[{"volume":2021,"user_id":"58465","_id":"40512","language":[{"iso":"eng"}],"publisher":"Friedrich Verlag","page":"23–27","intvolume":"      2021","date_updated":"2023-01-27T12:35:52Z","author":[{"id":"58465","last_name":"Hüsing","first_name":"Sven","full_name":"Hüsing, Sven"},{"last_name":"Weiser","first_name":"Niklas","full_name":"Weiser, Niklas"},{"id":"16274","full_name":"Biehler, Rolf","first_name":"Rolf","last_name":"Biehler"}],"status":"public","title":"Faszination 3D-Film: Entwicklung einer 3D-Konstruktion","year":"2021","department":[{"_id":"67"}],"type":"journal_article","date_created":"2023-01-27T12:35:37Z","citation":{"mla":"Hüsing, Sven, et al. “Faszination 3D-Film: Entwicklung Einer 3D-Konstruktion.” <i>Mathematik Lehren</i>, vol. 2021, no. 228, Friedrich Verlag, 2021, pp. 23–27.","ama":"Hüsing S, Weiser N, Biehler R. Faszination 3D-Film: Entwicklung einer 3D-Konstruktion. <i>mathematik lehren</i>. 2021;2021(228):23–27.","bibtex":"@article{Hüsing_Weiser_Biehler_2021, title={Faszination 3D-Film: Entwicklung einer 3D-Konstruktion}, volume={2021}, number={228}, journal={mathematik lehren}, publisher={Friedrich Verlag}, author={Hüsing, Sven and Weiser, Niklas and Biehler, Rolf}, year={2021}, pages={23–27} }","apa":"Hüsing, S., Weiser, N., &#38; Biehler, R. (2021). Faszination 3D-Film: Entwicklung einer 3D-Konstruktion. <i>Mathematik Lehren</i>, <i>2021</i>(228), 23–27.","ieee":"S. Hüsing, N. Weiser, and R. Biehler, “Faszination 3D-Film: Entwicklung einer 3D-Konstruktion,” <i>mathematik lehren</i>, vol. 2021, no. 228, pp. 23–27, 2021.","short":"S. Hüsing, N. Weiser, R. Biehler, Mathematik Lehren 2021 (2021) 23–27.","chicago":"Hüsing, Sven, Niklas Weiser, and Rolf Biehler. “Faszination 3D-Film: Entwicklung Einer 3D-Konstruktion.” <i>Mathematik Lehren</i> 2021, no. 228 (2021): 23–27."},"issue":"228","publication":"mathematik lehren"},{"oa":"1","citation":{"short":"D. Itner, H. Gravenkamp, D. Dreiling, N. Feldmann, B. Henning, in: 14th WCCM-ECCOMAS Congress, CIMNE, 2021.","chicago":"Itner, D., H. Gravenkamp, Dmitrij Dreiling, Nadine Feldmann, and Bernd Henning. “Simulation of Guided Waves in Cylinders Subject to Arbitrary Boundary Conditions Using the Scaled Boundary Finite Element Method.” In <i>14th WCCM-ECCOMAS Congress</i>, Vol. 700. Numerical Methods and Algorithms in Science and Engineering. CIMNE, 2021. <a href=\"https://doi.org/10.23967/wccm-eccomas.2020.307\">https://doi.org/10.23967/wccm-eccomas.2020.307</a>.","apa":"Itner, D., Gravenkamp, H., Dreiling, D., Feldmann, N., &#38; Henning, B. (2021). Simulation of Guided Waves in Cylinders Subject to Arbitrary Boundary Conditions Using the Scaled Boundary Finite Element Method. <i>14th WCCM-ECCOMAS Congress</i>, <i>700</i>. <a href=\"https://doi.org/10.23967/wccm-eccomas.2020.307\">https://doi.org/10.23967/wccm-eccomas.2020.307</a>","ieee":"D. Itner, H. Gravenkamp, D. Dreiling, N. Feldmann, and B. Henning, “Simulation of Guided Waves in Cylinders Subject to Arbitrary Boundary Conditions Using the Scaled Boundary Finite Element Method,” in <i>14th WCCM-ECCOMAS Congress</i>, 2021, vol. 700, doi: <a href=\"https://doi.org/10.23967/wccm-eccomas.2020.307\">10.23967/wccm-eccomas.2020.307</a>.","ama":"Itner D, Gravenkamp H, Dreiling D, Feldmann N, Henning B. Simulation of Guided Waves in Cylinders Subject to Arbitrary Boundary Conditions Using the Scaled Boundary Finite Element Method. In: <i>14th WCCM-ECCOMAS Congress</i>. Vol 700. Numerical Methods and Algorithms in Science and Engineering. CIMNE; 2021. doi:<a href=\"https://doi.org/10.23967/wccm-eccomas.2020.307\">10.23967/wccm-eccomas.2020.307</a>","bibtex":"@inproceedings{Itner_Gravenkamp_Dreiling_Feldmann_Henning_2021, series={Numerical Methods and Algorithms in Science and Engineering}, title={Simulation of Guided Waves in Cylinders Subject to Arbitrary Boundary Conditions Using the Scaled Boundary Finite Element Method}, volume={700}, DOI={<a href=\"https://doi.org/10.23967/wccm-eccomas.2020.307\">10.23967/wccm-eccomas.2020.307</a>}, booktitle={14th WCCM-ECCOMAS Congress}, publisher={CIMNE}, author={Itner, D. and Gravenkamp, H. and Dreiling, Dmitrij and Feldmann, Nadine and Henning, Bernd}, year={2021}, collection={Numerical Methods and Algorithms in Science and Engineering} }","mla":"Itner, D., et al. “Simulation of Guided Waves in Cylinders Subject to Arbitrary Boundary Conditions Using the Scaled Boundary Finite Element Method.” <i>14th WCCM-ECCOMAS Congress</i>, vol. 700, CIMNE, 2021, doi:<a href=\"https://doi.org/10.23967/wccm-eccomas.2020.307\">10.23967/wccm-eccomas.2020.307</a>."},"project":[{"grant_number":"409779252","_id":"89","name":"VaMP: Vollständige Bestimmung der akustischen Materialparameter von Polymeren"}],"publisher":"CIMNE","_id":"40541","user_id":"32616","volume":700,"status":"public","conference":{"start_date":"2021-01-11","name":"14th World Congress on Computational Mechanics (WCCM)","end_date":"2021-01-15"},"date_created":"2023-01-27T15:08:47Z","type":"conference","department":[{"_id":"49"}],"publication":"14th WCCM-ECCOMAS Congress","main_file_link":[{"open_access":"1","url":"https://www.scipedia.com/public/Itner_et_al_2021a"}],"language":[{"iso":"eng"}],"series_title":"Numerical Methods and Algorithms in Science and Engineering","doi":"10.23967/wccm-eccomas.2020.307","year":"2021","title":"Simulation of Guided Waves in Cylinders Subject to Arbitrary Boundary Conditions Using the Scaled Boundary Finite Element Method","author":[{"full_name":"Itner, D.","last_name":"Itner","first_name":"D."},{"last_name":"Gravenkamp","first_name":"H.","full_name":"Gravenkamp, H."},{"full_name":"Dreiling, Dmitrij","last_name":"Dreiling","first_name":"Dmitrij","id":"32616"},{"id":"23082","first_name":"Nadine","last_name":"Feldmann","full_name":"Feldmann, Nadine"},{"id":"213","full_name":"Henning, Bernd","last_name":"Henning","first_name":"Bernd"}],"date_updated":"2023-01-27T15:28:35Z","publication_status":"published","intvolume":"       700"},{"volume":9,"user_id":"43497","_id":"40673","publisher":"IEEE","page":"96948–96963","intvolume":"         9","date_updated":"2023-01-30T12:03:37Z","author":[{"full_name":"Soleymani, Mohammad","last_name":"Soleymani","first_name":"Mohammad"},{"last_name":"Santamaria","first_name":"Ignacio","full_name":"Santamaria, Ignacio"},{"full_name":"Schreier, Peter J","last_name":"Schreier","first_name":"Peter J"}],"title":"Distributed Algorithms for Spectral and Energy-Efficiency Maximization of $K$-User Interference Channels","year":"2021","status":"public","department":[{"_id":"263"}],"type":"journal_article","date_created":"2023-01-30T11:51:35Z","citation":{"mla":"Soleymani, Mohammad, et al. “Distributed Algorithms for Spectral and Energy-Efficiency Maximization of $K$-User Interference Channels.” <i>IEEE Access</i>, vol. 9, IEEE, 2021, pp. 96948–96963.","bibtex":"@article{Soleymani_Santamaria_Schreier_2021, title={Distributed Algorithms for Spectral and Energy-Efficiency Maximization of $K$-User Interference Channels}, volume={9}, journal={IEEE Access}, publisher={IEEE}, author={Soleymani, Mohammad and Santamaria, Ignacio and Schreier, Peter J}, year={2021}, pages={96948–96963} }","ama":"Soleymani M, Santamaria I, Schreier PJ. Distributed Algorithms for Spectral and Energy-Efficiency Maximization of $K$-User Interference Channels. <i>IEEE Access</i>. 