[{"doi":"10.1080/01694243.2025.2569660","title":"Testing, modelling and parameter identification for adhesively bonded joints under the combined influence of temperature and strain rate","author":[{"last_name":"Schmelzle","full_name":"Schmelzle, Lars","first_name":"Lars"},{"full_name":"Striewe, Marius","id":"30228","last_name":"Striewe","first_name":"Marius"},{"full_name":"Mergheim, Julia","last_name":"Mergheim","first_name":"Julia"},{"id":"32056","full_name":"Meschut, Gerson","last_name":"Meschut","orcid":"0000-0002-2763-1246","first_name":"Gerson"},{"first_name":"Gunnar","full_name":"Possart, Gunnar","last_name":"Possart"},{"last_name":"Teutenberg","id":"537","full_name":"Teutenberg, Dominik","first_name":"Dominik"}],"date_created":"2025-10-28T10:28:49Z","publisher":"Informa UK Limited","date_updated":"2025-10-28T10:32:49Z","page":"1-24","citation":{"ama":"Schmelzle L, Striewe M, Mergheim J, Meschut G, Possart G, Teutenberg D. Testing, modelling and parameter identification for adhesively bonded joints under the combined influence of temperature and strain rate. <i>Journal of Adhesion Science and Technology</i>. Published online 2025:1-24. doi:<a href=\"https://doi.org/10.1080/01694243.2025.2569660\">10.1080/01694243.2025.2569660</a>","chicago":"Schmelzle, Lars, Marius Striewe, Julia Mergheim, Gerson Meschut, Gunnar Possart, and Dominik Teutenberg. “Testing, Modelling and Parameter Identification for Adhesively Bonded Joints under the Combined Influence of Temperature and Strain Rate.” <i>Journal of Adhesion Science and Technology</i>, 2025, 1–24. <a href=\"https://doi.org/10.1080/01694243.2025.2569660\">https://doi.org/10.1080/01694243.2025.2569660</a>.","ieee":"L. Schmelzle, M. Striewe, J. Mergheim, G. Meschut, G. Possart, and D. Teutenberg, “Testing, modelling and parameter identification for adhesively bonded joints under the combined influence of temperature and strain rate,” <i>Journal of Adhesion Science and Technology</i>, pp. 1–24, 2025, doi: <a href=\"https://doi.org/10.1080/01694243.2025.2569660\">10.1080/01694243.2025.2569660</a>.","short":"L. Schmelzle, M. Striewe, J. Mergheim, G. Meschut, G. Possart, D. Teutenberg, Journal of Adhesion Science and Technology (2025) 1–24.","mla":"Schmelzle, Lars, et al. “Testing, Modelling and Parameter Identification for Adhesively Bonded Joints under the Combined Influence of Temperature and Strain Rate.” <i>Journal of Adhesion Science and Technology</i>, Informa UK Limited, 2025, pp. 1–24, doi:<a href=\"https://doi.org/10.1080/01694243.2025.2569660\">10.1080/01694243.2025.2569660</a>.","bibtex":"@article{Schmelzle_Striewe_Mergheim_Meschut_Possart_Teutenberg_2025, title={Testing, modelling and parameter identification for adhesively bonded joints under the combined influence of temperature and strain rate}, DOI={<a href=\"https://doi.org/10.1080/01694243.2025.2569660\">10.1080/01694243.2025.2569660</a>}, journal={Journal of Adhesion Science and Technology}, publisher={Informa UK Limited}, author={Schmelzle, Lars and Striewe, Marius and Mergheim, Julia and Meschut, Gerson and Possart, Gunnar and Teutenberg, Dominik}, year={2025}, pages={1–24} }","apa":"Schmelzle, L., Striewe, M., Mergheim, J., Meschut, G., Possart, G., &#38; Teutenberg, D. (2025). Testing, modelling and parameter identification for adhesively bonded joints under the combined influence of temperature and strain rate. <i>Journal of Adhesion Science and Technology</i>, 1–24. <a href=\"https://doi.org/10.1080/01694243.2025.2569660\">https://doi.org/10.1080/01694243.2025.2569660</a>"},"year":"2025","publication_identifier":{"issn":["0169-4243","1568-5616"]},"quality_controlled":"1","publication_status":"published","language":[{"iso":"eng"}],"department":[{"_id":"157"}],"user_id":"30228","_id":"62009","status":"public","publication":"Journal