[{"publication_status":"published","date_updated":"2019-05-27T10:50:49Z","status":"public","year":"2018","title":"\"Goal-oriented adaptivity for parameter identification in linear micromorphic elasticity\"","author":[{"first_name":"Xiaozhe","last_name":"Ju","full_name":"Ju, Xiaozhe"},{"last_name":"Mahnken","first_name":"Rolf","full_name":"Mahnken, Rolf"}],"publication_identifier":{"issn":["1617-7061"]},"user_id":"78813","doi":"10.1002/pamm.201800098","article_number":"e201800098","language":[{"iso":"eng"}],"_id":"9996","publication":"PAMM","citation":{"bibtex":"@article{Ju_Mahnken_2018, title={“Goal-oriented adaptivity for parameter identification in linear micromorphic elasticity”}, DOI={<a href=\"https://doi.org/10.1002/pamm.201800098\">10.1002/pamm.201800098</a>}, number={e201800098}, journal={PAMM}, author={Ju, Xiaozhe and Mahnken, Rolf}, year={2018} }","ama":"Ju X, Mahnken R. “Goal-oriented adaptivity for parameter identification in linear micromorphic elasticity.” <i>PAMM</i>. 2018. doi:<a href=\"https://doi.org/10.1002/pamm.201800098\">10.1002/pamm.201800098</a>","mla":"Ju, Xiaozhe, and Rolf Mahnken. “‘Goal-Oriented Adaptivity for Parameter Identification in Linear Micromorphic Elasticity.’” <i>PAMM</i>, e201800098, 2018, doi:<a href=\"https://doi.org/10.1002/pamm.201800098\">10.1002/pamm.201800098</a>.","short":"X. Ju, R. Mahnken, PAMM (2018).","chicago":"Ju, Xiaozhe, and Rolf Mahnken. “‘Goal-Oriented Adaptivity for Parameter Identification in Linear Micromorphic Elasticity.’” <i>PAMM</i>, 2018. <a href=\"https://doi.org/10.1002/pamm.201800098\">https://doi.org/10.1002/pamm.201800098</a>.","ieee":"X. Ju and R. Mahnken, “‘Goal-oriented adaptivity for parameter identification in linear micromorphic elasticity,’” <i>PAMM</i>, 2018.","apa":"Ju, X., &#38; Mahnken, R. (2018). “Goal-oriented adaptivity for parameter identification in linear micromorphic elasticity.” <i>PAMM</i>. <a href=\"https://doi.org/10.1002/pamm.201800098\">https://doi.org/10.1002/pamm.201800098</a>"},"type":"journal_article","department":[{"_id":"154"}],"date_created":"2019-05-27T10:23:38Z"},{"date_updated":"2020-05-07T05:33:56Z","year":"2018","title":"Effects of different working frequencies on the joint formation in copper wire bonding","status":"public","author":[{"id":"28647","last_name":"Schemmel","first_name":"Reinhard","full_name":"Schemmel, Reinhard"},{"last_name":"Althoff","first_name":"Simon","full_name":"Althoff, Simon"},{"id":"21220","first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter"},{"first_name":"Andreas","last_name":"Unger","full_name":"Unger, Andreas"},{"full_name":"Brökelmann, Michael","first_name":"Michael","last_name":"Brökelmann"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"}],"user_id":"210","page":"230-235","_id":"9997","language":[{"iso":"eng"}],"abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is used to connect the electrical terminals of semiconductor modules in power electronics. Mul- tiple influencing factors in wedge/wedge bonding are known and extensively investigated. A constructively settable but rarely examined parameter is the bonding frequency. In case of bonding on challenging substrates, e.g. supple substruc- tures, a high influence of the working frequency is observed. The choice of the working frequency is typically based on experimental investigations for a certain component or substrate and needs to be evaluated anew for new applications. A profound understanding of the influence of the working frequency is required to achieve a reliable bond process and a short process development. Here a generalized model for the numerical simulation of the bond formation with respect to the dynamics of the substructure is presented. The simulation results are compared to experiments using 300 µm copper wire at different working frequencies and geometries of the substructure."