---
_id: '21698'
abstract:
- lang: eng
text: 'Additive Manufacturing (AM) has been growing rapidly with doubledigit growth
rates during the last years and a rising trend towards end products. The further
development of the technology highly depends on some critical success factors.
For the future, it is vital to know which innovations will be necessary to satisfy
the needs of industry. The impulsive forces will be those branches whose special
characteristics are met by AM. Within the DMRC study “Thinking ahead the Future
of Additive Manufacturing – Analysis of Promising Industries” (Gausemeier 2011),
especially aircraft production, automotive production and the electronics industry
have been identified as very promising to profit from the use of AM. Experts have
selected these branches by assessing the prospective attractiveness of current
application fields. Those branches are characterized by low quantities, complex
part designs, lightweight design and/or high unit prices. For the aerospace industry,
all four elements are of high relevance, which is why it has been a pioneer in
applying and developing AM technology since the early beginning (Gausemeier 2011
and 2012). '
author:
- first_name: C.
full_name: Lindemann, C.
last_name: Lindemann
- first_name: G.
full_name: Deppe, G.
last_name: Deppe
- first_name: R.
full_name: Koch, R.
last_name: Koch
citation:
ama: Lindemann C, Deppe G, Koch R. Scenario Based Outlook of Additive Manufacturing
Applications for the Aerospace Market. Metropolis Verlag; 2016.
apa: Lindemann, C., Deppe, G., & Koch, R. (2016). Scenario Based Outlook
of Additive Manufacturing Applications for the Aerospace Market. Metropolis
Verlag.
bibtex: '@book{Lindemann_Deppe_Koch_2016, title={Scenario Based Outlook of Additive
Manufacturing Applications for the Aerospace Market}, publisher={Metropolis Verlag},
author={Lindemann, C. and Deppe, G. and Koch, R.}, year={2016} }'
chicago: Lindemann, C., G. Deppe, and R. Koch. Scenario Based Outlook of Additive
Manufacturing Applications for the Aerospace Market. Metropolis Verlag, 2016.
ieee: C. Lindemann, G. Deppe, and R. Koch, Scenario Based Outlook of Additive
Manufacturing Applications for the Aerospace Market. Metropolis Verlag, 2016.
mla: Lindemann, C., et al. Scenario Based Outlook of Additive Manufacturing Applications
for the Aerospace Market. Metropolis Verlag, 2016.
short: C. Lindemann, G. Deppe, R. Koch, Scenario Based Outlook of Additive Manufacturing
Applications for the Aerospace Market, Metropolis Verlag, 2016.
date_created: 2021-04-21T07:40:31Z
date_updated: 2022-01-06T06:55:10Z
department:
- _id: '144'
- _id: '219'
- _id: '624'
language:
- iso: eng
page: '283'
publication_identifier:
isbn:
- 978-3-7316-1156-1
publisher: Metropolis Verlag
status: public
title: Scenario Based Outlook of Additive Manufacturing Applications for the Aerospace
Market
type: book
user_id: '55833'
year: '2016'
...
---
_id: '21699'
abstract:
- lang: eng
text: 'Additive Manufacturing (AM) is often deemed to be a driver for product piracy
in public media. The reasons for this are mainly seen in the fact that it provides
a possibility to easily copy three-dimensional objects when used in combination
with scanning technologies. This contribution will not focus on the knowledge
and skills needed to master AM technology but on its potential contribution to
prevent product piracy and reverse engineering. The reverse engineering process
will be analyzed to understand the practice of imitators and to transfer the characteristics
of AM into specific measures. Finally a five-step methodology is presented which
can be used as a guideline to implement protection measures in products to be
(re-) developed. This guideline is supposed to be used by industrial companies
since an expert survey has identified them as being very likely to profit from
the use of AM (Echterhoff et al. 2011). '
author:
- first_name: U.
full_name: Jahnke, U.
last_name: Jahnke
- first_name: R.
full_name: Koch, R.
last_name: Koch
citation:
ama: Jahnke U, Koch R. Prevention of Product Piracy - Potentials of Additive
Manufacturing. Metropolis Verlag; 2016.
apa: Jahnke, U., & Koch, R. (2016). Prevention of Product Piracy - Potentials
of Additive Manufacturing. Metropolis Verlag.
bibtex: '@book{Jahnke_Koch_2016, title={Prevention of Product Piracy - Potentials
of Additive Manufacturing}, publisher={Metropolis Verlag}, author={Jahnke, U.
and Koch, R.}, year={2016} }'
chicago: Jahnke, U., and R. Koch. Prevention of Product Piracy - Potentials of
Additive Manufacturing. Metropolis Verlag, 2016.
ieee: U. Jahnke and R. Koch, Prevention of Product Piracy - Potentials of Additive
Manufacturing. Metropolis Verlag, 2016.
mla: Jahnke, U., and R. Koch. Prevention of Product Piracy - Potentials of Additive
Manufacturing. Metropolis Verlag, 2016.
short: U. Jahnke, R. Koch, Prevention of Product Piracy - Potentials of Additive
Manufacturing, Metropolis Verlag, 2016.
date_created: 2021-04-21T07:40:32Z
date_updated: 2022-01-06T06:55:10Z
department:
- _id: '144'
- _id: '219'
- _id: '624'
language:
- iso: eng
page: '283'
publication_identifier:
isbn:
- 978-3-7316-1156-1
publisher: Metropolis Verlag
status: public
title: Prevention of Product Piracy - Potentials of Additive Manufacturing
type: book
user_id: '55833'
year: '2016'
...
---
_id: '21702'
abstract:
- lang: eng
text: Nowadays, the material efficiency and part reliability are two majorissues
in product development. Thus a product optimization often requires complex structures
that are hard to be manufactured conventionally. Additive Manufacturing (AM) however
offers great potentials for producing complex shaped parts economically. Different
approaches are feasible to exploit these potentials based on the part’s application
from shape optimization of structural components to the integration of functions
and other entities of assemblies. Several parameters are defined that influence
the costs and quality of the future product and carefully have to be balanced.
To do so, the use of already known tools for the optimization and design needs
to be reconsidered and adapted to the special characteristics of AM. As not all
optimization potentials can be realized perfectly, a decision methodology is required
to obtain the relevant potentials and to get to a trade-off between all requirements
including the ecological impact. The paper shows different approaches for product
optimization with AM and procedures for decision making in order to get to the
optimal solution.
author:
- first_name: T.
full_name: Reiher, T.
last_name: Reiher
- first_name: G.
full_name: Deppe, G.
last_name: Deppe
- first_name: R.
full_name: Koch, R.
last_name: Koch
citation:
ama: 'Reiher T, Deppe G, Koch R. Combining material efficiency and part reliability
by product optimization applying additive manufacturing. In: International
Conference Production Engineering and Management 2016. Vol 6. ; 2016:27-38.
doi:https://www.th-owl.de/elsa/download/333/334/PEM_2016_Proceeding_2016_09_14_Inhaltsnavigation.pdf'
apa: Reiher, T., Deppe, G., & Koch, R. (2016). Combining material efficiency
and part reliability by product optimization applying additive manufacturing.
In International Conference Production Engineering and Management 2016
(Vol. 6, pp. 27–38). https://www.th-owl.de/elsa/download/333/334/PEM_2016_Proceeding_2016_09_14_Inhaltsnavigation.pdf
bibtex: '@inproceedings{Reiher_Deppe_Koch_2016, title={Combining material efficiency
and part reliability by product optimization applying additive manufacturing},
volume={6}, DOI={https://www.th-owl.de/elsa/download/333/334/PEM_2016_Proceeding_2016_09_14_Inhaltsnavigation.pdf},
booktitle={International Conference Production Engineering and Management 2016},
author={Reiher, T. and Deppe, G. and Koch, R.}, year={2016}, pages={27–38} }'
chicago: Reiher, T., G. Deppe, and R. Koch. “Combining Material Efficiency and Part
Reliability by Product Optimization Applying Additive Manufacturing.” In International
Conference Production Engineering and Management 2016, 6:27–38, 2016. https://www.th-owl.de/elsa/download/333/334/PEM_2016_Proceeding_2016_09_14_Inhaltsnavigation.pdf.
ieee: T. Reiher, G. Deppe, and R. Koch, “Combining material efficiency and part
reliability by product optimization applying additive manufacturing,” in International
Conference Production Engineering and Management 2016, 2016, vol. 6, pp. 27–38.
mla: Reiher, T., et al. “Combining Material Efficiency and Part Reliability by Product
Optimization Applying Additive Manufacturing.” International Conference Production
Engineering and Management 2016, vol. 6, 2016, pp. 27–38, doi:https://www.th-owl.de/elsa/download/333/334/PEM_2016_Proceeding_2016_09_14_Inhaltsnavigation.pdf.
short: 'T. Reiher, G. Deppe, R. Koch, in: International Conference Production Engineering
and Management 2016, 2016, pp. 27–38.'
date_created: 2021-04-21T07:40:35Z
date_updated: 2022-01-06T06:55:11Z
department:
- _id: '144'
- _id: '219'
- _id: '624'
doi: https://www.th-owl.de/elsa/download/333/334/PEM_2016_Proceeding_2016_09_14_Inhaltsnavigation.pdf
intvolume: ' 6'
language:
- iso: eng
page: 27-38
publication: International Conference Production Engineering and Management 2016
publication_identifier:
isbn:
- 978-3-946856-00-9
status: public
title: Combining material efficiency and part reliability by product optimization
applying additive manufacturing
type: conference
user_id: '55833'
volume: 6
year: '2016'
...
