[{"related_material":{"link":[{"url":"https://www.date-conference.com/content/date-2017-call-papers","relation":"confirmation"}]},"citation":{"chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Bernd Kleinjohann, and Christoph Scheytt. “ANALISA - A Tool for Static Instruction Set Analysis.” In <i>Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation</i>. Lausanne, CH, 2017.","short":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, C. Scheytt, in: Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation, Lausanne, CH, 2017.","apa":"Adelt, P., Koppelmann, B., Müller, W., Kleinjohann, B., &#38; Scheytt, C. (2017). ANALISA - A Tool for Static Instruction Set Analysis. <i>Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation</i>.","ieee":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, and C. Scheytt, “ANALISA - A Tool for Static Instruction Set Analysis,” 2017.","ama":"Adelt P, Koppelmann B, Müller W, Kleinjohann B, Scheytt C. ANALISA - A Tool for Static Instruction Set Analysis. In: <i>Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation</i>. ; 2017.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Kleinjohann_Scheytt_2017, place={Lausanne, CH}, title={ANALISA - A Tool for Static Instruction Set Analysis}, booktitle={Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Kleinjohann, Bernd and Scheytt, Christoph}, year={2017} }","mla":"Adelt, Peer, et al. “ANALISA - A Tool for Static Instruction Set Analysis.” <i>Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation</i>, 2017."},"publication":"Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation","department":[{"_id":"58"}],"type":"conference","date_created":"2021-09-13T08:20:40Z","place":"Lausanne, CH","date_updated":"2022-01-06T06:56:13Z","author":[{"full_name":"Adelt, Peer","last_name":"Adelt","first_name":"Peer","id":"5603"},{"id":"25260","full_name":"Koppelmann, Bastian","last_name":"Koppelmann","first_name":"Bastian"},{"id":"16243","last_name":"Müller","first_name":"Wolfgang","full_name":"Müller, Wolfgang"},{"full_name":"Kleinjohann, Bernd","last_name":"Kleinjohann","first_name":"Bernd"},{"last_name":"Scheytt","first_name":"Christoph","full_name":"Scheytt, Christoph","id":"37144"}],"conference":{"start_date":"2017.03.27","end_date":"2017.03.31"},"year":"2017","title":"ANALISA - A Tool for Static Instruction Set Analysis","status":"public","user_id":"15931","language":[{"iso":"eng"}],"_id":"24224"},{"user_id":"15931","language":[{"iso":"eng"}],"_id":"24225","page":"44","date_updated":"2022-01-06T06:56:13Z","author":[{"full_name":"Adelt, Peer","first_name":"Peer","last_name":"Adelt","id":"5603"},{"id":"25260","full_name":"Koppelmann, Bastian","first_name":"Bastian","last_name":"Koppelmann"},{"id":"16243","full_name":"Müller, Wolfgang","first_name":"Wolfgang","last_name":"Müller"},{"last_name":"Kleinjohann","first_name":"Bernd","full_name":"Kleinjohann, Bernd"},{"id":"37144","full_name":"Scheytt, Christoph","last_name":"Scheytt","first_name":"Christoph"}],"title":"An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries","status":"public","year":"2017","department":[{"_id":"58"}],"type":"conference","place":"Lausanne, Switzerland","date_created":"2021-09-13T08:20:41Z","related_material":{"link":[{"url":"https://www.edacentrum.de/rees/program","relation":"confirmation"}]},"citation":{"ama":"Adelt P, Koppelmann B, Müller W, Kleinjohann B, Scheytt C. An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries. In: <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>. ; 2017:44.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Kleinjohann_Scheytt_2017, place={Lausanne, Switzerland}, title={An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries}, booktitle={2nd Workshop on Resiliency in Embedded Electronic Systems (REES) }, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Kleinjohann, Bernd and Scheytt, Christoph}, year={2017}, pages={44} }","mla":"Adelt, Peer, et al. “An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries.” <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>, 2017, p. 44.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Bernd Kleinjohann, and Christoph Scheytt. “An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries.” In <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>, 44. Lausanne, Switzerland, 2017.","short":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, C. Scheytt, in: 2nd Workshop on Resiliency in Embedded Electronic Systems (REES) , Lausanne, Switzerland, 2017, p. 44.","apa":"Adelt, P., Koppelmann, B., Müller, W., Kleinjohann, B., &#38; Scheytt, C. (2017). An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries. <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>, 44.","ieee":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, and C. Scheytt, “An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries,” in <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>, 2017, p. 44."},"publication":"2nd Workshop on Resiliency in Embedded Electronic Systems (REES) "},{"status":"public","page":"198-200","_id":"24227","user_id":"15931","volume":27,"citation":{"short":"J. Wessel, K. Schmalz, C. Scheytt, D. Kissinger, IEEE Microwave and Wireless Components Letters 27 (2017) 198–200.","chicago":"Wessel, Jan, Klaus Schmalz, Christoph Scheytt, and Dietmar Kissinger. “A 120-GHz Electrical Interferometer for Contactless Permittivity Measurements With Direct Digital Read-Out.” <i>IEEE Microwave and Wireless Components Letters</i> 27, no. 2 (2017): 198–200. <a href=\"https://doi.org/10.1109/LMWC.2017.2649384\">https://doi.org/10.1109/LMWC.2017.2649384</a>.","apa":"Wessel, J., Schmalz, K., Scheytt, C., &#38; Kissinger, D. (2017). A 120-GHz Electrical Interferometer for Contactless Permittivity Measurements With Direct Digital Read-Out. <i>IEEE Microwave and Wireless Components Letters</i>, <i>27</i>(2), 198–200. <a href=\"https://doi.org/10.1109/LMWC.2017.2649384\">https://doi.org/10.1109/LMWC.2017.2649384</a>","ieee":"J. Wessel, K. Schmalz, C. Scheytt, and D. Kissinger, “A 120-GHz Electrical Interferometer for Contactless Permittivity Measurements With Direct Digital Read-Out,” <i>IEEE Microwave and Wireless Components Letters</i>, vol. 27, no. 2, pp. 198–200, 2017, doi: <a href=\"https://doi.org/10.1109/LMWC.2017.2649384\">10.1109/LMWC.2017.2649384</a>.","ama":"Wessel J, Schmalz K, Scheytt C, Kissinger D. A 120-GHz Electrical Interferometer for Contactless Permittivity Measurements With Direct Digital Read-Out. <i>IEEE Microwave and Wireless Components Letters</i>. 2017;27(2):198-200. doi:<a href=\"https://doi.org/10.1109/LMWC.2017.2649384\">10.1109/LMWC.2017.2649384</a>","bibtex":"@article{Wessel_Schmalz_Scheytt_Kissinger_2017, title={A 120-GHz Electrical Interferometer for Contactless Permittivity Measurements With Direct Digital Read-Out}, volume={27}, DOI={<a href=\"https://doi.org/10.1109/LMWC.2017.2649384\">10.1109/LMWC.2017.2649384</a>}, number={2}, journal={IEEE Microwave and Wireless Components Letters}, author={Wessel, Jan and Schmalz, Klaus and Scheytt, Christoph and Kissinger, Dietmar}, year={2017}, pages={198–200} }","mla":"Wessel, Jan, et al. “A 120-GHz Electrical Interferometer for Contactless Permittivity Measurements With Direct Digital Read-Out.” <i>IEEE Microwave and Wireless Components Letters</i>, vol. 27, no. 2, 2017, pp. 198–200, doi:<a href=\"https://doi.org/10.1109/LMWC.2017.2649384\">10.1109/LMWC.2017.2649384</a>."