}],"quality_controlled":"1","project":[{"grant_number":"MP-1-1-015","_id":"93","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen"}],"publication":"CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)","citation":{"bibtex":"@inproceedings{Schemmel_Althoff_Sextro_Unger_Brökelmann_Hunstig_2018, place={Stuttgart, Germany}, title={Effects of different working frequencies on the joint formation in copper wire bonding}, booktitle={CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)}, author={Schemmel, Reinhard and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={230–235} }","chicago":"Schemmel, Reinhard, Simon Althoff, Walter Sextro, Andreas Unger, Michael Brökelmann, and Matthias Hunstig. “Effects of Different Working Frequencies on the Joint Formation in Copper Wire Bonding.” In <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 230–35. Stuttgart, Germany, 2018.","ama":"Schemmel R, Althoff S, Sextro W, Unger A, Brökelmann M, Hunstig M. Effects of different working frequencies on the joint formation in copper wire bonding. In: <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>. Stuttgart, Germany; 2018:230-235.","short":"R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, in: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.","ieee":"R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig, “Effects of different working frequencies on the joint formation in copper wire bonding,” in <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 2018, pp. 230–235.","apa":"Schemmel, R., Althoff, S., Sextro, W., Unger, A., Brökelmann, M., &#38; Hunstig, M. (2018). Effects of different working frequencies on the joint formation in copper wire bonding. In <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i> (pp. 230–235). Stuttgart, Germany.","mla":"Schemmel, Reinhard, et al. “Effects of Different Working Frequencies on the Joint Formation in Copper Wire Bonding.” <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 2018, pp. 230–35."},"type":"conference","department":[{"_id":"151"}],"place":"Stuttgart, Germany","date_created":"2019-05-27T10:24:37Z"},{"department":[{"_id":"151"}],"type":"conference","place":"Glasgow, UK","date_created":"2019-05-27T10:24:38Z","abstract":[{"lang":"eng","text":"Ultrasonic wedge/wedge-wire bonding is used to connect electrical terminals of semiconductor modules in power electronics. The wire is clamped with a tool by a normal force and ultrasonic vibration is transmitted through the wire into the interface between wire and substrate. Due to frictional processes contaminations like oxide layers are removed from the contact zone and the surface roughness is reduced, thus the real contact area is increased. In the next step of bond formation, thermomechanical forces create micro-junctions between the wire and substrate and the bond strength increases. The bond parameters like the bond normal force, the ultrasonic vibration amplitude and the geometry of the clamping tool show a high influence on the strength and reliability of the wire bond and need to be investigated in detail. Therefore, in this contribution the dynamical behaviour of the ultrasonic system, the wire and the substrate are modeled in form of substructures, which are connected by the friction contacts between tool and wire and between wire and substrate. Approaches for modelling the time variant contact behaviour, the substrate dynamics, and the model order reduction for a time efficient simulation are described to simulate the full bonding process."}],"citation":{"ieee":"R. Schemmel, T. Hemsel, and W. Sextro, “Numerical and experimental investigations in ultrasonic heavy wire bonding,” in <i>6th European Conference on Computational Mechanics (ECCM 6)</i>, 2018, pp. 1–12.","apa":"Schemmel, R., Hemsel, T., &#38; Sextro, W. (2018). Numerical and experimental investigations in ultrasonic heavy wire bonding. In <i>6th European Conference on Computational Mechanics (ECCM 6)</i> (pp. 1–12). Glasgow, UK.","short":"R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.","chicago":"Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “Numerical and Experimental Investigations in Ultrasonic Heavy Wire Bonding.” In <i>6th European Conference on Computational Mechanics (ECCM 6)</i>, 1–12. Glasgow, UK, 2018.","mla":"Schemmel, Reinhard, et al. “Numerical and Experimental Investigations in Ultrasonic Heavy Wire Bonding.” <i>6th European Conference on Computational Mechanics (ECCM 6)</i>, 2018, pp. 1–12.","bibtex":"@inproceedings{Schemmel_Hemsel_Sextro_2018, place={Glasgow, UK}, title={Numerical and experimental investigations in ultrasonic heavy wire bonding}, booktitle={6th European Conference on Computational Mechanics (ECCM 6)}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2018}, pages={1–12} }","ama":"Schemmel R, Hemsel T, Sextro W. Numerical and experimental investigations in ultrasonic heavy wire bonding. In: <i>6th European Conference on Computational Mechanics (ECCM 6)</i>. Glasgow, UK; 2018:1-12."