---
_id: '39359'
author:
- first_name: Ibrahim
full_name: Mwammenywa, Ibrahim
last_name: Mwammenywa
- first_name: Dmitry
full_name: Petrov, Dmitry
last_name: Petrov
- first_name: Philipp
full_name: Holle, Philipp
last_name: Holle
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
id: '20179'
last_name: Hilleringmann
citation:
ama: 'Mwammenywa I, Petrov D, Holle P, Hilleringmann U. LoRa Transceiver for Load
Monitoring and Control System in Microgrids. In: 2022 International Conference
on Engineering and Emerging Technologies (ICEET). IEEE; 2023. doi:10.1109/iceet56468.2022.10007274'
apa: Mwammenywa, I., Petrov, D., Holle, P., & Hilleringmann, U. (2023). LoRa
Transceiver for Load Monitoring and Control System in Microgrids. 2022 International
Conference on Engineering and Emerging Technologies (ICEET). https://doi.org/10.1109/iceet56468.2022.10007274
bibtex: '@inproceedings{Mwammenywa_Petrov_Holle_Hilleringmann_2023, title={LoRa
Transceiver for Load Monitoring and Control System in Microgrids}, DOI={10.1109/iceet56468.2022.10007274},
booktitle={2022 International Conference on Engineering and Emerging Technologies
(ICEET)}, publisher={IEEE}, author={Mwammenywa, Ibrahim and Petrov, Dmitry and
Holle, Philipp and Hilleringmann, Ulrich}, year={2023} }'
chicago: Mwammenywa, Ibrahim, Dmitry Petrov, Philipp Holle, and Ulrich Hilleringmann.
“LoRa Transceiver for Load Monitoring and Control System in Microgrids.” In 2022
International Conference on Engineering and Emerging Technologies (ICEET).
IEEE, 2023. https://doi.org/10.1109/iceet56468.2022.10007274.
ieee: 'I. Mwammenywa, D. Petrov, P. Holle, and U. Hilleringmann, “LoRa Transceiver
for Load Monitoring and Control System in Microgrids,” 2023, doi: 10.1109/iceet56468.2022.10007274.'
mla: Mwammenywa, Ibrahim, et al. “LoRa Transceiver for Load Monitoring and Control
System in Microgrids.” 2022 International Conference on Engineering and Emerging
Technologies (ICEET), IEEE, 2023, doi:10.1109/iceet56468.2022.10007274.
short: 'I. Mwammenywa, D. Petrov, P. Holle, U. Hilleringmann, in: 2022 International
Conference on Engineering and Emerging Technologies (ICEET), IEEE, 2023.'
date_created: 2023-01-24T09:35:34Z
date_updated: 2023-03-21T09:42:20Z
department:
- _id: '59'
doi: 10.1109/iceet56468.2022.10007274
language:
- iso: eng
publication: 2022 International Conference on Engineering and Emerging Technologies
(ICEET)
publication_status: published
publisher: IEEE
status: public
title: LoRa Transceiver for Load Monitoring and Control System in Microgrids
type: conference
user_id: '20179'
year: '2023'
...
---
_id: '49890'
abstract:
- lang: eng
text: In this paper, the influence of the environment on an inductive location system
is analyzed. In the inductive location method, high frequency magnetic fields
generated by planar coils lead to induction in other coils, which is used for
localization analysis. Magnetic fields are not affected by changes in the dielectric
properties of the environment, which is an advantage over other localization methods.
However, electrical material parameters can still affect the localization results
by indirect effects. For this reason, in this publication the influence will be
investigated using real material parameters and their effects on the localization
will be considered, so that the robustness and the limits of the inductive localization
can be evaluated.
author:
- first_name: Sven
full_name: Lange, Sven
id: '38240'
last_name: Lange
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
id: '20179'
last_name: Hilleringmann
- first_name: Christian
full_name: Hedayat, Christian
last_name: Hedayat
- first_name: Harald
full_name: Kuhn, Harald
last_name: Kuhn
- first_name: Jens
full_name: Förstner, Jens
id: '158'
last_name: Förstner
orcid: 0000-0001-7059-9862
citation:
ama: 'Lange S, Hilleringmann U, Hedayat C, Kuhn H, Förstner J. Characterization
of Various Environmental Influences on the Inductive Localization. In: 2023
IEEE Conference on Antenna Measurements and Applications (CAMA). IEEE; 2023.
doi:10.1109/cama57522.2023.10352780'
apa: Lange, S., Hilleringmann, U., Hedayat, C., Kuhn, H., & Förstner, J. (2023).
Characterization of Various Environmental Influences on the Inductive Localization.
2023 IEEE Conference on Antenna Measurements and Applications (CAMA). 2023
IEEE Conference on Antenna Measurements and Applications (CAMA), Genoa, Italy
. https://doi.org/10.1109/cama57522.2023.10352780
bibtex: '@inproceedings{Lange_Hilleringmann_Hedayat_Kuhn_Förstner_2023, place={Genoa,
Italy }, title={Characterization of Various Environmental Influences on the Inductive
Localization}, DOI={10.1109/cama57522.2023.10352780},
booktitle={2023 IEEE Conference on Antenna Measurements and Applications (CAMA)},
publisher={IEEE}, author={Lange, Sven and Hilleringmann, Ulrich and Hedayat, Christian
and Kuhn, Harald and Förstner, Jens}, year={2023} }'
chicago: 'Lange, Sven, Ulrich Hilleringmann, Christian Hedayat, Harald Kuhn, and
Jens Förstner. “Characterization of Various Environmental Influences on the Inductive
Localization.” In 2023 IEEE Conference on Antenna Measurements and Applications
(CAMA). Genoa, Italy : IEEE, 2023. https://doi.org/10.1109/cama57522.2023.10352780.'
ieee: 'S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, and J. Förstner, “Characterization
of Various Environmental Influences on the Inductive Localization,” presented
at the 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), Genoa,
Italy , 2023, doi: 10.1109/cama57522.2023.10352780.'
mla: Lange, Sven, et al. “Characterization of Various Environmental Influences on
the Inductive Localization.” 2023 IEEE Conference on Antenna Measurements and
Applications (CAMA), IEEE, 2023, doi:10.1109/cama57522.2023.10352780.
short: 'S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, J. Förstner, in: 2023 IEEE
Conference on Antenna Measurements and Applications (CAMA), IEEE, Genoa, Italy
, 2023.'
conference:
end_date: 2023-11-17
location: 'Genoa, Italy '
name: 2023 IEEE Conference on Antenna Measurements and Applications (CAMA)
start_date: 2023-11-15
date_created: 2023-12-20T08:36:58Z
date_updated: 2023-12-21T09:51:11Z
department:
- _id: '59'
- _id: '61'
- _id: '485'
doi: 10.1109/cama57522.2023.10352780
keyword:
- Planar coils
- inductive locating
- magnetic fields
- environmental influences
- eddy currents
- tet_topic_hf
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/10352780
place: 'Genoa, Italy '
publication: 2023 IEEE Conference on Antenna Measurements and Applications (CAMA)
publication_identifier:
eisbn:
- 979-8-3503-2304-7
publication_status: published
publisher: IEEE
status: public
title: Characterization of Various Environmental Influences on the Inductive Localization
type: conference
user_id: '158'
year: '2023'
...
---
_id: '34140'
abstract:
- lang: eng
text: In this paper, machine learning techniques will be used to classify different
PCB layouts given their electromagnetic frequency spectra. These spectra result
from a simulated near-field measurement of electric field strengths at different
locations. Measured values consist of real and imaginary parts (amplitude and
phase) in X, Y and Z directions. Training data was obtained in the time domain
by varying transmission line geometries (size, distance and signaling). It was
then transformed into the frequency domain and used as deep neural network input.
Principal component analysis was applied to reduce the sample dimension. The results
show that classifying different designs is possible with high accuracy based on
synthetic data. Future work comprises measurements of real, custom-made PCB with
varying parameters to adapt the simulation model and also test the neural network.
