[{"article_number":"521","issue":"3","intvolume":" 13","_id":"51518","citation":{"bibtex":"@article{Aimiyekagbon_Bender_Hemsel_Sextro_2024, title={Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions}, volume={13}, DOI={10.3390/electronics13030521}, number={3521}, journal={Electronics}, publisher={MDPI AG}, author={Aimiyekagbon, Osarenren Kennedy and Bender, Amelie and Hemsel, Tobias and Sextro, Walter}, year={2024} }","mla":"Aimiyekagbon, Osarenren Kennedy, et al. “Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions.” Electronics, vol. 13, no. 3, 521, MDPI AG, 2024, doi:10.3390/electronics13030521.","apa":"Aimiyekagbon, O. K., Bender, A., Hemsel, T., & Sextro, W. (2024). Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions. Electronics, 13(3), Article 521. https://doi.org/10.3390/electronics13030521","ama":"Aimiyekagbon OK, Bender A, Hemsel T, Sextro W. Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions. Electronics. 2024;13(3). doi:10.3390/electronics13030521","chicago":"Aimiyekagbon, Osarenren Kennedy, Amelie Bender, Tobias Hemsel, and Walter Sextro. “Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions.” Electronics 13, no. 3 (2024). https://doi.org/10.3390/electronics13030521.","ieee":"O. K. Aimiyekagbon, A. Bender, T. Hemsel, and W. Sextro, “Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions,” Electronics, vol. 13, no. 3, Art. no. 521, 2024, doi: 10.3390/electronics13030521.","short":"O.K. Aimiyekagbon, A. Bender, T. Hemsel, W. Sextro, Electronics 13 (2024)."},"year":"2024","type":"journal_article","funded_apc":"1","user_id":"9557","abstract":[{"text":"In applications of piezoelectric actuators and sensors, the dependability and particularly the reliability throughout their lifetime are vital to manufacturers and end-users and are enabled through condition-monitoring approaches. Existing approaches often utilize impedance measurements over a range of frequencies or velocity measurements and require additional equipment or sensors, such as a laser Doppler vibrometer. Furthermore, the non-negligible effects of varying operating conditions are often unconsidered. To minimize the need for additional sensors while maintaining the dependability of piezoelectric bending actuators irrespective of varying operating conditions, an online diagnostics approach is proposed. To this end, time- and frequency-domain features are extracted from monitored current signals to reflect hairline crack development in bending actuators. For validation of applicability, the presented analysis method was evaluated on piezoelectric bending actuators subjected to accelerated lifetime tests at varying voltage amplitudes and under external damping conditions. In the presence of a crack and due to a diminished stiffness, the resonance frequency decreases and the root-mean-square amplitude of the current signal simultaneously abruptly drops during the lifetime tests. Furthermore, the piezoelectric crack surfaces clapping is reflected in higher harmonics of the current signal. Thus, time-domain features and harmonics of the current signals are sufficient to diagnose hairline cracks in the actuators.","lang":"eng"}],"article_type":"original","volume":13,"date_created":"2024-02-20T06:46:43Z","status":"public","publication":"Electronics","keyword":["piezoelectric transducer","self-sensing","fault detection","diagnostics","hairline crack","condition monitoring"],"author":[{"full_name":"Aimiyekagbon, Osarenren Kennedy","first_name":"Osarenren Kennedy","id":"9557","last_name":"Aimiyekagbon"},{"first_name":"Amelie","full_name":"Bender, Amelie","last_name":"Bender","id":"54290"},{"first_name":"Tobias","full_name":"Hemsel, Tobias","last_name":"Hemsel","id":"210"},{"id":"21220","last_name":"Sextro","full_name":"Sextro, Walter","first_name":"Walter"}],"quality_controlled":"1","publisher":"MDPI AG","doi":"10.3390/electronics13030521","date_updated":"2024-03-15T16:15:56Z","language":[{"iso":"eng"}],"title":"Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions","publication_identifier":{"issn":["2079-9292"]},"publication_status":"published","department":[{"_id":"151"}]},{"series_title":"Schriften des Lehrstuhls für Dynamik und Mechatronik","language":[{"iso":"ger"}],"date_updated":"2024-03-18T11:32:27Z","department":[{"_id":"151"}],"publication_status":"published","publication_identifier":{"isbn":["9783844093964"]},"place":"Düren","title":"Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten","related_material":{"link":[{"relation":"confirmation","url":"https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-9396-4&search=yes"}]},"page":"134","year":"2024","type":"dissertation","citation":{"mla":"Dymel, Collin. Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten. Shaker Verlag, 2024.","bibtex":"@book{Dymel_2024, place={Düren}, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten}, volume={16}, publisher={Shaker Verlag}, author={Dymel, Collin}, year={2024}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }","chicago":"Dymel, Collin. Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten. Vol. 16. Schriften des Lehrstuhls für Dynamik und Mechatronik. Düren: Shaker Verlag, 2024.","ama":"Dymel C. Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten. Vol 16. Shaker Verlag; 2024.","apa":"Dymel, C. (2024). Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten (Vol. 16). Shaker Verlag.","ieee":"C. Dymel, Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten, vol. 16. Düren: Shaker Verlag, 2024.","short":"C. Dymel, Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten, Shaker Verlag, Düren, 2024."},"intvolume":" 16","_id":"52611","keyword":["Nichtlineares piezoelektrisches Verhalten","Dehnungsabhängigkeit","Vorspannungseinfluss","Temperatureinfluss","Lasteinfluss","Langevin-Schwinger","Ultraschallwandler","Ultraschallbonden","FEM-Modell","Ultraschallschweißen","BVD-Modell"],"author":[{"last_name":"Dymel","full_name":"Dymel, Collin","first_name":"Collin"}],"publisher":"Shaker Verlag","volume":16,"jel":["D3"],"date_created":"2024-03-18T11:13:27Z","status":"public","abstract":[{"lang":"ger","text":"Ultraschallsysteme für das Herstellen für Bond- und Schweißverbindungen in der Halbleiterfertigung zeigen auf Grund des Betriebes unter hohen Anregungsniveaus nichtlineare Materialeigenschaften. Dabei wirken unterschiedliche Einflussfaktoren auf die elektrischen Eigenschaften und die mechanischen Übertragungscharakteristiken der Ultraschallsysteme ein. Die Herausforderungen ein solches geprägtes System auszulegen oder effizient und zuverlässig zu betreiben, sind aufgrund der Nichtlinearitäten relativ groß.\r\nDa für die Beschreibung der nichtlinearen Materialbeziehungen nur wenige Modelle und kaum quantitative Angaben vorliegen, werden die komplexen Wechselwirkungen von Materialparametern, Geometrie und Vorspannung des Schwingers, Betriebsgrößen (Strom, Spannung), Temperatur und Prozesslasten durch systematische Untersuchungen von Keramiken und Langevin-Schwingern messtechnisch erfasst. Aus den Messergebnissen werden einerseits eindimensionale Modelle für Voruntersuchungen als auch vollständige Materialparametersätze für die Simulation mittels dreidimensionaler FE-Modelle hergeleitet.\r\nEine Methodik zur Ermittlung der Materialparameter und ein auf iterativen Simulationen von FE-Modellen basierendes Werkzeug zur Simulation der komplexen Wechselwirkungen werden vorgestellt. Anhand eines exemplarischen Ultraschallsystems wird gezeigt, dass die Wirkungen temperaturbedingter Vorspannungsverluste, Änderungen des elektrischen Klemmenverhaltens und Amplituden- und Frequenzänderungen während des Betriebes bei großen Amplituden und Prozesslasten durch die Variationen des Keramikvolumens und der Keramikposition positiv beeinflusst werden können."