2021;9:96948–96963.","ieee":"M. Soleymani, I. Santamaria, and P. J. Schreier, “Distributed Algorithms for Spectral and Energy-Efficiency Maximization of $K$-User Interference Channels,” <i>IEEE Access</i>, vol. 9, pp. 96948–96963, 2021.","apa":"Soleymani, M., Santamaria, I., &#38; Schreier, P. J. (2021). Distributed Algorithms for Spectral and Energy-Efficiency Maximization of $K$-User Interference Channels. <i>IEEE Access</i>, <i>9</i>, 96948–96963.","chicago":"Soleymani, Mohammad, Ignacio Santamaria, and Peter J Schreier. “Distributed Algorithms for Spectral and Energy-Efficiency Maximization of $K$-User Interference Channels.” <i>IEEE Access</i> 9 (2021): 96948–96963.","short":"M. Soleymani, I. Santamaria, P.J. Schreier, IEEE Access 9 (2021) 96948–96963."},"publication":"IEEE Access"},{"page":"1638–1642","_id":"40677","user_id":"43497","year":"2021","status":"public","title":"Rate Region of the $K$-user MIMO Interference Channel with Imperfect Transmitters","author":[{"last_name":"Soleymani","first_name":"Mohammad","full_name":"Soleymani, Mohammad"},{"first_name":"Ignacio","last_name":"Santamaria","full_name":"Santamaria, Ignacio"},{"last_name":"Maham","first_name":"Behrouz","full_name":"Maham, Behrouz"},{"last_name":"Schreier","first_name":"Peter J","full_name":"Schreier, Peter J"}],"date_updated":"2023-01-30T12:03:35Z","date_created":"2023-01-30T11:51:35Z","type":"conference","department":[{"_id":"263"}],"publication":"Proc. 28th European Signal Processing Conference (EUSIPCO)","citation":{"short":"M. Soleymani, I. Santamaria, B. Maham, P.J. Schreier, in: Proc. 28th European Signal Processing Conference (EUSIPCO), 2021, pp. 1638–1642.","chicago":"Soleymani, Mohammad, Ignacio Santamaria, Behrouz Maham, and Peter J Schreier. “Rate Region of the $K$-User MIMO Interference Channel with Imperfect Transmitters.” In <i>Proc. 28th European Signal Processing Conference (EUSIPCO)</i>, 1638–1642, 2021.","apa":"Soleymani, M., Santamaria, I., Maham, B., &#38; Schreier, P. J. (2021). Rate Region of the $K$-user MIMO Interference Channel with Imperfect Transmitters. <i>Proc. 28th European Signal Processing Conference (EUSIPCO)</i>, 1638–1642.","ieee":"M. Soleymani, I. Santamaria, B. Maham, and P. J. Schreier, “Rate Region of the $K$-user MIMO Interference Channel with Imperfect Transmitters,” in <i>Proc. 28th European Signal Processing Conference (EUSIPCO)</i>, 2021, pp. 1638–1642.","ama":"Soleymani M, Santamaria I, Maham B, Schreier PJ. Rate Region of the $K$-user MIMO Interference Channel with Imperfect Transmitters. In: <i>Proc. 28th European Signal Processing Conference (EUSIPCO)</i>. ; 2021:1638–1642.","bibtex":"@inproceedings{Soleymani_Santamaria_Maham_Schreier_2021, title={Rate Region of the $K$-user MIMO Interference Channel with Imperfect Transmitters}, booktitle={Proc. 28th European Signal Processing Conference (EUSIPCO)}, author={Soleymani, Mohammad and Santamaria, Ignacio and Maham, Behrouz and Schreier, Peter J}, year={2021}, pages={1638–1642} }","mla":"Soleymani, Mohammad, et al. “Rate Region of the $K$-User MIMO Interference Channel with Imperfect Transmitters.” <i>Proc. 28th European Signal Processing Conference (EUSIPCO)</i>, 2021, pp. 1638–1642."}},{"publication":"Workshop Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV 2021)","citation":{"ama":"Adelt P, Koppelmann B, Müller W, Scheytt C. Register and Instruction Coverage Analysis for Different RISC-V ISA Modules. In: <i>Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2021)</i>. ; 2021.","short":"P. Adelt, B. Koppelmann, W. Müller, C. Scheytt, in: Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2021), 2021.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, and Christoph Scheytt. “Register and Instruction Coverage Analysis for Different RISC-V ISA Modules.” In <i>Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2021)</i>, 2021.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Scheytt_2021, title={Register and Instruction Coverage Analysis for Different RISC-V ISA Modules}, booktitle={Workshop Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV 2021)}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Scheytt, Christoph}, year={2021} }","apa":"Adelt, P., Koppelmann, B., Müller, W., &#38; Scheytt, C. (2021). Register and Instruction Coverage Analysis for Different RISC-V ISA Modules. <i>Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2021)</i>.","mla":"Adelt, Peer, et al. “Register and Instruction Coverage Analysis for Different RISC-V ISA Modules.” <i>Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2021)</i>, 2021.","ieee":"P. Adelt, B. Koppelmann, W. Müller, and C. Scheytt, “Register and Instruction Coverage Analysis for Different RISC-V ISA Modules,” 2021."},"type":"conference","department":[{"_id":"58"}],"date_created":"2021-09-09T08:30:03Z","date_updated":"2023-01-31T13:25:48Z","status":"public","title":"Register and Instruction Coverage Analysis for Different RISC-V ISA Modules","year":"2021","author":[{"first_name":"Peer","last_name":"Adelt","full_name":"Adelt, Peer","id":"5603"},{"id":"25260","last_name":"Koppelmann","first_name":"Bastian","full_name":"Koppelmann, Bastian"},{"id":"16243","full_name":"Müller, Wolfgang","first_name":"Wolfgang","last_name":"Müller"},{"id":"37144","full_name":"Scheytt, Christoph","orcid":"https://orcid.org/0000-0002-5950-6618","last_name":"Scheytt","first_name":"Christoph"}],"user_id":"15931","language":[{"iso":"eng"}],"_id":"23992"},{"publication":"Epilepsy Behav","citation":{"bibtex":"@article{Vieluf_Hasija_Schreier_El Atrache_Hammond_Mohammadpour Touserkani_Sarkis_Loddenkemper_Reinsberger_2021, title={Generalized tonic-clonic seizures are accompanied by changes of interrelations within the autonomic nervous system.}, volume={124}, journal={Epilepsy Behav}, author={Vieluf, S and Hasija, Tanuj and Schreier, PJ and El Atrache, R and Hammond, S and Mohammadpour Touserkani, F and Sarkis, RA and Loddenkemper, T and Reinsberger, Claus}, year={2021}, pages={108321} }","ama":"Vieluf S, Hasija T, Schreier P, et al. Generalized tonic-clonic seizures are accompanied by changes of interrelations within the autonomic nervous system. <i>Epilepsy Behav</i>. 2021;124:108321.","mla":"Vieluf, S., et al. “Generalized Tonic-Clonic Seizures Are Accompanied by Changes of Interrelations within the Autonomic Nervous System.” <i>Epilepsy Behav</i>, vol. 124, 2021, p. 108321.","short":"S. Vieluf, T. Hasija, P. Schreier, R. El Atrache, S. Hammond, F. Mohammadpour Touserkani, R. Sarkis, T. Loddenkemper, C. Reinsberger, Epilepsy Behav 124 (2021) 108321.","chicago":"Vieluf, S, Tanuj Hasija, PJ Schreier, R El Atrache, S Hammond, F Mohammadpour Touserkani, RA Sarkis, T Loddenkemper, and Claus Reinsberger. “Generalized Tonic-Clonic Seizures Are Accompanied by Changes of Interrelations within the Autonomic Nervous System.” <i>Epilepsy Behav</i> 124 (2021): 108321.","ieee":"S. Vieluf <i>et al.</i>, “Generalized tonic-clonic seizures are accompanied by changes of interrelations within the autonomic nervous system.,” <i>Epilepsy Behav</i>, vol. 124, p. 108321, 2021.","apa":"Vieluf, S., Hasija, T., Schreier, P., El Atrache, R., Hammond, S., Mohammadpour Touserkani, F., Sarkis, R., Loddenkemper, T., &#38; Reinsberger, C. (2021). Generalized tonic-clonic seizures are accompanied by changes of interrelations within the autonomic nervous system. <i>Epilepsy Behav</i>, <i>124</i>, 108321."