[{"language":[{"iso":"eng"}],"department":[{"_id":"144"},{"_id":"219"},{"_id":"624"}],"user_id":"55833","_id":"21683","status":"public","abstract":[{"lang":"eng","text":"Purpose – This paper aims to present a methodology to help end-users to find appropriate part candidates for the use of the additive manufacturing (AM) technology. These shall be capable of bringing AM into their businesses. The concept furthermore includes approaches for redesigning current available parts and helps to estimate the economic implications of the use of the technology. Design/methodology/approach – The approach starts to discuss general economic aspects for the successful use of AM. While describing the introduction of new technologies into existing businesses, the importance of an appropriate part selection for AM is pointed out. A methodology for a part selection process is presented, and the different criteria are developed. An approach for a redesign of the selected parts, including the gathering of requirements, is given based on different sample parts. A variation of criteria to include measures for product piracy is highlighted. Findings – The methodology has proven applicability in several research and industry projects in aerospace applications. Independent part selections from experts analyzed within a project of the European Space Agency had a 90 per cent overlap with the results. It allows companies with only basic AM knowledge to start a part screening for applicable AM candidates in their own company with a reasonable effort. Originality/value – The methodology for the redesign process helps to identify the main functions of the products targeted and the relevant environment, so one can benefit from the various advantages that AM has to offer. The selection methodology helps to ask the right questions and to reduce the effort."}],"publication":"Rapid Prototyping Journal","type":"conference","doi":"https://doi.org/10.1108/RPJ-12-2014-0179","title":"Towards a sustainable and economic selection of part candidates for Additive Manufacturing","volume":21,"date_created":"2021-04-21T07:22:24Z","author":[{"last_name":"Lindemann","full_name":"Lindemann, C.","first_name":"C."},{"first_name":"U.","full_name":"Jahnke, U.","last_name":"Jahnke"},{"last_name":"Reiher","full_name":"Reiher, T.","first_name":"T."},{"first_name":"R.","last_name":"Koch","full_name":"Koch, R."}],"date_updated":"2022-01-06T06:55:10Z","publisher":"Emerald","intvolume":"        21","page":"216-227","citation":{"apa":"Lindemann, C., Jahnke, U., Reiher, T., &#38; Koch, R. (2015). Towards a sustainable and economic selection of part candidates for Additive Manufacturing. In <i>Rapid Prototyping Journal</i> (Vol. 21, pp. 216–227). Emerald. <a href=\"https://doi.org/10.1108/RPJ-12-2014-0179\">https://doi.org/10.1108/RPJ-12-2014-0179</a>","short":"C. Lindemann, U. Jahnke, T. Reiher, R. Koch, in: Rapid Prototyping Journal, Emerald, 2015, pp. 216–227.","bibtex":"@inproceedings{Lindemann_Jahnke_Reiher_Koch_2015, title={Towards a sustainable and economic selection of part candidates for Additive Manufacturing}, volume={21}, DOI={<a href=\"https://doi.org/10.1108/RPJ-12-2014-0179\">https://doi.org/10.1108/RPJ-12-2014-0179</a>}, number={2}, booktitle={Rapid Prototyping Journal}, publisher={Emerald}, author={Lindemann, C. and Jahnke, U. and Reiher, T. and Koch, R.}, year={2015}, pages={216–227} }","mla":"Lindemann, C., et al. “Towards a Sustainable and Economic Selection of Part Candidates for Additive Manufacturing.” <i>Rapid Prototyping Journal</i>, vol. 21, no. 2, Emerald, 2015, pp. 216–27, doi:<a href=\"https://doi.org/10.1108/RPJ-12-2014-0179\">https://doi.org/10.1108/RPJ-12-2014-0179</a>.","ama":"Lindemann C, Jahnke U, Reiher T, Koch R. Towards a sustainable and economic selection of part candidates for Additive Manufacturing. In: <i>Rapid Prototyping Journal</i>. Vol 21. Emerald; 2015:216-227. doi:<a href=\"https://doi.org/10.1108/RPJ-12-2014-0179\">https://doi.org/10.1108/RPJ-12-2014-0179</a>","ieee":"C. Lindemann, U. Jahnke, T. Reiher, and R. Koch, “Towards a sustainable and economic selection of part candidates for Additive Manufacturing,” in <i>Rapid Prototyping Journal</i>, 2015, vol. 21, no. 2, pp. 216–227.","chicago":"Lindemann, C., U. Jahnke, T. Reiher, and R. Koch. “Towards a Sustainable and Economic Selection of Part Candidates for Additive Manufacturing.” In <i>Rapid Prototyping Journal</i>, 21:216–27. Emerald, 2015. <a href=\"https://doi.org/10.1108/RPJ-12-2014-0179\">https://doi.org/10.1108/RPJ-12-2014-0179</a>."},"year":"2015","issue":"2","publication_identifier":{"isbn":["1355-2546"]}},{"_id":"21684","user_id":"55833","department":[{"_id":"144"},{"_id":"219"},{"_id":"624"}],"language":[{"iso":"eng"}],"type":"conference","publication":"26th Annual International Solid Freeform Fabrication Symposium","abstract":[{"lang":"eng","text":"Additive Manufacturing offers a high potential in aerospace industry due to its freedom of design and the ability to manufacture complex and lightweight parts. The low number of units, high quality standards and fast response time are special challenges that have to be met especially in the Maintenance, Repair and Overhaul sector. Thus, companies have to decide at which point it is economic to apply Additive Manufacturing. However, companies lack experience on this new technology. This is why a tool is required that takes into account the above mentioned crucial points and supports the decision process. The paper analyzes aviation’s characteristics with regard to Additive Manufacturing. The structure of current MRO repair workflows is investigated to identify a feasible application for Additive Manufacturing. Additionally the supply chain will be examined to indicate the benefit which the technology can generate in this highly demanding field. The findings are integrated into a methodology that supports the decision whether to apply Additive Manufacturing on the basis of costs, time and quality."}],"status":"public","date_updated":"2022-01-06T06:55:10Z","author":[{"first_name":"G.","full_name":"Deppe, G.","last_name":"Deppe"},{"last_name":"Lindemann","full_name":"Lindemann, C.","first_name":"C."},{"first_name":"R.","last_name":"Koch","full_name":"Koch, R."}],"date_created":"2021-04-21T07:22:25Z","volume":26,"title":"Developement of an economic decision support for the application of Additive Manufacturing in aerospace","doi":"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-125-Deppe.pdf","year":"2015","citation":{"apa":"Deppe, G., Lindemann, C., &#38; Koch, R. (2015). Developement of an economic decision support for the application of Additive Manufacturing in aerospace. In <i>26th Annual International Solid Freeform Fabrication Symposium</i> (Vol. 26, pp. 1560–1563). <a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-125-Deppe.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-125-Deppe.pdf</a>","short":"G. Deppe, C. Lindemann, R. Koch, in: 26th Annual International Solid Freeform Fabrication Symposium, 2015, pp. 1560–1563.","mla":"Deppe, G., et al. “Developement of an Economic Decision Support for the Application of Additive Manufacturing in Aerospace.” <i>26th Annual International Solid Freeform Fabrication Symposium</i>, vol. 26, 2015, pp. 1560–63, doi:<a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-125-Deppe.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-125-Deppe.pdf</a>.","bibtex":"@inproceedings{Deppe_Lindemann_Koch_2015, title={Developement of an economic decision support for the application of Additive Manufacturing in aerospace}, volume={26}, DOI={<a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-125-Deppe.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-125-Deppe.pdf</a>}, booktitle={26th Annual International Solid Freeform Fabrication Symposium}, author={Deppe, G. and Lindemann, C. and Koch, R.}, year={2015}, pages={1560–1563} }","ieee":"G. Deppe, C. Lindemann, and R. Koch, “Developement of an economic decision support for the application of Additive Manufacturing in aerospace,” in <i>26th Annual International Solid Freeform Fabrication Symposium</i>, 2015, vol. 26, pp. 1560–1563.","chicago":"Deppe, G., C. Lindemann, and R. Koch. “Developement of an Economic Decision Support for the Application of Additive Manufacturing in Aerospace.” In <i>26th Annual International Solid Freeform Fabrication Symposium</i>, 26:1560–63, 2015. <a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-125-Deppe.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-125-Deppe.pdf</a>.","ama":"Deppe G, Lindemann C, Koch R. Developement of an economic decision support for the application of Additive Manufacturing in aerospace. In: <i>26th Annual International Solid Freeform Fabrication Symposium</i>. Vol 26. ; 2015:1560-1563. doi:<a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-125-Deppe.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-125-Deppe.pdf</a>"},"page":"1560-1563","intvolume":"        26"},{"date_created":"2021-04-21T07:22:26Z","author":[{"last_name":"Jahnke","full_name":"Jahnke, U.","first_name":"U."},{"full_name":"Büsching, J.","last_name":"Büsching","first_name":"J."},{"first_name":"T.","full_name":"Reiher, T.","last_name":"Reiher"},{"first_name":"R.","last_name":"Koch","full_name":"Koch, R."}],"volume":26,"date_updated":"2022-01-06T06:55:10Z","doi":"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-128-Jahnke.pdf","title":"Protection measures against product piracy and application by the use of AM","citation":{"apa":"Jahnke, U., Büsching, J., Reiher, T., &#38; Koch, R. (2015). Protection measures against product piracy and application by the use of AM. In <i>26th Annual International Solid Freeform Fabrication Symposium</i> (Vol. 26, pp. 1601–1611). <a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-128-Jahnke.