--- _id: '9959' abstract: - lang: eng text: Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical devices in power electronics. In order to facilitate powerful solutions combined with an increased efficiency, involving a material change from aluminum to copper wire as conductor material takes place in recent years. Due to the material related properties, copper wire bonding requires significant higher bond processing parameters such as bond force and ultrasonic power compared to aluminum which can lead to damages or a failure of the bonded component. Therefore, a profound knowledge of the processes prevailing during wire bonding is essential to optimize the application of the copper wires and consequently to achieve the demands on quality and reliability. The behavior of different natural surface oxides of aluminum and copper are assumed to be one reason for the deviation in the required bond parameters. Accordingly, the impact of differently pre-treated substrates surfaces on which the bonding is applied were investigated in this study. First, all conditions investigated (as-received, oxidefree, AlOx and the CuOx) were characterized by utilizing scanning electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam microscopy and atomic force microscopy. In addition, hardness tests were performed as well as perthometer measurements. Afterwards, a 500 $\mu$ m copper wire was bonded on the generated surfaces investigated. In consideration of the roughness, shear test of various bond times and microscopic images were evaluated. Finally, the results were compared and discussed. Overall, the current study indicates that an Al-oxide layer is beneficial for welding process in Cu wire bonding. On the contrary, the Cu-oxide is detrimental and leads to a delayed welding of the joining parts. Based on the obtained results, it can be expected that due to an ideal set of Al-oxide layers, lower optimal bond parameters can used to reach high bond strength with good reliability properties. author: - first_name: Florian full_name: Eacock, Florian last_name: Eacock - first_name: Andreas full_name: Unger, Andreas last_name: Unger - first_name: Paul full_name: Eichwald, Paul last_name: Eichwald - first_name: Olexandr full_name: Grydin, Olexandr last_name: Grydin - first_name: Florian full_name: Hengsbach, Florian last_name: Hengsbach - first_name: Simon full_name: Althoff, Simon last_name: Althoff - first_name: Mirko full_name: Schaper, Mirko last_name: Schaper - first_name: Karsten full_name: Guth, Karsten last_name: Guth citation: ama: 'Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on the ultrasonic copper wire bond process. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:2111-2118. doi:10.1109/ECTC.2016.91' apa: Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S., … Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire bond process. In IEEE 66th Electronic Components and Technology Conference (pp. 2111–2118). https://doi.org/10.1109/ECTC.2016.91 bibtex: '@inproceedings{Eacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016, title={Effect of different oxide layers on the ultrasonic copper wire bond process}, DOI={10.1109/ECTC.2016.91}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}, year={2016}, pages={2111–2118} }' chicago: Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In IEEE 66th Electronic Components and Technology Conference, 2111–18, 2016. https://doi.org/10.1109/ECTC.2016.91. ieee: F. Eacock et al., “Effect of different oxide layers on the ultrasonic copper wire bond process,” in IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118. mla: Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–18, doi:10.1109/ECTC.2016.91. short: 'F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.' date_created: 2019-05-27T09:00:50Z date_updated: 2019-09-16T10:38:59Z department: - _id: '151' doi: 10.1109/ECTC.2016.91 keyword: - Ultrasonic copper wire bonding - Al-oxide - Cuoxide - oxide-free - roughness - morphology language: - iso: eng page: 2111-2118 publication: IEEE 66th Electronic Components and Technology Conference quality_controlled: '1' status: public title: Effect of different oxide layers on the ultrasonic copper wire bond process type: conference user_id: '55222' year: '2016' ... --- _id: '9960' abstract: - lang: eng text: Ultrasonic wire bonding is a common technology for connecting electrodes of electronic components like power modules. Nowadays, bond connections are often made of copper instead of aluminum due to its thermal and mechanical assets. One of the main cost factors in the wire bonding process is the acquisition cost of consumables such as bonding tools. For copper wire bonding tool lifetime is much lower than for aluminium bonding. This paper presents a micro wear model for wedge/wedge bonding tools that was validated by observing wear patterns with a scanning electron microscope. The wear coefficient is determined in long-term bonding tests. The application of Fleischer´s wear approach incorporating frictional power to a finite element simulation of the bonding processes is used to shift element nodes depending on the rising frictional power for finite element modeling. The presented simulation method can be used to take tool wear into consideration for creating tools with increased lifetime. This enables the production of reliable bond connections using heavy as well as thin wire of any material. The paper discusses the predominant influences of wear on the main tool functions and their changes over tool life. Furthermore, the influence of the tool groove angle on the tool wear was investigated. One of the main results is that the wear is largest during the last phase of each bonding process, when the contact area between tool and wire is largest. author: - first_name: Paul full_name: Eichwald, Paul last_name: Eichwald - first_name: Andreas full_name: Unger, Andreas last_name: Unger - first_name: Florian full_name: Eacock, Florian last_name: Eacock - first_name: Simon full_name: Althoff, Simon last_name: Althoff - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro - first_name: Karsten full_name: Guth, Karsten last_name: Guth - first_name: Michael full_name: Brökelmann, Michael last_name: Brökelmann citation: ama: 'Eichwald P, Unger A, Eacock F, et al. Micro Wear Modeling in Copper Wire Wedge Bonding. In: IEEE CPMT Symposium Japan, 2016. ; 2016.' apa: Eichwald, P., Unger, A., Eacock, F., Althoff, S., Sextro, W., Guth, K., & Brökelmann, M. (2016). Micro Wear Modeling in Copper Wire Wedge Bonding. In IEEE CPMT Symposium Japan, 2016. bibtex: '@inproceedings{Eichwald_Unger_Eacock_Althoff_Sextro_Guth_Brökelmann_2016, title={Micro Wear Modeling in Copper Wire Wedge Bonding}, booktitle={IEEE CPMT Symposium Japan, 2016}, author={Eichwald, Paul and Unger, Andreas and Eacock, Florian and Althoff, Simon and Sextro, Walter and Guth, Karsten and Brökelmann, Michael}, year={2016} }' chicago: Eichwald, Paul, Andreas Unger, Florian Eacock, Simon Althoff, Walter Sextro, Karsten Guth, and Michael Brökelmann. “Micro Wear Modeling in Copper Wire Wedge Bonding.” In IEEE CPMT Symposium Japan, 2016, 2016. ieee: P. Eichwald et al., “Micro Wear Modeling in Copper Wire Wedge Bonding,” in IEEE CPMT Symposium Japan, 2016, 2016. mla: Eichwald, Paul, et al. “Micro Wear Modeling in Copper Wire Wedge Bonding.” IEEE CPMT Symposium Japan, 2016, 2016. short: 'P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann, in: IEEE CPMT Symposium Japan, 2016, 2016.' date_created: 2019-05-27T09:07:19Z date_updated: 2020-05-07T05:33:53Z department: - _id: '151' language: - iso: eng project: - _id: '92' grant_number: 02 PQ2210 name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen publication: IEEE CPMT Symposium Japan, 2016 quality_controlled: '1' status: public title: Micro Wear Modeling in Copper Wire Wedge Bonding type: conference user_id: '210' year: '2016' ... --- _id: '9961' abstract: - lang: eng text: Redundancy is a common approach to improve system reliability, availability and safety in technical systems. It is achieved by adding functionally equivalent elements that enable the system to remain operational even though one or more of those elements fail. This paper begins with an overview on the various terminologies and methods for redundancy concepts that can be modeled sufficiently using established reliability analysis methods. However, these approaches yield very complex system models, which limits their applicability. In current research, Bayesian Networks (BNs), especially Dynamic Bayesian Networks (DBNs) have been successfully used for reliability analysis because of their benefits in modeling complex systems and in representing multi-state variables. However, these approaches lack appropriate methods to model all commonly used redundancy concepts. To overcome this limitation, three different modeling approaches based on BNs and DBNs are described in this paper. Addressing those approaches, the benefits and limitations of BNs and DBNs for modeling reliability of redundant technical systems are discussed and evaluated. author: - first_name: Thorben full_name: Kaul, Thorben id: '14802' last_name: Kaul - first_name: Tobias full_name: Meyer, Tobias last_name: Meyer - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Kaul T, Meyer T, Sextro W. Modeling of Complex Redundancy in Technical Systems with Bayesian Networks. In: Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016. ; 2016.' apa: Kaul, T., Meyer, T., & Sextro, W. (2016). Modeling of Complex Redundancy in Technical Systems with Bayesian Networks. In Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016. bibtex: '@inproceedings{Kaul_Meyer_Sextro_2016, title={Modeling of Complex Redundancy in Technical Systems with Bayesian Networks}, booktitle={Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016}, author={Kaul, Thorben and Meyer, Tobias and Sextro, Walter}, year={2016} }' chicago: Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Modeling of Complex Redundancy in Technical Systems with Bayesian Networks.” In Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016, 2016. ieee: T. Kaul, T. Meyer, and W. Sextro, “Modeling of Complex Redundancy in Technical Systems with Bayesian Networks,” in Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016, 2016. mla: Kaul, Thorben, et al. “Modeling of Complex Redundancy in Technical Systems with Bayesian Networks.” Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016, 2016. short: 'T. Kaul, T. Meyer, W. Sextro, in: Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016, 2016.' date_created: 2019-05-27T09:10:07Z date_updated: 2019-09-30T08:05:55Z department: - _id: '151' language: - iso: eng publication: Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016 quality_controlled: '1' status: public title: Modeling of Complex Redundancy in Technical Systems with Bayesian Networks type: conference user_id: '55222' year: '2016' ... --- _id: '9963' abstract: - lang: eng text: Tire-wheel assembly is the only connection between road and vehicle. Contacting directly with road within postcard size of contact area, it is mounted and guided by the suspension system. Therefore kinematics and compliances of suspension system greatly influence the frictional coupling of tire tread elements and road surface asperities by affecting pressure and sliding velocity distribution in the contact zone. This study emphasizes the development of a numerical methodology for frictional rolling contact analysis with focus on interaction of suspension system dynamics and tire-road contact using ADAMS. For this purpose a comprehensive flexible multibody system of the multi-link rear suspension is established, where both flexible and rigid bodies are modeled to allow large displacements with included elastic effects. To meet accuracy requirements for the high frequency applications, such as road excitations, the amplitude- and frequency-dependency of rubber-metal bushings is included. Furthermore the proposed flexible viscoelastic suspension model is enhanced by a Flexible Ring Tire Model (FTire), which describes a 3D tire dynamic response and covers any road excitations by tread submodel connected to road surface model. Concerning the verification and validation procedure numerous experiments are carried out to confirm the validity and the accuracy of both the developed submodels and the entire model. The devised approach makes it possible to investigate the influence of suspension system design on dynamical rolling contact and to evaluate tire tread wear. Therefore it can be a useful tool to predict frictional power distribution within the contact area under more realistic conditions. author: - first_name: Sergej full_name: Kohl, Sergej last_name: Kohl - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro - first_name: Sebastian full_name: Schulze, Sebastian last_name: Schulze citation: ama: 'Kohl S, Sextro W, Schulze S. Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS. In: The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016. Cyberjaya, Malaysia, 2016; 2016:1-12.' apa: Kohl, S., Sextro, W., & Schulze, S. (2016). Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS. In The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016. (pp. 1–12). Cyberjaya, Malaysia, 2016. bibtex: '@inproceedings{Kohl_Sextro_Schulze_2016, place={Cyberjaya, Malaysia, 2016}, title={Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS}, booktitle={The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.}, author={Kohl, Sergej and Sextro, Walter and Schulze, Sebastian}, year={2016}, pages={1–12} }' chicago: Kohl, Sergej, Walter Sextro, and Sebastian Schulze. “Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis Using ADAMS.” In The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016., 1–12. Cyberjaya, Malaysia, 2016, 2016. ieee: S. Kohl, W. Sextro, and S. Schulze, “Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS,” in The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016., 2016, pp. 1–12. mla: Kohl, Sergej, et al. “Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis Using ADAMS.” The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016., 2016, pp. 1–12. short: 'S. Kohl, W. Sextro, S. Schulze, in: The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016., Cyberjaya, Malaysia, 2016, 2016, pp. 1–12.' date_created: 2019-05-27T09:13:14Z date_updated: 2019-05-27T09:13:54Z department: - _id: '151' keyword: - Kinematics and compliances - flexible viscoelastic suspension model - frictional rolling contact analysis - frictional power distribution. language: - iso: eng page: 1-12 place: Cyberjaya, Malaysia, 2016 publication: The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016. status: public title: Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS type: conference user_id: '55222' year: '2016' ... --- _id: '9964' abstract: - lang: eng text: This paper presents a benchmark data set for condition monitoring of rolling bearings in combination with an extensive description of the corresponding bearing damage, the data set generation by experiments and results of datadriven classifications used as a diagnostic method. The diagnostic method uses the motor current signal of an electromechanical drive system for bearing diagnostic. The advantage of this approach in general is that no additional sensors are required, as current measurements can be performed in existing frequency inverters. This will help to reduce the cost of future condition monitoring systems. A particular novelty of the present approach is the monitoring of damage in external bearings which are installed in the drive system but outside the electric motor. Nevertheless, the motor current signal is used as input for the detection of the damage. Moreover, a wide distribution of bearing damage is considered for the benchmark data set. The results of the classifications show that the motor current signal can be used to identify and classify bearing damage within the drive system. However, the classification accuracy is still low compared to classifications based on vibration signals. Further, dependency on properties of those bearing damage that were used for the generation of training data are observed, because training with data of artificially generated and real bearing damages lead to different accuracies. Altogether a verified and systematically generated data set is presented and published online for further research author: - first_name: Christian full_name: Lessmeier, Christian last_name: Lessmeier - first_name: James Kuria full_name: Kimotho, James Kuria last_name: Kimotho - first_name: Detmar full_name: Zimmer, Detmar last_name: Zimmer - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Lessmeier C, Kimotho JK, Zimmer D, Sextro W. Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification. In: European Conference of the Prognostics and Health Management Society. ; 2016.' apa: 'Lessmeier, C., Kimotho, J. K., Zimmer, D., & Sextro, W. (2016). Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification. In European Conference of the Prognostics and Health Management Society.' bibtex: '@inproceedings{Lessmeier_Kimotho_Zimmer_Sextro_2016, title={Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification}, booktitle={European Conference of the Prognostics and Health Management Society}, author={Lessmeier, Christian and Kimotho, James Kuria and Zimmer, Detmar and Sextro, Walter}, year={2016} }' chicago: 'Lessmeier, Christian, James Kuria Kimotho, Detmar Zimmer, and Walter Sextro. “Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification.” In European Conference of the Prognostics and Health Management Society, 2016.' ieee: 'C. Lessmeier, J. K. Kimotho, D. Zimmer, and W. Sextro, “Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification,” in European Conference of the Prognostics and Health Management Society, 2016.' mla: 'Lessmeier, Christian, et al. “Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification.” European Conference of the Prognostics and Health Management Society, 2016.' short: 'C. Lessmeier, J.K. Kimotho, D. Zimmer, W. Sextro, in: European Conference of the Prognostics and Health Management Society, 2016.' date_created: 2019-05-27T09:14:22Z date_updated: 2019-09-16T10:35:40Z department: - _id: '151' language: - iso: eng publication: European Conference of the Prognostics and Health Management Society quality_controlled: '1' status: public title: 'Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification' type: conference user_id: '55222' year: '2016' ... --- _id: '9966' abstract: - lang: eng text: Usage of copper wire bonds allows to push power boundaries imposed by aluminum wire bonds. Copper allows higher electrical, thermal and mechanical loads than aluminum, which currently is the most commonly used material in heavy wire bonding. This is the main driving factor for increased usage of copper in high power applications such as wind turbines, locomotives or electric vehicles. At the same time, usage of copper also increases tool wear and reduces the range of parameter values for a stable process, making the process more challenging. To overcome these drawbacks, parameter adaptation at runtime using self-optimization is desired. A self-optimizing system is based on system objectives that evaluate and quantify system performance. System parameters can be changed at runtime such that pre-selected objective values are reached. For adaptation of bond process parameters, model-based self-optimization is employed. Since it is based on a model of the system, the bond process was modeled. In addition to static model parameters such as wire and substrate material properties and vibration characteristics of transducer and tool, variable model inputs are process parameters. Main simulation result is bonded area in the wiresubstrate contact. This model is then used to find valid and optimal working points before operation. The working point is composed of normal force and ultrasonic voltage trajectories, which are usually determined experimentally. Instead, multiobjective optimalization is used to compute trajectories that simultaneously optimize bond quality, process duration, tool wear and probability of tool-substrate contacts. The values of these objectives are computed using the process model. At runtime, selection among pre-determined optimal working points is sufficient to prioritize individual objectives. This way, the computationally expensive process of numerically solving a multiobjective optimal control problem and the demanding high speed bonding process are separated. To evaluate to what extent the pre-defined goals of self-optimization are met, an offthe- shelf heavy wire bonding machine was modified to allow for parameter adaptation and for transmitting of measurement data at runtime. This data is received by an external computer system and evaluated to select a new working point. Then, new process parameters are sent to the modified bonding machine for use for subsequent bonds. With these components, a full self-optimizing system has been implemented. author: - first_name: Tobias full_name: Meyer , Tobias last_name: 'Meyer ' - first_name: Andreas full_name: Unger, Andreas last_name: Unger - first_name: Simon full_name: Althoff, Simon last_name: Althoff - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro - first_name: Michael full_name: Brökelmann, Michael last_name: Brökelmann - first_name: Matthias full_name: Hunstig, Matthias last_name: Hunstig - first_name: Karsten full_name: Guth, Karsten last_name: Guth citation: ama: 'Meyer T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215' apa: Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., & Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In IEEE 66th Electronic Components and Technology Conference (pp. 622–628). https://doi.org/10.1109/ECTC.2016.215 bibtex: '@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation}, DOI={10.1109/ECTC.2016.215}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628} }' chicago: Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” In IEEE 66th Electronic Components and Technology Conference, 622–28, 2016. https://doi.org/10.1109/ECTC.2016.215. ieee: T. Meyer et al., “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628. mla: Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215. short: 'T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.' date_created: 2019-05-27T09:17:26Z date_updated: 2020-05-07T05:33:53Z department: - _id: '151' doi: 10.1109/ECTC.2016.215 keyword: - Self-optimization - adaptive system - bond process - copper wire language: - iso: eng page: 622-628 project: - _id: '92' grant_number: 02 PQ2210 name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen publication: IEEE 66th Electronic Components and Technology Conference quality_controlled: '1' status: public title: Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation type: conference user_id: '210' year: '2016' ... --- _id: '9967' abstract: - lang: eng text: Multibody models of mechatronic systems are usually interdisciplinary and are continuously gaining complexity, due to a growing demand for comprehensive models of systems including effects of electro mechanics, elastic bodies, contacts and friction. To be capable of simulating large models with subassemblies and contact between bodies, reduction techniques are required, which need certain experience in the choice of parameters. This publication discusses different possibilities for the modal description of structures in flexible multibody models with application to an Adaptive Frontlighting System in ADAMS. It will be shown that mode count, assembling of structures before and after modal reduction and influence of damping parameters of particular structures and subassemblies affect the behavior of the entire system. A common reduction technique for flexible structures in multibody models is the component mode synthesis, which uses a certain number of modes for description of the modal behavior of a structure. The influence of the mode count will be shown by means of different modal descriptions of one structure that contributes to a comprehensive model. Another study will prove that modal data of subassemblies and assemblies of modal reduced single structures lead to different models. The definition of damping parameters depends on the number of structures that have been added to an assembly before modal reduction and on the number of modal reduced structures. The comparison of subassemblies and the entire model to experimental data will highlight the accuracy, computational overhead, complexity of models and modeling efficiency of the comprehensive model for the frontlighting system. author: - first_name: Sebastian full_name: Schulze, Sebastian last_name: Schulze - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro - first_name: Sergej full_name: Kohl, Sergej last_name: Kohl citation: ama: 'Schulze S, Sextro W, Kohl S. Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems. In: 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016. ; 2016:1-11.' apa: Schulze, S., Sextro, W., & Kohl, S. (2016). Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems. In 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016 (pp. 1–11). bibtex: '@inproceedings{Schulze_Sextro_Kohl_2016, title={Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems}, booktitle={2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016}, author={Schulze, Sebastian and Sextro, Walter and Kohl, Sergej}, year={2016}, pages={1–11} }' chicago: Schulze, Sebastian, Walter Sextro, and Sergej Kohl. “Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems.” In 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, 1–11, 2016. ieee: S. Schulze, W. Sextro, and S. Kohl, “Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems,” in 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, 2016, pp. 1–11. mla: Schulze, Sebastian, et al. “Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems.” 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, 2016, pp. 1–11. short: 'S. Schulze, W. Sextro, S. Kohl, in: 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, 2016, pp. 1–11.' date_created: 2019-05-27T09:19:20Z date_updated: 2019-05-27T09:19:49Z department: - _id: '151' keyword: - model reduction - modal description - flexible multibody systems language: - iso: eng page: 1-11 publication: 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016 status: public title: Using Adequate Reduced Models for Flexible Multibody Systems of Automotive Mechatronic Systems type: conference user_id: '55222' year: '2016' ... --- _id: '9968' abstract: - lang: eng text: To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tooltip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard’s wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage. author: - first_name: Andreas full_name: Unger, Andreas last_name: Unger - first_name: Reinhard full_name: Schemmel, Reinhard id: '28647' last_name: Schemmel - first_name: Tobias full_name: Meyer, Tobias last_name: Meyer - first_name: Florian full_name: Eacock, Florian last_name: Eacock - first_name: Paul full_name: Eichwald, Paul last_name: Eichwald - first_name: Simon full_name: Althoff, Simon last_name: Althoff - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro - first_name: Michael full_name: Brökelmann, Michael last_name: Brökelmann - first_name: Matthias full_name: