[{"title":"100 Gbps Wireless System and Circuit Design Using Parallel Spread-Spectrum Sequencing","year":"2017","status":"public","author":[{"first_name":"Christoph","last_name":"Scheytt","full_name":"Scheytt, Christoph","id":"37144"},{"first_name":"Abdul Rehman","last_name":"Javed","full_name":"Javed, Abdul Rehman"},{"full_name":"Bammidi, Eswara Rao","last_name":"Bammidi","first_name":"Eswara Rao"},{"last_name":"KrishneGowda","first_name":"Karthik","full_name":"KrishneGowda, Karthik"},{"full_name":"Kallfass, Ingmar","last_name":"Kallfass","first_name":"Ingmar"},{"first_name":"Rolf","last_name":"Kraemer","full_name":"Kraemer, Rolf"}],"date_updated":"2022-01-06T06:56:13Z","page":"399-414","language":[{"iso":"eng"}],"_id":"24216","user_id":"15931","volume":"71 ","publication":"Frequenz* Journal of RF-Engineering and Telecommunications","issue":"9-10","citation":{"apa":"Scheytt, C., Javed, A. R., Bammidi, E. R., KrishneGowda, K., Kallfass, I., &#38; Kraemer, R. (2017). 100 Gbps Wireless System and Circuit Design Using Parallel Spread-Spectrum Sequencing. <i>Frequenz* Journal of RF-Engineering and Telecommunications</i>, <i>71</i>(9–10), 399–414.","ieee":"C. Scheytt, A. R. Javed, E. R. Bammidi, K. KrishneGowda, I. Kallfass, and R. Kraemer, “100 Gbps Wireless System and Circuit Design Using Parallel Spread-Spectrum Sequencing,” <i>Frequenz* Journal of RF-Engineering and Telecommunications</i>, vol. 71, no. 9–10, pp. 399–414, 2017.","short":"C. Scheytt, A.R. Javed, E.R. Bammidi, K. KrishneGowda, I. Kallfass, R. Kraemer, Frequenz* Journal of RF-Engineering and Telecommunications 71 (2017) 399–414.","chicago":"Scheytt, Christoph, Abdul Rehman Javed, Eswara Rao Bammidi, Karthik KrishneGowda, Ingmar Kallfass, and Rolf Kraemer. “100 Gbps Wireless System and Circuit Design Using Parallel Spread-Spectrum Sequencing.” <i>Frequenz* Journal of RF-Engineering and Telecommunications</i> 71, no. 9–10 (2017): 399–414.","mla":"Scheytt, Christoph, et al. “100 Gbps Wireless System and Circuit Design Using Parallel Spread-Spectrum Sequencing.” <i>Frequenz* Journal of RF-Engineering and Telecommunications</i>, vol. 71, no. 9–10, 2017, pp. 399–414.","ama":"Scheytt C, Javed AR, Bammidi ER, KrishneGowda K, Kallfass I, Kraemer R. 100 Gbps Wireless System and Circuit Design Using Parallel Spread-Spectrum Sequencing. <i>Frequenz* Journal of RF-Engineering and Telecommunications</i>. 2017;71(9-10):399-414.","bibtex":"@article{Scheytt_Javed_Bammidi_KrishneGowda_Kallfass_Kraemer_2017, title={100 Gbps Wireless System and Circuit Design Using Parallel Spread-Spectrum Sequencing}, volume={71}, number={9–10}, journal={Frequenz* Journal of RF-Engineering and Telecommunications}, author={Scheytt, Christoph and Javed, Abdul Rehman and Bammidi, Eswara Rao and KrishneGowda, Karthik and Kallfass, Ingmar and Kraemer, Rolf}, year={2017}, pages={399–414} }"},"abstract":[{"lang":"eng","text":"In this article mixed analog/digital signal processing techniques based on parallel spread-spectrum sequencing (PSSS) and radio frequency (RF) carrier synchronization for ultra-broadband wireless communication are investigated on system and circuit level."}],"related_material":{"link":[{"relation":"confirmation","url":"https://doi.org/10.1515/freq-2017-0174"}]},"date_created":"2021-09-13T08:20:30Z","type":"journal_article","department":[{"_id":"58"}]},{"citation":{"ieee":"A. R. Javed, C. Scheytt, K. Karthik, and R. Kramer, “System design of a mixed signal PSSS transdeiver using a linear ultra-broadband analog correlator for the receiver baseband designed in 130nm SiGe BiCMOS technology,” in <i>IEEE EUROCON 2017-17th International Conference on Smart Technologies</i>, 2017, pp. 228–233, doi: <a href=\"https://doi.org/10.1109/EUROCON.2017.8011110\">10.1109/EUROCON.2017.8011110</a>.","apa":"Javed, A. R., Scheytt, C., Karthik, K., &#38; Kramer, R. (2017). System design of a mixed signal PSSS transdeiver using a linear ultra-broadband analog correlator for the receiver baseband designed in 130nm SiGe BiCMOS technology. <i>IEEE EUROCON 2017-17th International Conference on Smart Technologies</i>, 228–233. <a href=\"https://doi.org/10.1109/EUROCON.2017.8011110\">https://doi.org/10.1109/EUROCON.2017.8011110</a>","chicago":"Javed, Abdul Rehman, Christoph Scheytt, KrishneGowda Karthik, and Roland Kramer. “System Design of a Mixed Signal PSSS Transdeiver Using a Linear Ultra-Broadband Analog Correlator for the Receiver Baseband Designed in 130nm SiGe BiCMOS Technology.” In <i>IEEE EUROCON 2017-17th International Conference on Smart Technologies</i>, 228–33. 17th International Conference on Smart Technologies, 2017. <a href=\"https://doi.org/10.1109/EUROCON.2017.8011110\">https://doi.org/10.1109/EUROCON.2017.8011110</a>.","short":"A.R. Javed, C. Scheytt, K. Karthik, R. Kramer, in: IEEE EUROCON 2017-17th International Conference on Smart Technologies, 2017, pp. 228–233.","mla":"Javed, Abdul Rehman, et al. “System Design of a Mixed Signal PSSS Transdeiver Using a Linear Ultra-Broadband Analog Correlator for the Receiver Baseband Designed in 130nm SiGe BiCMOS Technology.” <i>IEEE EUROCON 2017-17th International Conference on Smart Technologies</i>, 2017, pp. 228–33, doi:<a href=\"https://doi.org/10.1109/EUROCON.2017.8011110\">10.1109/EUROCON.2017.8011110</a>.","bibtex":"@inproceedings{Javed_Scheytt_Karthik_Kramer_2017, series={17th International Conference on Smart Technologies}, title={System design of a mixed signal PSSS transdeiver using a linear ultra-broadband analog correlator for the receiver baseband designed in 130nm SiGe BiCMOS technology}, DOI={<a href=\"https://doi.org/10.1109/EUROCON.2017.8011110\">10.1109/EUROCON.2017.8011110</a>}, booktitle={IEEE EUROCON 2017-17th International Conference on Smart Technologies}, author={Javed, Abdul Rehman and Scheytt, Christoph and Karthik, KrishneGowda and Kramer, Roland}, year={2017}, pages={228–233}, collection={17th International Conference on Smart Technologies} }","ama":"Javed AR, Scheytt C, Karthik K, Kramer R. System design of a mixed signal PSSS transdeiver using a linear ultra-broadband analog correlator for the receiver baseband designed in 130nm SiGe BiCMOS technology. In: <i>IEEE EUROCON 2017-17th International Conference on Smart Technologies</i>. 17th International Conference on Smart Technologies. ; 2017:228-233. doi:<a href=\"https://doi.org/10.1109/EUROCON.2017.8011110\">10.1109/EUROCON.2017.8011110</a>"},"publication":"IEEE EUROCON 2017-17th International Conference on Smart Technologies","abstract":[{"text":"Parallel Sequence Spread Spectrum (PSSS) is a physical layer (PHY) baseband technology that is well suited for mixed-signal transceiver implementation for high data rate wireless communication systems. Mixed signal baseband realization allows for easier implementation of the channel equalization function and eliminates the need for high speed data converters. System design and architecture of a mixed signal baseband processor for 100 Gbps wireless communication is described that reduces the implementation complexity and results in a consequent reduction in power dissipation and chip area. An ultra-broadband analog correlator consisting of a four-quadrant multiplier and a fast resettable integrator using only NPN transistors was designed, fabricated, and measured. The correlator circuit is the core component of the receiver baseband. To the best knowledge of the authors, it is the fastest correlator circuit published so far.","lang":"eng"}],"related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/8011110"}]},"date_created":"2021-09-13T08:20:31Z","department":[{"_id":"58"}],"type":"conference","publication_identifier":{"isbn":["978-1-5090-3844-2"],"eisbn":["978-1-5090-3843-5"]},"author":[{"full_name":"Javed, Abdul Rehman","last_name":"Javed","first_name":"Abdul Rehman"},{"id":"37144","first_name":"Christoph","last_name":"Scheytt","full_name":"Scheytt, Christoph"},{"last_name":"Karthik","first_name":"KrishneGowda","full_name":"Karthik, KrishneGowda"},{"first_name":"Roland","last_name":"Kramer","full_name":"Kramer, Roland"}],"year":"2017","title":"System design of a mixed signal PSSS transdeiver using a linear ultra-broadband analog correlator for the receiver baseband designed in 130nm SiGe BiCMOS technology","status":"public","date_updated":"2022-01-06T06:56:13Z","_id":"24217","language":[{"iso":"eng"}],"series_title":"17th International Conference on Smart Technologies","page":"228-233","user_id":"15931","doi":"10.1109/EUROCON.2017.8011110"},{"_id":"24218","user_id":"15931","publication_date":"17.01.2019","author":[{"full_name":"Scheytt, Christoph","last_name":"Scheytt","first_name":"Christoph","id":"37144"}],"title":"Folge-Halte-Schaltung ","year":"2017","status":"public","ipn":"DE102017116001A1","date_updated":"2022-01-06T06:56:13Z","date_created":"2021-09-13T08:20:32Z","application_number":"102017116001","department":[{"_id":"58"}],"type":"patent","citation":{"ieee":"C. Scheytt, “Folge-Halte-Schaltung .” 