--- _id: '51518' abstract: - lang: eng text: In applications of piezoelectric actuators and sensors, the dependability and particularly the reliability throughout their lifetime are vital to manufacturers and end-users and are enabled through condition-monitoring approaches. Existing approaches often utilize impedance measurements over a range of frequencies or velocity measurements and require additional equipment or sensors, such as a laser Doppler vibrometer. Furthermore, the non-negligible effects of varying operating conditions are often unconsidered. To minimize the need for additional sensors while maintaining the dependability of piezoelectric bending actuators irrespective of varying operating conditions, an online diagnostics approach is proposed. To this end, time- and frequency-domain features are extracted from monitored current signals to reflect hairline crack development in bending actuators. For validation of applicability, the presented analysis method was evaluated on piezoelectric bending actuators subjected to accelerated lifetime tests at varying voltage amplitudes and under external damping conditions. In the presence of a crack and due to a diminished stiffness, the resonance frequency decreases and the root-mean-square amplitude of the current signal simultaneously abruptly drops during the lifetime tests. Furthermore, the piezoelectric crack surfaces clapping is reflected in higher harmonics of the current signal. Thus, time-domain features and harmonics of the current signals are sufficient to diagnose hairline cracks in the actuators. article_number: '521' article_type: original author: - first_name: Osarenren Kennedy full_name: Aimiyekagbon, Osarenren Kennedy id: '9557' last_name: Aimiyekagbon - first_name: Amelie full_name: Bender, Amelie id: '54290' last_name: Bender - first_name: Tobias full_name: Hemsel, Tobias id: '210' last_name: Hemsel - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: Aimiyekagbon OK, Bender A, Hemsel T, Sextro W. Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions. Electronics. 2024;13(3). doi:10.3390/electronics13030521 apa: Aimiyekagbon, O. K., Bender, A., Hemsel, T., & Sextro, W. (2024). Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions. Electronics, 13(3), Article 521. https://doi.org/10.3390/electronics13030521 bibtex: '@article{Aimiyekagbon_Bender_Hemsel_Sextro_2024, title={Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions}, volume={13}, DOI={10.3390/electronics13030521}, number={3521}, journal={Electronics}, publisher={MDPI AG}, author={Aimiyekagbon, Osarenren Kennedy and Bender, Amelie and Hemsel, Tobias and Sextro, Walter}, year={2024} }' chicago: Aimiyekagbon, Osarenren Kennedy, Amelie Bender, Tobias Hemsel, and Walter Sextro. “Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions.” Electronics 13, no. 3 (2024). https://doi.org/10.3390/electronics13030521. ieee: 'O. K. Aimiyekagbon, A. Bender, T. Hemsel, and W. Sextro, “Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions,” Electronics, vol. 13, no. 3, Art. no. 521, 2024, doi: 10.3390/electronics13030521.' mla: Aimiyekagbon, Osarenren Kennedy, et al. “Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions.” Electronics, vol. 13, no. 3, 521, MDPI AG, 2024, doi:10.3390/electronics13030521. short: O.K. Aimiyekagbon, A. Bender, T. Hemsel, W. Sextro, Electronics 13 (2024). date_created: 2024-02-20T06:46:43Z date_updated: 2024-03-15T16:15:56Z department: - _id: '151' doi: 10.3390/electronics13030521 funded_apc: '1' intvolume: ' 13' issue: '3' keyword: - piezoelectric transducer - self-sensing - fault detection - diagnostics - hairline crack - condition monitoring language: - iso: eng publication: Electronics publication_identifier: issn: - 2079-9292 publication_status: published publisher: MDPI AG quality_controlled: '1' status: public title: Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions type: journal_article user_id: '9557' volume: 13 year: '2024' ... --- _id: '52611' abstract: - lang: ger text: "Ultraschallsysteme für das Herstellen für Bond- und Schweißverbindungen in der Halbleiterfertigung zeigen auf Grund des Betriebes unter hohen Anregungsniveaus nichtlineare Materialeigenschaften. Dabei wirken unterschiedliche Einflussfaktoren auf die elektrischen Eigenschaften und die mechanischen Übertragungscharakteristiken der Ultraschallsysteme ein. Die Herausforderungen ein solches geprägtes System auszulegen oder effizient und zuverlässig zu betreiben, sind aufgrund der Nichtlinearitäten relativ groß.\r\nDa für die Beschreibung der nichtlinearen Materialbeziehungen nur wenige Modelle und kaum quantitative Angaben vorliegen, werden die komplexen Wechselwirkungen von Materialparametern, Geometrie und Vorspannung des Schwingers, Betriebsgrößen (Strom, Spannung), Temperatur und Prozesslasten durch systematische Untersuchungen von Keramiken und Langevin-Schwingern messtechnisch erfasst. Aus den Messergebnissen werden einerseits eindimensionale Modelle für Voruntersuchungen als auch vollständige Materialparametersätze für die Simulation mittels dreidimensionaler FE-Modelle hergeleitet.\r\nEine Methodik zur Ermittlung der Materialparameter und ein auf iterativen Simulationen von FE-Modellen basierendes Werkzeug zur Simulation der komplexen Wechselwirkungen werden vorgestellt. Anhand eines exemplarischen Ultraschallsystems wird gezeigt, dass die Wirkungen temperaturbedingter Vorspannungsverluste, Änderungen des elektrischen Klemmenverhaltens und Amplituden- und Frequenzänderungen während des Betriebes bei großen Amplituden und Prozesslasten durch die Variationen des Keramikvolumens und der Keramikposition positiv beeinflusst werden können." author: - first_name: Collin full_name: Dymel, Collin last_name: Dymel citation: ama: Dymel C. Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten. Vol 16. Shaker Verlag; 2024. apa: Dymel, C. (2024). Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten (Vol. 16). Shaker Verlag. bibtex: '@book{Dymel_2024, place={Düren}, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten}, volume={16}, publisher={Shaker Verlag}, author={Dymel, Collin}, year={2024}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }' chicago: 'Dymel, Collin. Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten. Vol. 16. Schriften des Lehrstuhls für Dynamik und Mechatronik. Düren: Shaker Verlag, 2024.' ieee: 'C. Dymel, Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten, vol. 16. Düren: Shaker Verlag, 2024.' mla: Dymel, Collin. Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten. Shaker Verlag, 2024. short: C. Dymel, Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten, Shaker Verlag, Düren, 2024. date_created: 2024-03-18T11:13:27Z date_updated: 2024-03-18T11:32:27Z department: - _id: '151' intvolume: ' 16' jel: - D3 keyword: - Nichtlineares piezoelektrisches Verhalten - Dehnungsabhängigkeit - Vorspannungseinfluss - Temperatureinfluss - Lasteinfluss - Langevin-Schwinger - Ultraschallwandler - Ultraschallbonden - FEM-Modell - Ultraschallschweißen - BVD-Modell language: - iso: ger page: '134' place: Düren publication_identifier: isbn: - '9783844093964' publication_status: published publisher: Shaker Verlag related_material: link: - relation: confirmation url: https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-9396-4&search=yes series_title: Schriften des Lehrstuhls für Dynamik und Mechatronik status: public title: Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung von Nichtlinearitäten type: dissertation user_id: '55222' volume: 16 year: '2024' ... --- _id: '41971' abstract: - lang: ger text: "Ultraschall-Drahtbonden ist eine Standardtechnologie im Bereich der Aufbau- und Verbindungstechnik von Leistungshalbleitermodulen. Um Prozessschritte und damit wertvolle Zeit zu sparen, sollen die Kupferdickdrähte für die Leistungshalbleiter auch für die Kontaktierung von eingespritzten Anschlusssteckern im Modulrahmen verwendet werden. Das Kontaktierungsverfahren mit diesen Drähten auf Steckern in dünnwandigen Kunststoffrahmen führt häufig zu unzureichender Bondqualität. In dieser Arbeit wird das Bonden von Anschlusssteckern experimentell und anhand von Simulationen untersucht, um die Prozessstabilität zu steigern.