[{"oa":"1","date_updated":"2026-03-14T19:04:46Z","author":[{"full_name":"Al Trjman, Mohamad","id":"65415","last_name":"Al Trjman","first_name":"Mohamad"},{"last_name":"Beule","full_name":"Beule, Felix","id":"66192","first_name":"Felix"},{"id":"537","full_name":"Teutenberg, Dominik","last_name":"Teutenberg","first_name":"Dominik"},{"first_name":"Gerson","full_name":"Meschut, Gerson","id":"32056","orcid":"0000-0002-2763-1246","last_name":"Meschut"},{"first_name":"Julia","full_name":"Riese, Julia","id":"101499","last_name":"Riese","orcid":"0000-0002-3053-0534"}],"main_file_link":[{"open_access":"1"}],"doi":"10.1080/00218464.2026.2644394","publication_status":"published","publication_identifier":{"issn":["0021-8464","1545-5823"]},"has_accepted_license":"1","citation":{"ieee":"M. Al Trjman, F. Beule, D. Teutenberg, G. Meschut, and J. Riese, “Experimental characterization and numerical analysis of the influence of the CED coating process on viscous fingering formation in hybrid-jointed mixed structures,” <i>The Journal of Adhesion</i>, pp. 1–24, 2026, doi: <a href=\"https://doi.org/10.1080/00218464.2026.2644394\">10.1080/00218464.2026.2644394</a>.","chicago":"Al Trjman, Mohamad, Felix Beule, Dominik Teutenberg, Gerson Meschut, and Julia Riese. “Experimental Characterization and Numerical Analysis of the Influence of the CED Coating Process on Viscous Fingering Formation in Hybrid-Jointed Mixed Structures.” <i>The Journal of Adhesion</i>, 2026, 1–24. <a href=\"https://doi.org/10.1080/00218464.2026.2644394\">https://doi.org/10.1080/00218464.2026.2644394</a>.","ama":"Al Trjman M, Beule F, Teutenberg D, Meschut G, Riese J. Experimental characterization and numerical analysis of the influence of the CED coating process on viscous fingering formation in hybrid-jointed mixed structures. <i>The Journal of Adhesion</i>. Published online 2026:1-24. doi:<a href=\"https://doi.org/10.1080/00218464.2026.2644394\">10.1080/00218464.2026.2644394</a>","short":"M. Al Trjman, F. Beule, D. Teutenberg, G. Meschut, J. Riese, The Journal of Adhesion (2026) 1–24.","bibtex":"@article{Al Trjman_Beule_Teutenberg_Meschut_Riese_2026, title={Experimental characterization and numerical analysis of the influence of the CED coating process on viscous fingering formation in hybrid-jointed mixed structures}, DOI={<a href=\"https://doi.org/10.1080/00218464.2026.2644394\">10.1080/00218464.2026.2644394</a>}, journal={The Journal of Adhesion}, publisher={Informa UK Limited}, author={Al Trjman, Mohamad and Beule, Felix and Teutenberg, Dominik and Meschut, Gerson and Riese, Julia}, year={2026}, pages={1–24} }","mla":"Al Trjman, Mohamad, et al. “Experimental Characterization and Numerical Analysis of the Influence of the CED Coating Process on Viscous Fingering Formation in Hybrid-Jointed Mixed Structures.” <i>The Journal of Adhesion</i>, Informa UK Limited, 2026, pp. 1–24, doi:<a href=\"https://doi.org/10.1080/00218464.2026.2644394\">10.1080/00218464.2026.2644394</a>.","apa":"Al Trjman, M., Beule, F., Teutenberg, D., Meschut, G., &#38; Riese, J. (2026). Experimental characterization and numerical analysis of the influence of the CED coating process on viscous fingering formation in hybrid-jointed mixed structures. <i>The Journal of Adhesion</i>, 1–24. <a