[{"volume":"Vol. 2018, No. 1, pp. 000572-000577.","author":[{"full_name":"Unger, Andreas","last_name":"Unger","first_name":"Andreas"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"},{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"last_name":"Brökelmann","full_name":"Brökelmann, Michael","first_name":"Michael"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"}],"date_created":"2019-05-27T10:27:45Z","date_updated":"2020-05-07T05:33:56Z","doi":"10.4071/2380-4505-2018.1.000572","title":"Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges","quality_controlled":"1","citation":{"bibtex":"@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>}, booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter}, year={2018} }","short":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.","mla":"Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, vol. Vol. 2018, No. 1, pp. 000572-000577., 2018, doi:<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>.","apa":"Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., &#38; Sextro, W. (2018). Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i> (Vol. Vol. 2018, No. 1, pp. 000572-000577.). <a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">https://doi.org/10.4071/2380-4505-2018.1.000572</a>","ama":"Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In: <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>","chicago":"Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, Vol. Vol. 2018, No. 1, pp. 000572-000577., 2018. <a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">https://doi.org/10.4071/2380-4505-2018.1.000572</a>.","ieee":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges,” in <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577."},"year":"2018","department":[{"_id":"151"}],"user_id":"210","_id":"9999","project":[{"_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210"}],"language":[{"iso":"eng"}],"keyword":["wire bonding","multi-objective optimization","process model","copper wire","self-optimization"],"publication":"In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018","type":"conference","status":"public","abstract":[{"text":"Ultrasonic wire bonding is an indispensable process in the industrial manufacturing of semiconductor devices. Copper wire is increasingly replacing the well-established aluminium wire because of its superior electrical, thermal and mechanical properties. Copper wire processes differ significantly from aluminium processes and are more sensitive to disturbances, which reduces the range of parameter values suitable for a stable process. Disturbances can be compensated by an adaption of process parameters, but finding suitable parameters manually is difficult and time-consuming. This paper presents a physical model of the ultrasonic wire bonding process including the friction contact between tool and wire. This model yields novel insights into the process. A prototype of a multi-objective optimizing bonding machine (MOBM) is presented. It uses multi-objective optimization, based on the complete process model, to automatically select the best operating point as a compromise of concurrent objectives.","lang":"eng"}]},{"date_updated":"2020-05-07T05:33:52Z","date_created":"2019-05-27T08:47:52Z","author":[{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"first_name":"Tobias","full_name":"Meyer, Tobias","last_name":"Meyer"},{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"},{"last_name":"Eacock","full_name":"Eacock, Florian","first_name":"Florian"}],"title":"Shape-Dependent Transmittable Tangential Force of Wire Bond Tools","doi":"10.1109/ECTC.2016.234","quality_controlled":"1","year":"2016","citation":{"chicago":"Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 2103–10, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.234\">https://doi.org/10.1109/ECTC.2016.234</a>.","ieee":"S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2103–2110.","ama":"Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:2103-2110. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>","bibtex":"@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent Transmittable Tangential Force of Wire Bond Tools}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2016}, pages={2103–2110} }","mla":"Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2103–10, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>.","short":"S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.","apa":"Althoff, S., Meyer, T., Unger, A., Sextro, W., &#38; Eacock, F. (2016). Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 2103–2110). <a href=\"https://doi.org/10.1109/ECTC.2016.234\">https://doi.org/10.1109/ECTC.2016.234</a>"},"page":"2103-2110","project":[{"grant_number":"02 PQ2210","_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"_id":"9955","user_id":"210","department":[{"_id":"151"}],"keyword":["finite element simulation","wire bonding","tool geometry"],"language":[{"iso":"eng"}],"type":"conference","publication":"IEEE 66th Electronic Components and Technology Conference","abstract":[{"text":"Wire bonding has been an established packaging technology for decades. When introducing copper as wire material for high power applications, adaptations to the bonding process and to machines became necessary. Here, challenges occur due to the stiffer wire material and changing oxide layers on the contact partners. To achieve sufficient process stability, a clean bond area is required, which can only be achieved with high shear stresses in the contact partners surfaces. These necessitate high normal forces to plastically deform the wire and substrate. To achieve such high stresses in the contact area, the bonding tool needs to be able to transmit the needed tangential forces to the top side of the wire. The wire itself performs a shear movement and transmits the force into the contact area to clean the contaminant and oxide layers and to level the desired bond surfaces. The main function of the tool is to transmit these forces. If the bond tool can only transmit low forces in the direction of excitation, the parameter space for a stable bond process is severely restricted. Here, a modeling approach to estimate how well different tool shapes meet the demand of transmitting high tangential forces is presented. The model depends on wire deformation and thus on the ultrasonic