\r\n\r\nZunächst wurden Experimente auf Untergründen mit hoher Steifigkeit durchgeführt, um Störgrößen von Untergrundeigenschaften zu verringern. Die gewonnenen Erkenntnisse erlaubten die Entwicklung eines Simulationsmodells für die Vorhersage der Bondqualität. Dieses basiert auf einer flächenaufgelösten Reibarbeitsbestimmung im Fügebereich unter Berücksichtigung des Ultraschallerweichungseffektes und der hierdurch entstehenden hohen Drahtverformung.\r\n\r\nExperimente an den Anschlusssteckern im Modulrahmen zeigten eine verringerte Relativverschiebung zwischen Draht und Stecker, was zu einer deutlichen Verringerung der Reibarbeit führt. Außerdem wurden verminderte Schwingamplituden des Bondwerkzeugs nachgewiesen. Dies führt zu einer weiteren Reduktion der Reibarbeit. Beide Effekte wurden mithilfe eines Mehrmassenschwingers modelliert. Die gewonnenen Erkenntnisse und die erstellten Simulationsmodelle ermöglichen die Entwicklung von Klemmvorrichtungen, welche die identifizierten Störgrößen gezielt kompensieren und so ein verlässliches Bonden der Anschlussstecker im gleichen Prozessschritt ermöglichen, in dem auch die Leistungshalbleiter kontaktiert werden." author: - first_name: Simon full_name: Althoff, Simon last_name: Althoff citation: ama: Althoff S. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol 15. Shaker; 2023. apa: Althoff, S. (2023). Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach (Vol. 15). Shaker. bibtex: '@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }' chicago: Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol. 15. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2023. ieee: S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach, vol. 15. Shaker, 2023. mla: Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Shaker, 2023. short: S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023. date_created: 2023-02-10T13:05:19Z date_updated: 2023-02-10T13:05:42Z department: - _id: '151' extern: '1' intvolume: ' 15' keyword: - heavy copper bonding - wire bonding - quality prediction - friction model - point-contact-element language: - iso: eng main_file_link: - url: https://katalog.ub.uni-paderborn.de/local/r/9925085762506463?sr[q,any]=Simon%20Althoff page: '192' publication_identifier: isbn: - 978-3-8440-8903-5 publication_status: published publisher: Shaker related_material: link: - relation: confirmation url: https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8903-5&search=yes series_title: Schriften des Lehrstuhls für Dynamik und Mechatronik status: public supervisor: - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro title: Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach type: dissertation user_id: '55222' volume: 15 year: '2023' ... --- _id: '41970' abstract: - lang: ger text: "Der Transport feiner Pulver mit in der Regel sehr hohen adhäsiven und kohäsiven Eigenschaften stellt für viele konventionelle Transportsysteme eine große Herausforderung dar. Durch die Anwendung von Ultraschallschwingungen können insbesondere die hohen adhäsiven Kontaktkräfte und damit auch die Reibungseigenschaften manipuliert werden.\r\n\r\nEin neu entwickeltes Pulvertransportsystem nutzt Ultraschallschwingungen, um die effektiven Tangentialkräfte im Pulver-Rohrkontakt zu reduzieren. Durch den koordinierten Einsatz von Ultraschallpulsen während einer niederfrequenten harmonischen Axialschwingung des Transportrohres wird ein kontinuierlicher Pulvertransport ermöglicht. Nach einer Einführung in die Grundlagen der Reibung und Reibungsmanipulation von Festkörpern und Pulvern sowie der Charakterisierung von Pulvern wird das Pulvertransportsystem auf Basis der Reibungsmanipulation inklusive der Leistungselektronik und der Ansteuerungshardware vorgestellt. Eine Sensitivitätsanalyse zeigt, dass die Anregungsparameter des Pulvertransportsystems ein großes Optimierungspotential aufweisen. Es wird ein effizientes, modulares Modell des Pulvertransportsystems vorgestellt, welches neben dem eigentlichen Modell des Transportprozesses ein Modell der Rohrschwingung und ein kennlinienbasiertes Modell des Pulver-Rohrkontakts beinhaltet. Mithilfe des Modells des Pulvertransportsystems werden Anregungsparameter hinsichtlich Amplituden und Frequenzen der auftretenden Schwingungen sowie der Schaltzeiten des Ultraschallpulses optimiert. " author: - first_name: Paul full_name: Dunst, Paul id: '22130' last_name: Dunst citation: ama: Dunst P. Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse. Vol 14. Shaker; 2023. apa: Dunst, P. (2023). Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse (Vol. 14). Shaker. bibtex: '@book{Dunst_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse}, volume={14}, publisher={Shaker}, author={Dunst, Paul}, year={2023}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }' chicago: Dunst, Paul. Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse. Vol. 14. Schriften des Lehrstuhls für Dynamik und Mechatronik. Shaker, 2023. ieee: P. Dunst, Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse, vol. 14. Shaker, 2023. mla: Dunst, Paul. Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse. Shaker, 2023. short: P. Dunst, Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse, Shaker, 2023. date_created: 2023-02-10T12:58:42Z date_updated: 2023-02-10T13:07:40Z department: - _id: '151' extern: '1' intvolume: ' 14' jel: - D3 keyword: - Ultraschall - Pulvertransport - Modellierung - Optimierung - Reibung - Adhäsion - Kohäsion - Reibungsmanipulation language: - iso: ger main_file_link: - url: https://katalog.ub.uni-paderborn.de/local/r/9925085666806463?sr[q,any]=paul%20dunst page: '150' publication_identifier: isbn: - "\t978-3-8440-8899-1" publication_status: published publisher: Shaker related_material: link: - relation: confirmation url: https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8899-1&search=yes series_title: Schriften des Lehrstuhls für Dynamik und Mechatronik status: public supervisor: - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro title: Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse type: dissertation user_id: '55222' volume: 14 year: '2023' ... --- _id: '44672' abstract: - lang: eng text: With enhancing digitalization, condition monitoring is used in an increasing number of application fields across various industrial sectors. By its application, increased reliability as well as reduced risks and costs can be achieved. Based on different approaches, technical systems are monitored and measured data is analyzed to enable condition-based or predictive maintenance. To this end, machine learning approaches are usually implemented to diagnose the health states or predict the health index of the monitored system. However, these trained models are often black-box models, not intuitively explainable for a human. To overcome this shortcoming, a model-based approach based on physics is developed for piezoelectric bending actuators. Such a model enables a transparent representation of the system. Moreover, the model-based approach is extended by a parameter-estimation to account for sudden changes in behavior e. g. caused by occurring cracks. article_number: '114399' article_type: original author: - first_name: Amelie full_name: Bender, Amelie id: '54290' last_name: Bender citation: ama: 'Bender A. Model-based condition monitoring of piezoelectric bending actuators. Sensors and Actuators A: Physical. 