---
_id: '10334'
abstract:
- lang: eng
  text: Ultrasonic joining is a common industrial process. In the electronics industry
    it is used to form electrical connections, including those of dissimilar materials.
    Multiple influencing factors in ultrasonic joining are known and extensively investigated;
    process parameters like ultrasonic power, bond force, and bonding frequency of
    the ultrasonic vibration are known to have a high impact on a reliable joining
    process and need to be adapted for each new application with different geometry
    or materials. This contribution is focused on increasing ultrasonic power transmitted
    to the interface and keeping mechanical stresses during ultrasonic bonding low
    by using a multi-dimensional ultrasonic transducer concept. Bonding results for
    a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional
    bonding are discussed.
author:
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Collin
  full_name: Dymel, Collin
  id: '66833'
  last_name: Dymel
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex
    multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors
    and Actuators A: Physical</i>. 2019;295:653-662. doi:<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>'
  apa: 'Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &#38; Sextro,
    W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic
    bonding and welding. <i>Sensors and Actuators A: Physical</i>, <i>295</i>, 653–662.
    <a href="https://doi.org/10.1016/j.sna.2019.04.025">https://doi.org/10.1016/j.sna.2019.04.025</a>'
  bibtex: '@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using
    complex multi-dimensional vibration trajectories in ultrasonic bonding and welding},
    volume={295}, DOI={<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>},
    journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel,
    Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro,
    Walter}, year={2019}, pages={653–662} }'
  chicago: 'Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael
    Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories
    in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i> 295
    (2019): 653–62. <a href="https://doi.org/10.1016/j.sna.2019.04.025">https://doi.org/10.1016/j.sna.2019.04.025</a>.'
  ieee: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro,
    “Using complex multi-dimensional vibration trajectories in ultrasonic bonding
    and welding,” <i>Sensors and Actuators A: Physical</i>, vol. 295, pp. 653–662,
    2019, doi: <a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>.'
  mla: 'Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories
    in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i>,
    vol. 295, 2019, pp. 653–62, doi:<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>.'
  short: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro,
    Sensors and Actuators A: Physical 295 (2019) 653–662.'
date_created: 2019-07-01T07:32:07Z
date_updated: 2023-09-21T14:12:15Z
department:
- _id: '151'
doi: 10.1016/j.sna.2019.04.025
intvolume: '       295'
keyword:
- Ultrasonic bonding
- Ultrasonic welding
- Multi-dimensional bonding
- Complex vibration
- Multi-frequent
- Two-dimensional friction model
language:
- iso: eng
page: 653 - 662
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: 'Sensors and Actuators A: Physical'
publication_identifier:
  issn:
  - 0924-4247
quality_controlled: '1'
status: public
title: Using complex multi-dimensional vibration trajectories in ultrasonic bonding
  and welding
type: journal_article
user_id: '210'
volume: 295
year: '2019'
...
---
_id: '9992'
abstract:
- lang: eng
  text: State-of-the-art industrial compact high power electronic packages require
    copper-copper interconnections with larger cross sections made by ultrasonic bonding.
    In comparison to aluminium-copper, copper-copper interconnections require increased
    normal forces and ultrasonic power, which might lead to substrate damage due to
    increased mechanical stresses. One option to raise friction energy without increasing
    vibration amplitude between wire and substrate or bonding force is the use of
    two-dimensional vibration. The first part of this contribution reports on the
    development of a novel bonding system that executes two-dimensional vibrations
    of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic
    bonds only form properly when surfaces are clean, oxide free and activated, the
    geometries of tool-tip and pin were optimised using finite element analysis. To
    maximize the area of the bonded annulus the distribution of normal pressure was
    optimized by varying the convexity of the bottom side of the pin. Second, a statistical
    model obtained from an experimental parameter study shows the influence of different
    bonding parameters on the bond result. To find bonding parameters with the minimum
    number of tests, the experiments have been planned using a D-optimal experimental
    design approach.
