[{"abstract":[{"text":"Ultrasonic joining is a common industrial process. In the electronics industry it is used to form electrical connections, including those of dissimilar materials. Multiple influencing factors in ultrasonic joining are known and extensively investigated; process parameters like ultrasonic power, bond force, and bonding frequency of the ultrasonic vibration are known to have a high impact on a reliable joining process and need to be adapted for each new application with different geometry or materials. This contribution is focused on increasing ultrasonic power transmitted to the interface and keeping mechanical stresses during ultrasonic bonding low by using a multi-dimensional ultrasonic transducer concept. Bonding results for a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional bonding are discussed.","lang":"eng"}],"status":"public","publication":"Sensors and Actuators A: Physical","type":"journal_article","keyword":["Ultrasonic bonding","Ultrasonic welding","Multi-dimensional bonding","Complex vibration","Multi-frequent","Two-dimensional friction model"],"language":[{"iso":"eng"}],"_id":"10334","project":[{"grant_number":"MP-1-1-015","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","_id":"93"}],"department":[{"_id":"151"}],"user_id":"210","year":"2019","intvolume":"       295","page":"653 - 662","citation":{"ieee":"R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” <i>Sensors and Actuators A: Physical</i>, vol. 295, pp. 653–662, 2019, doi: <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>.","chicago":"Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i> 295 (2019): 653–62. <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">https://doi.org/10.1016/j.sna.2019.04.025</a>.","ama":"Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors and Actuators A: Physical</i>. 2019;295:653-662. doi:<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>","short":"R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.","mla":"Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i>, vol. 295, 2019, pp. 653–62, doi:<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>.","bibtex":"@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding}, volume={295}, DOI={<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>}, journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={653–662} }","apa":"Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &#38; Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors and Actuators A: Physical</i>, <i>295</i>, 653–662. <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">https://doi.org/10.1016/j.sna.2019.04.025</a>"},"publication_identifier":{"issn":["0924-4247"]},"quality_controlled":"1","title":"Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding","doi":"10.1016/j.sna.2019.04.025","date_updated":"2023-09-21T14:12:15Z","volume":295,"author":[{"first_name":"Reinhard","full_name":"Schemmel, Reinhard","id":"28647","last_name":"Schemmel"},{"first_name":"Tobias","last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias"},{"first_name":"Collin","last_name":"Dymel","id":"66833","full_name":"Dymel, Collin"},{"last_name":"Hunstig","full_name":"Hunstig, Matthias","first_name":"Matthias"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"first_name":"Walter","full_name":"Sextro, Walter","id":"21220","last_name":"Sextro"}],"date_created":"2019-07-01T07:32:07Z"},{"type":"conference","publication":"(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)","abstract":[{"text":"State-of-the-art industrial compact high power electronic packages require copper-copper interconnections with larger cross sections made by ultrasonic bonding. In comparison to aluminium-copper, copper-copper interconnections require increased normal forces and ultrasonic power, which might lead to substrate damage due to increased mechanical stresses. One option to raise friction energy without increasing vibration amplitude between wire and substrate or bonding force is the use of two-dimensional vibration. The first part of this contribution reports on the development of a novel bonding system that executes two-dimensional vibrations of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic bonds only form properly when surfaces are clean, oxide free and activated, the geometries of tool-tip and pin were optimised using finite element analysis. To maximize the area of the bonded annulus the distribution of normal pressure was optimized by varying the convexity of the bottom side of the pin. Second, a statistical model obtained from an experimental parameter study shows the influence of different bonding parameters on the bond result. To find bonding parameters with the minimum number of tests, the experiments have been planned using a D-optimal experimental design approach.","lang":"eng"}],"status":"public","project":[{"name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","_id":"93","grant_number":"MP-1-1-015"}],"_id":"9992","user_id":"210","department":[{"_id":"151"}],"keyword":["ultrasonic wire-bonding","bond-tool design","parameter identification","statistical engineering"],"language":[{"iso":"eng"}],"quality_controlled":"1","year":"2018","citation":{"ama":"Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>. ; 2018:1-6.","ieee":"C. Dymel <i>et al.</i>, “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 2018, pp. 1–6.","chicago":"Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 1–6, 2018.","apa":"Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., &#38; Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i> (pp. 1–6).","mla":"Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>, 2018, pp. 1–6.","bibtex":"@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title={Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}, year={2018}, pages={1–6} }","short":"C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6."