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-128-Jahnke.pdf</a>","mla":"Jahnke, U., et al. “Protection Measures against Product Piracy and Application by the Use of AM.” <i>26th Annual International Solid Freeform Fabrication Symposium</i>, vol. 26, 2015, pp. 1601–11, doi:<a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-128-Jahnke.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-128-Jahnke.pdf</a>.","short":"U. Jahnke, J. Büsching, T. Reiher, R. Koch, in: 26th Annual International Solid Freeform Fabrication Symposium, 2015, pp. 1601–1611.","bibtex":"@inproceedings{Jahnke_Büsching_Reiher_Koch_2015, title={Protection measures against product piracy and application by the use of AM}, volume={26}, DOI={<a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-128-Jahnke.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-128-Jahnke.pdf</a>}, booktitle={26th Annual International Solid Freeform Fabrication Symposium}, author={Jahnke, U. and Büsching, J. and Reiher, T. and Koch, R.}, year={2015}, pages={1601–1611} }","ieee":"U. Jahnke, J. Büsching, T. Reiher, and R. Koch, “Protection measures against product piracy and application by the use of AM,” in <i>26th Annual International Solid Freeform Fabrication Symposium</i>, 2015, vol. 26, pp. 1601–1611.","chicago":"Jahnke, U., J. Büsching, T. Reiher, and R. Koch. “Protection Measures against Product Piracy and Application by the Use of AM.” In <i>26th Annual International Solid Freeform Fabrication Symposium</i>, 26:1601–11, 2015. <a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-128-Jahnke.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-128-Jahnke.pdf</a>.","ama":"Jahnke U, Büsching J, Reiher T, Koch R. Protection measures against product piracy and application by the use of AM. In: <i>26th Annual International Solid Freeform Fabrication Symposium</i>. Vol 26. ; 2015:1601-1611. doi:<a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-128-Jahnke.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-128-Jahnke.pdf</a>"},"intvolume":"        26","page":"1601-1611","year":"2015","user_id":"55833","department":[{"_id":"144"},{"_id":"219"},{"_id":"624"}],"_id":"21685","language":[{"iso":"eng"}],"type":"conference","publication":"26th Annual International Solid Freeform Fabrication Symposium","status":"public","abstract":[{"lang":"eng","text":"Presently the implications Additive Manufacturing (AM) on intellectual properties are discussed in public. Here AM is often mentioned as a driver for product piracy as it allows to produce and to copy objects with any geometries. Imitators need a lot of information to copy an object accurately. As reverse engineering has been identified as the most important information source for product imitators, AM can also help to reduce the threat of product piracy when correctly applied in the product development. Due to the layer wise production process that allows the manufacturing of very complex shapes and geometries, the reverse-engineering process can be complicated by far. By this, quite contrary to the public opinion, AM can increase the needed effort of imitators and strongly reduce the economic efficiency of product piracy. This paper will show different protection measures and a methodological approach of how to apply these measures to a product. Beside the protective effect some measures allow a traceability of parts over the product’s lifecycle and thus support the quality management of AM processes and additively produced parts. "}]},{"volume":26,"author":[{"full_name":"Reiher, T.","last_name":"Reiher","first_name":"T."},{"first_name":"R.","last_name":"Koch","full_name":"Koch, R."}],"date_created":"2021-04-21T07:22:27Z","date_updated":"2022-01-06T06:55:10Z","doi":"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-90-Reiher.pdf","title":"FE-Optimization and data handling for Additive Manufacturing of structural parts","page":"1092-1103","intvolume":"        26","citation":{"apa":"Reiher, T., &#38; Koch, R. (2015). FE-Optimization and data handling for Additive Manufacturing of structural parts. In <i>26th Annual International Solid Freeform Fabrication Symposium</i> (Vol. 26, pp. 1092–1103). <a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-90-Reiher.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-90-Reiher.pdf</a>","short":"T. Reiher, R. Koch, in: 26th Annual International Solid Freeform Fabrication Symposium, 2015, pp. 1092–1103.","bibtex":"@inproceedings{Reiher_Koch_2015, title={FE-Optimization and data handling for Additive Manufacturing of structural parts}, volume={26}, DOI={<a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-90-Reiher.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-90-Reiher.pdf</a>}, booktitle={26th Annual International Solid Freeform Fabrication Symposium}, author={Reiher, T. and Koch, R.}, year={2015}, pages={1092–1103} }","mla":"Reiher, T., and R. Koch. “FE-Optimization and Data Handling for Additive Manufacturing of Structural Parts.” <i>26th Annual International Solid Freeform Fabrication Symposium</i>, vol. 26, 2015, pp. 1092–103, doi:<a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-90-Reiher.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-90-Reiher.pdf</a>.","ama":"Reiher T, Koch R. FE-Optimization and data handling for Additive Manufacturing of structural parts. In: <i>26th Annual International Solid Freeform Fabrication Symposium</i>. Vol 26. ; 2015:1092-1103. doi:<a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-90-Reiher.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-90-Reiher.pdf</a>","chicago":"Reiher, T., and R. Koch. “FE-Optimization and Data Handling for Additive Manufacturing of Structural Parts.” In <i>26th Annual International Solid Freeform Fabrication Symposium</i>, 26:1092–1103, 2015. <a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-90-Reiher.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-90-Reiher.pdf</a>.","ieee":"T. Reiher and R. Koch, “FE-Optimization and data handling for Additive Manufacturing of structural parts,” in <i>26th Annual International Solid Freeform Fabrication Symposium</i>, 2015, vol. 26, pp. 1092–1103."},"year":"2015","department":[{"_id":"144"},{"_id":"219"},{"_id":"624"}],"user_id":"55833","_id":"21686","language":[{"iso":"eng"}],"publication":"26th Annual International Solid Freeform Fabrication Symposium","type":"conference","status":"public","abstract":[{"text":"Additive Manufacturing (AM) offers high potential due to its freedom of design for structural parts. Especially in combination with FE-based topology optimization an optimal use of material and thus significant weight reductions can be expected. However, the application of AM is hampered by different additional manufacturing processes along the entire production chain and data handling induced restrictions.Disadvantages emerge from a lack of adjustment of the entire design process for AM. First the optimization algorithms are not targeted to the opportunities and restrictions of AM –represented by design rules – like the design of support structures. Secondly, the CAD software is not adjusted to AM in particular. Creating freeform shaped surfaces based on the optimization results is significantly less convenient than building defined blocks or turning parts following the needs of conventional machining. The indispensable subsequent interpretation of optimization results regarding the design rules and the possibilities of CAD-tools counteracts optimal results. This paper considers different approaches for a Topology Optimization (TO)-shape regaining on different sample parts including telecommunication satellite parts. An innovative design methodology is presented getting crucial for creating high quality designs. ","lang":"eng"}]},{"department":[{"_id":"144"},{"_id":"219"},{"_id":"624"}],"user_id":"55833","_id":"21700","language":[{"iso":"eng"}],"publication":"Inside 3D Printing Conference and Expo","type":"conference","status":"public","date_created":"2021-04-21T07:40:33Z","author":[{"last_name":"Jahnke","full_name":"Jahnke, U.","first_name":"U."},{"full_name":"Lindemann, C.","last_name":"Lindemann","first_name":"C."}],"date_updated":"2022-01-06T06:55:11Z","title":"Sustainable Part Selection for the Use of Additive Manufacturing in Companies Focussing on Prevention of Product Piracy","citation":{"ama":"Jahnke U, Lindemann C. Sustainable Part Selection for the Use of Additive Manufacturing in Companies Focussing on Prevention of Product Piracy. In: <i>Inside 3D Printing Conference and Expo</i>. ; 2015.","ieee":"U. Jahnke and C. Lindemann, “Sustainable Part Selection for the Use of Additive Manufacturing in Companies Focussing on Prevention of Product Piracy,” in <i>Inside 3D Printing Conference and Expo</i>, 2015.","chicago":"Jahnke, U., and C. Lindemann. “Sustainable Part Selection for the Use of Additive Manufacturing in Companies Focussing on Prevention of Product Piracy.” In <i>Inside 3D Printing Conference and Expo</i>, 2015.","short":"U. Jahnke, C. Lindemann, in: Inside 3D Printing Conference and Expo, 2015.","bibtex":"@inproceedings{Jahnke_Lindemann_2015, title={Sustainable Part Selection for the Use of Additive Manufacturing in Companies Focussing on Prevention of Product Piracy}, booktitle={Inside 3D Printing Conference and Expo}, author={Jahnke, U. and Lindemann, C.}, year={2015} }","mla":"Jahnke, U., and C. Lindemann. “Sustainable Part Selection for the Use of Additive Manufacturing in Companies Focussing on Prevention of Product Piracy.” <i>Inside 3D Printing Conference and Expo</i>, 2015.","apa":"Jahnke, U., &#38; Lindemann, C. (2015). Sustainable Part Selection for the Use of Additive Manufacturing in Companies Focussing on Prevention of Product Piracy. In <i>Inside 3D Printing Conference and Expo</i>."