@article{55568,
  abstract     = {{<jats:p>Historical condition monitoring data from technical systems can be utilized to develop data-driven models for predicting the remaining useful life (RUL) of similar systems, whereas the Health Index (HI) often is a crucial component. The development of robust and accurate models requires meaningful features that reflect the system’s degradation process, enabling an accurate prediction of the system's HI. Traditionally, the identification of those is supported by one of various feature ranking methods. In literature, feature interdependencies and their transferability across various similar systems are not sufficiently considered in feature selection, exacerbating the challenge of HI prediction posed by the scarcity of data and system diversity in real-world applications. This work addresses this gaps by demonstrating how filter-based feature selection, incorporating failure thresholds and cross correlations, enhances feature selection leading to improved HI prediction. The proposed methodology is applied to a novel dataset* obtained from run-to-failure experiments on geared motors conducted as part of this study, which presents the aforementioned challenges. It is revealed that classical feature selection, consisting of feature ranking only, leaves potential untapped, which is utilized by the proposed selection methodology. It is shown that the proposed feature selection methodology leads to the best result with a RMSE of 0.14 in predicting the HI of a constructive different gearbox, while the features, determined by classical feature selection, lead to a RMSE of 0.19 at best.</jats:p>}},
  author       = {{Löwen, Alexander and Wissbrock, Peter and Bender, Amelie and Sextro, Walter}},
  isbn         = {{978-1-936263-40-0}},
  journal      = {{PHM Society European Conference}},
  location     = {{Prague}},
  number       = {{1}},
  pages        = {{955--964}},
  publisher    = {{PHM Society}},
  title        = {{{Filter-based feature selection for prognostics incorporating cross correlations and failure thresholds}}},
  doi          = {{10.36001/phme.2024.v8i1.4075}},
  volume       = {{8}},
  year         = {{2024}},
}

@inproceedings{55631,
  abstract     = {{This paper investigates the remaining useful lifetime (RUL) estimation of bearings under dynamic, i.e., time-varying, operating conditions (OC). Unlike conventional studies that assume constant OC in bearing accelerated life tests, we introduce a dataset with time-varying OC during run-to-failure experiments, simulating real-world scenarios. We explore data-driven approaches to identify the transition point from a healthy to an unhealthy state and estimate the RUL. Additionally, we examine strategies for integrating OC information to enhance RUL estimations. These methodologies are evaluated through numerical experiments using various machine learning algorithms.}},
  author       = {{Javanmardi, Alireza and Aimiyekagbon, Osarenren Kennedy and Bender, Amelie and Kimotho, James Kuria and Sextro, Walter and Hüllermeier, Eyke}},
  booktitle    = {{PHM Society European Conference}},
  isbn         = {{978-1-936263-40-0}},
  location     = {{Prague, Czech Republic}},
  number       = {{1}},
  publisher    = {{PHM Society}},
  title        = {{{Remaining Useful Lifetime Estimation of Bearings Operating under Time-Varying Conditions}}},
  doi          = {{10.36001/phme.2024.v8i1.4101}},
  volume       = {{8}},
  year         = {{2024}},
}

@inproceedings{51119,
  author       = {{Scheidemann, Claus and Hagedorn, Oliver Ernst Caspar and Hemsel, Tobias and Sextro, Walter}},
  location     = {{Jeju, Korea}},
  title        = {{{Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process}}},
  year         = {{2023}},
}

@inproceedings{51338,
  author       = {{Schütte, Jan and Sextro, Walter}},
  booktitle    = {{20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn}},
  location     = {{Karlsruhe}},
  pages        = {{165--180}},
  publisher    = {{VDI Verlag GmbH}},
  title        = {{{Einfluss der Radhubkinematik auf den Reifenverschleiß}}},
  volume       = {{2425}},
  year         = {{2023}},
}

@inproceedings{47116,
  abstract     = {{This paper presents a comprehensive study on diagnosing a spacecraft propulsion system utilizing data provided by the Prognostics and Health Management (PHM) society, specifically obtained as part of the Asia-Pacific PHM conference’s data challenge 2023. The objective of the challenge is to identify and diagnose known faults as well as unknown anomalies in the spacecraft’s propulsion system, which is critical for ensuring the spacecraft’s proper functionality and safety. To address this challenge, the proposed method follows a systematic approach of feature extraction, feature selection, and model development. The models employed in this study are kMeans clustering and decision trees combined to ensembles, enriched with expert knowledge. With the method presented, our team was capable of reaching high accuracy in identifying anomalies as well as diagnosing faults, resulting in attaining the seventh place with a score of 93.08 %.}},
  author       = {{Aimiyekagbon, Osarenren Kennedy and Löwen, Alexander and Bender, Amelie and Muth, Lars and Sextro, Walter}},
  booktitle    = {{Proceedings of the Asia Pacific Conference of the PHM Society 2023 }},
  keywords     = {{PHM, Fault Diagnostics, Multiple Fault Modes, Expert-Informed Diagnostics, Anomaly Detection}},
  number       = {{1}},
  title        = {{{Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System}}},
  doi          = {{10.36001/phmap.2023.v4i1.3596}},
  volume       = {{4}},
  year         = {{2023}},
}