softening effect.","lang":"eng"}],"status":"public"},{"popular_science":"1","type":"journal_article","publication":"wt-online","abstract":[{"text":"Leistungshalbleitermodule werden leistungsfähiger, effizienter, kompakter und haltbarer Ziel dieses Innovationsprojekts des Spitzenclusters „it’s OWL – Intelligente Technische Systeme OstWestfalen-Lippe“ ist die Entwicklung von selbstoptimierenden Verfahren, um unter variablen Produktionsbedingungen zuverlässige Kupferbondverbindungen herstellen zu können. Die Ultraschall-Drahtbondmaschine erhält die Fähigkeit, sich automatisch an veränderte Bedingungen anzupassen. Hierzu wird der gesamte Prozess der Ultraschall-Verbindungsbildung modelliert und neueste Verfahren der Selbstoptimierung angewandt. Die Evaluierung erfolgt anhand eines Prototypen in Form einer modifizierten Bondmaschine. Intelligent production of heavy copper wire bonds It is the aim of this innovation-project to develop a self-optimization system for ultrasonic copper wire bonding. It is part of the leading edge cluster “it’s OWL”. The bonding machine will be able to react autonomously to changing boundary conditions to ensure constant and reliable bonding results. For this, the hole bonding process is modeled in great detail and newest self-optimization techniques are utilized. A prototype-system incorporated in a serial machine is used for evaluation.","lang":"eng"}],"status":"public","project":[{"grant_number":"02 PQ2210","_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"_id":"9957","user_id":"210","department":[{"_id":"151"}],"language":[{"iso":"eng"}],"year":"2016","citation":{"ama":"Brökelmann M, Unger A, Meyer T, et al. Kupferbondverbindungen intelligent herstellen. <i>wt-online</i>. 2016;7/8:512-519.","chicago":"Brökelmann, Michael, Andreas Unger, Tobias Meyer, Simon Althoff, Walter Sextro, Matthias Hunstig, Florian Biermann, and Karsten Guth. “Kupferbondverbindungen Intelligent Herstellen.” <i>Wt-Online</i> 7/8 (2016): 512–19.","ieee":"M. Brökelmann <i>et al.</i>, “Kupferbondverbindungen intelligent herstellen,” <i>wt-online</i>, vol. 7/8, pp. 512–519, 2016.","bibtex":"@article{Brökelmann_Unger_Meyer_Althoff_Sextro_Hunstig_Biermann_Guth_2016, title={Kupferbondverbindungen intelligent herstellen}, volume={7/8}, journal={wt-online}, author={Brökelmann, Michael and Unger, Andreas and Meyer, Tobias and Althoff, Simon and Sextro, Walter and Hunstig, Matthias and Biermann, Florian and Guth, Karsten}, year={2016}, pages={512–519} }","mla":"Brökelmann, Michael, et al. “Kupferbondverbindungen Intelligent Herstellen.” <i>Wt-Online</i>, vol. 7/8, 2016, pp. 512–19.","short":"M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F. Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.","apa":"Brökelmann, M., Unger, A., Meyer, T., Althoff, S., Sextro, W., Hunstig, M., … Guth, K. (2016). Kupferbondverbindungen intelligent herstellen. <i>Wt-Online</i>, <i>7/8</i>, 512–519."},"page":"512-519","date_updated":"2020-05-07T05:33:52Z","author":[{"last_name":"Brökelmann","full_name":"Brökelmann, Michael","first_name":"Michael"},{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"first_name":"Tobias","full_name":"Meyer, Tobias","last_name":"Meyer"},{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"first_name":"Walter","full_name":"Sextro, Walter","id":"21220","last_name":"Sextro"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"},{"full_name":"Biermann, Florian","last_name":"Biermann","first_name":"Florian"},{"last_name":"Guth","full_name":"Guth, Karsten","first_name":"Karsten"}],"date_created":"2019-05-27T08:53:18Z","volume":"7/8","title":"Kupferbondverbindungen intelligent herstellen"},{"language":[{"iso":"eng"}],"_id":"9960","project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"department":[{"_id":"151"}],"user_id":"210","abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is a common technology for connecting electrodes of electronic components like power modules. Nowadays, bond connections are often made of copper instead of aluminum due to its thermal and mechanical assets. One of the main cost factors in the wire bonding process is the acquisition cost of consumables such as bonding tools. For copper wire bonding tool lifetime is much lower than for aluminium bonding. This paper presents a micro wear model for wedge/wedge bonding tools that was validated by observing wear patterns with a scanning electron microscope. The wear coefficient is determined in long-term bonding tests. The application of Fleischer´s wear approach incorporating frictional power to a finite element simulation of the bonding processes is used to shift element nodes depending on the rising frictional power for finite element modeling. The presented simulation method can be used to take tool wear into consideration for creating tools with increased lifetime. This enables the production of reliable bond connections using heavy as well as thin wire of any material. The paper discusses the predominant influences of wear on the main tool functions and their changes over tool life. Furthermore, the influence of the tool groove angle on the tool wear was investigated. One of the main results is that the wear is largest during the last phase of each bonding process, when the contact area between tool and wire is largest."}],"status":"public","publication":"IEEE CPMT Symposium Japan, 2016","type":"conference","title":"Micro Wear Modeling in Copper Wire Wedge Bonding","date_updated":"2020-05-07T05:33:53Z","author":[{"first_name":"Paul","last_name":"Eichwald","full_name":"Eichwald, Paul"},{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"full_name":"Eacock, Florian","last_name":"Eacock","first_name":"Florian"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"first_name":"Walter","full_name":"Sextro, Walter","id":"21220","last_name":"Sextro"},{"first_name":"Karsten","full_name":"Guth, Karsten","last_name":"Guth"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"}],"date_created":"2019-05-27T09:07:19Z","year":"2016","citation":{"bibtex":"@inproceedings{Eichwald_Unger_Eacock_Althoff_Sextro_Guth_Brökelmann_2016, title={Micro Wear Modeling in Copper Wire Wedge Bonding}, booktitle={IEEE CPMT Symposium Japan, 2016}, author={Eichwald, Paul and Unger, Andreas and Eacock, Florian and Althoff, Simon and Sextro, Walter and Guth, Karsten and Brökelmann, Michael}, year={2016} }","short":"P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann, in: IEEE CPMT Symposium Japan, 2016, 2016.","mla":"Eichwald, Paul, et al. “Micro Wear Modeling in Copper Wire Wedge Bonding.” <i>IEEE CPMT Symposium Japan, 2016</i>, 2016.","apa":"Eichwald, P., Unger, A., Eacock, F., Althoff, S., Sextro, W., Guth, K., &#38; Brökelmann, M. (2016). Micro Wear Modeling in Copper Wire Wedge Bonding. In <i>IEEE CPMT Symposium Japan, 2016</i>.","ieee":"P. Eichwald <i>et al.