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Wiesing, M.T. de los Arcos de Pedro, M. Gebhard, A. Devi, G. Grundmeier, Physical Chemistry Chemical Physics (2017) 180–190.","chicago":"Wiesing, M., Maria Teresa de los Arcos de Pedro, M. Gebhard, A. Devi, and Guido Grundmeier. “Analysis of Dispersive Interactions at Polymer/TiAlN Interfaces by Means of Dynamic Force Spectroscopy.” <i>Physical Chemistry Chemical Physics</i>, 2017, 180–90. <a href=\"https://doi.org/10.1039/c7cp05373h\">https://doi.org/10.1039/c7cp05373h</a>.","ieee":"M. Wiesing, M. T. de los Arcos de Pedro, M. Gebhard, A. Devi, and G. Grundmeier, “Analysis of dispersive interactions at polymer/TiAlN interfaces by means of dynamic force spectroscopy,” <i>Physical Chemistry Chemical Physics</i>, pp. 180–190, 2017, doi: <a href=\"https://doi.org/10.1039/c7cp05373h\">10.1039/c7cp05373h</a>.","apa":"Wiesing, M., de los Arcos de Pedro, M. T., Gebhard, M., Devi, A., &#38; Grundmeier, G. (2017). Analysis of dispersive interactions at polymer/TiAlN interfaces by means of dynamic force spectroscopy. <i>Physical Chemistry Chemical Physics</i>, 180–190. <a href=\"https://doi.org/10.1039/c7cp05373h\">https://doi.org/10.1039/c7cp05373h</a>","bibtex":"@article{Wiesing_de los Arcos de Pedro_Gebhard_Devi_Grundmeier_2017, title={Analysis of dispersive interactions at polymer/TiAlN interfaces by means of dynamic force spectroscopy}, DOI={<a href=\"https://doi.org/10.1039/c7cp05373h\">10.1039/c7cp05373h</a>}, journal={Physical Chemistry Chemical Physics}, author={Wiesing, M. and de los Arcos de Pedro, Maria Teresa and Gebhard, M. and Devi, A. and Grundmeier, Guido}, year={2017}, pages={180–190} }","ama":"Wiesing M, de los Arcos de Pedro MT, Gebhard M, Devi A, Grundmeier G. Analysis of dispersive interactions at polymer/TiAlN interfaces by means of dynamic force spectroscopy. <i>Physical Chemistry Chemical Physics</i>. Published online 2017:180-190. doi:<a href=\"https://doi.org/10.1039/c7cp05373h\">10.1039/c7cp05373h</a>","mla":"Wiesing, M., et al. “Analysis of Dispersive Interactions at Polymer/TiAlN Interfaces by Means of Dynamic Force Spectroscopy.” <i>Physical Chemistry Chemical Physics</i>, 2017, pp. 180–90, doi:<a href=\"https://doi.org/10.1039/c7cp05373h\">10.1039/c7cp05373h</a>."},"abstract":[{"text":"<p>Dispersion forces due to polarizable subsurface layers govern TiAlN/polymer interactions and decrease by 50% when oxidizing TiAlN to form TiAlO.</p>","lang":"eng"}]},{"doi":"10.1016/j.surfcoat.2017.12.015","user_id":"54556","language":[{"iso":"eng"}],"_id":"22555","page":"25-31","date_updated":"2023-01-24T08:40:38Z","publication_status":"published","publication_identifier":{"issn":["0257-8972"]},"author":[{"first_name":"C.","last_name":"Hoppe","full_name":"Hoppe, C."},{"full_name":"Mitschker, F.","first_name":"F.","last_name":"Mitschker"},{"first_name":"P.","last_name":"Awakowicz","full_name":"Awakowicz, P."},{"last_name":"Kirchheim","first_name":"D.","full_name":"Kirchheim, D."},{"full_name":"Dahlmann, R.","last_name":"Dahlmann","first_name":"R."},{"first_name":"Maria Teresa","last_name":"de los Arcos de Pedro","full_name":"de los Arcos de Pedro, Maria Teresa","id":"54556"},{"last_name":"Grundmeier","first_name":"Guido","full_name":"Grundmeier, Guido","id":"194"}],"status":"public","title":"Adhesion of plasma-deposited silicon oxide barrier layers on PDMS containing polypropylene","year":"2017","department":[{"_id":"302"}],"type":"journal_article","date_created":"2021-07-07T09:01:35Z","citation":{"bibtex":"@article{Hoppe_Mitschker_Awakowicz_Kirchheim_Dahlmann_de los Arcos de Pedro_Grundmeier_2017, title={Adhesion of plasma-deposited silicon oxide barrier layers on PDMS containing polypropylene}, DOI={<a href=\"https://doi.org/10.1016/j.surfcoat.2017.12.015\">10.1016/j.surfcoat.2017.12.015</a>}, journal={Surface and Coatings Technology}, author={Hoppe, C. and Mitschker, F. and Awakowicz, P. and Kirchheim, D. and