---
_id: '21705'
abstract:
- lang: eng
text: Additive Fertigungsverfahren bieten in der Luftfahrtindustrie großes Potential.
Die Geometriefreiheit ermöglicht die Produktion von komplexen und gewichtsoptimierten
Bauteilen. Die mangelnde Erfahrung der Unternehmen mit dieser Fertigungstechnologie
erschwert jedoch die Entscheidung, an welcher Stelle Additive Manufacturing ökonomisch
sinnvoll eingesetzt werden kann. Die Kosteneinflussfaktoren unterscheiden sich
an vielen Stellen von denen traditioneller Fertigungsverfahren und müssen gänzlich
neu bewertet und eingeordnet werden. Dabei verlagert sich auch der Fokus weg von
den reinen Herstellkosten hinzu einer ganzheitlichen Kostenbetrachtung. Wesentliche
Vorteile lassen sich auch meist in der Supply Chain erzielen und müssen im Zuge
des Entscheidungsprozesses für ein Fertigungsverfahren bei einem bestimmten Bauteil
berücksichtigt werden. Daher werden in der Präsentation die Charakteristika der
Luftfahrt analysiert und die Methodik einer Entscheidungsunterstützung vorgestellt.
Im Zuge dessen gilt es die Kostenbewertung additiver Fertigungsverfahren näher
zu beleuchten, um die Fertigungs- bzw. Reperaturkosten mit traditionellen Verfahren
vergleichen zu können. Weiterhin müssen Veränderungen in der Supply Chain identifiziert
und bewertbar gemacht werden. Qualitätskriterien müssen ebenfalls mit in die Betrachtung
einbezogen werden. Anschließend wird aufgeziegt wie diese Einflussfaktoren in
die Entscheidungsunterstützung integriert sind.
author:
- first_name: G.
full_name: Deppe, G.
last_name: Deppe
- first_name: R.
full_name: Koch, R.
last_name: Koch
citation:
ama: 'Deppe G, Koch R. Unterstützung des AM Entscheidungsprozesses in der Luftfahrtersatzteilversorgung.
In: Rapid Tech 2016. Vol 13. Hanser Verlag; 2016:349-360. doi:https://doi.org/10.3139/9783446450608.031'
apa: Deppe, G., & Koch, R. (2016). Unterstützung des AM Entscheidungsprozesses
in der Luftfahrtersatzteilversorgung. In Rapid Tech 2016 (Vol. 13, pp.
349–360). Hanser Verlag. https://doi.org/10.3139/9783446450608.031
bibtex: '@inproceedings{Deppe_Koch_2016, title={Unterstützung des AM Entscheidungsprozesses
in der Luftfahrtersatzteilversorgung}, volume={13}, DOI={https://doi.org/10.3139/9783446450608.031},
booktitle={Rapid Tech 2016}, publisher={Hanser Verlag}, author={Deppe, G. and
Koch, R.}, year={2016}, pages={349–360} }'
chicago: Deppe, G., and R. Koch. “Unterstützung Des AM Entscheidungsprozesses in
Der Luftfahrtersatzteilversorgung.” In Rapid Tech 2016, 13:349–60. Hanser
Verlag, 2016. https://doi.org/10.3139/9783446450608.031.
ieee: G. Deppe and R. Koch, “Unterstützung des AM Entscheidungsprozesses in der
Luftfahrtersatzteilversorgung,” in Rapid Tech 2016, 2016, vol. 13, pp.
349–360.
mla: Deppe, G., and R. Koch. “Unterstützung Des AM Entscheidungsprozesses in Der
Luftfahrtersatzteilversorgung.” Rapid Tech 2016, vol. 13, Hanser Verlag,
2016, pp. 349–60, doi:https://doi.org/10.3139/9783446450608.031.
short: 'G. Deppe, R. Koch, in: Rapid Tech 2016, Hanser Verlag, 2016, pp. 349–360.'
date_created: 2021-04-21T07:45:02Z
date_updated: 2022-01-06T06:55:11Z
department:
- _id: '144'
- _id: '219'
- _id: '624'
doi: https://doi.org/10.3139/9783446450608.031
intvolume: ' 13'
language:
- iso: eng
page: 349-360
publication: Rapid Tech 2016
publication_identifier:
isbn:
- 978-3-446-45017-2
publisher: Hanser Verlag
status: public
title: Unterstützung des AM Entscheidungsprozesses in der Luftfahrtersatzteilversorgung
type: conference
user_id: '55833'
volume: 13
year: '2016'
...
---
_id: '22019'
abstract:
- lang: eng
text: The mechanical characterization of fused deposition modeling (FDM) parts is
mostly done by static tests. In many applications, parts are also dynamically
loaded. Here, fatigue tests can help to identify the expected lifetime of a part.
This article discusses the fatigue behavior of FDM specimens manufactured with
Ultem 9085. For this, tensile bars are manufactured according to ASTM D638 in
different build orientations. Tests are performed in a range of pulsating tensile
stresses, and S-N curves are documented for different build orientations. For
higher loads, the FDM anisotropy characterizes the lifetime of used specimens,
which is similar to static tensile bars. For lower loads, including a higher number
of cycles to failure, S-N curves of different build orientations converge. In
further tests, tensile bars were chemically smoothed with chloroform vapor. Chemical
smoothing reduces surface roughness and increases tensile strength of specimens
in the upright build direction. Fatigue tests of chemically treated specimens
show no significant lifetime increase.
author:
- first_name: M.
full_name: Fischer, M.
last_name: Fischer
- first_name: Volker
full_name: Schöppner, Volker
id: '20530'
last_name: Schöppner
citation:
ama: 'Fischer M, Schöppner V. Fatigue Behavior of FDM Parts Manufactured with Ultem
9085. In: 27th Annual International Solid Freeform Fabrication Symposium .
Vol 27. ; 2016:563–568. doi:10.1007/s11837-016-2197-2'
apa: Fischer, M., & Schöppner, V. (2016). Fatigue Behavior of FDM Parts Manufactured
with Ultem 9085. 27th Annual International Solid Freeform Fabrication Symposium
, 27, 563–568. https://doi.org/10.1007/s11837-016-2197-2
bibtex: '@inproceedings{Fischer_Schöppner_2016, title={Fatigue Behavior of FDM Parts
Manufactured with Ultem 9085}, volume={27}, DOI={10.1007/s11837-016-2197-2},
booktitle={27th Annual International Solid Freeform Fabrication Symposium }, author={Fischer,
M. and Schöppner, Volker}, year={2016}, pages={563–568} }'
chicago: Fischer, M., and Volker Schöppner. “Fatigue Behavior of FDM Parts Manufactured
with Ultem 9085.” In 27th Annual International Solid Freeform Fabrication Symposium
, 27:563–568, 2016. https://doi.org/10.1007/s11837-016-2197-2.
ieee: 'M. Fischer and V. Schöppner, “Fatigue Behavior of FDM Parts Manufactured
with Ultem 9085,” in 27th Annual International Solid Freeform Fabrication Symposium
, 2016, vol. 27, pp. 563–568, doi: 10.1007/s11837-016-2197-2.'
mla: Fischer, M., and Volker Schöppner. “Fatigue Behavior of FDM Parts Manufactured
with Ultem 9085.” 27th Annual International Solid Freeform Fabrication Symposium
, vol. 27, 2016, pp. 563–568, doi:10.1007/s11837-016-2197-2.
short: 'M. Fischer, V. Schöppner, in: 27th Annual International Solid Freeform Fabrication
Symposium , 2016, pp. 563–568.'
date_created: 2021-05-07T13:22:58Z
date_updated: 2022-01-06T06:55:22Z
department:
- _id: '219'
- _id: '624'
- _id: '367'
- _id: '321'
- _id: '9'
doi: 10.1007/s11837-016-2197-2
intvolume: ' 27'
language:
- iso: eng
page: 563–568
publication: '27th Annual International Solid Freeform Fabrication Symposium '
status: public
title: Fatigue Behavior of FDM Parts Manufactured with Ultem 9085
type: conference
user_id: '70729'
volume: 27
year: '2016'
...
