---
_id: '9999'
abstract:
- lang: eng
text: Ultrasonic wire bonding is an indispensable process in the industrial manufacturing
of semiconductor devices. Copper wire is increasingly replacing the well-established
aluminium wire because of its superior electrical, thermal and mechanical properties.
Copper wire processes differ significantly from aluminium processes and are more
sensitive to disturbances, which reduces the range of parameter values suitable
for a stable process. Disturbances can be compensated by an adaption of process
parameters, but finding suitable parameters manually is difficult and time-consuming.
This paper presents a physical model of the ultrasonic wire bonding process including
the friction contact between tool and wire. This model yields novel insights into
the process. A prototype of a multi-objective optimizing bonding machine (MOBM)
is presented. It uses multi-objective optimization, based on the complete process
model, to automatically select the best operating point as a compromise of concurrent
objectives.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production
of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and
Challenges. In: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:10.4071/2380-4505-2018.1.000572'
apa: Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., & Sextro, W. (2018).
Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges. In In Proceedings of IMAPS 2018 – 51st Symposium
on Microelectronics, Pasadena, CA, 2018 (Vol. Vol. 2018, No. 1, pp. 000572-000577.).
https://doi.org/10.4071/2380-4505-2018.1.000572
bibtex: '@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={10.4071/2380-4505-2018.1.000572},
booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias
and Brökelmann, Michael and Sextro, Walter}, year={2018} }'
chicago: Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and
Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization
– Insights, Opportunities and Challenges.” In In Proceedings of IMAPS 2018
– 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018. https://doi.org/10.4071/2380-4505-2018.1.000572.
ieee: A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
mla: Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective
Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS
2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.
short: 'A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings
of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.'
date_created: 2019-05-27T10:27:45Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
doi: 10.4071/2380-4505-2018.1.000572
keyword:
- wire bonding
- multi-objective optimization
- process model
- copper wire
- self-optimization
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena,
CA, 2018
quality_controlled: '1'
status: public
title: Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges
type: conference
user_id: '210'
volume: Vol. 2018, No. 1, pp. 000572-000577.
year: '2018'
...
---
_id: '9955'
abstract:
- lang: eng
text: Wire bonding has been an established packaging technology for decades. When
introducing copper as wire material for high power applications, adaptations to
the bonding process and to machines became necessary. Here, challenges occur due
to the stiffer wire material and changing oxide layers on the contact partners.
To achieve sufficient process stability, a clean bond area is required, which
can only be achieved with high shear stresses in the contact partners surfaces.
These necessitate high normal forces to plastically deform the wire and substrate.
To achieve such high stresses in the contact area, the bonding tool needs to be
able to transmit the needed tangential forces to the top side of the wire. The
wire itself performs a shear movement and transmits the force into the contact
area to clean the contaminant and oxide layers and to level the desired bond surfaces.
The main function of the tool is to transmit these forces. If the bond tool can
only transmit low forces in the direction of excitation, the parameter space for
a stable bond process is severely restricted. Here, a modeling approach to estimate
how well different tool shapes meet the demand of transmitting high tangential
forces is presented. The model depends on wire deformation and thus on the ultrasonic
softening effect.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
citation:
ama: 'Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable
Tangential Force of Wire Bond Tools. In: IEEE 66th Electronic Components and
Technology Conference. ; 2016:2103-2110. doi:10.1109/ECTC.2016.234'
apa: Althoff, S., Meyer, T., Unger, A., Sextro, W., & Eacock, F. (2016). Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools. In IEEE 66th Electronic
Components and Technology Conference (pp. 2103–2110). https://doi.org/10.1109/ECTC.2016.234
bibtex: '@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools}, DOI={10.1109/ECTC.2016.234},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff,
Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian},
year={2016}, pages={2103–2110} }'
chicago: Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian
Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In
IEEE 66th Electronic Components and Technology Conference, 2103–10, 2016.
https://doi.org/10.1109/ECTC.2016.234.
ieee: S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools,” in IEEE 66th Electronic
Components and Technology Conference, 2016, pp. 2103–2110.
mla: Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire
Bond Tools.” IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2103–10, doi:10.1109/ECTC.2016.234.
short: 'S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic
Components and Technology Conference, 2016, pp. 2103–2110.'
date_created: 2019-05-27T08:47:52Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.234
keyword:
- finite element simulation
- wire bonding
- tool geometry
language:
- iso: eng
page: 2103-2110
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9957'
abstract:
- lang: eng
text: Leistungshalbleitermodule werden leistungsfähiger, effizienter, kompakter
und haltbarer Ziel dieses Innovationsprojekts des Spitzenclusters „it’s OWL –
Intelligente Technische Systeme OstWestfalen-Lippe“ ist die Entwicklung von selbstoptimierenden
Verfahren, um unter variablen Produktionsbedingungen zuverlässige Kupferbondverbindungen
herstellen zu können. Die Ultraschall-Drahtbondmaschine erhält die Fähigkeit,
sich automatisch an veränderte Bedingungen anzupassen. Hierzu wird der gesamte
Prozess der Ultraschall-Verbindungsbildung modelliert und neueste Verfahren der
Selbstoptimierung angewandt. Die Evaluierung erfolgt anhand eines Prototypen in
Form einer modifizierten Bondmaschine. Intelligent production of heavy copper
wire bonds It is the aim of this innovation-project to develop a self-optimization
system for ultrasonic copper wire bonding. It is part of the leading edge cluster
“it’s OWL”. The bonding machine will be able to react autonomously to changing
boundary conditions to ensure constant and reliable bonding results. For this,
the hole bonding process is modeled in great detail and newest self-optimization
techniques are utilized. A prototype-system incorporated in a serial machine is
used for evaluation.