2017.","apa":"Scheytt, C. (2017). <i>Folge-Halte-Schaltung </i>.","short":"C. Scheytt, (2017).","chicago":"Scheytt, Christoph. “Folge-Halte-Schaltung ,” 2017.","mla":"Scheytt, Christoph. <i>Folge-Halte-Schaltung </i>. 2017.","bibtex":"@article{Scheytt_2017, title={Folge-Halte-Schaltung }, author={Scheytt, Christoph}, year={2017} }","ama":"Scheytt C. Folge-Halte-Schaltung . Published online 2017."},"application_date":"17.07.2017","ipc":"H03K3/42","abstract":[{"lang":"ger","text":" Die Erfindung betrifft eine Folge-Halte-Schaltung zum Konvertieren eines analogen Eingangssignals in ein digitales Ausgangssignal mit einer Haltekapazitätseinheit, mit einer Spannungsverstärkereinheit enthaltend einen Eingang, an dem ein analoges Eingangsspannungssignal anlegbar ist, und enthaltend einen Ausgang, der mit der Haltekapazitätseinheit verbunden ist, mit einer Arbeitspunkteinstelleinheit zur Steuerung der Spannungsverstärkereinheit, wobei an einem Eingang der Arbeitspunkteinstelleinheit ein Steuersignal anliegt, so dass in einem Folgebetrieb der Folge-Halte-Schaltung eine an dem Ausgang der Spannungsverstärkereinheit anliegendes Ausgangssignal einen an den Eingang der Spannungsverstärkereinheit anliegendes Eingangssignal folgt, und in einem Haltebetrieb der Folge-Halte-Schaltung das Ausgangssignal der Spannungsverstärkereinheit konstant ist, mit einer Taktsignalquelle zur Erzeugung einer Folge von einem Eingang der Arbeitspunkteinstelleinheit anliegenden Taktsignalen, wobei die Arbeitspunkteinstelleinheit elektrooptische Mittel zur Erzeugung des Steuersignals aufweist, dass die Taktsignalquelle als eine optische Taktsignalquelle ausgebildet ist, so dass als Taktsignal eine optische Impulsfolge mit hohen und tiefen Taktsignalen an den Eingang der Arbeitspunkteinstelleinheit anliegt. "}],"related_material":{"link":[{"relation":"confirmation","url":"https://depatisnet.dpma.de/DepatisNet/depatisnet?action=bibdat&docid=DE102017116001A1"}]}},{"language":[{"iso":"ger"}],"_id":"24220","publisher":"Verlagsschriftenreihe des Heinz Nixdorf Instituts","doi":"10.17619/UNIPB/1-93","user_id":"15931","author":[{"id":"5603","full_name":"Adelt, Peer","first_name":"Peer","last_name":"Adelt"},{"first_name":"Bastian","last_name":"Koppelmann","full_name":"Koppelmann, Bastian","id":"25260"},{"id":"16243","last_name":"Müller","first_name":"Wolfgang","full_name":"Müller, Wolfgang"},{"last_name":"Mueller-Gritschneder","first_name":"Daniel","full_name":"Mueller-Gritschneder, Daniel"},{"full_name":"Kleinjohann, Bernd","last_name":"Kleinjohann","first_name":"Bernd"},{"id":"37144","last_name":"Scheytt","first_name":"Christoph","full_name":"Scheytt, Christoph"}],"publication_identifier":{"isbn":["978-3-942647-88-5"]},"title":"Automatisierte Fehlerinjektion zur Entwicklung sicherer Mikrocontrolleranwendungen auf der Basis virtueller Plattformen","status":"public","year":"2017","date_updated":"2022-01-06T06:56:13Z","publication_status":"published","place":"Germany, Paderborn","date_created":"2021-09-13T08:20:35Z","department":[{"_id":"58"}],"type":"conference","citation":{"mla":"Adelt, Peer, et al. “Automatisierte Fehlerinjektion zur Entwicklung sicherer Mikrocontrolleranwendungen auf der Basis virtueller Plattformen.” <i>Tagungsband des Wissenschaftsforums Intelligente Technische Systeme</i>, Verlagsschriftenreihe des Heinz Nixdorf Instituts, 2017, doi:<a href=\"https://doi.org/10.17619/UNIPB/1-93\">10.17619/UNIPB/1-93</a>.","apa":"Adelt, P., Koppelmann, B., Müller, W., Mueller-Gritschneder, D., Kleinjohann, B., &#38; Scheytt, C. (2017). Automatisierte Fehlerinjektion zur Entwicklung sicherer Mikrocontrolleranwendungen auf der Basis virtueller Plattformen. <i>Tagungsband des Wissenschaftsforums Intelligente Technische Systeme</i>. <a href=\"https://doi.org/10.17619/UNIPB/1-93\">https://doi.org/10.17619/UNIPB/1-93</a>","ieee":"P. Adelt, B. Koppelmann, W. Müller, D. Mueller-Gritschneder, B. Kleinjohann, and C. Scheytt, “Automatisierte Fehlerinjektion zur Entwicklung sicherer Mikrocontrolleranwendungen auf der Basis virtueller Plattformen,” 2017, doi: <a href=\"https://doi.org/10.17619/UNIPB/1-93\">10.17619/UNIPB/1-93</a>.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Daniel Mueller-Gritschneder, Bernd Kleinjohann, and Christoph Scheytt. “Automatisierte Fehlerinjektion zur Entwicklung sicherer Mikrocontrolleranwendungen auf der Basis virtueller Plattformen.” In <i>Tagungsband des Wissenschaftsforums Intelligente Technische Systeme</i>. Germany, Paderborn: Verlagsschriftenreihe des Heinz Nixdorf Instituts, 2017. <a href=\"https://doi.org/10.17619/UNIPB/1-93\">https://doi.org/10.17619/UNIPB/1-93</a>.","ama":"Adelt P, Koppelmann B, Müller W, Mueller-Gritschneder D, Kleinjohann B, Scheytt C. Automatisierte Fehlerinjektion zur Entwicklung sicherer Mikrocontrolleranwendungen auf der Basis virtueller Plattformen. In: <i>Tagungsband des Wissenschaftsforums Intelligente Technische Systeme</i>. Verlagsschriftenreihe des Heinz Nixdorf Instituts; 2017. doi:<a href=\"https://doi.org/10.17619/UNIPB/1-93\">10.17619/UNIPB/1-93</a>","short":"P. Adelt, B. Koppelmann, W. Müller, D. Mueller-Gritschneder, B. Kleinjohann, C. Scheytt, in: Tagungsband des Wissenschaftsforums Intelligente Technische Systeme, Verlagsschriftenreihe des Heinz Nixdorf Instituts, Germany, Paderborn, 2017.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Mueller-Gritschneder_Kleinjohann_Scheytt_2017, place={Germany, Paderborn}, title={Automatisierte Fehlerinjektion zur Entwicklung sicherer Mikrocontrolleranwendungen auf der Basis virtueller Plattformen}, DOI={<a href=\"https://doi.org/10.17619/UNIPB/1-93\">10.17619/UNIPB/1-93</a>}, booktitle={Tagungsband des Wissenschaftsforums Intelligente Technische Systeme}, publisher={Verlagsschriftenreihe des Heinz Nixdorf Instituts}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Mueller-Gritschneder, Daniel and Kleinjohann, Bernd and Scheytt, Christoph}, year={2017} }"},"publication":"Tagungsband des Wissenschaftsforums Intelligente Technische Systeme","related_material":{"link":[{"relation":"confirmation","url":"https://digital.ub.uni-paderborn.de/hs/content/titleinfo/2436759"}]}},{"status":"public","_id":"24221","publisher":"Verlagsschriftenreihe des Heinz Nixdorf Instituts, Paderborn","user_id":"15931","volume":369,"citation":{"mla":"Gausemeier, Jürgen, et al. <i>Wissenschaftsforum Intelligente Technische Systeme (WInTeSys)</i>. Verlagsschriftenreihe des Heinz Nixdorf Instituts, Paderborn, 2017, doi:<a href=\"https://doi.org/10.17619/UNIPB/1-93\">10.17619/UNIPB/1-93</a>.","ama":"Gausemeier J, Bodden E, Dressler F, et al. <i>Wissenschaftsforum Intelligente Technische Systeme (WInTeSys)</i>. Vol 369. Verlagsschriftenreihe des Heinz Nixdorf Instituts, Paderborn; 2017. doi:<a href=\"https://doi.org/10.17619/UNIPB/1-93\">10.17619/UNIPB/1-93</a>","bibtex":"@book{Gausemeier_Bodden_Dressler_Dumitrescu_Meyer auf der Heide_Scheytt_Trächtler_2017, series={369}, title={Wissenschaftsforum Intelligente Technische Systeme (WInTeSys)}, volume={369}, DOI={<a href=\"https://doi.org/10.17619/UNIPB/1-93\">10.17619/UNIPB/1-93</a>}, publisher={Verlagsschriftenreihe des Heinz Nixdorf Instituts, Paderborn}, author={Gausemeier, Jürgen and Bodden, Eric and Dressler, Falko and Dumitrescu, Roman and Meyer auf der Heide, Friedhelm and Scheytt, Christoph and Trächtler, Ansgar}, year={2017}, collection={369} }","apa":"Gausemeier, J., Bodden, E., Dressler, F., Dumitrescu, R., Meyer auf der Heide, F., Scheytt, C., &#38; Trächtler, A. (2017). <i>Wissenschaftsforum Intelligente Technische Systeme (WInTeSys)</i> (Vol. 369). Verlagsschriftenreihe des Heinz Nixdorf Instituts, Paderborn. <a href=\"https://doi.org/10.17619/UNIPB/1-93\">https://doi.org/10.17619/UNIPB/1-93</a>","ieee":"J. Gausemeier <i>et al.</i>, <i>Wissenschaftsforum Intelligente Technische Systeme (WInTeSys)</i>, vol. 369. Verlagsschriftenreihe des Heinz Nixdorf Instituts, Paderborn, 2017.","short":"J. Gausemeier, E. Bodden, F. Dressler, R. Dumitrescu, F. Meyer auf der Heide, C. Scheytt, A. Trächtler, Wissenschaftsforum Intelligente Technische Systeme (WInTeSys), Verlagsschriftenreihe des Heinz Nixdorf Instituts, Paderborn, 2017.","chicago":"Gausemeier, Jürgen, Eric Bodden, Falko Dressler, Roman Dumitrescu, Friedhelm Meyer auf der Heide, Christoph Scheytt, and Ansgar Trächtler. <i>Wissenschaftsforum Intelligente Technische Systeme (WInTeSys)</i>. Vol. 369. 