</i>, “Micro Wear Modeling in Copper Wire Wedge Bonding,” in <i>IEEE CPMT Symposium Japan, 2016</i>, 2016.","chicago":"Eichwald, Paul, Andreas Unger, Florian Eacock, Simon Althoff, Walter Sextro, Karsten Guth, and Michael Brökelmann. “Micro Wear Modeling in Copper Wire Wedge Bonding.” In <i>IEEE CPMT Symposium Japan, 2016</i>, 2016.","ama":"Eichwald P, Unger A, Eacock F, et al. Micro Wear Modeling in Copper Wire Wedge Bonding. In: <i>IEEE CPMT Symposium Japan, 2016</i>. ; 2016."},"quality_controlled":"1"},{"date_updated":"2020-05-07T05:33:53Z","date_created":"2019-05-27T09:17:26Z","author":[{"full_name":"Meyer , Tobias","last_name":"Meyer ","first_name":"Tobias"},{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"},{"first_name":"Michael","full_name":"Brökelmann, Michael","last_name":"Brökelmann"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"},{"full_name":"Guth, Karsten","last_name":"Guth","first_name":"Karsten"}],"title":"Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation","doi":"10.1109/ECTC.2016.215","quality_controlled":"1","year":"2016","page":"622-628","citation":{"apa":"Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., &#38; Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 622–628). <a href=\"https://doi.org/10.1109/ECTC.2016.215\">https://doi.org/10.1109/ECTC.2016.215</a>","short":"T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.","bibtex":"@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628} }","mla":"Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 622–28, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>.","ama":"Meyer  T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:622-628. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>","chicago":"Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 622–28, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.215\">https://doi.org/10.1109/ECTC.2016.215</a>.","ieee":"T. Meyer  <i>et al.</i>, “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 622–628."},"_id":"9966","project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"department":[{"_id":"151"}],"user_id":"210","keyword":["Self-optimization","adaptive system","bond process","copper wire"],"language":[{"iso":"eng"}],"publication":"IEEE 66th Electronic Components and Technology Conference","type":"conference","abstract":[{"lang":"eng","text":"Usage of copper wire bonds allows to push power boundaries imposed by aluminum wire bonds. Copper allows higher electrical, thermal and mechanical loads than aluminum, which currently is the most commonly used material in heavy wire bonding. This is the main driving factor for increased usage of copper in high power applications such as wind turbines, locomotives or electric vehicles. At the same time, usage of copper also increases tool wear and reduces the range of parameter values for a stable process, making the process more challenging. To overcome these drawbacks, parameter adaptation at runtime using self-optimization is desired. A self-optimizing system is based on system objectives that evaluate and quantify system performance. System parameters can be changed at runtime such that pre-selected objective values are reached. For adaptation of bond process parameters, model-based self-optimization is employed. Since it is based on a model of the system, the bond process was modeled. In addition to static model parameters such as wire and substrate material properties and vibration characteristics of transducer and tool, variable model inputs are process parameters. Main simulation result is bonded area in the wiresubstrate contact. This model is then used to find valid and optimal working points before operation. The working point is composed of normal force and ultrasonic voltage trajectories, which are usually determined experimentally. Instead, multiobjective optimalization is used to compute trajectories that simultaneously optimize bond quality, process duration, tool wear and probability of tool-substrate contacts. The values of these objectives are computed using the process model. At runtime, selection among pre-determined optimal working points is sufficient to prioritize individual objectives. This way, the computationally expensive process of numerically solving a multiobjective optimal control problem and the demanding high speed bonding process are separated. To evaluate to what extent the pre-defined goals of self-optimization are met, an offthe- shelf heavy wire bonding machine was modified to allow for parameter adaptation and for transmitting of measurement data at runtime. This data is received by an external computer system and evaluated to select a new working point. Then, new process parameters are sent to the modified bonding machine for use for subsequent bonds. With these components, a full self-optimizing system has been implemented."}],"status":"public"},{"title":"Validated Simulation of the Ultrasonic Wire Bonding Process","author":[{"first_name":"Andreas","last_name":"Unger","full_name":"Unger, Andreas"},{"last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard","first_name":"Reinhard"},{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"first_name":"Florian","last_name":"Eacock","full_name":"Eacock, Florian"},{"full_name":"Eichwald, Paul","last_name":"Eichwald","first_name":"Paul"},{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"first_name":"Walter","last_name":"Sextro","id":"21220","full_name":"Sextro, Walter"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"first_name":"Karsten","full_name":"Guth, Karsten","last_name":"Guth"}],"date_created":"2019-05-27T09:20:10Z","date_updated":"2020-05-07T05:33:53Z","citation":{"apa":"Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S., … Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i> (pp. 251–254). IEEE CPMT Symposium Japan.","bibtex":"@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }","mla":"Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–54.","short":"A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.","ieee":"A. Unger <i>et al.