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Yue (Eds.), Proceedings of the 18th International Conference on Remote Engineering and Virtual Instrumentation, Online Engineering and Society 4.0, Springer International Publishing, 2021, pp. 451–463."},"user_id":"15782","volume":"vol. 298","editor":[{"last_name":"Auer","first_name":"Michael E.","full_name":"Auer, Michael E."},{"first_name":"Kalyan Ram","last_name":"Bhimavaram","full_name":"Bhimavaram, Kalyan Ram"},{"full_name":"Yue, Xiao-Guang","last_name":"Yue","first_name":"Xiao-Guang"}],"page":"451-463","publisher":"Springer International Publishing","_id":"26404","language":[{"iso":"eng"}],"publication_status":"published","date_updated":"2022-01-06T06:57:20Z","title":"Augmented Reality-based Product Validation to Support Collaborative Engineering of Complex Technical Systems","status":"public","year":"2021","author":[{"first_name":"Daniel","last_name":"Eckertz","full_name":"Eckertz, Daniel"},{"first_name":"Harald","last_name":"Anacker","full_name":"Anacker, Harald"},{"first_name":"Roman","last_name":"Dumitrescu","full_name":"Dumitrescu, Roman","id":"16190"}],"publication_identifier":{"isbn":["978-3-030-82528-7"]}},{"date_created":"2021-10-19T07:01:06Z","type":"conference","department":[{"_id":"563"}],"publication":"Procedia CIRP","citation":{"ama":"Gabriel S, Grauthoff T, Joppen R, Kühn A, Dumitrescu R. Analyzing socio-technical risks in implementation of Industry 4.0-use cases. In: <i>Procedia CIRP</i>. Vol 100. ; 2021:241-246.","bibtex":"@inproceedings{Gabriel_Grauthoff_Joppen_Kühn_Dumitrescu_2021, title={Analyzing socio-technical risks in implementation of Industry 4.0-use cases}, volume={100}, booktitle={Procedia CIRP}, author={Gabriel, Stefan and Grauthoff, Tobias and Joppen, Robert and Kühn, Arno and Dumitrescu, Roman}, year={2021}, pages={241–246} }","mla":"Gabriel, Stefan, et al. “Analyzing Socio-Technical Risks in Implementation of Industry 4.0-Use Cases.” <i>Procedia CIRP</i>, vol. 100, 2021, pp. 241–46.","short":"S. Gabriel, T. Grauthoff, R. Joppen, A. Kühn, R. Dumitrescu, in: Procedia CIRP, 2021, pp. 241–246.","chicago":"Gabriel, Stefan, Tobias Grauthoff, Robert Joppen, Arno Kühn, and Roman Dumitrescu. “Analyzing Socio-Technical Risks in Implementation of Industry 4.0-Use Cases.” In <i>Procedia CIRP</i>, 100:241–46, 2021.","apa":"Gabriel, S., Grauthoff, T., Joppen, R., Kühn, A., &#38; Dumitrescu, R. (2021). Analyzing socio-technical risks in implementation of Industry 4.0-use cases. <i>Procedia CIRP</i>, <i>100</i>, 241–246.","ieee":"S. Gabriel, T. Grauthoff, R. Joppen, A. Kühn, and R. Dumitrescu, “Analyzing socio-technical risks in implementation of Industry 4.0-use cases,” in <i>Procedia CIRP</i>, Enschede, the Netherlands, 2021, vol. 100, pp. 241–246."},"page":"241-246","language":[{"iso":"eng"}],"_id":"26492","user_id":"15782","volume":"vol. 100","year":"2021","status":"public","title":"Analyzing socio-technical risks in implementation of Industry 4.0-use cases","author":[{"full_name":"Gabriel, Stefan","last_name":"Gabriel","first_name":"Stefan"},{"full_name":"Grauthoff, Tobias","first_name":"Tobias","last_name":"Grauthoff"},{"full_name":"Joppen, Robert","last_name":"Joppen","first_name":"Robert"},{"first_name":"Arno","last_name":"Kühn","full_name":"Kühn, Arno"},{"full_name":"Dumitrescu, Roman","last_name":"Dumitrescu","first_name":"Roman","id":"16190"}],"conference":{"name":"31st CIRP Design Conference","start_date":"2021-05-19","location":"Enschede, the Netherlands","end_date":"2021-05-21"},"publication_status":"published","date_updated":"2022-01-06T06:57:21Z"},{"page":"293","publisher":"Paderborn University","_id":"26746","user_id":"3118","ddc":["006"],"status":"public","place":"Paderborn","oa":"1","citation":{"ama":"Wiersema T. <i>Guaranteeing Properties of Reconfigurable Hardware Circuits with Proof-Carrying Hardware</i>. Paderborn University; 2021.","bibtex":"@book{Wiersema_2021, place={Paderborn}, title={Guaranteeing Properties of Reconfigurable Hardware Circuits with Proof-Carrying Hardware}, publisher={Paderborn University}, author={Wiersema, Tobias}, year={2021} }","mla":"Wiersema, Tobias. <i>Guaranteeing Properties of Reconfigurable Hardware Circuits with Proof-Carrying Hardware</i>. Paderborn University, 2021.","short":"T. Wiersema, Guaranteeing Properties of Reconfigurable Hardware Circuits with Proof-Carrying Hardware, Paderborn University, Paderborn, 2021.","chicago":"Wiersema, Tobias. <i>Guaranteeing Properties of Reconfigurable Hardware Circuits with Proof-Carrying Hardware</i>. Paderborn: Paderborn University, 2021.","apa":"Wiersema, T. (2021). <i>Guaranteeing Properties of Reconfigurable Hardware Circuits with Proof-Carrying Hardware</i>. Paderborn University.","ieee":"T. Wiersema, <i>Guaranteeing Properties of Reconfigurable Hardware Circuits with Proof-Carrying Hardware</i>. Paderborn: Paderborn University, 2021."