author:
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Florian
full_name: Biermann, Florian
last_name: Biermann
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: Brökelmann M, Unger A, Meyer T, et al. Kupferbondverbindungen intelligent herstellen.
wt-online. 2016;7/8:512-519.
apa: Brökelmann, M., Unger, A., Meyer, T., Althoff, S., Sextro, W., Hunstig, M.,
… Guth, K. (2016). Kupferbondverbindungen intelligent herstellen. Wt-Online,
7/8, 512–519.
bibtex: '@article{Brökelmann_Unger_Meyer_Althoff_Sextro_Hunstig_Biermann_Guth_2016,
title={Kupferbondverbindungen intelligent herstellen}, volume={7/8}, journal={wt-online},
author={Brökelmann, Michael and Unger, Andreas and Meyer, Tobias and Althoff,
Simon and Sextro, Walter and Hunstig, Matthias and Biermann, Florian and Guth,
Karsten}, year={2016}, pages={512–519} }'
chicago: 'Brökelmann, Michael, Andreas Unger, Tobias Meyer, Simon Althoff, Walter
Sextro, Matthias Hunstig, Florian Biermann, and Karsten Guth. “Kupferbondverbindungen
Intelligent Herstellen.” Wt-Online 7/8 (2016): 512–19.'
ieee: M. Brökelmann et al., “Kupferbondverbindungen intelligent herstellen,”
wt-online, vol. 7/8, pp. 512–519, 2016.
mla: Brökelmann, Michael, et al. “Kupferbondverbindungen Intelligent Herstellen.”
Wt-Online, vol. 7/8, 2016, pp. 512–19.
short: M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F.
Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.
date_created: 2019-05-27T08:53:18Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
language:
- iso: eng
page: 512-519
popular_science: '1'
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: wt-online
status: public
title: Kupferbondverbindungen intelligent herstellen
type: journal_article
user_id: '210'
volume: 7/8
year: '2016'
...
---
_id: '9960'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a common technology for connecting electrodes of
electronic components like power modules. Nowadays, bond connections are often
made of copper instead of aluminum due to its thermal and mechanical assets. One
of the main cost factors in the wire bonding process is the acquisition cost of
consumables such as bonding tools. For copper wire bonding tool lifetime is much
lower than for aluminium bonding. This paper presents a micro wear model for wedge/wedge
bonding tools that was validated by observing wear patterns with a scanning electron
microscope. The wear coefficient is determined in long-term bonding tests. The
application of Fleischer´s wear approach incorporating frictional power to a finite
element simulation of the bonding processes is used to shift element nodes depending
on the rising frictional power for finite element modeling. The presented simulation
method can be used to take tool wear into consideration for creating tools with
increased lifetime. This enables the production of reliable bond connections using
heavy as well as thin wire of any material. The paper discusses the predominant
influences of wear on the main tool functions and their changes over tool life.
Furthermore, the influence of the tool groove angle on the tool wear was investigated.
One of the main results is that the wear is largest during the last phase of each
bonding process, when the contact area between tool and wire is largest.
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
citation:
ama: 'Eichwald P, Unger A, Eacock F, et al. Micro Wear Modeling in Copper Wire Wedge
Bonding. In: IEEE CPMT Symposium Japan, 2016. ; 2016.'
apa: Eichwald, P., Unger, A., Eacock, F., Althoff, S., Sextro, W., Guth, K., &
Brökelmann, M. (2016). Micro Wear Modeling in Copper Wire Wedge Bonding. In IEEE
CPMT Symposium Japan, 2016.
bibtex: '@inproceedings{Eichwald_Unger_Eacock_Althoff_Sextro_Guth_Brökelmann_2016,
title={Micro Wear Modeling in Copper Wire Wedge Bonding}, booktitle={IEEE CPMT
Symposium Japan, 2016}, author={Eichwald, Paul and Unger, Andreas and Eacock,
Florian and Althoff, Simon and Sextro, Walter and Guth, Karsten and Brökelmann,
Michael}, year={2016} }'
chicago: Eichwald, Paul, Andreas Unger, Florian Eacock, Simon Althoff, Walter Sextro,
Karsten Guth, and Michael Brökelmann. “Micro Wear Modeling in Copper Wire Wedge
Bonding.” In IEEE CPMT Symposium Japan, 2016, 2016.
ieee: P. Eichwald et al., “Micro Wear Modeling in Copper Wire Wedge Bonding,”
in IEEE CPMT Symposium Japan, 2016, 2016.
mla: Eichwald, Paul, et al. “Micro Wear Modeling in Copper Wire Wedge Bonding.”