},"type":"journal_article","department":[{"_id":"35"},{"_id":"176"},{"_id":"17"},{"_id":"263"}],"external_id":{"pmid":["34624803"]},"date_created":"2022-06-07T09:06:23Z","date_updated":"2023-02-06T09:31:50Z","intvolume":"       124","year":"2021","status":"public","title":"Generalized tonic-clonic seizures are accompanied by changes of interrelations within the autonomic nervous system.","publication_identifier":{"issn":["1525-5050","1525-5069"]},"author":[{"full_name":"Vieluf, S","last_name":"Vieluf","first_name":"S"},{"last_name":"Hasija","first_name":"Tanuj","full_name":"Hasija, Tanuj"},{"full_name":"Schreier, PJ","last_name":"Schreier","first_name":"PJ"},{"full_name":"El Atrache, R","first_name":"R","last_name":"El Atrache"},{"first_name":"S","last_name":"Hammond","full_name":"Hammond, S"},{"full_name":"Mohammadpour Touserkani, F","last_name":"Mohammadpour Touserkani","first_name":"F"},{"full_name":"Sarkis, RA","first_name":"RA","last_name":"Sarkis"},{"full_name":"Loddenkemper, T","first_name":"T","last_name":"Loddenkemper"},{"full_name":"Reinsberger, Claus","first_name":"Claus","last_name":"Reinsberger","id":"48978"}],"user_id":"33213","pmid":"1","volume":124,"page":"108321","_id":"31702","language":[{"iso":"eng"}]},{"publisher":"IEEE","_id":"29899","user_id":"34289","conference":{"end_date":"2021-09-10","start_date":"2021-09-06","name":"23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe)","location":"Ghent, Belgium"},"status":"public","citation":{"ieee":"P. Rehlaender, R. Unruh, L. Hankeln, F. Schafmeister, and J. Böcker, “Frequency-Doubler Modulation for Reduced Junction Temperatures for LLC Resonant Converters Operated in Half-Bridge Configuration,” presented at the 23rd European Conference on Power Electronics and Applications (EPE’21 ECCE Europe), Ghent, Belgium, 2021, doi: <a href=\"https://doi.org/10.23919/EPE21ECCEEurope50061.2021.9570674\">10.23919/EPE21ECCEEurope50061.2021.9570674</a>.","apa":"Rehlaender, P., Unruh, R., Hankeln, L., Schafmeister, F., &#38; Böcker, J. (2021). Frequency-Doubler Modulation for Reduced Junction Temperatures for LLC Resonant Converters Operated in Half-Bridge Configuration. <i>23rd European Conference on Power Electronics and Applications (EPE’21 ECCE Europe)</i>. 23rd European Conference on Power Electronics and Applications (EPE’21 ECCE Europe), Ghent, Belgium. <a href=\"https://doi.org/10.23919/EPE21ECCEEurope50061.2021.9570674\">https://doi.org/10.23919/EPE21ECCEEurope50061.2021.9570674</a>","short":"P. Rehlaender, R. Unruh, L. Hankeln, F. Schafmeister, J. Böcker, in: 23rd European Conference on Power Electronics and Applications (EPE’21 ECCE Europe), IEEE, 2021.","chicago":"Rehlaender, Philipp, Roland Unruh, Lars Hankeln, Frank Schafmeister, and Joachim Böcker. “Frequency-Doubler Modulation for Reduced Junction Temperatures for LLC Resonant Converters Operated in Half-Bridge Configuration.” In <i>23rd European Conference on Power Electronics and Applications (EPE’21 ECCE Europe)</i>. IEEE, 2021. <a href=\"https://doi.org/10.23919/EPE21ECCEEurope50061.2021.9570674\">https://doi.org/10.23919/EPE21ECCEEurope50061.2021.9570674</a>.","mla":"Rehlaender, Philipp, et al. “Frequency-Doubler Modulation for Reduced Junction Temperatures for LLC Resonant Converters Operated in Half-Bridge Configuration.” <i>23rd European Conference on Power Electronics and Applications (EPE’21 ECCE Europe)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.23919/EPE21ECCEEurope50061.2021.9570674\">10.23919/EPE21ECCEEurope50061.2021.9570674</a>.","bibtex":"@inproceedings{Rehlaender_Unruh_Hankeln_Schafmeister_Böcker_2021, title={Frequency-Doubler Modulation for Reduced Junction Temperatures for LLC Resonant Converters Operated in Half-Bridge Configuration}, DOI={<a href=\"https://doi.org/10.23919/EPE21ECCEEurope50061.2021.9570674\">10.23919/EPE21ECCEEurope50061.2021.9570674</a>}, booktitle={23rd European Conference on Power Electronics and Applications (EPE’21 ECCE Europe)}, publisher={IEEE}, author={Rehlaender, Philipp and Unruh, Roland and Hankeln, Lars and Schafmeister, Frank and Böcker, Joachim}, year={2021} }","ama":"Rehlaender P, Unruh R, Hankeln L, Schafmeister F, Böcker J. Frequency-Doubler Modulation for Reduced Junction Temperatures for LLC Resonant Converters Operated in Half-Bridge Configuration. In: <i>23rd European Conference on Power Electronics and Applications (EPE’21 ECCE Europe)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.23919/EPE21ECCEEurope50061.2021.9570674\">10.23919/EPE21ECCEEurope50061.2021.9570674</a>"},"language":[{"iso":"eng"}],"main_file_link":[{"url":"https://ieeexplore.ieee.org/abstract/document/9570674"}],"doi":"10.23919/EPE21ECCEEurope50061.2021.9570674","publication_identifier":{"isbn":["978-9-0758-1537-5"]},"author":[{"last_name":"Rehlaender","first_name":"Philipp","full_name":"Rehlaender, Philipp","id":"69469"},{"full_name":"Unruh, Roland","last_name":"Unruh","first_name":"Roland","id":"34289"},{"full_name":"Hankeln, Lars","last_name":"Hankeln","first_name":"Lars"},{"id":"71291","full_name":"Schafmeister, Frank","first_name":"Frank","last_name":"Schafmeister"},{"full_name":"Böcker, Joachim","last_name":"Böcker","orcid":"0000-0002-8480-7295","first_name":"Joachim","id":"66"}],"title":"Frequency-Doubler Modulation for Reduced Junction Temperatures for LLC Resonant Converters Operated in Half-Bridge Configuration","year":"2021","publication_status":"published","date_updated":"2023-02-09T11:01:11Z","date_created":"2022-02-20T21:29:48Z","department":[{"_id":"34"},{"_id":"52"}],"keyword":["Resonant converter","High frequency power converter","Switched-mode power supply","Converter control","Control methods for electrical systems"],"type":"conference","publication":"23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe)","abstract":[{"text":"LLC resonant converters are typically unsuitable to be applied for wide voltage-transfer ratio applications. With a full-bridge inverter, however, they can be operated in a variety of different modulations. Most notably, by permanently turning on one MOSFET and turning off the other MOSFET of the same bridge leg, the LLC can be operated in half-bridge configuration reducing the gain by a factor of two. The resonant capacitor is hereby charged to an average voltage of half the input voltage. In this modulation, however, the switch that is permanently turned on is stressed by the complete resonant current while exhibiting no switching losses. This paper proves that the frequency-doubler modulation can better balance the losses among all MOSFETs and should be the preferred mode of operation favored over the conventional half-bridge modulation. This paper analyzes the beneficial loss distribution, proposes an on-the-fly morphing modulation and discusses potential operating strategies to further reduce the junction temperature. Furthermore, it is shown that this modulation can also be altered to achieve the asymmetrical LLC operation. Experimental measurement results show that the modulation results in a substantial decrease of the maximum MOSFET temperature and shows that the converter can be smoothly transitioned during operation from full-bridge modulation to the frequency-doubler half-bridge operation and back.","lang":"eng"}]},{"doi":"10.22331/q-2021-04-08-429","language":[{"iso":"eng"}],"article_number":"429","intvolume":"         