---
_id: '21436'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a solid-state joining process, used in the electronics
industry to form electrical connections, e.g. to connect electrical terminals
within semiconductor modules. Many process parameters affect the bond strength,
such like the bond normal force, ultrasonic power, wire material and bonding frequency.
Today, process design, development, and optimization is most likely based on the
knowledge of process engineers and is mainly performed by experimental testing.
In this contribution, a newly developed simulation tool is presented, to reduce
time and costs and efficiently determine optimized process parameter. Based on
a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire
bonding process are considered using finite element simulation for the complex
plastic deformation of the wire and reduced order models for the transient dynamics
of the transducer, wire, substrate and bond formation. The model parameters such
as the coefficients of friction between bond tool and wire and between wire and
substrate were determined for aluminium and copper wire in experiments with a
test rig specially developed for the requirements of heavy wire bonding. To reduce
simulation time, for the finite element simulation a restart analysis and high
performance computing is utilized. Detailed analysis of the bond formation showed,
that the normal pressure distribution in the contact between wire and substrate
has high impact on bond formation and distribution of welded areas in the contact
area.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Viktor
full_name: Krieger, Viktor
last_name: Krieger
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS
for ultrasonic wire bonding process optimization. Microelectronics Reliability.
2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
apa: Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation
of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics
Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
bibtex: '@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077},
journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger,
Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }'
chicago: 'Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro.
“Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”
Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.'
ieee: 'R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics
Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.'
mla: Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic
Wire Bonding Process Optimization.” Microelectronics Reliability, vol.
119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
short: R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability
119 (2021) 114077.
date_created: 2021-03-10T09:37:02Z
date_updated: 2023-09-21T14:15:33Z
department:
- _id: '151'
doi: https://doi.org/10.1016/j.microrel.2021.114077
intvolume: ' 119'
keyword:
- Ultrasonic heavy wire bonding
- Co-simulation
- ANSYS
- MATLAB
- Process optimization
- Friction coefficient
- Copper-copper
- Aluminium-copper
language:
- iso: eng
page: '114077'
publication: Microelectronics Reliability
publication_identifier:
issn:
- 0026-2714
publication_status: published
quality_controlled: '1'
status: public
title: Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
type: journal_article
user_id: '210'
volume: 119
year: '2021'
...
---
_id: '3585'
abstract:
- lang: eng
text: Existing approaches and tools for the generation of approximate circuits often
lack generality and are restricted to certain circuit types, approximation techniques,
and quality assurance methods. Moreover, only few tools are publicly available.
This hinders the development and evaluation of new techniques for approximating
circuits and their comparison to previous approaches. In this paper, we first analyze
and classify related approaches and then present CIRCA, our flexible framework
for search-based approximate circuit generation. CIRCA is developed with a focus
on modularity and extensibility. We present the architecture of CIRCA with its
clear separation into stages and functional blocks, report on the current prototype,
and show initial experiments.
author:
- first_name: Linus Matthias
full_name: Witschen, Linus Matthias
id: '49051'
last_name: Witschen
- first_name: Tobias
full_name: Wiersema, Tobias
id: '3118'
last_name: Wiersema
- first_name: Hassan
full_name: Ghasemzadeh Mohammadi, Hassan
id: '61186'
last_name: Ghasemzadeh Mohammadi
- first_name: Muhammad
full_name: Awais, Muhammad
id: '64665'
last_name: Awais
orcid: https://orcid.org/0000-0003-4148-2969
- first_name: Marco
full_name: Platzner, Marco
id: '398'
last_name: Platzner
citation:
ama: 'Witschen LM, Wiersema T, Ghasemzadeh Mohammadi H, Awais M, Platzner M. CIRCA:
Towards a Modular and Extensible Framework for Approximate Circuit Generation.
Microelectronics Reliability. 2019;99:277-290. doi:10.1016/j.microrel.2019.04.003'
apa: 'Witschen, L. M., Wiersema, T., Ghasemzadeh Mohammadi, H., Awais, M., &
Platzner, M. (2019). CIRCA: Towards a Modular and Extensible Framework for Approximate
Circuit Generation. Microelectronics Reliability, 99, 277–290. https://doi.org/10.1016/j.microrel.2019.04.003'
bibtex: '@article{Witschen_Wiersema_Ghasemzadeh Mohammadi_Awais_Platzner_2019, title={CIRCA:
Towards a Modular and Extensible Framework for Approximate Circuit Generation},
volume={99}, DOI={10.1016/j.microrel.2019.04.003},
journal={Microelectronics Reliability}, publisher={Elsevier}, author={Witschen,
Linus Matthias and Wiersema, Tobias and Ghasemzadeh Mohammadi, Hassan and Awais,
Muhammad and Platzner, Marco}, year={2019}, pages={277–290} }'
chicago: 'Witschen, Linus Matthias, Tobias Wiersema, Hassan Ghasemzadeh Mohammadi,
Muhammad Awais, and Marco Platzner. “CIRCA: Towards a Modular and Extensible Framework
for Approximate Circuit Generation.” Microelectronics Reliability 99 (2019):
277–90. https://doi.org/10.1016/j.microrel.2019.04.003.'
