[{"department":[{"_id":"151"}],"user_id":"210","_id":"21436","language":[{"iso":"eng"}],"keyword":["Ultrasonic heavy wire bonding","Co-simulation","ANSYS","MATLAB","Process optimization","Friction coefficient","Copper-copper","Aluminium-copper"],"publication":"Microelectronics Reliability","type":"journal_article","status":"public","abstract":[{"text":"Ultrasonic wire bonding is a solid-state joining process, used in the electronics industry to form electrical connections, e.g. to connect electrical terminals within semiconductor modules. Many process parameters affect the bond strength, such like the bond normal force, ultrasonic power, wire material and bonding frequency. Today, process design, development, and optimization is most likely based on the knowledge of process engineers and is mainly performed by experimental testing. In this contribution, a newly developed simulation tool is presented, to reduce time and costs and efficiently determine optimized process parameter. Based on a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire bonding process are considered using finite element simulation for the complex plastic deformation of the wire and reduced order models for the transient dynamics of the transducer, wire, substrate and bond formation. The model parameters such as the coefficients of friction between bond tool and wire and between wire and substrate were determined for aluminium and copper wire in experiments with a test rig specially developed for the requirements of heavy wire bonding. To reduce simulation time, for the finite element simulation a restart analysis and high performance computing is utilized. Detailed analysis of the bond formation showed, that the normal pressure distribution in the contact between wire and substrate has high impact on bond formation and distribution of welded areas in the contact area.","lang":"eng"}],"volume":119,"author":[{"last_name":"Schemmel","full_name":"Schemmel, Reinhard","id":"28647","first_name":"Reinhard"},{"first_name":"Viktor","last_name":"Krieger","full_name":"Krieger, Viktor"},{"first_name":"Tobias","last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"}],"date_created":"2021-03-10T09:37:02Z","date_updated":"2023-09-21T14:15:33Z","doi":"https://doi.org/10.1016/j.microrel.2021.114077","title":"Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization","publication_identifier":{"issn":["0026-2714"]},"quality_controlled":"1","publication_status":"published","page":"114077","intvolume":"       119","citation":{"apa":"Schemmel, R., Krieger, V., Hemsel, T., &#38; Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>Microelectronics Reliability</i>, <i>119</i>, 114077. <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>","bibtex":"@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>}, journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }","short":"R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.","mla":"Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” <i>Microelectronics Reliability</i>, vol. 119, 2021, p. 114077, doi:<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>.","ama":"Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>Microelectronics Reliability</i>. 2021;119:114077. doi:<a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>","chicago":"Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” <i>Microelectronics Reliability</i> 119 (2021): 114077. <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>.","ieee":"R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” <i>Microelectronics Reliability</i>, vol. 119, p. 114077, 2021, doi: <a href=\"https://doi.org/10.1016/j.microrel.2021.114077\">https://doi.org/10.1016/j.microrel.2021.114077</a>."},"year":"2021"},{"keyword":["Approximate Computing","Framework","Pareto Front","Accuracy"],"language":[{"iso":"eng"}],"publication":"Microelectronics Reliability","abstract":[{"lang":"eng","text":"Existing approaches and tools for the generation of approximate circuits often lack generality and are restricted to certain circuit types, approximation techniques, and quality assurance methods. Moreover, only few tools are publicly available. This hinders the development and evaluation of new techniques for approximating circuits and their comparison to previous approaches. In this paper, we first analyze and classify related approaches and then present CIRCA, our flexible framework for search-based approximate circuit generation. CIRCA is developed with a focus on modularity and extensibility. We present the architecture of CIRCA with its clear separation into stages and functional blocks, report on the current prototype, and show initial experiments."}],"publisher":"Elsevier","date_created":"2018-07-20T14:08:49Z","title":"CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit Generation","year":"2019","_id":"3585","project":[{"_id":"12","name":"SFB 901 - Subproject B4"},{"name":"SFB 901","_id":"1"},{"_id":"3","name":"SFB 901 - Project Area B"},{"_id":"52","name":"Computing Resources Provided by the Paderborn Center for Parallel Computing"}],"department":[{"_id":"78"}],"user_id":"49051","type":"journal_article","status":"public","date_updated":"2022-01-06T06:59:25Z","volume":99,"author":[{"first_name":"Linus Matthias","last_name":"Witschen","id":"49051","full_name":"Witschen, Linus Matthias"},{"last_name":"Wiersema","id":"3118","full_name":"Wiersema, Tobias","first_name":"Tobias"},{"first_name":"Hassan","last_name":"Ghasemzadeh Mohammadi","id":"61186","full_name":"Ghasemzadeh