[{"date_updated":"2025-03-16T14:57:43Z","publisher":"Klett","author":[{"first_name":"Volker","last_name":"Garske","id":"162","full_name":"Garske, Volker"}],"date_created":"2025-03-16T14:51:41Z","title":"Vom Walfischkomplex der Unterrichtenden. Überlegungen zum Buch Jona im Religionsunterricht","place":"https:/reli-ethik-blog.de/ (09.04.2024)","year":"2024","citation":{"chicago":"Garske, Volker. <i>Vom Walfischkomplex Der Unterrichtenden. Überlegungen Zum Buch Jona Im Religionsunterricht</i>. https:/reli-ethik-blog.de/ (09.04.2024): Klett, 2024.","ieee":"V. Garske, <i>Vom Walfischkomplex der Unterrichtenden. Überlegungen zum Buch Jona im Religionsunterricht</i>. https:/reli-ethik-blog.de/ (09.04.2024): Klett, 2024.","ama":"Garske V. <i>Vom Walfischkomplex Der Unterrichtenden. Überlegungen Zum Buch Jona Im Religionsunterricht</i>. Klett; 2024.","apa":"Garske, V. (2024). <i>Vom Walfischkomplex der Unterrichtenden. Überlegungen zum Buch Jona im Religionsunterricht</i>. Klett.","short":"V. Garske, Vom Walfischkomplex Der Unterrichtenden. Überlegungen Zum Buch Jona Im Religionsunterricht, Klett, https:/reli-ethik-blog.de/ (09.04.2024), 2024.","mla":"Garske, Volker. <i>Vom Walfischkomplex Der Unterrichtenden. Überlegungen Zum Buch Jona Im Religionsunterricht</i>. Klett, 2024.","bibtex":"@book{Garske_2024, place={https:/reli-ethik-blog.de/ (09.04.2024)}, title={Vom Walfischkomplex der Unterrichtenden. Überlegungen zum Buch Jona im Religionsunterricht}, publisher={Klett}, author={Garske, Volker}, year={2024} }"},"_id":"59049","user_id":"162","department":[{"_id":"36"}],"language":[{"iso":"eng"}],"type":"misc","status":"public"},{"language":[{"iso":"eng"}],"_id":"56782","project":[{"name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}],"department":[{"_id":"59"}],"user_id":"38240","status":"public","publication":"2024 International Symposium on Electromagnetic Compatibility – EMC Europe","type":"conference","title":"A Hybrid Data Generation Approach for the Development of an AI-based EMC Interference Recognition Method","doi":"10.1109/emceurope59828.2024.10722681","conference":{"start_date":"2024-09-02","name":"2024 International Symposium on Electromagnetic Compatibility – EMC Europe","location":"Bruges, Belgium","end_date":"2024-09-05"},"main_file_link":[{"url":"https://ieeexplore.ieee.org/document/10722681"}],"publisher":"IEEE","date_updated":"2025-03-17T12:14:38Z","date_created":"2024-10-29T10:35:08Z","author":[{"first_name":"Sven","id":"38240","full_name":"Lange, Sven","orcid":"0009-0007-9150-2266 ","last_name":"Lange"},{"first_name":"Marcel","full_name":"Olbrich, Marcel","last_name":"Olbrich"},{"first_name":"Dennis","last_name":"Hemker","full_name":"Hemker, Dennis"},{"full_name":"Maalouly, Jad","last_name":"Maalouly","first_name":"Jad"},{"first_name":"Jürgen","last_name":"Kutter","full_name":"Kutter, Jürgen"},{"first_name":"Dominik","last_name":"Schröder","full_name":"Schröder, Dominik"},{"first_name":"Christian","full_name":"Hedayat, Christian","last_name":"Hedayat"},{"first_name":"Michael","last_name":"Kleinen","full_name":"Kleinen, Michael"},{"first_name":"Andreas","last_name":"Grünwaldt","full_name":"Grünwaldt, Andreas"},{"last_name":"Bärenfänger","full_name":"Bärenfänger, Jörg","first_name":"Jörg"},{"first_name":"Harald","last_name":"Mathis","full_name":"Mathis, Harald"},{"first_name":"Harald","last_name":"Kuhn","full_name":"Kuhn, Harald"}],"place":"Bruges, Belgium","year":"2024","citation":{"short":"S. Lange, M. Olbrich, D. Hemker, J. Maalouly, J. Kutter, D. Schröder, C. Hedayat, M. Kleinen, A. Grünwaldt, J. Bärenfänger, H. Mathis, H. 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(2024). A Hybrid Data Generation Approach for the Development of an AI-based EMC Interference Recognition Method. <i>2024 International Symposium on Electromagnetic Compatibility – EMC Europe</i>. 2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Bruges, Belgium. <a href=\"https://doi.org/10.1109/emceurope59828.2024.10722681\">https://doi.org/10.1109/emceurope59828.2024.10722681</a>","ama":"Lange S, Olbrich M, Hemker D, et al. A Hybrid Data Generation Approach for the Development of an AI-based EMC Interference Recognition Method. In: <i>2024 International Symposium on Electromagnetic Compatibility – EMC Europe</i>. 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Lange <i>et al.</i>, “A Hybrid Data Generation Approach for the Development of an AI-based EMC Interference Recognition Method,” presented at the 2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Bruges, Belgium, 2024, doi: <a href=\"https://doi.org/10.1109/emceurope59828.2024.10722681\">10.1109/emceurope59828.2024.10722681</a>."},"publication_status":"published"},{"status":"public","type":"conference","publication":"2024 International Symposium on Electromagnetic Compatibility – EMC Europe","language":[{"iso":"eng"}],"user_id":"38240","department":[{"_id":"59"}],"project":[{"name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}],"_id":"56781","citation":{"short":"J. Maalouly, D. Hemker, S. Lange, M. Olbrich, C. Hedayat, J. Kutter, H. 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Maalouly <i>et al.</i>, “Evaluation of Simulated and Real Measurement Data for AI-based Interference Classification in EMC Applications,” presented at the 2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium , 2024, doi: <a href=\"https://doi.org/10.1109/emceurope59828.2024.10722094\">10.1109/emceurope59828.2024.10722094</a>.","ama":"Maalouly J, Hemker D, Lange S, et al. Evaluation of Simulated and Real Measurement Data for AI-based Interference Classification in EMC Applications. In: <i>2024 International Symposium on Electromagnetic Compatibility – EMC Europe</i>. IEEE; 2024. doi:<a href=\"https://doi.org/10.1109/emceurope59828.2024.10722094\">10.1109/emceurope59828.2024.10722094</a>"},"year":"2024","place":"Brugge, Belgium ","publication_status":"published","main_file_link":[{"url":"https://ieeexplore.ieee.org/document/10722094"}],"doi":"10.1109/emceurope59828.2024.10722094","conference":{"end_date":"2024-09-05","location":"Brugge, Belgium ","name":"2024 International Symposium on Electromagnetic Compatibility – EMC Europe","start_date":"2024-09-02"},"title":"Evaluation of Simulated and Real Measurement Data for AI-based Interference Classification in EMC Applications","author":[{"first_name":"Jad","full_name":"Maalouly, Jad","last_name":"Maalouly"},{"first_name":"Dennis","last_name":"Hemker","full_name":"Hemker, Dennis"},{"first_name":"Sven","id":"38240","full_name":"Lange, Sven","orcid":"0009-0007-9150-2266 ","last_name":"Lange"},{"first_name":"Marcel","full_name":"Olbrich, Marcel","last_name":"Olbrich"},{"first_name":"Christian","full_name":"Hedayat, Christian","last_name":"Hedayat"},{"first_name":"Jürgen","full_name":"Kutter, Jürgen","last_name":"Kutter"},{"first_name":"Harald","full_name":"Mathis, Harald","last_name":"Mathis"}],"date_created":"2024-10-29T10:34:53Z","publisher":"IEEE","date_updated":"2025-03-17T12:14:48Z"},{"doi":"10.1109/ssi63222.2024.10740546","conference":{"name":"2024 Smart Systems Integration Conference and Exhibition (SSI)","start_date":"2024-04-26","end_date":"2024-04-28","location":"Hamburg"},"title":"Enhancing Information Extraction in EMC Measurements through Artificial Intelligence","date_created":"2024-11-06T13:36:01Z","author":[{"last_name":"Stiemer","full_name":"Stiemer, Marcus","first_name":"Marcus"},{"full_name":"Lange, Sven","id":"38240","orcid":"0009-0007-9150-2266 ","last_name":"Lange","first_name":"Sven"},{"first_name":"Dominik","full_name":"Schröder, Dominik","last_name":"Schröder"},{"first_name":"Christian","last_name":"Hedayat","full_name":"Hedayat, Christian"},{"first_name":"Jad","full_name":"Maalouly, Jad","last_name":"Maalouly"},{"last_name":"Hemker","full_name":"Hemker, Dennis","first_name":"Dennis"},{"last_name":"Mathis","full_name":"Mathis, Harald","first_name":"Harald"}],"date_updated":"2025-03-17T12:14:22Z","publisher":"IEEE","citation":{"mla":"Stiemer, Marcus, et al. “Enhancing Information Extraction in EMC Measurements through Artificial Intelligence.” <i>2024 Smart Systems Integration Conference and Exhibition (SSI)</i>, IEEE, 2024, doi:<a href=\"https://doi.org/10.1109/ssi63222.2024.10740546\">10.1109/ssi63222.2024.10740546</a>.","short":"M. Stiemer, S. Lange, D. Schröder, C. Hedayat, J. Maalouly, D. Hemker, H. Mathis, in: 2024 Smart Systems Integration Conference and Exhibition (SSI), IEEE, Hamburg, 2024.","bibtex":"@inproceedings{Stiemer_Lange_Schröder_Hedayat_Maalouly_Hemker_Mathis_2024, place={Hamburg}, title={Enhancing Information Extraction in EMC Measurements through Artificial Intelligence}, DOI={<a href=\"https://doi.org/10.1109/ssi63222.2024.10740546\">10.1109/ssi63222.2024.10740546</a>}, booktitle={2024 Smart Systems Integration Conference and Exhibition (SSI)}, publisher={IEEE}, author={Stiemer, Marcus and Lange, Sven and Schröder, Dominik and Hedayat, Christian and Maalouly, Jad and Hemker, Dennis and Mathis, Harald}, year={2024} }","apa":"Stiemer, M., Lange, S., Schröder, D., Hedayat, C., Maalouly, J., Hemker, D., &#38; Mathis, H. (2024). Enhancing Information Extraction in EMC Measurements through Artificial Intelligence. <i>2024 Smart Systems Integration Conference and Exhibition (SSI)</i>. 2024 Smart Systems Integration Conference and Exhibition (SSI), Hamburg. <a href=\"https://doi.org/10.1109/ssi63222.2024.10740546\">https://doi.org/10.1109/ssi63222.2024.10740546</a>","ama":"Stiemer M, Lange S, Schröder D, et al. Enhancing Information Extraction in EMC Measurements through Artificial Intelligence. In: <i>2024 Smart Systems Integration Conference and Exhibition (SSI)</i>. IEEE; 2024. doi:<a href=\"https://doi.org/10.1109/ssi63222.2024.10740546\">10.1109/ssi63222.2024.10740546</a>","ieee":"M. Stiemer <i>et al.</i>, “Enhancing Information Extraction in EMC Measurements through Artificial Intelligence,” presented at the 2024 Smart Systems Integration Conference and Exhibition (SSI), Hamburg, 2024, doi: <a href=\"https://doi.org/10.1109/ssi63222.2024.10740546\">10.1109/ssi63222.2024.10740546</a>.","chicago":"Stiemer, Marcus, Sven Lange, Dominik Schröder, Christian Hedayat, Jad Maalouly, Dennis Hemker, and Harald Mathis. “Enhancing Information Extraction in EMC Measurements through Artificial Intelligence.” In <i>2024 Smart Systems Integration Conference and Exhibition (SSI)</i>. Hamburg: IEEE, 2024. <a href=\"https://doi.org/10.1109/ssi63222.2024.10740546\">https://doi.org/10.1109/ssi63222.2024.10740546</a>."},"place":"Hamburg","year":"2024","publication_status":"published","language":[{"iso":"eng"}],"user_id":"38240","department":[{"_id":"59"}],"project":[{"name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}],"_id":"56924","status":"public","type":"conference","publication":"2024 Smart Systems Integration Conference and Exhibition (SSI)"},{"publication":"Advances in Radio Science","type":"journal_article","status":"public","_id":"57499","project":[{"_id":"52","name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing"}],"department":[{"_id":"59"},{"_id":"485"}],"user_id":"38240","language":[{"iso":"eng"}],"publication_status":"published","year":"2024","page":"53–59","intvolume":"        22","citation":{"ama":"Maalouly J, Hemker D, Hedayat C, Olbrich M, Lange S, Mathis H. Using Autoencoders to Classify EMC Problems in Electronic System Development. <i>Advances in Radio Science</i>. 2024;22:53–59. doi:<a href=\"https://doi.org/10.5194/ars-22-53-2024\">10.5194/ars-22-53-2024</a>","ieee":"J. Maalouly, D. Hemker, C. Hedayat, M. Olbrich, S. Lange, and H. Mathis, “Using Autoencoders to Classify EMC Problems in Electronic System Development,” <i>Advances in Radio Science</i>, vol. 22, pp. 53–59, 2024, doi: <a href=\"https://doi.org/10.5194/ars-22-53-2024\">10.5194/ars-22-53-2024</a>.","chicago":"Maalouly, J., D. Hemker, C. Hedayat, M. Olbrich, Sven Lange, and H. Mathis. “Using Autoencoders to Classify EMC Problems in Electronic System Development.” <i>Advances in Radio Science</i> 22 (2024): 53–59. <a href=\"https://doi.org/10.5194/ars-22-53-2024\">https://doi.org/10.5194/ars-22-53-2024</a>.","short":"J. Maalouly, D. Hemker, C. Hedayat, M. Olbrich, S. Lange, H. Mathis, Advances in Radio Science 22 (2024) 53–59.","mla":"Maalouly, J., et al. “Using Autoencoders to Classify EMC Problems in Electronic System Development.” <i>Advances in Radio Science</i>, vol. 22, 2024, pp. 53–59, doi:<a href=\"https://doi.org/10.5194/ars-22-53-2024\">10.5194/ars-22-53-2024</a>.","bibtex":"@article{Maalouly_Hemker_Hedayat_Olbrich_Lange_Mathis_2024, title={Using Autoencoders to Classify EMC Problems in Electronic System Development}, volume={22}, DOI={<a href=\"https://doi.org/10.5194/ars-22-53-2024\">10.5194/ars-22-53-2024</a>}, journal={Advances in Radio Science}, author={Maalouly, J. and Hemker, D. and Hedayat, C. and Olbrich, M. and Lange, Sven and Mathis, H.}, year={2024}, pages={53–59} }","apa":"Maalouly, J., Hemker, D., Hedayat, C., Olbrich, M., Lange, S., &#38; Mathis, H. (2024). Using Autoencoders to Classify EMC Problems in Electronic System Development. <i>Advances in Radio Science</i>, <i>22</i>, 53–59. <a href=\"https://doi.org/10.5194/ars-22-53-2024\">https://doi.org/10.5194/ars-22-53-2024</a>"},"date_updated":"2025-03-17T12:13:32Z","volume":22,"date_created":"2024-11-29T10:05:47Z","author":[{"last_name":"Maalouly","full_name":"Maalouly, J.","first_name":"J."},{"last_name":"Hemker","full_name":"Hemker, D.","first_name":"D."},{"last_name":"Hedayat","full_name":"Hedayat, C.","first_name":"C."},{"first_name":"M.","last_name":"Olbrich","full_name":"Olbrich, M."},{"last_name":"Lange","orcid":"0009-0007-9150-2266 ","id":"38240","full_name":"Lange, Sven","first_name":"Sven"},{"full_name":"Mathis, H.","last_name":"Mathis","first_name":"H."}],"title":"Using Autoencoders to Classify EMC Problems in Electronic System Development","doi":"10.5194/ars-22-53-2024","conference":{"end_date":"2023-09-28","location":"Miltenberg","name":"Kleinheubacher Berichte 2023","start_date":"2023-09-26"},"main_file_link":[{"url":"https://ars.copernicus.org/articles/22/53/2024/"}]},{"citation":{"ama":"Giese H, Lynch D, Schulz KA, Sureth-Sloane C. <i>The Effects of Tax Reform on Labor Demand within Tax Departments</i>.; 2024. doi:<a href=\"https://dx.doi.org/10.2139/ssrn.5068550\">https://dx.doi.org/10.2139/ssrn.5068550</a>","ieee":"H. Giese, D. Lynch, K. A. Schulz, and C. Sureth-Sloane, <i>The Effects of Tax Reform on Labor Demand within Tax Departments</i>. 2024.","chicago":"Giese, Henning, Dan Lynch, Kim Alina Schulz, and Caren Sureth-Sloane. <i>The Effects of Tax Reform on Labor Demand within Tax Departments</i>. TRR 266 Accounting for Transparency Working Paper Series No. 171, 2024. <a href=\"https://dx.doi.org/10.2139/ssrn.5068550\">https://dx.doi.org/10.2139/ssrn.5068550</a>.","mla":"Giese, Henning, et al. <i>The Effects of Tax Reform on Labor Demand within Tax Departments</i>. 