},"page":"1-6","date_updated":"2020-05-07T05:33:56Z","author":[{"id":"66833","full_name":"Dymel, Collin","last_name":"Dymel","first_name":"Collin"},{"last_name":"Eichwald","full_name":"Eichwald, Paul","first_name":"Paul"},{"first_name":"Reinhard","last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard"},{"first_name":"Tobias","full_name":"Hemsel, Tobias","id":"210","last_name":"Hemsel"},{"last_name":"Brökelmann","full_name":"Brökelmann, Michael","first_name":"Michael"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"},{"first_name":"Walter","last_name":"Sextro","id":"21220","full_name":"Sextro, Walter"}],"date_created":"2019-05-27T10:18:10Z","title":"Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process"},{"abstract":[{"text":"Ultrasonic bonding and welding are common friction based approaches in the assembly of power electronics. Interconnections with cross-sections of 0.3 mm² up to 12 mm² made from copper are well suited in high power applications. For increasing friction energy, which is responsible for bond formation, a two-dimensional vibration approach is applied to newly developed interconnection pins. Using two-dimensional vibration for bonding requires identification of suitable bonding parameters. Even though simulation models of wire bonding processes exist, parameters for the two-dimensional pin-bonding process cannot be derived accurately yet. Within this contribution, a methodology and workflow for experimental studies identifying a suitable bond parameter space are presented. The results of a pre-study are used to set up an extensive statistical parameter study, which gives insights about the bond strength change due to bond process parameter variation. By evaluation of electrical data captured during bonding, errors biasing the resulting shear forces are identified. All data obtained during the experimental study is used to build a statistical regression model suitable for predicting shear forces. The accuracy of the regression model’s predictions is determined and the applicability to predict process parameters or validate simulation models is assessed. Finally, the influence of the tool trajectory on the bond formation is determined, comparing one dimensional, elliptic and circular trajectories.","lang":"eng"}],"status":"public","publication":"(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)","type":"conference","keyword":["ultrasonic two-dimensional bonding","electrical interconnection","process parameters"],"language":[{"iso":"eng"}],"_id":"9993","project":[{"grant_number":"MP-1-1-015","_id":"93","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen"}],"department":[{"_id":"151"}],"user_id":"210","year":"2018","page":"41-44","citation":{"apa":"Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., &#38; Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i> (pp. 41–44).","short":"C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.","bibtex":"@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={41–44} }","mla":"Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp. 41–44.","ama":"Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In: <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>. ; 2018:41-44.","chicago":"Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 41–44, 2018.","ieee":"C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig, “Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding,” in <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp. 41–44."},"quality_controlled":"1","title":"Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding","date_updated":"2020-05-07T05:33:56Z","author":[{"full_name":"Dymel, Collin","id":"66833","last_name":"Dymel","first_name":"Collin"},{"first_name":"Reinhard","full_name":"Schemmel, Reinhard","id":"28647","last_name":"Schemmel"},{"last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias","first_name":"Tobias"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"},{"last_name":"Brökelmann","full_name":"Brökelmann, Michael","first_name":"Michael"},{"last_name":"Hunstig","full_name":"Hunstig, Matthias","first_name":"Matthias"}],"date_created":"2019-05-27T10:19:18Z"},{"department":[{"_id":"151"}],"user_id":"210","_id":"9997","project":[{"name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","_id":"93","grant_number":"MP-1-1-015"}],"language":[{"iso":"eng"}],"publication":"CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)","type":"conference","status":"public","abstract":[{"text":"Ultrasonic wire bonding is used to connect the electrical terminals of semiconductor modules in power electronics. Mul- tiple influencing factors in wedge/wedge bonding are known and extensively investigated. A constructively settable but rarely examined parameter is the bonding frequency. In case of bonding on challenging substrates, e.g. supple substruc- tures, a high influence of the working frequency is observed. The choice of the working frequency is typically based on experimental investigations for a certain component or substrate and needs to be evaluated anew for new applications. A profound understanding of the influence of the working frequency is required to achieve a reliable bond process and a short process development. Here a generalized model for the numerical simulation of the bond formation with respect to the dynamics of the substructure is presented. The simulation results are compared to experiments using 300 µm copper wire at different working frequencies and geometries of the substructure.","lang":"eng"}],"author":[{"id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel","first_name":"Reinhard"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"full_name":"Sextro, Walter","id":"21220","last_name":"Sextro","first_name":"Walter"},{"full_name":"Unger, Andreas","last_name":"Unger","first_name":"Andreas"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"last_name":"Hunstig","full_name":"Hunstig, Matthias","first_name":"Matthias"}],"date_created":"2019-05-27T10:24:37Z","date_updated":"2020-05-07T05:33:56Z","title":"Effects of different working frequencies on the joint formation in copper wire