---
_id: '62009'
author:
- first_name: Lars
  full_name: Schmelzle, Lars
  last_name: Schmelzle
- first_name: Marius
  full_name: Striewe, Marius
  id: '30228'
  last_name: Striewe
- first_name: Julia
  full_name: Mergheim, Julia
  last_name: Mergheim
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
- first_name: Gunnar
  full_name: Possart, Gunnar
  last_name: Possart
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
citation:
  ama: Schmelzle L, Striewe M, Mergheim J, Meschut G, Possart G, Teutenberg D. Testing,
    modelling and parameter identification for adhesively bonded joints under the
    combined influence of temperature and strain rate. <i>Journal of Adhesion Science
    and Technology</i>. Published online 2025:1-24. doi:<a href="https://doi.org/10.1080/01694243.2025.2569660">10.1080/01694243.2025.2569660</a>
  apa: Schmelzle, L., Striewe, M., Mergheim, J., Meschut, G., Possart, G., &#38; Teutenberg,
    D. (2025). Testing, modelling and parameter identification for adhesively bonded
    joints under the combined influence of temperature and strain rate. <i>Journal
    of Adhesion Science and Technology</i>, 1–24. <a href="https://doi.org/10.1080/01694243.2025.2569660">https://doi.org/10.1080/01694243.2025.2569660</a>
  bibtex: '@article{Schmelzle_Striewe_Mergheim_Meschut_Possart_Teutenberg_2025, title={Testing,
    modelling and parameter identification for adhesively bonded joints under the
    combined influence of temperature and strain rate}, DOI={<a href="https://doi.org/10.1080/01694243.2025.2569660">10.1080/01694243.2025.2569660</a>},
    journal={Journal of Adhesion Science and Technology}, publisher={Informa UK Limited},
    author={Schmelzle, Lars and Striewe, Marius and Mergheim, Julia and Meschut, Gerson
    and Possart, Gunnar and Teutenberg, Dominik}, year={2025}, pages={1–24} }'
  chicago: Schmelzle, Lars, Marius Striewe, Julia Mergheim, Gerson Meschut, Gunnar
    Possart, and Dominik Teutenberg. “Testing, Modelling and Parameter Identification
    for Adhesively Bonded Joints under the Combined Influence of Temperature and Strain
    Rate.” <i>Journal of Adhesion Science and Technology</i>, 2025, 1–24. <a href="https://doi.org/10.1080/01694243.2025.2569660">https://doi.org/10.1080/01694243.2025.2569660</a>.
  ieee: 'L. Schmelzle, M. Striewe, J. Mergheim, G. Meschut, G. Possart, and D. Teutenberg,
    “Testing, modelling and parameter identification for adhesively bonded joints
    under the combined influence of temperature and strain rate,” <i>Journal of Adhesion
    Science and Technology</i>, pp. 1–24, 2025, doi: <a href="https://doi.org/10.1080/01694243.2025.2569660">10.1080/01694243.2025.2569660</a>.'
  mla: Schmelzle, Lars, et al. “Testing, Modelling and Parameter Identification for
    Adhesively Bonded Joints under the Combined Influence of Temperature and Strain
    Rate.” <i>Journal of Adhesion Science and Technology</i>, Informa UK Limited,
    2025, pp. 1–24, doi:<a href="https://doi.org/10.1080/01694243.2025.2569660">10.1080/01694243.2025.2569660</a>.
  short: L. Schmelzle, M. Striewe, J. Mergheim, G. Meschut, G. Possart, D. Teutenberg,
    Journal of Adhesion Science and Technology (2025) 1–24.
date_created: 2025-10-28T10:28:49Z
date_updated: 2025-10-28T10:32:49Z
department:
- _id: '157'
doi: 10.1080/01694243.2025.2569660
language:
- iso: eng
page: 1-24
publication: Journal of Adhesion Science and Technology
publication_identifier:
  issn:
  - 0169-4243
  - 1568-5616
publication_status: published
publisher: Informa UK Limited
quality_controlled: '1'
status: public
title: Testing, modelling and parameter identification for adhesively bonded joints
  under the combined influence of temperature and strain rate
type: journal_article
user_id: '30228'
year: '2025'
...
---
_id: '63108'
abstract:
- lang: eng
  text: In the context of decarbonization initiatives, the repairability and recyclability
    of components have become a major concern in various industrial sectors, particularly
    for resource-intensive components. The development of innovative bonding and debonding
    processes that must adhere to the stringent mechanical specifications of the manufacturers
    and facilitate their efficient disassembly is a major issue faced in the implementation
    of a sustainable circular economy. Although adhesively bonded joints satisfy the
    stringent requirements for mechanical performance, they present several challenges
    during the repair and recycling process. Solvolytically debondable epoxy resin
    adhesives may be employed to overcome this issue. In this study, we aim to conduct
    an exploratory feasibility study on the application of such chemical debonding
    mechanisms within an adhesive bond as well as to systematically analyse and evaluate
    the suitability of such adhesive systems for various applications. To this end,
    we employed various thermo-analytical methods and quasi-static tensile tests to
    characterise the mechanical adhesive and joint properties of two solvolytically
    debondable adhesive systems. Furthermore, we analysed the debondability of the
    adhesive joints and evaluated their feasibility in an industrial environment.
    The results indicate considerable application potential for solvolytically debondable
    adhesives, along with further development steps currently required.
author:
- first_name: Julian
  full_name: Gilich, Julian
  id: '44391'
  last_name: Gilich
- first_name: Janika
  full_name: Kroos, Janika
  id: '50198'
  last_name: Kroos
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: Gilich J, Kroos J, Teutenberg D, Meschut G. Solvolytically debondable adhesive
    systems – potentials and challenges for repair and recycling. <i>The Journal of
    Adhesion</i>. Published online 2025:1-26. doi:<a href="https://doi.org/10.1080/00218464.2025.2600590">10.1080/00218464.2025.2600590</a>
  apa: Gilich, J., Kroos, J., Teutenberg, D., &#38; Meschut, G. (2025). Solvolytically
    debondable adhesive systems – potentials and challenges for repair and recycling.
    <i>The Journal of Adhesion</i>, 1–26. <a href="https://doi.org/10.1080/00218464.2025.2600590">https://doi.org/10.1080/00218464.2025.2600590</a>
  bibtex: '@article{Gilich_Kroos_Teutenberg_Meschut_2025, title={Solvolytically debondable
    adhesive systems – potentials and challenges for repair and recycling}, DOI={<a
    href="https://doi.org/10.1080/00218464.2025.2600590">10.1080/00218464.2025.2600590</a>},
    journal={The Journal of Adhesion}, publisher={Informa UK Limited}, author={Gilich,
    Julian and Kroos, Janika and Teutenberg, Dominik and Meschut, Gerson}, year={2025},
    pages={1–26} }'
  chicago: Gilich, Julian, Janika Kroos, Dominik Teutenberg, and Gerson Meschut. “Solvolytically
    Debondable Adhesive Systems – Potentials and Challenges for Repair and Recycling.”
    <i>The Journal of Adhesion</i>, 2025, 1–26. <a href="https://doi.org/10.1080/00218464.2025.2600590">https://doi.org/10.1080/00218464.2025.2600590</a>.
  ieee: 'J. Gilich, J. Kroos, D. Teutenberg, and G. Meschut, “Solvolytically debondable
    adhesive systems – potentials and challenges for repair and recycling,” <i>The
    Journal of Adhesion</i>, pp. 1–26, 2025, doi: <a href="https://doi.org/10.1080/00218464.2025.2600590">10.1080/00218464.2025.2600590</a>.'
  mla: Gilich, Julian, et al. “Solvolytically Debondable Adhesive Systems – Potentials
    and Challenges for Repair and Recycling.” <i>The Journal of Adhesion</i>, Informa
    UK Limited, 2025, pp. 1–26, doi:<a href="https://doi.org/10.1080/00218464.2025.2600590">10.1080/00218464.2025.2600590</a>.
  short: J. Gilich, J. Kroos, D. Teutenberg, G. Meschut, The Journal of Adhesion (2025)
    1–26.
date_created: 2025-12-16T07:50:36Z
date_updated: 2025-12-16T07:53:52Z
department:
- _id: '157'
doi: 10.1080/00218464.2025.2600590
language:
- iso: eng
page: 1-26
publication: The Journal of Adhesion
publication_identifier:
  issn:
  - 0021-8464
  - 1545-5823
publication_status: published
publisher: Informa UK Limited
quality_controlled: '1'
status: public
title: Solvolytically debondable adhesive systems – potentials and challenges for
  repair and recycling
type: journal_article
user_id: '44391'
year: '2025'
...