},"year":"2015"},{"publication_identifier":{"isbn":["9783941645110"]},"year":"2015","citation":{"short":"G. Deppe, T. Reiher, R. Koch, in: International Conference Production Engineering and Management 2015, 2015, pp. 219–230.","bibtex":"@inproceedings{Deppe_Reiher_Koch_2015, title={Exploring the cost and lifetime benefits of a topology optimized aerospace part applying additive manufacturing}, volume={5}, DOI={<a href=\"https://www.th-owl.de/elsa/download/335/336/PEM_Tagung_zusammen2015.pdf\">https://www.th-owl.de/elsa/download/335/336/PEM_Tagung_zusammen2015.pdf</a>}, booktitle={International Conference Production Engineering and Management 2015}, author={Deppe, G. and Reiher, T. and Koch, R.}, year={2015}, pages={219–230} }","mla":"Deppe, G., et al. “Exploring the Cost and Lifetime Benefits of a Topology Optimized Aerospace Part Applying Additive Manufacturing.” <i>International Conference Production Engineering and Management 2015</i>, vol. 5, 2015, pp. 219–30, doi:<a href=\"https://www.th-owl.de/elsa/download/335/336/PEM_Tagung_zusammen2015.pdf\">https://www.th-owl.de/elsa/download/335/336/PEM_Tagung_zusammen2015.pdf</a>.","apa":"Deppe, G., Reiher, T., &#38; Koch, R. (2015). Exploring the cost and lifetime benefits of a topology optimized aerospace part applying additive manufacturing. In <i>International Conference Production Engineering and Management 2015</i> (Vol. 5, pp. 219–230). <a href=\"https://www.th-owl.de/elsa/download/335/336/PEM_Tagung_zusammen2015.pdf\">https://www.th-owl.de/elsa/download/335/336/PEM_Tagung_zusammen2015.pdf</a>","ama":"Deppe G, Reiher T, Koch R. Exploring the cost and lifetime benefits of a topology optimized aerospace part applying additive manufacturing. In: <i>International Conference Production Engineering and Management 2015</i>. Vol 5. ; 2015:219-230. doi:<a href=\"https://www.th-owl.de/elsa/download/335/336/PEM_Tagung_zusammen2015.pdf\">https://www.th-owl.de/elsa/download/335/336/PEM_Tagung_zusammen2015.pdf</a>","ieee":"G. Deppe, T. Reiher, and R. Koch, “Exploring the cost and lifetime benefits of a topology optimized aerospace part applying additive manufacturing,” in <i>International Conference Production Engineering and Management 2015</i>, 2015, vol. 5, pp. 219–230.","chicago":"Deppe, G., T. Reiher, and R. Koch. “Exploring the Cost and Lifetime Benefits of a Topology Optimized Aerospace Part Applying Additive Manufacturing.” In <i>International Conference Production Engineering and Management 2015</i>, 5:219–30, 2015. <a href=\"https://www.th-owl.de/elsa/download/335/336/PEM_Tagung_zusammen2015.pdf\">https://www.th-owl.de/elsa/download/335/336/PEM_Tagung_zusammen2015.pdf</a>."},"page":"219-230","intvolume":"         5","date_updated":"2022-01-06T06:55:11Z","date_created":"2021-04-21T07:40:34Z","author":[{"last_name":"Deppe","full_name":"Deppe, G.","first_name":"G."},{"first_name":"T.","full_name":"Reiher, T.","last_name":"Reiher"},{"full_name":"Koch, R.","last_name":"Koch","first_name":"R."}],"volume":5,"title":"Exploring the cost and lifetime benefits of a topology optimized aerospace part applying additive manufacturing","doi":"https://www.th-owl.de/elsa/download/335/336/PEM_Tagung_zusammen2015.pdf","type":"conference","publication":"International Conference Production Engineering and Management 2015","abstract":[{"lang":"eng","text":"The aerospace sector is characterized by long product life cycles and a need for lightweight design. Additive manufacturing is a technology that produces parts layer by layer and thus enables the manufacturing of any complex parts at nearly no extra costs. A topology optimization enhances the part’s performance for their special purpose. The results are often complex bionic structures that cannot be produced with conventional manufacturing technologies. The paper analyzes how the high potential of this technology can be applied to aerospace parts. A topology optimization will be conducted for an aircraft part explaining the crucial points and a life cycle analysis examines the achieved sustainable improvements for the aircraft’s life cycle."}],"status":"public","_id":"21701","user_id":"55833","department":[{"_id":"144"},{"_id":"219"},{"_id":"624"}],"language":[{"iso":"eng"}]},{"status":"public","type":"conference","publication":"Paris Space Week","language":[{"iso":"eng"}],"user_id":"55833","department":[{"_id":"144"},{"_id":"219"},{"_id":"624"}],"_id":"21703","citation":{"chicago":"Lindemann, C., T. Reiher, and R. Koch. “Guidelines for a Sustainable and Economic Selection of Part Candidates for Space Applications Using Additive Manufacturing.” In <i>Paris Space Week</i>, 2015.","ieee":"C. Lindemann, T. Reiher, and R. Koch, “Guidelines for a sustainable and economic selection of part candidates for space applications using additive manufacturing,” in <i>Paris Space Week</i>, 2015.","ama":"Lindemann C, Reiher T, Koch R. Guidelines for a sustainable and economic selection of part candidates for space applications using additive manufacturing. In: <i>Paris Space Week</i>. ; 2015.","mla":"Lindemann, C., et al. “Guidelines for a Sustainable and Economic Selection of Part Candidates for Space Applications Using Additive Manufacturing.” <i>Paris Space Week</i>, 2015.","short":"C. Lindemann, T. Reiher, R. Koch, in: Paris Space Week, 2015.","bibtex":"@inproceedings{Lindemann_Reiher_Koch_2015, title={Guidelines for a sustainable and economic selection of part candidates for space applications using additive manufacturing}, booktitle={Paris Space Week}, author={Lindemann, C. and Reiher, T. and Koch, R.}, year={2015} }","apa":"Lindemann, C., Reiher, T., &#38; Koch, R. (2015). Guidelines for a sustainable and economic selection of part candidates for space applications using additive manufacturing. In <i>Paris Space Week</i>."},"year":"2015","title":"Guidelines for a sustainable and economic selection of part candidates for space applications using additive manufacturing","author":[{"first_name":"C.","last_name":"Lindemann","full_name":"Lindemann, C."},{"first_name":"T.","last_name":"Reiher","full_name":"Reiher, T."},{"last_name":"Koch","full_name":"Koch, R.","first_name":"R."}],"date_created":"2021-04-21T07:45:00Z","date_updated":"2022-01-06T06:55:11Z"},{"author":[{"first_name":"F.","full_name":"Knoop, F.","last_name":"Knoop"},{"last_name":"Schöppner","full_name":"Schöppner, Volker","id":"20530","first_name":"Volker"}],"date_created":"2021-05-07T13:23:12Z","date_updated":"2022-01-06T06:55:23Z","doi":"https://www.researchgate.net/publication/283735736_Analysis_and_optimization_of_the_dimensional_accuracy_for_FDM_parts_manufactured_with_ABS-M30","title":"Analysis and Optimization of the Dimensional Accuracy for FDM Parts manufactured with ABS-M30","page":"26-31","citation":{"ama":"Knoop F, Schöppner V. Analysis and Optimization of the Dimensional Accuracy for FDM Parts manufactured with ABS-M30. In: <i>ASPE Spring Topical Meeting</i>. ; 2015:26-31. doi:<a href=\"https://www.researchgate.net/publication/283735736_Analysis_and_optimization_of_the_dimensional_accuracy_for_FDM_parts_manufactured_with_ABS-M30\">https://www.researchgate.net/publication/283735736_Analysis_and_optimization_of_the_dimensional_accuracy_for_FDM_parts_manufactured_with_ABS-M30</a>","ieee":"F. Knoop and V. Schöppner, “Analysis and Optimization of the Dimensional Accuracy for FDM Parts manufactured with ABS-M30,” in <i>ASPE Spring Topical Meeting</i>, 2015, pp. 26–31, doi: <a href=\"https://www.researchgate.net/publication/283735736_Analysis_and_optimization_of_the_dimensional_accuracy_for_FDM_parts_manufactured_with_ABS-M30\">https://www.researchgate.net/publication/283735736_Analysis_and_optimization_of_the_dimensional_accuracy_for_FDM_parts_manufactured_with_ABS-M30</a>.","chicago":"Knoop, F., and Volker Schöppner. “Analysis and Optimization of the Dimensional Accuracy for FDM Parts Manufactured with ABS-M30.” In <i>ASPE Spring Topical Meeting</i>, 26–31, 2015. <a href=\"https://www.researchgate.net/publication/283735736_Analysis_and_optimization_of_the_dimensional_accuracy_for_FDM_parts_manufactured_with_ABS-M30\">https://www.researchgate.net/publication/283735736_Analysis_and_optimization_of_the_dimensional_accuracy_for_FDM_parts_manufactured_with_ABS-M30</a>.","apa":"Knoop, F., &#38; Schöppner, V. (2015). Analysis and Optimization of the Dimensional Accuracy for FDM Parts manufactured with ABS-M30. <i>ASPE Spring Topical Meeting</i>, 26–31. <a href=\"https://www.researchgate.net/publication/283735736_Analysis_and_optimization_of_the_dimensional_accuracy_for_FDM_parts_manufactured_with_ABS-M30\">https://www.researchgate.net/publication/283735736_Analysis_and_optimization_of_the_dimensional_accuracy_for_FDM_parts_manufactured_with_ABS-M30</a>","mla":"Knoop, F., and Volker Schöppner. “Analysis and Optimization of the Dimensional Accuracy for FDM Parts Manufactured with ABS-M30.” <i>ASPE Spring Topical Meeting</i>, 2015, pp. 26–31, doi:<a href=\"https://www.researchgate.net/publication/283735736_Analysis_and_optimization_of_the_dimensional_accuracy_for_FDM_parts_manufactured_with_ABS-M30\">https://www.researchgate.net/publication/283735736_Analysis_and_optimization_of_the_dimensional_accuracy_for_FDM_parts_manufactured_with_ABS-M30</a>.","bibtex":"@inproceedings{Knoop_Schöppner_2015, title={Analysis and Optimization of the Dimensional Accuracy for FDM Parts manufactured with ABS-M30}, DOI={<a href=\"https://www.researchgate.net/publication/283735736_Analysis_and_optimization_of_the_dimensional_accuracy_for_FDM_parts_manufactured_with_ABS-M30\">https://www.researchgate.net/publication/283735736_Analysis_and_optimization_of_the_dimensional_accuracy_for_FDM_parts_manufactured_with_ABS-M30</a>}, booktitle={ASPE Spring Topical Meeting}, author={Knoop, F. and Schöppner, Volker}, year={2015}, pages={26–31} }","short":"F. Knoop, V. Schöppner, in: ASPE Spring Topical Meeting, 2015, pp. 26–31."