},"title":"A 120-GHz Electrical Interferometer for Contactless Permittivity Measurements With Direct Digital Read-Out","year":"2017","publication_identifier":{"eissn":["1558-1764"]},"author":[{"full_name":"Wessel, Jan","first_name":"Jan","last_name":"Wessel"},{"last_name":"Schmalz","first_name":"Klaus","full_name":"Schmalz, Klaus"},{"last_name":"Scheytt","first_name":"Christoph","full_name":"Scheytt, Christoph","id":"37144"},{"first_name":"Dietmar","last_name":"Kissinger","full_name":"Kissinger, Dietmar"}],"date_updated":"2022-01-06T06:56:13Z","intvolume":"        27","language":[{"iso":"eng"}],"doi":"10.1109/LMWC.2017.2649384","issue":"2","publication":"IEEE Microwave and Wireless Components Letters","abstract":[{"text":"This work describes an electrical interferometer for contactless permittivity measurements working at 120 GHz. It was fabricated in a 130 nm SiGe process featuring an ft and fmax of 240 and 330 GHz. The on-chip system contains a 120 GHz VCO with a tuning range of 7 GHz featuring a divide-by-64 circuit to enable external PLL operation. The subsequent buffer provides 7 dBm of output power at 120 GHz. Additionally, the IC contains high-precision and high-resolution phase shifters based on a slow-wave transmission line approach with digital control for direct readout ability. A 120 GHz LNA with 17 dB gain and a power detector to provide DC output signals were realized on chip. It enables sample emulation capability by phase shift inducement in the measurement as well as a reference transmission line. In terms of phase detection, the system shows a sensitivity of 907.36 MHz/°.","lang":"eng"}],"related_material":{"link":[{"url":"https://ieeexplore.ieee.org/document/7845690","relation":"confirmation"}]},"date_created":"2021-09-13T08:20:44Z","type":"journal_article","department":[{"_id":"58"}]},{"_id":"24211","language":[{"iso":"eng"}],"doi":"10.1109/BCTM.2017.8112922","user_id":"15931","title":"Fully-differential, DC-coupled, Self-biased, Monolithically-integrated Optical Receiver in 0.25μm Photonic BiCMOS Technology for Multi-channel Fiber Links","year":"2017","status":"public","conference":{"end_date":"2017.10.21","start_date":"2017.10.19"},"author":[{"full_name":"Gudyriev, Sergiy","last_name":"Gudyriev","first_name":"Sergiy"},{"first_name":"Christoph","last_name":"Scheytt","orcid":"https://orcid.org/0000-0002-5950-6618","full_name":"Scheytt, Christoph","id":"37144"},{"first_name":"Lei","last_name":"Yan","full_name":"Yan, Lei"},{"full_name":"Christian, Meuer","last_name":"Christian","first_name":"Meuer"},{"full_name":"Zimmermann, Lars","last_name":"Zimmermann","first_name":"Lars"}],"publication_identifier":{"eissn":[" 2378-590X"]},"date_updated":"2023-01-10T13:02:44Z","date_created":"2021-09-13T08:15:30Z","type":"journal_article","department":[{"_id":"58"},{"_id":"230"}],"publication":"IEEE Bipolar/BiCMOS Circuits and Technology Meeting","citation":{"short":"S. Gudyriev, C. Scheytt, L. Yan, M. Christian, L. Zimmermann, IEEE Bipolar/BiCMOS Circuits and Technology Meeting (2017).","chicago":"Gudyriev, Sergiy, Christoph Scheytt, Lei Yan, Meuer Christian, and Lars Zimmermann. “Fully-Differential, DC-Coupled, Self-Biased, Monolithically-Integrated Optical Receiver in 0.25μm Photonic BiCMOS Technology for Multi-Channel Fiber Links.” <i>IEEE Bipolar/BiCMOS Circuits and Technology Meeting</i>, 2017. <a href=\"https://doi.org/10.1109/BCTM.2017.8112922\">https://doi.org/10.1109/BCTM.2017.8112922</a>.","ieee":"S. Gudyriev, C. Scheytt, L. Yan, M. Christian, and L. Zimmermann, “Fully-differential, DC-coupled, Self-biased, Monolithically-integrated Optical Receiver in 0.25μm Photonic BiCMOS Technology for Multi-channel Fiber Links,” <i>IEEE Bipolar/BiCMOS Circuits and Technology Meeting</i>, 2017, doi: <a href=\"https://doi.org/10.1109/BCTM.2017.8112922\">10.1109/BCTM.2017.8112922</a>.","apa":"Gudyriev, S., Scheytt, C., Yan, L., Christian, M., &#38; Zimmermann, L. (2017). Fully-differential, DC-coupled, Self-biased, Monolithically-integrated Optical Receiver in 0.25μm Photonic BiCMOS Technology for Multi-channel Fiber Links. <i>IEEE Bipolar/BiCMOS Circuits and Technology Meeting</i>. <a href=\"https://doi.org/10.1109/BCTM.2017.8112922\">https://doi.org/10.1109/BCTM.2017.8112922</a>","bibtex":"@article{Gudyriev_Scheytt_Yan_Christian_Zimmermann_2017, title={Fully-differential, DC-coupled, Self-biased, Monolithically-integrated Optical Receiver in 0.25μm Photonic BiCMOS Technology for Multi-channel Fiber Links}, DOI={<a href=\"https://doi.org/10.1109/BCTM.2017.8112922\">10.1109/BCTM.2017.8112922</a>}, journal={IEEE Bipolar/BiCMOS Circuits and Technology Meeting}, author={Gudyriev, Sergiy and Scheytt, Christoph and Yan, Lei and Christian, Meuer and Zimmermann, Lars}, year={2017} }","ama":"Gudyriev S, Scheytt C, Yan L, Christian M, Zimmermann L. Fully-differential, DC-coupled, Self-biased, Monolithically-integrated Optical Receiver in 0.25μm Photonic BiCMOS Technology for Multi-channel Fiber Links. <i>IEEE Bipolar/BiCMOS Circuits and Technology Meeting</i>. Published online 2017. doi:<a href=\"https://doi.org/10.1109/BCTM.2017.8112922\">10.1109/BCTM.2017.8112922</a>","mla":"Gudyriev, Sergiy, et al. “Fully-Differential, DC-Coupled, Self-Biased, Monolithically-Integrated Optical Receiver in 0.25μm Photonic BiCMOS Technology for Multi-Channel Fiber Links.” <i>IEEE Bipolar/BiCMOS Circuits and Technology Meeting</i>, 2017, doi:<a href=\"https://doi.org/10.1109/BCTM.2017.8112922\">10.1109/BCTM.2017.8112922</a>."},"related_material":{"link":[{"url":"https://ieeexplore.ieee.org/document/8112922","relation":"confirmation"}]},"abstract":[{"lang":"eng","text":"A fully-differential receiver structure for fiber links is presented, in which the photodiode (PD) is DC-coupled to the transimpedance amplifier (TIA) and biased through the feedback resistors. The biasing voltage is defined by the internal structure of the input stage. Different options are suggested that allow to adjust PD biasing. Multiple architecture variants are proposed, that were implemented in 0.25μm SiGe BiCMOS technology. Initial measurement results are reported, proving the feasibility of the concept. A 25Gbps hybrid receiver designed to comply with a specific standard is also presented, featuring large horizontal eye opening of 800mV, OMA of -15dBm at BER of 10 -6 and power dissipation of 330mW from a single 3.3V power supply."}]},{"user_id":"15931","language":[{"iso":"eng"}],"_id":"24226","date_updated":"2023-01-10T13:04:16Z","conference":{"end_date":"2017.02.22","start_date":"2017.02.21"},"author":[{"first_name":"Christoph","orcid":"https://orcid.org/0000-0002-5950-6618","last_name":"Scheytt","full_name":"Scheytt, Christoph","id":"37144"}],"year":"2017","status":"public","title":"Silicon Photonics Microsystems for Communications and Sensing","department":[{"_id":"58"},{"_id":"230"}],"type":"conference","place":"Wetzlar, Germany","date_created":"2021-09-13T08:20:43Z","related_material":{"link":[{"relation":"confirmation","url":"https://www.technologieland-hessen.de/news/28134"}]},"citation":{"short":"C. Scheytt, in: W3+Fair on Optoelectronics, Electronics, and Mechanics, Wetzlar, Germany, 2017.","chicago":"Scheytt, Christoph. “Silicon Photonics Microsystems for Communications and Sensing.” In <i>W3+Fair on Optoelectronics, Electronics, and Mechanics</i>. Wetzlar, Germany, 2017.","ieee":"C. Scheytt, “Silicon Photonics Microsystems for Communications and Sensing,” 2017.","apa":"Scheytt, C. (2017). Silicon Photonics Microsystems for Communications and Sensing. <i>W3+Fair on Optoelectronics, Electronics, and Mechanics</i>.","bibtex":"@inproceedings{Scheytt_2017, place={Wetzlar, Germany}, title={Silicon Photonics Microsystems for Communications and Sensing}, booktitle={W3+Fair on Optoelectronics, Electronics, and Mechanics}, author={Scheytt, Christoph}, year={2017} }","ama":"Scheytt C. Silicon Photonics Microsystems for Communications and Sensing. In: <i>W3+Fair on Optoelectronics, Electronics, and Mechanics</i>. ; 2017.","mla":"Scheytt, Christoph. “Silicon Photonics Microsystems for Communications and Sensing.” <i>W3+Fair on Optoelectronics, Electronics, and Mechanics</i>, 2017."},"publication":"W3+Fair on Optoelectronics, Electronics, and Mechanics"},{"language":[{"iso":"eng"}],"_id":"53591","user_id":"16243","editor":[{"full_name":"Müller-Gridschneder, Daniel","first_name":"Daniel","last_name":"Müller-Gridschneder"}],"title":"Proceedings of the 2nd International Workshop on Resiliency in Embedded Electronic Systems","year":"2017","status":"public","date_updated":"2024-04-18T22:12:47Z","date_created":"2024-04-18T21:40:02Z","place":"Lausanne, Switzerland","type":"book_editor","department":[{"_id":"58"}],"citation":{"chicago":"Müller-Gridschneder, Daniel, ed. <i>Proceedings of the 2nd International Workshop on Resiliency in Embedded Electronic Systems</i>. Lausanne, Switzerland, 2017.","short":"D. Müller-Gridschneder, ed., Proceedings of the 2nd International Workshop on Resiliency in Embedded Electronic Systems, Lausanne, Switzerland, 2017.","ieee":"D. Müller-Gridschneder, Ed., <i>Proceedings of the 2nd International Workshop on Resiliency in Embedded Electronic Systems</i>. Lausanne, Switzerland, 2017.","apa":"Müller-Gridschneder, D. (Ed.). (2017). <i>Proceedings of the 2nd International Workshop on Resiliency in Embedded Electronic Systems</i>.","bibtex":"@book{Müller-Gridschneder_2017, place={Lausanne, Switzerland}, title={Proceedings of the 2nd International Workshop on Resiliency in Embedded Electronic Systems}, year={2017} }","ama":"Müller-Gridschneder D, ed. <i>Proceedings of the 2nd International Workshop on Resiliency in Embedded Electronic Systems</i>.; 2017.","mla":"Müller-Gridschneder, Daniel, editor. <i>Proceedings of the 2nd International Workshop on Resiliency in Embedded Electronic Systems</i>. 