@inproceedings{64131,
  author       = {{Hermelingmeier, Lucas and Teutenberg, Dominik and Meschut, Gerson and Korten, Matthias and Urban, Peter and Marquardt, Raphael and Rethmeier, Michael}},
  location     = {{Köln}},
  title        = {{{Konzeptentwicklung für eine stahlintenisve zirkuläre und modulare Bauweise elektrisch angetriebener Fahrzeuge}}},
  year         = {{2026}},
}

@article{63607,
  author       = {{Striewe, Marius and Schmelzle, Lars and Possart, Gunnar and Meschut, Gerson and Mergheim, Julia and Teutenberg, Dominik}},
  issn         = {{0169-4243}},
  journal      = {{Journal of Adhesion Science and Technology}},
  pages        = {{1--38}},
  publisher    = {{Informa UK Limited}},
  title        = {{{Analytical parameter identification for a viscoplastic material model for structural adhesive bonds}}},
  doi          = {{10.1080/01694243.2025.2611999}},
  year         = {{2026}},
}

@inproceedings{64130,
  author       = {{Hermelingmeier, Lucas and Teutenberg, Dominik and Meschut, Gerson}},
  booktitle    = {{26. Kolloquium: Gemeinsame Forschung in der Klebtechnik}},
  location     = {{Köln}},
  title        = {{{Methodenentwicklung zur Ermittlung lokaler Klebschichtzustände innerhalb struktureller Verbindungen}}},
  year         = {{2026}},
}

@inproceedings{64589,
  author       = {{Rodschei, Maxim and Mergheim, Julia and Neubert, Fynn Lucas and Teutenberg, Dominik and Meschut, Gerson}},
  booktitle    = {{26. Kolloquium: Gemeinsame Forschung in der Klebtechnik}},
  location     = {{Köln}},
  title        = {{{Experimentelle und numerische Untersuchungen zur Alterung von Klebverbindungen unter zyklischer und hygrothermischer Beanspruchung im Stahl- und Anlagenbau}}},
  year         = {{2026}},
}

@inproceedings{64590,
  author       = {{Neubert, Fynn Lucas and Teutenberg, Dominik and Meschut, Gerson}},
  booktitle    = {{26. Kolloquium: Gemeinsame Forschung in der Klebtechnik}},
  location     = {{Köln}},
  title        = {{{Optimierung der induktiven Klebstoff-Schnellhärtung durch numerische Prozesssimulation}}},
  year         = {{2026}},
}

@inproceedings{64593,
  author       = {{Neubert, Fynn Lucas and Teutenberg, Dominik and Meschut, Gerson and Rodschei, Maxim and Mergheim, Julia}},
  booktitle    = {{DECHEMA-Workshop für Klebstoffanwender: Langzeitverhalten von Klebungen}},
  location     = {{Köln}},
  title        = {{{Bewitterung in der Simulation}}},
  year         = {{2026}},
}

@article{64813,
  abstract     = {{This paper describes the development of a method concept for the mechanical characterisation of cathodic electrodeposition (CED) coatings in the context of adhesively bonded joints. The objective is to determine mechanical properties of coating layer in order to incorporate its influence into numerical simulation models for load-bearing adhesive joints. For this purpose, both single-lap joints (SLJ) and modified thick adherend shear specimens (TASS) with defined CED coating layers were produced and tested under quasi-static loading conditions. Additionally, the deposition process was analysed in terms of coating thickness evolution as a function of deposition time and applied voltage. The specimens were pre-cured to reduce gas inclusions from evaporating solvents in the CED coating layer. The pre-curing temperature was determined using DSC. The results indicate that the modified TASS configuration is particularly suited for the reproducible evaluation of the shear load-bearing capacity. In comparison to the SLJ, it favours the degassing of solvents through the installation of grooves. Furthermore, it is demonstrated that gas-induced defect zones originating from the electrochemical deposition process significantly compromise joint performance. The experimental and process methodology developed in this study enables isolated characterisation of the coating layer and provides a solid foundation for simulation of coated adhesive joints.}},
  author       = {{Hofmann, Julia and Teutenberg, Dominik and Meschut, Gerson}},
  issn         = {{0021-8464}},
  journal      = {{The Journal of Adhesion}},
  pages        = {{1--16}},
  publisher    = {{Informa UK Limited}},
  title        = {{{Method development for the mechanical characterisation of cathodic electrodeposition coatings for numerical simulation of bonded joints}}},
  doi          = {{10.1080/00218464.2026.2621198}},
  year         = {{2026}},
}

