[{"editor":[{"first_name":"Monuko","full_name":"du Plessis, Monuko","last_name":"du Plessis"}],"status":"public","publication":"Fifth Conference on Sensors, MEMS, and Electro-Optic Systems","type":"conference","language":[{"iso":"eng"}],"_id":"39419","department":[{"_id":"59"}],"user_id":"20179","year":"2019","citation":{"mla":"Vidor, Fabio Fedrizzi, et al. “Mechanical Deformation on Nanoparticle-Based Thin-Film Transistors.” <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, edited by Monuko du Plessis, SPIE, 2019, doi:<a href=\"https://doi.org/10.1117/12.2502393\">10.1117/12.2502393</a>.","bibtex":"@inproceedings{Vidor_Meyers_Reker_Müller_Wirth_Hilleringmann_2019, title={Mechanical deformation on nanoparticle-based thin-film transistors}, DOI={<a href=\"https://doi.org/10.1117/12.2502393\">10.1117/12.2502393</a>}, booktitle={Fifth Conference on Sensors, MEMS, and Electro-Optic Systems}, publisher={SPIE}, author={Vidor, Fabio Fedrizzi and Meyers, Thorsten and Reker, Julia and Müller, Kathrin and Wirth, Gilson I. and Hilleringmann, Ulrich}, editor={du Plessis, Monuko}, year={2019} }","short":"F.F. Vidor, T. Meyers, J. Reker, K. Müller, G.I. Wirth, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.","apa":"Vidor, F. F., Meyers, T., Reker, J., Müller, K., Wirth, G. I., &#38; Hilleringmann, U. (2019). Mechanical deformation on nanoparticle-based thin-film transistors. In M. du Plessis (Ed.), <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>. SPIE. <a href=\"https://doi.org/10.1117/12.2502393\">https://doi.org/10.1117/12.2502393</a>","ieee":"F. F. Vidor, T. Meyers, J. Reker, K. Müller, G. I. Wirth, and U. Hilleringmann, “Mechanical deformation on nanoparticle-based thin-film transistors,” in <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, 2019, doi: <a href=\"https://doi.org/10.1117/12.2502393\">10.1117/12.2502393</a>.","chicago":"Vidor, Fabio Fedrizzi, Thorsten Meyers, Julia Reker, Kathrin Müller, Gilson I. Wirth, and Ulrich Hilleringmann. “Mechanical Deformation on Nanoparticle-Based Thin-Film Transistors.” In <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, edited by Monuko du Plessis. SPIE, 2019. <a href=\"https://doi.org/10.1117/12.2502393\">https://doi.org/10.1117/12.2502393</a>.","ama":"Vidor FF, Meyers T, Reker J, Müller K, Wirth GI, Hilleringmann U. Mechanical deformation on nanoparticle-based thin-film transistors. In: du Plessis M, ed. <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>. SPIE; 2019. doi:<a href=\"https://doi.org/10.1117/12.2502393\">10.1117/12.2502393</a>"},"publication_status":"published","title":"Mechanical deformation on nanoparticle-based thin-film transistors","doi":"10.1117/12.2502393","publisher":"SPIE","date_updated":"2023-03-22T10:24:30Z","author":[{"first_name":"Fabio Fedrizzi","full_name":"Vidor, Fabio Fedrizzi","last_name":"Vidor"},{"first_name":"Thorsten","last_name":"Meyers","full_name":"Meyers, Thorsten"},{"first_name":"Julia","last_name":"Reker","full_name":"Reker, Julia"},{"full_name":"Müller, Kathrin","last_name":"Müller","first_name":"Kathrin"},{"last_name":"Wirth","full_name":"Wirth, Gilson I.","first_name":"Gilson I."},{"last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich","id":"20179","first_name":"Ulrich"}],"date_created":"2023-01-24T10:34:44Z"},{"title":"Oxygen detection with zinc oxide nanoparticle structures","doi":"10.1117/12.2501507","date_updated":"2023-03-22T10:31:13Z","publisher":"SPIE","author":[{"last_name":"Schwabe","full_name":"Schwabe, Tobias","first_name":"Tobias"},{"first_name":"Axel","full_name":"Balke, Axel","last_name":"Balke"},{"full_name":"Bezuidenhout, Petrone","last_name":"Bezuidenhout","first_name":"Petrone"},{"full_name":"Reker, Julia","last_name":"Reker","first_name":"Julia"},{"last_name":"Meyers","full_name":"Meyers, Thorsten","first_name":"Thorsten"},{"first_name":"Trudi-Heleen","last_name":"Joubert","full_name":"Joubert, Trudi-Heleen"},{"first_name":"Ulrich","last_name":"Hilleringmann","id":"20179","full_name":"Hilleringmann, Ulrich"}],"date_created":"2023-01-24T10:40:45Z","year":"2019","citation":{"ama":"Schwabe T, Balke A, Bezuidenhout P, et al. Oxygen detection with zinc oxide nanoparticle structures. In: du Plessis M, ed. <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>. SPIE; 2019. doi:<a href=\"https://doi.org/10.1117/12.2501507\">10.1117/12.2501507</a>","ieee":"T. Schwabe <i>et al.</i>, “Oxygen detection with zinc oxide nanoparticle structures,” in <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, 2019, doi: <a href=\"https://doi.org/10.1117/12.2501507\">10.1117/12.2501507</a>.","chicago":"Schwabe, Tobias, Axel Balke, Petrone Bezuidenhout, Julia Reker, Thorsten Meyers, Trudi-Heleen Joubert, and Ulrich Hilleringmann. “Oxygen Detection with Zinc Oxide Nanoparticle Structures.” In <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, edited by Monuko du Plessis. SPIE, 2019. <a href=\"https://doi.org/10.1117/12.2501507\">https://doi.org/10.1117/12.2501507</a>.","mla":"Schwabe, Tobias, et al. “Oxygen Detection with Zinc Oxide Nanoparticle Structures.” <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, edited by Monuko du Plessis, SPIE, 2019, doi:<a href=\"https://doi.org/10.1117/12.2501507\">10.1117/12.2501507</a>.","bibtex":"@inproceedings{Schwabe_Balke_Bezuidenhout_Reker_Meyers_Joubert_Hilleringmann_2019, title={Oxygen detection with zinc oxide nanoparticle structures}, DOI={<a href=\"https://doi.org/10.1117/12.2501507\">10.1117/12.2501507</a>}, booktitle={Fifth Conference on Sensors, MEMS, and Electro-Optic Systems}, publisher={SPIE}, author={Schwabe, Tobias and Balke, Axel and Bezuidenhout, Petrone and Reker, Julia and Meyers, Thorsten and Joubert, Trudi-Heleen and Hilleringmann, Ulrich}, editor={du Plessis, Monuko}, year={2019} }","short":"T. Schwabe, A. Balke, P. Bezuidenhout, J. Reker, T. Meyers, T.-H. Joubert, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.","apa":"Schwabe, T., Balke, A., Bezuidenhout, P., Reker, J., Meyers, T., Joubert, T.-H., &#38; Hilleringmann, U. (2019). Oxygen detection with zinc oxide nanoparticle structures. In M. du Plessis (Ed.), <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>. SPIE. <a href=\"https://doi.org/10.1117/12.2501507\">https://doi.org/10.1117/12.2501507</a>"},"publication_status":"published","language":[{"iso":"eng"}],"_id":"39426","department":[{"_id":"59"}],"user_id":"20179","editor":[{"first_name":"Monuko","full_name":"du Plessis, Monuko","last_name":"du Plessis"}],"status":"public","publication":"Fifth Conference on Sensors, MEMS, and Electro-Optic Systems","type":"conference"},{"doi":"10.1117/12.2502489","title":"Characterization of inkjet-printed dielectric on different substrates","author":[{"full_name":"Kruger, Jené","last_name":"Kruger","first_name":"Jené"},{"first_name":"Petroné H.","last_name":"Bezuidenhout","full_name":"Bezuidenhout, Petroné H."},{"last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich","id":"20179","first_name":"Ulrich"},{"first_name":"Trudi-Heleen","last_name":"Joubert","full_name":"Joubert, Trudi-Heleen"}],"date_created":"2023-01-24T10:39:58Z","publisher":"SPIE","date_updated":"2023-03-22T10:31:43Z","citation":{"ama":"Kruger J, Bezuidenhout PH, Hilleringmann U, Joubert T-H. Characterization of inkjet-printed dielectric on different substrates. In: du Plessis M, ed. <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>. SPIE; 2019. doi:<a href=\"https://doi.org/10.1117/12.2502489\">10.1117/12.2502489</a>","chicago":"Kruger, Jené, Petroné H. Bezuidenhout, Ulrich Hilleringmann, and Trudi-Heleen Joubert. “Characterization of Inkjet-Printed Dielectric on Different Substrates.” In <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, edited by Monuko du Plessis. SPIE, 2019. <a href=\"https://doi.org/10.1117/12.2502489\">https://doi.org/10.1117/12.2502489</a>.","ieee":"J. Kruger, P. H. Bezuidenhout, U. Hilleringmann, and T.