2017."}},{"language":[{"iso":"eng"}],"_id":"24212","doi":"https://doi.org/10.1364/FIO.2017.FM3A.3","user_id":"13256","conference":{"start_date":"2017.09.18","end_date":"2017.09.21"},"author":[{"first_name":"Sergiy","last_name":"Gudyriev","full_name":"Gudyriev, Sergiy"},{"id":"37144","full_name":"Scheytt, Christoph","orcid":"https://orcid.org/0000-0002-5950-6618","first_name":"Christoph","last_name":"Scheytt"},{"last_name":"Kress","first_name":"Christian","full_name":"Kress, Christian","id":"13256"},{"full_name":"Yan, Lei","last_name":"Yan","first_name":"Lei"},{"first_name":"Meuer","last_name":"Christian","full_name":"Christian, Meuer"},{"full_name":"Zimmermann, Lars","first_name":"Lars","last_name":"Zimmermann"}],"publication_identifier":{"isbn":["978-1-943580-33-0"]},"year":"2017","status":"public","title":"Fully-Differential, Hybrid, Multi-channel 4x25Gbps Direct Direction Receiver in 0.25\\textmum BiCMOS SiGe Technology","date_updated":"2023-08-04T08:31:47Z","date_created":"2021-09-13T08:15:31Z","department":[{"_id":"58"},{"_id":"230"}],"type":"journal_article","citation":{"bibtex":"@article{Gudyriev_Scheytt_Kress_Yan_Christian_Zimmermann_2017, title={Fully-Differential, Hybrid, Multi-channel 4x25Gbps Direct Direction Receiver in 0.25\\textmum BiCMOS SiGe Technology}, DOI={<a href=\"https://doi.org/10.1364/FIO.2017.FM3A.3\">https://doi.org/10.1364/FIO.2017.FM3A.3</a>}, journal={OSA Frontiers in Optics + Laser Science}, author={Gudyriev, Sergiy and Scheytt, Christoph and Kress, Christian and Yan, Lei and Christian, Meuer and Zimmermann, Lars}, year={2017} }","ama":"Gudyriev S, Scheytt C, Kress C, Yan L, Christian M, Zimmermann L. Fully-Differential, Hybrid, Multi-channel 4x25Gbps Direct Direction Receiver in 0.25\\textmum BiCMOS SiGe Technology. <i>OSA Frontiers in Optics + Laser Science</i>. Published online 2017. doi:<a href=\"https://doi.org/10.1364/FIO.2017.FM3A.3\">https://doi.org/10.1364/FIO.2017.FM3A.3</a>","mla":"Gudyriev, Sergiy, et al. “Fully-Differential, Hybrid, Multi-Channel 4x25Gbps Direct Direction Receiver in 0.25\\textmum BiCMOS SiGe Technology.” <i>OSA Frontiers in Optics + Laser Science</i>, 2017, doi:<a href=\"https://doi.org/10.1364/FIO.2017.FM3A.3\">https://doi.org/10.1364/FIO.2017.FM3A.3</a>.","chicago":"Gudyriev, Sergiy, Christoph Scheytt, Christian Kress, Lei Yan, Meuer Christian, and Lars Zimmermann. “Fully-Differential, Hybrid, Multi-Channel 4x25Gbps Direct Direction Receiver in 0.25\\textmum BiCMOS SiGe Technology.” <i>OSA Frontiers in Optics + Laser Science</i>, 2017. <a href=\"https://doi.org/10.1364/FIO.2017.FM3A.3\">https://doi.org/10.1364/FIO.2017.FM3A.3</a>.","short":"S. Gudyriev, C. Scheytt, C. Kress, L. Yan, M. Christian, L. Zimmermann, OSA Frontiers in Optics + Laser Science (2017).","ieee":"S. Gudyriev, C. Scheytt, C. Kress, L. Yan, M. Christian, and L. Zimmermann, “Fully-Differential, Hybrid, Multi-channel 4x25Gbps Direct Direction Receiver in 0.25\\textmum BiCMOS SiGe Technology,” <i>OSA Frontiers in Optics + Laser Science</i>, 2017, doi: <a href=\"https://doi.org/10.1364/FIO.2017.FM3A.3\">https://doi.org/10.1364/FIO.2017.FM3A.3</a>.","apa":"Gudyriev, S., Scheytt, C., Kress, C., Yan, L., Christian, M., &#38; Zimmermann, L. (2017). Fully-Differential, Hybrid, Multi-channel 4x25Gbps Direct Direction Receiver in 0.25\\textmum BiCMOS SiGe Technology. <i>OSA Frontiers in Optics + Laser Science</i>. <a href=\"https://doi.org/10.1364/FIO.2017.FM3A.3\">https://doi.org/10.1364/FIO.2017.FM3A.3</a>"},"publication":"OSA Frontiers in Optics + Laser Science","related_material":{"link":[{"relation":"confirmation","url":"https://www.osapublishing.org/abstract.cfm?uri=FiO-2017-FM3A.3"}]},"abstract":[{"lang":"eng","text":"A hybrid multi-channel receiver featuring fully-differential transimpedance input stages for 25Gbps data rate per channel is presented along with measurement results focusing on the channel-to-channel interference and sensitivity. OMA of -16dBm at a BER of 10−4 is estimated at the photodiode for all channels. Each channel dissipates 330mW of power provided from a single 3.3V supply voltage."}]},{"language":[{"iso":"eng"}],"_id":"24219","publisher":"VDE ITG","user_id":"59648","publication_identifier":{"isbn":["978-3-8007-4428-2"]},"author":[{"last_name":"Kuhn","first_name":"Peter","full_name":"Kuhn, Peter"},{"full_name":"Haddadian, Sanaz","first_name":"Sanaz","last_name":"Haddadian","id":"59648"},{"full_name":"Meyer, Frederic","first_name":"Frederic","last_name":"Meyer"},{"first_name":"Marc","last_name":"Hoffmann","full_name":"Hoffmann, Marc"},{"full_name":"Grabmaier, Anton","first_name":"Anton","last_name":"Grabmaier"},{"id":"37144","orcid":"0000-0002-5950-6618 ","first_name":"Christoph","last_name":"Scheytt","full_name":"Scheytt, Christoph"},{"first_name":"Thomas","last_name":"Kaiser","full_name":"Kaiser, Thomas"}],"title":"SHF RFID System for Automatic Process Optimization with Intelligent Tools","status":"public","year":"2017","date_updated":"2025-02-13T14:23:57Z","place":"München, Germany","date_created":"2021-09-13T08:20:34Z","department":[{"_id":"58"}],"type":"conference","citation":{"short":"P. Kuhn, S. Haddadian, F. Meyer, M. Hoffmann, A. Grabmaier, C. Scheytt, T. Kaiser, in: Smart SysTech 2017; European Conference on Smart Objects, Systems and Technologies, VDE ITG, München, Germany, 2017.","chicago":"Kuhn, Peter, Sanaz Haddadian, Frederic Meyer, Marc Hoffmann, Anton Grabmaier, Christoph Scheytt, and Thomas Kaiser. “SHF RFID System for Automatic Process Optimization with Intelligent Tools.” In <i>Smart SysTech 2017; European Conference on Smart Objects, Systems and Technologies</i>. München, Germany: VDE ITG, 2017.","ieee":"P. Kuhn <i>et al.</i>, “SHF RFID System for Automatic Process Optimization with Intelligent Tools,” 2017.","apa":"Kuhn, P., Haddadian, S., Meyer, F., Hoffmann, M., Grabmaier, A., Scheytt, C., &#38; Kaiser, T. (2017). SHF RFID System for Automatic Process Optimization with Intelligent Tools. <i>Smart SysTech 2017; European Conference on Smart Objects, Systems and Technologies</i>.","bibtex":"@inproceedings{Kuhn_Haddadian_Meyer_Hoffmann_Grabmaier_Scheytt_Kaiser_2017, place={München, Germany}, title={SHF RFID System for Automatic Process Optimization with Intelligent Tools}, booktitle={Smart SysTech 2017; European Conference on Smart Objects, Systems and Technologies}, publisher={VDE ITG}, author={Kuhn, Peter and Haddadian, Sanaz and Meyer, Frederic and Hoffmann, Marc and Grabmaier, Anton and Scheytt, Christoph and Kaiser, Thomas}, year={2017} }","ama":"Kuhn P, Haddadian S, Meyer F, et al. SHF RFID System for Automatic Process Optimization with Intelligent Tools. In: <i>Smart SysTech 2017; European Conference on Smart Objects, Systems and Technologies</i>. VDE ITG; 2017.","mla":"Kuhn, Peter, et al. “SHF RFID System for Automatic Process Optimization with Intelligent Tools.” <i>Smart SysTech 2017; European Conference on Smart Objects, Systems and Technologies</i>, VDE ITG, 2017."},"publication":"Smart SysTech 2017; European Conference on Smart Objects, Systems and Technologies","abstract":[{"lang":"eng","text":"In this paper we present theoretical, simulated and measured data for a reader to tag communication RFID system at 5.8 GHz. First a theoretical link budget analysis for a reader to tag architecture is shown for a wireless industrial application at 1m distance. This includes a power budget of the passively powered transponder. The received power level of the backscattered data for the theoretical link budget is -52:5 dBm. For the first setup slot antennas are developed and measured in the anechoic chamber. The measured gain is 4.0 dB. The power of the backscatter data in setup 1 is -74:8 dBm. This corresponds to the theoretical link budget since, all losses such as cable or lower antenna gain are taken into account. Setup 2 is upgraded on the reader side with horn antennas. At 5.8 GHz, the gain reaches the value of 10.8 dB. The second setup shows improvement in the receiving backscattered power to a value of -62:4 dBm. Furthermore, as a solution to detect those transponders not presented in the main slope of the antenna, a steerable beam is introduced by means of a Rotman lens. On the topic of the passive transponder, different harvesting topologies at 5.8 GHz are investigated, and the efficiency simulation of the harvesting circuitry has been performed. The simulated efficiency of the implemented technique is 68 %."