2024, doi:<a href=\"https://dx.doi.org/10.2139/ssrn.5068550\">https://dx.doi.org/10.2139/ssrn.5068550</a>.","bibtex":"@book{Giese_Lynch_Schulz_Sureth-Sloane_2024, series={TRR 266 Accounting for Transparency Working Paper Series No. 171}, title={The Effects of Tax Reform on Labor Demand within Tax Departments}, DOI={<a href=\"https://dx.doi.org/10.2139/ssrn.5068550\">https://dx.doi.org/10.2139/ssrn.5068550</a>}, author={Giese, Henning and Lynch, Dan and Schulz, Kim Alina and Sureth-Sloane, Caren}, year={2024}, collection={TRR 266 Accounting for Transparency Working Paper Series No. 171} }","short":"H. Giese, D. Lynch, K.A. Schulz, C. Sureth-Sloane, The Effects of Tax Reform on Labor Demand within Tax Departments, 2024.","apa":"Giese, H., Lynch, D., Schulz, K. A., &#38; Sureth-Sloane, C. (2024). <i>The Effects of Tax Reform on Labor Demand within Tax Departments</i>. <a href=\"https://dx.doi.org/10.2139/ssrn.5068550\">https://dx.doi.org/10.2139/ssrn.5068550</a>"},"year":"2024","doi":"https://dx.doi.org/10.2139/ssrn.5068550","main_file_link":[{"open_access":"1","url":"https://ssrn.com/abstract=5068550"}],"title":"The Effects of Tax Reform on Labor Demand within Tax Departments","author":[{"first_name":"Henning","full_name":"Giese, Henning","id":"92812","last_name":"Giese"},{"last_name":"Lynch","full_name":"Lynch, Dan","first_name":"Dan"},{"first_name":"Kim Alina","last_name":"Schulz","id":"68607","full_name":"Schulz, Kim Alina"},{"first_name":"Caren","last_name":"Sureth-Sloane","orcid":" 0000-0002-8183-5901","full_name":"Sureth-Sloane, Caren","id":"530"}],"date_created":"2025-01-03T11:35:10Z","oa":"1","date_updated":"2025-03-18T13:31:37Z","status":"public","abstract":[{"lang":"eng","text":"This study examines the effect of major tax reform on firms’ demand for internal tax department employees. Specifically, we analyze the effects of the Tax Cuts and Jobs Act (TCJA) on the number of job postings and skill profiles for tax department positions in large U.S. firms. Understanding how tax reform affects the demand for tax employees is important for quantifying potential compliance costs and assessing how firms adjust their tax planning capacity in response to new regulations. Additionally, our findings provide insights into the evolving skill sets required in the context of technological change and intensifying competition for talent. To address our research question, we employ textual analyses and machine learning techniques to identify and classify approximately 30,000 tax-related job postings from 1,620 firms over the period of 2015-2020. Using a difference-in-differences research design, we find a 26.7% increase in the number of tax-related job postings in the three years following the TCJA enactment. This translates into approximately 1.5 new tax department employees, which, based on prior literature estimates of tax department size, implies a 21% increase in the size of the average tax department. Focusing on the dynamics, we find that this effect is concentrated in the second year after the reform. Consistent with increased compliance costs and new tax planning opportunities, we also find that firms seek tax department employees for both compliance and planning roles, with some evidence of greater demand for employees focused on tax compliance."}],"type":"working_paper","language":[{"iso":"eng"}],"department":[{"_id":"187"}],"user_id":"68607","series_title":"TRR 266 Accounting for Transparency Working Paper Series No. 171","_id":"57902","project":[{"name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}]},{"_id":"59074","department":[{"_id":"34"},{"_id":"7"},{"_id":"75"}],"user_id":"102868","article_number":"110952","language":[{"iso":"eng"}],"publication":"Computer Networks","type":"journal_article","status":"public","date_updated":"2025-03-21T07:16:37Z","publisher":"Elsevier BV","volume":257,"author":[{"first_name":"Jiahai","full_name":"Hu, Jiahai","last_name":"Hu"},{"first_name":"Lin","last_name":"Wang","full_name":"Wang, Lin"},{"first_name":"Jing","last_name":"Wu","full_name":"Wu, Jing"},{"last_name":"Pei","full_name":"Pei, Qiangyu","first_name":"Qiangyu"},{"full_name":"Liu, Fangming","last_name":"Liu","first_name":"Fangming"},{"first_name":"Bo","last_name":"Li","full_name":"Li, Bo"}],"date_created":"2025-03-21T07:15:20Z","title":"A Comparative Measurement Study of Cross-Layer 5G Performance Under Different Mobility Scenarios","doi":"10.1016/j.comnet.2024.110952","publication_identifier":{"issn":["1389-1286"]},"publication_status":"published","year":"2024","intvolume":"       257","citation":{"chicago":"Hu, Jiahai, Lin Wang, Jing Wu, Qiangyu Pei, Fangming Liu, and Bo Li. “A Comparative Measurement Study of Cross-Layer 5G Performance Under Different Mobility Scenarios.” <i>Computer Networks</i> 257 (2024). <a href=\"https://doi.org/10.1016/j.comnet.2024.110952\">https://doi.org/10.1016/j.comnet.2024.110952</a>.","ieee":"J. Hu, L. Wang, J. Wu, Q. Pei, F. Liu, and B. Li, “A Comparative Measurement Study of Cross-Layer 5G Performance Under Different Mobility Scenarios,” <i>Computer Networks</i>, vol. 257, Art. no. 110952, 2024, doi: <a href=\"https://doi.org/10.1016/j.comnet.2024.110952\">10.1016/j.comnet.2024.110952</a>.","ama":"Hu J, Wang L, Wu J, Pei Q, Liu F, Li B. A Comparative Measurement Study of Cross-Layer 5G Performance Under Different Mobility Scenarios. <i>Computer Networks</i>. 2024;257. doi:<a href=\"https://doi.org/10.1016/j.comnet.2024.110952\">10.1016/j.comnet.2024.110952</a>","apa":"Hu, J., Wang, L., Wu, J., Pei, Q., Liu, F., &#38; Li, B. (2024). A Comparative Measurement Study of Cross-Layer 5G Performance Under Different Mobility Scenarios. <i>Computer Networks</i>, <i>257</i>, Article 110952. <a href=\"https://doi.org/10.1016/j.comnet.2024.110952\">https://doi.org/10.1016/j.comnet.2024.110952</a>","short":"J. Hu, L. Wang, J. Wu, Q. Pei, F. Liu, B. Li, Computer Networks 257 (2024).","bibtex":"@article{Hu_Wang_Wu_Pei_Liu_Li_2024, title={A Comparative Measurement Study of Cross-Layer 5G Performance Under Different Mobility Scenarios}, volume={257}, DOI={<a href=\"https://doi.org/10.1016/j.comnet.2024.110952\">10.1016/j.comnet.2024.110952</a>}, number={110952}, journal={Computer Networks}, publisher={Elsevier BV}, author={Hu, Jiahai and Wang, Lin and Wu, Jing and Pei, Qiangyu and Liu, Fangming and Li, Bo}, year={2024} }","mla":"Hu, Jiahai, et al. “A Comparative Measurement Study of Cross-Layer 5G Performance Under Different Mobility Scenarios.” <i>Computer Networks</i>, vol. 257, 110952, Elsevier BV, 2024, doi:<a href=\"https://doi.org/10.1016/j.comnet.2024.110952\">10.1016/j.comnet.2024.110952</a>."}},{"department":[{"_id":"58"}],"user_id":"44271","_id":"59071","project":[{"_id":"298","name":"FOR 2863: Metrologie für die THz Kommunikation (Meteracom)","grant_number":"403579441"},{"grant_number":"403579441","name":"FOR 2863 - Ultrabreitbandige Abtastung","_id":"308"},{"name":"PACE: SPP 2111 - Ultrabreitbandiger Photonisch-Elektronischer Analog-Digital-Wandler (PACE) - Phase 2","_id":"303","grant_number":"403188360"}],"language":[{"iso":"eng"}],"type":"misc","status":"public","date_created":"2025-03-19T16:05:18Z","author":[{"full_name":"Weizel, Maxim","id":"44271","orcid":"0000-0003-2699-9839","last_name":"Weizel","first_name":"Maxim"},{"first_name":"J. Christoph","full_name":"Scheytt, J. Christoph","id":"37144","last_name":"Scheytt","orcid":"0000-0002-5950-6618 "}],"date_updated":"2025-03-19T16:25:10Z","publisher":"Zenodo","doi":"10.5281/ZENODO.14990093","title":"Photonically Assisted Sampling Circuits","citation":{"ieee":"M. Weizel and J. C. Scheytt, <i>Photonically Assisted Sampling Circuits</i>. Workshop GeMiC 2024 Duisburg: Zenodo, 2024.","chicago":"Weizel, Maxim, and J. Christoph Scheytt. <i>Photonically Assisted Sampling Circuits</i>. Workshop GeMiC 2024 Duisburg: Zenodo, 2024. <a href=\"https://doi.org/10.5281/ZENODO.14990093\">https://doi.org/10.5281/ZENODO.14990093</a>.","ama":"Weizel M, Scheytt JC. <i>Photonically Assisted Sampling Circuits</i>. Zenodo; 2024. doi:<a href=\"https://doi.org/10.5281/ZENODO.14990093\">10.5281/ZENODO.14990093</a>","short":"M. Weizel, J.C. Scheytt, Photonically