---
_id: '22025'
abstract:
- lang: eng
text: Das Fraunhofer-Institut für Werkstoff- und Strahltechnik IWS etablierte in
enger Kooperation mit Partnern in den letzten Jahren erfolgreich eine geschlossene
Technologiekette zur Umsetzung maßgeschneiderter mikrophysiologischer Systeme.
Darauf aufbauend wurde eine universelle Mikrobearbeitungsplattform zum automatisierten
Fertigen konzipiert und entwickelt. Dies umfasst neue Technologien für Schlüsselprozesse
wie das Herstellen mikrofluidischer Komponenten mittels ARBURG Kunststoff-Freiformen
sowie das Erzeugen funktionaler Strukturen und das Einbringen von Produktschutzmerkmalen
auf innenliegenden Polymergrenzflächen mittels Direktem Laserinterferenz-Verfahren.
author:
- first_name: Elmar
full_name: Moritzer, Elmar
id: '20531'
last_name: Moritzer
- first_name: André
full_name: Hirsch, André
id: '27599'
last_name: Hirsch
- first_name: K.
full_name: Günther, K.
last_name: Günther
- first_name: S.
full_name: Teutoburg-Weiss, S.
last_name: Teutoburg-Weiss
- first_name: A.F.
full_name: Lasagni, A.F.
last_name: Lasagni
- first_name: U.
full_name: Klotzbach, U.
last_name: Klotzbach
- first_name: F.
full_name: Sonntag, F.
last_name: Sonntag
citation:
ama: Moritzer E, Hirsch A, Günther K, et al. Universelle Mikrobearbeitungsplaffform
und Basistechnologien für das Fertigen und Markieren mikrophysiologischer Systeme.
6 Dresdner Medizintechnik-Symposium, Biomedizinische Technik - interdisziplinär,
integrativ und innovativ. 2016;6:65-70.
apa: Moritzer, E., Hirsch, A., Günther, K., Teutoburg-Weiss, S., Lasagni, A. F.,
Klotzbach, U., & Sonntag, F. (2016). Universelle Mikrobearbeitungsplaffform
und Basistechnologien für das Fertigen und Markieren mikrophysiologischer Systeme.
6. Dresdner Medizintechnik-Symposium, Biomedizinische Technik - Interdisziplinär,
Integrativ Und Innovativ, 6, 65–70.
bibtex: '@article{Moritzer_Hirsch_Günther_Teutoburg-Weiss_Lasagni_Klotzbach_Sonntag_2016,
title={Universelle Mikrobearbeitungsplaffform und Basistechnologien für das Fertigen
und Markieren mikrophysiologischer Systeme}, volume={6}, journal={6. Dresdner
Medizintechnik-Symposium, Biomedizinische Technik - interdisziplinär, integrativ
und innovativ}, author={Moritzer, Elmar and Hirsch, André and Günther, K. and
Teutoburg-Weiss, S. and Lasagni, A.F. and Klotzbach, U. and Sonntag, F.}, year={2016},
pages={65–70} }'
chicago: 'Moritzer, Elmar, André Hirsch, K. Günther, S. Teutoburg-Weiss, A.F. Lasagni,
U. Klotzbach, and F. Sonntag. “Universelle Mikrobearbeitungsplaffform Und Basistechnologien
Für Das Fertigen Und Markieren Mikrophysiologischer Systeme.” 6. Dresdner Medizintechnik-Symposium,
Biomedizinische Technik - Interdisziplinär, Integrativ Und Innovativ 6 (2016):
65–70.'
ieee: E. Moritzer et al., “Universelle Mikrobearbeitungsplaffform und Basistechnologien
für das Fertigen und Markieren mikrophysiologischer Systeme,” 6. Dresdner Medizintechnik-Symposium,
Biomedizinische Technik - interdisziplinär, integrativ und innovativ, vol.
6, pp. 65–70, 2016.
mla: Moritzer, Elmar, et al. “Universelle Mikrobearbeitungsplaffform Und Basistechnologien
Für Das Fertigen Und Markieren Mikrophysiologischer Systeme.” 6. Dresdner Medizintechnik-Symposium,
Biomedizinische Technik - Interdisziplinär, Integrativ Und Innovativ, vol.
6, 2016, pp. 65–70.
short: E. Moritzer, A. Hirsch, K. Günther, S. Teutoburg-Weiss, A.F. Lasagni, U.
Klotzbach, F. Sonntag, 6. Dresdner Medizintechnik-Symposium, Biomedizinische Technik
- Interdisziplinär, Integrativ Und Innovativ 6 (2016) 65–70.
date_created: 2021-05-07T13:23:05Z
date_updated: 2022-01-06T06:55:22Z
department:
- _id: '219'
- _id: '624'
- _id: '367'
- _id: '321'
- _id: '9'
intvolume: ' 6'
language:
- iso: eng
page: 65-70
publication: 6. Dresdner Medizintechnik-Symposium, Biomedizinische Technik - interdisziplinär,
integrativ und innovativ
publication_identifier:
isbn:
- 978-3-95908-078-1
status: public
title: Universelle Mikrobearbeitungsplaffform und Basistechnologien für das Fertigen
und Markieren mikrophysiologischer Systeme
type: journal_article
user_id: '70729'
volume: 6
year: '2016'
...
---
_id: '22039'
abstract:
- lang: eng
text: The material Ultem 9085 is a flame-retardant thermoplastic polymer, which
can be processed with Fused Deposition Modeling (FDM). Due to ist high strength-to-weight
ratio and FST rating, Ultem 9085 parts are used in aviation. Process related staircase
effects on rounded and slanting part areas require a surface treatment for end
use parts. These processes include smoothing by mass finishing or coating in order
to reduce surface roughness. An alternative smoothing technique is chemical surface
treatment, such as the use of Acetone for ABS materials. In this paper, the surface
of Ultem 9085 parts is treated with Chloroform vapor in order to solve material
at the surface and smooth it. Therefore, specimens built in different build orientations
are treated and tested with regard to surface roughness values and mechancial
strength properties. The analysis of surface roughness and treatment time shows
a significantly higher efficiency for chemical treatment in comparison to mass
finishing. By employing chemical treatment, it is possible to reduce surface roughness
by more than 80 % to Rz values of approximately 15 µm. Mechanical tests and measurements
of the Melt Volume Rate (MVR) show no material destruction for chemical surface
treatment at room temperature for less than 150 min.
author:
- first_name: M.
full_name: Fischer, M.
last_name: Fischer
- first_name: O.
full_name: Seewald, O.
last_name: Seewald
- first_name: Volker
full_name: Schöppner, Volker
id: '20530'
last_name: Schöppner
citation:
ama: 'Fischer M, Seewald O, Schöppner V. Chemical Surface Treatment of Ultem 9085
Parts. In: Rapid Tech - International Trade Show & Conference for Additive
Manufacturing. Carl Hanser Verlag GmbH & Co. KG; 2016:121-133. doi:10.3139/9783446450608.010'
apa: Fischer, M., Seewald, O., & Schöppner, V. (2016). Chemical Surface Treatment
of Ultem 9085 Parts. Rapid Tech - International Trade Show & Conference
for Additive Manufacturing, 121–133. https://doi.org/10.3139/9783446450608.010
bibtex: '@inproceedings{Fischer_Seewald_Schöppner_2016, title={Chemical Surface
Treatment of Ultem 9085 Parts}, DOI={10.3139/9783446450608.010},
booktitle={Rapid Tech - International Trade Show & Conference for Additive
Manufacturing}, publisher={Carl Hanser Verlag GmbH & Co. KG}, author={Fischer,
M. and Seewald, O. and Schöppner, Volker}, year={2016}, pages={121–133} }'
chicago: Fischer, M., O. Seewald, and Volker Schöppner. “Chemical Surface Treatment
of Ultem 9085 Parts.” In Rapid Tech - International Trade Show & Conference
for Additive Manufacturing, 121–33. Carl Hanser Verlag GmbH & Co. KG,
2016. https://doi.org/10.3139/9783446450608.010.
