---
_id: '51518'
abstract:
- lang: eng
text: In applications of piezoelectric actuators and sensors, the dependability
and particularly the reliability throughout their lifetime are vital to manufacturers
and end-users and are enabled through condition-monitoring approaches. Existing
approaches often utilize impedance measurements over a range of frequencies or
velocity measurements and require additional equipment or sensors, such as a laser
Doppler vibrometer. Furthermore, the non-negligible effects of varying operating
conditions are often unconsidered. To minimize the need for additional sensors
while maintaining the dependability of piezoelectric bending actuators irrespective
of varying operating conditions, an online diagnostics approach is proposed. To
this end, time- and frequency-domain features are extracted from monitored current
signals to reflect hairline crack development in bending actuators. For validation
of applicability, the presented analysis method was evaluated on piezoelectric
bending actuators subjected to accelerated lifetime tests at varying voltage amplitudes
and under external damping conditions. In the presence of a crack and due to a
diminished stiffness, the resonance frequency decreases and the root-mean-square
amplitude of the current signal simultaneously abruptly drops during the lifetime
tests. Furthermore, the piezoelectric crack surfaces clapping is reflected in
higher harmonics of the current signal. Thus, time-domain features and harmonics
of the current signals are sufficient to diagnose hairline cracks in the actuators.
article_number: '521'
article_type: original
author:
- first_name: Osarenren Kennedy
full_name: Aimiyekagbon, Osarenren Kennedy
id: '9557'
last_name: Aimiyekagbon
- first_name: Amelie
full_name: Bender, Amelie
id: '54290'
last_name: Bender
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Aimiyekagbon OK, Bender A, Hemsel T, Sextro W. Diagnostics of Piezoelectric
Bending Actuators Subjected to Varying Operating Conditions. Electronics.
2024;13(3). doi:10.3390/electronics13030521
apa: Aimiyekagbon, O. K., Bender, A., Hemsel, T., & Sextro, W. (2024). Diagnostics
of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions.
Electronics, 13(3), Article 521. https://doi.org/10.3390/electronics13030521
bibtex: '@article{Aimiyekagbon_Bender_Hemsel_Sextro_2024, title={Diagnostics of
Piezoelectric Bending Actuators Subjected to Varying Operating Conditions}, volume={13},
DOI={10.3390/electronics13030521},
number={3521}, journal={Electronics}, publisher={MDPI AG}, author={Aimiyekagbon,
Osarenren Kennedy and Bender, Amelie and Hemsel, Tobias and Sextro, Walter}, year={2024}
}'
chicago: Aimiyekagbon, Osarenren Kennedy, Amelie Bender, Tobias Hemsel, and Walter
Sextro. “Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating
Conditions.” Electronics 13, no. 3 (2024). https://doi.org/10.3390/electronics13030521.
ieee: 'O. K. Aimiyekagbon, A. Bender, T. Hemsel, and W. Sextro, “Diagnostics of
Piezoelectric Bending Actuators Subjected to Varying Operating Conditions,” Electronics,
vol. 13, no. 3, Art. no. 521, 2024, doi: 10.3390/electronics13030521.'
mla: Aimiyekagbon, Osarenren Kennedy, et al. “Diagnostics of Piezoelectric Bending
Actuators Subjected to Varying Operating Conditions.” Electronics, vol.
13, no. 3, 521, MDPI AG, 2024, doi:10.3390/electronics13030521.
short: O.K. Aimiyekagbon, A. Bender, T. Hemsel, W. Sextro, Electronics 13 (2024).
date_created: 2024-02-20T06:46:43Z
date_updated: 2024-03-15T16:15:56Z
department:
- _id: '151'
doi: 10.3390/electronics13030521
funded_apc: '1'
intvolume: ' 13'
issue: '3'
keyword:
- piezoelectric transducer
- self-sensing
- fault detection
- diagnostics
- hairline crack
- condition monitoring
language:
- iso: eng
publication: Electronics
publication_identifier:
issn:
- 2079-9292
publication_status: published
publisher: MDPI AG
quality_controlled: '1'
status: public
title: Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating
Conditions
type: journal_article
user_id: '9557'
volume: 13
year: '2024'
...
---
_id: '52611'
abstract:
- lang: ger
text: "Ultraschallsysteme für das Herstellen für Bond- und Schweißverbindungen in
der Halbleiterfertigung zeigen auf Grund des Betriebes unter hohen Anregungsniveaus
nichtlineare Materialeigenschaften. Dabei wirken unterschiedliche Einflussfaktoren
auf die elektrischen Eigenschaften und die mechanischen Übertragungscharakteristiken
der Ultraschallsysteme ein. Die Herausforderungen ein solches geprägtes System
auszulegen oder effizient und zuverlässig zu betreiben, sind aufgrund der Nichtlinearitäten
relativ groß.\r\nDa für die Beschreibung der nichtlinearen Materialbeziehungen
nur wenige Modelle und kaum quantitative Angaben vorliegen, werden die komplexen
Wechselwirkungen von Materialparametern, Geometrie und Vorspannung des Schwingers,
Betriebsgrößen (Strom, Spannung), Temperatur und Prozesslasten durch systematische
Untersuchungen von Keramiken und Langevin-Schwingern messtechnisch erfasst. Aus
den Messergebnissen werden einerseits eindimensionale Modelle für Voruntersuchungen
als auch vollständige Materialparametersätze für die Simulation mittels dreidimensionaler
FE-Modelle hergeleitet.\r\nEine Methodik zur Ermittlung der Materialparameter
und ein auf iterativen Simulationen von FE-Modellen basierendes Werkzeug zur Simulation
der komplexen Wechselwirkungen werden vorgestellt. Anhand eines exemplarischen
Ultraschallsystems wird gezeigt, dass die Wirkungen temperaturbedingter Vorspannungsverluste,
Änderungen des elektrischen Klemmenverhaltens und Amplituden- und Frequenzänderungen
während des Betriebes bei großen Amplituden und Prozesslasten durch die Variationen
des Keramikvolumens und der Keramikposition positiv beeinflusst werden können."
author:
- first_name: Collin
full_name: Dymel, Collin
last_name: Dymel
citation:
ama: Dymel C. Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung
von Nichtlinearitäten. Vol 16. Shaker Verlag; 2024.
apa: Dymel, C. (2024). Modellbasierte Entwicklung von Ultraschallwandlern unter
der Berücksichtigung von Nichtlinearitäten (Vol. 16). Shaker Verlag.
bibtex: '@book{Dymel_2024, place={Düren}, series={Schriften des Lehrstuhls für Dynamik
und Mechatronik}, title={Modellbasierte Entwicklung von Ultraschallwandlern unter
der Berücksichtigung von Nichtlinearitäten}, volume={16}, publisher={Shaker Verlag},
author={Dymel, Collin}, year={2024}, collection={Schriften des Lehrstuhls für
Dynamik und Mechatronik} }'
chicago: 'Dymel, Collin. Modellbasierte Entwicklung von Ultraschallwandlern unter
der Berücksichtigung von Nichtlinearitäten. Vol. 16. Schriften des Lehrstuhls
für Dynamik und Mechatronik. Düren: Shaker Verlag, 2024.'
ieee: 'C. Dymel, Modellbasierte Entwicklung von Ultraschallwandlern unter der
Berücksichtigung von Nichtlinearitäten, vol. 16. Düren: Shaker Verlag, 2024.'
mla: Dymel, Collin. Modellbasierte Entwicklung von Ultraschallwandlern unter
der Berücksichtigung von Nichtlinearitäten. Shaker Verlag, 2024.
short: C. Dymel, Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung
von Nichtlinearitäten, Shaker Verlag, Düren, 2024.
date_created: 2024-03-18T11:13:27Z
date_updated: 2024-03-18T11:32:27Z
department:
- _id: '151'
intvolume: ' 16'
jel:
- D3
keyword:
- Nichtlineares piezoelektrisches Verhalten
- Dehnungsabhängigkeit
- Vorspannungseinfluss
- Temperatureinfluss
- Lasteinfluss
- Langevin-Schwinger
- Ultraschallwandler
- Ultraschallbonden
- FEM-Modell
- Ultraschallschweißen
- BVD-Modell
language:
- iso: ger
page: '134'
place: Düren
publication_identifier:
isbn:
- '9783844093964'
publication_status: published
publisher: Shaker Verlag
related_material:
link:
- relation: confirmation
url: https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-9396-4&search=yes
series_title: Schriften des Lehrstuhls für Dynamik und Mechatronik
status: public
title: Modellbasierte Entwicklung von Ultraschallwandlern unter der Berücksichtigung
von Nichtlinearitäten
type: dissertation
user_id: '55222'
volume: 16
year: '2024'
...