-H. Joubert, “Characterization of inkjet-printed dielectric on different substrates,” in <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, 2019, doi: <a href=\"https://doi.org/10.1117/12.2502489\">10.1117/12.2502489</a>.","mla":"Kruger, Jené, et al. “Characterization of Inkjet-Printed Dielectric on Different Substrates.” <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, edited by Monuko du Plessis, SPIE, 2019, doi:<a href=\"https://doi.org/10.1117/12.2502489\">10.1117/12.2502489</a>.","short":"J. Kruger, P.H. Bezuidenhout, U. Hilleringmann, T.-H. Joubert, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.","bibtex":"@inproceedings{Kruger_Bezuidenhout_Hilleringmann_Joubert_2019, title={Characterization of inkjet-printed dielectric on different substrates}, DOI={<a href=\"https://doi.org/10.1117/12.2502489\">10.1117/12.2502489</a>}, booktitle={Fifth Conference on Sensors, MEMS, and Electro-Optic Systems}, publisher={SPIE}, author={Kruger, Jené and Bezuidenhout, Petroné H. and Hilleringmann, Ulrich and Joubert, Trudi-Heleen}, editor={du Plessis, Monuko}, year={2019} }","apa":"Kruger, J., Bezuidenhout, P. H., Hilleringmann, U., &#38; Joubert, T.-H. (2019). Characterization of inkjet-printed dielectric on different substrates. In M. du Plessis (Ed.), <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>. SPIE. <a href=\"https://doi.org/10.1117/12.2502489\">https://doi.org/10.1117/12.2502489</a>"},"year":"2019","publication_status":"published","language":[{"iso":"eng"}],"user_id":"20179","department":[{"_id":"59"}],"_id":"39424","status":"public","editor":[{"last_name":"du Plessis","full_name":"du Plessis, Monuko","first_name":"Monuko"}],"type":"conference","publication":"Fifth Conference on Sensors, MEMS, and Electro-Optic Systems"},{"year":"2019","page":"1-4","citation":{"chicago":"Lange, Sven, Maik-Julian Bueker, Denis Sievers, Christian Hedayat, Jens Foerstner, Ulrich Hilleringmann, and Thomas Otto. “Method of Superposing a Multiple Driven Magnetic Field to Minimize Stray Fields around the Receiver for Inductive Wireless Power Transmission.” In <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 1–4, 2019.","ieee":"S. Lange <i>et al.</i>, “Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission,” in <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 2019, pp. 1–4.","ama":"Lange S, Bueker M-J, Sievers D, et al. Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission. In: <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>. ; 2019:1-4.","apa":"Lange, S., Bueker, M.-J., Sievers, D., Hedayat, C., Foerstner, J., Hilleringmann, U., &#38; Otto, T. (2019). Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission. <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 1–4.","mla":"Lange, Sven, et al. “Method of Superposing a Multiple Driven Magnetic Field to Minimize Stray Fields around the Receiver for Inductive Wireless Power Transmission.” <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 2019, pp. 1–4.","short":"S. Lange, M.-J. Bueker, D. Sievers, C. Hedayat, J. Foerstner, U. Hilleringmann, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.","bibtex":"@inproceedings{Lange_Bueker_Sievers_Hedayat_Foerstner_Hilleringmann_Otto_2019, title={Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission}, booktitle={Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems}, author={Lange, Sven and Bueker, Maik-Julian and Sievers, Denis and Hedayat, Christian and Foerstner, Jens and Hilleringmann, Ulrich and Otto, Thomas}, year={2019}, pages={1–4} }"},"date_updated":"2023-03-22T10:38:20Z","author":[{"first_name":"Sven","last_name":"Lange","full_name":"Lange, Sven"},{"last_name":"Bueker","full_name":"Bueker, Maik-Julian","first_name":"Maik-Julian"},{"full_name":"Sievers, Denis","last_name":"Sievers","first_name":"Denis"},{"full_name":"Hedayat, Christian","last_name":"Hedayat","first_name":"Christian"},{"first_name":"Jens","last_name":"Foerstner","full_name":"Foerstner, Jens"},{"last_name":"Hilleringmann","id":"20179","full_name":"Hilleringmann, Ulrich","first_name":"Ulrich"},{"full_name":"Otto, Thomas","last_name":"Otto","first_name":"Thomas"}],"date_created":"2023-01-25T09:50:13Z","title":"Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission","publication":"Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems","type":"conference","status":"public","_id":"39942","department":[{"_id":"59"}],"user_id":"20179","language":[{"iso":"eng"}]},{"publication":"Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems","type":"conference","status":"public","_id":"39940","department":[{"_id":"59"}],"user_id":"20179","language":[{"iso":"eng"}],"year":"2019","page":"1-4","citation":{"ama":"Schroeder D, Hangmann C, Hedayat C, Otto T, Hilleringmann U. Characterization of H-field Probes regarding Unwanted Field Suppression using Different Calibration Structures. In: <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>. ; 2019:1-4.","chicago":"Schroeder, Dominik, Christian Hangmann, Christian Hedayat, Thomas Otto, and Ulrich Hilleringmann. “Characterization of H-Field Probes Regarding Unwanted Field Suppression Using Different Calibration Structures.” In <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 1–4, 2019.","ieee":"D. Schroeder, C. Hangmann, C. Hedayat, T. Otto, and U. Hilleringmann, “Characterization of H-field Probes regarding Unwanted Field Suppression using Different Calibration Structures,” in <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 2019, pp. 1–4.","apa":"Schroeder, D., Hangmann, C., Hedayat, C., Otto, T., &#38; Hilleringmann, U. (2019). Characterization of H-field Probes regarding Unwanted Field Suppression using Different Calibration Structures. <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 1–4.","bibtex":"@inproceedings{Schroeder_Hangmann_Hedayat_Otto_Hilleringmann_2019, title={Characterization of H-field Probes regarding Unwanted Field Suppression using Different Calibration Structures}, booktitle={Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems}, author={Schroeder, Dominik and Hangmann, Christian and Hedayat, Christian and Otto, Thomas and Hilleringmann, Ulrich}, year={2019}, pages={1–4} }","mla":"Schroeder, Dominik, et al. “Characterization of H-Field Probes Regarding Unwanted Field Suppression Using Different Calibration Structures.” <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 2019, pp. 1–4.","short":"D. Schroeder, C. Hangmann, C. Hedayat, T. Otto, U. Hilleringmann, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4."},"date_updated":"2023-03-22T10:37:24Z","date_created":"2023-01-25T09:49:22Z","author":[{"first_name":"Dominik","full_name":"Schroeder, Dominik","last_name":"Schroeder"},{"first_name":"Christian","full_name":"Hangmann, Christian","last_name":"Hangmann"},{"first_name":"Christian","full_name":"Hedayat, Christian","last_name":"Hedayat"},{"last_name":"Otto","full_name":"Otto, Thomas","first_name":"Thomas"},{"first_name":"Ulrich","last_name":"Hilleringmann","id":"20179","full_name":"Hilleringmann, Ulrich"}],"title":"Characterization of H-field Probes regarding Unwanted Field Suppression using Different Calibration Structures"},{"date_created":"2023-01-24T10:38:41Z","author":[{"last_name":"Kruger","full_name":"Kruger, Jené","first_name":"Jené"},{"first_name":"Petroné H.","last_name":"Bezuidenhout","full_name":"Bezuidenhout, Petroné H."},{"full_name":"Hilleringmann, Ulrich","id":"20179","last_name":"Hilleringmann","first_name":"Ulrich"},{"full_name":"Joubert, Trudi-Heleen","last_name":"Joubert","first_name":"Trudi-Heleen"}],"publisher":"SPIE","date_updated":"2023-03-23T13:20:07Z","doi":"10.1117/12.2502489","title":"Characterization of inkjet-printed dielectric on different substrates","publication_status":"published","citation":{"apa":"Kruger, J., Bezuidenhout, P. H., Hilleringmann, U., &#38; Joubert, T.