369. Verlagsschriftenreihe des Heinz Nixdorf Instituts, Paderborn, 2017. <a href=\"https://doi.org/10.17619/UNIPB/1-93\">https://doi.org/10.17619/UNIPB/1-93</a>."},"year":"2017","title":"Wissenschaftsforum Intelligente Technische Systeme (WInTeSys)","author":[{"last_name":"Gausemeier","first_name":"Jürgen","full_name":"Gausemeier, Jürgen"},{"orcid":"0000-0003-3470-3647","first_name":"Eric","last_name":"Bodden","full_name":"Bodden, Eric","id":"59256"},{"last_name":"Dressler","first_name":"Falko","orcid":"0000-0002-1989-1750","full_name":"Dressler, Falko","id":"48097"},{"first_name":"Roman","last_name":"Dumitrescu","full_name":"Dumitrescu, Roman","id":"16190"},{"full_name":"Meyer auf der Heide, Friedhelm","first_name":"Friedhelm","last_name":"Meyer auf der Heide","id":"15523"},{"last_name":"Scheytt","first_name":"Christoph","full_name":"Scheytt, Christoph","id":"37144"},{"full_name":"Trächtler, Ansgar","first_name":"Ansgar","last_name":"Trächtler","id":"552"}],"publication_identifier":{"isbn":["978-3-942647-88-5"]},"date_updated":"2022-01-06T06:56:13Z","publication_status":"published","intvolume":"       369","language":[{"iso":"ger"}],"series_title":"369","doi":"10.17619/UNIPB/1-93","abstract":[{"text":"Das Wissenschaftsforum Intelligente Technische Systeme (WInTeSys) legt am 11. und 12. Mai 2017 in Paderborn den Schwerpunkt auf die Grundlagen und die Entwicklung intelligenter technischer Systeme im Kontext Industrie 4.0. Etwa 40 begutachtete hochkarätige Beiträge geben einen Überblick über Forschungsfelder, Technologien und Anwendungen. Die Veranstaltung bietet den Teilnehmerinnen und Teilnehmern eine ausgezeichnete Bühne für den Erfahrungsaustausch auf dem Weg in die Digitalisierung von Produkten und Produktionssystemen. »Das Besondere ist der Dialog von Hochschulforschung und industrieller Entwicklung, also das Aufeinandertreffen von »Science-Push« und »Application-Pull«. Die Beiträge spiegeln die hervorragende Vernetzung in der Region OWL und darüber hinaus wider«, sagt Veranstalter Prof. Jürgen Gausemeier (Heinz Nixdorf Institut, Universität Paderborn).","lang":"ger"}],"related_material":{"link":[{"relation":"confirmation","url":"https://digital.ub.uni-paderborn.de/hs/content/titleinfo/2436759"}]},"date_created":"2021-09-13T08:20:36Z","type":"book","department":[{"_id":"58"}]},{"place":"Lausanne, Switzerland","date_created":"2021-09-13T08:20:39Z","type":"conference","department":[{"_id":"58"}],"publication":"2nd Workshop on Resiliency in Embedded Electronic Systems (REES)","citation":{"bibtex":"@inproceedings{Wu_Abughannam_Müller_Scheytt_Ecker_2017, place={Lausanne, Switzerland}, title={SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study}, booktitle={2nd Workshop on Resiliency in Embedded Electronic Systems (REES)}, author={Wu, Liang and Abughannam, Saed and Müller, Wolfgang and Scheytt, Christoph and Ecker, Wolfgang}, year={2017}, pages={68} }","ama":"Wu L, Abughannam S, Müller W, Scheytt C, Ecker W. SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study. In: <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>. ; 2017:68.","mla":"Wu, Liang, et al. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study.” <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 2017, p. 68.","short":"L. Wu, S. Abughannam, W. Müller, C. Scheytt, W. Ecker, in: 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), Lausanne, Switzerland, 2017, p. 68.","chicago":"Wu, Liang, Saed Abughannam, Wolfgang Müller, Christoph Scheytt, and Wolfgang Ecker. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study.” In <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 68. Lausanne, Switzerland, 2017.","ieee":"L. Wu, S. Abughannam, W. Müller, C. Scheytt, and W. Ecker, “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study,” in <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 2017, p. 68.","apa":"Wu, L., Abughannam, S., Müller, W., Scheytt, C., &#38; Ecker, W. (2017). SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study. <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 68."},"related_material":{"link":[{"relation":"confirmation","url":"https://past.date-conference.com/date17/conference/workshop-w05"}]},"abstract":[{"lang":"eng","text":"This paper presents the design flow of using \r\nsampling technique for fault injection on sche-\r\nmatic level. The parameters used in the docu-\r\nment to calculate the likelihood could be modi-\r\nfied by using more realistic data from the fab. \r\nWith the help of the fault simulator, the whole \r\ndesign flow of the fault effect simulation can be \r\nrealized automatically."}],"page":"68","language":[{"iso":"eng"}],"_id":"24223","user_id":"15931","year":"2017","title":"SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study","status":"public","author":[{"id":"30401","first_name":"Liang","last_name":"Wu","full_name":"Wu, Liang"},{"first_name":"Saed","last_name":"Abughannam","full_name":"Abughannam, Saed","id":"37628"},{"id":"16243","first_name":"Wolfgang","last_name":"Müller","full_name":"Müller, Wolfgang"},{"first_name":"Christoph","last_name":"Scheytt","full_name":"Scheytt, Christoph","id":"37144"},{"first_name":"Wolfgang","last_name":"Ecker","full_name":"Ecker, Wolfgang"}],"date_updated":"2022-01-06T06:56:13Z"},{"user_id":"15931","language":[{"iso":"eng"}],"_id":"24224","date_updated":"2022-01-06T06:56:13Z","title":"ANALISA - A Tool for Static Instruction Set Analysis","year":"2017","status":"public","author":[{"id":"5603","full_name":"Adelt, Peer","last_name":"Adelt","first_name":"Peer"},{"id":"25260","first_name":"Bastian","last_name":"Koppelmann","full_name":"Koppelmann, Bastian"},{"full_name":"Müller, Wolfgang","first_name":"Wolfgang","last_name":"Müller","id":"16243"},{"last_name":"Kleinjohann","first_name":"Bernd","full_name":"Kleinjohann, Bernd"},{"last_name":"Scheytt","first_name":"Christoph","full_name":"Scheytt, Christoph","id":"37144"}],"conference":{"start_date":"2017.03.27","end_date":"2017.03.31"},"type":"conference","department":[{"_id":"58"}],"date_created":"2021-09-13T08:20:40Z","place":"Lausanne, CH","related_material":{"link":[{"url":"https://www.date-conference.com/content/date-2017-call-papers","relation":"confirmation"}]},"publication":"Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation","citation":{"chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Bernd Kleinjohann, and Christoph Scheytt. “ANALISA - A Tool for Static Instruction Set Analysis.” In <i>Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation</i>. Lausanne, CH, 2017.","short":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, C. Scheytt, in: Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation, Lausanne, CH, 2017.","apa":"Adelt, P., Koppelmann, B., Müller, W., Kleinjohann, B., &#38; Scheytt, C. (2017). ANALISA - A Tool for Static Instruction Set Analysis. <i>Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation</i>.","ieee":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, and C. Scheytt, “ANALISA - A Tool for Static Instruction Set Analysis,” 2017.","ama":"Adelt P, Koppelmann B, Müller W, Kleinjohann B, Scheytt C. ANALISA - A Tool for Static Instruction Set Analysis. In: <i>Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation</i>. ; 2017.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Kleinjohann_Scheytt_2017, place={Lausanne, CH}, title={ANALISA - A Tool for Static Instruction Set Analysis}, booktitle={Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Kleinjohann, Bernd and Scheytt, Christoph}, year={2017} }","mla":"Adelt, Peer, et al. “ANALISA - A Tool for Static Instruction Set Analysis.” <i>Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation</i>, 2017."}},{"related_material":{"link":[{"url":"https://www.edacentrum.de/rees/program","relation":"confirmation"}]},"publication":"2nd Workshop on Resiliency in Embedded Electronic Systems (REES) ","citation":{"mla":"Adelt, Peer, et al. “An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries.” <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>, 2017, p. 44.