---
_id: '29351'
abstract:
- lang: eng
  text: Safety-critical systems have to follow extremely high dependability requirements
    as specified in the standards for automotive, air, and space applications. The
    required high fault coverage at runtime is usually obtained by a combination of
    concurrent error detection or correction and periodic tests within rather short
    time intervals. The concurrent scheme ensures the integrity of computed results
    while the periodic test has to identify potential aging problems and to prevent
    any fault accumulation which may invalidate the concurrent error detection mechanism.
    Such periodic built-in self-test (BIST) schemes are already commercialized for
    memories and for random logic. The paper at hand extends this approach to interconnect
    structures. A BIST scheme is presented which targets interconnect defects before
    they will actually affect the system functionality at nominal speed. A BIST schedule
    is developed which significantly reduces aging caused by electromigration during
    the lifetime application of the periodic test.
article_type: original
author:
- first_name: Somayeh
  full_name: Sadeghi-Kohan, Somayeh
  id: '78614'
  last_name: Sadeghi-Kohan
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
- first_name: Hans-Joachim
  full_name: Wunderlich, Hans-Joachim
  last_name: Wunderlich
citation:
  ama: Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. Stress-Aware Periodic Test of
    Interconnects. <i>Journal of Electronic Testing</i>. Published online 2022. doi:<a
    href="https://doi.org/10.1007/s10836-021-05979-5">10.1007/s10836-021-05979-5</a>
  apa: Sadeghi-Kohan, S., Hellebrand, S., &#38; Wunderlich, H.-J. (2022). Stress-Aware
    Periodic Test of Interconnects. <i>Journal of Electronic Testing</i>. <a href="https://doi.org/10.1007/s10836-021-05979-5">https://doi.org/10.1007/s10836-021-05979-5</a>
  bibtex: '@article{Sadeghi-Kohan_Hellebrand_Wunderlich_2022, title={Stress-Aware
    Periodic Test of Interconnects}, DOI={<a href="https://doi.org/10.1007/s10836-021-05979-5">10.1007/s10836-021-05979-5</a>},
    journal={Journal of Electronic Testing}, publisher={Springer Science and Business
    Media LLC}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille and Wunderlich,
    Hans-Joachim}, year={2022} }'
  chicago: Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich.
    “Stress-Aware Periodic Test of Interconnects.” <i>Journal of Electronic Testing</i>,
    2022. <a href="https://doi.org/10.1007/s10836-021-05979-5">https://doi.org/10.1007/s10836-021-05979-5</a>.
  ieee: 'S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, “Stress-Aware Periodic
    Test of Interconnects,” <i>Journal of Electronic Testing</i>, 2022, doi: <a href="https://doi.org/10.1007/s10836-021-05979-5">10.1007/s10836-021-05979-5</a>.'
  mla: Sadeghi-Kohan, Somayeh, et al. “Stress-Aware Periodic Test of Interconnects.”
    <i>Journal of Electronic Testing</i>, Springer Science and Business Media LLC,
    2022, doi:<a href="https://doi.org/10.1007/s10836-021-05979-5">10.1007/s10836-021-05979-5</a>.
  short: S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, Journal of Electronic
    Testing (2022).
date_created: 2022-01-14T11:16:34Z
date_updated: 2022-05-11T16:10:01Z
department:
- _id: '48'
doi: 10.1007/s10836-021-05979-5
keyword:
- Electrical and Electronic Engineering
language:
- iso: eng
publication: Journal of Electronic Testing
publication_identifier:
  issn:
  - 0923-8174
  - 1573-0727
publication_status: published
publisher: Springer Science and Business Media LLC
status: public
title: Stress-Aware Periodic Test of Interconnects
type: journal_article
user_id: '209'
year: '2022'
...