-H. (2019). Characterization of inkjet-printed dielectric on different substrates. In M. du Plessis (Ed.), <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>. SPIE. <a href=\"https://doi.org/10.1117/12.2502489\">https://doi.org/10.1117/12.2502489</a>","bibtex":"@inproceedings{Kruger_Bezuidenhout_Hilleringmann_Joubert_2019, title={Characterization of inkjet-printed dielectric on different substrates}, DOI={<a href=\"https://doi.org/10.1117/12.2502489\">10.1117/12.2502489</a>}, booktitle={Fifth Conference on Sensors, MEMS, and Electro-Optic Systems}, publisher={SPIE}, author={Kruger, Jené and Bezuidenhout, Petroné H. and Hilleringmann, Ulrich and Joubert, Trudi-Heleen}, editor={du Plessis, Monuko}, year={2019} }","mla":"Kruger, Jené, et al. “Characterization of Inkjet-Printed Dielectric on Different Substrates.” <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, edited by Monuko du Plessis, SPIE, 2019, doi:<a href=\"https://doi.org/10.1117/12.2502489\">10.1117/12.2502489</a>.","short":"J. Kruger, P.H. Bezuidenhout, U. Hilleringmann, T.-H. Joubert, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.","ama":"Kruger J, Bezuidenhout PH, Hilleringmann U, Joubert T-H. Characterization of inkjet-printed dielectric on different substrates. In: du Plessis M, ed. <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>. SPIE; 2019. doi:<a href=\"https://doi.org/10.1117/12.2502489\">10.1117/12.2502489</a>","ieee":"J. Kruger, P. H. Bezuidenhout, U. Hilleringmann, and T.-H. Joubert, “Characterization of inkjet-printed dielectric on different substrates,” in <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, 2019, doi: <a href=\"https://doi.org/10.1117/12.2502489\">10.1117/12.2502489</a>.","chicago":"Kruger, Jené, Petroné H. Bezuidenhout, Ulrich Hilleringmann, and Trudi-Heleen Joubert. “Characterization of Inkjet-Printed Dielectric on Different Substrates.” In <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, edited by Monuko du Plessis. SPIE, 2019. <a href=\"https://doi.org/10.1117/12.2502489\">https://doi.org/10.1117/12.2502489</a>."},"year":"2019","department":[{"_id":"59"}],"user_id":"20179","_id":"39423","language":[{"iso":"eng"}],"publication":"Fifth Conference on Sensors, MEMS, and Electro-Optic Systems","type":"conference","status":"public","editor":[{"last_name":"du Plessis","full_name":"du Plessis, Monuko","first_name":"Monuko"}]},{"status":"public","type":"journal_article","publication":"CHEMICAL ENGINEERING TRANSACTIONS","language":[{"iso":"eng"}],"_id":"21519","user_id":"7828","department":[{"_id":"145"},{"_id":"728"},{"_id":"52"},{"_id":"393"},{"_id":"155"},{"_id":"9"}],"year":"2019","citation":{"ama":"Grabo M, Weber D, Paul A, et al. Numerical Investigation of the Temperature Distribution in PCM-integrated Solar Modules. <i>CHEMICAL ENGINEERING TRANSACTIONS</i>. 2019;76:895-900. doi:<a href=\"https://doi.org/10.3303/CET1976150\">10.3303/CET1976150</a>","ieee":"M. Grabo <i>et al.</i>, “Numerical Investigation of the Temperature Distribution in PCM-integrated Solar Modules,” <i>CHEMICAL ENGINEERING TRANSACTIONS</i>, vol. 76, pp. 895–900, 2019, doi: <a href=\"https://doi.org/10.3303/CET1976150\">10.3303/CET1976150</a>.","chicago":"Grabo, Matti, Daniel Weber, Andreas Paul, Tobias Klaus, Wolfgang Bermpohl, Stefan Krauter, and Eugeny Kenig. “Numerical Investigation of the Temperature Distribution in PCM-Integrated Solar Modules.” <i>CHEMICAL ENGINEERING TRANSACTIONS</i> 76 (2019): 895–900. <a href=\"https://doi.org/10.3303/CET1976150\">https://doi.org/10.3303/CET1976150</a>.","apa":"Grabo, M., Weber, D., Paul, A., Klaus, T., Bermpohl, W., Krauter, S., &#38; Kenig, E. (2019). Numerical Investigation of the Temperature Distribution in PCM-integrated Solar Modules. <i>CHEMICAL ENGINEERING TRANSACTIONS</i>, <i>76</i>, 895–900. <a href=\"https://doi.org/10.3303/CET1976150\">https://doi.org/10.3303/CET1976150</a>","mla":"Grabo, Matti, et al. “Numerical Investigation of the Temperature Distribution in PCM-Integrated Solar Modules.” <i>CHEMICAL ENGINEERING TRANSACTIONS</i>, vol. 76, AIDIC The Italian Association of Chemical Engineering, 2019, pp. 895–900, doi:<a href=\"https://doi.org/10.3303/CET1976150\">10.3303/CET1976150</a>.","bibtex":"@article{Grabo_Weber_Paul_Klaus_Bermpohl_Krauter_Kenig_2019, title={Numerical Investigation of the Temperature Distribution in PCM-integrated Solar Modules}, volume={76}, DOI={<a href=\"https://doi.org/10.3303/CET1976150\">10.3303/CET1976150</a>}, journal={CHEMICAL ENGINEERING TRANSACTIONS}, publisher={AIDIC The Italian Association of Chemical Engineering}, author={Grabo, Matti and Weber, Daniel and Paul, Andreas and Klaus, Tobias and Bermpohl, Wolfgang and Krauter, Stefan and Kenig, Eugeny}, year={2019}, pages={895–900} }","short":"M. Grabo, D. Weber, A. Paul, T. Klaus, W. Bermpohl, S. Krauter, E. Kenig, CHEMICAL ENGINEERING TRANSACTIONS 76 (2019) 895–900."},"intvolume":"        76","page":"895-900","publication_status":"published","publication_identifier":{"isbn":["978-88-95608-73-0"]},"quality_controlled":"1","title":"Numerical Investigation of the Temperature Distribution in PCM-integrated Solar Modules","doi":"10.3303/CET1976150","date_updated":"2023-04-27T11:09:16Z","publisher":"AIDIC The Italian Association of Chemical Engineering","date_created":"2021-03-16T12:25:44Z","author":[{"last_name":"Grabo","id":"66520","full_name":"Grabo, Matti","first_name":"Matti"},{"id":"24041","full_name":"Weber, Daniel","last_name":"Weber","orcid":"0000-0003-3367-5998","first_name":"Daniel"},{"first_name":"Andreas","last_name":"Paul","id":"7828","full_name":"Paul, Andreas"},{"full_name":"Klaus, Tobias","last_name":"Klaus","first_name":"Tobias"},{"first_name":"Wolfgang","last_name":"Bermpohl","id":"15290","full_name":"Bermpohl, Wolfgang"},{"first_name":"Stefan","orcid":"0000-0002-3594-260X","last_name":"Krauter","full_name":"Krauter, Stefan","id":"28836"},{"last_name":"Kenig","id":"665","full_name":"Kenig, Eugeny","first_name":"Eugeny"}],"volume":76},{"_id":"21521","department":[{"_id":"155"},{"_id":"145"},{"_id":"52"},{"_id":"728"},{"_id":"393"},{"_id":"9"}],"user_id":"7828","language":[{"iso":"eng"}],"type":"conference","status":"public","date_updated":"2023-04-27T11:10:09Z","author":[{"last_name":"Grabo","id":"66520","full_name":"Grabo, Matti","first_name":"Matti"},{"last_name":"Weber","orcid":"0000-0003-3367-5998","full_name":"Weber, Daniel","id":"24041","first_name":"Daniel"},{"first_name":"Andreas","id":"7828","full_name":"Paul, Andreas","last_name":"Paul"},{"last_name":"Klaus","full_name":"Klaus, Tobias","first_name":"Tobias"},{"first_name":"Wolfgang","id":"15290","full_name":"Bermpohl, Wolfgang","last_name":"Bermpohl"},{"first_name":"Eugeny","full_name":"Kenig, Eugeny","id":"665","last_name":"Kenig"}],"date_created":"2021-03-16T12:35:37Z","title":"Numerische Untersuchung der Temperaturverteilung in PCM-integrierten Solarmodulen","conference":{"name":"Jahrestreffen der ProcessNet-Fachgruppe Energieverfahrenstechnik und des Arbeitsausschusses Thermische Energiespeicherung","start_date":"2019-03-06","end_date":"2019-03-07","location":"Frankfurt am Main"},"year":"2019","citation":{"ama":"Grabo M, Weber D, Paul A, Klaus T, Bermpohl W, Kenig E. Numerische Untersuchung der Temperaturverteilung in PCM-integrierten Solarmodulen. In: ; 2019.","ieee":"M. Grabo, D. Weber, A. Paul, T. Klaus, W. Bermpohl, and E. Kenig, “Numerische Untersuchung der Temperaturverteilung in PCM-integrierten Solarmodulen,” presented at the Jahrestreffen der ProcessNet-Fachgruppe Energieverfahrenstechnik und des Arbeitsausschusses Thermische Energiespeicherung, Frankfurt am Main, 2019.","chicago":"Grabo, Matti, Daniel Weber, Andreas Paul, Tobias Klaus, Wolfgang Bermpohl, and Eugeny Kenig. “Numerische Untersuchung Der Temperaturverteilung in PCM-Integrierten Solarmodulen,” 2019.","apa":"Grabo, M., Weber, D., Paul, A., Klaus, T., Bermpohl, W., &#38; Kenig, E. (2019). <i>Numerische Untersuchung der Temperaturverteilung in PCM-integrierten Solarmodulen</i>. Jahrestreffen der ProcessNet-Fachgruppe Energieverfahrenstechnik und des Arbeitsausschusses Thermische Energiespeicherung, Frankfurt am Main.","mla":"Grabo, Matti, et al. <i>Numerische Untersuchung Der Temperaturverteilung in PCM-Integrierten Solarmodulen</i>. 2019.","bibtex":"@inproceedings{Grabo_Weber_Paul_Klaus_Bermpohl_Kenig_2019, title={Numerische Untersuchung der Temperaturverteilung in PCM-integrierten Solarmodulen}, author={Grabo, Matti and Weber, Daniel and Paul, Andreas and Klaus, Tobias and Bermpohl, Wolfgang and Kenig, Eugeny}, year={2019} }","short":"M. Grabo, D. Weber, A. Paul, T. Klaus, W. Bermpohl, E. Kenig, in: 2019."