ieee: 'M. Fischer, O. Seewald, and V. Schöppner, “Chemical Surface Treatment of
Ultem 9085 Parts,” in Rapid Tech - International Trade Show & Conference
for Additive Manufacturing, 2016, pp. 121–133, doi: 10.3139/9783446450608.010.'
mla: Fischer, M., et al. “Chemical Surface Treatment of Ultem 9085 Parts.” Rapid
Tech - International Trade Show & Conference for Additive Manufacturing,
Carl Hanser Verlag GmbH & Co. KG, 2016, pp. 121–33, doi:10.3139/9783446450608.010.
short: 'M. Fischer, O. Seewald, V. Schöppner, in: Rapid Tech - International Trade
Show & Conference for Additive Manufacturing, Carl Hanser Verlag GmbH &
Co. KG, 2016, pp. 121–133.'
date_created: 2021-05-07T13:23:21Z
date_updated: 2022-01-06T06:55:23Z
department:
- _id: '219'
- _id: '624'
- _id: '367'
- _id: '321'
- _id: '9'
doi: 10.3139/9783446450608.010
language:
- iso: eng
page: 121-133
publication: Rapid Tech - International Trade Show & Conference for Additive Manufacturing
publisher: Carl Hanser Verlag GmbH & Co. KG
status: public
title: Chemical Surface Treatment of Ultem 9085 Parts
type: conference
user_id: '70729'
year: '2016'
...
---
_id: '9955'
abstract:
- lang: eng
text: Wire bonding has been an established packaging technology for decades. When
introducing copper as wire material for high power applications, adaptations to
the bonding process and to machines became necessary. Here, challenges occur due
to the stiffer wire material and changing oxide layers on the contact partners.
To achieve sufficient process stability, a clean bond area is required, which
can only be achieved with high shear stresses in the contact partners surfaces.
These necessitate high normal forces to plastically deform the wire and substrate.
To achieve such high stresses in the contact area, the bonding tool needs to be
able to transmit the needed tangential forces to the top side of the wire. The
wire itself performs a shear movement and transmits the force into the contact
area to clean the contaminant and oxide layers and to level the desired bond surfaces.
The main function of the tool is to transmit these forces. If the bond tool can
only transmit low forces in the direction of excitation, the parameter space for
a stable bond process is severely restricted. Here, a modeling approach to estimate
how well different tool shapes meet the demand of transmitting high tangential
forces is presented. The model depends on wire deformation and thus on the ultrasonic
softening effect.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
citation:
ama: 'Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable
Tangential Force of Wire Bond Tools. In: IEEE 66th Electronic Components and
Technology Conference. ; 2016:2103-2110. doi:10.1109/ECTC.2016.234'
apa: Althoff, S., Meyer, T., Unger, A., Sextro, W., & Eacock, F. (2016). Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools. In IEEE 66th Electronic
Components and Technology Conference (pp. 2103–2110). https://doi.org/10.1109/ECTC.2016.234
bibtex: '@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools}, DOI={10.1109/ECTC.2016.234},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff,
Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian},
year={2016}, pages={2103–2110} }'
chicago: Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian
Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In
IEEE 66th Electronic Components and Technology Conference, 2103–10, 2016.
https://doi.org/10.1109/ECTC.2016.234.
ieee: S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools,” in IEEE 66th Electronic
Components and Technology Conference, 2016, pp. 2103–2110.
mla: Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire
Bond Tools.” IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2103–10, doi:10.1109/ECTC.2016.234.
short: 'S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic
Components and Technology Conference, 2016, pp. 2103–2110.'
date_created: 2019-05-27T08:47:52Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.234
keyword:
- finite element simulation
- wire bonding
- tool geometry
language:
- iso: eng
page: 2103-2110
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9957'
abstract:
- lang: eng
text: Leistungshalbleitermodule werden leistungsfähiger, effizienter, kompakter
und haltbarer Ziel dieses Innovationsprojekts des Spitzenclusters „it’s OWL –
Intelligente Technische Systeme OstWestfalen-Lippe“ ist die Entwicklung von selbstoptimierenden
Verfahren, um unter variablen Produktionsbedingungen zuverlässige Kupferbondverbindungen
herstellen zu können. Die Ultraschall-Drahtbondmaschine erhält die Fähigkeit,
sich automatisch an veränderte Bedingungen anzupassen. Hierzu wird der gesamte
Prozess der Ultraschall-Verbindungsbildung modelliert und neueste Verfahren der
Selbstoptimierung angewandt. Die Evaluierung erfolgt anhand eines Prototypen in
Form einer modifizierten Bondmaschine. Intelligent production of heavy copper
wire bonds It is the aim of this innovation-project to develop a self-optimization
system for ultrasonic copper wire bonding. It is part of the leading edge cluster
“it’s OWL”. The bonding machine will be able to react autonomously to changing
boundary conditions to ensure constant and reliable bonding results. For this,
the hole bonding process is modeled in great detail and newest self-optimization
techniques are utilized. A prototype-system incorporated in a serial machine is
used for evaluation.
author:
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Florian
full_name: Biermann, Florian
last_name: Biermann
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: Brökelmann M, Unger A, Meyer T, et al. Kupferbondverbindungen intelligent herstellen.
wt-online. 2016;7/8:512-519.
apa: Brökelmann, M., Unger, A., Meyer, T., Althoff, S., Sextro, W., Hunstig, M.,
… Guth, K. (2016). Kupferbondverbindungen intelligent herstellen. Wt-Online,
7/8, 512–519.
bibtex: '@article{Brökelmann_Unger_Meyer_Althoff_Sextro_Hunstig_Biermann_Guth_2016,
title={Kupferbondverbindungen intelligent herstellen}, volume={7/8}, journal={wt-online},
author={Brökelmann, Michael and Unger, Andreas and Meyer, Tobias and Althoff,
Simon and Sextro, Walter and Hunstig, Matthias and Biermann, Florian and Guth,
Karsten}, year={2016}, pages={512–519} }'
chicago: 'Brökelmann, Michael, Andreas Unger, Tobias Meyer, Simon Althoff, Walter
Sextro, Matthias Hunstig, Florian Biermann, and Karsten Guth. “Kupferbondverbindungen
Intelligent Herstellen.” Wt-Online 7/8 (2016): 512–19.'
ieee: M. Brökelmann et al., “Kupferbondverbindungen intelligent herstellen,”
wt-online, vol. 7/8, pp. 512–519, 2016.
mla: Brökelmann, Michael, et al. “Kupferbondverbindungen Intelligent Herstellen.”
Wt-Online, vol. 7/8, 2016, pp. 512–19.
short: M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F.
Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.
date_created: 2019-05-27T08:53:18Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
language:
- iso: eng
page: 512-519
popular_science: '1'
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: wt-online
status: public
title: Kupferbondverbindungen intelligent herstellen
type: journal_article
user_id: '210'
volume: 7/8
year: '2016'
...
---
_id: '9958'
abstract:
- lang: eng
text: The transportation of dry fine powders is an emerging technologic task, as
in biotechnology, pharmaceutical or coatings industry particle sizes of processed
powders are getting smaller and smaller. Fine powders are primarily defined by
the fact that adhesive and cohesive forces outweigh the weight forces. This leads
to mostly unwanted agglomeration (clumping) and adhesion to surfaces, what makes
it more difficult to use conventional conveyor systems (e. g. pneumatic or vibratory
conveyors) for transport. A rather new method for transporting these fine powders
is based on ultrasonic vibrations, which are used to reduce friction and adhesion
between powder and the substrate. One very effective set-up consists of a pipe,
which vibrates harmoniously in axial direction at low frequency combined with
a pulsed radial high frequency vibration. The high frequency vibration accelerates
the particles perpendicular to the surface of the pipe, which in average leads
to lower normal and thereby smaller friction force. With coordinated friction
manipulation the powder acceleration can be varied so that the powder may be greatly
accelerated and only slightly decelerated in each excitation period of the low
frequency axial vibration of the pipe. The amount of powder flow is adjustable
by vibration amplitudes, frequencies, and pulse rate, which makes the device versatile
for comparable high volume and fine dosing using one setup. Within this contribution
an experimental set-up consisting of a pipe, a solenoid actuator for axial vibration
and a piezoelectric actuator for the radial high frequency vibration is described.