}]},{"page":"18","language":[{"iso":"eng"}],"_id":"24222","publisher":"Technische Universität Berlin","user_id":"59648","status":"public","year":"2017","title":"Energy Harvesting Analysis for Next Generation Passive RFID Tags","author":[{"id":"59648","full_name":"Haddadian, Sanaz","first_name":"Sanaz","last_name":"Haddadian"},{"id":"37144","full_name":"Scheytt, Christoph","orcid":"0000-0002-5950-6618 ","last_name":"Scheytt","first_name":"Christoph"},{"first_name":"Roland","last_name":"Kramer","full_name":"Kramer, Roland"}],"date_updated":"2025-02-13T14:24:50Z","place":"Berlin, Germany","date_created":"2021-09-13T08:20:37Z","type":"conference","department":[{"_id":"58"}],"publication":"ANALOG 2017; 16th ITG/GMM-Symposium","citation":{"ieee":"S. Haddadian, C. Scheytt, and R. Kramer, “Energy Harvesting Analysis for Next Generation Passive RFID Tags,” in <i>ANALOG 2017; 16th ITG/GMM-Symposium</i>, 2017, p. 18.","apa":"Haddadian, S., Scheytt, C., &#38; Kramer, R. (2017). Energy Harvesting Analysis for Next Generation Passive RFID Tags. <i>ANALOG 2017; 16th ITG/GMM-Symposium</i>, 18.","chicago":"Haddadian, Sanaz, Christoph Scheytt, and Roland Kramer. “Energy Harvesting Analysis for Next Generation Passive RFID Tags.” In <i>ANALOG 2017; 16th ITG/GMM-Symposium</i>, 18. Berlin, Germany: Technische Universität Berlin, 2017.","short":"S. Haddadian, C. Scheytt, R. Kramer, in: ANALOG 2017; 16th ITG/GMM-Symposium, Technische Universität Berlin, Berlin, Germany, 2017, p. 18.","mla":"Haddadian, Sanaz, et al. “Energy Harvesting Analysis for Next Generation Passive RFID Tags.” <i>ANALOG 2017; 16th ITG/GMM-Symposium</i>, Technische Universität Berlin, 2017, p. 18.","bibtex":"@inproceedings{Haddadian_Scheytt_Kramer_2017, place={Berlin, Germany}, title={Energy Harvesting Analysis for Next Generation Passive RFID Tags}, booktitle={ANALOG 2017; 16th ITG/GMM-Symposium}, publisher={Technische Universität Berlin}, author={Haddadian, Sanaz and Scheytt, Christoph and Kramer, Roland}, year={2017}, pages={18} }","ama":"Haddadian S, Scheytt C, Kramer R. Energy Harvesting Analysis for Next Generation Passive RFID Tags. In: <i>ANALOG 2017; 16th ITG/GMM-Symposium</i>. Technische Universität Berlin; 2017:18."},"abstract":[{"text":"This paper focuses on the design  of a high\r\nefficiency cross-connected differential drive rectifier for\r\nnext-generation passive RFID tags. To provide a\r\nrealistic estimation of the transponders’power and\r\nefficiency requirements at 5.8 GHz, detailed\r\nlink/power-budget analysis for various blocks of the tag\r\nchip is carried  out. From  link  budget  analysis  realistic\r\nRF  power  levels  are  obtained  and  a  rectifier  with  high\r\nconversion  efficiency  at  low  power  levels  is  designed.\r\nSimulations based on a commercial 65nm CMOS\r\ntechnology  investigate  the  suitability  of  the  harvesting\r\ncircuit for 5.8 GHz RFID tags.","lang":"eng"}]},{"language":[{"iso":"eng"}],"_id":"24264","user_id":"15931","doi":"10.1109/VLSI-SoC.2016.7753545","title":"Fast Dynamic Fault Injection for Virtual Microcontroller Platforms","year":"2016","status":"public","author":[{"first_name":"Peer","last_name":"Adelt","full_name":"Adelt, Peer","id":"5603"},{"id":"25260","full_name":"Koppelmann, Bastian","last_name":"Koppelmann","first_name":"Bastian"},{"first_name":"Wolfgang","last_name":"Müller","full_name":"Müller, Wolfgang","id":"16243"},{"first_name":"Markus","last_name":"Becker","full_name":"Becker, Markus"},{"full_name":"Kleinjohann, Bernd","last_name":"Kleinjohann","first_name":"Bernd"},{"full_name":"Scheytt, Christoph","first_name":"Christoph","last_name":"Scheytt","id":"37144"}],"publication_identifier":{"eissn":["2324-8440"]},"conference":{"start_date":"2016.09.26","end_date":"2016.09.28"},"date_updated":"2022-02-17T13:57:45Z","date_created":"2021-09-13T09:44:30Z","place":"Tallin, Estonia","type":"conference","department":[{"_id":"58"}],"publication":"Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)","citation":{"ama":"Adelt P, Koppelmann B, Müller W, Becker M, Kleinjohann B, Scheytt C. Fast Dynamic Fault Injection for Virtual Microcontroller Platforms. In: <i>Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)</i>. ; 2016. doi:<a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">10.1109/VLSI-SoC.2016.7753545</a>","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Becker_Kleinjohann_Scheytt_2016, place={Tallin, Estonia}, title={Fast Dynamic Fault Injection for Virtual Microcontroller Platforms}, DOI={<a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">10.1109/VLSI-SoC.2016.7753545</a>}, booktitle={Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Becker, Markus and Kleinjohann, Bernd and Scheytt, Christoph}, year={2016} }","mla":"Adelt, Peer, et al. “Fast Dynamic Fault Injection for Virtual Microcontroller Platforms.” <i>Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)</i>, 2016, doi:<a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">10.1109/VLSI-SoC.2016.7753545</a>.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Markus Becker, Bernd Kleinjohann, and Christoph Scheytt. “Fast Dynamic Fault Injection for Virtual Microcontroller Platforms.” In <i>Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)</i>. Tallin, Estonia, 2016. <a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">https://doi.org/10.1109/VLSI-SoC.2016.7753545</a>.","short":"P. Adelt, B. Koppelmann, W. Müller, M. Becker, B. Kleinjohann, C. Scheytt, in: Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC), Tallin, Estonia, 2016.","apa":"Adelt, P., Koppelmann, B., Müller, W., Becker, M., Kleinjohann, B., &#38; Scheytt, C. (2016). Fast Dynamic Fault Injection for Virtual Microcontroller Platforms. <i>Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)</i>. <a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">https://doi.org/10.1109/VLSI-SoC.2016.7753545</a>","ieee":"P. Adelt, B. Koppelmann, W. Müller, M. Becker, B. Kleinjohann, and C. Scheytt, “Fast Dynamic Fault Injection for Virtual Microcontroller Platforms,” 2016, doi: <a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">10.1109/VLSI-SoC.2016.7753545</a>."},"related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/7753545"}]},"abstract":[{"text":"Electronic systems, like they are embedded in road vehicles, have to be compliant to functional safety standards like ISO 26262 [1], which limit the impacts of malfunctions for safety critical systems. ISO 26262, for instance, defines different safety levels for road vehicles, which require different means and measures for a safety compliant system and its development process like risk analysis and fault effect simulation. For fault effect simulation it is important to investigate the impact of physical and hardware related effects to the correct function of a system. This article first studies code and model mutations for fault injection in the context of fault effect simulation through different system abstraction levels. It demonstrates how high level mutations correlate to bit flips of software binaries by examples from the TriCore™ instruction set and finally presents a virtual platform based implementation for automated injection of bit flip based mutations into software binaries. Experimental results demonstrate the efficiency of the implemented approach.","lang":"eng"}]},{"year":"2016","status":"public","title":"An all-transmission-line 220 GHz differential LNA in SiGe BiCMOS","conference":{"end_date":"2016.08.26","start_date":"2016.08.24"},"publication_identifier":{"eisbn":["978-1-5090-1235-0"]},"author":[{"last_name":"Mao","first_name":"Yanfei","full_name":"Mao, Yanfei"},{"last_name":"Schmalz","first_name":"Klaus","full_name":"Schmalz, Klaus"},{"last_name":"Scheytt","first_name":"Christoph","full_name":"Scheytt, Christoph","id":"37144"},{"last_name":"Shiju","first_name":"E.","full_name":"Shiju, E."