@article{9996, author = {{Ju, Xiaozhe and Mahnken, Rolf}}, issn = {{1617-7061}}, journal = {{PAMM}}, title = {{{"Goal-oriented adaptivity for parameter identification in linear micromorphic elasticity"}}}, doi = {{10.1002/pamm.201800098}}, year = {{2018}}, } @inproceedings{9997, abstract = {{Ultrasonic wire bonding is used to connect the electrical terminals of semiconductor modules in power electronics. Mul- tiple influencing factors in wedge/wedge bonding are known and extensively investigated. A constructively settable but rarely examined parameter is the bonding frequency. In case of bonding on challenging substrates, e.g. supple substruc- tures, a high influence of the working frequency is observed. The choice of the working frequency is typically based on experimental investigations for a certain component or substrate and needs to be evaluated anew for new applications. A profound understanding of the influence of the working frequency is required to achieve a reliable bond process and a short process development. Here a generalized model for the numerical simulation of the bond formation with respect to the dynamics of the substructure is presented. The simulation results are compared to experiments using 300 µm copper wire at different working frequencies and geometries of the substructure.}}, author = {{Schemmel, Reinhard and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}}, booktitle = {{CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)}}, pages = {{230--235}}, title = {{{Effects of different working frequencies on the joint formation in copper wire bonding}}}, year = {{2018}}, } @inproceedings{9998, abstract = {{Ultrasonic wedge/wedge-wire bonding is used to connect electrical terminals of semiconductor modules in power electronics. The wire is clamped with a tool by a normal force and ultrasonic vibration is transmitted through the wire into the interface between wire and substrate. Due to frictional processes contaminations like oxide layers are removed from the contact zone and the surface roughness is reduced, thus the real contact area is increased. In the next step of bond formation, thermomechanical forces create micro-junctions between the wire and substrate and the bond strength increases. The bond parameters like the bond normal force, the ultrasonic vibration amplitude and the geometry of the clamping tool show a high influence on the strength and reliability of the wire bond and need to be investigated in detail. Therefore, in this contribution the dynamical behaviour of the ultrasonic system, the wire and the substrate are modeled in form of substructures, which are connected by the friction contacts between tool and wire and between wire and substrate. Approaches for modelling the time variant contact behaviour, the substrate dynamics, and the model order reduction for a time efficient simulation are described to simulate the full bonding process.}}, author = {{Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}}, booktitle = {{6th European Conference on Computational Mechanics (ECCM 6)}}, pages = {{1--12}}, title = {{{Numerical and experimental investigations in ultrasonic heavy wire bonding}}}, year = {{2018}}, } @inproceedings{9999, abstract = {{Ultrasonic wire bonding is an indispensable process in the industrial manufacturing of semiconductor devices. Copper wire is increasingly replacing the well-established aluminium wire because of its superior electrical, thermal and mechanical properties. Copper wire processes differ significantly from aluminium processes and are more sensitive to disturbances, which reduces the range of parameter values suitable for a stable process. Disturbances can be compensated by an adaption of process parameters, but finding suitable parameters manually is difficult and time-consuming. This paper presents a physical model of the ultrasonic wire bonding process including the friction contact between tool and wire. This model yields novel insights into the process. A prototype of a multi-objective optimizing bonding machine (MOBM) is presented. It uses multi-objective optimization, based on the complete process model, to automatically select the best operating point as a compromise of concurrent objectives.}}, author = {{Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter}}, booktitle = {{In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018}}, keywords = {{wire bonding, multi-objective optimization, process model, copper wire, self-optimization}}, title = {{{Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges}}}, doi = {{10.4071/2380-4505-2018.1.000572}}, volume = {{Vol. 2018, No. 1, pp. 000572-000577.