-20T13:08:43Z
department:
- _id: '151'
doi: 10.1007/s00419-014-0940-0
keyword:
- Inertia motor
- High velocity
- Stick-slip motor
- Slip-slip operation
- Friction parameter identification
language:
- iso: eng
page: 1-9
publication: Archive of Applied Mechanics
publication_identifier:
issn:
- 0939-1533
publisher: Springer Berlin Heidelberg
status: public
title: 'High-velocity operation of piezoelectric inertia motors: experimental validation'
type: journal_article
user_id: '55222'
year: '2014'
...
---
_id: '9879'
abstract:
- lang: eng
text: Application of prognostics and health management (PHM) in the field of Proton
Exchange Membrane (PEM) fuel cells is emerging as an important tool in increasing
the reliability and availability of these systems. Though a lot of work is currently
being conducted to develop PHM systems for fuel cells, various challenges have
been encountered including the self-healing effect after characterization as well
as accelerated degradation due to dynamic loading, all which make RUL predictions
a difficult task. In this study, a prognostic approach based on adaptive particle
filter algorithm is proposed. The novelty of the proposed method lies in the introduction
of a self-healing factor after each characterization and the adaption of the degradation
model parameters to fit to the changing degradation trend. An ensemble of five
different state models based on weighted mean is then developed. The results show
that the method is effective in estimating the remaining useful life of PEM fuel
cells, with majority of the predictions falling within 5\% error. The method was
employed in the IEEE 2014 PHM Data Challenge and led to our team emerging the
winner of the RUL category of the challenge.
author:
- first_name: 'James Kuria '
full_name: 'Kimotho, James Kuria '
last_name: Kimotho
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Kimotho JK, Meyer T, Sextro W. PEM fuel cell prognostics using particle filter
with model parameter adaptation. In: Prognostics and Health Management (PHM),
2014 IEEE Conference On. ; 2014:1-6. doi:10.1109/ICPHM.2014.7036406'
apa: Kimotho, J. K., Meyer, T., & Sextro, W. (2014). PEM fuel cell prognostics
using particle filter with model parameter adaptation. In Prognostics and Health
Management (PHM), 2014 IEEE Conference on (pp. 1–6). https://doi.org/10.1109/ICPHM.2014.7036406
bibtex: '@inproceedings{Kimotho_Meyer_Sextro_2014, title={PEM fuel cell prognostics
using particle filter with model parameter adaptation}, DOI={10.1109/ICPHM.2014.7036406},
booktitle={Prognostics and Health Management (PHM), 2014 IEEE Conference on},
author={Kimotho, James Kuria and Meyer, Tobias and Sextro, Walter}, year={2014},
pages={1–6} }'
chicago: Kimotho, James Kuria , Tobias Meyer, and Walter Sextro. “PEM Fuel Cell
Prognostics Using Particle Filter with Model Parameter Adaptation.” In Prognostics
and Health Management (PHM), 2014 IEEE Conference On, 1–6, 2014. https://doi.org/10.1109/ICPHM.2014.7036406.
ieee: J. K. Kimotho, T. Meyer, and W. Sextro, “PEM fuel cell prognostics using particle
filter with model parameter adaptation,” in Prognostics and Health Management
(PHM), 2014 IEEE Conference on, 2014, pp. 1–6.
mla: Kimotho, James Kuria, et al. “PEM Fuel Cell Prognostics Using Particle Filter
with Model Parameter Adaptation.” Prognostics and Health Management (PHM),
2014 IEEE Conference On, 2014, pp. 1–6, doi:10.1109/ICPHM.2014.7036406.
short: 'J.K. Kimotho, T. Meyer, W. Sextro, in: Prognostics and Health Management
(PHM), 2014 IEEE Conference On, 2014, pp. 1–6.'
date_created: 2019-05-20T13:11:02Z
date_updated: 2019-05-20T13:12:27Z
department:
- _id: '151'
doi: 10.1109/ICPHM.2014.7036406
keyword:
- ageing
- particle filtering (numerical methods)
- proton exchange membrane fuel cells
- remaining life assessment
- PEM fuel cell prognostics
- PHM
- RUL predictions
- accelerated degradation
- adaptive particle filter algorithm
- dynamic loading
- model parameter adaptation
- prognostics and health management
- proton exchange membrane fuel cells
- remaining useful life estimation
- self-healing effect
- Adaptation models
- Data models
- Degradation
- Estimation
- Fuel cells
- Mathematical model
- Prognostics and health management
language:
- iso: eng
page: 1-6
publication: Prognostics and Health Management (PHM), 2014 IEEE Conference on
status: public
title: PEM fuel cell prognostics using particle filter with model parameter adaptation
type: conference
user_id: '55222'
year: '2014'
...