Dahlmann, R. and de los Arcos de Pedro, Maria Teresa and Grundmeier, Guido}, year={2017}, pages={25–31} }","ama":"Hoppe C, Mitschker F, Awakowicz P, et al. Adhesion of plasma-deposited silicon oxide barrier layers on PDMS containing polypropylene. <i>Surface and Coatings Technology</i>. Published online 2017:25-31. doi:<a href=\"https://doi.org/10.1016/j.surfcoat.2017.12.015\">10.1016/j.surfcoat.2017.12.015</a>","mla":"Hoppe, C., et al. “Adhesion of Plasma-Deposited Silicon Oxide Barrier Layers on PDMS Containing Polypropylene.” <i>Surface and Coatings Technology</i>, 2017, pp. 25–31, doi:<a href=\"https://doi.org/10.1016/j.surfcoat.2017.12.015\">10.1016/j.surfcoat.2017.12.015</a>.","short":"C. Hoppe, F. Mitschker, P. Awakowicz, D. Kirchheim, R. Dahlmann, M.T. de los Arcos de Pedro, G. Grundmeier, Surface and Coatings Technology (2017) 25–31.","chicago":"Hoppe, C., F. Mitschker, P. Awakowicz, D. Kirchheim, R. Dahlmann, Maria Teresa de los Arcos de Pedro, and Guido Grundmeier. “Adhesion of Plasma-Deposited Silicon Oxide Barrier Layers on PDMS Containing Polypropylene.” <i>Surface and Coatings Technology</i>, 2017, 25–31. <a href=\"https://doi.org/10.1016/j.surfcoat.2017.12.015\">https://doi.org/10.1016/j.surfcoat.2017.12.015</a>.","ieee":"C. Hoppe <i>et al.</i>, “Adhesion of plasma-deposited silicon oxide barrier layers on PDMS containing polypropylene,” <i>Surface and Coatings Technology</i>, pp. 25–31, 2017, doi: <a href=\"https://doi.org/10.1016/j.surfcoat.2017.12.015\">10.1016/j.surfcoat.2017.12.015</a>.","apa":"Hoppe, C., Mitschker, F., Awakowicz, P., Kirchheim, D., Dahlmann, R., de los Arcos de Pedro, M. T., &#38; Grundmeier, G. (2017). Adhesion of plasma-deposited silicon oxide barrier layers on PDMS containing polypropylene. <i>Surface and Coatings Technology</i>, 25–31. <a href=\"https://doi.org/10.1016/j.surfcoat.2017.12.015\">https://doi.org/10.1016/j.surfcoat.2017.12.015</a>"},"publication":"Surface and Coatings Technology"},{"_id":"20941","page":"1371-1380","volume":18,"user_id":"7266","status":"public","external_id":{"isi":["000382984300008"]},"isi":"1","citation":{"chicago":"Hoppe, Christian, Christoph Ebbert, Richard Grothe, Hans Christian Schmidt, Illia Hordych, Werner Homberg, Hans Juergen Maier, and Guido Grundmeier. “Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation.” <i>ADVANCED ENGINEERING MATERIALS</i> 18, no. 8 (2016): 1371–80. <a href=\"https://doi.org/10.1002/adem.201600085\">https://doi.org/10.1002/adem.201600085</a>.","short":"C. Hoppe, C. Ebbert, R. Grothe, H.C. Schmidt, I. Hordych, W. Homberg, H.J. Maier, G. Grundmeier, ADVANCED ENGINEERING MATERIALS 18 (2016) 1371–1380.","ieee":"C. Hoppe <i>et al.</i>, “Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation,” <i>ADVANCED ENGINEERING MATERIALS</i>, vol. 18, no. 8, pp. 1371–1380, 2016.","apa":"Hoppe, C., Ebbert, C., Grothe, R., Schmidt, H. C., Hordych, I., Homberg, W., … Grundmeier, G. (2016). Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation. <i>ADVANCED ENGINEERING MATERIALS</i>, <i>18</i>(8), 1371–1380. <a href=\"https://doi.org/10.1002/adem.201600085\">https://doi.org/10.1002/adem.201600085</a>","bibtex":"@article{Hoppe_Ebbert_Grothe_Schmidt_Hordych_Homberg_Maier_Grundmeier_2016, title={Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation}, volume={18}, DOI={<a href=\"https://doi.org/10.1002/adem.201600085\">10.1002/adem.201600085</a>}, number={8}, journal={ADVANCED ENGINEERING MATERIALS}, author={Hoppe, Christian and Ebbert, Christoph and Grothe, Richard and Schmidt, Hans Christian and Hordych, Illia and Homberg, Werner and Maier, Hans Juergen and Grundmeier, Guido}, year={2016}, pages={1371–1380} }","ama":"Hoppe C, Ebbert C, Grothe R, et al. Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation. <i>ADVANCED ENGINEERING MATERIALS</i>. 