---
_id: '52212'
author:
- first_name: Karina
  full_name: Tews, Karina
  id: '40263'
  last_name: Tews
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
- first_name: Moritz
  full_name: Buczek, Moritz
  id: '83727'
  last_name: Buczek
- first_name: Tobias
  full_name: Duffe, Tobias
  id: '41322'
  last_name: Duffe
- first_name: Gunter
  full_name: Kullmer, Gunter
  id: '291'
  last_name: Kullmer
citation:
  ama: 'Tews K, Teutenberg D, Meschut G, Buczek M, Duffe T, Kullmer G. Bruchmechanisches
    Schnittebenenkonzept zur lebensdauergerechten Auslegung von hyperelastischen Klebverbindungen
    bei multiaxialen und variablen Belastungsamplituden. In: <i>24. Kolloquium: Gemeinsame
    Forschung in der Klebtechnik</i>. ; 2024.'
  apa: 'Tews, K., Teutenberg, D., Meschut, G., Buczek, M., Duffe, T., &#38; Kullmer,
    G. (2024). Bruchmechanisches Schnittebenenkonzept zur lebensdauergerechten Auslegung
    von hyperelastischen Klebverbindungen bei multiaxialen und variablen Belastungsamplituden.
    <i>24. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>. 24. Kolloquium:
    Gemeinsame Forschung in der Klebtechnik, Köln.'
  bibtex: '@inproceedings{Tews_Teutenberg_Meschut_Buczek_Duffe_Kullmer_2024, title={Bruchmechanisches
    Schnittebenenkonzept zur lebensdauergerechten Auslegung von hyperelastischen Klebverbindungen
    bei multiaxialen und variablen Belastungsamplituden}, booktitle={24. Kolloquium:
    Gemeinsame Forschung in der Klebtechnik}, author={Tews, Karina and Teutenberg,
    Dominik and Meschut, Gerson and Buczek, Moritz and Duffe, Tobias and Kullmer,
    Gunter}, year={2024} }'
  chicago: 'Tews, Karina, Dominik Teutenberg, Gerson Meschut, Moritz Buczek, Tobias
    Duffe, and Gunter Kullmer. “Bruchmechanisches Schnittebenenkonzept zur lebensdauergerechten
    Auslegung von hyperelastischen Klebverbindungen bei multiaxialen und variablen
    Belastungsamplituden.” In <i>24. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>,
    2024.'
  ieee: 'K. Tews, D. Teutenberg, G. Meschut, M. Buczek, T. Duffe, and G. Kullmer,
    “Bruchmechanisches Schnittebenenkonzept zur lebensdauergerechten Auslegung von
    hyperelastischen Klebverbindungen bei multiaxialen und variablen Belastungsamplituden,”
    presented at the 24. Kolloquium: Gemeinsame Forschung in der Klebtechnik, Köln,
    2024.'
  mla: 'Tews, Karina, et al. “Bruchmechanisches Schnittebenenkonzept zur lebensdauergerechten
    Auslegung von hyperelastischen Klebverbindungen bei multiaxialen und variablen
    Belastungsamplituden.” <i>24. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>,
    2024.'
  short: 'K. Tews, D. Teutenberg, G. Meschut, M. Buczek, T. Duffe, G. Kullmer, in:
    24. Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2024.'
conference:
  end_date: 2024-02-28
  location: Köln
  name: '24. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
  start_date: 2024-02-27
date_created: 2024-02-29T12:24:25Z
date_updated: 2024-02-29T12:33:41Z
department:
- _id: '157'
language:
- iso: ger
publication: '24. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
status: public
title: Bruchmechanisches Schnittebenenkonzept zur lebensdauergerechten Auslegung von
  hyperelastischen Klebverbindungen bei multiaxialen und variablen Belastungsamplituden
type: conference
user_id: '40263'
year: '2024'
...
---
_id: '54142'
author:
- first_name: Felix
  full_name: Beule, Felix
  id: '66192'
  last_name: Beule
- first_name: Mohamad
  full_name: Al Trjman, Mohamad
  id: '65415'
  last_name: Al Trjman
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: 'Beule F, Al Trjman M, Teutenberg D, Meschut G. Method development (modelling,
    simulation, characterisation) in adhesive bonding technology. In: ; 2024.'
  apa: Beule, F., Al Trjman, M., Teutenberg, D., &#38; Meschut, G. (2024). <i>Method
    development (modelling, simulation, characterisation) in adhesive bonding technology</i>.
    International Symposium Smart Joining Solutions for Future Mobility, Shanghai.
  bibtex: '@inproceedings{Beule_Al Trjman_Teutenberg_Meschut_2024, place={Shanghai},
    title={Method development (modelling, simulation, characterisation) in adhesive
    bonding technology}, author={Beule, Felix and Al Trjman, Mohamad and Teutenberg,
    Dominik and Meschut, Gerson}, year={2024} }'
  chicago: Beule, Felix, Mohamad Al Trjman, Dominik Teutenberg, and Gerson Meschut.
    “Method Development (Modelling, Simulation, Characterisation) in Adhesive Bonding
    Technology.” Shanghai, 2024.
  ieee: F. Beule, M. Al Trjman, D. Teutenberg, and G. Meschut, “Method development
    (modelling, simulation, characterisation) in adhesive bonding technology,” presented
    at the International Symposium Smart Joining Solutions for Future Mobility, Shanghai,
    2024.
  mla: Beule, Felix, et al. <i>Method Development (Modelling, Simulation, Characterisation)
    in Adhesive Bonding Technology</i>. 2024.
  short: 'F. Beule, M. Al Trjman, D. Teutenberg, G. Meschut, in: Shanghai, 2024.'
conference:
  end_date: 2024-04-24
  location: Shanghai
  name: International Symposium Smart Joining Solutions for Future Mobility
  start_date: 2024-04-24
date_created: 2024-05-10T06:06:50Z
date_updated: 2024-05-10T06:07:02Z
department:
- _id: '157'
language:
- iso: eng
place: Shanghai
status: public
title: Method development (modelling, simulation, characterisation) in adhesive bonding
  technology
type: conference_abstract
user_id: '66192'
year: '2024'
...
---
_id: '56087'
author:
- first_name: Felix
  full_name: Beule, Felix
  id: '66192'
  last_name: Beule
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: 'Beule F, Teutenberg D, Meschut G. Numerical modelling of the influence of
    viscous fingering on the mechanical properties of structural adhesive joints.
    In: IOM3, ed. <i>The 16th International Conference on the Science and Technology
    of Adhesion and Adhesives</i>. ; 2024.'
  apa: Beule, F., Teutenberg, D., &#38; Meschut, G. (2024). Numerical modelling of
    the influence of viscous fingering on the mechanical properties of structural
    adhesive joints. In IOM3 (Ed.), <i>The 16th International Conference on the Science
    and Technology of Adhesion and Adhesives</i>.
  bibtex: '@inproceedings{Beule_Teutenberg_Meschut_2024, place={London}, title={Numerical
    modelling of the influence of viscous fingering on the mechanical properties of
    structural adhesive joints}, booktitle={The 16th International Conference on the
    Science and Technology of Adhesion and Adhesives}, author={Beule, Felix and Teutenberg,
    Dominik and Meschut, Gerson}, editor={IOM3}, year={2024} }'
  chicago: Beule, Felix, Dominik Teutenberg, and Gerson Meschut. “Numerical Modelling
    of the Influence of Viscous Fingering on the Mechanical Properties of Structural
    Adhesive Joints.” In <i>The 16th International Conference on the Science and Technology
    of Adhesion and Adhesives</i>, edited by IOM3. London, 2024.
  ieee: F. Beule, D. Teutenberg, and G. Meschut, “Numerical modelling of the influence
    of viscous fingering on the mechanical properties of structural adhesive joints,”
    in <i>The 16th International Conference on the Science and Technology of Adhesion
    and Adhesives</i>, Oxford, UK, 2024.
  mla: Beule, Felix, et al. “Numerical Modelling of the Influence of Viscous Fingering
    on the Mechanical Properties of Structural Adhesive Joints.” <i>The 16th International
    Conference on the Science and Technology of Adhesion and Adhesives</i>, edited
    by IOM3, 2024.
  short: 'F. Beule, D. Teutenberg, G. Meschut, in: IOM3 (Ed.), The 16th International
    Conference on the Science and Technology of Adhesion and Adhesives, London, 2024.'
conference:
  end_date: 2024-09-06
  location: Oxford, UK
  name: The 16th International Conference on the Science and Technology of Adhesion
    and Adhesives
  start_date: 2024-09-04
corporate_editor:
- IOM3
date_created: 2024-09-06T09:31:34Z
date_updated: 2024-09-06T09:31:50Z
department:
- _id: '157'
language:
- iso: eng
place: London
publication: The 16th International Conference on the Science and Technology of Adhesion
  and Adhesives
status: public
title: Numerical modelling of the influence of viscous fingering on the mechanical
  properties of structural adhesive joints
type: conference
user_id: '66192'
year: '2024'
...