Finally, the trained model could be used to give hints about the error’s cause
when overshooting EMC limits.
author:
- first_name: Jad
full_name: Maalouly, Jad
last_name: Maalouly
- first_name: Dennis
full_name: Hemker, Dennis
last_name: Hemker
- first_name: Christian
full_name: Hedayat, Christian
last_name: Hedayat
- first_name: Christian
full_name: Rückert, Christian
last_name: Rückert
- first_name: Ivan
full_name: Kaufmann, Ivan
last_name: Kaufmann
- first_name: Marcel
full_name: Olbrich, Marcel
last_name: Olbrich
- first_name: Sven
full_name: Lange, Sven
id: '38240'
last_name: Lange
- first_name: Harald
full_name: Mathis, Harald
last_name: Mathis
citation:
ama: 'Maalouly J, Hemker D, Hedayat C, et al. AI Assisted Interference Classification
to Improve EMC Troubleshooting in Electronic System Development. In: 2022 Kleinheubach
Conference. IEEE; 2022.'
apa: Maalouly, J., Hemker, D., Hedayat, C., Rückert, C., Kaufmann, I., Olbrich,
M., Lange, S., & Mathis, H. (2022). AI Assisted Interference Classification
to Improve EMC Troubleshooting in Electronic System Development. 2022 Kleinheubach
Conference. 2022 Kleinheubach Conference, Miltenberg, Germany.
bibtex: '@inproceedings{Maalouly_Hemker_Hedayat_Rückert_Kaufmann_Olbrich_Lange_Mathis_2022,
place={Miltenberg, Germany}, title={AI Assisted Interference Classification to
Improve EMC Troubleshooting in Electronic System Development}, booktitle={2022
Kleinheubach Conference}, publisher={IEEE}, author={Maalouly, Jad and Hemker,
Dennis and Hedayat, Christian and Rückert, Christian and Kaufmann, Ivan and Olbrich,
Marcel and Lange, Sven and Mathis, Harald}, year={2022} }'
chicago: 'Maalouly, Jad, Dennis Hemker, Christian Hedayat, Christian Rückert, Ivan
Kaufmann, Marcel Olbrich, Sven Lange, and Harald Mathis. “AI Assisted Interference
Classification to Improve EMC Troubleshooting in Electronic System Development.”
In 2022 Kleinheubach Conference. Miltenberg, Germany: IEEE, 2022.'
ieee: J. Maalouly et al., “AI Assisted Interference Classification to Improve
EMC Troubleshooting in Electronic System Development,” presented at the 2022 Kleinheubach
Conference, Miltenberg, Germany, 2022.
mla: Maalouly, Jad, et al. “AI Assisted Interference Classification to Improve EMC
Troubleshooting in Electronic System Development.” 2022 Kleinheubach Conference,
IEEE, 2022.
short: 'J. Maalouly, D. Hemker, C. Hedayat, C. Rückert, I. Kaufmann, M. Olbrich,
S. Lange, H. Mathis, in: 2022 Kleinheubach Conference, IEEE, Miltenberg, Germany,
2022.'
conference:
end_date: 2022-09-29
location: Miltenberg, Germany
name: 2022 Kleinheubach Conference
start_date: 2022-09-27
date_created: 2022-11-24T14:21:17Z
date_updated: 2022-11-24T14:21:34Z
department:
- _id: '59'
- _id: '485'
keyword:
- emc
- pcb
- electronic system development
- machine learning
- neural network
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9954484
place: Miltenberg, Germany
project:
- _id: '52'
name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
publication: 2022 Kleinheubach Conference
publication_identifier:
eisbn:
- 978-3-948571-07-8
publication_status: published
publisher: IEEE
status: public
title: AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic
System Development
type: conference
user_id: '38240'
year: '2022'
...
---
_id: '33508'
abstract:
- lang: eng
text: In this work, methods will be evaluated to numerically calculate the passive
electrical parameters of planar coils. These parameters can then be used to optimize
inductive applications such as wireless power transmission. The focus here will
be on inductive localization, which uses high-frequency magnetic fields and the
resulting induced voltage to provide localization through the coupling parameter
mutual inductance. To achieve localization with high accuracy and best possible
operation (resonance, signal strength, etc.), the coil parameters need to be well
known. For this reason, some numerical methods for the calculation of these quantities
are presented and validated. In addition, the physical effects are thereby considered
in more detail, allowing the localization procedure to be better optimized compared
to simulative black-box methods. The goal should be a dedicated simulation platform
for planar coils to be able to develop training data for neural networks and to
test and optimize localization algorithms.
author:
- first_name: Sven
full_name: Lange, Sven
id: '38240'
last_name: Lange
- first_name: Christian
full_name: Hedayat, Christian
last_name: Hedayat
- first_name: Harald
full_name: Kuhn, Harald
last_name: Kuhn
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
last_name: Hilleringmann
citation:
ama: 'Lange S, Hedayat C, Kuhn H, Hilleringmann U. Modeling and Characterization
of a 3D Environment for the Design of an Inductively Based Locating Method by
Coil Couplings. In: 2022 Smart Systems Integration (SSI). IEEE; 2022. doi:10.1109/ssi56489.2022.9901416'
apa: Lange, S., Hedayat, C., Kuhn, H., & Hilleringmann, U. (2022). Modeling
and Characterization of a 3D Environment for the Design of an Inductively Based
Locating Method by Coil Couplings. 2022 Smart Systems Integration (SSI).
2022 Smart Systems Integration (SSI), Grenoble, France. https://doi.org/10.1109/ssi56489.2022.9901416
bibtex: '@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2022, place={Grenoble,
France}, title={Modeling and Characterization of a 3D Environment for the Design
of an Inductively Based Locating Method by Coil Couplings}, DOI={10.1109/ssi56489.2022.9901416},
booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange,
Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2022}
}'
chicago: 'Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann.
“Modeling and Characterization of a 3D Environment for the Design of an Inductively
Based Locating Method by Coil Couplings.” In 2022 Smart Systems Integration
(SSI). Grenoble, France: IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901416.'
ieee: 'S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Modeling and Characterization
of a 3D Environment for the Design of an Inductively Based Locating Method by
Coil Couplings,” presented at the 2022 Smart Systems Integration (SSI), Grenoble,
France, 2022, doi: 10.1109/ssi56489.2022.9901416.'
mla: Lange, Sven, et al. “Modeling and Characterization of a 3D Environment for
the Design of an Inductively Based Locating Method by Coil Couplings.” 2022
Smart Systems Integration (SSI), IEEE, 2022, doi:10.1109/ssi56489.2022.9901416.
short: 'S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems
Integration (SSI), IEEE, Grenoble, France, 2022.'
conference:
end_date: 2022-04-28
location: Grenoble, France
name: 2022 Smart Systems Integration (SSI)
start_date: 2022-04-27
date_created: 2022-10-04T11:26:11Z
date_updated: 2022-10-04T11:35:11Z
department:
- _id: '59'
- _id: '485'
doi: 10.1109/ssi56489.2022.9901416
keyword:
- Simulation Environment
- Inductive Localization
- Coil Parameters
- Inductive Applications
- Near-Field
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9901416
place: Grenoble, France
project:
- _id: '52'
name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
publication: 2022 Smart Systems Integration (SSI)
publication_identifier:
eisbn:
- 978-1-6654-8849-5
publication_status: published
publisher: IEEE
status: public
title: Modeling and Characterization of a 3D Environment for the Design of an Inductively
Based Locating Method by Coil Couplings
type: conference
user_id: '38240'
year: '2022'
...
---
_id: '33510'
abstract:
- lang: eng
text: In the manufacture of real wood products, defects can quickly occur during
the production process. To quickly sort out these defects, a system is needed
that finds damage in the irregularly structured surfaces of the product. The difficulty
in this task is that each surface is visually different and no standard defects
can be defined. Thus, damage detection using correlation does not work, so this
paper will test different machine learning methods. To evaluate different machine
learning methods, a data set is needed. For this reason, the available samples
were recorded manually using a static fixed camera. Subsequently, the images were
divided into sub-images, which resulted in a relatively small data set. Next,
a convolutional neural network (CNN) was constructed to classify the images. However,
this approach did not lead to a generalized solution, so the dataset was hashed
using the a- and pHash. These hash values were then trained with a fully supervised
system that will later serve as a reference model, in the semi-supervised learning
procedures. To improve the supervised model and not have to label every data point,
semi-supervised learning methods are used in the following. For this purpose,
the CEAL method (wrapper method) is considered in the first and then the Π-Model
(intrinsically semi-supervised).
author:
- first_name: Tom
full_name: Sander, Tom
last_name: Sander
- first_name: Sven
full_name: Lange, Sven
id: '38240'
last_name: Lange
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
last_name: Hilleringmann
- first_name: Volker
full_name: Geneiß, Volker
last_name: Geneiß
- first_name: Christian
full_name: Hedayat, Christian
last_name: Hedayat
- first_name: Harald
full_name: Kuhn, Harald
last_name: Kuhn
citation:
ama: 'Sander T, Lange S, Hilleringmann U, Geneiß V, Hedayat C, Kuhn H. Detection
of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised
Learning Methods. In: 2022 Smart Systems Integration (SSI). IEEE; 2022.
doi:10.1109/ssi56489.2022.9901433'
apa: Sander, T., Lange, S., Hilleringmann, U., Geneiß, V., Hedayat, C., & Kuhn,
H. (2022). Detection of Defects on Irregularly Structured Surfaces using Supervised
and Semi-Supervised Learning Methods. 2022 Smart Systems Integration (SSI).