},"supervisor":[{"first_name":"Marco","last_name":"Platzner","full_name":"Platzner, Marco","id":"398"}],"project":[{"name":"SFB 901","_id":"1"},{"name":"SFB 901 - Project Area B","_id":"3"},{"name":"SFB 901 - Subproject B4","_id":"12"}],"main_file_link":[{"url":"https://nbn-resolving.de/urn:nbn:de:hbz:466:2-39800","open_access":"1"}],"language":[{"iso":"eng"}],"year":"2021","title":"Guaranteeing Properties of Reconfigurable Hardware Circuits with Proof-Carrying Hardware","author":[{"last_name":"Wiersema","first_name":"Tobias","full_name":"Wiersema, Tobias","id":"3118"}],"publication_status":"published","date_updated":"2022-01-06T06:57:26Z","date_created":"2021-10-25T06:35:41Z","type":"dissertation","keyword":["Proof-Carrying Hardware","Formal Verification","Sequential Circuits","Non-Functional Properties","Functional Properties"],"department":[{"_id":"78"}],"abstract":[{"lang":"eng","text":"Previous research in proof-carrying hardware has established the feasibility and utility of the approach, and provided a concrete solution for employing it for the certification of functional equivalence checking against a specification, but fell short in connecting it to state-of-the-art formal verification insights, methods and tools. Due to the immense complexity of modern circuits, and verification challenges such as the state explosion problem for sequential circuits, this restriction of readily-available verification solutions severely limited the applicability of the approach in wider contexts.\r\n\r\nThis thesis closes the gap between the PCH approach and current advances in formal hardware verification, provides methods and tools to express and certify a wide range of circuit properties, both functional and non-functional, and presents for the first time prototypes in which circuits that are implemented on actual reconfigurable hardware are verified with PCH methods. Using these results, designers can now apply PCH to establish trust in more complex circuits, by using more diverse properties which they can express using modern, efficient property specification techniques."},{"lang":"ger","text":"Die bisherige Forschung zu Proof-Carrying Hardware (PCH) hat dessen Machbarkeit und Nützlichkeit gezeigt und einen Ansatz zur Zertifizierung der funktionalen Äquivalenz zu einer Spezifikation geliefert, jedoch ohne PCH mit aktuellen Erkenntnissen, Methoden oder Werkzeugen formaler Hardwareverifikation zu verknüpfen. Aufgrund der Komplexität moderner Schaltungen und Verifikationsherausforderungen wie der Zustandsexplosion bei sequentiellen Schaltungen, limitiert diese Einschränkung sofort verfügbarer Verifikationslösungen die Anwendbarkeit des Ansatzes in einem größeren Kontext signifikant.\r\n\r\nDiese Dissertation schließt die Lücke zwischen PCH und modernen Entwicklungen in der Schaltungsverifikation und stellt Methoden und Werkzeuge zur Verfügung, welche die Zertifizierung einer großen Bandbreite von Schaltungseigenschaften ermöglicht; sowohl funktionale, als auch nicht-funktionale. Überdies werden erstmals Prototypen vorgestellt in welchen Schaltungen mittels PCH verifiziert werden, die auf tatsächlicher rekonfigurierbarer Hardware realisiert sind. Dank dieser Ergebnisse können Entwickler PCH zur Herstellung von Vertrauen in weit komplexere Schaltungen verwenden, unter Zuhilfenahme einer größeren Vielfalt von Eigenschaften, welche durch moderne, effiziente Spezifikationstechniken ausgedrückt werden können."