Hunstig, Matthias last_name: Hunstig - first_name: Karsten full_name: Guth, Karsten last_name: Guth citation: ama: 'Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.' apa: Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S., … Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016 (pp. 251–254). IEEE CPMT Symposium Japan. bibtex: '@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }' chicago: Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54. IEEE CPMT Symposium Japan, 2016. ieee: A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–254. mla: Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–54. short: 'A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.' date_created: 2019-05-27T09:20:10Z date_updated: 2020-05-07T05:33:53Z department: - _id: '151' keyword: - the Ultrasonic Wire Bonding Process language: - iso: eng page: 251-254 place: IEEE CPMT Symposium Japan project: - _id: '92' grant_number: 02 PQ2210 name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen publication: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016 quality_controlled: '1' status: public title: Validated Simulation of the Ultrasonic Wire Bonding Process type: conference user_id: '210' year: '2016' ... --- _id: '9962' abstract: - lang: eng text: As the need to improve reliability, availability and safety of technical systems increases, a large number of proactive maintenance strategies have been proposed. Of greater interest is the development of prognostic and health management strategies where maintenance is scheduled based on the current and the predicted future health state of a technical system. In addition, prognostic information can be used to control the reliability of intelligent mechatronic systems to ensure their mission objective is achieved. Therefore methodologies for estimating these current and future health states reliably and accurately are imperative. With the advancement in sensor technology, majority of the present day technical systems are installed with a network of sensors for condition or performance monitoring. This has led to the increased application of machine learning algorithms in condition monitoring. Depending on the sensor data available, different approaches for utilizing the data with machine learning algorithms can be applied. However, aguide for selecting the appropriate approach for a given system is either lacking or has not been explored extensively. Therefore, this work aims at providing a guide for selecting suitable approaches and machine learning algorithms for a given system depending on the available sensor data.Five approaches for prognostics and an ensemble of the best performing approaches are presented. Since the performance of machine learning algorithms is highly dependent on the input features, methods for feature extraction and selection are also presented. The approaches are evaluated and validated with run-to-failure condition monitoring data of actual systems. This information could serve as a guide for selecting the appropriate method for a given kind of system depending on the available condition monitoring data. author: - first_name: James Kuria full_name: Kimotho, James Kuria last_name: Kimotho citation: ama: Kimotho JK. Development and Performance Evaluation of Prognostic Approaches for Technical Systems. Shaker; 2016. apa: Kimotho, J. K. (2016). Development and Performance Evaluation of Prognostic Approaches for Technical Systems. Shaker. bibtex: '@book{Kimotho_2016, title={Development and Performance Evaluation of Prognostic Approaches for Technical Systems}, publisher={Shaker}, author={Kimotho, James Kuria}, year={2016} }' chicago: Kimotho, James Kuria. Development and Performance Evaluation of Prognostic Approaches for Technical Systems. Shaker, 2016. ieee: J. K. Kimotho, Development and Performance Evaluation of Prognostic Approaches for Technical Systems. Shaker, 2016. mla: Kimotho, James Kuria. Development and Performance Evaluation of Prognostic Approaches for Technical Systems. Shaker, 2016. short: J.K. Kimotho, Development and Performance Evaluation of Prognostic Approaches for Technical Systems, Shaker, 2016. date_created: 2019-05-27T09:11:54Z date_updated: 2023-09-15T12:27:35Z department: - _id: '151' language: - iso: eng publisher: Shaker status: public title: Development and Performance Evaluation of Prognostic Approaches for Technical Systems type: dissertation user_id: '210' year: '2016' ... --- _id: '9943' abstract: - lang: eng text: Changing manufacturing technologies or material in well-known processes has to be followed by an adaption of process parameters. In case of the transition from aluminum wire to copper wire in heavy wire bonding, the adaption effort is high due to the strongly different mechanical properties of the wire. One of these adaption aspects, apart from wire material, is the existent oxide layers on wire and substrate. The ductile aluminum oxide is not influencing the bonding process much, because it is supposed to break apart in case of plastic deformation. The lubricating copper oxide layer has to be removed before micro welds can develop. Therefore, in this paper, experiments are carried out at low frequency to determine the friction energy needed to abrade the copper oxide layer of wire and substrate, which is indicated by an increase in the resulting friction coefficient. The friction energy per contact area to remove the interfering layers at low frequency is compared to the real bonding process working at 58 kHz. In addition, a theoretical concept is being described to get a grasp of the occurring mechanism. In the end a proposal is given how to set bonding parameters to get the cleanest surfaces with the installed bond tool. author: - first_name: Simon full_name: Althoff, Simon last_name: Althoff - first_name: Andreas full_name: Unger, Andreas last_name: Unger - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro - first_name: Florian full_name: Eacock, Florian last_name: Eacock citation: ama: 'Althoff S, Unger A, Sextro W, Eacock F. Improving the cleaning process in copper wire bonding by adapting bonding parameters. In: 2015 17th Electronics Packaging Technology Conference. ; 2015:1-6. doi:10.1109/EPTC.2015.7412402' apa: Althoff, S., Unger, A., Sextro, W., & Eacock, F. (2015). Improving the cleaning process in copper wire bonding by adapting bonding parameters. In 2015 17th Electronics Packaging Technology Conference (pp. 1–6). https://doi.org/10.1109/EPTC.2015.7412402 bibtex: '@inproceedings{Althoff_Unger_Sextro_Eacock_2015, title={Improving the cleaning process in copper wire bonding by adapting bonding parameters}, DOI={10.1109/EPTC.2015.7412402}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Althoff, Simon and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2015}, pages={1–6} }' chicago: Althoff, Simon, Andreas Unger, Walter Sextro, and Florian Eacock. “Improving the Cleaning Process in Copper Wire Bonding by Adapting Bonding Parameters.” In 2015 17th Electronics Packaging Technology Conference, 1–6, 2015. https://doi.org/10.1109/EPTC.2015.7412402. ieee: S. Althoff, A. Unger, W. Sextro, and F. Eacock, “Improving the cleaning process in copper wire bonding by adapting bonding parameters,” in 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6. mla: Althoff, Simon, et al. “Improving the Cleaning Process in Copper Wire Bonding by Adapting Bonding Parameters.” 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6, doi:10.1109/EPTC.2015.7412402. short: 'S. Althoff, A. Unger, W. Sextro, F. Eacock, in: 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6.' date_created: 2019-05-27T08:10:43Z date_updated: 2020-05-07T05:33:51Z department: - _id: '151' doi: 10.1109/EPTC.2015.7412402 language: - iso: eng page: 1-6 project: - _id: '92' grant_number: 02 PQ2210 name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen publication: 2015 17th Electronics Packaging Technology Conference quality_controlled: '1' status: public title: Improving the cleaning process in copper wire bonding by adapting bonding parameters type: conference user_id: '210' year: '2015' ... --- _id: '9944' abstract: - lang: eng text: Eine Vielzahl von Prozessen in der Chemie und Verfahrenstechnik kann durch Ultraschall positiv beeinflusst werden. Oftmals ist ultraschallinduzierte Kavitation der Hauptwirkmechanismus für die positiven Effekte der Beschallung. Daher ist es notwendig die Kavitationsaktivität während des Prozesses zu quantifizieren um die Beschallung für den jeweiligen Prozess optimal gestalten und überwachen zu können. Eine Möglichkeit der prozessbegleitenden Kavitationsdetektion ist die Auswertung der akustischen Emissionen von oszillierenden und kollabierenden Kavitationsblasen mittels Drucksensoren in der Flüssigkeit. Raue Prozessrandbedingungen wie hohe Temperaturen oder aggressive Flüssigkeiten erschweren es jedoch geeignete Sensoren zu finden. Als Alternative wurde daher die Nutzbarkeit der Rückwirkung von Kavitationsereignissen auf das elektrische Eingansgssignal des Ultraschallwandlers zur Quantifizierung von Kavitation untersucht. Die experimentelle Analyse hat ergeben, dass das Einsetzen und in einigen Fällen auch die Art der Kavitation auf Basis der Rückwirkung auf das Stromsignal des Ultraschallwandlers bestimmt werden kann. Die Stärke der Kavitation war hingegen nicht aus den Stromsignalen abzuleiten. author: - first_name: Peter full_name: Bornmann, Peter last_name: Bornmann - first_name: Tobias full_name: Hemsel, Tobias id: '210' last_name: Hemsel - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro - first_name: Gianluca full_name: Memoli, Gianluca last_name: Memoli - first_name: Mark full_name: Hodnett, Mark last_name: Hodnett - first_name: Bajram full_name: Zeqiri, Bajram last_name: Zeqiri citation: ama: Bornmann P, Hemsel T, Sextro W, Memoli G, Hodnett M, Zeqiri B. Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler. tm - Technisches Messen. 2015;82(2):73-84. doi:10.1515/teme-2015-0017 apa: Bornmann, P., Hemsel, T., Sextro, W., Memoli, G., Hodnett, M., & Zeqiri, B. (2015). Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler. Tm - Technisches Messen, 82(2), 73–84. https://doi.org/10.1515/teme-2015-0017 bibtex: '@article{Bornmann_Hemsel_Sextro_Memoli_Hodnett_Zeqiri_2015, title={Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler}, volume={82}, DOI={10.1515/teme-2015-0017}, number={2}, journal={tm - Technisches Messen}, author={Bornmann, Peter and Hemsel, Tobias and Sextro, Walter and Memoli, Gianluca and Hodnett, Mark and Zeqiri, Bajram}, year={2015}, pages={73–84} }' chicago: 'Bornmann, Peter, Tobias Hemsel, Walter Sextro, Gianluca Memoli, Mark Hodnett, and Bajram Zeqiri. “Kavitationsdetektion Mittels Self-Sensing-Ultraschallwandler.” Tm - Technisches Messen 82, no. 2 (2015): 73–84. https://doi.org/10.1515/teme-2015-0017.' ieee: P. Bornmann, T. Hemsel, W. Sextro, G. Memoli, M. Hodnett, and B. Zeqiri, “Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler,” tm - Technisches Messen, vol. 82, no. 2, pp. 73–84, 2015. mla: Bornmann, Peter, et al. “Kavitationsdetektion Mittels Self-Sensing-Ultraschallwandler.” Tm - Technisches Messen, vol. 82, no. 2, 2015, pp. 73–84, doi:10.1515/teme-2015-0017. short: P. Bornmann, T. Hemsel, W. Sextro, G. Memoli, M. Hodnett, B. Zeqiri, Tm - Technisches Messen 82 (2015) 73–84. date_created: 2019-05-27T08:13:40Z date_updated: 2019-09-16T10:44:38Z department: - _id: '151' doi: 10.1515/teme-2015-0017 intvolume: ' 82' issue: '2' keyword: - Kavitationsdetektion - Self-Sensing - So- nochemie - Ultraschallwandler language: - iso: eng page: 73-84 popular_science: '1' publication: tm - Technisches Messen status: public title: Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler type: journal_article user_id: '55222' volume: 82 year: '2015' ... --- _id: '9945' abstract: - lang: eng text: Die starke Integration von Sensorik, Aktorik, Hard- und Software stellt Herausforderungen an die Verlässlichkeit intelligenter mechatronischer Systeme dar. Diese Systeme verfügen aber auch über großes Potential zur Verbesserung ihrer Verlässlichkeit durch eine Anpassung des Systemverhaltens an den aktuellen Zustand. Um den Umfang der Systemmodelle zu reduzieren und die Anpassung des Systemverhaltens zu ermöglichen, sind fortschrittliche Modellierungsmethoden notwendig, mit denen die Verlässlichkeit in frühen Phasen des Entwicklungsprozesses sichergestellt und evaluiert werden kann. Von den Attributen der Verlässlichkeit ist insbesondere die Zuverlässigkeit in hohem Maße von den auftretenden Belastungen an den Komponenten und damit vom dynamischen Systemverhalten abhängig. Bisherige Modellierungsansätze bilden diese Abhängigkeit nur unzureichend ab. Es wird daher ein Ansatz zur integrierten Modellierung mechatronischer Systeme vorgestellt. Dieser ist in der Lage, sowohl die Dynamik als auch die Zuverlässigkeit des Systems abzubilden. Die Transformation eines Modells des dynamischen Systemverhaltens generiert dabei ein Zuverlässigkeitsmodell. Für typischerweise konkurrierende Ziele können mit Hilfe von Mehrzieloptimierungsverfahren Betriebspunkte eines Systems bestimmt werden. Das integrierte Modell kann zur Erzeugung von Zielfunktionen für die Dynamik als auch für die Zuverlässigkeit genutzt werden. Die Ergebnisse ermöglichen eine Verhaltensanpassung durch Wahl eines paretooptimalen Betriebspunkts während des Betriebs. Das vorgeschlagene Konzept zur integrierten Modellierung mechatronischer Systeme bietet aufgrund des modellbasierten Entwicklungsansatzes und der automatisierten Transformation eines Verlässlichkeitsmodells eine Reduktion der Benutzereingaben und eine Entlastung des Benutzers. Dadurch wird die Wahrscheinlichkeit von Benutzerfehlern gesenkt und die Verlässlichkeit bereits während der Entwicklung erhöht. Somit können Iterationsschleifen vermieden und die Entwicklungskosten gesenkt werden. author: - first_name: Thorben full_name: Kaul, Thorben id: '14802' last_name: Kaul - first_name: Tobias full_name: Meyer, Tobias last_name: Meyer - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Kaul T, Meyer T, Sextro W. Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme. In: Gausemeier J, Dumitrescu R, Rammig F, Schäfer W, Trächtler A, eds. 10. Paderborner Workshop Entwurf Mechatronischer Systeme. HNI-Verlagsschriftenreihe. Paderborn: Heinz Nixdorf Institut, Universität Paderborn; 2015:101-112.' apa: 'Kaul, T., Meyer, T., & Sextro, W. (2015). Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme. In J. Gausemeier, R. Dumitrescu, F. Rammig, W. Schäfer, & A. Trächtler (Eds.), 10. Paderborner Workshop Entwurf mechatronischer Systeme (pp. 101–112). Paderborn: Heinz Nixdorf Institut, Universität Paderborn.' bibtex: '@inproceedings{Kaul_Meyer_Sextro_2015, place={Paderborn}, series={HNI-Verlagsschriftenreihe}, title={Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme}, booktitle={10. Paderborner Workshop Entwurf mechatronischer Systeme}, publisher={Heinz Nixdorf Institut, Universität Paderborn}, author={Kaul, Thorben and Meyer, Tobias and Sextro, Walter}, editor={Gausemeier, Jürgen and Dumitrescu, Roman and Rammig, Franz and Schäfer, Wilhelm and Trächtler, AnsgarEditors}, year={2015}, pages={101–112}, collection={HNI-Verlagsschriftenreihe} }' chicago: 'Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Integrierte Modellierung Der Dynamik Und Der Verlässlichkeit Komplexer Mechatronischer Systeme.” In 10. Paderborner Workshop Entwurf Mechatronischer Systeme, edited by Jürgen Gausemeier, Roman Dumitrescu, Franz Rammig, Wilhelm Schäfer, and Ansgar Trächtler, 101–12. HNI-Verlagsschriftenreihe. Paderborn: Heinz Nixdorf Institut, Universität Paderborn, 2015.' ieee: T. Kaul, T. Meyer, and W. Sextro, “Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme,” in 10. Paderborner Workshop Entwurf mechatronischer Systeme, 2015, pp. 101–112. mla: Kaul, Thorben, et al. “Integrierte Modellierung Der Dynamik Und Der Verlässlichkeit Komplexer Mechatronischer Systeme.” 10. Paderborner Workshop Entwurf Mechatronischer Systeme, edited by Jürgen Gausemeier et al., Heinz Nixdorf Institut, Universität Paderborn, 2015, pp. 101–12. short: 'T. Kaul, T. Meyer, W. Sextro, in: J. Gausemeier, R. Dumitrescu, F. Rammig, W. Schäfer, A. Trächtler (Eds.), 10. Paderborner Workshop Entwurf Mechatronischer Systeme, Heinz Nixdorf Institut, Universität Paderborn, Paderborn, 2015, pp. 101–112.' date_created: 2019-05-27T08:17:18Z date_updated: 2019-09-30T08:06:51Z department: - _id: '151' editor: - first_name: Jürgen full_name: Gausemeier, Jürgen last_name: Gausemeier - first_name: Roman full_name: Dumitrescu, Roman last_name: Dumitrescu - first_name: Franz full_name: Rammig, Franz last_name: Rammig - first_name: Wilhelm full_name: Schäfer, Wilhelm last_name: Schäfer - first_name: Ansgar full_name: Trächtler, Ansgar last_name: Trächtler keyword: - Verlässlichkeit - Zuverlässigkeit - Dynamik - integrierte Modellierung language: - iso: eng page: 101-112 place: Paderborn publication: 10. Paderborner Workshop Entwurf mechatronischer Systeme publisher: Heinz Nixdorf Institut, Universität Paderborn quality_controlled: '1' series_title: HNI-Verlagsschriftenreihe status: public title: Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme type: conference user_id: '55222' year: '2015' ... --- _id: '9946' abstract: - lang: eng text: Intelligent mechatronic systems are able to autonomously adapt system behavior to current environmental conditions and to system states. To allow for such reactions, complex sensor and actuator systems as well as sophisticated information processing are required, making these systems increasingly complex. However, with the risk of increased system complexity also comes the chance to adapt system behavior based on current reliability and in turn to increase reliability. The adaptation is based on switching selecting an appropriate working point at runtime. Multiple suitable working points can be found using multi-objective optimization techniques, which require an accurate system model including system reliability. At present, modeling of system reliability is a laborious manual task performed by reliability modelling experts. Despite actual system reliability being highly dependent on system dynamics, pre-existing system dynamics models and the resulting reliability model are at best loosely coupled. To allow for closer interaction among dynamics and reliability model and to ensure these are always synchronized, advanced modeling techniques are required. Therefore, an integrated model is introduced that reduces user input to a minimum and that integrates system dynamics and system reliability. author: - first_name: Thorben full_name: Kaul, Thorben id: '14802' last_name: Kaul - first_name: Tobias full_name: Meyer, Tobias last_name: Meyer - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Kaul T, Meyer T, Sextro W. Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems. In: et al.} P, ed. European Safety and Reliability Conference (ESREL2015). London: Taylor and Francis; 2015. doi:10.1201/b19094-290' apa: 'Kaul, T., Meyer, T., & Sextro, W. (2015). Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems. In P. et al.} (Ed.), European Safety and Reliability Conference (ESREL2015). London: Taylor and Francis. https://doi.org/10.1201/b19094-290' bibtex: '@inproceedings{Kaul_Meyer_Sextro_2015, place={London}, title={Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems}, DOI={10.1201/b19094-290}, booktitle={European Safety and Reliability Conference (ESREL2015)}, publisher={Taylor and Francis}, author={Kaul, Thorben and Meyer, Tobias and Sextro, Walter}, editor={et al.}, PodofilliniEditor}, year={2015} }' chicago: 'Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems.” In European Safety and Reliability Conference (ESREL2015), edited by Podofillini et al.}. London: Taylor and Francis, 2015. https://doi.org/10.1201/b19094-290.' ieee: T. Kaul, T. Meyer, and W. Sextro, “Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems,” in European Safety and Reliability Conference (ESREL2015), 2015. mla: Kaul, Thorben, et al. “Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems.” European Safety and Reliability Conference (ESREL2015), edited by Podofillini et al.}, Taylor and Francis, 2015, doi:10.1201/b19094-290. short: 'T. Kaul, T. Meyer, W. Sextro, in: P. et al.} (Ed.), European Safety and Reliability Conference (ESREL2015), Taylor and Francis, London, 2015.' date_created: 2019-05-27T08:20:55Z date_updated: 2019-09-30T08:07:29Z department: - _id: '151' doi: 10.1201/b19094-290 editor: - first_name: Podofillini full_name: et al.}, Podofillini last_name: et al.} language: - iso: eng place: London publication: European Safety and Reliability Conference (ESREL2015) publisher: Taylor and Francis quality_controlled: '1' status: public title: Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems type: conference user_id: '55222' year: '2015' ... --- _id: '9947' abstract: - lang: eng text: This paper presents a comparison of a number of prognostic methods with regard to algorithm complexity and performance based on prognostic metrics. This information serves as a guide for selection and design of prognostic systems for real-time condition monitoring of technical systems. The methods are evaluated on ability to estimate the remaining useful life of rolling element bearing. Run-to failure vibration and temperature data is used in the analysis. The sampled prognostic methods include wear-temperature correlation method, health state estimation using temperature measurement, a multi-model particle filter approach with model parameter adaptation utilizing temperature measurements, prognostics through health state estimation and mapping extracted features to the remaining useful life through regression approach. Although the performance of the methods utilizing the vibration measurements is much better than the methods using temperature measurements, the methods using temperature measurements are quite promising in terms of reducing the overall cost of the condition monitoring system as well as the computational time. An ensemble of the presented methods through weighted average is also introduced. The results show that the methods are able to estimate the remaining useful life within error bounds of +-15\%, which can be further reduced to +-5\% with the ensemble approach. author: - first_name: James Kuria full_name: Kimotho, James Kuria last_name: Kimotho - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Kimotho JK, Sextro W. Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics. In: Annual Conference of the Prognostics and Health Management Society 2015. Vol 6. ; 2015.' apa: Kimotho, J. K., & Sextro, W. (2015). Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics. In Annual Conference of the Prognostics and Health Management Society 2015 (Vol. 6). bibtex: '@inproceedings{Kimotho_Sextro_2015, title={Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics}, volume={6}, booktitle={Annual Conference of the Prognostics and Health Management Society 2015}, author={Kimotho, James Kuria and Sextro, Walter}, year={2015} }' chicago: Kimotho, James Kuria, and Walter Sextro. “Comparison and Ensemble of Temperature-Based and Vibration-Based Methods for Machinery Prognostics.” In Annual Conference of the Prognostics and Health Management Society 2015, Vol. 6, 2015. ieee: J. K. Kimotho and W. Sextro, “Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics,” in Annual Conference of the Prognostics and Health Management Society 2015, 2015, vol. 6. mla: Kimotho, James Kuria, and Walter Sextro. “Comparison and Ensemble of Temperature-Based and Vibration-Based Methods for Machinery Prognostics.” Annual Conference of the Prognostics and Health Management Society 2015, vol. 6, 2015. short: 'J.K. Kimotho, W. Sextro, in: Annual Conference of the Prognostics and Health Management Society 2015, 2015.' date_created: 2019-05-27T08:24:50Z date_updated: 2019-05-27T08:25:44Z department: - _id: '151' intvolume: ' 6' keyword: - ensemble methods - combined prognostics - data fusion language: - iso: eng publication: Annual Conference of the Prognostics and Health Management Society 2015 status: public title: Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics type: conference user_id: '55222' volume: 6 year: '2015' ... --- _id: '9948' author: - first_name: Ryo full_name: Kudo, Ryo last_name: Kudo - first_name: Peter full_name: Bornmann, Peter last_name: Bornmann - first_name: Tobias full_name: Hemsel, Tobias id: '210' last_name: Hemsel - first_name: Takeshi full_name: Morita, Takeshi last_name: Morita citation: ama: Kudo R, Bornmann P, Hemsel T, Morita T. Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method. Acoustical Science and Technology. 2015;36(3):262-264. doi:10.1250/ast.36.262 apa: Kudo, R., Bornmann, P., Hemsel, T., & Morita, T. (2015). Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method. Acoustical Science and Technology, 36(3), 262–264. https://doi.org/10.1250/ast.36.262 bibtex: '@article{Kudo_Bornmann_Hemsel_Morita_2015, title={Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method}, volume={36}, DOI={10.1250/ast.36.262}, number={3}, journal={Acoustical Science and Technology}, publisher={Acoustical Society of Japan}, author={Kudo, Ryo and Bornmann, Peter and Hemsel, Tobias and Morita, Takeshi}, year={2015}, pages={262–264} }' chicago: 'Kudo, Ryo, Peter Bornmann, Tobias Hemsel, and Takeshi Morita. “Thick KNbO 3 Films Deposited by Ultrasonic-Assisted Hydrothermal Method.” Acoustical Science and Technology 36, no. 3 (2015): 262–64. https://doi.org/10.1250/ast.36.262.' ieee: R. Kudo, P. Bornmann, T. Hemsel, and T. Morita, “Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method,” Acoustical Science and Technology, vol. 36, no. 3, pp. 262–264, 2015. mla: Kudo, Ryo, et al. “Thick KNbO 3 Films Deposited by Ultrasonic-Assisted Hydrothermal Method.” Acoustical Science and Technology, vol. 36, no. 3, Acoustical Society of Japan, 2015, pp. 262–64, doi:10.1250/ast.36.262. short: R. Kudo, P. Bornmann, T. Hemsel, T. Morita, Acoustical Science and Technology 36 (2015) 262–264. date_created: 2019-05-27T08:28:31Z date_updated: 2019-09-16T10:51:23Z department: - _id: '151' doi: 10.1250/ast.36.262 intvolume: ' 36' issue: '3' language: - iso: eng page: 262-264 publication: Acoustical Science and Technology publisher: Acoustical Society of Japan quality_controlled: '1' status: public title: Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method type: journal_article user_id: '55222' volume: 36 year: '2015' ... --- _id: '9949' abstract: - lang: eng text: Intelligent mechatronic systems other the possibility to adapt system behavior to current dependability. This can be used to assure reliability by controlling system behavior to reach a pre-defined lifetime. By using such closed loop control, the margin of error of useful lifetime of an individual system is lowered. It is also possible to change the pre-defined lifetime during operation, by adapting system behavior to derate component usage. When planning maintenance actions, the remaining useful lifetime of each individual system has to be taken into account. Usually, stochastic properties of a fleet of systems are analyzed to create maintenance plans. Among these, the main factor is the probability of an individual system to last until maintenance. If condition-based maintenance is used, this is updated for each individual system using available information about its