--- _id: '39359' author: - first_name: Ibrahim full_name: Mwammenywa, Ibrahim last_name: Mwammenywa - first_name: Dmitry full_name: Petrov, Dmitry last_name: Petrov - first_name: Philipp full_name: Holle, Philipp last_name: Holle - first_name: Ulrich full_name: Hilleringmann, Ulrich id: '20179' last_name: Hilleringmann citation: ama: 'Mwammenywa I, Petrov D, Holle P, Hilleringmann U. LoRa Transceiver for Load Monitoring and Control System in Microgrids. In: 2022 International Conference on Engineering and Emerging Technologies (ICEET). IEEE; 2023. doi:10.1109/iceet56468.2022.10007274' apa: Mwammenywa, I., Petrov, D., Holle, P., & Hilleringmann, U. (2023). LoRa Transceiver for Load Monitoring and Control System in Microgrids. 2022 International Conference on Engineering and Emerging Technologies (ICEET). https://doi.org/10.1109/iceet56468.2022.10007274 bibtex: '@inproceedings{Mwammenywa_Petrov_Holle_Hilleringmann_2023, title={LoRa Transceiver for Load Monitoring and Control System in Microgrids}, DOI={10.1109/iceet56468.2022.10007274}, booktitle={2022 International Conference on Engineering and Emerging Technologies (ICEET)}, publisher={IEEE}, author={Mwammenywa, Ibrahim and Petrov, Dmitry and Holle, Philipp and Hilleringmann, Ulrich}, year={2023} }' chicago: Mwammenywa, Ibrahim, Dmitry Petrov, Philipp Holle, and Ulrich Hilleringmann. “LoRa Transceiver for Load Monitoring and Control System in Microgrids.” In 2022 International Conference on Engineering and Emerging Technologies (ICEET). IEEE, 2023. https://doi.org/10.1109/iceet56468.2022.10007274. ieee: 'I. Mwammenywa, D. Petrov, P. Holle, and U. Hilleringmann, “LoRa Transceiver for Load Monitoring and Control System in Microgrids,” 2023, doi: 10.1109/iceet56468.2022.10007274.' mla: Mwammenywa, Ibrahim, et al. “LoRa Transceiver for Load Monitoring and Control System in Microgrids.” 2022 International Conference on Engineering and Emerging Technologies (ICEET), IEEE, 2023, doi:10.1109/iceet56468.2022.10007274. short: 'I. Mwammenywa, D. Petrov, P. Holle, U. Hilleringmann, in: 2022 International Conference on Engineering and Emerging Technologies (ICEET), IEEE, 2023.' date_created: 2023-01-24T09:35:34Z date_updated: 2023-03-21T09:42:20Z department: - _id: '59' doi: 10.1109/iceet56468.2022.10007274 language: - iso: eng publication: 2022 International Conference on Engineering and Emerging Technologies (ICEET) publication_status: published publisher: IEEE status: public title: LoRa Transceiver for Load Monitoring and Control System in Microgrids type: conference user_id: '20179' year: '2023' ... --- _id: '49890' abstract: - lang: eng text: In this paper, the influence of the environment on an inductive location system is analyzed. In the inductive location method, high frequency magnetic fields generated by planar coils lead to induction in other coils, which is used for localization analysis. Magnetic fields are not affected by changes in the dielectric properties of the environment, which is an advantage over other localization methods. However, electrical material parameters can still affect the localization results by indirect effects. For this reason, in this publication the influence will be investigated using real material parameters and their effects on the localization will be considered, so that the robustness and the limits of the inductive localization can be evaluated. author: - first_name: Sven full_name: Lange, Sven id: '38240' last_name: Lange - first_name: Ulrich full_name: Hilleringmann, Ulrich id: '20179' last_name: Hilleringmann - first_name: Christian full_name: Hedayat, Christian last_name: Hedayat - first_name: Harald full_name: Kuhn, Harald last_name: Kuhn - first_name: Jens full_name: Förstner, Jens id: '158' last_name: Förstner orcid: 0000-0001-7059-9862 citation: ama: 'Lange S, Hilleringmann U, Hedayat C, Kuhn H, Förstner J. Characterization of Various Environmental Influences on the Inductive Localization. In: 2023 IEEE Conference on Antenna Measurements and Applications (CAMA). IEEE; 2023. doi:10.1109/cama57522.2023.10352780' apa: Lange, S., Hilleringmann, U., Hedayat, C., Kuhn, H., & Förstner, J. (2023). Characterization of Various Environmental Influences on the Inductive Localization. 2023 IEEE Conference on Antenna Measurements and Applications (CAMA). 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), Genoa, Italy . https://doi.org/10.1109/cama57522.2023.10352780 bibtex: '@inproceedings{Lange_Hilleringmann_Hedayat_Kuhn_Förstner_2023, place={Genoa, Italy }, title={Characterization of Various Environmental Influences on the Inductive Localization}, DOI={10.1109/cama57522.2023.10352780}, booktitle={2023 IEEE Conference on Antenna Measurements and Applications (CAMA)}, publisher={IEEE}, author={Lange, Sven and Hilleringmann, Ulrich and Hedayat, Christian and Kuhn, Harald and Förstner, Jens}, year={2023} }' chicago: 'Lange, Sven, Ulrich Hilleringmann, Christian Hedayat, Harald Kuhn, and Jens Förstner. “Characterization of Various Environmental Influences on the Inductive Localization.” In 2023 IEEE Conference on Antenna Measurements and Applications (CAMA). Genoa, Italy : IEEE, 2023. https://doi.org/10.1109/cama57522.2023.10352780.' ieee: 'S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, and J. Förstner, “Characterization of Various Environmental Influences on the Inductive Localization,” presented at the 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), Genoa, Italy , 2023, doi: 10.1109/cama57522.2023.10352780.' mla: Lange, Sven, et al. “Characterization of Various Environmental Influences on the Inductive Localization.” 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), IEEE, 2023, doi:10.1109/cama57522.2023.10352780. short: 'S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, J. Förstner, in: 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), IEEE, Genoa, Italy , 2023.' conference: end_date: 2023-11-17 location: 'Genoa, Italy ' name: 2023 IEEE Conference on Antenna Measurements and Applications (CAMA) start_date: 2023-11-15 date_created: 2023-12-20T08:36:58Z date_updated: 2023-12-21T09:51:11Z department: - _id: '59' - _id: '61' - _id: '485' doi: 10.1109/cama57522.2023.10352780 keyword: - Planar coils - inductive locating - magnetic fields - environmental influences - eddy currents - tet_topic_hf language: - iso: eng main_file_link: - url: https://ieeexplore.ieee.org/document/10352780 place: 'Genoa, Italy ' publication: 2023 IEEE Conference on Antenna Measurements and Applications (CAMA) publication_identifier: eisbn: - 979-8-3503-2304-7 publication_status: published publisher: IEEE status: public title: Characterization of Various Environmental Influences on the Inductive Localization type: conference user_id: '158' year: '2023' ... --- _id: '34140' abstract: - lang: eng text: In this paper, machine learning techniques will be used to classify different PCB layouts given their electromagnetic frequency spectra. These spectra result from a simulated near-field measurement of electric field strengths at different locations. Measured values consist of real and imaginary parts (amplitude and phase) in X, Y and Z directions. Training data was obtained in the time domain by varying transmission line geometries (size, distance and signaling). It was then transformed into the frequency domain and used as deep neural network input. Principal component analysis was applied to reduce the sample dimension. The results show that classifying different designs is possible