@article{21436,
  abstract     = {{Ultrasonic wire bonding is a solid-state joining process, used in the electronics industry to form electrical connections, e.g. to connect electrical terminals within semiconductor modules. Many process parameters affect the bond strength, such like the bond normal force, ultrasonic power, wire material and bonding frequency. Today, process design, development, and optimization is most likely based on the knowledge of process engineers and is mainly performed by experimental testing. In this contribution, a newly developed simulation tool is presented, to reduce time and costs and efficiently determine optimized process parameter. Based on a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire bonding process are considered using finite element simulation for the complex plastic deformation of the wire and reduced order models for the transient dynamics of the transducer, wire, substrate and bond formation. The model parameters such as the coefficients of friction between bond tool and wire and between wire and substrate were determined for aluminium and copper wire in experiments with a test rig specially developed for the requirements of heavy wire bonding. To reduce simulation time, for the finite element simulation a restart analysis and high performance computing is utilized. Detailed analysis of the bond formation showed, that the normal pressure distribution in the contact between wire and substrate has high impact on bond formation and distribution of welded areas in the contact area.}},
  author       = {{Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}},
  issn         = {{0026-2714}},
  journal      = {{Microelectronics Reliability}},
  keywords     = {{Ultrasonic heavy wire bonding, Co-simulation, ANSYS, MATLAB, Process optimization, Friction coefficient, Copper-copper, Aluminium-copper}},
  pages        = {{114077}},
  title        = {{{Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}}},
  doi          = {{https://doi.org/10.1016/j.microrel.2021.114077}},
  volume       = {{119}},
  year         = {{2021}},
}

@article{3585,
  abstract     = {{Existing approaches and tools for the generation of approximate circuits often lack generality and are restricted to certain circuit types, approximation techniques, and quality assurance methods. Moreover, only few tools are publicly available. This hinders the development and evaluation of new techniques for approximating circuits and their comparison to previous approaches. In this paper, we first analyze and classify related approaches and then present CIRCA, our flexible framework for search-based approximate circuit generation. CIRCA is developed with a focus on modularity and extensibility. We present the architecture of CIRCA with its clear separation into stages and functional blocks, report on the current prototype, and show initial experiments.}},
  author       = {{Witschen, Linus Matthias and Wiersema, Tobias and Ghasemzadeh Mohammadi, Hassan and Awais, Muhammad and Platzner, Marco}},
  issn         = {{0026-2714}},
  journal      = {{Microelectronics Reliability}},
  keywords     = {{Approximate Computing, Framework, Pareto Front, Accuracy}},
  pages        = {{277--290}},
  publisher    = {{Elsevier}},
  title        = {{{CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit Generation}}},
  doi          = {{10.1016/j.microrel.2019.04.003}},
  volume       = {{99}},
  year         = {{2019}},
}

@article{39483,
  author       = {{Vidor, F.F. and Wirth, G.I. and Hilleringmann, Ulrich}},
  issn         = {{0026-2714}},
  journal      = {{Microelectronics Reliability}},
  keywords     = {{Electrical and Electronic Engineering, Surfaces, Coatings and Films, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials}},
  number       = {{12}},
  pages        = {{2760--2765}},
  publisher    = {{Elsevier BV}},
  title        = {{{Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics}}},
  doi          = {{10.1016/j.microrel.2014.07.147}},
  volume       = {{54}},
  year         = {{2014}},
}