@inbook{18054, author = {{Kamin, A.-M. and Meister, Dorothee M.}}, booktitle = {{Universal Access in Human-Computer Interaction: Methods, Techniques, and Best Practices. 10th International Conference, UAHCI 2016 Held as Part of HCI International 2016 Toronto, Canada, Juli 17- 22, 2016, Proceedings, Part III}}, editor = {{Antona, M. and Stephanidis, C.}}, pages = {{82 -- 92}}, title = {{{Increasing Educational Opportunities through Digital Participation}}}, year = {{2016}}, } @inproceedings{1836, author = {{Derakhshandeh, Zahra and Gmyr, Robert and Porter, Alexandra and W. Richa, Andrea and Scheideler, Christian and Strothmann, Thim Frederik}}, booktitle = {{DNA Computing and Molecular Programming - 22nd International Conference, DNA 22, Munich, Germany, September 4-8, 2016, Proceedings}}, pages = {{148----164}}, title = {{{On the Runtime of Universal Coating for Programmable Matter}}}, doi = {{10.1007/978-3-319-43994-5_10}}, volume = {{9818}}, year = {{2016}}, } @article{22185, abstract = {{The layered structure of Additive Manufacturing processes results in a stair- stepping effect of the surface topographies. In general, the impact of this effect strongly depends on the build angle of a surface, whereas the overall surface roughness is additionally caused by the resolution of the specific AM process. The aim of this work is the prediction of the surface quality in dependence of the building orientation of a part. These results can finally be used to optimize the orientation to get a desired surface quality. As not all parts of the component surface are equally important, a preselection of areas can be used to improve the overall surface quality of relevant areas. The model uses the digital AMF format of a part. Each triangle is assigned with a roughness value and by testing different orientations the best one can be found. This approach needs a database for the surface qualities. This must be done separately for each Additive Manufacturing process and is shown exemplarily with a surface topography simulation for the laser sintering process.}}, author = {{Delfs, Patrick and Tows, Marcel and Schmid, Hans-Joachim}}, isbn = {{2214-8604}}, journal = {{Additive Manufacturing}}, number = {{12, Part B}}, pages = {{214--320}}, publisher = {{Elsevier}}, title = {{{Optimized build orientation of additive manufactured parts for improved surface quality and build time}}}, doi = {{10.1016/j.addma.2016.06.003}}, volume = {{2}}, year = {{2016}}, } @inproceedings{22404, abstract = {{Additive Manufacturing (AM), also known as 3D printing, is a relatively new technology which enables the toolless production of components and entire assemblies directly from a CAD file. Today, the technology is still not widely used in industrial production. It is mainly limited to special applications, although it shows great potential. In this paper, first approaches are shown to apply AM to the production of rotors for permanent magnet synchronous machines (PMSM). The possibilities of a lightweight design with a low moment of inertia as well as the influence on the magnetic anisotropy for an improved sensorless control of PMSM are pointed out. The results clearly demonstrate the great potential of additive manufacturing in electrical engineering applications.}}, author = {{Lammers, Stefan and Adam, Guido and Schmid, Hans-Joachim and Mrozek, Rafael and Oberacker, Rainer and Hoffmann, Michael and Quattrone, Francesco and Ponick, Bernd}}, booktitle = {{EDPC 2016}}, isbn = {{978-1-5090-2908-2}}, title = {{{Additive Manufacturing of a Lightweight Rotor for a Permanent Magnet Synchronous Machine}}}, doi = {{10.1109/EDPC.2016.7851312}}, year = {{2016}}, } @inproceedings{23044, author = {{Michael, Jan and Holtkötter, Jens and Henke, Christian and Trächtler, Ansgar}}, booktitle = {{ASIM-Treffen STS/GMMS 2016}}, pages = {{174--179}}, title = {{{Modellbildung und Simulation im Kontext des Systems Engineering}}}, year = {{2016}}, } @article{21730, author = {{Yanaka, K. and Yamanouchi, T.