2016;18(8):1371-1380. doi:<a href=\"https://doi.org/10.1002/adem.201600085\">10.1002/adem.201600085</a>","mla":"Hoppe, Christian, et al. “Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation.” <i>ADVANCED ENGINEERING MATERIALS</i>, vol. 18, no. 8, 2016, pp. 1371–80, doi:<a href=\"https://doi.org/10.1002/adem.201600085\">10.1002/adem.201600085</a>."},"quality_controlled":"1","language":[{"iso":"eng"}],"doi":"10.1002/adem.201600085","publication_identifier":{"issn":["1438-1656"],"eissn":["1527-2648"]},"author":[{"full_name":"Hoppe, Christian","last_name":"Hoppe","first_name":"Christian","id":"27401"},{"id":"7266","full_name":"Ebbert, Christoph","last_name":"Ebbert","first_name":"Christoph"},{"full_name":"Grothe, Richard","first_name":"Richard","last_name":"Grothe"},{"last_name":"Schmidt","first_name":"Hans Christian","full_name":"Schmidt, Hans Christian"},{"first_name":"Illia","last_name":"Hordych","full_name":"Hordych, Illia"},{"first_name":"Werner","last_name":"Homberg","full_name":"Homberg, Werner"},{"full_name":"Maier, Hans Juergen","last_name":"Maier","first_name":"Hans Juergen"},{"last_name":"Grundmeier","first_name":"Guido","full_name":"Grundmeier, Guido","id":"194"}],"title":"Influence of the Surface and Heat Treatment on the Bond Strength of Galvanized Steel/Aluminum Composites Joined by Plastic Deformation","year":"2016","intvolume":"        18","date_updated":"2022-01-06T06:54:41Z","publication_status":"published","date_created":"2021-01-13T10:12:46Z","department":[{"_id":"35"},{"_id":"302"},{"_id":"321"}],"type":"journal_article","publication":"ADVANCED ENGINEERING MATERIALS","issue":"8","abstract":[{"lang":"eng","text":"The influence of a chemical or mechanical surface modification followed by different post-heat treatments on the bond strength of galvanized steel/ aluminum composites is studied. An incremental rolling process is used for joint formation based on plastic deformation. The morphology, the chemical state of the modified surfaces as well as the cross-section, and local potential distribution of the welded zone is characterized by different microscopic and spectroscopic methods. The stability of the joint is analyzed by a shear-force test in combination with microscopic failure analysis. A clear correlation between pre/post-treatment and the joint strength is observed."}]},{"volume":18,"user_id":"7266","_id":"20942","page":"1066-1074","status":"public","external_id":{"isi":["000378684200023"]},"quality_controlled":"1","isi":"1","citation":{"mla":"Hoppe, Christian, et al. “Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation.” <i>ADVANCED ENGINEERING MATERIALS</i>, vol. 18, no. 6, 2016, pp. 1066–74, doi:<a href=\"https://doi.org/10.1002/adem.201500501\">10.1002/adem.201500501</a>.","ama":"Hoppe C, Ebbert C, Voigt M, et al. Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation. <i>ADVANCED ENGINEERING MATERIALS</i>. 2016;18(6):1066-1074. doi:<a href=\"https://doi.org/10.1002/adem.201500501\">10.1002/adem.201500501</a>","bibtex":"@article{Hoppe_Ebbert_Voigt_Schmidt_Rodman_Homberg_Maier_Grundmeier_2016, title={Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation}, volume={18}, DOI={<a href=\"https://doi.org/10.1002/adem.201500501\">10.1002/adem.201500501</a>}, number={6}, journal={ADVANCED ENGINEERING MATERIALS}, author={Hoppe, Christian and Ebbert, Christoph and Voigt, Markus and Schmidt, Hans Christian and Rodman, Dmytro and Homberg, Werner and Maier, Hans Juergen and Grundmeier, Guido}, year={2016}, pages={1066–1074} }","apa":"Hoppe, C., Ebbert, C., Voigt, M., Schmidt, H. C., Rodman, D., Homberg, W., … Grundmeier, G. (2016). Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation. <i>ADVANCED ENGINEERING MATERIALS</i>, <i>18</i>(6), 1066–1074. <a href=\"https://doi.org/10.1002/adem.201500501\">https://doi.org/10.1002/adem.201500501</a>","ieee":"C. Hoppe <i>et al.