---
_id: '19381'
author:
- first_name: Dominik
  full_name: Teutenberg, Dominik
  id: '537'
  last_name: Teutenberg
- first_name: Gerson
  full_name: Meschut, Gerson
  id: '32056'
  last_name: Meschut
  orcid: 0000-0002-2763-1246
- first_name: O
  full_name: Hahn, O
  last_name: Hahn
- first_name: M
  full_name: Schlimmer, M
  last_name: Schlimmer
- first_name: P
  full_name: Kuehlmeyer, P
  last_name: Kuehlmeyer
- first_name: A
  full_name: Matzenmiller, A
  last_name: Matzenmiller
citation:
  ama: Teutenberg D, Meschut G, Hahn O, Schlimmer M, Kuehlmeyer P, Matzenmiller A.
    Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing
    Processes. <i>Journal of The Adhesion Society of Japan</i>. 2015:227-228. doi:<a
    href="https://doi.org/10.11618/adhesion.51.227">10.11618/adhesion.51.227</a>
  apa: Teutenberg, D., Meschut, G., Hahn, O., Schlimmer, M., Kuehlmeyer, P., &#38;
    Matzenmiller, A. (2015). Influence of Stress and Temperature on AdhesivelyBonded
    Joints in and After Heat-curing Processes. <i>Journal of The Adhesion Society
    of Japan</i>, 227–228. <a href="https://doi.org/10.11618/adhesion.51.227">https://doi.org/10.11618/adhesion.51.227</a>
  bibtex: '@article{Teutenberg_Meschut_Hahn_Schlimmer_Kuehlmeyer_Matzenmiller_2015,
    title={Influence of Stress and Temperature on AdhesivelyBonded Joints in and After
    Heat-curing Processes}, DOI={<a href="https://doi.org/10.11618/adhesion.51.227">10.11618/adhesion.51.227</a>},
    journal={Journal of The Adhesion Society of Japan}, author={Teutenberg, Dominik
    and Meschut, Gerson and Hahn, O and Schlimmer, M and Kuehlmeyer, P and Matzenmiller,
    A}, year={2015}, pages={227–228} }'
  chicago: Teutenberg, Dominik, Gerson Meschut, O Hahn, M Schlimmer, P Kuehlmeyer,
    and A Matzenmiller. “Influence of Stress and Temperature on AdhesivelyBonded Joints
    in and After Heat-Curing Processes.” <i>Journal of The Adhesion Society of Japan</i>,
    2015, 227–28. <a href="https://doi.org/10.11618/adhesion.51.227">https://doi.org/10.11618/adhesion.51.227</a>.
  ieee: D. Teutenberg, G. Meschut, O. Hahn, M. Schlimmer, P. Kuehlmeyer, and A. Matzenmiller,
    “Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing
    Processes,” <i>Journal of The Adhesion Society of Japan</i>, pp. 227–228, 2015.
  mla: Teutenberg, Dominik, et al. “Influence of Stress and Temperature on AdhesivelyBonded
    Joints in and After Heat-Curing Processes.” <i>Journal of The Adhesion Society
    of Japan</i>, 2015, pp. 227–28, doi:<a href="https://doi.org/10.11618/adhesion.51.227">10.11618/adhesion.51.227</a>.
  short: D. Teutenberg, G. Meschut, O. Hahn, M. Schlimmer, P. Kuehlmeyer, A. Matzenmiller,
    Journal of The Adhesion Society of Japan (2015) 227–228.
date_created: 2020-09-14T12:28:04Z
date_updated: 2022-01-06T06:54:03Z
doi: 10.11618/adhesion.51.227
language:
- iso: eng
page: 227-228
publication: Journal of The Adhesion Society of Japan
publication_identifier:
  issn:
  - 0916-4812
  - 2187-4816
publication_status: published
status: public
title: Influence of Stress and Temperature on AdhesivelyBonded Joints in and After
  Heat-curing Processes
type: journal_article
user_id: '537'
year: '2015'
...