@phdthesis{41971,
  abstract     = {{Ultraschall-Drahtbonden ist eine Standardtechnologie im Bereich der Aufbau- und Verbindungstechnik von Leistungshalbleitermodulen. Um Prozessschritte und damit wertvolle Zeit zu sparen, sollen die Kupferdickdrähte für die Leistungshalbleiter auch für die Kontaktierung von eingespritzten Anschlusssteckern im Modulrahmen verwendet werden. Das Kontaktierungsverfahren mit diesen Drähten auf Steckern in dünnwandigen Kunststoffrahmen führt häufig zu unzureichender Bondqualität. In dieser Arbeit wird das Bonden von Anschlusssteckern experimentell und anhand von Simulationen untersucht, um die Prozessstabilität zu steigern.

Zunächst wurden Experimente auf Untergründen mit hoher Steifigkeit durchgeführt, um Störgrößen von Untergrundeigenschaften zu verringern. Die gewonnenen Erkenntnisse erlaubten die Entwicklung eines Simulationsmodells für die Vorhersage der Bondqualität. Dieses basiert auf einer flächenaufgelösten Reibarbeitsbestimmung im Fügebereich unter Berücksichtigung des Ultraschallerweichungseffektes und der hierdurch entstehenden hohen Drahtverformung.

Experimente an den Anschlusssteckern im Modulrahmen zeigten eine verringerte Relativverschiebung zwischen Draht und Stecker, was zu einer deutlichen Verringerung der Reibarbeit führt. Außerdem wurden verminderte Schwingamplituden des Bondwerkzeugs nachgewiesen. Dies führt zu einer weiteren Reduktion der Reibarbeit. Beide Effekte wurden mithilfe eines Mehrmassenschwingers modelliert. Die gewonnenen Erkenntnisse und die erstellten Simulationsmodelle ermöglichen die Entwicklung von Klemmvorrichtungen, welche die identifizierten Störgrößen gezielt kompensieren und so ein verlässliches Bonden der Anschlussstecker im gleichen Prozessschritt ermöglichen, in dem auch die Leistungshalbleiter kontaktiert werden.}},
  author       = {{Althoff, Simon}},
  isbn         = {{978-3-8440-8903-5}},
  keywords     = {{heavy copper bonding, wire bonding, quality prediction, friction model, point-contact-element}},
  pages        = {{192}},
  publisher    = {{Shaker}},
  title        = {{{Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach}}},
  volume       = {{15}},
  year         = {{2023}},
}

@phdthesis{41970,
  abstract     = {{Der Transport feiner Pulver mit in der Regel sehr hohen adhäsiven und kohäsiven Eigenschaften stellt für viele konventionelle Transportsysteme eine große Herausforderung dar. Durch die Anwendung von Ultraschallschwingungen können insbesondere die hohen adhäsiven Kontaktkräfte und damit auch die Reibungseigenschaften manipuliert werden.

Ein neu entwickeltes Pulvertransportsystem nutzt Ultraschallschwingungen, um die effektiven Tangentialkräfte im Pulver-Rohrkontakt zu reduzieren. Durch den koordinierten Einsatz von Ultraschallpulsen während einer niederfrequenten harmonischen Axialschwingung des Transportrohres wird ein kontinuierlicher Pulvertransport ermöglicht. Nach einer Einführung in die Grundlagen der Reibung und Reibungsmanipulation von Festkörpern und Pulvern sowie der Charakterisierung von Pulvern wird das Pulvertransportsystem auf Basis der Reibungsmanipulation inklusive der Leistungselektronik und der Ansteuerungshardware vorgestellt. Eine Sensitivitätsanalyse zeigt, dass die Anregungsparameter des Pulvertransportsystems ein großes Optimierungspotential aufweisen. Es wird ein effizientes, modulares Modell des Pulvertransportsystems vorgestellt, welches neben dem eigentlichen Modell des Transportprozesses ein Modell der Rohrschwingung und ein kennlinienbasiertes Modell des Pulver-Rohrkontakts beinhaltet. Mithilfe des Modells des Pulvertransportsystems werden Anregungsparameter hinsichtlich Amplituden und Frequenzen der auftretenden Schwingungen sowie der Schaltzeiten des Ultraschallpulses optimiert. }},
  author       = {{Dunst, Paul}},
  isbn         = {{	978-3-8440-8899-1}},
  keywords     = {{Ultraschall, Pulvertransport, Modellierung, Optimierung, Reibung, Adhäsion, Kohäsion, Reibungsmanipulation}},
  pages        = {{150}},
  publisher    = {{Shaker}},
  title        = {{{Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse}}},
  volume       = {{14}},
  year         = {{2023}},
}