}},{"conference":{"start_date":"2019-02-07","name":"2. Regenerative Energietechnik Konferenz (RET.Con 2019)","location":"Nordhausen","end_date":"2019-02-08"},"language":[{"iso":"eng"}],"title":"Entwicklung eines thermischen 1D-Simulationsmodells zur Bestimmung der Temperaturverteilung in Solarmodulen","date_created":"2021-03-16T12:32:39Z","author":[{"last_name":"Grabo","id":"66520","full_name":"Grabo, Matti","first_name":"Matti"},{"first_name":"Daniel","last_name":"Weber","orcid":"0000-0003-3367-5998","full_name":"Weber, Daniel","id":"24041"},{"last_name":"Paul","id":"7828","full_name":"Paul, Andreas","first_name":"Andreas"},{"first_name":"Tobias","full_name":"Klaus, Tobias","last_name":"Klaus"},{"first_name":"Wolfgang","last_name":"Bermpohl","id":"15290","full_name":"Bermpohl, Wolfgang"},{"orcid":"0000-0002-3594-260X","last_name":"Krauter","full_name":"Krauter, Stefan","id":"28836","first_name":"Stefan"},{"first_name":"Eugeny","id":"665","full_name":"Kenig, Eugeny","last_name":"Kenig"}],"user_id":"7828","department":[{"_id":"155"},{"_id":"728"},{"_id":"145"},{"_id":"52"},{"_id":"393"},{"_id":"9"}],"date_updated":"2023-04-27T11:09:56Z","_id":"21520","citation":{"ama":"Grabo M, Weber D, Paul A, et al. Entwicklung eines thermischen 1D-Simulationsmodells zur Bestimmung der Temperaturverteilung in Solarmodulen. In: ; 2019.","chicago":"Grabo, Matti, Daniel Weber, Andreas Paul, Tobias Klaus, Wolfgang Bermpohl, Stefan Krauter, and Eugeny Kenig. “Entwicklung Eines Thermischen 1D-Simulationsmodells Zur Bestimmung Der Temperaturverteilung in Solarmodulen,” 2019.","ieee":"M. Grabo <i>et al.</i>, “Entwicklung eines thermischen 1D-Simulationsmodells zur Bestimmung der Temperaturverteilung in Solarmodulen,” presented at the 2. Regenerative Energietechnik Konferenz (RET.Con 2019), Nordhausen, 2019.","bibtex":"@inproceedings{Grabo_Weber_Paul_Klaus_Bermpohl_Krauter_Kenig_2019, title={Entwicklung eines thermischen 1D-Simulationsmodells zur Bestimmung der Temperaturverteilung in Solarmodulen}, author={Grabo, Matti and Weber, Daniel and Paul, Andreas and Klaus, Tobias and Bermpohl, Wolfgang and Krauter, Stefan and Kenig, Eugeny}, year={2019} }","mla":"Grabo, Matti, et al. <i>Entwicklung Eines Thermischen 1D-Simulationsmodells Zur Bestimmung Der Temperaturverteilung in Solarmodulen</i>. 2019.","short":"M. Grabo, D. Weber, A. Paul, T. Klaus, W. Bermpohl, S. Krauter, E. Kenig, in: 2019.","apa":"Grabo, M., Weber, D., Paul, A., Klaus, T., Bermpohl, W., Krauter, S., &#38; Kenig, E. (2019). <i>Entwicklung eines thermischen 1D-Simulationsmodells zur Bestimmung der Temperaturverteilung in Solarmodulen</i>. 2. Regenerative Energietechnik Konferenz (RET.Con 2019), Nordhausen."},"status":"public","year":"2019","type":"conference"},{"_id":"59781","user_id":"8282","department":[{"_id":"59"},{"_id":"977"}],"language":[{"iso":"eng"}],"type":"conference","publication":"Fifth Conference on Sensors, MEMS, and Electro-Optic Systems","editor":[{"first_name":"Monuko","last_name":"du Plessis","full_name":"du Plessis, Monuko"}],"status":"public","date_updated":"2026-02-24T19:14:18Z","publisher":"SPIE","author":[{"id":"8282","full_name":"Petrov, Dmitry","last_name":"Petrov","first_name":"Dmitry"},{"first_name":"Thorsten","last_name":"Meyers","full_name":"Meyers, Thorsten"},{"first_name":"Julia","last_name":"Reker","full_name":"Reker, Julia"},{"first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich","id":"20179"}],"date_created":"2025-05-03T08:01:08Z","title":"Doctor blade system for the deposition of thin semiconducting films","doi":"10.1117/12.2501307","publication_status":"published","year":"2019","citation":{"ama":"Petrov D, Meyers T, Reker J, Hilleringmann U. Doctor blade system for the deposition of thin semiconducting films. In: du Plessis M, ed. <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>. SPIE; 2019. doi:<a href=\"https://doi.org/10.1117/12.2501307\">10.1117/12.2501307</a>","ieee":"D. Petrov, T. Meyers, J. Reker, and U. Hilleringmann, “Doctor blade system for the deposition of thin semiconducting films,” in <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, 2019, doi: <a href=\"https://doi.org/10.1117/12.2501307\">10.1117/12.2501307</a>.","chicago":"Petrov, Dmitry, Thorsten Meyers, Julia Reker, and Ulrich Hilleringmann. “Doctor Blade System for the Deposition of Thin Semiconducting Films.” In <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, edited by Monuko du Plessis. SPIE, 2019. <a href=\"https://doi.org/10.1117/12.2501307\">https://doi.org/10.1117/12.2501307</a>.","mla":"Petrov, Dmitry, et al. “Doctor Blade System for the Deposition of Thin Semiconducting Films.” <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>, edited by Monuko du Plessis, SPIE, 2019, doi:<a href=\"https://doi.org/10.1117/12.2501307\">10.1117/12.2501307</a>.","bibtex":"@inproceedings{Petrov_Meyers_Reker_Hilleringmann_2019, title={Doctor blade system for the deposition of thin semiconducting films}, DOI={<a href=\"https://doi.org/10.1117/12.2501307\">10.1117/12.2501307</a>}, booktitle={Fifth Conference on Sensors, MEMS, and Electro-Optic Systems}, publisher={SPIE}, author={Petrov, Dmitry and Meyers, Thorsten and Reker, Julia and Hilleringmann, Ulrich}, editor={du Plessis, Monuko}, year={2019} }","short":"D. Petrov, T. Meyers, J. Reker, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.","apa":"Petrov, D., Meyers, T., Reker, J., &#38; Hilleringmann, U. (2019). Doctor blade system for the deposition of thin semiconducting films. In M. du Plessis (Ed.), <i>Fifth Conference on Sensors, MEMS, and Electro-Optic Systems</i>. SPIE. <a href=\"https://doi.org/10.1117/12.2501307\">https://doi.org/10.1117/12.2501307</a>"}},{"year":"2019","citation":{"short":"M. Schmidt, D. Petrov, C. Hedayat, U. Hilleringmann, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.","mla":"Schmidt, Marco, et al. “Wireless Power Supply for a RFID Based Sensor Platform.” <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 2019, pp. 1–4.","bibtex":"@inproceedings{Schmidt_Petrov_Hedayat_Hilleringmann_Otto_2019, title={Wireless power supply for a RFID based sensor platform}, booktitle={Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems}, author={Schmidt, Marco and Petrov, Dmitry and Hedayat, Christian and Hilleringmann, Ulrich and Otto, Thomas}, year={2019}, pages={1–4} }","apa":"Schmidt, M., Petrov, D., Hedayat, C., Hilleringmann, U., &#38; Otto, T. (2019). Wireless power supply for a RFID based sensor platform. <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 1–4.","ama":"Schmidt M, Petrov D, Hedayat C, Hilleringmann U, Otto T. Wireless power supply for a RFID based sensor platform. In: <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>. ; 2019:1-4.","chicago":"Schmidt, Marco, Dmitry Petrov, Christian Hedayat, Ulrich Hilleringmann, and Thomas Otto. “Wireless Power Supply for a RFID Based Sensor Platform.” In <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 1–4, 2019.","ieee":"M. Schmidt, D. Petrov, C. Hedayat, U. Hilleringmann, and T. Otto, “Wireless power supply for a RFID based sensor platform,” in <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 2019, pp. 1–4."