}]},{"department":[{"_id":"563"}],"type":"conference","date_created":"2021-10-25T12:18:36Z","citation":{"ieee":"A. Kharatyan, C. Jürgenhake, and R. Dumitrescu, “Towards generative design in the development of mechatronic integrated devices (MID),” in <i>Procedia CIRP</i>, 2021, vol. Vol. 100, pp. 373–378.","apa":"Kharatyan, A., Jürgenhake, C., &#38; Dumitrescu, R. (2021). Towards generative design in the development of mechatronic integrated devices (MID). <i>Procedia CIRP</i>, <i>Vol. 100</i>, 373–378.","short":"A. Kharatyan, C. Jürgenhake, R. Dumitrescu, in: Procedia CIRP, 2021, pp. 373–378.","chicago":"Kharatyan, Aschot, Christoph Jürgenhake, and Roman Dumitrescu. “Towards Generative Design in the Development of Mechatronic Integrated Devices (MID).” In <i>Procedia CIRP</i>, Vol. 100:373–78, 2021.","mla":"Kharatyan, Aschot, et al. “Towards Generative Design in the Development of Mechatronic Integrated Devices (MID).” <i>Procedia CIRP</i>, vol. Vol. 100, 2021, pp. 373–78.","bibtex":"@inproceedings{Kharatyan_Jürgenhake_Dumitrescu_2021, title={Towards generative design in the development of mechatronic integrated devices (MID)}, volume={Vol. 100}, booktitle={Procedia CIRP}, author={Kharatyan, Aschot and Jürgenhake, Christoph and Dumitrescu, Roman}, year={2021}, pages={373–378} }","ama":"Kharatyan A, Jürgenhake C, Dumitrescu R. Towards generative design in the development of mechatronic integrated devices (MID). In: <i>Procedia CIRP</i>. Vol Vol. 100. ; 2021:373-378."},"publication":"Procedia CIRP","volume":"Vol. 100","user_id":"15782","_id":"26823","language":[{"iso":"eng"}],"page":"373-378","date_updated":"2022-01-06T06:57:29Z","publication_status":"published","conference":{"end_date":"2021-05-21","start_date":"2021-05-19","name":"31st CIRP Design Conference"},"author":[{"full_name":"Kharatyan, Aschot","first_name":"Aschot","last_name":"Kharatyan"},{"full_name":"Jürgenhake, Christoph","first_name":"Christoph","last_name":"Jürgenhake"},{"id":"16190","full_name":"Dumitrescu, Roman","first_name":"Roman","last_name":"Dumitrescu"}],"status":"public","year":"2021","title":"Towards generative design in the development of mechatronic integrated devices (MID)"},{"type":"conference","department":[{"_id":"563"}],"date_created":"2021-10-25T12:24:20Z","publication":"14th International Congress Molded Interconnect Devices (MID)","citation":{"chicago":"Mager, Thomas, Christoph Jürgenhake, and Roman Dumitrescu. “Approach for a Modular Design Methodology for an Efficient Development of 3D MID Components.” In <i>14th International Congress Molded Interconnect Devices (MID)</i>, 1–9, 2021.","short":"T. Mager, C. Jürgenhake, R. Dumitrescu, in: 14th International Congress Molded Interconnect Devices (MID), 2021, pp. 1–9.","apa":"Mager, T., Jürgenhake, C., &#38; Dumitrescu, R. (2021). Approach for a modular design methodology for an efficient development of 3D MID components. <i>14th International Congress Molded Interconnect Devices (MID)</i>, 1–9.","ieee":"T. Mager, C. Jürgenhake, and R. Dumitrescu, “Approach for a modular design methodology for an efficient development of 3D MID components,” in <i>14th International Congress Molded Interconnect Devices (MID)</i>, Amberg, 2021, pp. 1–9.","ama":"Mager T, Jürgenhake C, Dumitrescu R. Approach for a modular design methodology for an efficient development of 3D MID components. In: <i>14th International Congress Molded Interconnect Devices (MID)</i>. ; 2021:1-9.","bibtex":"@inproceedings{Mager_Jürgenhake_Dumitrescu_2021, title={Approach for a modular design methodology for an efficient development of 3D MID components}, booktitle={14th International Congress Molded Interconnect Devices (MID)}, author={Mager, Thomas and Jürgenhake, Christoph and Dumitrescu, Roman}, year={2021}, pages={1–9} }","mla":"Mager, Thomas, et al. “Approach for a Modular Design Methodology for an Efficient Development of 3D MID Components.” <i>14th International Congress Molded Interconnect Devices (MID)</i>, 2021, pp. 1–9."