</i>, “Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation,” <i>ADVANCED ENGINEERING MATERIALS</i>, vol. 18, no. 6, pp. 1066–1074, 2016.","short":"C. Hoppe, C. Ebbert, M. Voigt, H.C. Schmidt, D. Rodman, W. Homberg, H.J. Maier, G. Grundmeier, ADVANCED ENGINEERING MATERIALS 18 (2016) 1066–1074.","chicago":"Hoppe, Christian, Christoph Ebbert, Markus Voigt, Hans Christian Schmidt, Dmytro Rodman, Werner Homberg, Hans Juergen Maier, and Guido Grundmeier. “Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation.” <i>ADVANCED ENGINEERING MATERIALS</i> 18, no. 6 (2016): 1066–74. <a href=\"https://doi.org/10.1002/adem.201500501\">https://doi.org/10.1002/adem.201500501</a>."},"doi":"10.1002/adem.201500501","language":[{"iso":"eng"}],"intvolume":"        18","date_updated":"2022-01-06T06:54:41Z","publication_status":"published","author":[{"last_name":"Hoppe","first_name":"Christian","full_name":"Hoppe, Christian","id":"27401"},{"id":"7266","first_name":"Christoph","last_name":"Ebbert","full_name":"Ebbert, Christoph"},{"last_name":"Voigt","first_name":"Markus","full_name":"Voigt, Markus"},{"last_name":"Schmidt","first_name":"Hans Christian","full_name":"Schmidt, Hans Christian"},{"full_name":"Rodman, Dmytro","first_name":"Dmytro","last_name":"Rodman"},{"full_name":"Homberg, Werner","first_name":"Werner","last_name":"Homberg"},{"first_name":"Hans Juergen","last_name":"Maier","full_name":"Maier, Hans Juergen"},{"first_name":"Guido","last_name":"Grundmeier","full_name":"Grundmeier, Guido","id":"194"}],"publication_identifier":{"eissn":["1527-2648"],"issn":["1438-1656"]},"title":"Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation","year":"2016","department":[{"_id":"35"},{"_id":"302"},{"_id":"321"}],"type":"journal_article","date_created":"2021-01-13T10:12:47Z","abstract":[{"lang":"eng","text":"Interface modification based on ultra-thin mercapto-propyl(trimethoxy) silane (MPTMS) films is shown to promote joining of copper and aluminum by plastic deformation followed by a heat treatment. The surface morphology and the surface chemistry of the metal substrates were analyzed by means of FE-SEM, XPS, and FT-IRRAS. The spectroscopic data show that the MPTMS film is crosslinked via Si-O-Si bonds and that stable Cu-S and Si-O-Al interfacial bonds are formed. The shear-force tests of the joints led to force displacement curves that are characteristic for a covalently bonded interface. Complementary cross sectional SEM and EDS analysis of the joint proved that a defect-free interface was formed without any measureable interdiffusion of metals across the interface or cracking of an oxide films."}],"publication":"ADVANCED ENGINEERING MATERIALS","issue":"6"},{"publication_identifier":{"issn":["0743-7463","1520-5827"]},"author":[{"full_name":"Hajiraissi, Roozbeh","last_name":"Hajiraissi","first_name":"Roozbeh"},{"last_name":"Giner","first_name":"Ignacio","full_name":"Giner, Ignacio"},{"id":"194","full_name":"Grundmeier, Guido","first_name":"Guido","last_name":"Grundmeier"},{"full_name":"Keller, Adrian","last_name":"Keller","first_name":"Adrian","orcid":"0000-0001-7139-3110","id":"48864"}],"year":"2016","status":"public","title":"Self-Assembly, Dynamics, and Polymorphism of hIAPP(20–29) Aggregates at Solid–Liquid Interfaces","intvolume":"        33","date_updated":"2022-01-06T06:55:38Z","publication_status":"published","_id":"22671","language":[{"iso":"eng"}],"page":"372-381","volume":33,"doi":"10.1021/acs.langmuir.6b03288","user_id":"48864","citation":{"mla":"Hajiraissi, Roozbeh, et al. “Self-Assembly, Dynamics, and Polymorphism of HIAPP(20–29) Aggregates at Solid–Liquid Interfaces.” <i>Langmuir</i>, vol. 33, 2016, pp. 372–81, doi:<a href=\"https://doi.org/10.1021/acs.langmuir.6b03288\">10.1021/acs.langmuir.6b03288</a>.","ama":"Hajiraissi R, Giner I, Grundmeier G, Keller A. Self-Assembly, Dynamics, and Polymorphism of hIAPP(20–29) Aggregates at Solid–Liquid Interfaces. <i>Langmuir</i>. 