current state. By lowering the margin of error of useful lifetime, which directly corresponds to the time until maintenance, extended maintenance periods are made possible. Also using reliability-adaptive operation, a reversal of degradation driven maintenance planning is possible where a maintenance plan is setup not only according to system properties, but mainly to requirements imposed by maintenance personnel or infrastructure. Each system then adapts its behavior accordingly and fails according to the maintenance plan, making better use of maintenance personnel and system capabilities at the same time. In this contribution, the potential of maintenance plan driven system behavior adaptation is shown. A model including adaptation process and maintenance actions is simulated over full system lifetime to assess the advantages gained. author: - first_name: Tobias full_name: Meyer, Tobias last_name: Meyer - first_name: Thorben full_name: Kaul, Thorben id: '14802' last_name: Kaul - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Meyer T, Kaul T, Sextro W. Advantages of reliability-adaptive system operation for maintenance planning. In: Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes. ; 2015:940-945. doi:10.1016/j.ifacol.2015.09.647' apa: Meyer, T., Kaul, T., & Sextro, W. (2015). Advantages of reliability-adaptive system operation for maintenance planning. In Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes (pp. 940–945). https://doi.org/10.1016/j.ifacol.2015.09.647 bibtex: '@inproceedings{Meyer_Kaul_Sextro_2015, title={Advantages of reliability-adaptive system operation for maintenance planning}, DOI={10.1016/j.ifacol.2015.09.647}, booktitle={Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes}, author={Meyer, Tobias and Kaul, Thorben and Sextro, Walter}, year={2015}, pages={940–945} }' chicago: Meyer, Tobias, Thorben Kaul, and Walter Sextro. “Advantages of Reliability-Adaptive System Operation for Maintenance Planning.” In Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes, 940–45, 2015. https://doi.org/10.1016/j.ifacol.2015.09.647. ieee: T. Meyer, T. Kaul, and W. Sextro, “Advantages of reliability-adaptive system operation for maintenance planning,” in Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes, 2015, pp. 940–945. mla: Meyer, Tobias, et al. “Advantages of Reliability-Adaptive System Operation for Maintenance Planning.” Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes, 2015, pp. 940–45, doi:10.1016/j.ifacol.2015.09.647. short: 'T. Meyer, T. Kaul, W. Sextro, in: Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes, 2015, pp. 940–945.' date_created: 2019-05-27T08:29:40Z date_updated: 2019-09-16T10:43:42Z department: - _id: '151' doi: 10.1016/j.ifacol.2015.09.647 keyword: - Adaptive systems - Reliability analysis - Availability - Adaptive control - Maintenance - Self-optimizing systems - Self-optimizing control - Stochastic Petri-nets language: - iso: eng page: 940-945 publication: Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes quality_controlled: '1' status: public title: Advantages of reliability-adaptive system operation for maintenance planning type: conference user_id: '55222' year: '2015' ... --- _id: '9950' abstract: - lang: eng text: Intelligente technische Systeme, die in der Lage sind, sich an geänderte Umgebungsbedingungen anzupassen, ermöglichen eine Adaption anhand der aktuell erreichten Zuverlässigkeit. Zu diesem Zwecke kann ein geschlossener Regelkreis formuliert werden, der dazu geeignet ist, den Betriebspunkt des Systems während der gesamten Lebensdauer anzupassen. Dadurch wird eine harte Umschaltung während des Betriebs vermieden und die Verhaltensanpassung ist vom Nutzer weitgehend unbemerkt möglich. Dazu wird die aktuelle Restlebensdauer mit einer vorgegebenen Restlebensdauer verglichen. Durch Änderung der vorgegebenen Restlebensdauer lässt sich auch eine Anpassung der gewünschten Nutzungsdauer erreichen, beispielsweise um veränderte Wartungsintervalle einzuhalten. Zu diesem Zwecke ist es allerdings notwendig, die aktuell erreichte Zuverlässigkeit zu schätzen. Für die Regelung ist dabei die aktuelle Restlebensdauer der wichtigste Parameter, da er als Istwert direkt mit der gewünschten Restlebensdauer als Sollwert verglichen wird und als Reglereingang dient. Für die Genauigkeit der Regelung ist daher die Bestimmung der Restlebensdauer von entscheidender Bedeutung. Es wird ein Modell des Regelkreises vorgestellt, das auch den Einfluss einer fehlerhaften Restlebensdauerschätzung auf die Verhaltensanpassung abbildet. Dadurch ist es möglich, Grenzen der Verhaltensanpassung und die zur Einhaltung notwendige Genauigkeit der Restlebensdauerschätzung zu bestimmen. Es gibt zahlreiche Ansätze, die Restlebensdauer zu schätzen, die aufgeteilt werden in modellbasierte Verfahren und datengetriebene Verfahren. Die individuelle Eignung eines jeden Verfahrens sowie die Modellbildung oder die Nutzung geeigneter Algorithmen ist stark systemabhängig. Um die Auswahl von Verfahren und Modellen oder Algorithmen zu ermöglichen, werden zunächst die Anforderungen an die Restlebensdauerschätzung zur Nutzung als Regelungs-Istwert bestimmt. Verschiedene Verfahren werden sodann hinsichtlich ihrer Eignung evaluiert und Anwendungsgrenzen aufgezeigt. author: - first_name: Tobias full_name: Meyer, Tobias last_name: Meyer - first_name: James Kuria full_name: Kimotho, James Kuria last_name: Kimotho - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Meyer T, Kimotho JK, Sextro W. Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme. In: 27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte. Leonberg; 2015:111-122.' apa: Meyer, T., Kimotho, J. K., & Sextro, W. (2015). Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme. In 27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger Produkte (pp. 111–122). Leonberg. bibtex: '@inproceedings{Meyer_Kimotho_Sextro_2015, place={Leonberg}, title={Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme}, number={2260}, booktitle={27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger Produkte}, author={Meyer, Tobias and Kimotho, James Kuria and Sextro, Walter}, year={2015}, pages={111–122} }' chicago: Meyer, Tobias, James Kuria Kimotho, and Walter Sextro. “Anforderungen an Condition-Monitoring-Verfahren Zur Nutzung Im Zuverläsigkeitsgeregelten Betrieb Adaptiver Systeme.” In 27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte, 111–22. Leonberg, 2015. ieee: T. Meyer, J. K. Kimotho, and W. Sextro, “Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme,” in 27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger Produkte, 2015, no. 2260, pp. 111–122. mla: Meyer, Tobias, et al. “Anforderungen an Condition-Monitoring-Verfahren Zur Nutzung Im Zuverläsigkeitsgeregelten Betrieb Adaptiver Systeme.” 27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte, no. 2260, 2015, pp. 111–22. short: 'T. Meyer, J.K. Kimotho, W. Sextro, in: 27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte, Leonberg, 2015, pp. 111–122.' date_created: 2019-05-27T08:31:38Z date_updated: 2019-09-30T08:09:22Z department: - _id: '151' issue: '2260' language: - iso: eng page: 111-122 place: Leonberg publication: 27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger Produkte quality_controlled: '1' status: public title: Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme type: conference user_id: '55222' year: '2015' ... --- _id: '9951' abstract: - lang: eng text: Ultrasonic wire bonding is an indispensable process in the manufacturing of semiconductor components. It is used for interconnecting the silicon die to e.g. connectors in the housing or to other semiconductors in complex components. In high power applications, such as wind turbines, locomotives or electric vehicles, the thermal and mechanical limits of interconnects made from aluminum are nearing. The limits could be overcome using copper wire bonds, but their manufacturing poses challenges due to the harder material, which leads to increased wear of the bond tools and to less reliable production. To overcome these drawbacks, adaptation of process parameters at runtime is employed. However, the range of parameter values for which a stable process can be maintained is very small, making it necessary to compute suitable parameters beforehand. To this end, and to gain insights into the process itself, the ultrasonic bonding process is modeled. The full model is composed of several partial models, some of which were introduced before. This paper focuses on the modularization of the full model and on the interaction of partial models. All partial models are presented, their interaction is shown and the general outline of the simulation process is given. author: - first_name: Tobias full_name: Meyer, Tobias last_name: Meyer - first_name: Andreas full_name: Unger, Andreas last_name: Unger - first_name: Simon full_name: Althoff, Simon last_name: Althoff - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro - first_name: Michael full_name: Brökelmann, Michael last_name: Brökelmann - first_name: Matthias full_name: Hunstig, Matthias last_name: Hunstig - first_name: Karsten full_name: Guth, Karsten last_name: Guth citation: ama: 'Meyer T, Unger A, Althoff S, et al. Modeling and simulation of the ultrasonic wire bonding process. In: 2015 17th Electronics Packaging Technology Conference. ; 2015. doi:10.1109/EPTC.2015.7412377' apa: Meyer, T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., & Guth, K. (2015). Modeling and simulation of the ultrasonic wire bonding process. In 2015 17th Electronics Packaging Technology Conference. https://doi.org/10.1109/EPTC.2015.7412377 bibtex: '@inproceedings{Meyer_Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2015, title={Modeling and simulation of the ultrasonic wire bonding process}, DOI={10.1109/EPTC.2015.7412377}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Meyer, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2015} }' chicago: Meyer, Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” In 2015 17th Electronics Packaging Technology Conference, 2015. https://doi.org/10.1109/EPTC.2015.7412377. ieee: T. Meyer et al., “Modeling and simulation of the ultrasonic wire bonding process,” in 2015 17th Electronics Packaging Technology Conference, 2015. mla: Meyer, Tobias, et al. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” 2015 17th Electronics Packaging Technology Conference, 2015, doi:10.1109/EPTC.2015.7412377. short: 'T. Meyer, A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: 2015 17th Electronics Packaging Technology Conference, 2015.' date_created: 2019-05-27T08:34:21Z date_updated: 2020-05-07T05:33:52Z department: - _id: '151' doi: 10.1109/EPTC.2015.7412377 language: - iso: eng project: - _id: '92' grant_number: 02 PQ2210 name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen publication: 2015 17th Electronics Packaging Technology Conference quality_controlled: '1' status: public title: Modeling and simulation of the ultrasonic wire bonding process type: conference user_id: '210' year: '2015' ... --- _id: '9952' abstract: - lang: eng text: The contact between viscoelastic materials e.g. elastomers and a rough surface leads to a special friction characteristic, which differs greatly in its properties comparing to other materials like metals. In practice, this friction combination occurs for example in the tire-road contact, or in the use of rubber gaskets. Due to the frictional forces a system is significantly influenced in its vibrational properties. The friction force is composed of two main components adhesion and hysteresis. The adhesion results from molecular bounds between the contact partners, while the deformation of the viscoelastic material by the roughness of the counter body leads to power loss. This internal friction results in an additional frictional force, which is described by the hysteresis. To simulate the frictional behaviour of elastomers on rough surfaces and thus to determine the energy dissipation in contact, it is necessary to develop a mechanical model which considers the roughness of the contact partners, as well as dynamic effects and the dependence on normal pressure and sliding speed. The viscoelastic material behaviour must also be considered. The contact between two rough surfaces is modelled as a rough rigid layer contacting a rough elas- tic layer. The elastic layer is modelled by point masses connected by Maxwell-elements. This allows the viscoelastic properties of the elastomer to be considered. The behaviour of whole system can be described by equations of motion with integrated constraints. The degrees of freedom of the model depends on the varying contact conditions. A point mass not in contact has two degrees of freedom. A point mass in contact moving along the roughness path can be described by only one degree of freedom. For each Maxwell-Element also an inner coordinate and thus a further degree of freedom is needed. Because of varying contact conditions dur- ing the simulation, the simulation interrupts in case the contact conditions change. Then the equations of motions are adapted with respect to the contact constraints. As a result of the simulation one obtain the energy dissipation and thus the friction char- acteristic during the friction process. It is possible to use these results in three dimensional point-contact elements in order to model contact surfaces on lager length scales. author: - first_name: Frank full_name: Schulte, Frank last_name: Schulte - first_name: Jan full_name: Neuhaus, Jan last_name: Neuhaus - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Schulte F, Neuhaus J, Sextro W. A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In: Proceedings of ICoEV 2015 International Conference on Engineering Vibration. ; 2015:1109-1117.' apa: Schulte, F., Neuhaus, J., & Sextro, W. (2015). A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In Proceedings of ICoEV 2015 International Conference on Engineering Vibration (pp. 1109–1117). bibtex: '@inproceedings{Schulte_Neuhaus_Sextro_2015, title={A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties}, booktitle={Proceedings of ICoEV 2015 International Conference on Engineering Vibration}, author={Schulte, Frank and Neuhaus, Jan and Sextro, Walter}, year={2015}, pages={1109–1117} }' chicago: Schulte, Frank, Jan Neuhaus, and Walter Sextro. “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties.” In Proceedings of ICoEV 2015 International Conference on Engineering Vibration, 1109–17, 2015. ieee: F. Schulte, J. Neuhaus, and W. Sextro, “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties,” in Proceedings of ICoEV 2015 International Conference on Engineering Vibration, 2015, pp. 1109–1117. mla: Schulte, Frank, et al. “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties.” Proceedings of ICoEV 2015 International Conference on Engineering Vibration, 2015, pp. 1109–17. short: 'F. Schulte, J. Neuhaus, W. Sextro, in: Proceedings of ICoEV 2015 International Conference on Engineering Vibration, 2015, pp. 1109–1117.' date_created: 2019-05-27T08:37:22Z date_updated: 2019-09-16T10:47:53Z department: - _id: '151' keyword: - Contact Mechanics - Viscoelastic Material - Adhesive Friction - Hysteresis Friction - Energy Dissipation - Vibration language: - iso: eng page: 1109-1117 publication: Proceedings of ICoEV 2015 International Conference on Engineering Vibration quality_controlled: '1' status: public title: A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties type: conference user_id: '55222' year: '2015' ... --- _id: '9954' abstract: - lang: eng text: To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tool tip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard's wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage. author: - first_name: Andreas full_name: Unger, Andreas last_name: Unger - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro - first_name: Tobias full_name: Meyer, Tobias last_name: Meyer - first_name: Paul full_name: Eichwald, Paul last_name: Eichwald - first_name: Simon full_name: Althoff, Simon last_name: Althoff - first_name: Florian full_name: Eacock, Florian last_name: Eacock - first_name: Michael full_name: Brökelmann, Michael last_name: Brökelmann citation: ama: 'Unger A, Sextro W, Meyer T, et al. Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In: 2015 17th Electronics Packaging Technology Conference. ; 2015. doi:10.1109/EPTC.2015.7412375' apa: Unger, A., Sextro, W., Meyer, T., Eichwald, P., Althoff, S., Eacock, F., & Brökelmann, M. (2015). Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In 2015 17th Electronics Packaging Technology Conference. https://doi.org/10.1109/EPTC.2015.7412375 bibtex: '@inproceedings{Unger_Sextro_Meyer_Eichwald_Althoff_Eacock_Brökelmann_2015, title={Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear}, DOI={10.1109/EPTC.2015.7412375}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Unger, Andreas and Sextro, Walter and Meyer, Tobias and Eichwald, Paul and Althoff, Simon and Eacock, Florian and Brökelmann, Michael}, year={2015} }' chicago: Unger, Andreas, Walter Sextro, Tobias Meyer, Paul Eichwald, Simon Althoff, Florian Eacock, and Michael Brökelmann. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” In 2015 17th Electronics Packaging Technology Conference, 2015. https://doi.org/10.1109/EPTC.2015.7412375. ieee: A. Unger et al., “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear,” in 2015 17th Electronics Packaging Technology Conference, 2015. mla: Unger, Andreas, et al. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” 2015 17th Electronics Packaging Technology Conference, 2015, doi:10.1109/EPTC.2015.7412375. short: 'A. Unger, W. Sextro, T. Meyer, P. Eichwald, S. Althoff, F. Eacock, M. Brökelmann, in: 2015 17th Electronics Packaging Technology Conference, 2015.' date_created: 2019-05-27T08:43:55Z date_updated: 2020-05-07T05:33:52Z department: - _id: '151' doi: 10.1109/EPTC.2015.7412375 language: - iso: eng project: - _id: '92' grant_number: 02 PQ2210 name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen publication: 2015 17th Electronics Packaging Technology Conference quality_controlled: '1' status: public title: Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear type: conference user_id: '210' year: '2015' ...