2022 Smart Systems Integration (SSI), Grenoble, France. https://doi.org/10.1109/ssi56489.2022.9901433
bibtex: '@inproceedings{Sander_Lange_Hilleringmann_Geneiß_Hedayat_Kuhn_2022, place={Grenoble,
France}, title={Detection of Defects on Irregularly Structured Surfaces using
Supervised and Semi-Supervised Learning Methods}, DOI={10.1109/ssi56489.2022.9901433},
booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Sander,
Tom and Lange, Sven and Hilleringmann, Ulrich and Geneiß, Volker and Hedayat,
Christian and Kuhn, Harald}, year={2022} }'
chicago: 'Sander, Tom, Sven Lange, Ulrich Hilleringmann, Volker Geneiß, Christian
Hedayat, and Harald Kuhn. “Detection of Defects on Irregularly Structured Surfaces
Using Supervised and Semi-Supervised Learning Methods.” In 2022 Smart Systems
Integration (SSI). Grenoble, France: IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901433.'
ieee: 'T. Sander, S. Lange, U. Hilleringmann, V. Geneiß, C. Hedayat, and H. Kuhn,
“Detection of Defects on Irregularly Structured Surfaces using Supervised and
Semi-Supervised Learning Methods,” presented at the 2022 Smart Systems Integration
(SSI), Grenoble, France, 2022, doi: 10.1109/ssi56489.2022.9901433.'
mla: Sander, Tom, et al. “Detection of Defects on Irregularly Structured Surfaces
Using Supervised and Semi-Supervised Learning Methods.” 2022 Smart Systems
Integration (SSI), IEEE, 2022, doi:10.1109/ssi56489.2022.9901433.
short: 'T. Sander, S. Lange, U. Hilleringmann, V. Geneiß, C. Hedayat, H. Kuhn, in:
2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.'
conference:
end_date: 2022-04-28
location: Grenoble, France
name: 2022 Smart Systems Integration (SSI)
start_date: 2022-04-27
date_created: 2022-10-04T11:35:55Z
date_updated: 2022-10-04T11:37:39Z
department:
- _id: '59'
- _id: '485'
doi: 10.1109/ssi56489.2022.9901433
keyword:
- Machine Learning
- CNN
- Hashing
- semi-supervised learning
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9901433
place: Grenoble, France
project:
- _id: '52'
name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
publication: 2022 Smart Systems Integration (SSI)
publication_status: published
publisher: IEEE
status: public
title: Detection of Defects on Irregularly Structured Surfaces using Supervised and
Semi-Supervised Learning Methods
type: conference
user_id: '38240'
year: '2022'
...
---
_id: '39389'
author:
- first_name: Ibrahim
full_name: Mwammenywa, Ibrahim
last_name: Mwammenywa
- first_name: Geoffrey Mark
full_name: Kagarura, Geoffrey Mark
last_name: Kagarura
- first_name: Dmitry
full_name: Petrov, Dmitry
last_name: Petrov
- first_name: Philip
full_name: Holle, Philip
last_name: Holle
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
id: '20179'
last_name: Hilleringmann
citation:
ama: 'Mwammenywa I, Kagarura GM, Petrov D, Holle P, Hilleringmann U. LoRa-based
Demand-side Load Monitoring and Management System for Microgrids in Africa. In:
2021 International Conference on Electrical, Computer and Energy Technologies
(ICECET). IEEE; 2022. doi:10.1109/icecet52533.2021.9698506'
apa: Mwammenywa, I., Kagarura, G. M., Petrov, D., Holle, P., & Hilleringmann,
U. (2022). LoRa-based Demand-side Load Monitoring and Management System for Microgrids
in Africa. 2021 International Conference on Electrical, Computer and Energy
Technologies (ICECET). https://doi.org/10.1109/icecet52533.2021.9698506
bibtex: '@inproceedings{Mwammenywa_Kagarura_Petrov_Holle_Hilleringmann_2022, title={LoRa-based
Demand-side Load Monitoring and Management System for Microgrids in Africa}, DOI={10.1109/icecet52533.2021.9698506},
booktitle={2021 International Conference on Electrical, Computer and Energy Technologies
(ICECET)}, publisher={IEEE}, author={Mwammenywa, Ibrahim and Kagarura, Geoffrey
Mark and Petrov, Dmitry and Holle, Philip and Hilleringmann, Ulrich}, year={2022}
}'
chicago: Mwammenywa, Ibrahim, Geoffrey Mark Kagarura, Dmitry Petrov, Philip Holle,
and Ulrich Hilleringmann. “LoRa-Based Demand-Side Load Monitoring and Management
System for Microgrids in Africa.” In 2021 International Conference on Electrical,
Computer and Energy Technologies (ICECET). IEEE, 2022. https://doi.org/10.1109/icecet52533.2021.9698506.
ieee: 'I. Mwammenywa, G. M. Kagarura, D. Petrov, P. Holle, and U. Hilleringmann,
“LoRa-based Demand-side Load Monitoring and Management System for Microgrids in
Africa,” 2022, doi: 10.1109/icecet52533.2021.9698506.'
mla: Mwammenywa, Ibrahim, et al. “LoRa-Based Demand-Side Load Monitoring and Management
System for Microgrids in Africa.” 2021 International Conference on Electrical,
Computer and Energy Technologies (ICECET), IEEE, 2022, doi:10.1109/icecet52533.2021.9698506.
short: 'I. Mwammenywa, G.M. Kagarura, D. Petrov, P. Holle, U. Hilleringmann, in:
2021 International Conference on Electrical, Computer and Energy Technologies
(ICECET), IEEE, 2022.'
date_created: 2023-01-24T10:11:55Z
date_updated: 2023-03-22T10:30:39Z
department:
- _id: '59'
doi: 10.1109/icecet52533.2021.9698506
language:
- iso: eng
publication: 2021 International Conference on Electrical, Computer and Energy Technologies
(ICECET)
publication_status: published
publisher: IEEE
status: public
title: LoRa-based Demand-side Load Monitoring and Management System for Microgrids
in Africa
type: conference
user_id: '20179'
year: '2022'
...
---
_id: '39377'
author:
- first_name: Christoph
full_name: Marschalt, Christoph
last_name: Marschalt
- first_name: Dominik
full_name: Schroder, Dominik
last_name: Schroder
- first_name: Sven
full_name: Lange, Sven
last_name: Lange
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
id: '20179'
last_name: Hilleringmann
- first_name: Christian
full_name: Hedayat, Christian
last_name: Hedayat
- first_name: Harald
full_name: Kuhn, Harald
last_name: Kuhn
- first_name: Denis
full_name: Sievers, Denis
last_name: Sievers
- first_name: Jens
full_name: Forstner, Jens
last_name: Forstner
citation:
ama: 'Marschalt C, Schroder D, Lange S, et al. Far-field Calculation from magnetic
Huygens Box Data using the Boundary Element Method. In: 2022 Smart Systems
Integration (SSI). IEEE; 2022. doi:10.1109/ssi56489.2022.9901431'
apa: Marschalt, C., Schroder, D., Lange, S., Hilleringmann, U., Hedayat, C., Kuhn,
H., Sievers, D., & Forstner, J. (2022). Far-field Calculation from magnetic
Huygens Box Data using the Boundary Element Method. 2022 Smart Systems Integration
(SSI). https://doi.org/10.1109/ssi56489.2022.9901431
bibtex: '@inproceedings{Marschalt_Schroder_Lange_Hilleringmann_Hedayat_Kuhn_Sievers_Forstner_2022,
title={Far-field Calculation from magnetic Huygens Box Data using the Boundary
Element Method}, DOI={10.1109/ssi56489.2022.9901431},
booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Marschalt,
Christoph and Schroder, Dominik and Lange, Sven and Hilleringmann, Ulrich and
Hedayat, Christian and Kuhn, Harald and Sievers, Denis and Forstner, Jens}, year={2022}
}'
chicago: Marschalt, Christoph, Dominik Schroder, Sven Lange, Ulrich Hilleringmann,
Christian Hedayat, Harald Kuhn, Denis Sievers, and Jens Forstner. “Far-Field Calculation
from Magnetic Huygens Box Data Using the Boundary Element Method.” In 2022
Smart Systems Integration (SSI). IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901431.
