[{"publication":"Plasma Processes and Polymers","type":"journal_article","status":"public","department":[{"_id":"302"}],"user_id":"48864","_id":"34648","language":[{"iso":"eng"}],"keyword":["Polymers and Plastics","Condensed Matter Physics"],"article_number":"2100174","issue":"4","publication_identifier":{"issn":["1612-8850","1612-8869"]},"publication_status":"published","intvolume":"        19","citation":{"apa":"Hoppe, C., Mitschker, F., Mai, L., Liedke, M. O., Arcos, T., Awakowicz, P., Devi, A., Attallah, A. G., Butterling, M., Wagner, A., &#38; Grundmeier, G. (2022). Influence of surface activation on the microporosity of PE‐CVD and PE‐ALD SiO            <sub>              <i>x</i>            </sub>            thin films on PDMS. <i>Plasma Processes and Polymers</i>, <i>19</i>(4), Article 2100174. <a href=\"https://doi.org/10.1002/ppap.202100174\">https://doi.org/10.1002/ppap.202100174</a>","short":"C. Hoppe, F. Mitschker, L. Mai, M.O. Liedke, T. Arcos, P. Awakowicz, A. Devi, A.G. Attallah, M. Butterling, A. Wagner, G. Grundmeier, Plasma Processes and Polymers 19 (2022).","mla":"Hoppe, Christian, et al. “Influence of Surface Activation on the Microporosity of PE‐CVD and PE‐ALD SiO            <sub>              <i>x</i>            </sub>            Thin Films on PDMS.” <i>Plasma Processes and Polymers</i>, vol. 19, no. 4, 2100174, Wiley, 2022, doi:<a href=\"https://doi.org/10.1002/ppap.202100174\">10.1002/ppap.202100174</a>.","bibtex":"@article{Hoppe_Mitschker_Mai_Liedke_Arcos_Awakowicz_Devi_Attallah_Butterling_Wagner_et al._2022, title={Influence of surface activation on the microporosity of PE‐CVD and PE‐ALD SiO            <sub>              <i>x</i>            </sub>            thin films on PDMS}, volume={19}, DOI={<a href=\"https://doi.org/10.1002/ppap.202100174\">10.1002/ppap.202100174</a>}, number={42100174}, journal={Plasma Processes and Polymers}, publisher={Wiley}, author={Hoppe, Christian and Mitschker, Felix and Mai, Lukas and Liedke, Maciej Oskar and Arcos, Teresa and Awakowicz, Peter and Devi, Anjana and Attallah, Ahmed Gamal and Butterling, Maik and Wagner, Andreas and et al.}, year={2022} }","ieee":"C. Hoppe <i>et al.</i>, “Influence of surface activation on the microporosity of PE‐CVD and PE‐ALD SiO            <sub>              <i>x</i>            </sub>            thin films on PDMS,” <i>Plasma Processes and Polymers</i>, vol. 19, no. 4, Art. no. 2100174, 2022, doi: <a href=\"https://doi.org/10.1002/ppap.202100174\">10.1002/ppap.202100174</a>.","chicago":"Hoppe, Christian, Felix Mitschker, Lukas Mai, Maciej Oskar Liedke, Teresa Arcos, Peter Awakowicz, Anjana Devi, et al. “Influence of Surface Activation on the Microporosity of PE‐CVD and PE‐ALD SiO            <sub>              <i>x</i>            </sub>            Thin Films on PDMS.” <i>Plasma Processes and Polymers</i> 19, no. 4 (2022). <a href=\"https://doi.org/10.1002/ppap.202100174\">https://doi.org/10.1002/ppap.202100174</a>.","ama":"Hoppe C, Mitschker F, Mai L, et al. Influence of surface activation on the microporosity of PE‐CVD and PE‐ALD SiO            <sub>              <i>x</i>            </sub>            thin films on PDMS. <i>Plasma Processes and Polymers</i>. 2022;19(4). doi:<a href=\"https://doi.org/10.1002/ppap.202100174\">10.1002/ppap.202100174</a>"},"year":"2022","volume":19,"date_created":"2022-12-21T09:32:52Z","author":[{"last_name":"Hoppe","id":"27401","full_name":"Hoppe, Christian","first_name":"Christian"},{"first_name":"Felix","last_name":"Mitschker","full_name":"Mitschker, Felix"},{"first_name":"Lukas","last_name":"Mai","full_name":"Mai, Lukas"},{"last_name":"Liedke","full_name":"Liedke, Maciej Oskar","first_name":"Maciej Oskar"},{"full_name":"Arcos, Teresa","last_name":"Arcos","first_name":"Teresa"},{"first_name":"Peter","full_name":"Awakowicz, Peter","last_name":"Awakowicz"},{"first_name":"Anjana","full_name":"Devi, Anjana","last_name":"Devi"},{"last_name":"Attallah","full_name":"Attallah, Ahmed Gamal","first_name":"Ahmed Gamal"},{"last_name":"Butterling","full_name":"Butterling, Maik","first_name":"Maik"},{"last_name":"Wagner","full_name":"Wagner, Andreas","first_name":"Andreas"},{"full_name":"Grundmeier, Guido","id":"194","last_name":"Grundmeier","first_name":"Guido"}],"publisher":"Wiley","date_updated":"2022-12-21T09:33:14Z","doi":"10.1002/ppap.202100174","title":"Influence