of Adhesion Science and Technology","type":"journal_article"},{"abstract":[{"text":"In the context of decarbonization initiatives, the repairability and recyclability of components have become a major concern in various industrial sectors, particularly for resource-intensive components. The development of innovative bonding and debonding processes that must adhere to the stringent mechanical specifications of the manufacturers and facilitate their efficient disassembly is a major issue faced in the implementation of a sustainable circular economy. Although adhesively bonded joints satisfy the stringent requirements for mechanical performance, they present several challenges during the repair and recycling process. Solvolytically debondable epoxy resin adhesives may be employed to overcome this issue. In this study, we aim to conduct an exploratory feasibility study on the application of such chemical debonding mechanisms within an adhesive bond as well as to systematically analyse and evaluate the suitability of such adhesive systems for various applications. To this end, we employed various thermo-analytical methods and quasi-static tensile tests to characterise the mechanical adhesive and joint properties of two solvolytically debondable adhesive systems. Furthermore, we analysed the debondability of the adhesive joints and evaluated their feasibility in an industrial environment. The results indicate considerable application potential for solvolytically debondable adhesives, along with further development steps currently required.","lang":"eng"}],"status":"public","publication":"The Journal of Adhesion","type":"journal_article","language":[{"iso":"eng"}],"_id":"63108","department":[{"_id":"157"}],"user_id":"44391","year":"2025","page":"1-26","citation":{"apa":"Gilich, J., Kroos, J., Teutenberg, D., &#38; Meschut, G. (2025). Solvolytically debondable adhesive systems – potentials and challenges for repair and recycling. <i>The Journal of Adhesion</i>, 1–26. <a href=\"https://doi.org/10.1080/00218464.2025.2600590\">https://doi.org/10.1080/00218464.2025.2600590</a>","short":"J. Gilich, J. Kroos, D. Teutenberg, G. Meschut, The Journal of Adhesion (2025) 1–26.","bibtex":"@article{Gilich_Kroos_Teutenberg_Meschut_2025, title={Solvolytically debondable adhesive systems – potentials and challenges for repair and recycling}, DOI={<a href=\"https://doi.org/10.1080/00218464.2025.2600590\">10.1080/00218464.2025.2600590</a>}, journal={The Journal of Adhesion}, publisher={Informa UK Limited}, author={Gilich, Julian and Kroos, Janika and Teutenberg, Dominik and Meschut, Gerson}, year={2025}, pages={1–26} }","mla":"Gilich, Julian, et al. “Solvolytically Debondable Adhesive Systems – Potentials and Challenges for Repair and Recycling.” <i>The Journal of Adhesion</i>, Informa UK Limited, 2025, pp. 1–26, doi:<a href=\"https://doi.org/10.1080/00218464.2025.2600590\">10.1080/00218464.2025.2600590</a>.","ama":"Gilich J, Kroos J, Teutenberg D, Meschut G. Solvolytically debondable adhesive systems – potentials and challenges for repair and recycling. <i>The Journal of Adhesion</i>. Published online 2025:1-26. doi:<a href=\"https://doi.org/10.1080/00218464.2025.2600590\">10.1080/00218464.2025.2600590</a>","chicago":"Gilich, Julian, Janika Kroos, Dominik Teutenberg, and Gerson Meschut. “Solvolytically Debondable Adhesive Systems – Potentials and Challenges for Repair and Recycling.” <i>The Journal of Adhesion</i>, 2025, 1–26. <a href=\"https://doi.org/10.1080/00218464.2025.2600590\">https://doi.org/10.1080/00218464.2025.2600590</a>.","ieee":"J. Gilich, J. Kroos, D. Teutenberg, and G. Meschut, “Solvolytically debondable adhesive systems – potentials and challenges for repair and recycling,” <i>The Journal of Adhesion</i>, pp. 1–26, 2025, doi: <a href=\"https://doi.org/10.1080/00218464.2025.2600590\">10.1080/00218464.2025.2600590</a>."