href=\"https://doi.org/10.1080/00218464.2026.2644394\">https://doi.org/10.1080/00218464.2026.2644394</a>"},"page":"1-24","_id":"64916","user_id":"65415","department":[{"_id":"9"}],"article_type":"original","file_date_updated":"2026-03-14T18:50:31Z","type":"journal_article","status":"public","publisher":"Informa UK Limited","date_created":"2026-03-14T18:43:41Z","title":"Experimental characterization and numerical analysis of the influence of the CED coating process on viscous fingering formation in hybrid-jointed mixed structures","year":"2026","ddc":["620","670","660"],"keyword":["Adhesive area reduction","CED coating process","delta alpha problem","epoxy structural adhesive","influence of manufacture","multi-material design","numerical simulation (FEM)","relative displacements","viscous fingering (saffman-taylor-instability)."],"language":[{"iso":"eng"}],"publication":"The Journal of Adhesion","abstract":[{"text":"The joining of dissimilar materials, such as steel and aluminum, entails significant challenges during thermal curing processes due to differing coefficients of thermal expansion. This study addresses the formation of “viscous fingering” instabilities in structural adhesive joints, which are induced by thermally driven relative displacements during the liquid phase of the adhesive. Using a component-like specimen “bridge specimen,” the dependency of this phenomenon on process temperature and structural stiffness (rivet distance) was characterized. Experimental results reveal that while the relative displacement scales cubically with the free buckling length, the resulting adhesive area reduction follows an exponential trend, leading to a loss of effective bond area of up to 79%, which significantly compromises the joint strength in automotive applications. To predict these process-induced defects, a thermo-chemo-viscoelastic-viscoplastic adhesive model implemented in LS-DYNA was applied. The model combines curing kinetics, viscoelastic relaxation, and pressure-dependent plasticity and features a geometric damage parameter (D) that captures the adhesive area reduction caused by viscous fingering as an exponential function of the accumulated normal strain in the liquid phase. This damage parameter, calibrated on base-specimen level, was transferred to the component geometry. The simulation demonstrated high predictive accuracy with a maximum deviation of the adhesive area reduction of 3.1% compared to experimental data. This validates the model’s capability to predict manufacturing-induced damage in complex hybrid structures solely based on thermal boundary conditions.","lang":"eng"}],"file":[{"content_type":"application/pdf","success":1,"relation":"main_file","date_updated":"2026-03-14T18:50:31Z","date_created":"2026-03-14T18:50:31Z","creator":"mohamada","file_size":14668789,"file_id":"64917","access_level":"closed","file_name":"Experimental characterization and numerical analysis of the influence of the CED coating process on viscous fingering formation in hybrid-jointed mixe.pdf"}]},{"year":"2025","intvolume":"       139","citation":{"short":"M. Al Trjman, A.H.J. Salten, F. Beule, D. Teutenberg, G. Meschut, J. Riese, E. Kenig, International Journal of Adhesion and Adhesives 139 (2025).","bibtex":"@article{Al Trjman_Salten_Beule_Teutenberg_Meschut_Riese_Kenig_2025, title={Viscous fingering in adhesive bonding}, volume={139}, DOI={<a href=\"https://doi.org/10.1016/j.ijadhadh.2025.103960\">10.1016/j.ijadhadh.2025.103960</a>}, number={103960}, journal={International