},"user_id":"15782","page":"1-9","_id":"26830","language":[{"iso":"eng"}],"publication_status":"published","date_updated":"2022-01-06T06:57:29Z","title":"Approach for a modular design methodology for an efficient development of 3D MID components","status":"public","year":"2021","author":[{"full_name":"Mager, Thomas","first_name":"Thomas","last_name":"Mager"},{"full_name":"Jürgenhake, Christoph","last_name":"Jürgenhake","first_name":"Christoph"},{"id":"16190","full_name":"Dumitrescu, Roman","last_name":"Dumitrescu","first_name":"Roman"}],"conference":{"end_date":"2021-02-10","name":"International Congress Molded Interconnect Devices (MID)","start_date":"2021-02-9","location":"Amberg"}},{"date_created":"2021-10-25T12:27:28Z","department":[{"_id":"563"}],"type":"conference","citation":{"chicago":"Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jürgenhake, and Roman Dumitrescu. “Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications.” In <i>14th International Congress Molded Interconnect Devices (MID)</i>, 2021.","short":"F. Hemmelgarn, P. Ehlert, T. Mager, C. Jürgenhake, R. Dumitrescu, in: 14th International Congress Molded Interconnect Devices (MID), 2021.","ieee":"F. Hemmelgarn, P. Ehlert, T. Mager, C. Jürgenhake, and R. Dumitrescu, “Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications,” presented at the International Congress Molded Interconnect Devices (MID), Amberg, 2021.","apa":"Hemmelgarn, F., Ehlert, P., Mager, T., Jürgenhake, C., &#38; Dumitrescu, R. (2021). Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. <i>14th International Congress Molded Interconnect Devices (MID)</i>. 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In: <i>14th International Congress Molded Interconnect Devices (MID)</i>. ; 2021.","mla":"Hemmelgarn, Florian, et al. “Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications.” <i>14th International Congress Molded Interconnect Devices (MID)</i>, 2021."},"publication":"14th International Congress Molded Interconnect Devices (MID)","_id":"26833","language":[{"iso":"eng"}],"user_id":"15782","conference":{"location":"Amberg","start_date":"2021-02-9","name":"International Congress Molded Interconnect Devices (MID)","end_date":"2021-02-10"},"author":[{"full_name":"Hemmelgarn, Florian","last_name":"Hemmelgarn","first_name":"Florian"},{"full_name":"Ehlert, Patrick","first_name":"Patrick","last_name":"Ehlert"},{"first_name":"Thomas","last_name":"Mager","full_name":"Mager, Thomas"},{"full_name":"Jürgenhake, Christoph","last_name":"Jürgenhake","first_name":"Christoph"},{"full_name":"Dumitrescu, Roman","last_name":"Dumitrescu","first_name":"Roman","id":"16190"}],"title":"Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications","year":"2021","status":"public","date_updated":"2022-01-06T06:57:29Z","publication_status":"published"},{"publication_status":"published","date_updated":"2022-01-06T06:57:29Z","author":[{"last_name":"Menzefricke","first_name":"Jörn Steffen","full_name":"Menzefricke, Jörn Steffen","id":"29799"},{"full_name":"Wiederkehr, Ingrid","last_name":"Wiederkehr","first_name":"Ingrid","id":"38169"},{"first_name":"Christian","orcid":"https://orcid.org/0000-0001-7992-6399","last_name":"Koldewey","full_name":"Koldewey, Christian","id":"43136"},{"last_name":"Dumitrescu","first_name":"Roman","full_name":"Dumitrescu, Roman","id":"16190"}],"conference":{"end_date":"2021-05-21","name":"31st CIRP Design Conference","start_date":"2021-05-19"},"status":"public","title":"Socio-technical risk management in the age of digital transformation – identification and analysis of existing approaches","year":"2021","volume":"vol. 100","user_id":"15782","language":[{"iso":"eng"}],"_id":"26839","page":"708-713","citation":{"chicago":"Menzefricke, Jörn Steffen, Ingrid Wiederkehr, Christian Koldewey, and Roman Dumitrescu. “Socio-Technical Risk Management in the Age of Digital Transformation – Identification and Analysis of Existing Approaches.” In <i>Procedia CIRP</i>, 100:708–13, 2021.","short":"J.S. Menzefricke, I. Wiederkehr, C. Koldewey, R. Dumitrescu, in: Procedia CIRP, 2021, pp. 708–713.","ieee":"J. S. Menzefricke, I. Wiederkehr, C. Koldewey, and R. Dumitrescu, “Socio-technical risk management in the age of digital transformation – identification and analysis of existing approaches,” in <i>Procedia CIRP</i>, 2021, vol. 100, pp. 708–713.","apa":"Menzefricke, J. S., Wiederkehr, I., Koldewey, C., &#38; Dumitrescu, R. (2021). Socio-technical risk management in the age of digital transformation – identification and analysis of existing approaches. <i>Procedia CIRP</i>, <i>100</i>, 708–713.","bibtex":"@inproceedings{Menzefricke_Wiederkehr_Koldewey_Dumitrescu_2021, title={Socio-technical risk management in the age of digital transformation – identification and analysis of existing approaches}, volume={100}, booktitle={Procedia CIRP}, author={Menzefricke, Jörn Steffen and Wiederkehr, Ingrid and Koldewey, Christian and Dumitrescu, Roman}, year={2021}, pages={708–713} }","ama":"Menzefricke JS, Wiederkehr I, Koldewey C, Dumitrescu R. Socio-technical risk management in the age of digital transformation – identification and analysis of existing approaches. In: <i>Procedia CIRP</i>. Vol 100. ; 2021:708-713.","mla":"Menzefricke, Jörn Steffen, et al. “Socio-Technical Risk Management in the Age of Digital Transformation – Identification and Analysis of Existing Approaches.” <i>Procedia CIRP</i>, vol. 100, 2021, pp. 708–13."