Assisted Sampling Circuits, Zenodo, Workshop GeMiC 2024 Duisburg, 2024.","mla":"Weizel, Maxim, and J. Christoph Scheytt. <i>Photonically Assisted Sampling Circuits</i>. Zenodo, 2024, doi:<a href=\"https://doi.org/10.5281/ZENODO.14990093\">10.5281/ZENODO.14990093</a>.","bibtex":"@book{Weizel_Scheytt_2024, place={Workshop GeMiC 2024 Duisburg}, title={Photonically Assisted Sampling Circuits}, DOI={<a href=\"https://doi.org/10.5281/ZENODO.14990093\">10.5281/ZENODO.14990093</a>}, publisher={Zenodo}, author={Weizel, Maxim and Scheytt, J. Christoph}, year={2024} }","apa":"Weizel, M., &#38; Scheytt, J. C. (2024). <i>Photonically Assisted Sampling Circuits</i>. Zenodo. <a href=\"https://doi.org/10.5281/ZENODO.14990093\">https://doi.org/10.5281/ZENODO.14990093</a>"},"place":"Workshop GeMiC 2024 Duisburg","year":"2024"},{"publication":"Journal of Luminescence","type":"journal_article","status":"public","_id":"58381","department":[{"_id":"149"},{"_id":"321"},{"_id":"9"}],"user_id":"49504","article_number":"120948","language":[{"iso":"eng"}],"publication_identifier":{"issn":["0022-2313"]},"publication_status":"published","year":"2024","intvolume":"       277","citation":{"ieee":"K. Suresh <i>et al.</i>, “Stokes and anti-Stokes emission characteristics of Er3+/Yb3+ co-doped zinc tellurite glasses under 377 and 1550 nm excitations for solar energy conversion application,” <i>Journal of Luminescence</i>, vol. 277, Art. no. 120948, 2024, doi: <a href=\"https://doi.org/10.1016/j.jlumin.2024.120948\">10.1016/j.jlumin.2024.120948</a>.","chicago":"Suresh, Keenatampalle, C.R. Kesavulu, Deviprasad Chalicheemalapalli Jayasankar, Wisanu Pecharapa, Upendra Kumar Kagola, Thomas Tröster, and C.K. Jayasankar. “Stokes and Anti-Stokes Emission Characteristics of Er3+/Yb3+ Co-Doped Zinc Tellurite Glasses under 377 and 1550 Nm Excitations for Solar Energy Conversion Application.” <i>Journal of Luminescence</i> 277 (2024). <a href=\"https://doi.org/10.1016/j.jlumin.2024.120948\">https://doi.org/10.1016/j.jlumin.2024.120948</a>.","ama":"Suresh K, Kesavulu CR, Chalicheemalapalli Jayasankar D, et al. Stokes and anti-Stokes emission characteristics of Er3+/Yb3+ co-doped zinc tellurite glasses under 377 and 1550 nm excitations for solar energy conversion application. <i>Journal of Luminescence</i>. 2024;277. doi:<a href=\"https://doi.org/10.1016/j.jlumin.2024.120948\">10.1016/j.jlumin.2024.120948</a>","mla":"Suresh, Keenatampalle, et al. “Stokes and Anti-Stokes Emission Characteristics of Er3+/Yb3+ Co-Doped Zinc Tellurite Glasses under 377 and 1550 Nm Excitations for Solar Energy Conversion Application.” <i>Journal of Luminescence</i>, vol. 277, 120948, Elsevier BV, 2024, doi:<a href=\"https://doi.org/10.1016/j.jlumin.2024.120948\">10.1016/j.jlumin.2024.120948</a>.","bibtex":"@article{Suresh_Kesavulu_Chalicheemalapalli Jayasankar_Pecharapa_Kagola_Tröster_Jayasankar_2024, title={Stokes and anti-Stokes emission characteristics of Er3+/Yb3+ co-doped zinc tellurite glasses under 377 and 1550 nm excitations for solar energy conversion application}, volume={277}, DOI={<a href=\"https://doi.org/10.1016/j.jlumin.2024.120948\">10.1016/j.jlumin.2024.120948</a>}, number={120948}, journal={Journal of Luminescence}, publisher={Elsevier BV}, author={Suresh, Keenatampalle and Kesavulu, C.R. and Chalicheemalapalli Jayasankar, Deviprasad and Pecharapa, Wisanu and Kagola, Upendra Kumar and Tröster, Thomas and Jayasankar, C.K.}, year={2024} }","short":"K. Suresh, C.R. Kesavulu, D. Chalicheemalapalli Jayasankar, W. Pecharapa, U.K. Kagola, T. Tröster, C.K. Jayasankar, Journal of Luminescence 277 (2024).","apa":"Suresh, K., Kesavulu, C. R., Chalicheemalapalli Jayasankar, D., Pecharapa, W., Kagola, U. K., Tröster, T., &#38; Jayasankar, C. K. (2024). Stokes and anti-Stokes emission characteristics of Er3+/Yb3+ co-doped zinc tellurite glasses under 377 and 1550 nm excitations for solar energy conversion application. <i>Journal of Luminescence</i>, <i>277</i>, Article 120948. <a href=\"https://doi.org/10.1016/j.jlumin.2024.120948\">https://doi.org/10.1016/j.jlumin.2024.120948</a>"},"date_updated":"2025-03-25T14:05:08Z","publisher":"Elsevier BV","volume":277,"date_created":"2025-01-28T08:36:00Z","author":[{"full_name":"Suresh, Keenatampalle","last_name":"Suresh","first_name":"Keenatampalle"},{"first_name":"C.R.","last_name":"Kesavulu","full_name":"Kesavulu, C.R."},{"id":"49504","full_name":"Chalicheemalapalli Jayasankar, Deviprasad","orcid":"https://orcid.org/ 0000-0002-3446-2444","last_name":"Chalicheemalapalli Jayasankar","first_name":"Deviprasad"},{"last_name":"Pecharapa","full_name":"Pecharapa, Wisanu","first_name":"Wisanu"},{"full_name":"Kagola, Upendra Kumar","last_name":"Kagola","first_name":"Upendra Kumar"},{"id":"553","full_name":"Tröster, Thomas","last_name":"Tröster","first_name":"Thomas"},{"full_name":"Jayasankar, C.K.","last_name":"Jayasankar","first_name":"C.K."}],"title":"Stokes and anti-Stokes emission characteristics of Er3+/Yb3+ co-doped zinc tellurite glasses under 377 and 1550 nm excitations for solar energy conversion application","doi":"10.1016/j.jlumin.2024.120948"},{"doi":"10.1016/j.chphi.2024.100797","title":"Optical and photoluminescence characteristics of Pr3+-doped P2O5 +BaO+La2O3 glasses","volume":10,"date_created":"2025-01-28T08:35:08Z","author":[{"first_name":"C.R.","full_name":"Kesavulu, C.R.","last_name":"Kesavulu"},{"first_name":"Ch.","full_name":"Basavapoornima, Ch.","last_name":"Basavapoornima"},{"full_name":"Ramprasad, Pikkili","last_name":"Ramprasad","first_name":"Pikkili"},{"id":"49504","full_name":"Chalicheemalapalli Jayasankar, Deviprasad","orcid":"https://orcid.org/ 0000-0002-3446-2444","last_name":"Chalicheemalapalli Jayasankar","first_name":"Deviprasad"},{"last_name":"Depuru","full_name":"Depuru, Shobha Rani","first_name":"Shobha Rani"},{"last_name":"Jayasankar","full_name":"Jayasankar, C.K.","first_name":"C.K."}],"date_updated":"2025-03-25T14:05:37Z","publisher":"Elsevier BV","intvolume":"        10","citation":{"ama":"Kesavulu CR, Basavapoornima Ch, Ramprasad P, Chalicheemalapalli Jayasankar D, Depuru SR, Jayasankar CK. Optical and photoluminescence characteristics of Pr3+-doped P2O5 +BaO+La2O3 glasses. <i>Chemical Physics Impact</i>. 2024;10. doi:<a href=\"https://doi.org/10.1016/j.chphi.2024.100797\">10.1016/j.chphi.2024.100797</a>","chicago":"Kesavulu, C.R., Ch. Basavapoornima, Pikkili Ramprasad, Deviprasad Chalicheemalapalli Jayasankar, Shobha Rani Depuru, and C.K. Jayasankar. “Optical and Photoluminescence Characteristics of Pr3+-Doped P2O5 +BaO+La2O3 Glasses.” <i>Chemical Physics Impact</i> 10 (2024). <a href=\"https://doi.org/10.1016/j.chphi.2024.100797\">https://doi.org/10.1016/j.chphi.2024.100797</a>.","ieee":"C. R. Kesavulu, Ch. Basavapoornima, P. Ramprasad, D. Chalicheemalapalli Jayasankar, S. R. Depuru, and C. K. Jayasankar, “Optical and photoluminescence characteristics of Pr3+-doped P2O5 +BaO+La2O3 glasses,” <i>Chemical Physics Impact</i>, vol. 10, Art. no. 100797, 2024, doi: <a href=\"https://doi.org/10.1016/j.chphi.2024.100797\">10.1016/j.chphi.2024.100797</a>.","short":"C.R. Kesavulu, Ch. Basavapoornima, P. Ramprasad, D. Chalicheemalapalli Jayasankar, S.R. Depuru, C.K. Jayasankar, Chemical Physics Impact 10 (2024).","bibtex":"@article{Kesavulu_Basavapoornima_Ramprasad_Chalicheemalapalli Jayasankar_Depuru_Jayasankar_2024, title={Optical and photoluminescence characteristics of Pr3+-doped P2O5 +BaO+La2O3 glasses}, volume={10}, DOI={<a href=\"https://doi.org/10.1016/j.chphi.2024.100797\">10.1016/j.chphi.2024.100797</a>}, number={100797}, journal={Chemical Physics Impact}, publisher={Elsevier BV}, author={Kesavulu, C.R. and Basavapoornima, Ch. and Ramprasad, Pikkili and Chalicheemalapalli Jayasankar, Deviprasad and Depuru, Shobha Rani and Jayasankar, C.K.