5","publication_status":"published","date_updated":"2023-02-28T11:07:47Z","author":[{"first_name":"Anne","last_name":"Broadbent","full_name":"Broadbent, Anne"},{"id":"71541","first_name":"Sevag","orcid":"0000-0002-9992-3379","last_name":"Gharibian","full_name":"Gharibian, Sevag"},{"full_name":"Zhou, Hong-Sheng","first_name":"Hong-Sheng","last_name":"Zhou"}],"publication_identifier":{"issn":["2521-327X"]},"title":"Towards Quantum One-Time Memories from Stateless Hardware","year":"2021","department":[{"_id":"623"},{"_id":"7"}],"keyword":["Physics and Astronomy (miscellaneous)","Atomic and Molecular Physics","and Optics"],"type":"journal_article","date_created":"2022-02-08T10:59:00Z","abstract":[{"text":"<jats:p>A central tenet of theoretical cryptography is the study of the minimal assumptions required to implement a given cryptographic primitive. One such primitive is the one-time memory (OTM), introduced by Goldwasser, Kalai, and Rothblum [CRYPTO 2008], which is a classical functionality modeled after a non-interactive 1-out-of-2 oblivious transfer, and which is complete for one-time classical and quantum programs. It is known that secure OTMs do not exist in the standard model in both the classical and quantum settings. Here, we propose a scheme for using quantum information, together with the assumption of stateless (<mml:math xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"><mml:mi>i</mml:mi><mml:mo>.</mml:mo><mml:mi>e</mml:mi><mml:mo>.</mml:mo></mml:math>, reusable) hardware tokens, to build statistically secure OTMs. Via the semidefinite programming-based quantum games framework of Gutoski and Watrous [STOC 2007], we prove security for a malicious receiver making at most 0.114<mml:math xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"><mml:mi>n</mml:mi></mml:math> adaptive queries to the token (for <mml:math xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"><mml:mi>n</mml:mi></mml:math> the key size), in the quantum universal composability framework, but leave open the question of security against a polynomial amount of queries. Compared to alternative schemes derived from the literature on quantum money, our scheme is technologically simple since it is of the \"prepare-and-measure\" type. We also give two impossibility results showing certain assumptions in our scheme cannot be relaxed.</jats:p>","lang":"eng"}],"publication":"Quantum","volume":5,"user_id":"71541","publisher":"Verein zur Forderung des Open Access Publizierens in den Quantenwissenschaften","_id":"29780","status":"public","citation":{"apa":"Broadbent, A., Gharibian, S., &#38; Zhou, H.-S. (2021). Towards Quantum One-Time Memories from Stateless Hardware. <i>Quantum</i>, <i>5</i>, Article 429. <a href=\"https://doi.org/10.22331/q-2021-04-08-429\">https://doi.org/10.22331/q-2021-04-08-429</a>","ieee":"A. Broadbent, S. Gharibian, and H.-S. Zhou, “Towards Quantum One-Time Memories from Stateless Hardware,” <i>Quantum</i>, vol. 5, Art. no. 429, 2021, doi: <a href=\"https://doi.org/10.22331/q-2021-04-08-429\">10.22331/q-2021-04-08-429</a>.","short":"A. Broadbent, S. Gharibian, H.-S. Zhou, Quantum 5 (2021).","chicago":"Broadbent, Anne, Sevag Gharibian, and Hong-Sheng Zhou. “Towards Quantum One-Time Memories from Stateless Hardware.” <i>Quantum</i> 5 (2021). <a href=\"https://doi.org/10.22331/q-2021-04-08-429\">https://doi.org/10.22331/q-2021-04-08-429</a>.","mla":"Broadbent, Anne, et al. “Towards Quantum One-Time Memories from Stateless Hardware.” <i>Quantum</i>, vol. 5, 429, Verein zur Forderung des Open Access Publizierens in den Quantenwissenschaften, 2021, doi:<a href=\"https://doi.org/10.22331/q-2021-04-08-429\">10.22331/q-2021-04-08-429</a>.","ama":"Broadbent A, Gharibian S, Zhou H-S. Towards Quantum One-Time Memories from Stateless Hardware. <i>Quantum</i>. 2021;5. doi:<a href=\"https://doi.org/10.22331/q-2021-04-08-429\">10.22331/q-2021-04-08-429</a>","bibtex":"@article{Broadbent_Gharibian_Zhou_2021, title={Towards Quantum One-Time Memories from Stateless Hardware}, volume={5}, DOI={<a href=\"https://doi.org/10.22331/q-2021-04-08-429\">10.22331/q-2021-04-08-429</a>}, number={429}, journal={Quantum}, publisher={Verein zur Forderung des Open Access Publizierens in den Quantenwissenschaften}, author={Broadbent, Anne and Gharibian, Sevag and Zhou, Hong-Sheng}, year={2021} }"}},{"date_created":"2022-12-22T10:48:44Z","department":[{"_id":"102"}],"type":"journal_article","keyword":["Applied Mathematics","Computational Mathematics","Algebra and Number Theory"],"issue":"329","publication":"Mathematics of Computation","abstract":[{"text":"In this paper we obtain a complete list of imaginary n-quadratic fields with class groups of exponent 3 and 5 under ERH for every positive integer n where an n-quadratic field is a number field of degree 2ⁿ represented as the composite of n quadratic fields. ","lang":"eng"}],"language":[{"iso":"eng"}],"doi":"10.1090/mcom/3609","publication_identifier":{"issn":["0025-5718","1088-6842"]},"author":[{"id":"21202","full_name":"Klüners, Jürgen","last_name":"Klüners","first_name":"Jürgen"},{"last_name":"Komatsu","first_name":"Toru","full_name":"Komatsu, Toru"}],"year":"2021","title":"Imaginary multiquadratic number fields with class group of exponent $3$ and $5$","intvolume":"        90","date_updated":"2023-03-06T08:57:45Z","publication_status":"published","external_id":{"arxiv":["2004.03308v2"]},"citation":{"chicago":"Klüners, Jürgen, and Toru Komatsu. “Imaginary Multiquadratic Number Fields with Class Group of Exponent $3$ and $5$.” <i>Mathematics of Computation</i> 90, no. 329 (2021): 1483–97. <a href=\"https://doi.org/10.1090/mcom/3609\">https://doi.org/10.1090/mcom/3609</a>.","short":"J. Klüners, T. Komatsu, Mathematics of Computation 90 (2021) 1483–1497.","ieee":"J. Klüners and T. Komatsu, “Imaginary multiquadratic number fields with class group of exponent $3$ and $5$,” <i>Mathematics of Computation</i>, vol. 90, no. 329, pp. 1483–1497, 2021, doi: <a href=\"https://doi.org/10.1090/mcom/3609\">10.1090/mcom/3609</a>.","apa":"Klüners, J., &#38; Komatsu, T. (2021). Imaginary multiquadratic number fields with class group of exponent $3$ and $5$. <i>Mathematics of Computation</i>, <i>90</i>(329), 1483–1497. <a href=\"https://doi.org/10.1090/mcom/3609\">https://doi.org/10.1090/mcom/3609</a>","bibtex":"@article{Klüners_Komatsu_2021, title={Imaginary multiquadratic number fields with class group of exponent $3$ and $5$}, volume={90}, DOI={<a href=\"https://doi.org/10.1090/mcom/3609\">10.1090/mcom/3609</a>}, number={329}, journal={Mathematics of Computation}, publisher={American Mathematical Society (AMS)}, author={Klüners, Jürgen and Komatsu, Toru}, year={2021}, pages={1483–1497} }","ama":"Klüners J, Komatsu T. Imaginary multiquadratic number fields with class group of exponent $3$ and $5$. <i>Mathematics of Computation</i>. 2021;90(329):1483-1497. doi:<a href=\"https://doi.org/10.1090/mcom/3609\">10.1090/mcom/3609</a>","mla":"Klüners, Jürgen, and Toru Komatsu. “Imaginary Multiquadratic Number Fields with Class Group of Exponent $3$ and $5$.” <i>Mathematics of Computation</i>, vol. 90, no. 329, American Mathematical Society (AMS), 2021, pp. 1483–97, doi:<a href=\"https://doi.org/10.1090/mcom/3609\">10.1090/mcom/3609</a>."