[{"publication_identifier":{"isbn":["9781728160498"]},"publication_status":"published","citation":{"chicago":"Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” In <i>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</i>, 2020. <a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">https://doi.org/10.1109/eurosime48426.2020.9152679</a>.","ieee":"R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” 2020, doi: <a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">10.1109/eurosime48426.2020.9152679</a>.","ama":"Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. In: <i>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</i>. ; 2020. doi:<a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">10.1109/eurosime48426.2020.9152679</a>","apa":"Schemmel, R., Krieger, V., Hemsel, T., &#38; Sextro, W. (2020). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</i>. <a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">https://doi.org/10.1109/eurosime48426.2020.9152679</a>","bibtex":"@inproceedings{Schemmel_Krieger_Hemsel_Sextro_2020, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, DOI={<a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">10.1109/eurosime48426.2020.9152679</a>}, booktitle={2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2020} }","mla":"Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” <i>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</i>, 2020, doi:<a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">10.1109/eurosime48426.2020.9152679</a>.","short":"R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020."},"year":"2020","date_created":"2020-08-07T09:49:17Z","author":[{"full_name":"Schemmel, Reinhard","id":"28647","last_name":"Schemmel","first_name":"Reinhard"},{"first_name":"Viktor","last_name":"Krieger","full_name":"Krieger, Viktor"},{"full_name":"Hemsel, Tobias","id":"210","last_name":"Hemsel","first_name":"Tobias"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"}],"date_updated":"2023-09-21T14:16:41Z","doi":"10.1109/eurosime48426.2020.9152679","title":"Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization","publication":"2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","type":"conference","status":"public","department":[{"_id":"151"}],"user_id":"210","_id":"17706","language":[{"iso":"eng"}]}]