2023;357. doi:10.1016/j.sna.2023.114399' apa: 'Bender, A. (2023). Model-based condition monitoring of piezoelectric bending actuators. Sensors and Actuators A: Physical, 357, Article 114399. https://doi.org/10.1016/j.sna.2023.114399' bibtex: '@article{Bender_2023, title={Model-based condition monitoring of piezoelectric bending actuators}, volume={357}, DOI={10.1016/j.sna.2023.114399}, number={114399}, journal={Sensors and Actuators A: Physical}, publisher={Elsevier BV}, author={Bender, Amelie}, year={2023} }' chicago: 'Bender, Amelie. “Model-Based Condition Monitoring of Piezoelectric Bending Actuators.” Sensors and Actuators A: Physical 357 (2023). https://doi.org/10.1016/j.sna.2023.114399.' ieee: 'A. Bender, “Model-based condition monitoring of piezoelectric bending actuators,” Sensors and Actuators A: Physical, vol. 357, Art. no. 114399, 2023, doi: 10.1016/j.sna.2023.114399.' mla: 'Bender, Amelie. “Model-Based Condition Monitoring of Piezoelectric Bending Actuators.” Sensors and Actuators A: Physical, vol. 357, 114399, Elsevier BV, 2023, doi:10.1016/j.sna.2023.114399.' short: 'A. Bender, Sensors and Actuators A: Physical 357 (2023).' date_created: 2023-05-09T09:49:44Z date_updated: 2023-05-09T09:53:31Z department: - _id: '151' doi: 10.1016/j.sna.2023.114399 intvolume: ' 357' keyword: - Condition Monitoring - Model-based approach Diagnostics - Varying conditions - Explainability - Piezoelectric bending actuators language: - iso: eng main_file_link: - open_access: '1' url: https://authors.elsevier.com/a/1h2WV3IC9dF7Hm oa: '1' publication: 'Sensors and Actuators A: Physical' publication_identifier: issn: - 0924-4247 publication_status: published publisher: Elsevier BV quality_controlled: '1' status: public title: Model-based condition monitoring of piezoelectric bending actuators type: journal_article user_id: '54290' volume: 357 year: '2023' ... --- _id: '46813' abstract: - lang: eng text: Modelling of dynamic systems plays an important role in many engineering disciplines. Two different approaches are physical modelling and data‐driven modelling, both of which have their respective advantages and disadvantages. By combining these two approaches, hybrid models can be created in which the respective disadvantages are mitigated, with discrepancy models being a particular subclass. Here, the basic system behaviour is described physically, that is, in the form of differential equations. Inaccuracies resulting from insufficient modelling or numerics lead to a discrepancy between the measurements and the model, which can be compensated by a data‐driven error correction term. Since discrepancy methods still require a large amount of measurement data, this paper investigates the extent to which a single discrepancy model can be trained for a physical model with additional parameter dependencies without the need for retraining. As an example, a damped electromagnetic oscillating circuit is used. The physical model is realised by a differential equation describing the electric current, considering only inductance and capacitance; dissipation due to resistance is neglected. This creates a discrepancy between measurement and model, which is corrected by a data‐driven model. In the experiments, the inductance and the capacity are varied. It is found that the same data‐driven model can only be used if additional parametric dependencies in the data‐driven term are considered as well. author: - first_name: Meike Claudia full_name: Wohlleben, Meike Claudia id: '43991' last_name: Wohlleben orcid: 0009-0009-9767-7168 - first_name: Lars full_name: Muth, Lars id: '77313' last_name: Muth orcid: 0000-0002-2938-5616 - first_name: Sebastian full_name: Peitz, Sebastian id: '47427' last_name: Peitz orcid: 0000-0002-3389-793X - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Wohlleben MC, Muth L, Peitz S, Sextro W. Transferability of a discrepancy model for the dynamics of electromagnetic oscillating circuits. In: Proceedings in Applied Mathematics and Mechanics. Wiley; 2023. doi:10.1002/pamm.202300039' apa: Wohlleben, M. C., Muth, L., Peitz, S., & Sextro, W. (2023). Transferability of a discrepancy model for the dynamics of electromagnetic oscillating circuits. Proceedings in Applied Mathematics and Mechanics. https://doi.org/10.1002/pamm.202300039 bibtex: '@inproceedings{Wohlleben_Muth_Peitz_Sextro_2023, title={Transferability of a discrepancy model for the dynamics of electromagnetic oscillating circuits}, DOI={10.1002/pamm.202300039}, booktitle={Proceedings in Applied Mathematics and Mechanics}, publisher={Wiley}, author={Wohlleben, Meike Claudia and Muth, Lars and Peitz, Sebastian and Sextro, Walter}, year={2023} }' chicago: Wohlleben, Meike Claudia, Lars Muth, Sebastian Peitz, and Walter Sextro. “Transferability of a Discrepancy Model for the Dynamics of Electromagnetic Oscillating Circuits.” In Proceedings in Applied Mathematics and Mechanics. Wiley, 2023. https://doi.org/10.1002/pamm.202300039. ieee: 'M. C. Wohlleben, L. Muth, S. Peitz, and W. Sextro, “Transferability of a discrepancy model for the dynamics of electromagnetic oscillating circuits,” 2023, doi: 10.1002/pamm.202300039.' mla: Wohlleben, Meike Claudia, et al. “Transferability of a Discrepancy Model for the Dynamics of Electromagnetic Oscillating Circuits.” Proceedings in Applied Mathematics and Mechanics, Wiley, 2023, doi:10.1002/pamm.202300039. short: 'M.C. Wohlleben, L. Muth, S. Peitz, W. Sextro, in: Proceedings in Applied Mathematics and Mechanics, Wiley, 2023.' date_created: 2023-09-06T05:18:05Z date_updated: 2023-09-21T14:47:20Z department: - _id: '655' - _id: '151' doi: 10.1002/pamm.202300039 keyword: - Electrical and Electronic Engineering - Atomic and Molecular Physics - and Optics language: - iso: eng main_file_link: - open_access: '1' url: https://onlinelibrary.wiley.com/doi/epdf/10.1002/pamm.202300039 oa: '1' publication: Proceedings in Applied Mathematics and Mechanics publication_identifier: issn: - 1617-7061 - 1617-7061 publication_status: published publisher: Wiley quality_controlled: '1' status: public title: Transferability of a discrepancy model for the dynamics of electromagnetic oscillating circuits type: conference user_id: '77313' year: '2023' ... --- _id: '47116' abstract: - lang: eng text: This paper presents a comprehensive study on diagnosing a spacecraft propulsion system utilizing data provided by the Prognostics and Health Management (PHM) society, specifically obtained as part of the Asia-Pacific PHM conference’s data challenge 2023. The objective of the challenge is to identify and diagnose known faults as well as unknown anomalies in the spacecraft’s propulsion system, which is critical for ensuring the spacecraft’s proper functionality and safety. To address this challenge, the proposed method follows a systematic approach of feature extraction, feature selection, and model development. The models employed in this study are kMeans clustering and decision trees combined to ensembles, enriched with expert knowledge. With the method presented, our team was capable of reaching high accuracy in identifying anomalies as well as diagnosing faults, resulting in attaining the seventh place with a score of 93.08 %. author: - first_name: Osarenren Kennedy full_name: Aimiyekagbon, Osarenren Kennedy id: '9557' last_name: Aimiyekagbon - first_name: Alexander full_name: Löwen, Alexander last_name: Löwen - first_name: Amelie full_name: Bender, Amelie id: '54290' last_name: Bender - first_name: Lars full_name: Muth, Lars id: '77313' last_name: Muth orcid: 0000-0002-2938-5616 - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Aimiyekagbon OK, Löwen A, Bender A, Muth L, Sextro W. Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System. In: Proceedings of the Asia Pacific Conference of the PHM Society 2023 . Vol 4. ; 2023. doi:10.36001/phmap.2023.v4i1.3596' apa: Aimiyekagbon, O. K., Löwen, A., Bender, A., Muth, L., & Sextro, W. (2023). Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System. Proceedings of the Asia Pacific Conference of the PHM Society 2023 , 4(1). https://doi.org/10.36001/phmap.2023.v4i1.3596 bibtex: '@inproceedings{Aimiyekagbon_Löwen_Bender_Muth_Sextro_2023, title={Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System}, volume={4}, DOI={10.36001/phmap.2023.v4i1.3596}, number={1}, booktitle={Proceedings of the Asia Pacific Conference of the PHM Society 2023 }, author={Aimiyekagbon, Osarenren Kennedy and Löwen, Alexander and Bender, Amelie and Muth, Lars and Sextro, Walter}, year={2023} }' chicago: Aimiyekagbon, Osarenren Kennedy, Alexander Löwen, Amelie Bender, Lars Muth, and Walter Sextro. “Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System.” In Proceedings of the Asia Pacific Conference of the PHM Society 2023 , Vol. 4, 2023. https://doi.org/10.36001/phmap.2023.v4i1.3596. ieee: 'O. K. Aimiyekagbon, A. Löwen, A. Bender, L. Muth, and W. Sextro, “Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System,” in Proceedings of the Asia Pacific Conference of the PHM Society 2023 , 2023, vol. 4, no. 1, doi: 10.36001/phmap.2023.v4i1.3596.' mla: Aimiyekagbon, Osarenren Kennedy, et al. “Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System.” Proceedings of the Asia Pacific Conference of the PHM Society 2023 , vol. 4, no. 1, 2023, doi:10.36001/phmap.2023.v4i1.3596. short: 'O.K. Aimiyekagbon, A. Löwen, A. Bender, L. Muth, W. Sextro, in: Proceedings of the Asia Pacific Conference of the PHM Society 2023 , 2023.' date_created: 2023-09-18T07:52:32Z date_updated: 2023-09-21T14:51:27Z department: - _id: '151' doi: 10.36001/phmap.2023.v4i1.3596 intvolume: ' 4' issue: '1' keyword: - PHM - Fault Diagnostics - Multiple Fault Modes - Expert-Informed Diagnostics - Anomaly Detection language: - iso: eng main_file_link: - open_access: '1' url: https://www.papers.phmsociety.org/index.php/phmap/article/view/3596 oa: '1' publication: 'Proceedings of the Asia Pacific Conference of the PHM Society 2023 ' quality_controlled: '1' status: public title: Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System type: conference user_id: '77313' volume: 4 year: '2023' ... --- _id: '47234' author: - first_name: Birte full_name: Sehlmeyer, Birte last_name: Sehlmeyer - first_name: 'Rebecca ' full_name: 'Kampmann, Rebecca ' last_name: Kampmann - first_name: Claus full_name: Scheidemann, Claus id: '38259' last_name: Scheidemann - first_name: Tobias full_name: Hemsel, Tobias id: '210' last_name: Hemsel - first_name: 'Mathias ' full_name: 'Getzlaff, Mathias ' last_name: Getzlaff citation: ama: 'Sehlmeyer B, Kampmann R, Scheidemann C, Hemsel T, Getzlaff M. Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells. In: Deutsche Physikalische Gesellschaft e. V., ed. Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM). ; 2023.' apa: Sehlmeyer, B., Kampmann, R., Scheidemann, C., Hemsel, T., & Getzlaff, M. (2023). Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells. In Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM). bibtex: '@inproceedings{Sehlmeyer_Kampmann_Scheidemann_Hemsel_Getzlaff_2023, title={Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells}, booktitle={Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM)}, author={Sehlmeyer, Birte and Kampmann, Rebecca and Scheidemann, Claus and Hemsel, Tobias and Getzlaff, Mathias }, editor={Deutsche Physikalische Gesellschaft e. V.}, year={2023} }' chicago: Sehlmeyer, Birte, Rebecca Kampmann, Claus Scheidemann, Tobias Hemsel, and Mathias Getzlaff. “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023. ieee: B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), Dresden, 2023. mla: Sehlmeyer, Birte, et al. “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells.” Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023. short: 'B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), 2023.' conference: end_date: 2023-03-31 location: Dresden name: 'Deutsche Physikalische Gesellschaft e. V., Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM) ' start_date: 2023-03-26 corporate_editor: - Deutsche Physikalische Gesellschaft e. V. date_created: 2023-09-22T12:13:25Z date_updated: 2023-09-28T09:58:48Z department: - _id: '151' language: - iso: eng publication: Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM) related_material: link: - relation: confirmation url: https://www.dpg-verhandlungen.de/year/2023/conference/skm/part/bp/session/28/contribution/27 status: public title: Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells type: conference_abstract user_id: '210' year: '2023' ... --- _id: '47235' author: - first_name: Rebecca full_name: Kampmann, Rebecca last_name: Kampmann - first_name: Birte full_name: Sehlmeyer, Birte last_name: Sehlmeyer - first_name: Claus full_name: Scheidemann, Claus id: '38259' last_name: Scheidemann - first_name: Tobias full_name: Hemsel, Tobias id: '210' last_name: Hemsel - first_name: Mathias full_name: Getzlaff, Mathias last_name: Getzlaff citation: ama: 'Kampmann R, Sehlmeyer B, Scheidemann C, Hemsel T, Getzlaff M. Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells. In: Deutsche Physikalische Gesellschaft e. V., ed. Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM). ; 2023.' apa: Kampmann, R., Sehlmeyer, B., Scheidemann, C., Hemsel, T., & Getzlaff, M. (2023). Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells. In Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM). bibtex: '@inproceedings{Kampmann_Sehlmeyer_Scheidemann_Hemsel_Getzlaff_2023, title={Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells}, booktitle={Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM)}, author={Kampmann, Rebecca and Sehlmeyer, Birte and Scheidemann, Claus and Hemsel, Tobias and Getzlaff, Mathias}, editor={Deutsche Physikalische Gesellschaft e. V.}, year={2023} }' chicago: Kampmann, Rebecca, Birte Sehlmeyer, Claus Scheidemann, Tobias Hemsel, and Mathias Getzlaff. “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023. ieee: R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), Dresden, 2023. mla: Kampmann, Rebecca, et al. “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells.” Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023. short: 'R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), 2023.' conference: end_date: 2023-03-31 location: Dresden name: Deutsche Physikalische Gesellschaft e. V., Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM) start_date: 2023-03-26 corporate_editor: - Deutsche Physikalische Gesellschaft e. V. date_created: 2023-09-22T12:19:07Z date_updated: 2023-09-28T09:54:55Z department: - _id: '151' language: - iso: eng publication: Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM) related_material: link: - relation: confirmation url: https://www.dpg-verhandlungen.de/year/2023/conference/skm/part/bp/session/28/contribution/26 status: public title: Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells type: conference_abstract user_id: '210' year: '2023' ... --- _id: '51117' author: - first_name: Claus full_name: Scheidemann, Claus id: '38259' last_name: Scheidemann - first_name: Tobias full_name: Hemsel, Tobias id: '210' last_name: Hemsel - first_name: Olga full_name: Friesen, Olga id: '44026' last_name: Friesen - first_name: Leander full_name: Claes, Leander id: '11829' last_name: Claes orcid: 0000-0002-4393-268X - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Scheidemann C, Hemsel T, Friesen O, Claes L, Sextro W. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. In: ; 2023.' apa: Scheidemann, C., Hemsel, T., Friesen, O., Claes, L., & Sextro, W. (2023). Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. 