},"publication":"6th European Conference on Computational Mechanics (ECCM 6)","user_id":"55222","language":[{"iso":"eng"}],"_id":"9998","page":"1-12","date_updated":"2019-09-23T08:48:04Z","author":[{"last_name":"Schemmel","first_name":"Reinhard","full_name":"Schemmel, Reinhard","id":"28647"},{"last_name":"Hemsel","first_name":"Tobias","full_name":"Hemsel, Tobias","id":"210"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"}],"status":"public","year":"2018","title":"Numerical and experimental investigations in ultrasonic heavy wire bonding"},{"project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92","grant_number":"02 PQ2210"}],"quality_controlled":"1","abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is an indispensable process in the industrial manufacturing of semiconductor devices. Copper wire is increasingly replacing the well-established aluminium wire because of its superior electrical, thermal and mechanical properties. Copper wire processes differ significantly from aluminium processes and are more sensitive to disturbances, which reduces the range of parameter values suitable for a stable process. Disturbances can be compensated by an adaption of process parameters, but finding suitable parameters manually is difficult and time-consuming. This paper presents a physical model of the ultrasonic wire bonding process including the friction contact between tool and wire. This model yields novel insights into the process. A prototype of a multi-objective optimizing bonding machine (MOBM) is presented. It uses multi-objective optimization, based on the complete process model, to automatically select the best operating point as a compromise of concurrent objectives."}],"citation":{"ama":"Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In: <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>","bibtex":"@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>}, booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter}, year={2018} }","mla":"Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, vol. Vol. 2018, No. 1, pp. 000572-000577., 2018, doi:<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>.","short":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.","chicago":"Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, Vol. Vol. 2018, No. 1, pp. 000572-000577., 2018. <a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">https://doi.org/10.4071/2380-4505-2018.1.000572</a>.","apa":"Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., &#38; Sextro, W. (2018). Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i> (Vol. Vol. 2018, No. 1, pp. 000572-000577.). <a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">https://doi.org/10.4071/2380-4505-2018.1.000572</a>","ieee":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges,” in <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577."},"publication":"In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018","department":[{"_id":"151"}],"keyword":["wire bonding","multi-objective optimization","process model","copper wire","self-optimization"],"type":"conference","date_created":"2019-05-27T10:27:45Z","date_updated":"2020-05-07T05:33:56Z","author":[{"last_name":"Unger","first_name":"Andreas","full_name":"Unger, Andreas"},{"full_name":"Hunstig, Matthias","first_name":"Matthias","last_name":"Hunstig"},{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"full_name":"Brökelmann, Michael","first_name":"Michael","last_name":"Brökelmann"},{"full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro","id":"21220"}],"status":"public","year":"2018","title":"Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges","volume":"Vol. 2018, No. 1, pp. 000572-000577.","user_id":"210","doi":"10.4071/2380-4505-2018.1.000572","_id":"9999","language":[{"iso":"eng"}]},{"date_updated":"2022-01-06T07:03:13Z","author":[{"id":"11829","full_name":"Claes, Leander","first_name":"Leander","last_name":"Claes","orcid":"0000-0002-4393-268X"},{"full_name":"Zeipert, Henning","first_name":"Henning","last_name":"Zeipert","id":"32580"},{"last_name":"Koppa","first_name":"Peter","full_name":"Koppa, Peter"},{"id":"553","full_name":"Tröster, Thomas","first_name":"Thomas","last_name":"Tröster"},{"full_name":"Henning, Bernd","last_name":"Henning","first_name":"Bernd","id":"213"}],"year":"2018","title":"Additiv