ieee: 'L. M. Witschen, T. Wiersema, H. Ghasemzadeh Mohammadi, M. Awais, and M. Platzner,
“CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit Generation,”
Microelectronics Reliability, vol. 99, pp. 277–290, 2019.'
mla: 'Witschen, Linus Matthias, et al. “CIRCA: Towards a Modular and Extensible
Framework for Approximate Circuit Generation.” Microelectronics Reliability,
vol. 99, Elsevier, 2019, pp. 277–90, doi:10.1016/j.microrel.2019.04.003.'
short: L.M. Witschen, T. Wiersema, H. Ghasemzadeh Mohammadi, M. Awais, M. Platzner,
Microelectronics Reliability 99 (2019) 277–290.
date_created: 2018-07-20T14:08:49Z
date_updated: 2022-01-06T06:59:25Z
department:
- _id: '78'
doi: 10.1016/j.microrel.2019.04.003
intvolume: ' 99'
keyword:
- Approximate Computing
- Framework
- Pareto Front
- Accuracy
language:
- iso: eng
page: 277-290
project:
- _id: '12'
name: SFB 901 - Subproject B4
- _id: '1'
name: SFB 901
- _id: '3'
name: SFB 901 - Project Area B
- _id: '52'
name: Computing Resources Provided by the Paderborn Center for Parallel Computing
publication: Microelectronics Reliability
publication_identifier:
issn:
- 0026-2714
publication_status: published
publisher: Elsevier
status: public
title: 'CIRCA: Towards a Modular and Extensible Framework for Approximate Circuit
Generation'
type: journal_article
user_id: '49051'
volume: 99
year: '2019'
...
---
_id: '39483'
author:
- first_name: F.F.
full_name: Vidor, F.F.
last_name: Vidor
- first_name: G.I.
full_name: Wirth, G.I.
last_name: Wirth
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
id: '20179'
last_name: Hilleringmann
citation:
ama: Vidor FF, Wirth GI, Hilleringmann U. Low temperature fabrication of a ZnO nanoparticle
thin-film transistor suitable for flexible electronics. Microelectronics Reliability.
2014;54(12):2760-2765. doi:10.1016/j.microrel.2014.07.147
apa: Vidor, F. F., Wirth, G. I., & Hilleringmann, U. (2014). Low temperature
fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics.
Microelectronics Reliability, 54(12), 2760–2765. https://doi.org/10.1016/j.microrel.2014.07.147
bibtex: '@article{Vidor_Wirth_Hilleringmann_2014, title={Low temperature fabrication
of a ZnO nanoparticle thin-film transistor suitable for flexible electronics},
volume={54}, DOI={10.1016/j.microrel.2014.07.147},
number={12}, journal={Microelectronics Reliability}, publisher={Elsevier BV},
author={Vidor, F.F. and Wirth, G.I. and Hilleringmann, Ulrich}, year={2014}, pages={2760–2765}
}'
chicago: 'Vidor, F.F., G.I. Wirth, and Ulrich Hilleringmann. “Low Temperature Fabrication
of a ZnO Nanoparticle Thin-Film Transistor Suitable for Flexible Electronics.”
Microelectronics Reliability 54, no. 12 (2014): 2760–65. https://doi.org/10.1016/j.microrel.2014.07.147.'
ieee: 'F. F. Vidor, G. I. Wirth, and U. Hilleringmann, “Low temperature fabrication
of a ZnO nanoparticle thin-film transistor suitable for flexible electronics,”
Microelectronics Reliability, vol. 54, no. 12, pp. 2760–2765, 2014, doi:
10.1016/j.microrel.2014.07.147.'
mla: Vidor, F. F., et al. “Low Temperature Fabrication of a ZnO Nanoparticle Thin-Film
Transistor Suitable for Flexible Electronics.” Microelectronics Reliability,
vol. 54, no. 12, Elsevier BV, 2014, pp. 2760–65, doi:10.1016/j.microrel.2014.07.147.
short: F.F. Vidor, G.I. Wirth, U. Hilleringmann, Microelectronics Reliability 54
(2014) 2760–2765.
date_created: 2023-01-24T11:25:42Z
date_updated: 2023-03-22T10:15:06Z
department:
- _id: '59'
doi: 10.1016/j.microrel.2014.07.147
intvolume: ' 54'
issue: '12'
keyword:
- Electrical and Electronic Engineering
- Surfaces
- Coatings and Films
- Safety
- Risk
- Reliability and Quality
- Condensed Matter Physics
- Atomic and Molecular Physics
- and Optics
- Electronic
- Optical and Magnetic Materials
language:
- iso: eng
page: 2760-2765
publication: Microelectronics Reliability
publication_identifier:
issn:
- 0026-2714
publication_status: published
publisher: Elsevier BV
status: public
title: Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable
for flexible electronics
type: journal_article
user_id: '20179'
volume: 54
year: '2014'
...