</i>, “Validated Simulation of the Ultrasonic Wire Bonding Process,” in <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 2016, pp. 251–254.","chicago":"Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>, 251–54. IEEE CPMT Symposium Japan, 2016.","ama":"Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: <i>Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016</i>. IEEE CPMT Symposium Japan; 2016:251-254."},"page":"251-254","year":"2016","place":"IEEE CPMT Symposium Japan","quality_controlled":"1","language":[{"iso":"eng"}],"keyword":["the Ultrasonic Wire Bonding Process"],"user_id":"210","department":[{"_id":"151"}],"project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"_id":"9968","status":"public","abstract":[{"text":"To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tooltip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard’s wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage.","lang":"eng"}],"type":"conference","publication":"Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016"},{"quality_controlled":"1","year":"2015","page":"1-6","citation":{"mla":"Althoff, Simon, et al. “Improving the Cleaning Process in Copper Wire Bonding by Adapting Bonding Parameters.” <i>2015 17th Electronics Packaging Technology Conference</i>, 2015, pp. 1–6, doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">10.1109/EPTC.2015.7412402</a>.","bibtex":"@inproceedings{Althoff_Unger_Sextro_Eacock_2015, title={Improving the cleaning process in copper wire bonding by adapting bonding parameters}, DOI={<a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">10.1109/EPTC.2015.7412402</a>}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Althoff, Simon and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2015}, pages={1–6} }","short":"S. Althoff, A. Unger, W. Sextro, F. Eacock, in: 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6.","apa":"Althoff, S., Unger, A., Sextro, W., &#38; Eacock, F. (2015). Improving the cleaning process in copper wire bonding by adapting bonding parameters. In <i>2015 17th Electronics Packaging Technology Conference</i> (pp. 1–6). <a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">https://doi.org/10.1109/EPTC.2015.7412402</a>","chicago":"Althoff, Simon, Andreas Unger, Walter Sextro, and Florian Eacock. “Improving the Cleaning Process in Copper Wire Bonding by Adapting Bonding Parameters.” In <i>2015 17th Electronics Packaging Technology Conference</i>, 1–6, 2015. <a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">https://doi.org/10.1109/EPTC.2015.7412402</a>.","ieee":"S. Althoff, A. Unger, W. Sextro, and F. Eacock, “Improving the cleaning process in copper wire bonding by adapting bonding parameters,” in <i>2015 17th Electronics Packaging Technology Conference</i>, 2015, pp. 1–6.","ama":"Althoff S, Unger A, Sextro W, Eacock F. Improving the cleaning process in copper wire bonding by adapting bonding parameters. In: <i>2015 17th Electronics Packaging Technology Conference</i>. ; 2015:1-6. doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">10.1109/EPTC.2015.7412402</a>"},"date_updated":"2020-05-07T05:33:51Z","author":[{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"first_name":"Walter","last_name":"Sextro","id":"21220","full_name":"Sextro, Walter"},{"last_name":"Eacock","full_name":"Eacock, Florian","first_name":"Florian"}],"date_created":"2019-05-27T08:10:43Z","title":"Improving the cleaning process in copper wire bonding by adapting bonding parameters","doi":"10.1109/EPTC.2015.7412402","publication":"2015 17th Electronics Packaging Technology Conference","type":"conference","abstract":[{"lang":"eng","text":"Changing manufacturing technologies or material in well-known processes has to be followed by an adaption of process parameters. In case of the transition from aluminum wire to copper wire in heavy wire bonding, the adaption effort is high due to the strongly different mechanical properties of the wire. One of these adaption aspects, apart from wire material, is the existent oxide layers on wire and substrate. The ductile aluminum oxide is not influencing the bonding process much, because it is supposed to break apart in case of plastic deformation. The lubricating copper oxide layer has to be removed before micro welds can develop. Therefore, in this paper, experiments are carried out at low frequency to determine the friction energy needed to abrade the copper oxide layer of wire and substrate, which is indicated by an increase in the resulting friction coefficient. The friction energy per contact area to remove the interfering layers at low frequency is compared to the real bonding process working at 58 kHz. In addition, a theoretical concept is being described to get a grasp of the occurring mechanism. In the end a proposal is given how to set bonding parameters to get the cleanest surfaces with the installed bond tool."}],"status":"public","_id":"9943","project":[{"grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92"}],"department":[{"_id":"151"}],"user_id":"210","language":[{"iso":"eng"}]},{"quality_controlled":"1","year":"2015","citation":{"ama":"Meyer T, Unger A, Althoff S, et al. Modeling and simulation of the ultrasonic wire bonding process. In: <i>2015 17th Electronics Packaging Technology Conference</i>. ; 2015. doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">10.1109/EPTC.2015.7412377</a>","chicago":"Meyer, Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” In <i>2015 17th Electronics Packaging Technology Conference</i>, 2015. <a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">https://doi.org/10.1109/EPTC.2015.7412377</a>.","ieee":"T. Meyer <i>et al.</i>, “Modeling and simulation of the ultrasonic wire bonding process,” in <i>2015 17th Electronics Packaging Technology Conference</i>, 2015.","apa":"Meyer, T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., &#38; Guth, K. (2015). Modeling and simulation of the ultrasonic wire bonding process. In <i>2015 17th Electronics Packaging Technology Conference</i>. <a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">https://doi.org/10.1109/EPTC.2015.7412377</a>","bibtex":"@inproceedings{Meyer_Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2015, title={Modeling and simulation of the ultrasonic wire bonding process}, DOI={<a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">10.1109/EPTC.2015.7412377</a>}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Meyer, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2015} }","mla":"Meyer, Tobias, et al. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” <i>2015 17th Electronics Packaging Technology Conference</i>, 2015, doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">10.1109/EPTC.2015.7412377</a>.","short":"T. Meyer, A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: 2015 17th Electronics Packaging Technology Conference, 2015."},"date_updated":"2020-05-07T05:33:52Z","date_created":"2019-05-27T08:34:21Z","author":[{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"},{"full_name":"Guth, Karsten","last_name":"Guth","first_name":"Karsten"}],"title":"Modeling and simulation of the ultrasonic wire bonding process","doi":"10.1109/EPTC.2015.7412377","publication":"2015 17th Electronics Packaging Technology Conference","type":"conference","abstract":[{"text":"Ultrasonic wire bonding is an indispensable process in the manufacturing of semiconductor components. It is used for interconnecting the silicon die to e.g. connectors in the housing or to other semiconductors in complex components. In high power applications, such as wind turbines, locomotives or electric vehicles, the thermal and mechanical limits of interconnects made from aluminum are nearing. The limits could be overcome using copper wire bonds, but their manufacturing poses challenges due to the harder material, which leads to increased wear of the bond tools and to less reliable production. To overcome these drawbacks, adaptation of process parameters at runtime is employed. However, the range of parameter values for which a stable process can be maintained is very small, making it necessary to compute suitable parameters beforehand. To this end, and to gain insights into the process itself, the ultrasonic bonding process is modeled. The full model is composed of several partial models, some of which were introduced before. This paper focuses on the modularization of the full model and on the interaction of partial models. All partial models are presented, their interaction is shown and the general outline of the simulation process is given.","lang":"eng"}],"status":"public","_id":"9951","project":[{"grant_number":"02 PQ2210","_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"department":[{"_id":"151"}],"user_id":"210","language":[{"iso":"eng"}]},{"quality_controlled":"1","citation":{"apa":"Unger, A., Sextro, W., Meyer, T., Eichwald, P., Althoff, S., Eacock, F., &#38; Brökelmann, M. (2015). Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In <i>2015 17th Electronics Packaging Technology Conference</i>. <a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">https://doi.org/10.1109/EPTC.2015.7412375</a>","short":"A. Unger, W. Sextro, T. Meyer, P. Eichwald, S. Althoff, F. Eacock, M. Brökelmann, in: 2015 17th Electronics Packaging Technology Conference, 2015.","mla":"Unger, Andreas, et al. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” <i>2015 17th Electronics Packaging Technology Conference</i>, 2015, doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">10.1109/EPTC.2015.7412375</a>.","bibtex":"@inproceedings{Unger_Sextro_Meyer_Eichwald_Althoff_Eacock_Brökelmann_2015, title={Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear}, DOI={<a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">10.1109/EPTC.2015.7412375</a>}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Unger, Andreas and Sextro, Walter and Meyer, Tobias and Eichwald, Paul and Althoff, Simon and Eacock, Florian and Brökelmann, Michael}, year={2015} }","ama":"Unger A, Sextro W, Meyer T, et al. Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In: <i>2015 17th Electronics Packaging Technology Conference</i>. ; 2015. doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">10.1109/EPTC.2015.7412375</a>","ieee":"A. Unger <i>et al.</i>, “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear,” in <i>2015 17th Electronics Packaging Technology Conference</i>, 2015.","chicago":"Unger, Andreas, Walter Sextro, Tobias Meyer, Paul Eichwald, Simon Althoff, Florian Eacock, and Michael Brökelmann. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” In <i>2015 17th Electronics Packaging Technology Conference</i>, 2015. <a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">https://doi.org/10.1109/EPTC.2015.7412375</a>."},"year":"2015","date_created":"2019-05-27T08:43:55Z","author":[{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"full_name":"Sextro, Walter","id":"21220","last_name":"Sextro","first_name":"Walter"},{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"last_name":"Eichwald","full_name":"Eichwald, Paul","first_name":"Paul"},{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"first_name":"Florian","last_name":"Eacock","full_name":"Eacock, Florian"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"}],"date_updated":"2020-05-07T05:33:52Z","doi":"10.1109/EPTC.2015.7412375","title":"Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear","type":"conference","publication":"2015 17th Electronics Packaging Technology Conference","status":"public","abstract":[{"lang":"eng","text":"To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tool tip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard's wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage."}],"user_id":"210","department":[{"_id":"151"}],"project":[{"grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92"}],"_id":"9954","language":[{"iso":"eng"}]},{"year":"2014","citation":{"apa":"Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., &#38; Guth, K. (2014). Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In <i>Proceedings of the 47th International Symposium on Microelectronics</i> (pp. 856–861). <a href=\"https://doi.org/10.4071/isom-THP34\">https://doi.org/10.4071/isom-THP34</a>","bibtex":"@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding}, DOI={<a href=\"https://doi.org/10.4071/isom-THP34\">10.4071/isom-THP34</a>}, booktitle={Proceedings of the 47th International Symposium on Microelectronics}, author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861} }","mla":"Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 2014, pp. 856–61, doi:<a href=\"https://doi.org/10.4071/isom-THP34\">10.4071/isom-THP34</a>.","short":"P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.","chicago":"Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger, Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 856–61, 2014. <a href=\"https://doi.org/10.4071/isom-THP34\">https://doi.org/10.4071/isom-THP34</a>.","ieee":"P. Eichwald <i>et al.