of surface activation on the microporosity of PE‐CVD and PE‐ALD SiO            <sub>              <i>x</i>            </sub>            thin films on PDMS"},{"title":"Atomic Layer Deposition of Copper Metal Films from Cu(acac)            <sub>2</sub>            and Hydroquinone Reductant","doi":"10.1002/adem.202100446","publisher":"Wiley","date_updated":"2022-12-21T09:31:52Z","volume":23,"author":[{"full_name":"Tripathi, Tripurari Sharan","last_name":"Tripathi","first_name":"Tripurari Sharan"},{"first_name":"Martin","last_name":"Wilken","full_name":"Wilken, Martin"},{"id":"27401","full_name":"Hoppe, Christian","last_name":"Hoppe","first_name":"Christian"},{"last_name":"de los Arcos","full_name":"de los Arcos, Teresa","first_name":"Teresa"},{"id":"194","full_name":"Grundmeier, Guido","last_name":"Grundmeier","first_name":"Guido"},{"full_name":"Devi, Anjana","last_name":"Devi","first_name":"Anjana"},{"first_name":"Maarit","full_name":"Karppinen, Maarit","last_name":"Karppinen"}],"date_created":"2022-12-21T09:30:44Z","year":"2021","intvolume":"        23","citation":{"short":"T.S. Tripathi, M. Wilken, C. Hoppe, T. de los Arcos, G. Grundmeier, A. Devi, M. Karppinen, Advanced Engineering Materials 23 (2021).","mla":"Tripathi, Tripurari Sharan, et al. “Atomic Layer Deposition of Copper Metal Films from Cu(Acac)            <sub>2</sub>            and Hydroquinone Reductant.” <i>Advanced Engineering Materials</i>, vol. 23, no. 10, 2100446, Wiley, 2021, doi:<a href=\"https://doi.org/10.1002/adem.202100446\">10.1002/adem.202100446</a>.","bibtex":"@article{Tripathi_Wilken_Hoppe_de los Arcos_Grundmeier_Devi_Karppinen_2021, title={Atomic Layer Deposition of Copper Metal Films from Cu(acac)            <sub>2</sub>            and Hydroquinone Reductant}, volume={23}, DOI={<a href=\"https://doi.org/10.1002/adem.202100446\">10.1002/adem.202100446</a>}, number={102100446}, journal={Advanced Engineering Materials}, publisher={Wiley}, author={Tripathi, Tripurari Sharan and Wilken, Martin and Hoppe, Christian and de los Arcos, Teresa and Grundmeier, Guido and Devi, Anjana and Karppinen, Maarit}, year={2021} }","apa":"Tripathi, T. S., Wilken, M., Hoppe, C., de los Arcos, T., Grundmeier, G., Devi, A., &#38; Karppinen, M. (2021). Atomic Layer Deposition of Copper Metal Films from Cu(acac)            <sub>2</sub>            and Hydroquinone Reductant. <i>Advanced Engineering Materials</i>, <i>23</i>(10), Article 2100446. <a href=\"https://doi.org/10.1002/adem.202100446\">https://doi.org/10.1002/adem.202100446</a>","ama":"Tripathi TS, Wilken M, Hoppe C, et al. Atomic Layer Deposition of Copper Metal Films from Cu(acac)            <sub>2</sub>            and Hydroquinone Reductant. <i>Advanced Engineering Materials</i>. 2021;23(10). doi:<a href=\"https://doi.org/10.1002/adem.202100446\">10.1002/adem.202100446</a>","chicago":"Tripathi, Tripurari Sharan, Martin Wilken, Christian Hoppe, Teresa de los Arcos, Guido Grundmeier, Anjana Devi, and Maarit Karppinen. “Atomic Layer Deposition of Copper Metal Films from Cu(Acac)            <sub>2</sub>            and Hydroquinone Reductant.” <i>Advanced Engineering Materials</i> 23, no. 10 (2021). <a href=\"https://doi.org/10.1002/adem.202100446\">https://doi.org/10.1002/adem.202100446</a>.","ieee":"T. S. Tripathi <i>et al.</i>, “Atomic Layer Deposition of Copper Metal Films from Cu(acac)            <sub>2</sub>            and Hydroquinone Reductant,” <i>Advanced Engineering Materials</i>, vol. 23, no. 10, Art. no. 2100446, 2021, doi: <a href=\"https://doi.org/10.1002/adem.202100446\">10.1002/adem.202100446</a>."