2016;33:372-381. doi:<a href=\"https://doi.org/10.1021/acs.langmuir.6b03288\">10.1021/acs.langmuir.6b03288</a>","bibtex":"@article{Hajiraissi_Giner_Grundmeier_Keller_2016, title={Self-Assembly, Dynamics, and Polymorphism of hIAPP(20–29) Aggregates at Solid–Liquid Interfaces}, volume={33}, DOI={<a href=\"https://doi.org/10.1021/acs.langmuir.6b03288\">10.1021/acs.langmuir.6b03288</a>}, journal={Langmuir}, author={Hajiraissi, Roozbeh and Giner, Ignacio and Grundmeier, Guido and Keller, Adrian}, year={2016}, pages={372–381} }","apa":"Hajiraissi, R., Giner, I., Grundmeier, G., &#38; Keller, A. (2016). Self-Assembly, Dynamics, and Polymorphism of hIAPP(20–29) Aggregates at Solid–Liquid Interfaces. <i>Langmuir</i>, <i>33</i>, 372–381. <a href=\"https://doi.org/10.1021/acs.langmuir.6b03288\">https://doi.org/10.1021/acs.langmuir.6b03288</a>","ieee":"R. Hajiraissi, I. Giner, G. Grundmeier, and A. Keller, “Self-Assembly, Dynamics, and Polymorphism of hIAPP(20–29) Aggregates at Solid–Liquid Interfaces,” <i>Langmuir</i>, vol. 33, pp. 372–381, 2016.","short":"R. Hajiraissi, I. Giner, G. Grundmeier, A. Keller, Langmuir 33 (2016) 372–381.","chicago":"Hajiraissi, Roozbeh, Ignacio Giner, Guido Grundmeier, and Adrian Keller. “Self-Assembly, Dynamics, and Polymorphism of HIAPP(20–29) Aggregates at Solid–Liquid Interfaces.” <i>Langmuir</i> 33 (2016): 372–81. <a href=\"https://doi.org/10.1021/acs.langmuir.6b03288\">https://doi.org/10.1021/acs.langmuir.6b03288</a>."},"publication":"Langmuir","date_created":"2021-07-08T12:42:32Z","department":[{"_id":"302"}],"type":"journal_article"},{"publication_status":"published","date_updated":"2022-01-06T06:55:38Z","intvolume":"         8","year":"2016","title":"Regular Nanoscale Protein Patterns via Directed Adsorption through Self-Assembled DNA Origami Masks","status":"public","author":[{"full_name":"Ramakrishnan, Saminathan","first_name":"Saminathan","last_name":"Ramakrishnan"},{"full_name":"Subramaniam, Sivaraman","last_name":"Subramaniam","first_name":"Sivaraman"},{"first_name":"A. Francis","last_name":"Stewart","full_name":"Stewart, A. Francis"},{"full_name":"Grundmeier, Guido","last_name":"Grundmeier","first_name":"Guido","id":"194"},{"id":"48864","orcid":"0000-0001-7139-3110","last_name":"Keller","first_name":"Adrian","full_name":"Keller, Adrian"}],"publication_identifier":{"issn":["1944-8244","1944-8252"]},"user_id":"48864","doi":"10.1021/acsami.6b10535","volume":8,"page":"31239-31247","language":[{"iso":"eng"}],"_id":"22672","publication":"ACS Applied Materials & Interfaces","citation":{"bibtex":"@article{Ramakrishnan_Subramaniam_Stewart_Grundmeier_Keller_2016, title={Regular Nanoscale Protein Patterns via Directed Adsorption through Self-Assembled DNA Origami Masks}, volume={8}, DOI={<a href=\"https://doi.org/10.1021/acsami.6b10535\">10.1021/acsami.6b10535</a>}, journal={ACS Applied Materials &#38; Interfaces}, author={Ramakrishnan, Saminathan and Subramaniam, Sivaraman and Stewart, A. Francis and Grundmeier, Guido and Keller, Adrian}, year={2016}, pages={31239–31247} }","ama":"Ramakrishnan S, Subramaniam S, Stewart AF, Grundmeier G, Keller A. Regular Nanoscale Protein Patterns via Directed Adsorption through Self-Assembled DNA Origami Masks. <i>ACS Applied Materials &#38; Interfaces</i>. 2016;8:31239-31247. doi:<a href=\"https://doi.org/10.1021/acsami.6b10535\">10.1021/acsami.6b10535</a>","mla":"Ramakrishnan, Saminathan, et al. “Regular Nanoscale Protein Patterns via Directed Adsorption through Self-Assembled DNA Origami Masks.” <i>ACS Applied Materials &#38; Interfaces</i>, vol. 8, 2016, pp. 31239–47, doi:<a href=\"https://doi.org/10.1021/acsami.6b10535\">10.1021/acsami.6b10535</a>.","short":"S. Ramakrishnan, S. Subramaniam, A.F. Stewart, G. Grundmeier, A. Keller, ACS Applied Materials &#38; Interfaces 8 (2016) 31239–31247.","chicago":"Ramakrishnan, Saminathan, Sivaraman Subramaniam, A. Francis Stewart, Guido Grundmeier, and Adrian Keller. “Regular Nanoscale Protein Patterns via Directed Adsorption through Self-Assembled DNA Origami Masks.” <i>ACS Applied Materials &#38; Interfaces</i> 8 (2016): 31239–47. <a