},"publication":"Procedia CIRP","department":[{"_id":"563"}],"type":"conference","date_created":"2021-10-25T12:35:16Z"},{"_id":"26843","language":[{"iso":"eng"}],"page":"159 - 166","user_id":"15782","author":[{"first_name":"Felix","last_name":"Schnasse","full_name":"Schnasse, Felix"},{"first_name":"Jörn Steffen","last_name":"Menzefricke","full_name":"Menzefricke, Jörn Steffen","id":"29799"},{"id":"16190","first_name":"Roman","last_name":"Dumitrescu","full_name":"Dumitrescu, Roman"}],"conference":{"end_date":"2021-04-26","start_date":"2021-04-23","name":"IEEE 8th International Conference on Industrial Engineering and Applications (ICIEA)"},"status":"public","year":"2021","title":"Identification of Socio-Technical Risks and Their Correlations in the Context of Digital Transformation for the Manufacturing Sector","publication_status":"published","date_updated":"2022-01-06T06:57:29Z","date_created":"2021-10-25T12:53:11Z","department":[{"_id":"563"}],"type":"conference","citation":{"bibtex":"@inproceedings{Schnasse_Menzefricke_Dumitrescu_2021, title={Identification of Socio-Technical Risks and Their Correlations in the Context of Digital Transformation for the Manufacturing Sector}, booktitle={Proceedings of the IEEE 8th International Conference on Industrial Engineering and Applications (ICIEA)}, author={Schnasse, Felix and Menzefricke, Jörn Steffen and Dumitrescu, Roman}, year={2021}, pages={159–166} }","ama":"Schnasse F, Menzefricke JS, Dumitrescu R. Identification of Socio-Technical Risks and Their Correlations in the Context of Digital Transformation for the Manufacturing Sector. In: <i>Proceedings of the IEEE 8th International Conference on Industrial Engineering and Applications (ICIEA)</i>. ; 2021:159-166.","mla":"Schnasse, Felix, et al. “Identification of Socio-Technical Risks and Their Correlations in the Context of Digital Transformation for the Manufacturing Sector.” <i>Proceedings of the IEEE 8th International Conference on Industrial Engineering and Applications (ICIEA)</i>, 2021, pp. 159–66.","short":"F. Schnasse, J.S. Menzefricke, R. Dumitrescu, in: Proceedings of the IEEE 8th International Conference on Industrial Engineering and Applications (ICIEA), 2021, pp. 159–166.","chicago":"Schnasse, Felix, Jörn Steffen Menzefricke, and Roman Dumitrescu. “Identification of Socio-Technical Risks and Their Correlations in the Context of Digital Transformation for the Manufacturing Sector.” In <i>Proceedings of the IEEE 8th International Conference on Industrial Engineering and Applications (ICIEA)</i>, 159–66, 2021.","ieee":"F. Schnasse, J. S. Menzefricke, and R. Dumitrescu, “Identification of Socio-Technical Risks and Their Correlations in the Context of Digital Transformation for the Manufacturing Sector,” in <i>Proceedings of the IEEE 8th International Conference on Industrial Engineering and Applications (ICIEA)</i>, 2021, pp. 159–166.","apa":"Schnasse, F., Menzefricke, J. S., &#38; Dumitrescu, R. (2021). Identification of Socio-Technical Risks and Their Correlations in the Context of Digital Transformation for the Manufacturing Sector. <i>Proceedings of the IEEE 8th International Conference on Industrial Engineering and Applications (ICIEA)</i>, 159–166."