@inproceedings{64815,
  author       = {{Hofmann, Julia and Teutenberg, Dominik and Meschut, Gerson and Schulz, Paul and Gude, Maik}},
  booktitle    = {{26. Kolloquium: Gemeinsame Forschung in der Klebtechnik}},
  title        = {{{Entwicklung eines methodischen Ansatzes zur Gewährleistung der anforderungsgerechten Klebbarkeit von rezyklatbasierten Kunststoffen in der Kreislaufwirtschaft}}},
  year         = {{2026}},
}

@inproceedings{64814,
  author       = {{Hofmann, Julia and Teutenberg, Dominik and Meschut, Gerson}},
  booktitle    = {{26. Kolloquium: Gemeinsame Forschung in der Klebtechnik}},
  title        = {{{Methodenentwicklung zur numerischen Auslegung von Klebverbindungen mit lackierten Fügeteilen}}},
  year         = {{2026}},
}

@article{64916,
  abstract     = {{The joining of dissimilar materials, such as steel and aluminum, entails significant challenges during thermal curing processes due to differing coefficients of thermal expansion. This study addresses the formation of “viscous fingering” instabilities in structural adhesive joints, which are induced by thermally driven relative displacements during the liquid phase of the adhesive. Using a component-like specimen “bridge specimen,” the dependency of this phenomenon on process temperature and structural stiffness (rivet distance) was characterized. Experimental results reveal that while the relative displacement scales cubically with the free buckling length, the resulting adhesive area reduction follows an exponential trend, leading to a loss of effective bond area of up to 79%, which significantly compromises the joint strength in automotive applications. To predict these process-induced defects, a thermo-chemo-viscoelastic-viscoplastic adhesive model implemented in LS-DYNA was applied. The model combines curing kinetics, viscoelastic relaxation, and pressure-dependent plasticity and features a geometric damage parameter (D) that captures the adhesive area reduction caused by viscous fingering as an exponential function of the accumulated normal strain in the liquid phase. This damage parameter, calibrated on base-specimen level, was transferred to the component geometry. The simulation demonstrated high predictive accuracy with a maximum deviation of the adhesive area reduction of 3.1% compared to experimental data. This validates the model’s capability to predict manufacturing-induced damage in complex hybrid structures solely based on thermal boundary conditions.}},
  author       = {{Al Trjman, Mohamad and Beule, Felix and Teutenberg, Dominik and Meschut, Gerson and Riese, Julia}},
  issn         = {{0021-8464}},
  journal      = {{The Journal of Adhesion}},
  keywords     = {{Adhesive area reduction, CED coating process, delta alpha problem, epoxy structural adhesive, influence of manufacture, multi-material design, numerical simulation (FEM), relative displacements, viscous fingering (saffman-taylor-instability).}},
  pages        = {{1--24}},
  publisher    = {{Informa UK Limited}},
  title        = {{{Experimental characterization and numerical analysis of the influence of the CED coating process on viscous fingering formation in hybrid-jointed mixed structures}}},
  doi          = {{10.1080/00218464.2026.2644394}},
  year         = {{2026}},
}

@article{65104,
  author       = {{Hermelingmeier, Lucas and Beule, Felix and Teutenberg, Dominik and Meschut, Gerson}},
  issn         = {{0143-7496}},
  journal      = {{International Journal of Adhesion and Adhesives}},
  publisher    = {{Elsevier BV}},
  title        = {{{Comparison of fixture-based and manual fiber integration in adhesive joints: Effects on strain signal quality}}},
  doi          = {{10.1016/j.ijadhadh.2026.104319}},
  volume       = {{149}},
  year         = {{2026}},
}

@article{58454,
  abstract     = {{Powertrain concepts incorporating renewable energies are an essential element of the energy revolution and increasingly require efficient manufacturing processes for electronic systems. Particularly, the joining of structures to be thermally coupled, such as the battery modules and the thermal management system (TMS), poses new challenges in process design. Factors that limit the process include the increased density, viscosity, and abrasiveness of thermal pastes as well as the pressure sensitivity of battery modules. The research presented aims to systematically investigate the influences of joining parameters on flow behavior, the formation of air inclusions, and the occurring joining forces to understand and systematically optimize the joining process. Employing a test setup following the Closing-Hele-Shaw-Cell, the influence of specific process parameters on the joining process such as the joining speed, joining gap, application pattern, and temperature was investigated for a silicone- and a polyurethane-based thermally conductive paste. The results indicate a high dependency of both the ensuing joining forces and the flow behavior on the parameters investigated. These insights imply a potential systematic parameter optimization and the specific adaptation of the joining process to improve flow behavior and reduce compressive stresses. This can ensure lower component deformations and qualify the process for the employment of cell types with a higher power density, a reduced encapsulation, and lower stiffness while at the same time improving production rates.}},
  author       = {{Gilich, Julian and Teutenberg, Dominik and Meschut, Gerson and Gröger, B. and Wiebicke, F. and Koch, I. and Gude, M.}},
  issn         = {{0043-2288}},
  journal      = {{Welding in the World}},
  publisher    = {{Springer Science and Business Media LLC}},
  title        = {{{Effects of various process parameters in the joining process on the squeeze flow of highly viscous thermal interface materials}}},
  doi          = {{10.1007/s40194-025-01929-3}},
  year         = {{2025}},
}