gefertigte, akustische Diffusor-Strukturen für Ultraschallanwendungen","status":"public","user_id":"11829","_id":"6594","language":[{"iso":"eng"}],"citation":{"chicago":"Claes, Leander, Henning Zeipert, Peter Koppa, Thomas Tröster, and Bernd Henning. <i>Additiv Gefertigte, Akustische Diffusor-Strukturen Für Ultraschallanwendungen</i>. Workshop “Messtechnische Anwendungen von Ultraschall”, Drübeck, 2018.","short":"L. Claes, H. Zeipert, P. Koppa, T. Tröster, B. Henning, Additiv Gefertigte, Akustische Diffusor-Strukturen Für Ultraschallanwendungen, Workshop “Messtechnische Anwendungen von Ultraschall”, Drübeck, 2018.","apa":"Claes, L., Zeipert, H., Koppa, P., Tröster, T., &#38; Henning, B. (2018). <i>Additiv gefertigte, akustische Diffusor-Strukturen für Ultraschallanwendungen</i>. Workshop “Messtechnische Anwendungen von Ultraschall”, Drübeck.","ieee":"L. Claes, H. Zeipert, P. Koppa, T. Tröster, and B. Henning, <i>Additiv gefertigte, akustische Diffusor-Strukturen für Ultraschallanwendungen</i>. Workshop “Messtechnische Anwendungen von Ultraschall”, Drübeck, 2018.","ama":"Claes L, Zeipert H, Koppa P, Tröster T, Henning B. <i>Additiv Gefertigte, Akustische Diffusor-Strukturen Für Ultraschallanwendungen</i>. Workshop “Messtechnische Anwendungen von Ultraschall”, Drübeck; 2018.","bibtex":"@book{Claes_Zeipert_Koppa_Tröster_Henning_2018, place={Workshop “Messtechnische Anwendungen von Ultraschall”, Drübeck}, title={Additiv gefertigte, akustische Diffusor-Strukturen für Ultraschallanwendungen}, author={Claes, Leander and Zeipert, Henning and Koppa, Peter and Tröster, Thomas and Henning, Bernd}, year={2018} }","mla":"Claes, Leander, et al. <i>Additiv Gefertigte, Akustische Diffusor-Strukturen Für Ultraschallanwendungen</i>. 2018."},"department":[{"_id":"49"},{"_id":"149"},{"_id":"219"}],"type":"misc","place":"Workshop \"Messtechnische Anwendungen von Ultraschall\", Drübeck","date_created":"2019-01-09T16:12:23Z"},{"status":"public","volume":11,"user_id":"60544","_id":"15876","publisher":"Springer Vieweg","page":"24-29","project":[{"_id":"52","name":"Computing Resources Provided by the Paderborn Center for Parallel Computing"}],"citation":{"bibtex":"@article{Camberg_Engelkemeier_Dietrich_Heggemann_2018, title={Top-down design of tailored fiber-metal laminates}, volume={11}, DOI={<a href=\"https://doi.org/10.1007/s41777-018-0004-1\">10.1007/s41777-018-0004-1</a>}, number={2}, journal={Lightweight Design worldwide}, publisher={Springer Vieweg}, author={Camberg, Alan Adam and Engelkemeier, Katja and Dietrich, Jan and Heggemann, Thomas}, year={2018}, pages={24–29} }","ama":"Camberg AA, Engelkemeier K, Dietrich J, Heggemann T. Top-down design of tailored fiber-metal laminates. <i>Lightweight Design worldwide</i>. 2018;11(2):24-29. doi:<a href=\"https://doi.org/10.1007/s41777-018-0004-1\">10.1007/s41777-018-0004-1</a>","mla":"Camberg, Alan Adam, et al. “Top-down Design of Tailored Fiber-Metal Laminates.” <i>Lightweight Design Worldwide</i>, vol. 11, no. 2, Springer Vieweg, 2018, pp. 24–29, doi:<a href=\"https://doi.org/10.1007/s41777-018-0004-1\">10.1007/s41777-018-0004-1</a>.","short":"A.A. Camberg, K. Engelkemeier, J. Dietrich, T. Heggemann, Lightweight Design Worldwide 11 (2018) 24–29.","chicago":"Camberg, Alan Adam, Katja Engelkemeier, Jan Dietrich, and Thomas Heggemann. “Top-down Design of Tailored Fiber-Metal Laminates.” <i>Lightweight Design Worldwide</i> 11, no. 2 (2018): 24–29. <a href=\"https://doi.org/10.1007/s41777-018-0004-1\">https://doi.org/10.1007/s41777-018-0004-1</a>.","ieee":"A. A. Camberg, K. Engelkemeier, J. Dietrich, and T. Heggemann, “Top-down design of tailored fiber-metal laminates,” <i>Lightweight Design worldwide</i>, vol. 11, no. 2, pp. 24–29, 2018.","apa":"Camberg, A. A., Engelkemeier, K., Dietrich, J., &#38; Heggemann, T. (2018). Top-down design of tailored fiber-metal laminates. <i>Lightweight Design Worldwide</i>, <i>11</i>(2), 24–29. <a href=\"https://doi.org/10.1007/s41777-018-0004-1\">https://doi.org/10.1007/s41777-018-0004-1</a>"},"intvolume":"        