---
_id: '52216'
author:
- first_name: Karina
  full_name: Tews, Karina
  id: '40263'
  last_name: Tews
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: 'Tews K, Teutenberg D, Meschut G. Mechanisches Verhalten: Charakterisierung
    von Klebstoffen. In: <i>DECHEMA Workshop für Klebstoffanwender: Simulation von
    Klebverbindungen</i>. ; 2024.'
  apa: 'Tews, K., Teutenberg, D., &#38; Meschut, G. (2024). Mechanisches Verhalten:
    Charakterisierung von Klebstoffen. <i>DECHEMA Workshop für Klebstoffanwender:
    Simulation von Klebverbindungen</i>. DECHEMA Workshop für Klebstoffanwender: Simulation
    von Klebverbindungen, Köln.'
  bibtex: '@inproceedings{Tews_Teutenberg_Meschut_2024, title={Mechanisches Verhalten:
    Charakterisierung von Klebstoffen}, booktitle={DECHEMA Workshop für Klebstoffanwender:
    Simulation von Klebverbindungen}, author={Tews, Karina and Teutenberg, Dominik
    and Meschut, Gerson}, year={2024} }'
  chicago: 'Tews, Karina, Dominik Teutenberg, and Gerson Meschut. “Mechanisches Verhalten:
    Charakterisierung von Klebstoffen.” In <i>DECHEMA Workshop für Klebstoffanwender:
    Simulation von Klebverbindungen</i>, 2024.'
  ieee: 'K. Tews, D. Teutenberg, and G. Meschut, “Mechanisches Verhalten: Charakterisierung
    von Klebstoffen,” presented at the DECHEMA Workshop für Klebstoffanwender: Simulation
    von Klebverbindungen, Köln, 2024.'
  mla: 'Tews, Karina, et al. “Mechanisches Verhalten: Charakterisierung von Klebstoffen.”
    <i>DECHEMA Workshop für Klebstoffanwender: Simulation von Klebverbindungen</i>,
    2024.'
  short: 'K. Tews, D. Teutenberg, G. Meschut, in: DECHEMA Workshop für Klebstoffanwender:
    Simulation von Klebverbindungen, 2024.'
conference:
  location: Köln
  name: 'DECHEMA Workshop für Klebstoffanwender: Simulation von Klebverbindungen'
  start_date: 22024-02-26
date_created: 2024-02-29T12:33:31Z
date_updated: 2025-01-30T08:49:33Z
department:
- _id: '157'
language:
- iso: ger
publication: 'DECHEMA Workshop für Klebstoffanwender: Simulation von Klebverbindungen'
status: public
title: 'Mechanisches Verhalten: Charakterisierung von Klebstoffen'
type: conference
user_id: '40263'
year: '2024'
...
---
_id: '58458'
author:
- first_name: Julian
  full_name: Gilich, Julian
  id: '44391'
  last_name: Gilich
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
- first_name: Benjamin
  full_name: Gröger, Benjamin
  last_name: Gröger
- first_name: Felix
  full_name: Wiebicke, Felix
  last_name: Wiebicke
- first_name: Ilja
  full_name: Koch, Ilja
  last_name: Koch
- first_name: Maik
  full_name: Gude, Maik
  last_name: Gude
citation:
  ama: 'Gilich J, Teutenberg D, Meschut G, et al. Influences on the Material Displacement
    and Compression Stresses in the Joining Process of Highly Viscous Thermal Interface
    Materials. In: <i>77th IIW Annual Assembly and International Conference on Welding
    and Joining</i>. ; 2024.'
  apa: Gilich, J., Teutenberg, D., Meschut, G., Gröger, B., Wiebicke, F., Koch, I.,
    &#38; Gude, M. (2024). Influences on the Material Displacement and Compression
    Stresses in the Joining Process of Highly Viscous Thermal Interface Materials.
    <i>77th IIW Annual Assembly and International Conference on Welding and Joining</i>.
    77th IIW Annual Assembly and International Conference on Welding and Joining,
    Rhodos, Griechenland.
  bibtex: '@inproceedings{Gilich_Teutenberg_Meschut_Gröger_Wiebicke_Koch_Gude_2024,
    title={Influences on the Material Displacement and Compression Stresses in the
    Joining Process of Highly Viscous Thermal Interface Materials}, booktitle={77th
    IIW Annual Assembly and International Conference on Welding and Joining}, author={Gilich,
    Julian and Teutenberg, Dominik and Meschut, Gerson and Gröger, Benjamin and Wiebicke,
    Felix and Koch, Ilja and Gude, Maik}, year={2024} }'
  chicago: Gilich, Julian, Dominik Teutenberg, Gerson Meschut, Benjamin Gröger, Felix
    Wiebicke, Ilja Koch, and Maik Gude. “Influences on the Material Displacement and
    Compression Stresses in the Joining Process of Highly Viscous Thermal Interface
    Materials.” In <i>77th IIW Annual Assembly and International Conference on Welding
    and Joining</i>, 2024.
  ieee: J. Gilich <i>et al.</i>, “Influences on the Material Displacement and Compression
    Stresses in the Joining Process of Highly Viscous Thermal Interface Materials,”
    presented at the 77th IIW Annual Assembly and International Conference on Welding
    and Joining, Rhodos, Griechenland, 2024.
  mla: Gilich, Julian, et al. “Influences on the Material Displacement and Compression
    Stresses in the Joining Process of Highly Viscous Thermal Interface Materials.”
    <i>77th IIW Annual Assembly and International Conference on Welding and Joining</i>,
    2024.
  short: 'J. Gilich, D. Teutenberg, G. Meschut, B. Gröger, F. Wiebicke, I. Koch, M.
    Gude, in: 77th IIW Annual Assembly and International Conference on Welding and
    Joining, 2024.'
conference:
  end_date: 2024-07-07
  location: Rhodos, Griechenland
  name: 77th IIW Annual Assembly and International Conference on Welding and Joining
  start_date: 2024-07-12
date_created: 2025-01-31T12:34:52Z
date_updated: 2025-01-31T12:35:05Z
department:
- _id: '157'
language:
- iso: eng
publication: 77th IIW Annual Assembly and International Conference on Welding and
  Joining
status: public
title: Influences on the Material Displacement and Compression Stresses in the Joining
  Process of Highly Viscous Thermal Interface Materials
type: conference_abstract
user_id: '44391'
year: '2024'
...
---
_id: '52211'
author:
- first_name: Felix
  full_name: Beule, Felix
  id: '66192'
  last_name: Beule
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: 'Beule F, Teutenberg D, Meschut G. Klebstoffmodell - Parameteridentifikation,
    Verifikation und Validierung für den Lastfall Crash. In: DECHEMA, ed. <i>DECHEMA-Workshop
    Für Klebstoffanwender: Simulation von Klebverbindungen</i>. ; 2024.'
  apa: 'Beule, F., Teutenberg, D., &#38; Meschut, G. (2024). Klebstoffmodell - Parameteridentifikation,
    Verifikation und Validierung für den Lastfall Crash. In DECHEMA (Ed.), <i>DECHEMA-Workshop
    für Klebstoffanwender: Simulation von Klebverbindungen</i>.'
  bibtex: '@inproceedings{Beule_Teutenberg_Meschut_2024, title={Klebstoffmodell -
    Parameteridentifikation, Verifikation und Validierung für den Lastfall Crash},
    booktitle={DECHEMA-Workshop für Klebstoffanwender: Simulation von Klebverbindungen},
    author={Beule, Felix and Teutenberg, Dominik and Meschut, Gerson}, editor={DECHEMA},
    year={2024} }'
  chicago: 'Beule, Felix, Dominik Teutenberg, and Gerson Meschut. “Klebstoffmodell
    - Parameteridentifikation, Verifikation Und Validierung Für Den Lastfall Crash.”