@inproceedings{60623,
  author       = {{Hermelingmeier, Lucas and Teutenberg, Dominik and Meschut, Gerson}},
  location     = {{Porto, Portugal}},
  title        = {{{Application of distributed fiber optic sensing for defect detection in adhesive bonds}}},
  year         = {{2025}},
}

@inproceedings{58878,
  author       = {{Buczek, Moritz and Duffe, Tobias and Kullmer, Gunter and Tews, Karina and Teutenberg, Dominik and Meschut, Gerson}},
  booktitle    = {{25. Kolloquium: Gemeinsame Forschung in der Klebtechnik}},
  location     = {{Köln}},
  title        = {{{Bruchmechanisches Schnittebenenkonzept zur lebensdauergerechten Auslegung von hyperelastischen Klebverbindungen bei multiaxialen und variablen Belastungsamplituden}}},
  year         = {{2025}},
}

@inproceedings{58843,
  author       = {{Beule, Felix and Teutenberg, Dominik and Meschut, Gerson}},
  booktitle    = {{25. Kolloquium: Gemeinsame Forschung in der Klebtechnik}},
  location     = {{Köln}},
  title        = {{{Berücksichtigung des Einflusses fertigungsinduzierter Vorverformungen warmaushärtender Klebstoffe auf die Schwingfestigkeit geklebter Verbindungen}}},
  year         = {{2025}},
}

@inproceedings{58844,
  author       = {{Schmelzle, Lars and Beule, Felix and Possart, Gunnar and Teutenberg, Dominik and Mergheim, Julia and Meschut, Gerson}},
  booktitle    = {{25. Kolloquium: Gemeinsame Forschung in der Klebtechnik}},
  location     = {{Köln}},
  title        = {{{Methodenentwicklung zur Simulation von hyperelastischen Klebverbindungen unter Crashbelastung}}},
  year         = {{2025}},
}

@inproceedings{60615,
  author       = {{Hermelingmeier, Lucas and Teutenberg, Dominik and Meschut, Gerson}},
  booktitle    = {{25. Kolloquium: Gemeinsame Forschung in der Klebtechnik}},
  title        = {{{Methodenentwicklung zur Ermittlung lokaler Klebschichtzustände innerhalb struktureller Verbindungen}}},
  year         = {{2025}},
}

@inproceedings{64588,
  author       = {{Neubert, Fynn Lucas and Teutenberg, Dominik and Meschut, Gerson and Rodschei, Maxim and Mergheim, Julia}},
  booktitle    = {{25. Kolloquium: Gemeinsame Forschung in der Klebtechnik}},
  location     = {{Köln}},
  title        = {{{Experimentelle und numerische Untersuchungen zur Alterung von Klebverbindungen unter zyklischer und hygrothermischer Beanspruchung im Stahl- und Anlagenbau}}},
  year         = {{2025}},
}

@inproceedings{64812,
  author       = {{Hofmann, Julia and Teutenberg, Dominik and Meschut, Gerson}},
  booktitle    = {{25. Kolloquium: Gemeinsame Forschung in der Klebtechnik}},
  location     = {{Köln}},
  title        = {{{Methodenentwicklung zur numerischen Auslegung von Klebverbindungen mit lackierten Fügeteilen}}},
  year         = {{2025}},
}

@article{58672,
  author       = {{Al Trjman, Mohamad and Salten, Alexander Heinrich Johannes and Beule, Felix and Teutenberg, Dominik and Meschut, Gerson and Riese, Julia and Kenig, Eugeny}},
  issn         = {{0143-7496}},
  journal      = {{International Journal of Adhesion and Adhesives}},
  publisher    = {{Elsevier BV}},
  title        = {{{Viscous fingering in adhesive bonding}}},
  doi          = {{10.1016/j.ijadhadh.2025.103960}},
  volume       = {{139}},
  year         = {{2025}},
}