},"publication":"Proceedings of the IEEE 8th International Conference on Industrial Engineering and Applications (ICIEA)"},{"type":"conference","department":[{"_id":"563"}],"date_created":"2021-10-25T13:07:32Z","publication":"Procedia CIRP","citation":{"apa":"Japs, S., Anacker, H., &#38; Dumitrescu, R. (2021). SAVE: Security &#38; safety by model-based systems engineering on the example of automotive industry. <i>Procedia CIRP</i>, 187–192.","ieee":"S. Japs, H. Anacker, and R. Dumitrescu, “SAVE: Security &#38; safety by model-based systems engineering on the example of automotive industry,” in <i>Procedia CIRP</i>, 2021, pp. 187–192.","chicago":"Japs, Sergej, Harald Anacker, and Roman Dumitrescu. “SAVE: Security &#38; Safety by Model-Based Systems Engineering on the Example of Automotive Industry.” In <i>Procedia CIRP</i>, 187–92, 2021.","short":"S. Japs, H. Anacker, R. Dumitrescu, in: Procedia CIRP, 2021, pp. 187–192.","mla":"Japs, Sergej, et al. “SAVE: Security &#38; Safety by Model-Based Systems Engineering on the Example of Automotive Industry.” <i>Procedia CIRP</i>, 2021, pp. 187–92.","ama":"Japs S, Anacker H, Dumitrescu R. SAVE: Security &#38; safety by model-based systems engineering on the example of automotive industry. In: <i>Procedia CIRP</i>. ; 2021:187-192.","bibtex":"@inproceedings{Japs_Anacker_Dumitrescu_2021, title={SAVE: Security &#38; safety by model-based systems engineering on the example of automotive industry}, booktitle={Procedia CIRP}, author={Japs, Sergej and Anacker, Harald and Dumitrescu, Roman}, year={2021}, pages={187–192} }"},"user_id":"15782","page":"187-192","language":[{"iso":"eng"}],"_id":"26850","publication_status":"published","date_updated":"2022-01-06T06:57:29Z","year":"2021","title":"SAVE: Security & safety by model-based systems engineering on the example of automotive industry","status":"public","author":[{"full_name":"Japs, Sergej","last_name":"Japs","first_name":"Sergej"},{"last_name":"Anacker","first_name":"Harald","full_name":"Anacker, Harald"},{"id":"16190","last_name":"Dumitrescu","first_name":"Roman","full_name":"Dumitrescu, Roman"}],"conference":{"start_date":"2021-05-19","name":"31st CIRP Design Conference","end_date":"2021-05-21"}},{"publication":"Vorausschau und Technologieplanung - 16. Symposium Vorausschau und Technologieplanung","citation":{"mla":"Dumitrescu, Roman, et al. “Erfolgspotentiale für die Zukunft des Engineeringstandorts Deutschland – Ein Beitrag zum Advanced Systems Engineering.” <i>Vorausschau und Technologieplanung - 16. Symposium Vorausschau und Technologieplanung</i>, edited by Jürgen Gausemeier et al., Heinz Nixdorf Institut, Universität Paderborn, 2021.","ama":"Dumitrescu R, Anacker H, Grote E-M, et al. Erfolgspotentiale für die Zukunft des Engineeringstandorts Deutschland – Ein Beitrag zum Advanced Systems Engineering. In: Gausemeier J, Bauer W, Dumitrescu R, eds. <i>Vorausschau und Technologieplanung - 16. Symposium Vorausschau und Technologieplanung</i>. Heinz Nixdorf Institut, Universität Paderborn; 2021.","bibtex":"@inproceedings{Dumitrescu_Anacker_Grote_Rasor_Tekaat_Meyer_Gausemeier_Steglich_2021, place={Paderborn}, title={Erfolgspotentiale für die Zukunft des Engineeringstandorts Deutschland – Ein Beitrag zum Advanced Systems Engineering}, booktitle={Vorausschau und Technologieplanung - 16. Symposium Vorausschau und Technologieplanung}, publisher={Heinz Nixdorf Institut, Universität Paderborn}, author={Dumitrescu, Roman and Anacker, Harald and Grote, Eva-Maria and Rasor, Rik and Tekaat, Julian and Meyer, Maurice and Gausemeier, Jürgen and Steglich, Steffen}, editor={Gausemeier, Jürgen and Bauer, Wilhelm and Dumitrescu, Roman}, year={2021} }","apa":"Dumitrescu, R., Anacker, H., Grote, E.-M., Rasor, R., Tekaat, J., Meyer, M., Gausemeier, J., &#38; Steglich, S. (2021). Erfolgspotentiale für die Zukunft des Engineeringstandorts Deutschland – Ein Beitrag zum Advanced Systems Engineering. In J. Gausemeier, W. Bauer, &#38; R. Dumitrescu (Eds.), <i>Vorausschau und Technologieplanung - 16. Symposium Vorausschau und Technologieplanung</i>. Heinz Nixdorf Institut, Universität Paderborn.","ieee":"R. Dumitrescu <i>et al.</i>, “Erfolgspotentiale für die Zukunft des Engineeringstandorts Deutschland – Ein Beitrag zum Advanced Systems Engineering,” in <i>Vorausschau und Technologieplanung - 16. Symposium Vorausschau und Technologieplanung</i>, Berlin, 2021.","short":"R. Dumitrescu, H. Anacker, E.-M. Grote, R. Rasor, J. Tekaat, M. Meyer, J. Gausemeier, S. Steglich, in: J. Gausemeier, W. Bauer, R. Dumitrescu (Eds.), Vorausschau und Technologieplanung - 16. Symposium Vorausschau und Technologieplanung, Heinz Nixdorf Institut, Universität Paderborn, Paderborn, 2021.","chicago":"Dumitrescu, Roman, Harald Anacker, Eva-Maria Grote, Rik Rasor, Julian Tekaat, Maurice Meyer, Jürgen Gausemeier, and Steffen Steglich. “Erfolgspotentiale für die Zukunft des Engineeringstandorts Deutschland – Ein Beitrag zum Advanced Systems Engineering.” In <i>Vorausschau und Technologieplanung - 16. Symposium Vorausschau und Technologieplanung</i>, edited by Jürgen Gausemeier, Wilhelm Bauer, and Roman Dumitrescu. Paderborn: Heinz Nixdorf Institut, Universität Paderborn, 2021."