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Memory Carousel: LLVM-Based Bitwise Wear Leveling for Nonvolatile Main Memory. <i>IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems</i>. 2022;42(8):2527-2539. doi:<a href=\"https://doi.org/10.1109/tcad.2022.3228897\">10.1109/tcad.2022.3228897</a>","bibtex":"@article{Hölscher_Hakert_Nassar_Chen_Bauer_Chen_Henkel_2022, title={Memory Carousel: LLVM-Based Bitwise Wear Leveling for Nonvolatile Main Memory}, volume={42}, DOI={<a href=\"https://doi.org/10.1109/tcad.2022.3228897\">10.1109/tcad.2022.3228897</a>}, number={8}, journal={IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Hölscher, Nils and Hakert, Christian and Nassar, Hassan and Chen, Kuan-Hsun and Bauer, Lars and Chen, Jian-Jia and Henkel, Jörg}, year={2022}, pages={2527–2539} }"},"issue":"8","publication":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","language":[{"iso":"eng"}],"_id":"66181","publisher":"Institute of Electrical and Electronics Engineers (IEEE)","page":"2527-2539","volume":42,"user_id":"128464","doi":"10.1109/tcad.2022.3228897","author":[{"last_name":"Hölscher","first_name":"Nils","full_name":"Hölscher, Nils"},{"first_name":"Christian","last_name":"Hakert","full_name":"Hakert, Christian"},{"full_name":"Nassar, Hassan","last_name":"Nassar","first_name":"Hassan"},{"orcid":"0000-0002-7110-921X","last_name":"Chen","first_name":"Kuan-Hsun","full_name":"Chen, Kuan-Hsun","id":"128464"},{"full_name":"Bauer, Lars","first_name":"Lars","last_name":"Bauer"},{"full_name":"Chen, Jian-Jia","first_name":"Jian-Jia","last_name":"Chen"},{"first_name":"Jörg","last_name":"Henkel","full_name":"Henkel, Jörg"}],"publication_identifier":{"issn":["0278-0070","1937-4151"]},"year":"2022","status":"public","title":"Memory Carousel: LLVM-Based Bitwise Wear Leveling for Nonvolatile Main Memory","intvolume":"        42","publication_status":"published","date_updated":"2026-10-12T20:28:27Z"},{"volume":41,"doi":"10.1109/tcad.2022.3197501","user_id":"128464","language":[{"iso":"eng"}],"_id":"66201","publisher":"Institute of Electrical and Electronics Engineers (IEEE)","page":"4157-4168","intvolume":"        41","date_updated":"2026-10-12T20:31:27Z","publication_status":"published","publication_identifier":{"issn":["0278-0070","1937-4151"]},"author":[{"full_name":"Shi, Junjie","last_name":"Shi","first_name":"Junjie"},{"last_name":"von Egidy","first_name":"Christoph-Cordt","full_name":"von Egidy, Christoph-Cordt"},{"full_name":"Chen, Kuan-Hsun","orcid":"0000-0002-7110-921X","last_name":"Chen","first_name":"Kuan-Hsun","id":"128464"},{"full_name":"Chen, Jian-Jia","first_name":"Jian-Jia","last_name":"Chen"}],"year":"2022","status":"public","title":"Formal Verification of Resource Synchronization Protocol Implementations: A Case Study in RTEMS","type":"journal_article","date_created":"2026-07-03T21:17:18Z","citation":{"ieee":"J. Shi, C.-C. von Egidy, K.-H. Chen, and J.-J. Chen, “Formal Verification of Resource Synchronization Protocol Implementations: A Case Study in RTEMS,” <i>IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems</i>, vol. 41, no. 11, pp. 4157–4168, 2022, doi: <a href=\"https://doi.org/10.1109/tcad.2022.3197501\">10.1109/tcad.2022.3197501</a>.","apa":"Shi, J., von Egidy, C.-C., Chen, K.-H., &#38; Chen, J.-J. (2022). Formal Verification of Resource Synchronization Protocol Implementations: A Case Study in RTEMS. <i>IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems</i>, <i>41</i>(11), 4157–4168. <a href=\"https://doi.org/10.1109/tcad.2022.3197501\">https://doi.org/10.1109/tcad.2022.3197501</a>","short":"J. Shi, C.-C. von Egidy, K.-H. Chen, J.-J. 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Formal Verification of Resource Synchronization Protocol Implementations: A Case Study in RTEMS. <i>IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems</i>. 2022;41(11):4157-4168. doi:<a href=\"https://doi.org/10.1109/tcad.2022.3197501\">10.1109/tcad.2022.3197501</a>"},"issue":"11","publication":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"}]