IEEE CPMT Symposium Japan, 2016, 2016.
short: 'P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann,
in: IEEE CPMT Symposium Japan, 2016, 2016.'
date_created: 2019-05-27T09:07:19Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE CPMT Symposium Japan, 2016
quality_controlled: '1'
status: public
title: Micro Wear Modeling in Copper Wire Wedge Bonding
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9966'
abstract:
- lang: eng
text: Usage of copper wire bonds allows to push power boundaries imposed by aluminum
wire bonds. Copper allows higher electrical, thermal and mechanical loads than
aluminum, which currently is the most commonly used material in heavy wire bonding.
This is the main driving factor for increased usage of copper in high power applications
such as wind turbines, locomotives or electric vehicles. At the same time, usage
of copper also increases tool wear and reduces the range of parameter values for
a stable process, making the process more challenging. To overcome these drawbacks,
parameter adaptation at runtime using self-optimization is desired. A self-optimizing
system is based on system objectives that evaluate and quantify system performance.
System parameters can be changed at runtime such that pre-selected objective values
are reached. For adaptation of bond process parameters, model-based self-optimization
is employed. Since it is based on a model of the system, the bond process was
modeled. In addition to static model parameters such as wire and substrate material
properties and vibration characteristics of transducer and tool, variable model
inputs are process parameters. Main simulation result is bonded area in the wiresubstrate
contact. This model is then used to find valid and optimal working points before
operation. The working point is composed of normal force and ultrasonic voltage
trajectories, which are usually determined experimentally. Instead, multiobjective
optimalization is used to compute trajectories that simultaneously optimize bond
quality, process duration, tool wear and probability of tool-substrate contacts.
The values of these objectives are computed using the process model. At runtime,
selection among pre-determined optimal working points is sufficient to prioritize
individual objectives. This way, the computationally expensive process of numerically
solving a multiobjective optimal control problem and the demanding high speed
bonding process are separated. To evaluate to what extent the pre-defined goals
of self-optimization are met, an offthe- shelf heavy wire bonding machine was
modified to allow for parameter adaptation and for transmitting of measurement
data at runtime. This data is received by an external computer system and evaluated
to select a new working point. Then, new process parameters are sent to the modified
bonding machine for use for subsequent bonds. With these components, a full self-optimizing
system has been implemented.
author:
- first_name: Tobias
full_name: Meyer , Tobias
last_name: 'Meyer '
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Meyer T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper
Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components
and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215'
apa: Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M.,
& Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation. In IEEE 66th Electronic Components and Technology
Conference (pp. 622–628). https://doi.org/10.1109/ECTC.2016.215
bibtex: '@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter
Adaptation}, DOI={10.1109/ECTC.2016.215},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer
, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann,
Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628}
}'
chicago: Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann,
Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire
Bonds Using Online Parameter Adaptation.” In IEEE 66th Electronic Components
and Technology Conference, 622–28, 2016. https://doi.org/10.1109/ECTC.2016.215.
ieee: T. Meyer et al., “Reliable Manufacturing of Heavy Copper Wire Bonds
Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and
Technology Conference, 2016, pp. 622–628.
mla: Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology
Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.
short: 'T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K.
Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp.
622–628.'
date_created: 2019-05-27T09:17:26Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.215
keyword:
- Self-optimization
- adaptive system
- bond process
- copper wire
language:
- iso: eng
page: 622-628
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9968'
abstract:
- lang: eng
text: To increase quality and reliability of copper wire bonds, self-optimization
is a promising technique. For the implementation of self-optimization for ultrasonic
heavy copper wire bonding machines, a model of stick-slip motion between tool
and wire and between wire and substrate during the bonding process is essential.
Investigations confirm that both of these contacts do indeed show stick-slip movement
in each period oscillation. In a first step, this paper shows the importance of
modeling the stick-slip effect by determining, monitoring and analyzing amplitudes
and phase angles of tooltip, wire and substrate experimentally during bonding
via laser measurements. In a second step, the paper presents a dynamic model which
has been parameterized using an iterative numerical parameter identification method.
This model includes Archard’s wear approach in order to compute the lost volume
of tool tip due to wear over the entire process time. A validation of the model
by comparing measured and calculated amplitudes of tool tip and wire reveals high
model quality. Then it is then possible to calculate the lifetime of the tool
for different process parameters, i.e. values of normal force and ultrasonic voltage.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic
Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE
CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.'
apa: Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S.,
… Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process.
In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016
(pp. 251–254). IEEE CPMT Symposium Japan.
bibtex: '@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic
Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding.
IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard
and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and
Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten},
year={2016}, pages={251–254} }'
chicago: Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald,
Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten
Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear
Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54.
IEEE CPMT Symposium Japan, 2016.
ieee: A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding
Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium
Japan, 2016, 2016, pp. 251–254.
mla: Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding
Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016, 2016, pp. 251–54.
short: 'A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W.
Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge
Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp.
251–254.'
date_created: 2019-05-27T09:20:10Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
keyword:
- the Ultrasonic Wire Bonding Process
language:
- iso: eng
page: 251-254
place: IEEE CPMT Symposium Japan
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016
quality_controlled: '1'
status: public
title: Validated Simulation of the Ultrasonic Wire Bonding Process
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9943'
abstract:
- lang: eng
text: Changing manufacturing technologies or material in well-known processes has
to be followed by an adaption of process parameters. In case of the transition
from aluminum wire to copper wire in heavy wire bonding, the adaption effort is
high due to the strongly different mechanical properties of the wire. One of these
adaption aspects, apart from wire material, is the existent oxide layers on wire
and substrate. The ductile aluminum oxide is not influencing the bonding process
much, because it is supposed to break apart in case of plastic deformation. The
lubricating copper oxide layer has to be removed before micro welds can develop.