---
_id: '41971'
abstract:
- lang: ger
text: "Ultraschall-Drahtbonden ist eine Standardtechnologie im Bereich der Aufbau-
und Verbindungstechnik von Leistungshalbleitermodulen. Um Prozessschritte und
damit wertvolle Zeit zu sparen, sollen die Kupferdickdrähte für die Leistungshalbleiter
auch für die Kontaktierung von eingespritzten Anschlusssteckern im Modulrahmen
verwendet werden. Das Kontaktierungsverfahren mit diesen Drähten auf Steckern
in dünnwandigen Kunststoffrahmen führt häufig zu unzureichender Bondqualität.
In dieser Arbeit wird das Bonden von Anschlusssteckern experimentell und anhand
von Simulationen untersucht, um die Prozessstabilität zu steigern.\r\n\r\nZunächst
wurden Experimente auf Untergründen mit hoher Steifigkeit durchgeführt, um Störgrößen
von Untergrundeigenschaften zu verringern. Die gewonnenen Erkenntnisse erlaubten
die Entwicklung eines Simulationsmodells für die Vorhersage der Bondqualität.
Dieses basiert auf einer flächenaufgelösten Reibarbeitsbestimmung im Fügebereich
unter Berücksichtigung des Ultraschallerweichungseffektes und der hierdurch entstehenden
hohen Drahtverformung.\r\n\r\nExperimente an den Anschlusssteckern im Modulrahmen
zeigten eine verringerte Relativverschiebung zwischen Draht und Stecker, was zu
einer deutlichen Verringerung der Reibarbeit führt. Außerdem wurden verminderte
Schwingamplituden des Bondwerkzeugs nachgewiesen. Dies führt zu einer weiteren
Reduktion der Reibarbeit. Beide Effekte wurden mithilfe eines Mehrmassenschwingers
modelliert. Die gewonnenen Erkenntnisse und die erstellten Simulationsmodelle
ermöglichen die Entwicklung von Klemmvorrichtungen, welche die identifizierten
Störgrößen gezielt kompensieren und so ein verlässliches Bonden der Anschlussstecker
im gleichen Prozessschritt ermöglichen, in dem auch die Leistungshalbleiter kontaktiert
werden."
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
citation:
ama: Althoff S. Predicting the Bond Quality of Heavy Copper Wire Bonds Using
a Friction Model Approach. Vol 15. Shaker; 2023.
apa: Althoff, S. (2023). Predicting the Bond Quality of Heavy Copper Wire Bonds
using a Friction Model Approach (Vol. 15). Shaker.
bibtex: '@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik},
title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction
Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023},
collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }'
chicago: Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds
Using a Friction Model Approach. Vol. 15. Schriften Des Lehrstuhls Für Dynamik
Und Mechatronik. Shaker, 2023.
ieee: S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds using
a Friction Model Approach, vol. 15. Shaker, 2023.
mla: Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using
a Friction Model Approach. Shaker, 2023.
short: S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using
a Friction Model Approach, Shaker, 2023.
date_created: 2023-02-10T13:05:19Z
date_updated: 2023-02-10T13:05:42Z
department:
- _id: '151'
extern: '1'
intvolume: ' 15'
keyword:
- heavy copper bonding
- wire bonding
- quality prediction
- friction model
- point-contact-element
language:
- iso: eng
main_file_link:
- url: https://katalog.ub.uni-paderborn.de/local/r/9925085762506463?sr[q,any]=Simon%20Althoff
page: '192'
publication_identifier:
isbn:
- 978-3-8440-8903-5
publication_status: published
publisher: Shaker
related_material:
link:
- relation: confirmation
url: https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8903-5&search=yes
series_title: Schriften des Lehrstuhls für Dynamik und Mechatronik
status: public
supervisor:
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
title: Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model
Approach
type: dissertation
user_id: '55222'
volume: 15
year: '2023'
...
---
_id: '41970'
abstract:
- lang: ger
text: "Der Transport feiner Pulver mit in der Regel sehr hohen adhäsiven und kohäsiven
Eigenschaften stellt für viele konventionelle Transportsysteme eine große Herausforderung
dar. Durch die Anwendung von Ultraschallschwingungen können insbesondere die hohen
adhäsiven Kontaktkräfte und damit auch die Reibungseigenschaften manipuliert werden.\r\n\r\nEin
neu entwickeltes Pulvertransportsystem nutzt Ultraschallschwingungen, um die effektiven
Tangentialkräfte im Pulver-Rohrkontakt zu reduzieren. Durch den koordinierten
Einsatz von Ultraschallpulsen während einer niederfrequenten harmonischen Axialschwingung
des Transportrohres wird ein kontinuierlicher Pulvertransport ermöglicht. Nach
einer Einführung in die Grundlagen der Reibung und Reibungsmanipulation von Festkörpern
und Pulvern sowie der Charakterisierung von Pulvern wird das Pulvertransportsystem
auf Basis der Reibungsmanipulation inklusive der Leistungselektronik und der Ansteuerungshardware
vorgestellt. Eine Sensitivitätsanalyse zeigt, dass die Anregungsparameter des
Pulvertransportsystems ein großes Optimierungspotential aufweisen. Es wird ein
effizientes, modulares Modell des Pulvertransportsystems vorgestellt, welches
neben dem eigentlichen Modell des Transportprozesses ein Modell der Rohrschwingung
und ein kennlinienbasiertes Modell des Pulver-Rohrkontakts beinhaltet. Mithilfe
des Modells des Pulvertransportsystems werden Anregungsparameter hinsichtlich
Amplituden und Frequenzen der auftretenden Schwingungen sowie der Schaltzeiten
des Ultraschallpulses optimiert. "
author:
- first_name: Paul
full_name: Dunst, Paul
id: '22130'
last_name: Dunst
citation:
ama: Dunst P. Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse.
Vol 14. Shaker; 2023.
apa: Dunst, P. (2023). Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse
(Vol. 14). Shaker.
bibtex: '@book{Dunst_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik},
title={Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse},
volume={14}, publisher={Shaker}, author={Dunst, Paul}, year={2023}, collection={Schriften
des Lehrstuhls für Dynamik und Mechatronik} }'
chicago: Dunst, Paul. Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse.
Vol. 14. Schriften des Lehrstuhls für Dynamik und Mechatronik. Shaker, 2023.
ieee: P. Dunst, Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse,
vol. 14. Shaker, 2023.
mla: Dunst, Paul. Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse.
Shaker, 2023.
short: P. Dunst, Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse,
Shaker, 2023.
date_created: 2023-02-10T12:58:42Z
date_updated: 2023-02-10T13:07:40Z
department:
- _id: '151'
extern: '1'
intvolume: ' 14'
jel:
- D3
keyword:
- Ultraschall
- Pulvertransport
- Modellierung
- Optimierung
- Reibung
- Adhäsion
- Kohäsion
- Reibungsmanipulation
language:
- iso: ger
main_file_link:
- url: https://katalog.ub.uni-paderborn.de/local/r/9925085666806463?sr[q,any]=paul%20dunst
page: '150'
publication_identifier:
isbn:
- "\t978-3-8440-8899-1"
publication_status: published
publisher: Shaker
related_material:
link:
- relation: confirmation
url: https://www.shaker.de/de/content/catalogue/index.asp?lang=de&ID=8&ISBN=978-3-8440-8899-1&search=yes
series_title: Schriften des Lehrstuhls für Dynamik und Mechatronik
status: public
supervisor:
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
title: Modellierung und Optimierung reibungsbasierter Ultraschall-Pulvertransportprozesse
type: dissertation
user_id: '55222'
volume: 14
year: '2023'
...
---
_id: '44672'
abstract:
- lang: eng
text: With enhancing digitalization, condition monitoring is used in an increasing
number of application fields across various industrial sectors. By its application,
increased reliability as well as reduced risks and costs can be achieved. Based
on different approaches, technical systems are monitored and measured data is
analyzed to enable condition-based or predictive maintenance. To this end, machine
learning approaches are usually implemented to diagnose the health states or predict
the health index of the monitored system. However, these trained models are often
black-box models, not intuitively explainable for a human. To overcome this shortcoming,
a model-based approach based on physics is developed for piezoelectric bending
actuators. Such a model enables a transparent representation of the system. Moreover,
the model-based approach is extended by a parameter-estimation to account for
sudden changes in behavior e. g. caused by occurring cracks.
article_number: '114399'
article_type: original
author:
- first_name: Amelie
full_name: Bender, Amelie
id: '54290'
last_name: Bender
citation:
ama: 'Bender A. Model-based condition monitoring of piezoelectric bending actuators.