</i>, “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in <i>Proceedings of the 47th International Symposium on Microelectronics</i>, 2014, pp. 856–861.","ama":"Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In: <i>Proceedings of the 47th International Symposium on Microelectronics</i>. ; 2014:856-861. doi:<a href=\"https://doi.org/10.4071/isom-THP34\">10.4071/isom-THP34</a>"},"page":"856-861","title":"Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding","doi":"10.4071/isom-THP34","date_updated":"2020-05-07T05:33:45Z","author":[{"last_name":"Eichwald","full_name":"Eichwald, Paul","first_name":"Paul"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"},{"full_name":"Althof, Simon","last_name":"Althof","first_name":"Simon"},{"first_name":"Florian","last_name":"Eacock","full_name":"Eacock, Florian"},{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"last_name":"Meyer","full_name":"Meyer, Tobias","first_name":"Tobias"},{"first_name":"Karsten","full_name":"Guth, Karsten","last_name":"Guth"}],"date_created":"2019-05-20T12:18:55Z","abstract":[{"text":"Wire bonding is the most common technology for connecting electronic components. Due to their efficiency bond interconnections made of copper wire are used for example in the aerospace and medical technology as well as in the fields of renewable energies. One of the main cost factors in the manufacturing process is the consumables like bonding tools. The technological transition to copper as wire material causes significant wear on the millimeter large effective contact area of the bonding tool. This wear leads to a loss by a factor of 30 of the number of reliable interconnections which can be produced by a single tool. To reduce setting-up time in the production and minimizing costs, an enlarged bonding tool lifetime is desirable. Consequently a better understanding of wear and recognition of wear pattern is required. Therefore, the paper presents an analyzing method of the tool topography change of a heavy wire bonding tool by using a confocal microscope. Furthermore, the paper discusses the identification of the main wear indicators by the help of the named topography change for different bond parameters, like ultrasonic power and tool geometry. Reference topography has been carried out by choosing typical parameters of the production line. To judge whether the quality requirement of the bond connections made by a single tool cannot be fulfilled shear test of the source bond have been carried out after a defined number of produced bond connections. Main steps of analysis: (I)Topography of the tool surface is sampled after a defined number of bonds by means of a confocal microscope to detect the wear progress.(II)The recorded data is filtered using Matlab. So, measurement errors can be eliminated and the topography can be overlaid more easy to identify differences between diverse tools or differences in wear stages of the same tool.(III)The subsequent discretization of the topography into sub volumes allows to (IV)describe the loss of volume depending on the position in the groove. Thereby, intermediate status of wear of one tool can be used to obtain a persistent description of the topography change over the number of produced bonds by interpolating the confocal data. Afterwards the persistent change of the groove flank has been analyzed for the named test series to identify the main wear indicators and their effect on shear forces. All worn tools show dominant areas for volume loss especially for plastic deformation and accordingly abrasion. These wear mechanism can be referred to the change of main parts of the groove geometry like the rounding of the front and back radius. The most volume loss was identified in the upper part of the tool flanks or rather at the transition from the groove flank to the front or back radius. Furthermore the observation of the center of the groove flank shows just a little change in volume. All in all, the identification of the wear indicators will be discussed with the objective of increasing the tool lifetime by optimizing the tool geometry without losses in bond quality and reliability.","lang":"eng"}],"status":"public","type":"conference","publication":"Proceedings of the 47th International Symposium on Microelectronics","keyword":["wedge/wedge bonding","copper wire","tool wear"],"language":[{"iso":"eng"}],"project":[{"grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92"}],"_id":"9871","user_id":"210","department":[{"_id":"151"}]},{"date_updated":"2020-05-07T05:33:47Z","date_created":"2019-05-20T13:35:09Z","author":[{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"first_name":"Paul","full_name":"Eichwald, Paul","last_name":"Eichwald"},{"last_name":"Meyer","full_name":"Meyer, Tobias","first_name":"Tobias"},{"last_name":"Eacock","full_name":"Eacock, Florian","first_name":"Florian"},{"first_name":"Michael","full_name":"Brökelmann, Michael","last_name":"Brökelmann"}],"title":"Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds","place":"San Diego, CA, US","year":"2014","citation":{"ieee":"A. Unger <i>et al.</i>, “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 2014, pp. 289–294.","chicago":"Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 289–94. San Diego, CA, US, 2014.","ama":"Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>. San Diego, CA, US; 2014:289-294.","apa":"Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., &#38; Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i> (pp. 289–294). San Diego, CA, US.","mla":"Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 2014, pp. 289–94.","bibtex":"@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014, place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the 47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }","short":"A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294."