with high accuracy based on synthetic data. Future work comprises measurements of real, custom-made PCB with varying parameters to adapt the simulation model and also test the neural network. Finally, the trained model could be used to give hints about the error’s cause when overshooting EMC limits. author: - first_name: Jad full_name: Maalouly, Jad last_name: Maalouly - first_name: Dennis full_name: Hemker, Dennis last_name: Hemker - first_name: Christian full_name: Hedayat, Christian last_name: Hedayat - first_name: Christian full_name: Rückert, Christian last_name: Rückert - first_name: Ivan full_name: Kaufmann, Ivan last_name: Kaufmann - first_name: Marcel full_name: Olbrich, Marcel last_name: Olbrich - first_name: Sven full_name: Lange, Sven id: '38240' last_name: Lange - first_name: Harald full_name: Mathis, Harald last_name: Mathis citation: ama: 'Maalouly J, Hemker D, Hedayat C, et al. AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development. In: 2022 Kleinheubach Conference. IEEE; 2022.' apa: Maalouly, J., Hemker, D., Hedayat, C., Rückert, C., Kaufmann, I., Olbrich, M., Lange, S., & Mathis, H. (2022). AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development. 2022 Kleinheubach Conference. 2022 Kleinheubach Conference, Miltenberg, Germany. bibtex: '@inproceedings{Maalouly_Hemker_Hedayat_Rückert_Kaufmann_Olbrich_Lange_Mathis_2022, place={Miltenberg, Germany}, title={AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development}, booktitle={2022 Kleinheubach Conference}, publisher={IEEE}, author={Maalouly, Jad and Hemker, Dennis and Hedayat, Christian and Rückert, Christian and Kaufmann, Ivan and Olbrich, Marcel and Lange, Sven and Mathis, Harald}, year={2022} }' chicago: 'Maalouly, Jad, Dennis Hemker, Christian Hedayat, Christian Rückert, Ivan Kaufmann, Marcel Olbrich, Sven Lange, and Harald Mathis. “AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development.” In 2022 Kleinheubach Conference. Miltenberg, Germany: IEEE, 2022.' ieee: J. Maalouly et al., “AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development,” presented at the 2022 Kleinheubach Conference, Miltenberg, Germany, 2022. mla: Maalouly, Jad, et al. “AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development.” 2022 Kleinheubach Conference, IEEE, 2022. short: 'J. Maalouly, D. Hemker, C. Hedayat, C. Rückert, I. Kaufmann, M. Olbrich, S. Lange, H. Mathis, in: 2022 Kleinheubach Conference, IEEE, Miltenberg, Germany, 2022.' conference: end_date: 2022-09-29 location: Miltenberg, Germany name: 2022 Kleinheubach Conference start_date: 2022-09-27 date_created: 2022-11-24T14:21:17Z date_updated: 2022-11-24T14:21:34Z department: - _id: '59' - _id: '485' keyword: - emc - pcb - electronic system development - machine learning - neural network language: - iso: eng main_file_link: - url: https://ieeexplore.ieee.org/document/9954484 place: Miltenberg, Germany project: - _id: '52' name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing' publication: 2022 Kleinheubach Conference publication_identifier: eisbn: - 978-3-948571-07-8 publication_status: published publisher: IEEE status: public title: AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development type: conference user_id: '38240' year: '2022' ... --- _id: '33508' abstract: - lang: eng text: In this work, methods will be evaluated to numerically calculate the passive electrical parameters of planar coils. These parameters can then be used to optimize inductive applications such as wireless power transmission. The focus here will be on inductive localization, which uses high-frequency magnetic fields and the resulting induced voltage to provide localization through the coupling parameter mutual inductance. To achieve localization with high accuracy and best possible operation (resonance, signal strength, etc.), the coil parameters need to be well known. For this reason, some numerical methods for the calculation of these quantities are presented and validated. In addition, the physical effects are thereby considered in more detail, allowing the localization procedure to be better optimized compared to simulative black-box methods. The goal should be a dedicated simulation platform for planar coils to be able to develop training data for neural networks and to test and optimize localization algorithms. author: - first_name: Sven full_name: Lange, Sven id: '38240' last_name: Lange - first_name: Christian full_name: Hedayat, Christian last_name: Hedayat - first_name: Harald full_name: Kuhn, Harald last_name: Kuhn - first_name: Ulrich full_name: Hilleringmann, Ulrich last_name: Hilleringmann citation: ama: 'Lange S, Hedayat C, Kuhn H, Hilleringmann U. Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. In: 2022 Smart Systems Integration (SSI). IEEE; 2022. doi:10.1109/ssi56489.2022.9901416' apa: Lange, S., Hedayat, C., Kuhn, H., & Hilleringmann, U. (2022). Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. 2022 Smart Systems Integration (SSI). 2022 Smart Systems Integration (SSI), Grenoble, France. https://doi.org/10.1109/ssi56489.2022.9901416 bibtex: '@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2022, place={Grenoble, France}, title={Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings}, DOI={10.1109/ssi56489.2022.9901416}, booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange, Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2022} }' chicago: 'Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” In 2022 Smart Systems Integration (SSI). Grenoble, France: IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901416.' ieee: 'S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings,” presented at the 2022 Smart Systems Integration (SSI), Grenoble, France, 2022, doi: 10.1109/ssi56489.2022.9901416.' mla: Lange, Sven, et al. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” 2022 Smart Systems Integration (SSI), IEEE, 2022, doi:10.1109/ssi56489.2022.9901416. short: 'S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.' conference: end_date: 2022-04-28 location: Grenoble, France name: 2022 Smart Systems Integration (SSI) start_date: 2022-04-27 date_created: 2022-10-04T11:26:11Z date_updated: 2022-10-04T11:35:11Z department: - _id: '59' - _id: '485' doi: 10.1109/ssi56489.2022.9901416 keyword: - Simulation Environment - Inductive Localization - Coil Parameters - Inductive Applications - Near-Field language: - iso: eng main_file_link: - url: https://ieeexplore.ieee.org/document/9901416 place: Grenoble, France project: - _id: '52' name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing' publication: 2022 Smart Systems Integration (SSI) publication_identifier: eisbn: - 978-1-6654-8849-5 publication_status: published publisher: IEEE status: public title: Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings type: conference user_id: '38240' year: '2022' ... --- _id: '33510' abstract: - lang: eng text: In the manufacture of real wood products, defects can quickly occur during the production process. To quickly sort out these defects, a system is needed that finds damage in the irregularly structured surfaces of the product. The difficulty in this task is that each surface is visually different and no standard defects can be defined. Thus, damage detection using correlation does not work, so this paper will test different machine learning methods. To evaluate different machine learning methods, a data set is needed. For this reason, the available samples were recorded manually using