Therefore, in this paper, experiments are carried out at low frequency to determine
the friction energy needed to abrade the copper oxide layer of wire and substrate,
which is indicated by an increase in the resulting friction coefficient. The friction
energy per contact area to remove the interfering layers at low frequency is compared
to the real bonding process working at 58 kHz. In addition, a theoretical concept
is being described to get a grasp of the occurring mechanism. In the end a proposal
is given how to set bonding parameters to get the cleanest surfaces with the installed
bond tool.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
citation:
ama: 'Althoff S, Unger A, Sextro W, Eacock F. Improving the cleaning process in
copper wire bonding by adapting bonding parameters. In: 2015 17th Electronics
Packaging Technology Conference. ; 2015:1-6. doi:10.1109/EPTC.2015.7412402'
apa: Althoff, S., Unger, A., Sextro, W., & Eacock, F. (2015). Improving the
cleaning process in copper wire bonding by adapting bonding parameters. In 2015
17th Electronics Packaging Technology Conference (pp. 1–6). https://doi.org/10.1109/EPTC.2015.7412402
bibtex: '@inproceedings{Althoff_Unger_Sextro_Eacock_2015, title={Improving the cleaning
process in copper wire bonding by adapting bonding parameters}, DOI={10.1109/EPTC.2015.7412402},
booktitle={2015 17th Electronics Packaging Technology Conference}, author={Althoff,
Simon and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2015},
pages={1–6} }'
chicago: Althoff, Simon, Andreas Unger, Walter Sextro, and Florian Eacock. “Improving
the Cleaning Process in Copper Wire Bonding by Adapting Bonding Parameters.” In
2015 17th Electronics Packaging Technology Conference, 1–6, 2015. https://doi.org/10.1109/EPTC.2015.7412402.
ieee: S. Althoff, A. Unger, W. Sextro, and F. Eacock, “Improving the cleaning process
in copper wire bonding by adapting bonding parameters,” in 2015 17th Electronics
Packaging Technology Conference, 2015, pp. 1–6.
mla: Althoff, Simon, et al. “Improving the Cleaning Process in Copper Wire Bonding
by Adapting Bonding Parameters.” 2015 17th Electronics Packaging Technology
Conference, 2015, pp. 1–6, doi:10.1109/EPTC.2015.7412402.
short: 'S. Althoff, A. Unger, W. Sextro, F. Eacock, in: 2015 17th Electronics Packaging
Technology Conference, 2015, pp. 1–6.'
date_created: 2019-05-27T08:10:43Z
date_updated: 2020-05-07T05:33:51Z
department:
- _id: '151'
doi: 10.1109/EPTC.2015.7412402
language:
- iso: eng
page: 1-6
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: 2015 17th Electronics Packaging Technology Conference
quality_controlled: '1'
status: public
title: Improving the cleaning process in copper wire bonding by adapting bonding parameters
type: conference
user_id: '210'
year: '2015'
...
---
_id: '9951'
abstract:
- lang: eng
text: Ultrasonic wire bonding is an indispensable process in the manufacturing of
semiconductor components. It is used for interconnecting the silicon die to e.g.
connectors in the housing or to other semiconductors in complex components. In
high power applications, such as wind turbines, locomotives or electric vehicles,
the thermal and mechanical limits of interconnects made from aluminum are nearing.
The limits could be overcome using copper wire bonds, but their manufacturing
poses challenges due to the harder material, which leads to increased wear of
the bond tools and to less reliable production. To overcome these drawbacks, adaptation
of process parameters at runtime is employed. However, the range of parameter
values for which a stable process can be maintained is very small, making it necessary
to compute suitable parameters beforehand. To this end, and to gain insights into
the process itself, the ultrasonic bonding process is modeled. The full model
is composed of several partial models, some of which were introduced before. This
paper focuses on the modularization of the full model and on the interaction of
partial models. All partial models are presented, their interaction is shown and
the general outline of the simulation process is given.
author:
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Meyer T, Unger A, Althoff S, et al. Modeling and simulation of the ultrasonic
wire bonding process. In: 2015 17th Electronics Packaging Technology Conference.
; 2015. doi:10.1109/EPTC.2015.7412377'
apa: Meyer, T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M.,
& Guth, K. (2015). Modeling and simulation of the ultrasonic wire bonding
process. In 2015 17th Electronics Packaging Technology Conference. https://doi.org/10.1109/EPTC.2015.7412377
bibtex: '@inproceedings{Meyer_Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2015,
title={Modeling and simulation of the ultrasonic wire bonding process}, DOI={10.1109/EPTC.2015.7412377},
booktitle={2015 17th Electronics Packaging Technology Conference}, author={Meyer,
Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann,
Michael and Hunstig, Matthias and Guth, Karsten}, year={2015} }'
chicago: Meyer, Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann,
Matthias Hunstig, and Karsten Guth. “Modeling and Simulation of the Ultrasonic
Wire Bonding Process.” In 2015 17th Electronics Packaging Technology Conference,
2015. https://doi.org/10.1109/EPTC.2015.7412377.
ieee: T. Meyer et al., “Modeling and simulation of the ultrasonic wire bonding
process,” in 2015 17th Electronics Packaging Technology Conference, 2015.
mla: Meyer, Tobias, et al. “Modeling and Simulation of the Ultrasonic Wire Bonding
Process.” 2015 17th Electronics Packaging Technology Conference, 2015,
doi:10.1109/EPTC.2015.7412377.
short: 'T. Meyer, A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K.