}}, journal = {{IEEE Computer Graphics and Applications}}, number = {{2}}, pages = {{68--73}}, publisher = {{Editors G. Domik and G. S. Owen}}, title = {{{3D Image Display Courses for Information Media Students}}}, doi = {{10.1109/MCG.2016.36}}, volume = {{36}}, year = {{2016}}, } @article{7484, author = {{Hoffmann, Sandro Phil and Albert, Maximilian and Meier, Cedrik}}, issn = {{0749-6036}}, journal = {{Superlattices and Microstructures}}, pages = {{397--408}}, publisher = {{Elsevier BV}}, title = {{{Fabrication of fully undercut ZnO-based photonic crystal membranes with 3D optical confinement}}}, doi = {{10.1016/j.spmi.2016.07.006}}, volume = {{97}}, year = {{2016}}, } @inproceedings{9955, abstract = {{Wire bonding has been an established packaging technology for decades. When introducing copper as wire material for high power applications, adaptations to the bonding process and to machines became necessary. Here, challenges occur due to the stiffer wire material and changing oxide layers on the contact partners. To achieve sufficient process stability, a clean bond area is required, which can only be achieved with high shear stresses in the contact partners surfaces. These necessitate high normal forces to plastically deform the wire and substrate. To achieve such high stresses in the contact area, the bonding tool needs to be able to transmit the needed tangential forces to the top side of the wire. The wire itself performs a shear movement and transmits the force into the contact area to clean the contaminant and oxide layers and to level the desired bond surfaces. The main function of the tool is to transmit these forces. If the bond tool can only transmit low forces in the direction of excitation, the parameter space for a stable bond process is severely restricted. Here, a modeling approach to estimate how well different tool shapes meet the demand of transmitting high tangential forces is presented. The model depends on wire deformation and thus on the ultrasonic softening effect.}}, author = {{Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian}}, booktitle = {{IEEE 66th Electronic Components and Technology Conference}}, keywords = {{finite element simulation, wire bonding, tool geometry}}, pages = {{2103--2110}}, title = {{{Shape-Dependent Transmittable Tangential Force of Wire Bond Tools}}}, doi = {{10.1109/ECTC.2016.234}}, year = {{2016}}, } @inproceedings{9958, abstract = {{The transportation of dry fine powders is an emerging technologic task, as in biotechnology, pharmaceutical or coatings industry particle sizes of processed powders are getting smaller and smaller. Fine powders are primarily defined by the fact that adhesive and cohesive forces outweigh the weight forces. This leads to mostly unwanted agglomeration (clumping) and adhesion to surfaces, what makes it more difficult to use conventional conveyor systems (e. g. pneumatic or vibratory conveyors) for transport. A rather new method for transporting these fine powders is based on ultrasonic vibrations, which are used to reduce friction and adhesion between powder and the substrate. One very effective set-up consists of a pipe, which vibrates harmoniously in axial direction at low frequency combined with a pulsed radial high frequency vibration. The high frequency vibration accelerates the particles perpendicular to the surface of the pipe, which in average leads to lower normal and thereby smaller friction force. With coordinated friction manipulation the powder acceleration can be varied so that the powder may be greatly accelerated and only slightly decelerated in each excitation period of the low frequency axial vibration of the pipe. The amount of powder flow is adjustable by vibration amplitudes, frequencies, and pulse rate, which makes the device versatile for comparable high volume and fine dosing using one setup. Within this contribution an experimental set-up consisting of a pipe, a solenoid actuator for axial vibration and a piezoelectric actuator for the radial high frequency vibration is described. An analytical model is shown, that simulates the powder velocity. Finally, simulation results are validated by experimental data for different driving parameters such as amplitude of low frequency vibration, pipe material and inclination angle.}}, author = {{Dunst, Paul and Sextro, Walter and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter}}, booktitle = {{PAMM Proc. Appl. Math. Mech. 16}}, pages = {{635--636}}, title = {{{Transportation of dry fine powders by coordinated friction manipulation}}}, doi = {{10.1002/pamm.201610306}}, year = {{2016}}, } @inproceedings{9960, abstract = {{Ultrasonic wire bonding is a common technology for connecting electrodes of electronic components like power modules. Nowadays, bond connections are often made of copper instead of aluminum due to its thermal and mechanical assets. One of the main cost factors in the wire bonding process is the acquisition cost of consumables such as bonding tools. For copper wire bonding tool lifetime is much lower than for aluminium bonding. This paper presents a micro wear model for wedge/wedge bonding tools that was validated