    In <i>DECHEMA-Workshop Für Klebstoffanwender: Simulation von Klebverbindungen</i>,
    edited by DECHEMA, 2024.'
  ieee: 'F. Beule, D. Teutenberg, and G. Meschut, “Klebstoffmodell - Parameteridentifikation,
    Verifikation und Validierung für den Lastfall Crash,” in <i>DECHEMA-Workshop für
    Klebstoffanwender: Simulation von Klebverbindungen</i>, Köln, 2024.'
  mla: 'Beule, Felix, et al. “Klebstoffmodell - Parameteridentifikation, Verifikation
    Und Validierung Für Den Lastfall Crash.” <i>DECHEMA-Workshop Für Klebstoffanwender:
    Simulation von Klebverbindungen</i>, edited by DECHEMA, 2024.'
  short: 'F. Beule, D. Teutenberg, G. Meschut, in: DECHEMA (Ed.), DECHEMA-Workshop
    Für Klebstoffanwender: Simulation von Klebverbindungen, 2024.'
conference:
  end_date: 2024-02-26
  location: Köln
  name: 'DECHEMA-Workshop für Klebstoffanwender: Simulation von Klebverbindungen'
  start_date: 2024-02-26
corporate_editor:
- DECHEMA
date_created: 2024-02-29T12:19:57Z
date_updated: 2026-02-23T08:26:01Z
department:
- _id: '157'
language:
- iso: eng
publication: 'DECHEMA-Workshop für Klebstoffanwender: Simulation von Klebverbindungen'
quality_controlled: '1'
status: public
title: Klebstoffmodell - Parameteridentifikation, Verifikation und Validierung für
  den Lastfall Crash
type: conference
user_id: '537'
year: '2024'
...
---
_id: '52214'
author:
- first_name: Felix
  full_name: Beule, Felix
  id: '66192'
  last_name: Beule
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
- first_name: Lars
  full_name: Schmelzle, Lars
  last_name: Schmelzle
- first_name: Gunnar
  full_name: Possart, Gunnar
  last_name: Possart
- first_name: Julia
  full_name: Mergheim, Julia
  last_name: Mergheim
- first_name: Paul
  full_name: Steinmann, Paul
  last_name: Steinmann
citation:
  ama: 'Beule F, Teutenberg D, Meschut G, et al. Methodenentwicklung zur Simulation
    von hyperelastischen Klebverbindungen unter Crashbelastung. In: DECHEMA, ed. ;
    2024.'
  apa: Beule, F., Teutenberg, D., Meschut, G., Schmelzle, L., Possart, G., Mergheim,
    J., &#38; Steinmann, P. (2024). <i>Methodenentwicklung zur Simulation von hyperelastischen
    Klebverbindungen unter Crashbelastung</i> (DECHEMA, Ed.).
  bibtex: '@inproceedings{Beule_Teutenberg_Meschut_Schmelzle_Possart_Mergheim_Steinmann_2024,
    title={Methodenentwicklung zur Simulation von hyperelastischen Klebverbindungen
    unter Crashbelastung}, author={Beule, Felix and Teutenberg, Dominik and Meschut,
    Gerson and Schmelzle, Lars and Possart, Gunnar and Mergheim, Julia and Steinmann,
    Paul}, editor={DECHEMA}, year={2024} }'
  chicago: Beule, Felix, Dominik Teutenberg, Gerson Meschut, Lars Schmelzle, Gunnar
    Possart, Julia Mergheim, and Paul Steinmann. “Methodenentwicklung Zur Simulation
    von Hyperelastischen Klebverbindungen Unter Crashbelastung.” edited by DECHEMA,
    2024.
  ieee: F. Beule <i>et al.</i>, “Methodenentwicklung zur Simulation von hyperelastischen
    Klebverbindungen unter Crashbelastung,” Köln, 2024.
  mla: Beule, Felix, et al. <i>Methodenentwicklung Zur Simulation von Hyperelastischen
    Klebverbindungen Unter Crashbelastung</i>. Edited by DECHEMA, 2024.
  short: 'F. Beule, D. Teutenberg, G. Meschut, L. Schmelzle, G. Possart, J. Mergheim,
    P. Steinmann, in: DECHEMA (Ed.), 2024.'
conference:
  end_date: 2024-02-28
  location: Köln
  name: '24. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
  start_date: 2024-02-27
corporate_editor:
- DECHEMA
date_created: 2024-02-29T12:24:51Z
date_updated: 2026-02-23T08:26:30Z
department:
- _id: '157'
language:
- iso: eng
quality_controlled: '1'
status: public
title: Methodenentwicklung zur Simulation von hyperelastischen Klebverbindungen unter
  Crashbelastung
type: conference
user_id: '537'
year: '2024'
...
---
_id: '57575'
article_type: original
author:
- first_name: Felix
  full_name: Beule, Felix
  id: '66192'
  last_name: Beule
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: Beule F, Teutenberg D, Meschut G. Analysis of the anisotropic mechanical properties
    of structural adhesive joints with curing-induced pre-deformations. <i>Journal
    of Adhesion Science and Technology</i>. Published online 2024:1-20. doi:<a href="https://doi.org/10.1080/01694243.2024.2427799">10.1080/01694243.2024.2427799</a>
  apa: Beule, F., Teutenberg, D., &#38; Meschut, G. (2024). Analysis of the anisotropic
    mechanical properties of structural adhesive joints with curing-induced pre-deformations.
    <i>Journal of Adhesion Science and Technology</i>, 1–20. <a href="https://doi.org/10.1080/01694243.2024.2427799">https://doi.org/10.1080/01694243.2024.2427799</a>
  bibtex: '@article{Beule_Teutenberg_Meschut_2024, title={Analysis of the anisotropic
    mechanical properties of structural adhesive joints with curing-induced pre-deformations},
    DOI={<a href="https://doi.org/10.1080/01694243.2024.2427799">10.1080/01694243.2024.2427799</a>},
    journal={Journal of Adhesion Science and Technology}, publisher={Informa UK Limited},
    author={Beule, Felix and Teutenberg, Dominik and Meschut, Gerson}, year={2024},
    pages={1–20} }'
  chicago: Beule, Felix, Dominik Teutenberg, and Gerson Meschut. “Analysis of the
    Anisotropic Mechanical Properties of Structural Adhesive Joints with Curing-Induced
    Pre-Deformations.” <i>Journal of Adhesion Science and Technology</i>, 2024, 1–20.
    <a href="https://doi.org/10.1080/01694243.2024.2427799">https://doi.org/10.1080/01694243.2024.2427799</a>.
  ieee: 'F. Beule, D. Teutenberg, and G. Meschut, “Analysis of the anisotropic mechanical
    properties of structural adhesive joints with curing-induced pre-deformations,”
    <i>Journal of Adhesion Science and Technology</i>, pp. 1–20, 2024, doi: <a href="https://doi.org/10.1080/01694243.2024.2427799">10.1080/01694243.2024.2427799</a>.'
  mla: Beule, Felix, et al. “Analysis of the Anisotropic Mechanical Properties of
    Structural Adhesive Joints with Curing-Induced Pre-Deformations.” <i>Journal of
    Adhesion Science and Technology</i>, Informa UK Limited, 2024, pp. 1–20, doi:<a
    href="https://doi.org/10.1080/01694243.2024.2427799">10.1080/01694243.2024.2427799</a>.
  short: F. Beule, D. Teutenberg, G. Meschut, Journal of Adhesion Science and Technology
    (2024) 1–20.
date_created: 2024-12-04T12:56:42Z
date_updated: 2024-12-04T12:59:08Z
department:
- _id: '157'
doi: 10.1080/01694243.2024.2427799
language:
- iso: eng
main_file_link:
- open_access: '1'
  url: https://www.tandfonline.com/doi/full/10.1080/01694243.2024.2427799
oa: '1'
page: 1-20
publication: Journal of Adhesion Science and Technology
publication_identifier:
  issn:
  - 0169-4243
  - 1568-5616
publication_status: published
publisher: Informa UK Limited
quality_controlled: '1'
status: public
title: Analysis of the anisotropic mechanical properties of structural adhesive joints
  with curing-induced pre-deformations
type: journal_article
user_id: '66192'
year: '2024'
...
---
_id: '60617'
author:
- first_name: Lucas
  full_name: Hermelingmeier, Lucas
  id: '58649'
  last_name: Hermelingmeier
- first_name: Verena
  full_name: Aßmuth, Verena
  id: '53299'
  last_name: Aßmuth
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: 'Hermelingmeier L, Aßmuth V, Teutenberg D, Meschut G. The influence of embedded
    fiber optic sensors on the global mechanical behavior of adhesively bonded joints.