},"page":"289-294","project":[{"_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210"}],"_id":"9895","user_id":"210","department":[{"_id":"151"}],"keyword":["pre-deformation","copper wire bonding","finite element model"],"language":[{"iso":"eng"}],"type":"conference","publication":"Proceedings of the 47th International Symposium on Microelectronics (IMAPS)","abstract":[{"lang":"eng","text":"Power semiconductor modules are used to control and switch high electrical currents and voltages. Within the power module package wire bonding is used as an interconnection technology. In recent years, aluminum wire has been used preferably, but an ever-growing market of powerful and efficient power modules requires a material with better mechanical and electrical properties. For this reason, a technology change from aluminum to copper is indispensable. However, the copper wire bonding process reacts more sensitive to parameter changes. This makes manufacturing reliable copper bond connections a challenging task. The aim of the BMBF funded project Itsowl-InCuB is the development of self-optimizing techniques to enable the reliable production of copper bond connections under varying conditions. A model of the process is essential to achieve this aim. This model needs to include the dynamic elasto-plastic deformation, the ultrasonic softening effect and the proceeding adhesion between wire and substrate. This paper focusses on the pre-deformation process. In the touchdown phase, the wire is pressed into the V-groove of the tool and a small initial contact area between wire and substrate arise. The local characteristics of the material change abruptly because of the cold forming. Consequently, the pre-deformation has a strong effect on the joining process. In [1], a pre-cleaning effect during the touchdown process of aluminum wires by cracking of oxide layers was presented. These interactions of the process parameters are still largely unknown for copper. In a first step, this paper validates the importance of modeling the pre-deformation by showing its impact on the wire deformation characteristic experimentally. Creating cross-section views of pre-deformed copper wires has shown a low deformation degree compared to aluminum. By using a digital microscope and a scanning confocal microscope an analysis about the contact areas and penetration depths after touchdown has been made. Additionally, it has to be taken into account that the dynamical touchdown force depends on the touchdown speed and the touchdown force set in the bonding machine. In order to measure the overshoot in the force signals, a strain gauge sensor has been used. Subsequently, the affecting factors have been interpreted independently Furthermore, the material properties of copper wire have been investigated with tensile tests and hardness measurements. In a second step, the paper presents finite element models of the touchdown process for source and destination bonds. These models take the measured overshoot in the touchdown forces into account. A multi-linear, isotropic material model has been selected to map the material properties of the copper. A validation of the model with the experimental determined contact areas, normal pressures and penetration depths reveals the high model quality. Thus, the simulation is able to calculate and visualize the three dimensional pre-deformation with an integrated material parameter of the wire if the touchdown parameters of the bonding machine are known. Based on the calculated deformation degrees of wire and substrate, it is probably possible to investigate the effect of the pre-deformation on the pre-cleaning phase in the copper wire bonding."}],"status":"public"},{"title":"Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding","date_updated":"2020-05-07T05:33:47Z","date_created":"2019-05-20T13:38:10Z","author":[{"first_name":"Andreas","last_name":"Unger","full_name":"Unger, Andreas"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"},{"first_name":"Simon","last_name":"Althoff","full_name":"Althoff, Simon"},{"last_name":"Meyer","full_name":"Meyer, Tobias","first_name":"Tobias"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"first_name":"Klaus","full_name":"Neumann, Klaus","last_name":"Neumann"},{"first_name":"René Felix","full_name":"Reimann, René Felix","last_name":"Reimann"},{"last_name":"Guth","full_name":"Guth, Karsten","first_name":"Karsten"},{"first_name":"Daniel","last_name":"Bolowski","full_name":"Bolowski, Daniel"}],"volume":141,"year":"2014","citation":{"apa":"Unger, A., Sextro, W., Althoff, S., Meyer, T., Brökelmann, M., Neumann, K., … Bolowski, D. (2014). Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding. In <i>Proceedings of 8th International Conference on Integrated Power Electronic Systems</i> (Vol. 141, pp. 175–180).","short":"A. Unger, W. Sextro, S. Althoff, T. Meyer, M. Brökelmann, K. Neumann, R.F. Reimann, K. Guth, D. Bolowski, in: Proceedings of 8th International Conference on Integrated Power Electronic Systems, 2014, pp. 175–180.","bibtex":"@inproceedings{Unger_Sextro_Althoff_Meyer_Brökelmann_Neumann_Reimann_Guth_Bolowski_2014, title={Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding}, volume={141}, booktitle={Proceedings of 8th International Conference on Integrated Power Electronic Systems}, author={Unger, Andreas and Sextro, Walter and Althoff, Simon and Meyer, Tobias and Brökelmann, Michael and Neumann, Klaus and Reimann, René Felix and Guth, Karsten and Bolowski, Daniel}, year={2014}, pages={175–180} }","mla":"Unger, Andreas, et al. “Data-Driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding.” <i>Proceedings of 8th International Conference on Integrated Power Electronic Systems</i>, vol. 141, 2014, pp. 175–80.","ama":"Unger A, Sextro W, Althoff S, et al. Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding. In: <i>Proceedings of 8th International Conference on Integrated Power Electronic Systems</i>. Vol 141. ; 2014:175-180.","chicago":"Unger, Andreas, Walter Sextro, Simon Althoff, Tobias Meyer, Michael Brökelmann, Klaus Neumann, René Felix Reimann, Karsten Guth, and Daniel Bolowski. “Data-Driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding.” In <i>Proceedings of 8th International Conference on Integrated Power Electronic Systems</i>, 141:175–80, 2014.","ieee":"A. Unger <i>et al.