},"publication_identifier":{"issn":["0021-8464","1545-5823"]},"quality_controlled":"1","publication_status":"published","title":"Solvolytically debondable adhesive systems – potentials and challenges for repair and recycling","doi":"10.1080/00218464.2025.2600590","publisher":"Informa UK Limited","date_updated":"2025-12-16T07:53:52Z","author":[{"first_name":"Julian","id":"44391","full_name":"Gilich, Julian","last_name":"Gilich"},{"id":"50198","full_name":"Kroos, Janika","last_name":"Kroos","first_name":"Janika"},{"first_name":"Dominik","id":"537","full_name":"Teutenberg, Dominik","last_name":"Teutenberg"},{"first_name":"Gerson","last_name":"Meschut","orcid":"0000-0002-2763-1246","id":"32056","full_name":"Meschut, Gerson"}],"date_created":"2025-12-16T07:50:36Z"},{"title":"Bruchmechanisches Schnittebenenkonzept zur lebensdauergerechten Auslegung von hyperelastischen Klebverbindungen bei multiaxialen und variablen Belastungsamplituden","conference":{"location":"Köln","end_date":"2024-02-28","start_date":"2024-02-27","name":"24. Kolloquium: Gemeinsame Forschung in der Klebtechnik"},"date_updated":"2024-02-29T12:33:41Z","author":[{"last_name":"Tews","id":"40263","full_name":"Tews, Karina","first_name":"Karina"},{"last_name":"Teutenberg","full_name":"Teutenberg, Dominik","id":"537","first_name":"Dominik"},{"full_name":"Meschut, Gerson","id":"32056","orcid":"0000-0002-2763-1246","last_name":"Meschut","first_name":"Gerson"},{"last_name":"Buczek","full_name":"Buczek, Moritz","id":"83727","first_name":"Moritz"},{"first_name":"Tobias","last_name":"Duffe","id":"41322","full_name":"Duffe, Tobias"},{"first_name":"Gunter","id":"291","full_name":"Kullmer, Gunter","last_name":"Kullmer"}],"date_created":"2024-02-29T12:24:25Z","year":"2024","citation":{"mla":"Tews, Karina, et al. “Bruchmechanisches Schnittebenenkonzept zur lebensdauergerechten Auslegung von hyperelastischen Klebverbindungen bei multiaxialen und variablen Belastungsamplituden.” <i>24. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>, 2024.","bibtex":"@inproceedings{Tews_Teutenberg_Meschut_Buczek_Duffe_Kullmer_2024, title={Bruchmechanisches Schnittebenenkonzept zur lebensdauergerechten Auslegung von hyperelastischen Klebverbindungen bei multiaxialen und variablen Belastungsamplituden}, booktitle={24. Kolloquium: Gemeinsame Forschung in der Klebtechnik}, author={Tews, Karina and Teutenberg, Dominik and Meschut, Gerson and Buczek, Moritz and Duffe, Tobias and Kullmer, Gunter}, year={2024} }","short":"K. Tews, D. Teutenberg, G. Meschut, M. Buczek, T. Duffe, G. Kullmer, in: 24. Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2024.","apa":"Tews, K., Teutenberg, D., Meschut, G., Buczek, M., Duffe, T., &#38; Kullmer, G. (2024). Bruchmechanisches Schnittebenenkonzept zur lebensdauergerechten Auslegung von hyperelastischen Klebverbindungen bei multiaxialen und variablen Belastungsamplituden. <i>24. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>. 24. Kolloquium: Gemeinsame Forschung in der Klebtechnik, Köln.","ama":"Tews K, Teutenberg D, Meschut G, Buczek M, Duffe T, Kullmer G. Bruchmechanisches Schnittebenenkonzept zur lebensdauergerechten Auslegung von hyperelastischen Klebverbindungen bei multiaxialen und variablen Belastungsamplituden. In: <i>24. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>. ; 2024.","chicago":"Tews, Karina, Dominik Teutenberg, Gerson Meschut, Moritz Buczek, Tobias Duffe, and Gunter Kullmer. “Bruchmechanisches Schnittebenenkonzept zur lebensdauergerechten Auslegung von hyperelastischen Klebverbindungen bei multiaxialen und variablen Belastungsamplituden.” In <i>24. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>, 2024.","ieee":"K. Tews, D. Teutenberg, G. Meschut, M. Buczek, T. Duffe, and G. Kullmer, “Bruchmechanisches Schnittebenenkonzept zur lebensdauergerechten Auslegung von hyperelastischen Klebverbindungen bei multiaxialen und variablen Belastungsamplituden,” presented at the 24. Kolloquium: Gemeinsame Forschung in der Klebtechnik, Köln, 2024."},"language":[{"iso":"ger"}],"_id":"52212","user_id":"40263","department":[{"_id":"157"}],"status":"public","type":"conference","publication":"24. Kolloquium: Gemeinsame Forschung in der Klebtechnik"},{"status":"public","type":"conference_abstract","language":[{"iso":"eng"}],"user_id":"66192","department":[{"_id":"157"}],"_id":"54142","citation":{"mla":"Beule, Felix, et al. <i>Method Development (Modelling, Simulation, Characterisation) in Adhesive Bonding Technology</i>. 2024.","bibtex":"@inproceedings{Beule_Al Trjman_Teutenberg_Meschut_2024, place={Shanghai}, title={Method development (modelling, simulation, characterisation) in adhesive bonding technology}, author={Beule, Felix and Al Trjman, Mohamad and Teutenberg, Dominik and Meschut, Gerson}, year={2024} }","short":"F. Beule, M. Al Trjman, D. Teutenberg, G. Meschut, in: Shanghai, 2024.","apa":"Beule, F., Al Trjman, M., Teutenberg, D., &#38; Meschut, G. (2024). <i>Method development (modelling, simulation, characterisation) in adhesive bonding technology</i>. International Symposium Smart Joining Solutions for Future Mobility, Shanghai.","ama":"Beule F, Al Trjman M, Teutenberg D, Meschut G. Method development (modelling, simulation, characterisation) in adhesive bonding technology. In: ; 2024.","ieee":"F. Beule, M. Al Trjman, D. Teutenberg, and G. Meschut, “Method development (modelling, simulation, characterisation) in adhesive bonding technology,” presented at the International Symposium Smart Joining Solutions for Future Mobility, Shanghai, 2024.","chicago":"Beule, Felix, Mohamad Al Trjman, Dominik Teutenberg, and Gerson Meschut. “Method Development (Modelling, Simulation, Characterisation) in Adhesive Bonding Technology.” Shanghai, 2024."},"place":"Shanghai","year":"2024","conference":{"name":"International Symposium Smart Joining Solutions for Future Mobility","start_date":"2024-04-24","end_date":"2024-04-24","location":"Shanghai"},"title":"Method development (modelling, simulation, characterisation) in adhesive bonding technology","author":[{"last_name":"Beule","id":"66192","full_name":"Beule, Felix","first_name":"Felix"},{"full_name":"Al Trjman, Mohamad","id":"65415","last_name":"Al Trjman","first_name":"Mohamad"},{"id":"537","full_name":"Teutenberg, Dominik","last_name":"Teutenberg","first_name":"Dominik"},{"last_name":"Meschut","orcid":"0000-0002-2763-1246","full_name":"Meschut, Gerson","id":"32056","first_name":"Gerson"}],"date_created":"2024-05-10T06:06:50Z","date_updated":"2024-05-10T06:07:02Z"},{"language":[{"iso":"eng"}],"_id":"56087","user_id":"66192","department":[{"_id":"157"}],"status":"public","type":"conference","publication":"The 16th International Conference on the Science and Technology of Adhesion and Adhesives","title":"Numerical modelling of the influence of viscous fingering on the mechanical properties of structural adhesive joints","conference":{"location":"Oxford, UK","end_date":"2024-09-06","start_date":"2024-09-04","name":"The 16th International Conference on the Science and Technology of Adhesion and