Sensors and Actuators A: Physical. 2023;357. doi:10.1016/j.sna.2023.114399'
apa: 'Bender, A. (2023). Model-based condition monitoring of piezoelectric bending
actuators. Sensors and Actuators A: Physical, 357, Article 114399.
https://doi.org/10.1016/j.sna.2023.114399'
bibtex: '@article{Bender_2023, title={Model-based condition monitoring of piezoelectric
bending actuators}, volume={357}, DOI={10.1016/j.sna.2023.114399},
number={114399}, journal={Sensors and Actuators A: Physical}, publisher={Elsevier
BV}, author={Bender, Amelie}, year={2023} }'
chicago: 'Bender, Amelie. “Model-Based Condition Monitoring of Piezoelectric Bending
Actuators.” Sensors and Actuators A: Physical 357 (2023). https://doi.org/10.1016/j.sna.2023.114399.'
ieee: 'A. Bender, “Model-based condition monitoring of piezoelectric bending actuators,”
Sensors and Actuators A: Physical, vol. 357, Art. no. 114399, 2023, doi:
10.1016/j.sna.2023.114399.'
mla: 'Bender, Amelie. “Model-Based Condition Monitoring of Piezoelectric Bending
Actuators.” Sensors and Actuators A: Physical, vol. 357, 114399, Elsevier
BV, 2023, doi:10.1016/j.sna.2023.114399.'
short: 'A. Bender, Sensors and Actuators A: Physical 357 (2023).'
date_created: 2023-05-09T09:49:44Z
date_updated: 2023-05-09T09:53:31Z
department:
- _id: '151'
doi: 10.1016/j.sna.2023.114399
intvolume: ' 357'
keyword:
- Condition Monitoring
- Model-based approach Diagnostics
- Varying conditions
- Explainability
- Piezoelectric bending actuators
language:
- iso: eng
main_file_link:
- open_access: '1'
url: https://authors.elsevier.com/a/1h2WV3IC9dF7Hm
oa: '1'
publication: 'Sensors and Actuators A: Physical'
publication_identifier:
issn:
- 0924-4247
publication_status: published
publisher: Elsevier BV
quality_controlled: '1'
status: public
title: Model-based condition monitoring of piezoelectric bending actuators
type: journal_article
user_id: '54290'
volume: 357
year: '2023'
...
---
_id: '46813'
abstract:
- lang: eng
text: Modelling of dynamic systems plays an important role in many engineering disciplines.
Two different approaches are physical modelling and data‐driven modelling, both
of which have their respective advantages and disadvantages. By combining these
two approaches, hybrid models can be created in which the respective disadvantages
are mitigated, with discrepancy models being a particular subclass. Here, the
basic system behaviour is described physically, that is, in the form of differential
equations. Inaccuracies resulting from insufficient modelling or numerics lead
to a discrepancy between the measurements and the model, which can be compensated
by a data‐driven error correction term. Since discrepancy methods still require
a large amount of measurement data, this paper investigates the extent to which
a single discrepancy model can be trained for a physical model with additional
parameter dependencies without the need for retraining. As an example, a damped
electromagnetic oscillating circuit is used. The physical model is realised by
a differential equation describing the electric current, considering only inductance
and capacitance; dissipation due to resistance is neglected. This creates a discrepancy
between measurement and model, which is corrected by a data‐driven model. In the
experiments, the inductance and the capacity are varied. It is found that the
same data‐driven model can only be used if additional parametric dependencies
in the data‐driven term are considered as well.
author:
- first_name: Meike Claudia
full_name: Wohlleben, Meike Claudia
id: '43991'
last_name: Wohlleben
orcid: 0009-0009-9767-7168
- first_name: Lars
full_name: Muth, Lars
id: '77313'
last_name: Muth
orcid: 0000-0002-2938-5616
- first_name: Sebastian
full_name: Peitz, Sebastian
id: '47427'
last_name: Peitz
orcid: 0000-0002-3389-793X
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Wohlleben MC, Muth L, Peitz S, Sextro W. Transferability of a discrepancy
model for the dynamics of electromagnetic oscillating circuits. In: Proceedings
in Applied Mathematics and Mechanics. Wiley; 2023. doi:10.1002/pamm.202300039'
apa: Wohlleben, M. C., Muth, L., Peitz, S., & Sextro, W. (2023). Transferability
of a discrepancy model for the dynamics of electromagnetic oscillating circuits.
Proceedings in Applied Mathematics and Mechanics. https://doi.org/10.1002/pamm.202300039
bibtex: '@inproceedings{Wohlleben_Muth_Peitz_Sextro_2023, title={Transferability
of a discrepancy model for the dynamics of electromagnetic oscillating circuits},
DOI={10.1002/pamm.202300039},
booktitle={Proceedings in Applied Mathematics and Mechanics}, publisher={Wiley},
author={Wohlleben, Meike Claudia and Muth, Lars and Peitz, Sebastian and Sextro,
Walter}, year={2023} }'
chicago: Wohlleben, Meike Claudia, Lars Muth, Sebastian Peitz, and Walter Sextro.
“Transferability of a Discrepancy Model for the Dynamics of Electromagnetic Oscillating
Circuits.” In Proceedings in Applied Mathematics and Mechanics. Wiley,
2023. https://doi.org/10.1002/pamm.202300039.
ieee: 'M. C. Wohlleben, L. Muth, S. Peitz, and W. Sextro, “Transferability of a
discrepancy model for the dynamics of electromagnetic oscillating circuits,” 2023,
doi: 10.1002/pamm.202300039.'
mla: Wohlleben, Meike Claudia, et al. “Transferability of a Discrepancy Model for
the Dynamics of Electromagnetic Oscillating Circuits.” Proceedings in Applied
Mathematics and Mechanics, Wiley, 2023, doi:10.1002/pamm.202300039.
short: 'M.C. Wohlleben, L. Muth, S. Peitz, W. Sextro, in: Proceedings in Applied
Mathematics and Mechanics, Wiley, 2023.'
date_created: 2023-09-06T05:18:05Z
date_updated: 2023-09-21T14:47:20Z
department:
- _id: '655'
- _id: '151'
doi: 10.1002/pamm.202300039
keyword:
- Electrical and Electronic Engineering
- Atomic and Molecular Physics
- and Optics
language:
- iso: eng
main_file_link:
- open_access: '1'
url: https://onlinelibrary.wiley.com/doi/epdf/10.1002/pamm.202300039
oa: '1'
publication: Proceedings in Applied Mathematics and Mechanics
publication_identifier:
issn:
- 1617-7061
- 1617-7061
publication_status: published
publisher: Wiley
quality_controlled: '1'
status: public
title: Transferability of a discrepancy model for the dynamics of electromagnetic
oscillating circuits
type: conference
user_id: '77313'
year: '2023'
...
---
_id: '47116'
abstract:
- lang: eng
text: This paper presents a comprehensive study on diagnosing a spacecraft propulsion
system utilizing data provided by the Prognostics and Health Management (PHM)
society, specifically obtained as part of the Asia-Pacific PHM conference’s data
challenge 2023. The objective of the challenge is to identify and diagnose known
faults as well as unknown anomalies in the spacecraft’s propulsion system, which
is critical for ensuring the spacecraft’s proper functionality and safety. To
address this challenge, the proposed method follows a systematic approach of feature
extraction, feature selection, and model development. The models employed in this
study are kMeans clustering and decision trees combined to ensembles, enriched
with expert knowledge. With the method presented, our team was capable of reaching
high accuracy in identifying anomalies as well as diagnosing faults, resulting
in attaining the seventh place with a score of 93.08 %.
author:
- first_name: Osarenren Kennedy
full_name: Aimiyekagbon, Osarenren Kennedy
id: '9557'
last_name: Aimiyekagbon
- first_name: Alexander
full_name: Löwen, Alexander
last_name: Löwen
- first_name: Amelie
full_name: Bender, Amelie
id: '54290'
last_name: Bender
- first_name: Lars
full_name: Muth, Lars
id: '77313'
last_name: Muth
orcid: 0000-0002-2938-5616
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Aimiyekagbon OK, Löwen A, Bender A, Muth L, Sextro W. Expert-Informed Hierarchical
Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System. In: Proceedings
of the Asia Pacific Conference of the PHM Society 2023 . Vol 4. ; 2023. doi:10.36001/phmap.2023.v4i1.3596'
apa: Aimiyekagbon, O. K., Löwen, A., Bender, A., Muth, L., & Sextro, W. (2023).
Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft
Propulsion System. Proceedings of the Asia Pacific Conference of the PHM Society
2023 , 4(1). https://doi.org/10.36001/phmap.2023.v4i1.3596
bibtex: '@inproceedings{Aimiyekagbon_Löwen_Bender_Muth_Sextro_2023, title={Expert-Informed
Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System},
volume={4}, DOI={10.36001/phmap.2023.v4i1.3596},
number={1}, booktitle={Proceedings of the Asia Pacific Conference of the PHM Society
2023 }, author={Aimiyekagbon, Osarenren Kennedy and Löwen, Alexander and Bender,
Amelie and Muth, Lars and Sextro, Walter}, year={2023} }'
chicago: Aimiyekagbon, Osarenren Kennedy, Alexander Löwen, Amelie Bender, Lars Muth,
and Walter Sextro. “Expert-Informed Hierarchical Diagnostics of Multiple Fault
Modes of a Spacecraft Propulsion System.” In Proceedings of the Asia Pacific
Conference of the PHM Society 2023 , Vol. 4, 2023. https://doi.org/10.36001/phmap.2023.v4i1.3596.
ieee: 'O. K. Aimiyekagbon, A. Löwen, A. Bender, L. Muth, and W. Sextro, “Expert-Informed
Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft Propulsion System,”
in Proceedings of the Asia Pacific Conference of the PHM Society 2023 ,
2023, vol. 4, no. 1, doi: 10.36001/phmap.2023.v4i1.3596.'
mla: Aimiyekagbon, Osarenren Kennedy, et al. “Expert-Informed Hierarchical Diagnostics
of Multiple Fault Modes of a Spacecraft Propulsion System.” Proceedings of
the Asia Pacific Conference of the PHM Society 2023 , vol. 4, no. 1, 2023,
doi:10.36001/phmap.2023.v4i1.3596.
short: 'O.K. Aimiyekagbon, A. Löwen, A. Bender, L. Muth, W. Sextro, in: Proceedings
of the Asia Pacific Conference of the PHM Society 2023 , 2023.'
date_created: 2023-09-18T07:52:32Z
date_updated: 2023-09-21T14:51:27Z
department:
- _id: '151'
doi: 10.36001/phmap.2023.v4i1.3596
intvolume: ' 4'
issue: '1'
keyword:
- PHM
- Fault Diagnostics
- Multiple Fault Modes
- Expert-Informed Diagnostics
- Anomaly Detection
language:
- iso: eng
main_file_link:
- open_access: '1'
url: https://www.papers.phmsociety.org/index.php/phmap/article/view/3596
oa: '1'
publication: 'Proceedings of the Asia Pacific Conference of the PHM Society 2023 '
quality_controlled: '1'
status: public
title: Expert-Informed Hierarchical Diagnostics of Multiple Fault Modes of a Spacecraft
Propulsion System
type: conference
user_id: '77313'
volume: 4
year: '2023'
...
---
_id: '47234'
author:
- first_name: Birte
full_name: Sehlmeyer, Birte
last_name: Sehlmeyer
- first_name: 'Rebecca '
full_name: 'Kampmann, Rebecca '
last_name: Kampmann
- first_name: Claus
full_name: Scheidemann, Claus
id: '38259'
last_name: Scheidemann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: 'Mathias '
full_name: 'Getzlaff, Mathias '
last_name: Getzlaff
citation:
ama: 'Sehlmeyer B, Kampmann R, Scheidemann C, Hemsel T, Getzlaff M. Burst Mode of
Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells.
In: Deutsche Physikalische Gesellschaft e. V., ed. Frühjahrstagung 2023, Sektion
Kondensierte Materie (SKM). ; 2023.'
apa: Sehlmeyer, B., Kampmann, R., Scheidemann, C., Hemsel, T., & Getzlaff, M.
(2023). Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction
of Tumor Cells. In Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung
2023, Sektion Kondensierte Materie (SKM).
bibtex: '@inproceedings{Sehlmeyer_Kampmann_Scheidemann_Hemsel_Getzlaff_2023, title={Burst
Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor
Cells}, booktitle={Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM)},
author={Sehlmeyer, Birte and Kampmann, Rebecca and Scheidemann, Claus and Hemsel,
Tobias and Getzlaff, Mathias }, editor={Deutsche Physikalische Gesellschaft e.
V.}, year={2023} }'
chicago: Sehlmeyer, Birte, Rebecca Kampmann, Claus Scheidemann, Tobias Hemsel,
and Mathias Getzlaff. “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation
and Destruction of Tumor Cells.” In Frühjahrstagung 2023, Sektion Kondensierte
Materie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.
ieee: B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst
Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor
Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), Dresden,
2023.
mla: Sehlmeyer, Birte, et al. “Burst Mode of Ultrasonic Resonant Oscillations for
Stimulation and Destruction of Tumor Cells.” Frühjahrstagung 2023, Sektion
Kondensierte Materie (SKM), edited by Deutsche Physikalische Gesellschaft
e. V., 2023.
short: 'B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche
Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte
Materie (SKM), 2023.'
conference:
end_date: 2023-03-31
location: Dresden
name: 'Deutsche Physikalische Gesellschaft e. V., Frühjahrstagung 2023, Sektion
Kondensierte Marterie (SKM) '
start_date: 2023-03-26
corporate_editor:
- Deutsche Physikalische Gesellschaft e. V.
date_created: 2023-09-22T12:13:25Z
date_updated: 2023-09-28T09:58:48Z
department:
- _id: '151'
language:
- iso: eng
publication: Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM)
related_material:
link:
- relation: confirmation
url: https://www.dpg-verhandlungen.de/year/2023/conference/skm/part/bp/session/28/contribution/27
status: public
title: Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction
of Tumor Cells
type: conference_abstract
user_id: '210'
year: '2023'
...
---
_id: '47235'
author:
- first_name: Rebecca
full_name: Kampmann, Rebecca
last_name: Kampmann
- first_name: Birte
full_name: Sehlmeyer, Birte
last_name: Sehlmeyer
- first_name: Claus
full_name: Scheidemann, Claus
id: '38259'
last_name: Scheidemann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Mathias
full_name: Getzlaff, Mathias
last_name: Getzlaff
citation:
ama: 'Kampmann R, Sehlmeyer B, Scheidemann C, Hemsel T, Getzlaff M. Burst Mode Characteristics
of an Ultrasonic Transducer for Treatment of Cancer Cells. In: Deutsche Physikalische
Gesellschaft e. V., ed. Frühjahrstagung 2023, Sektion Kondensierte Marterie
(SKM). ; 2023.'
apa: Kampmann, R., Sehlmeyer, B., Scheidemann, C., Hemsel, T., & Getzlaff, M.
(2023). Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of
Cancer Cells. In Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung
2023, Sektion Kondensierte Marterie (SKM).
bibtex: '@inproceedings{Kampmann_Sehlmeyer_Scheidemann_Hemsel_Getzlaff_2023, title={Burst
Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells},
booktitle={Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM)}, author={Kampmann,
Rebecca and Sehlmeyer, Birte and Scheidemann, Claus and Hemsel, Tobias and Getzlaff,
Mathias}, editor={Deutsche Physikalische Gesellschaft e. V.}, year={2023} }'
chicago: Kampmann, Rebecca, Birte Sehlmeyer, Claus Scheidemann, Tobias Hemsel, and
Mathias Getzlaff. “Burst Mode Characteristics of an Ultrasonic Transducer for
Treatment of Cancer Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Marterie
(SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.
ieee: R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst
Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells,”
in Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), Dresden,
2023.
mla: Kampmann, Rebecca, et al. “Burst Mode Characteristics of an Ultrasonic Transducer
for Treatment of Cancer Cells.” Frühjahrstagung 2023, Sektion Kondensierte
Marterie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.
short: 'R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche
Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte
Marterie (SKM), 2023.'
conference:
end_date: 2023-03-31
location: Dresden
name: Deutsche Physikalische Gesellschaft e. V., Frühjahrstagung 2023, Sektion Kondensierte
Marterie (SKM)
start_date: 2023-03-26
corporate_editor:
- Deutsche Physikalische Gesellschaft e. V.
date_created: 2023-09-22T12:19:07Z
date_updated: 2023-09-28T09:54:55Z
department:
- _id: '151'
language:
- iso: eng
publication: Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM)
related_material:
link:
- relation: confirmation
url: https://www.dpg-verhandlungen.de/year/2023/conference/skm/part/bp/session/28/contribution/26
status: public
title: Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer
Cells
type: conference_abstract
user_id: '210'
year: '2023'
...
---
_id: '51117'
author:
- first_name: Claus
full_name: Scheidemann, Claus
id: '38259'
last_name: Scheidemann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Olga
full_name: Friesen, Olga
id: '44026'
last_name: Friesen
- first_name: Leander
full_name: Claes, Leander
id: '11829'
last_name: Claes
orcid: 0000-0002-4393-268X
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Scheidemann C, Hemsel T, Friesen O, Claes L, Sextro W. Influence of Temperature
and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics.
In: ; 2023.'
apa: Scheidemann, C., Hemsel, T., Friesen, O., Claes, L., & Sextro, W. (2023).
Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior
of Ring-Shaped Ceramics. 7th International Conference on Advanced Electromaterials
(ICAE 2023), Jeju, Korea.
bibtex: '@inproceedings{Scheidemann_Hemsel_Friesen_Claes_Sextro_2023, title={Influence
of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped
Ceramics}, author={Scheidemann, Claus and Hemsel, Tobias and Friesen, Olga and
Claes, Leander and Sextro, Walter}, year={2023} }'
chicago: Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter
Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material
Behavior of Ring-Shaped Ceramics,” 2023.
ieee: C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence
of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped
Ceramics,” presented at the 7th International Conference on Advanced Electromaterials
(ICAE 2023), Jeju, Korea, 2023.
mla: Scheidemann, Claus, et al. Influence of Temperature and Pre-Stress on the
Piezoelectric Material Behavior of Ring-Shaped Ceramics. 2023.
short: 'C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.'
conference:
end_date: 2023-11-03
location: Jeju, Korea
name: 7th International Conference on Advanced Electromaterials (ICAE 2023)
start_date: 2023-10-31
date_created: 2024-02-01T15:55:44Z
date_updated: 2024-02-01T16:54:33Z
department:
- _id: '151'
- _id: '49'
language:
- iso: eng
project:
- _id: '108'
grant_number: FOR 5208
name: 'NEPTUN: Modellbasierte Bestimmung nichtlinearer Eigenschaften von Piezokeramiken
für Leistungsschallanwendungen'
status: public
title: Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior
of Ring-Shaped Ceramics
type: conference_abstract
user_id: '38259'
year: '2023'
...
---
_id: '51118'
author:
- first_name: Claus
full_name: Scheidemann, Claus
id: '38259'
last_name: Scheidemann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Olga
full_name: Friesen, Olga
id: '44026'
last_name: Friesen
- first_name: Leander
full_name: Claes, Leander
id: '11829'
last_name: Claes
orcid: 0000-0002-4393-268X
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Scheidemann C, Hemsel T, Friesen O, Claes L, Sextro W. Influence of Temperature
and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics.
In: ; 2023.'
apa: Scheidemann, C., Hemsel, T., Friesen, O., Claes, L., & Sextro, W. (2023).
Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior
of Ring-Shaped Ceramics. International Conference on Functional Materials
& Devices 2023 (ICFMD 2023), Incheon, Korea.
bibtex: '@inproceedings{Scheidemann_Hemsel_Friesen_Claes_Sextro_2023, title={Influence
of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped
Ceramics}, author={Scheidemann, Claus and Hemsel, Tobias and Friesen, Olga and
Claes, Leander and Sextro, Walter}, year={2023} }'
chicago: Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter
Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material
Behavior of Ring-Shaped Ceramics,” 2023.
ieee: C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence
of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped
Ceramics,” presented at the International Conference on Functional Materials &
Devices 2023 (ICFMD 2023), Incheon, Korea, 2023.
mla: Scheidemann, Claus, et al. Influence of Temperature and Pre-Stress on the
Piezoelectric Material Behavior of Ring-Shaped Ceramics. 2023.
short: 'C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.'
conference:
location: Incheon, Korea
name: International Conference on Functional Materials & Devices 2023 (ICFMD 2023)
date_created: 2024-02-01T16:00:19Z
date_updated: 2024-02-01T16:55:09Z
department:
- _id: '151'
- _id: '49'
language:
- iso: eng
project:
- _id: '108'
grant_number: FOR 5208
name: 'NEPTUN: Modellbasierte Bestimmung nichtlinearer Eigenschaften von Piezokeramiken
für Leistungsschallanwendungen'
status: public
title: Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior
of Ring-Shaped Ceramics
type: conference_abstract
user_id: '38259'
year: '2023'
...
---
_id: '51119'
author:
- first_name: Claus
full_name: Scheidemann, Claus
id: '38259'
last_name: Scheidemann
- first_name: Oliver Ernst Caspar
full_name: Hagedorn, Oliver Ernst Caspar
id: '53321'
last_name: Hagedorn
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Scheidemann C, Hagedorn OEC, Hemsel T, Sextro W. Experimental Investigation
of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process.
In: ; 2023.'
apa: Scheidemann, C., Hagedorn, O. E. C., Hemsel, T., & Sextro, W. (2023). Experimental
Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding
Process. International Conference on Functional Materials & Devices 2023
(ICFMD 2023), Jeju, Korea.
bibtex: '@inproceedings{Scheidemann_Hagedorn_Hemsel_Sextro_2023, title={Experimental
Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding
Process}, author={Scheidemann, Claus and Hagedorn, Oliver Ernst Caspar and Hemsel,
Tobias and Sextro, Walter}, year={2023} }'
chicago: Scheidemann, Claus, Oliver Ernst Caspar Hagedorn, Tobias Hemsel, and Walter
Sextro. “Experimental Investigation of Bond Formation and Wire Deformation in
the Ultrasonic Wire Bonding Process,” 2023.
ieee: C. Scheidemann, O. E. C. Hagedorn, T. Hemsel, and W. Sextro, “Experimental
Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding
Process,” presented at the International Conference on Functional Materials &
Devices 2023 (ICFMD 2023), Jeju, Korea, 2023.
mla: Scheidemann, Claus, et al. Experimental Investigation of Bond Formation
and Wire Deformation in the Ultrasonic Wire Bonding Process. 2023.
short: 'C. Scheidemann, O.E.C. Hagedorn, T. Hemsel, W. Sextro, in: 2023.'
conference:
end_date: 2023-11-03
location: Jeju, Korea
name: International Conference on Functional Materials & Devices 2023 (ICFMD 2023)
start_date: 2023-10-31
date_created: 2024-02-01T16:03:41Z
date_updated: 2024-02-01T16:04:33Z
department:
- _id: '151'
language:
- iso: eng
status: public
title: Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic
Wire Bonding Process
type: conference_abstract
user_id: '38259'
year: '2023'
...
---
_id: '51338'
author:
- first_name: Jan
full_name: Schütte, Jan
id: '22109'
last_name: Schütte
orcid: 0000-0001-9025-9742
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schütte J, Sextro W. Einfluss der Radhubkinematik auf den Reifenverschleiß.
In: 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn. Vol 2425. VDI-Berichte.
VDI Verlag GmbH; 2023:165-180.'
apa: Schütte, J., & Sextro, W. (2023). Einfluss der Radhubkinematik auf den
Reifenverschleiß. In 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn (Vol.
2425, pp. 165–180). VDI Verlag GmbH.
bibtex: '@inbook{Schütte_Sextro_2023, series={VDI-Berichte}, title={Einfluss der
Radhubkinematik auf den Reifenverschleiß}, volume={2425}, booktitle={20. VDI-Fachtagung
Reifen - Fahrwerk - Fahrbahn}, publisher={VDI Verlag GmbH}, author={Schütte, Jan
and Sextro, Walter}, year={2023}, pages={165–180}, collection={VDI-Berichte} }'
chicago: Schütte, Jan, and Walter Sextro. “Einfluss der Radhubkinematik auf den
Reifenverschleiß.” In 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn,
2425:165–80. VDI-Berichte. VDI Verlag GmbH, 2023.
ieee: J. Schütte and W. Sextro, “Einfluss der Radhubkinematik auf den Reifenverschleiß,”
in 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn, vol. 2425, VDI Verlag
GmbH, 2023, pp. 165–180.
mla: Schütte, Jan, and Walter Sextro. “Einfluss der Radhubkinematik auf den Reifenverschleiß.”
20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn, vol. 2425, VDI Verlag
GmbH, 2023, pp. 165–80.
short: 'J. Schütte, W. Sextro, in: 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn,
VDI Verlag GmbH, 2023, pp. 165–180.'
conference:
end_date: 2023-11-09
location: Karlsruhe
name: 20. VDI Fachtagung Reifen - Fahrwerk - Fahrbahn
start_date: 2023-11-08
date_created: 2024-02-13T11:29:58Z
date_updated: 2024-03-12T13:15:28Z
department:
- _id: '151'
intvolume: ' 2425'
language:
- iso: ger
page: 165-180
publication: 20. VDI-Fachtagung Reifen - Fahrwerk - Fahrbahn
publication_identifier:
unknown:
- 978-3-18-092425-0
publication_status: published
publisher: VDI Verlag GmbH
series_title: VDI-Berichte
status: public
title: Einfluss der Radhubkinematik auf den Reifenverschleiß
type: book_chapter
user_id: '22109'
volume: 2425
year: '2023'
...