author:
- first_name: Collin
  full_name: Dymel, Collin
  id: '66833'
  last_name: Dymel
- first_name: Paul
  full_name: Eichwald, Paul
  last_name: Eichwald
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation
    of weld formation in a novel two-dimensional copper-copper bonding process. In:
    <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
    Germany)</i>. ; 2018:1-6.'
  apa: Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig,
    M., &#38; Sextro, W. (2018). Numerical and statistical investigation of weld formation
    in a novel two-dimensional copper-copper bonding process. In <i>(Proceedings of
    7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>
    (pp. 1–6).
  bibtex: '@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018,
    title={Numerical and statistical investigation of weld formation in a novel two-dimensional
    copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration
    Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald,
    Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig,
    Matthias and Sextro, Walter}, year={2018}, pages={1–6} }'
  chicago: Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael
    Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation
    of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In
    <i>(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
    Germany)</i>, 1–6, 2018.
  ieee: C. Dymel <i>et al.</i>, “Numerical and statistical investigation of weld formation
    in a novel two-dimensional copper-copper bonding process,” in <i>(Proceedings
    of 7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>,
    2018, pp. 1–6.
  mla: Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation
    in a Novel Two-Dimensional Copper-Copper Bonding Process.” <i>(Proceedings of
    7th Electronics System-Integration Technology Conference, Dresden, Germany)</i>,
    2018, pp. 1–6.
  short: 'C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig,
    W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference,
    Dresden, Germany), 2018, pp. 1–6.'
date_created: 2019-05-27T10:18:10Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic wire-bonding
- bond-tool design
- parameter identification
- statistical engineering
language:
- iso: eng
page: 1-6
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 7th Electronics System-Integration Technology Conference,
  Dresden, Germany)
quality_controlled: '1'
status: public
title: Numerical and statistical investigation of weld formation in a novel two-dimensional
  copper-copper bonding process
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9993'
abstract:
- lang: eng
  text: Ultrasonic bonding and welding are common friction based approaches in the
    assembly of power electronics. Interconnections with cross-sections of 0.3 mm²
    up to 12 mm² made from copper are well suited in high power applications. For
    increasing friction energy, which is responsible for bond formation, a two-dimensional
    vibration approach is applied to newly developed interconnection pins. Using two-dimensional
    vibration for bonding requires identification of suitable bonding parameters.
    Even though simulation models of wire bonding processes exist, parameters for
    the two-dimensional pin-bonding process cannot be derived accurately yet. Within
    this contribution, a methodology and workflow for experimental studies identifying
    a suitable bond parameter space are presented. The results of a pre-study are
    used to set up an extensive statistical parameter study, which gives insights
    about the bond strength change due to bond process parameter variation. By evaluation
    of electrical data captured during bonding, errors biasing the resulting shear
    forces are identified. All data obtained during the experimental study is used
    to build a statistical regression model suitable for predicting shear forces.
    The accuracy of the regression model’s predictions is determined and the applicability
    to predict process parameters or validate simulation models is assessed. Finally,
    the influence of the tool trajectory on the bond formation is determined, comparing
    one dimensional, elliptic and circular trajectories.
author:
- first_name: Collin
  full_name: Dymel, Collin
  id: '66833'
  last_name: Dymel
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
citation:
  ama: 'Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental
    investigations on the impact of bond process parameters in two-dimensional ultrasonic
    copper bonding. In: <i>(Proceedings of 8th Electronics IEEE CPMT Symposium Japan
    (ICSJ 2018), Kyoto, Japan)</i>. ; 2018:41-44.'
  apa: Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., &#38; Hunstig,
    M. (2018). Experimental investigations on the impact of bond process parameters
    in two-dimensional ultrasonic copper bonding. In <i>(Proceedings of 8th Electronics
    IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i> (pp. 41–44).
  bibtex: '@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental
    investigations on the impact of bond process parameters in two-dimensional ultrasonic
    copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium
    Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard
    and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias},
    year={2018}, pages={41–44} }'
  chicago: Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael
    Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of
    Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In <i>(Proceedings
    of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 41–44,
    2018.
  ieee: C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig,
    “Experimental investigations on the impact of bond process parameters in two-dimensional
    ultrasonic copper bonding,” in <i>(Proceedings of 8th Electronics IEEE CPMT Symposium
    Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp. 41–44.
  mla: Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process
    Parameters in Two-Dimensional Ultrasonic Copper Bonding.” <i>(Proceedings of 8th
    Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)</i>, 2018, pp.