href=\"https://doi.org/10.1021/acsami.6b10535\">https://doi.org/10.1021/acsami.6b10535</a>.","ieee":"S. Ramakrishnan, S. Subramaniam, A. F. Stewart, G. Grundmeier, and A. Keller, “Regular Nanoscale Protein Patterns via Directed Adsorption through Self-Assembled DNA Origami Masks,” <i>ACS Applied Materials &#38; Interfaces</i>, vol. 8, pp. 31239–31247, 2016.","apa":"Ramakrishnan, S., Subramaniam, S., Stewart, A. F., Grundmeier, G., &#38; Keller, A. (2016). Regular Nanoscale Protein Patterns via Directed Adsorption through Self-Assembled DNA Origami Masks. <i>ACS Applied Materials &#38; Interfaces</i>, <i>8</i>, 31239–31247. <a href=\"https://doi.org/10.1021/acsami.6b10535\">https://doi.org/10.1021/acsami.6b10535</a>"},"type":"journal_article","department":[{"_id":"302"}],"date_created":"2021-07-08T12:47:25Z"},{"citation":{"bibtex":"@article{Teschome_Facsko_Schönherr_Kerbusch_Keller_Erbe_2016, title={Temperature-Dependent Charge Transport through Individually Contacted DNA Origami-Based Au Nanowires.}, volume={32}, DOI={<a href=\"https://doi.org/10.1021/acs.langmuir.6b01961\">10.1021/acs.langmuir.6b01961</a>}, number={40}, journal={Langmuir}, author={Teschome, B and Facsko, S and Schönherr, T and Kerbusch, J and Keller, Adrian and Erbe, A}, year={2016}, pages={10159–10165} }","ama":"Teschome B, Facsko S, Schönherr T, Kerbusch J, Keller A, Erbe A. Temperature-Dependent Charge Transport through Individually Contacted DNA Origami-Based Au Nanowires. <i>Langmuir</i>. 2016;32(40):10159-10165. doi:<a href=\"https://doi.org/10.1021/acs.langmuir.6b01961\">10.1021/acs.langmuir.6b01961</a>","mla":"Teschome, B., et al. “Temperature-Dependent Charge Transport through Individually Contacted DNA Origami-Based Au Nanowires.” <i>Langmuir</i>, vol. 32, no. 40, 2016, pp. 10159–65, doi:<a href=\"https://doi.org/10.1021/acs.langmuir.6b01961\">10.1021/acs.langmuir.6b01961</a>.","short":"B. Teschome, S. Facsko, T. Schönherr, J. Kerbusch, A. Keller, A. Erbe, Langmuir 32 (2016) 10159–10165.","chicago":"Teschome, B, S Facsko, T Schönherr, J Kerbusch, Adrian Keller, and A Erbe. “Temperature-Dependent Charge Transport through Individually Contacted DNA Origami-Based Au Nanowires.” <i>Langmuir</i> 32, no. 40 (2016): 10159–65. <a href=\"https://doi.org/10.1021/acs.langmuir.6b01961\">https://doi.org/10.1021/acs.langmuir.6b01961</a>.","ieee":"B. Teschome, S. Facsko, T. Schönherr, J. Kerbusch, A. Keller, and A. Erbe, “Temperature-Dependent Charge Transport through Individually Contacted DNA Origami-Based Au Nanowires.,” <i>Langmuir</i>, vol. 32, no. 40, pp. 10159–10165, 2016.","apa":"Teschome, B., Facsko, S., Schönherr, T., Kerbusch, J., Keller, A., &#38; Erbe, A. (2016). Temperature-Dependent Charge Transport through Individually Contacted DNA Origami-Based Au Nanowires. <i>Langmuir</i>, <i>32</i>(40), 10159–10165. <a href=\"https://doi.org/10.1021/acs.langmuir.6b01961\">https://doi.org/10.1021/acs.langmuir.6b01961</a>"},"external_id":{"pmid":["27626925"]},"status":"public","page":"10159-10165","_id":"22673","user_id":"48864","volume":32,"publication":"Langmuir","issue":"40","date_created":"2021-07-08T12:49:07Z","type":"journal_article","department":[{"_id":"302"}],"year":"2016","title":"Temperature-Dependent Charge Transport through Individually Contacted DNA Origami-Based Au Nanowires.","author":[{"last_name":"Teschome","first_name":"B","full_name":"Teschome, B"},{"full_name":"Facsko, S","last_name":"Facsko","first_name":"S"},{"first_name":"T","last_name":"Schönherr","full_name":"Schönherr, T"},{"last_name":"Kerbusch","first_name":"J","full_name":"Kerbusch, J"},{"full_name":"Keller, Adrian","first_name":"Adrian","orcid":"0000-0001-7139-3110","last_name":"Keller","id":"48864"},{"full_name":"Erbe, A","first_name":"A","last_name":"Erbe"}],"publication_identifier":{"issn":["0743-7463","1520-5827"]},"date_updated":"2022-01-06T06:55:38Z","intvolume":"        