---
_id: '15412'
abstract:
- lang: eng
  text: <jats:p> Ultrasonic joining is a common industrial process. To build electrical
    connections in the electronics industry, uni-axial and torsional ultrasonic vibration
    have been used to join different types of workpieces for decades. Many influencing
    factors like ultrasonic power, bond normal force, bond duration and frequency
    are known to have a high impact on bond quality and reliability. Multi-dimensional
    bonding has been investigated in the past to increase ultrasonic power and consequently
    bond strength. This contribution is focused on the comparison of circular, multi-frequency
    planar and uniaxial vibration trajectories used for ultrasonic bonding of copper
    pins on copper substrate. Bond quality was analyzed by shear tests, scanning acoustic
    microscopy and interface cross-sections. </jats:p>
author:
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Florian
  full_name: Eacock, Florian
  last_name: Eacock
- first_name: Collin
  full_name: Dymel, Collin
  last_name: Dymel
- first_name: Tobias
  full_name: Hemsel, Tobias
  last_name: Hemsel
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Walter
  full_name: Sextro, Walter
  last_name: Sextro
citation:
  ama: 'Schemmel R, Eacock F, Dymel C, et al. Impact of multi-dimensional vibration
    trajectories on quality and failure modes in ultrasonic bonding. In: <i>International
    Symposium on Microelectronics</i>. ; 2019:509-514. doi:<a href="https://doi.org/10.4071/2380-4505-2019.1.000509">10.4071/2380-4505-2019.1.000509</a>'
  apa: Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M.,
    &#38; Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on
    quality and failure modes in ultrasonic bonding. <i>International Symposium on
    Microelectronics</i>, 509–514. <a href="https://doi.org/10.4071/2380-4505-2019.1.000509">https://doi.org/10.4071/2380-4505-2019.1.000509</a>
  bibtex: '@inproceedings{Schemmel_Eacock_Dymel_Hemsel_Hunstig_Brökelmann_Sextro_2019,
    title={Impact of multi-dimensional vibration trajectories on quality and failure
    modes in ultrasonic bonding}, DOI={<a href="https://doi.org/10.4071/2380-4505-2019.1.000509">10.4071/2380-4505-2019.1.000509</a>},
    booktitle={International Symposium on Microelectronics}, author={Schemmel, Reinhard
    and Eacock, Florian and Dymel, Collin and Hemsel, Tobias and Hunstig, Matthias
    and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={509–514} }'
  chicago: Schemmel, Reinhard, Florian Eacock, Collin Dymel, Tobias Hemsel, Matthias
    Hunstig, Michael Brökelmann, and Walter Sextro. “Impact of Multi-Dimensional Vibration
    Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” In <i>International
    Symposium on Microelectronics</i>, 509–14, 2019. <a href="https://doi.org/10.4071/2380-4505-2019.1.000509">https://doi.org/10.4071/2380-4505-2019.1.000509</a>.
  ieee: 'R. Schemmel <i>et al.</i>, “Impact of multi-dimensional vibration trajectories
    on quality and failure modes in ultrasonic bonding,” in <i>International Symposium
    on Microelectronics</i>, Boston, 2019, pp. 509–514, doi: <a href="https://doi.org/10.4071/2380-4505-2019.1.000509">10.4071/2380-4505-2019.1.000509</a>.'
  mla: Schemmel, Reinhard, et al. “Impact of Multi-Dimensional Vibration Trajectories
    on Quality and Failure Modes in Ultrasonic Bonding.” <i>International Symposium
    on Microelectronics</i>, 2019, pp. 509–14, doi:<a href="https://doi.org/10.4071/2380-4505-2019.1.000509">10.4071/2380-4505-2019.1.000509</a>.
  short: 'R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann,
    W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.'
conference:
  location: Boston
  name: International Symposium on Microelectronics
date_created: 2019-12-24T21:41:04Z
date_updated: 2023-09-21T14:28:50Z
ddc:
- '620'
department:
- _id: '151'
doi: 10.4071/2380-4505-2019.1.000509
file:
- access_level: closed
  content_type: application/pdf
  creator: schemmel
  date_created: 2019-12-24T21:43:59Z
  date_updated: 2019-12-24T21:43:59Z
  file_id: '15413'
  file_name: 2380-4505-2019.1.000509.pdf
  file_size: 1010930
  relation: main_file
  success: 1
file_date_updated: 2019-12-24T21:43:59Z
has_accepted_license: '1'
language:
- iso: eng
page: 509-514
publication: International Symposium on Microelectronics
publication_identifier:
  issn:
  - 2380-4505
publication_status: published
quality_controlled: '1'
status: public
title: Impact of multi-dimensional vibration trajectories on quality and failure modes
  in ultrasonic bonding
type: conference
user_id: '210'
year: '2019'
...