Guth, in: 2015 17th Electronics Packaging Technology Conference, 2015.'
date_created: 2019-05-27T08:34:21Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
doi: 10.1109/EPTC.2015.7412377
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: 2015 17th Electronics Packaging Technology Conference
quality_controlled: '1'
status: public
title: Modeling and simulation of the ultrasonic wire bonding process
type: conference
user_id: '210'
year: '2015'
...
---
_id: '9954'
abstract:
- lang: eng
text: To increase quality and reliability of copper wire bonds, self-optimization
is a promising technique. For the implementation of self-optimization for ultrasonic
heavy copper wire bonding machines, a model of stick-slip motion between tool
and wire and between wire and substrate during the bonding process is essential.
Investigations confirm that both of these contacts do indeed show stick-slip movement
in each period oscillation. In a first step, this paper shows the importance of
modeling the stick-slip effect by determining, monitoring and analyzing amplitudes
and phase angles of tool tip, wire and substrate experimentally during bonding
via laser measurements. In a second step, the paper presents a dynamic model which
has been parameterized using an iterative numerical parameter identification method.
This model includes Archard's wear approach in order to compute the lost volume
of tool tip due to wear over the entire process time. A validation of the model
by comparing measured and calculated amplitudes of tool tip and wire reveals high
model quality. Then it is then possible to calculate the lifetime of the tool
for different process parameters, i.e. values of normal force and ultrasonic voltage.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
citation:
ama: 'Unger A, Sextro W, Meyer T, et al. Modeling of the Stick-Slip Effect in Heavy
Copper Wire Bonding to Determine and Reduce Tool Wear. In: 2015 17th Electronics
Packaging Technology Conference. ; 2015. doi:10.1109/EPTC.2015.7412375'
apa: Unger, A., Sextro, W., Meyer, T., Eichwald, P., Althoff, S., Eacock, F., &
Brökelmann, M. (2015). Modeling of the Stick-Slip Effect in Heavy Copper Wire
Bonding to Determine and Reduce Tool Wear. In 2015 17th Electronics Packaging
Technology Conference. https://doi.org/10.1109/EPTC.2015.7412375
bibtex: '@inproceedings{Unger_Sextro_Meyer_Eichwald_Althoff_Eacock_Brökelmann_2015,
title={Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine
and Reduce Tool Wear}, DOI={10.1109/EPTC.2015.7412375},
booktitle={2015 17th Electronics Packaging Technology Conference}, author={Unger,
Andreas and Sextro, Walter and Meyer, Tobias and Eichwald, Paul and Althoff, Simon
and Eacock, Florian and Brökelmann, Michael}, year={2015} }'
chicago: Unger, Andreas, Walter Sextro, Tobias Meyer, Paul Eichwald, Simon Althoff,
Florian Eacock, and Michael Brökelmann. “Modeling of the Stick-Slip Effect in
Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” In 2015 17th
Electronics Packaging Technology Conference, 2015. https://doi.org/10.1109/EPTC.2015.7412375.
ieee: A. Unger et al., “Modeling of the Stick-Slip Effect in Heavy Copper
Wire Bonding to Determine and Reduce Tool Wear,” in 2015 17th Electronics Packaging
Technology Conference, 2015.
mla: Unger, Andreas, et al. “Modeling of the Stick-Slip Effect in Heavy Copper Wire
Bonding to Determine and Reduce Tool Wear.” 2015 17th Electronics Packaging
Technology Conference, 2015, doi:10.1109/EPTC.2015.7412375.
short: 'A. Unger, W. Sextro, T. Meyer, P. Eichwald, S. Althoff, F. Eacock, M. Brökelmann,
in: 2015 17th Electronics Packaging Technology Conference, 2015.'
date_created: 2019-05-27T08:43:55Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
doi: 10.1109/EPTC.2015.7412375
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: 2015 17th Electronics Packaging Technology Conference
quality_controlled: '1'
status: public
title: Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine
and Reduce Tool Wear
type: conference
user_id: '210'
year: '2015'
...
---
_id: '9871'
abstract:
- lang: eng
text: 'Wire bonding is the most common technology for connecting electronic components.
Due to their efficiency bond interconnections made of copper wire are used for
example in the aerospace and medical technology as well as in the fields of renewable
energies. One of the main cost factors in the manufacturing process is the consumables
like bonding tools. The technological transition to copper as wire material causes
significant wear on the millimeter large effective contact area of the bonding
tool. This wear leads to a loss by a factor of 30 of the number of reliable interconnections
which can be produced by a single tool. To reduce setting-up time in the production
and minimizing costs, an enlarged bonding tool lifetime is desirable. Consequently
a better understanding of wear and recognition of wear pattern is required. Therefore,
the paper presents an analyzing method of the tool topography change of a heavy
wire bonding tool by using a confocal microscope. Furthermore, the paper discusses
the identification of the main wear indicators by the help of the named topography
change for different bond parameters, like ultrasonic power and tool geometry.