Journal of Adhesion and Adhesives}, publisher={Elsevier BV}, author={Al Trjman, Mohamad and Salten, Alexander Heinrich Johannes and Beule, Felix and Teutenberg, Dominik and Meschut, Gerson and Riese, Julia and Kenig, Eugeny}, year={2025} }","mla":"Al Trjman, Mohamad, et al. “Viscous Fingering in Adhesive Bonding.” <i>International Journal of Adhesion and Adhesives</i>, vol. 139, 103960, Elsevier BV, 2025, doi:<a href=\"https://doi.org/10.1016/j.ijadhadh.2025.103960\">10.1016/j.ijadhadh.2025.103960</a>.","apa":"Al Trjman, M., Salten, A. H. J., Beule, F., Teutenberg, D., Meschut, G., Riese, J., &#38; Kenig, E. (2025). Viscous fingering in adhesive bonding. <i>International Journal of Adhesion and Adhesives</i>, <i>139</i>, Article 103960. <a href=\"https://doi.org/10.1016/j.ijadhadh.2025.103960\">https://doi.org/10.1016/j.ijadhadh.2025.103960</a>","ama":"Al Trjman M, Salten AHJ, Beule F, et al. Viscous fingering in adhesive bonding. <i>International Journal of Adhesion and Adhesives</i>. 2025;139. doi:<a href=\"https://doi.org/10.1016/j.ijadhadh.2025.103960\">10.1016/j.ijadhadh.2025.103960</a>","chicago":"Al Trjman, Mohamad, Alexander Heinrich Johannes Salten, Felix Beule, Dominik Teutenberg, Gerson Meschut, Julia Riese, and Eugeny Kenig. “Viscous Fingering in Adhesive Bonding.” <i>International Journal of Adhesion and Adhesives</i> 139 (2025). <a href=\"https://doi.org/10.1016/j.ijadhadh.2025.103960\">https://doi.org/10.1016/j.ijadhadh.2025.103960</a>.","ieee":"M. Al Trjman <i>et al.</i>, “Viscous fingering in adhesive bonding,” <i>International Journal of Adhesion and Adhesives</i>, vol. 139, Art. no. 103960, 2025, doi: <a href=\"https://doi.org/10.1016/j.ijadhadh.2025.103960\">10.1016/j.ijadhadh.2025.103960</a>."},"publication_identifier":{"issn":["0143-7496"]},"quality_controlled":"1","publication_status":"published","title":"Viscous fingering in adhesive bonding","doi":"10.1016/j.ijadhadh.2025.103960","date_updated":"2025-02-21T12:10:51Z","publisher":"Elsevier BV","volume":139,"date_created":"2025-02-17T19:39:31Z","author":[{"first_name":"Mohamad","last_name":"Al Trjman","id":"65415","full_name":"Al Trjman, Mohamad"},{"first_name":"Alexander Heinrich Johannes","orcid":"0000-0003-3069-9601","last_name":"Salten","full_name":"Salten, Alexander Heinrich Johannes","id":"59551"},{"full_name":"Beule, Felix","id":"66192","last_name":"Beule","first_name":"Felix"},{"id":"537","full_name":"Teutenberg, Dominik","last_name":"Teutenberg","first_name":"Dominik"},{"id":"32056","full_name":"Meschut, Gerson","orcid":"0000-0002-2763-1246","last_name":"Meschut","first_name":"Gerson"},{"id":"101499","full_name":"Riese, Julia","last_name":"Riese","orcid":"0000-0002-3053-0534","first_name":"Julia"},{"first_name":"Eugeny","full_name":"Kenig, Eugeny","id":"665","last_name":"Kenig"}],"status":"public","publication":"International Journal of Adhesion and Adhesives","type":"journal_article","article_number":"103960","language":[{"iso":"eng"}],"_id":"58672","department":[{"_id":"9"},{"_id":"831"}],"user_id":"101499"},{"conference":{"start_date":"2024-02-27","name":"Gemeinsame Forschung in der Klebtechnik","location":"Köln","end_date":"2024-02-28"},"title":"Methodenentwicklung zur Simulation des Viscous Fingering in Klebverbindungen von stahlintensiven Mischbaustrukturen","author":[{"first_name":"Mohamad","last_name":"Al Trjman","full_name":"Al Trjman, Mohamad","id":"65415"},{"full_name":"Meschut, Gerson","id":"32056","orcid":"0000-0002-2763-1246","last_name":"Meschut","first_name":"Gerson"},{"id":"59551","full_name":"Salten, Alexander Heinrich Johannes","orcid":"0000-0003-3069-9601","last_name":"Salten","first_name":"Alexander Heinrich Johannes"},{"full_name":"Kenig, Eugeny Y.","id":"665","last_name":"Kenig","first_name":"Eugeny Y."