}],"date_updated":"2022-02-17T14:00:40Z","language":[{"iso":"eng"}],"_id":"24265","doi":"10.1109/RFIT.2016.7578132","user_id":"15931","publication":"IEEE International Symposium on Radio-Frequency Integration Technology","citation":{"short":"Y. Mao, K. Schmalz, C. Scheytt, E. Shiju, in: IEEE International Symposium on Radio-Frequency Integration Technology, Taipei, Taiwan, 2016.","chicago":"Mao, Yanfei, Klaus Schmalz, Christoph Scheytt, and E. Shiju. “An All-Transmission-Line 220 GHz Differential LNA in SiGe BiCMOS.” In <i>IEEE International Symposium on Radio-Frequency Integration Technology</i>. Taipei, Taiwan, 2016. <a href=\"https://doi.org/10.1109/RFIT.2016.7578132\">https://doi.org/10.1109/RFIT.2016.7578132</a>.","ieee":"Y. Mao, K. Schmalz, C. Scheytt, and E. Shiju, “An all-transmission-line 220 GHz differential LNA in SiGe BiCMOS,” 2016, doi: <a href=\"https://doi.org/10.1109/RFIT.2016.7578132\">10.1109/RFIT.2016.7578132</a>.","apa":"Mao, Y., Schmalz, K., Scheytt, C., &#38; Shiju, E. (2016). An all-transmission-line 220 GHz differential LNA in SiGe BiCMOS. <i>IEEE International Symposium on Radio-Frequency Integration Technology</i>. <a href=\"https://doi.org/10.1109/RFIT.2016.7578132\">https://doi.org/10.1109/RFIT.2016.7578132</a>","bibtex":"@inproceedings{Mao_Schmalz_Scheytt_Shiju_2016, place={Taipei, Taiwan}, title={An all-transmission-line 220 GHz differential LNA in SiGe BiCMOS}, DOI={<a href=\"https://doi.org/10.1109/RFIT.2016.7578132\">10.1109/RFIT.2016.7578132</a>}, booktitle={IEEE International Symposium on Radio-Frequency Integration Technology}, author={Mao, Yanfei and Schmalz, Klaus and Scheytt, Christoph and Shiju, E.}, year={2016} }","ama":"Mao Y, Schmalz K, Scheytt C, Shiju E. An all-transmission-line 220 GHz differential LNA in SiGe BiCMOS. In: <i>IEEE International Symposium on Radio-Frequency Integration Technology</i>. ; 2016. doi:<a href=\"https://doi.org/10.1109/RFIT.2016.7578132\">10.1109/RFIT.2016.7578132</a>","mla":"Mao, Yanfei, et al. “An All-Transmission-Line 220 GHz Differential LNA in SiGe BiCMOS.” <i>IEEE International Symposium on Radio-Frequency Integration Technology</i>, 2016, doi:<a href=\"https://doi.org/10.1109/RFIT.2016.7578132\">10.1109/RFIT.2016.7578132</a>."},"related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/7578132"}]},"abstract":[{"text":"This paper presents a four stage all-transmission-line 220 GHz differential LNA in SiGe BiCMOS technology. Cascode topology is chosen for each stage. The amplifier takes advantage of microstrip transmission lines to realize the inductive load, Marshand balun, input, output, and inter-stage matching of the LNA. The LNA has a gain of 21 dB at 224 GHz, a 3 dB bandwidth of more than 6 GHz. It has a supply voltage of 3V and power dissipation of 234 mW. The amplifier is intended for the use in communication, security scanning, imaging and remote sensing at 220 GHz.","lang":"eng"}],"place":"Taipei, Taiwan","date_created":"2021-09-13T09:44:31Z","type":"conference","department":[{"_id":"58"}]},{"status":"public","title":"Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study","year":"2016","publication_identifier":{"isbn":["978-3-8007-4265-3"]},"author":[{"last_name":"Abughannam","first_name":"Saed","full_name":"Abughannam, Saed","id":"37628"},{"last_name":"Wu","first_name":"Liang","full_name":"Wu, Liang","id":"30401"},{"id":"16243","full_name":"Müller, Wolfgang","first_name":"Wolfgang","last_name":"Müller"},{"last_name":"Scheytt","first_name":"Christoph","full_name":"Scheytt, Christoph","id":"37144"},{"last_name":"Ecker","first_name":"Wolfgang","full_name":"Ecker, Wolfgang"},{"full_name":"Novello, Christiano","first_name":"Christiano","last_name":"Novello"}],"conference":{"end_date":"2016.09.14","start_date":"2016.09.12"},"date_updated":"2022-02-17T13:58:08Z","language":[{"iso":"eng"}],"_id":"24263","user_id":"15931","publication":"Analog 2016 - VDE","citation":{"mla":"Abughannam, Saed, et al. “Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study.” <i>Analog 2016 - VDE</i>, 2016.","ama":"Abughannam S, Wu L, Müller W, Scheytt C, Ecker W, Novello C. Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study. In: <i>Analog 2016 - VDE</i>. ; 2016.","bibtex":"@inproceedings{Abughannam_Wu_Müller_Scheytt_Ecker_Novello_2016, title={Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study}, booktitle={Analog 2016 - VDE}, author={Abughannam, Saed and Wu, Liang and Müller, Wolfgang and Scheytt, Christoph and Ecker, Wolfgang and Novello, Christiano}, year={2016} }","apa":"Abughannam, S., Wu, L., Müller, W., Scheytt, C., Ecker, W., &#38; Novello, C. (2016). Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study. <i>Analog 2016 - VDE</i>.","ieee":"S. Abughannam, L. Wu, W. Müller, C. Scheytt, W. Ecker, and C. Novello, “Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study,” 2016.","chicago":"Abughannam, Saed, Liang Wu, Wolfgang Müller, Christoph Scheytt, Wolfgang Ecker, and Christiano Novello. “Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study.” In <i>Analog 2016 - VDE</i>, 2016.","short":"S. Abughannam, L. Wu, W. Müller, C. Scheytt, W. Ecker, C. Novello, in: Analog 2016 - VDE, 2016."},"abstract":[{"text":"The design of safety critical systems requires an efficient methodology for an effective fault effect simulation for analog and digital circuits where analog fault injection and fault effect simulation is currently a field of active research and commercial tools are not available yet. This article begins by discussing fault injection strategies for analog circuits applied on a case study with two topologies of a Voltage Controlled Oscillator (VCO). In the second part it performs on the basis of the example of a Wireless Sensor Network (WSN) node, how far different mixed level implementations with Verilog-A and SPICE can affect the simulation time and points out which component consumes the major part of the simulation time.","lang":"eng"}],"related_material":{"link":[{"url":"https://ieeexplore.ieee.org/document/7584296/","relation":"confirmation"}]},"date_created":"2021-09-13T09:44:29Z","type":"conference","department":[{"_id":"58"}]},{"abstract":[{"text":"Currently, all drone manufactures face the same problem: flight safety utility will become mandatory to obtain the legal admission for broad commercial use of drones. This means that on-board obstacle detection and collision avoidance is a must-have in order to overcome existing legal barriers and acceptance issues. Some of the currently available sensors are too large, too heavy, or can be poorly integrated into existing systems. During the exhibition a demonstration of a novel micro-sensor operating at 120 GHz will be given and participants will have the chance to experience the device first-hand.","lang":"eng"}],"publication":"DRONE Berlin 2016","citation":{"mla":"Nava, Federico, et al. “Obstacle Detection Using a Miniaturized Radar Sensor Operating at 120GHz ISM Band.” <i>DRONE Berlin 2016</i>, 2016.","bibtex":"@inproceedings{Nava_Genschow_Scheytt_2016, place={Berlin, Germany}, title={Obstacle detection using a miniaturized radar sensor operating at 120GHz ISM band}, booktitle={DRONE Berlin 2016}, author={Nava, Federico and Genschow, Dieter and Scheytt, Christoph}, year={2016} }","ama":"Nava F, Genschow D, Scheytt C. Obstacle detection using a miniaturized radar sensor operating at 120GHz ISM band. In: <i>DRONE Berlin 2016</i>. ; 2016.","ieee":"F. Nava, D. Genschow, and C. Scheytt, “Obstacle detection using a miniaturized radar sensor operating at 120GHz ISM band,” 2016.","apa":"Nava, F., Genschow, D., &#38; Scheytt, C. (2016). Obstacle detection using a miniaturized radar sensor operating at 120GHz ISM band. <i>DRONE Berlin 2016</i>.","short":"F. Nava, D. Genschow, C. Scheytt, in: DRONE Berlin 2016, Berlin, Germany, 2016.","chicago":"Nava, Federico, Dieter Genschow, and Christoph Scheytt. “Obstacle Detection Using a Miniaturized Radar Sensor Operating at 120GHz ISM Band.” In <i>DRONE Berlin 2016</i>. Berlin, Germany, 2016."},"type":"conference","department":[{"_id":"58"}],"date_created":"2021-09-13T09:44:27Z","place":"Berlin, Germany","date_updated":"2022-02-17T13:51:39Z","year":"2016","title":"Obstacle detection using a miniaturized radar sensor operating at 120GHz ISM band","status":"public","author":[{"full_name":"Nava, Federico","first_name":"Federico","last_name":"Nava"},{"first_name":"Dieter","last_name":"Genschow","full_name":"Genschow, Dieter"},{"id":"37144","full_name":"Scheytt, Christoph","last_name":"Scheytt","first_name":"Christoph"}],"user_id":"15931","language":[{"iso":"eng"}],"_id":"24262"},{"type":"conference","department":[{"_id":"58"}],"place":"New Brunswick, NJ, USA","date_created":"2021-09-13T09:44:39Z","related_material":{"link":[{"url":"https://ieeexplore.ieee.org/document/7738962","relation":"confirmation"}]},"abstract":[{"lang":"eng","text":"An ultra-broadband analog correlator consisting of a four-quadrant multiplier and an ultra-fast resettable integrator using only NPN transistors was designed, fabricated, and measured. For the integrator, a cross-coupled transistor pair is used as a negative resistance generator. A novel ultra-fast reset circuit is implemented which allows to reset the integrator within very short time of 120 ps. The chip was fabricated using 130 nm SiGe BiCMOS technology with fT of 250 GHz and f max of 300 GHz. In the measurements carried out on printed circuit board, the correlator operated without noticeable performance degradation with inputs up to 33 Gbps which correspond to a bandwidth of more than 24 GHz. The correlator exhibits high linearity with output P1dB of more than 9.9 dBm (700 mV diff ) for both inputs. It dissipates 122.5 mW for the core circuit excluding the 50 Ω output driver. To the knowledge of the authors, the circuit represents the fastest analog correlator published so far. It can be used for spread spectrum communication, radar signal processing, and measurement applications."