@inproceedings{17706,
  author       = {{Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}},
  booktitle    = {{2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}},
  isbn         = {{9781728160498}},
  title        = {{{Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}}},
  doi          = {{10.1109/eurosime48426.2020.9152679}},
  year         = {{2020}},
}