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Kleinjohann_Scheytt_2017, place={Lausanne, Switzerland}, title={An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries}, booktitle={2nd Workshop on Resiliency in Embedded Electronic Systems (REES) }, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Kleinjohann, Bernd and Scheytt, Christoph}, year={2017}, pages={44} }","ama":"Adelt P, Koppelmann B, Müller W, Kleinjohann B, Scheytt C. An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries. In: <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>. ; 2017:44.","ieee":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, and C. Scheytt, “An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries,” in <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>, 2017, p. 44.","apa":"Adelt, P., Koppelmann, B., Müller, W., Kleinjohann, B., &#38; Scheytt, C. (2017). An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries. <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>, 44.","short":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, C. Scheytt, in: 2nd Workshop on Resiliency in Embedded Electronic Systems (REES) , Lausanne, Switzerland, 2017, p. 44.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Bernd Kleinjohann, and Christoph Scheytt. “An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries.” In <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>, 44. Lausanne, Switzerland, 2017."},"type":"conference","department":[{"_id":"58"}],"place":"Lausanne, Switzerland","date_created":"2021-09-13T08:20:41Z","date_updated":"2022-01-06T06:56:13Z","title":"An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries","status":"public","year":"2017","author":[{"last_name":"Adelt","first_name":"Peer","full_name":"Adelt, Peer","id":"5603"},{"last_name":"Koppelmann","first_name":"Bastian","full_name":"Koppelmann, Bastian","id":"25260"},{"full_name":"Müller, Wolfgang","last_name":"Müller","first_name":"Wolfgang","id":"16243"},{"first_name":"Bernd","last_name":"Kleinjohann","full_name":"Kleinjohann, Bernd"},{"id":"37144","last_name":"Scheytt","first_name":"Christoph","full_name":"Scheytt, Christoph"}],"user_id":"15931","page":"44","language":[{"iso":"eng"}],"_id":"24225"},{"page":"198-200","_id":"24227","user_id":"15931","volume":27,"status":"public","citation":{"mla":"Wessel, Jan, et al. “A 120-GHz Electrical Interferometer for Contactless Permittivity Measurements With Direct Digital Read-Out.” <i>IEEE Microwave and Wireless Components Letters</i>, vol. 27, no. 2, 2017, pp. 198–200, doi:<a href=\"https://doi.org/10.1109/LMWC.2017.2649384\">10.1109/LMWC.2017.2649384</a>.","bibtex":"@article{Wessel_Schmalz_Scheytt_Kissinger_2017, title={A 120-GHz Electrical Interferometer for Contactless Permittivity Measurements With Direct Digital Read-Out}, volume={27}, DOI={<a href=\"https://doi.org/10.1109/LMWC.2017.2649384\">10.1109/LMWC.2017.2649384</a>}, number={2}, journal={IEEE Microwave and Wireless Components Letters}, author={Wessel, Jan and Schmalz, Klaus and Scheytt, Christoph and Kissinger, Dietmar}, year={2017}, pages={198–200} }","ama":"Wessel J, Schmalz K, Scheytt C, Kissinger D. A 120-GHz Electrical Interferometer for Contactless Permittivity Measurements With Direct Digital Read-Out. <i>IEEE Microwave and Wireless Components Letters</i>. 2017;27(2):198-200. doi:<a href=\"https://doi.org/10.1109/LMWC.2017.2649384\">10.1109/LMWC.2017.2649384</a>","ieee":"J. Wessel, K. Schmalz, C. Scheytt, and D. Kissinger, “A 120-GHz Electrical Interferometer for Contactless Permittivity Measurements With Direct Digital Read-Out,” <i>IEEE Microwave and Wireless Components Letters</i>, vol. 27, no. 2, pp. 198–200, 2017, doi: <a href=\"https://doi.org/10.1109/LMWC.2017.2649384\">10.1109/LMWC.2017.2649384</a>.","apa":"Wessel, J., Schmalz, K., Scheytt, C., &#38; Kissinger, D. (2017). A 120-GHz Electrical Interferometer for Contactless Permittivity Measurements With Direct Digital Read-Out. <i>IEEE Microwave and Wireless Components Letters</i>, <i>27</i>(2), 198–200. <a href=\"https://doi.org/10.1109/LMWC.2017.2649384\">https://doi.org/10.1109/LMWC.2017.2649384</a>","short":"J. Wessel, K. Schmalz, C. Scheytt, D. Kissinger, IEEE Microwave and Wireless Components Letters 27 (2017) 198–200.","chicago":"Wessel, Jan, Klaus Schmalz, Christoph Scheytt, and Dietmar Kissinger. “A 120-GHz Electrical Interferometer for Contactless Permittivity Measurements With Direct Digital Read-Out.” <i>IEEE Microwave and Wireless Components Letters</i> 27, no. 2 (2017): 198–200. <a href=\"https://doi.org/10.1109/LMWC.2017.2649384\">https://doi.org/10.1109/LMWC.2017.2649384</a>."},"language":[{"iso":"eng"}],"doi":"10.1109/LMWC.2017.2649384","title":"A 120-GHz Electrical Interferometer for Contactless Permittivity Measurements With Direct Digital Read-Out","year":"2017","publication_identifier":{"eissn":["1558-1764"]},"author":[{"full_name":"Wessel, Jan","first_name":"Jan","last_name":"Wessel"},{"last_name":"Schmalz","first_name":"Klaus","full_name":"Schmalz, Klaus"},{"full_name":"Scheytt, Christoph","first_name":"Christoph","last_name":"Scheytt","id":"37144"},{"last_name":"Kissinger","first_name":"Dietmar","full_name":"Kissinger, Dietmar"}],"date_updated":"2022-01-06T06:56:13Z","intvolume":"        27","date_created":"2021-09-13T08:20:44Z","type":"journal_article","department":[{"_id":"58"}],"publication":"IEEE Microwave and Wireless Components Letters","issue":"2","abstract":[{"text":"This work describes an electrical interferometer for contactless permittivity measurements working at 120 GHz. It was fabricated in a 130 nm SiGe process featuring an ft and fmax of 240 and 330 GHz. The on-chip system contains a 120 GHz VCO with a tuning range of 7 GHz featuring a divide-by-64 circuit to enable external PLL operation. The subsequent buffer provides 7 dBm of output power at 120 GHz. Additionally, the IC contains high-precision and high-resolution phase shifters based on a slow-wave transmission line approach with digital control for direct readout ability. A 120 GHz LNA with 17 dB gain and a power detector to provide DC output signals were realized on chip. It enables sample emulation capability by phase shift inducement in the measurement as well as a reference transmission line. In terms of phase detection, the system shows a sensitivity of 907.36 MHz/°.","lang":"eng"}],"related_material":{"link":[{"url":"https://ieeexplore.ieee.org/document/7845690","relation":"confirmation"}]}},{"language":[{"iso":"ger"}],"_id":"27415","publisher":"Verlagsschriftenreihe des Heinz Nixdorf Instituts","user_id":"21240","editor":[{"last_name":"Gausemeier","first_name":"Jürgen","full_name":"Gausemeier, Jürgen"},{"orcid":"0000-0003-3470-3647","first_name":"Eric","last_name":"Bodden","full_name":"Bodden, Eric","id":"59256"},{"full_name":"Dressler, Falko","last_name":"Dressler","orcid":"0000-0002-1989-1750","first_name":"Falko","id":"48097"},{"id":"16190","full_name":"Dumitrescu, Roman","last_name":"Dumitrescu","first_name":"Roman"},{"full_name":"Meyer auf der Heide, Friedhelm","last_name":"Meyer auf der Heide","first_name":"Friedhelm","id":"15523"},{"full_name":"Scheytt, Christoph","first_name":"Christoph","last_name":"Scheytt","id":"37144"},{"last_name":"Trächtler","first_name":"Ansgar","full_name":"Trächtler, Ansgar","id":"552"}],"volume":369,"year":"2017","title":"Wissenschaftsforum Intelligente Technische Systeme (WInTeSys). , Band 369","status":"public","date_updated":"2022-01-06T06:57:39Z","intvolume":"       369","place":"Paderborn","date_created":"2021-11-15T08:34:31Z","type":"book_editor","department":[{"_id":"676"}],"citation":{"apa":"Gausemeier, J., Bodden, E., Dressler, F., Dumitrescu, R., Meyer auf der Heide, F., Scheytt, C., &#38; Trächtler, A. (Eds.). (2017). <i>Wissenschaftsforum Intelligente Technische Systeme (WInTeSys). , Band 369</i> (Vol. 369). Verlagsschriftenreihe des Heinz Nixdorf Instituts.","ieee":"J. Gausemeier <i>et al.