Reference topography has been carried out by choosing typical parameters of the
production line. To judge whether the quality requirement of the bond connections
made by a single tool cannot be fulfilled shear test of the source bond have been
carried out after a defined number of produced bond connections. Main steps of
analysis: (I)Topography of the tool surface is sampled after a defined number
of bonds by means of a confocal microscope to detect the wear progress.(II)The
recorded data is filtered using Matlab. So, measurement errors can be eliminated
and the topography can be overlaid more easy to identify differences between diverse
tools or differences in wear stages of the same tool.(III)The subsequent discretization
of the topography into sub volumes allows to (IV)describe the loss of volume depending
on the position in the groove. Thereby, intermediate status of wear of one tool
can be used to obtain a persistent description of the topography change over the
number of produced bonds by interpolating the confocal data. Afterwards the persistent
change of the groove flank has been analyzed for the named test series to identify
the main wear indicators and their effect on shear forces. All worn tools show
dominant areas for volume loss especially for plastic deformation and accordingly
abrasion. These wear mechanism can be referred to the change of main parts of
the groove geometry like the rounding of the front and back radius. The most volume
loss was identified in the upper part of the tool flanks or rather at the transition
from the groove flank to the front or back radius. Furthermore the observation
of the center of the groove flank shows just a little change in volume. All in
all, the identification of the wear indicators will be discussed with the objective
of increasing the tool lifetime by optimizing the tool geometry without losses
in bond quality and reliability.'
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Simon
full_name: Althof, Simon
last_name: Althof
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography
Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.
In: Proceedings of the 47th International Symposium on Microelectronics.
; 2014:856-861. doi:10.4071/isom-THP34'
apa: Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., &
Guth, K. (2014). Analysis Method of Tool Topography Change and Identification
of Wear Indicators for Heavy Copper Wire Wedge Bonding. In Proceedings of the
47th International Symposium on Microelectronics (pp. 856–861). https://doi.org/10.4071/isom-THP34
bibtex: '@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis
Method of Tool Topography Change and Identification of Wear Indicators for Heavy
Copper Wire Wedge Bonding}, DOI={10.4071/isom-THP34},
booktitle={Proceedings of the 47th International Symposium on Microelectronics},
author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian
and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861}
}'
chicago: Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger,
Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and
Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In Proceedings
of the 47th International Symposium on Microelectronics, 856–61, 2014. https://doi.org/10.4071/isom-THP34.
ieee: P. Eichwald et al., “Analysis Method of Tool Topography Change and
Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in Proceedings
of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
mla: Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification
of Wear Indicators for Heavy Copper Wire Wedge Bonding.” Proceedings of the
47th International Symposium on Microelectronics, 2014, pp. 856–61, doi:10.4071/isom-THP34.
short: 'P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth,
in: Proceedings of the 47th International Symposium on Microelectronics, 2014,
pp. 856–861.'
date_created: 2019-05-20T12:18:55Z
date_updated: 2020-05-07T05:33:45Z
department:
- _id: '151'
doi: 10.4071/isom-THP34
keyword:
- wedge/wedge bonding
- copper wire
- tool wear
language:
- iso: eng
page: 856-861
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of the 47th International Symposium on Microelectronics
status: public
title: Analysis Method of Tool Topography Change and Identification of Wear Indicators
for Heavy Copper Wire Wedge Bonding
type: conference
user_id: '210'
year: '2014'
...
---
_id: '9895'
abstract:
- lang: eng
text: Power semiconductor modules are used to control and switch high electrical
currents and voltages. Within the power module package wire bonding is used as
an interconnection technology. In recent years, aluminum wire has been used preferably,
but an ever-growing market of powerful and efficient power modules requires a
material with better mechanical and electrical properties. For this reason, a
technology change from aluminum to copper is indispensable. However, the copper
wire bonding process reacts more sensitive to parameter changes. This makes manufacturing
reliable copper bond connections a challenging task. The aim of the BMBF funded
project Itsowl-InCuB is the development of self-optimizing techniques to enable
the reliable production of copper bond connections under varying conditions. A
model of the process is essential to achieve this aim. This model needs to include
the dynamic elasto-plastic deformation, the ultrasonic softening effect and the
proceeding adhesion between wire and substrate. This paper focusses on the pre-deformation
process. In the touchdown phase, the wire is pressed into the V-groove of the
tool and a small initial contact area between wire and substrate arise. The local
characteristics of the material change abruptly because of the cold forming. Consequently,
the pre-deformation has a strong effect on the joining process. In [1], a pre-cleaning
effect during the touchdown process of aluminum wires by cracking of oxide layers
was presented. These interactions of the process parameters are still largely
unknown for copper. In a first step, this paper validates the importance of modeling
the pre-deformation by showing its impact on the wire deformation characteristic
experimentally. Creating cross-section views of pre-deformed copper wires has
shown a low deformation degree compared to aluminum. By using a digital microscope
and a scanning confocal microscope an analysis about the contact areas and penetration
depths after touchdown has been made. Additionally, it has to be taken into account
that the dynamical touchdown force depends on the touchdown speed and the touchdown
force set in the bonding machine. In order to measure the overshoot in the force
signals, a strain gauge sensor has been used. Subsequently, the affecting factors
have been interpreted independently Furthermore, the material properties of copper
wire have been investigated with tensile tests and hardness measurements. In a
second step, the paper presents finite element models of the touchdown process
for source and destination bonds. These models take the measured overshoot in
the touchdown forces into account. A multi-linear, isotropic material model has
been selected to map the material properties of the copper. A validation of the
model with the experimental determined contact areas, normal pressures and penetration
depths reveals the high model quality. Thus, the simulation is able to calculate
and visualize the three dimensional pre-deformation with an integrated material
parameter of the wire if the touchdown parameters of the bonding machine are known.
