---
_id: '39495'
author:
- first_name: Ulrich
  full_name: Hilleringmann, Ulrich
  id: '20179'
  last_name: Hilleringmann
- first_name: F.
  full_name: Assion, F.
  last_name: Assion
- first_name: F. F.
  full_name: Vidor, F. F.
  last_name: Vidor
- first_name: G. I.
  full_name: Wirth, G. I.
  last_name: Wirth
citation:
  ama: Hilleringmann U, Assion F, Vidor FF, Wirth GI. Nanometer Scale Electronic Device
    Integration Using Side-Wall Deposition and Etch-Back Technology. <i>Journal of
    Machine to Machine Communications</i>. 2015;1(3):197-214. doi:<a href="https://doi.org/10.13052/jmmc2246-137x.131">10.13052/jmmc2246-137x.131</a>
  apa: Hilleringmann, U., Assion, F., Vidor, F. F., &#38; Wirth, G. I. (2015). Nanometer
    Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology.
    <i>Journal of Machine to Machine Communications</i>, <i>1</i>(3), 197–214. <a
    href="https://doi.org/10.13052/jmmc2246-137x.131">https://doi.org/10.13052/jmmc2246-137x.131</a>
  bibtex: '@article{Hilleringmann_Assion_Vidor_Wirth_2015, title={Nanometer Scale
    Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology},
    volume={1}, DOI={<a href="https://doi.org/10.13052/jmmc2246-137x.131">10.13052/jmmc2246-137x.131</a>},
    number={3}, journal={Journal of Machine to Machine Communications}, publisher={River
    Publishers}, author={Hilleringmann, Ulrich and Assion, F. and Vidor, F. F. and
    Wirth, G. I.}, year={2015}, pages={197–214} }'
  chicago: 'Hilleringmann, Ulrich, F. Assion, F. F. Vidor, and G. I. Wirth. “Nanometer
    Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology.”
    <i>Journal of Machine to Machine Communications</i> 1, no. 3 (2015): 197–214.
    <a href="https://doi.org/10.13052/jmmc2246-137x.131">https://doi.org/10.13052/jmmc2246-137x.131</a>.'
  ieee: 'U. Hilleringmann, F. Assion, F. F. Vidor, and G. I. Wirth, “Nanometer Scale
    Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology,”
    <i>Journal of Machine to Machine Communications</i>, vol. 1, no. 3, pp. 197–214,
    2015, doi: <a href="https://doi.org/10.13052/jmmc2246-137x.131">10.13052/jmmc2246-137x.131</a>.'
  mla: Hilleringmann, Ulrich, et al. “Nanometer Scale Electronic Device Integration
    Using Side-Wall Deposition and Etch-Back Technology.” <i>Journal of Machine to
    Machine Communications</i>, vol. 1, no. 3, River Publishers, 2015, pp. 197–214,
    doi:<a href="https://doi.org/10.13052/jmmc2246-137x.131">10.13052/jmmc2246-137x.131</a>.
  short: U. Hilleringmann, F. Assion, F.F. Vidor, G.I. Wirth, Journal of Machine to
    Machine Communications 1 (2015) 197–214.
date_created: 2023-01-24T11:40:14Z
date_updated: 2023-03-22T10:11:18Z
department:
- _id: '59'
doi: 10.13052/jmmc2246-137x.131
intvolume: '         1'
issue: '3'
keyword:
- General Medicine
language:
- iso: eng
page: 197-214
publication: Journal of Machine to Machine Communications
publication_identifier:
  issn:
  - 2246-137X
publication_status: published
publisher: River Publishers
status: public
title: Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and
  Etch-Back Technology
type: journal_article
user_id: '20179'
volume: 1
year: '2015'
...