},"type":"conference","department":[{"_id":"563"}],"place":"Paderborn","date_created":"2021-10-25T13:32:30Z","date_updated":"2022-01-06T06:57:29Z","publication_status":"published","status":"public","title":"Erfolgspotentiale für die Zukunft des Engineeringstandorts Deutschland – Ein Beitrag zum Advanced Systems Engineering","year":"2021","conference":{"end_date":"2021-12-03","start_date":"2021-12-02","name":"16. Symposium für Vorausschau und Technologieplanung","location":"Berlin"},"author":[{"id":"16190","first_name":"Roman","last_name":"Dumitrescu","full_name":"Dumitrescu, Roman"},{"full_name":"Anacker, Harald","last_name":"Anacker","first_name":"Harald"},{"full_name":"Grote, Eva-Maria","last_name":"Grote","first_name":"Eva-Maria"},{"last_name":"Rasor","first_name":"Rik","full_name":"Rasor, Rik"},{"full_name":"Tekaat, Julian","last_name":"Tekaat","first_name":"Julian"},{"last_name":"Meyer","first_name":"Maurice","orcid":"0000-0003-0606-7321","full_name":"Meyer, Maurice","id":"77201"},{"full_name":"Gausemeier, Jürgen","last_name":"Gausemeier","first_name":"Jürgen","id":"163"},{"first_name":"Steffen","last_name":"Steglich","full_name":"Steglich, Steffen"}],"user_id":"15782","editor":[{"last_name":"Gausemeier","first_name":"Jürgen","full_name":"Gausemeier, Jürgen"},{"full_name":"Bauer, Wilhelm","last_name":"Bauer","first_name":"Wilhelm"},{"full_name":"Dumitrescu, Roman","last_name":"Dumitrescu","first_name":"Roman"}],"_id":"26851","language":[{"iso":"ger"}],"publisher":"Heinz Nixdorf Institut, Universität Paderborn"},{"department":[{"_id":"563"}],"type":"conference","date_created":"2021-10-25T13:40:50Z","citation":{"mla":"Kharatyan, Aschot, et al. “Metamodel for Safety and Security Integrated System Architecture Modeling.” <i> Proceedings of the Design Society</i>, vol. Vol. 1, 2021, pp. 2027–36.","ama":"Kharatyan A, Tekaat J, Japs S, Anacker H, Dumitrescu R. Metamodel for safety and security integrated system architecture modeling. In: <i> Proceedings of the Design Society</i>. Vol Vol. 1. ; 2021:2027-2036.","bibtex":"@inproceedings{Kharatyan_Tekaat_Japs_Anacker_Dumitrescu_2021, title={Metamodel for safety and security integrated system architecture modeling}, volume={Vol. 1}, booktitle={ Proceedings of the Design Society}, author={Kharatyan, Aschot and Tekaat, Julian and Japs, Sergej and Anacker, Harald and Dumitrescu, Roman}, year={2021}, pages={2027–2036} }","apa":"Kharatyan, A., Tekaat, J., Japs, S., Anacker, H., &#38; Dumitrescu, R. (2021). Metamodel for safety and security integrated system architecture modeling. <i> Proceedings of the Design Society</i>, <i>Vol. 1</i>, 2027–2036.","ieee":"A. Kharatyan, J. Tekaat, S. Japs, H. Anacker, and R. Dumitrescu, “Metamodel for safety and security integrated system architecture modeling,” in <i> Proceedings of the Design Society</i>, Cavtat, Dubrovnik, Croatia, 2021, vol. Vol. 1, pp. 2027–2036.","short":"A. Kharatyan, J. Tekaat, S. Japs, H. Anacker, R. Dumitrescu, in:  Proceedings of the Design Society, 2021, pp. 2027–2036.","chicago":"Kharatyan, Aschot, Julian Tekaat, Sergej Japs, Harald Anacker, and Roman Dumitrescu. “Metamodel for Safety and Security Integrated System Architecture Modeling.” In <i> Proceedings of the Design Society</i>, Vol. 1:2027–36, 2021."},"publication":" Proceedings of the Design Society","volume":"Vol. 1","user_id":"15782","language":[{"iso":"eng"}],"_id":"26852","page":"2027 - 2036","date_updated":"2022-01-06T06:57:29Z","publication_status":"published","conference":{"end_date":"2020-05-21","start_date":"2020-05-18","name":"16th International Design Conference","location":"Cavtat, Dubrovnik, Croatia"},"author":[{"full_name":"Kharatyan, Aschot","last_name":"Kharatyan","first_name":"Aschot"},{"last_name":"Tekaat","first_name":"Julian","full_name":"Tekaat, Julian"},{"first_name":"Sergej","last_name":"Japs","full_name":"Japs, Sergej"},{"full_name":"Anacker, Harald","first_name":"Harald","last_name":"Anacker"},{"full_name":"Dumitrescu, Roman","first_name":"Roman","last_name":"Dumitrescu","id":"16190"}],"year":"2021","status":"public","title":"Metamodel