</i>, Eds., <i>Wissenschaftsforum Intelligente Technische Systeme (WInTeSys). , Band 369</i>, vol. 369. Paderborn: Verlagsschriftenreihe des Heinz Nixdorf Instituts, 2017.","chicago":"Gausemeier, Jürgen, Eric Bodden, Falko Dressler, Roman Dumitrescu, Friedhelm Meyer auf der Heide, Christoph Scheytt, and Ansgar Trächtler, eds. <i>Wissenschaftsforum Intelligente Technische Systeme (WInTeSys). , Band 369</i>. Vol. 369. Paderborn: Verlagsschriftenreihe des Heinz Nixdorf Instituts, 2017.","short":"J. Gausemeier, E. Bodden, F. Dressler, R. Dumitrescu, F. Meyer auf der Heide, C. Scheytt, A. Trächtler, eds., Wissenschaftsforum Intelligente Technische Systeme (WInTeSys). , Band 369, Verlagsschriftenreihe des Heinz Nixdorf Instituts, Paderborn, 2017.","mla":"Gausemeier, Jürgen, et al., editors. <i>Wissenschaftsforum Intelligente Technische Systeme (WInTeSys). , Band 369</i>. Verlagsschriftenreihe des Heinz Nixdorf Instituts, 2017.","ama":"Gausemeier J, Bodden E, Dressler F, et al., eds. <i>Wissenschaftsforum Intelligente Technische Systeme (WInTeSys). , Band 369</i>. Vol 369. Verlagsschriftenreihe des Heinz Nixdorf Instituts; 2017.","bibtex":"@book{Gausemeier_Bodden_Dressler_Dumitrescu_Meyer auf der Heide_Scheytt_Trächtler_2017, place={Paderborn}, title={Wissenschaftsforum Intelligente Technische Systeme (WInTeSys). , Band 369}, volume={369}, publisher={Verlagsschriftenreihe des Heinz Nixdorf Instituts}, year={2017} }"}},{"date_updated":"2023-01-10T13:02:44Z","status":"public","year":"2017","title":"Fully-differential, DC-coupled, Self-biased, Monolithically-integrated Optical Receiver in 0.25μm Photonic BiCMOS Technology for Multi-channel Fiber Links","author":[{"first_name":"Sergiy","last_name":"Gudyriev","full_name":"Gudyriev, Sergiy"},{"last_name":"Scheytt","first_name":"Christoph","orcid":"https://orcid.org/0000-0002-5950-6618","full_name":"Scheytt, Christoph","id":"37144"},{"full_name":"Yan, Lei","last_name":"Yan","first_name":"Lei"},{"first_name":"Meuer","last_name":"Christian","full_name":"Christian, Meuer"},{"last_name":"Zimmermann","first_name":"Lars","full_name":"Zimmermann, Lars"}],"publication_identifier":{"eissn":[" 2378-590X"]},"conference":{"start_date":"2017.10.19","end_date":"2017.10.21"},"user_id":"15931","doi":"10.1109/BCTM.2017.8112922","_id":"24211","language":[{"iso":"eng"}],"related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/8112922"}]},"abstract":[{"lang":"eng","text":"A fully-differential receiver structure for fiber links is presented, in which the photodiode (PD) is DC-coupled to the transimpedance amplifier (TIA) and biased through the feedback resistors. The biasing voltage is defined by the internal structure of the input stage. Different options are suggested that allow to adjust PD biasing. Multiple architecture variants are proposed, that were implemented in 0.25μm SiGe BiCMOS technology. Initial measurement results are reported, proving the feasibility of the concept. A 25Gbps hybrid receiver designed to comply with a specific standard is also presented, featuring large horizontal eye opening of 800mV, OMA of -15dBm at BER of 10 -6 and power dissipation of 330mW from a single 3.3V power supply."}],"publication":"IEEE Bipolar/BiCMOS Circuits and Technology Meeting","citation":{"apa":"Gudyriev, S., Scheytt, C., Yan, L., Christian, M., &#38; Zimmermann, L. (2017). Fully-differential, DC-coupled, Self-biased, Monolithically-integrated Optical Receiver in 0.25μm Photonic BiCMOS Technology for Multi-channel Fiber Links. <i>IEEE Bipolar/BiCMOS Circuits and Technology Meeting</i>. <a href=\"https://doi.org/10.1109/BCTM.2017.8112922\">https://doi.org/10.1109/BCTM.2017.8112922</a>","ieee":"S. Gudyriev, C. Scheytt, L. Yan, M. Christian, and L. Zimmermann, “Fully-differential, DC-coupled, Self-biased, Monolithically-integrated Optical Receiver in 0.25μm Photonic BiCMOS Technology for Multi-channel Fiber Links,” <i>IEEE Bipolar/BiCMOS Circuits and Technology Meeting</i>, 2017, doi: <a href=\"https://doi.org/10.1109/BCTM.2017.8112922\">10.1109/BCTM.2017.8112922</a>.","short":"S. Gudyriev, C. Scheytt, L. Yan, M. Christian, L. Zimmermann, IEEE Bipolar/BiCMOS Circuits and Technology Meeting (2017).","chicago":"Gudyriev, Sergiy, Christoph Scheytt, Lei Yan, Meuer Christian, and Lars Zimmermann. “Fully-Differential, DC-Coupled, Self-Biased, Monolithically-Integrated Optical Receiver in 0.25μm Photonic BiCMOS Technology for Multi-Channel Fiber Links.” <i>IEEE Bipolar/BiCMOS Circuits and Technology Meeting</i>, 2017. <a href=\"https://doi.org/10.1109/BCTM.2017.8112922\">https://doi.org/10.1109/BCTM.2017.8112922</a>.","mla":"Gudyriev, Sergiy, et al. “Fully-Differential, DC-Coupled, Self-Biased, Monolithically-Integrated Optical Receiver in 0.25μm Photonic BiCMOS Technology for Multi-Channel Fiber Links.” <i>IEEE Bipolar/BiCMOS Circuits and Technology Meeting</i>, 2017, doi:<a href=\"https://doi.org/10.1109/BCTM.2017.8112922\">10.1109/BCTM.2017.8112922</a>.","ama":"Gudyriev S, Scheytt C, Yan L, Christian M, Zimmermann L. Fully-differential, DC-coupled, Self-biased, Monolithically-integrated Optical Receiver in 0.25μm Photonic BiCMOS Technology for Multi-channel Fiber Links. <i>IEEE Bipolar/BiCMOS Circuits and Technology Meeting</i>. Published online 2017. doi:<a href=\"https://doi.org/10.1109/BCTM.2017.8112922\">10.1109/BCTM.2017.8112922</a>","bibtex":"@article{Gudyriev_Scheytt_Yan_Christian_Zimmermann_2017, title={Fully-differential, DC-coupled, Self-biased, Monolithically-integrated Optical Receiver in 0.25μm Photonic BiCMOS Technology for Multi-channel Fiber Links}, DOI={<a href=\"https://doi.org/10.1109/BCTM.2017.8112922\">10.1109/BCTM.2017.8112922</a>}, journal={IEEE Bipolar/BiCMOS Circuits and Technology Meeting}, author={Gudyriev, Sergiy and Scheytt, Christoph and Yan, Lei and Christian, Meuer and Zimmermann, Lars}, year={2017} }"},"type":"journal_article","department":[{"_id":"58"},{"_id":"230"}],"date_created":"2021-09-13T08:15:30Z"},{"language":[{"iso":"eng"}],"_id":"24226","user_id":"15931","title":"Silicon Photonics Microsystems for Communications and Sensing","status":"public","year":"2017","conference":{"end_date":"2017.02.22","start_date":"2017.02.21"},"author":[{"id":"37144","last_name":"Scheytt","first_name":"Christoph","orcid":"https://orcid.org/0000-0002-5950-6618","full_name":"Scheytt, Christoph"}],"date_updated":"2023-01-10T13:04:16Z","place":"Wetzlar, Germany","date_created":"2021-09-13T08:20:43Z","type":"conference","department":[{"_id":"58"},{"_id":"230"}],"publication":"W3+Fair on Optoelectronics, Electronics, and Mechanics","citation":{"short":"C. Scheytt, in: W3+Fair on Optoelectronics, Electronics, and Mechanics, Wetzlar, Germany, 2017.","chicago":"Scheytt, Christoph. “Silicon Photonics Microsystems for Communications and Sensing.” In <i>W3+Fair on Optoelectronics, Electronics, and Mechanics</i>. Wetzlar, Germany, 2017.","ieee":"C. Scheytt, “Silicon Photonics Microsystems for Communications and Sensing,” 2017.","apa":"Scheytt, C. (2017). Silicon Photonics Microsystems for Communications and Sensing. <i>W3+Fair on Optoelectronics, Electronics, and Mechanics</i>.","bibtex":"@inproceedings{Scheytt_2017, place={Wetzlar, Germany}, title={Silicon Photonics Microsystems for Communications and Sensing}, booktitle={W3+Fair on Optoelectronics, Electronics, and Mechanics}, author={Scheytt, Christoph}, year={2017} }","ama":"Scheytt C. Silicon Photonics Microsystems for Communications and Sensing. In: <i>W3+Fair on Optoelectronics, Electronics, and Mechanics</i>. ; 2017.","mla":"Scheytt, Christoph. “Silicon Photonics Microsystems for Communications and Sensing.” <i>W3+Fair on Optoelectronics, Electronics, and Mechanics</i>, 2017."},"related_material":{"link":[{"url":"https://www.technologieland-hessen.de/news/28134","relation":"confirmation"}]}},{"department":[{"_id":"58"},{"_id":"230"}],"type":"journal_article","date_created":"2021-09-13T08:15:31Z","related_material":{"link":[{"url":"https://www.osapublishing.org/abstract.cfm?uri=FiO-2017-FM3A.3","relation":"confirmation"}]},"abstract":[{"lang":"eng","text":"A hybrid multi-channel receiver featuring fully-differential transimpedance input stages for 25Gbps data rate per channel is presented along with measurement results focusing on the channel-to-channel interference and sensitivity. OMA of -16dBm at a BER of 10−4 is estimated at the photodiode for all channels. Each channel dissipates 330mW of power provided from a single 3.3V supply voltage."