}}, year = {{2018}}, } @misc{6594, author = {{Claes, Leander and Zeipert, Henning and Koppa, Peter and Tröster, Thomas and Henning, Bernd}}, title = {{{Additiv gefertigte, akustische Diffusor-Strukturen für Ultraschallanwendungen}}}, year = {{2018}}, } @article{15876, author = {{Camberg, Alan Adam and Engelkemeier, Katja and Dietrich, Jan and Heggemann, Thomas}}, issn = {{2510-2877}}, journal = {{Lightweight Design worldwide}}, number = {{2}}, pages = {{24--29}}, publisher = {{Springer Vieweg}}, title = {{{Top-down design of tailored fiber-metal laminates}}}, doi = {{10.1007/s41777-018-0004-1}}, volume = {{11}}, year = {{2018}}, } @inproceedings{15129, author = {{Bolenz, Lukas and Toye, Dominique and Kenig, Eugeny}}, location = {{Köln}}, title = {{{Tomographische Untersuchungen der Fluiddynamik viskoser Systeme in Packungskolonnen}}}, year = {{2018}}, } @article{15977, author = {{Tasdemirci, Alper and Akbulut Irmak, Emine Fulya and Guzel, Erkan and Tuzgel, Firat and Yucesoy, Atacan and Sahin, Selim and Guden, Mustafa}}, issn = {{0263-8231}}, journal = {{Thin-Walled Structures}}, pages = {{547--555}}, title = {{{Crushing behavior and energy absorption performance of a bio-inspired metallic structure: Experimental and numerical study}}}, doi = {{10.1016/j.tws.2018.07.051}}, year = {{2018}}, } @inproceedings{16034, author = {{Camberg, Alan Adam and Tröster, Thomas}}, booktitle = {{HYBRID - MATERIALS AND STRUCTURES 2018 - PROCEEDINGS}}, isbn = {{978-3-88355-417-4}}, location = {{Bremen}}, publisher = {{DGM - Deutsche Gesellschaft für Materialkunde e.V.}}, title = {{{Optimization-based material design of tailored stacked hybrids for further improvement in lightweight car body structures}}}, year = {{2018}}, } @inproceedings{16039, author = {{Ahlers, Dominik and Tröster, Thomas}}, location = {{Erfurt}}, title = {{{Entwicklung einer Prozessroute für die Luftfahrtindustrie mit erhöhter Aufbaurate im Laserstrahlschmelzprozess von Ti6Al4V}}}, year = {{2018}}, } @inproceedings{16040, author = {{Wang, Z. and Tröster, Thomas}}, location = {{Bologna, Italy}}, title = {{{Influences of interface on the adhesion and corrosion properties of steel-CFRP hybrid structures manufactured by vacuum assisted resin transfer moulding}}}, year = {{2018}}, } @inproceedings{16042, author = {{Triebus, Marcel and Tröster, Thomas and Camberg, Alan Adam and Bienia, S. and Dröder, K.}}, booktitle = {{15. Deutsches LS-Dyna Forum}}, location = {{Bamberg}}, title = {{{Modelling the Interface of Hybrid Metal-FRP Components Joint by Form Closures}}}, year = {{2018}}, } @inproceedings{16043, author = {{Camberg, Alan Adam and Tröster, Thomas and Schneidt , A. and Sotirov , N. and Tölle, J.}}, booktitle = {{15. Deutsches LS-Dyna Forum}}, location = {{Bamberg}}, title = {{{The influence of damage accumulation on failure prediction: a comparative assessment of *MAT_224 and *MAT_024 + GISSMO for the application in non-isothermal sheet metal forming}}}, year = {{2018}}, } @article{16045, author = {{Camberg, Alan Adam}}, issn = {{2366-8024}}, journal = {{Carbon Composites Magazin}}, number = {{2}}, pages = {{15--16}}, title = {{{Top-down-Entwicklung von Faser-Metall-Laminaten auf Grundlage von Gesamtfahrzeugsimulationen}}}, year = {{2018}}, } @inproceedings{16056, author = {{Schweizer, Swetlana and Tröster, Thomas}}, location = {{Siegen}}, title = {{{Holz als Werkstoff im Automobil}}}, year = {{2018}}, } @inproceedings{16057, author = {{Wang, Z. and Tröster, Thomas}}, location = {{Siegen}}, title = {{{Herstellung hybrider Strukturkomponenten in einem modifizierten VARTM-Prozess}}}, year = {{2018}}, } @article{13160, author = {{Thol, Monika and Dubberke, Frithjof H. and Baumhögger, Elmar and Span, Roland and Vrabec, Jadran}}, issn = {{0021-9568}}, journal = {{Journal of Chemical & Engineering Data}}, pages = {{2533--2547}}, title = {{{Speed of Sound Measurements and a Fundamental Equation of State for Hydrogen Chloride}}}, doi = {{10.1021/acs.jced.7b01031}}, year = {{2018}}, } @article{13163, author = {{Thol, Monika and Dubberke, Frithjof H. and Baumhögger, Elmar and Span, Roland and Vrabec, Jadran}}, issn = {{0021-9568}}, journal = {{Journal of Chemical & Engineering Data}}, pages = {{2533--2547}}, title = {{{Speed of Sound Measurements and a Fundamental Equation of State for Hydrogen Chloride}}}, doi = {{10.1021/acs.jced.7b01031}}, year = {{2018}}, } @article{13439, author = {{Camberg, Alan Adam and Bohner, F and Tölle, J and Schneidt, A and Meiners, S and Tröster, Thomas}}, issn = {{1757-899X}}, journal = {{IOP Conference Series: Materials Science and Engineering}}, title = {{{Formability enhancement of EN AW-5182 H18 aluminum alloy sheet metal parts in a flash forming process: testing, calibration and evaluation of fracture models}}}, doi = {{10.1088/1757-899x/418/1/012018}}, year = {{2018}}, } @article{10005, author = {{Ju, X. and Mahnken, R.}}, issn = {{0029-5981}}, journal = {{International Journal for Numerical Methods in Engineering}}, pages = {{472--473}}, title = {{{Goal-oriented adaptivity for linear elastic micromorphic continua based on primal and adjoint consistency analysis}}}, doi = {{10.1002/nme.5996}}, year = {{2018}}, }