Adhesives"},"date_updated":"2024-09-06T09:31:50Z","date_created":"2024-09-06T09:31:34Z","author":[{"first_name":"Felix","full_name":"Beule, Felix","id":"66192","last_name":"Beule"},{"first_name":"Dominik","last_name":"Teutenberg","id":"537","full_name":"Teutenberg, Dominik"},{"first_name":"Gerson","last_name":"Meschut","orcid":"0000-0002-2763-1246","full_name":"Meschut, Gerson","id":"32056"}],"place":"London","year":"2024","citation":{"short":"F. Beule, D. Teutenberg, G. Meschut, in: IOM3 (Ed.), The 16th International Conference on the Science and Technology of Adhesion and Adhesives, London, 2024.","mla":"Beule, Felix, et al. “Numerical Modelling of the Influence of Viscous Fingering on the Mechanical Properties of Structural Adhesive Joints.” <i>The 16th International Conference on the Science and Technology of Adhesion and Adhesives</i>, edited by IOM3, 2024.","bibtex":"@inproceedings{Beule_Teutenberg_Meschut_2024, place={London}, title={Numerical modelling of the influence of viscous fingering on the mechanical properties of structural adhesive joints}, booktitle={The 16th International Conference on the Science and Technology of Adhesion and Adhesives}, author={Beule, Felix and Teutenberg, Dominik and Meschut, Gerson}, editor={IOM3}, year={2024} }","apa":"Beule, F., Teutenberg, D., &#38; Meschut, G. (2024). Numerical modelling of the influence of viscous fingering on the mechanical properties of structural adhesive joints. In IOM3 (Ed.), <i>The 16th International Conference on the Science and Technology of Adhesion and Adhesives</i>.","ieee":"F. Beule, D. Teutenberg, and G. Meschut, “Numerical modelling of the influence of viscous fingering on the mechanical properties of structural adhesive joints,” in <i>The 16th International Conference on the Science and Technology of Adhesion and Adhesives</i>, Oxford, UK, 2024.","chicago":"Beule, Felix, Dominik Teutenberg, and Gerson Meschut. “Numerical Modelling of the Influence of Viscous Fingering on the Mechanical Properties of Structural Adhesive Joints.” In <i>The 16th International Conference on the Science and Technology of Adhesion and Adhesives</i>, edited by IOM3. London, 2024.","ama":"Beule F, Teutenberg D, Meschut G. Numerical modelling of the influence of viscous fingering on the mechanical properties of structural adhesive joints. In: IOM3, ed. <i>The 16th International Conference on the Science and Technology of Adhesion and Adhesives</i>. ; 2024."},"corporate_editor":["IOM3"]},{"publication":"DECHEMA Workshop für Klebstoffanwender: Simulation von Klebverbindungen","type":"conference","status":"public","_id":"52216","department":[{"_id":"157"}],"user_id":"40263","language":[{"iso":"ger"}],"year":"2024","citation":{"ieee":"K. Tews, D. Teutenberg, and G. Meschut, “Mechanisches Verhalten: Charakterisierung von Klebstoffen,” presented at the DECHEMA Workshop für Klebstoffanwender: Simulation von Klebverbindungen, Köln, 2024.","chicago":"Tews, Karina, Dominik Teutenberg, and Gerson Meschut. “Mechanisches Verhalten: Charakterisierung von Klebstoffen.” In <i>DECHEMA Workshop für Klebstoffanwender: Simulation von Klebverbindungen</i>, 2024.","ama":"Tews K, Teutenberg D, Meschut G. Mechanisches Verhalten: Charakterisierung von Klebstoffen. In: <i>DECHEMA Workshop für Klebstoffanwender: Simulation von Klebverbindungen</i>. ; 2024.","apa":"Tews, K., Teutenberg, D., &#38; Meschut, G. (2024). Mechanisches Verhalten: Charakterisierung von Klebstoffen. <i>DECHEMA Workshop für Klebstoffanwender: Simulation von Klebverbindungen</i>. DECHEMA Workshop für Klebstoffanwender: Simulation von Klebverbindungen, Köln.","short":"K. Tews, D. Teutenberg, G. Meschut, in: DECHEMA Workshop für Klebstoffanwender: Simulation von Klebverbindungen, 2024.","bibtex":"@inproceedings{Tews_Teutenberg_Meschut_2024, title={Mechanisches Verhalten: Charakterisierung von Klebstoffen}, booktitle={DECHEMA Workshop für Klebstoffanwender: Simulation von Klebverbindungen}, author={Tews, Karina and Teutenberg, Dominik and Meschut, Gerson}, year={2024} }","mla":"Tews, Karina, et al. “Mechanisches Verhalten: Charakterisierung von Klebstoffen.” <i>DECHEMA Workshop für Klebstoffanwender: Simulation von Klebverbindungen</i>, 2024."