    41–44.
  short: 'C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig,
    in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto,
    Japan), 2018, pp. 41–44.'
date_created: 2019-05-27T10:19:18Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic two-dimensional bonding
- electrical interconnection
- process parameters
language:
- iso: eng
page: 41-44
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018),
  Kyoto, Japan)
quality_controlled: '1'
status: public
title: Experimental investigations on the impact of bond process parameters in two-dimensional
  ultrasonic copper bonding
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9997'
abstract:
- lang: eng
  text: Ultrasonic wire bonding is used to connect the electrical terminals of semiconductor
    modules in power electronics. Mul- tiple influencing factors in wedge/wedge bonding
    are known and extensively investigated. A constructively settable but rarely examined
    parameter is the bonding frequency. In case of bonding on challenging substrates,
    e.g. supple substruc- tures, a high influence of the working frequency is observed.
    The choice of the working frequency is typically based on experimental investigations
    for a certain component or substrate and needs to be evaluated anew for new applications.
    A profound understanding of the influence of the working frequency is required
    to achieve a reliable bond process and a short process development. Here a generalized
    model for the numerical simulation of the bond formation with respect to the dynamics
    of the substructure is presented. The simulation results are compared to experiments
    using 300 µm copper wire at different working frequencies and geometries of the
    substructure.
author:
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
citation:
  ama: 'Schemmel R, Althoff S, Sextro W, Unger A, Brökelmann M, Hunstig M. Effects
    of different working frequencies on the joint formation in copper wire bonding.
    In: <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics
    Systems (CIPS 2018)</i>. Stuttgart, Germany; 2018:230-235.'
  apa: Schemmel, R., Althoff, S., Sextro, W., Unger, A., Brökelmann, M., &#38; Hunstig,
    M. (2018). Effects of different working frequencies on the joint formation in
    copper wire bonding. In <i>CIPS 2018 - 10th International Conference on Integrated
    Power Electronics Systems (CIPS 2018)</i> (pp. 230–235). Stuttgart, Germany.
  bibtex: '@inproceedings{Schemmel_Althoff_Sextro_Unger_Brökelmann_Hunstig_2018, place={Stuttgart,
    Germany}, title={Effects of different working frequencies on the joint formation
    in copper wire bonding}, booktitle={CIPS 2018 - 10th International Conference
    on Integrated Power Electronics Systems (CIPS 2018)}, author={Schemmel, Reinhard
    and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael
    and Hunstig, Matthias}, year={2018}, pages={230–235} }'
  chicago: Schemmel, Reinhard, Simon Althoff, Walter Sextro, Andreas Unger, Michael
    Brökelmann, and Matthias Hunstig. “Effects of Different Working Frequencies on
    the Joint Formation in Copper Wire Bonding.” In <i>CIPS 2018 - 10th International
    Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 230–35. Stuttgart,
    Germany, 2018.
  ieee: R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig,
    “Effects of different working frequencies on the joint formation in copper wire
    bonding,” in <i>CIPS 2018 - 10th International Conference on Integrated Power
    Electronics Systems (CIPS 2018)</i>, 2018, pp. 230–235.
  mla: Schemmel, Reinhard, et al. “Effects of Different Working Frequencies on the
    Joint Formation in Copper Wire Bonding.” <i>CIPS 2018 - 10th International Conference
    on Integrated Power Electronics Systems (CIPS 2018)</i>, 2018, pp. 230–35.
  short: 'R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig,
    in: CIPS 2018 - 10th International Conference on Integrated Power Electronics
    Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.'