@article{44672,
  abstract     = {{With enhancing digitalization, condition monitoring is used in an increasing number of application fields across various industrial sectors. By its application, increased reliability as well as reduced risks and costs can be achieved. Based on different approaches, technical systems are monitored and measured data is analyzed to enable condition-based or predictive maintenance. To this end, machine learning approaches are usually implemented to diagnose the health states or predict the health index of the monitored system. However, these trained models are often black-box models, not intuitively explainable for a human. To overcome this shortcoming, a model-based approach based on physics is developed for piezoelectric bending actuators. Such a model enables a transparent representation of the system. Moreover, the model-based approach is extended by a parameter-estimation to account for sudden changes in behavior e. g. caused by occurring cracks.}},
  author       = {{Bender, Amelie}},
  issn         = {{0924-4247}},
  journal      = {{Sensors and Actuators A: Physical}},
  keywords     = {{Condition Monitoring, Model-based approach Diagnostics, Varying conditions, Explainability, Piezoelectric bending actuators}},
  publisher    = {{Elsevier BV}},
  title        = {{{Model-based condition monitoring of piezoelectric bending actuators}}},
  doi          = {{10.1016/j.sna.2023.114399}},
  volume       = {{357}},
  year         = {{2023}},
}

@inproceedings{46813,
  abstract     = {{Modelling of dynamic systems plays an important role in many engineering disciplines. Two different approaches are physical modelling and data‐driven modelling, both of which have their respective advantages and disadvantages. By combining these two approaches, hybrid models can be created in which the respective disadvantages are mitigated, with discrepancy models being a particular subclass. Here, the basic system behaviour is described physically, that is, in the form of differential equations. Inaccuracies resulting from insufficient modelling or numerics lead to a discrepancy between the measurements and the model, which can be compensated by a data‐driven error correction term. Since discrepancy methods still require a large amount of measurement data, this paper investigates the extent to which a single discrepancy model can be trained for a physical model with additional parameter dependencies without the need for retraining. As an example, a damped electromagnetic oscillating circuit is used. The physical model is realised by a differential equation describing the electric current, considering only inductance and capacitance; dissipation due to resistance is neglected. This creates a discrepancy between measurement and model, which is corrected by a data‐driven model. In the experiments, the inductance and the capacity are varied. It is found that the same data‐driven model can only be used if additional parametric dependencies in the data‐driven term are considered as well.}},
  author       = {{Wohlleben, Meike Claudia and Muth, Lars and Peitz, Sebastian and Sextro, Walter}},
  booktitle    = {{Proceedings in Applied Mathematics and Mechanics}},
  issn         = {{1617-7061}},
  keywords     = {{Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics}},
  publisher    = {{Wiley}},
  title        = {{{Transferability of a discrepancy model for the dynamics of electromagnetic oscillating circuits}}},
  doi          = {{10.1002/pamm.202300039}},
  year         = {{2023}},
}

@inproceedings{47234,
  author       = {{Sehlmeyer, Birte and Kampmann, Rebecca  and Scheidemann, Claus and Hemsel, Tobias and Getzlaff, Mathias }},
  booktitle    = {{Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM)}},
  location     = {{Dresden}},
  title        = {{{Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells}}},
  year         = {{2023}},
}

@inproceedings{47235,
  author       = {{Kampmann, Rebecca and Sehlmeyer, Birte and Scheidemann, Claus and Hemsel, Tobias and Getzlaff, Mathias}},
  booktitle    = {{Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM)}},
  location     = {{Dresden}},
  title        = {{{Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells}}},
  year         = {{2023}},
}

@inproceedings{51117,
  author       = {{Scheidemann, Claus and Hemsel, Tobias and Friesen, Olga and Claes, Leander and Sextro, Walter}},
  location     = {{Jeju, Korea}},
  title        = {{{Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics}}},
  year         = {{2023}},
}