ieee: 'C. Marschalt et al., “Far-field Calculation from magnetic Huygens
Box Data using the Boundary Element Method,” 2022, doi: 10.1109/ssi56489.2022.9901431.'
mla: Marschalt, Christoph, et al. “Far-Field Calculation from Magnetic Huygens Box
Data Using the Boundary Element Method.” 2022 Smart Systems Integration (SSI),
IEEE, 2022, doi:10.1109/ssi56489.2022.9901431.
short: 'C. Marschalt, D. Schroder, S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn,
D. Sievers, J. Forstner, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.'
date_created: 2023-01-24T10:06:15Z
date_updated: 2023-03-22T10:28:19Z
department:
- _id: '59'
doi: 10.1109/ssi56489.2022.9901431
language:
- iso: eng
publication: 2022 Smart Systems Integration (SSI)
publication_status: published
publisher: IEEE
status: public
title: Far-field Calculation from magnetic Huygens Box Data using the Boundary Element
Method
type: conference
user_id: '20179'
year: '2022'
...
---
_id: '39376'
author:
- first_name: Tom
full_name: Sander, Tom
last_name: Sander
- first_name: Sven
full_name: Lange, Sven
last_name: Lange
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
id: '20179'
last_name: Hilleringmann
- first_name: Volker
full_name: Geneis, Volker
last_name: Geneis
- first_name: Christian
full_name: Hedayat, Christian
last_name: Hedayat
- first_name: Harald
full_name: Kuhn, Harald
last_name: Kuhn
citation:
ama: 'Sander T, Lange S, Hilleringmann U, Geneis V, Hedayat C, Kuhn H. Detection
of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised
Learning Methods. In: 2022 Smart Systems Integration (SSI). IEEE; 2022.
doi:10.1109/ssi56489.2022.9901433'
apa: Sander, T., Lange, S., Hilleringmann, U., Geneis, V., Hedayat, C., & Kuhn,
H. (2022). Detection of Defects on Irregularly Structured Surfaces using Supervised
and Semi-Supervised Learning Methods. 2022 Smart Systems Integration (SSI).
https://doi.org/10.1109/ssi56489.2022.9901433
bibtex: '@inproceedings{Sander_Lange_Hilleringmann_Geneis_Hedayat_Kuhn_2022, title={Detection
of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised
Learning Methods}, DOI={10.1109/ssi56489.2022.9901433},
booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Sander,
Tom and Lange, Sven and Hilleringmann, Ulrich and Geneis, Volker and Hedayat,
Christian and Kuhn, Harald}, year={2022} }'
chicago: Sander, Tom, Sven Lange, Ulrich Hilleringmann, Volker Geneis, Christian
Hedayat, and Harald Kuhn. “Detection of Defects on Irregularly Structured Surfaces
Using Supervised and Semi-Supervised Learning Methods.” In 2022 Smart Systems
Integration (SSI). IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901433.
ieee: 'T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, and H. Kuhn,
“Detection of Defects on Irregularly Structured Surfaces using Supervised and
Semi-Supervised Learning Methods,” 2022, doi: 10.1109/ssi56489.2022.9901433.'
mla: Sander, Tom, et al. “Detection of Defects on Irregularly Structured Surfaces
Using Supervised and Semi-Supervised Learning Methods.” 2022 Smart Systems
Integration (SSI), IEEE, 2022, doi:10.1109/ssi56489.2022.9901433.
short: 'T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, in:
2022 Smart Systems Integration (SSI), IEEE, 2022.'
date_created: 2023-01-24T10:05:48Z
date_updated: 2023-03-22T10:28:37Z
department:
- _id: '59'
doi: 10.1109/ssi56489.2022.9901433
language:
- iso: eng
publication: 2022 Smart Systems Integration (SSI)
publication_status: published
publisher: IEEE
status: public
title: Detection of Defects on Irregularly Structured Surfaces using Supervised and
Semi-Supervised Learning Methods
type: conference
user_id: '20179'
year: '2022'
...
---
_id: '39372'
author:
- first_name: Sven
full_name: Lange, Sven
last_name: Lange
- first_name: Christian
full_name: Hedayat, Christian
last_name: Hedayat
- first_name: Harald
full_name: Kuhn, Harald
last_name: Kuhn
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
id: '20179'
last_name: Hilleringmann
citation:
ama: 'Lange S, Hedayat C, Kuhn H, Hilleringmann U. Modeling and Characterization
of a 3D Environment for the Design of an Inductively Based Locating Method by
Coil Couplings. In: 2022 Smart Systems Integration (SSI). IEEE; 2022. doi:10.1109/ssi56489.2022.9901416'
apa: Lange, S., Hedayat, C., Kuhn, H., & Hilleringmann, U. (2022). Modeling
and Characterization of a 3D Environment for the Design of an Inductively Based
Locating Method by Coil Couplings. 2022 Smart Systems Integration (SSI).
https://doi.org/10.1109/ssi56489.2022.9901416
bibtex: '@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2022, title={Modeling and
Characterization of a 3D Environment for the Design of an Inductively Based Locating
Method by Coil Couplings}, DOI={10.1109/ssi56489.2022.9901416},
booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange,
Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2022}
}'
chicago: Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann.
“Modeling and Characterization of a 3D Environment for the Design of an Inductively
Based Locating Method by Coil Couplings.” In 2022 Smart Systems Integration
(SSI). IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901416.
ieee: 'S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Modeling and Characterization
of a 3D Environment for the Design of an Inductively Based Locating Method by
Coil Couplings,” 2022, doi: 10.1109/ssi56489.2022.9901416.'
mla: Lange, Sven, et al. “Modeling and Characterization of a 3D Environment for
the Design of an Inductively Based Locating Method by Coil Couplings.” 2022
Smart Systems Integration (SSI), IEEE, 2022, doi:10.1109/ssi56489.2022.9901416.
short: 'S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems
Integration (SSI), IEEE, 2022.'
date_created: 2023-01-24T10:02:44Z
date_updated: 2023-03-22T10:27:01Z
department:
- _id: '59'
doi: 10.1109/ssi56489.2022.9901416
language:
- iso: eng
publication: 2022 Smart Systems Integration (SSI)
publication_status: published
publisher: IEEE
status: public
title: Modeling and Characterization of a 3D Environment for the Design of an Inductively
Based Locating Method by Coil Couplings
type: conference
user_id: '20179'
year: '2022'
...
---
_id: '39373'
author:
- first_name: Sven
full_name: Lange, Sven
last_name: Lange
- first_name: Christian
full_name: Hedayat, Christian
last_name: Hedayat
- first_name: Harald
full_name: Kuhn, Harald
last_name: Kuhn
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
id: '20179'
last_name: Hilleringmann
citation:
ama: 'Lange S, Hedayat C, Kuhn H, Hilleringmann U. Modeling and Characterization
of a 3D Environment for the Design of an Inductively Based Locating Method by
Coil Couplings. In: 2022 Smart Systems Integration (SSI). IEEE; 2022. doi:10.1109/ssi56489.2022.9901416'
apa: Lange, S., Hedayat, C., Kuhn, H., & Hilleringmann, U. (2022). Modeling
and Characterization of a 3D Environment for the Design of an Inductively Based
Locating Method by Coil Couplings. 2022 Smart Systems Integration (SSI).
https://doi.org/10.1109/ssi56489.2022.9901416
bibtex: '@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2022, title={Modeling and
Characterization of a 3D Environment for the Design of an Inductively Based Locating
Method by Coil Couplings}, DOI={10.1109/ssi56489.2022.9901416},
booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange,
Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2022}
}'
chicago: Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann.