},"page":"1-4","title":"Wireless power supply for a RFID based sensor platform","date_updated":"2026-02-24T19:10:12Z","author":[{"first_name":"Marco","last_name":"Schmidt","full_name":"Schmidt, Marco"},{"first_name":"Dmitry","last_name":"Petrov","full_name":"Petrov, Dmitry","id":"8282"},{"first_name":"Christian","last_name":"Hedayat","full_name":"Hedayat, Christian"},{"last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich","id":"20179","first_name":"Ulrich"},{"full_name":"Otto, Thomas","last_name":"Otto","first_name":"Thomas"}],"date_created":"2023-01-25T09:51:25Z","status":"public","type":"conference","publication":"Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems","language":[{"iso":"eng"}],"_id":"39943","user_id":"8282","department":[{"_id":"59"},{"_id":"977"}]},{"year":"2019","citation":{"ama":"Petrov D, Schmidt M, Hilleringmann U, Hedayat C, Otto T. RFID based sensor platform for industry 4.0 application. In: <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>. ; 2019:1-4.","ieee":"D. Petrov, M. Schmidt, U. Hilleringmann, C. Hedayat, and T. Otto, “RFID based sensor platform for industry 4.0 application,” in <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 2019, pp. 1–4.","chicago":"Petrov, Dmitry, Marco Schmidt, Ulrich Hilleringmann, Christian Hedayat, and Thomas Otto. “RFID Based Sensor Platform for Industry 4.0 Application.” In <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 1–4, 2019.","apa":"Petrov, D., Schmidt, M., Hilleringmann, U., Hedayat, C., &#38; Otto, T. (2019). RFID based sensor platform for industry 4.0 application. <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 1–4.","bibtex":"@inproceedings{Petrov_Schmidt_Hilleringmann_Hedayat_Otto_2019, title={RFID based sensor platform for industry 4.0 application}, booktitle={Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems}, author={Petrov, Dmitry and Schmidt, Marco and Hilleringmann, Ulrich and Hedayat, Christian and Otto, Thomas}, year={2019}, pages={1–4} }","short":"D. Petrov, M. Schmidt, U. Hilleringmann, C. Hedayat, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.","mla":"Petrov, Dmitry, et al. “RFID Based Sensor Platform for Industry 4.0 Application.” <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 2019, pp. 1–4."},"page":"1-4","date_updated":"2026-02-24T19:13:17Z","date_created":"2023-01-25T09:52:16Z","author":[{"last_name":"Petrov","full_name":"Petrov, Dmitry","id":"8282","first_name":"Dmitry"},{"first_name":"Marco","full_name":"Schmidt, Marco","last_name":"Schmidt"},{"last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich","id":"20179","first_name":"Ulrich"},{"last_name":"Hedayat","full_name":"Hedayat, Christian","first_name":"Christian"},{"first_name":"Thomas","full_name":"Otto, Thomas","last_name":"Otto"}],"title":"RFID based sensor platform for industry 4.0 application","type":"conference","publication":"Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems","status":"public","_id":"39944","user_id":"8282","department":[{"_id":"59"},{"_id":"977"}],"language":[{"iso":"eng"}]},{"year":"2019","citation":{"ieee":"K. Neutsch, M. R. Hofmann, N. C. Gerhardt, L. Schnitzler, and M. J. Tranelis, “Three-dimensional particle localization with common-path digital holographic microscopy,” 2019, doi: <a href=\"https://doi.org/10.1117/12.2509448\">10.1117/12.2509448</a>.","chicago":"Neutsch, Krisztian, Martin R. Hofmann, Nils Christopher Gerhardt, Lena Schnitzler, and Marlon J. Tranelis. “Three-Dimensional Particle Localization with Common-Path Digital Holographic Microscopy.” In <i>Practical Holography XXXIII: Displays, Materials, and Applications</i>, 2019. <a href=\"https://doi.org/10.1117/12.2509448\">https://doi.org/10.1117/12.2509448</a>.","apa":"Neutsch, K., Hofmann, M. R., Gerhardt, N. C., Schnitzler, L., &#38; Tranelis, M. J. (2019). Three-dimensional particle localization with common-path digital holographic microscopy. <i>Practical Holography XXXIII: Displays, Materials, and Applications</i>. <a href=\"https://doi.org/10.1117/12.2509448\">https://doi.org/10.1117/12.2509448</a>","ama":"Neutsch K, Hofmann MR, Gerhardt NC, Schnitzler L, Tranelis MJ. Three-dimensional particle localization with common-path digital holographic microscopy. In: <i>Practical Holography XXXIII: Displays, Materials, and Applications</i>. ; 2019. doi:<a href=\"https://doi.org/10.1117/12.2509448\">10.1117/12.2509448</a>","short":"K. Neutsch, M.R. Hofmann, N.C. Gerhardt, L. Schnitzler, M.J. Tranelis, in: Practical Holography XXXIII: Displays, Materials, and Applications, 2019.","bibtex":"@inproceedings{Neutsch_Hofmann_Gerhardt_Schnitzler_Tranelis_2019, title={Three-dimensional particle localization with common-path digital holographic microscopy}, DOI={<a href=\"https://doi.org/10.1117/12.2509448\">10.1117/12.2509448</a>}, booktitle={Practical Holography XXXIII: Displays, Materials, and Applications}, author={Neutsch, Krisztian and Hofmann, Martin R. and Gerhardt, Nils Christopher and Schnitzler, Lena and Tranelis, Marlon J.}, year={2019} }","mla":"Neutsch, Krisztian, et al. “Three-Dimensional Particle Localization with Common-Path Digital Holographic Microscopy.” <i>Practical Holography XXXIII: Displays, Materials, and Applications</i>, 2019, doi:<a href=\"https://doi.org/10.1117/12.2509448\">10.1117/12.2509448</a>."},"date_updated":"2026-02-25T13:50:47Z","date_created":"2026-02-20T10:04:02Z","author":[{"first_name":"Krisztian","last_name":"Neutsch","full_name":"Neutsch, Krisztian"},{"full_name":"Hofmann, Martin R.","last_name":"Hofmann","first_name":"Martin R."},{"first_name":"Nils Christopher","id":"115298","full_name":"Gerhardt, Nils Christopher","last_name":"Gerhardt","orcid":"0009-0002-5538-231X"},{"first_name":"Lena","last_name":"Schnitzler","full_name":"Schnitzler, Lena"},{"first_name":"Marlon J.","full_name":"Tranelis, Marlon J.","last_name":"Tranelis"}],"title":"Three-dimensional particle localization with common-path digital holographic microscopy","doi":"10.1117/12.2509448","type":"conference","publication":"Practical Holography XXXIII: Displays, Materials, and Applications","status":"public","_id":"64361","user_id":"15911","department":[{"_id":"977"}],"language":[{"iso":"eng"}]},{"status":"public","publication":"Nanoscale spintronics and applications","type":"book_chapter","language":[{"iso":"eng"}],"department":[{"_id":"977"}],"user_id":"15911","_id":"64360","page":"499 - 540","citation":{"apa":"Gerhardt, N. C., Žutić, I., Lee, J., Gøthgen, C., Farla, Paulo E., J., Xu, G., &#38; Sipahi, G. M. (2019). Semiconductor spin-lasers. In <i>Nanoscale spintronics and applications</i> (pp. 499–540).","short":"N.C. Gerhardt, I. Žutić, J. Lee, C. Gøthgen, J. Farla, Paulo E., G. Xu, G.M. Sipahi, in: Nanoscale Spintronics and Applications, 2019, pp. 499–540.","mla":"Gerhardt, Nils Christopher, et al. “Semiconductor Spin-Lasers.” <i>Nanoscale Spintronics and Applications</i>, 2019, pp. 499–540.","bibtex":"@inbook{Gerhardt_Žutić_Lee_Gøthgen_Farla, Paulo E._Xu_Sipahi_2019, title={Semiconductor spin-lasers}, booktitle={Nanoscale spintronics and applications}, author={Gerhardt, Nils Christopher and Žutić, Igor and Lee, Jeongsu and Gøthgen, Christian and Farla, Paulo E., Junior and Xu, Gaofeng and Sipahi, Guilherme M.}, year={2019}, pages={499–540} }","ama":"Gerhardt NC, Žutić I, Lee J, et al. Semiconductor spin-lasers. In: <i>Nanoscale Spintronics and Applications</i>. ; 2019:499-540.","chicago":"Gerhardt, Nils Christopher, Igor Žutić, Jeongsu Lee, Christian Gøthgen, Junior Farla, Paulo E., Gaofeng Xu, and Guilherme M. Sipahi. “Semiconductor Spin-Lasers.” In <i>Nanoscale Spintronics and Applications</i>, 499–540, 2019.","ieee":"N. C. Gerhardt <i>et al.</i>, “Semiconductor spin-lasers,” in <i>Nanoscale spintronics and applications</i>, 2019, pp. 499–540."},"year":"2019","title":"Semiconductor spin-lasers","date_created":"2026-02-20T10:04:02Z","author":[{"first_name":"Nils Christopher","orcid":"0009-0002-5538-231X","last_name":"Gerhardt","full_name":"Gerhardt, Nils Christopher","id":"115298"},{"full_name":"Žutić, Igor","last_name":"Žutić","first_name":"Igor"},{"last_name":"Lee","full_name":"Lee, Jeongsu","first_name":"Jeongsu"},{"first_name":"Christian","last_name":"Gøthgen","full_name":"Gøthgen, Christian"},{"first_name":"Junior","last_name":"Farla, Paulo E.","full_name":"Farla, Paulo E., Junior"},{"last_name":"Xu","full_name":"Xu, Gaofeng","first_name":"Gaofeng"},{"full_name":"Sipahi, Guilherme M.","last_name":"Sipahi","first_name":"Guilherme M."