}],"user_id":"55222"},{"publisher":"Shaker","author":[{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"}],"keyword":["heavy copper bonding","wire bonding","quality prediction","friction model","point-contact-element"],"status":"public","date_created":"2023-02-10T13:05:19Z","volume":15,"abstract":[{"text":"Ultraschall-Drahtbonden ist eine Standardtechnologie im Bereich der Aufbau- und Verbindungstechnik von Leistungshalbleitermodulen. Um Prozessschritte und damit wertvolle Zeit zu sparen, sollen die Kupferdickdrähte für die Leistungshalbleiter auch für die Kontaktierung von eingespritzten Anschlusssteckern im Modulrahmen verwendet werden. Das Kontaktierungsverfahren mit diesen Drähten auf Steckern in dünnwandigen Kunststoffrahmen führt häufig zu unzureichender Bondqualität. In dieser Arbeit wird das Bonden von Anschlusssteckern experimentell und anhand von Simulationen untersucht, um die Prozessstabilität zu steigern.\r\n\r\nZunächst wurden Experimente auf Untergründen mit hoher Steifigkeit durchgeführt, um Störgrößen von Untergrundeigenschaften zu verringern. Die gewonnenen Erkenntnisse erlaubten die Entwicklung eines Simulationsmodells für die Vorhersage der Bondqualität. Dieses basiert auf einer flächenaufgelösten Reibarbeitsbestimmung im Fügebereich unter Berücksichtigung des Ultraschallerweichungseffektes und der hierdurch entstehenden hohen Drahtverformung.\r\n\r\nExperimente an den Anschlusssteckern im Modulrahmen zeigten eine verringerte Relativverschiebung zwischen Draht und Stecker, was zu einer deutlichen Verringerung der Reibarbeit führt. Außerdem wurden verminderte Schwingamplituden des Bondwerkzeugs nachgewiesen. Dies führt zu einer weiteren Reduktion der Reibarbeit. Beide Effekte wurden mithilfe eines Mehrmassenschwingers modelliert. Die gewonnenen Erkenntnisse und die erstellten Simulationsmodelle ermöglichen die Entwicklung von Klemmvorrichtungen, welche die identifizierten Störgrößen gezielt kompensieren und so ein verlässliches Bonden der Anschlussstecker im gleichen Prozessschritt ermöglichen, in dem auch die Leistungshalbleiter kontaktiert werden.","lang":"ger"}],"extern":"1","user_id":"55222","main_file_link":[{"url":"https://katalog.ub.uni-paderborn.de/local/r/9925085762506463?sr[q,any]=Simon%20Althoff"}],"supervisor":[{"full_name":"Sextro, Walter","first_name":"Walter","id":"21220","last_name":"Sextro"}],"type":"dissertation","year":"2023","citation":{"ama":"Althoff S. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol 15. Shaker; 2023.","apa":"Althoff, S. (2023). Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach (Vol. 15). Shaker.","chicago":"Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol. 15. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2023.","mla":"Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Shaker, 2023.","bibtex":"@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }","short":"S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.","ieee":"S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach, vol. 15. Shaker, 2023."},"page":"192","_id":"41971","intvolume":" 15","department":[{"_id":"151"}],"publication_identifier":{"isbn":["978-3-8440-8903-5"]},"publication_status":"published","related_material":{"link":[{"url":"https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8903-5&search=yes","relation":"confirmation"}]},"title":"Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach","series_title":"Schriften des Lehrstuhls für Dynamik und Mechatronik","language":[{"iso":"eng"}],"date_updated":"2023-02-10T13:05:42Z"},{"date_updated":"2023-02-10T13:07:40Z","series_title":"Schriften des Lehrstuhls für Dynamik und Mechatronik","language":[{"iso":"ger"}],"title":"Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse","related_material":{"link":[{"relation":"confirmation","url":"https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8899-1&search=yes"}]},"department":[{"_id":"151"}],"publication_identifier":{"isbn":["\t978-3-8440-8899-1"]},"publication_status":"published","intvolume":" 14","_id":"41970","main_file_link":[{"url":"https://katalog.ub.uni-paderborn.de/local/r/9925085666806463?sr[q,any]=paul%20dunst"}],"citation":{"bibtex":"@book{Dunst_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse}, volume={14}, publisher={Shaker}, author={Dunst, Paul}, year={2023}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }","mla":"Dunst, Paul. Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse. Shaker, 2023.","chicago":"Dunst, Paul. Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse. Vol. 14. Schriften des Lehrstuhls für Dynamik und Mechatronik. Shaker, 2023.","apa":"Dunst, P. (2023). Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse (Vol. 14). Shaker.","ama":"Dunst P. Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse. Vol 14. Shaker; 2023.","ieee":"P. Dunst, Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse, vol. 14. Shaker, 2023.","short":"P. Dunst, Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse, Shaker, 2023."},"year":"2023","type":"dissertation","page":"150","supervisor":[{"full_name":"Sextro, Walter","first_name":"Walter","id":"21220","last_name":"Sextro"}],"extern":"1","abstract":[{"lang":"ger","text":"Der Transport feiner Pulver mit in der Regel sehr hohen adhäsiven und kohäsiven Eigenschaften stellt für viele konventionelle Transportsysteme eine große Herausforderung dar. Durch die Anwendung von Ultraschallschwingungen können insbesondere die hohen adhäsiven Kontaktkräfte und damit auch die Reibungseigenschaften manipuliert werden.\r\n\r\nEin neu entwickeltes Pulvertransportsystem nutzt Ultraschallschwingungen, um die effektiven Tangentialkräfte im Pulver-Rohrkontakt zu reduzieren. Durch den koordinierten Einsatz von Ultraschallpulsen während einer niederfrequenten harmonischen Axialschwingung des Transportrohres wird ein kontinuierlicher Pulvertransport ermöglicht. Nach einer Einführung in die Grundlagen der Reibung und Reibungsmanipulation von Festkörpern und Pulvern sowie der Charakterisierung von Pulvern wird das Pulvertransportsystem auf Basis der Reibungsmanipulation inklusive der Leistungselektronik und der Ansteuerungshardware vorgestellt. Eine Sensitivitätsanalyse zeigt, dass die Anregungsparameter des Pulvertransportsystems ein großes Optimierungspotential aufweisen. Es wird ein effizientes, modulares Modell des Pulvertransportsystems vorgestellt, welches neben dem eigentlichen Modell des Transportprozesses ein Modell der Rohrschwingung und ein kennlinienbasiertes Modell des Pulver-Rohrkontakts beinhaltet. Mithilfe des Modells des Pulvertransportsystems werden Anregungsparameter hinsichtlich Amplituden und Frequenzen der auftretenden Schwingungen sowie der Schaltzeiten des Ultraschallpulses optimiert. "}],"user_id":"55222","author":[{"id":"22130","last_name":"Dunst","full_name":"Dunst, Paul","first_name":"Paul"}],"publisher":"Shaker","keyword":["Ultraschall","Pulvertransport","Modellierung","Optimierung","Reibung","Adhäsion","Kohäsion","Reibungsmanipulation"],"jel":["D3"],"volume":14,"status":"public","date_created":"2023-02-10T12:58:42Z"},{"language":[{"iso":"eng"}],"oa":"1","doi":"10.1016/j.sna.2023.114399","date_updated":"2023-05-09T09:53:31Z","publication_status":"published","publication_identifier":{"issn":["0924-4247"]},"department":[{"_id":"151"}],"title":"Model-based condition monitoring of piezoelectric bending actuators","citation":{"ama":"Bender A. Model-based condition monitoring of piezoelectric bending actuators. Sensors and Actuators A: Physical. 2023;357. doi:10.1016/j.sna.2023.114399","apa":"Bender, A. (2023). Model-based condition monitoring of piezoelectric bending actuators. Sensors and Actuators A: Physical, 357, Article 114399. https://doi.org/10.1016/j.sna.2023.114399","chicago":"Bender, Amelie. “Model-Based Condition Monitoring of Piezoelectric Bending Actuators.” Sensors and Actuators A: Physical 357 (2023). https://doi.org/10.1016/j.sna.2023.114399.","mla":"Bender, Amelie. “Model-Based Condition Monitoring of Piezoelectric Bending Actuators.” Sensors and Actuators A: Physical, vol. 357, 114399, Elsevier BV, 2023, doi:10.1016/j.sna.2023.114399.","bibtex":"@article{Bender_2023, title={Model-based condition monitoring of piezoelectric bending actuators}, volume={357}, DOI={10.1016/j.sna.2023.114399}, number={114399}, journal={Sensors and Actuators A: Physical}, publisher={Elsevier BV}, author={Bender, Amelie}, year={2023} }","short":"A. Bender, Sensors and Actuators A: Physical 357 (2023).","ieee":"A. Bender, “Model-based condition monitoring of piezoelectric bending actuators,” Sensors and Actuators A: Physical, vol. 357, Art. no. 114399, 2023, doi: 10.1016/j.sna.2023.114399."