“Modeling and Characterization of a 3D Environment for the Design of an Inductively
Based Locating Method by Coil Couplings.” In 2022 Smart Systems Integration
(SSI). IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901416.
ieee: 'S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Modeling and Characterization
of a 3D Environment for the Design of an Inductively Based Locating Method by
Coil Couplings,” 2022, doi: 10.1109/ssi56489.2022.9901416.'
mla: Lange, Sven, et al. “Modeling and Characterization of a 3D Environment for
the Design of an Inductively Based Locating Method by Coil Couplings.” 2022
Smart Systems Integration (SSI), IEEE, 2022, doi:10.1109/ssi56489.2022.9901416.
short: 'S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems
Integration (SSI), IEEE, 2022.'
date_created: 2023-01-24T10:03:39Z
date_updated: 2023-03-23T13:26:35Z
department:
- _id: '59'
doi: 10.1109/ssi56489.2022.9901416
language:
- iso: eng
publication: 2022 Smart Systems Integration (SSI)
publication_status: published
publisher: IEEE
status: public
title: Modeling and Characterization of a 3D Environment for the Design of an Inductively
Based Locating Method by Coil Couplings
type: conference
user_id: '20179'
year: '2022'
...
---
_id: '39375'
author:
- first_name: Sven
full_name: Lange, Sven
last_name: Lange
- first_name: Christian
full_name: Hedayat, Christian
last_name: Hedayat
- first_name: Harald
full_name: Kuhn, Harald
last_name: Kuhn
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
id: '20179'
last_name: Hilleringmann
citation:
ama: 'Lange S, Hedayat C, Kuhn H, Hilleringmann U. Modeling and Characterization
of a 3D Environment for the Design of an Inductively Based Locating Method by
Coil Couplings. In: 2022 Smart Systems Integration (SSI). IEEE; 2022. doi:10.1109/ssi56489.2022.9901416'
apa: Lange, S., Hedayat, C., Kuhn, H., & Hilleringmann, U. (2022). Modeling
and Characterization of a 3D Environment for the Design of an Inductively Based
Locating Method by Coil Couplings. 2022 Smart Systems Integration (SSI).
https://doi.org/10.1109/ssi56489.2022.9901416
bibtex: '@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2022, title={Modeling and
Characterization of a 3D Environment for the Design of an Inductively Based Locating
Method by Coil Couplings}, DOI={10.1109/ssi56489.2022.9901416},
booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange,
Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2022}
}'
chicago: Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann.
“Modeling and Characterization of a 3D Environment for the Design of an Inductively
Based Locating Method by Coil Couplings.” In 2022 Smart Systems Integration
(SSI). IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901416.
ieee: 'S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Modeling and Characterization
of a 3D Environment for the Design of an Inductively Based Locating Method by
Coil Couplings,” 2022, doi: 10.1109/ssi56489.2022.9901416.'
mla: Lange, Sven, et al. “Modeling and Characterization of a 3D Environment for
the Design of an Inductively Based Locating Method by Coil Couplings.” 2022
Smart Systems Integration (SSI), IEEE, 2022, doi:10.1109/ssi56489.2022.9901416.
short: 'S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems
Integration (SSI), IEEE, 2022.'
date_created: 2023-01-24T10:05:18Z
date_updated: 2023-03-23T13:27:07Z
department:
- _id: '59'
doi: 10.1109/ssi56489.2022.9901416
language:
- iso: eng
publication: 2022 Smart Systems Integration (SSI)
publication_status: published
publisher: IEEE
status: public
title: Modeling and Characterization of a 3D Environment for the Design of an Inductively
Based Locating Method by Coil Couplings
type: conference
user_id: '20179'
year: '2022'
...
---
_id: '33509'
abstract:
- lang: eng
text: In this publication a novel method for far-field prediction from magnetic
Huygens box data based on the boundary element method (BEM) is presented. Two
examples are considered for the validation of this method. The first example represents
an electric dipole so that the obtained calculations can be compared to an analytical
solution. As a second example, a printed circuit board is considered and the calculated
far-field is compared to a fullwave simulation. In both cases, the calculations
for different field integral equations are under comparison, and the results indicate
that the presented method performs very well with a combined field integral equation,
for the specified problem, when only magnetic Huygens box data is given.
author:
- first_name: Christoph
full_name: Marschalt, Christoph
last_name: Marschalt
- first_name: Dominik
full_name: Schroder, Dominik
last_name: Schroder
- first_name: Sven
full_name: Lange, Sven
id: '38240'
last_name: Lange
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
id: '20179'
last_name: Hilleringmann
- first_name: Christian
full_name: Hedayat, Christian
last_name: Hedayat
- first_name: Harald
full_name: Kuhn, Harald
last_name: Kuhn
- first_name: Denis
full_name: Sievers, Denis
last_name: Sievers
- first_name: Jens
full_name: Förstner, Jens
id: '158'
last_name: Förstner
orcid: 0000-0001-7059-9862
citation:
ama: 'Marschalt C, Schroder D, Lange S, et al. Far-field Calculation from magnetic
Huygens Box Data using the Boundary Element Method. In: 2022 Smart Systems
Integration (SSI). IEEE; 2022. doi:10.1109/ssi56489.2022.9901431'
apa: Marschalt, C., Schroder, D., Lange, S., Hilleringmann, U., Hedayat, C., Kuhn,
H., Sievers, D., & Förstner, J. (2022). Far-field Calculation from magnetic
Huygens Box Data using the Boundary Element Method. 2022 Smart Systems Integration
(SSI). 2022 Smart Systems Integration (SSI), Grenoble, France. https://doi.org/10.1109/ssi56489.2022.9901431
bibtex: '@inproceedings{Marschalt_Schroder_Lange_Hilleringmann_Hedayat_Kuhn_Sievers_Förstner_2022,
place={Grenoble, France}, title={Far-field Calculation from magnetic Huygens Box
Data using the Boundary Element Method}, DOI={10.1109/ssi56489.2022.9901431},
booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Marschalt,
Christoph and Schroder, Dominik and Lange, Sven and Hilleringmann, Ulrich and
Hedayat, Christian and Kuhn, Harald and Sievers, Denis and Förstner, Jens}, year={2022}
}'
chicago: 'Marschalt, Christoph, Dominik Schroder, Sven Lange, Ulrich Hilleringmann,
Christian Hedayat, Harald Kuhn, Denis Sievers, and Jens Förstner. “Far-Field Calculation
from Magnetic Huygens Box Data Using the Boundary Element Method.” In 2022
Smart Systems Integration (SSI). Grenoble, France: IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901431.'
ieee: 'C. Marschalt et al., “Far-field Calculation from magnetic Huygens
Box Data using the Boundary Element Method,” presented at the 2022 Smart Systems
Integration (SSI), Grenoble, France, 2022, doi: 10.1109/ssi56489.2022.9901431.'
mla: Marschalt, Christoph, et al. “Far-Field Calculation from Magnetic Huygens Box
Data Using the Boundary Element Method.” 2022 Smart Systems Integration (SSI),
IEEE, 2022, doi:10.1109/ssi56489.2022.9901431.
short: 'C. Marschalt, D. Schroder, S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn,
D. Sievers, J. Förstner, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble,
France, 2022.'
conference:
end_date: 2022-04-28
location: Grenoble, France
name: 2022 Smart Systems Integration (SSI)
start_date: 2022-04-27
date_created: 2022-10-04T11:31:43Z
date_updated: 2023-10-31T07:40:54Z
department:
- _id: '59'
- _id: '61'
- _id: '485'
doi: 10.1109/ssi56489.2022.9901431
keyword:
- Near-Field Scanning
- Huygens Box
- Boundary Element Method
- Method of Moments
- tet_topic_hf
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9901431
place: Grenoble, France
project:
- _id: '52'
name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
publication: 2022 Smart Systems Integration (SSI)
publication_identifier:
eisbn:
- 978-1-6654-8849-5
publication_status: published
publisher: IEEE
status: public
title: Far-field Calculation from magnetic Huygens Box Data using the Boundary Element
Method
type: conference
user_id: '20179'
year: '2022'
...