}],"citation":{"ieee":"S. Gudyriev, C. Scheytt, C. Kress, L. Yan, M. Christian, and L. Zimmermann, “Fully-Differential, Hybrid, Multi-channel 4x25Gbps Direct Direction Receiver in 0.25\\textmum BiCMOS SiGe Technology,” <i>OSA Frontiers in Optics + Laser Science</i>, 2017, doi: <a href=\"https://doi.org/10.1364/FIO.2017.FM3A.3\">https://doi.org/10.1364/FIO.2017.FM3A.3</a>.","apa":"Gudyriev, S., Scheytt, C., Kress, C., Yan, L., Christian, M., &#38; Zimmermann, L. (2017). Fully-Differential, Hybrid, Multi-channel 4x25Gbps Direct Direction Receiver in 0.25\\textmum BiCMOS SiGe Technology. <i>OSA Frontiers in Optics + Laser Science</i>. <a href=\"https://doi.org/10.1364/FIO.2017.FM3A.3\">https://doi.org/10.1364/FIO.2017.FM3A.3</a>","short":"S. Gudyriev, C. Scheytt, C. Kress, L. Yan, M. Christian, L. Zimmermann, OSA Frontiers in Optics + Laser Science (2017).","chicago":"Gudyriev, Sergiy, Christoph Scheytt, Christian Kress, Lei Yan, Meuer Christian, and Lars Zimmermann. “Fully-Differential, Hybrid, Multi-Channel 4x25Gbps Direct Direction Receiver in 0.25\\textmum BiCMOS SiGe Technology.” <i>OSA Frontiers in Optics + Laser Science</i>, 2017. <a href=\"https://doi.org/10.1364/FIO.2017.FM3A.3\">https://doi.org/10.1364/FIO.2017.FM3A.3</a>.","mla":"Gudyriev, Sergiy, et al. “Fully-Differential, Hybrid, Multi-Channel 4x25Gbps Direct Direction Receiver in 0.25\\textmum BiCMOS SiGe Technology.” <i>OSA Frontiers in Optics + Laser Science</i>, 2017, doi:<a href=\"https://doi.org/10.1364/FIO.2017.FM3A.3\">https://doi.org/10.1364/FIO.2017.FM3A.3</a>.","bibtex":"@article{Gudyriev_Scheytt_Kress_Yan_Christian_Zimmermann_2017, title={Fully-Differential, Hybrid, Multi-channel 4x25Gbps Direct Direction Receiver in 0.25\\textmum BiCMOS SiGe Technology}, DOI={<a href=\"https://doi.org/10.1364/FIO.2017.FM3A.3\">https://doi.org/10.1364/FIO.2017.FM3A.3</a>}, journal={OSA Frontiers in Optics + Laser Science}, author={Gudyriev, Sergiy and Scheytt, Christoph and Kress, Christian and Yan, Lei and Christian, Meuer and Zimmermann, Lars}, year={2017} }","ama":"Gudyriev S, Scheytt C, Kress C, Yan L, Christian M, Zimmermann L. Fully-Differential, Hybrid, Multi-channel 4x25Gbps Direct Direction Receiver in 0.25\\textmum BiCMOS SiGe Technology. <i>OSA Frontiers in Optics + Laser Science</i>. Published online 2017. doi:<a href=\"https://doi.org/10.1364/FIO.2017.FM3A.3\">https://doi.org/10.1364/FIO.2017.FM3A.3</a>"},"publication":"OSA Frontiers in Optics + Laser Science","doi":"https://doi.org/10.1364/FIO.2017.FM3A.3","user_id":"13256","_id":"24212","language":[{"iso":"eng"}],"date_updated":"2023-08-04T08:31:47Z","conference":{"start_date":"2017.09.18","end_date":"2017.09.21"},"author":[{"first_name":"Sergiy","last_name":"Gudyriev","full_name":"Gudyriev, Sergiy"},{"full_name":"Scheytt, Christoph","first_name":"Christoph","last_name":"Scheytt","orcid":"https://orcid.org/0000-0002-5950-6618","id":"37144"},{"full_name":"Kress, Christian","last_name":"Kress","first_name":"Christian","id":"13256"},{"first_name":"Lei","last_name":"Yan","full_name":"Yan, Lei"},{"first_name":"Meuer","last_name":"Christian","full_name":"Christian, Meuer"},{"last_name":"Zimmermann","first_name":"Lars","full_name":"Zimmermann, Lars"}],"publication_identifier":{"isbn":["978-1-943580-33-0"]},"title":"Fully-Differential, Hybrid, Multi-channel 4x25Gbps Direct Direction Receiver in 0.25\\textmum BiCMOS SiGe Technology","year":"2017","status":"public"},{"publication_identifier":{"isbn":["978-3-8007-4428-2"]},"author":[{"first_name":"Peter","last_name":"Kuhn","full_name":"Kuhn, Peter"},{"id":"59648","full_name":"Haddadian, Sanaz","first_name":"Sanaz","last_name":"Haddadian"},{"full_name":"Meyer, Frederic","first_name":"Frederic","last_name":"Meyer"},{"full_name":"Hoffmann, Marc","first_name":"Marc","last_name":"Hoffmann"},{"full_name":"Grabmaier, Anton","last_name":"Grabmaier","first_name":"Anton"},{"full_name":"Scheytt, Christoph","orcid":"0000-0002-5950-6618 ","last_name":"Scheytt","first_name":"Christoph","id":"37144"},{"first_name":"Thomas","last_name":"Kaiser","full_name":"Kaiser, Thomas"}],"status":"public","title":"SHF RFID System for Automatic Process Optimization with Intelligent Tools","year":"2017","date_updated":"2025-02-13T14:23:57Z","_id":"24219","language":[{"iso":"eng"}],"publisher":"VDE ITG","user_id":"59648","citation":{"ama":"Kuhn P, Haddadian S, Meyer F, et al. SHF RFID System for Automatic Process Optimization with Intelligent Tools. In: <i>Smart SysTech 2017; European Conference on Smart Objects, Systems and Technologies</i>. VDE ITG; 2017.","bibtex":"@inproceedings{Kuhn_Haddadian_Meyer_Hoffmann_Grabmaier_Scheytt_Kaiser_2017, place={München, Germany}, title={SHF RFID System for Automatic Process Optimization with Intelligent Tools}, booktitle={Smart SysTech 2017; European Conference on Smart Objects, Systems and Technologies}, publisher={VDE ITG}, author={Kuhn, Peter and Haddadian, Sanaz and Meyer, Frederic and Hoffmann, Marc and Grabmaier, Anton and Scheytt, Christoph and Kaiser, Thomas}, year={2017} }","mla":"Kuhn, Peter, et al. “SHF RFID System for Automatic Process Optimization with Intelligent Tools.” <i>Smart SysTech 2017; European Conference on Smart Objects, Systems and Technologies</i>, VDE ITG, 2017.","chicago":"Kuhn, Peter, Sanaz Haddadian, Frederic Meyer, Marc Hoffmann, Anton Grabmaier, Christoph Scheytt, and Thomas Kaiser. “SHF RFID System for Automatic Process Optimization with Intelligent Tools.” In <i>Smart SysTech 2017; European Conference on Smart Objects, Systems and Technologies</i>. München, Germany: VDE ITG, 2017.","short":"P. Kuhn, S. Haddadian, F. Meyer, M. Hoffmann, A. Grabmaier, C. Scheytt, T. Kaiser, in: Smart SysTech 2017; European Conference on Smart Objects, Systems and Technologies, VDE ITG, München, Germany, 2017.","apa":"Kuhn, P., Haddadian, S., Meyer, F., Hoffmann, M., Grabmaier, A., Scheytt, C., &#38; Kaiser, T. (2017). SHF RFID System for Automatic Process Optimization with Intelligent Tools. <i>Smart SysTech 2017; European Conference on Smart Objects, Systems and Technologies</i>.","ieee":"P. Kuhn <i>et al.</i>, “SHF RFID System for Automatic Process Optimization with Intelligent Tools,” 2017."},"publication":"Smart SysTech 2017; European Conference on Smart Objects, Systems and Technologies","abstract":[{"text":"In this paper we present theoretical, simulated and measured data for a reader to tag communication RFID system at 5.8 GHz. First a theoretical link budget analysis for a reader to tag architecture is shown for a wireless industrial application at 1m distance. This includes a power budget of the passively powered transponder. The received power level of the backscattered data for the theoretical link budget is -52:5 dBm. For the first setup slot antennas are developed and measured in the anechoic chamber. The measured gain is 4.0 dB. The power of the backscatter data in setup 1 is -74:8 dBm. This corresponds to the theoretical link budget since, all losses such as cable or lower antenna gain are taken into account. Setup 2 is upgraded on the reader side with horn antennas. At 5.8 GHz, the gain reaches the value of 10.8 dB. The second setup shows improvement in the receiving backscattered power to a value of -62:4 dBm. Furthermore, as a solution to detect those transponders not presented in the main slope of the antenna, a steerable beam is introduced by means of a Rotman lens. On the topic of the passive transponder, different harvesting topologies at 5.8 GHz are investigated, and the efficiency simulation of the harvesting circuitry has been performed. The simulated efficiency of the implemented technique is 68 %.","lang":"eng"}],"date_created":"2021-09-13T08:20:34Z","place":"München, Germany","department":[{"_id":"58"}],"type":"conference"},{"citation":{"apa":"Haddadian, S., Scheytt, C., &#38; Kramer, R. (2017). Energy Harvesting Analysis for Next Generation Passive RFID Tags. <i>ANALOG 2017; 16th ITG/GMM-Symposium</i>, 18.","ieee":"S. Haddadian, C. Scheytt, and R. Kramer, “Energy Harvesting Analysis for Next Generation Passive RFID Tags,” in <i>ANALOG 2017; 16th ITG/GMM-Symposium</i>, 2017, p. 18.","chicago":"Haddadian, Sanaz, Christoph Scheytt, and Roland Kramer. “Energy Harvesting Analysis for Next Generation Passive RFID Tags.” In <i>ANALOG 2017; 16th ITG/GMM-Symposium</i>, 18. Berlin, Germany: Technische Universität Berlin, 2017.","short":"S. Haddadian, C. Scheytt, R. Kramer, in: ANALOG 2017; 16th ITG/GMM-Symposium, Technische Universität Berlin, Berlin, Germany, 2017, p. 18.","mla":"Haddadian, Sanaz, et al. “Energy Harvesting Analysis for Next Generation Passive RFID Tags.” <i>ANALOG 2017; 16th ITG/GMM-Symposium</i>, Technische Universität Berlin, 2017, p. 18.","ama":"Haddadian S, Scheytt C, Kramer R. Energy Harvesting Analysis for Next Generation Passive RFID Tags. In: <i>ANALOG 2017; 16th ITG/GMM-Symposium</i>. Technische Universität Berlin; 2017:18.","bibtex":"@inproceedings{Haddadian_Scheytt_Kramer_2017, place={Berlin, Germany}, title={Energy Harvesting Analysis for Next Generation Passive RFID Tags}, booktitle={ANALOG 2017; 16th ITG/GMM-Symposium}, publisher={Technische Universität Berlin}, author={Haddadian, Sanaz and Scheytt, Christoph and Kramer, Roland}, year={2017}, pages={18} }"},"publication":"ANALOG 2017; 16th ITG/GMM-Symposium","abstract":[{"lang":"eng","text":"This paper focuses on the design  of a high\r\nefficiency cross-connected differential drive rectifier for\r\nnext-generation passive RFID tags. To provide a\r\nrealistic estimation of the transponders’power and\r\nefficiency requirements at 5.8 GHz, detailed\r\nlink/power-budget analysis for various blocks of the tag\r\nchip is carried  out. From  link  budget  analysis  realistic\r\nRF  power  levels  are  obtained  and  a  rectifier  with  high\r\nconversion  efficiency  at  low  power  levels  is  designed.