},"year":"2015","department":[{"_id":"219"},{"_id":"624"},{"_id":"367"},{"_id":"321"},{"_id":"9"}],"user_id":"70729","_id":"22031","language":[{"iso":"eng"}],"publication":"ASPE Spring Topical Meeting","type":"conference","status":"public"},{"volume":26,"author":[{"first_name":"F.","full_name":"Knoop, F.","last_name":"Knoop"},{"id":"20530","full_name":"Schöppner, Volker","last_name":"Schöppner","first_name":"Volker"}],"date_created":"2021-05-07T13:23:27Z","date_updated":"2022-01-06T06:55:23Z","doi":"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-77-Knoop.pdf","title":"Mechanical and Thermal Properties of FDM Parts manufactured with Polyamide 12","intvolume":"        26","page":"935-948","citation":{"ama":"Knoop F, Schöppner V. Mechanical and Thermal Properties of FDM Parts manufactured with Polyamide 12. In: <i>26th Annual International Solid Freeform Fabrication Symposium</i>. Vol 26. ; 2015:935-948. doi:<a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-77-Knoop.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-77-Knoop.pdf</a>","ieee":"F. Knoop and V. Schöppner, “Mechanical and Thermal Properties of FDM Parts manufactured with Polyamide 12,” in <i>26th Annual International Solid Freeform Fabrication Symposium</i>, 2015, vol. 26, pp. 935–948, doi: <a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-77-Knoop.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-77-Knoop.pdf</a>.","chicago":"Knoop, F., and Volker Schöppner. “Mechanical and Thermal Properties of FDM Parts Manufactured with Polyamide 12.” In <i>26th Annual International Solid Freeform Fabrication Symposium</i>, 26:935–48, 2015. <a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-77-Knoop.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-77-Knoop.pdf</a>.","apa":"Knoop, F., &#38; Schöppner, V. (2015). Mechanical and Thermal Properties of FDM Parts manufactured with Polyamide 12. <i>26th Annual International Solid Freeform Fabrication Symposium</i>, <i>26</i>, 935–948. <a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-77-Knoop.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-77-Knoop.pdf</a>","short":"F. Knoop, V. Schöppner, in: 26th Annual International Solid Freeform Fabrication Symposium, 2015, pp. 935–948.","bibtex":"@inproceedings{Knoop_Schöppner_2015, title={Mechanical and Thermal Properties of FDM Parts manufactured with Polyamide 12}, volume={26}, DOI={<a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-77-Knoop.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-77-Knoop.pdf</a>}, booktitle={26th Annual International Solid Freeform Fabrication Symposium}, author={Knoop, F. and Schöppner, Volker}, year={2015}, pages={935–948} }","mla":"Knoop, F., and Volker Schöppner. “Mechanical and Thermal Properties of FDM Parts Manufactured with Polyamide 12.” <i>26th Annual International Solid Freeform Fabrication Symposium</i>, vol. 26, 2015, pp. 935–48, doi:<a href=\"http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-77-Knoop.pdf\">http://utw10945.utweb.utexas.edu/sites/default/files/2015/2015-77-Knoop.pdf</a>."},"year":"2015","department":[{"_id":"219"},{"_id":"624"},{"_id":"367"},{"_id":"321"},{"_id":"9"}],"user_id":"70729","_id":"22044","language":[{"iso":"eng"}],"publication":"26th Annual International Solid Freeform Fabrication Symposium","type":"conference","status":"public","abstract":[{"lang":"eng","text":"Fused Deposition Modeling (FDM) is an Additive Manufacturing (AM) technology which is used for prototypes, single-part production and also small batch productions. For use as a final product, it is important that the parts have good mechanical properties, high dimensional accuracy and smooth surfaces. The knowledge of the mechanical properties is very important for the design engineer when it comes to the component design. End-use products out of the FDM process have to resist applied forces. In this paper, investigations were conducted with the polymer Polyamide 12 (FDM Nylon 12) from Stratasys Inc. This polymer can be processed with three different tip sizes resulting in different layer thicknesses from 178 µm to 330 µm. Thus, the mechanical properties were determined for these layer thicknesses and for different orientations on the build platform. In addition to the mechanical properties the thermal properties (e.g. with a DSC analysis) are also investigated."}]},{"author":[{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"},{"first_name":"Florian","full_name":"Eacock, Florian","last_name":"Eacock"}],"date_created":"2019-05-27T08:10:43Z","date_updated":"2020-05-07T05:33:51Z","doi":"10.1109/EPTC.2015.7412402","title":"Improving the cleaning process in copper wire bonding by adapting bonding parameters","quality_controlled":"1","page":"1-6","citation":{"ama":"Althoff S, Unger A, Sextro W, Eacock F. Improving the cleaning process in copper wire bonding by adapting bonding parameters. In: <i>2015 17th Electronics Packaging Technology Conference</i>. ; 2015:1-6. doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">10.1109/EPTC.2015.7412402</a>","ieee":"S. Althoff, A. Unger, W. Sextro, and F. Eacock, “Improving the cleaning process in copper wire bonding by adapting bonding parameters,” in <i>2015 17th Electronics Packaging Technology Conference</i>, 2015, pp. 1–6.","chicago":"Althoff, Simon, Andreas Unger, Walter Sextro, and Florian Eacock. “Improving the Cleaning Process in Copper Wire Bonding by Adapting Bonding Parameters.” In <i>2015 17th Electronics Packaging Technology Conference</i>, 1–6, 2015. <a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">https://doi.org/10.1109/EPTC.2015.7412402</a>.","bibtex":"@inproceedings{Althoff_Unger_Sextro_Eacock_2015, title={Improving the cleaning process in copper wire bonding by adapting bonding parameters}, DOI={<a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">10.1109/EPTC.2015.7412402</a>}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Althoff, Simon and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2015}, pages={1–6} }","short":"S. Althoff, A. Unger, W. Sextro, F. Eacock, in: 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6.","mla":"Althoff, Simon, et al. “Improving the Cleaning Process in Copper Wire Bonding by Adapting Bonding Parameters.” <i>2015 17th Electronics Packaging Technology Conference</i>, 2015, pp. 1–6, doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">10.1109/EPTC.2015.7412402</a>.","apa":"Althoff, S., Unger, A., Sextro, W., &#38; Eacock, F. (2015). Improving the cleaning process in copper wire bonding by adapting bonding parameters. In <i>2015 17th Electronics Packaging Technology Conference</i> (pp. 1–6). <a href=\"https://doi.org/10.1109/EPTC.2015.7412402\">https://doi.org/10.1109/EPTC.2015.7412402</a>"},"year":"2015","department":[{"_id":"151"}],"user_id":"210","_id":"9943","project":[{"grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","_id":"92"}],"language":[{"iso":"eng"}],"publication":"2015 17th Electronics Packaging Technology Conference","type":"conference","status":"public","abstract":[{"text":"Changing manufacturing technologies or material in well-known processes has to be followed by an adaption of process parameters. In case of the transition from aluminum wire to copper wire in heavy wire bonding, the adaption effort is high due to the strongly different mechanical properties of the wire. One of these adaption aspects, apart from wire material, is the existent oxide layers on wire and substrate. The ductile aluminum oxide is not influencing the bonding process much, because it is supposed to break apart in case of plastic deformation. The lubricating copper oxide layer has to be removed before micro welds can develop. Therefore, in this paper, experiments are carried out at low frequency to determine the friction energy needed to abrade the copper oxide layer of wire and substrate, which is indicated by an increase in the resulting friction coefficient. The friction energy per contact area to remove the interfering layers at low frequency is compared to the real bonding process working at 58 kHz. In addition, a theoretical concept is being described to get a grasp of the occurring mechanism. In the end a proposal is given how to set bonding parameters to get the cleanest surfaces with the installed bond tool.","lang":"eng"}]},{"publication":"tm - Technisches Messen","type":"journal_article","popular_science":"1","status":"public","abstract":[{"text":"Eine Vielzahl von Prozessen in der Chemie und Verfahrenstechnik kann durch Ultraschall positiv beeinflusst werden. Oftmals ist ultraschallinduzierte Kavitation der Hauptwirkmechanismus für die positiven Effekte der Beschallung. Daher ist es notwendig die Kavitationsaktivität während des Prozesses zu quantifizieren um die Beschallung für den jeweiligen Prozess optimal gestalten und überwachen zu können. Eine Möglichkeit der prozessbegleitenden Kavitationsdetektion ist die Auswertung der akustischen Emissionen von oszillierenden und kollabierenden Kavitationsblasen mittels Drucksensoren in der Flüssigkeit. Raue Prozessrandbedingungen wie hohe Temperaturen oder aggressive Flüssigkeiten erschweren es jedoch geeignete Sensoren zu finden. Als Alternative wurde daher die Nutzbarkeit der Rückwirkung von Kavitationsereignissen auf das elektrische Eingansgssignal des Ultraschallwandlers zur Quantifizierung von Kavitation untersucht. Die experimentelle Analyse hat ergeben, dass das Einsetzen und in einigen Fällen auch die Art der Kavitation auf Basis der Rückwirkung auf das Stromsignal des Ultraschallwandlers bestimmt werden kann. Die Stärke der Kavitation war hingegen nicht aus den Stromsignalen abzuleiten.","lang":"eng"}],"department":[{"_id":"151"}],"user_id":"55222","_id":"9944","language":[{"iso":"eng"}],"keyword":["Kavitationsdetektion","Self-Sensing","So- nochemie","Ultraschallwandler"],"issue":"2","page":"73-84","intvolume":"        82","citation":{"bibtex":"@article{Bornmann_Hemsel_Sextro_Memoli_Hodnett_Zeqiri_2015, title={Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler}, volume={82}, DOI={<a href=\"https://doi.org/10.1515/teme-2015-0017\">10.1515/teme-2015-0017</a>}, number={2}, journal={tm - Technisches Messen}, author={Bornmann, Peter and Hemsel, Tobias and Sextro, Walter and Memoli, Gianluca and Hodnett, Mark and Zeqiri, Bajram}, year={2015}, pages={73–84} }","mla":"Bornmann, Peter, et al. “Kavitationsdetektion Mittels Self-Sensing-Ultraschallwandler.” <i>Tm - Technisches Messen</i>, vol. 82, no. 2, 2015, pp. 73–84, doi:<a href=\"https://doi.org/10.1515/teme-2015-0017\">10.1515/teme-2015-0017</a>.","short":"P. Bornmann, T. Hemsel, W. Sextro, G. Memoli, M. Hodnett, B. Zeqiri, Tm - Technisches Messen 82 (2015) 73–84.","apa":"Bornmann, P., Hemsel, T., Sextro, W., Memoli, G., Hodnett, M., &#38; Zeqiri, B. (2015). Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler. <i>Tm - Technisches Messen</i>, <i>82</i>(2), 73–84. <a href=\"https://doi.org/10.1515/teme-2015-0017\">https://doi.org/10.1515/teme-2015-0017</a>","ama":"Bornmann P, Hemsel T, Sextro W, Memoli G, Hodnett M, Zeqiri B. Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler. <i>tm - Technisches Messen</i>. 2015;82(2):73-84. doi:<a href=\"https://doi.org/10.1515/teme-2015-0017\">10.1515/teme-2015-0017</a>","ieee":"P. Bornmann, T. Hemsel, W. Sextro, G. Memoli, M. Hodnett, and B. Zeqiri, “Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler,” <i>tm - Technisches Messen</i>, vol. 82, no. 2, pp. 73–84, 2015.","chicago":"Bornmann, Peter, Tobias Hemsel, Walter Sextro, Gianluca Memoli, Mark Hodnett, and Bajram Zeqiri. “Kavitationsdetektion Mittels Self-Sensing-Ultraschallwandler.” <i>Tm - Technisches Messen</i> 82, no. 2 (2015): 73–84. <a href=\"https://doi.org/10.1515/teme-2015-0017\">https://doi.org/10.1515/teme-2015-0017</a>."},"year":"2015","volume":82,"date_created":"2019-05-27T08:13:40Z","author":[{"full_name":"Bornmann, Peter","last_name":"Bornmann","first_name":"Peter"},{"last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias","first_name":"Tobias"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"},{"first_name":"Gianluca","full_name":"Memoli, Gianluca","last_name":"Memoli"},{"first_name":"Mark","last_name":"Hodnett","full_name":"Hodnett, Mark"},{"full_name":"Zeqiri, Bajram","last_name":"Zeqiri","first_name":"Bajram"}],"date_updated":"2019-09-16T10:44:38Z","doi":"10.1515/teme-2015-0017","title":"Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler"},{"keyword":["Verlässlichkeit","Zuverlässigkeit","Dynamik","integrierte Modellierung"],"language":[{"iso":"eng"}],"_id":"9945","user_id":"55222","series_title":"HNI-Verlagsschriftenreihe","department":[{"_id":"151"}],"abstract":[{"text":"Die starke Integration von Sensorik, Aktorik, Hard- und Software stellt Herausforderungen an die Verlässlichkeit intelligenter mechatronischer Systeme dar. Diese Systeme verfügen aber auch über großes Potential zur Verbesserung ihrer Verlässlichkeit durch eine Anpassung des Systemverhaltens an den aktuellen Zustand. Um den Umfang der Systemmodelle zu reduzieren und die Anpassung des Systemverhaltens zu ermöglichen, sind fortschrittliche Modellierungsmethoden notwendig, mit denen die Verlässlichkeit in frühen Phasen des Entwicklungsprozesses sichergestellt und evaluiert werden kann. Von den Attributen der Verlässlichkeit ist insbesondere die Zuverlässigkeit in hohem Maße von den auftretenden Belastungen an den Komponenten und damit vom dynamischen Systemverhalten abhängig. Bisherige Modellierungsansätze bilden diese Abhängigkeit nur unzureichend ab. Es wird daher ein Ansatz zur integrierten Modellierung mechatronischer Systeme vorgestellt. Dieser ist in der Lage, sowohl die Dynamik als auch die Zuverlässigkeit des Systems abzubilden. Die Transformation eines Modells des dynamischen Systemverhaltens generiert dabei ein Zuverlässigkeitsmodell. Für typischerweise konkurrierende Ziele können mit Hilfe von Mehrzieloptimierungsverfahren Betriebspunkte eines Systems bestimmt werden. Das integrierte Modell kann zur Erzeugung von Zielfunktionen für die Dynamik als auch für die Zuverlässigkeit genutzt werden. Die Ergebnisse ermöglichen eine Verhaltensanpassung durch Wahl eines paretooptimalen Betriebspunkts während des Betriebs. Das vorgeschlagene Konzept zur integrierten Modellierung mechatronischer Systeme bietet aufgrund des modellbasierten Entwicklungsansatzes und der automatisierten Transformation eines Verlässlichkeitsmodells eine Reduktion der Benutzereingaben und eine Entlastung des Benutzers. Dadurch wird die Wahrscheinlichkeit von Benutzerfehlern gesenkt und die Verlässlichkeit bereits während der Entwicklung erhöht. Somit können Iterationsschleifen vermieden und die Entwicklungskosten gesenkt werden.","lang":"eng"}],"editor":[{"full_name":"Gausemeier, Jürgen","last_name":"Gausemeier","first_name":"Jürgen"},{"last_name":"Dumitrescu","full_name":"Dumitrescu, Roman","first_name":"Roman"},{"last_name":"Rammig","full_name":"Rammig, Franz","first_name":"Franz"},{"full_name":"Schäfer, Wilhelm","last_name":"Schäfer","first_name":"Wilhelm"},{"last_name":"Trächtler","full_name":"Trächtler, Ansgar","first_name":"Ansgar"}],"status":"public","type":"conference","publication":"10. Paderborner Workshop Entwurf mechatronischer Systeme","title":"Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme","date_updated":"2019-09-30T08:06:51Z","publisher":"Heinz Nixdorf Institut, Universität Paderborn","date_created":"2019-05-27T08:17:18Z","author":[{"id":"14802","full_name":"Kaul, Thorben","last_name":"Kaul","first_name":"Thorben"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"}],"year":"2015","place":"Paderborn","citation":{"mla":"Kaul, Thorben, et al. “Integrierte Modellierung Der Dynamik Und Der Verlässlichkeit Komplexer Mechatronischer Systeme.” <i>10. Paderborner Workshop Entwurf Mechatronischer Systeme</i>, edited by Jürgen Gausemeier et al., Heinz Nixdorf Institut, Universität Paderborn, 2015, pp. 101–12.","short":"T. Kaul, T. Meyer, W. Sextro, in: J. Gausemeier, R. Dumitrescu, F. Rammig, W. Schäfer, A. Trächtler (Eds.), 10. Paderborner Workshop Entwurf Mechatronischer Systeme, Heinz Nixdorf Institut, Universität Paderborn, Paderborn, 2015, pp. 101–112.","bibtex":"@inproceedings{Kaul_Meyer_Sextro_2015, place={Paderborn}, series={HNI-Verlagsschriftenreihe}, title={Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme}, booktitle={10. Paderborner Workshop Entwurf mechatronischer Systeme}, publisher={Heinz Nixdorf Institut, Universität Paderborn}, author={Kaul, Thorben and Meyer, Tobias and Sextro, Walter}, editor={Gausemeier, Jürgen and Dumitrescu, Roman and Rammig, Franz and Schäfer, Wilhelm and Trächtler, AnsgarEditors}, year={2015}, pages={101–112}, collection={HNI-Verlagsschriftenreihe} }","apa":"Kaul, T., Meyer, T., &#38; Sextro, W. (2015). Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme. In J. Gausemeier, R. Dumitrescu, F. Rammig, W. Schäfer, &#38; A. Trächtler (Eds.), <i>10. Paderborner Workshop Entwurf mechatronischer Systeme</i> (pp. 101–112). Paderborn: Heinz Nixdorf Institut, Universität Paderborn.","ama":"Kaul T, Meyer T, Sextro W. Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme. In: Gausemeier J, Dumitrescu R, Rammig F, Schäfer W, Trächtler A, eds. <i>10. Paderborner Workshop Entwurf Mechatronischer Systeme</i>. HNI-Verlagsschriftenreihe. Paderborn: Heinz Nixdorf Institut, Universität Paderborn; 2015:101-112.","chicago":"Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Integrierte Modellierung Der Dynamik Und Der Verlässlichkeit Komplexer Mechatronischer Systeme.” In <i>10. Paderborner Workshop Entwurf Mechatronischer Systeme</i>, edited by Jürgen Gausemeier, Roman Dumitrescu, Franz Rammig, Wilhelm Schäfer, and Ansgar Trächtler, 101–12. HNI-Verlagsschriftenreihe. Paderborn: Heinz Nixdorf Institut, Universität Paderborn, 2015.","ieee":"T. Kaul, T. Meyer, and W. Sextro, “Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme,” in <i>10. Paderborner Workshop Entwurf mechatronischer Systeme</i>, 2015, pp. 101–112."},"page":"101-112","quality_controlled":"1"},{"user_id":"55222","department":[{"_id":"151"}],"_id":"9946","language":[{"iso":"eng"}],"type":"conference","publication":"European Safety and Reliability Conference (ESREL2015)","status":"public","editor":[{"first_name":"Podofillini","last_name":"et al.}","full_name":"et al.}, Podofillini"}],"abstract":[{"lang":"eng","text":"Intelligent mechatronic systems are able to autonomously adapt system behavior to current environmental conditions and to system states. To allow for such reactions, complex sensor and actuator systems as well as sophisticated information processing are required, making these systems increasingly complex. However, with the risk of increased system complexity also comes the chance to adapt system behavior based on current reliability and in turn to increase reliability. The adaptation is based on switching selecting an appropriate working point at runtime. Multiple suitable working points can be found using multi-objective optimization techniques, which require an accurate system model including system reliability. At present, modeling of system reliability is a laborious manual task performed by reliability modelling experts. Despite actual system reliability being highly dependent on system dynamics, pre-existing system dynamics models and the resulting reliability model are at best loosely coupled. To allow for closer interaction among dynamics and reliability model and to ensure these are always synchronized, advanced modeling techniques are required. Therefore, an integrated model is introduced that reduces user input to a minimum and that integrates system dynamics and system reliability."