},"publication_identifier":{"issn":["1438-1656","1527-2648"]},"publication_status":"published","issue":"10","keyword":["Condensed Matter Physics","General Materials Science"],"article_number":"2100446","language":[{"iso":"eng"}],"_id":"34645","department":[{"_id":"302"}],"user_id":"48864","status":"public","publication":"Advanced Engineering Materials","type":"journal_article"},{"date_updated":"2022-01-06T06:55:42Z","author":[{"first_name":"Lukas","last_name":"Mai","full_name":"Mai, Lukas"},{"first_name":"David","last_name":"Zanders","full_name":"Zanders, David"},{"first_name":"Ersoy","full_name":"Subaşı, Ersoy","last_name":"Subaşı"},{"first_name":"Engin","full_name":"Ciftyurek, Engin","last_name":"Ciftyurek"},{"first_name":"Christian","last_name":"Hoppe","full_name":"Hoppe, Christian","id":"27401"},{"last_name":"Rogalla","full_name":"Rogalla, Detlef","first_name":"Detlef"},{"last_name":"Gilbert","full_name":"Gilbert, Wolfram","first_name":"Wolfram"},{"first_name":"Teresa de los","last_name":"Arcos","full_name":"Arcos, Teresa de los"},{"first_name":"Klaus","full_name":"Schierbaum, Klaus","last_name":"Schierbaum"},{"first_name":"Guido","last_name":"Grundmeier","id":"194","full_name":"Grundmeier, Guido"},{"full_name":"Bock, Claudia","last_name":"Bock","first_name":"Claudia"},{"full_name":"Devi, Anjana","last_name":"Devi","first_name":"Anjana"}],"date_created":"2021-07-27T14:11:16Z","title":"Low-Temperature Plasma-Enhanced Atomic Layer Deposition of Tin(IV) Oxide from a Functionalized Alkyl Precursor: Fabrication and Evaluation of SnO2-Based Thin-Film Transistor Devices","doi":"10.1021/acsami.8b16443","publication_identifier":{"issn":["1944-8244","1944-8252"]},"publication_status":"published","year":"2019","page":"3169-3180","citation":{"ieee":"L. Mai <i>et al.</i>, “Low-Temperature Plasma-Enhanced Atomic Layer Deposition of Tin(IV) Oxide from a Functionalized Alkyl Precursor: Fabrication and Evaluation of SnO2-Based Thin-Film Transistor Devices,” <i>ACS Applied Materials &#38; Interfaces</i>, pp. 3169–3180, 2019.","chicago":"Mai, Lukas, David Zanders, Ersoy Subaşı, Engin Ciftyurek, Christian Hoppe, Detlef Rogalla, Wolfram Gilbert, et al. “Low-Temperature Plasma-Enhanced Atomic Layer Deposition of Tin(IV) Oxide from a Functionalized Alkyl Precursor: Fabrication and Evaluation of SnO2-Based Thin-Film Transistor Devices.” <i>ACS Applied Materials &#38; Interfaces</i>, 2019, 3169–80. <a href=\"https://doi.org/10.1021/acsami.8b16443\">https://doi.org/10.1021/acsami.8b16443</a>.","ama":"Mai L, Zanders D, Subaşı E, et al. Low-Temperature Plasma-Enhanced Atomic Layer Deposition of Tin(IV) Oxide from a Functionalized Alkyl Precursor: Fabrication and Evaluation of SnO2-Based Thin-Film Transistor Devices. <i>ACS Applied Materials &#38; Interfaces</i>. 2019:3169-3180. doi:<a href=\"https://doi.org/10.1021/acsami.8b16443\">10.1021/acsami.8b16443</a>","mla":"Mai, Lukas, et al. “Low-Temperature Plasma-Enhanced Atomic Layer Deposition of Tin(IV) Oxide from a Functionalized Alkyl Precursor: Fabrication and Evaluation of SnO2-Based Thin-Film Transistor Devices.” <i>ACS Applied Materials &#38; Interfaces</i>, 2019, pp. 3169–80, doi:<a href=\"https://doi.org/10.1021/acsami.8b16443\">10.1021/acsami.8b16443</a>.","bibtex":"@article{Mai_Zanders_Subaşı_Ciftyurek_Hoppe_Rogalla_Gilbert_Arcos_Schierbaum_Grundmeier_et al._2019, title={Low-Temperature Plasma-Enhanced Atomic Layer Deposition of Tin(IV) Oxide from a Functionalized Alkyl Precursor: Fabrication and Evaluation of SnO2-Based Thin-Film Transistor Devices}, DOI={<a href=\"https://doi.org/10.1021/acsami.8b16443\">10.1021/acsami.8b16443</a>}, journal={ACS Applied Materials &#38; Interfaces}, author={Mai, Lukas and Zanders, David and Subaşı, Ersoy and Ciftyurek, Engin and Hoppe, Christian and Rogalla, Detlef and Gilbert, Wolfram and Arcos, Teresa de los and Schierbaum, Klaus and Grundmeier, Guido and et al.}, year={2019}, pages={3169–3180} }","short":"L. Mai, D. Zanders, E. Subaşı, E. Ciftyurek, C. Hoppe, D. Rogalla, W. Gilbert, T. de los Arcos, K. Schierbaum, G. Grundmeier, C. Bock, A. Devi, ACS Applied Materials &#38; Interfaces (2019) 3169–3180.","apa":"Mai, L., Zanders, D., Subaşı, E., Ciftyurek, E., Hoppe, C., Rogalla, D., … Devi, A. (2019). Low-Temperature Plasma-Enhanced Atomic Layer Deposition of Tin(IV) Oxide from a Functionalized Alkyl Precursor: Fabrication and Evaluation of SnO2-Based Thin-Film Transistor Devices. <i>ACS Applied Materials &#38; Interfaces</i>, 3169–3180. <a href=\"https://doi.org/10.1021/acsami.8b16443\">https://doi.org/10.1021/acsami.8b16443</a>"},"_id":"22833","user_id":"194","language":[{"iso":"eng"}],"publication":"ACS Applied Materials & Interfaces","type":"journal_article","status":"public"},{"doi":"10.1002/ppap.201700209","title":"A combinatorial approach to enhance barrier properties of thin films on polymers: Seeding and capping of PECVD thin films by PEALD","date_created":"2021-07-27T14:13:58Z","author":[{"full_name":"Gebhard, Maximilian","last_name":"Gebhard","first_name":"Maximilian"},{"first_name":"Felix","full_name":"Mitschker, Felix","last_name":"Mitschker"},{"first_name":"Christian","id":"27401","full_name":"Hoppe, Christian","last_name":"Hoppe"},{"first_name":"Morteza","full_name":"Aghaee, Morteza","last_name":"Aghaee"},{"full_name":"Rogalla, Detlef","last_name":"Rogalla","first_name":"Detlef"},{"full_name":"Creatore, Mariadriana","last_name":"Creatore","first_name":"Mariadriana"},{"first_name":"Guido","last_name":"Grundmeier","id":"194","full_name":"Grundmeier, Guido"},{"full_name":"Awakowicz, Peter","last_name":"Awakowicz","first_name":"Peter"},{"first_name":"Anjana","full_name":"Devi, Anjana","last_name":"Devi"}],"date_updated":"2022-01-06T06:55:42Z","citation":{"ama":"Gebhard M, Mitschker F, Hoppe C, et al. A combinatorial approach to enhance barrier properties of thin films on polymers: Seeding and capping of PECVD thin films by PEALD. <i>Plasma Processes and Polymers</i>. 2018. doi:<a href=\"https://doi.org/10.1002/ppap.201700209\">10.1002/ppap.201700209</a>","chicago":"Gebhard, Maximilian, Felix Mitschker, Christian Hoppe, Morteza Aghaee, Detlef Rogalla, Mariadriana Creatore, Guido Grundmeier, Peter Awakowicz, and Anjana Devi. “A Combinatorial Approach to Enhance Barrier Properties of Thin Films on Polymers: Seeding and Capping of PECVD Thin Films by PEALD.” <i>Plasma Processes and Polymers</i>, 2018. <a href=\"https://doi.org/10.1002/ppap.201700209\">https://doi.org/10.1002/ppap.201700209</a>.","ieee":"M. Gebhard <i>et al.</i>, “A combinatorial approach to enhance barrier properties of thin films on polymers: Seeding and capping of PECVD thin films by PEALD,” <i>Plasma Processes and Polymers</i>, 2018.","apa":"Gebhard, M., Mitschker, F., Hoppe, C., Aghaee, M., Rogalla, D., Creatore, M., … Devi, A. (2018). A combinatorial approach to enhance barrier properties of thin films on polymers: Seeding and capping of PECVD thin films by PEALD. <i>Plasma Processes and Polymers</i>. <a href=\"https://doi.org/10.1002/ppap.201700209\">https://doi.org/10.1002/ppap.201700209</a>","bibtex":"@article{Gebhard_Mitschker_Hoppe_Aghaee_Rogalla_Creatore_Grundmeier_Awakowicz_Devi_2018, title={A combinatorial approach to enhance barrier properties of thin films on polymers: Seeding and capping of PECVD thin films by PEALD}, DOI={<a href=\"https://doi.org/10.1002/ppap.201700209\">10.1002/ppap.201700209</a>}, number={1700209}, journal={Plasma Processes and Polymers}, author={Gebhard, Maximilian and Mitschker, Felix and Hoppe, Christian and Aghaee, Morteza and Rogalla, Detlef and Creatore, Mariadriana and Grundmeier, Guido and Awakowicz, Peter and Devi, Anjana}, year={2018} }","short":"M. Gebhard, F. Mitschker, C. Hoppe, M. Aghaee, D. Rogalla, M. Creatore, G. Grundmeier, P. Awakowicz, A. Devi, Plasma Processes and Polymers (2018).","mla":"Gebhard, Maximilian, et al. “A Combinatorial Approach to Enhance Barrier Properties of Thin Films on Polymers: Seeding and Capping of PECVD Thin Films by PEALD.” <i>Plasma Processes and Polymers</i>, 1700209, 2018, doi:<a href=\"https://doi.org/10.1002/ppap.201700209\">10.1002/ppap.201700209</a>."},"year":"2018","publication_status":"published","publication_identifier":{"issn":["1612-8850"]},"language":[{"iso":"eng"}],"article_number":"1700209","user_id":"194","_id":"22839","status":"public","type":"journal_article","publication":"Plasma Processes and Polymers"},{"title":"Influence of organic surface chemistry on the nucleation of plasma deposited SiOxfilms","doi":"10.1088/1361-6463/aa69e5","date_updated":"2022-01-06T06:55:42Z","author":[{"last_name":"Hoppe","id":"27401","full_name":"Hoppe, Christian","first_name":"Christian"},{"last_name":"Mitschker","full_name":"Mitschker, F","first_name":"F"},{"full_name":"Giner, I","last_name":"Giner","first_name":"I"},{"first_name":"T","last_name":"de los Arcos","full_name":"de los