---
_id: '17706'
author:
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Viktor
  full_name: Krieger, Viktor
  last_name: Krieger
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS
    for ultrasonic wire bonding process optimization. In: <i>2020 21st International
    Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments
    in Microelectronics and Microsystems (EuroSimE)</i>. ; 2020. doi:<a href="https://doi.org/10.1109/eurosime48426.2020.9152679">10.1109/eurosime48426.2020.9152679</a>'
  apa: Schemmel, R., Krieger, V., Hemsel, T., &#38; Sextro, W. (2020). Co-simulation
    of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>2020
    21st International Conference on Thermal, Mechanical and Multi-Physics Simulation
    and Experiments in Microelectronics and Microsystems (EuroSimE)</i>. <a href="https://doi.org/10.1109/eurosime48426.2020.9152679">https://doi.org/10.1109/eurosime48426.2020.9152679</a>
  bibtex: '@inproceedings{Schemmel_Krieger_Hemsel_Sextro_2020, title={Co-simulation
    of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, DOI={<a
    href="https://doi.org/10.1109/eurosime48426.2020.9152679">10.1109/eurosime48426.2020.9152679</a>},
    booktitle={2020 21st International Conference on Thermal, Mechanical and Multi-Physics
    Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, author={Schemmel,
    Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2020}
    }'
  chicago: Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation
    of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” In <i>2020
    21st International Conference on Thermal, Mechanical and Multi-Physics Simulation
    and Experiments in Microelectronics and Microsystems (EuroSimE)</i>, 2020. <a
    href="https://doi.org/10.1109/eurosime48426.2020.9152679">https://doi.org/10.1109/eurosime48426.2020.9152679</a>.
  ieee: 'R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB
    and ANSYS for ultrasonic wire bonding process optimization,” 2020, doi: <a href="https://doi.org/10.1109/eurosime48426.2020.9152679">10.1109/eurosime48426.2020.9152679</a>.'
  mla: Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic
    Wire Bonding Process Optimization.” <i>2020 21st International Conference on Thermal,
    Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
    Microsystems (EuroSimE)</i>, 2020, doi:<a href="https://doi.org/10.1109/eurosime48426.2020.9152679">10.1109/eurosime48426.2020.9152679</a>.
  short: 'R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International
    Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments
    in Microelectronics and Microsystems (EuroSimE), 2020.'
date_created: 2020-08-07T09:49:17Z
date_updated: 2023-09-21T14:16:41Z
department:
- _id: '151'
doi: 10.1109/eurosime48426.2020.9152679
language:
- iso: eng
publication: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics
  Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
publication_identifier:
  isbn:
  - '9781728160498'
publication_status: published
status: public
title: Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
type: conference
user_id: '210'
year: '2020'
...