---
_id: '22480'
abstract:
- lang: eng
text: In this publication important aspects for the implementation of inductive
locating are explained. The miniaturized sensor platform called Sens-o-Spheres
is used as an application of this locating method. The sensor platform is applied
in bioreactors in order to obtain the environmental parameters, which makes a
localization by magnetic fields necessary. Since the properties of magnetic fields
in the localization area are very different from the wave characteristics, the
principle of inductive localization is investigated in this publication and explained
by using electrical equivalent circuit diagrams. Thereby, inductive localization
uses the coupling or the mutual inductivities between coils, which is noticeable
by an induced voltage. Therefore some properties and procedures are explained
to extract the location of Sens-o-Spheres or other industrial sensor platforms
from the couplings of the coils. One method calculates the location from an adapted
ratio calculation and the other method uses neural networks and stochastic filters
to obtain the results. In the end, these results are evaluated and compared.
author:
- first_name: Sven
full_name: Lange, Sven
id: '38240'
last_name: Lange
- first_name: Dominik
full_name: Schröder, Dominik
last_name: Schröder
- first_name: Christian
full_name: Hedayat, Christian
last_name: Hedayat
- first_name: Harald
full_name: Kuhn, Harald
last_name: Kuhn
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
last_name: Hilleringmann
citation:
ama: 'Lange S, Schröder D, Hedayat C, Kuhn H, Hilleringmann U. Development of Methods
for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms
in Bioprocesses. In: 22nd IEEE International Conference on Industrial Technology
(ICIT). Valencia, Spain : IEEE; 2021. doi:10.1109/icit46573.2021.9453609'
apa: 'Lange, S., Schröder, D., Hedayat, C., Kuhn, H., & Hilleringmann, U. (2021).
Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized
Sensor Platforms in Bioprocesses. In 22nd IEEE International Conference on
Industrial Technology (ICIT). Valencia, Spain : IEEE. https://doi.org/10.1109/icit46573.2021.9453609'
bibtex: '@inproceedings{Lange_Schröder_Hedayat_Kuhn_Hilleringmann_2021, place={
Valencia, Spain }, title={Development of Methods for Coil-Based Localization by
Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses}, DOI={10.1109/icit46573.2021.9453609},
booktitle={22nd IEEE International Conference on Industrial Technology (ICIT)},
publisher={IEEE}, author={Lange, Sven and Schröder, Dominik and Hedayat, Christian
and Kuhn, Harald and Hilleringmann, Ulrich}, year={2021} }'
chicago: 'Lange, Sven, Dominik Schröder, Christian Hedayat, Harald Kuhn, and Ulrich
Hilleringmann. “Development of Methods for Coil-Based Localization by Magnetic
Fields of Miniaturized Sensor Platforms in Bioprocesses.” In 22nd IEEE International
Conference on Industrial Technology (ICIT). Valencia, Spain : IEEE, 2021.
https://doi.org/10.1109/icit46573.2021.9453609.'
ieee: S. Lange, D. Schröder, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Development
of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor
Platforms in Bioprocesses,” in 22nd IEEE International Conference on Industrial
Technology (ICIT), Valencia, Spain , 2021.
mla: Lange, Sven, et al. “Development of Methods for Coil-Based Localization by
Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses.” 22nd IEEE
International Conference on Industrial Technology (ICIT), IEEE, 2021, doi:10.1109/icit46573.2021.9453609.
short: 'S. Lange, D. Schröder, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 22nd IEEE
International Conference on Industrial Technology (ICIT), IEEE, Valencia, Spain
, 2021.'
conference:
end_date: 2021-03-12
location: 'Valencia, Spain '
name: 22nd IEEE International Conference on Industrial Technology (ICIT)
start_date: 2021-03-10
date_created: 2021-06-20T23:25:54Z
date_updated: 2022-01-06T06:55:33Z
department:
- _id: '59'
- _id: '485'
doi: 10.1109/icit46573.2021.9453609
keyword:
- Location awareness
- Coils
- Couplings
- Nonuniform electric fields
- Magnetic separation
- Neural networks
- Training data
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9453609
place: ' Valencia, Spain '
project:
- _id: '52'
name: Computing Resources Provided by the Paderborn Center for Parallel Computing
publication: 22nd IEEE International Conference on Industrial Technology (ICIT)
publication_identifier:
isbn:
- '9781728157306'
publication_status: published
publisher: IEEE
status: public
title: Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized
Sensor Platforms in Bioprocesses
type: conference
user_id: '38240'
year: '2021'
...
---
_id: '22481'
abstract:
- lang: eng
text: During the industrial processing of materials for the manufacture of new products,
surface defects can quickly occur. In order to achieve high quality without a
long time delay, it makes sense to inspect the work pieces so that defective work
pieces can be sorted out right at the beginning of the process. At the same time,
the evaluation unit should come close the perception of the human eye regarding
detection of defects in surfaces. Such defects often manifest themselves by a
deviation of the existing structure. The only restriction should be that only
matt surfaces should be considered here. Therefore in this work, different classification
and image processing algorithms are applied to surface data to identify possible
surface damages. For this purpose, the Gabor filter and the FST (Fused Structure
and Texture) features generated with it, as well as the salience metric are used
on the image processing side. On the classification side, however, deep neural
networks, Convolutional Neural Networks (CNN), and autoencoders are used to make
a decision. A distinction is also made between training using class labels and
without. It turns out later that the salience metric are best performed by CNN.
On the other hand, if there is no labeled training data available, a novelty classification
can easily be achieved by using autoencoders as well as the salience metric and
some filters.
author:
- first_name: Tom
full_name: Sander, Tom
last_name: Sander
- first_name: Sven
full_name: Lange, Sven
id: '38240'
last_name: Lange
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
last_name: Hilleringmann
- first_name: Volker
full_name: Geneis, Volker
last_name: Geneis
- first_name: Christian
full_name: Hedayat, Christian
last_name: Hedayat
- first_name: Harald
full_name: Kuhn, Harald
last_name: Kuhn
- first_name: Franz-Barthold
full_name: Gockel, Franz-Barthold
last_name: Gockel
citation:
ama: 'Sander T, Lange S, Hilleringmann U, et al. Detection of Defects on Irregular
Structured Surfaces by Image Processing Methods for Feature Extraction. In: 22nd
IEEE International Conference on Industrial Technology (ICIT). Valencia, Spain
: IEEE; 2021. doi:10.1109/icit46573.2021.9453646'
apa: 'Sander, T., Lange, S., Hilleringmann, U., Geneis, V., Hedayat, C., Kuhn, H.,
& Gockel, F.-B. (2021). Detection of Defects on Irregular Structured Surfaces
by Image Processing Methods for Feature Extraction. In 22nd IEEE International
Conference on Industrial Technology (ICIT). Valencia, Spain : IEEE. https://doi.org/10.1109/icit46573.2021.9453646'
bibtex: '@inproceedings{Sander_Lange_Hilleringmann_Geneis_Hedayat_Kuhn_Gockel_2021,
place={Valencia, Spain }, title={Detection of Defects on Irregular Structured
Surfaces by Image Processing Methods for Feature Extraction}, DOI={10.1109/icit46573.2021.9453646},
booktitle={22nd IEEE International Conference on Industrial Technology (ICIT)},
publisher={IEEE}, author={Sander, Tom and Lange, Sven and Hilleringmann, Ulrich
and Geneis, Volker and Hedayat, Christian and Kuhn, Harald and Gockel, Franz-Barthold},
year={2021} }'
chicago: 'Sander, Tom, Sven Lange, Ulrich Hilleringmann, Volker Geneis, Christian
Hedayat, Harald Kuhn, and Franz-Barthold Gockel. “Detection of Defects on Irregular
Structured Surfaces by Image Processing Methods for Feature Extraction.” In 22nd
IEEE International Conference on Industrial Technology (ICIT). Valencia, Spain
: IEEE, 2021. https://doi.org/10.1109/icit46573.2021.9453646.'
ieee: T. Sander et al., “Detection of Defects on Irregular Structured Surfaces
by Image Processing Methods for Feature Extraction,” in 22nd IEEE International
Conference on Industrial Technology (ICIT), Valencia, Spain , 2021.
mla: Sander, Tom, et al. “Detection of Defects on Irregular Structured Surfaces
by Image Processing Methods for Feature Extraction.” 22nd IEEE International
Conference on Industrial Technology (ICIT), IEEE, 2021, doi:10.1109/icit46573.2021.9453646.
short: 'T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, F.-B.
Gockel, in: 22nd IEEE International Conference on Industrial Technology (ICIT),
IEEE, Valencia, Spain , 2021.'
conference:
end_date: 2021-03-12
location: 'Valencia, Spain '
name: 22nd IEEE International Conference on Industrial Technology (ICIT)
start_date: 2021-03-10
date_created: 2021-06-20T23:32:11Z
date_updated: 2022-01-06T06:55:33Z
department:
- _id: '59'
- _id: '485'
doi: 10.1109/icit46573.2021.9453646
keyword:
- Image Processing
- Defect Detection
- wooden surfaces
- Machine Learning
- Neural Networks
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9453646
place: 'Valencia, Spain '
publication: 22nd IEEE International Conference on Industrial Technology (ICIT)
publication_identifier:
isbn:
- '9781728157306'
publication_status: published
publisher: IEEE
status: public
title: Detection of Defects on Irregular Structured Surfaces by Image Processing Methods
for Feature Extraction
type: conference
user_id: '38240'
year: '2021'
...