a static fixed camera. Subsequently, the images were divided into sub-images, which resulted in a relatively small data set. Next, a convolutional neural network (CNN) was constructed to classify the images. However, this approach did not lead to a generalized solution, so the dataset was hashed using the a- and pHash. These hash values were then trained with a fully supervised system that will later serve as a reference model, in the semi-supervised learning procedures. To improve the supervised model and not have to label every data point, semi-supervised learning methods are used in the following. For this purpose, the CEAL method (wrapper method) is considered in the first and then the Π-Model (intrinsically semi-supervised). author: - first_name: Tom full_name: Sander, Tom last_name: Sander - first_name: Sven full_name: Lange, Sven id: '38240' last_name: Lange - first_name: Ulrich full_name: Hilleringmann, Ulrich last_name: Hilleringmann - first_name: Volker full_name: Geneiß, Volker last_name: Geneiß - first_name: Christian full_name: Hedayat, Christian last_name: Hedayat - first_name: Harald full_name: Kuhn, Harald last_name: Kuhn citation: ama: 'Sander T, Lange S, Hilleringmann U, Geneiß V, Hedayat C, Kuhn H. Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods. In: 2022 Smart Systems Integration (SSI). IEEE; 2022. doi:10.1109/ssi56489.2022.9901433' apa: Sander, T., Lange, S., Hilleringmann, U., Geneiß, V., Hedayat, C., & Kuhn, H. (2022). Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods. 2022 Smart Systems Integration (SSI). 2022 Smart Systems Integration (SSI), Grenoble, France. https://doi.org/10.1109/ssi56489.2022.9901433 bibtex: '@inproceedings{Sander_Lange_Hilleringmann_Geneiß_Hedayat_Kuhn_2022, place={Grenoble, France}, title={Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods}, DOI={10.1109/ssi56489.2022.9901433}, booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Sander, Tom and Lange, Sven and Hilleringmann, Ulrich and Geneiß, Volker and Hedayat, Christian and Kuhn, Harald}, year={2022} }' chicago: 'Sander, Tom, Sven Lange, Ulrich Hilleringmann, Volker Geneiß, Christian Hedayat, and Harald Kuhn. “Detection of Defects on Irregularly Structured Surfaces Using Supervised and Semi-Supervised Learning Methods.” In 2022 Smart Systems Integration (SSI). Grenoble, France: IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901433.' ieee: 'T. Sander, S. Lange, U. Hilleringmann, V. Geneiß, C. Hedayat, and H. Kuhn, “Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods,” presented at the 2022 Smart Systems Integration (SSI), Grenoble, France, 2022, doi: 10.1109/ssi56489.2022.9901433.' mla: Sander, Tom, et al. “Detection of Defects on Irregularly Structured Surfaces Using Supervised and Semi-Supervised Learning Methods.” 2022 Smart Systems Integration (SSI), IEEE, 2022, doi:10.1109/ssi56489.2022.9901433. short: 'T. Sander, S. Lange, U. Hilleringmann, V. Geneiß, C. Hedayat, H. Kuhn, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.' conference: end_date: 2022-04-28 location: Grenoble, France name: 2022 Smart Systems Integration (SSI) start_date: 2022-04-27 date_created: 2022-10-04T11:35:55Z date_updated: 2022-10-04T11:37:39Z department: - _id: '59' - _id: '485' doi: 10.1109/ssi56489.2022.9901433 keyword: - Machine Learning - CNN - Hashing - semi-supervised learning language: - iso: eng main_file_link: - url: https://ieeexplore.ieee.org/document/9901433 place: Grenoble, France project: - _id: '52' name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing' publication: 2022 Smart Systems Integration (SSI) publication_status: published publisher: IEEE status: public title: Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods type: conference user_id: '38240' year: '2022' ... --- _id: '39389' author: - first_name: Ibrahim full_name: Mwammenywa, Ibrahim last_name: Mwammenywa - first_name: Geoffrey Mark full_name: Kagarura, Geoffrey Mark last_name: Kagarura - first_name: Dmitry full_name: Petrov, Dmitry last_name: Petrov - first_name: Philip full_name: Holle, Philip last_name: Holle - first_name: Ulrich full_name: Hilleringmann, Ulrich id: '20179' last_name: Hilleringmann citation: ama: 'Mwammenywa I, Kagarura GM, Petrov D, Holle P, Hilleringmann U. LoRa-based Demand-side Load Monitoring and Management System for Microgrids in Africa. In: 2021 International Conference on Electrical, Computer and Energy Technologies (ICECET). IEEE; 2022. doi:10.1109/icecet52533.2021.9698506' apa: Mwammenywa, I., Kagarura, G. M., Petrov, D., Holle, P., & Hilleringmann, U. (2022). LoRa-based Demand-side Load Monitoring and Management System for Microgrids in Africa. 2021 International Conference on Electrical, Computer and Energy Technologies (ICECET). https://doi.org/10.1109/icecet52533.2021.9698506 bibtex: '@inproceedings{Mwammenywa_Kagarura_Petrov_Holle_Hilleringmann_2022, title={LoRa-based Demand-side Load Monitoring and Management System for Microgrids in Africa}, DOI={10.1109/icecet52533.2021.9698506}, booktitle={2021 International Conference on Electrical, Computer and Energy Technologies (ICECET)}, publisher={IEEE}, author={Mwammenywa, Ibrahim and Kagarura, Geoffrey Mark and Petrov, Dmitry and Holle, Philip and Hilleringmann, Ulrich}, year={2022} }' chicago: Mwammenywa, Ibrahim, Geoffrey Mark Kagarura, Dmitry Petrov, Philip Holle, and Ulrich Hilleringmann. “LoRa-Based Demand-Side Load Monitoring and Management System for Microgrids in Africa.” In 2021 International Conference on Electrical, Computer and Energy Technologies (ICECET). IEEE, 2022. https://doi.org/10.1109/icecet52533.2021.9698506. ieee: 'I. Mwammenywa, G. M. Kagarura, D. Petrov, P. Holle, and U. Hilleringmann, “LoRa-based Demand-side Load Monitoring and Management System for Microgrids in Africa,” 2022, doi: 10.1109/icecet52533.2021.9698506.' mla: Mwammenywa, Ibrahim, et al. “LoRa-Based Demand-Side Load Monitoring and Management System for Microgrids in Africa.” 2021 International Conference on Electrical, Computer and Energy Technologies (ICECET), IEEE, 2022, doi:10.1109/icecet52533.2021.9698506. short: 'I. Mwammenywa, G.M. Kagarura, D. Petrov, P. Holle, U. Hilleringmann, in: 2021 International Conference on Electrical, Computer and Energy Technologies (ICECET), IEEE, 2022.' date_created: 2023-01-24T10:11:55Z date_updated: 2023-03-22T10:30:39Z department: - _id: '59' doi: 10.1109/icecet52533.2021.9698506 language: - iso: eng publication: 2021 International Conference on Electrical, Computer and Energy Technologies (ICECET) publication_status: published publisher: IEEE status: public title: LoRa-based Demand-side Load Monitoring and Management System for Microgrids in Africa type: conference user_id: '20179' year: '2022' ... --- _id: '39377' author: - first_name: Christoph full_name: Marschalt, Christoph last_name: Marschalt - first_name: Dominik full_name: Schroder, Dominik last_name: Schroder - first_name: Sven full_name: Lange, Sven last_name: Lange - first_name: Ulrich full_name: Hilleringmann, Ulrich id: '20179' last_name: Hilleringmann - first_name: Christian full_name: Hedayat, Christian last_name: Hedayat - first_name: Harald full_name: Kuhn, Harald last_name: Kuhn - first_name: Denis full_name: Sievers, Denis last_name: Sievers - first_name: Jens full_name: Forstner, Jens last_name: Forstner citation: ama: 'Marschalt C, Schroder D, Lange S, et al. Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method. In: 2022 Smart Systems Integration (SSI). IEEE; 2022. doi:10.1109/ssi56489.2022.9901431' apa: Marschalt, C., Schroder, D., Lange, S., Hilleringmann, U., Hedayat, C., Kuhn, H., Sievers, D., & Forstner, J. (2022). Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method. 2022 Smart Systems Integration (SSI). https://doi.org/10.1109/ssi56489.2022.9901431 bibtex: '@inproceedings{Marschalt_Schroder_Lange_Hilleringmann_Hedayat_Kuhn_Sievers_Forstner_2022, title={Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method}, DOI={10.1109/ssi56489.2022.9901431}, booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Marschalt, Christoph and Schroder, Dominik and Lange, Sven and Hilleringmann, Ulrich and Hedayat, Christian and Kuhn, Harald and Sievers, Denis and Forstner, Jens}, year={2022} }' chicago: Marschalt, Christoph, Dominik Schroder, Sven Lange, Ulrich Hilleringmann, Christian Hedayat, Harald Kuhn, Denis Sievers, and Jens Forstner. “Far-Field Calculation from Magnetic Huygens Box Data Using the Boundary Element Method.” In 2022 Smart Systems Integration (SSI). IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901431. ieee: 'C. Marschalt et al., “Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method,” 2022, doi: 10.1109/ssi56489.2022.9901431.' mla: Marschalt, Christoph, et al. “Far-Field Calculation from Magnetic Huygens Box Data Using the Boundary Element Method.” 2022 Smart Systems Integration (SSI), IEEE, 2022, doi:10.1109/ssi56489.2022.9901431. short: 'C. Marschalt, D. Schroder, S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, D. Sievers, J. Forstner, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.' date_created: 2023-01-24T10:06:15Z date_updated: 2023-03-22T10:28:19Z department: - _id: '59' doi: 10.1109/ssi56489.2022.9901431 language: - iso: eng publication: 2022 Smart Systems Integration (SSI) publication_status: published publisher: IEEE status: public title: Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method type: conference user_id: '20179' year: '2022' ... --- _id: '39376' author: - first_name: Tom full_name: Sander, Tom last_name: Sander - first_name: Sven full_name: Lange, Sven last_name: Lange - first_name: Ulrich full_name: Hilleringmann, Ulrich id: '20179' last_name: Hilleringmann - first_name: Volker full_name: Geneis, Volker last_name: Geneis - first_name: Christian full_name: Hedayat, Christian last_name: Hedayat - first_name: Harald full_name: Kuhn, Harald last_name: Kuhn citation: ama: 'Sander T, Lange S, Hilleringmann U, Geneis V, Hedayat C, Kuhn H. Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods. In: 2022 Smart Systems Integration (SSI). IEEE; 2022. doi:10.1109/ssi56489.2022.9901433' apa: Sander, T., Lange, S., Hilleringmann, U., Geneis, V., Hedayat, C., & Kuhn, H. (2022). Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods. 2022 Smart Systems Integration (SSI). https://doi.org/10.1109/ssi56489.2022.9901433 bibtex: '@inproceedings{Sander_Lange_Hilleringmann_Geneis_Hedayat_Kuhn_2022, title={Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods}, DOI={10.1109/ssi56489.2022.9901433}, booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Sander, Tom and Lange, Sven and Hilleringmann, Ulrich and Geneis, Volker and Hedayat, Christian and Kuhn, Harald}, year={2022} }' chicago: Sander, Tom, Sven Lange, Ulrich Hilleringmann, Volker Geneis, Christian Hedayat, and Harald Kuhn. “Detection of Defects on Irregularly Structured Surfaces Using Supervised and Semi-Supervised Learning Methods.” In 2022 Smart Systems Integration (SSI). IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901433. ieee: 'T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, and H. Kuhn, “Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods,” 2022, doi: 10.1109/ssi56489.2022.9901433.' mla: Sander, Tom, et al. “Detection of Defects on Irregularly Structured Surfaces Using Supervised and Semi-Supervised Learning Methods.” 2022 Smart Systems Integration (SSI), IEEE, 2022, doi:10.1109/ssi56489.2022.9901433. short: 'T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.' date_created: 2023-01-24T10:05:48Z date_updated: 2023-03-22T10:28:37Z department: - _id: '59' doi: 10.1109/ssi56489.2022.9901433 language: - iso: eng publication: 2022 Smart Systems Integration (SSI) publication_status: published publisher: IEEE status: public title: Detection of Defects on Irregularly Structured Surfaces using Supervised and Semi-Supervised Learning Methods type: conference user_id: '20179' year: '2022' ... --- _id: '39372' author: - first_name: Sven full_name: Lange, Sven last_name: Lange - first_name: Christian full_name: Hedayat, Christian last_name: Hedayat - first_name: Harald full_name: Kuhn, Harald last_name: Kuhn - first_name: Ulrich full_name: Hilleringmann, Ulrich id: '20179' last_name: Hilleringmann citation: ama: 'Lange S, Hedayat C, Kuhn H, Hilleringmann U. Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. In: 2022 Smart Systems Integration (SSI). IEEE; 2022. doi:10.1109/ssi56489.2022.9901416' apa: Lange, S., Hedayat, C., Kuhn, H., & Hilleringmann, U. (2022). Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. 2022 Smart Systems Integration (SSI). https://doi.org/10.1109/ssi56489.2022.9901416 bibtex: '@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2022, title={Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings}, DOI={10.1109/ssi56489.2022.9901416}, booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange, Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2022} }' chicago: Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” In 2022 Smart Systems Integration (SSI). IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901416. ieee: 'S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings,” 2022, doi: 10.1109/ssi56489.2022.9901416.' mla: Lange, Sven, et al. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” 2022 Smart Systems Integration (SSI), IEEE, 2022, doi:10.1109/ssi56489.2022.9901416. short: 'S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.' date_created: 2023-01-24T10:02:44Z date_updated: 2023-03-22T10:27:01Z department: - _id: '59' doi: 10.1109/ssi56489.2022.9901416 language: - iso: eng publication: 2022 Smart Systems Integration (SSI) publication_status: published publisher: IEEE status: public title: Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings type: conference user_id: '20179' year: '2022' ... --- _id: '39373' author: - first_name: Sven full_name: Lange, Sven last_name: Lange - first_name: Christian full_name: Hedayat, Christian last_name: Hedayat - first_name: Harald full_name: Kuhn, Harald last_name: Kuhn - first_name: Ulrich full_name: Hilleringmann, Ulrich id: '20179' last_name: Hilleringmann citation: ama: 'Lange S, Hedayat C, Kuhn H, Hilleringmann U. Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. In: 2022 Smart Systems Integration (SSI). IEEE; 2022. doi:10.1109/ssi56489.2022.9901416' apa: Lange, S., Hedayat, C., Kuhn, H., & Hilleringmann, U. (2022). Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. 2022 Smart Systems Integration (SSI). https://doi.org/10.1109/ssi56489.2022.9901416 bibtex: '@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2022, title={Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings}, DOI={10.1109/ssi56489.2022.9901416}, booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange, Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2022} }' chicago: Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” In 2022 Smart Systems Integration (SSI). IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901416. ieee: 'S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings,” 2022, doi: 10.1109/ssi56489.2022.9901416.' mla: Lange, Sven, et al. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” 2022 Smart Systems Integration (SSI), IEEE, 2022, doi:10.1109/ssi56489.2022.9901416. short: 'S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.' date_created: 2023-01-24T10:03:39Z date_updated: 2023-03-23T13:26:35Z department: - _id: '59' doi: 10.1109/ssi56489.2022.9901416 language: - iso: eng publication: 2022 Smart Systems Integration (SSI) publication_status: published publisher: IEEE status: public title: Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings type: conference user_id: '20179' year: '2022' ... --- _id: '39375' author: - first_name: Sven full_name: Lange, Sven last_name: Lange - first_name: Christian full_name: Hedayat, Christian last_name: Hedayat - first_name: Harald full_name: Kuhn, Harald last_name: Kuhn - first_name: Ulrich full_name: Hilleringmann, Ulrich id: '20179' last_name: Hilleringmann citation: ama: 'Lange S, Hedayat C, Kuhn H, Hilleringmann U. Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. In: 2022 Smart Systems Integration (SSI). IEEE; 2022. doi:10.1109/ssi56489.2022.9901416' apa: Lange, S., Hedayat, C., Kuhn, H., & Hilleringmann, U. (2022). Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. 2022 Smart Systems Integration (SSI). https://doi.org/10.1109/ssi56489.2022.9901416 bibtex: '@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2022, title={Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings}, DOI={10.1109/ssi56489.2022.9901416}, booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange, Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2022} }' chicago: Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” In 2022 Smart Systems Integration (SSI). IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901416. ieee: 'S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings,” 2022, doi: 10.1109/ssi56489.2022.9901416.' mla: Lange, Sven, et al. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” 2022 Smart Systems Integration (SSI), IEEE, 2022, doi:10.1109/ssi56489.2022.9901416. short: 'S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.' date_created: 2023-01-24T10:05:18Z date_updated: 2023-03-23T13:27:07Z department: - _id: '59' doi: 10.1109/ssi56489.2022.9901416 language: - iso: eng publication: 2022 Smart Systems Integration (SSI) publication_status: published publisher: IEEE status: public title: Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings type: conference user_id: '20179' year: '2022' ... --- _id: '33509' abstract: - lang: eng text: In this publication a novel method for far-field prediction from magnetic Huygens box data based on the boundary element method (BEM) is presented. Two examples are considered for the validation of this method. The first example represents an electric dipole so that the obtained calculations can be compared to an analytical solution. As a second example, a printed circuit board is considered and the calculated far-field is compared to a fullwave simulation. In both cases, the calculations for different field integral equations are under comparison, and the results indicate that the presented method performs very well with a combined field integral equation, for the specified problem, when only magnetic Huygens box data is given. author: - first_name: Christoph full_name: Marschalt, Christoph last_name: Marschalt - first_name: Dominik full_name: Schroder, Dominik last_name: Schroder - first_name: Sven full_name: Lange, Sven id: '38240' last_name: Lange - first_name: Ulrich full_name: Hilleringmann, Ulrich id: '20179' last_name: Hilleringmann - first_name: Christian full_name: Hedayat, Christian last_name: Hedayat - first_name: Harald full_name: Kuhn, Harald last_name: Kuhn - first_name: Denis full_name: Sievers, Denis last_name: Sievers - first_name: Jens full_name: Förstner, Jens id: '158' last_name: Förstner orcid: 0000-0001-7059-9862 citation: ama: 'Marschalt C, Schroder D, Lange S, et al. Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method. In: 2022 Smart Systems Integration (SSI). IEEE; 2022. doi:10.1109/ssi56489.2022.9901431' apa: Marschalt, C., Schroder, D., Lange, S., Hilleringmann, U., Hedayat, C., Kuhn, H., Sievers, D., & Förstner, J. (2022). Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method. 2022 Smart Systems Integration (SSI). 2022 Smart Systems Integration (SSI), Grenoble, France. https://doi.org/10.1109/ssi56489.2022.9901431 bibtex: '@inproceedings{Marschalt_Schroder_Lange_Hilleringmann_Hedayat_Kuhn_Sievers_Förstner_2022, place={Grenoble, France}, title={Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method}, DOI={10.1109/ssi56489.2022.9901431}, booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Marschalt, Christoph and Schroder, Dominik and Lange, Sven and Hilleringmann, Ulrich and Hedayat, Christian and Kuhn, Harald and Sievers, Denis and Förstner, Jens}, year={2022} }' chicago: 'Marschalt, Christoph, Dominik Schroder, Sven Lange, Ulrich Hilleringmann, Christian Hedayat, Harald Kuhn, Denis Sievers, and Jens Förstner. “Far-Field Calculation from Magnetic Huygens Box Data Using the Boundary Element Method.” In 2022 Smart Systems Integration (SSI). Grenoble, France: IEEE, 2022. https://doi.org/10.1109/ssi56489.2022.9901431.' ieee: 'C. Marschalt et al., “Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method,” presented at the 2022 Smart Systems Integration (SSI), Grenoble, France, 2022, doi: 10.1109/ssi56489.2022.9901431.' mla: Marschalt, Christoph, et al. “Far-Field Calculation from Magnetic Huygens Box Data Using the Boundary Element Method.” 2022 Smart Systems Integration (SSI), IEEE, 2022, doi:10.1109/ssi56489.2022.9901431. short: 'C. Marschalt, D. Schroder, S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, D. Sievers, J. Förstner, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.' conference: end_date: 2022-04-28 location: Grenoble, France name: 2022 Smart Systems Integration (SSI) start_date: 2022-04-27 date_created: 2022-10-04T11:31:43Z date_updated: 2023-10-31T07:40:54Z department: - _id: '59' - _id: '61' - _id: '485' doi: 10.1109/ssi56489.2022.9901431 keyword: - Near-Field Scanning - Huygens Box - Boundary Element Method - Method of Moments - tet_topic_hf language: - iso: eng main_file_link: - url: https://ieeexplore.ieee.org/document/9901431 place: Grenoble, France project: - _id: '52' name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing' publication: 2022 Smart Systems Integration (SSI) publication_identifier: eisbn: - 978-1-6654-8849-5 publication_status: published publisher: IEEE status: public title: Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method type: conference user_id: '20179' year: '2022' ... --- _id: '22480' abstract: - lang: eng text: In this publication important aspects for the implementation of inductive locating are explained. The miniaturized sensor platform called Sens-o-Spheres is used as an application of this locating method. The sensor platform is applied in bioreactors in order to obtain the environmental parameters, which makes a localization by magnetic fields necessary. Since the properties of magnetic fields in the localization area are very different from the wave characteristics, the principle of inductive localization is investigated in this publication and explained by using electrical equivalent circuit diagrams. Thereby, inductive localization uses the coupling or the mutual inductivities between coils, which is noticeable by an induced voltage. Therefore some properties and procedures are explained to extract the location of Sens-o-Spheres or other industrial sensor platforms from the couplings of the coils. One method calculates the location from an adapted ratio calculation and the other method uses neural networks and stochastic filters to obtain the results. In the end, these results are evaluated and compared. author: - first_name: Sven full_name: Lange, Sven id: '38240' last_name: Lange - first_name: Dominik full_name: Schröder, Dominik last_name: Schröder - first_name: Christian full_name: Hedayat, Christian last_name: Hedayat - first_name: Harald full_name: Kuhn, Harald last_name: Kuhn - first_name: Ulrich full_name: Hilleringmann, Ulrich last_name: Hilleringmann citation: ama: 'Lange S, Schröder D, Hedayat C, Kuhn H, Hilleringmann U. Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses. In: 22nd IEEE International Conference on Industrial Technology (ICIT). Valencia, Spain : IEEE; 2021. doi:10.1109/icit46573.2021.9453609' apa: 'Lange, S., Schröder, D., Hedayat, C., Kuhn, H., & Hilleringmann, U. (2021). Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses. In 22nd IEEE International Conference on Industrial Technology (ICIT). Valencia, Spain : IEEE. https://doi.org/10.1109/icit46573.2021.9453609' bibtex: '@inproceedings{Lange_Schröder_Hedayat_Kuhn_Hilleringmann_2021, place={ Valencia, Spain }, title={Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses}, DOI={10.1109/icit46573.2021.9453609}, booktitle={22nd IEEE International Conference on Industrial Technology (ICIT)}, publisher={IEEE}, author={Lange, Sven and Schröder, Dominik and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2021} }' chicago: 'Lange, Sven, Dominik Schröder, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses.” In 22nd IEEE International Conference on Industrial Technology (ICIT). Valencia, Spain : IEEE, 2021. https://doi.org/10.1109/icit46573.2021.9453609.' ieee: S. Lange, D. Schröder, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses,” in 22nd IEEE International Conference on Industrial Technology (ICIT), Valencia, Spain , 2021. mla: Lange, Sven, et al. “Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses.” 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, 2021, doi:10.1109/icit46573.2021.9453609. short: 'S. Lange, D. Schröder, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, Valencia, Spain , 2021.' conference: end_date: 2021-03-12 location: 'Valencia, Spain ' name: 22nd IEEE International Conference on Industrial Technology (ICIT) start_date: 2021-03-10 date_created: 2021-06-20T23:25:54Z date_updated: 2022-01-06T06:55:33Z department: - _id: '59' - _id: '485' doi: 10.1109/icit46573.2021.9453609 keyword: - Location awareness - Coils - Couplings - Nonuniform electric fields - Magnetic separation - Neural networks - Training data language: - iso: eng main_file_link: - url: https://ieeexplore.ieee.org/document/9453609 place: ' Valencia, Spain ' project: - _id: '52' name: Computing Resources Provided by the Paderborn Center for Parallel Computing publication: 22nd IEEE International Conference on Industrial Technology (ICIT) publication_identifier: isbn: - '9781728157306' publication_status: published publisher: IEEE status: public title: Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses type: conference user_id: '38240' year: '2021' ... --- _id: '22481' abstract: - lang: eng text: During the industrial processing of materials for the manufacture of new products, surface defects can quickly occur. In order to achieve high quality without a long time delay, it makes sense to inspect the work pieces so that defective work pieces can be sorted out right at the beginning of the process. At the same time, the evaluation unit should come close the perception of the human eye regarding detection of defects in surfaces. Such defects often manifest themselves by a deviation of the existing structure. The only restriction should be that only matt surfaces should be considered here. Therefore in this work, different classification and image processing algorithms are applied to surface data to identify possible surface damages. For this purpose, the Gabor filter and the FST (Fused Structure and Texture) features generated with it, as well as the salience metric are used on the image processing side. On the classification side, however, deep neural networks, Convolutional Neural Networks (CNN), and autoencoders are used to make a decision. A distinction is also made between training using class labels and without. It turns out later that the salience metric are best performed by CNN. On the other hand, if there is no labeled training data available, a novelty classification can easily be achieved by using autoencoders as well as the salience metric and some filters. author: - first_name: Tom full_name: Sander, Tom last_name: Sander - first_name: Sven full_name: Lange, Sven id: '38240' last_name: Lange - first_name: Ulrich full_name: Hilleringmann, Ulrich last_name: Hilleringmann - first_name: Volker full_name: Geneis, Volker last_name: Geneis - first_name: Christian full_name: Hedayat, Christian last_name: Hedayat - first_name: Harald full_name: Kuhn, Harald last_name: Kuhn - first_name: Franz-Barthold full_name: Gockel, Franz-Barthold last_name: Gockel citation: ama: 'Sander T, Lange S, Hilleringmann U, et al. Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction. In: 22nd IEEE International Conference on Industrial Technology (ICIT). Valencia, Spain : IEEE; 2021. doi:10.1109/icit46573.2021.9453646' apa: 'Sander, T., Lange, S., Hilleringmann, U., Geneis, V., Hedayat, C., Kuhn, H., & Gockel, F.-B. (2021). Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction. In 22nd IEEE International Conference on Industrial Technology (ICIT). Valencia, Spain : IEEE. https://doi.org/10.1109/icit46573.2021.9453646' bibtex: '@inproceedings{Sander_Lange_Hilleringmann_Geneis_Hedayat_Kuhn_Gockel_2021, place={Valencia, Spain }, title={Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction}, DOI={10.1109/icit46573.2021.9453646}, booktitle={22nd IEEE International Conference on Industrial Technology (ICIT)}, publisher={IEEE}, author={Sander, Tom and Lange, Sven and Hilleringmann, Ulrich and Geneis, Volker and Hedayat, Christian and Kuhn, Harald and Gockel, Franz-Barthold}, year={2021} }' chicago: 'Sander, Tom, Sven Lange, Ulrich Hilleringmann, Volker Geneis, Christian Hedayat, Harald Kuhn, and Franz-Barthold Gockel. “Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction.” In 22nd IEEE International Conference on Industrial Technology (ICIT). Valencia, Spain : IEEE, 2021. https://doi.org/10.1109/icit46573.2021.9453646.' ieee: T. Sander et al., “Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction,” in 22nd IEEE International Conference on Industrial Technology (ICIT), Valencia, Spain , 2021. mla: Sander, Tom, et al. “Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction.” 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, 2021, doi:10.1109/icit46573.2021.9453646. short: 'T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, F.