32","language":[{"iso":"eng"}],"doi":"10.1021/acs.langmuir.6b01961","pmid":"1"},{"language":[{"iso":"eng"}],"_id":"22674","page":"34525","volume":6,"pmid":"1","doi":"10.1038/srep34525","user_id":"48864","author":[{"full_name":"Subramaniam, S","last_name":"Subramaniam","first_name":"S"},{"first_name":"A","last_name":"Erler","full_name":"Erler, A"},{"full_name":"Fu, J","first_name":"J","last_name":"Fu"},{"full_name":"Kranz, A","last_name":"Kranz","first_name":"A"},{"first_name":"J","last_name":"Tang","full_name":"Tang, J"},{"first_name":"M","last_name":"Gopalswamy","full_name":"Gopalswamy, M"},{"full_name":"Ramakrishnan, S","last_name":"Ramakrishnan","first_name":"S"},{"full_name":"Keller, Adrian","last_name":"Keller","orcid":"0000-0001-7139-3110","first_name":"Adrian","id":"48864"},{"id":"194","first_name":"Guido","last_name":"Grundmeier","full_name":"Grundmeier, Guido"},{"last_name":"Müller","first_name":"D","full_name":"Müller, D"},{"first_name":"M","last_name":"Sattler","full_name":"Sattler, M"},{"first_name":"AF","last_name":"Stewart","full_name":"Stewart, AF"}],"publication_identifier":{"issn":["2045-2322"]},"title":"DNA annealing by Redβ is insufficient for homologous recombination and the additional requirements involve intra- and inter-molecular interactions.","status":"public","year":"2016","intvolume":"         6","date_updated":"2022-01-06T06:55:38Z","date_created":"2021-07-08T12:50:58Z","external_id":{"pmid":["27708411"]},"department":[{"_id":"302"}],"type":"journal_article","citation":{"ieee":"S. Subramaniam <i>et al.</i>, “DNA annealing by Redβ is insufficient for homologous recombination and the additional requirements involve intra- and inter-molecular interactions.,” <i>Scientific Reports</i>, vol. 6, p. 34525, 2016.","apa":"Subramaniam, S., Erler, A., Fu, J., Kranz, A., Tang, J., Gopalswamy, M., … Stewart, A. (2016). DNA annealing by Redβ is insufficient for homologous recombination and the additional requirements involve intra- and inter-molecular interactions. <i>Scientific Reports</i>, <i>6</i>, 34525. <a href=\"https://doi.org/10.1038/srep34525\">https://doi.org/10.1038/srep34525</a>","short":"S. Subramaniam, A. Erler, J. Fu, A. Kranz, J. Tang, M. Gopalswamy, S. Ramakrishnan, A. Keller, G. Grundmeier, D. Müller, M. Sattler, A. Stewart, Scientific Reports 6 (2016) 34525.","chicago":"Subramaniam, S, A Erler, J Fu, A Kranz, J Tang, M Gopalswamy, S Ramakrishnan, et al. “DNA Annealing by Redβ Is Insufficient for Homologous Recombination and the Additional Requirements Involve Intra- and Inter-Molecular Interactions.” <i>Scientific Reports</i> 6 (2016): 34525. <a href=\"https://doi.org/10.1038/srep34525\">https://doi.org/10.1038/srep34525</a>.","mla":"Subramaniam, S., et al. “DNA Annealing by Redβ Is Insufficient for Homologous Recombination and the Additional Requirements Involve Intra- and Inter-Molecular Interactions.” <i>Scientific Reports</i>, vol. 6, 2016, p. 34525, doi:<a href=\"https://doi.org/10.1038/srep34525\">10.1038/srep34525</a>.","bibtex":"@article{Subramaniam_Erler_Fu_Kranz_Tang_Gopalswamy_Ramakrishnan_Keller_Grundmeier_Müller_et al._2016, title={DNA annealing by Redβ is insufficient for homologous recombination and the additional requirements involve intra- and inter-molecular interactions.}, volume={6}, DOI={<a href=\"https://doi.org/10.1038/srep34525\">10.1038/srep34525</a>}, journal={Scientific Reports}, author={Subramaniam, S and Erler, A and Fu, J and Kranz, A and Tang, J and Gopalswamy, M and Ramakrishnan, S and Keller, Adrian and Grundmeier, Guido and Müller, D and et al.}, year={2016}, pages={34525} }","ama":"Subramaniam S, Erler A, Fu J, et al. DNA annealing by Redβ is insufficient for homologous recombination and the additional requirements involve intra- and inter-molecular interactions. <i>Scientific Reports</i>. 