7th International Conference on Advanced Electromaterials (ICAE 2023), Jeju, Korea. bibtex: '@inproceedings{Scheidemann_Hemsel_Friesen_Claes_Sextro_2023, title={Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics}, author={Scheidemann, Claus and Hemsel, Tobias and Friesen, Olga and Claes, Leander and Sextro, Walter}, year={2023} }' chicago: Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” 2023. ieee: C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the 7th International Conference on Advanced Electromaterials (ICAE 2023), Jeju, Korea, 2023. mla: Scheidemann, Claus, et al. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. 2023. short: 'C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.' conference: end_date: 2023-11-03 location: Jeju, Korea name: 7th International Conference on Advanced Electromaterials (ICAE 2023) start_date: 2023-10-31 date_created: 2024-02-01T15:55:44Z date_updated: 2024-02-01T16:54:33Z department: - _id: '151' - _id: '49' language: - iso: eng project: - _id: '108' grant_number: FOR 5208 name: 'NEPTUN: Modellbasierte Bestimmung nichtlinearer Eigenschaften von Piezokeramiken für Leistungsschallanwendungen' status: public title: Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics type: conference_abstract user_id: '38259' year: '2023' ... --- _id: '51118' author: - first_name: Claus full_name: Scheidemann, Claus id: '38259' last_name: Scheidemann - first_name: Tobias full_name: Hemsel, Tobias id: '210' last_name: Hemsel - first_name: Olga full_name: Friesen, Olga id: '44026' last_name: Friesen - first_name: Leander full_name: Claes, Leander id: '11829' last_name: Claes orcid: 0000-0002-4393-268X - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Scheidemann C, Hemsel T, Friesen O, Claes L, Sextro W. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. In: ; 2023.' apa: Scheidemann, C., Hemsel, T., Friesen, O., Claes, L., & Sextro, W. (2023). Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Incheon, Korea. bibtex: '@inproceedings{Scheidemann_Hemsel_Friesen_Claes_Sextro_2023, title={Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics}, author={Scheidemann, Claus and Hemsel, Tobias and Friesen, Olga and Claes, Leander and Sextro, Walter}, year={2023} }' chicago: Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” 2023. ieee: C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Incheon, Korea, 2023. mla: Scheidemann, Claus, et al. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. 2023. short: 'C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.' conference: location: Incheon, Korea name: International Conference on Functional Materials & Devices 2023 (ICFMD 2023) date_created: 2024-02-01T16:00:19Z date_updated: 2024-02-01T16:55:09Z department: - _id: '151' - _id: '49' language: - iso: eng project: - _id: '108' grant_number: FOR 5208 name: 'NEPTUN: Modellbasierte Bestimmung nichtlinearer Eigenschaften von Piezokeramiken für Leistungsschallanwendungen' status: public title: Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics type: conference_abstract user_id: '38259' year: '2023' ... --- _id: '51119' author: - first_name: Claus full_name: Scheidemann, Claus id: '38259' last_name: Scheidemann - first_name: Oliver Ernst Caspar full_name: Hagedorn, Oliver Ernst Caspar id: '53321' last_name: Hagedorn - first_name: Tobias full_name: Hemsel, Tobias id: '210' last_name: Hemsel - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Scheidemann C, Hagedorn OEC, Hemsel T, Sextro W. Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. In: ; 2023.' apa: Scheidemann, C., Hagedorn, O. E. C., Hemsel, T., & Sextro, W. (2023). Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Jeju, Korea. bibtex: '@inproceedings{Scheidemann_Hagedorn_Hemsel_Sextro_2023, title={Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process}, author={Scheidemann, Claus and Hagedorn, Oliver Ernst Caspar and Hemsel, Tobias and Sextro, Walter}, year={2023} }' chicago: Scheidemann, Claus, Oliver Ernst Caspar Hagedorn, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” 2023. ieee: C. Scheidemann, O. E. C. Hagedorn, T. Hemsel, and W. Sextro, “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” presented at the International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Jeju, Korea, 2023. mla: Scheidemann, Claus, et al. Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. 2023. short: 'C. Scheidemann, O.E.C. Hagedorn, T. Hemsel, W. Sextro, in: 2023.' conference: end_date: 2023-11-03 location: Jeju, Korea name: International Conference on Functional Materials & Devices 2023 (ICFMD 2023) start_date: 2023-10-31 date_created: 2024-02-01T16:03:41Z date_updated: 2024-02-01T16:04:33Z department: - _id: '151' language: - iso: eng status: public title: Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process type: conference_abstract user_id: '38259' year: '2023' ... --- _id: '51338' author: - first_name: Jan full_name: Schütte, Jan id: '22109' last_name: Schütte orcid: 0000-0001-9025-9742 - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Schütte J, Sextro W. Einfluss der Radhubkinematik auf den Reifenverschleiß. In: 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn. Vol 2425. VDI-Berichte. VDI Verlag GmbH; 2023:165-180.' apa: Schütte, J., & Sextro, W. (2023). Einfluss der Radhubkinematik auf den Reifenverschleiß. In 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn (Vol. 2425, pp. 165–180). VDI Verlag GmbH. bibtex: '@inbook{Schütte_Sextro_2023, series={VDI-Berichte}, title={Einfluss der Radhubkinematik auf den Reifenverschleiß}, volume={2425}, booktitle={20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn}, publisher={VDI Verlag GmbH}, author={Schütte, Jan and Sextro, Walter}, year={2023}, pages={165–180}, collection={VDI-Berichte} }' chicago: Schütte, Jan, and Walter Sextro. “Einfluss der Radhubkinematik auf den Reifenverschleiß.” In 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn, 2425:165–80. VDI-Berichte. VDI Verlag GmbH, 2023. ieee: J. Schütte and W. Sextro, “Einfluss der Radhubkinematik auf den Reifenverschleiß,” in 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn, vol. 2425, VDI Verlag GmbH, 2023, pp. 165–180. mla: Schütte, Jan, and Walter Sextro. “Einfluss der Radhubkinematik auf den Reifenverschleiß.” 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn, vol. 2425, VDI Verlag GmbH, 2023, pp. 165–80. short: 'J. Schütte, W. Sextro, in: 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn, VDI Verlag GmbH, 2023, pp. 165–180.' conference: end_date: 2023-11-09 location: Karlsruhe name: 20. VDI Fachtagung Reifen - Fahrwerk - Fahrbahn start_date: 2023-11-08 date_created: 2024-02-13T11:29:58Z date_updated: 2024-03-12T13:15:28Z department: - _id: '151' intvolume: ' 2425' language: - iso: ger page: 165-180 publication: 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn publication_identifier: unknown: - 978-3-18-092425-0 publication_status: published publisher: VDI Verlag GmbH series_title: VDI-Berichte status: public title: Einfluss der Radhubkinematik auf den Reifenverschleiß type: book_chapter user_id: '22109' volume: 2425 year: '2023' ... --- _id: '34272' abstract: - lang: ger text: Das Ultraschall-Dickdrahtbonden mit Aluminiumdraht ist ein Standardverfahren zur elektrischenKontaktierung von Leistungshalbleitermodulen. Die steigenden Anforderungen an die Effizienzund Zuverlässigkeit der Module haben zu technologischen Weiterentwicklungen geführt und eswerden vermehrt Kupferdrähte mit wesentlich besseren elektrischen und thermischen Eigenschafteneingesetzt. Hieraus resultieren durch höhere Prozesskräfte und Ultraschallleistung neueHerausforderungen bei der Prozessentwicklung; hierfür wird ein Simulationsmodell zur Verbesserungder Prozessentwicklung entwickelt.In Ultraschall-Drahtbondversuchen mit 400 m Aluminium und Kupfer Drähten wurde der Einflussder Prozessparameter auf die Bondqualität untersucht; diese Ergebnisse und zusätzliche Messungender Drahtdeformation und Schwingungen wurden für die Formulierung der Anforderungenund zur Validierung der Ergebnisse des