@inproceedings{20905,
  author       = {{Pohlmann, Uwe and Holtmann, Jörg and Meyer, Matthias and Gerking, Christopher}},
  booktitle    = {{Proceedings of the 40th Euromicro Conference on Software Engineering and Advanced Applications (SEAA)}},
  publisher    = {{IEEE Xplore}},
  title        = {{{Generating Modelica Models from Software Specifications for the Simulation of Cyber-physical Systems}}},
  year         = {{2014}},
}

@inproceedings{20908,
  author       = {{Pohlmann, Uwe and Dziwok, Stefan and Meyer, Matthias and Tichy, Matthias and Thiele, Sebastian}},
  booktitle    = {{Proceedings of the 7th International ICST Conference on Simulation Tools and Techniques}},
  title        = {{{A Modelica Coordination Pattern Library for Cyber-Physical Systems}}},
  year         = {{2014}},
}

@inproceedings{22176,
  abstract     = {{One barrier of laser sintering (LS) to become the main process for Direct Manufacturing (DM) is the surface quality of LS parts. Hence, the property which has to be improved is the rough surfaces of LS parts due to the layered structure. Another additional effect is the incomplete melting of powder particles on the surface due to the high process temperature. In this paper we demonstrate our approach of a theoretical model for the topography of LS part surfaces. We investigated the surface roughness as a function of surface orientation. Considering that the model involves further variables as layer thickness, particle density and particle size distribution to describe the topography precisely. Experimental results were used to optimize and check the results of the model.}},
  author       = {{Delfs, Patrick and Herale, A.A. and Li, Z. and Schmid, Hans-Joachim}},
  booktitle    = {{25th Annual International Solid Freeform Fabrication Symposium}},
  pages        = {{1250--1258}},
  title        = {{{Simulation of the Surface Topography on Laser Sintered Polymer Parts}}},
  doi          = {{http://utw10945.utweb.utexas.edu/sites/default/files/2014-098-Delfs.pdf}},
  volume       = {{25}},
  year         = {{2014}},
}

@inproceedings{22177,
  abstract     = {{An uneven temperature distribution and varying cooling rates at different positions within the part cake are two of the most important challenges regarding the part quality and reproducibility of the polymer laser sintering process. In the presented work, a temperature measurement system is implemented within an EOSINT P395 laser sintering system. It allows the determination of a three dimensional temperature distribution and history during the full build and cooling process. The influence of important job parameters, for example the packing density, job height and layer thickness, can be figured out. In combination with a finite element simulation of the cooling process, the temperature measurement will be the basis for optimized process controls.}},
  author       = {{Josupeit, Stefan and Schmid, Hans-Joachim}},
  booktitle    = {{25th Annual International Solid Freeform Fabrication Symposium}},
  pages        = {{49--58}},
  title        = {{{Three-dimensional in-process temperature measurement of laser sintered part cakes}}},
  doi          = {{http://utw10945.utweb.utexas.edu/sites/default/files/2014-006-Josupeit.pdf}},
  volume       = {{25}},
  year         = {{2014}},
}

@inproceedings{22203,
  abstract     = {{One barrier of laser sintering (LS) to become the main process for Direct Manufacturing (DM) is the surface quality of LS parts. Hence, the property which has to be improved is the rough surfaces of LS parts due to the layered structure. Another additional effect is the incomplete melting of powder particles on the surface due to the high process temperature. In this paper we demonstrate our approach of a theoretical model for the topography of LS part surfaces. We investigated the surface roughness as a function of surface orientation. Considering that the model involves further variables as layer thickness, particle density and particle size distribution to describe the topography precisely. Experimental results were used to optimize and check the results of the model.}},
  author       = {{Delfs, Patrick and Schmid, Hans-Joachim}},
  booktitle    = {{25th Annual International Solid Freeform Fabrication Symposium}},
  pages        = {{1250--1258}},
  title        = {{{Simulation of the Surface Topography on Laser Sintered Polymer Parts}}},
  doi          = {{http://utw10945.utweb.utexas.edu/sites/default/files/2014-098-Delfs.pdf}},
  volume       = {{25}},
  year         = {{2014}},
}

@inproceedings{23083,
  author       = {{Kromov, Ivan and Deter, Matthias and Trächtler, Ansgar}},
  booktitle    = {{SPS IPC Drives}},
  title        = {{{Ansätze zur Regelung eines elektronischen Lastemulators für die Hardware-in-the-Loop-Simulation von Antriebsreglern auf Leistungsebene}}},
  year         = {{2014}},
}

@inproceedings{23087,
  author       = {{Al Qaisi, Imad and Zimmermann, Daniel and Kohlstedt, Andreas and Gausemeier, Sandra and Trächtler, Ansgar}},
  booktitle    = {{Driving Simulation Conference 2014}},
  title        = {{{Subjective Evaluation of Different Motion Cueing Algorithms Implemented on ATMOS Driving Simulator}}},
  year         = {{2014}},
}

@inproceedings{23105,
  author       = {{Flottmeier, Sarah and Jäker, Karl-Peter and Trächtler, Ansgar}},
  booktitle    = {{Proceedings of the 9th International Fluid Power Conference}},
  pages        = {{366--377}},
  title        = {{{Test Rig for the Hardware-in-the-Loop Simulation of Mechatronic Axles}}},
  volume       = {{3}},
  year         = {{2014}},
}

@inproceedings{23106,
  author       = {{Oestersötebier, Felix and Wang, Peng and Trächtler, Ansgar}},
  booktitle    = {{10th International Modelica Conference}},
  title        = {{{A Modelica Contact Library for Idealized Simulation of Independently Defined Contact Surfaces}}},
  year         = {{2014}},
}