@phdthesis{34272,
  abstract     = {{Das Ultraschall-Dickdrahtbonden mit Aluminiumdraht ist ein Standardverfahren zur elektrischenKontaktierung von Leistungshalbleitermodulen. Die steigenden Anforderungen an die Effizienzund Zuverlässigkeit der Module haben zu technologischen Weiterentwicklungen geführt und eswerden vermehrt Kupferdrähte mit wesentlich besseren elektrischen und thermischen Eigenschafteneingesetzt. Hieraus resultieren durch höhere Prozesskräfte und Ultraschallleistung neueHerausforderungen bei der Prozessentwicklung; hierfür wird ein Simulationsmodell zur Verbesserungder Prozessentwicklung entwickelt.In Ultraschall-Drahtbondversuchen mit 400 m Aluminium und Kupfer Drähten wurde der Einflussder Prozessparameter auf die Bondqualität untersucht; diese Ergebnisse und zusätzliche Messungender Drahtdeformation und Schwingungen wurden für die Formulierung der Anforderungenund zur Validierung der Ergebnisse des Simulationsmodells genutzt.Es wurde ein Prozessmodell, basierend auf einer Co-Simulation zwischen MATLAB und ANSYS,entwickelt; hierbei wurden die phyiskalischen Phänomene wie die Ultraschall Werkstoffentfestigung,der Verbindungsaufbau und die dynamischen Systemeigenschaften abgebildet.Basierend auf einer Zug-Druck-Prüfmaschine wurde ein Prüfstand zur Identifikation der Modellparameterentwickelt. In zusätzlichen Druckversuchen mit den Bonddrähten mit und ohneUltraschallanregung wurde die Reduktion der Umformkräfte unter Ultraschalleinfluss untersucht.Mit dem entwickelten Prozessmodell wurden die Parameterstudien aus den Ultraschall-Drahtbondversuchensimuliert und direkt mit den experimentellen Ergebnissen verglichen, wobei sich einerelativ gute Übereinstimmung zwischen Simulation und Messung sowohl für Aluminium, als auchfür Kupfer, erzielen ließ.}},
  author       = {{Schemmel, Reinhard}},
  isbn         = {{	978-3-8440-8527-3}},
  pages        = {{174}},
  publisher    = {{Shaker}},
  title        = {{{Enhanced process development by simulation of ultrasonic heavy wire bonding}}},
  doi          = {{10.17619/UNIPB/1-1280}},
  volume       = {{13}},
  year         = {{2022}},
}

@inproceedings{29934,
  abstract     = {{Tire and road wear are a major source of emissions of nonexhaust particulate matter (PM) and make up the largest share of microplastics in the environment. To reduce tire wear through numerical optimization of a vehicle's suspension system, fast simulations of the representative usage of a vehicle are needed. Therefore, this contribution evaluates if instead of a full simulation of a representative test drive, only specific driving maneuvers resulting from a clustering of the driving data can be used to predict tire wear. As a measure for tire wear, the friction work between tire and road is calculated. It is shown that enough clusters result in negligible deviations between the total friction work of the full simulation and the cluster simulations as well as between the distributions of the friction work over the tire width. The calculation time can be reduced to about 1% of the full simulation.}},
  author       = {{Muth, Lars and Noll, Christian and Sextro, Walter}},
  booktitle    = {{Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021}},
  editor       = {{Orlova, Anna and Cole, David}},
  isbn         = {{978-3-031-07304-5}},
  keywords     = {{Tire Wear, Vehicle Dynamics, Clustering, Virtual Test}},
  location     = {{Saint Petersburg, Russia}},
  publisher    = {{Springer}},
  title        = {{{Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data}}},
  doi          = {{10.1007/978-3-031-07305-2_92}},
  year         = {{2022}},
}