\r\nSimulations based on a commercial 65nm CMOS\r\ntechnology  investigate  the  suitability  of  the  harvesting\r\ncircuit for 5.8 GHz RFID tags."}],"place":"Berlin, Germany","date_created":"2021-09-13T08:20:37Z","department":[{"_id":"58"}],"type":"conference","author":[{"id":"59648","last_name":"Haddadian","first_name":"Sanaz","full_name":"Haddadian, Sanaz"},{"full_name":"Scheytt, Christoph","last_name":"Scheytt","orcid":"0000-0002-5950-6618 ","first_name":"Christoph","id":"37144"},{"full_name":"Kramer, Roland","last_name":"Kramer","first_name":"Roland"}],"status":"public","year":"2017","title":"Energy Harvesting Analysis for Next Generation Passive RFID Tags","date_updated":"2025-02-13T14:24:50Z","_id":"24222","language":[{"iso":"eng"}],"publisher":"Technische Universität Berlin","page":"18","user_id":"59648"},{"type":"conference","department":[{"_id":"672"}],"date_created":"2021-09-28T11:12:00Z","publication":"Design Automation and Testing in Europe (DATE)","citation":{"ama":"Adelt P, Koppelmann B, Müller W, Kleinjohann B, Scheytt JC. ANALISA - A Tool for Static Instruction Set Analysis. In: University Booth Interactive Presentation, ed. <i>Design Automation and Testing in Europe (DATE)</i>. ; 2017.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Kleinjohann_Scheytt_2017, title={ANALISA - A Tool for Static Instruction Set Analysis}, booktitle={Design Automation and Testing in Europe (DATE)}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Kleinjohann, Bernd and Scheytt, J. Christoph}, editor={University Booth Interactive Presentation}, year={2017} }","mla":"Adelt, Peer, et al. “ANALISA - A Tool for Static Instruction Set Analysis.” <i>Design Automation and Testing in Europe (DATE)</i>, edited by University Booth Interactive Presentation, 2017.","short":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, J.C. Scheytt, in: University Booth Interactive Presentation (Ed.), Design Automation and Testing in Europe (DATE), 2017.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Bernd Kleinjohann, and J. Christoph Scheytt. “ANALISA - A Tool for Static Instruction Set Analysis.” In <i>Design Automation and Testing in Europe (DATE)</i>, edited by University Booth Interactive Presentation, 2017.","apa":"Adelt, P., Koppelmann, B., Müller, W., Kleinjohann, B., &#38; Scheytt, J. C. (2017). ANALISA - A Tool for Static Instruction Set Analysis. In University Booth Interactive Presentation (Ed.), <i>Design Automation and Testing in Europe (DATE)</i>.","ieee":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, and J. C. Scheytt, “ANALISA - A Tool for Static Instruction Set Analysis,” in <i>Design Automation and Testing in Europe (DATE)</i>, Lausanne, CH, Mrz. 2017, 2017."},"user_id":"5603","language":[{"iso":"eng"}],"_id":"25069","date_updated":"2025-02-26T14:45:23Z","year":"2017","title":"ANALISA - A Tool for Static Instruction Set Analysis","status":"public","conference":{"location":"Lausanne, CH, Mrz. 2017"},"author":[{"id":"5603","first_name":"Peer","last_name":"Adelt","full_name":"Adelt, Peer"},{"last_name":"Koppelmann","first_name":"Bastian","full_name":"Koppelmann, Bastian","id":"25260"},{"last_name":"Müller","first_name":"Wolfgang","full_name":"Müller, Wolfgang","id":"16243"},{"first_name":"Bernd","last_name":"Kleinjohann","full_name":"Kleinjohann, Bernd"},{"full_name":"Scheytt, J. Christoph","orcid":"0000-0002-5950-6618 ","first_name":"J. Christoph","last_name":"Scheytt","id":"37144"}],"corporate_editor":["University Booth Interactive Presentation"]},{"abstract":[{"lang":"eng","text":"Electronic systems, like they are embedded in road vehicles, have to be compliant to functional safety standards like ISO 26262 [1], which limit the impacts of malfunctions for safety critical systems. ISO 26262, for instance, defines different safety levels for road vehicles, which require different means and measures for a safety compliant system and its development process like risk analysis and fault effect simulation. For fault effect simulation it is important to investigate the impact of physical and hardware related effects to the correct function of a system. This article first studies code and model mutations for fault injection in the context of fault effect simulation through different system abstraction levels. It demonstrates how high level mutations correlate to bit flips of software binaries by examples from the TriCore™ instruction set and finally presents a virtual platform based implementation for automated injection of bit flip based mutations into software binaries. Experimental results demonstrate the efficiency of the implemented approach."}],"related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/7753545"}]},"publication":"Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)","citation":{"short":"P. Adelt, B. Koppelmann, W. Müller, M. Becker, B. Kleinjohann, C. Scheytt, in: Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC), Tallin, Estonia, 2016.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Markus Becker, Bernd Kleinjohann, and Christoph Scheytt. “Fast Dynamic Fault Injection for Virtual Microcontroller Platforms.” In <i>Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)</i>. Tallin, Estonia, 2016. <a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">https://doi.org/10.1109/VLSI-SoC.2016.7753545</a>.","apa":"Adelt, P., Koppelmann, B., Müller, W., Becker, M., Kleinjohann, B., &#38; Scheytt, C. (2016). Fast Dynamic Fault Injection for Virtual Microcontroller Platforms. <i>Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)</i>. <a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">https://doi.org/10.1109/VLSI-SoC.2016.7753545</a>","ieee":"P. Adelt, B. Koppelmann, W. Müller, M. Becker, B. Kleinjohann, and C. Scheytt, “Fast Dynamic Fault Injection for Virtual Microcontroller Platforms,” 2016, doi: <a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">10.1109/VLSI-SoC.2016.7753545</a>.","ama":"Adelt P, Koppelmann B, Müller W, Becker M, Kleinjohann B, Scheytt C. Fast Dynamic Fault Injection for Virtual Microcontroller Platforms. In: <i>Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)</i>. ; 2016. doi:<a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">10.1109/VLSI-SoC.2016.7753545</a>","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Becker_Kleinjohann_Scheytt_2016, place={Tallin, Estonia}, title={Fast Dynamic Fault Injection for Virtual Microcontroller Platforms}, DOI={<a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">10.1109/VLSI-SoC.2016.7753545</a>}, booktitle={Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Becker, Markus and Kleinjohann, Bernd and Scheytt, Christoph}, year={2016} }","mla":"Adelt, Peer, et al. “Fast Dynamic Fault Injection for Virtual Microcontroller Platforms.” <i>Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)</i>, 2016, doi:<a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">10.1109/VLSI-SoC.2016.7753545</a>."},"type":"conference","department":[{"_id":"58"}],"place":"Tallin, Estonia","date_created":"2021-09-13T09:44:30Z","date_updated":"2022-02-17T13:57:45Z","title":"Fast Dynamic Fault Injection for Virtual Microcontroller Platforms","status":"public","year":"2016","conference":{"start_date":"2016.09.26","end_date":"2016.09.28"},"publication_identifier":{"eissn":["2324-8440"]},"author":[{"id":"5603","full_name":"Adelt, Peer","first_name":"Peer","last_name":"Adelt"},{"id":"25260","full_name":"Koppelmann, Bastian","last_name":"Koppelmann","first_name":"Bastian"},{"first_name":"Wolfgang","last_name":"Müller","full_name":"Müller, Wolfgang","id":"16243"},{"full_name":"Becker, Markus","first_name":"Markus","last_name":"Becker"},{"first_name":"Bernd","last_name":"Kleinjohann","full_name":"Kleinjohann, Bernd"},{"id":"37144","full_name":"Scheytt, Christoph","first_name":"Christoph","last_name":"Scheytt"}],"doi":"10.1109/VLSI-SoC.2016.7753545","user_id":"15931","language":[{"iso":"eng"}],"_id":"24264"},{"_id":"24265","language":[{"iso":"eng"}],"doi":"10.1109/RFIT.2016.7578132","user_id":"15931","status":"public","title":"An all-transmission-line 220 GHz differential LNA in SiGe BiCMOS","year":"2016","conference":{"end_date":"2016.08.26","start_date":"2016.08.24"},"publication_identifier":{"eisbn":["978-1-5090-1235-0"]},"author":[{"last_name":"Mao","first_name":"Yanfei","full_name":"Mao, Yanfei"},{"first_name":"Klaus","last_name":"Schmalz","full_name":"Schmalz, Klaus"},{"id":"37144","full_name":"Scheytt, Christoph","last_name":"Scheytt","first_name":"Christoph"},{"full_name":"Shiju, E.","last_name":"Shiju","first_name":"E."