Arcos, T"},{"last_name":"Awakowicz","full_name":"Awakowicz, P","first_name":"P"},{"last_name":"Grundmeier","full_name":"Grundmeier, Guido","id":"194","first_name":"Guido"}],"date_created":"2021-07-27T14:19:04Z","year":"2017","citation":{"apa":"Hoppe, C., Mitschker, F., Giner, I., de los Arcos, T., Awakowicz, P., &#38; Grundmeier, G. (2017). Influence of organic surface chemistry on the nucleation of plasma deposited SiOxfilms. <i>Journal of Physics D: Applied Physics</i>. <a href=\"https://doi.org/10.1088/1361-6463/aa69e5\">https://doi.org/10.1088/1361-6463/aa69e5</a>","bibtex":"@article{Hoppe_Mitschker_Giner_de los Arcos_Awakowicz_Grundmeier_2017, title={Influence of organic surface chemistry on the nucleation of plasma deposited SiOxfilms}, DOI={<a href=\"https://doi.org/10.1088/1361-6463/aa69e5\">10.1088/1361-6463/aa69e5</a>}, number={204002}, journal={Journal of Physics D: Applied Physics}, author={Hoppe, Christian and Mitschker, F and Giner, I and de los Arcos, T and Awakowicz, P and Grundmeier, Guido}, year={2017} }","short":"C. Hoppe, F. Mitschker, I. Giner, T. de los Arcos, P. Awakowicz, G. Grundmeier, Journal of Physics D: Applied Physics (2017).","mla":"Hoppe, Christian, et al. “Influence of Organic Surface Chemistry on the Nucleation of Plasma Deposited SiOxfilms.” <i>Journal of Physics D: Applied Physics</i>, 204002, 2017, doi:<a href=\"https://doi.org/10.1088/1361-6463/aa69e5\">10.1088/1361-6463/aa69e5</a>.","ieee":"C. Hoppe, F. Mitschker, I. Giner, T. de los Arcos, P. Awakowicz, and G. Grundmeier, “Influence of organic surface chemistry on the nucleation of plasma deposited SiOxfilms,” <i>Journal of Physics D: Applied Physics</i>, 2017.","chicago":"Hoppe, Christian, F Mitschker, I Giner, T de los Arcos, P Awakowicz, and Guido Grundmeier. “Influence of Organic Surface Chemistry on the Nucleation of Plasma Deposited SiOxfilms.” <i>Journal of Physics D: Applied Physics</i>, 2017. <a href=\"https://doi.org/10.1088/1361-6463/aa69e5\">https://doi.org/10.1088/1361-6463/aa69e5</a>.","ama":"Hoppe C, Mitschker F, Giner I, de los Arcos T, Awakowicz P, Grundmeier G. Influence of organic surface chemistry on the nucleation of plasma deposited SiOxfilms. <i>Journal of Physics D: Applied Physics</i>. 2017. doi:<a href=\"https://doi.org/10.1088/1361-6463/aa69e5\">10.1088/1361-6463/aa69e5</a>"},"publication_status":"published","publication_identifier":{"issn":["0022-3727","1361-6463"]},"article_number":"204002","language":[{"iso":"eng"}],"_id":"22849","user_id":"194","status":"public","type":"journal_article","publication":"Journal of Physics D: Applied Physics"},{"external_id":{"isi":["000382984300008"]},"language":[{"iso":"eng"}],"publication":"ADVANCED ENGINEERING MATERIALS","abstract":[{"lang":"eng","text":"The influence of a chemical or mechanical surface modification followed by different post-heat treatments on the bond strength of galvanized steel/ aluminum composites is studied. An incremental rolling process is used for joint formation based on plastic deformation. The morphology, the chemical state of the modified surfaces as well as the cross-section, and local potential distribution of the welded zone is characterized by different microscopic and spectroscopic methods. The stability of the joint is analyzed by a shear-force test in combination with microscopic failure analysis. A clear correlation between pre/post-treatment and the joint strength is observed."}],"date_created":"2021-01-13T10:12:46Z","title":"Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation","quality_controlled":"1","issue":"8","year":"2016","_id":"20941","user_id":"7266","department":[{"_id":"35"},{"_id":"302"},{"_id":"321"}],"isi":"1","type":"journal_article","status":"public","date_updated":"2022-01-06T06:54:41Z","author":[{"first_name":"Christian","id":"27401","full_name":"Hoppe, Christian","last_name":"Hoppe"},{"first_name":"Christoph","full_name":"Ebbert, Christoph","id":"7266","last_name":"Ebbert"},{"first_name":"Richard","last_name":"Grothe","full_name":"Grothe, Richard"},{"full_name":"Schmidt, Hans Christian","last_name":"Schmidt","first_name":"Hans Christian"},{"full_name":"Hordych, Illia","last_name":"Hordych","first_name":"Illia"},{"first_name":"Werner","last_name":"Homberg","full_name":"Homberg, Werner"},{"full_name":"Maier, Hans