by observing wear patterns with a scanning electron microscope. The wear coefficient is determined in long-term bonding tests. The application of Fleischer´s wear approach incorporating frictional power to a finite element simulation of the bonding processes is used to shift element nodes depending on the rising frictional power for finite element modeling. The presented simulation method can be used to take tool wear into consideration for creating tools with increased lifetime. This enables the production of reliable bond connections using heavy as well as thin wire of any material. The paper discusses the predominant influences of wear on the main tool functions and their changes over tool life. Furthermore, the influence of the tool groove angle on the tool wear was investigated. One of the main results is that the wear is largest during the last phase of each bonding process, when the contact area between tool and wire is largest.}}, author = {{Eichwald, Paul and Unger, Andreas and Eacock, Florian and Althoff, Simon and Sextro, Walter and Guth, Karsten and Brökelmann, Michael}}, booktitle = {{IEEE CPMT Symposium Japan, 2016}}, title = {{{Micro Wear Modeling in Copper Wire Wedge Bonding}}}, year = {{2016}}, } @inproceedings{9963, abstract = {{Tire-wheel assembly is the only connection between road and vehicle. Contacting directly with road within postcard size of contact area, it is mounted and guided by the suspension system. Therefore kinematics and compliances of suspension system greatly influence the frictional coupling of tire tread elements and road surface asperities by affecting pressure and sliding velocity distribution in the contact zone. This study emphasizes the development of a numerical methodology for frictional rolling contact analysis with focus on interaction of suspension system dynamics and tire-road contact using ADAMS. For this purpose a comprehensive flexible multibody system of the multi-link rear suspension is established, where both flexible and rigid bodies are modeled to allow large displacements with included elastic effects. To meet accuracy requirements for the high frequency applications, such as road excitations, the amplitude- and frequency-dependency of rubber-metal bushings is included. Furthermore the proposed flexible viscoelastic suspension model is enhanced by a Flexible Ring Tire Model (FTire), which describes a 3D tire dynamic response and covers any road excitations by tread submodel connected to road surface model. Concerning the verification and validation procedure numerous experiments are carried out to confirm the validity and the accuracy of both the developed submodels and the entire model. The devised approach makes it possible to investigate the influence of suspension system design on dynamical rolling contact and to evaluate tire tread wear. Therefore it can be a useful tool to predict frictional power distribution within the contact area under more realistic conditions.}}, author = {{Kohl, Sergej and Sextro, Walter and Schulze, Sebastian}}, booktitle = {{The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.}}, keywords = {{Kinematics and compliances, flexible viscoelastic suspension model, frictional rolling contact analysis, frictional power distribution.}}, pages = {{1--12}}, title = {{{Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS}}}, year = {{2016}}, } @inproceedings{9966, abstract = {{Usage of copper wire bonds allows to push power boundaries imposed by aluminum wire bonds. Copper allows higher electrical, thermal and mechanical loads than aluminum, which currently is the most commonly used material in heavy wire bonding. This is the main driving factor for increased usage of copper in high power applications such as wind turbines, locomotives or electric vehicles. At the same time, usage of copper also increases tool wear and reduces the range of parameter values for a stable process, making the process more challenging. To overcome these drawbacks, parameter adaptation at runtime using self-optimization is desired. A self-optimizing system is based on system objectives that evaluate and quantify system performance. System parameters can be changed at runtime such that pre-selected objective values are reached. For adaptation of bond process parameters, model-based self-optimization is employed. Since it is based on a model of the system, the bond process was modeled. In addition to static model parameters such as wire and substrate material properties and vibration characteristics of transducer and tool, variable model inputs are process