Mohammadi, Hassan"},{"first_name":"Muhammad","id":"64665","full_name":"Awais, Muhammad","orcid":"https://orcid.org/0000-0003-4148-2969","last_name":"Awais"},{"id":"398","full_name":"Platzner, Marco","last_name":"Platzner","first_name":"Marco"}],"doi":"10.1016/j.microrel.2019.04.003","publication_identifier":{"issn":["0026-2714"]},"publication_status":"published","intvolume":"        99","page":"277-290","citation":{"apa":"Witschen, L. M., Wiersema, T., Ghasemzadeh Mohammadi, H., Awais, M., &#38; Platzner, M. (2019). CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit Generation. <i>Microelectronics Reliability</i>, <i>99</i>, 277–290. <a href=\"https://doi.org/10.1016/j.microrel.2019.04.003\">https://doi.org/10.1016/j.microrel.2019.04.003</a>","short":"L.M. Witschen, T. Wiersema, H. Ghasemzadeh Mohammadi, M. Awais, M. Platzner, Microelectronics Reliability 99 (2019) 277–290.","bibtex":"@article{Witschen_Wiersema_Ghasemzadeh Mohammadi_Awais_Platzner_2019, title={CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit Generation}, volume={99}, DOI={<a href=\"https://doi.org/10.1016/j.microrel.2019.04.003\">10.1016/j.microrel.2019.04.003</a>}, journal={Microelectronics Reliability}, publisher={Elsevier}, author={Witschen, Linus Matthias and Wiersema, Tobias and Ghasemzadeh Mohammadi, Hassan and Awais, Muhammad and Platzner, Marco}, year={2019}, pages={277–290} }","mla":"Witschen, Linus Matthias, et al. “CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit Generation.” <i>Microelectronics Reliability</i>, vol. 99, Elsevier, 2019, pp. 277–90, doi:<a href=\"https://doi.org/10.1016/j.microrel.2019.04.003\">10.1016/j.microrel.2019.04.003</a>.","ama":"Witschen LM, Wiersema T, Ghasemzadeh Mohammadi H, Awais M, Platzner M. CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit Generation. <i>Microelectronics Reliability</i>. 2019;99:277-290. doi:<a href=\"https://doi.org/10.1016/j.microrel.2019.04.003\">10.1016/j.microrel.2019.04.003</a>","ieee":"L. M. Witschen, T. Wiersema, H. Ghasemzadeh Mohammadi, M. Awais, and M. Platzner, “CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit Generation,” <i>Microelectronics Reliability</i>, vol. 99, pp. 277–290, 2019.","chicago":"Witschen, Linus Matthias, Tobias Wiersema, Hassan Ghasemzadeh Mohammadi, Muhammad Awais, and Marco Platzner. “CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit Generation.” <i>Microelectronics Reliability</i> 99 (2019): 277–90. <a href=\"https://doi.org/10.1016/j.microrel.2019.04.003\">https://doi.org/10.1016/j.microrel.2019.04.003</a>."}},{"doi":"10.1016/j.microrel.2014.07.147","title":"Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics","volume":54,"author":[{"first_name":"F.F.","full_name":"Vidor, F.F.","last_name":"Vidor"},{"first_name":"G.I.","last_name":"Wirth","full_name":"Wirth, G.I."},{"first_name":"Ulrich","last_name":"Hilleringmann","id":"20179","full_name":"Hilleringmann, Ulrich"}],"date_created":"2023-01-24T11:25:42Z","date_updated":"2023-03-22T10:15:06Z","publisher":"Elsevier BV","intvolume":"        54","page":"2760-2765","citation":{"chicago":"Vidor, F.F., G.I. Wirth, and Ulrich Hilleringmann. “Low Temperature Fabrication of a ZnO Nanoparticle Thin-Film Transistor Suitable for Flexible Electronics.” <i>Microelectronics Reliability</i> 54, no. 12 (2014): 2760–65. <a href=\"https://doi.org/10.1016/j.microrel.2014.07.147\">https://doi.org/10.1016/j.microrel.2014.07.147</a>.","ieee":"F. F. Vidor, G. I. Wirth, and U. Hilleringmann, “Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics,” <i>Microelectronics Reliability</i>, vol. 54, no. 12, pp. 2760–2765, 2014, doi: <a href=\"https://doi.org/10.1016/j.microrel.2014.07.147\">10.1016/j.microrel.2014.07.147</a>.","ama":"Vidor FF, Wirth GI, Hilleringmann U. Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics. <i>Microelectronics Reliability</i>. 2014;54(12):2760-2765. doi:<a href=\"https://doi.org/10.1016/j.microrel.2014.07.147\">10.1016/j.microrel.2014.07.147</a>","short":"F.F. Vidor, G.I. Wirth, U. Hilleringmann, Microelectronics Reliability 54 (2014) 2760–2765.","bibtex":"@article{Vidor_Wirth_Hilleringmann_2014, title={Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics}, volume={54}, DOI={<a href=\"https://doi.org/10.1016/j.microrel.2014.07.147\">10.1016/j.microrel.2014.07.147</a>}, number={12}, journal={Microelectronics Reliability}, publisher={Elsevier BV}, author={Vidor, F.F. and Wirth, G.I. and Hilleringmann, Ulrich}, year={2014}, pages={2760–2765} }","mla":"Vidor, F. F., et al. “Low Temperature Fabrication of a ZnO Nanoparticle Thin-Film Transistor Suitable for Flexible Electronics.” <i>Microelectronics Reliability</i>, vol. 54, no. 12, Elsevier BV, 2014, pp. 2760–65, doi:<a href=\"https://doi.org/10.1016/j.microrel.2014.07.147\">10.1016/j.microrel.2014.07.147</a>.","apa":"Vidor, F. F., Wirth, G. I., &#38; Hilleringmann, U. (2014). Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics. <i>Microelectronics Reliability</i>, <i>54</i>(12), 2760–2765. <a href=\"https://doi.org/10.1016/j.microrel.2014.07.147\">https://doi.org/10.1016/j.microrel.2014.07.147</a>"},"year":"2014","issue":"12","publication_identifier":{"issn":["0026-2714"]},"publication_status":"published","language":[{"iso":"eng"}],"keyword":["Electrical and Electronic Engineering","Surfaces","Coatings and Films","Safety","Risk","Reliability and Quality","Condensed Matter Physics","Atomic and Molecular Physics","and Optics","Electronic","Optical and Magnetic Materials"],"department":[{"_id":"59"}],"user_id":"20179","_id":"39483","status":"public","publication":"Microelectronics Reliability","type":"journal_article"}]