Juergen","last_name":"Maier","first_name":"Hans Juergen"},{"full_name":"Grundmeier, Guido","id":"194","last_name":"Grundmeier","first_name":"Guido"}],"volume":18,"doi":"10.1002/adem.201600085","publication_status":"published","publication_identifier":{"issn":["1438-1656"],"eissn":["1527-2648"]},"citation":{"mla":"Hoppe, Christian, et al. “Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation.” <i>ADVANCED ENGINEERING MATERIALS</i>, vol. 18, no. 8, 2016, pp. 1371–80, doi:<a href=\"https://doi.org/10.1002/adem.201600085\">10.1002/adem.201600085</a>.","bibtex":"@article{Hoppe_Ebbert_Grothe_Schmidt_Hordych_Homberg_Maier_Grundmeier_2016, title={Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation}, volume={18}, DOI={<a href=\"https://doi.org/10.1002/adem.201600085\">10.1002/adem.201600085</a>}, number={8}, journal={ADVANCED ENGINEERING MATERIALS}, author={Hoppe, Christian and Ebbert, Christoph and Grothe, Richard and Schmidt, Hans Christian and Hordych, Illia and Homberg, Werner and Maier, Hans Juergen and Grundmeier, Guido}, year={2016}, pages={1371–1380} }","short":"C. Hoppe, C. Ebbert, R. Grothe, H.C. Schmidt, I. Hordych, W. Homberg, H.J. Maier, G. Grundmeier, ADVANCED ENGINEERING MATERIALS 18 (2016) 1371–1380.","apa":"Hoppe, C., Ebbert, C., Grothe, R., Schmidt, H. C., Hordych, I., Homberg, W., … Grundmeier, G. (2016). Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation. <i>ADVANCED ENGINEERING MATERIALS</i>, <i>18</i>(8), 1371–1380. <a href=\"https://doi.org/10.1002/adem.201600085\">https://doi.org/10.1002/adem.201600085</a>","chicago":"Hoppe, Christian, Christoph Ebbert, Richard Grothe, Hans Christian Schmidt, Illia Hordych, Werner Homberg, Hans Juergen Maier, and Guido Grundmeier. “Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation.” <i>ADVANCED ENGINEERING MATERIALS</i> 18, no. 8 (2016): 1371–80. <a href=\"https://doi.org/10.1002/adem.201600085\">https://doi.org/10.1002/adem.201600085</a>.","ieee":"C. Hoppe <i>et al.</i>, “Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation,” <i>ADVANCED ENGINEERING MATERIALS</i>, vol. 18, no. 8, pp. 1371–1380, 2016.","ama":"Hoppe C, Ebbert C, Grothe R, et al. Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation. <i>ADVANCED ENGINEERING MATERIALS</i>. 2016;18(8):1371-1380. doi:<a href=\"https://doi.org/10.1002/adem.201600085\">10.1002/adem.201600085</a>"},"intvolume":"        18","page":"1371-1380"},{"abstract":[{"text":"Interface modification based on ultra-thin mercapto-propyl(trimethoxy) silane (MPTMS) films is shown to promote joining of copper and aluminum by plastic deformation followed by a heat treatment. The surface morphology and the surface chemistry of the metal substrates were analyzed by means of FE-SEM, XPS, and FT-IRRAS. The spectroscopic data show that the MPTMS film is crosslinked via Si-O-Si bonds and that stable Cu-S and Si-O-Al interfacial bonds are formed. The shear-force tests of the joints led to force displacement curves that are characteristic for a covalently bonded interface. Complementary cross sectional SEM and EDS analysis of the joint proved that a defect-free interface was formed without any measureable interdiffusion of metals across the interface or cracking of an oxide films.","lang":"eng"}],"publication":"ADVANCED ENGINEERING MATERIALS","language":[{"iso":"eng"}],"external_id":{"isi":["000378684200023"]},"year":"2016","issue":"6","quality_controlled":"1","title":"Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation","date_created":"2021-01-13T10:12:47Z","status":"public","type":"journal_article","isi":"1","department":[{"_id":"35"},{"_id":"302"},{"_id":"321"}],"user_id":"7266","_id":"20942","intvolume":"        18","page":"1066-1074","citation":{"ama":"Hoppe C, Ebbert C, Voigt M, et al. Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation. <i>ADVANCED ENGINEERING MATERIALS</i>. 2016;18(6):1066-1074. doi:<a href=\"https://doi.org/10.1002/adem.201500501\">10.1002/adem.201500501</a>","chicago":"Hoppe, Christian, Christoph Ebbert, Markus Voigt, Hans Christian Schmidt, Dmytro Rodman, Werner Homberg, Hans Juergen Maier, and Guido Grundmeier. “Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation.” <i>ADVANCED ENGINEERING MATERIALS</i> 18, no. 6 (2016): 1066–74. <a href=\"https://doi.org/10.1002/adem.201500501\">https://doi.org/10.1002/adem.201500501</a>.","ieee":"C. Hoppe <i>et al.