parameters. Main simulation result is bonded area in the wiresubstrate contact. This model is then used to find valid and optimal working points before operation. The working point is composed of normal force and ultrasonic voltage trajectories, which are usually determined experimentally. Instead, multiobjective optimalization is used to compute trajectories that simultaneously optimize bond quality, process duration, tool wear and probability of tool-substrate contacts. The values of these objectives are computed using the process model. At runtime, selection among pre-determined optimal working points is sufficient to prioritize individual objectives. This way, the computationally expensive process of numerically solving a multiobjective optimal control problem and the demanding high speed bonding process are separated. To evaluate to what extent the pre-defined goals of self-optimization are met, an offthe- shelf heavy wire bonding machine was modified to allow for parameter adaptation and for transmitting of measurement data at runtime. This data is received by an external computer system and evaluated to select a new working point. Then, new process parameters are sent to the modified bonding machine for use for subsequent bonds. With these components, a full self-optimizing system has been implemented.}}, author = {{Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}}, booktitle = {{IEEE 66th Electronic Components and Technology Conference}}, keywords = {{Self-optimization, adaptive system, bond process, copper wire}}, pages = {{622--628}}, title = {{{Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation}}}, doi = {{10.1109/ECTC.2016.215}}, year = {{2016}}, } @inproceedings{9968, abstract = {{To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tooltip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard’s wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage.}}, author = {{Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}}, booktitle = {{Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}}, keywords = {{the Ultrasonic Wire Bonding Process}}, pages = {{251--254}}, title = {{{Validated Simulation of the Ultrasonic Wire Bonding Process}}}, year = {{2016}}, } @inproceedings{3934, abstract = {{Typical optical integrated circuits combine elements, like straight and curved waveguides, or cavities, the simulation and design of which is well established through numerical eigenproblem-solvers. It remains to predict the interaction of these modes. We address this task by a ”Hybrid” variant (HCMT) of Coupled Mode Theory. Using methods from finite-element numerics, the optical properties of a circuit are approximated by superpositions of eigen-solutions for its constituents, leading to quantitative, low-dimensional, and interpretable models in the frequency domain. Spectral scans are complemented by the direct computation of supermode properties (spectral positions and linewidths, coupling-induced phase shifts). This contribution outlines the theoretical background, and discusses briefly limitations and implementational details, with the help of an example of a 2-D coupled-resonator-optical-waveguide configuration.}}, author = {{Hammer, Manfred}}, booktitle = {{Integrated Optics: Devices, Materials, and Technologies XX}}, editor = {{Broquin, Jean-Emmanuel and Nunzi Conti, Gualtiero}}, keywords = {{tet_topic_waveguide, tet_topic_numerics}}, location = {{San Francisco, USA}}, number = {{9750}}, pages = {{975018--975018--8 }}, publisher = {{SPIE}}, title = {{{Wave interaction in photonic integrated circuits: Hybrid analytical / numerical coupled mode modeling}}}, doi = {{10.1117/12.2214331}}, year = {{2016}}, } @misc{10695, author = {{Horstmann, Jens}}, publisher = {{Paderborn University}}, title = {{{Beschleunigte Simulation elektrischer Stromnetze mit GPUs}}}, year = {{2016}}, } @inproceedings{10766, author = {{Ghribi, Ines and Ben Abdallah, Riadh and Khalgui, Mohamed and Platzner, Marco}}, booktitle = {{Proceedings of the 30th European Simulation and Modelling Conference (ESM)}}, title = {{{RCo-Design: New Visual Environment for Reconfigurable Embedded Systems}}}, year = {{2016}}, } @inproceedings{11829, abstract = {{This contribution investigates Direction of Arrival (DoA) estimation using linearly arranged microphone arrays. We are going to develop a model for the DoA estimation error in a reverberant scenario and show the existence of a bias, that is a consequence of the linear arrangement and limited field of view (FoV) bias: First, the limited FoV leading to a clipping of the measurements, and, second, the angular distribution of the signal energy of the reflections being non-uniform. Since both issues are a consequence of the linear arrangement of the sensors, the bias arises largely independent of the kind of DoA estimator. The experimental evaluation demonstrates the existence of the bias for a selected number of DoA estimation methods and proves that the prediction from the developed theoretical model matches the simulation results.