for safety and security integrated system architecture modeling"},{"date_created":"2021-10-25T14:43:11Z","type":"journal_article","department":[{"_id":"563"}],"publication":"Proceedings of the Design Society","citation":{"apa":"Meyer, M., Wiederkehr, I., Koldewey, C., &#38; Dumitrescu, R. (2021). UNDERSTANDING USAGE DATA-DRIVEN PRODUCT PLANNING: A SYSTEMATIC LITERATURE REVIEW. <i>Proceedings of the Design Society</i>, 3289–3298. <a href=\"https://doi.org/10.1017/pds.2021.590\">https://doi.org/10.1017/pds.2021.590</a>","mla":"Meyer, Maurice, et al. “UNDERSTANDING USAGE DATA-DRIVEN PRODUCT PLANNING: A SYSTEMATIC LITERATURE REVIEW.” <i>Proceedings of the Design Society</i>, 2021, pp. 3289–98, doi:<a href=\"https://doi.org/10.1017/pds.2021.590\">10.1017/pds.2021.590</a>.","ieee":"M. Meyer, I. Wiederkehr, C. Koldewey, and R. Dumitrescu, “UNDERSTANDING USAGE DATA-DRIVEN PRODUCT PLANNING: A SYSTEMATIC LITERATURE REVIEW,” <i>Proceedings of the Design Society</i>, pp. 3289–3298, 2021, doi: <a href=\"https://doi.org/10.1017/pds.2021.590\">10.1017/pds.2021.590</a>.","chicago":"Meyer, Maurice, Ingrid Wiederkehr, Christian Koldewey, and Roman Dumitrescu. “UNDERSTANDING USAGE DATA-DRIVEN PRODUCT PLANNING: A SYSTEMATIC LITERATURE REVIEW.” <i>Proceedings of the Design Society</i>, 2021, 3289–98. <a href=\"https://doi.org/10.1017/pds.2021.590\">https://doi.org/10.1017/pds.2021.590</a>.","ama":"Meyer M, Wiederkehr I, Koldewey C, Dumitrescu R. UNDERSTANDING USAGE DATA-DRIVEN PRODUCT PLANNING: A SYSTEMATIC LITERATURE REVIEW. <i>Proceedings of the Design Society</i>. Published online 2021:3289-3298. doi:<a href=\"https://doi.org/10.1017/pds.2021.590\">10.1017/pds.2021.590</a>","short":"M. Meyer, I. Wiederkehr, C. Koldewey, R. Dumitrescu, Proceedings of the Design Society (2021) 3289–3298.","bibtex":"@article{Meyer_Wiederkehr_Koldewey_Dumitrescu_2021, title={UNDERSTANDING USAGE DATA-DRIVEN PRODUCT PLANNING: A SYSTEMATIC LITERATURE REVIEW}, DOI={<a href=\"https://doi.org/10.1017/pds.2021.590\">10.1017/pds.2021.590</a>}, journal={Proceedings of the Design Society}, author={Meyer, Maurice and Wiederkehr, Ingrid and Koldewey, Christian and Dumitrescu, Roman}, year={2021}, pages={3289–3298} }"},"abstract":[{"text":"<jats:title>Abstract</jats:title><jats:p>Cyber-physical systems (CPS) are able the collect huge amounts of data about themselves, their users, and their environment during their usage phase. By feeding these usage data back into product planning, manufacturers can optimize their engineering and decision-making processes. Despite promising potentials, most manufacturers still do not analyze usage data within product planning. Also, research on usage data-driven product planning is scarce. Therefore, this paper aims to identify the main concepts, advantages, success factors and challenges of usage data-driven product planning. To answer the corresponding research questions, a comprehensive systematic literature review is conducted. From its results, a detailed description of usage data-driven product planning consisting of six main concepts is derived. Furthermore, taxonomies for the advantages, success factors and challenges of usage data-driven product planning are presented. The six main concepts and the three taxonomies allow for a deeper understanding of the topic while highlighting necessary future actions and research needs.</jats:p>","lang":"eng"}],"page":"3289-3298","_id":"26855","language":[{"iso":"eng"}],"user_id":"43136","doi":"10.1017/pds.2021.590","title":"UNDERSTANDING USAGE DATA-DRIVEN PRODUCT PLANNING: A SYSTEMATIC LITERATURE REVIEW","status":"public","year":"2021","publication_identifier":{"issn":["2732-527X"]},"author":[{"full_name":"Meyer, Maurice","first_name":"Maurice","last_name":"Meyer","orcid":"0000-0003-0606-7321","id":"77201"},{"full_name":"Wiederkehr, Ingrid","last_name":"Wiederkehr","first_name":"Ingrid","id":"38169"},{"id":"43136","first_name":"Christian","orcid":"https://orcid.org/0000-0001-7992-6399","last_name":"Koldewey","full_name":"Koldewey, Christian"},{"id":"16190","first_name":"Roman","last_name":"Dumitrescu","full_name":"Dumitrescu, Roman"}],"publication_status":"published","date_updated":"2022-01-06T06:57:29Z"}]