    In: <i>77th IIW Annual Assembly and International Conference on Welding and Joining</i>.
    ; 2024.'
  apa: Hermelingmeier, L., Aßmuth, V., Teutenberg, D., &#38; Meschut, G. (2024). The
    influence of embedded fiber optic sensors on the global mechanical behavior of
    adhesively bonded joints. <i>77th IIW Annual Assembly and International Conference
    on Welding and Joining</i>. 77th IIW Annual Assembly and International Conference
    on Welding and Joining, Rhodos, Greece.
  bibtex: '@inproceedings{Hermelingmeier_Aßmuth_Teutenberg_Meschut_2024, title={The
    influence of embedded fiber optic sensors on the global mechanical behavior of
    adhesively bonded joints}, booktitle={77th IIW Annual Assembly and International
    Conference on Welding and Joining}, author={Hermelingmeier, Lucas and Aßmuth,
    Verena and Teutenberg, Dominik and Meschut, Gerson}, year={2024} }'
  chicago: Hermelingmeier, Lucas, Verena Aßmuth, Dominik Teutenberg, and Gerson Meschut.
    “The Influence of Embedded Fiber Optic Sensors on the Global Mechanical Behavior
    of Adhesively Bonded Joints.” In <i>77th IIW Annual Assembly and International
    Conference on Welding and Joining</i>, 2024.
  ieee: L. Hermelingmeier, V. Aßmuth, D. Teutenberg, and G. Meschut, “The influence
    of embedded fiber optic sensors on the global mechanical behavior of adhesively
    bonded joints,” presented at the 77th IIW Annual Assembly and International Conference
    on Welding and Joining, Rhodos, Greece, 2024.
  mla: Hermelingmeier, Lucas, et al. “The Influence of Embedded Fiber Optic Sensors
    on the Global Mechanical Behavior of Adhesively Bonded Joints.” <i>77th IIW Annual
    Assembly and International Conference on Welding and Joining</i>, 2024.
  short: 'L. Hermelingmeier, V. Aßmuth, D. Teutenberg, G. Meschut, in: 77th IIW Annual
    Assembly and International Conference on Welding and Joining, 2024.'
conference:
  end_date: 2024-07-12
  location: Rhodos, Greece
  name: 77th IIW Annual Assembly and International Conference on Welding and Joining
  start_date: 2024-07-07
date_created: 2025-07-15T11:10:36Z
date_updated: 2025-07-15T11:10:43Z
department:
- _id: '157'
language:
- iso: eng
publication: 77th IIW Annual Assembly and International Conference on Welding and
  Joining
status: public
title: The influence of embedded fiber optic sensors on the global mechanical behavior
  of adhesively bonded joints
type: conference_abstract
user_id: '58649'
year: '2024'
...
---
_id: '50178'
author:
- first_name: Felix
  full_name: Beule, Felix
  id: '66192'
  last_name: Beule
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: 'Beule F, Teutenberg D, Meschut G. Untersuchung des Einflusses von Relativverschiebungen
    während der Aushärtung auf die mechanischen Eigenschaften von Klebverbindungen.
    In: DVS Media GmbH, ed. <i>Klebtechnische Doktorandenseminare 2020 - 2022</i>.
    Vol 369. DVS-Berichte. DVS Media GmbH; 2023.'
  apa: Beule, F., Teutenberg, D., &#38; Meschut, G. (2023). Untersuchung des Einflusses
    von Relativverschiebungen während der Aushärtung auf die mechanischen Eigenschaften
    von Klebverbindungen. In DVS Media GmbH (Ed.), <i>Klebtechnische Doktorandenseminare
    2020 - 2022</i> (Vol. 369). DVS Media GmbH.
  bibtex: '@inbook{Beule_Teutenberg_Meschut_2023, place={Düsseldorf}, series={DVS-Berichte},
    title={Untersuchung des Einflusses von Relativverschiebungen während der Aushärtung
    auf die mechanischen Eigenschaften von Klebverbindungen}, volume={369}, booktitle={Klebtechnische
    Doktorandenseminare 2020 - 2022}, publisher={DVS Media GmbH}, author={Beule, Felix
    and Teutenberg, Dominik and Meschut, Gerson}, editor={DVS Media GmbH}, year={2023},
    collection={DVS-Berichte} }'
  chicago: 'Beule, Felix, Dominik Teutenberg, and Gerson Meschut. “Untersuchung des
    Einflusses von Relativverschiebungen während der Aushärtung auf die mechanischen
    Eigenschaften von Klebverbindungen.” In <i>Klebtechnische Doktorandenseminare
    2020 - 2022</i>, edited by DVS Media GmbH, Vol. 369. DVS-Berichte. Düsseldorf:
    DVS Media GmbH, 2023.'
  ieee: 'F. Beule, D. Teutenberg, and G. Meschut, “Untersuchung des Einflusses von
    Relativverschiebungen während der Aushärtung auf die mechanischen Eigenschaften
    von Klebverbindungen,” in <i>Klebtechnische Doktorandenseminare 2020 - 2022</i>,
    vol. 369, DVS Media GmbH, Ed. Düsseldorf: DVS Media GmbH, 2023.'
  mla: Beule, Felix, et al. “Untersuchung des Einflusses von Relativverschiebungen
    während der Aushärtung auf die mechanischen Eigenschaften von Klebverbindungen.”
    <i>Klebtechnische Doktorandenseminare 2020 - 2022</i>, edited by DVS Media GmbH,
    vol. 369, DVS Media GmbH, 2023.
  short: 'F. Beule, D. Teutenberg, G. Meschut, in: DVS Media GmbH (Ed.), Klebtechnische
    Doktorandenseminare 2020 - 2022, DVS Media GmbH, Düsseldorf, 2023.'
conference:
  end_date: 2021-09-22
  location: Paderborn
  name: 12. Doktorandenseminar Klebtechnik
  start_date: 2021-09-21
corporate_editor:
- DVS Media GmbH
date_created: 2024-01-04T09:48:12Z
date_updated: 2024-01-04T09:48:18Z
department:
- _id: '157'
intvolume: '       369'
language:
- iso: ger
place: Düsseldorf
publication: Klebtechnische Doktorandenseminare 2020 - 2022
publication_identifier:
  isbn:
  - 978-3-96144-139-6
publication_status: published
publisher: DVS Media GmbH
quality_controlled: '1'
series_title: DVS-Berichte
status: public
title: Untersuchung des Einflusses von Relativverschiebungen während der Aushärtung
  auf die mechanischen Eigenschaften von Klebverbindungen
type: book_chapter
user_id: '66192'
volume: 369
year: '2023'
...
---
_id: '42766'
author:
- first_name: Karina
  full_name: Tews, Karina
  id: '40263'
  last_name: Tews
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: 'Tews K, Teutenberg D, Meschut G. Experimental investigation of the fatigue
    behavior and calculation of the service life of adhesively bonded joints. In:
    ; 2023.'
  apa: Tews, K., Teutenberg, D., &#38; Meschut, G. (2023). <i>Experimental investigation
    of the fatigue behavior and calculation of the service life of adhesively bonded
    joints</i>. 46th Annual Meeting of the Adhesion Society, Orlando, USA.
  bibtex: '@inproceedings{Tews_Teutenberg_Meschut_2023, title={Experimental investigation
    of the fatigue behavior and calculation of the service life of adhesively bonded
    joints}, author={Tews, Karina and Teutenberg, Dominik and Meschut, Gerson}, year={2023}
    }'
  chicago: Tews, Karina, Dominik Teutenberg, and Gerson Meschut. “Experimental Investigation
    of the Fatigue Behavior and Calculation of the Service Life of Adhesively Bonded
    Joints,” 2023.
  ieee: K. Tews, D. Teutenberg, and G. Meschut, “Experimental investigation of the
    fatigue behavior and calculation of the service life of adhesively bonded joints,”
    presented at the 46th Annual Meeting of the Adhesion Society, Orlando, USA, 2023.
  mla: Tews, Karina, et al. <i>Experimental Investigation of the Fatigue Behavior
    and Calculation of the Service Life of Adhesively Bonded Joints</i>. 2023.
  short: 'K. Tews, D. Teutenberg, G. Meschut, in: 2023.'
conference:
  end_date: 2023-02-22
  location: Orlando, USA
  name: 46th Annual Meeting of the Adhesion Society
  start_date: 2023-02-19
date_created: 2023-03-06T10:02:58Z
date_updated: 2023-03-06T10:03:01Z
department:
- _id: '157'
language:
- iso: eng
status: public
title: Experimental investigation of the fatigue behavior and calculation of the service
  life of adhesively bonded joints
type: conference_abstract
user_id: '40263'
year: '2023'
...