Simulationsmodells genutzt.Es wurde ein Prozessmodell, basierend auf einer Co-Simulation zwischen MATLAB und ANSYS,entwickelt; hierbei wurden die phyiskalischen Phänomene wie die Ultraschall Werkstoffentfestigung,der Verbindungsaufbau und die dynamischen Systemeigenschaften abgebildet.Basierend auf einer Zug-Druck-Prüfmaschine wurde ein Prüfstand zur Identifikation der Modellparameterentwickelt. In zusätzlichen Druckversuchen mit den Bonddrähten mit und ohneUltraschallanregung wurde die Reduktion der Umformkräfte unter Ultraschalleinfluss untersucht.Mit dem entwickelten Prozessmodell wurden die Parameterstudien aus den Ultraschall-Drahtbondversuchensimuliert und direkt mit den experimentellen Ergebnissen verglichen, wobei sich einerelativ gute Übereinstimmung zwischen Simulation und Messung sowohl für Aluminium, als auchfür Kupfer, erzielen ließ. - lang: eng text: Ultrasonic heavy wire bonding with aluminium wire is a standard process to produce electricalcontacts in power semiconductor modules. The increasing demands on the efficiency and reliabilityof the modules have led to technological developments and copper wires with significantlybetter electrical and thermal properties are used more often nowadays. This results in new challengesin process development due to higher process forces and ultrasonic power; for this purpose,a simulation model is developed to improve process development.Ultrasonic wire bonding tests with 400 m aluminium and copper wires were carried out to investigatethe influence of the process parameters on the bond quality; these results and additionalmeasurements of wire deformation and vibrations were used to define the requirements for themodel and validate the results of the simulation.A process model based on a co-simulation was developed between MATLAB and ANSYS; thephysical phenomena such as ultrasonic softening of the wire material, bond formation and dynamicbehaviour of the components were considered.Based on a tensile-compression testing machine, a test rig was developed to identify the modelparameters. In additional compression tests with the wires with and without ultrasonic excitation,the reduction of the forming forces under ultrasonic influence was characterised.With the developed process model, the parameter studies from the ultrasonic wire bond testswere simulated and directly compared with the experimental results; a relative good agreementbetween simulation and measurement could be achieved for both aluminium and copper. author: - first_name: Reinhard full_name: Schemmel, Reinhard id: '28647' last_name: Schemmel citation: ama: Schemmel R. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Vol 13. Shaker; 2022. doi:10.17619/UNIPB/1-1280 apa: Schemmel, R. (2022). Enhanced process development by simulation of ultrasonic heavy wire bonding (Vol. 13). Shaker. https://doi.org/10.17619/UNIPB/1-1280 bibtex: '@book{Schemmel_2022, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Enhanced process development by simulation of ultrasonic heavy wire bonding}, volume={13}, DOI={10.17619/UNIPB/1-1280}, publisher={Shaker}, author={Schemmel, Reinhard}, year={2022}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }' chicago: Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Vol. 13. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2022. https://doi.org/10.17619/UNIPB/1-1280. ieee: R. Schemmel, Enhanced process development by simulation of ultrasonic heavy wire bonding, vol. 13. Shaker, 2022. mla: Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Shaker, 2022, doi:10.17619/UNIPB/1-1280. short: R. Schemmel, Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding, Shaker, 2022. date_created: 2022-12-07T14:03:17Z date_updated: 2022-12-07T14:15:23Z department: - _id: '151' doi: 10.17619/UNIPB/1-1280 intvolume: ' 13' language: - iso: eng main_file_link: - open_access: '1' url: https://digital.ub.uni-paderborn.de/hs/id/6223291 oa: '1' page: '174' publication_identifier: isbn: - "\t978-3-8440-8527-3" publication_status: published publisher: Shaker related_material: link: - relation: dissertation_contains url: https://www.shaker.eu/en/content/catalogue/index.asp?lang=en&ID=8&ISBN=978-3-8440-8527-3&search=yes series_title: Schriften des Lehrstuhls für Dynamik und Mechatronik status: public supervisor: - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro title: Enhanced process development by simulation of ultrasonic heavy wire bonding type: dissertation user_id: '210' volume: 13 year: '2022' ... --- _id: '29934' abstract: - lang: eng text: Tire and road wear are a major source of emissions of nonexhaust particulate matter (PM) and make up the largest share of microplastics in the environment. To reduce tire wear through numerical optimization of a vehicle's suspension system, fast simulations of the representative usage of a vehicle are needed. Therefore, this contribution evaluates if instead of a full simulation of a representative test drive, only specific driving maneuvers resulting from a clustering of the driving data can be used to predict tire wear. As a measure for tire wear, the friction work between tire and road is calculated. It is shown that enough clusters result in negligible deviations between the total friction work of the full simulation and the cluster simulations as well as between the distributions of the friction work over the tire width. The calculation time can be reduced to about 1% of the full simulation. author: - first_name: Lars full_name: Muth, Lars id: '77313' last_name: Muth orcid: 0000-0002-2938-5616 - first_name: Christian full_name: Noll, Christian last_name: Noll - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Muth L, Noll C, Sextro W. Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data. In: Orlova A, Cole D, eds. Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021. Lecture Notes in Mechanical Engineering. Springer; 2022. doi:10.1007/978-3-031-07305-2_92' apa: Muth, L., Noll, C., & Sextro, W. (2022). Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data. In A. Orlova & D. Cole (Eds.), Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021. Springer. https://doi.org/10.1007/978-3-031-07305-2_92 bibtex: '@inproceedings{Muth_Noll_Sextro_2022, place={Cham}, series={Lecture Notes in Mechanical Engineering}, title={Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data}, DOI={10.1007/978-3-031-07305-2_92}, booktitle={Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021}, publisher={Springer}, author={Muth, Lars and Noll, Christian and Sextro, Walter}, editor={Orlova, Anna and Cole, David}, year={2022}, collection={Lecture Notes in Mechanical Engineering} }' chicago: 'Muth, Lars, Christian Noll, and Walter Sextro. “Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data.” In Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021, edited by Anna Orlova and David Cole. Lecture Notes in Mechanical Engineering. Cham: Springer, 2022. https://doi.org/10.1007/978-3-031-07305-2_92.' ieee: 'L. Muth, C. Noll, and W. Sextro, “Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data,” in Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021, Saint Petersburg, Russia, 2022, doi: 10.1007/978-3-031-07305-2_92.' mla: Muth, Lars, et al. “Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data.” Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021, edited by Anna Orlova and David Cole, Springer, 2022, doi:10.1007/978-3-031-07305-2_92. short: 'L. Muth, C. Noll, W. Sextro, in: A. Orlova, D. Cole (Eds.), Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021, Springer, Cham, 2022.' conference: end_date: 2021-08-19 location: Saint Petersburg, Russia name: 27th IAVSD Symposium on Dynamics of Vehicles on Roads and Tracks, IAVSD 2021 start_date: 2021-08-17 date_created: 2022-02-21T14:14:11Z date_updated: 2022-08-23T11:55:07Z department: - _id: '151' doi: 10.1007/978-3-031-07305-2_92 editor: - first_name: Anna full_name: Orlova, Anna last_name: Orlova - first_name: David full_name: Cole, David last_name: Cole keyword: - Tire Wear - Vehicle Dynamics - Clustering - Virtual Test language: - iso: eng main_file_link: - url: https://link.springer.com/chapter/10.1007/978-3-031-07305-2_92 place: Cham publication: Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2021 publication_identifier: eisbn: - 978-3-031-07305-2 isbn: - 978-3-031-07304-5 publication_status: published publisher: Springer quality_controlled: '1' series_title: Lecture Notes in Mechanical Engineering status: public title: Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data type: conference user_id: '77313' year: '2022' ... --- _id: '33500' abstract: - lang: eng text: 'This article is dedicated to piezoelectric ultrasonic power transducers that differ to well known medical ultrasonic diagnostic apparatus or non destructive testing devices by the level of power in use; typically several tens of up to more than thousand watts are used in a multitude of different applications. After a short introduction including historical development, the first focus is on theoretical background of the operating principle, design and mechanical modeling. As piezoelectric elements transform electrical to mechanical energy and vice versa, equivalent circuit modeling is also described. After that, sample applications are delineated by the matter wherein ultrasound generates unique effects: incredible high pressure level as well in air as in water, micro-bubbles generating temperature peaks for very short time instances in fluids, acoustoplastic effect, enhancement of diffusion and recrystallization in solids, friction manipulation, incremental deformation and micro-cracking of surfaces, or even generation of macroscopic movements in motors. At the end, some future directions ranging from novel modeling approaches to advanced control and new materials are addressed.' author: - first_name: Tobias full_name: Hemsel, Tobias id: '210' last_name: Hemsel - first_name: Jens full_name: Twiefel, Jens last_name: Twiefel citation: ama: 'Hemsel T, Twiefel J. Piezoelectric Ultrasonic Power Transducers. In: Reference Module in Materials Science and Materials Engineering. Elsevier; 2022. doi:10.1016/b978-0-12-819728-8.00047-4' apa: Hemsel, T., & Twiefel, J. (2022). Piezoelectric Ultrasonic Power Transducers. In Reference Module in Materials Science and Materials Engineering. Elsevier. https://doi.org/10.1016/b978-0-12-819728-8.00047-4 bibtex: '@inbook{Hemsel_Twiefel_2022, title={Piezoelectric Ultrasonic Power Transducers}, DOI={10.1016/b978-0-12-819728-8.00047-4}, booktitle={Reference Module in Materials Science and Materials Engineering}, publisher={Elsevier}, author={Hemsel, Tobias and Twiefel, Jens}, year={2022} }' chicago: Hemsel, Tobias, and Jens Twiefel. “Piezoelectric Ultrasonic Power Transducers.” In Reference Module in Materials Science and Materials Engineering. Elsevier, 2022. https://doi.org/10.1016/b978-0-12-819728-8.00047-4. ieee: T. Hemsel and J. Twiefel, “Piezoelectric Ultrasonic Power Transducers,” in Reference Module in Materials Science and Materials Engineering, Elsevier, 2022. mla: Hemsel, Tobias, and Jens Twiefel. “Piezoelectric Ultrasonic Power Transducers.” Reference Module in Materials Science and Materials Engineering, Elsevier, 2022, doi:10.1016/b978-0-12-819728-8.00047-4. short: 'T. Hemsel, J. Twiefel, in: Reference Module in Materials Science and Materials Engineering, Elsevier, 2022.' date_created: 2022-09-30T09:35:16Z date_updated: 2022-09-30T09:41:47Z department: - _id: '151' doi: 10.1016/b978-0-12-819728-8.00047-4 keyword: - Equivalent circuit model - Langevin transducer - Lumped parameter model - Piezoelectric transducer - Ultrasonic processes - Ultrasound language: - iso: eng main_file_link: - url: https://www.sciencedirect.com/science/article/pii/B9780128197288000474 publication: Reference Module in Materials Science and Materials Engineering publication_identifier: isbn: - 978-0-12-803581-8 publication_status: published publisher: Elsevier quality_controlled: '1' status: public title: Piezoelectric Ultrasonic Power Transducers type: book_chapter user_id: '210' year: '2022' ... --- _id: '29727' author: - first_name: Meike Claudia full_name: Wohlleben, Meike Claudia id: '43991' last_name: Wohlleben - first_name: Amelie full_name: Bender, Amelie id: '54290' last_name: Bender - first_name: Sebastian full_name: Peitz, Sebastian id: '47427' last_name: Peitz orcid: 0000-0002-3389-793X - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Wohlleben MC, Bender A, Peitz S, Sextro W. Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction. In: Machine Learning, Optimization, and Data Science. Springer International Publishing; 2022. doi:10.1007/978-3-030-95470-3_8' apa: Wohlleben, M. C., Bender, A., Peitz, S., & Sextro, W. (2022). Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction. In Machine Learning, Optimization, and Data Science. Springer International Publishing. https://doi.org/10.1007/978-3-030-95470-3_8 bibtex: '@inbook{Wohlleben_Bender_Peitz_Sextro_2022, place={Cham}, title={Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction}, DOI={10.1007/978-3-030-95470-3_8}, booktitle={Machine Learning, Optimization, and Data Science}, publisher={Springer International Publishing}, author={Wohlleben, Meike Claudia and Bender, Amelie and Peitz, Sebastian and Sextro, Walter}, year={2022} }' chicago: 'Wohlleben, Meike Claudia, Amelie Bender, Sebastian Peitz, and Walter Sextro. “Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction.” In Machine Learning, Optimization, and Data Science. Cham: Springer International Publishing, 2022. https://doi.org/10.1007/978-3-030-95470-3_8.' ieee: 'M. C. Wohlleben, A. Bender, S. Peitz, and W. Sextro, “Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction,” in Machine Learning, Optimization, and Data Science, Cham: Springer International Publishing, 2022.' mla: Wohlleben, Meike Claudia, et al. “Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction.” Machine Learning, Optimization, and Data Science, Springer International Publishing, 2022, doi:10.1007/978-3-030-95470-3_8. short: 'M.C. Wohlleben, A. Bender, S. Peitz, W. Sextro, in: Machine Learning, Optimization, and Data Science, Springer International Publishing, Cham, 2022.' date_created: 2022-02-03T10:30:23Z date_updated: 2023-04-26T12:10:58Z department: - _id: '151' - _id: '655' doi: 10.1007/978-3-030-95470-3_8 language: - iso: eng main_file_link: - url: https://link.springer.com/content/pdf/10.1007%2F978-3-030-95470-3_8.pdf place: Cham publication: Machine Learning, Optimization, and Data Science publication_identifier: isbn: - '9783030954697' - '9783030954703' issn: - 0302-9743 - 1611-3349 publication_status: published publisher: Springer International Publishing quality_controlled: '1' status: public title: Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction type: book_chapter user_id: '43991' year: '2022' ... --- _id: '30371' abstract: - lang: eng text: "To achieve optimum bond results at ultrasonic bonding thick copper wire on sensitive components is quite challenging.