</i>, “Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation,” <i>ADVANCED ENGINEERING MATERIALS</i>, vol. 18, no. 6, pp. 1066–1074, 2016.","apa":"Hoppe, C., Ebbert, C., Voigt, M., Schmidt, H. C., Rodman, D., Homberg, W., … Grundmeier, G. (2016). Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation. <i>ADVANCED ENGINEERING MATERIALS</i>, <i>18</i>(6), 1066–1074. <a href=\"https://doi.org/10.1002/adem.201500501\">https://doi.org/10.1002/adem.201500501</a>","short":"C. Hoppe, C. Ebbert, M. Voigt, H.C. Schmidt, D. Rodman, W. Homberg, H.J. Maier, G. Grundmeier, ADVANCED ENGINEERING MATERIALS 18 (2016) 1066–1074.","bibtex":"@article{Hoppe_Ebbert_Voigt_Schmidt_Rodman_Homberg_Maier_Grundmeier_2016, title={Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation}, volume={18}, DOI={<a href=\"https://doi.org/10.1002/adem.201500501\">10.1002/adem.201500501</a>}, number={6}, journal={ADVANCED ENGINEERING MATERIALS}, author={Hoppe, Christian and Ebbert, Christoph and Voigt, Markus and Schmidt, Hans Christian and Rodman, Dmytro and Homberg, Werner and Maier, Hans Juergen and Grundmeier, Guido}, year={2016}, pages={1066–1074} }","mla":"Hoppe, Christian, et al. “Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation.” <i>ADVANCED ENGINEERING MATERIALS</i>, vol. 18, no. 6, 2016, pp. 1066–74, doi:<a href=\"https://doi.org/10.1002/adem.201500501\">10.1002/adem.201500501</a>."},"publication_identifier":{"eissn":["1527-2648"],"issn":["1438-1656"]},"publication_status":"published","doi":"10.1002/adem.201500501","volume":18,"author":[{"full_name":"Hoppe, Christian","id":"27401","last_name":"Hoppe","first_name":"Christian"},{"first_name":"Christoph","id":"7266","full_name":"Ebbert, Christoph","last_name":"Ebbert"},{"first_name":"Markus","last_name":"Voigt","full_name":"Voigt, Markus"},{"first_name":"Hans Christian","full_name":"Schmidt, Hans Christian","last_name":"Schmidt"},{"first_name":"Dmytro","full_name":"Rodman, Dmytro","last_name":"Rodman"},{"first_name":"Werner","last_name":"Homberg","full_name":"Homberg, Werner"},{"last_name":"Maier","full_name":"Maier, Hans Juergen","first_name":"Hans Juergen"},{"first_name":"Guido","last_name":"Grundmeier","id":"194","full_name":"Grundmeier, Guido"}],"date_updated":"2022-01-06T06:54:41Z"},{"language":[{"iso":"eng"}],"_id":"22854","user_id":"194","status":"public","publication":"steel research international","type":"journal_article","title":"Effect of Pre-Rolling Heat Treatments on the Bond Strength of Cladded Galvanized Steels in a Cold Roll Bonding Process","doi":"10.1002/srin.201600021","date_updated":"2022-01-06T06:55:42Z","date_created":"2021-07-27T14:21:02Z","author":[{"first_name":"Illia","full_name":"Hordych, Illia","last_name":"Hordych"},{"last_name":"Rodman","full_name":"Rodman, Dmytro","first_name":"Dmytro"},{"full_name":"Nürnberger, Florian","last_name":"Nürnberger","first_name":"Florian"},{"first_name":"Christian","last_name":"Hoppe","full_name":"Hoppe, Christian","id":"27401"},{"first_name":"Hans Christian","last_name":"Schmidt","full_name":"Schmidt, Hans Christian"},{"first_name":"Guido","id":"194","full_name":"Grundmeier, Guido","last_name":"Grundmeier"},{"first_name":"Werner","last_name":"Homberg","full_name":"Homberg, Werner"},{"last_name":"Maier","full_name":"Maier, Hans Jürgen","first_name":"Hans Jürgen"}],"year":"2016","page":"1619-1626","citation":{"ama":"Hordych I, Rodman D, Nürnberger F, et al. Effect of Pre-Rolling Heat Treatments on the Bond Strength of Cladded Galvanized Steels in a Cold Roll Bonding Process. <i>steel research international</i>. 2016:1619-1626. doi:<a href=\"https://doi.org/10.1002/srin.201600021\">10.1002/srin.201600021</a>","chicago":"Hordych, Illia, Dmytro Rodman, Florian Nürnberger, Christian Hoppe, Hans Christian Schmidt, Guido Grundmeier, Werner Homberg, and Hans Jürgen Maier. “Effect of Pre-Rolling Heat Treatments on the Bond Strength of Cladded Galvanized Steels in a Cold Roll Bonding Process.” <i>Steel Research International</i>, 2016, 1619–26. <a href=\"https://doi.org/10.1002/srin.201600021\">https://doi.org/10.1002/srin.201600021</a>.","ieee":"I. Hordych <i>et al.