}],"date_created":"2024-03-08T14:00:06Z","date_updated":"2024-03-08T14:01:49Z","citation":{"ama":"Al Trjman M, Meschut G, Salten AHJ, Kenig EY. Methodenentwicklung zur Simulation des Viscous Fingering in Klebverbindungen von stahlintensiven Mischbaustrukturen. In: ; 2024.","chicago":"Al Trjman, Mohamad, Gerson Meschut, Alexander Heinrich Johannes Salten, and Eugeny Y. Kenig. “Methodenentwicklung Zur Simulation Des Viscous Fingering in Klebverbindungen von Stahlintensiven Mischbaustrukturen,” 2024.","ieee":"M. Al Trjman, G. Meschut, A. H. J. Salten, and E. Y. Kenig, “Methodenentwicklung zur Simulation des Viscous Fingering in Klebverbindungen von stahlintensiven Mischbaustrukturen,” presented at the Gemeinsame Forschung in der Klebtechnik, Köln, 2024.","short":"M. Al Trjman, G. Meschut, A.H.J. Salten, E.Y. Kenig, in: 2024.","mla":"Al Trjman, Mohamad, et al. <i>Methodenentwicklung Zur Simulation Des Viscous Fingering in Klebverbindungen von Stahlintensiven Mischbaustrukturen</i>. 2024.","bibtex":"@inproceedings{Al Trjman_Meschut_Salten_Kenig_2024, title={Methodenentwicklung zur Simulation des Viscous Fingering in Klebverbindungen von stahlintensiven Mischbaustrukturen}, author={Al Trjman, Mohamad and Meschut, Gerson and Salten, Alexander Heinrich Johannes and Kenig, Eugeny Y.}, year={2024} }","apa":"Al Trjman, M., Meschut, G., Salten, A. H. J., &#38; Kenig, E. Y. (2024). <i>Methodenentwicklung zur Simulation des Viscous Fingering in Klebverbindungen von stahlintensiven Mischbaustrukturen</i>. Gemeinsame Forschung in der Klebtechnik, Köln."},"year":"2024","language":[{"iso":"eng"}],"user_id":"59551","department":[{"_id":"831"}],"_id":"52403","status":"public","type":"conference_abstract"},{"conference":{"end_date":"2024-04-24","location":"Shanghai","name":"International Symposium Smart Joining Solutions for Future Mobility","start_date":"2024-04-24"},"title":"Method development (modelling, simulation, characterisation) in adhesive bonding technology","date_created":"2024-05-10T06:06:50Z","author":[{"id":"66192","full_name":"Beule, Felix","last_name":"Beule","first_name":"Felix"},{"full_name":"Al Trjman, Mohamad","id":"65415","last_name":"Al Trjman","first_name":"Mohamad"},{"full_name":"Teutenberg, Dominik","id":"537","last_name":"Teutenberg","first_name":"Dominik"},{"first_name":"Gerson","last_name":"Meschut","orcid":"0000-0002-2763-1246","full_name":"Meschut, Gerson","id":"32056"}],"date_updated":"2024-05-10T06:07:02Z","citation":{"ama":"Beule F, Al Trjman M, Teutenberg D, Meschut G. Method development (modelling, simulation, characterisation) in adhesive bonding technology. In: ; 2024.","ieee":"F. Beule, M. Al Trjman, D. Teutenberg, and G. Meschut, “Method development (modelling, simulation, characterisation) in adhesive bonding technology,” presented at the International Symposium Smart Joining Solutions for Future Mobility, Shanghai, 2024.","chicago":"Beule, Felix, Mohamad Al Trjman, Dominik Teutenberg, and Gerson Meschut. “Method Development (Modelling, Simulation, Characterisation) in Adhesive Bonding Technology.” Shanghai, 2024.","mla":"Beule, Felix, et al. <i>Method Development (Modelling, Simulation, Characterisation) in Adhesive Bonding Technology</i>. 