Based on the calculated deformation degrees of wire and substrate, it is probably
possible to investigate the effect of the pre-deformation on the pre-cleaning
phase in the copper wire bonding.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
citation:
ama: 'Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation
Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: Proceedings of the
47th International Symposium on Microelectronics (IMAPS). San Diego, CA, US;
2014:289-294.'
apa: Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., &
Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed
Heavy Copper Wire Wedge Bonds. In Proceedings of the 47th International Symposium
on Microelectronics (IMAPS) (pp. 289–294). San Diego, CA, US.
bibtex: '@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014,
place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study
of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the
47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas
and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and
Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }'
chicago: Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer,
Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation
Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In Proceedings of the
47th International Symposium on Microelectronics (IMAPS), 289–94. San Diego,
CA, US, 2014.
ieee: A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed
Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium
on Microelectronics (IMAPS), 2014, pp. 289–294.
mla: Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed
Heavy Copper Wire Wedge Bonds.” Proceedings of the 47th International Symposium
on Microelectronics (IMAPS), 2014, pp. 289–94.
short: 'A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann,
in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS),
San Diego, CA, US, 2014, pp. 289–294.'
date_created: 2019-05-20T13:35:09Z
date_updated: 2020-05-07T05:33:47Z
department:
- _id: '151'
keyword:
- pre-deformation
- copper wire bonding
- finite element model
language:
- iso: eng
page: 289-294
place: San Diego, CA, US
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of the 47th International Symposium on Microelectronics (IMAPS)
status: public
title: Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire
Wedge Bonds
type: conference
user_id: '210'
year: '2014'
...
---
_id: '9896'
abstract:
- lang: eng
text: In power electronics, ultrasonic wire bonding is used to connect the electrical
terminals of power modules. To implement a self-optimization technique for ultrasonic
wire bonding machines, a model of the process is essential. This model needs to
include the so called ultrasonic softening effect. It is a key effect within the
wire bonding process primarily enabling the robust interconnection between the
wire and a substrate. However, the physical modeling of the ultrasonic softening
effect is notoriously difficult because of its highly non-linear character and
the absence of a proper measurement method. In a first step, this paper validates
the importance of modeling the ultrasonic softening by showing its impact on the
wire deformation characteristic experimentally. In a second step, the paper presents
a data-driven model of the ultrasonic softening effect which is constructed from
data using machine learning techniques. A typical caveat of data-driven modeling
is the need for training data that cover the considered domain of process parameters
in order to achieve accurate generalization of the trained model to new process
configurations. In practice, however, the space of process parameters can only
be sampled sparsely. In this paper, a novel technique is applied which enables
the integration of prior knowledge about the process into the datadriven modeling
process. It turns out that this approach results in accurate generalization of
the data-driven model to unseen process parameters from sparse data.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Klaus
full_name: Neumann, Klaus
last_name: Neumann
- first_name: René Felix
full_name: Reimann, René Felix
last_name: Reimann
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
- first_name: Daniel
full_name: Bolowski, Daniel
last_name: Bolowski
citation:
ama: 'Unger A, Sextro W, Althoff S, et al. Data-driven Modeling of the Ultrasonic
Softening Effect for Robust Copper Wire Bonding. In: Proceedings of 8th International
Conference on Integrated Power Electronic Systems. Vol 141. ; 2014:175-180.'
apa: Unger, A., Sextro, W., Althoff, S., Meyer, T., Brökelmann, M., Neumann, K.,
… Bolowski, D. (2014). Data-driven Modeling of the Ultrasonic Softening Effect
for Robust Copper Wire Bonding. In Proceedings of 8th International Conference
on Integrated Power Electronic Systems (Vol. 141, pp. 175–180).
bibtex: '@inproceedings{Unger_Sextro_Althoff_Meyer_Brökelmann_Neumann_Reimann_Guth_Bolowski_2014,
title={Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper
Wire Bonding}, volume={141}, booktitle={Proceedings of 8th International Conference
on Integrated Power Electronic Systems}, author={Unger, Andreas and Sextro, Walter
and Althoff, Simon and Meyer, Tobias and Brökelmann, Michael and Neumann, Klaus
and Reimann, René Felix and Guth, Karsten and Bolowski, Daniel}, year={2014},
pages={175–180} }'
chicago: Unger, Andreas, Walter Sextro, Simon Althoff, Tobias Meyer, Michael Brökelmann,
Klaus Neumann, René Felix Reimann, Karsten Guth, and Daniel Bolowski. “Data-Driven
Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding.” In
Proceedings of 8th International Conference on Integrated Power Electronic
Systems, 141:175–80, 2014.