}],"date_updated":"2026-02-25T13:51:03Z"},{"language":[{"iso":"eng"}],"publication":"Nature","abstract":[{"lang":"eng","text":"Lasers have both ubiquitous applications and roles as model systems in which non-equilibrium and cooperative phenomena can be elucidated1. The introduction of novel concepts in laser operation thus has potential to lead to both new applications and fundamental insights2. Spintronics3, in which both the spin and the charge of the electron are used, has led to the development of spin-lasers, in which charge-carrier spin and photon spin are exploited. Here we show experimentally that the coupling between carrier spin and light polarization in common semiconductor lasers can enable room-temperature modulation frequencies above 200 gigahertz, exceeding by nearly an order of magnitude the best conventional semiconductor lasers. Surprisingly, this ultrafast operation of the resultant spin-laser relies on a short carrier spin relaxation time and a large anisotropy of the refractive index, both of which are commonly viewed as detrimental in spintronics3 and conventional lasers4. Our results overcome the key speed limitations of conventional directly modulated lasers and offer a prospect for the next generation of low-energy ultrafast optical communication."}],"publisher":"Springer Science and Business Media LLC","date_created":"2025-04-25T07:21:34Z","title":"Ultrafast spin-lasers","quality_controlled":"1","issue":"7751","year":"2019","_id":"59687","department":[{"_id":"977"}],"user_id":"15911","extern":"1","type":"journal_article","status":"public","date_updated":"2026-02-25T14:09:49Z","volume":568,"author":[{"first_name":"Markus","last_name":"Lindemann","full_name":"Lindemann, Markus"},{"full_name":"Xu, Gaofeng","last_name":"Xu","first_name":"Gaofeng"},{"first_name":"Tobias","last_name":"Pusch","full_name":"Pusch, Tobias"},{"last_name":"Michalzik","full_name":"Michalzik, Rainer","first_name":"Rainer"},{"first_name":"Martin R.","full_name":"Hofmann, Martin R.","last_name":"Hofmann"},{"first_name":"Igor","last_name":"Žutić","full_name":"Žutić, Igor"},{"first_name":"Nils Christopher","last_name":"Gerhardt","orcid":"0009-0002-5538-231X","id":"115298","full_name":"Gerhardt, Nils Christopher"}],"doi":"10.1038/s41586-019-1073-y","publication_identifier":{"issn":["0028-0836","1476-4687"]},"publication_status":"published","page":"212-215","intvolume":"       568","citation":{"ama":"Lindemann M, Xu G, Pusch T, et al. Ultrafast spin-lasers. <i>Nature</i>. 2019;568(7751):212-215. doi:<a href=\"https://doi.org/10.1038/s41586-019-1073-y\">10.1038/s41586-019-1073-y</a>","ieee":"M. Lindemann <i>et al.</i>, “Ultrafast spin-lasers,” <i>Nature</i>, vol. 568, no. 7751, pp. 212–215, 2019, doi: <a href=\"https://doi.org/10.1038/s41586-019-1073-y\">10.1038/s41586-019-1073-y</a>.","chicago":"Lindemann, Markus, Gaofeng Xu, Tobias Pusch, Rainer Michalzik, Martin R. Hofmann, Igor Žutić, and Nils Christopher Gerhardt. “Ultrafast Spin-Lasers.” <i>Nature</i> 568, no. 7751 (2019): 212–15. <a href=\"https://doi.org/10.1038/s41586-019-1073-y\">https://doi.org/10.1038/s41586-019-1073-y</a>.","short":"M. Lindemann, G. Xu, T. Pusch, R. Michalzik, M.R. Hofmann, I. Žutić, N.C. Gerhardt, Nature 568 (2019) 212–215.","mla":"Lindemann, Markus, et al. “Ultrafast Spin-Lasers.” <i>Nature</i>, vol. 568, no. 7751, Springer Science and Business Media LLC, 2019, pp. 212–15, doi:<a href=\"https://doi.org/10.1038/s41586-019-1073-y\">10.1038/s41586-019-1073-y</a>.","bibtex":"@article{Lindemann_Xu_Pusch_Michalzik_Hofmann_Žutić_Gerhardt_2019, title={Ultrafast spin-lasers}, volume={568}, DOI={<a href=\"https://doi.org/10.1038/s41586-019-1073-y\">10.1038/s41586-019-1073-y</a>}, number={7751}, journal={Nature}, publisher={Springer Science and Business Media LLC}, author={Lindemann, Markus and Xu, Gaofeng and Pusch, Tobias and Michalzik, Rainer and Hofmann, Martin R. and Žutić, Igor and Gerhardt, Nils Christopher}, year={2019}, pages={212–215} }","apa":"Lindemann, M., Xu, G., Pusch, T., Michalzik, R., Hofmann, M. R., Žutić, I., &#38; Gerhardt, N. C. (2019). Ultrafast spin-lasers. <i>Nature</i>, <i>568</i>(7751), 212–215. <a href=\"https://doi.org/10.1038/s41586-019-1073-y\">https://doi.org/10.1038/s41586-019-1073-y</a>"}},{"abstract":[{"lang":"eng","text":"This paper presents a new methodology by using a multiple coil array for energy transmission. The complex current strengths of the transmitting coil array are calculated by having the knowledge about of the mutual inductances and the symmetries of the transmitting coil array, so that its resulting magnetic field mainly penetrates only the receiving coil and is strongly attenuated outside. This method is used for an optimized wireless energy transmission but can also be implemented for other inductive applications."}],"publication":"Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems","keyword":["tet_enas"],"language":[{"iso":"eng"}],"year":"2019","title":"Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission","publisher":"VDE VERLAG GMBH","date_created":"2021-03-12T09:46:55Z","status":"public","type":"conference","_id":"21462","user_id":"158","department":[{"_id":"59"},{"_id":"61"},{"_id":"485"}],"place":"Berlin · Offenbach","citation":{"apa":"Lange, S., Büker, M.-J., Sievers, D., Hedayat, C., Förstner, J., Hilleringmann, U., &#38; Otto, T. (2019). Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission. <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 1–4.","bibtex":"@inproceedings{Lange_Büker_Sievers_Hedayat_Förstner_Hilleringmann_Otto_2019, place={Berlin · Offenbach}, title={Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission}, booktitle={Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems}, publisher={VDE VERLAG GMBH}, author={Lange, Sven and Büker, Maik-Julian and Sievers, Denis and Hedayat, Christian and Förstner, Jens and Hilleringmann, Ulrich and Otto, Thomas}, year={2019}, pages={1–4} }","mla":"Lange, Sven, et al. “Method of Superposing a Multiple Driven Magnetic Field to Minimize Stray Fields around the Receiver for Inductive Wireless Power Transmission.” <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, VDE VERLAG GMBH, 2019, pp. 1–4.","short":"S. Lange, M.-J. Büker, D. Sievers, C. Hedayat, J. Förstner, U. Hilleringmann, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, VDE VERLAG GMBH, Berlin · Offenbach, 2019, pp. 1–4.","ieee":"S. Lange <i>et al.</i>, “Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission,” in <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, Barcelona, Spain , 2019, pp. 1–4.","chicago":"Lange, Sven, Maik-Julian Büker, Denis Sievers, Christian Hedayat, Jens Förstner, Ulrich Hilleringmann, and Thomas Otto. “Method of Superposing a Multiple Driven Magnetic Field to Minimize Stray Fields around the Receiver for Inductive Wireless Power Transmission.” In <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>, 1–4. Berlin · Offenbach: VDE VERLAG GMBH, 2019.","ama":"Lange S, Büker M-J, Sievers D, et al. Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission. In: <i>Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems</i>. VDE VERLAG GMBH; 2019:1-4."},"page":"1-4","publication_status":"published","publication_identifier":{"isbn":["978-3-8007-4919-5"]},"related_material":{"record":[{"status":"deleted","relation":"other","id":"9265"}]},"main_file_link":[{"url":"https://ieeexplore.ieee.org/document/8727831"}],"conference":{"name":"Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems","start_date":"2019-04-10","end_date":"2019-04-11","location":"Barcelona, Spain "},"date_updated":"2024-11-30T19:32:36Z","author":[{"full_name":"Lange, Sven","id":"38240","last_name":"Lange","orcid":"0009-0007-9150-2266 ","first_name":"Sven"},{"full_name":"Büker, Maik-Julian","last_name":"Büker","first_name":"Maik-Julian"},{"full_name":"Sievers, Denis","last_name":"Sievers","first_name":"Denis"},{"first_name":"Christian","last_name":"Hedayat","full_name":"Hedayat, Christian"},{"first_name":"Jens","full_name":"Förstner, Jens","id":"158","last_name":"Förstner","orcid":"0000-0001-7059-9862"},{"first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich"},{"first_name":"Thomas","full_name":"Otto, Thomas","last_name":"Otto"}]},{"file_date_updated":"2024-12-29T11:07:54Z","department":[{"_id":"34"},{"_id":"300"}],"user_id":"11763","_id":"34123","status":"public","type":"book_chapter","doi":"10.1007/978-3-030-11932-4_54","conference":{"location":"Kos