}],"date_updated":"2022-02-17T14:00:40Z","place":"Taipei, Taiwan","date_created":"2021-09-13T09:44:31Z","type":"conference","department":[{"_id":"58"}],"publication":"IEEE International Symposium on Radio-Frequency Integration Technology","citation":{"short":"Y. Mao, K. Schmalz, C. Scheytt, E. Shiju, in: IEEE International Symposium on Radio-Frequency Integration Technology, Taipei, Taiwan, 2016.","chicago":"Mao, Yanfei, Klaus Schmalz, Christoph Scheytt, and E. Shiju. “An All-Transmission-Line 220 GHz Differential LNA in SiGe BiCMOS.” In <i>IEEE International Symposium on Radio-Frequency Integration Technology</i>. Taipei, Taiwan, 2016. <a href=\"https://doi.org/10.1109/RFIT.2016.7578132\">https://doi.org/10.1109/RFIT.2016.7578132</a>.","apa":"Mao, Y., Schmalz, K., Scheytt, C., &#38; Shiju, E. (2016). An all-transmission-line 220 GHz differential LNA in SiGe BiCMOS. <i>IEEE International Symposium on Radio-Frequency Integration Technology</i>. <a href=\"https://doi.org/10.1109/RFIT.2016.7578132\">https://doi.org/10.1109/RFIT.2016.7578132</a>","ieee":"Y. Mao, K. Schmalz, C. Scheytt, and E. Shiju, “An all-transmission-line 220 GHz differential LNA in SiGe BiCMOS,” 2016, doi: <a href=\"https://doi.org/10.1109/RFIT.2016.7578132\">10.1109/RFIT.2016.7578132</a>.","ama":"Mao Y, Schmalz K, Scheytt C, Shiju E. An all-transmission-line 220 GHz differential LNA in SiGe BiCMOS. In: <i>IEEE International Symposium on Radio-Frequency Integration Technology</i>. ; 2016. doi:<a href=\"https://doi.org/10.1109/RFIT.2016.7578132\">10.1109/RFIT.2016.7578132</a>","bibtex":"@inproceedings{Mao_Schmalz_Scheytt_Shiju_2016, place={Taipei, Taiwan}, title={An all-transmission-line 220 GHz differential LNA in SiGe BiCMOS}, DOI={<a href=\"https://doi.org/10.1109/RFIT.2016.7578132\">10.1109/RFIT.2016.7578132</a>}, booktitle={IEEE International Symposium on Radio-Frequency Integration Technology}, author={Mao, Yanfei and Schmalz, Klaus and Scheytt, Christoph and Shiju, E.}, year={2016} }","mla":"Mao, Yanfei, et al. “An All-Transmission-Line 220 GHz Differential LNA in SiGe BiCMOS.” <i>IEEE International Symposium on Radio-Frequency Integration Technology</i>, 2016, doi:<a href=\"https://doi.org/10.1109/RFIT.2016.7578132\">10.1109/RFIT.2016.7578132</a>."},"abstract":[{"lang":"eng","text":"This paper presents a four stage all-transmission-line 220 GHz differential LNA in SiGe BiCMOS technology. Cascode topology is chosen for each stage. The amplifier takes advantage of microstrip transmission lines to realize the inductive load, Marshand balun, input, output, and inter-stage matching of the LNA. The LNA has a gain of 21 dB at 224 GHz, a 3 dB bandwidth of more than 6 GHz. It has a supply voltage of 3V and power dissipation of 234 mW. The amplifier is intended for the use in communication, security scanning, imaging and remote sensing at 220 GHz."}],"related_material":{"link":[{"url":"https://ieeexplore.ieee.org/document/7578132","relation":"confirmation"}]}},{"date_created":"2021-09-13T09:44:29Z","type":"conference","department":[{"_id":"58"}],"publication":"Analog 2016 - VDE","citation":{"chicago":"Abughannam, Saed, Liang Wu, Wolfgang Müller, Christoph Scheytt, Wolfgang Ecker, and Christiano Novello. “Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study.” In <i>Analog 2016 - VDE</i>, 2016.","short":"S. Abughannam, L. Wu, W. Müller, C. Scheytt, W. Ecker, C. Novello, in: Analog 2016 - VDE, 2016.","apa":"Abughannam, S., Wu, L., Müller, W., Scheytt, C., Ecker, W., &#38; Novello, C. (2016). Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study. <i>Analog 2016 - VDE</i>.","ieee":"S. Abughannam, L. Wu, W. Müller, C. Scheytt, W. Ecker, and C. Novello, “Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study,” 2016.","ama":"Abughannam S, Wu L, Müller W, Scheytt C, Ecker W, Novello C. Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study. In: <i>Analog 2016 - VDE</i>. ; 2016.","bibtex":"@inproceedings{Abughannam_Wu_Müller_Scheytt_Ecker_Novello_2016, title={Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study}, booktitle={Analog 2016 - VDE}, author={Abughannam, Saed and Wu, Liang and Müller, Wolfgang and Scheytt, Christoph and Ecker, Wolfgang and Novello, Christiano}, year={2016} }","mla":"Abughannam, Saed, et al. “Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study.” <i>Analog 2016 - VDE</i>, 2016."},"abstract":[{"lang":"eng","text":"The design of safety critical systems requires an efficient methodology for an effective fault effect simulation for analog and digital circuits where analog fault injection and fault effect simulation is currently a field of active research and commercial tools are not available yet. This article begins by discussing fault injection strategies for analog circuits applied on a case study with two topologies of a Voltage Controlled Oscillator (VCO). In the second part it performs on the basis of the example of a Wireless Sensor Network (WSN) node, how far different mixed level implementations with Verilog-A and SPICE can affect the simulation time and points out which component consumes the major part of the simulation time."}],"related_material":{"link":[{"url":"https://ieeexplore.ieee.org/document/7584296/","relation":"confirmation"}]},"language":[{"iso":"eng"}],"_id":"24263","user_id":"15931","year":"2016","title":"Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study","status":"public","conference":{"start_date":"2016.09.12","end_date":"2016.09.14"},"author":[{"id":"37628","first_name":"Saed","last_name":"Abughannam","full_name":"Abughannam, Saed"},{"id":"30401","first_name":"Liang","last_name":"Wu","full_name":"Wu, Liang"},{"full_name":"Müller, Wolfgang","last_name":"Müller","first_name":"Wolfgang","id":"16243"},{"full_name":"Scheytt, Christoph","first_name":"Christoph","last_name":"Scheytt","id":"37144"},{"full_name":"Ecker, Wolfgang","first_name":"Wolfgang","last_name":"Ecker"},{"last_name":"Novello","first_name":"Christiano","full_name":"Novello, Christiano"}],"publication_identifier":{"isbn":["978-3-8007-4265-3"]},"date_updated":"2022-02-17T13:58:08Z"},{"date_updated":"2022-02-17T13:51:39Z","author":[{"last_name":"Nava","first_name":"Federico","full_name":"Nava, Federico"},{"last_name":"Genschow","first_name":"Dieter","full_name":"Genschow, Dieter"},{"full_name":"Scheytt, Christoph","first_name":"Christoph","last_name":"Scheytt","id":"37144"}],"year":"2016","title":"Obstacle detection using a miniaturized radar sensor operating at 120GHz ISM band","status":"public","user_id":"15931","_id":"24262","language":[{"iso":"eng"}],"abstract":[{"text":"Currently, all drone manufactures face the same problem: flight safety utility will become mandatory to obtain the legal admission for broad commercial use of drones. This means that on-board obstacle detection and collision avoidance is a must-have in order to overcome existing legal barriers and acceptance issues. Some of the currently available sensors are too large, too heavy, or can be poorly integrated into existing systems. During the exhibition a demonstration of a novel micro-sensor operating at 120 GHz will be given and participants will have the chance to experience the device first-hand.","lang":"eng"}],"citation":{"mla":"Nava, Federico, et al. “Obstacle Detection Using a Miniaturized Radar Sensor Operating at 120GHz ISM Band.” <i>DRONE Berlin 2016</i>, 2016.","ama":"Nava F, Genschow D, Scheytt C. Obstacle detection using a miniaturized radar sensor operating at 120GHz ISM band. In: <i>DRONE Berlin 2016</i>. ; 2016.","bibtex":"@inproceedings{Nava_Genschow_Scheytt_2016, place={Berlin, Germany}, title={Obstacle detection using a miniaturized radar sensor operating at 120GHz ISM band}, booktitle={DRONE Berlin 2016}, author={Nava, Federico and Genschow, Dieter and Scheytt, Christoph}, year={2016} }","apa":"Nava, F., Genschow, D., &#38; Scheytt, C. (2016). Obstacle detection using a miniaturized radar sensor operating at 120GHz ISM band. <i>DRONE Berlin 2016</i>.","ieee":"F. Nava, D. Genschow, and C. Scheytt, “Obstacle detection using a miniaturized radar sensor operating at 120GHz ISM band,” 2016.","short":"F. Nava, D. Genschow, C. Scheytt, in: DRONE Berlin 2016, Berlin, Germany, 2016.","chicago":"Nava, Federico, Dieter Genschow, and Christoph Scheytt. “Obstacle Detection Using a Miniaturized Radar Sensor Operating at 120GHz ISM Band.” In <i>DRONE Berlin 2016</i>. Berlin, Germany, 2016."},"publication":"DRONE Berlin 2016","department":[{"_id":"58"}],"type":"conference","place":"Berlin, Germany","date_created":"2021-09-13T09:44:27Z"}]