}],"author":[{"last_name":"Kaul","id":"14802","full_name":"Kaul, Thorben","first_name":"Thorben"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"full_name":"Sextro, Walter","id":"21220","last_name":"Sextro","first_name":"Walter"}],"date_created":"2019-05-27T08:20:55Z","publisher":"Taylor and Francis","date_updated":"2019-09-30T08:07:29Z","doi":"10.1201/b19094-290","title":"Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems","quality_controlled":"1","citation":{"apa":"Kaul, T., Meyer, T., &#38; Sextro, W. (2015). Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems. In P. et al.} (Ed.), <i>European Safety and Reliability Conference (ESREL2015)</i>. London: Taylor and Francis. <a href=\"https://doi.org/10.1201/b19094-290\">https://doi.org/10.1201/b19094-290</a>","bibtex":"@inproceedings{Kaul_Meyer_Sextro_2015, place={London}, title={Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems}, DOI={<a href=\"https://doi.org/10.1201/b19094-290\">10.1201/b19094-290</a>}, booktitle={European Safety and Reliability Conference (ESREL2015)}, publisher={Taylor and Francis}, author={Kaul, Thorben and Meyer, Tobias and Sextro, Walter}, editor={et al.}, PodofilliniEditor}, year={2015} }","short":"T. Kaul, T. Meyer, W. Sextro, in: P. et al.} (Ed.), European Safety and Reliability Conference (ESREL2015), Taylor and Francis, London, 2015.","mla":"Kaul, Thorben, et al. “Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems.” <i>European Safety and Reliability Conference (ESREL2015)</i>, edited by Podofillini et al.}, Taylor and Francis, 2015, doi:<a href=\"https://doi.org/10.1201/b19094-290\">10.1201/b19094-290</a>.","ama":"Kaul T, Meyer T, Sextro W. Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems. In: et al.} P, ed. <i>European Safety and Reliability Conference (ESREL2015)</i>. London: Taylor and Francis; 2015. doi:<a href=\"https://doi.org/10.1201/b19094-290\">10.1201/b19094-290</a>","chicago":"Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems.” In <i>European Safety and Reliability Conference (ESREL2015)</i>, edited by Podofillini et al.}. London: Taylor and Francis, 2015. <a href=\"https://doi.org/10.1201/b19094-290\">https://doi.org/10.1201/b19094-290</a>.","ieee":"T. Kaul, T. Meyer, and W. Sextro, “Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems,” in <i>European Safety and Reliability Conference (ESREL2015)</i>, 2015."},"place":"London","year":"2015"},{"abstract":[{"text":"This paper presents a comparison of a number of prognostic methods with regard to algorithm complexity and performance based on prognostic metrics. This information serves as a guide for selection and design of prognostic systems for real-time condition monitoring of technical systems. The methods are evaluated on ability to estimate the remaining useful life of rolling element bearing. Run-to failure vibration and temperature data is used in the analysis. The sampled prognostic methods include wear-temperature correlation method, health state estimation using temperature measurement, a multi-model particle filter approach with model parameter adaptation utilizing temperature measurements, prognostics through health state estimation and mapping extracted features to the remaining useful life through regression approach. Although the performance of the methods utilizing the vibration measurements is much better than the methods using temperature measurements, the methods using temperature measurements are quite promising in terms of reducing the overall cost of the condition monitoring system as well as the computational time. An ensemble of the presented methods through weighted average is also introduced. The results show that the methods are able to estimate the remaining useful life within error bounds of +-15\\%, which can be further reduced to +-5\\% with the ensemble approach.","lang":"eng"}],"status":"public","type":"conference","publication":"Annual Conference of the Prognostics and Health Management Society 2015","keyword":["ensemble methods","combined prognostics","data fusion"],"language":[{"iso":"eng"}],"_id":"9947","user_id":"55222","department":[{"_id":"151"}],"year":"2015","citation":{"ieee":"J. K. Kimotho and W. Sextro, “Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics,” in <i>Annual Conference of the Prognostics and Health Management Society 2015</i>, 2015, vol. 6.","chicago":"Kimotho, James Kuria, and Walter Sextro. “Comparison and Ensemble of Temperature-Based and Vibration-Based Methods for Machinery Prognostics.” In <i>Annual Conference of the Prognostics and Health Management Society 2015</i>, Vol. 6, 2015.","ama":"Kimotho JK, Sextro W. Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics. In: <i>Annual Conference of the Prognostics and Health Management Society 2015</i>. Vol 6. ; 2015.","bibtex":"@inproceedings{Kimotho_Sextro_2015, title={Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics}, volume={6}, booktitle={Annual Conference of the Prognostics and Health Management Society 2015}, author={Kimotho, James Kuria and Sextro, Walter}, year={2015} }","mla":"Kimotho, James Kuria, and Walter Sextro. “Comparison and Ensemble of Temperature-Based and Vibration-Based Methods for Machinery Prognostics.” <i>Annual Conference of the Prognostics and Health Management Society 2015</i>, vol. 6, 2015.","short":"J.K. Kimotho, W. Sextro, in: Annual Conference of the Prognostics and Health Management Society 2015, 2015.","apa":"Kimotho, J. K., &#38; Sextro, W. (2015). Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics. In <i>Annual Conference of the Prognostics and Health Management Society 2015</i> (Vol. 6)."},"intvolume":"         6","title":"Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics","date_updated":"2019-05-27T08:25:44Z","author":[{"full_name":"Kimotho, James Kuria","last_name":"Kimotho","first_name":"James Kuria"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"}],"date_created":"2019-05-27T08:24:50Z","volume":6},{"title":"Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method","doi":"10.1250/ast.36.262","date_updated":"2019-09-16T10:51:23Z","publisher":"Acoustical Society of Japan","author":[{"first_name":"Ryo","last_name":"Kudo","full_name":"Kudo, Ryo"},{"first_name":"Peter","full_name":"Bornmann, Peter","last_name":"Bornmann"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"last_name":"Morita","full_name":"Morita, Takeshi","first_name":"Takeshi"}],"date_created":"2019-05-27T08:28:31Z","volume":36,"year":"2015","citation":{"apa":"Kudo, R., Bornmann, P., Hemsel, T., &#38; Morita, T. (2015). Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method. <i>Acoustical Science and Technology</i>, <i>36</i>(3), 262–264. <a href=\"https://doi.org/10.1250/ast.36.262\">https://doi.org/10.1250/ast.36.262</a>","mla":"Kudo, Ryo, et al. “Thick KNbO 3 Films Deposited by Ultrasonic-Assisted Hydrothermal Method.” <i>Acoustical Science and Technology</i>, vol. 36, no. 3, Acoustical Society of Japan, 2015, pp. 262–64, doi:<a href=\"https://doi.org/10.1250/ast.36.262\">10.1250/ast.36.262</a>.","bibtex":"@article{Kudo_Bornmann_Hemsel_Morita_2015, title={Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method}, volume={36}, DOI={<a href=\"https://doi.org/10.1250/ast.36.262\">10.1250/ast.36.262</a>}, number={3}, journal={Acoustical Science and Technology}, publisher={Acoustical Society of Japan}, author={Kudo, Ryo and Bornmann, Peter and Hemsel, Tobias and Morita, Takeshi}, year={2015}, pages={262–264} }","short":"R. Kudo, P. Bornmann, T. Hemsel, T. Morita, Acoustical Science and Technology 36 (2015) 262–264.","ieee":"R. Kudo, P. Bornmann, T. Hemsel, and T. Morita, “Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method,” <i>Acoustical Science and Technology</i>, vol. 36, no. 3, pp. 262–264, 2015.","chicago":"Kudo, Ryo, Peter Bornmann, Tobias Hemsel, and Takeshi Morita. “Thick KNbO 3 Films Deposited by Ultrasonic-Assisted Hydrothermal Method.” <i>Acoustical Science and Technology</i> 36, no. 3 (2015): 262–64. <a href=\"https://doi.org/10.1250/ast.36.262\">https://doi.org/10.1250/ast.36.262</a>.","ama":"Kudo R, Bornmann P, Hemsel T, Morita T. Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method. <i>Acoustical Science and Technology</i>. 