An analytical model is shown, that simulates the powder velocity. Finally, simulation
results are validated by experimental data for different driving parameters such
as amplitude of low frequency vibration, pipe material and inclination angle.
author:
- first_name: Paul
full_name: Dunst, Paul
id: '22130'
last_name: Dunst
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Peter
full_name: Bornmann, Peter
last_name: Bornmann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Littmann, Walter
last_name: Littmann
citation:
ama: 'Dunst P, Sextro W, Bornmann P, Hemsel T, Littmann W. Transportation of dry
fine powders by coordinated friction manipulation. In: PAMM Proc. Appl. Math.
Mech. 16. Braunschweig; 2016:635-636. doi:10.1002/pamm.201610306'
apa: Dunst, P., Sextro, W., Bornmann, P., Hemsel, T., & Littmann, W. (2016).
Transportation of dry fine powders by coordinated friction manipulation. In PAMM
Proc. Appl. Math. Mech. 16 (pp. 635–636). Braunschweig. https://doi.org/10.1002/pamm.201610306
bibtex: '@inproceedings{Dunst_Sextro_Bornmann_Hemsel_Littmann_2016, place={Braunschweig},
title={Transportation of dry fine powders by coordinated friction manipulation},
DOI={10.1002/pamm.201610306},
booktitle={PAMM Proc. Appl. Math. Mech. 16}, author={Dunst, Paul and Sextro, Walter
and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter}, year={2016}, pages={635–636}
}'
chicago: Dunst, Paul, Walter Sextro, Peter Bornmann, Tobias Hemsel, and Walter Littmann.
“Transportation of Dry Fine Powders by Coordinated Friction Manipulation.” In
PAMM Proc. Appl. Math. Mech. 16, 635–36. Braunschweig, 2016. https://doi.org/10.1002/pamm.201610306.
ieee: P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, and W. Littmann, “Transportation
of dry fine powders by coordinated friction manipulation,” in PAMM Proc. Appl.
Math. Mech. 16, 2016, pp. 635–636.
mla: Dunst, Paul, et al. “Transportation of Dry Fine Powders by Coordinated Friction
Manipulation.” PAMM Proc. Appl. Math. Mech. 16, 2016, pp. 635–36, doi:10.1002/pamm.201610306.
short: 'P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, W. Littmann, in: PAMM Proc.
Appl. Math. Mech. 16, Braunschweig, 2016, pp. 635–636.'
date_created: 2019-05-27T08:57:25Z
date_updated: 2019-05-27T08:59:25Z
department:
- _id: '151'
doi: 10.1002/pamm.201610306
language:
- iso: eng
page: 635-636
place: Braunschweig
publication: PAMM Proc. Appl. Math. Mech. 16
status: public
title: Transportation of dry fine powders by coordinated friction manipulation
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9959'
abstract:
- lang: eng
text: Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical
devices in power electronics. In order to facilitate powerful solutions combined
with an increased efficiency, involving a material change from aluminum to copper
wire as conductor material takes place in recent years. Due to the material related
properties, copper wire bonding requires significant higher bond processing parameters
such as bond force and ultrasonic power compared to aluminum which can lead to
damages or a failure of the bonded component. Therefore, a profound knowledge
of the processes prevailing during wire bonding is essential to optimize the application
of the copper wires and consequently to achieve the demands on quality and reliability.
The behavior of different natural surface oxides of aluminum and copper are assumed
to be one reason for the deviation in the required bond parameters. Accordingly,
the impact of differently pre-treated substrates surfaces on which the bonding
is applied were investigated in this study. First, all conditions investigated
(as-received, oxidefree, AlOx and the CuOx) were characterized by utilizing scanning
electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam microscopy
and atomic force microscopy. In addition, hardness tests were performed as well
as perthometer measurements. Afterwards, a 500 $\mu$ m copper wire was bonded
on the generated surfaces investigated. In consideration of the roughness, shear
test of various bond times and microscopic images were evaluated. Finally, the
results were compared and discussed. Overall, the current study indicates that
an Al-oxide layer is beneficial for welding process in Cu wire bonding. On the
contrary, the Cu-oxide is detrimental and leads to a delayed welding of the joining
parts. Based on the obtained results, it can be expected that due to an ideal
set of Al-oxide layers, lower optimal bond parameters can used to reach high bond
strength with good reliability properties.
author:
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Olexandr
full_name: Grydin, Olexandr
last_name: Grydin
- first_name: Florian
full_name: Hengsbach, Florian
last_name: Hengsbach
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Mirko
full_name: Schaper, Mirko
last_name: Schaper
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on
the ultrasonic copper wire bond process. In: IEEE 66th Electronic Components
and Technology Conference. ; 2016:2111-2118. doi:10.1109/ECTC.2016.91'
apa: Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S.,
… Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire
bond process. In IEEE 66th Electronic Components and Technology Conference
(pp. 2111–2118). https://doi.org/10.1109/ECTC.2016.91
bibtex: '@inproceedings{Eacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016,
title={Effect of different oxide layers on the ultrasonic copper wire bond process},
DOI={10.1109/ECTC.2016.91},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Eacock,
Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach,
Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}, year={2016},
pages={2111–2118} }'
chicago: Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian
Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different
Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In IEEE 66th Electronic
Components and Technology Conference, 2111–18, 2016. https://doi.org/10.1109/ECTC.2016.91.
ieee: F. Eacock et al., “Effect of different oxide layers on the ultrasonic
copper wire bond process,” in IEEE 66th Electronic Components and Technology
Conference, 2016, pp. 2111–2118.
mla: Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic
Copper Wire Bond Process.” IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2111–18, doi:10.1109/ECTC.2016.91.
short: 'F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M.
Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2111–2118.'
date_created: 2019-05-27T09:00:50Z
date_updated: 2019-09-16T10:38:59Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.91
keyword:
- Ultrasonic copper wire bonding
- Al-oxide
- Cuoxide
- oxide-free
- roughness
- morphology
language:
- iso: eng
page: 2111-2118
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Effect of different oxide layers on the ultrasonic copper wire bond process
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9960'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a common technology for connecting electrodes of
electronic components like power modules. Nowadays, bond connections are often
made of copper instead of aluminum due to its thermal and mechanical assets. One
of the main cost factors in the wire bonding process is the acquisition cost of
consumables such as bonding tools. For copper wire bonding tool lifetime is much
lower than for aluminium bonding. This paper presents a micro wear model for wedge/wedge
bonding tools that was validated by observing wear patterns with a scanning electron
microscope. The wear coefficient is determined in long-term bonding tests. The
application of Fleischer´s wear approach incorporating frictional power to a finite
element simulation of the bonding processes is used to shift element nodes depending
on the rising frictional power for finite element modeling. The presented simulation
method can be used to take tool wear into consideration for creating tools with
increased lifetime. This enables the production of reliable bond connections using
heavy as well as thin wire of any material. The paper discusses the predominant
influences of wear on the main tool functions and their changes over tool life.
Furthermore, the influence of the tool groove angle on the tool wear was investigated.
One of the main results is that the wear is largest during the last phase of each
bonding process, when the contact area between tool and wire is largest.
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
citation:
ama: 'Eichwald P, Unger A, Eacock F, et al. Micro Wear Modeling in Copper Wire Wedge
Bonding. In: IEEE CPMT Symposium Japan, 2016. ; 2016.'
apa: Eichwald, P., Unger, A., Eacock, F., Althoff, S., Sextro, W., Guth, K., &
Brökelmann, M. (2016). Micro Wear Modeling in Copper Wire Wedge Bonding. In IEEE
CPMT Symposium Japan, 2016.
bibtex: '@inproceedings{Eichwald_Unger_Eacock_Althoff_Sextro_Guth_Brökelmann_2016,
title={Micro Wear Modeling in Copper Wire Wedge Bonding}, booktitle={IEEE CPMT
Symposium Japan, 2016}, author={Eichwald, Paul and Unger, Andreas and Eacock,
Florian and Althoff, Simon and Sextro, Walter and Guth, Karsten and Brökelmann,
Michael}, year={2016} }'
chicago: Eichwald, Paul, Andreas Unger, Florian Eacock, Simon Althoff, Walter Sextro,
Karsten Guth, and Michael Brökelmann. “Micro Wear Modeling in Copper Wire Wedge
Bonding.” In IEEE CPMT Symposium Japan, 2016, 2016.
ieee: P. Eichwald et al., “Micro Wear Modeling in Copper Wire Wedge Bonding,”
in IEEE CPMT Symposium Japan, 2016, 2016.
mla: Eichwald, Paul, et al. “Micro Wear Modeling in Copper Wire Wedge Bonding.”