},"year":"2023","type":"journal_article","main_file_link":[{"open_access":"1","url":"https://authors.elsevier.com/a/1h2WV3IC9dF7Hm"}],"article_number":"114399","_id":"44672","intvolume":" 357","status":"public","date_created":"2023-05-09T09:49:44Z","volume":357,"author":[{"first_name":"Amelie","full_name":"Bender, Amelie","last_name":"Bender","id":"54290"}],"quality_controlled":"1","publisher":"Elsevier BV","keyword":["Condition Monitoring","Model-based approach Diagnostics","Varying conditions","Explainability","Piezoelectric bending actuators"],"publication":"Sensors and Actuators A: Physical","user_id":"54290","article_type":"original","abstract":[{"lang":"eng","text":"With enhancing digitalization, condition monitoring is used in an increasing number of application fields across various industrial sectors. By its application, increased reliability as well as reduced risks and costs can be achieved. Based on different approaches, technical systems are monitored and measured data is analyzed to enable condition-based or predictive maintenance. To this end, machine learning approaches are usually implemented to diagnose the health states or predict the health index of the monitored system. However, these trained models are often black-box models, not intuitively explainable for a human. To overcome this shortcoming, a model-based approach based on physics is developed for piezoelectric bending actuators. Such a model enables a transparent representation of the system. Moreover, the model-based approach is extended by a parameter-estimation to account for sudden changes in behavior e. g. caused by occurring cracks."}]},{"language":[{"iso":"eng"}],"doi":"10.1002/pamm.202300039","oa":"1","date_updated":"2023-09-21T14:47:20Z","publication_status":"published","publication_identifier":{"issn":["1617-7061","1617-7061"]},"department":[{"_id":"655"},{"_id":"151"}],"title":"Transferability of a discrepancy model for the dynamics of electromagnetic oscillating circuits","year":"2023","type":"conference","citation":{"bibtex":"@inproceedings{Wohlleben_Muth_Peitz_Sextro_2023, title={Transferability of a discrepancy model for the dynamics of electromagnetic oscillating circuits}, DOI={10.1002/pamm.202300039}, booktitle={Proceedings in Applied Mathematics and Mechanics}, publisher={Wiley}, author={Wohlleben, Meike Claudia and Muth, Lars and Peitz, Sebastian and Sextro, Walter}, year={2023} }","mla":"Wohlleben, Meike Claudia, et al. “Transferability of a Discrepancy Model for the Dynamics of Electromagnetic Oscillating Circuits.” Proceedings in Applied Mathematics and Mechanics, Wiley, 2023, doi:10.1002/pamm.202300039.","apa":"Wohlleben, M. C., Muth, L., Peitz, S., & Sextro, W. (2023). Transferability of a discrepancy model for the dynamics of electromagnetic oscillating circuits. Proceedings in Applied Mathematics and Mechanics. https://doi.org/10.1002/pamm.202300039","ama":"Wohlleben MC, Muth L, Peitz S, Sextro W. Transferability of a discrepancy model for the dynamics of electromagnetic oscillating circuits. In: Proceedings in Applied Mathematics and Mechanics. Wiley; 2023. doi:10.1002/pamm.202300039","chicago":"Wohlleben, Meike Claudia, Lars Muth, Sebastian Peitz, and Walter Sextro. “Transferability of a Discrepancy Model for the Dynamics of Electromagnetic Oscillating Circuits.” In Proceedings in Applied Mathematics and Mechanics. Wiley, 2023. https://doi.org/10.1002/pamm.202300039.","ieee":"M. C. Wohlleben, L. Muth, S. Peitz, and W. Sextro, “Transferability of a discrepancy model for the dynamics of electromagnetic oscillating circuits,” 2023, doi: 10.1002/pamm.202300039.","short":"M.C. Wohlleben, L. Muth, S. Peitz, W. Sextro, in: Proceedings in Applied Mathematics and Mechanics, Wiley, 2023."},"main_file_link":[{"open_access":"1","url":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/pamm.202300039"}],"_id":"46813","date_created":"2023-09-06T05:18:05Z","status":"public","keyword":["Electrical and Electronic Engineering","Atomic and Molecular Physics","and Optics"],"publication":"Proceedings in Applied Mathematics and Mechanics","publisher":"Wiley","quality_controlled":"1","author":[{"id":"43991","last_name":"Wohlleben","orcid":"0009-0009-9767-7168","full_name":"Wohlleben, Meike Claudia","first_name":"Meike Claudia"},{"last_name":"Muth","id":"77313","first_name":"Lars","full_name":"Muth, Lars","orcid":"0000-0002-2938-5616"},{"full_name":"Peitz, Sebastian","orcid":"0000-0002-3389-793X","first_name":"Sebastian","id":"47427","last_name":"Peitz"},{"last_name":"Sextro","id":"21220","first_name":"Walter","full_name":"Sextro, Walter"}],"user_id":"77313","abstract":[{"lang":"eng","text":"Modelling of dynamic systems plays an important role in many engineering disciplines. Two different approaches are physical modelling and data‐driven modelling, both of which have their respective advantages and disadvantages. By combining these two approaches, hybrid models can be created in which the respective disadvantages are mitigated, with discrepancy models being a particular subclass. Here, the basic system behaviour is described physically, that is, in the form of differential equations. Inaccuracies resulting from insufficient modelling or numerics lead to a discrepancy between the measurements and the model, which can be compensated by a data‐driven error correction term. Since discrepancy methods still require a large amount of measurement data, this paper investigates the extent to which a single discrepancy model can be trained for a physical model with additional parameter dependencies without the need for retraining. As an example, a damped electromagnetic oscillating circuit is used. The physical model is realised by a differential equation describing the electric current, considering only inductance and capacitance; dissipation due to resistance is neglected. This creates a discrepancy between measurement and model, which is corrected by a data‐driven model. In the experiments, the inductance and the capacity are varied. It is found that the same data‐driven model can only be used if additional parametric dependencies in the data‐driven term are considered as well."}]},{"language":[{"iso":"eng"}],"date_updated":"2023-09-21T14:51:27Z","oa":"1","doi":"10.36001/phmap.2023.v4i1.3596","department":[{"_id":"151"}],"title":"Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System","main_file_link":[{"url":"https://www.papers.phmsociety.org/index.php/phmap/article/view/3596","open_access":"1"}],"year":"2023","type":"conference","citation":{"mla":"Aimiyekagbon, Osarenren Kennedy, et al. “Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System.” Proceedings of the Asia Pacific Conference of the PHM Society 2023 , vol. 4, no. 1, 2023, doi:10.36001/phmap.2023.v4i1.3596.","bibtex":"@inproceedings{Aimiyekagbon_Löwen_Bender_Muth_Sextro_2023, title={Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System}, volume={4}, DOI={10.36001/phmap.2023.v4i1.3596}, number={1}, booktitle={Proceedings of the Asia Pacific Conference of the PHM Society 2023 }, author={Aimiyekagbon, Osarenren Kennedy and Löwen, Alexander and Bender, Amelie and Muth, Lars and Sextro, Walter}, year={2023} }","chicago":"Aimiyekagbon, Osarenren Kennedy, Alexander Löwen, Amelie Bender, Lars Muth, and Walter Sextro. “Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System.” In Proceedings of the Asia Pacific Conference of the PHM Society 2023 , Vol. 4, 2023. https://doi.org/10.36001/phmap.2023.v4i1.3596.","apa":"Aimiyekagbon, O. K., Löwen, A., Bender, A., Muth, L., & Sextro, W. (2023). Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System. Proceedings of the Asia Pacific Conference of the PHM Society 2023 , 4(1). https://doi.org/10.36001/phmap.2023.v4i1.3596","ama":"Aimiyekagbon OK, Löwen A, Bender A, Muth L, Sextro W. Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System. In: Proceedings of the Asia Pacific Conference of the PHM Society 2023 . Vol 4. ; 2023. doi:10.36001/phmap.2023.v4i1.3596","ieee":"O. K. Aimiyekagbon, A. Löwen, A. Bender, L. Muth, and W. Sextro, “Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System,” in Proceedings of the Asia Pacific Conference of the PHM Society 2023 , 2023, vol. 4, no. 1, doi: 10.36001/phmap.2023.v4i1.3596.","short":"O.K. Aimiyekagbon, A. Löwen, A. Bender, L. Muth, W. Sextro, in: Proceedings of the Asia Pacific Conference of the PHM Society 2023 , 2023."