}],"publication":"IEEE Bipolar/BiCMOS Circuits and Technology Meeting","citation":{"ama":"Javed AR, Scheytt C, Von der Ahe U. Linear ultra-broadband NPN-only analog correlator at 33 Gbps in 130nm SiGe BiCMOS technology. In: <i>IEEE Bipolar/BiCMOS Circuits and Technology Meeting</i>. IEEE; 2016. doi:<a href=\"https://doi.org/ 10.1109/BCTM.2016.7738962\"> 10.1109/BCTM.2016.7738962</a>","bibtex":"@inproceedings{Javed_Scheytt_Von der Ahe_2016, place={New Brunswick, NJ, USA}, title={Linear ultra-broadband NPN-only analog correlator at 33 Gbps in 130nm SiGe BiCMOS technology}, DOI={<a href=\"https://doi.org/ 10.1109/BCTM.2016.7738962\"> 10.1109/BCTM.2016.7738962</a>}, booktitle={IEEE Bipolar/BiCMOS Circuits and Technology Meeting}, publisher={IEEE}, author={Javed, Abdul Rehman and Scheytt, Christoph and Von der Ahe, Uwe}, year={2016} }","mla":"Javed, Abdul Rehman, et al. “Linear Ultra-Broadband NPN-Only Analog Correlator at 33 Gbps in 130nm SiGe BiCMOS Technology.” <i>IEEE Bipolar/BiCMOS Circuits and Technology Meeting</i>, IEEE, 2016, doi:<a href=\"https://doi.org/ 10.1109/BCTM.2016.7738962\"> 10.1109/BCTM.2016.7738962</a>.","short":"A.R. Javed, C. Scheytt, U. Von der Ahe, in: IEEE Bipolar/BiCMOS Circuits and Technology Meeting, IEEE, New Brunswick, NJ, USA, 2016.","chicago":"Javed, Abdul Rehman, Christoph Scheytt, and Uwe Von der Ahe. “Linear Ultra-Broadband NPN-Only Analog Correlator at 33 Gbps in 130nm SiGe BiCMOS Technology.” In <i>IEEE Bipolar/BiCMOS Circuits and Technology Meeting</i>. New Brunswick, NJ, USA: IEEE, 2016. <a href=\"https://doi.org/ 10.1109/BCTM.2016.7738962\">https://doi.org/ 10.1109/BCTM.2016.7738962</a>.","apa":"Javed, A. R., Scheytt, C., &#38; Von der Ahe, U. (2016). Linear ultra-broadband NPN-only analog correlator at 33 Gbps in 130nm SiGe BiCMOS technology. <i>IEEE Bipolar/BiCMOS Circuits and Technology Meeting</i>. <a href=\"https://doi.org/ 10.1109/BCTM.2016.7738962\">https://doi.org/ 10.1109/BCTM.2016.7738962</a>","ieee":"A. R. Javed, C. Scheytt, and U. Von der Ahe, “Linear ultra-broadband NPN-only analog correlator at 33 Gbps in 130nm SiGe BiCMOS technology,” 2016, doi: <a href=\"https://doi.org/ 10.1109/BCTM.2016.7738962\"> 10.1109/BCTM.2016.7738962</a>."},"doi":" 10.1109/BCTM.2016.7738962","user_id":"15931","publisher":"IEEE","_id":"24271","language":[{"iso":"eng"}],"date_updated":"2022-02-17T14:09:28Z","year":"2016","title":"Linear ultra-broadband NPN-only analog correlator at 33 Gbps in 130nm SiGe BiCMOS technology","status":"public","conference":{"start_date":"2016.11.10"},"author":[{"full_name":"Javed, Abdul Rehman","last_name":"Javed","first_name":"Abdul Rehman"},{"id":"37144","last_name":"Scheytt","first_name":"Christoph","full_name":"Scheytt, Christoph"},{"id":"15739","first_name":"Uwe","last_name":"Von der Ahe","full_name":"Von der Ahe, Uwe"}],"publication_identifier":{"eissn":["https://ieeexplore.ieee.org/document/7738962"]}},{"doi":" 10.1016/j.protcy.2016.08.031","user_id":"15931","publisher":"Elsevier","_id":"24269","language":[{"iso":"eng"}],"page":"227-234","date_updated":"2022-02-17T14:06:38Z","author":[{"full_name":"Jatzkowski, Jan","last_name":"Jatzkowski","first_name":"Jan"},{"id":"5603","full_name":"Adelt, Peer","last_name":"Adelt","first_name":"Peer"},{"last_name":"Rettberg","first_name":"Achim","full_name":"Rettberg, Achim"}],"title":"Hierarchical Scheduling for Plug-and-Produce","status":"public","year":"2016","department":[{"_id":"58"}],"type":"conference","place":"Paderborn, DE","date_created":"2021-09-13T09:44:37Z","related_material":{"link":[{"url":"https://scholar.google.de/scholar?q=10.1016/j.protcy.2016.08.031&hl=de&as_sdt=0&as_vis=1&oi=scholart","relation":"confirmation"}]},"abstract":[{"lang":"eng","text":"Today's increasing number of sensors and computation nodes covered by cyber physical systems (CPS) results in rising complexity. For instance, computation results are based on measured data whose quality strongly depends on their age. CPS therefore have real-time requirements on computation results and communication to keep temporal dependency between measured inputs and computed outputs. In addition, today's CPS shall be modular to enable flexibility and scalability, e.g., postulated for production systems in context of Industry 4.0. Enabling CPS to easily integrate components by some Plug-and-Produce mechanism is desired.In this paper, we aim at enabling Plug-and-Produce in CPS using hypervisor-based virtualization. This implies hierarchical scheduling of dependent real-time systems. Here, dependencies are given by precedence constraints of tasks. Based on an approach for detection of new components added to a real-time network, in this paper we focus on integration of enabled applications into the current schedule of a computation node. Here, enabled application refers to an application software that just got executable by plugging some component to the CPS. Applications are encapsulated by virtual machines and provide a self-description including information about required and provided data as well as timing behavior. This self-description is used to adjust global scheduling and thus include new functionality to the CPS."}],"citation":{"chicago":"Jatzkowski, Jan, Peer Adelt, and Achim Rettberg. “Hierarchical Scheduling for Plug-and-Produce.” In <i>3rd International Conference on System-Integrated Intelligence: New Challenges for Product and Production Engineering</i>, 227–34. Paderborn, DE: Elsevier, 2016. <a href=\"https://doi.org/ 10.1016/j.protcy.2016.08.031\">https://doi.org/ 10.1016/j.protcy.2016.08.031</a>.","short":"J. Jatzkowski, P. Adelt, A. Rettberg, in: 3rd International Conference on System-Integrated Intelligence: New Challenges for Product and Production Engineering, Elsevier, Paderborn, DE, 2016, pp. 227–234.","ieee":"J. Jatzkowski, P. Adelt, and A. Rettberg, “Hierarchical Scheduling for Plug-and-Produce,” in <i>3rd International Conference on System-integrated Intelligence: New Challenges for Product and Production Engineering</i>, 2016, pp. 227–234, doi: <a href=\"https://doi.org/ 10.1016/j.protcy.2016.08.031\"> 10.1016/j.protcy.2016.08.031</a>.","apa":"Jatzkowski, J., Adelt, P., &#38; Rettberg, A. (2016). Hierarchical Scheduling for Plug-and-Produce. <i>3rd International Conference on System-Integrated Intelligence: New Challenges for Product and Production Engineering</i>, 227–234. <a href=\"https://doi.org/ 10.1016/j.protcy.2016.08.031\">https://doi.org/ 10.1016/j.protcy.2016.08.031</a>","bibtex":"@inproceedings{Jatzkowski_Adelt_Rettberg_2016, place={Paderborn, DE}, title={Hierarchical Scheduling for Plug-and-Produce}, DOI={<a href=\"https://doi.org/ 10.1016/j.protcy.2016.08.031\"> 10.1016/j.protcy.2016.08.031</a>}, booktitle={3rd International Conference on System-integrated Intelligence: New Challenges for Product and Production Engineering}, publisher={Elsevier}, author={Jatzkowski, Jan and Adelt, Peer and Rettberg, Achim}, year={2016}, pages={227–234} }","ama":"Jatzkowski J, Adelt P, Rettberg A. Hierarchical Scheduling for Plug-and-Produce. In: <i>3rd International Conference on System-Integrated Intelligence: New Challenges for Product and Production Engineering</i>. Elsevier; 2016:227-234. doi:<a href=\"https://doi.org/ 10.1016/j.protcy.2016.08.031\"> 10.1016/j.protcy.2016.08.031</a>","mla":"Jatzkowski, Jan, et al. “Hierarchical Scheduling for Plug-and-Produce.” <i>3rd International Conference on System-Integrated Intelligence: New Challenges for Product and Production Engineering</i>, Elsevier, 2016, pp. 227–34, doi:<a href=\"https://doi.org/ 10.1016/j.protcy.2016.08.031\"> 10.1016/j.protcy.2016.08.031</a>."},"publication":"3rd International Conference on System-integrated Intelligence: New Challenges for Product and Production Engineering"},{"date_updated":"2022-02-17T14:07:47Z","status":"public","title":"Ultra-compact 122GHz Radar Sensor for Autonomous Aircrafts","year":"2016","author":[{"full_name":"Nava, Federico","first_name":"Federico","last_name":"Nava"},{"id":"37144","last_name":"Scheytt","first_name":"Christoph","full_name":"Scheytt, Christoph"},{"last_name":"Zwick","first_name":"Thomas","full_name":"Zwick, Thomas"},{"last_name":"Pauli","first_name":"Mario","full_name":"Pauli, Mario"},{"last_name":"Goettel","first_name":"B.","full_name":"Goettel, B."