</i>, “Effect of Pre-Rolling Heat Treatments on the Bond Strength of Cladded Galvanized Steels in a Cold Roll Bonding Process,” <i>steel research international</i>, pp. 1619–1626, 2016.","mla":"Hordych, Illia, et al. “Effect of Pre-Rolling Heat Treatments on the Bond Strength of Cladded Galvanized Steels in a Cold Roll Bonding Process.” <i>Steel Research International</i>, 2016, pp. 1619–26, doi:<a href=\"https://doi.org/10.1002/srin.201600021\">10.1002/srin.201600021</a>.","short":"I. Hordych, D. Rodman, F. Nürnberger, C. Hoppe, H.C. Schmidt, G. Grundmeier, W. Homberg, H.J. Maier, Steel Research International (2016) 1619–1626.","bibtex":"@article{Hordych_Rodman_Nürnberger_Hoppe_Schmidt_Grundmeier_Homberg_Maier_2016, title={Effect of Pre-Rolling Heat Treatments on the Bond Strength of Cladded Galvanized Steels in a Cold Roll Bonding Process}, DOI={<a href=\"https://doi.org/10.1002/srin.201600021\">10.1002/srin.201600021</a>}, journal={steel research international}, author={Hordych, Illia and Rodman, Dmytro and Nürnberger, Florian and Hoppe, Christian and Schmidt, Hans Christian and Grundmeier, Guido and Homberg, Werner and Maier, Hans Jürgen}, year={2016}, pages={1619–1626} }","apa":"Hordych, I., Rodman, D., Nürnberger, F., Hoppe, C., Schmidt, H. C., Grundmeier, G., … Maier, H. J. (2016). Effect of Pre-Rolling Heat Treatments on the Bond Strength of Cladded Galvanized Steels in a Cold Roll Bonding Process. <i>Steel Research International</i>, 1619–1626. <a href=\"https://doi.org/10.1002/srin.201600021\">https://doi.org/10.1002/srin.201600021</a>"},"publication_identifier":{"issn":["1611-3683"]},"publication_status":"published"},{"date_updated":"2022-01-06T06:55:42Z","date_created":"2021-07-27T14:22:33Z","author":[{"last_name":"Schmidt","full_name":"Schmidt, Hans Christian","first_name":"Hans Christian"},{"last_name":"Homberg","full_name":"Homberg, Werner","first_name":"Werner"},{"last_name":"Hoppe","id":"27401","full_name":"Hoppe, Christian","first_name":"Christian"},{"first_name":"Guido","id":"194","full_name":"Grundmeier, Guido","last_name":"Grundmeier"},{"first_name":"Illia","full_name":"Hordych, Illia","last_name":"Hordych"},{"first_name":"Hans Jürgen","full_name":"Maier, Hans Jürgen","last_name":"Maier"}],"title":"Cold pressure welding by incremental rolling: Deformation zone analysis","doi":"10.1063/1.4963507","publication_status":"published","year":"2016","citation":{"ieee":"H. C. Schmidt, W. Homberg, C. Hoppe, G. Grundmeier, I. Hordych, and H. J. Maier, “Cold pressure welding by incremental rolling: Deformation zone analysis,” 2016.","chicago":"Schmidt, Hans Christian, Werner Homberg, Christian Hoppe, Guido Grundmeier, Illia Hordych, and Hans Jürgen Maier. “Cold Pressure Welding by Incremental Rolling: Deformation Zone Analysis,” 2016. <a href=\"https://doi.org/10.1063/1.4963507\">https://doi.org/10.1063/1.4963507</a>.","ama":"Schmidt HC, Homberg W, Hoppe C, Grundmeier G, Hordych I, Maier HJ. Cold pressure welding by incremental rolling: Deformation zone analysis. In: ; 2016. doi:<a href=\"https://doi.org/10.1063/1.4963507\">10.1063/1.4963507</a>","bibtex":"@inproceedings{Schmidt_Homberg_Hoppe_Grundmeier_Hordych_Maier_2016, title={Cold pressure welding by incremental rolling: Deformation zone analysis}, DOI={<a href=\"https://doi.org/10.1063/1.4963507\">10.1063/1.4963507</a>}, author={Schmidt, Hans Christian and Homberg, Werner and Hoppe, Christian and Grundmeier, Guido and Hordych, Illia and Maier, Hans Jürgen}, year={2016} }","short":"H.C. Schmidt, W. Homberg, C. Hoppe, G. Grundmeier, I. Hordych, H.J. Maier, in: 2016.","mla":"Schmidt, Hans Christian, et al. <i>Cold Pressure Welding by Incremental Rolling: Deformation Zone Analysis</i>. 2016, doi:<a href=\"https://doi.org/10.1063/1.4963507\">10.1063/1.4963507</a>.","apa":"Schmidt, H. C., Homberg, W., Hoppe, C., Grundmeier, G., Hordych, I., &#38; Maier, H. J. (2016). Cold pressure welding by incremental rolling: Deformation zone analysis. <a href=\"https://doi.org/10.1063/1.4963507\">https://doi.org/10.1063/1.4963507</a>"},"_id":"22858","user_id":"194","language":[{"iso":"eng"}],"type":"conference","status":"public"}]