},"_id":"47116","intvolume":" 4","issue":"1","keyword":["PHM","Fault Diagnostics","Multiple Fault Modes","Expert-Informed Diagnostics","Anomaly Detection"],"publication":"Proceedings of the Asia Pacific Conference of the PHM Society 2023 ","author":[{"first_name":"Osarenren Kennedy","full_name":"Aimiyekagbon, Osarenren Kennedy","last_name":"Aimiyekagbon","id":"9557"},{"last_name":"Löwen","full_name":"Löwen, Alexander","first_name":"Alexander"},{"first_name":"Amelie","full_name":"Bender, Amelie","last_name":"Bender","id":"54290"},{"last_name":"Muth","id":"77313","first_name":"Lars","orcid":"0000-0002-2938-5616","full_name":"Muth, Lars"},{"first_name":"Walter","full_name":"Sextro, Walter","last_name":"Sextro","id":"21220"}],"quality_controlled":"1","date_created":"2023-09-18T07:52:32Z","status":"public","volume":4,"abstract":[{"text":"This paper presents a comprehensive study on diagnosing a spacecraft propulsion system utilizing data provided by the Prognostics and Health Management (PHM) society, specifically obtained as part of the Asia-Pacific PHM conference’s data challenge 2023. The objective of the challenge is to identify and diagnose known faults as well as unknown anomalies in the spacecraft’s propulsion system, which is critical for ensuring the spacecraft’s proper functionality and safety. To address this challenge, the proposed method follows a systematic approach of feature extraction, feature selection, and model development. The models employed in this study are kMeans clustering and decision trees combined to ensembles, enriched with expert knowledge. With the method presented, our team was capable of reaching high accuracy in identifying anomalies as well as diagnosing faults, resulting in attaining the seventh place with a score of 93.08 %.","lang":"eng"}],"user_id":"77313"},{"corporate_editor":["Deutsche Physikalische Gesellschaft e. V."],"conference":{"name":"Deutsche Physikalische Gesellschaft e. V., Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM) ","start_date":"2023-03-26","location":"Dresden","end_date":"2023-03-31"},"date_updated":"2023-09-28T09:58:48Z","_id":"47234","language":[{"iso":"eng"}],"year":"2023","type":"conference_abstract","citation":{"short":"B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), 2023.","ieee":"B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), Dresden, 2023.","chicago":"Sehlmeyer, Birte, Rebecca Kampmann, Claus Scheidemann, Tobias Hemsel, and Mathias Getzlaff. “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.","ama":"Sehlmeyer B, Kampmann R, Scheidemann C, Hemsel T, Getzlaff M. Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells. In: Deutsche Physikalische Gesellschaft e. V., ed. Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM). ; 2023.","apa":"Sehlmeyer, B., Kampmann, R., Scheidemann, C., Hemsel, T., & Getzlaff, M. (2023). Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells. In Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM).","bibtex":"@inproceedings{Sehlmeyer_Kampmann_Scheidemann_Hemsel_Getzlaff_2023, title={Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells}, booktitle={Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM)}, author={Sehlmeyer, Birte and Kampmann, Rebecca and Scheidemann, Claus and Hemsel, Tobias and Getzlaff, Mathias }, editor={Deutsche Physikalische Gesellschaft e. V.}, year={2023} }","mla":"Sehlmeyer, Birte, et al. “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells.” Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023."},"related_material":{"link":[{"url":"https://www.dpg-verhandlungen.de/year/2023/conference/skm/part/bp/session/28/contribution/27","relation":"confirmation"}]},"user_id":"210","title":"Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells","date_created":"2023-09-22T12:13:25Z","status":"public","publication":"Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM)","department":[{"_id":"151"}],"author":[{"last_name":"Sehlmeyer","first_name":"Birte","full_name":"Sehlmeyer, Birte"},{"first_name":"Rebecca ","full_name":"Kampmann, Rebecca ","last_name":"Kampmann"},{"last_name":"Scheidemann","id":"38259","first_name":"Claus","full_name":"Scheidemann, Claus"},{"full_name":"Hemsel, Tobias","first_name":"Tobias","id":"210","last_name":"Hemsel"},{"first_name":"Mathias ","full_name":"Getzlaff, Mathias ","last_name":"Getzlaff"}]},{"title":"Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells","user_id":"210","related_material":{"link":[{"relation":"confirmation","url":"https://www.dpg-verhandlungen.de/year/2023/conference/skm/part/bp/session/28/contribution/26"}]},"date_created":"2023-09-22T12:19:07Z","status":"public","publication":"Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM)","department":[{"_id":"151"}],"author":[{"last_name":"Kampmann","first_name":"Rebecca","full_name":"Kampmann, Rebecca"},{"first_name":"Birte","full_name":"Sehlmeyer, Birte","last_name":"Sehlmeyer"},{"last_name":"Scheidemann","id":"38259","first_name":"Claus","full_name":"Scheidemann, Claus"},{"first_name":"Tobias","full_name":"Hemsel, Tobias","last_name":"Hemsel","id":"210"},{"last_name":"Getzlaff","full_name":"Getzlaff, Mathias","first_name":"Mathias"}],"corporate_editor":["Deutsche Physikalische Gesellschaft e. V."],"conference":{"end_date":"2023-03-31","location":"Dresden","name":"Deutsche Physikalische Gesellschaft e. V., Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM)","start_date":"2023-03-26"},"_id":"47235","date_updated":"2023-09-28T09:54:55Z","type":"conference_abstract","citation":{"ieee":"R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), Dresden, 2023.","short":"R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), 2023.","mla":"Kampmann, Rebecca, et al. “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells.” Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.","bibtex":"@inproceedings{Kampmann_Sehlmeyer_Scheidemann_Hemsel_Getzlaff_2023, title={Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells}, booktitle={Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM)}, author={Kampmann, Rebecca and Sehlmeyer, Birte and Scheidemann, Claus and Hemsel, Tobias and Getzlaff, Mathias}, editor={Deutsche Physikalische Gesellschaft e. V.}, year={2023} }","apa":"Kampmann, R., Sehlmeyer, B., Scheidemann, C., Hemsel, T., & Getzlaff, M. (2023). Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells. In Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM).","ama":"Kampmann R, Sehlmeyer B, Scheidemann C, Hemsel T, Getzlaff M. Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells. In: Deutsche Physikalische Gesellschaft e. V., ed. Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM). ; 2023.","chicago":"Kampmann, Rebecca, Birte Sehlmeyer, Claus Scheidemann, Tobias Hemsel, and Mathias Getzlaff. “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023."},"year":"2023","language":[{"iso":"eng"}]},{"type":"conference_abstract","year":"2023","citation":{"short":"C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.","ieee":"C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the 7th International Conference on Advanced Electromaterials (ICAE 2023), Jeju, Korea, 2023.","chicago":"Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” 2023.","ama":"Scheidemann C, Hemsel T, Friesen O, Claes L, Sextro W. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. In: ; 2023.","apa":"Scheidemann, C., Hemsel, T., Friesen, O., Claes, L., & Sextro, W. (2023). Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. 7th International Conference on Advanced Electromaterials (ICAE 2023), Jeju, Korea.","bibtex":"@inproceedings{Scheidemann_Hemsel_Friesen_Claes_Sextro_2023, title={Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics}, author={Scheidemann, Claus and Hemsel, Tobias and Friesen, Olga and Claes, Leander and Sextro, Walter}, year={2023} }","mla":"Scheidemann, Claus, et al. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. 2023."