[{"date_updated":"2022-01-06T06:54:03Z","_id":"19381","doi":"10.11618/adhesion.51.227","language":[{"iso":"eng"}],"type":"journal_article","year":"2015","citation":{"bibtex":"@article{Teutenberg_Meschut_Hahn_Schlimmer_Kuehlmeyer_Matzenmiller_2015, title={Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes}, DOI={10.11618/adhesion.51.227}, journal={Journal of The Adhesion Society of Japan}, author={Teutenberg, Dominik and Meschut, Gerson and Hahn, O and Schlimmer, M and Kuehlmeyer, P and Matzenmiller, A}, year={2015}, pages={227–228} }","mla":"Teutenberg, Dominik, et al. “Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-Curing Processes.” Journal of The Adhesion Society of Japan, 2015, pp. 227–28, doi:10.11618/adhesion.51.227.","ama":"Teutenberg D, Meschut G, Hahn O, Schlimmer M, Kuehlmeyer P, Matzenmiller A. Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes. Journal of The Adhesion Society of Japan. 2015:227-228. doi:10.11618/adhesion.51.227","apa":"Teutenberg, D., Meschut, G., Hahn, O., Schlimmer, M., Kuehlmeyer, P., & Matzenmiller, A. (2015). Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes. Journal of The Adhesion Society of Japan, 227–228. https://doi.org/10.11618/adhesion.51.227","chicago":"Teutenberg, Dominik, Gerson Meschut, O Hahn, M Schlimmer, P Kuehlmeyer, and A Matzenmiller. “Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-Curing Processes.” Journal of The Adhesion Society of Japan, 2015, 227–28. https://doi.org/10.11618/adhesion.51.227.","ieee":"D. Teutenberg, G. Meschut, O. Hahn, M. Schlimmer, P. Kuehlmeyer, and A. Matzenmiller, “Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes,” Journal of The Adhesion Society of Japan, pp. 227–228, 2015.","short":"D. Teutenberg, G. Meschut, O. Hahn, M. Schlimmer, P. Kuehlmeyer, A. Matzenmiller, Journal of The Adhesion Society of Japan (2015) 227–228."},"page":"227-228","user_id":"537","title":"Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes","author":[{"last_name":"Teutenberg","id":"537","first_name":"Dominik","full_name":"Teutenberg, Dominik"},{"first_name":"Gerson","orcid":"0000-0002-2763-1246","full_name":"Meschut, Gerson","last_name":"Meschut","id":"32056"},{"full_name":"Hahn, O","first_name":"O","last_name":"Hahn"},{"last_name":"Schlimmer","first_name":"M","full_name":"Schlimmer, M"},{"last_name":"Kuehlmeyer","full_name":"Kuehlmeyer, P","first_name":"P"},{"last_name":"Matzenmiller","full_name":"Matzenmiller, A","first_name":"A"}],"publication":"Journal of The Adhesion Society of Japan","status":"public","date_created":"2020-09-14T12:28:04Z","publication_status":"published","publication_identifier":{"issn":["0916-4812","2187-4816"]}}]