2015;36(3):262-264. doi:<a href=\"https://doi.org/10.1250/ast.36.262\">10.1250/ast.36.262</a>"},"intvolume":"        36","page":"262-264","quality_controlled":"1","issue":"3","language":[{"iso":"eng"}],"_id":"9948","user_id":"55222","department":[{"_id":"151"}],"status":"public","type":"journal_article","publication":"Acoustical Science and Technology"},{"year":"2015","page":"940-945","citation":{"short":"T. Meyer, T. Kaul, W. Sextro, in: Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes, 2015, pp. 940–945.","mla":"Meyer, Tobias, et al. “Advantages of Reliability-Adaptive System Operation for Maintenance Planning.” <i>Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes</i>, 2015, pp. 940–45, doi:<a href=\"https://doi.org/10.1016/j.ifacol.2015.09.647\">10.1016/j.ifacol.2015.09.647</a>.","bibtex":"@inproceedings{Meyer_Kaul_Sextro_2015, title={Advantages of reliability-adaptive system operation for maintenance planning}, DOI={<a href=\"https://doi.org/10.1016/j.ifacol.2015.09.647\">10.1016/j.ifacol.2015.09.647</a>}, booktitle={Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes}, author={Meyer, Tobias and Kaul, Thorben and Sextro, Walter}, year={2015}, pages={940–945} }","apa":"Meyer, T., Kaul, T., &#38; Sextro, W. (2015). Advantages of reliability-adaptive system operation for maintenance planning. In <i>Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes</i> (pp. 940–945). <a href=\"https://doi.org/10.1016/j.ifacol.2015.09.647\">https://doi.org/10.1016/j.ifacol.2015.09.647</a>","chicago":"Meyer, Tobias, Thorben Kaul, and Walter Sextro. “Advantages of Reliability-Adaptive System Operation for Maintenance Planning.” In <i>Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes</i>, 940–45, 2015. <a href=\"https://doi.org/10.1016/j.ifacol.2015.09.647\">https://doi.org/10.1016/j.ifacol.2015.09.647</a>.","ieee":"T. Meyer, T. Kaul, and W. Sextro, “Advantages of reliability-adaptive system operation for maintenance planning,” in <i>Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes</i>, 2015, pp. 940–945.","ama":"Meyer T, Kaul T, Sextro W. Advantages of reliability-adaptive system operation for maintenance planning. In: <i>Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes</i>. ; 2015:940-945. doi:<a href=\"https://doi.org/10.1016/j.ifacol.2015.09.647\">10.1016/j.ifacol.2015.09.647</a>"},"quality_controlled":"1","title":"Advantages of reliability-adaptive system operation for maintenance planning","doi":"10.1016/j.ifacol.2015.09.647","date_updated":"2019-09-16T10:43:42Z","author":[{"last_name":"Meyer","full_name":"Meyer, Tobias","first_name":"Tobias"},{"id":"14802","full_name":"Kaul, Thorben","last_name":"Kaul","first_name":"Thorben"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"}],"date_created":"2019-05-27T08:29:40Z","abstract":[{"lang":"eng","text":"Intelligent mechatronic systems other the possibility to adapt system behavior to current dependability. This can be used to assure reliability by controlling system behavior to reach a pre-defined lifetime. By using such closed loop control, the margin of error of useful lifetime of an individual system is lowered. It is also possible to change the pre-defined lifetime during operation, by adapting system behavior to derate component usage. When planning maintenance actions, the remaining useful lifetime of each individual system has to be taken into account. Usually, stochastic properties of a fleet of systems are analyzed to create maintenance plans. Among these, the main factor is the probability of an individual system to last until maintenance. If condition-based maintenance is used, this is updated for each individual system using available information about its current state. By lowering the margin of error of useful lifetime, which directly corresponds to the time until maintenance, extended maintenance periods are made possible. Also using reliability-adaptive operation, a reversal of degradation driven maintenance planning is possible where a maintenance plan is setup not only according to system properties, but mainly to requirements imposed by maintenance personnel or infrastructure. Each system then adapts its behavior accordingly and fails according to the maintenance plan, making better use of maintenance personnel and system capabilities at the same time. In this contribution, the potential of maintenance plan driven system behavior adaptation is shown. A model including adaptation process and maintenance actions is simulated over full system lifetime to assess the advantages gained."}],"status":"public","publication":"Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes","type":"conference","keyword":["Adaptive systems","Reliability analysis","Availability","Adaptive control","Maintenance","Self-optimizing systems","Self-optimizing control","Stochastic Petri-nets"],"language":[{"iso":"eng"}],"_id":"9949","department":[{"_id":"151"}],"user_id":"55222"},{"title":"Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme","author":[{"last_name":"Meyer","full_name":"Meyer, Tobias","first_name":"Tobias"},{"first_name":"James Kuria","last_name":"Kimotho","full_name":"Kimotho, James Kuria"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"}],"date_created":"2019-05-27T08:31:38Z","date_updated":"2019-09-30T08:09:22Z","page":"111-122","citation":{"ieee":"T. Meyer, J. K. Kimotho, and W. Sextro, “Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme,” in <i>27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger Produkte</i>, 2015, no. 2260, pp. 111–122.","chicago":"Meyer, Tobias, James Kuria Kimotho, and Walter Sextro. “Anforderungen an Condition-Monitoring-Verfahren Zur Nutzung Im Zuverläsigkeitsgeregelten Betrieb Adaptiver Systeme.” In <i>27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte</i>, 111–22. Leonberg, 2015.","ama":"Meyer T, Kimotho JK, Sextro W. Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme. In: <i>27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte</i>. Leonberg; 2015:111-122.","mla":"Meyer, Tobias, et al. “Anforderungen an Condition-Monitoring-Verfahren Zur Nutzung Im Zuverläsigkeitsgeregelten Betrieb Adaptiver Systeme.” <i>27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte</i>, no. 2260, 2015, pp. 111–22.","bibtex":"@inproceedings{Meyer_Kimotho_Sextro_2015, place={Leonberg}, title={Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme}, number={2260}, booktitle={27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger Produkte}, author={Meyer, Tobias and Kimotho, James Kuria and Sextro, Walter}, year={2015}, pages={111–122} }","short":"T. Meyer, J.K. Kimotho, W. Sextro, in: 27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung Und Betrieb Zuverlässiger Produkte, Leonberg, 2015, pp. 111–122.","apa":"Meyer, T., Kimotho, J. K., &#38; Sextro, W. (2015). Anforderungen an Condition-Monitoring-Verfahren zur Nutzung im zuverläsigkeitsgeregelten Betrieb adaptiver Systeme. In <i>27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger Produkte</i> (pp. 111–122). Leonberg."},"year":"2015","place":"Leonberg","issue":"2260","quality_controlled":"1","language":[{"iso":"eng"}],"department":[{"_id":"151"}],"user_id":"55222","_id":"9950","status":"public","abstract":[{"text":"Intelligente technische Systeme, die in der Lage sind, sich an geänderte Umgebungsbedingungen anzupassen, ermöglichen eine Adaption anhand der aktuell erreichten Zuverlässigkeit. Zu diesem Zwecke kann ein geschlossener Regelkreis formuliert werden, der dazu geeignet ist, den Betriebspunkt des Systems während der gesamten Lebensdauer anzupassen. Dadurch wird eine harte Umschaltung während des Betriebs vermieden und die Verhaltensanpassung ist vom Nutzer weitgehend unbemerkt möglich. Dazu wird die aktuelle Restlebensdauer mit einer vorgegebenen Restlebensdauer verglichen. Durch Änderung der vorgegebenen Restlebensdauer lässt sich auch eine Anpassung der gewünschten Nutzungsdauer erreichen, beispielsweise um veränderte Wartungsintervalle einzuhalten. Zu diesem Zwecke ist es allerdings notwendig, die aktuell erreichte Zuverlässigkeit zu schätzen. Für die Regelung ist dabei die aktuelle Restlebensdauer der wichtigste Parameter, da er als Istwert direkt mit der gewünschten Restlebensdauer als Sollwert verglichen wird und als Reglereingang dient. Für die Genauigkeit der Regelung ist daher die Bestimmung der Restlebensdauer von entscheidender Bedeutung. Es wird ein Modell des Regelkreises vorgestellt, das auch den Einfluss einer fehlerhaften Restlebensdauerschätzung auf die Verhaltensanpassung abbildet. Dadurch ist es möglich, Grenzen der Verhaltensanpassung und die zur Einhaltung notwendige Genauigkeit der Restlebensdauerschätzung zu bestimmen. Es gibt zahlreiche Ansätze, die Restlebensdauer zu schätzen, die aufgeteilt werden in modellbasierte Verfahren und datengetriebene Verfahren. Die individuelle Eignung eines jeden Verfahrens sowie die Modellbildung oder die Nutzung geeigneter Algorithmen ist stark systemabhängig. Um die Auswahl von Verfahren und Modellen oder Algorithmen zu ermöglichen, werden zunächst die Anforderungen an die Restlebensdauerschätzung zur Nutzung als Regelungs-Istwert bestimmt. Verschiedene Verfahren werden sodann hinsichtlich ihrer Eignung evaluiert und Anwendungsgrenzen aufgezeigt.","lang":"eng"}],"publication":"27. Tagung Technische Zuverlässigkeit (TTZ 2015) - Entwicklung und Betrieb zuverlässiger Produkte","type":"conference"},{"quality_controlled":"1","citation":{"apa":"Meyer, T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., &#38; Guth, K. (2015). Modeling and simulation of the ultrasonic wire bonding process. In <i>2015 17th Electronics Packaging Technology Conference</i>. <a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">https://doi.org/10.1109/EPTC.2015.7412377</a>","mla":"Meyer, Tobias, et al. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” <i>2015 17th Electronics Packaging Technology Conference</i>, 2015, doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">10.1109/EPTC.2015.7412377</a>.","bibtex":"@inproceedings{Meyer_Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2015, title={Modeling and simulation of the ultrasonic wire bonding process}, DOI={<a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">10.1109/EPTC.2015.7412377</a>}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Meyer, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2015} }","short":"T. Meyer, A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: 2015 17th Electronics Packaging Technology Conference, 2015.","ieee":"T. Meyer <i>et al.