2024.","short":"F. Beule, M. Al Trjman, D. Teutenberg, G. Meschut, in: Shanghai, 2024.","bibtex":"@inproceedings{Beule_Al Trjman_Teutenberg_Meschut_2024, place={Shanghai}, title={Method development (modelling, simulation, characterisation) in adhesive bonding technology}, author={Beule, Felix and Al Trjman, Mohamad and Teutenberg, Dominik and Meschut, Gerson}, year={2024} }","apa":"Beule, F., Al Trjman, M., Teutenberg, D., &#38; Meschut, G. (2024). <i>Method development (modelling, simulation, characterisation) in adhesive bonding technology</i>. International Symposium Smart Joining Solutions for Future Mobility, Shanghai."},"place":"Shanghai","year":"2024","language":[{"iso":"eng"}],"user_id":"66192","department":[{"_id":"157"}],"_id":"54142","status":"public","type":"conference_abstract"},{"status":"public","type":"conference_abstract","language":[{"iso":"eng"}],"_id":"44228","user_id":"65415","department":[{"_id":"145"},{"_id":"157"}],"year":"2023","citation":{"ama":"Salten AHJ, Al Trjman M, Meschut G, Kenig EY. Simulation des „viscous fingering“ Effektes in Klebverbindungen. In: ; 2023.","ieee":"A. H. J. Salten, M. Al Trjman, G. Meschut, and E. Y. Kenig, “Simulation des „viscous fingering“ Effektes in Klebverbindungen,” presented at the Jahrestreffen der DECHEMA Fachgruppen Aerosoltechnik, Gasreingigung, Mehrphasenströmung und Partikelmesstechnik, Paderborn, 2023.","chicago":"Salten, Alexander Heinrich Johannes, Mohamad Al Trjman, Gerson Meschut, and Eugeny Y. Kenig. “Simulation Des „viscous Fingering“ Effektes in Klebverbindungen,” 2023.","apa":"Salten, A. H. J., Al Trjman, M., Meschut, G., &#38; Kenig, E. Y. (2023). <i>Simulation des „viscous fingering“ Effektes in Klebverbindungen</i>. Jahrestreffen der DECHEMA Fachgruppen Aerosoltechnik, Gasreingigung, Mehrphasenströmung und Partikelmesstechnik, Paderborn.","bibtex":"@inproceedings{Salten_Al Trjman_Meschut_Kenig_2023, title={Simulation des „viscous fingering“ Effektes in Klebverbindungen}, author={Salten, Alexander Heinrich Johannes and Al Trjman, Mohamad and Meschut, Gerson and Kenig, Eugeny Y.}, year={2023} }","mla":"Salten, Alexander Heinrich Johannes, et al. <i>Simulation Des „viscous Fingering“ Effektes in Klebverbindungen</i>. 2023.","short":"A.H.J. Salten, M. Al Trjman, G. Meschut, E.Y. Kenig, in: 2023."},"title":"Simulation des „viscous fingering“ Effektes in Klebverbindungen","conference":{"end_date":"2023-03-30","location":"Paderborn","name":"Jahrestreffen der DECHEMA Fachgruppen Aerosoltechnik, Gasreingigung, Mehrphasenströmung und Partikelmesstechnik","start_date":"2023-03-28"},"date_updated":"2023-05-09T08:12:28Z","author":[{"last_name":"Salten","id":"59551","full_name":"Salten, Alexander Heinrich Johannes","first_name":"Alexander Heinrich Johannes"},{"last_name":"Al Trjman","id":"65415","full_name":"Al Trjman, Mohamad","first_name":"Mohamad"},{"first_name":"Gerson","full_name":"Meschut, Gerson","id":"32056","orcid":"0000-0002-2763-1246","last_name":"Meschut"},{"last_name":"Kenig","full_name":"Kenig, Eugeny Y.","id":"665","first_name":"Eugeny Y."