---
_id: '34272'
abstract:
- lang: ger
text: Das Ultraschall-Dickdrahtbonden mit Aluminiumdraht ist ein Standardverfahren
zur elektrischenKontaktierung von Leistungshalbleitermodulen. Die steigenden Anforderungen
an die Effizienzund Zuverlässigkeit der Module haben zu technologischen Weiterentwicklungen
geführt und eswerden vermehrt Kupferdrähte mit wesentlich besseren elektrischen
und thermischen Eigenschafteneingesetzt. Hieraus resultieren durch höhere Prozesskräfte
und Ultraschallleistung neueHerausforderungen bei der Prozessentwicklung; hierfür
wird ein Simulationsmodell zur Verbesserungder Prozessentwicklung entwickelt.In
Ultraschall-Drahtbondversuchen mit 400 m Aluminium und Kupfer Drähten wurde der
Einflussder Prozessparameter auf die Bondqualität untersucht; diese Ergebnisse
und zusätzliche Messungender Drahtdeformation und Schwingungen wurden für die
Formulierung der Anforderungenund zur Validierung der Ergebnisse des Simulationsmodells
genutzt.Es wurde ein Prozessmodell, basierend auf einer Co-Simulation zwischen
MATLAB und ANSYS,entwickelt; hierbei wurden die phyiskalischen Phänomene wie die
Ultraschall Werkstoffentfestigung,der Verbindungsaufbau und die dynamischen Systemeigenschaften
abgebildet.Basierend auf einer Zug-Druck-Prüfmaschine wurde ein Prüfstand zur
Identifikation der Modellparameterentwickelt. In zusätzlichen Druckversuchen mit
den Bonddrähten mit und ohneUltraschallanregung wurde die Reduktion der Umformkräfte
unter Ultraschalleinfluss untersucht.Mit dem entwickelten Prozessmodell wurden
die Parameterstudien aus den Ultraschall-Drahtbondversuchensimuliert und direkt
mit den experimentellen Ergebnissen verglichen, wobei sich einerelativ gute Übereinstimmung
zwischen Simulation und Messung sowohl für Aluminium, als auchfür Kupfer, erzielen
ließ.
- lang: eng
text: Ultrasonic heavy wire bonding with aluminium wire is a standard process to
produce electricalcontacts in power semiconductor modules. The increasing demands
on the efficiency and reliabilityof the modules have led to technological developments
and copper wires with significantlybetter electrical and thermal properties are
used more often nowadays. This results in new challengesin process development
due to higher process forces and ultrasonic power; for this purpose,a simulation
model is developed to improve process development.Ultrasonic wire bonding tests
with 400 m aluminium and copper wires were carried out to investigatethe influence
of the process parameters on the bond quality; these results and additionalmeasurements
of wire deformation and vibrations were used to define the requirements for themodel
and validate the results of the simulation.A process model based on a co-simulation
was developed between MATLAB and ANSYS; thephysical phenomena such as ultrasonic
softening of the wire material, bond formation and dynamicbehaviour of the components
were considered.Based on a tensile-compression testing machine, a test rig was
developed to identify the modelparameters. In additional compression tests with
the wires with and without ultrasonic excitation,the reduction of the forming
forces under ultrasonic influence was characterised.With the developed process
model, the parameter studies from the ultrasonic wire bond testswere simulated
and directly compared with the experimental results; a relative good agreementbetween
simulation and measurement could be achieved for both aluminium and copper.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
citation:
ama: Schemmel R. Enhanced Process Development by Simulation of Ultrasonic Heavy
Wire Bonding. Vol 13. Shaker; 2022. doi:10.17619/UNIPB/1-1280
apa: Schemmel, R. (2022). Enhanced process development by simulation of ultrasonic
heavy wire bonding (Vol. 13). Shaker. https://doi.org/10.17619/UNIPB/1-1280
bibtex: '@book{Schemmel_2022, series={Schriften des Lehrstuhls für Dynamik und Mechatronik},
title={Enhanced process development by simulation of ultrasonic heavy wire bonding},
volume={13}, DOI={10.17619/UNIPB/1-1280},
publisher={Shaker}, author={Schemmel, Reinhard}, year={2022}, collection={Schriften
des Lehrstuhls für Dynamik und Mechatronik} }'
chicago: Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic
Heavy Wire Bonding. Vol. 13. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik.
Shaker, 2022. https://doi.org/10.17619/UNIPB/1-1280.
ieee: R. Schemmel, Enhanced process development by simulation of ultrasonic heavy
wire bonding, vol. 13. Shaker, 2022.
mla: Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic
Heavy Wire Bonding. Shaker, 2022, doi:10.17619/UNIPB/1-1280.
short: R. Schemmel, Enhanced Process Development by Simulation of Ultrasonic Heavy
Wire Bonding, Shaker, 2022.
date_created: 2022-12-07T14:03:17Z
date_updated: 2022-12-07T14:15:23Z
department:
- _id: '151'
doi: 10.17619/UNIPB/1-1280
intvolume: ' 13'
language:
- iso: eng
main_file_link:
- open_access: '1'
url: https://digital.ub.uni-paderborn.de/hs/id/6223291
oa: '1'
page: '174'
publication_identifier:
isbn:
- "\t978-3-8440-8527-3"
publication_status: published
publisher: Shaker
related_material:
link:
- relation: dissertation_contains
url: https://www.shaker.eu/en/content/catalogue/index.asp?lang=en&ID=8&ISBN=978-3-8440-8527-3&search=yes
series_title: Schriften des Lehrstuhls für Dynamik und Mechatronik
status: public
supervisor:
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
title: Enhanced process development by simulation of ultrasonic heavy wire bonding
type: dissertation
user_id: '210'
volume: 13
year: '2022'
...
---
_id: '29934'
abstract:
- lang: eng
text: Tire and road wear are a major source of emissions of nonexhaust particulate
matter (PM) and make up the largest share of microplastics in the environment.
To reduce tire wear through numerical optimization of a vehicle's suspension system,
fast simulations of the representative usage of a vehicle are needed. Therefore,
this contribution evaluates if instead of a full simulation of a representative
test drive, only specific driving maneuvers resulting from a clustering of the
driving data can be used to predict tire wear. As a measure for tire wear, the
friction work between tire and road is calculated. It is shown that enough clusters
result in negligible deviations between the total friction work of the full simulation
and the cluster simulations as well as between the distributions of the friction
work over the tire width. The calculation time can be reduced to about 1% of the
full simulation.
author:
- first_name: Lars
full_name: Muth, Lars
id: '77313'
last_name: Muth
orcid: 0000-0002-2938-5616
- first_name: Christian
full_name: Noll, Christian
last_name: Noll
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Muth L, Noll C, Sextro W. Generation of a Reduced, Representative, Virtual
Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data. In:
Orlova A, Cole D, eds. Advances in Dynamics of Vehicles on Roads and Tracks
II - Proceedings of the 27th Symposium of the International Association of Vehicle
System Dynamics, IAVSD 2021. Lecture Notes in Mechanical Engineering. Springer;
2022. doi:10.1007/978-3-031-07305-2_92'
apa: Muth, L., Noll, C., & Sextro, W. (2022). Generation of a Reduced, Representative,
Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data.
In A. Orlova & D. Cole (Eds.), Advances in Dynamics of Vehicles on Roads
and Tracks II - Proceedings of the 27th Symposium of the International Association
of Vehicle System Dynamics, IAVSD 2021. Springer. https://doi.org/10.1007/978-3-031-07305-2_92
bibtex: '@inproceedings{Muth_Noll_Sextro_2022, place={Cham}, series={Lecture Notes
in Mechanical Engineering}, title={Generation of a Reduced, Representative, Virtual
Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data}, DOI={10.1007/978-3-031-07305-2_92},
booktitle={Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings
of the 27th Symposium of the International Association of Vehicle System Dynamics,
IAVSD 2021}, publisher={Springer}, author={Muth, Lars and Noll, Christian and
Sextro, Walter}, editor={Orlova, Anna and Cole, David}, year={2022}, collection={Lecture
Notes in Mechanical Engineering} }'
chicago: 'Muth, Lars, Christian Noll, and Walter Sextro. “Generation of a Reduced,
Representative, Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering
of Driving Data.” In Advances in Dynamics of Vehicles on Roads and Tracks II
- Proceedings of the 27th Symposium of the International Association of Vehicle
System Dynamics, IAVSD 2021, edited by Anna Orlova and David Cole. Lecture
Notes in Mechanical Engineering. Cham: Springer, 2022. https://doi.org/10.1007/978-3-031-07305-2_92.'
ieee: 'L. Muth, C. Noll, and W. Sextro, “Generation of a Reduced, Representative,
Virtual Test Drive for Fast Evaluation of Tire Wear by Clustering of Driving Data,”
in Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings of
the 27th Symposium of the International Association of Vehicle System Dynamics,
IAVSD 2021, Saint Petersburg, Russia, 2022, doi: 10.1007/978-3-031-07305-2_92.'
mla: Muth, Lars, et al. “Generation of a Reduced, Representative, Virtual Test Drive
for Fast Evaluation of Tire Wear by Clustering of Driving Data.” Advances in
Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium
of the International Association of Vehicle System Dynamics, IAVSD 2021, edited
by Anna Orlova and David Cole, Springer, 2022, doi:10.1007/978-3-031-07305-2_92.
short: 'L. Muth, C. Noll, W. Sextro, in: A. Orlova, D. Cole (Eds.), Advances in
Dynamics of Vehicles on Roads and Tracks II - Proceedings of the 27th Symposium
of the International Association of Vehicle System Dynamics, IAVSD 2021, Springer,
Cham, 2022.'
conference:
end_date: 2021-08-19
location: Saint Petersburg, Russia
name: 27th IAVSD Symposium on Dynamics of Vehicles on Roads and Tracks, IAVSD 2021
start_date: 2021-08-17
date_created: 2022-02-21T14:14:11Z
date_updated: 2022-08-23T11:55:07Z
department:
- _id: '151'
doi: 10.1007/978-3-031-07305-2_92
editor:
- first_name: Anna
full_name: Orlova, Anna
last_name: Orlova
- first_name: David
full_name: Cole, David
last_name: Cole
keyword:
- Tire Wear
- Vehicle Dynamics
- Clustering
- Virtual Test
language:
- iso: eng
main_file_link:
- url: https://link.springer.com/chapter/10.1007/978-3-031-07305-2_92
place: Cham
publication: Advances in Dynamics of Vehicles on Roads and Tracks II - Proceedings
of the 27th Symposium of the International Association of Vehicle System Dynamics,
IAVSD 2021
publication_identifier:
eisbn:
- 978-3-031-07305-2
isbn:
- 978-3-031-07304-5
publication_status: published
publisher: Springer
quality_controlled: '1'
series_title: Lecture Notes in Mechanical Engineering
status: public
title: Generation of a Reduced, Representative, Virtual Test Drive for Fast Evaluation
of Tire Wear by Clustering of Driving Data
type: conference
user_id: '77313'
year: '2022'
...