},{"last_name":"Winkler","first_name":"Wolfgang","full_name":"Winkler, Wolfgang"}],"user_id":"15931","doi":" 10.1016/j.protcy.2016.08.051","_id":"24270","language":[{"iso":"eng"}],"abstract":[{"text":"In this paper a prototype of an ultra-compact continuous-wave (CW) and frequency-modulated continuous-wave (FMCW) radar system using a highly-integrated radar chip and in-package antennas will be presented. An introduction will be given on the concept of antenna integration for millimeter-wave radar and the advantages of such systems. The radar then will be described in its main components, a 122 GHz Integrated Circuit including in-package antennas as well as the acquisition and processing system realized using flexible printed circuit board (FLEX PCB) technology. Furthermore initial measurements of the radar system will be presented and explained. ","lang":"eng"}],"related_material":{"link":[{"relation":"confirmation","url":"https://scholar.google.de/scholar?hl=de&as_sdt=0%2C5&as_vis=1&q=+10.1016%2Fj.protcy.2016.08.051&btnG="}]},"publication":" 3rd International Conference on System-Integrated Intelligence","citation":{"mla":"Nava, Federico, et al. “Ultra-Compact 122GHz Radar Sensor for Autonomous Aircrafts.” <i> 3rd International Conference on System-Integrated Intelligence</i>, 2016, doi:<a href=\"https://doi.org/ 10.1016/j.protcy.2016.08.051\"> 10.1016/j.protcy.2016.08.051</a>.","ama":"Nava F, Scheytt C, Zwick T, Pauli M, Goettel B, Winkler W. Ultra-compact 122GHz Radar Sensor for Autonomous Aircrafts. In: <i> 3rd International Conference on System-Integrated Intelligence</i>. ; 2016. doi:<a href=\"https://doi.org/ 10.1016/j.protcy.2016.08.051\"> 10.1016/j.protcy.2016.08.051</a>","bibtex":"@inproceedings{Nava_Scheytt_Zwick_Pauli_Goettel_Winkler_2016, place={Paderborn, Germany}, title={Ultra-compact 122GHz Radar Sensor for Autonomous Aircrafts}, DOI={<a href=\"https://doi.org/ 10.1016/j.protcy.2016.08.051\"> 10.1016/j.protcy.2016.08.051</a>}, booktitle={ 3rd International Conference on System-Integrated Intelligence}, author={Nava, Federico and Scheytt, Christoph and Zwick, Thomas and Pauli, Mario and Goettel, B. and Winkler, Wolfgang}, year={2016} }","apa":"Nava, F., Scheytt, C., Zwick, T., Pauli, M., Goettel, B., &#38; Winkler, W. (2016). Ultra-compact 122GHz Radar Sensor for Autonomous Aircrafts. <i> 3rd International Conference on System-Integrated Intelligence</i>. <a href=\"https://doi.org/ 10.1016/j.protcy.2016.08.051\">https://doi.org/ 10.1016/j.protcy.2016.08.051</a>","ieee":"F. Nava, C. Scheytt, T. Zwick, M. Pauli, B. Goettel, and W. Winkler, “Ultra-compact 122GHz Radar Sensor for Autonomous Aircrafts,” 2016, doi: <a href=\"https://doi.org/ 10.1016/j.protcy.2016.08.051\"> 10.1016/j.protcy.2016.08.051</a>.","chicago":"Nava, Federico, Christoph Scheytt, Thomas Zwick, Mario Pauli, B. Goettel, and Wolfgang Winkler. “Ultra-Compact 122GHz Radar Sensor for Autonomous Aircrafts.” In <i> 3rd International Conference on System-Integrated Intelligence</i>. Paderborn, Germany, 2016. <a href=\"https://doi.org/ 10.1016/j.protcy.2016.08.051\">https://doi.org/ 10.1016/j.protcy.2016.08.051</a>.","short":"F. Nava, C. Scheytt, T. Zwick, M. Pauli, B. Goettel, W. Winkler, in:  3rd International Conference on System-Integrated Intelligence, Paderborn, Germany, 2016."},"type":"conference","department":[{"_id":"58"}],"date_created":"2021-09-13T09:44:38Z","place":"Paderborn, Germany"},{"abstract":[{"text":"Recently electronic-photonic integrated circuits (EPIC) technology platforms became available [1] which allow fabrication of very compact and fast monolithic receivers. However, although the cointegration of electronics and photonics on the same chip allows for novel circuit topologies which could help to improve circuit performance quite often transmitter and receiver circuit design is using more or less conventional approaches. We propose a novel architecture that effectively utilizes the benefits of the EPIC technology such as: very short interconnects between the photodiode and the amplifier, symmetrical and compact photodiode structure with low operating voltages. Our architecture shown in Fig. 1 features fully-differential input stage, automatic biasing of the photodiode, DC coupling between diode and transimpedance amplifier (TIA) and very small footprint.","lang":"eng"}],"related_material":{"link":[{"url":"https://ieeexplore.ieee.org/document/7739126","relation":"confirmation"}]},"publication":"IEEE Group IV Photonics Conference","citation":{"ama":"Gudyriev S, Scheytt C, Meister S, et al.  Low-Power, Ultra-compact, Fully-differential 40Gbps Direct Detection Receiver in 0.25μm Photonic BiCMOS SiGe Technology. In: <i>IEEE Group IV Photonics Conference</i>. ; 2016. doi:<a href=\"https://doi.org/10.1109/GROUP4.2016.7739126\">10.1109/GROUP4.2016.7739126</a>","bibtex":"@inproceedings{Gudyriev_Scheytt_Meister_Knoll_Lischke_Zimmermann_Meuer_2016, place={Shanghai, China}, title={ Low-Power, Ultra-compact, Fully-differential 40Gbps Direct Detection Receiver in 0.25μm Photonic BiCMOS SiGe Technology}, DOI={<a href=\"https://doi.org/10.1109/GROUP4.2016.7739126\">10.1109/GROUP4.2016.7739126</a>}, booktitle={IEEE Group IV Photonics Conference}, author={Gudyriev, Sergiy and Scheytt, Christoph and Meister, Stefan and Knoll, Dieter and Lischke, Stefan and Zimmermann, Lars and Meuer, Christian}, year={2016} }","mla":"Gudyriev, Sergiy, et al. “ Low-Power, Ultra-Compact, Fully-Differential 40Gbps Direct Detection Receiver in 0.25μm Photonic BiCMOS SiGe Technology.” <i>IEEE Group IV Photonics Conference</i>, 2016, doi:<a href=\"https://doi.org/10.1109/GROUP4.2016.7739126\">10.1109/GROUP4.2016.7739126</a>.","short":"S. Gudyriev, C. Scheytt, S. Meister, D. Knoll, S. Lischke, L. Zimmermann, C. Meuer, in: IEEE Group IV Photonics Conference, Shanghai, China, 2016.","chicago":"Gudyriev, Sergiy, Christoph Scheytt, Stefan Meister, Dieter Knoll, Stefan Lischke, Lars Zimmermann, and Christian Meuer. “ Low-Power, Ultra-Compact, Fully-Differential 40Gbps Direct Detection Receiver in 0.25μm Photonic BiCMOS SiGe Technology.” In <i>IEEE Group IV Photonics Conference</i>. Shanghai, China, 2016. <a href=\"https://doi.org/10.1109/GROUP4.2016.7739126\">https://doi.org/10.1109/GROUP4.2016.7739126</a>.","apa":"Gudyriev, S., Scheytt, C., Meister, S., Knoll, D., Lischke, S., Zimmermann, L., &#38; Meuer, C. (2016).  Low-Power, Ultra-compact, Fully-differential 40Gbps Direct Detection Receiver in 0.25μm Photonic BiCMOS SiGe Technology. <i>IEEE Group IV Photonics Conference</i>. <a href=\"https://doi.org/10.1109/GROUP4.2016.7739126\">https://doi.org/10.1109/GROUP4.2016.7739126</a>","ieee":"S. Gudyriev <i>et al.</i>, “ Low-Power, Ultra-compact, Fully-differential 40Gbps Direct Detection Receiver in 0.25μm Photonic BiCMOS SiGe Technology,” 2016, doi: <a href=\"https://doi.org/10.1109/GROUP4.2016.7739126\">10.1109/GROUP4.2016.7739126</a>."},"type":"conference","department":[{"_id":"58"},{"_id":"230"}],"place":"Shanghai, China","date_created":"2021-09-13T09:44:33Z","date_updated":"2023-01-10T12:46:49Z","year":"2016","title":" Low-Power, Ultra-compact, Fully-differential 40Gbps Direct Detection Receiver in 0.25μm Photonic BiCMOS SiGe Technology","status":"public","conference":{"end_date":"2016.08.26","start_date":"2016.08.24"},"publication_identifier":{"eisbn":["978-1-5090-1903-8"]},"author":[{"last_name":"Gudyriev","first_name":"Sergiy","full_name":"Gudyriev, Sergiy"},{"id":"37144","orcid":"https://orcid.org/0000-0002-5950-6618","first_name":"Christoph","last_name":"Scheytt","full_name":"Scheytt, Christoph"},{"full_name":"Meister, Stefan","first_name":"Stefan","last_name":"Meister"},{"full_name":"Knoll, Dieter","first_name":"Dieter","last_name":"Knoll"},{"full_name":"Lischke, Stefan","last_name":"Lischke","first_name":"Stefan"},{"full_name":"Zimmermann, Lars","first_name":"Lars","last_name":"Zimmermann"},{"last_name":"Meuer","first_name":"Christian","full_name":"Meuer, Christian"}],"doi":"10.1109/GROUP4.2016.7739126","user_id":"15931","_id":"24266","language":[{"iso":"eng"}]},{"_id":"24267","language":[{"iso":"eng"}],"user_id":"15931","author":[{"id":"37144","orcid":"https://orcid.org/0000-0002-5950-6618","last_name":"Scheytt","first_name":"Christoph","full_name":"Scheytt, Christoph"}],"year":"2016","title":"Recent Advances in Millimeter-Wave-and Electronic-Photonic System-on-Chip Design","status":"public","date_updated":"2023-01-10T12:45:40Z","place":"Nanjing, China","date_created":"2021-09-13T09:44:34Z","department":[{"_id":"58"},{"_id":"230"}],"type":"conference","citation":{"ama":"Scheytt C. Recent Advances in Millimeter-Wave-and Electronic-Photonic System-on-Chip Design. In: <i>Microelectronics Seminar</i>. ; 2016.","bibtex":"@inproceedings{Scheytt_2016, place={Nanjing, China}, title={Recent Advances in Millimeter-Wave-and Electronic-Photonic System-on-Chip Design}, booktitle={Microelectronics Seminar}, author={Scheytt, Christoph}, year={2016} }","mla":"Scheytt, Christoph. “Recent Advances in Millimeter-Wave-and Electronic-Photonic System-on-Chip Design.” <i>Microelectronics Seminar</i>, 2016.","chicago":"Scheytt, Christoph. “Recent Advances in Millimeter-Wave-and Electronic-Photonic System-on-Chip Design.” In <i>Microelectronics Seminar</i>. Nanjing, China, 2016.","short":"C. Scheytt, in: Microelectronics Seminar, Nanjing, China, 2016.","apa":"Scheytt, C. (2016). Recent Advances in Millimeter-Wave-and Electronic-Photonic System-on-Chip Design. <i>Microelectronics Seminar</i>.","ieee":"C. Scheytt, “Recent Advances in Millimeter-Wave-and Electronic-Photonic System-on-Chip Design,” 2016."