}],"date_created":"2023-04-27T11:58:46Z"},{"type":"conference_abstract","status":"public","user_id":"65415","department":[{"_id":"145"},{"_id":"157"}],"_id":"44227","language":[{"iso":"eng"}],"citation":{"chicago":"Al Trjman, Mohamad, Gerson Meschut, Alexander Heinrich Johannes Salten, and Eugeny Y. Kenig. “Methodenentwicklung Zur Simulation Des Viscous Fingering in Klebverbindungen von Stahlintensiven Mischbaustrukturen,” 2023.","ieee":"M. Al Trjman, G. Meschut, A. H. J. Salten, and E. Y. Kenig, “Methodenentwicklung zur Simulation des Viscous Fingering in Klebverbindungen von stahlintensiven Mischbaustrukturen,” presented at the 23. Kolloquium Gemeinsame Forschung in der Klebtechnik, Frankfurt am Main, 2023.","ama":"Al Trjman M, Meschut G, Salten AHJ, Kenig EY. Methodenentwicklung zur Simulation des Viscous Fingering in Klebverbindungen von stahlintensiven Mischbaustrukturen. In: ; 2023.","short":"M. Al Trjman, G. Meschut, A.H.J. Salten, E.Y. Kenig, in: 2023.","bibtex":"@inproceedings{Al Trjman_Meschut_Salten_Kenig_2023, title={Methodenentwicklung zur Simulation des Viscous Fingering in Klebverbindungen von stahlintensiven Mischbaustrukturen}, author={Al Trjman, Mohamad and Meschut, Gerson and Salten, Alexander Heinrich Johannes and Kenig, Eugeny Y.}, year={2023} }","mla":"Al Trjman, Mohamad, et al. <i>Methodenentwicklung Zur Simulation Des Viscous Fingering in Klebverbindungen von Stahlintensiven Mischbaustrukturen</i>. 2023.","apa":"Al Trjman, M., Meschut, G., Salten, A. H. J., &#38; Kenig, E. Y. (2023). <i>Methodenentwicklung zur Simulation des Viscous Fingering in Klebverbindungen von stahlintensiven Mischbaustrukturen</i>. 23. Kolloquium Gemeinsame Forschung in der Klebtechnik, Frankfurt am Main."},"year":"2023","date_created":"2023-04-27T11:47:47Z","author":[{"last_name":"Al Trjman","full_name":"Al Trjman, Mohamad","id":"65415","first_name":"Mohamad"},{"id":"32056","full_name":"Meschut, Gerson","orcid":"0000-0002-2763-1246","last_name":"Meschut","first_name":"Gerson"},{"first_name":"Alexander Heinrich Johannes","last_name":"Salten","full_name":"Salten, Alexander Heinrich Johannes","id":"59551"},{"first_name":"Eugeny Y.","last_name":"Kenig","id":"665","full_name":"Kenig, Eugeny Y."}],"date_updated":"2023-05-09T08:12:11Z","conference":{"location":"Frankfurt am Main","end_date":"2023-03-01","start_date":"2023-02-28","name":"23. Kolloquium Gemeinsame Forschung in der Klebtechnik"},"title":"Methodenentwicklung zur Simulation des Viscous Fingering in Klebverbindungen von stahlintensiven Mischbaustrukturen"},{"publication":"22. Kolloquium: Gemeinsame Forschung in der Klebtechnik","type":"conference_abstract","status":"public","department":[{"_id":"157"}],"user_id":"65415","_id":"29856","language":[{"iso":"ger"}],"citation":{"ama":"Jamei S, Döller N, Lossau S, et al. DigiBody - Digitale Prozesskette zur Abbildung und Optimierung der Fügetechnik im Rohbau . In: <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>. ; 2022.","chicago":"Jamei, Said, Norbert Döller, Sebastian Lossau, Felix Beule, Mohamad Al Trjman, Tobias Aubel, Gerson Meschut, et al. “DigiBody - Digitale Prozesskette zur Abbildung und Optimierung der Fügetechnik im Rohbau .” In <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>, 2022.","ieee":"S. Jamei <i>et al.