},"language":[{"iso":"eng"}],"conference":{"end_date":"2023-11-03","location":"Jeju, Korea","start_date":"2023-10-31","name":"7th International Conference on Advanced Electromaterials (ICAE 2023)"},"_id":"51117","date_updated":"2024-02-01T16:54:33Z","department":[{"_id":"151"},{"_id":"49"}],"author":[{"id":"38259","last_name":"Scheidemann","full_name":"Scheidemann, Claus","first_name":"Claus"},{"first_name":"Tobias","full_name":"Hemsel, Tobias","last_name":"Hemsel","id":"210"},{"last_name":"Friesen","id":"44026","first_name":"Olga","full_name":"Friesen, Olga"},{"last_name":"Claes","id":"11829","first_name":"Leander","orcid":"0000-0002-4393-268X","full_name":"Claes, Leander"},{"last_name":"Sextro","id":"21220","first_name":"Walter","full_name":"Sextro, Walter"}],"date_created":"2024-02-01T15:55:44Z","project":[{"grant_number":"FOR 5208","name":"NEPTUN: Modellbasierte Bestimmung nichtlinearer Eigenschaften von Piezokeramiken für Leistungsschallanwendungen","_id":"108"}],"status":"public","title":"Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics","user_id":"38259"},{"language":[{"iso":"eng"}],"type":"conference_abstract","citation":{"ieee":"C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Incheon, Korea, 2023.","short":"C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.","bibtex":"@inproceedings{Scheidemann_Hemsel_Friesen_Claes_Sextro_2023, title={Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics}, author={Scheidemann, Claus and Hemsel, Tobias and Friesen, Olga and Claes, Leander and Sextro, Walter}, year={2023} }","mla":"Scheidemann, Claus, et al. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. 2023.","chicago":"Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” 2023.","ama":"Scheidemann C, Hemsel T, Friesen O, Claes L, Sextro W. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. In: ; 2023.","apa":"Scheidemann, C., Hemsel, T., Friesen, O., Claes, L., & Sextro, W. (2023). Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Incheon, Korea."},"year":"2023","conference":{"location":"Incheon, Korea","name":"International Conference on Functional Materials & Devices 2023 (ICFMD 2023)"},"date_updated":"2024-02-01T16:55:09Z","_id":"51118","date_created":"2024-02-01T16:00:19Z","project":[{"grant_number":"FOR 5208","name":"NEPTUN: Modellbasierte Bestimmung nichtlinearer Eigenschaften von Piezokeramiken für Leistungsschallanwendungen","_id":"108"}],"status":"public","department":[{"_id":"151"},{"_id":"49"}],"author":[{"id":"38259","last_name":"Scheidemann","full_name":"Scheidemann, Claus","first_name":"Claus"},{"first_name":"Tobias","full_name":"Hemsel, Tobias","last_name":"Hemsel","id":"210"},{"full_name":"Friesen, Olga","first_name":"Olga","id":"44026","last_name":"Friesen"},{"full_name":"Claes, Leander","orcid":"0000-0002-4393-268X","first_name":"Leander","id":"11829","last_name":"Claes"},{"full_name":"Sextro, Walter","first_name":"Walter","id":"21220","last_name":"Sextro"}],"user_id":"38259","title":"Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics"},{"title":"Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process","user_id":"38259","status":"public","date_created":"2024-02-01T16:03:41Z","author":[{"last_name":"Scheidemann","id":"38259","first_name":"Claus","full_name":"Scheidemann, Claus"},{"first_name":"Oliver Ernst Caspar","full_name":"Hagedorn, Oliver Ernst Caspar","last_name":"Hagedorn","id":"53321"},{"last_name":"Hemsel","id":"210","first_name":"Tobias","full_name":"Hemsel, Tobias"},{"last_name":"Sextro","id":"21220","first_name":"Walter","full_name":"Sextro, Walter"}],"department":[{"_id":"151"}],"date_updated":"2024-02-01T16:04:33Z","_id":"51119","conference":{"end_date":"2023-11-03","start_date":"2023-10-31","name":"International Conference on Functional Materials & Devices 2023 (ICFMD 2023)","location":"Jeju, Korea"},"citation":{"short":"C. Scheidemann, O.E.C. Hagedorn, T. Hemsel, W. Sextro, in: 2023.","ama":"Scheidemann C, Hagedorn OEC, Hemsel T, Sextro W. Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. In: ; 2023.","apa":"Scheidemann, C., Hagedorn, O. E. C., Hemsel, T., & Sextro, W. (2023). Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Jeju, Korea.","chicago":"Scheidemann, Claus, Oliver Ernst Caspar Hagedorn, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” 2023.","ieee":"C. Scheidemann, O. E. C. Hagedorn, T. Hemsel, and W. Sextro, “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” presented at the International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Jeju, Korea, 2023.","bibtex":"@inproceedings{Scheidemann_Hagedorn_Hemsel_Sextro_2023, title={Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process}, author={Scheidemann, Claus and Hagedorn, Oliver Ernst Caspar and Hemsel, Tobias and Sextro, Walter}, year={2023} }","mla":"Scheidemann, Claus, et al. Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. 2023."},"year":"2023","type":"conference_abstract","language":[{"iso":"eng"}]},{"date_updated":"2024-03-12T13:15:28Z","series_title":"VDI-Berichte","language":[{"iso":"ger"}],"title":"Einfluss der Radhubkinematik auf den Reifenverschleiß","department":[{"_id":"151"}],"publication_status":"published","publication_identifier":{"unknown":["978-3-18-092425-0"]},"conference":{"end_date":"2023-11-09","location":"Karlsruhe","start_date":"2023-11-08","name":"20. VDI Fachtagung Reifen - Fahrwerk - Fahrbahn"},"intvolume":" 2425","_id":"51338","page":"165-180","year":"2023","citation":{"short":"J. Schütte, W. Sextro, in: 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn, VDI Verlag GmbH, 2023, pp. 165–180.","ieee":"J. Schütte and W. Sextro, “Einfluss der Radhubkinematik auf den Reifenverschleiß,” in 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn, vol. 2425, VDI Verlag GmbH, 2023, pp. 165–180.","chicago":"Schütte, Jan, and Walter Sextro. “Einfluss der Radhubkinematik auf den Reifenverschleiß.” In 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn, 2425:165–80. VDI-Berichte. VDI Verlag GmbH, 2023.","ama":"Schütte J, Sextro W. Einfluss der Radhubkinematik auf den Reifenverschleiß. In: 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn. Vol 2425. VDI-Berichte. VDI Verlag GmbH; 2023:165-180.","apa":"Schütte, J., & Sextro, W. (2023). Einfluss der Radhubkinematik auf den Reifenverschleiß. In 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn (Vol. 2425, pp. 165–180). VDI Verlag GmbH.","bibtex":"@inbook{Schütte_Sextro_2023, series={VDI-Berichte}, title={Einfluss der Radhubkinematik auf den Reifenverschleiß}, volume={2425}, booktitle={20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn}, publisher={VDI Verlag GmbH}, author={Schütte, Jan and Sextro, Walter}, year={2023}, pages={165–180}, collection={VDI-Berichte} }","mla":"Schütte, Jan, and Walter Sextro. “Einfluss der Radhubkinematik auf den Reifenverschleiß.” 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn, vol. 2425, VDI Verlag GmbH, 2023, pp. 165–80."},"type":"book_chapter","user_id":"22109","publication":"20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn","author":[{"orcid":"0000-0001-9025-9742","full_name":"Schütte, Jan","first_name":"Jan","id":"22109","last_name":"Schütte"},{"first_name":"Walter","full_name":"Sextro, Walter","last_name":"Sextro","id":"21220"}],"publisher":"VDI Verlag GmbH","date_created":"2024-02-13T11:29:58Z","status":"public","volume":2425},{"user_id":"210","abstract":[{"text":"Das Ultraschall-Dickdrahtbonden mit Aluminiumdraht ist ein Standardverfahren zur elektrischenKontaktierung von Leistungshalbleitermodulen. Die steigenden Anforderungen an die Effizienzund Zuverlässigkeit der Module haben zu technologischen Weiterentwicklungen geführt und eswerden vermehrt Kupferdrähte mit wesentlich besseren elektrischen und thermischen Eigenschafteneingesetzt. Hieraus resultieren durch höhere Prozesskräfte und Ultraschallleistung neueHerausforderungen bei der Prozessentwicklung; hierfür wird ein Simulationsmodell zur Verbesserungder Prozessentwicklung entwickelt.In Ultraschall-Drahtbondversuchen mit 400 m Aluminium und Kupfer Drähten wurde der Einflussder Prozessparameter auf die Bondqualität untersucht; diese Ergebnisse und zusätzliche Messungender Drahtdeformation und Schwingungen wurden für die Formulierung der Anforderungenund zur Validierung der Ergebnisse des