}, year={2024} }","mla":"Kesavulu, C. R., et al. “Optical and Photoluminescence Characteristics of Pr3+-Doped P2O5 +BaO+La2O3 Glasses.” <i>Chemical Physics Impact</i>, vol. 10, 100797, Elsevier BV, 2024, doi:<a href=\"https://doi.org/10.1016/j.chphi.2024.100797\">10.1016/j.chphi.2024.100797</a>.","apa":"Kesavulu, C. R., Basavapoornima, Ch., Ramprasad, P., Chalicheemalapalli Jayasankar, D., Depuru, S. R., &#38; Jayasankar, C. K. (2024). Optical and photoluminescence characteristics of Pr3+-doped P2O5 +BaO+La2O3 glasses. <i>Chemical Physics Impact</i>, <i>10</i>, Article 100797. <a href=\"https://doi.org/10.1016/j.chphi.2024.100797\">https://doi.org/10.1016/j.chphi.2024.100797</a>"},"year":"2024","publication_identifier":{"issn":["2667-0224"]},"publication_status":"published","language":[{"iso":"eng"}],"article_number":"100797","department":[{"_id":"149"},{"_id":"321"},{"_id":"9"}],"user_id":"49504","_id":"58380","status":"public","publication":"Chemical Physics Impact","type":"journal_article"},{"user_id":"97359","department":[{"_id":"101"}],"_id":"59171","file_date_updated":"2025-03-27T10:19:48Z","type":"journal_article","status":"public","author":[{"first_name":"Sören","id":"97359","full_name":"von der Gracht, Sören","last_name":"von der Gracht","orcid":"0000-0002-8054-2058"},{"first_name":"Eddie","last_name":"Nijholt","full_name":"Nijholt, Eddie"},{"last_name":"Rink","full_name":"Rink, Bob","first_name":"Bob"}],"volume":480,"oa":"1","date_updated":"2025-03-27T10:19:56Z","doi":"10.1098/rspa.2023.0945","publication_status":"published","publication_identifier":{"issn":["1364-5021","1471-2946"]},"has_accepted_license":"1","citation":{"ieee":"S. von der Gracht, E. Nijholt, and B. Rink, “Higher-order interactions lead to ‘reluctant’ synchrony breaking,” <i>Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences</i>, vol. 480, no. 2301, 2024, doi: <a href=\"https://doi.org/10.1098/rspa.2023.0945\">10.1098/rspa.2023.0945</a>.","chicago":"Gracht, Sören von der, Eddie Nijholt, and Bob Rink. “Higher-Order Interactions Lead to ‘Reluctant’ Synchrony Breaking.” <i>Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences</i> 480, no. 2301 (2024). <a href=\"https://doi.org/10.1098/rspa.2023.0945\">https://doi.org/10.1098/rspa.2023.0945</a>.","ama":"von der Gracht S, Nijholt E, Rink B. Higher-order interactions lead to ‘reluctant’ synchrony breaking. <i>Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences</i>. 2024;480(2301). doi:<a href=\"https://doi.org/10.1098/rspa.2023.0945\">10.1098/rspa.2023.0945</a>","short":"S. von der Gracht, E. Nijholt, B. Rink, Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences 480 (2024).","mla":"von der Gracht, Sören, et al. “Higher-Order Interactions Lead to ‘Reluctant’ Synchrony Breaking.” <i>Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences</i>, vol. 480, no. 2301, The Royal Society, 2024, doi:<a href=\"https://doi.org/10.1098/rspa.2023.0945\">10.1098/rspa.2023.0945</a>.","bibtex":"@article{von der Gracht_Nijholt_Rink_2024, title={Higher-order interactions lead to ‘reluctant’ synchrony breaking}, volume={480}, DOI={<a href=\"https://doi.org/10.1098/rspa.2023.0945\">10.1098/rspa.2023.0945</a>}, number={2301}, journal={Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences}, publisher={The Royal Society}, author={von der Gracht, Sören and Nijholt, Eddie and Rink, Bob}, year={2024} }","apa":"von der Gracht, S., Nijholt, E., &#38; Rink, B. (2024). Higher-order interactions lead to ‘reluctant’ synchrony breaking. <i>Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences</i>, <i>480</i>(2301). <a href=\"https://doi.org/10.1098/rspa.2023.0945\">https://doi.org/10.1098/rspa.2023.0945</a>"},"intvolume":"       480","language":[{"iso":"eng"}],"ddc":["510"],"keyword":["higher-order interactions","synchrony breaking","network dynamics","coupled cell systems"],"publication":"Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences","file":[{"file_id":"59172","access_level":"open_access","file_name":"higher-order-interactions-lead-to-reluctant-synchrony-breaking.pdf","file_size":820435,"creator":"svdg","date_created":"2025-03-27T10:16:20Z","date_updated":"2025-03-27T10:19:48Z","relation":"main_file","content_type":"application/pdf"}],"abstract":[{"lang":"eng","text":"To model dynamical systems on networks with higher-order (non-pairwise) interactions, we recently introduced a new class of ordinary differential equations (ODEs) on hypernetworks. Here, we consider one-parameter synchrony breaking bifurcations in such ODEs. We call a synchrony breaking steady-state branch ‘reluctant’ if it is tangent to a synchrony space, but does not lie inside it. We prove that reluctant synchrony breaking is ubiquitous in hypernetwork systems, by constructing a large class of examples that support it. We also give an explicit formula for the order of tangency to the synchrony space of a reluctant steady-state branch."}],"date_created":"2025-03-27T10:15:06Z","publisher":"The Royal Society","title":"Higher-order interactions lead to ‘reluctant’ synchrony breaking","issue":"2301","year":"2024"},{"place":"Lippstadt","year":"2024","citation":{"short":"E. Moritzer, P.L. Völklein, in: DVS Sitzung FA11 - Kunststofffügen, DVS, Lippstadt, 2024.","bibtex":"@inproceedings{Moritzer_Völklein_2024, place={Lippstadt}, title={Praxisrelevante Aspekte des Stempelnietens für Organoblech-Metall-Hybridverbindungen}, booktitle={DVS Sitzung FA11 - Kunststofffügen}, publisher={DVS}, author={Moritzer, Elmar and Völklein, Paul Leonhard}, year={2024} }","mla":"Moritzer, Elmar, and Paul Leonhard Völklein. “Praxisrelevante Aspekte Des Stempelnietens Für Organoblech-Metall-Hybridverbindungen.” <i>DVS Sitzung FA11 - Kunststofffügen</i>, DVS, 2024.","apa":"Moritzer, E., &#38; Völklein, P. L. (2024). Praxisrelevante Aspekte des Stempelnietens für Organoblech-Metall-Hybridverbindungen. <i>DVS Sitzung FA11 - Kunststofffügen</i>.","ama":"Moritzer E, Völklein PL. Praxisrelevante Aspekte des Stempelnietens für Organoblech-Metall-Hybridverbindungen. In: <i>DVS Sitzung FA11 - Kunststofffügen</i>. DVS; 2024.","chicago":"Moritzer, Elmar, and Paul Leonhard Völklein. “Praxisrelevante Aspekte Des Stempelnietens Für Organoblech-Metall-Hybridverbindungen.” In <i>DVS Sitzung FA11 - Kunststofffügen</i>. Lippstadt: DVS, 2024.","ieee":"E. Moritzer and P. L. Völklein, “Praxisrelevante Aspekte des Stempelnietens für Organoblech-Metall-Hybridverbindungen,” 2024."},"publisher":"DVS","date_updated":"2025-03-27T10:34:17Z","date_created":"2025-03-26T15:57:52Z","author":[{"first_name":"Elmar","last_name":"Moritzer","full_name":"Moritzer, Elmar","id":"20531"},{"first_name":"Paul Leonhard","last_name":"Völklein","id":"40735","full_name":"Völklein, Paul Leonhard"}],"title":"Praxisrelevante Aspekte des Stempelnietens für Organoblech-Metall-Hybridverbindungen","publication":"DVS Sitzung FA11 - Kunststofffügen","type":"conference_abstract","status":"public","_id":"59160","department":[{"_id":"9"},{"_id":"321"},{"_id":"367"}],"user_id":"59363","language":[{"iso":"eng"}]},{"date_updated":"2025-03-27T10:33:59Z","date_created":"2025-03-26T16:06:28Z","author":[{"first_name":"Elmar","last_name":"Moritzer","full_name":"Moritzer, Elmar","id":"20531"},{"first_name":"Christian","last_name":"Held","full_name":"Held, Christian","id":"40647"}],"title":"Werkstoffgerechte Auslegung von Direktverschraubungen in SMC/BMC Bauteilen","year":"2024","place":"Chemnitz","citation":{"ieee":"E. Moritzer and C. Held, “Werkstoffgerechte Auslegung von Direktverschraubungen in SMC/BMC Bauteilen,” 2024.","chicago":"Moritzer, Elmar, and Christian Held. “Werkstoffgerechte Auslegung von Direktverschraubungen in SMC/BMC Bauteilen.” In <i>DVS Sitzung FA11 - Kunststofffügen</i>. Chemnitz, 2024.","ama":"Moritzer E, Held C. Werkstoffgerechte Auslegung von Direktverschraubungen in SMC/BMC Bauteilen. In: <i>DVS Sitzung FA11 - Kunststofffügen</i>. ; 2024.","apa":"Moritzer, E., &#38; Held, C. (2024). Werkstoffgerechte Auslegung von Direktverschraubungen in SMC/BMC Bauteilen. <i>DVS Sitzung FA11 - Kunststofffügen</i>.","bibtex":"@inproceedings{Moritzer_Held_2024, place={Chemnitz}, title={Werkstoffgerechte Auslegung von Direktverschraubungen in SMC/BMC Bauteilen}, booktitle={DVS Sitzung FA11 - Kunststofffügen}, author={Moritzer, Elmar and Held, Christian}, year={2024} }","mla":"Moritzer, Elmar, and Christian Held. “Werkstoffgerechte Auslegung von Direktverschraubungen in SMC/BMC Bauteilen.” <i>DVS Sitzung FA11 - Kunststofffügen</i>, 2024.","short":"E. Moritzer, C. Held, in: DVS Sitzung FA11 - Kunststofffügen, Chemnitz, 2024."