</i>, “DigiBody - Digitale Prozesskette zur Abbildung und Optimierung der Fügetechnik im Rohbau ,” presented at the 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2022.","bibtex":"@inproceedings{Jamei_Döller_Lossau_Beule_Al Trjman_Aubel_Meschut_Sommer_Facciotto_Droste_et al._2022, title={DigiBody - Digitale Prozesskette zur Abbildung und Optimierung der Fügetechnik im Rohbau }, booktitle={22. Kolloquium: Gemeinsame Forschung in der Klebtechnik}, author={Jamei, Said and Döller, Norbert and Lossau, Sebastian and Beule, Felix and Al Trjman, Mohamad and Aubel, Tobias and Meschut, Gerson and Sommer, Daniel and Facciotto, Silvio and Droste, Alexander and et al.}, year={2022} }","mla":"Jamei, Said, et al. “DigiBody - Digitale Prozesskette zur Abbildung und Optimierung der Fügetechnik im Rohbau .” <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>, 2022.","short":"S. Jamei, N. Döller, S. Lossau, F. Beule, M. Al Trjman, T. Aubel, G. Meschut, D. Sommer, S. Facciotto, A. Droste, A. Haufe, M. Helbig, H. Gleich, K. Kose, in: 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik, 2022.","apa":"Jamei, S., Döller, N., Lossau, S., Beule, F., Al Trjman, M., Aubel, T., Meschut, G., Sommer, D., Facciotto, S., Droste, A., Haufe, A., Helbig, M., Gleich, H., &#38; Kose, K. (2022). DigiBody - Digitale Prozesskette zur Abbildung und Optimierung der Fügetechnik im Rohbau . <i>22. Kolloquium: Gemeinsame Forschung in der Klebtechnik</i>. 22. Kolloquium: Gemeinsame Forschung in der Klebtechnik."},"year":"2022","author":[{"last_name":"Jamei","full_name":"Jamei, Said","first_name":"Said"},{"first_name":"Norbert","last_name":"Döller","full_name":"Döller, Norbert"},{"full_name":"Lossau, Sebastian","last_name":"Lossau","first_name":"Sebastian"},{"last_name":"Beule","id":"66192","full_name":"Beule, Felix","first_name":"Felix"},{"last_name":"Al Trjman","full_name":"Al Trjman, Mohamad","id":"65415","first_name":"Mohamad"},{"full_name":"Aubel, Tobias","last_name":"Aubel","first_name":"Tobias"},{"full_name":"Meschut, Gerson","id":"32056","orcid":"0000-0002-2763-1246","last_name":"Meschut","first_name":"Gerson"},{"first_name":"Daniel","full_name":"Sommer, Daniel","last_name":"Sommer"},{"last_name":"Facciotto","full_name":"Facciotto, Silvio","first_name":"Silvio"},{"first_name":"Alexander","full_name":"Droste, Alexander","last_name":"Droste"},{"first_name":"Andre","full_name":"Haufe, Andre","last_name":"Haufe"},{"full_name":"Helbig, Martin","last_name":"Helbig","first_name":"Martin"},{"last_name":"Gleich","full_name":"Gleich, Henning","first_name":"Henning"},{"full_name":"Kose, Kim","last_name":"Kose","first_name":"Kim"}],"date_created":"2022-02-16T07:23:45Z","date_updated":"2023-05-09T08:07:16Z","conference":{"end_date":"2022-02-16","name":"22. Kolloquium: Gemeinsame Forschung in der Klebtechnik","start_date":"2022-02-15"},"title":"DigiBody - Digitale Prozesskette zur Abbildung und Optimierung der Fügetechnik im Rohbau "},{"title":"A new viscoelastic-viscoplastic constitutive formulation in LS-DYNA to model adhesives during the complete manufacturing-crashworthiness process chain","conference":{"end_date":"2022-06-29","location":"Schladming","name":"4a-Technologietage 2022","start_date":"2022-06-27"},"date_updated":"2023-05-09T08:12:48Z","author":[{"first_name":"Thomas","last_name":"Klöppel","full_name":"Klöppel, Thomas"},{"full_name":"Haufe, Andre","last_name":"Haufe","first_name":"Andre"},{"full_name":"Helbig, Martin","last_name":"Helbig","first_name":"Martin"},{"first_name":"Christian","last_name":"Liebold","full_name":"Liebold, Christian"},{"last_name":"Beule","full_name":"Beule, Felix","id":"66192","first_name":"Felix"},{"first_name":"Mohamad","id":"65415","full_name":"Al