---
_id: '33500'
abstract:
- lang: eng
text: 'This article is dedicated to piezoelectric ultrasonic power transducers that
differ to well known medical ultrasonic diagnostic apparatus or non destructive
testing devices by the level of power in use; typically several tens of up to
more than thousand watts are used in a multitude of different applications. After
a short introduction including historical development, the first focus is on theoretical
background of the operating principle, design and mechanical modeling. As piezoelectric
elements transform electrical to mechanical energy and vice versa, equivalent
circuit modeling is also described. After that, sample applications are delineated
by the matter wherein ultrasound generates unique effects: incredible high pressure
level as well in air as in water, micro-bubbles generating temperature peaks for
very short time instances in fluids, acoustoplastic effect, enhancement of diffusion
and recrystallization in solids, friction manipulation, incremental deformation
and micro-cracking of surfaces, or even generation of macroscopic movements in
motors. At the end, some future directions ranging from novel modeling approaches
to advanced control and new materials are addressed.'
author:
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Jens
full_name: Twiefel, Jens
last_name: Twiefel
citation:
ama: 'Hemsel T, Twiefel J. Piezoelectric Ultrasonic Power Transducers. In: Reference
Module in Materials Science and Materials Engineering. Elsevier; 2022. doi:10.1016/b978-0-12-819728-8.00047-4'
apa: Hemsel, T., & Twiefel, J. (2022). Piezoelectric Ultrasonic Power Transducers.
In Reference Module in Materials Science and Materials Engineering. Elsevier.
https://doi.org/10.1016/b978-0-12-819728-8.00047-4
bibtex: '@inbook{Hemsel_Twiefel_2022, title={Piezoelectric Ultrasonic Power Transducers},
DOI={10.1016/b978-0-12-819728-8.00047-4},
booktitle={Reference Module in Materials Science and Materials Engineering}, publisher={Elsevier},
author={Hemsel, Tobias and Twiefel, Jens}, year={2022} }'
chicago: Hemsel, Tobias, and Jens Twiefel. “Piezoelectric Ultrasonic Power Transducers.”
In Reference Module in Materials Science and Materials Engineering. Elsevier,
2022. https://doi.org/10.1016/b978-0-12-819728-8.00047-4.
ieee: T. Hemsel and J. Twiefel, “Piezoelectric Ultrasonic Power Transducers,” in
Reference Module in Materials Science and Materials Engineering, Elsevier,
2022.
mla: Hemsel, Tobias, and Jens Twiefel. “Piezoelectric Ultrasonic Power Transducers.”
Reference Module in Materials Science and Materials Engineering, Elsevier,
2022, doi:10.1016/b978-0-12-819728-8.00047-4.
short: 'T. Hemsel, J. Twiefel, in: Reference Module in Materials Science and Materials
Engineering, Elsevier, 2022.'
date_created: 2022-09-30T09:35:16Z
date_updated: 2022-09-30T09:41:47Z
department:
- _id: '151'
doi: 10.1016/b978-0-12-819728-8.00047-4
keyword:
- Equivalent circuit model
- Langevin transducer
- Lumped parameter model
- Piezoelectric transducer
- Ultrasonic processes
- Ultrasound
language:
- iso: eng
main_file_link:
- url: https://www.sciencedirect.com/science/article/pii/B9780128197288000474
publication: Reference Module in Materials Science and Materials Engineering
publication_identifier:
isbn:
- 978-0-12-803581-8
publication_status: published
publisher: Elsevier
quality_controlled: '1'
status: public
title: Piezoelectric Ultrasonic Power Transducers
type: book_chapter
user_id: '210'
year: '2022'
...
---
_id: '29727'
author:
- first_name: Meike Claudia
full_name: Wohlleben, Meike Claudia
id: '43991'
last_name: Wohlleben
- first_name: Amelie
full_name: Bender, Amelie
id: '54290'
last_name: Bender
- first_name: Sebastian
full_name: Peitz, Sebastian
id: '47427'
last_name: Peitz
orcid: 0000-0002-3389-793X
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Wohlleben MC, Bender A, Peitz S, Sextro W. Development of a Hybrid Modeling
Methodology for Oscillating Systems with Friction. In: Machine Learning, Optimization,
and Data Science. Springer International Publishing; 2022. doi:10.1007/978-3-030-95470-3_8'
apa: Wohlleben, M. C., Bender, A., Peitz, S., & Sextro, W. (2022). Development
of a Hybrid Modeling Methodology for Oscillating Systems with Friction. In Machine
Learning, Optimization, and Data Science. Springer International Publishing.
https://doi.org/10.1007/978-3-030-95470-3_8
bibtex: '@inbook{Wohlleben_Bender_Peitz_Sextro_2022, place={Cham}, title={Development
of a Hybrid Modeling Methodology for Oscillating Systems with Friction}, DOI={10.1007/978-3-030-95470-3_8},
booktitle={Machine Learning, Optimization, and Data Science}, publisher={Springer
International Publishing}, author={Wohlleben, Meike Claudia and Bender, Amelie
and Peitz, Sebastian and Sextro, Walter}, year={2022} }'
chicago: 'Wohlleben, Meike Claudia, Amelie Bender, Sebastian Peitz, and Walter Sextro.
“Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction.”
In Machine Learning, Optimization, and Data Science. Cham: Springer International
Publishing, 2022. https://doi.org/10.1007/978-3-030-95470-3_8.'
ieee: 'M. C. Wohlleben, A. Bender, S. Peitz, and W. Sextro, “Development of a Hybrid
Modeling Methodology for Oscillating Systems with Friction,” in Machine Learning,
Optimization, and Data Science, Cham: Springer International Publishing, 2022.'
mla: Wohlleben, Meike Claudia, et al. “Development of a Hybrid Modeling Methodology
for Oscillating Systems with Friction.” Machine Learning, Optimization, and
Data Science, Springer International Publishing, 2022, doi:10.1007/978-3-030-95470-3_8.
short: 'M.C. Wohlleben, A. Bender, S. Peitz, W. Sextro, in: Machine Learning, Optimization,
and Data Science, Springer International Publishing, Cham, 2022.'
date_created: 2022-02-03T10:30:23Z
date_updated: 2023-04-26T12:10:58Z
department:
- _id: '151'
- _id: '655'
doi: 10.1007/978-3-030-95470-3_8
language:
- iso: eng
main_file_link:
- url: https://link.springer.com/content/pdf/10.1007%2F978-3-030-95470-3_8.pdf
place: Cham
publication: Machine Learning, Optimization, and Data Science
publication_identifier:
isbn:
- '9783030954697'
- '9783030954703'
issn:
- 0302-9743
- 1611-3349
publication_status: published
publisher: Springer International Publishing
quality_controlled: '1'
status: public
title: Development of a Hybrid Modeling Methodology for Oscillating Systems with Friction
type: book_chapter
user_id: '43991'
year: '2022'
...
---
_id: '30371'
abstract:
- lang: eng
text: "To achieve optimum bond results at ultrasonic bonding thick copper wire on
sensitive components is quite challenging.\r\nBearing in mind that high normal
force and ultrasonic power are needed for bond quality but as well increase stress
and finally failure risk of the substrate, methods should be found to achieve
high bond quality even at lower bond parameters. Therefore, bond experiments with
different bond tool grove geometries have been conducted for copper and aluminum
wire on direct copper bonded (DCB) substrates to investigate the impact of geometric
parameters on bond formation and bond quality. The wire material depending impact
of geometry changes on the bond formation and deformation was quantified. Additionally,
a bonding parameter design of experiments (DOE) has been conducted for the reference
and the most promising groove geometry. Higher shear values were achieved at reduced
vertical tool displacement for most bonding parameter combinations, compared to
the reference tool. This behavior allows for reducing ultrasonic power to obtain
equal shear values; consequently, mechanical stresses in the interface decrease.