Island, Greece","end_date":"2018-09-28","start_date":"2018-09-25","name":"International Conference on Interactive Collaborative Learning and Engineering Pedagogy (ICL) 2018"},"author":[{"first_name":"Mesut","last_name":"Alptekin","full_name":"Alptekin, Mesut","id":"11763"},{"last_name":"Temmen","id":"30086","full_name":"Temmen, Katrin","first_name":"Katrin"}],"date_updated":"2024-12-29T11:09:43Z","citation":{"chicago":"Alptekin, Mesut, and Katrin Temmen. “Gamification in an Augmented Reality Based Virtual Preparation Laboratory Training.” In <i>The Challenges of the Digital Transformation in Education</i>. Cham: Springer International Publishing, 2019. <a href=\"https://doi.org/10.1007/978-3-030-11932-4_54\">https://doi.org/10.1007/978-3-030-11932-4_54</a>.","ieee":"M. Alptekin and K. Temmen, “Gamification in an Augmented Reality Based Virtual Preparation Laboratory Training,” in <i>The Challenges of the Digital Transformation in Education</i>, Cham: Springer International Publishing, 2019.","ama":"Alptekin M, Temmen K. Gamification in an Augmented Reality Based Virtual Preparation Laboratory Training. In: <i>The Challenges of the Digital Transformation in Education</i>. Springer International Publishing; 2019. doi:<a href=\"https://doi.org/10.1007/978-3-030-11932-4_54\">10.1007/978-3-030-11932-4_54</a>","apa":"Alptekin, M., &#38; Temmen, K. (2019). Gamification in an Augmented Reality Based Virtual Preparation Laboratory Training. In <i>The Challenges of the Digital Transformation in Education</i>. International Conference on Interactive Collaborative Learning and Engineering Pedagogy (ICL) 2018, Kos Island, Greece. Springer International Publishing. <a href=\"https://doi.org/10.1007/978-3-030-11932-4_54\">https://doi.org/10.1007/978-3-030-11932-4_54</a>","bibtex":"@inbook{Alptekin_Temmen_2019, place={Cham}, title={Gamification in an Augmented Reality Based Virtual Preparation Laboratory Training}, DOI={<a href=\"https://doi.org/10.1007/978-3-030-11932-4_54\">10.1007/978-3-030-11932-4_54</a>}, booktitle={The Challenges of the Digital Transformation in Education}, publisher={Springer International Publishing}, author={Alptekin, Mesut and Temmen, Katrin}, year={2019} }","short":"M. Alptekin, K. Temmen, in: The Challenges of the Digital Transformation in Education, Springer International Publishing, Cham, 2019.","mla":"Alptekin, Mesut, and Katrin Temmen. “Gamification in an Augmented Reality Based Virtual Preparation Laboratory Training.” <i>The Challenges of the Digital Transformation in Education</i>, Springer International Publishing, 2019, doi:<a href=\"https://doi.org/10.1007/978-3-030-11932-4_54\">10.1007/978-3-030-11932-4_54</a>."},"place":"Cham","publication_identifier":{"isbn":["9783030119317","9783030119324"],"issn":["2194-5357","2194-5365"]},"has_accepted_license":"1","publication_status":"published","language":[{"iso":"eng"}],"keyword":["Augmented Reality","Laboratory Training","Engineering Education","Gamification"],"ddc":["000"],"file":[{"content_type":"application/pdf","success":1,"relation":"main_file","date_updated":"2024-12-29T11:07:54Z","creator":"mesutalp","date_created":"2024-12-29T11:07:54Z","file_size":366224,"access_level":"closed","file_name":"fullpaper_camera_ready.pdf","file_id":"57865"}],"abstract":[{"text":"Through technological progress during recent years, Augmented Reality (AR) technology can be used on ordinary smartphones with applications (Apps) in many formal and informal learning environments and educational institutions (e.g. [1, 2]). It is emerging as a suitable technology for teaching psychomotor skills. Simultaneously, gamification has become increasingly popular in the teaching field, providing famous examples, such as Duolingo (for the acquisition of foreign languages) or Codecademy (for learning programming languages) [3]. Many papers have already highlighted the beneficial aspects of gamification and AR for education and teaching (e.g. [1, 2, 4, 5]. While gamification is useful for improving students’ motivation and engagement, AR can be applied to teach them operational skills without any time, costs and place constraints. Hence, this opens up numerous possibilities and forms to combine these two aspects (AR and gamification) for higher education teaching. However, there has been less research focusing on how gamification and AR can be combined in a useful manner to keep up students’ initial motivation aroused through novelty effects of AR learning environments. Accordingly, this paper will present such a gamification concept for an AR based virtual preparation laboratory training to overcome the risk of demotivation, once AR will settle as a mainstream technology such as learning videos. The focus of the AR-App – presently being developed at the University of Paderborn – is to remedy the students’ lack of practical skills when operating electro-technical laboratory equipment during their compulsory laboratory training.","lang":"eng"}],"publication":"The Challenges of the Digital Transformation in Education","title":"Gamification in an Augmented Reality Based Virtual Preparation Laboratory Training","date_created":"2022-11-22T11:32:35Z","publisher":"Springer International Publishing","year":"2019"},{"_id":"24052","department":[{"_id":"58"}],"user_id":"44271","language":[{"iso":"eng"}],"publication":"26th IEEE International Conference on Electronics Circuits and Systems (ICECS)","type":"conference","abstract":[{"text":"This paper presents a broadband track-and-hold amplifier (THA) based on switched-emitter-follower (SEF) topology. The THA exhibits a record 3dB small-signal bandwidth of 70 GHz. With the high sampling rate of 40 GS/s, it achieves an effective number of bits (ENOB) of 7.5 bit at 1 GHz input frequency and an ENOB of >5 bit up to 15 GHz input frequency. The chip was fabricated in a 130 nm SiGe BiCMOS technology from IHP (SG13G2). It draws 110 mA from a -4 V supply voltage, dissipating 440 mW.","lang":"eng"}],"status":"public","date_updated":"2025-02-13T12:09:29Z","date_created":"2021-09-09T12:26:06Z","author":[{"id":"30401","full_name":"Wu, Liang","last_name":"Wu","first_name":"Liang"},{"id":"44271","full_name":"Weizel, Maxim","last_name":"Weizel","orcid":"https://orcid.org/0000-0003-2699-9839","first_name":"Maxim"},{"first_name":"Christoph","full_name":"Scheytt, Christoph","id":"37144","orcid":"0000-0002-5950-6618 ","last_name":"Scheytt"}],"title":"A 70 GHz Small-signal Bandwidth 40 GS/s Track-and-Hold Amplifier in 130 nm SiGe BiCMOS Technology","doi":"10.1109/ICECS46596.2019.8965046","conference":{"end_date":"2019.11.29","start_date":"2019.11.27"},"place":"Genova, Italy","year":"2019","citation":{"short":"L. Wu, M. Weizel, C. Scheytt, in: 26th IEEE International Conference on Electronics Circuits and Systems (ICECS), Genova, Italy, 2019.","bibtex":"@inproceedings{Wu_Weizel_Scheytt_2019, place={Genova, Italy}, title={A 70 GHz Small-signal Bandwidth 40 GS/s Track-and-Hold Amplifier in 130 nm SiGe BiCMOS Technology}, DOI={<a href=\"https://doi.org/10.1109/ICECS46596.2019.8965046\">10.1109/ICECS46596.2019.8965046</a>}, booktitle={26th IEEE International Conference on Electronics Circuits and Systems (ICECS)}, author={Wu, Liang and Weizel, Maxim and Scheytt, Christoph}, year={2019} }","mla":"Wu, Liang, et al. “A 70 GHz Small-Signal Bandwidth 40 GS/s Track-and-Hold Amplifier in 130 Nm SiGe BiCMOS Technology.” <i>26th IEEE International Conference on Electronics Circuits and Systems (ICECS)</i>, 2019, doi:<a href=\"https://doi.org/10.1109/ICECS46596.2019.8965046\">10.1109/ICECS46596.2019.8965046</a>.","apa":"Wu, L., Weizel, M., &#38; Scheytt, C. (2019). A 70 GHz Small-signal Bandwidth 40 GS/s Track-and-Hold Amplifier in 130 nm SiGe BiCMOS Technology. <i>26th IEEE International Conference on Electronics Circuits and Systems (ICECS)</i>. <a href=\"https://doi.org/10.1109/ICECS46596.2019.8965046\">https://doi.org/10.1109/ICECS46596.2019.8965046</a>","ama":"Wu L, Weizel M, Scheytt C. A 70 GHz Small-signal Bandwidth 40 GS/s Track-and-Hold Amplifier in 130 nm SiGe BiCMOS Technology. In: <i>26th IEEE International Conference on Electronics Circuits and Systems (ICECS)</i>. ; 2019. doi:<a href=\"https://doi.org/10.1109/ICECS46596.2019.8965046\">10.1109/ICECS46596.2019.8965046</a>","ieee":"L. Wu, M. Weizel, and C. Scheytt, “A 70 GHz Small-signal Bandwidth 40 GS/s Track-and-Hold Amplifier in 130 nm SiGe BiCMOS Technology,” 2019, doi: <a href=\"https://doi.org/10.1109/ICECS46596.2019.8965046\">10.1109/ICECS46596.2019.8965046</a>.","chicago":"Wu, Liang, Maxim Weizel, and Christoph Scheytt. “A 70 GHz Small-Signal Bandwidth 40 GS/s Track-and-Hold Amplifier in 130 Nm SiGe BiCMOS Technology.” In <i>26th IEEE International Conference on Electronics Circuits and Systems (ICECS)</i>. Genova, Italy, 2019. <a href=\"https://doi.org/10.1109/ICECS46596.2019.8965046\">https://doi.org/10.1109/ICECS46596.2019.8965046</a>."