ieee: A. Unger et al., “Data-driven Modeling of the Ultrasonic Softening
Effect for Robust Copper Wire Bonding,” in Proceedings of 8th International
Conference on Integrated Power Electronic Systems, 2014, vol. 141, pp. 175–180.
mla: Unger, Andreas, et al. “Data-Driven Modeling of the Ultrasonic Softening Effect
for Robust Copper Wire Bonding.” Proceedings of 8th International Conference
on Integrated Power Electronic Systems, vol. 141, 2014, pp. 175–80.
short: 'A. Unger, W. Sextro, S. Althoff, T. Meyer, M. Brökelmann, K. Neumann, R.F.
Reimann, K. Guth, D. Bolowski, in: Proceedings of 8th International Conference
on Integrated Power Electronic Systems, 2014, pp. 175–180.'
date_created: 2019-05-20T13:38:10Z
date_updated: 2020-05-07T05:33:47Z
department:
- _id: '151'
intvolume: ' 141'
language:
- iso: eng
page: 175-180
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of 8th International Conference on Integrated Power Electronic
Systems
status: public
title: Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire
Bonding
type: conference
user_id: '210'
volume: 141
year: '2014'
...
---
_id: '9799'
abstract:
- lang: eng
text: 'Ultrasonic wire bonding is a common technology for manufacturing electrical
interconnects. In the field of power electronics, new thermal and electrical obligations
arose due to increasing power density requirements. One approach to achieve these
aims is replacing the wire material for heavy wire bonds from aluminum to copper.
This material change leads to challenging tasks and problems, for instance the
occurring wear of the bond tool. The wear is significantly higher using copper
wire instead of aluminum and results in a dramatic loss in the amount of interconnects
which can be produced reliable by a single tool. To reduce setting-up time in
the production and minimizing costs, an enlarged bonding tool lifetime is desirable.
Therefore, the paper discusses the influences of bonding parameters on the wear.
The key question is which of the tasks cannot be fulfilled with increased wear
of the tool, e.g. loss of process capability. The main functions are fixing the
wire in the tool groove, predeformation, applying normal force and transmission
of ultrasonic oscillation to the wire. To identify the most affecting factors,
four bonding parameters are varied and their influences are investigated. These
parameters are: (I) ultrasonic power, (II) tool geometry, (III) the way of tangential
force transmission and (IV) loop trajectory.'
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Mark
full_name: Schnietz, Mark
last_name: Schnietz
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
citation:
ama: 'Eichwald P, Sextro W, Althoff S, et al. Influences of Bonding Parameters on
the Tool Wear for Copper Wire Bonding. In: 15th Electronics Packaging Technology
Conference. ; 2013. doi:10.1109/EPTC.2013.6745803'
apa: Eichwald, P., Sextro, W., Althoff, S., Eacock, F., Schnietz, M., Guth, K.,
& Brökelmann, M. (2013). Influences of Bonding Parameters on the Tool Wear
for Copper Wire Bonding. In 15th Electronics Packaging Technology Conference.
https://doi.org/10.1109/EPTC.2013.6745803
bibtex: '@inproceedings{Eichwald_Sextro_Althoff_Eacock_Schnietz_Guth_Brökelmann_2013,
title={Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding},
DOI={10.1109/EPTC.2013.6745803},
booktitle={15th Electronics Packaging Technology Conference}, author={Eichwald,
Paul and Sextro, Walter and Althoff, Simon and Eacock, Florian and Schnietz, Mark
and Guth, Karsten and Brökelmann, Michael}, year={2013} }'
chicago: Eichwald, Paul, Walter Sextro, Simon Althoff, Florian Eacock, Mark Schnietz,
Karsten Guth, and Michael Brökelmann. “Influences of Bonding Parameters on the
Tool Wear for Copper Wire Bonding.” In 15th Electronics Packaging Technology
Conference, 2013. https://doi.org/10.1109/EPTC.2013.6745803.
ieee: P. Eichwald et al., “Influences of Bonding Parameters on the Tool Wear
for Copper Wire Bonding,” in 15th Electronics Packaging Technology Conference,
2013.
mla: Eichwald, Paul, et al. “Influences of Bonding Parameters on the Tool Wear for
Copper Wire Bonding.” 15th Electronics Packaging Technology Conference,
2013, doi:10.1109/EPTC.2013.6745803.
short: 'P. Eichwald, W. Sextro, S. Althoff, F. Eacock, M. Schnietz, K. Guth, M.
Brökelmann, in: 15th Electronics Packaging Technology Conference, 2013.'
date_created: 2019-05-13T13:57:49Z
date_updated: 2022-01-06T07:04:20Z
department:
- _id: '151'
doi: 10.1109/EPTC.2013.6745803
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: 15th Electronics Packaging Technology Conference
status: public
title: Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding
type: conference
user_id: '210'
year: '2013'
...