},"publisher":"American Mathematical Society (AMS)","_id":"34840","page":"1483-1497","volume":90,"user_id":"93826","status":"public"},{"user_id":"49265","_id":"29655","language":[{"iso":"eng"}],"date_updated":"2023-03-09T10:11:13Z","status":"public","year":"2021","title":"Thermal Neural Networks: Lumped-Parameter Thermal Modeling With State-Space Machine Learning","author":[{"id":"49265","full_name":"Kirchgässner, Wilhelm","first_name":"Wilhelm","last_name":"Kirchgässner","orcid":"0000-0001-9490-1843"},{"id":"11291","orcid":"https://orcid.org/0000-0001-9362-8777","last_name":"Wallscheid","first_name":"Oliver","full_name":"Wallscheid, Oliver"},{"first_name":"Joachim","orcid":"0000-0002-8480-7295","last_name":"Böcker","full_name":"Böcker, Joachim","id":"66"}],"type":"preprint","department":[{"_id":"52"}],"date_created":"2022-01-28T14:11:06Z","project":[{"_id":"52","name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing"}],"publication":"arXiv preprint arXiv:2103.16323","citation":{"bibtex":"@article{Kirchgässner_Wallscheid_Böcker_2021, title={Thermal Neural Networks: Lumped-Parameter Thermal Modeling With State-Space Machine Learning}, journal={arXiv preprint arXiv:2103.16323}, author={Kirchgässner, Wilhelm and Wallscheid, Oliver and Böcker, Joachim}, year={2021} }","ama":"Kirchgässner W, Wallscheid O, Böcker J. Thermal Neural Networks: Lumped-Parameter Thermal Modeling With State-Space Machine Learning. <i>arXiv preprint arXiv:210316323</i>. Published online 2021.","mla":"Kirchgässner, Wilhelm, et al. “Thermal Neural Networks: Lumped-Parameter Thermal Modeling With State-Space Machine Learning.” <i>ArXiv Preprint ArXiv:2103.16323</i>, 2021.","short":"W. Kirchgässner, O. Wallscheid, J. Böcker, ArXiv Preprint ArXiv:2103.16323 (2021).","chicago":"Kirchgässner, Wilhelm, Oliver Wallscheid, and Joachim Böcker. “Thermal Neural Networks: Lumped-Parameter Thermal Modeling With State-Space Machine Learning.” <i>ArXiv Preprint ArXiv:2103.16323</i>, 2021.","ieee":"W. Kirchgässner, O. Wallscheid, and J. Böcker, “Thermal Neural Networks: Lumped-Parameter Thermal Modeling With State-Space Machine Learning,” <i>arXiv preprint arXiv:2103.16323</i>. 2021.","apa":"Kirchgässner, W., Wallscheid, O., &#38; Böcker, J. (2021). Thermal Neural Networks: Lumped-Parameter Thermal Modeling With State-Space Machine Learning. In <i>arXiv preprint arXiv:2103.16323</i>."}},{"publication_status":"published","date_updated":"2023-03-21T10:00:40Z","status":"public","title":"Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field","year":"2021","author":[{"full_name":"Lange, Sven","last_name":"Lange","first_name":"Sven"},{"full_name":"Hedayat, Christian","last_name":"Hedayat","first_name":"Christian"},{"first_name":"Harald","last_name":"Kuhn","full_name":"Kuhn, Harald"},{"full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich","id":"20179"}],"user_id":"20179","doi":"10.1109/ssi52265.2021.9466958","language":[{"iso":"eng"}],"_id":"39401","publisher":"IEEE","publication":"2021 Smart Systems Integration (SSI)","citation":{"apa":"Lange, S., Hedayat, C., Kuhn, H., &#38; Hilleringmann, U. (2021). Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field. <i>2021 Smart Systems Integration (SSI)</i>. <a href=\"https://doi.org/10.1109/ssi52265.2021.9466958\">https://doi.org/10.1109/ssi52265.2021.9466958</a>","ieee":"S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field,” 2021, doi: <a href=\"https://doi.org/10.1109/ssi52265.2021.9466958\">10.1109/ssi52265.2021.9466958</a>.","short":"S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.","chicago":"Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field.” In <i>2021 Smart Systems Integration (SSI)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/ssi52265.2021.9466958\">https://doi.org/10.1109/ssi52265.2021.9466958</a>.","mla":"Lange, Sven, et al. “Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field.” <i>2021 Smart Systems Integration (SSI)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9466958\">10.1109/ssi52265.2021.9466958</a>.","ama":"Lange S, Hedayat C, Kuhn H, Hilleringmann U. Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field. In: <i>2021 Smart Systems Integration (SSI)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9466958\">10.1109/ssi52265.2021.9466958</a>","bibtex":"@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2021, title={Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field}, DOI={<a href=\"https://doi.org/10.1109/ssi52265.2021.9466958\">10.1109/ssi52265.2021.9466958</a>}, booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange, Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2021} }"},"type":"conference","department":[{"_id":"59"}],"date_created":"2023-01-24T10:18:52Z"},{"publisher":"IEEE","_id":"39384","language":[{"iso":"eng"}],"doi":"10.1109/africon51333.2021.9570953","user_id":"20179","author":[{"full_name":"Reker, Julia","last_name":"Reker","first_name":"Julia"},{"full_name":"Meyers, Thorsten","last_name":"Meyers","first_name":"Thorsten"},{"last_name":"Vidor","first_name":"Fabio F.","full_name":"Vidor, Fabio F."},{"last_name":"Joubert","first_name":"Trudi-Heleen","full_name":"Joubert, Trudi-Heleen"},{"id":"20179","full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich"}],"title":"Influence of electrode metallization on thin-film transistor performance","status":"public","year":"2021","date_updated":"2023-03-22T10:23:56Z","publication_status":"published","date_created":"2023-01-24T10:08:41Z","department":[{"_id":"59"}],"type":"conference","citation":{"bibtex":"@inproceedings{Reker_Meyers_Vidor_Joubert_Hilleringmann_2021, title={Influence of electrode metallization on thin-film transistor performance}, DOI={<a href=\"https://doi.org/10.1109/africon51333.2021.9570953\">10.1109/africon51333.2021.9570953</a>}, booktitle={2021 IEEE AFRICON}, publisher={IEEE}, author={Reker, Julia and Meyers, Thorsten and Vidor, Fabio F. and Joubert, Trudi-Heleen and Hilleringmann, Ulrich}, year={2021} }","ama":"Reker J, Meyers T, Vidor FF, Joubert T-H, Hilleringmann U. Influence of electrode metallization on thin-film transistor performance. In: <i>2021 IEEE AFRICON</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/africon51333.2021.9570953\">10.1109/africon51333.2021.9570953</a>","mla":"Reker, Julia, et al. “Influence of Electrode Metallization on Thin-Film Transistor Performance.” <i>2021 IEEE AFRICON</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/africon51333.2021.9570953\">10.1109/africon51333.2021.9570953</a>.","chicago":"Reker, Julia, Thorsten Meyers, Fabio F. Vidor, Trudi-Heleen Joubert, and Ulrich Hilleringmann. “Influence of Electrode Metallization on Thin-Film Transistor Performance.” In <i>2021 IEEE AFRICON</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/africon51333.2021.9570953\">https://doi.org/10.1109/africon51333.2021.9570953</a>.","short":"J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 IEEE AFRICON, IEEE, 2021.","ieee":"J. Reker, T. Meyers, F. F. Vidor, T.-H. Joubert, and U. Hilleringmann, “Influence of electrode metallization on thin-film transistor performance,” 2021, doi: <a href=\"https://doi.org/10.1109/africon51333.2021.9570953\">10.1109/africon51333.2021.9570953</a>.","apa":"Reker, J., Meyers, T., Vidor, F. F., Joubert, T.