---
_id: '22532'
abstract:
- lang: eng
text: In this publication, further elements of the newly developed inductive localization
in the near field are presented. The advantage of inductive localization is the
usage of the magnetic fields, which have a very low influence of non-metallic
materials in the environment and thus follows good applications in the area of
medicine and biochemistry. This allows a precise localization of sensor platforms
in inhomogeneous mixtures of materials, where classical methods have major problems
with inhomogeneous dielectric conductivity or density. The calculation of the
localization of the searched object differs from other methods such as ultrasound
or electromagnetic waves due to the source-free propagation of the magnetic field.
Therefore, new mathematical evaluation methods and systematic adaptations are
necessary, which are presented in this paper in circuit analysis. For this purpose,
the exact circuit influences of one coil and the influence of another coil are
investigated and which resonance circuit should be selected for both coils for
a inductive localization with optimized signal strength.
author:
- first_name: Sven
full_name: Lange, Sven
id: '38240'
last_name: Lange
- first_name: Christian
full_name: Hedayat, Christian
last_name: Hedayat
- first_name: Harald
full_name: Kuhn, Harald
last_name: Kuhn
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
last_name: Hilleringmann
citation:
ama: 'Lange S, Hedayat C, Kuhn H, Hilleringmann U. Adaptation and Optimization of
Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization
in the Near Field. In: 2021 Smart Systems Integration (SSI). Grenoble,
France: IEEE; 2021. doi:10.1109/ssi52265.2021.9466958'
apa: 'Lange, S., Hedayat, C., Kuhn, H., & Hilleringmann, U. (2021). Adaptation
and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic
Field-Based Localization in the Near Field. In 2021 Smart Systems Integration
(SSI). Grenoble, France: IEEE. https://doi.org/10.1109/ssi52265.2021.9466958'
bibtex: '@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2021, place={Grenoble,
France}, title={Adaptation and Optimization of Planar Coils for a More Accurate
and Far-Reaching Magnetic Field-Based Localization in the Near Field}, DOI={10.1109/ssi52265.2021.9466958},
booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange,
Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2021}
}'
chicago: 'Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann.
“Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching
Magnetic Field-Based Localization in the Near Field.” In 2021 Smart Systems
Integration (SSI). Grenoble, France: IEEE, 2021. https://doi.org/10.1109/ssi52265.2021.9466958.'
ieee: S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Adaptation and Optimization
of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization
in the Near Field,” in 2021 Smart Systems Integration (SSI), Grenoble,
France , 2021.
mla: Lange, Sven, et al. “Adaptation and Optimization of Planar Coils for a More
Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field.”
2021 Smart Systems Integration (SSI), IEEE, 2021, doi:10.1109/ssi52265.2021.9466958.
short: 'S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 Smart Systems
Integration (SSI), IEEE, Grenoble, France, 2021.'
conference:
end_date: 2021-04-29
location: 'Grenoble, France '
name: 2021 Smart Systems Integration (SSI)
start_date: 2021-04-27
date_created: 2021-07-05T19:31:52Z
date_updated: 2022-01-06T06:55:36Z
department:
- _id: '59'
- _id: '485'
doi: 10.1109/ssi52265.2021.9466958
keyword:
- Electrotechnical Characteristics of Real Coils
- Inductive Localization
- Resonant Circuit
- Mutual Inductance
- Near-Field
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9466958
place: Grenoble, France
publication: 2021 Smart Systems Integration (SSI)
publication_identifier:
isbn:
- '9781665440929'
publication_status: published
publisher: IEEE
status: public
title: Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching
Magnetic Field-Based Localization in the Near Field
type: conference
user_id: '38240'
year: '2021'
...
---
_id: '24538'
author:
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
last_name: Hilleringmann
- first_name: Dmitry
full_name: Petrov, Dmitry
last_name: Petrov
- first_name: Ibrahim
full_name: Mwammenywa, Ibrahim
last_name: Mwammenywa
- first_name: Geoffrey M.
full_name: Kagarura, Geoffrey M.
last_name: Kagarura
citation:
ama: 'Hilleringmann U, Petrov D, Mwammenywa I, Kagarura GM. Local Power Control
using Wireless Sensor System for Microgrids in Africa. In: IEEE; 2021.'
apa: Hilleringmann, U., Petrov, D., Mwammenywa, I., & Kagarura, G. M. (2021).
Local Power Control using Wireless Sensor System for Microgrids in Africa.
IEEE Africon 2021, Arusha, Tansania.
bibtex: '@inproceedings{Hilleringmann_Petrov_Mwammenywa_Kagarura_2021, place={Arusha,
Tansania}, title={Local Power Control using Wireless Sensor System for Microgrids
in Africa}, publisher={IEEE}, author={Hilleringmann, Ulrich and Petrov, Dmitry
and Mwammenywa, Ibrahim and Kagarura, Geoffrey M.}, year={2021} }'
chicago: 'Hilleringmann, Ulrich, Dmitry Petrov, Ibrahim Mwammenywa, and Geoffrey
M. Kagarura. “Local Power Control Using Wireless Sensor System for Microgrids
in Africa.” Arusha, Tansania: IEEE, 2021.'
ieee: U. Hilleringmann, D. Petrov, I. Mwammenywa, and G. M. Kagarura, “Local Power
Control using Wireless Sensor System for Microgrids in Africa,” presented at the
IEEE Africon 2021, Arusha, Tansania, 2021.
mla: Hilleringmann, Ulrich, et al. Local Power Control Using Wireless Sensor
System for Microgrids in Africa. IEEE, 2021.
short: 'U. Hilleringmann, D. Petrov, I. Mwammenywa, G.M. Kagarura, in: IEEE, Arusha,
Tansania, 2021.'
conference:
end_date: 2021-09-15
location: Arusha, Tansania
name: IEEE Africon 2021
start_date: 2021-09-13
date_created: 2021-09-16T05:47:21Z
date_updated: 2023-02-09T07:16:08Z
department:
- _id: '59'
keyword:
- Art-D
- Afrika
language:
- iso: eng
place: Arusha, Tansania
publisher: IEEE
status: public
title: Local Power Control using Wireless Sensor System for Microgrids in Africa
type: conference
user_id: '16148'
year: '2021'
...
---
_id: '39401'
author:
- first_name: Sven
full_name: Lange, Sven
last_name: Lange
- first_name: Christian
full_name: Hedayat, Christian
last_name: Hedayat
- first_name: Harald
full_name: Kuhn, Harald
last_name: Kuhn
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
id: '20179'
last_name: Hilleringmann
citation:
ama: 'Lange S, Hedayat C, Kuhn H, Hilleringmann U. Adaptation and Optimization of
Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization
in the Near Field. In: 2021 Smart Systems Integration (SSI). IEEE; 2021.
doi:10.1109/ssi52265.2021.9466958'
apa: Lange, S., Hedayat, C., Kuhn, H., & Hilleringmann, U. (2021). Adaptation
and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic
Field-Based Localization in the Near Field. 2021 Smart Systems Integration
(SSI). https://doi.org/10.1109/ssi52265.2021.9466958
bibtex: '@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2021, title={Adaptation
and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic
Field-Based Localization in the Near Field}, DOI={10.1109/ssi52265.2021.9466958},
booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange,
Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2021}
}'
chicago: Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann.
“Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching
Magnetic Field-Based Localization in the Near Field.” In 2021 Smart Systems
Integration (SSI). IEEE, 2021. https://doi.org/10.1109/ssi52265.2021.9466958.
ieee: 'S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Adaptation and Optimization
of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization
in the Near Field,” 2021, doi: 10.1109/ssi52265.2021.9466958.'
mla: Lange, Sven, et al. “Adaptation and Optimization of Planar Coils for a More
Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field.”
2021 Smart Systems Integration (SSI), IEEE, 2021, doi:10.1109/ssi52265.2021.9466958.
short: 'S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 Smart Systems
Integration (SSI), IEEE, 2021.'
date_created: 2023-01-24T10:18:52Z
date_updated: 2023-03-21T10:00:40Z
department:
- _id: '59'
doi: 10.1109/ssi52265.2021.9466958
language:
- iso: eng
publication: 2021 Smart Systems Integration (SSI)
publication_status: published
publisher: IEEE
status: public
title: Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching
Magnetic Field-Based Localization in the Near Field
type: conference
user_id: '20179'
year: '2021'
...