\r\nBearing in mind that high normal force and ultrasonic power are needed for bond quality but as well increase stress and finally failure risk of the substrate, methods should be found to achieve high bond quality even at lower bond parameters. Therefore, bond experiments with different bond tool grove geometries have been conducted for copper and aluminum wire on direct copper bonded (DCB) substrates to investigate the impact of geometric parameters on bond formation and bond quality. The wire material depending impact of geometry changes on the bond formation and deformation was quantified. Additionally, a bonding parameter design of experiments (DOE) has been conducted for the reference and the most promising groove geometry. Higher shear values were achieved at reduced vertical tool displacement for most bonding parameter combinations, compared to the reference tool. This behavior allows for reducing ultrasonic power to obtain equal shear values; consequently, mechanical stresses in the interface decrease. This could potentially reduce the risk of chip damage and thus yield loss." author: - first_name: Oliver Ernst Caspar full_name: Hagedorn, Oliver Ernst Caspar id: '53321' last_name: Hagedorn - first_name: Marian full_name: Broll, Marian last_name: Broll - first_name: Olaf full_name: Kirsch, Olaf last_name: Kirsch - first_name: Tobias full_name: Hemsel, Tobias id: '210' last_name: Hemsel - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Hagedorn OEC, Broll M, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. In: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems. VDE VERLAG GMBH; 2022:138-143.' apa: Hagedorn, O. E. C., Broll, M., Kirsch, O., Hemsel, T., & Sextro, W. (2022). Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, 138–143. bibtex: '@inproceedings{Hagedorn_Broll_Kirsch_Hemsel_Sextro_2022, place={Berlin}, title={Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding}, booktitle={CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems}, publisher={VDE VERLAG GMBH}, author={Hagedorn, Oliver Ernst Caspar and Broll, Marian and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}, year={2022}, pages={138–143} }' chicago: 'Hagedorn, Oliver Ernst Caspar, Marian Broll, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of the Influence of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” In CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, 138–43. Berlin: VDE VERLAG GMBH, 2022.' ieee: O. E. C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding,” in CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, Berlin, 2022, pp. 138–143. mla: Hagedorn, Oliver Ernst Caspar, et al. “Experimental Investigation of the Influence of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, 2022, pp. 138–43. short: 'O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, Berlin, 2022, pp. 138–143.' conference: end_date: 2022.03.17 location: Berlin name: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems start_date: 2022.03.15 date_created: 2022-03-17T15:00:06Z date_updated: 2023-09-21T14:22:17Z department: - _id: '151' language: - iso: eng page: 138-143 place: Berlin publication: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems publication_identifier: isbn: - 'ISBN 978-3-8007-5757-2 ' publisher: VDE VERLAG GMBH quality_controlled: '1' status: public title: Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding type: conference user_id: '210' year: '2022' ... --- _id: '47159' author: - first_name: Osarenren Kennedy full_name: Aimiyekagbon, Osarenren Kennedy id: '9557' last_name: Aimiyekagbon - first_name: Amelie full_name: Bender, Amelie id: '54290' last_name: Bender - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: Aimiyekagbon OK, Bender A, Sextro W. On the applicability of time series features as health indicators for technical systems operating under varying conditions. Condition Monitor. 2022:5-10. apa: Aimiyekagbon, O. K., Bender, A., & Sextro, W. (2022). On the applicability of time series features as health indicators for technical systems operating under varying conditions. Condition Monitor, 425, 5–10. bibtex: '@article{Aimiyekagbon_Bender_Sextro_2022, title={On the applicability of time series features as health indicators for technical systems operating under varying conditions}, number={425}, journal={ Condition Monitor}, author={Aimiyekagbon, Osarenren Kennedy and Bender, Amelie and Sextro, Walter}, year={2022}, pages={5–10} }' chicago: Aimiyekagbon, Osarenren Kennedy, Amelie Bender, and Walter Sextro. “On the Applicability of Time Series Features as Health Indicators for Technical Systems Operating under Varying Conditions.” Condition Monitor, 2022. ieee: O. K. Aimiyekagbon, A. Bender, and W. Sextro, “On the applicability of time series features as health indicators for technical systems operating under varying conditions,” Condition Monitor, no. 425, pp. 5–10, 2022. mla: Aimiyekagbon, Osarenren Kennedy, et al. “On the Applicability of Time Series Features as Health Indicators for Technical Systems Operating under Varying Conditions.” Condition Monitor, no. 425, 2022, pp. 5–10. short: O.K. Aimiyekagbon, A. Bender, W. Sextro, Condition Monitor (2022) 5–10. date_created: 2023-09-22T09:25:48Z date_updated: 2023-09-22T09:29:51Z department: - _id: '151' issue: '425' language: - iso: eng page: 5 - 10 publication: ' Condition Monitor' publication_date: 2022-08 publication_identifier: issn: - 0268-8050 publication_status: published status: public title: On the applicability of time series features as health indicators for technical systems operating under varying conditions type: newspaper_article user_id: '9557' year: '2022' ... --- _id: '34104' abstract: - lang: eng text: 'ue to the constantly growing energy demand of power electronics and the need to reduce the size of electronic components like power modules for e-mobility, new challenges arise for ultrasonic wire bonding: the electrical connection must endure higher thermal and mechanical stress while the connecting partners become more sensitive or require more energy to get bonded. Past investigations have shown already that multi-dimensional ultrasonic bonding and welding yield the same or even better bond quality while reducing the load on the components. This contribution is intended to show whether multidi-mensional thick wire bonding is a promising concept to over-come the new challenges. The focus is on experimental investi-gations of different bond tool trajectories in ultrasonic wire bonding of aluminum and copper wire on DCB''s and chips. The bond quality is analyzed by shear tests, microsections and, in the case of aluminum bonding, by a new machine learning method for an objective automated evaluation of the sheared area.' author: - first_name: Claus full_name: Scheidemann, Claus id: '38259' last_name: Scheidemann - first_name: Olaf full_name: Kirsch, Olaf last_name: Kirsch - first_name: Tobias full_name: Hemsel, Tobias id: '210' last_name: Hemsel - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Scheidemann C, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE; 2022. doi:10.1109/estc55720.2022.9939478' apa: Scheidemann, C., Kirsch, O., Hemsel, T., & Sextro, W. (2022). Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). https://doi.org/10.1109/estc55720.2022.9939478 bibtex: '@inproceedings{Scheidemann_Kirsch_Hemsel_Sextro_2022, title={Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding}, DOI={10.1109/estc55720.2022.9939478}, booktitle={2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)}, publisher={IEEE}, author={Scheidemann, Claus and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}, year={2022} }' chicago: Scheidemann, Claus, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE, 2022. https://doi.org/10.1109/estc55720.2022.9939478. ieee: 'C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding,” 2022, doi: 10.1109/estc55720.2022.9939478.' mla: Scheidemann, Claus, et al. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022, doi:10.1109/estc55720.2022.9939478. short: 'C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.' date_created: 2022-11-17T15:17:39Z date_updated: 2023-09-22T12:24:18Z department: - _id: '151' doi: 10.1109/estc55720.2022.9939478 language: - iso: eng publication: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) publication_status: published publisher: IEEE quality_controlled: '1' status: public title: Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding type: conference user_id: '38259' year: '2022' ...