-H., &#38; Hilleringmann, U. (2021). Influence of electrode metallization on thin-film transistor performance. <i>2021 IEEE AFRICON</i>. <a href=\"https://doi.org/10.1109/africon51333.2021.9570953\">https://doi.org/10.1109/africon51333.2021.9570953</a>"},"publication":"2021 IEEE AFRICON"},{"language":[{"iso":"eng"}],"_id":"39392","publisher":"IEEE","user_id":"20179","doi":"10.1109/icit46573.2021.9453646","author":[{"last_name":"Sander","first_name":"Tom","full_name":"Sander, Tom"},{"full_name":"Lange, Sven","last_name":"Lange","first_name":"Sven"},{"last_name":"Hilleringmann","first_name":"Ulrich","full_name":"Hilleringmann, Ulrich","id":"20179"},{"last_name":"Geneis","first_name":"Volker","full_name":"Geneis, Volker"},{"first_name":"Christian","last_name":"Hedayat","full_name":"Hedayat, Christian"},{"first_name":"Harald","last_name":"Kuhn","full_name":"Kuhn, Harald"},{"full_name":"Gockel, Franz-Barthold","first_name":"Franz-Barthold","last_name":"Gockel"}],"year":"2021","title":"Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction","status":"public","publication_status":"published","date_updated":"2023-03-22T10:31:28Z","date_created":"2023-01-24T10:12:47Z","department":[{"_id":"59"}],"type":"conference","citation":{"bibtex":"@inproceedings{Sander_Lange_Hilleringmann_Geneis_Hedayat_Kuhn_Gockel_2021, title={Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction}, DOI={<a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">10.1109/icit46573.2021.9453646</a>}, booktitle={2021 22nd IEEE International Conference on Industrial Technology (ICIT)}, publisher={IEEE}, author={Sander, Tom and Lange, Sven and Hilleringmann, Ulrich and Geneis, Volker and Hedayat, Christian and Kuhn, Harald and Gockel, Franz-Barthold}, year={2021} }","ama":"Sander T, Lange S, Hilleringmann U, et al. Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction. In: <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">10.1109/icit46573.2021.9453646</a>","mla":"Sander, Tom, et al. “Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction.” <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">10.1109/icit46573.2021.9453646</a>.","short":"T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, F.-B. Gockel, in: 2021 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, 2021.","chicago":"Sander, Tom, Sven Lange, Ulrich Hilleringmann, Volker Geneis, Christian Hedayat, Harald Kuhn, and Franz-Barthold Gockel. “Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction.” In <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">https://doi.org/10.1109/icit46573.2021.9453646</a>.","ieee":"T. Sander <i>et al.</i>, “Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction,” 2021, doi: <a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">10.1109/icit46573.2021.9453646</a>.","apa":"Sander, T., Lange, S., Hilleringmann, U., Geneis, V., Hedayat, C., Kuhn, H., &#38; Gockel, F.-B. (2021). Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction. <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>. <a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">https://doi.org/10.1109/icit46573.2021.9453646</a>"},"publication":"2021 22nd IEEE International Conference on Industrial Technology (ICIT)"},{"user_id":"20179","doi":"10.1109/icit46573.2021.9453609","_id":"39390","language":[{"iso":"eng"}],"publisher":"IEEE","publication_status":"published","date_updated":"2023-03-22T10:30:58Z","author":[{"first_name":"Sven","last_name":"Lange","full_name":"Lange, Sven"},{"last_name":"Schroder","first_name":"Dominik","full_name":"Schroder, Dominik"},{"first_name":"Christian","last_name":"Hedayat","full_name":"Hedayat, Christian"},{"full_name":"Kuhn, Harald","last_name":"Kuhn","first_name":"Harald"},{"full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich","id":"20179"}],"year":"2021","title":"Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses","status":"public","department":[{"_id":"59"}],"type":"conference","date_created":"2023-01-24T10:12:18Z","citation":{"short":"S. Lange, D. Schroder, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, 2021.","ama":"Lange S, Schroder D, Hedayat C, Kuhn H, Hilleringmann U. Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses. In: <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">10.1109/icit46573.2021.9453609</a>","chicago":"Lange, Sven, Dominik Schroder, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses.” In <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">https://doi.org/10.1109/icit46573.2021.9453609</a>.","bibtex":"@inproceedings{Lange_Schroder_Hedayat_Kuhn_Hilleringmann_2021, title={Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses}, DOI={<a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">10.1109/icit46573.2021.9453609</a>}, booktitle={2021 22nd IEEE International Conference on Industrial Technology (ICIT)}, publisher={IEEE}, author={Lange, Sven and Schroder, Dominik and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2021} }","mla":"Lange, Sven, et al. “Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses.” <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">10.1109/icit46573.2021.9453609</a>.","apa":"Lange, S., Schroder, D., Hedayat, C., Kuhn, H., &#38; Hilleringmann, U. (2021). Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses. <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>. <a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">https://doi.org/10.1109/icit46573.2021.9453609</a>","ieee":"S. Lange, D. Schroder, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses,” 2021, doi: <a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">10.1109/icit46573.2021.9453609</a>."},"publication":"2021 22nd IEEE International Conference on Industrial Technology (ICIT)"},{"citation":{"short":"U. Hilleringmann, in: Nanostructured Zinc Oxide, Elsevier, 2021.","chicago":"Hilleringmann, Ulrich. “ZnO Nanoparticle Films as Active Layer for Thin Film Transistors.” In <i>Nanostructured Zinc Oxide</i>. Elsevier, 2021. <a href=\"https://doi.org/10.1016/b978-0-12-818900-9.00013-9\">https://doi.org/10.1016/b978-0-12-818900-9.00013-9</a>.","ieee":"U. Hilleringmann, “ZnO nanoparticle films as active layer for thin film transistors,” in <i>Nanostructured Zinc Oxide</i>, Elsevier, 2021.","apa":"Hilleringmann, U. (2021). ZnO nanoparticle films as active layer for thin film transistors. In <i>Nanostructured Zinc Oxide</i>. Elsevier. <a href=\"https://doi.org/10.1016/b978-0-12-818900-9.00013-9\">https://doi.org/10.1016/b978-0-12-818900-9.00013-9</a>","bibtex":"@inbook{Hilleringmann_2021, title={ZnO nanoparticle films as active layer for thin film transistors}, DOI={<a href=\"https://doi.org/10.1016/b978-0-12-818900-9.00013-9\">10.1016/b978-0-12-818900-9.00013-9</a>}, booktitle={Nanostructured Zinc Oxide}, publisher={Elsevier}, author={Hilleringmann, Ulrich}, year={2021} }","ama":"Hilleringmann U. ZnO nanoparticle films as active layer for thin film transistors. In: <i>Nanostructured Zinc Oxide</i>. Elsevier; 2021. doi:<a href=\"https://doi.org/10.1016/b978-0-12-818900-9.00013-9\">10.1016/b978-0-12-818900-9.00013-9</a>","mla":"Hilleringmann, Ulrich. “ZnO Nanoparticle Films as Active Layer for Thin Film Transistors.” <i>Nanostructured Zinc Oxide</i>, Elsevier, 2021, doi:<a href=\"https://doi.org/10.1016/b978-0-12-818900-9.00013-9\">10.1016/b978-0-12-818900-9.00013-9</a>."