</i>, “Modeling and simulation of the ultrasonic wire bonding process,” in <i>2015 17th Electronics Packaging Technology Conference</i>, 2015.","chicago":"Meyer, Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” In <i>2015 17th Electronics Packaging Technology Conference</i>, 2015. <a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">https://doi.org/10.1109/EPTC.2015.7412377</a>.","ama":"Meyer T, Unger A, Althoff S, et al. Modeling and simulation of the ultrasonic wire bonding process. In: <i>2015 17th Electronics Packaging Technology Conference</i>. ; 2015. doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412377\">10.1109/EPTC.2015.7412377</a>"},"year":"2015","date_created":"2019-05-27T08:34:21Z","author":[{"first_name":"Tobias","full_name":"Meyer, Tobias","last_name":"Meyer"},{"first_name":"Andreas","full_name":"Unger, Andreas","last_name":"Unger"},{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"first_name":"Walter","last_name":"Sextro","id":"21220","full_name":"Sextro, Walter"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"},{"full_name":"Guth, Karsten","last_name":"Guth","first_name":"Karsten"}],"date_updated":"2020-05-07T05:33:52Z","doi":"10.1109/EPTC.2015.7412377","title":"Modeling and simulation of the ultrasonic wire bonding process","publication":"2015 17th Electronics Packaging Technology Conference","type":"conference","status":"public","abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is an indispensable process in the manufacturing of semiconductor components. It is used for interconnecting the silicon die to e.g. connectors in the housing or to other semiconductors in complex components. In high power applications, such as wind turbines, locomotives or electric vehicles, the thermal and mechanical limits of interconnects made from aluminum are nearing. The limits could be overcome using copper wire bonds, but their manufacturing poses challenges due to the harder material, which leads to increased wear of the bond tools and to less reliable production. To overcome these drawbacks, adaptation of process parameters at runtime is employed. However, the range of parameter values for which a stable process can be maintained is very small, making it necessary to compute suitable parameters beforehand. To this end, and to gain insights into the process itself, the ultrasonic bonding process is modeled. The full model is composed of several partial models, some of which were introduced before. This paper focuses on the modularization of the full model and on the interaction of partial models. All partial models are presented, their interaction is shown and the general outline of the simulation process is given."}],"department":[{"_id":"151"}],"user_id":"210","_id":"9951","project":[{"_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210"}],"language":[{"iso":"eng"}]},{"type":"conference","publication":"Proceedings of ICoEV 2015 International Conference on Engineering Vibration","abstract":[{"lang":"eng","text":"The contact between viscoelastic materials e.g. elastomers and a rough surface leads to a special friction characteristic, which differs greatly in its properties comparing to other materials like metals. In practice, this friction combination occurs for example in the tire-road contact, or in the use of rubber gaskets. Due to the frictional forces a system is significantly influenced in its vibrational properties. The friction force is composed of two main components adhesion and hysteresis. The adhesion results from molecular bounds between the contact partners, while the deformation of the viscoelastic material by the roughness of the counter body leads to power loss. This internal friction results in an additional frictional force, which is described by the hysteresis. To simulate the frictional behaviour of elastomers on rough surfaces and thus to determine the energy dissipation in contact, it is necessary to develop a mechanical model which considers the roughness of the contact partners, as well as dynamic effects and the dependence on normal pressure and sliding speed. The viscoelastic material behaviour must also be considered. The contact between two rough surfaces is modelled as a rough rigid layer contacting a rough elas- tic layer. The elastic layer is modelled by point masses connected by Maxwell-elements. This allows the viscoelastic properties of the elastomer to be considered. The behaviour of whole system can be described by equations of motion with integrated constraints. The degrees of freedom of the model depends on the varying contact conditions. A point mass not in contact has two degrees of freedom. A point mass in contact moving along the roughness path can be described by only one degree of freedom. For each Maxwell-Element also an inner coordinate and thus a further degree of freedom is needed. Because of varying contact conditions dur- ing the simulation, the simulation interrupts in case the contact conditions change. Then the equations of motions are adapted with respect to the contact constraints. As a result of the simulation one obtain the energy dissipation and thus the friction char- acteristic during the friction process. It is possible to use these results in three dimensional point-contact elements in order to model contact surfaces on lager length scales."}],"status":"public","_id":"9952","user_id":"55222","department":[{"_id":"151"}],"keyword":["Contact Mechanics","Viscoelastic Material","Adhesive Friction","Hysteresis Friction","Energy Dissipation","Vibration"],"language":[{"iso":"eng"}],"quality_controlled":"1","year":"2015","citation":{"bibtex":"@inproceedings{Schulte_Neuhaus_Sextro_2015, title={A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties}, booktitle={Proceedings of ICoEV 2015 International Conference on Engineering Vibration}, author={Schulte, Frank and Neuhaus, Jan and Sextro, Walter}, year={2015}, pages={1109–1117} }","mla":"Schulte, Frank, et al. “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties.” <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>, 2015, pp. 1109–17.","short":"F. Schulte, J. Neuhaus, W. Sextro, in: Proceedings of ICoEV 2015 International Conference on Engineering Vibration, 2015, pp. 1109–1117.","apa":"Schulte, F., Neuhaus, J., &#38; Sextro, W. (2015). A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i> (pp. 1109–1117).","ieee":"F. Schulte, J. Neuhaus, and W. Sextro, “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties,” in <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>, 2015, pp. 1109–1117.","chicago":"Schulte, Frank, Jan Neuhaus, and Walter Sextro. “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties.” In <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>, 1109–17, 2015.","ama":"Schulte F, Neuhaus J, Sextro W. A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In: <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>. ; 2015:1109-1117."},"page":"1109-1117","date_updated":"2019-09-16T10:47:53Z","date_created":"2019-05-27T08:37:22Z","author":[{"last_name":"Schulte","full_name":"Schulte, Frank","first_name":"Frank"},{"last_name":"Neuhaus","full_name":"Neuhaus, Jan","first_name":"Jan"},{"first_name":"Walter","last_name":"Sextro","id":"21220","full_name":"Sextro, Walter"}],"title":"A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties"},{"language":[{"iso":"eng"}],"project":[{"_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210"}],"_id":"9954","user_id":"210","department":[{"_id":"151"}],"abstract":[{"text":"To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tool tip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard's wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage.","lang":"eng"}],"status":"public","type":"conference","publication":"2015 17th Electronics Packaging Technology Conference","title":"Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear","doi":"10.1109/EPTC.2015.7412375","date_updated":"2020-05-07T05:33:52Z","date_created":"2019-05-27T08:43:55Z","author":[{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"first_name":"Walter","last_name":"Sextro","id":"21220","full_name":"Sextro, Walter"},{"first_name":"Tobias","full_name":"Meyer, Tobias","last_name":"Meyer"},{"full_name":"Eichwald, Paul","last_name":"Eichwald","first_name":"Paul"},{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"first_name":"Florian","full_name":"Eacock, Florian","last_name":"Eacock"},{"first_name":"Michael","full_name":"Brökelmann, Michael","last_name":"Brökelmann"}],"year":"2015","citation":{"bibtex":"@inproceedings{Unger_Sextro_Meyer_Eichwald_Althoff_Eacock_Brökelmann_2015, title={Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear}, DOI={<a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">10.1109/EPTC.2015.7412375</a>}, booktitle={2015 17th Electronics Packaging Technology Conference}, author={Unger, Andreas and Sextro, Walter and Meyer, Tobias and Eichwald, Paul and Althoff, Simon and Eacock, Florian and Brökelmann, Michael}, year={2015} }","mla":"Unger, Andreas, et al. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” <i>2015 17th Electronics Packaging Technology Conference</i>, 2015, doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">10.1109/EPTC.2015.7412375</a>.","short":"A. Unger, W. Sextro, T. Meyer, P. Eichwald, S. Althoff, F. Eacock, M. Brökelmann, in: 2015 17th Electronics Packaging Technology Conference, 2015.","apa":"Unger, A., Sextro, W., Meyer, T., Eichwald, P., Althoff, S., Eacock, F., &#38; Brökelmann, M. (2015). Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In <i>2015 17th Electronics Packaging Technology Conference</i>. <a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">https://doi.org/10.1109/EPTC.2015.7412375</a>","chicago":"Unger, Andreas, Walter Sextro, Tobias Meyer, Paul Eichwald, Simon Althoff, Florian Eacock, and Michael Brökelmann. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” In <i>2015 17th Electronics Packaging Technology Conference</i>, 2015. <a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">https://doi.org/10.1109/EPTC.2015.7412375</a>.","ieee":"A. Unger <i>et al.</i>, “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear,” in <i>2015 17th Electronics Packaging Technology Conference</i>, 2015.","ama":"Unger A, Sextro W, Meyer T, et al. Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. In: <i>2015 17th Electronics Packaging Technology Conference</i>. ; 2015. doi:<a href=\"https://doi.org/10.1109/EPTC.2015.7412375\">10.1109/EPTC.2015.7412375</a>"},"quality_controlled":"1"}]