---
_id: '39927'
author:
- first_name: Dmitry
full_name: Petrov, Dmitry
last_name: Petrov
- first_name: Konstantin
full_name: Kroschewski, Konstantin
last_name: Kroschewski
- first_name: Ibrahim
full_name: Mwammenywa, Ibrahim
last_name: Mwammenywa
- first_name: G. Mark
full_name: Kagarura, G. Mark
last_name: Kagarura
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
id: '20179'
last_name: Hilleringmann
citation:
ama: 'Petrov D, Kroschewski K, Mwammenywa I, Kagarura GM, Hilleringmann U. Low-Cost
NB-IoT Microgrid Power Quality Monitoring System. In: 2021 IEEE Sensors.
IEEE; 2021. doi:10.1109/sensors47087.2021.9639641'
apa: Petrov, D., Kroschewski, K., Mwammenywa, I., Kagarura, G. M., & Hilleringmann,
U. (2021). Low-Cost NB-IoT Microgrid Power Quality Monitoring System. 2021
IEEE Sensors. https://doi.org/10.1109/sensors47087.2021.9639641
bibtex: '@inproceedings{Petrov_Kroschewski_Mwammenywa_Kagarura_Hilleringmann_2021,
title={Low-Cost NB-IoT Microgrid Power Quality Monitoring System}, DOI={10.1109/sensors47087.2021.9639641},
booktitle={2021 IEEE Sensors}, publisher={IEEE}, author={Petrov, Dmitry and Kroschewski,
Konstantin and Mwammenywa, Ibrahim and Kagarura, G. Mark and Hilleringmann, Ulrich},
year={2021} }'
chicago: Petrov, Dmitry, Konstantin Kroschewski, Ibrahim Mwammenywa, G. Mark Kagarura,
and Ulrich Hilleringmann. “Low-Cost NB-IoT Microgrid Power Quality Monitoring
System.” In 2021 IEEE Sensors. IEEE, 2021. https://doi.org/10.1109/sensors47087.2021.9639641.
ieee: 'D. Petrov, K. Kroschewski, I. Mwammenywa, G. M. Kagarura, and U. Hilleringmann,
“Low-Cost NB-IoT Microgrid Power Quality Monitoring System,” 2021, doi: 10.1109/sensors47087.2021.9639641.'
mla: Petrov, Dmitry, et al. “Low-Cost NB-IoT Microgrid Power Quality Monitoring
System.” 2021 IEEE Sensors, IEEE, 2021, doi:10.1109/sensors47087.2021.9639641.
short: 'D. Petrov, K. Kroschewski, I. Mwammenywa, G.M. Kagarura, U. Hilleringmann,
in: 2021 IEEE Sensors, IEEE, 2021.'
date_created: 2023-01-25T09:34:58Z
date_updated: 2023-03-21T10:12:03Z
department:
- _id: '59'
doi: 10.1109/sensors47087.2021.9639641
language:
- iso: eng
publication: 2021 IEEE Sensors
publication_status: published
publisher: IEEE
status: public
title: Low-Cost NB-IoT Microgrid Power Quality Monitoring System
type: conference
user_id: '20179'
year: '2021'
...
---
_id: '39397'
author:
- first_name: Dmitry
full_name: Petrov, Dmitry
last_name: Petrov
- first_name: Konstantin
full_name: Kroschewski, Konstantin
last_name: Kroschewski
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
id: '20179'
last_name: Hilleringmann
citation:
ama: 'Petrov D, Kroschewski K, Hilleringmann U. Microcontroller Firmware Design
for Industrial Wireless Sensors. In: 2021 Smart Systems Integration (SSI).
IEEE; 2021. doi:10.1109/ssi52265.2021.9467010'
apa: Petrov, D., Kroschewski, K., & Hilleringmann, U. (2021). Microcontroller
Firmware Design for Industrial Wireless Sensors. 2021 Smart Systems Integration
(SSI). https://doi.org/10.1109/ssi52265.2021.9467010
bibtex: '@inproceedings{Petrov_Kroschewski_Hilleringmann_2021, title={Microcontroller
Firmware Design for Industrial Wireless Sensors}, DOI={10.1109/ssi52265.2021.9467010},
booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Petrov,
Dmitry and Kroschewski, Konstantin and Hilleringmann, Ulrich}, year={2021} }'
chicago: Petrov, Dmitry, Konstantin Kroschewski, and Ulrich Hilleringmann. “Microcontroller
Firmware Design for Industrial Wireless Sensors.” In 2021 Smart Systems Integration
(SSI). IEEE, 2021. https://doi.org/10.1109/ssi52265.2021.9467010.
ieee: 'D. Petrov, K. Kroschewski, and U. Hilleringmann, “Microcontroller Firmware
Design for Industrial Wireless Sensors,” 2021, doi: 10.1109/ssi52265.2021.9467010.'
mla: Petrov, Dmitry, et al. “Microcontroller Firmware Design for Industrial Wireless
Sensors.” 2021 Smart Systems Integration (SSI), IEEE, 2021, doi:10.1109/ssi52265.2021.9467010.
short: 'D. Petrov, K. Kroschewski, U. Hilleringmann, in: 2021 Smart Systems Integration
(SSI), IEEE, 2021.'
date_created: 2023-01-24T10:14:17Z
date_updated: 2023-03-21T10:08:46Z
department:
- _id: '59'
doi: 10.1109/ssi52265.2021.9467010
language:
- iso: eng
publication: 2021 Smart Systems Integration (SSI)
publication_status: published
publisher: IEEE
status: public
title: Microcontroller Firmware Design for Industrial Wireless Sensors
type: conference
user_id: '20179'
year: '2021'
...
---
_id: '39384'
author:
- first_name: Julia
full_name: Reker, Julia
last_name: Reker
- first_name: Thorsten
full_name: Meyers, Thorsten
last_name: Meyers
- first_name: Fabio F.
full_name: Vidor, Fabio F.
last_name: Vidor
- first_name: Trudi-Heleen
full_name: Joubert, Trudi-Heleen
last_name: Joubert
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
id: '20179'
last_name: Hilleringmann
citation:
ama: 'Reker J, Meyers T, Vidor FF, Joubert T-H, Hilleringmann U. Influence of electrode
metallization on thin-film transistor performance. In: 2021 IEEE AFRICON.
IEEE; 2021. doi:10.1109/africon51333.2021.9570953'
apa: Reker, J., Meyers, T., Vidor, F. F., Joubert, T.-H., & Hilleringmann, U.
(2021). Influence of electrode metallization on thin-film transistor performance.
2021 IEEE AFRICON. https://doi.org/10.1109/africon51333.2021.9570953
bibtex: '@inproceedings{Reker_Meyers_Vidor_Joubert_Hilleringmann_2021, title={Influence
of electrode metallization on thin-film transistor performance}, DOI={10.1109/africon51333.2021.9570953},
booktitle={2021 IEEE AFRICON}, publisher={IEEE}, author={Reker, Julia and Meyers,
Thorsten and Vidor, Fabio F. and Joubert, Trudi-Heleen and Hilleringmann, Ulrich},
year={2021} }'
chicago: Reker, Julia, Thorsten Meyers, Fabio F. Vidor, Trudi-Heleen Joubert, and
Ulrich Hilleringmann. “Influence of Electrode Metallization on Thin-Film Transistor
Performance.” In 2021 IEEE AFRICON. IEEE, 2021. https://doi.org/10.1109/africon51333.2021.9570953.
ieee: 'J. Reker, T. Meyers, F. F. Vidor, T.-H. Joubert, and U. Hilleringmann, “Influence
of electrode metallization on thin-film transistor performance,” 2021, doi: 10.1109/africon51333.2021.9570953.'
mla: Reker, Julia, et al. “Influence of Electrode Metallization on Thin-Film Transistor
Performance.” 2021 IEEE AFRICON, IEEE, 2021, doi:10.1109/africon51333.2021.9570953.
short: 'J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021
IEEE AFRICON, IEEE, 2021.'
date_created: 2023-01-24T10:08:41Z
date_updated: 2023-03-22T10:23:56Z
department:
- _id: '59'
doi: 10.1109/africon51333.2021.9570953
language:
- iso: eng
publication: 2021 IEEE AFRICON
publication_status: published
publisher: IEEE
status: public
title: Influence of electrode metallization on thin-film transistor performance
type: conference
user_id: '20179'
year: '2021'
...