},"publication":"Nanostructured Zinc Oxide","department":[{"_id":"59"}],"type":"book_chapter","date_created":"2023-01-24T10:13:10Z","date_updated":"2023-03-22T10:30:19Z","publication_status":"published","publication_identifier":{"isbn":["9780128189009"]},"author":[{"full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich","id":"20179"}],"year":"2021","status":"public","title":"ZnO nanoparticle films as active layer for thin film transistors","doi":"10.1016/b978-0-12-818900-9.00013-9","user_id":"20179","publisher":"Elsevier","_id":"39394","language":[{"iso":"eng"}]},{"publication_status":"published","date_updated":"2023-03-22T10:30:04Z","status":"public","year":"2021","title":"Complementary Inverter Circuits on Flexible Substrates","author":[{"last_name":"Reker","first_name":"Julia","full_name":"Reker, Julia"},{"full_name":"Meyers, Thorsten","last_name":"Meyers","first_name":"Thorsten"},{"full_name":"Vidor, Fabio F.","first_name":"Fabio F.","last_name":"Vidor"},{"last_name":"Joubert","first_name":"Trudi-Heleen","full_name":"Joubert, Trudi-Heleen"},{"id":"20179","first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich"}],"user_id":"20179","doi":"10.1109/ssi52265.2021.9466966","_id":"39396","publisher":"IEEE","language":[{"iso":"eng"}],"publication":"2021 Smart Systems Integration (SSI)","citation":{"ama":"Reker J, Meyers T, Vidor FF, Joubert T-H, Hilleringmann U. Complementary Inverter Circuits on Flexible Substrates. In: <i>2021 Smart Systems Integration (SSI)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>","short":"J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.","chicago":"Reker, Julia, Thorsten Meyers, Fabio F. Vidor, Trudi-Heleen Joubert, and Ulrich Hilleringmann. “Complementary Inverter Circuits on Flexible Substrates.” In <i>2021 Smart Systems Integration (SSI)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">https://doi.org/10.1109/ssi52265.2021.9466966</a>.","bibtex":"@inproceedings{Reker_Meyers_Vidor_Joubert_Hilleringmann_2021, title={Complementary Inverter Circuits on Flexible Substrates}, DOI={<a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>}, booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Reker, Julia and Meyers, Thorsten and Vidor, Fabio F. and Joubert, Trudi-Heleen and Hilleringmann, Ulrich}, year={2021} }","mla":"Reker, Julia, et al. “Complementary Inverter Circuits on Flexible Substrates.” <i>2021 Smart Systems Integration (SSI)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>.","apa":"Reker, J., Meyers, T., Vidor, F. F., Joubert, T.-H., &#38; Hilleringmann, U. (2021). Complementary Inverter Circuits on Flexible Substrates. <i>2021 Smart Systems Integration (SSI)</i>. <a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">https://doi.org/10.1109/ssi52265.2021.9466966</a>","ieee":"J. Reker, T. Meyers, F. F. Vidor, T.-H. Joubert, and U. Hilleringmann, “Complementary Inverter Circuits on Flexible Substrates,” 2021, doi: <a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>."},"type":"conference","department":[{"_id":"59"}],"date_created":"2023-01-24T10:13:47Z"},{"publication_status":"published","date_updated":"2023-03-23T13:24:52Z","year":"2021","title":"Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics","status":"public","author":[{"last_name":"Reker","first_name":"Julia","full_name":"Reker, Julia"},{"full_name":"Meyers, Thorsten","first_name":"Thorsten","last_name":"Meyers"},{"full_name":"Vidor, Fabio F.","last_name":"Vidor","first_name":"Fabio F."},{"full_name":"Joubert, Trudi-Heleen","first_name":"Trudi-Heleen","last_name":"Joubert"},{"id":"20179","full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich"}],"user_id":"20179","doi":"10.1109/fleps51544.2021.9469764","_id":"39388","publisher":"IEEE","language":[{"iso":"eng"}],"publication":"2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","citation":{"bibtex":"@inproceedings{Reker_Meyers_Vidor_Joubert_Hilleringmann_2021, title={Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics}, DOI={<a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">10.1109/fleps51544.2021.9469764</a>}, booktitle={2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)}, publisher={IEEE}, author={Reker, Julia and Meyers, Thorsten and Vidor, Fabio F. and Joubert, Trudi-Heleen and Hilleringmann, Ulrich}, year={2021} }","ama":"Reker J, Meyers T, Vidor FF, Joubert T-H, Hilleringmann U. Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics. In: <i>2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">10.1109/fleps51544.2021.9469764</a>","mla":"Reker, Julia, et al. “Integration Process for Self-Aligned Sub-Μm Thin-Film Transistors for Flexible Electronics.” <i>2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">10.1109/fleps51544.2021.9469764</a>.","chicago":"Reker, Julia, Thorsten Meyers, Fabio F. Vidor, Trudi-Heleen Joubert, and Ulrich Hilleringmann. “Integration Process for Self-Aligned Sub-Μm Thin-Film Transistors for Flexible Electronics.” In <i>2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">https://doi.org/10.1109/fleps51544.2021.9469764</a>.","short":"J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), IEEE, 2021.","ieee":"J. Reker, T. Meyers, F. F. Vidor, T.-H. Joubert, and U. Hilleringmann, “Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics,” 2021, doi: <a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">10.1109/fleps51544.2021.9469764</a>.","apa":"Reker, J., Meyers, T., Vidor, F. F., Joubert, T.-H., &#38; Hilleringmann, U. (2021). Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics. <i>2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)</i>. <a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">https://doi.org/10.1109/fleps51544.2021.9469764</a>"},"type":"conference","department":[{"_id":"59"}],"date_created":"2023-01-24T10:11:30Z"},{"type":"conference","department":[{"_id":"78"}],"date_created":"2021-12-30T00:02:24Z","project":[{"_id":"3","name":"SFB 901 - B: SFB 901 - Project Area B"},{"_id":"12","name":"SFB 901 - B4: SFB 901 - Subproject B4"},{"_id":"1","name":"SFB 901: SFB 901"}],"publication":"2021 IFIP/IEEE 29th International Conference on Very Large Scale Integration (VLSI-SoC)","citation":{"mla":"Ahmed, Qazi Arbab. “Hardware Trojans in Reconfigurable Computing.” <i>2021 IFIP/IEEE 29th International Conference on Very Large Scale Integration (VLSI-SoC)</i>, 2021, doi:<a href=\"https://doi.org/10.1109/vlsi-soc53125.2021.9606974\">10.1109/vlsi-soc53125.2021.9606974</a>.","bibtex":"@inproceedings{Ahmed_2021, title={Hardware Trojans in Reconfigurable Computing}, DOI={<a href=\"https://doi.org/10.1109/vlsi-soc53125.2021.9606974\">10.1109/vlsi-soc53125.2021.9606974</a>}, booktitle={2021 IFIP/IEEE 29th International Conference on Very Large Scale Integration (VLSI-SoC)}, author={Ahmed, Qazi Arbab}, year={2021} }","ama":"Ahmed QA. Hardware Trojans in Reconfigurable Computing. In: <i>2021 IFIP/IEEE 29th International Conference on Very Large Scale Integration (VLSI-SoC)</i>. ; 2021. doi:<a href=\"https://doi.org/10.1109/vlsi-soc53125.2021.9606974\">10.1109/vlsi-soc53125.2021.9606974</a>","ieee":"Q. A. Ahmed, “Hardware Trojans in Reconfigurable Computing,” 2021, doi: <a href=\"https://doi.org/10.1109/vlsi-soc53125.2021.9606974\">10.1109/vlsi-soc53125.2021.9606974</a>.","apa":"Ahmed, Q. A. (2021). Hardware Trojans in Reconfigurable Computing. <i>2021 IFIP/IEEE 29th International Conference on Very Large Scale Integration (VLSI-SoC)</i>. <a href=\"https://doi.org/10.1109/vlsi-soc53125.2021.9606974\">https://doi.org/10.1109/vlsi-soc53125.2021.9606974</a>","short":"Q.A. Ahmed, in: 2021 IFIP/IEEE 29th International Conference on Very Large Scale Integration (VLSI-SoC), 2021.","chicago":"Ahmed, Qazi Arbab. “Hardware Trojans in Reconfigurable Computing.” In <i>2021 IFIP/IEEE 29th International Conference on Very Large Scale Integration (VLSI-SoC)</i>, 2021. <a href=\"https://doi.org/10.1109/vlsi-soc53125.2021.9606974\">https://doi.org/10.1109/vlsi-soc53125.2021.9606974</a>."