},"publication":"Microelectronics Seminar"},{"department":[{"_id":"58"}],"type":"conference","date_created":"2021-09-14T07:06:28Z","place":"Montreal, Canada","abstract":[{"lang":"eng","text":"Terahertz frequency band of 0.06 - 10 THz is especially interesting for ultra-high-speed wireless communication to achieve data rates of 100 Gbps or higher. To accommodate this demand, advanced terahertz signal processing techniques need to be investigated. Parallel Sequence Spread Spectrum (PSSS) is a physical layer (PHY) baseband technology that seems to be suited for being used for ultra-high speed wireless communication since the receiver architecture is especially simple and can be implemented almost completely in analog hardware. In this paper, a PSSS modulated signal at a chip rate of 20 Gcps with a spectral efficiency of (only) 1 bit/s/Hz is transmitted using a linearity limited 240 GHz wireless frontend. PSSS transceiver models are realized offline in MATLAB/Simulink. The PSSS transmitter generates the PSSS modulated symbols that are loaded onto an Arbitrary Waveform generator (AWG) and then transmitted using the available 240 GHz wireless frontend. A Digital Storage Oscilloscope (DSO) samples and stores the received signal. The PSSS receiver performs synchronization, channel estimation and demodulation. For a coded data rate of 20 Gbps, an eye opening of 40% and a BER of 5.4·10 -5 has been measured. These results are highly promising to achieve data rates of up to 100 Gbps with PSSS modulation using a RF-frontend having higher linear operating range and thus allowing increasing the bandwidth efficiency to 4 b/s/Hz."}],"related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/7324520"}]},"citation":{"chicago":"KrishneGowda, Karthik, Tobias  Messinger, Andreas Wolf, Rolf Kraemer, Ingmar Kallfass, and Christoph Scheytt. “Towards 100 Gbps Wireless Communication in THz Band with PSSS Modulation: A Promising Hardware in the Loop Experiment.” In <i>ICUWB 2015</i>. Montreal, Canada, 2015. <a href=\"https://doi.org/10.1109/ICUWB.2015.7324520\">https://doi.org/10.1109/ICUWB.2015.7324520</a>.","short":"K. KrishneGowda, T. Messinger, A. Wolf, R. Kraemer, I. Kallfass, C. Scheytt, in: ICUWB 2015, Montreal, Canada, 2015.","ieee":"K. KrishneGowda, T. Messinger, A. Wolf, R. Kraemer, I. Kallfass, and C. Scheytt, “Towards 100 Gbps Wireless Communication in THz Band with PSSS Modulation: A Promising Hardware in the Loop Experiment,” 2015, doi: <a href=\"https://doi.org/10.1109/ICUWB.2015.7324520\">10.1109/ICUWB.2015.7324520</a>.","apa":"KrishneGowda, K., Messinger, T., Wolf, A., Kraemer, R., Kallfass, I., &#38; Scheytt, C. (2015). Towards 100 Gbps Wireless Communication in THz Band with PSSS Modulation: A Promising Hardware in the Loop Experiment. <i>ICUWB 2015</i>. <a href=\"https://doi.org/10.1109/ICUWB.2015.7324520\">https://doi.org/10.1109/ICUWB.2015.7324520</a>","bibtex":"@inproceedings{KrishneGowda_Messinger_Wolf_Kraemer_Kallfass_Scheytt_2015, place={Montreal, Canada}, title={Towards 100 Gbps Wireless Communication in THz Band with PSSS Modulation: A Promising Hardware in the Loop Experiment}, DOI={<a href=\"https://doi.org/10.1109/ICUWB.2015.7324520\">10.1109/ICUWB.2015.7324520</a>}, booktitle={ICUWB 2015}, author={KrishneGowda, Karthik and Messinger, Tobias  and Wolf, Andreas and Kraemer, Rolf and Kallfass, Ingmar and Scheytt, Christoph}, year={2015} }","ama":"KrishneGowda K, Messinger T, Wolf A, Kraemer R, Kallfass I, Scheytt C. Towards 100 Gbps Wireless Communication in THz Band with PSSS Modulation: A Promising Hardware in the Loop Experiment. In: <i>ICUWB 2015</i>. ; 2015. doi:<a href=\"https://doi.org/10.1109/ICUWB.2015.7324520\">10.1109/ICUWB.2015.7324520</a>","mla":"KrishneGowda, Karthik, et al. “Towards 100 Gbps Wireless Communication in THz Band with PSSS Modulation: A Promising Hardware in the Loop Experiment.” <i>ICUWB 2015</i>, 2015, doi:<a href=\"https://doi.org/10.1109/ICUWB.2015.7324520\">10.1109/ICUWB.2015.7324520</a>."},"publication":"ICUWB 2015","user_id":"15931","doi":"10.1109/ICUWB.2015.7324520","language":[{"iso":"eng"}],"_id":"24287","date_updated":"2022-02-17T09:43:32Z","author":[{"last_name":"KrishneGowda","first_name":"Karthik","full_name":"KrishneGowda, Karthik"},{"first_name":"Tobias ","last_name":"Messinger","full_name":"Messinger, Tobias "},{"full_name":"Wolf, Andreas","last_name":"Wolf","first_name":"Andreas"},{"full_name":"Kraemer, Rolf","last_name":"Kraemer","first_name":"Rolf"},{"full_name":"Kallfass, Ingmar","last_name":"Kallfass","first_name":"Ingmar"},{"full_name":"Scheytt, Christoph","first_name":"Christoph","last_name":"Scheytt","id":"37144"}],"publication_identifier":{"eisbn":["978-1-4673-6555-0"]},"conference":{"end_date":"2015.10.07","start_date":"2015.10.04"},"status":"public","year":"2015","title":"Towards 100 Gbps Wireless Communication in THz Band with PSSS Modulation: A Promising Hardware in the Loop Experiment"},{"date_updated":"2022-02-17T09:41:04Z","title":"Shifting the Analog-Digital Boundary in Signal Processing: Should We Use Mixed-Signal \"Approximate\" Computing?","year":"2015","status":"public","conference":{"end_date":"2015.10.16","location":"Paderborn","start_date":"2015.10.15","name":"Workshop on Approximate Computing"},"author":[{"id":"37144","last_name":"Scheytt","first_name":"Christoph","full_name":"Scheytt, Christoph"},{"last_name":"Javed","first_name":"Abdul Rehman","full_name":"Javed, Abdul Rehman"}],"user_id":"15931","language":[{"iso":"eng"}],"_id":"24286","related_material":{"link":[{"url":"https://approximate.uni-paderborn.de/2015/pages/general-info/welcome.php","relation":"confirmation"}]},"publication":"Workshop on Approximate Computing","citation":{"chicago":"Scheytt, Christoph, and Abdul Rehman Javed. “Shifting the Analog-Digital Boundary in Signal Processing: Should We Use Mixed-Signal ‘Approximate’ Computing?” In <i>Workshop on Approximate Computing</i>. Paderborn, Germany, 2015.","short":"C. Scheytt, A.R. Javed, in: Workshop on Approximate Computing, Paderborn, Germany, 2015.","apa":"Scheytt, C., &#38; Javed, A. R. (2015). Shifting the Analog-Digital Boundary in Signal Processing: Should We Use Mixed-Signal “Approximate” Computing? <i>Workshop on Approximate Computing</i>. Workshop on Approximate Computing, Paderborn.","ieee":"C. Scheytt and A. R. Javed, “Shifting the Analog-Digital Boundary in Signal Processing: Should We Use Mixed-Signal ‘Approximate’ Computing?,” presented at the Workshop on Approximate Computing, Paderborn, 2015.","ama":"Scheytt C, Javed AR. Shifting the Analog-Digital Boundary in Signal Processing: Should We Use Mixed-Signal “Approximate” Computing? In: <i>Workshop on Approximate Computing</i>. ; 2015.","bibtex":"@inproceedings{Scheytt_Javed_2015, place={Paderborn, Germany}, title={Shifting the Analog-Digital Boundary in Signal Processing: Should We Use Mixed-Signal “Approximate” Computing?}, booktitle={Workshop on Approximate Computing}, author={Scheytt, Christoph and Javed, Abdul Rehman}, year={2015} }","mla":"Scheytt, Christoph, and Abdul Rehman Javed. “Shifting the Analog-Digital Boundary in Signal Processing: Should We Use Mixed-Signal ‘Approximate’ Computing?” <i>Workshop on Approximate Computing</i>, 2015."},"type":"conference","department":[{"_id":"58"}],"place":"Paderborn, Germany","date_created":"2021-09-14T07:06:27Z"}]