---
_id: '43130'
article_type: review
author:
- first_name: Tobias
  full_name: Schmolke, Tobias
  id: '44759'
  last_name: Schmolke
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: Schmolke T, Teutenberg D, Meschut G. Investigation of the leak tightness of
    structural adhesive joints for use in battery housings considering mechanical
    and corrosive loads. <i>The Journal of Adhesion</i>. Published online 2023. doi:<a
    href="https://doi.org/10.1080/00218464.2023.2195556">10.1080/00218464.2023.2195556</a>
  apa: Schmolke, T., Teutenberg, D., &#38; Meschut, G. (2023). Investigation of the
    leak tightness of structural adhesive joints for use in battery housings considering
    mechanical and corrosive loads. <i>The Journal of Adhesion</i>. <a href="https://doi.org/10.1080/00218464.2023.2195556">https://doi.org/10.1080/00218464.2023.2195556</a>
  bibtex: '@article{Schmolke_Teutenberg_Meschut_2023, title={Investigation of the
    leak tightness of structural adhesive joints for use in battery housings considering
    mechanical and corrosive loads}, DOI={<a href="https://doi.org/10.1080/00218464.2023.2195556">10.1080/00218464.2023.2195556</a>},
    journal={The Journal of Adhesion}, publisher={Taylor &#38; Francis}, author={Schmolke,
    Tobias and Teutenberg, Dominik and Meschut, Gerson}, year={2023} }'
  chicago: Schmolke, Tobias, Dominik Teutenberg, and Gerson Meschut. “Investigation
    of the Leak Tightness of Structural Adhesive Joints for Use in Battery Housings
    Considering Mechanical and Corrosive Loads.” <i>The Journal of Adhesion</i>, 2023.
    <a href="https://doi.org/10.1080/00218464.2023.2195556">https://doi.org/10.1080/00218464.2023.2195556</a>.
  ieee: 'T. Schmolke, D. Teutenberg, and G. Meschut, “Investigation of the leak tightness
    of structural adhesive joints for use in battery housings considering mechanical
    and corrosive loads,” <i>The Journal of Adhesion</i>, 2023, doi: <a href="https://doi.org/10.1080/00218464.2023.2195556">10.1080/00218464.2023.2195556</a>.'
  mla: Schmolke, Tobias, et al. “Investigation of the Leak Tightness of Structural
    Adhesive Joints for Use in Battery Housings Considering Mechanical and Corrosive
    Loads.” <i>The Journal of Adhesion</i>, Taylor &#38; Francis, 2023, doi:<a href="https://doi.org/10.1080/00218464.2023.2195556">10.1080/00218464.2023.2195556</a>.
  short: T. Schmolke, D. Teutenberg, G. Meschut, The Journal of Adhesion (2023).
date_created: 2023-03-28T12:01:34Z
date_updated: 2023-04-27T09:01:15Z
department:
- _id: '157'
doi: 10.1080/00218464.2023.2195556
language:
- iso: eng
publication: The Journal of Adhesion
publication_status: published
publisher: Taylor & Francis
quality_controlled: '1'
status: public
title: Investigation of the leak tightness of structural adhesive joints for use in
  battery housings considering mechanical and corrosive loads
type: journal_article
user_id: '44759'
year: '2023'
...
---
_id: '44181'
author:
- first_name: Felix
  full_name: Beule, Felix
  id: '66192'
  last_name: Beule
- first_name: Lars
  full_name: Schmelzle, Lars
  last_name: Schmelzle
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gunnar
  full_name: Possart, Gunnar
  last_name: Possart
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
- first_name: Julia
  full_name: Mergheim, Julia
  last_name: Mergheim
citation:
  ama: 'Beule F, Schmelzle L, Teutenberg D, Possart G, Meschut G, Mergheim J. Methodenentwicklung
    zur Simulation von hyperelastischen Klebverbindungen unter Crashbelastung. In:
    <i>23. Kolloquium: Gemeinsame Forschung in Der Klebtechnik</i>. 23. Kolloquium:
    Gemeinsame Forschung in der Klebtechnik. ; 2023.'
  apa: 'Beule, F., Schmelzle, L., Teutenberg, D., Possart, G., Meschut, G., &#38;
    Mergheim, J. (2023). Methodenentwicklung zur Simulation von hyperelastischen Klebverbindungen
    unter Crashbelastung. <i>23. Kolloquium: Gemeinsame Forschung in Der Klebtechnik</i>.
    23. Kolloquium: Gemeinsame Forschung in der Klebtechnik, Frankfurt.'
  bibtex: '@inproceedings{Beule_Schmelzle_Teutenberg_Possart_Meschut_Mergheim_2023,
    place={Frankfurt}, series={23. Kolloquium: Gemeinsame Forschung in der Klebtechnik},
    title={Methodenentwicklung zur Simulation von hyperelastischen Klebverbindungen
    unter Crashbelastung}, booktitle={23. Kolloquium: Gemeinsame Forschung in der
    Klebtechnik}, author={Beule, Felix and Schmelzle, Lars and Teutenberg, Dominik
    and Possart, Gunnar and Meschut, Gerson and Mergheim, Julia}, year={2023}, collection={23.
    Kolloquium: Gemeinsame Forschung in der Klebtechnik} }'
  chicago: 'Beule, Felix, Lars Schmelzle, Dominik Teutenberg, Gunnar Possart, Gerson
    Meschut, and Julia Mergheim. “Methodenentwicklung Zur Simulation von Hyperelastischen
    Klebverbindungen Unter Crashbelastung.” In <i>23. Kolloquium: Gemeinsame Forschung
    in Der Klebtechnik</i>. 23. Kolloquium: Gemeinsame Forschung in Der Klebtechnik.
    Frankfurt, 2023.'
  ieee: 'F. Beule, L. Schmelzle, D. Teutenberg, G. Possart, G. Meschut, and J. Mergheim,
    “Methodenentwicklung zur Simulation von hyperelastischen Klebverbindungen unter
    Crashbelastung,” presented at the 23. Kolloquium: Gemeinsame Forschung in der
    Klebtechnik, Frankfurt, 2023.'
  mla: 'Beule, Felix, et al. “Methodenentwicklung Zur Simulation von Hyperelastischen
    Klebverbindungen Unter Crashbelastung.” <i>23. Kolloquium: Gemeinsame Forschung
    in Der Klebtechnik</i>, 2023.'
  short: 'F. Beule, L. Schmelzle, D. Teutenberg, G. Possart, G. Meschut, J. Mergheim,
    in: 23. Kolloquium: Gemeinsame Forschung in Der Klebtechnik, Frankfurt, 2023.'
conference:
  end_date: 2023-03-01
  location: Frankfurt
  name: '23. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
  start_date: 2023-02-28
date_created: 2023-04-26T07:12:20Z
date_updated: 2023-04-26T07:12:24Z
department:
- _id: '157'
language:
- iso: eng
place: Frankfurt
publication: '23. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
series_title: '23. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
status: public
title: Methodenentwicklung zur Simulation von hyperelastischen Klebverbindungen unter
  Crashbelastung
type: conference_abstract
user_id: '66192'
year: '2023'
...
---
_id: '44183'
author:
- first_name: Jannik
  full_name: Kowatz, Jannik
  id: '32252'
  last_name: Kowatz
  orcid: 0000-0002-4972-4718
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: 'Kowatz J, Teutenberg D, Meschut G. Weiterentwicklung der induktiven Schnellhärtung
    von Klebverbindungen für robuste Fertigungsprozesse unter Berücksichtigung von
    serienrelevanten Einflussfaktoren. In: DECHEMA, Gesellschaft für Chemische Technik
    und Biotechnologie e.V., ed. <i>23. Kolloquium Gemeinsame Forschung in der Klebtechnik</i>.
    ; 2023.'
  apa: Kowatz, J., Teutenberg, D., &#38; Meschut, G. (2023). Weiterentwicklung der
    induktiven Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse
    unter Berücksichtigung von serienrelevanten Einflussfaktoren. In DECHEMA, Gesellschaft
    für Chemische Technik und Biotechnologie e.V. (Ed.), <i>23. Kolloquium Gemeinsame
    Forschung in der Klebtechnik</i>.
  bibtex: '@inproceedings{Kowatz_Teutenberg_Meschut_2023, title={Weiterentwicklung
    der induktiven Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse
    unter Berücksichtigung von serienrelevanten Einflussfaktoren}, booktitle={23.