@inbook{33500,
  abstract     = {{This article is dedicated to piezoelectric ultrasonic power transducers that differ to well known medical ultrasonic diagnostic apparatus or non destructive testing devices by the level of power in use; typically several tens of up to more than thousand watts are used in a multitude of different applications. After a short introduction including historical development, the first focus is on theoretical background of the operating principle, design and mechanical modeling. As piezoelectric elements transform electrical to mechanical energy and vice versa, equivalent circuit modeling is also described. After that, sample applications are delineated by the matter wherein ultrasound generates unique effects: incredible high pressure level as well in air as in water, micro-bubbles generating temperature peaks for very short time instances in fluids, acoustoplastic effect, enhancement of diffusion and recrystallization in solids, friction manipulation, incremental deformation and micro-cracking of surfaces, or even generation of macroscopic movements in motors. At the end, some future directions ranging from novel modeling approaches to advanced control and new materials are addressed.}},
  author       = {{Hemsel, Tobias and Twiefel, Jens}},
  booktitle    = {{Reference Module in Materials Science and Materials Engineering}},
  isbn         = {{978-0-12-803581-8}},
  keywords     = {{Equivalent circuit model, Langevin transducer, Lumped parameter model, Piezoelectric transducer, Ultrasonic processes, Ultrasound}},
  publisher    = {{Elsevier}},
  title        = {{{Piezoelectric Ultrasonic Power Transducers}}},
  doi          = {{10.1016/b978-0-12-819728-8.00047-4}},
  year         = {{2022}},
}

@techreport{52045,
  author       = {{Scheidemann, Claus and Hemsel, Tobias and Sextro, Walter}},
  publisher    = {{LibreCat University}},
  title        = {{{Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen}}},
  doi          = {{10.2314/KXP:1879655276}},
  year         = {{2022}},
}

@inbook{29727,
  author       = {{Wohlleben, Meike Claudia and Bender, Amelie and Peitz, Sebastian and Sextro, Walter}},
  booktitle    = {{Machine Learning, Optimization, and Data Science}},
  isbn         = {{9783030954697}},
  issn         = {{0302-9743}},
  publisher    = {{Springer International Publishing}},
  title        = {{{Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction}}},
  doi          = {{10.1007/978-3-030-95470-3_8}},
  year         = {{2022}},
}

@inproceedings{30371,
  abstract     = {{To achieve optimum bond results at ultrasonic bonding thick copper wire on sensitive components is quite challenging.
Bearing in mind that high normal force and ultrasonic power are needed for bond quality but as well increase stress and finally failure risk of the substrate, methods should be found to achieve high bond quality even at lower bond parameters. Therefore, bond experiments with different bond tool grove geometries have been conducted for copper and aluminum wire on direct copper bonded (DCB) substrates to investigate the impact of geometric parameters on bond formation and bond quality. The wire material depending impact of geometry changes on the bond formation and deformation was quantified. Additionally, a bonding parameter design of experiments (DOE) has been conducted for the reference and the most promising groove geometry. Higher shear values were achieved at reduced vertical tool displacement for most bonding parameter combinations, compared to the reference tool. This behavior allows for reducing ultrasonic power to obtain equal shear values; consequently, mechanical stresses in the interface decrease. This could potentially reduce the risk of chip damage and thus yield loss.}},
  author       = {{Hagedorn, Oliver Ernst Caspar and Broll, Marian and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}},
  booktitle    = {{CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems}},
  isbn         = {{ISBN 978-3-8007-5757-2 }},
  location     = {{Berlin}},
  pages        = {{138--143}},
  publisher    = {{VDE VERLAG GMBH}},
  title        = {{{Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding}}},
  year         = {{2022}},
}

@misc{47159,
  author       = {{Aimiyekagbon, Osarenren Kennedy and Bender, Amelie and Sextro, Walter}},
  booktitle    = {{ Condition Monitor}},
  issn         = {{0268-8050}},
  number       = {{425}},
  pages        = {{5 -- 10}},
  title        = {{{On the applicability of time series features as health indicators for technical systems operating under varying conditions}}},
  year         = {{2022}},
}

@inproceedings{34104,
  abstract     = {{ue to the constantly growing energy demand of power electronics and the need to reduce the size of electronic components like power modules for e-mobility, new challenges arise for ultrasonic wire bonding: the electrical connection must endure higher thermal and mechanical stress while the connecting partners become more sensitive or require more energy to get bonded. Past investigations have shown already that multi-dimensional ultrasonic bonding and welding yield the same or even better bond quality while reducing the load on the components. This contribution is intended to show whether multidi-mensional thick wire bonding is a promising concept to over-come the new challenges. The focus is on experimental investi-gations of different bond tool trajectories in ultrasonic wire bonding of aluminum and copper wire on DCB's and chips. The bond quality is analyzed by shear tests, microsections and, in the case of aluminum bonding, by a new machine learning method for an objective automated evaluation of the sheared area.}},
  author       = {{Scheidemann, Claus and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}},
  booktitle    = {{2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)}},
  publisher    = {{IEEE}},
  title        = {{{Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding}}},
  doi          = {{10.1109/estc55720.2022.9939478}},
  year         = {{2022}},
}