</i>, “Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding,” in <i>Proceedings of 8th International Conference on Integrated Power Electronic Systems</i>, 2014, vol. 141, pp. 175–180."},"page":"175-180","intvolume":"       141","language":[{"iso":"eng"}],"project":[{"_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210"}],"_id":"9896","user_id":"210","department":[{"_id":"151"}],"abstract":[{"lang":"eng","text":"In power electronics, ultrasonic wire bonding is used to connect the electrical terminals of power modules. To implement a self-optimization technique for ultrasonic wire bonding machines, a model of the process is essential. This model needs to include the so called ultrasonic softening effect. It is a key effect within the wire bonding process primarily enabling the robust interconnection between the wire and a substrate. However, the physical modeling of the ultrasonic softening effect is notoriously difficult because of its highly non-linear character and the absence of a proper measurement method. In a first step, this paper validates the importance of modeling the ultrasonic softening by showing its impact on the wire deformation characteristic experimentally. In a second step, the paper presents a data-driven model of the ultrasonic softening effect which is constructed from data using machine learning techniques. A typical caveat of data-driven modeling is the need for training data that cover the considered domain of process parameters in order to achieve accurate generalization of the trained model to new process configurations. In practice, however, the space of process parameters can only be sampled sparsely. In this paper, a novel technique is applied which enables the integration of prior knowledge about the process into the datadriven modeling process. It turns out that this approach results in accurate generalization of the data-driven model to unseen process parameters from sparse data."}],"status":"public","type":"conference","publication":"Proceedings of 8th International Conference on Integrated Power Electronic Systems"},{"user_id":"210","department":[{"_id":"151"}],"project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"_id":"9799","language":[{"iso":"eng"}],"type":"conference","publication":"15th Electronics Packaging Technology Conference","status":"public","abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is a common technology for manufacturing electrical interconnects. In the field of power electronics, new thermal and electrical obligations arose due to increasing power density requirements. One approach to achieve these aims is replacing the wire material for heavy wire bonds from aluminum to copper. This material change leads to challenging tasks and problems, for instance the occurring wear of the bond tool. The wear is significantly higher using copper wire instead of aluminum and results in a dramatic loss in the amount of interconnects which can be produced reliable by a single tool. To reduce setting-up time in the production and minimizing costs, an enlarged bonding tool lifetime is desirable. Therefore, the paper discusses the influences of bonding parameters on the wear. The key question is which of the tasks cannot be fulfilled with increased wear of the tool, e.g. loss of process capability. The main functions are fixing the wire in the tool groove, predeformation, applying normal force and transmission of ultrasonic oscillation to the wire. To identify the most affecting factors, four bonding parameters are varied and their influences are investigated. These parameters are: (I) ultrasonic power, (II) tool geometry, (III) the way of tangential force transmission and (IV) loop trajectory."}],"author":[{"first_name":"Paul","last_name":"Eichwald","full_name":"Eichwald, Paul"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"},{"first_name":"Simon","full_name":"Althoff, Simon","last_name":"Althoff"},{"last_name":"Eacock","full_name":"Eacock, Florian","first_name":"Florian"},{"first_name":"Mark","full_name":"Schnietz, Mark","last_name":"Schnietz"},{"first_name":"Karsten","last_name":"Guth","full_name":"Guth, Karsten"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"}],"date_created":"2019-05-13T13:57:49Z","date_updated":"2022-01-06T07:04:20Z","doi":"10.1109/EPTC.2013.6745803","title":"Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding","citation":{"ama":"Eichwald P, Sextro W, Althoff S, et al. Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding. In: <i>15th Electronics Packaging Technology Conference</i>. ; 2013. doi:<a href=\"https://doi.org/10.1109/EPTC.2013.6745803\">10.1109/EPTC.2013.6745803</a>","chicago":"Eichwald, Paul, Walter Sextro, Simon Althoff, Florian Eacock, Mark Schnietz, Karsten Guth, and Michael Brökelmann. “Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding.” In <i>15th Electronics Packaging Technology Conference</i>, 2013. <a href=\"https://doi.org/10.1109/EPTC.2013.6745803\">https://doi.org/10.1109/EPTC.2013.6745803</a>.","ieee":"P. Eichwald <i>et al.</i>, “Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding,” in <i>15th Electronics Packaging Technology Conference</i>, 2013.","mla":"Eichwald, Paul, et al. “Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding.” <i>15th Electronics Packaging Technology Conference</i>, 2013, doi:<a href=\"https://doi.org/10.1109/EPTC.2013.6745803\">10.1109/EPTC.2013.6745803</a>.","short":"P. Eichwald, W. Sextro, S. Althoff, F. Eacock, M. Schnietz, K. Guth, M. Brökelmann, in: 15th Electronics Packaging Technology Conference, 2013.","bibtex":"@inproceedings{Eichwald_Sextro_Althoff_Eacock_Schnietz_Guth_Brökelmann_2013, title={Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding}, DOI={<a href=\"https://doi.org/10.1109/EPTC.2013.6745803\">10.1109/EPTC.2013.6745803</a>}, booktitle={15th Electronics Packaging Technology Conference}, author={Eichwald, Paul and Sextro, Walter and Althoff, Simon and Eacock, Florian and Schnietz, Mark and Guth, Karsten and Brökelmann, Michael}, year={2013} }","apa":"Eichwald, P., Sextro, W., Althoff, S., Eacock, F., Schnietz, M., Guth, K., &#38; Brökelmann, M. (2013). Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding. In <i>15th Electronics Packaging Technology Conference</i>. <a href=\"https://doi.org/10.1109/EPTC.2013.6745803\">https://doi.org/10.1109/EPTC.2013.6745803</a>"},"year":"2013"}]