},"_id":"59161","department":[{"_id":"9"},{"_id":"321"},{"_id":"367"}],"user_id":"59363","language":[{"iso":"eng"}],"publication":"DVS Sitzung FA11 - Kunststofffügen","type":"conference_abstract","status":"public"},{"citation":{"ama":"Schöppner V, Arndt T. Ambossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen. In: <i>DVS Plenarsitzung AG W4 Fügen von Kunststoffen</i>. DVS; 2024.","ieee":"V. Schöppner and T. Arndt, “Ambossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen,” 2024.","chicago":"Schöppner, Volker, and Theresa Arndt. “Ambossfreies Ultraschallschweißen Für Nur Einseitig Zugängliche Schweißsituationen.” In <i>DVS Plenarsitzung AG W4 Fügen von Kunststoffen</i>. Würzburg: DVS, 2024.","short":"V. Schöppner, T. Arndt, in: DVS Plenarsitzung AG W4 Fügen von Kunststoffen, DVS, Würzburg, 2024.","mla":"Schöppner, Volker, and Theresa Arndt. “Ambossfreies Ultraschallschweißen Für Nur Einseitig Zugängliche Schweißsituationen.” <i>DVS Plenarsitzung AG W4 Fügen von Kunststoffen</i>, DVS, 2024.","bibtex":"@inproceedings{Schöppner_Arndt_2024, place={Würzburg}, title={Ambossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen}, booktitle={DVS Plenarsitzung AG W4 Fügen von Kunststoffen}, publisher={DVS}, author={Schöppner, Volker and Arndt, Theresa}, year={2024} }","apa":"Schöppner, V., &#38; Arndt, T. (2024). Ambossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen. <i>DVS Plenarsitzung AG W4 Fügen von Kunststoffen</i>."},"year":"2024","place":"Würzburg","title":"Ambossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen","date_created":"2025-03-26T15:45:32Z","author":[{"first_name":"Volker","id":"20530","full_name":"Schöppner, Volker","last_name":"Schöppner"},{"first_name":"Theresa","id":"45302","full_name":"Arndt, Theresa","last_name":"Arndt"}],"publisher":"DVS","date_updated":"2025-03-27T10:49:29Z","status":"public","publication":"DVS Plenarsitzung AG W4 Fügen von Kunststoffen","type":"conference_abstract","language":[{"iso":"eng"}],"department":[{"_id":"9"},{"_id":"321"},{"_id":"367"}],"user_id":"59363","_id":"59158"},{"status":"public","type":"conference_abstract","publication":"DVS Sitzung FA11 - Kunststofffügen","language":[{"iso":"eng"}],"_id":"59157","user_id":"59363","department":[{"_id":"36"},{"_id":"321"},{"_id":"367"}],"place":"Lippstadt","year":"2024","citation":{"ieee":"V. Schöppner and T. Arndt, “Anbossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen,” 2024.","chicago":"Schöppner, Volker, and Theresa Arndt. “Anbossfreies Ultraschallschweißen Für Nur Einseitig Zugängliche Schweißsituationen.” In <i>DVS Sitzung FA11 - Kunststofffügen</i>. Lippstadt: DVS, 2024.","ama":"Schöppner V, Arndt T. Anbossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen. In: <i>DVS Sitzung FA11 - Kunststofffügen</i>. DVS; 2024.","mla":"Schöppner, Volker, and Theresa Arndt. “Anbossfreies Ultraschallschweißen Für Nur Einseitig Zugängliche Schweißsituationen.” <i>DVS Sitzung FA11 - Kunststofffügen</i>, DVS, 2024.","bibtex":"@inproceedings{Schöppner_Arndt_2024, place={Lippstadt}, title={Anbossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen}, booktitle={DVS Sitzung FA11 - Kunststofffügen}, publisher={DVS}, author={Schöppner, Volker and Arndt, Theresa}, year={2024} }","short":"V. Schöppner, T. Arndt, in: DVS Sitzung FA11 - Kunststofffügen, DVS, Lippstadt, 2024.","apa":"Schöppner, V., &#38; Arndt, T. (2024). Anbossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen. <i>DVS Sitzung FA11 - Kunststofffügen</i>."},"title":"Anbossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen","publisher":"DVS","date_updated":"2025-03-27T10:49:46Z","date_created":"2025-03-26T15:42:13Z","author":[{"full_name":"Schöppner, Volker","id":"20530","last_name":"Schöppner","first_name":"Volker"},{"first_name":"Theresa","last_name":"Arndt","full_name":"Arndt, Theresa","id":"45302"}]},{"language":[{"iso":"eng"}],"_id":"59162","department":[{"_id":"9"},{"_id":"321"},{"_id":"367"}],"user_id":"59363","status":"public","publication":"DVS Sitzung FA11 - Kunststofffügen","type":"conference_abstract","title":"Ambossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen","date_updated":"2025-03-27T10:49:11Z","publisher":"DVS","date_created":"2025-03-26T16:08:48Z","author":[{"last_name":"Schöppner","id":"20530","full_name":"Schöppner, Volker","first_name":"Volker"},{"full_name":"Arndt, Theresa","id":"45302","last_name":"Arndt","first_name":"Theresa"}],"year":"2024","place":"Chemnitz","citation":{"apa":"Schöppner, V., &#38; Arndt, T. (2024). Ambossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen. <i>DVS Sitzung FA11 - Kunststofffügen</i>.","short":"V. Schöppner, T. Arndt, in: DVS Sitzung FA11 - Kunststofffügen, DVS, Chemnitz, 2024.","bibtex":"@inproceedings{Schöppner_Arndt_2024, place={Chemnitz}, title={Ambossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen}, booktitle={DVS Sitzung FA11 - Kunststofffügen}, publisher={DVS}, author={Schöppner, Volker and Arndt, Theresa}, year={2024} }","mla":"Schöppner, Volker, and Theresa Arndt. “Ambossfreies Ultraschallschweißen Für Nur Einseitig Zugängliche Schweißsituationen.” <i>DVS Sitzung FA11 - Kunststofffügen</i>, DVS, 2024.","ieee":"V. Schöppner and T. Arndt, “Ambossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen,” 2024.","chicago":"Schöppner, Volker, and Theresa Arndt. “Ambossfreies Ultraschallschweißen Für Nur Einseitig Zugängliche Schweißsituationen.” In <i>DVS Sitzung FA11 - Kunststofffügen</i>. Chemnitz: DVS, 2024.","ama":"Schöppner V, Arndt T. Ambossfreies Ultraschallschweißen für nur einseitig zugängliche Schweißsituationen. In: <i>DVS Sitzung FA11 - Kunststofffügen</i>. DVS; 2024."}},{"status":"public","publication":"DVS Sitzung FA11 - Kunststofffügen","type":"conference_abstract","language":[{"iso":"eng"}],"department":[{"_id":"9"},{"_id":"321"},{"_id":"367"}],"user_id":"59363","_id":"59156","citation":{"ama":"Moritzer E, Held C. Werkstoffgerechte Auslegung von Direktverschraubungen in SMC/BMC Bauteilen. In: <i>DVS Sitzung FA11 - Kunststofffügen</i>. DVS; 2024.","ieee":"E. Moritzer and C. Held, “Werkstoffgerechte Auslegung von Direktverschraubungen in SMC/BMC Bauteilen,” 2024.","chicago":"Moritzer, Elmar, and Christian Held. “Werkstoffgerechte Auslegung von Direktverschraubungen in SMC/BMC Bauteilen.” In <i>DVS Sitzung FA11 - Kunststofffügen</i>. Lippstadt: DVS, 2024.","apa":"Moritzer, E., &#38; Held, C. (2024). Werkstoffgerechte Auslegung von Direktverschraubungen in SMC/BMC Bauteilen. <i>DVS Sitzung FA11 - Kunststofffügen</i>.","mla":"Moritzer, Elmar, and Christian Held. “Werkstoffgerechte Auslegung von Direktverschraubungen in SMC/BMC Bauteilen.” <i>DVS Sitzung FA11 - Kunststofffügen</i>, DVS, 2024.","bibtex":"@inproceedings{Moritzer_Held_2024, place={Lippstadt}, title={Werkstoffgerechte Auslegung von Direktverschraubungen in SMC/BMC Bauteilen}, booktitle={DVS Sitzung FA11 - Kunststofffügen}, publisher={DVS}, author={Moritzer, Elmar and Held, Christian}, year={2024} }","short":"E. Moritzer, C. Held, in: DVS Sitzung FA11 - Kunststofffügen, DVS, Lippstadt, 2024."