-B. Gockel, in: 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, Valencia, Spain , 2021.' conference: end_date: 2021-03-12 location: 'Valencia, Spain ' name: 22nd IEEE International Conference on Industrial Technology (ICIT) start_date: 2021-03-10 date_created: 2021-06-20T23:32:11Z date_updated: 2022-01-06T06:55:33Z department: - _id: '59' - _id: '485' doi: 10.1109/icit46573.2021.9453646 keyword: - Image Processing - Defect Detection - wooden surfaces - Machine Learning - Neural Networks language: - iso: eng main_file_link: - url: https://ieeexplore.ieee.org/document/9453646 place: 'Valencia, Spain ' publication: 22nd IEEE International Conference on Industrial Technology (ICIT) publication_identifier: isbn: - '9781728157306' publication_status: published publisher: IEEE status: public title: Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction type: conference user_id: '38240' year: '2021' ... --- _id: '22532' abstract: - lang: eng text: In this publication, further elements of the newly developed inductive localization in the near field are presented. The advantage of inductive localization is the usage of the magnetic fields, which have a very low influence of non-metallic materials in the environment and thus follows good applications in the area of medicine and biochemistry. This allows a precise localization of sensor platforms in inhomogeneous mixtures of materials, where classical methods have major problems with inhomogeneous dielectric conductivity or density. The calculation of the localization of the searched object differs from other methods such as ultrasound or electromagnetic waves due to the source-free propagation of the magnetic field. Therefore, new mathematical evaluation methods and systematic adaptations are necessary, which are presented in this paper in circuit analysis. For this purpose, the exact circuit influences of one coil and the influence of another coil are investigated and which resonance circuit should be selected for both coils for a inductive localization with optimized signal strength. author: - first_name: Sven full_name: Lange, Sven id: '38240' last_name: Lange - first_name: Christian full_name: Hedayat, Christian last_name: Hedayat - first_name: Harald full_name: Kuhn, Harald last_name: Kuhn - first_name: Ulrich full_name: Hilleringmann, Ulrich last_name: Hilleringmann citation: ama: 'Lange S, Hedayat C, Kuhn H, Hilleringmann U. Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field. In: 2021 Smart Systems Integration (SSI). Grenoble, France: IEEE; 2021. doi:10.1109/ssi52265.2021.9466958' apa: 'Lange, S., Hedayat, C., Kuhn, H., & Hilleringmann, U. (2021). Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field. In 2021 Smart Systems Integration (SSI). Grenoble, France: IEEE. https://doi.org/10.1109/ssi52265.2021.9466958' bibtex: '@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2021, place={Grenoble, France}, title={Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field}, DOI={10.1109/ssi52265.2021.9466958}, booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange, Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2021} }' chicago: 'Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field.” In 2021 Smart Systems Integration (SSI). Grenoble, France: IEEE, 2021. https://doi.org/10.1109/ssi52265.2021.9466958.' ieee: S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field,” in 2021 Smart Systems Integration (SSI), Grenoble, France , 2021. mla: Lange, Sven, et al. “Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field.” 2021 Smart Systems Integration (SSI), IEEE, 2021, doi:10.1109/ssi52265.2021.9466958. short: 'S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2021.' conference: end_date: 2021-04-29 location: 'Grenoble, France ' name: 2021 Smart Systems Integration (SSI) start_date: 2021-04-27 date_created: 2021-07-05T19:31:52Z date_updated: 2022-01-06T06:55:36Z department: - _id: '59' - _id: '485' doi: 10.1109/ssi52265.2021.9466958 keyword: - Electrotechnical Characteristics of Real Coils - Inductive Localization - Resonant Circuit - Mutual Inductance - Near-Field language: - iso: eng main_file_link: - url: https://ieeexplore.ieee.org/document/9466958 place: Grenoble, France publication: 2021 Smart Systems Integration (SSI) publication_identifier: isbn: - '9781665440929' publication_status: published publisher: IEEE status: public title: Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field type: conference user_id: '38240' year: '2021' ... --- _id: '24538' author: - first_name: Ulrich full_name: Hilleringmann, Ulrich last_name: Hilleringmann - first_name: Dmitry full_name: Petrov, Dmitry last_name: Petrov - first_name: Ibrahim full_name: Mwammenywa, Ibrahim last_name: Mwammenywa - first_name: Geoffrey M. full_name: Kagarura, Geoffrey M. last_name: Kagarura citation: ama: 'Hilleringmann U, Petrov D, Mwammenywa I, Kagarura GM. Local Power Control using Wireless Sensor System for Microgrids in Africa. In: IEEE; 2021.' apa: Hilleringmann, U., Petrov, D., Mwammenywa, I., & Kagarura, G. M. (2021). Local Power Control using Wireless Sensor System for Microgrids in Africa. IEEE Africon 2021, Arusha, Tansania. bibtex: '@inproceedings{Hilleringmann_Petrov_Mwammenywa_Kagarura_2021, place={Arusha, Tansania}, title={Local Power Control using Wireless Sensor System for Microgrids in Africa}, publisher={IEEE}, author={Hilleringmann, Ulrich and Petrov, Dmitry and Mwammenywa, Ibrahim and Kagarura, Geoffrey M.}, year={2021} }' chicago: 'Hilleringmann, Ulrich, Dmitry Petrov, Ibrahim Mwammenywa, and Geoffrey M. Kagarura. “Local Power Control Using Wireless Sensor System for Microgrids in Africa.” Arusha, Tansania: IEEE, 2021.' ieee: U. Hilleringmann, D. Petrov, I. Mwammenywa, and G. M. Kagarura, “Local Power Control using Wireless Sensor System for Microgrids in Africa,” presented at the IEEE Africon 2021, Arusha, Tansania, 2021. mla: Hilleringmann, Ulrich, et al. Local Power Control Using Wireless Sensor System for Microgrids in Africa. IEEE, 2021. short: 'U. Hilleringmann, D. Petrov, I. Mwammenywa, G.M. Kagarura, in: IEEE, Arusha, Tansania, 2021.' conference: end_date: 2021-09-15 location: Arusha, Tansania name: IEEE Africon 2021 start_date: 2021-09-13 date_created: 2021-09-16T05:47:21Z date_updated: 2023-02-09T07:16:08Z department: - _id: '59' keyword: - Art-D - Afrika language: - iso: eng place: Arusha, Tansania publisher: IEEE status: public title: Local Power Control using Wireless Sensor System for Microgrids in Africa type: conference user_id: '16148' year: '2021' ... --- _id: '39401' author: - first_name: Sven full_name: Lange, Sven last_name: Lange - first_name: Christian full_name: Hedayat, Christian last_name: Hedayat - first_name: Harald full_name: Kuhn, Harald last_name: Kuhn - first_name: Ulrich full_name: Hilleringmann, Ulrich id: '20179' last_name: Hilleringmann citation: ama: 'Lange S, Hedayat C, Kuhn H, Hilleringmann U. Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field. In: 2021 Smart Systems Integration (SSI). IEEE; 2021. doi:10.1109/ssi52265.2021.9466958' apa: Lange, S., Hedayat, C., Kuhn, H., & Hilleringmann, U. (2021). Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field. 2021 Smart Systems Integration (SSI). https://doi.org/10.1109/ssi52265.2021.9466958 bibtex: '@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2021, title={Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field}, DOI={10.1109/ssi52265.2021.9466958}, booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange, Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2021} }' chicago: Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field.” In 2021 Smart Systems Integration (SSI). IEEE, 2021. https://doi.org/10.1109/ssi52265.2021.9466958. ieee: 'S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field,” 2021, doi: 10.1109/ssi52265.2021.9466958.' mla: Lange, Sven, et al. “Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field.” 