bonding","quality_controlled":"1","page":"230-235","citation":{"apa":"Schemmel, R., Althoff, S., Sextro, W., Unger, A., Brökelmann, M., &#38; Hunstig, M. (2018). Effects of different working frequencies on the joint formation in copper wire bonding. In <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i> (pp. 230–235). Stuttgart, Germany.","bibtex":"@inproceedings{Schemmel_Althoff_Sextro_Unger_Brökelmann_Hunstig_2018, place={Stuttgart, Germany}, title={Effects of different working frequencies on the joint formation in copper wire bonding}, booktitle={CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)}, author={Schemmel, Reinhard and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={230–235} }","mla":"Schemmel, Reinhard, et al. “Effects of Different Working Frequencies on the Joint Formation in Copper Wire Bonding.” <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 2018, pp. 230–35.","short":"R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, in: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.","ama":"Schemmel R, Althoff S, Sextro W, Unger A, Brökelmann M, Hunstig M. Effects of different working frequencies on the joint formation in copper wire bonding. In: <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>. Stuttgart, Germany; 2018:230-235.","ieee":"R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig, “Effects of different working frequencies on the joint formation in copper wire bonding,” in <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 2018, pp. 230–235.","chicago":"Schemmel, Reinhard, Simon Althoff, Walter Sextro, Andreas Unger, Michael Brökelmann, and Matthias Hunstig. “Effects of Different Working Frequencies on the Joint Formation in Copper Wire Bonding.” In <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 230–35. Stuttgart, Germany, 2018."},"year":"2018","place":"Stuttgart, Germany"},{"volume":"Vol. 2017, No. 1","date_created":"2019-05-27T09:32:42Z","author":[{"last_name":"Eichwald","full_name":"Eichwald, Paul","first_name":"Paul"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"first_name":"Reinhard","last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard"},{"full_name":"Sextro, Walter","id":"21220","last_name":"Sextro","first_name":"Walter"},{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"last_name":"Brökelmann","full_name":"Brökelmann, Michael","first_name":"Michael"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"}],"date_updated":"2020-05-07T05:33:54Z","title":"Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design","quality_controlled":"1","citation":{"apa":"Eichwald, P., Althoff, S., Schemmel, R., Sextro, W., Unger, A., Brökelmann, M., &#38; Hunstig, M. (2017). Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. <i>IMAPSource</i>, <i>Vol. 2017</i>, <i>No. 1</i>.","short":"P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).","bibtex":"@article{Eichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017, title={Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design}, volume={Vol. 2017, No. 1}, journal={IMAPSource}, author={Eichwald, Paul and Althoff, Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}, year={2017} }","mla":"Eichwald, Paul, et al. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” <i>IMAPSource</i>, vol. Vol. 2017, No. 1, 2017.","ama":"Eichwald P, Althoff S, Schemmel R, et al. Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. <i>IMAPSource</i>. 2017;Vol. 2017, No. 1.","ieee":"P. Eichwald <i>et al.</i>, “Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design,” <i>IMAPSource</i>, vol. Vol. 2017, No. 1, 2017.","chicago":"Eichwald, Paul, Simon Althoff, Reinhard Schemmel, Walter Sextro, Andreas Unger, Michael Brökelmann, and Matthias Hunstig. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” <i>IMAPSource</i> Vol. 2017, No. 1 (2017)."},"year":"2017","department":[{"_id":"151"}],"user_id":"210","_id":"9973","project":[{"grant_number":"MP-1-1-015","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","_id":"93"}],"language":[{"iso":"eng"}],"keyword":["International Symposium on Microelectronics"],"publication":"IMAPSource","type":"journal_article","status":"public","abstract":[{"lang":"eng","text":"In power electronics, copper connector pins are e.g. used to connect control boards with power modules. The new chip generation based on SiC and GaN technology increase the power density of semiconductor modules significantly with junction temperatures reaching 200°C. To enable reliable operation at such high temperature, the soldering of these connector pins should be substituted by a multi-dimensional copper-copper bonding technology. A copper pin welded directly on DBC substrate also simplifies the assembly. With this aim, a proper bond tool and a suitable connector pin geometry are designed. This paper presents a two-dimensional trajectory approach for ultrasonic bonding of copper pieces, e.g. connector pins, with the intention to minimize mechanical stresses exposed to the substrate. This is achieved using a multi-dimensional vibration system with multiple transducers known from flip chip bonding. Applying a planar relative motion between the bonding piece and the substrate increases the induced frictional power compared to one-dimensional excitation. The core of this work is the development of a new tool design which enables a reliable and effective transmission of the multidimensional vibration into the contact area between nail-shaped bonding piece and substrate. For this purpose, different bonding tool as well as bonding piece designs are discussed. A proper bonding tool design is selected based on the simulated alternatives. This tool is examined in bonding experiments and the results are presented. In addition, different grades of hardness for bonding piece and substrate are examined as well as different bonding parameters. Optical inspection of the bonded area shows the emergence of initial micro welds in form of a ring which is growing in direction of the interface boundaries with increasing bonding duration."}]}]