}},{"conference":{"start_date":"2019.12.10","location":"Singapore ","end_date":"2019.12.13"},"doi":"10.1109/APMC46564.2019.9038239","title":"70 GHz Large-signal Bandwidth Sampler Using Current-mode Integrate-and-Hold Circuit in 130 nm SiGe BiCMOS Technology","author":[{"full_name":"Wu, Liang","id":"30401","last_name":"Wu","first_name":"Liang"},{"last_name":"Weizel","orcid":"https://orcid.org/0000-0003-2699-9839","id":"44271","full_name":"Weizel, Maxim","first_name":"Maxim"},{"first_name":"Christoph","id":"37144","full_name":"Scheytt, Christoph","last_name":"Scheytt","orcid":"0000-0002-5950-6618 "}],"date_created":"2021-09-09T12:26:04Z","date_updated":"2025-02-13T12:09:17Z","citation":{"ieee":"L. Wu, M. Weizel, and C. Scheytt, “70 GHz Large-signal Bandwidth Sampler Using Current-mode Integrate-and-Hold Circuit in 130 nm SiGe BiCMOS Technology,” Singapore , 2019, doi: <a href=\"https://doi.org/10.1109/APMC46564.2019.9038239\">10.1109/APMC46564.2019.9038239</a>.","chicago":"Wu, Liang, Maxim Weizel, and Christoph Scheytt. “70 GHz Large-Signal Bandwidth Sampler Using Current-Mode Integrate-and-Hold Circuit in 130 Nm SiGe BiCMOS Technology.” In <i>Asia-Pacific Microwave Conference (APMC)</i>, 2019. <a href=\"https://doi.org/10.1109/APMC46564.2019.9038239\">https://doi.org/10.1109/APMC46564.2019.9038239</a>.","ama":"Wu L, Weizel M, Scheytt C. 70 GHz Large-signal Bandwidth Sampler Using Current-mode Integrate-and-Hold Circuit in 130 nm SiGe BiCMOS Technology. In: <i>Asia-Pacific Microwave Conference (APMC)</i>. ; 2019. doi:<a href=\"https://doi.org/10.1109/APMC46564.2019.9038239\">10.1109/APMC46564.2019.9038239</a>","bibtex":"@inproceedings{Wu_Weizel_Scheytt_2019, title={70 GHz Large-signal Bandwidth Sampler Using Current-mode Integrate-and-Hold Circuit in 130 nm SiGe BiCMOS Technology}, DOI={<a href=\"https://doi.org/10.1109/APMC46564.2019.9038239\">10.1109/APMC46564.2019.9038239</a>}, booktitle={Asia-Pacific Microwave Conference (APMC)}, author={Wu, Liang and Weizel, Maxim and Scheytt, Christoph}, year={2019} }","mla":"Wu, Liang, et al. “70 GHz Large-Signal Bandwidth Sampler Using Current-Mode Integrate-and-Hold Circuit in 130 Nm SiGe BiCMOS Technology.” <i>Asia-Pacific Microwave Conference (APMC)</i>, 2019, doi:<a href=\"https://doi.org/10.1109/APMC46564.2019.9038239\">10.1109/APMC46564.2019.9038239</a>.","short":"L. Wu, M. Weizel, C. Scheytt, in: Asia-Pacific Microwave Conference (APMC), 2019.","apa":"Wu, L., Weizel, M., &#38; Scheytt, C. (2019). 70 GHz Large-signal Bandwidth Sampler Using Current-mode Integrate-and-Hold Circuit in 130 nm SiGe BiCMOS Technology. <i>Asia-Pacific Microwave Conference (APMC)</i>. <a href=\"https://doi.org/10.1109/APMC46564.2019.9038239\">https://doi.org/10.1109/APMC46564.2019.9038239</a>"},"year":"2019","language":[{"iso":"eng"}],"department":[{"_id":"58"}],"user_id":"44271","_id":"24049","status":"public","abstract":[{"text":"This paper presents a broadband sampler IC using a current-mode integrated-and-hold-circuit (IHC) as sampling circuit. The sampler IC exhibits 1dB large-signal bandwidth of 70 GHz and excellent signal integrity on hold-mode. With a sampling rate of 5 GS/s, it achieves effective number of bits (ENOB) of 6 bit at 9.9 GHz input frequency. The chip was fabricated in a 130 nm SiGe BiCMOS technology from IHP.","lang":"eng"}],"publication":"Asia-Pacific Microwave Conference (APMC)","type":"conference"},{"citation":{"ama":"Haddadian S, Scheytt C. A 5.8 GHz CMOS Analog Front-End Targeting RF Energy Harvesting for Microwave RFIDs with MIMO Reader. In: <i>IEEE International Conference on RFID Technology &#38; Application (RFID-TA) </i>. ; 2019. doi:<a href=\"https://doi.org/10.1109/RFID-TA.2019.8892037\">10.1109/RFID-TA.2019.8892037</a>","ieee":"S. Haddadian and C. Scheytt, “A 5.8 GHz CMOS Analog Front-End Targeting RF Energy Harvesting for Microwave RFIDs with MIMO Reader,” 2019, doi: <a href=\"https://doi.org/10.1109/RFID-TA.2019.8892037\">10.1109/RFID-TA.2019.8892037</a>.","chicago":"Haddadian, Sanaz, and Christoph Scheytt. “A 5.8 GHz CMOS Analog Front-End Targeting RF Energy Harvesting for Microwave RFIDs with MIMO Reader.” In <i>IEEE International Conference on RFID Technology &#38; Application (RFID-TA) </i>. Pisa, Italy, 2019. <a href=\"https://doi.org/10.1109/RFID-TA.2019.8892037\">https://doi.org/10.1109/RFID-TA.2019.8892037</a>.","bibtex":"@inproceedings{Haddadian_Scheytt_2019, place={Pisa, Italy}, title={A 5.8 GHz CMOS Analog Front-End Targeting RF Energy Harvesting for Microwave RFIDs with MIMO Reader}, DOI={<a href=\"https://doi.org/10.1109/RFID-TA.2019.8892037\">10.1109/RFID-TA.2019.8892037</a>}, booktitle={IEEE International Conference on RFID Technology &#38; Application (RFID-TA) }, author={Haddadian, Sanaz and Scheytt, Christoph}, year={2019} }","mla":"Haddadian, Sanaz, and Christoph Scheytt. “A 5.8 GHz CMOS Analog Front-End Targeting RF Energy Harvesting for Microwave RFIDs with MIMO Reader.” <i>IEEE International Conference on RFID Technology &#38; Application (RFID-TA) </i>, 2019, doi:<a href=\"https://doi.org/10.1109/RFID-TA.2019.8892037\">10.1109/RFID-TA.2019.8892037</a>.","short":"S. Haddadian, C. Scheytt, in: IEEE International Conference on RFID Technology &#38; Application (RFID-TA) , Pisa, Italy, 2019.","apa":"Haddadian, S., &#38; Scheytt, C. (2019). A 5.8 GHz CMOS Analog Front-End Targeting RF Energy Harvesting for Microwave RFIDs with MIMO Reader. <i>IEEE International Conference on RFID Technology &#38; Application (RFID-TA) </i>. <a href=\"https://doi.org/10.1109/RFID-TA.2019.8892037\">https://doi.org/10.1109/RFID-TA.2019.8892037</a>"},"place":"Pisa, Italy","year":"2019","date_created":"2021-09-09T12:26:13Z","author":[{"first_name":"Sanaz","full_name":"Haddadian, Sanaz","id":"59648","last_name":"Haddadian"},{"first_name":"Christoph","orcid":"0000-0002-5950-6618 ","last_name":"Scheytt","full_name":"Scheytt, Christoph","id":"37144"}],"date_updated":"2025-02-13T14:26:02Z","conference":{"end_date":"2019.09.27","start_date":"2019.09.25"},"doi":"10.1109/RFID-TA.2019.8892037","title":"A 5.8 GHz CMOS Analog Front-End Targeting RF Energy Harvesting for Microwave RFIDs with MIMO Reader","publication":"IEEE International Conference on RFID Technology & Application (RFID-TA) ","type":"conference","status":"public","abstract":[{"lang":"eng","text":"Targeting the feasible application of microwave RFID systems with MIMO reader technology for tracking small objects in multipath fading conditions, we present a fully integrated Analog Front-End (AFE) designed and fabricated in a standard 65-nm CMOS technology for low power passive RFID tags in the 5.8 GHz ISM band. A differential drive power scavenging unit is dimensioned to provide a 1.2 V rectified voltage resulting in a 1 V regulated voltage for the AFE while supplying a 50 μW load. Transistors with standard threshold voltage (V th ) have been used for implementation. Measurements of the fabricated circuits show a maximum Power Conversion Efficiency (PCE) of 71.8% at -12.5 dBm, and an input quality factor (Q-factor) of approximately 10."}],"department":[{"_id":"58"}],"user_id":"59648","_id":"24057","language":[{"iso":"eng"}]}]