2016;6:34525. doi:<a href=\"https://doi.org/10.1038/srep34525\">10.1038/srep34525</a>"},"publication":"Scientific Reports"},{"page":"17805-17816","_id":"22675","language":[{"iso":"eng"}],"user_id":"48864","doi":"10.1021/acsami.6b04421","volume":8,"status":"public","title":"Plasma-Enhanced Chemical Vapor Deposition (PE-CVD) yields better Hydrolytical Stability of Biocompatible SiOx Thin Films on Implant Alumina Ceramics compared to Rapid Thermal Evaporation Physical Vapor Deposition (PVD)","year":"2016","publication_identifier":{"issn":["1944-8244","1944-8252"]},"author":[{"full_name":"Böke, Frederik","last_name":"Böke","first_name":"Frederik"},{"full_name":"Giner, Ignacio","last_name":"Giner","first_name":"Ignacio"},{"full_name":"Keller, Adrian","first_name":"Adrian","last_name":"Keller","orcid":"0000-0001-7139-3110","id":"48864"},{"first_name":"Guido","last_name":"Grundmeier","full_name":"Grundmeier, Guido","id":"194"},{"full_name":"Fischer, Horst","last_name":"Fischer","first_name":"Horst"}],"publication_status":"published","date_updated":"2022-01-06T06:55:38Z","intvolume":"         8","date_created":"2021-07-08T12:51:40Z","type":"journal_article","department":[{"_id":"302"}],"publication":"ACS Applied Materials & Interfaces","citation":{"bibtex":"@article{Böke_Giner_Keller_Grundmeier_Fischer_2016, title={Plasma-Enhanced Chemical Vapor Deposition (PE-CVD) yields better Hydrolytical Stability of Biocompatible SiOx Thin Films on Implant Alumina Ceramics compared to Rapid Thermal Evaporation Physical Vapor Deposition (PVD)}, volume={8}, DOI={<a href=\"https://doi.org/10.1021/acsami.6b04421\">10.1021/acsami.6b04421</a>}, journal={ACS Applied Materials &#38; Interfaces}, author={Böke, Frederik and Giner, Ignacio and Keller, Adrian and Grundmeier, Guido and Fischer, Horst}, year={2016}, pages={17805–17816} }","ama":"Böke F, Giner I, Keller A, Grundmeier G, Fischer H. Plasma-Enhanced Chemical Vapor Deposition (PE-CVD) yields better Hydrolytical Stability of Biocompatible SiOx Thin Films on Implant Alumina Ceramics compared to Rapid Thermal Evaporation Physical Vapor Deposition (PVD). <i>ACS Applied Materials &#38; Interfaces</i>. 2016;8:17805-17816. doi:<a href=\"https://doi.org/10.1021/acsami.6b04421\">10.1021/acsami.6b04421</a>","mla":"Böke, Frederik, et al. “Plasma-Enhanced Chemical Vapor Deposition (PE-CVD) Yields Better Hydrolytical Stability of Biocompatible SiOx Thin Films on Implant Alumina Ceramics Compared to Rapid Thermal Evaporation Physical Vapor Deposition (PVD).” <i>ACS Applied Materials &#38; Interfaces</i>, vol. 8, 2016, pp. 17805–16, doi:<a href=\"https://doi.org/10.1021/acsami.6b04421\">10.1021/acsami.6b04421</a>.","short":"F. Böke, I. Giner, A. Keller, G. Grundmeier, H. Fischer, ACS Applied Materials &#38; Interfaces 8 (2016) 17805–17816.","chicago":"Böke, Frederik, Ignacio Giner, Adrian Keller, Guido Grundmeier, and Horst Fischer. “Plasma-Enhanced Chemical Vapor Deposition (PE-CVD) Yields Better Hydrolytical Stability of Biocompatible SiOx Thin Films on Implant Alumina Ceramics Compared to Rapid Thermal Evaporation Physical Vapor Deposition (PVD).” <i>ACS Applied Materials &#38; Interfaces</i> 8 (2016): 17805–16. <a href=\"https://doi.org/10.1021/acsami.6b04421\">https://doi.org/10.1021/acsami.6b04421</a>.","ieee":"F. Böke, I. Giner, A. Keller, G. Grundmeier, and H. Fischer, “Plasma-Enhanced Chemical Vapor Deposition (PE-CVD) yields better Hydrolytical Stability of Biocompatible SiOx Thin Films on Implant Alumina Ceramics compared to Rapid Thermal Evaporation Physical Vapor Deposition (PVD),” <i>ACS Applied Materials &#38; Interfaces</i>, vol. 8, pp. 17805–17816, 2016.","apa":"Böke, F., Giner, I., Keller, A., Grundmeier, G., &#38; Fischer, H. (2016). Plasma-Enhanced Chemical Vapor Deposition (PE-CVD) yields better Hydrolytical Stability of Biocompatible SiOx Thin Films on Implant Alumina Ceramics compared to Rapid Thermal Evaporation Physical Vapor Deposition (PVD). <i>ACS Applied Materials &#38; Interfaces</i>, <i>8</i>, 17805–17816. <a href=\"https://doi.org/10.1021/acsami.6b04421\">https://doi.org/10.1021/acsami.6b04421</a>"}}]