IEEE CPMT Symposium Japan, 2016, 2016.
short: 'P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann,
in: IEEE CPMT Symposium Japan, 2016, 2016.'
date_created: 2019-05-27T09:07:19Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE CPMT Symposium Japan, 2016
quality_controlled: '1'
status: public
title: Micro Wear Modeling in Copper Wire Wedge Bonding
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9961'
abstract:
- lang: eng
text: Redundancy is a common approach to improve system reliability, availability
and safety in technical systems. It is achieved by adding functionally equivalent
elements that enable the system to remain operational even though one or more
of those elements fail. This paper begins with an overview on the various terminologies
and methods for redundancy concepts that can be modeled sufficiently using established
reliability analysis methods. However, these approaches yield very complex system
models, which limits their applicability. In current research, Bayesian Networks
(BNs), especially Dynamic Bayesian Networks (DBNs) have been successfully used
for reliability analysis because of their benefits in modeling complex systems
and in representing multi-state variables. However, these approaches lack appropriate
methods to model all commonly used redundancy concepts. To overcome this limitation,
three different modeling approaches based on BNs and DBNs are described in this
paper. Addressing those approaches, the benefits and limitations of BNs and DBNs
for modeling reliability of redundant technical systems are discussed and evaluated.
author:
- first_name: Thorben
full_name: Kaul, Thorben
id: '14802'
last_name: Kaul
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Kaul T, Meyer T, Sextro W. Modeling of Complex Redundancy in Technical Systems
with Bayesian Networks. In: Proceedings of the Third European Conference of
the Prognostics and Health Management Society 2016. ; 2016.'
apa: Kaul, T., Meyer, T., & Sextro, W. (2016). Modeling of Complex Redundancy
in Technical Systems with Bayesian Networks. In Proceedings of the Third European
Conference of the Prognostics and Health Management Society 2016.
bibtex: '@inproceedings{Kaul_Meyer_Sextro_2016, title={Modeling of Complex Redundancy
in Technical Systems with Bayesian Networks}, booktitle={Proceedings of the Third
European Conference of the Prognostics and Health Management Society 2016}, author={Kaul,
Thorben and Meyer, Tobias and Sextro, Walter}, year={2016} }'
chicago: Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Modeling of Complex Redundancy
in Technical Systems with Bayesian Networks.” In Proceedings of the Third European
Conference of the Prognostics and Health Management Society 2016, 2016.
ieee: T. Kaul, T. Meyer, and W. Sextro, “Modeling of Complex Redundancy in Technical
Systems with Bayesian Networks,” in Proceedings of the Third European Conference
of the Prognostics and Health Management Society 2016, 2016.
mla: Kaul, Thorben, et al. “Modeling of Complex Redundancy in Technical Systems
with Bayesian Networks.” Proceedings of the Third European Conference of the
Prognostics and Health Management Society 2016, 2016.
short: 'T. Kaul, T. Meyer, W. Sextro, in: Proceedings of the Third European Conference
of the Prognostics and Health Management Society 2016, 2016.'
date_created: 2019-05-27T09:10:07Z
date_updated: 2019-09-30T08:05:55Z
department:
- _id: '151'
language:
- iso: eng
publication: Proceedings of the Third European Conference of the Prognostics and Health
Management Society 2016
quality_controlled: '1'
status: public
title: Modeling of Complex Redundancy in Technical Systems with Bayesian Networks
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9963'
abstract:
- lang: eng
text: Tire-wheel assembly is the only connection between road and vehicle. Contacting
directly with road within postcard size of contact area, it is mounted and guided
by the suspension system. Therefore kinematics and compliances of suspension system
greatly influence the frictional coupling of tire tread elements and road surface
asperities by affecting pressure and sliding velocity distribution in the contact
zone. This study emphasizes the development of a numerical methodology for frictional
rolling contact analysis with focus on interaction of suspension system dynamics
and tire-road contact using ADAMS. For this purpose a comprehensive flexible multibody
system of the multi-link rear suspension is established, where both flexible and
rigid bodies are modeled to allow large displacements with included elastic effects.
To meet accuracy requirements for the high frequency applications, such as road
excitations, the amplitude- and frequency-dependency of rubber-metal bushings
is included. Furthermore the proposed flexible viscoelastic suspension model is
enhanced by a Flexible Ring Tire Model (FTire), which describes a 3D tire dynamic
response and covers any road excitations by tread submodel connected to road surface
model. Concerning the verification and validation procedure numerous experiments
are carried out to confirm the validity and the accuracy of both the developed
submodels and the entire model. The devised approach makes it possible to investigate
the influence of suspension system design on dynamical rolling contact and to
evaluate tire tread wear. Therefore it can be a useful tool to predict frictional
power distribution within the contact area under more realistic conditions.
author:
- first_name: Sergej
full_name: Kohl, Sergej
last_name: Kohl
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Sebastian
full_name: Schulze, Sebastian
last_name: Schulze
citation:
ama: 'Kohl S, Sextro W, Schulze S. Aspects of Flexible Viscoelastic Suspension Modeling
for Frictional Rolling Contact Analysis using ADAMS. In: The 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
Malaysia, 2016. Cyberjaya, Malaysia, 2016; 2016:1-12.'
apa: Kohl, S., Sextro, W., & Schulze, S. (2016). Aspects of Flexible Viscoelastic
Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS. In The
2nd International Conference on Automotive Innovation and Green Energy Vehicle
(AiGEV 2016), Cyberjaya, Malaysia, 2016. (pp. 1–12). Cyberjaya, Malaysia,
2016.
bibtex: '@inproceedings{Kohl_Sextro_Schulze_2016, place={Cyberjaya, Malaysia, 2016},
title={Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling
Contact Analysis using ADAMS}, booktitle={The 2nd International Conference on
Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia,
2016.}, author={Kohl, Sergej and Sextro, Walter and Schulze, Sebastian}, year={2016},
pages={1–12} }'
chicago: Kohl, Sergej, Walter Sextro, and Sebastian Schulze. “Aspects of Flexible
Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis Using
ADAMS.” In The 2nd International Conference on Automotive Innovation and Green
Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016., 1–12. Cyberjaya,
Malaysia, 2016, 2016.
ieee: S. Kohl, W. Sextro, and S. Schulze, “Aspects of Flexible Viscoelastic Suspension
Modeling for Frictional Rolling Contact Analysis using ADAMS,” in The 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
Malaysia, 2016., 2016, pp. 1–12.
mla: Kohl, Sergej, et al. “Aspects of Flexible Viscoelastic Suspension Modeling
for Frictional Rolling Contact Analysis Using ADAMS.” The 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
Malaysia, 2016., 2016, pp. 1–12.
short: 'S. Kohl, W. Sextro, S. Schulze, in: The 2nd International Conference on
Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia,
2016., Cyberjaya, Malaysia, 2016, 2016, pp. 1–12.'
date_created: 2019-05-27T09:13:14Z
date_updated: 2019-05-27T09:13:54Z
department:
- _id: '151'
keyword:
- Kinematics and compliances
- flexible viscoelastic suspension model
- frictional rolling contact analysis
- frictional power distribution.
language:
- iso: eng
page: 1-12
place: Cyberjaya, Malaysia, 2016
publication: The 2nd International Conference on Automotive Innovation and Green Energy
Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.
status: public
title: Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling
Contact Analysis using ADAMS
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9964'
abstract:
- lang: eng
text: This paper presents a benchmark data set for condition monitoring of rolling
bearings in combination with an extensive description of the corresponding bearing
damage, the data set generation by experiments and results of datadriven classifications
used as a diagnostic method. The diagnostic method uses the motor current signal
of an electromechanical drive system for bearing diagnostic. The advantage of
this approach in general is that no additional sensors are required, as current
measurements can be performed in existing frequency inverters. This will help
to reduce the cost of future condition monitoring systems. A particular novelty
of the present approach is the monitoring of damage in external bearings which
are installed in the drive system but outside the electric motor. Nevertheless,
the motor current signal is used as input for the detection of the damage. Moreover,
a wide distribution of bearing damage is considered for the benchmark data set.
The results of the classifications show that the motor current signal can be used
to identify and classify bearing damage within the drive system. However, the
classification accuracy is still low compared to classifications based on vibration
signals. Further, dependency on properties of those bearing damage that were used
for the generation of training data are observed, because training with data of
artificially generated and real bearing damages lead to different accuracies.