},"place":"Lippstadt","year":"2024","title":"Werkstoffgerechte Auslegung von Direktverschraubungen in SMC/BMC Bauteilen","date_created":"2025-03-26T15:38:05Z","author":[{"last_name":"Moritzer","full_name":"Moritzer, Elmar","id":"20531","first_name":"Elmar"},{"id":"40647","full_name":"Held, Christian","last_name":"Held","first_name":"Christian"}],"date_updated":"2025-03-27T10:34:41Z","publisher":"DVS"},{"publication":"77th Annual Assembly of the International Institute of Welding","type":"conference","status":"public","_id":"59139","department":[{"_id":"9"},{"_id":"321"},{"_id":"367"}],"user_id":"59363","language":[{"iso":"eng"}],"year":"2024","place":"Rhodos","citation":{"chicago":"Moritzer, Elmar, and Christian Held. “Influence of the Screw Dome Geometry on the Mechanical Strength of Direct Screw Fastened SMC/BMC Components.” In <i>77th Annual Assembly of the International Institute of Welding</i>. Rhodos, 2024.","ieee":"E. Moritzer and C. Held, “Influence of the screw dome geometry on the mechanical strength of direct screw fastened SMC/BMC components,” 2024.","ama":"Moritzer E, Held C. Influence of the screw dome geometry on the mechanical strength of direct screw fastened SMC/BMC components. In: <i>77th Annual Assembly of the International Institute of Welding</i>. ; 2024.","short":"E. Moritzer, C. Held, in: 77th Annual Assembly of the International Institute of Welding, Rhodos, 2024.","bibtex":"@inproceedings{Moritzer_Held_2024, place={Rhodos}, title={Influence of the screw dome geometry on the mechanical strength of direct screw fastened SMC/BMC components}, booktitle={77th Annual Assembly of the International Institute of Welding}, author={Moritzer, Elmar and Held, Christian}, year={2024} }","mla":"Moritzer, Elmar, and Christian Held. “Influence of the Screw Dome Geometry on the Mechanical Strength of Direct Screw Fastened SMC/BMC Components.” <i>77th Annual Assembly of the International Institute of Welding</i>, 2024.","apa":"Moritzer, E., &#38; Held, C. (2024). Influence of the screw dome geometry on the mechanical strength of direct screw fastened SMC/BMC components. <i>77th Annual Assembly of the International Institute of Welding</i>."},"date_updated":"2025-03-27T10:43:44Z","author":[{"first_name":"Elmar","full_name":"Moritzer, Elmar","id":"20531","last_name":"Moritzer"},{"last_name":"Held","id":"40647","full_name":"Held, Christian","first_name":"Christian"}],"date_created":"2025-03-25T12:21:02Z","title":"Influence of the screw dome geometry on the mechanical strength of direct screw fastened SMC/BMC components"},{"language":[{"iso":"eng"}],"_id":"59136","user_id":"59363","department":[{"_id":"9"},{"_id":"321"},{"_id":"367"}],"status":"public","type":"conference","publication":"VDI-Jahrestagung Spritzgießen","title":"Inline Plasmavorbehandlung im Mehrkomponentenspritzgießen - InMould-Plasma","date_updated":"2025-03-27T10:51:00Z","author":[{"full_name":"Moritzer, Elmar","id":"20531","last_name":"Moritzer","first_name":"Elmar"},{"last_name":"Rauen","full_name":"Rauen, Dennis","id":"62033","first_name":"Dennis"}],"date_created":"2025-03-25T10:56:14Z","year":"2024","place":"Wiesbaden","citation":{"chicago":"Moritzer, Elmar, and Dennis Rauen. “Inline Plasmavorbehandlung Im Mehrkomponentenspritzgießen - InMould-Plasma.” In <i>VDI-Jahrestagung Spritzgießen</i>. Wiesbaden, 2024.","ieee":"E. Moritzer and D. Rauen, “Inline Plasmavorbehandlung im Mehrkomponentenspritzgießen - InMould-Plasma,” 2024.","ama":"Moritzer E, Rauen D. Inline Plasmavorbehandlung im Mehrkomponentenspritzgießen - InMould-Plasma. In: <i>VDI-Jahrestagung Spritzgießen</i>. ; 2024.","apa":"Moritzer, E., &#38; Rauen, D. (2024). Inline Plasmavorbehandlung im Mehrkomponentenspritzgießen - InMould-Plasma. <i>VDI-Jahrestagung Spritzgießen</i>.","mla":"Moritzer, Elmar, and Dennis Rauen. “Inline Plasmavorbehandlung Im Mehrkomponentenspritzgießen - InMould-Plasma.” <i>VDI-Jahrestagung Spritzgießen</i>, 2024.","short":"E. Moritzer, D. Rauen, in: VDI-Jahrestagung Spritzgießen, Wiesbaden, 2024.","bibtex":"@inproceedings{Moritzer_Rauen_2024, place={Wiesbaden}, title={Inline Plasmavorbehandlung im Mehrkomponentenspritzgießen - InMould-Plasma}, booktitle={VDI-Jahrestagung Spritzgießen}, author={Moritzer, Elmar and Rauen, Dennis}, year={2024} }"}},{"publication":"Plastverarbeiter","type":"journal_article","abstract":[{"text":"Füllstoffe erhöhen die Wärmeleitfähigkeit von im Fused Filament Fabrication (FFF) Verfahren hergestellten Strukturen. Neben der Füllstoffart ist dabei der Füllstoffvolumenanteil relevant. Der maximal verarbeitbare Füllstoffanteil ist hier gegenüber vergleichbaren Spritzgussmaterialien reduziert. An der Kunststofftechnik Paderborn (KTP) wurde untersucht, welchen Einfluss spezifische Füllstoffe auf die Materialeigenschaften haben. Die additive Fertigung (AM) gewinnt durch stetig steigende Anforderungen an die Bauteilkomplexität und Fertigungsflexibilität nicht nur im Prototypenbau an Bedeutung [1]. Eines der am weitesten verbreiteten additiven Fertigungsverfahren ist dabei das Fused Filament Fabrication (FFF) Verfahren [2]. Bei diesem Verfahren wird ein Kunststofffilament in eine temperierte Düse gefördert, dort aufgeschmolzen und in einer charakteristischen, näherungsweise elliptischen Stranggeometrie ausgetragen. Durch die Verfahrbewegung der Plastifiziereinheit und der Bauplattform können dreidimensionale Strukturen gefertigt werden [3]. Das FFF-Verfahren zeichnet sich unter anderem durch die Verarbeitung einer großen Bandbreite an thermoplastischen Kunststoffen aus [4]. Dies ermöglicht eine anwendungsspezifische Materialauswahl. In diesem Zusammenhang stellt auch die Modifizierung mit Füllstoffen eine Möglichkeit dar, die Materialeigenschaften gezielt einzustellen. Die Füllstoffe können dabei nach dem jeweiligen Aspektverhältnis in Kugeln, Plättchen oder Fasern unterteilt werden [5]. Die Steigerung der Wärmeleitfähigkeit von im FFF-Verfahren hergestellten Strukturen ist aktuell Stand der Forschung, gewinnt jedoch vor dem Hintergrund der aktuellen Herausforderungen, z. B. in der Elektrotechnik, an Bedeutung [6]. Die Kunststofftechnik Paderborn (KTP) befasst sich am Direct Manufacturing Research Center (DMRC) – Academic derzeit mit der Entwicklung und Verarbeitung wärmeleitfähiger Kunststoffe für das FFF-Verfahren. Der Fokus liegt dabei auf den material- und prozessseitigen Einflüssen auf die Materialeigenschaften. Für die Erzielung hoher Wärmeleitfähigkeiten sind dabei die Wahl der Füllstoffart und des Füllstoffvolumenanteils hervorzuheben. Kenntnisse über die Auswirkungen der Füllstoffzugabe und dem Zusammenspiel zwischen den mechanischen Eigenschaften und der Wärmeleitfähigkeit sind für die anwendungsgerechte Bauteilauslegung essenziell. Das Vorgehen Zur Analyse der Wärmeleitfähigkeit wurde eine am DMRC – Academic entwickelte Methode verwendet. Diese basiert auf der Fertigung von zylindrischen Probekörpern, welche im FFF-Verfahren entlang der Längsachse parallel zu den drei Koordinatenrichtungen X, Y und Z orientiert gefertigt werden. Im Anschluss werden die Probekörper spanend auf das für die Messung erforderliche Maß nachbearbeitet. Dadurch können fertigungsbedingte Einflüsse auf die Geometrie und Oberflächengüte reduziert und damit die