Simulationsmodells genutzt.Es wurde ein Prozessmodell, basierend auf einer Co-Simulation zwischen MATLAB und ANSYS,entwickelt; hierbei wurden die phyiskalischen Phänomene wie die Ultraschall Werkstoffentfestigung,der Verbindungsaufbau und die dynamischen Systemeigenschaften abgebildet.Basierend auf einer Zug-Druck-Prüfmaschine wurde ein Prüfstand zur Identifikation der Modellparameterentwickelt. In zusätzlichen Druckversuchen mit den Bonddrähten mit und ohneUltraschallanregung wurde die Reduktion der Umformkräfte unter Ultraschalleinfluss untersucht.Mit dem entwickelten Prozessmodell wurden die Parameterstudien aus den Ultraschall-Drahtbondversuchensimuliert und direkt mit den experimentellen Ergebnissen verglichen, wobei sich einerelativ gute Übereinstimmung zwischen Simulation und Messung sowohl für Aluminium, als auchfür Kupfer, erzielen ließ.","lang":"ger"},{"text":"Ultrasonic heavy wire bonding with aluminium wire is a standard process to produce electricalcontacts in power semiconductor modules. The increasing demands on the efficiency and reliabilityof the modules have led to technological developments and copper wires with significantlybetter electrical and thermal properties are used more often nowadays. This results in new challengesin process development due to higher process forces and ultrasonic power; for this purpose,a simulation model is developed to improve process development.Ultrasonic wire bonding tests with 400 m aluminium and copper wires were carried out to investigatethe influence of the process parameters on the bond quality; these results and additionalmeasurements of wire deformation and vibrations were used to define the requirements for themodel and validate the results of the simulation.A process model based on a co-simulation was developed between MATLAB and ANSYS; thephysical phenomena such as ultrasonic softening of the wire material, bond formation and dynamicbehaviour of the components were considered.Based on a tensile-compression testing machine, a test rig was developed to identify the modelparameters. In additional compression tests with the wires with and without ultrasonic excitation,the reduction of the forming forces under ultrasonic influence was characterised.With the developed process model, the parameter studies from the ultrasonic wire bond testswere simulated and directly compared with the experimental results; a relative good agreementbetween simulation and measurement could be achieved for both aluminium and copper.","lang":"eng"}],"volume":13,"date_created":"2022-12-07T14:03:17Z","status":"public","author":[{"id":"28647","last_name":"Schemmel","full_name":"Schemmel, Reinhard","first_name":"Reinhard"}],"publisher":"Shaker","_id":"34272","intvolume":" 13","page":"174","citation":{"bibtex":"@book{Schemmel_2022, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Enhanced process development by simulation of ultrasonic heavy wire bonding}, volume={13}, DOI={10.17619/UNIPB/1-1280}, publisher={Shaker}, author={Schemmel, Reinhard}, year={2022}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }","mla":"Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Shaker, 2022, doi:10.17619/UNIPB/1-1280.","chicago":"Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Vol. 13. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2022. https://doi.org/10.17619/UNIPB/1-1280.","apa":"Schemmel, R. (2022). Enhanced process development by simulation of ultrasonic heavy wire bonding (Vol. 13). Shaker. https://doi.org/10.17619/UNIPB/1-1280","ama":"Schemmel R. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Vol 13. Shaker; 2022. doi:10.17619/UNIPB/1-1280","ieee":"R. Schemmel, Enhanced process development by simulation of ultrasonic heavy wire bonding, vol. 13. Shaker, 2022.","short":"R. Schemmel, Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding, Shaker, 2022."},"year":"2022","type":"dissertation","supervisor":[{"id":"21220","last_name":"Sextro","full_name":"Sextro, Walter","first_name":"Walter"}],"main_file_link":[{"open_access":"1","url":"https://digital.ub.uni-paderborn.de/hs/id/6223291"}],"title":"Enhanced process development by simulation of ultrasonic heavy wire bonding","related_material":{"link":[{"url":"https://www.shaker.eu/en/content/catalogue/index.asp?lang=en&ID=8&ISBN=978-3-8440-8527-3&search=yes","relation":"dissertation_contains"}]},"publication_identifier":{"isbn":["\t978-3-8440-8527-3"]},"publication_status":"published","department":[{"_id":"151"}],"doi":"10.17619/UNIPB/1-1280","oa":"1","date_updated":"2022-12-07T14:15:23Z","language":[{"iso":"eng"}],"series_title":"Schriften des Lehrstuhls für Dynamik und Mechatronik"},{"abstract":[{"text":"Tire and road wear are a major source of emissions of nonexhaust particulate matter (PM) and make up the largest share of microplastics in the environment. To reduce tire wear through numerical optimization of a vehicle's suspension system, fast simulations of the representative usage of a vehicle are needed. Therefore, this contribution evaluates if instead of a full simulation of a representative test drive, only specific driving maneuvers resulting from a clustering of the driving data can be used to predict tire wear. As a measure for tire wear, the friction work between tire and road is calculated. It is shown that enough clusters result in negligible deviations between the total friction work of the full simulation and the cluster simulations as well as between the distributions of the friction work over the tire width. The calculation time can be reduced to about 1% of the full simulation.","lang":"eng"}],"user_id":"77313","author":[{"first_name":"Lars","orcid":"0000-0002-2938-5616","full_name":"Muth, Lars","last_name":"Muth","id":"77313"},{"last_name":"Noll","full_name":"Noll, Christian","first_name":"Christian"},{"full_name":"Sextro, Walter","first_name":"Walter","id":"21220","last_name":"Sextro"}],"quality_controlled":"1","publisher":"Springer","publication":"Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021","keyword":["Tire Wear","Vehicle Dynamics","Clustering","Virtual Test"],"status":"public","date_created":"2022-02-21T14:14:11Z","_id":"29934","conference":{"location":"Saint Petersburg, Russia","start_date":"2021-08-17","name":"27th IAVSD Symposium on Dynamics of Vehicles on Roads and Tracks, IAVSD 2021","end_date":"2021-08-19"},"main_file_link":[{"url":"https://link.springer.com/chapter/10.1007/978-3-031-07305-2_92"}],"type":"conference","year":"2022","citation":{"short":"L. Muth, C. Noll, W. Sextro, in: A. Orlova, D. Cole (Eds.), Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021, Springer, Cham, 2022.","ieee":"L. Muth, C. Noll, and W. Sextro, “Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data,” in Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021, Saint Petersburg, Russia, 2022, doi: 10.1007/978-3-031-07305-2_92.","chicago":"Muth, Lars, Christian Noll, and Walter Sextro. “Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data.” In Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021, edited by Anna Orlova and David Cole. Lecture Notes in Mechanical Engineering. Cham: Springer, 2022. https://doi.org/10.1007/978-3-031-07305-2_92.","ama":"Muth L, Noll C, Sextro W. Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data. In: Orlova A, Cole D, eds. Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021. Lecture Notes in Mechanical Engineering. Springer; 2022. doi:10.1007/978-3-031-07305-2_92","apa":"Muth, L., Noll, C., & Sextro, W. (2022). Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data. In A. Orlova & D. Cole (Eds.), Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021. Springer. https://doi.org/10.1007/978-3-031-07305-2_92","bibtex":"@inproceedings{Muth_Noll_Sextro_2022, place={Cham}, series={Lecture Notes in Mechanical Engineering}, title={Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data}, DOI={10.1007/978-3-031-07305-2_92}, booktitle={Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021}, publisher={Springer}, author={Muth, Lars and Noll, Christian and Sextro, Walter}, editor={Orlova, Anna and Cole, David}, year={2022}, collection={Lecture Notes in Mechanical Engineering} }","mla":"Muth, Lars, et al. “Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data.” Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021, edited by Anna Orlova and David Cole, Springer, 2022, doi:10.1007/978-3-031-07305-2_92."},"place":"Cham","title":"Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data","department":[{"_id":"151"}],"editor":[{"last_name":"Orlova","full_name":"Orlova, Anna","first_name":"Anna"},{"full_name":"Cole, David","first_name":"David","last_name":"Cole"}],"publication_identifier":{"isbn":["978-3-031-07304-5"],"eisbn":["978-3-031-07305-2"]},"publication_status":"published","date_updated":"2022-08-23T11:55:07Z","doi":"10.1007/978-3-031-07305-2_92","series_title":"Lecture Notes in Mechanical Engineering","language":[{"iso":"eng"}]},{"abstract":[{"lang":"eng","text":"This article is dedicated to piezoelectric ultrasonic power transducers that differ to well known medical ultrasonic diagnostic apparatus or non destructive testing devices by the level of power in use; typically several tens of up to more than thousand watts are used in a multitude of different applications. After a short introduction including historical development, the first focus is on theoretical background of the operating principle, design and mechanical modeling. As piezoelectric elements transform electrical to mechanical energy and vice versa, equivalent circuit modeling is also described. After that, sample applications are delineated by the matter wherein ultrasound generates unique effects: incredible high pressure level as well in air as in water, micro-bubbles generating temperature peaks for very short time instances in fluids, acoustoplastic effect, enhancement of diffusion and recrystallization in solids, friction manipulation, incremental deformation and micro-cracking of surfaces, or even generation of macroscopic movements in motors. At the end, some future directions ranging from novel modeling approaches to advanced control and new materials are addressed."}],"user_id":"210","keyword":["Equivalent circuit model","Langevin transducer","Lumped parameter model","Piezoelectric transducer","Ultrasonic processes","Ultrasound"],"publication":"Reference Module in Materials Science and Materials Engineering","author":[{"id":"210","last_name":"Hemsel","full_name":"Hemsel, Tobias","first_name":"Tobias"},{"last_name":"Twiefel","first_name":"Jens","full_name":"Twiefel, Jens"}],"quality_controlled":"1","publisher":"Elsevier","date_created":"2022-09-30T09:35:16Z","status":"public","_id":"33500","main_file_link":[{"url":"https://www.sciencedirect.com/science/article/pii/B9780128197288000474"}],"type":"book_chapter","citation":{"mla":"Hemsel, Tobias, and Jens Twiefel. “Piezoelectric Ultrasonic Power Transducers.” Reference Module in Materials Science and Materials Engineering, Elsevier, 2022, doi:10.1016/b978-0-12-819728-8.00047-4.","bibtex":"@inbook{Hemsel_Twiefel_2022, title={Piezoelectric Ultrasonic Power Transducers}, DOI={10.1016/b978-0-12-819728-8.00047-4}, booktitle={Reference Module in Materials Science and Materials Engineering}, publisher={Elsevier}, author={Hemsel, Tobias and Twiefel, Jens}, year={2022} }","apa":"Hemsel, T., & Twiefel, J. (2022). Piezoelectric Ultrasonic Power Transducers. In Reference Module in Materials Science and Materials Engineering. Elsevier. https://doi.org/10.1016/b978-0-12-819728-8.00047-4","ama":"Hemsel T, Twiefel J. Piezoelectric Ultrasonic Power Transducers. In: Reference Module in Materials Science and Materials Engineering. Elsevier; 2022. doi:10.1016/b978-0-12-819728-8.00047-4","chicago":"Hemsel, Tobias, and Jens Twiefel. “Piezoelectric Ultrasonic Power Transducers.” In Reference Module in Materials Science and Materials Engineering. Elsevier, 2022. https://doi.org/10.1016/b978-0-12-819728-8.00047-4.","ieee":"T. Hemsel and J. Twiefel, “Piezoelectric Ultrasonic Power Transducers,” in Reference Module in Materials Science and Materials Engineering, Elsevier, 2022.","short":"T. Hemsel, J. Twiefel, in: Reference Module in Materials Science and Materials Engineering, Elsevier, 2022."},"year":"2022","title":"Piezoelectric Ultrasonic Power Transducers","department":[{"_id":"151"}],"publication_identifier":{"isbn":["978-0-12-803581-8"]},"publication_status":"published","date_updated":"2022-09-30T09:41:47Z","doi":"10.1016/b978-0-12-819728-8.00047-4","language":[{"iso":"eng"}]},{"_id":"29727","date_updated":"2023-04-26T12:10:58Z","doi":"10.1007/978-3-030-95470-3_8","main_file_link":[{"url":"https://link.springer.com/content/pdf/10.1007%2F978-3-030-95470-3_8.pdf"}],"language":[{"iso":"eng"}],"year":"2022","citation":{"apa":"Wohlleben, M. C., Bender, A., Peitz, S., & Sextro, W. (2022). Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction. In Machine Learning, Optimization, and Data Science. Springer International Publishing. https://doi.org/10.1007/978-3-030-95470-3_8","ama":"Wohlleben MC, Bender A, Peitz S, Sextro W. Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction. In: Machine Learning, Optimization, and Data Science. Springer International Publishing; 2022. doi:10.1007/978-3-030-95470-3_8","chicago":"Wohlleben, Meike Claudia, Amelie Bender, Sebastian Peitz, and Walter Sextro. “Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction.” In Machine Learning, Optimization, and Data Science. Cham: Springer International Publishing, 2022. https://doi.org/10.1007/978-3-030-95470-3_8.","bibtex":"@inbook{Wohlleben_Bender_Peitz_Sextro_2022, place={Cham}, title={Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction}, DOI={10.1007/978-3-030-95470-3_8}, booktitle={Machine Learning, Optimization, and Data Science}, publisher={Springer International Publishing}, author={Wohlleben, Meike Claudia and Bender, Amelie and Peitz, Sebastian and Sextro, Walter}, year={2022} }","mla":"Wohlleben, Meike Claudia, et al. “Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction.” Machine Learning, Optimization, and Data Science, Springer International Publishing, 2022, doi:10.1007/978-3-030-95470-3_8.","short":"M.C. Wohlleben, A. Bender, S. Peitz, W. Sextro, in: Machine Learning, Optimization, and Data Science, Springer International Publishing, Cham, 2022.","ieee":"M. C. Wohlleben, A. Bender, S. Peitz, and W. Sextro, “Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction,” in Machine Learning, Optimization, and Data Science, Cham: Springer International Publishing, 2022."},"type":"book_chapter","place":"Cham","user_id":"43991","title":"Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction","publication":"Machine Learning, Optimization, and Data Science","department":[{"_id":"151"},{"_id":"655"}],"author":[{"last_name":"Wohlleben","id":"43991","first_name":"Meike Claudia","full_name":"Wohlleben, Meike Claudia"},{"last_name":"Bender","id":"54290","first_name":"Amelie","full_name":"Bender, Amelie"},{"first_name":"Sebastian","full_name":"Peitz, Sebastian","orcid":"0000-0002-3389-793X","last_name":"Peitz","id":"47427"},{"last_name":"Sextro","id":"21220","first_name":"Walter","full_name":"Sextro, Walter"}],"publisher":"Springer International Publishing","quality_controlled":"1","date_created":"2022-02-03T10:30:23Z","status":"public","publication_status":"published","publication_identifier":{"isbn":["9783030954697","9783030954703"],"issn":["0302-9743","1611-3349"]}},{"abstract":[{"lang":"eng","text":"To achieve optimum bond results at ultrasonic bonding thick copper wire on sensitive components is quite challenging.\r\nBearing in mind that high normal force and ultrasonic power are needed for bond quality but as well increase stress and finally failure risk of the substrate, methods should be found to achieve high bond quality even at lower bond parameters. Therefore, bond experiments with different bond tool grove geometries have been conducted for copper and aluminum wire on direct copper bonded (DCB) substrates to investigate the impact of geometric parameters on bond formation and bond quality. The wire material depending impact of geometry changes on the bond formation and deformation was quantified. Additionally, a bonding parameter design of experiments (DOE) has been conducted for the reference and the most promising groove geometry. Higher shear values were achieved at reduced vertical tool displacement for most bonding parameter combinations, compared to the reference tool. This behavior allows for reducing ultrasonic power to obtain equal shear values; consequently, mechanical stresses in the interface decrease. This could potentially reduce the risk of chip damage and thus yield loss."