    Kolloquium Gemeinsame Forschung in der Klebtechnik}, author={Kowatz, Jannik and
    Teutenberg, Dominik and Meschut, Gerson}, editor={DECHEMA, Gesellschaft für Chemische
    Technik und Biotechnologie e.V.}, year={2023} }'
  chicago: Kowatz, Jannik, Dominik Teutenberg, and Gerson Meschut. “Weiterentwicklung
    der induktiven Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse
    unter Berücksichtigung von serienrelevanten Einflussfaktoren.” In <i>23. Kolloquium
    Gemeinsame Forschung in der Klebtechnik</i>, edited by DECHEMA, Gesellschaft für
    Chemische Technik und Biotechnologie e.V., 2023.
  ieee: J. Kowatz, D. Teutenberg, and G. Meschut, “Weiterentwicklung der induktiven
    Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse unter Berücksichtigung
    von serienrelevanten Einflussfaktoren,” in <i>23. Kolloquium Gemeinsame Forschung
    in der Klebtechnik</i>, Frankfurt a. M., 2023.
  mla: Kowatz, Jannik, et al. “Weiterentwicklung der induktiven Schnellhärtung von
    Klebverbindungen für robuste Fertigungsprozesse unter Berücksichtigung von serienrelevanten
    Einflussfaktoren.” <i>23. Kolloquium Gemeinsame Forschung in der Klebtechnik</i>,
    edited by DECHEMA, Gesellschaft für Chemische Technik und Biotechnologie e.V.,
    2023.
  short: 'J. Kowatz, D. Teutenberg, G. Meschut, in: DECHEMA, Gesellschaft für Chemische
    Technik und Biotechnologie e.V. (Ed.), 23. Kolloquium Gemeinsame Forschung in
    der Klebtechnik, 2023.'
conference:
  end_date: 01.03.2023
  location: Frankfurt a. M.
  name: 23. Kolloquium Gemeinsame Forschung in der Klebtechnik
  start_date: 28.02.2023
corporate_editor:
- DECHEMA, Gesellschaft für Chemische Technik und Biotechnologie e.V.
date_created: 2023-04-26T07:21:47Z
date_updated: 2023-04-26T07:21:56Z
department:
- _id: '9'
- _id: '157'
language:
- iso: ger
publication: 23. Kolloquium Gemeinsame Forschung in der Klebtechnik
status: public
title: Weiterentwicklung der induktiven Schnellhärtung von Klebverbindungen für robuste
  Fertigungsprozesse unter Berücksichtigung von serienrelevanten Einflussfaktoren
type: conference
user_id: '32252'
year: '2023'
...
---
_id: '35536'
article_type: original
author:
- first_name: Jannik
  full_name: Kowatz, Jannik
  id: '32252'
  last_name: Kowatz
  orcid: 0000-0002-4972-4718
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
citation:
  ama: Kowatz J, Teutenberg D, Meschut G. Optimization of inductive fast-curing of
    epoxy adhesive by model-based kinetics. <i>International Journal of Adhesion and
    Adhesives</i>. 2023;124. doi:<a href="https://doi.org/10.1016/j.ijadhadh.2023.103392">https://doi.org/10.1016/j.ijadhadh.2023.103392</a>
  apa: Kowatz, J., Teutenberg, D., &#38; Meschut, G. (2023). Optimization of inductive
    fast-curing of epoxy adhesive by model-based kinetics. <i>International Journal
    of Adhesion and Adhesives</i>, <i>124</i>. <a href="https://doi.org/10.1016/j.ijadhadh.2023.103392">https://doi.org/10.1016/j.ijadhadh.2023.103392</a>
  bibtex: '@article{Kowatz_Teutenberg_Meschut_2023, title={Optimization of inductive
    fast-curing of epoxy adhesive by model-based kinetics}, volume={124}, DOI={<a
    href="https://doi.org/10.1016/j.ijadhadh.2023.103392">https://doi.org/10.1016/j.ijadhadh.2023.103392</a>},
    journal={International Journal of Adhesion and Adhesives}, publisher={Elsevier},
    author={Kowatz, Jannik and Teutenberg, Dominik and Meschut, Gerson}, year={2023}
    }'
  chicago: Kowatz, Jannik, Dominik Teutenberg, and Gerson Meschut. “Optimization of
    Inductive Fast-Curing of Epoxy Adhesive by Model-Based Kinetics.” <i>International
    Journal of Adhesion and Adhesives</i> 124 (2023). <a href="https://doi.org/10.1016/j.ijadhadh.2023.103392">https://doi.org/10.1016/j.ijadhadh.2023.103392</a>.
  ieee: 'J. Kowatz, D. Teutenberg, and G. Meschut, “Optimization of inductive fast-curing
    of epoxy adhesive by model-based kinetics,” <i>International Journal of Adhesion
    and Adhesives</i>, vol. 124, 2023, doi: <a href="https://doi.org/10.1016/j.ijadhadh.2023.103392">https://doi.org/10.1016/j.ijadhadh.2023.103392</a>.'
  mla: Kowatz, Jannik, et al. “Optimization of Inductive Fast-Curing of Epoxy Adhesive
    by Model-Based Kinetics.” <i>International Journal of Adhesion and Adhesives</i>,
    vol. 124, Elsevier, 2023, doi:<a href="https://doi.org/10.1016/j.ijadhadh.2023.103392">https://doi.org/10.1016/j.ijadhadh.2023.103392</a>.
  short: J. Kowatz, D. Teutenberg, G. Meschut, International Journal of Adhesion and
    Adhesives 124 (2023).
date_created: 2023-01-09T15:48:17Z
date_updated: 2023-05-09T06:43:41Z
department:
- _id: '9'
- _id: '157'
doi: https://doi.org/10.1016/j.ijadhadh.2023.103392
intvolume: '       124'
language:
- iso: eng
publication: International Journal of Adhesion and Adhesives
publication_identifier:
  issn:
  - 0143-7496
publication_status: published
publisher: Elsevier
quality_controlled: '1'
status: public
title: Optimization of inductive fast-curing of epoxy adhesive by model-based kinetics
type: journal_article
user_id: '32252'
volume: 124
year: '2023'
...
---
_id: '52689'
author:
- first_name: Marius
  full_name: Striewe, Marius
  id: '30228'
  last_name: Striewe
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: David
  full_name: Hein, David
  id: '7728'
  last_name: Hein
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
- first_name: Lars
  full_name: Schmelzle, Lars
  last_name: Schmelzle
- first_name: Julia
  full_name: Mergheim, Julia
  last_name: Mergheim
- first_name: Gunnar
  full_name: Possart, Gunnar
  last_name: Possart
citation:
  ama: 'Striewe M, Teutenberg D, Hein D, et al. Methode zur Simulation des temperaturabhängigen
    Crashverhaltens von strukturellen Klebverbindungen. In: DVS Media GmbH, ed. <i>Klebtechnische
    Doktorandenseminare 2020 - 2022</i>. Vol 369. DVS Berichte. ; 2023.'
  apa: Striewe, M., Teutenberg, D., Hein, D., Meschut, G., Schmelzle, L., Mergheim,
    J., &#38; Possart, G. (2023). Methode zur Simulation des temperaturabhängigen
    Crashverhaltens von strukturellen Klebverbindungen. In DVS Media GmbH (Ed.), <i>Klebtechnische
    Doktorandenseminare 2020 - 2022</i> (Vol. 369).
  bibtex: '@inbook{Striewe_Teutenberg_Hein_Meschut_Schmelzle_Mergheim_Possart_2023,
    series={DVS Berichte}, title={Methode zur Simulation des temperaturabhängigen
    Crashverhaltens von strukturellen Klebverbindungen}, volume={369}, booktitle={Klebtechnische
    Doktorandenseminare 2020 - 2022}, author={Striewe, Marius and Teutenberg, Dominik
    and Hein, David and Meschut, Gerson and Schmelzle, Lars and Mergheim, Julia and
    Possart, Gunnar}, editor={DVS Media GmbH}, year={2023}, collection={DVS Berichte}
    }'
  chicago: Striewe, Marius, Dominik Teutenberg, David Hein, Gerson Meschut, Lars Schmelzle,
    Julia Mergheim, and Gunnar Possart. “Methode zur Simulation des temperaturabhängigen
    Crashverhaltens von strukturellen Klebverbindungen.” In <i>Klebtechnische Doktorandenseminare
    2020 - 2022</i>, edited by DVS Media GmbH, Vol. 369. DVS Berichte, 2023.