2021 Smart Systems Integration (SSI), IEEE, 2021, doi:10.1109/ssi52265.2021.9466958. short: 'S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.' date_created: 2023-01-24T10:18:52Z date_updated: 2023-03-21T10:00:40Z department: - _id: '59' doi: 10.1109/ssi52265.2021.9466958 language: - iso: eng publication: 2021 Smart Systems Integration (SSI) publication_status: published publisher: IEEE status: public title: Adaptation and Optimization of Planar Coils for a More Accurate and Far-Reaching Magnetic Field-Based Localization in the Near Field type: conference user_id: '20179' year: '2021' ... --- _id: '39927' author: - first_name: Dmitry full_name: Petrov, Dmitry last_name: Petrov - first_name: Konstantin full_name: Kroschewski, Konstantin last_name: Kroschewski - first_name: Ibrahim full_name: Mwammenywa, Ibrahim last_name: Mwammenywa - first_name: G. Mark full_name: Kagarura, G. Mark last_name: Kagarura - first_name: Ulrich full_name: Hilleringmann, Ulrich id: '20179' last_name: Hilleringmann citation: ama: 'Petrov D, Kroschewski K, Mwammenywa I, Kagarura GM, Hilleringmann U. Low-Cost NB-IoT Microgrid Power Quality Monitoring System. In: 2021 IEEE Sensors. IEEE; 2021. doi:10.1109/sensors47087.2021.9639641' apa: Petrov, D., Kroschewski, K., Mwammenywa, I., Kagarura, G. M., & Hilleringmann, U. (2021). Low-Cost NB-IoT Microgrid Power Quality Monitoring System. 2021 IEEE Sensors. https://doi.org/10.1109/sensors47087.2021.9639641 bibtex: '@inproceedings{Petrov_Kroschewski_Mwammenywa_Kagarura_Hilleringmann_2021, title={Low-Cost NB-IoT Microgrid Power Quality Monitoring System}, DOI={10.1109/sensors47087.2021.9639641}, booktitle={2021 IEEE Sensors}, publisher={IEEE}, author={Petrov, Dmitry and Kroschewski, Konstantin and Mwammenywa, Ibrahim and Kagarura, G. Mark and Hilleringmann, Ulrich}, year={2021} }' chicago: Petrov, Dmitry, Konstantin Kroschewski, Ibrahim Mwammenywa, G. Mark Kagarura, and Ulrich Hilleringmann. “Low-Cost NB-IoT Microgrid Power Quality Monitoring System.” In 2021 IEEE Sensors. IEEE, 2021. https://doi.org/10.1109/sensors47087.2021.9639641. ieee: 'D. Petrov, K. Kroschewski, I. Mwammenywa, G. M. Kagarura, and U. Hilleringmann, “Low-Cost NB-IoT Microgrid Power Quality Monitoring System,” 2021, doi: 10.1109/sensors47087.2021.9639641.' mla: Petrov, Dmitry, et al. “Low-Cost NB-IoT Microgrid Power Quality Monitoring System.” 2021 IEEE Sensors, IEEE, 2021, doi:10.1109/sensors47087.2021.9639641. short: 'D. Petrov, K. Kroschewski, I. Mwammenywa, G.M. Kagarura, U. Hilleringmann, in: 2021 IEEE Sensors, IEEE, 2021.' date_created: 2023-01-25T09:34:58Z date_updated: 2023-03-21T10:12:03Z department: - _id: '59' doi: 10.1109/sensors47087.2021.9639641 language: - iso: eng publication: 2021 IEEE Sensors publication_status: published publisher: IEEE status: public title: Low-Cost NB-IoT Microgrid Power Quality Monitoring System type: conference user_id: '20179' year: '2021' ... --- _id: '39397' author: - first_name: Dmitry full_name: Petrov, Dmitry last_name: Petrov - first_name: Konstantin full_name: Kroschewski, Konstantin last_name: Kroschewski - first_name: Ulrich full_name: Hilleringmann, Ulrich id: '20179' last_name: Hilleringmann citation: ama: 'Petrov D, Kroschewski K, Hilleringmann U. Microcontroller Firmware Design for Industrial Wireless Sensors. In: 2021 Smart Systems Integration (SSI). IEEE; 2021. doi:10.1109/ssi52265.2021.9467010' apa: Petrov, D., Kroschewski, K., & Hilleringmann, U. (2021). Microcontroller Firmware Design for Industrial Wireless Sensors. 2021 Smart Systems Integration (SSI). https://doi.org/10.1109/ssi52265.2021.9467010 bibtex: '@inproceedings{Petrov_Kroschewski_Hilleringmann_2021, title={Microcontroller Firmware Design for Industrial Wireless Sensors}, DOI={10.1109/ssi52265.2021.9467010}, booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Petrov, Dmitry and Kroschewski, Konstantin and Hilleringmann, Ulrich}, year={2021} }' chicago: Petrov, Dmitry, Konstantin Kroschewski, and Ulrich Hilleringmann. “Microcontroller Firmware Design for Industrial Wireless Sensors.” In 2021 Smart Systems Integration (SSI). IEEE, 2021. https://doi.org/10.1109/ssi52265.2021.9467010. ieee: 'D. Petrov, K. Kroschewski, and U. Hilleringmann, “Microcontroller Firmware Design for Industrial Wireless Sensors,” 2021, doi: 10.1109/ssi52265.2021.9467010.' mla: Petrov, Dmitry, et al. “Microcontroller Firmware Design for Industrial Wireless Sensors.” 2021 Smart Systems Integration (SSI), IEEE, 2021, doi:10.1109/ssi52265.2021.9467010. short: 'D. Petrov, K. Kroschewski, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.' date_created: 2023-01-24T10:14:17Z date_updated: 2023-03-21T10:08:46Z department: - _id: '59' doi: 10.1109/ssi52265.2021.9467010 language: - iso: eng publication: 2021 Smart Systems Integration (SSI) publication_status: published publisher: IEEE status: public title: Microcontroller Firmware Design for Industrial Wireless Sensors type: conference user_id: '20179' year: '2021' ... --- _id: '39384' author: - first_name: Julia full_name: Reker, Julia last_name: Reker - first_name: Thorsten full_name: Meyers, Thorsten last_name: Meyers - first_name: Fabio F. full_name: Vidor, Fabio F. last_name: Vidor - first_name: Trudi-Heleen full_name: Joubert, Trudi-Heleen last_name: Joubert - first_name: Ulrich full_name: Hilleringmann, Ulrich id: '20179' last_name: Hilleringmann citation: ama: 'Reker J, Meyers T, Vidor FF, Joubert T-H, Hilleringmann U. Influence of electrode metallization on thin-film transistor performance. In: 2021 IEEE AFRICON. IEEE; 2021. doi:10.1109/africon51333.2021.9570953' apa: Reker, J., Meyers, T., Vidor, F. F., Joubert, T.-H., & Hilleringmann, U. (2021). Influence of electrode metallization on thin-film transistor performance. 2021 IEEE AFRICON. https://doi.org/10.1109/africon51333.2021.9570953 bibtex: '@inproceedings{Reker_Meyers_Vidor_Joubert_Hilleringmann_2021, title={Influence of electrode metallization on thin-film transistor performance}, DOI={10.1109/africon51333.2021.9570953}, booktitle={2021 IEEE AFRICON}, publisher={IEEE}, author={Reker, Julia and Meyers, Thorsten and Vidor, Fabio F. and Joubert, Trudi-Heleen and Hilleringmann, Ulrich}, year={2021} }' chicago: Reker, Julia, Thorsten Meyers, Fabio F. Vidor, Trudi-Heleen Joubert, and Ulrich Hilleringmann. “Influence of Electrode Metallization on Thin-Film Transistor Performance.” In 2021 IEEE AFRICON. IEEE, 2021. https://doi.org/10.1109/africon51333.2021.9570953. ieee: 'J. Reker, T. Meyers, F. F. Vidor, T.-H. Joubert, and U. Hilleringmann, “Influence of electrode metallization on thin-film transistor performance,” 2021, doi: 10.1109/africon51333.2021.9570953.' mla: Reker, Julia, et al. “Influence of Electrode Metallization on Thin-Film Transistor Performance.” 2021 IEEE AFRICON, IEEE, 2021, doi:10.1109/africon51333.2021.9570953. short: 'J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 IEEE AFRICON, IEEE, 2021.' date_created: 2023-01-24T10:08:41Z date_updated: 2023-03-22T10:23:56Z department: - _id: '59' doi: 10.1109/africon51333.2021.9570953 language: - iso: eng publication: 2021 IEEE AFRICON publication_status: published publisher: IEEE status: public title: Influence of electrode metallization on thin-film transistor performance type: conference user_id: '20179' year: '2021' ...