date_created: 2019-05-27T10:24:37Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
language:
- iso: eng
page: 230-235
place: Stuttgart, Germany
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: CIPS 2018 - 10th International Conference on Integrated Power Electronics
  Systems (CIPS 2018)
quality_controlled: '1'
status: public
title: Effects of different working frequencies on the joint formation in copper wire
  bonding
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9973'
abstract:
- lang: eng
  text: In power electronics, copper connector pins are e.g. used to connect control
    boards with power modules. The new chip generation based on SiC and GaN technology
    increase the power density of semiconductor modules significantly with junction
    temperatures reaching 200°C. To enable reliable operation at such high temperature,
    the soldering of these connector pins should be substituted by a multi-dimensional
    copper-copper bonding technology. A copper pin welded directly on DBC substrate
    also simplifies the assembly. With this aim, a proper bond tool and a suitable
    connector pin geometry are designed. This paper presents a two-dimensional trajectory
    approach for ultrasonic bonding of copper pieces, e.g. connector pins, with the
    intention to minimize mechanical stresses exposed to the substrate. This is achieved
    using a multi-dimensional vibration system with multiple transducers known from
    flip chip bonding. Applying a planar relative motion between the bonding piece
    and the substrate increases the induced frictional power compared to one-dimensional
    excitation. The core of this work is the development of a new tool design which
    enables a reliable and effective transmission of the multidimensional vibration
    into the contact area between nail-shaped bonding piece and substrate. For this
    purpose, different bonding tool as well as bonding piece designs are discussed.
    A proper bonding tool design is selected based on the simulated alternatives.
    This tool is examined in bonding experiments and the results are presented. In
    addition, different grades of hardness for bonding piece and substrate are examined
    as well as different bonding parameters. Optical inspection of the bonded area
    shows the emergence of initial micro welds in form of a ring which is growing
    in direction of the interface boundaries with increasing bonding duration.
author:
- first_name: Paul
  full_name: Eichwald, Paul
  last_name: Eichwald
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
citation:
  ama: Eichwald P, Althoff S, Schemmel R, et al. Multi-dimensional Ultrasonic Copper
    Bonding – New Challenges for Tool Design. <i>IMAPSource</i>. 2017;Vol. 2017, No.
    1.
  apa: Eichwald, P., Althoff, S., Schemmel, R., Sextro, W., Unger, A., Brökelmann,
    M., &#38; Hunstig, M. (2017). Multi-dimensional Ultrasonic Copper Bonding – New
    Challenges for Tool Design. <i>IMAPSource</i>, <i>Vol. 2017</i>, <i>No. 1</i>.
  bibtex: '@article{Eichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017,
    title={Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design},
    volume={Vol. 2017, No. 1}, journal={IMAPSource}, author={Eichwald, Paul and Althoff,
    Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann,
    Michael and Hunstig, Matthias}, year={2017} }'
  chicago: Eichwald, Paul, Simon Althoff, Reinhard Schemmel, Walter Sextro, Andreas
    Unger, Michael Brökelmann, and Matthias Hunstig. “Multi-Dimensional Ultrasonic
    Copper Bonding – New Challenges for Tool Design.” <i>IMAPSource</i> Vol. 2017,
    No. 1 (2017).
  ieee: P. Eichwald <i>et al.</i>, “Multi-dimensional Ultrasonic Copper Bonding –
    New Challenges for Tool Design,” <i>IMAPSource</i>, vol. Vol. 2017, No. 1, 2017.
  mla: Eichwald, Paul, et al. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges
    for Tool Design.” <i>IMAPSource</i>, vol. Vol. 2017, No. 1, 2017.
  short: P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann,
    M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).
date_created: 2019-05-27T09:32:42Z
date_updated: 2020-05-07T05:33:54Z
department:
- _id: '151'
keyword:
- International Symposium on Microelectronics
language:
- iso: eng
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: IMAPSource
quality_controlled: '1'
status: public
title: Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
type: journal_article
user_id: '210'
volume: Vol. 2017, No. 1
year: '2017'
...