Altogether a verified and systematically generated data set is presented and published
online for further research
author:
- first_name: Christian
full_name: Lessmeier, Christian
last_name: Lessmeier
- first_name: James Kuria
full_name: Kimotho, James Kuria
last_name: Kimotho
- first_name: Detmar
full_name: Zimmer, Detmar
last_name: Zimmer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Lessmeier C, Kimotho JK, Zimmer D, Sextro W. Condition Monitoring of Bearing
Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric
Motors: A Benchmark Data Set for Data-Driven Classification. In: European Conference
of the Prognostics and Health Management Society. ; 2016.'
apa: 'Lessmeier, C., Kimotho, J. K., Zimmer, D., & Sextro, W. (2016). Condition
Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor
Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification.
In European Conference of the Prognostics and Health Management Society.'
bibtex: '@inproceedings{Lessmeier_Kimotho_Zimmer_Sextro_2016, title={Condition Monitoring
of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals
of Electric Motors: A Benchmark Data Set for Data-Driven Classification}, booktitle={European
Conference of the Prognostics and Health Management Society}, author={Lessmeier,
Christian and Kimotho, James Kuria and Zimmer, Detmar and Sextro, Walter}, year={2016}
}'
chicago: 'Lessmeier, Christian, James Kuria Kimotho, Detmar Zimmer, and Walter Sextro.
“Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by
Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven
Classification.” In European Conference of the Prognostics and Health Management
Society, 2016.'
ieee: 'C. Lessmeier, J. K. Kimotho, D. Zimmer, and W. Sextro, “Condition Monitoring
of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals
of Electric Motors: A Benchmark Data Set for Data-Driven Classification,” in European
Conference of the Prognostics and Health Management Society, 2016.'
mla: 'Lessmeier, Christian, et al. “Condition Monitoring of Bearing Damage in Electromechanical
Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data
Set for Data-Driven Classification.” European Conference of the Prognostics
and Health Management Society, 2016.'
short: 'C. Lessmeier, J.K. Kimotho, D. Zimmer, W. Sextro, in: European Conference
of the Prognostics and Health Management Society, 2016.'
date_created: 2019-05-27T09:14:22Z
date_updated: 2019-09-16T10:35:40Z
department:
- _id: '151'
language:
- iso: eng
publication: European Conference of the Prognostics and Health Management Society
quality_controlled: '1'
status: public
title: 'Condition Monitoring of Bearing Damage in Electromechanical Drive Systems
by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven
Classification'
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9966'
abstract:
- lang: eng
text: Usage of copper wire bonds allows to push power boundaries imposed by aluminum
wire bonds. Copper allows higher electrical, thermal and mechanical loads than
aluminum, which currently is the most commonly used material in heavy wire bonding.
This is the main driving factor for increased usage of copper in high power applications
such as wind turbines, locomotives or electric vehicles. At the same time, usage
of copper also increases tool wear and reduces the range of parameter values for
a stable process, making the process more challenging. To overcome these drawbacks,
parameter adaptation at runtime using self-optimization is desired. A self-optimizing
system is based on system objectives that evaluate and quantify system performance.
System parameters can be changed at runtime such that pre-selected objective values
are reached. For adaptation of bond process parameters, model-based self-optimization
is employed. Since it is based on a model of the system, the bond process was
modeled. In addition to static model parameters such as wire and substrate material
properties and vibration characteristics of transducer and tool, variable model
inputs are process parameters. Main simulation result is bonded area in the wiresubstrate
contact. This model is then used to find valid and optimal working points before
operation. The working point is composed of normal force and ultrasonic voltage
trajectories, which are usually determined experimentally. Instead, multiobjective
optimalization is used to compute trajectories that simultaneously optimize bond
quality, process duration, tool wear and probability of tool-substrate contacts.
The values of these objectives are computed using the process model. At runtime,
selection among pre-determined optimal working points is sufficient to prioritize
individual objectives. This way, the computationally expensive process of numerically
solving a multiobjective optimal control problem and the demanding high speed
bonding process are separated. To evaluate to what extent the pre-defined goals
of self-optimization are met, an offthe- shelf heavy wire bonding machine was
modified to allow for parameter adaptation and for transmitting of measurement
data at runtime. This data is received by an external computer system and evaluated
to select a new working point. Then, new process parameters are sent to the modified
bonding machine for use for subsequent bonds. With these components, a full self-optimizing
system has been implemented.
author:
- first_name: Tobias
full_name: Meyer , Tobias
last_name: 'Meyer '
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Meyer T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper
Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components
and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215'
apa: Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M.,
& Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation. In IEEE 66th Electronic Components and Technology
Conference (pp. 622–628). https://doi.org/10.1109/ECTC.2016.215
bibtex: '@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter
Adaptation}, DOI={10.1109/ECTC.2016.215},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer
, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann,
Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628}
}'
chicago: Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann,
Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire
Bonds Using Online Parameter Adaptation.” In IEEE 66th Electronic Components
and Technology Conference, 622–28, 2016. https://doi.org/10.1109/ECTC.2016.215.
ieee: T. Meyer et al., “Reliable Manufacturing of Heavy Copper Wire Bonds
Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and
Technology Conference, 2016, pp. 622–628.
mla: Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology
Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.
short: 'T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K.
Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp.
622–628.'
date_created: 2019-05-27T09:17:26Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.215
keyword:
- Self-optimization
- adaptive system
- bond process
- copper wire
language:
- iso: eng
page: 622-628
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9967'
abstract:
- lang: eng
text: Multibody models of mechatronic systems are usually interdisciplinary and
are continuously gaining complexity, due to a growing demand for comprehensive
models of systems including effects of electro mechanics, elastic bodies, contacts
and friction. To be capable of simulating large models with subassemblies and
contact between bodies, reduction techniques are required, which need certain
experience in the choice of parameters. This publication discusses different possibilities
for the modal description of structures in flexible multibody models with application
to an Adaptive Frontlighting System in ADAMS. It will be shown that mode count,
assembling of structures before and after modal reduction and influence of damping
parameters of particular structures and subassemblies affect the behavior of the
entire system. A common reduction technique for flexible structures in multibody
models is the component mode synthesis, which uses a certain number of modes for
description of the modal behavior of a structure. The influence of the mode count
will be shown by means of different modal descriptions of one structure that contributes
to a comprehensive model. Another study will prove that modal data of subassemblies
and assemblies of modal reduced single structures lead to different models. The
definition of damping parameters depends on the number of structures that have
been added to an assembly before modal reduction and on the number of modal reduced
structures. The comparison of subassemblies and the entire model to experimental
data will highlight the accuracy, computational overhead, complexity of models
and modeling efficiency of the comprehensive model for the frontlighting system.
author:
- first_name: Sebastian
full_name: Schulze, Sebastian
last_name: Schulze
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Sergej
full_name: Kohl, Sergej
last_name: Kohl
citation:
ama: 'Schulze S, Sextro W, Kohl S. Using Adequate Reduced Models for Flexible Multibody
Systems of Automotive Mechatronic Systems. In: 2nd International Conference
on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016. ;
2016:1-11.'
apa: Schulze, S., Sextro, W., & Kohl, S. (2016). Using Adequate Reduced Models
for Flexible Multibody Systems of Automotive Mechatronic Systems. In 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia
2016 (pp. 1–11).
bibtex: '@inproceedings{Schulze_Sextro_Kohl_2016, title={Using Adequate Reduced
Models for Flexible Multibody Systems of Automotive Mechatronic Systems}, booktitle={2nd
International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV)
Malaysia 2016}, author={Schulze, Sebastian and Sextro, Walter and Kohl, Sergej},
year={2016}, pages={1–11} }'
chicago: Schulze, Sebastian, Walter Sextro, and Sergej Kohl. “Using Adequate Reduced
Models for Flexible Multibody Systems of Automotive Mechatronic Systems.” In 2nd
International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV)
Malaysia 2016, 1–11, 2016.
ieee: S. Schulze, W. Sextro, and S. Kohl, “Using Adequate Reduced Models for Flexible
Multibody Systems of Automotive Mechatronic Systems,” in 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia
2016, 2016, pp. 1–11.
mla: Schulze, Sebastian, et al. “Using Adequate Reduced Models for Flexible Multibody
Systems of Automotive Mechatronic Systems.” 2nd International Conference on
Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, 2016,
pp. 1–11.
short: 'S. Schulze, W. Sextro, S. Kohl, in: 2nd International Conference on Automotive
Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, 2016, pp. 1–11.'
date_created: 2019-05-27T09:19:20Z
date_updated: 2019-05-27T09:19:49Z
department:
- _id: '151'
keyword:
- model reduction
- modal description
- flexible multibody systems
language:
- iso: eng
page: 1-11
publication: 2nd International Conference on Automotive Innovation and Green Energy
Vehicle (AiGEV) Malaysia 2016
status: public
title: Using Adequate Reduced Models for Flexible Multibody Systems of Automotive
Mechatronic Systems
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9968'
abstract:
- lang: eng
text: To increase quality and reliability of copper wire bonds, self-optimization
is a promising technique. For the implementation of self-optimization for ultrasonic
heavy copper wire bonding machines, a model of stick-slip motion between tool
and wire and between wire and substrate during the bonding process is essential.