}}, author = {{Jacob, Florian and Haeb-Umbach, Reinhold}}, booktitle = {{12. ITG Fachtagung Sprachkommunikation (ITG 2016)}}, title = {{{On the Bias of Direction of Arrival Estimation Using Linear Microphone Arrays}}}, year = {{2016}}, } @inproceedings{11834, abstract = {{We present a system for the 4th CHiME challenge which significantly increases the performance for all three tracks with respect to the provided baseline system. The front-end uses a bi-directional Long Short-Term Memory (BLSTM)-based neural network to estimate signal statistics. These then steer a Generalized Eigenvalue beamformer. The back-end consists of a 22 layer deep Wide Residual Network and two extra BLSTM layers. Working on a whole utterance instead of frames allows us to refine Batch-Normalization. We also train our own BLSTM-based language model. Adding a discriminative speaker adaptation leads to further gains. The final system achieves a word error rate on the six channel real test data of 3.48%. For the two channel track we achieve 5.96% and for the one channel track 9.34%. This is the best reported performance on the challenge achieved by a single system, i.e., a configuration, which does not combine multiple systems. At the same time, our system is independent of the microphone configuration. We can thus use the same components for all three tracks.}}, author = {{Heymann, Jahn and Drude, Lukas and Haeb-Umbach, Reinhold}}, booktitle = {{Computer Speech and Language}}, title = {{{Wide Residual BLSTM Network with Discriminative Speaker Adaptation for Robust Speech Recognition}}}, year = {{2016}}, } @article{144, abstract = {{Following the direction pioneered by Fiat and Papadimitriou in their 2010 paper [12], we study the complexity of deciding the existence of mixed equilibria for minimization games where players use valuations other than expectation to evaluate their costs. We consider risk-averse players seeking to minimize the sum V=E+R of expectationE and a risk valuationR of their costs; R is non-negative and vanishes exactly when the cost incurred to a player is constant over all choices of strategies by the other players. In a V-equilibrium, no player could unilaterally reduce her cost.Say that V has the Weak-Equilibrium-for-Expectation property if all strategies supported in a player's best-response mixed strategy incur the same conditional expectation of her cost. We introduce E-strict concavity and observe that every E-strictly concave valuation has the Weak-Equilibrium-for-Expectation property. We focus on a broad class of valuations shown to have the Weak-Equilibrium-for-Expectation property, which we exploit to prove two main complexity results, the first of their kind, for the two simplest cases of the problem:• Two strategies: Deciding the existence of a V-equilibrium is strongly NP-hard for the restricted class of player-specific scheduling games on two ordered links [22], when choosing R as (1)Var (variance), or (2)SD (standard deviation), or (3) a concave linear sum of even moments of small order.• Two players: Deciding the existence of a V-equilibrium is strongly NP-hard when choosing R as (1)γ⋅Var, or (2)γ⋅SD, where γ>0 is the risk-coefficient, or choosing V as (3) a convex combination of E+γ⋅Var and the concave ν-valuationν−1(E(ν(⋅))), where ν(x)=xr, with r≥2. This is a concrete consequence of a general strong NP-hardness result that only needs the Weak-Equilibrium-for-Expectation property and a few additional properties for V; its proof involves a reduction with a single parameter, which can be chosen efficiently so that each valuation satisfies the additional properties.}}, author = {{Monien, Burkhard and Mavronicolas, Marios}}, journal = {{Theoretical Computer Science}}, pages = {{67--96}}, publisher = {{Elsevier}}, title = {{{The complexity of equilibria for risk-modeling valuations}}}, doi = {{10.1016/j.tcs.2016.04.013}}, volume = {{634}}, year = {{2016}}, } @inproceedings{13152, author = {{Graf, Tobias and Platzner, Marco}}, booktitle = {{IEEE Computational Intelligence and Games}}, title = {{{Monte-Carlo Simulation Balancing Revisited}}}, year = {{2016}}, }