This could potentially reduce the risk of chip damage and thus yield loss."
author:
- first_name: Oliver Ernst Caspar
full_name: Hagedorn, Oliver Ernst Caspar
id: '53321'
last_name: Hagedorn
- first_name: Marian
full_name: Broll, Marian
last_name: Broll
- first_name: Olaf
full_name: Kirsch, Olaf
last_name: Kirsch
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Hagedorn OEC, Broll M, Kirsch O, Hemsel T, Sextro W. Experimental Investigation
of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic
Thick Wire Bonding. In: CIPS 2022 - 12th International Conference on Integrated
Power Electronics Systems. VDE VERLAG GMBH; 2022:138-143.'
apa: Hagedorn, O. E. C., Broll, M., Kirsch, O., Hemsel, T., & Sextro, W. (2022).
Experimental Investigation of the Influence of different Bond Tool Grooves on
the Bond Quality for Ultrasonic Thick Wire Bonding. CIPS 2022 - 12th International
Conference on Integrated Power Electronics Systems, 138–143.
bibtex: '@inproceedings{Hagedorn_Broll_Kirsch_Hemsel_Sextro_2022, place={Berlin},
title={Experimental Investigation of the Influence of different Bond Tool Grooves
on the Bond Quality for Ultrasonic Thick Wire Bonding}, booktitle={CIPS 2022 -
12th International Conference on Integrated Power Electronics Systems}, publisher={VDE
VERLAG GMBH}, author={Hagedorn, Oliver Ernst Caspar and Broll, Marian and Kirsch,
Olaf and Hemsel, Tobias and Sextro, Walter}, year={2022}, pages={138–143} }'
chicago: 'Hagedorn, Oliver Ernst Caspar, Marian Broll, Olaf Kirsch, Tobias Hemsel,
and Walter Sextro. “Experimental Investigation of the Influence of Different Bond
Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” In CIPS
2022 - 12th International Conference on Integrated Power Electronics Systems,
138–43. Berlin: VDE VERLAG GMBH, 2022.'
ieee: O. E. C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental
Investigation of the Influence of different Bond Tool Grooves on the Bond Quality
for Ultrasonic Thick Wire Bonding,” in CIPS 2022 - 12th International Conference
on Integrated Power Electronics Systems, Berlin, 2022, pp. 138–143.
mla: Hagedorn, Oliver Ernst Caspar, et al. “Experimental Investigation of the Influence
of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.”
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems,
VDE VERLAG GMBH, 2022, pp. 138–43.
short: 'O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022
- 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG
GMBH, Berlin, 2022, pp. 138–143.'
conference:
end_date: 2022.03.17
location: Berlin
name: CIPS 2022 - 12th International Conference on Integrated Power Electronics
Systems
start_date: 2022.03.15
date_created: 2022-03-17T15:00:06Z
date_updated: 2023-09-21T14:22:17Z
department:
- _id: '151'
language:
- iso: eng
page: 138-143
place: Berlin
publication: CIPS 2022 - 12th International Conference on Integrated Power Electronics
Systems
publication_identifier:
isbn:
- 'ISBN 978-3-8007-5757-2 '
publisher: VDE VERLAG GMBH
quality_controlled: '1'
status: public
title: Experimental Investigation of the Influence of different Bond Tool Grooves
on the Bond Quality for Ultrasonic Thick Wire Bonding
type: conference
user_id: '210'
year: '2022'
...
---
_id: '47159'
author:
- first_name: Osarenren Kennedy
full_name: Aimiyekagbon, Osarenren Kennedy
id: '9557'
last_name: Aimiyekagbon
- first_name: Amelie
full_name: Bender, Amelie
id: '54290'
last_name: Bender
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Aimiyekagbon OK, Bender A, Sextro W. On the applicability of time series features
as health indicators for technical systems operating under varying conditions.
Condition Monitor. 2022:5-10.
apa: Aimiyekagbon, O. K., Bender, A., & Sextro, W. (2022). On the applicability
of time series features as health indicators for technical systems operating under
varying conditions. Condition Monitor, 425, 5–10.
bibtex: '@article{Aimiyekagbon_Bender_Sextro_2022, title={On the applicability of
time series features as health indicators for technical systems operating under
varying conditions}, number={425}, journal={ Condition Monitor}, author={Aimiyekagbon,
Osarenren Kennedy and Bender, Amelie and Sextro, Walter}, year={2022}, pages={5–10}
}'
chicago: Aimiyekagbon, Osarenren Kennedy, Amelie Bender, and Walter Sextro. “On
the Applicability of Time Series Features as Health Indicators for Technical Systems
Operating under Varying Conditions.” Condition Monitor, 2022.
ieee: O. K. Aimiyekagbon, A. Bender, and W. Sextro, “On the applicability of time
series features as health indicators for technical systems operating under varying
conditions,” Condition Monitor, no. 425, pp. 5–10, 2022.
mla: Aimiyekagbon, Osarenren Kennedy, et al. “On the Applicability of Time Series
Features as Health Indicators for Technical Systems Operating under Varying Conditions.”
Condition Monitor, no. 425, 2022, pp. 5–10.
short: O.K. Aimiyekagbon, A. Bender, W. Sextro, Condition Monitor (2022) 5–10.
date_created: 2023-09-22T09:25:48Z
date_updated: 2023-09-22T09:29:51Z
department:
- _id: '151'
issue: '425'
language:
- iso: eng
page: 5 - 10
publication: ' Condition Monitor'
publication_date: 2022-08
publication_identifier:
issn:
- 0268-8050
publication_status: published
status: public
title: On the applicability of time series features as health indicators for technical
systems operating under varying conditions
type: newspaper_article
user_id: '9557'
year: '2022'
...
---
_id: '34104'
abstract:
- lang: eng
text: 'ue to the constantly growing energy demand of power electronics and the need
to reduce the size of electronic components like power modules for e-mobility,
new challenges arise for ultrasonic wire bonding: the electrical connection must
endure higher thermal and mechanical stress while the connecting partners become
more sensitive or require more energy to get bonded. Past investigations have
shown already that multi-dimensional ultrasonic bonding and welding yield the
same or even better bond quality while reducing the load on the components. This
contribution is intended to show whether multidi-mensional thick wire bonding
is a promising concept to over-come the new challenges. The focus is on experimental
investi-gations of different bond tool trajectories in ultrasonic wire bonding
of aluminum and copper wire on DCB''s and chips. The bond quality is analyzed
by shear tests, microsections and, in the case of aluminum bonding, by a new machine
learning method for an objective automated evaluation of the sheared area.'
author:
- first_name: Claus
full_name: Scheidemann, Claus
id: '38259'
last_name: Scheidemann
- first_name: Olaf
full_name: Kirsch, Olaf
last_name: Kirsch
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Scheidemann C, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of
Multidimensional Ultrasonic Heavy Wire Bonding. In: 2022 IEEE 9th Electronics
System-Integration Technology Conference (ESTC). IEEE; 2022. doi:10.1109/estc55720.2022.9939478'
apa: Scheidemann, C., Kirsch, O., Hemsel, T., & Sextro, W. (2022). Experimental
Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. 2022 IEEE
9th Electronics System-Integration Technology Conference (ESTC). https://doi.org/10.1109/estc55720.2022.9939478
bibtex: '@inproceedings{Scheidemann_Kirsch_Hemsel_Sextro_2022, title={Experimental
Investigation of Multidimensional Ultrasonic Heavy Wire Bonding}, DOI={10.1109/estc55720.2022.9939478},
booktitle={2022 IEEE 9th Electronics System-Integration Technology Conference
(ESTC)}, publisher={IEEE}, author={Scheidemann, Claus and Kirsch, Olaf and Hemsel,
Tobias and Sextro, Walter}, year={2022} }'
chicago: Scheidemann, Claus, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental
Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” In 2022 IEEE
9th Electronics System-Integration Technology Conference (ESTC). IEEE, 2022.
https://doi.org/10.1109/estc55720.2022.9939478.
ieee: 'C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation
of Multidimensional Ultrasonic Heavy Wire Bonding,” 2022, doi: 10.1109/estc55720.2022.9939478.'
mla: Scheidemann, Claus, et al. “Experimental Investigation of Multidimensional
Ultrasonic Heavy Wire Bonding.” 2022 IEEE 9th Electronics System-Integration
Technology Conference (ESTC), IEEE, 2022, doi:10.1109/estc55720.2022.9939478.
short: 'C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics
System-Integration Technology Conference (ESTC), IEEE, 2022.'
date_created: 2022-11-17T15:17:39Z
date_updated: 2023-09-22T12:24:18Z
department:
- _id: '151'
doi: 10.1109/estc55720.2022.9939478
language:
- iso: eng
publication: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
publication_status: published
publisher: IEEE
quality_controlled: '1'
status: public
title: Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding
type: conference
user_id: '38259'
year: '2022'
...