Investigations confirm that both of these contacts do indeed show stick-slip movement
in each period oscillation. In a first step, this paper shows the importance of
modeling the stick-slip effect by determining, monitoring and analyzing amplitudes
and phase angles of tooltip, wire and substrate experimentally during bonding
via laser measurements. In a second step, the paper presents a dynamic model which
has been parameterized using an iterative numerical parameter identification method.
This model includes Archard’s wear approach in order to compute the lost volume
of tool tip due to wear over the entire process time. A validation of the model
by comparing measured and calculated amplitudes of tool tip and wire reveals high
model quality. Then it is then possible to calculate the lifetime of the tool
for different process parameters, i.e. values of normal force and ultrasonic voltage.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic
Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE
CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.'
apa: Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S.,
… Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process.
In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016
(pp. 251–254). IEEE CPMT Symposium Japan.
bibtex: '@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic
Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding.
IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard
and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and
Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten},
year={2016}, pages={251–254} }'
chicago: Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald,
Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten
Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear
Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54.
IEEE CPMT Symposium Japan, 2016.
ieee: A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding
Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium
Japan, 2016, 2016, pp. 251–254.
mla: Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding
Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016, 2016, pp. 251–54.
short: 'A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W.
Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge
Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp.
251–254.'
date_created: 2019-05-27T09:20:10Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
keyword:
- the Ultrasonic Wire Bonding Process
language:
- iso: eng
page: 251-254
place: IEEE CPMT Symposium Japan
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016
quality_controlled: '1'
status: public
title: Validated Simulation of the Ultrasonic Wire Bonding Process
type: conference
user_id: '210'
year: '2016'
...
---
_id: '6655'
author:
- first_name: Ewald
full_name: Japs, Ewald
last_name: Japs
- first_name: Gerrit
full_name: Sonnenrein, Gerrit
last_name: Sonnenrein
- first_name: Stefan
full_name: Krauter, Stefan
id: '28836'
last_name: Krauter
orcid: 0000-0002-3594-260X
- first_name: Jadran
full_name: Vrabec, Jadran
last_name: Vrabec
citation:
ama: 'Japs E, Sonnenrein G, Krauter S, Vrabec J. Experimental study of phase change
materials for photovoltaic modules: Energy performance and economic yield for
the EPEX spot market. Solar Energy. 2016;140:51-59.'
apa: 'Japs, E., Sonnenrein, G., Krauter, S., & Vrabec, J. (2016). Experimental
study of phase change materials for photovoltaic modules: Energy performance and
economic yield for the EPEX spot market. Solar Energy, 140, 51–59.'
bibtex: '@article{Japs_Sonnenrein_Krauter_Vrabec_2016, title={Experimental study
of phase change materials for photovoltaic modules: Energy performance and economic
yield for the EPEX spot market}, volume={140}, journal={Solar Energy}, publisher={Elsevier},
author={Japs, Ewald and Sonnenrein, Gerrit and Krauter, Stefan and Vrabec, Jadran},
year={2016}, pages={51–59} }'
chicago: 'Japs, Ewald, Gerrit Sonnenrein, Stefan Krauter, and Jadran Vrabec. “Experimental
Study of Phase Change Materials for Photovoltaic Modules: Energy Performance and
Economic Yield for the EPEX Spot Market.” Solar Energy 140 (2016): 51–59.'
ieee: 'E. Japs, G. Sonnenrein, S. Krauter, and J. Vrabec, “Experimental study of
phase change materials for photovoltaic modules: Energy performance and economic
yield for the EPEX spot market,” Solar Energy, vol. 140, pp. 51–59, 2016.'
mla: 'Japs, Ewald, et al. “Experimental Study of Phase Change Materials for Photovoltaic
Modules: Energy Performance and Economic Yield for the EPEX Spot Market.” Solar
Energy, vol. 140, Elsevier, 2016, pp. 51–59.'
short: E. Japs, G. Sonnenrein, S. Krauter, J. Vrabec, Solar Energy 140 (2016) 51–59.
date_created: 2019-01-14T10:28:43Z
date_updated: 2022-01-06T07:03:14Z
department:
- _id: '53'
- _id: '155'
intvolume: ' 140'
language:
- iso: eng
page: 51-59
publication: Solar Energy
publisher: Elsevier
status: public
title: 'Experimental study of phase change materials for photovoltaic modules: Energy
performance and economic yield for the EPEX spot market'
type: journal_article
user_id: '16148'
volume: 140
year: '2016'
...
---
_id: '15978'
author:
- first_name: Alper
full_name: Tasdemirci, Alper
last_name: Tasdemirci
- first_name: Firat
full_name: Tüzgel, Firat
last_name: Tüzgel
- first_name: Erkan
full_name: Güzel, Erkan
last_name: Güzel
- first_name: Emine Fulya
full_name: Akbulut Irmak, Emine Fulya
id: '72008'
last_name: Akbulut Irmak
orcid: 0000-0002-1338-810X
- first_name: Mustafa
full_name: Güden, Mustafa
last_name: Güden
citation:
ama: 'Tasdemirci A, Tüzgel F, Güzel E, Akbulut Irmak EF, Güden M. The Investigation
of the Dynamic Deformation Behaviour of a 304L Steel Plate with Direct-Pressure
Pulse Experiments. In: The British Society for Strain Measurement; 2016.'
apa: 'Tasdemirci, A., Tüzgel, F., Güzel, E., Akbulut Irmak, E. F., & Güden,
M. (2016). The Investigation of the Dynamic Deformation Behaviour of a 304L Steel
Plate with Direct-Pressure Pulse Experiments. Presented at the 11th International
Conference on Advances in Experimental Mechanics, Exeter, London: The British
Society for Strain Measurement.'
bibtex: '@inproceedings{Tasdemirci_Tüzgel_Güzel_Akbulut Irmak_Güden_2016, title={The
Investigation of the Dynamic Deformation Behaviour of a 304L Steel Plate with
Direct-Pressure Pulse Experiments}, publisher={The British Society for Strain
Measurement}, author={Tasdemirci, Alper and Tüzgel, Firat and Güzel, Erkan and
Akbulut Irmak, Emine Fulya and Güden, Mustafa}, year={2016} }'
chicago: Tasdemirci, Alper, Firat Tüzgel, Erkan Güzel, Emine Fulya Akbulut Irmak,
and Mustafa Güden. “The Investigation of the Dynamic Deformation Behaviour of
a 304L Steel Plate with Direct-Pressure Pulse Experiments.” The British Society
for Strain Measurement, 2016.
ieee: A. Tasdemirci, F. Tüzgel, E. Güzel, E. F. Akbulut Irmak, and M. Güden, “The
Investigation of the Dynamic Deformation Behaviour of a 304L Steel Plate with
Direct-Pressure Pulse Experiments,” presented at the 11th International Conference
on Advances in Experimental Mechanics, Exeter, London, 2016.
mla: Tasdemirci, Alper, et al. The Investigation of the Dynamic Deformation Behaviour
of a 304L Steel Plate with Direct-Pressure Pulse Experiments. The British
Society for Strain Measurement, 2016.
short: 'A. Tasdemirci, F. Tüzgel, E. Güzel, E.F. Akbulut Irmak, M. Güden, in: The
British Society for Strain Measurement, 2016.'
conference:
end_date: 2016-09-07
location: Exeter, London
name: 11th International Conference on Advances in Experimental Mechanics
start_date: 2016-09-05
date_created: 2020-02-21T15:40:18Z
date_updated: 2022-01-06T06:52:41Z
department:
- _id: '9'
- _id: '321'
- _id: '149'
extern: '1'
language:
- iso: eng
publisher: The British Society for Strain Measurement
status: public
title: The Investigation of the Dynamic Deformation Behaviour of a 304L Steel Plate
with Direct-Pressure Pulse Experiments
type: conference
user_id: '72008'
year: '2016'
...