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Für diese Aufgabe bieten sich einerseits nasschemische Ätzlösungen an, zum anderen eignen sich speziell entwickelte Trockenätzverfahren zur geforderten präzisen Strukturübertragung vom Lack in das Material."}],"citation":{"short":"U. Hilleringmann, in: Silizium-Halbleitertechnologie, Vieweg+Teubner Verlag, Wiesbaden, 2004, pp. 65–90.","chicago":"Hilleringmann, Ulrich. “Ätztechnik.” In <i>Silizium-Halbleitertechnologie</i>, 65–90. Wiesbaden: Vieweg+Teubner Verlag, 2004. <a href=\"https://doi.org/10.1007/978-3-322-94072-8_5\">https://doi.org/10.1007/978-3-322-94072-8_5</a>.","apa":"Hilleringmann, U. (2004). Ätztechnik. In <i>Silizium-Halbleitertechnologie</i> (pp. 65–90). Vieweg+Teubner Verlag. <a href=\"https://doi.org/10.1007/978-3-322-94072-8_5\">https://doi.org/10.1007/978-3-322-94072-8_5</a>","ieee":"U. Hilleringmann, “Ätztechnik,” in <i>Silizium-Halbleitertechnologie</i>, Wiesbaden: Vieweg+Teubner Verlag, 2004, pp. 65–90.","ama":"Hilleringmann U. Ätztechnik. 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