},"date_updated":"2025-01-30T08:49:33Z","author":[{"first_name":"Karina","last_name":"Tews","full_name":"Tews, Karina","id":"40263"},{"first_name":"Dominik","full_name":"Teutenberg, Dominik","id":"537","last_name":"Teutenberg"},{"first_name":"Gerson","orcid":"0000-0002-2763-1246","last_name":"Meschut","full_name":"Meschut, Gerson","id":"32056"}],"date_created":"2024-02-29T12:33:31Z","title":"Mechanisches Verhalten: Charakterisierung von Klebstoffen","conference":{"location":"Köln","name":"DECHEMA Workshop für Klebstoffanwender: Simulation von Klebverbindungen","start_date":"22024-02-26"}},{"citation":{"ama":"Gilich J, Teutenberg D, Meschut G, et al. Influences on the Material Displacement and Compression Stresses in the Joining Process of Highly Viscous Thermal Interface Materials. In: <i>77th IIW Annual Assembly and International Conference on Welding and Joining</i>. ; 2024.","chicago":"Gilich, Julian, Dominik Teutenberg, Gerson Meschut, Benjamin Gröger, Felix Wiebicke, Ilja Koch, and Maik Gude. “Influences on the Material Displacement and Compression Stresses in the Joining Process of Highly Viscous Thermal Interface Materials.” In <i>77th IIW Annual Assembly and International Conference on Welding and Joining</i>, 2024.","ieee":"J. Gilich <i>et al.</i>, “Influences on the Material Displacement and Compression Stresses in the Joining Process of Highly Viscous Thermal Interface Materials,” presented at the 77th IIW Annual Assembly and International Conference on Welding and Joining, Rhodos, Griechenland, 2024.","mla":"Gilich, Julian, et al. “Influences on the Material Displacement and Compression Stresses in the Joining Process of Highly Viscous Thermal Interface Materials.” <i>77th IIW Annual Assembly and International Conference on Welding and Joining</i>, 2024.","short":"J. Gilich, D. Teutenberg, G. Meschut, B. Gröger, F. Wiebicke, I. Koch, M. Gude, in: 77th IIW Annual Assembly and International Conference on Welding and Joining, 2024.","bibtex":"@inproceedings{Gilich_Teutenberg_Meschut_Gröger_Wiebicke_Koch_Gude_2024, title={Influences on the Material Displacement and Compression Stresses in the Joining Process of Highly Viscous Thermal Interface Materials}, booktitle={77th IIW Annual Assembly and International Conference on Welding and Joining}, author={Gilich, Julian and Teutenberg, Dominik and Meschut, Gerson and Gröger, Benjamin and Wiebicke, Felix and Koch, Ilja and Gude, Maik}, year={2024} }","apa":"Gilich, J., Teutenberg, D., Meschut, G., Gröger, B., Wiebicke, F., Koch, I., &#38; Gude, M. (2024). Influences on the Material Displacement and Compression Stresses in the Joining Process of Highly Viscous Thermal Interface Materials. <i>77th IIW Annual Assembly and International Conference on Welding and Joining</i>. 77th IIW Annual Assembly and International Conference on Welding and Joining, Rhodos, Griechenland."