Trjman, Mohamad","last_name":"Al Trjman"},{"last_name":"Aubel","full_name":"Aubel, Tobias","first_name":"Tobias"},{"first_name":"Gerson","last_name":"Meschut","orcid":"0000-0002-2763-1246","full_name":"Meschut, Gerson","id":"32056"},{"full_name":"Jamei, Said","last_name":"Jamei","first_name":"Said"},{"first_name":"Fabian","full_name":"Fürle, Fabian","last_name":"Fürle"},{"first_name":"Sebastian","last_name":"Lossau","full_name":"Lossau, Sebastian"},{"first_name":"Alexander","last_name":"Droste","full_name":"Droste, Alexander"},{"first_name":"Henning","full_name":"Gleich, Henning","last_name":"Gleich"},{"last_name":"Kose","full_name":"Kose, Kim","first_name":"Kim"},{"full_name":"Sommer, Daniel","last_name":"Sommer","first_name":"Daniel"},{"full_name":"Facciotto, Silvio","last_name":"Facciotto","first_name":"Silvio"}],"date_created":"2023-02-20T10:01:18Z","year":"2022","citation":{"short":"T. Klöppel, A. Haufe, M. Helbig, C. Liebold, F. Beule, M. Al Trjman, T. Aubel, G. Meschut, S. Jamei, F. Fürle, S. Lossau, A. Droste, H. Gleich, K. Kose, D. Sommer, S. Facciotto, in: 4a-Technologietage 2022, 2022.","bibtex":"@inproceedings{Klöppel_Haufe_Helbig_Liebold_Beule_Al Trjman_Aubel_Meschut_Jamei_Fürle_et al._2022, title={A new viscoelastic-viscoplastic constitutive formulation in LS-DYNA to model adhesives during the complete manufacturing-crashworthiness process chain}, booktitle={4a-Technologietage 2022}, author={Klöppel, Thomas and Haufe, Andre and Helbig, Martin and Liebold, Christian and Beule, Felix and Al Trjman, Mohamad and Aubel, Tobias and Meschut, Gerson and Jamei, Said and Fürle, Fabian and et al.}, year={2022} }","mla":"Klöppel, Thomas, et al. “A New Viscoelastic-Viscoplastic Constitutive Formulation in LS-DYNA to Model Adhesives during the Complete Manufacturing-Crashworthiness Process Chain.” <i>4a-Technologietage 2022</i>, 2022.","apa":"Klöppel, T., Haufe, A., Helbig, M., Liebold, C., Beule, F., Al Trjman, M., Aubel, T., Meschut, G., Jamei, S., Fürle, F., Lossau, S., Droste, A., Gleich, H., Kose, K., Sommer, D., &#38; Facciotto, S. (2022). A new viscoelastic-viscoplastic constitutive formulation in LS-DYNA to model adhesives during the complete manufacturing-crashworthiness process chain. <i>4a-Technologietage 2022</i>. 4a-Technologietage 2022, Schladming.","ama":"Klöppel T, Haufe A, Helbig M, et al. A new viscoelastic-viscoplastic constitutive formulation in LS-DYNA to model adhesives during the complete manufacturing-crashworthiness process chain. In: <i>4a-Technologietage 2022</i>. ; 2022.","chicago":"Klöppel, Thomas, Andre Haufe, Martin Helbig, Christian Liebold, Felix Beule, Mohamad Al Trjman, Tobias Aubel, et al. “A New Viscoelastic-Viscoplastic Constitutive Formulation in LS-DYNA to Model Adhesives during the Complete Manufacturing-Crashworthiness Process Chain.” In <i>4a-Technologietage 2022</i>, 2022.","ieee":"T. Klöppel <i>et al.</i>, “A new viscoelastic-viscoplastic constitutive formulation in LS-DYNA to model adhesives during the complete manufacturing-crashworthiness process chain,” presented at the 4a-Technologietage 2022, Schladming, 2022."},"publication_status":"published","language":[{"iso":"eng"}],"_id":"42239","department":[{"_id":"157"}],"user_id":"65415","status":"public","publication":"4a-Technologietage 2022","type":"conference_abstract"}]