}],"place":"Berlin","user_id":"210","title":"Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding","department":[{"_id":"151"}],"publication":"CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems","publisher":"VDE VERLAG GMBH","author":[{"last_name":"Hagedorn","id":"53321","first_name":"Oliver Ernst Caspar","full_name":"Hagedorn, Oliver Ernst Caspar"},{"last_name":"Broll","first_name":"Marian","full_name":"Broll, Marian"},{"last_name":"Kirsch","first_name":"Olaf","full_name":"Kirsch, Olaf"},{"last_name":"Hemsel","id":"210","first_name":"Tobias","full_name":"Hemsel, Tobias"},{"last_name":"Sextro","id":"21220","first_name":"Walter","full_name":"Sextro, Walter"}],"quality_controlled":"1","date_created":"2022-03-17T15:00:06Z","status":"public","publication_identifier":{"isbn":["ISBN 978-3-8007-5757-2 "]},"conference":{"location":"Berlin","start_date":"2022.03.15","name":"CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems","end_date":"2022.03.17"},"date_updated":"2023-09-21T14:22:17Z","_id":"30371","language":[{"iso":"eng"}],"page":"138-143","type":"conference","year":"2022","citation":{"ieee":"O. E. C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding,” in CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, Berlin, 2022, pp. 138–143.","short":"O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, Berlin, 2022, pp. 138–143.","mla":"Hagedorn, Oliver Ernst Caspar, et al. “Experimental Investigation of the Influence of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, 2022, pp. 138–43.","bibtex":"@inproceedings{Hagedorn_Broll_Kirsch_Hemsel_Sextro_2022, place={Berlin}, title={Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding}, booktitle={CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems}, publisher={VDE VERLAG GMBH}, author={Hagedorn, Oliver Ernst Caspar and Broll, Marian and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}, year={2022}, pages={138–143} }","ama":"Hagedorn OEC, Broll M, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. In: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems. VDE VERLAG GMBH; 2022:138-143.","apa":"Hagedorn, O. E. C., Broll, M., Kirsch, O., Hemsel, T., & Sextro, W. (2022). Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, 138–143.","chicago":"Hagedorn, Oliver Ernst Caspar, Marian Broll, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of the Influence of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” In CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, 138–43. Berlin: VDE VERLAG GMBH, 2022."}},{"publication_date":"2022-08","issue":"425","_id":"47159","date_updated":"2023-09-22T09:29:51Z","page":"5 - 10","year":"2022","citation":{"short":"O.K. Aimiyekagbon, A. Bender, W. Sextro, Condition Monitor (2022) 5–10.","ieee":"O. K. Aimiyekagbon, A. Bender, and W. Sextro, “On the applicability of time series features as health indicators for technical systems operating under varying conditions,” Condition Monitor, no. 425, pp. 5–10, 2022.","apa":"Aimiyekagbon, O. K., Bender, A., & Sextro, W. (2022). On the applicability of time series features as health indicators for technical systems operating under varying conditions. Condition Monitor, 425, 5–10.","ama":"Aimiyekagbon OK, Bender A, Sextro W. On the applicability of time series features as health indicators for technical systems operating under varying conditions. Condition Monitor. 2022:5-10.","chicago":"Aimiyekagbon, Osarenren Kennedy, Amelie Bender, and Walter Sextro. “On the Applicability of Time Series Features as Health Indicators for Technical Systems Operating under Varying Conditions.” Condition Monitor, 2022.","bibtex":"@article{Aimiyekagbon_Bender_Sextro_2022, title={On the applicability of time series features as health indicators for technical systems operating under varying conditions}, number={425}, journal={ Condition Monitor}, author={Aimiyekagbon, Osarenren Kennedy and Bender, Amelie and Sextro, Walter}, year={2022}, pages={5–10} }","mla":"Aimiyekagbon, Osarenren Kennedy, et al. “On the Applicability of Time Series Features as Health Indicators for Technical Systems Operating under Varying Conditions.” Condition Monitor, no. 425, 2022, pp. 5–10."},"type":"newspaper_article","language":[{"iso":"eng"}],"title":"On the applicability of time series features as health indicators for technical systems operating under varying conditions","user_id":"9557","publication_status":"published","publication_identifier":{"issn":["0268-8050"]},"date_created":"2023-09-22T09:25:48Z","status":"public","department":[{"_id":"151"}],"publication":" Condition Monitor","author":[{"full_name":"Aimiyekagbon, Osarenren Kennedy","first_name":"Osarenren Kennedy","id":"9557","last_name":"Aimiyekagbon"},{"full_name":"Bender, Amelie","first_name":"Amelie","id":"54290","last_name":"Bender"},{"last_name":"Sextro","id":"21220","first_name":"Walter","full_name":"Sextro, Walter"}]},{"language":[{"iso":"eng"}],"year":"2022","type":"conference","citation":{"apa":"Scheidemann, C., Kirsch, O., Hemsel, T., & Sextro, W. (2022). Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). https://doi.org/10.1109/estc55720.2022.9939478","ama":"Scheidemann C, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE; 2022. doi:10.1109/estc55720.2022.9939478","chicago":"Scheidemann, Claus, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE, 2022. https://doi.org/10.1109/estc55720.2022.9939478.","bibtex":"@inproceedings{Scheidemann_Kirsch_Hemsel_Sextro_2022, title={Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding}, DOI={10.1109/estc55720.2022.9939478}, booktitle={2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)}, publisher={IEEE}, author={Scheidemann, Claus and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}, year={2022} }","mla":"Scheidemann, Claus, et al. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022, doi:10.1109/estc55720.2022.9939478.","short":"C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.","ieee":"C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding,” 2022, doi: 10.1109/estc55720.2022.9939478."},"date_updated":"2023-09-22T12:24:18Z","_id":"34104","doi":"10.1109/estc55720.2022.9939478","department":[{"_id":"151"}],"publication":"2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)","author":[{"full_name":"Scheidemann, Claus","first_name":"Claus","id":"38259","last_name":"Scheidemann"},{"last_name":"Kirsch","full_name":"Kirsch, Olaf","first_name":"Olaf"},{"first_name":"Tobias","full_name":"Hemsel, Tobias","last_name":"Hemsel","id":"210"},{"first_name":"Walter","full_name":"Sextro, Walter","last_name":"Sextro","id":"21220"}],"quality_controlled":"1","publisher":"IEEE","date_created":"2022-11-17T15:17:39Z","status":"public","publication_status":"published","abstract":[{"text":"ue to the constantly growing energy demand of power electronics and the need to reduce the size of electronic components like power modules for e-mobility, new challenges arise for ultrasonic wire bonding: the electrical connection must endure higher thermal and mechanical stress while the connecting partners become more sensitive or require more energy to get bonded. Past investigations have shown already that multi-dimensional ultrasonic bonding and welding yield the same or even better bond quality while reducing the load on the components. This contribution is intended to show whether multidi-mensional thick wire bonding is a promising concept to over-come the new challenges. The focus is on experimental investi-gations of different bond tool trajectories in ultrasonic wire bonding of aluminum and copper wire on DCB's and chips. The bond quality is analyzed by shear tests, microsections and, in the case of aluminum bonding, by a new machine learning method for an objective automated evaluation of the sheared area.","lang":"eng"}],"user_id":"38259","title":"Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding"}]