  ieee: M. Striewe <i>et al.</i>, “Methode zur Simulation des temperaturabhängigen
    Crashverhaltens von strukturellen Klebverbindungen,” in <i>Klebtechnische Doktorandenseminare
    2020 - 2022</i>, vol. 369, DVS Media GmbH, Ed. 2023.
  mla: Striewe, Marius, et al. “Methode zur Simulation des temperaturabhängigen Crashverhaltens
    von strukturellen Klebverbindungen.” <i>Klebtechnische Doktorandenseminare 2020
    - 2022</i>, edited by DVS Media GmbH, vol. 369, 2023.
  short: 'M. Striewe, D. Teutenberg, D. Hein, G. Meschut, L. Schmelzle, J. Mergheim,
    G. Possart, in: DVS Media GmbH (Ed.), Klebtechnische Doktorandenseminare 2020
    - 2022, 2023.'
conference:
  location: Blankenburg (Harz)
  name: 13. Doktorandenseminar Klebtechnik
corporate_editor:
- DVS Media GmbH
date_created: 2024-03-20T14:00:11Z
date_updated: 2026-02-23T08:27:39Z
department:
- _id: '157'
intvolume: '       369'
language:
- iso: ger
publication: Klebtechnische Doktorandenseminare 2020 - 2022
publication_identifier:
  isbn:
  - 978-3-96144-139-6
quality_controlled: '1'
series_title: DVS Berichte
status: public
title: Methode zur Simulation des temperaturabhängigen Crashverhaltens von strukturellen
  Klebverbindungen
type: book_chapter
user_id: '537'
volume: 369
year: '2023'
...
---
_id: '46164'
author:
- first_name: Nick
  full_name: Chudalla, Nick
  id: '41235'
  last_name: Chudalla
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Miriam
  full_name: Schneider, Miriam
  last_name: Schneider
- first_name: 'Dominic '
  full_name: 'Smart, Dominic '
  last_name: Smart
citation:
  ama: Chudalla N, Meschut G, Teutenberg D, Schneider M, Smart D. Rechnergestützte
    Versagensanalyse geklebter Verbindungen. <i> adhäsion KLEBEN &#38; DICHTEN</i>.
    2023;(6). doi:<a href="https://doi.org/10.1007/s35145-023-1198-x ">https://doi.org/10.1007/s35145-023-1198-x
    </a>
  apa: Chudalla, N., Meschut, G., Teutenberg, D., Schneider, M., &#38; Smart, D. (2023).
    Rechnergestützte Versagensanalyse geklebter Verbindungen. <i> Adhäsion KLEBEN
    &#38; DICHTEN</i>, <i>6</i>. <a href="https://doi.org/10.1007/s35145-023-1198-x
    ">https://doi.org/10.1007/s35145-023-1198-x </a>
  bibtex: '@article{Chudalla_Meschut_Teutenberg_Schneider_Smart_2023, title={Rechnergestützte
    Versagensanalyse geklebter Verbindungen}, DOI={<a href="https://doi.org/10.1007/s35145-023-1198-x
    ">https://doi.org/10.1007/s35145-023-1198-x </a>}, number={6}, journal={ adhäsion
    KLEBEN &#38; DICHTEN}, author={Chudalla, Nick and Meschut, Gerson and Teutenberg,
    Dominik and Schneider, Miriam and Smart, Dominic }, year={2023} }'
  chicago: Chudalla, Nick, Gerson Meschut, Dominik Teutenberg, Miriam Schneider, and
    Dominic  Smart. “Rechnergestützte Versagensanalyse Geklebter Verbindungen.” <i>
    Adhäsion KLEBEN &#38; DICHTEN</i>, no. 6 (2023). <a href="https://doi.org/10.1007/s35145-023-1198-x
    ">https://doi.org/10.1007/s35145-023-1198-x </a>.
  ieee: 'N. Chudalla, G. Meschut, D. Teutenberg, M. Schneider, and D. Smart, “Rechnergestützte
    Versagensanalyse geklebter Verbindungen,” <i> adhäsion KLEBEN &#38; DICHTEN</i>,
    no. 6, 2023, doi: <a href="https://doi.org/10.1007/s35145-023-1198-x ">https://doi.org/10.1007/s35145-023-1198-x
    </a>.'
  mla: Chudalla, Nick, et al. “Rechnergestützte Versagensanalyse Geklebter Verbindungen.”
    <i> Adhäsion KLEBEN &#38; DICHTEN</i>, no. 6, 2023, doi:<a href="https://doi.org/10.1007/s35145-023-1198-x
    ">https://doi.org/10.1007/s35145-023-1198-x </a>.
  short: N. Chudalla, G. Meschut, D. Teutenberg, M. Schneider, D. Smart,  Adhäsion
    KLEBEN &#38; DICHTEN (2023).
date_created: 2023-07-27T06:55:20Z
date_updated: 2026-02-23T08:27:14Z
department:
- _id: '157'
doi: 'https://doi.org/10.1007/s35145-023-1198-x '
issue: '6'
language:
- iso: eng
publication: ' adhäsion KLEBEN & DICHTEN'
quality_controlled: '1'
status: public
title: Rechnergestützte Versagensanalyse geklebter Verbindungen
type: journal_article
user_id: '537'
year: '2023'
...
---
_id: '29852'
author:
- first_name: Felix
  full_name: Beule, Felix
  id: '66192'
  last_name: Beule
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
- first_name: Tobias
  full_name: Aubel, Tobias
  last_name: Aubel
- first_name: Anton
  full_name: Matzenmiller, Anton
  last_name: Matzenmiller
citation:
  ama: 'Beule F, Teutenberg D, Meschut G, Aubel T, Matzenmiller A. Methodenentwicklung
    zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter Klebverbindungen
    in stahlintensiven Mischbaustrukturen. In: <i>22. Kolloquium: Gemeinsame Forschung
    in der Klebtechnik</i>. ; 2022.'
  apa: 'Beule, F., Teutenberg, D., Meschut, G., Aubel, T., &#38; Matzenmiller, A.
    (2022). Methodenentwicklung zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter
    Klebverbindungen in stahlintensiven Mischbaustrukturen. <i>22. Kolloquium: Gemeinsame
    Forschung in der Klebtechnik</i>. 22. Kolloquium: Gemeinsame Forschung in der
    Klebtechnik.'
  bibtex: '@inproceedings{Beule_Teutenberg_Meschut_Aubel_Matzenmiller_2022, title={Methodenentwicklung
    zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter Klebverbindungen
    in stahlintensiven Mischbaustrukturen}, booktitle={22. Kolloquium: Gemeinsame
    Forschung in der Klebtechnik}, author={Beule, Felix and Teutenberg, Dominik and
    Meschut, Gerson and Aubel, Tobias and Matzenmiller, Anton}, year={2022} }'
  chicago: 'Beule, Felix, Dominik Teutenberg, Gerson Meschut, Tobias Aubel, and Anton
    Matzenmiller. “Methodenentwicklung zur Versagensanalyse aufgrund der Aushärtung
    vorgeschädigter Klebverbindungen in stahlintensiven Mischbaustrukturen.” In <i>22.
    Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>, 2022.'
  ieee: 'F. Beule, D. Teutenberg, G. Meschut, T. Aubel, and A. Matzenmiller, “Methodenentwicklung
    zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter Klebverbindungen
    in stahlintensiven Mischbaustrukturen,” presented at the 22. Kolloquium: Gemeinsame
    Forschung in der Klebtechnik, 2022.'
  mla: 'Beule, Felix, et al. “Methodenentwicklung zur Versagensanalyse aufgrund der
    Aushärtung vorgeschädigter Klebverbindungen in stahlintensiven Mischbaustrukturen.”
    <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>, 2022.'
  short: 'F. Beule, D. Teutenberg, G. Meschut, T. Aubel, A. Matzenmiller, in: 22.
    Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2022.'
conference:
  end_date: 2022-02-16
  name: '22. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
  start_date: 2022-02-15
date_created: 2022-02-16T07:14:34Z
date_updated: 2022-02-16T07:15:15Z
department:
- _id: '157'
language:
- iso: ger
publication: '22. Kolloquium: Gemeinsame Forschung in der Klebtechnik'
status: public
title: Methodenentwicklung zur Versagensanalyse aufgrund der Aushärtung vorgeschädigter
  Klebverbindungen in stahlintensiven Mischbaustrukturen
type: conference_abstract
user_id: '66192'
year: '2022'
...