},"doi":"10.1109/vlsi-soc53125.2021.9606974","user_id":"72764","language":[{"iso":"eng"}],"_id":"29138","date_updated":"2023-04-19T15:03:45Z","publication_status":"published","status":"public","title":"Hardware Trojans in Reconfigurable Computing","year":"2021","author":[{"id":"72764","full_name":"Ahmed, Qazi Arbab","last_name":"Ahmed","orcid":"0000-0002-1837-2254","first_name":"Qazi Arbab"}]},{"abstract":[{"text":"<jats:p>Zinc oxide nanoparticles (ZnO NP) used for the channel region in inverted coplanar setup in Thin Film Transistors (TFT) were the focus of this study. The regions between the source electrode and the ZnO NP and the drain electrode were under investigation as they produce a Schottky barrier in metal-semiconductor interfaces. A more general Thermionic emission theory must be evaluated: one that considers both metal/semiconductor interfaces (MSM structures). Aluminum, gold, and nickel were used as metallization layers for source and drain electrodes. An organic-inorganic nanocomposite was used as a gate dielectric. The TFTs transfer and output characteristics curves were extracted, and a numerical computational program was used for fitting the data; hence information about Schottky Barrier Height (SBH) and ideality factors for each TFT could be estimated. The nickel metallization appears with the lowest SBH among the metals investigated. For this metal and for higher drain-to-source voltages, the SBH tended to converge to some value around 0.3 eV. The developed fitting method showed good fitting accuracy even when the metallization produced different SBH in each metal-semiconductor interface, as was the case for gold metallization. The Schottky effect is also present and was studied when the drain-to-source voltages and/or the gate voltage were increased.</jats:p>","lang":"eng"}],"issue":"5","publication":"Nanomaterials","department":[{"_id":"59"}],"keyword":["General Materials Science","General Chemical Engineering"],"type":"journal_article","date_created":"2023-01-24T10:08:10Z","intvolume":"        11","publication_status":"published","date_updated":"2023-03-22T10:27:25Z","publication_identifier":{"issn":["2079-4991"]},"author":[{"first_name":"Ivan Rodrigo","last_name":"Kaufmann","full_name":"Kaufmann, Ivan Rodrigo"},{"first_name":"Onur","last_name":"Zerey","full_name":"Zerey, Onur"},{"full_name":"Meyers, Thorsten","first_name":"Thorsten","last_name":"Meyers"},{"first_name":"Julia","last_name":"Reker","full_name":"Reker, Julia"},{"full_name":"Vidor, Fábio","last_name":"Vidor","first_name":"Fábio"},{"id":"20179","last_name":"Hilleringmann","first_name":"Ulrich","full_name":"Hilleringmann, Ulrich"}],"year":"2021","title":"A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application","doi":"10.3390/nano11051188","language":[{"iso":"eng"}],"article_number":"1188","citation":{"bibtex":"@article{Kaufmann_Zerey_Meyers_Reker_Vidor_Hilleringmann_2021, title={A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application}, volume={11}, DOI={<a href=\"https://doi.org/10.3390/nano11051188\">10.3390/nano11051188</a>}, number={51188}, journal={Nanomaterials}, publisher={MDPI AG}, author={Kaufmann, Ivan Rodrigo and Zerey, Onur and Meyers, Thorsten and Reker, Julia and Vidor, Fábio and Hilleringmann, Ulrich}, year={2021} }","ama":"Kaufmann IR, Zerey O, Meyers T, Reker J, Vidor F, Hilleringmann U. A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application. <i>Nanomaterials</i>. 2021;11(5). doi:<a href=\"https://doi.org/10.3390/nano11051188\">10.3390/nano11051188</a>","short":"I.R. Kaufmann, O. Zerey, T. Meyers, J. Reker, F. Vidor, U. Hilleringmann, Nanomaterials 11 (2021).","chicago":"Kaufmann, Ivan Rodrigo, Onur Zerey, Thorsten Meyers, Julia Reker, Fábio Vidor, and Ulrich Hilleringmann. “A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application.” <i>Nanomaterials</i> 11, no. 5 (2021). <a href=\"https://doi.org/10.3390/nano11051188\">https://doi.org/10.3390/nano11051188</a>.","ieee":"I. R. Kaufmann, O. Zerey, T. Meyers, J. Reker, F. Vidor, and U. Hilleringmann, “A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application,” <i>Nanomaterials</i>, vol. 11, no. 5, Art. no. 1188, 2021, doi: <a href=\"https://doi.org/10.3390/nano11051188\">10.3390/nano11051188</a>.","apa":"Kaufmann, I. R., Zerey, O., Meyers, T., Reker, J., Vidor, F., &#38; Hilleringmann, U. (2021). A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application. <i>Nanomaterials</i>, <i>11</i>(5), Article 1188. <a href=\"https://doi.org/10.3390/nano11051188\">https://doi.org/10.3390/nano11051188</a>","mla":"Kaufmann, Ivan Rodrigo, et al. “A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application.” <i>Nanomaterials</i>, vol. 11, no. 5, 1188, MDPI AG, 2021, doi:<a href=\"https://doi.org/10.3390/nano11051188\">10.3390/nano11051188</a>."},"status":"public","volume":11,"user_id":"20179","_id":"39383","publisher":"MDPI AG"},{"publication_status":"published","date_updated":"2023-03-22T10:26:21Z","year":"2021","status":"public","title":"Complementary Inverter Circuits on Flexible Substrates","author":[{"full_name":"Reker, Julia","first_name":"Julia","last_name":"Reker"},{"last_name":"Meyers","first_name":"Thorsten","full_name":"Meyers, Thorsten"},{"full_name":"Vidor, Fabio F.","last_name":"Vidor","first_name":"Fabio F."},{"full_name":"Joubert, Trudi-Heleen","first_name":"Trudi-Heleen","last_name":"Joubert"},{"first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich","id":"20179"}],"user_id":"20179","doi":"10.1109/ssi52265.2021.9466966","_id":"39395","publisher":"IEEE","language":[{"iso":"eng"}],"publication":"2021 Smart Systems Integration (SSI)","citation":{"ieee":"J. Reker, T. Meyers, F. F. Vidor, T.-H. Joubert, and U. Hilleringmann, “Complementary Inverter Circuits on Flexible Substrates,” 2021, doi: <a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>.","apa":"Reker, J., Meyers, T., Vidor, F. F., Joubert, T.-H., &#38; Hilleringmann, U. (2021). Complementary Inverter Circuits on Flexible Substrates. <i>2021 Smart Systems Integration (SSI)</i>. <a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">https://doi.org/10.1109/ssi52265.2021.9466966</a>","short":"J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.","chicago":"Reker, Julia, Thorsten Meyers, Fabio F. Vidor, Trudi-Heleen Joubert, and Ulrich Hilleringmann. “Complementary Inverter Circuits on Flexible Substrates.” In <i>2021 Smart Systems Integration (SSI)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">https://doi.org/10.1109/ssi52265.2021.9466966</a>.","mla":"Reker, Julia, et al. “Complementary Inverter Circuits on Flexible Substrates.” <i>2021 Smart Systems Integration (SSI)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>.","bibtex":"@inproceedings{Reker_Meyers_Vidor_Joubert_Hilleringmann_2021, title={Complementary Inverter Circuits on Flexible Substrates}, DOI={<a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>}, booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Reker, Julia and Meyers, Thorsten and Vidor, Fabio F. and Joubert, Trudi-Heleen and Hilleringmann, Ulrich}, year={2021} }","ama":"Reker J, Meyers T, Vidor FF, Joubert T-H, Hilleringmann U. Complementary Inverter Circuits on Flexible Substrates. In: <i>2021 Smart Systems Integration (SSI)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>"},"type":"conference","department":[{"_id":"59"}],"date_created":"2023-01-24T10:13:36Z"}]