11","publication_status":"published","date_updated":"2022-01-06T06:52:39Z","publication_identifier":{"issn":["2510-2877"]},"author":[{"id":"60544","first_name":"Alan Adam","last_name":"Camberg","full_name":"Camberg, Alan Adam"},{"last_name":"Engelkemeier","first_name":"Katja","full_name":"Engelkemeier, Katja"},{"first_name":"Jan","last_name":"Dietrich","full_name":"Dietrich, Jan"},{"first_name":"Thomas","last_name":"Heggemann","full_name":"Heggemann, Thomas"}],"title":"Top-down design of tailored fiber-metal laminates","year":"2018","doi":"10.1007/s41777-018-0004-1","language":[{"iso":"eng"}],"publication":"Lightweight Design worldwide","issue":"2","department":[{"_id":"9"},{"_id":"321"},{"_id":"149"}],"type":"journal_article","date_created":"2020-02-11T10:25:31Z"},{"user_id":"65478","language":[{"iso":"eng"}],"_id":"15129","date_updated":"2022-01-06T06:52:16Z","status":"public","title":"Tomographische Untersuchungen der Fluiddynamik viskoser Systeme in Packungskolonnen","year":"2018","conference":{"name":"Jahrestreffen der ProcessNet-Fachgemeinschaft \"Prozess-, Apparate- und Anlagentechnik\"","location":"Köln"},"author":[{"id":"65478","last_name":"Bolenz","first_name":"Lukas","full_name":"Bolenz, Lukas"},{"last_name":"Toye","first_name":"Dominique","full_name":"Toye, Dominique"},{"full_name":"Kenig, Eugeny","first_name":"Eugeny","last_name":"Kenig","id":"665"}],"type":"conference_abstract","department":[{"_id":"9"},{"_id":"145"}],"date_created":"2019-11-22T08:20:21Z","citation":{"bibtex":"@inproceedings{Bolenz_Toye_Kenig_2018, title={Tomographische Untersuchungen der Fluiddynamik viskoser Systeme in Packungskolonnen}, author={Bolenz, Lukas and Toye, Dominique and Kenig, Eugeny}, year={2018} }","ama":"Bolenz L, Toye D, Kenig E. Tomographische Untersuchungen der Fluiddynamik viskoser Systeme in Packungskolonnen. In: ; 2018.","short":"L. Bolenz, D. Toye, E. Kenig, in: 2018.","chicago":"Bolenz, Lukas, Dominique Toye, and Eugeny Kenig. “Tomographische Untersuchungen Der Fluiddynamik Viskoser Systeme in Packungskolonnen,” 2018.","ieee":"L. Bolenz, D. Toye, and E. Kenig, “Tomographische Untersuchungen der Fluiddynamik viskoser Systeme in Packungskolonnen,” presented at the Jahrestreffen der ProcessNet-Fachgemeinschaft “Prozess-, Apparate- und Anlagentechnik,” Köln, 2018.","apa":"Bolenz, L., Toye, D., &#38; Kenig, E. (2018). Tomographische Untersuchungen der Fluiddynamik viskoser Systeme in Packungskolonnen. Presented at the Jahrestreffen der ProcessNet-Fachgemeinschaft “Prozess-, Apparate- und Anlagentechnik,” Köln.","mla":"Bolenz, Lukas, et al. <i>Tomographische Untersuchungen Der Fluiddynamik Viskoser Systeme in Packungskolonnen</i>. 2018."}},{"publication_status":"published","date_updated":"2022-01-06T06:52:41Z","title":"Crushing behavior and energy absorption performance of a bio-inspired metallic structure: Experimental and numerical study","status":"public","year":"2018","author":[{"last_name":"Tasdemirci","first_name":"Alper","full_name":"Tasdemirci, Alper"},{"id":"72008","orcid":"0000-0002-1338-810X","last_name":"Akbulut Irmak","first_name":"Emine Fulya","full_name":"Akbulut Irmak, Emine Fulya"},{"full_name":"Guzel, Erkan","last_name":"Guzel","first_name":"Erkan"},{"last_name":"Tuzgel","first_name":"Firat","full_name":"Tuzgel, Firat"},{"first_name":"Atacan","last_name":"Yucesoy","full_name":"Yucesoy, Atacan"},{"full_name":"Sahin, Selim","first_name":"Selim","last_name":"Sahin"},{"full_name":"Guden, Mustafa","first_name":"Mustafa","last_name":"Guden"}],"publication_identifier":{"issn":["0263-8231"]},"user_id":"72008","doi":"10.1016/j.tws.2018.07.051","page":"547-555","language":[{"iso":"eng"}],"_id":"15977","extern":"1","publication":"Thin-Walled Structures","citation":{"bibtex":"@article{Tasdemirci_Akbulut Irmak_Guzel_Tuzgel_Yucesoy_Sahin_Guden_2018, title={Crushing behavior and energy absorption performance of a bio-inspired metallic structure: Experimental and numerical study}, DOI={<a href=\"https://doi.org/10.1016/j.tws.2018.07.051\">10.1016/j.tws.2018.07.051</a>}, journal={Thin-Walled Structures}, author={Tasdemirci, Alper and Akbulut Irmak, Emine Fulya and Guzel, Erkan and Tuzgel, Firat and Yucesoy, Atacan and Sahin, Selim and Guden, Mustafa}, year={2018}, pages={547–555} }","ama":"Tasdemirci A, Akbulut Irmak EF, Guzel E, et al. 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