Messgenauigkeit erhöht werden (Bild 2). Durch die Fertigung von drei unterschiedlichen Orientierungen kann weiterhin eine resultierende Anisotropie bewertet werden. Die auf einem Doppelschneckenextruder (Thermo Fisher Process11) hergestellten Filamente wurden nachfolgend mit einem Gewo HTP260 (Gewo Feinmechanik) verarbeitet. Die entsprechenden FFF-Prozessparameter sind in Tabelle 1 dargestellt. Dabei ist anzumerken, dass eine Bauraumtemperierung im Allgemeinen und der auf 120 °C beheizte Bauraum für die Verarbeitung der betrachteten Materialien im Speziellen zur prozesssicheren FFF-Fertigung unerlässlich sind. Die Analyse der Wärmeleitfähigkeit erfolgte schließlich mittels der Laser-Flash-Analyse (LFA) (Netzsch LFA 467 HyperFlash) entsprechend der DIN EN ISO 22007-4 [7]. Für die Bewertung der mechanischen Eigenschaften wurden Probekörper entsprechend der DIN EN ISO 527-2 Typ 1BA unter Verwendung einer Kolben-Spritzgussmaschine (Thermo Fisher Mini Jet Pro) gefertigt und mit einer Zugprüfmaschine (Zwick/Roell ProLine Z 010) geprüft, um den grundlegenden Füllstoffeinfluss bewerten zu können [8]. Für die Untersuchungen wurde ein Kunststoff-Compound basierend auf Polybutylenterephthalat (PBT) ohne (PBTx) und mit (PBTxa) Verarbeitungshilfe verwendet. Als Füllstoffe kamen zwei wärmeleitfähige plättchenförmige Füllstoffe (Bezeichnung: F1 und F2) zur Anwendung, welche einen mittleren Partikeldurchmesser (d50) für F1 von 5,0 µm und für F2 von 7,9 µm aufweisen. Ergebnisse der Zugversuche Die Auswertung der mechanischen Eigenschaften zeigt den Einfluss des Füllstoffvolumenanteils anhand des Elastizitätsmoduls und der Bruchdehnung auf (Bild 3). Die resultierende Festigkeit wird durch die geringe Verstärkungswirkung der Plättchen hingegen nur geringfügig beeinflusst und ist folglich nicht gesondert aufgeführt. Im Gegensatz dazu erhöht sich die Steifigkeit mit steigendem Füllstoffvolumenanteil, was auf den erhöhten E-Modul der Füllstoffe gegenüber der Kunststoffmatrix zurückzuführen ist. So kann durch die Füllstoffzugabe mit einem Volumenanteil in Höhe von 22 {%} der E-Modul für das Material PBTxa-F1 gegenüber der reinen Kunststoffmatrix um den Faktor 2,7 gesteigert werden. Hingegen nimmt die Bruchdehnung mit steigendem Füllstoffvolumenanteil ab. Diese mit dem Volumenanteil positiv korrelierende Versprödung stellt einen begrenzenden Faktor bei der Herstellung hochgefüllter Filamente dar. So neigen höher gefüllte Filamente eher zu einem Bruch bei der Herstellung und Verarbeitung. Dies resultiert in den vorliegenden maximalen Füllstoffvolumenanteilen, welche im Vergleich zu Spritzgussmaterialien deutlich reduziert sind. Eine weitere Erhöhung führt zu einer unzureichenden Prozessstabilität und damit zu einer unzureichenden Verarbeitungseignung für das FFF-Verfahren. Weiterhin zeigt sich, dass der Einfluss der verwendeten plättchenförmigen Füllstoffe für eine identische Kunststoffmatrix vergleichbar ist. Durch die Verwendung von Verarbeitungshilfen können die mechanischen Eigenschaften allerdings beeinflusst werden. Die Erhöhung des E-Moduls und der Bruchdehnung ist dabei auf die verbesserte Benetzung der Füllstoffpartikel und damit eine verbesserte Kunststoff-Füllstoff-Interaktion zurückzuführen. Bewertung der Wärmeleitfähigkeit Zur Darstellung der Ergebnisse der Wärmeleitfähigkeit wurden die Messergebnisse von je vier Probekörpern über die Prüftemperaturen zwischen 30 °C und 180 °C in 30 °C Inkrementen gemittelt (Bild 4). Die Ergebnisse zeigen eine positive Korrelation zwischen einem zunehmenden Füllstoffvolumenanteil und der Wärmeleitfähigkeit. Diese Steigerung ist wiederum abhängig von der jeweilig verwendeten Füllstoffart. Hierbei liefert das Material PBTx-F2-X eine vergleichbare Wärmeleitfähigkeit wie die Materialien PBTx-F1 und PBTxa-F1 in der jeweiligen Y-Orientierung. Die Unterschiede zwischen den beiden Materialien PBTx-F1 und PBTxa-F1 sind hingegen minimal und der Einfluss der Verarbeitungshilfe auf die Wärmeleitfähigkeit dementsprechend als vernachlässigbar anzusehen. Weiterhin ist eine anisotrope Wärmeleitfähigkeit für die mit Plättchen gefüllten Kunststoffe ersichtlich. Während die X-Orientierung (entlang der abgelegten Stränge) eine erhöhte Wärmeleitfähigkeit für alle Materialien liefert, ist diese für die Z-Orientierung (zwischen den Schichten) am geringsten. Gründe hierfür sind der Strangverbund sowie die Füllstofforientierung innerhalb der abgelegten Stränge. Dabei ist die aufgezeigte Anisotropie für den Füllstoff F2 im Vergleich zu F1 leicht reduziert und bestätigt den spezifischen Einfluss der Füllstoffart. Auf Basis der Ergebnisse können allgemein drei charakteristische Orientierungen zur Bewertung der Wärmeleitfähigkeit erfasst werden. Für die Bauteilauslegung ist der aufgezeigte Einfluss plättchenförmiger Füllstoffe auf die sich einstellende Anisotropie von im FFF-Verfahren gefertigten Strukturen zwingend zu beachten. Ausblick Die angeführten Untersuchungen zeigen, dass die Verwendung von plättchenförmigen Füllstoffen in Abhängigkeit von dem Füllstoffvolumenanteil zu einer Beeinflussung der Materialeigenschaften führt. Die dargelegten Ergebnisse stellen in diesem Kontext eine Grundlage zur Bewertung des Zusammenhangs zwischen den mechanischen Eigenschaften und der Wärmeleitfähigkeit dar. Insbesondere die Limitierung des Füllstoffvolumenanteils durch die erhöhte Versprödung ist hierbei anzuführen. Aktuelle Untersuchungen an der Kunststofftechnik Paderborn befassen sich mit der Betrachtung weiterer material- und prozessseitiger Einflussgrößen auf die Wärmeleitfähigkeit. Die generierten Daten sollen schließlich für die Entwicklung eines Modells zur Vorhersage der Wärmeleitfähigkeit von im FFF-Verfahren gefertigten Strukturen zusammengeführt werden.","lang":"eng"}],"status":"public","_id":"59131","department":[{"_id":"9"},{"_id":"321"},{"_id":"624"},{"_id":"367"}],"user_id":"59363","keyword":["Compoundieren","Fused Filament Fabrication"],"language":[{"iso":"eng"}],"year":"2024","intvolume":"      2024","citation":{"ieee":"E. Moritzer, C. L. Elsner, and M. K. F. Salm, “Wie der Füllstoffvolumenanteil die Materialeigenschaften beeinflusst,” <i>Plastverarbeiter</i>, vol. 2024, 2024.","chicago":"Moritzer, Elmar, Christian Lennart Elsner, and Maximilian Karl Franz Salm. “Wie Der Füllstoffvolumenanteil Die Materialeigenschaften Beeinflusst.” <i>Plastverarbeiter</i> 2024 (2024).","ama":"Moritzer E, Elsner CL, Salm MKF. Wie der Füllstoffvolumenanteil die Materialeigenschaften beeinflusst. <i>Plastverarbeiter</i>. 2024;2024.","apa":"Moritzer, E., Elsner, C. L., &#38; Salm, M. K. F. (2024). Wie der Füllstoffvolumenanteil die Materialeigenschaften beeinflusst. <i>Plastverarbeiter</i>, <i>2024</i>.","bibtex":"@article{Moritzer_Elsner_Salm_2024, title={Wie der Füllstoffvolumenanteil die Materialeigenschaften beeinflusst}, volume={2024}, journal={Plastverarbeiter}, author={Moritzer, Elmar and Elsner, Christian Lennart and Salm, Maximilian Karl Franz}, year={2024} }","mla":"Moritzer, Elmar, et al. “Wie Der Füllstoffvolumenanteil Die Materialeigenschaften Beeinflusst.” <i>Plastverarbeiter</i>, vol. 2024, 2024.","short":"E. Moritzer, C.L. Elsner, M.K.F. Salm, Plastverarbeiter 2024 (2024)."},"date_updated":"2025-03-27T10:56:02Z","volume":2024,"author":[{"full_name":"Moritzer, Elmar","id":"20531","last_name":"Moritzer","first_name":"Elmar"},{"first_name":"Christian Lennart","last_name":"Elsner","full_name":"Elsner, Christian Lennart","id":"70729"},{"last_name":"Salm","full_name":"Salm, Maximilian Karl Franz","id":"57929","first_name":"Maximilian Karl Franz"}],"date_created":"2025-03-25T10:18:06Z","title":"Wie der Füllstoffvolumenanteil die Materialeigenschaften beeinflusst"}]