},"year":"2024","conference":{"start_date":"2024-07-12","name":"77th IIW Annual Assembly and International Conference on Welding and Joining","location":"Rhodos, Griechenland","end_date":"2024-07-07"},"title":"Influences on the Material Displacement and Compression Stresses in the Joining Process of Highly Viscous Thermal Interface Materials","author":[{"full_name":"Gilich, Julian","id":"44391","last_name":"Gilich","first_name":"Julian"},{"first_name":"Dominik","last_name":"Teutenberg","id":"537","full_name":"Teutenberg, Dominik"},{"first_name":"Gerson","id":"32056","full_name":"Meschut, Gerson","orcid":"0000-0002-2763-1246","last_name":"Meschut"},{"first_name":"Benjamin","full_name":"Gröger, Benjamin","last_name":"Gröger"},{"full_name":"Wiebicke, Felix","last_name":"Wiebicke","first_name":"Felix"},{"first_name":"Ilja","full_name":"Koch, Ilja","last_name":"Koch"},{"first_name":"Maik","last_name":"Gude","full_name":"Gude, Maik"}],"date_created":"2025-01-31T12:34:52Z","date_updated":"2025-01-31T12:35:05Z","status":"public","type":"conference_abstract","publication":"77th IIW Annual Assembly and International Conference on Welding and Joining","language":[{"iso":"eng"}],"user_id":"44391","department":[{"_id":"157"}],"_id":"58458"},{"quality_controlled":"1","citation":{"ieee":"F. Beule, D. Teutenberg, and G. Meschut, “Klebstoffmodell - Parameteridentifikation, Verifikation und Validierung für den Lastfall Crash,” in <i>DECHEMA-Workshop für Klebstoffanwender: Simulation von Klebverbindungen</i>, Köln, 2024.","chicago":"Beule, Felix, Dominik Teutenberg, and Gerson Meschut. “Klebstoffmodell - Parameteridentifikation, Verifikation Und Validierung Für Den Lastfall Crash.” In <i>DECHEMA-Workshop Für Klebstoffanwender: Simulation von Klebverbindungen</i>, edited by DECHEMA, 2024.","ama":"Beule F, Teutenberg D, Meschut G. Klebstoffmodell - Parameteridentifikation, Verifikation und Validierung für den Lastfall Crash. In: DECHEMA, ed. <i>DECHEMA-Workshop Für Klebstoffanwender: Simulation von Klebverbindungen</i>. ; 2024.","short":"F. Beule, D. Teutenberg, G. 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Optimization of inductive fast-curing of epoxy adhesive by model-based kinetics. <i>International Journal of Adhesion and Adhesives</i>, <i>124</i>. <a href=\"https://doi.org/10.1016/j.ijadhadh.2023.103392\">https://doi.org/10.1016/j.ijadhadh.2023.103392</a>"},"date_updated":"2023-05-09T06:43:41Z","publisher":"Elsevier","volume":124,"date_created":"2023-01-09T15:48:17Z","author":[{"last_name":"Kowatz","orcid":"0000-0002-4972-4718","full_name":"Kowatz, Jannik","id":"32252","first_name":"Jannik"},{"first_name":"Dominik","last_name":"Teutenberg","full_name":"Teutenberg, Dominik","id":"537"},{"first_name":"Gerson","last_name":"Meschut","orcid":"0000-0002-2763-1246","full_name":"Meschut, Gerson","id":"32056"}],"title":"Optimization of inductive fast-curing of epoxy adhesive by model-based kinetics","doi":"https://doi.org/10.1016/j.ijadhadh.2023.103392"},{"_id":"52689","user_id":"537","series_title":"DVS Berichte","department":[{"_id":"157"}],"language":[{"iso":"ger"}],"type":"book_chapter","publication":"Klebtechnische Doktorandenseminare 2020 - 2022","status":"public","date_updated":"2026-02-23T08:27:39Z","author":[{"first_name":"Marius","id":"30228","full_name":"Striewe, Marius","last_name":"Striewe"},{"last_name":"Teutenberg","full_name":"Teutenberg, Dominik","id":"537","first_name":"Dominik"},{"first_name":"David","last_name":"Hein","id":"7728","full_name":"Hein, David"},{"first_name":"Gerson","orcid":"0000-0002-2763-1246","last_name":"Meschut","full_name":"Meschut, Gerson","id":"32056"},{"first_name":"Lars","full_name":"Schmelzle, Lars","last_name":"Schmelzle"},{"full_name":"Mergheim, Julia","last_name":"Mergheim","first_name":"Julia"},{"first_name":"Gunnar","full_name":"Possart, Gunnar","last_name":"Possart"}],"date_created":"2024-03-20T14:00:11Z","volume":369,"title":"Methode zur Simulation des temperaturabhängigen Crashverhaltens von strukturellen Klebverbindungen","conference":{"name":"13. 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