@article{21743,
  author       = {{Repenning, A. and C. Webb, D. and Brand, C. and Gluck, F. and Grover, R. and Miller, S. and Nickerson, H. and Song, M.}},
  journal      = {{IEEE Computer Graphics and Applications}},
  number       = {{3}},
  pages        = {{68--71}},
  publisher    = {{IEEE}},
  title        = {{{Beyond Minecraft: Facilitating Computational Thinking through Modeling and Programming in 3D}}},
  doi          = {{10.1109/MCG.2014.46}},
  volume       = {{34}},
  year         = {{2014}},
}

@proceedings{7761,
  editor       = {{Weskamp , Christoph  and John , Thomas  and Kundisch , Dennis  and Teetz, Alexander and Rose, Mirko }},
  title        = {{{Towards a Simulation-based Approach for Evaluating Business Models for the Electric Vehicle Market}}},
  year         = {{2014}},
}

@inproceedings{5749,
  author       = {{Yigitbas, Enes and Fischer, Holger Gerhard and Sauer, Stefan}},
  booktitle    = {{Design, User Experience, and Usability. Theories, Methods, and Tools for Designing the User Experience - Third International Conference, {DUXU} 2014, Held as Part of {HCI} International 2014, Heraklion, Crete, Greece, June 22-27, 2014, Proceedings, Part {I}}},
  pages        = {{206--213}},
  title        = {{{Model-Based User Interface Development for Adaptive Self-Service Systems}}},
  doi          = {{10.1007/978-3-319-07668-3\_21}},
  year         = {{2014}},
}

@inproceedings{462,
  abstract     = {{We discuss a technique to analyze complex infinitely repeated games using techniques from the fields of game theory and simulations. Our research is motivated by the analysis of electronic markets with thousands of participants and possibly complex strategic behavior. We consider an example of a global market of composed IT services to demonstrate the use of our simulation technique. We present our current work in this area and we want to discuss further approaches for the future.}},
  author       = {{Feldotto, Matthias and Skopalik, Alexander}},
  booktitle    = {{Proceedings of the 4th International Conference on Simulation and Modeling Methodologies, Technologies and Applications (SIMULTECH 2014)}},
  pages        = {{625--630}},
  title        = {{{A Simulation Framework for Analyzing Complex Infinitely Repeated Games}}},
  doi          = {{10.5220/0005110406250630}},
  year         = {{2014}},
}

@techreport{465,
  abstract     = {{This article presents a novel Mixed Integer Nonlinear Programming (MINLP) approach for ﬁnding a renewal plan of pipes in a water distribution system. We formulate a MINLP model for ﬁnding the times of renewal and suited measurements of pipe dimensions in a multi-year planning horizon. The model includes a multi-period hydraulic simulation of the distribution systems behaviour thereby respecting the friction caused headloss as a nonlinear constraint. We apply the MINLP solver Bonmin to a test network and present ﬁrst numerical results. The models embedding into a general solution framework for water network problems consisting of network reduction and simulation steps in an interated way, is beign discussed. This latter discussion corresponds well to the recent results by C. Hallmann for the problem of tank planning within the mentioned solution framework that has been presented there for the ﬁrst time.}},
  author       = {{Stapel, Florian and Suhl, Leena}},
  publisher    = {{Universität Paderborn}},
  title        = {{{A MINLP Approach for Planning the Renewal of Pipes in Drinking Water Networks}}},
  year         = {{2014}},
}

@inproceedings{759,
  author       = {{Dräxler, Martin and Dreimann, Philipp and Karl, Holger}},
  booktitle    = {{IEEE Online Conference on Green Communications, OnlineGreenComm 2014, November 12-14, 2014}},
  pages        = {{1----7}},
  title        = {{{Anticipatory power cycling of mobile network equipment for high demand multimedia traffic}}},
  doi          = {{10.1109/OnlineGreenCom.2014.7114415}},
  year         = {{2014}},
}

@inproceedings{760,
  author       = {{Auroux, Sebastien and Karl, Holger}},
  booktitle    = {{25th IEEE Annual International Symposium on Personal, Indoor, and Mobile Radio Communication, {PIMRC} 2014, Washington DC, USA, September 2-5, 2014}},
  pages        = {{1294----1299}},
  title        = {{{Flow processing-aware controller placement in wireless DenseNets}}},
  doi          = {{10.1109/PIMRC.2014.7136368}},
  year         = {{2014}},
}

@inproceedings{762,
  author       = {{Schwabe, Arne and Karl, Holger}},
  booktitle    = {{Proceedings of the third workshop on Hot topics in software defined networking, HotSDN '14, Chicago, Illinois, USA, August 22, 2014}},
  pages        = {{115----120}},
  title        = {{{Using MAC addresses as efficient routing labels in data centers}}},
  doi          = {{10.1145/2620728.2620730}},
  year         = {{2014}},
}

@article{9882,
  abstract     = {{An automotive suspension system represents one of the most complex and important systems in a passenger vehicle, which has to ensure a robust and optimized contact between the wheels and the road at any time. For improving a suspension system it is important to take an investigative look at the interaction between suspension, tire and road dynamics. Thus a part of a study into aspects of suspension modeling on multi-body simulations of rear multi-link suspension system dynamics with focus on the tire footprint area is presented in this work.}},
  author       = {{Kohl, Sergej and Sextro, Walter and Zuber, Armin}},
  issn         = {{1617-7061}},
  journal      = {{PAMM}},
  number       = {{1}},
  pages        = {{65--66}},
  publisher    = {{WILEY-VCH Verlag}},
  title        = {{{Tire footprint analysis depending on the elastokinematics of a multi-link suspension system using multi-body dynamics simulation}}},
  doi          = {{10.1002/pamm.201410020}},
  volume       = {{14}},
  year         = {{2014}},
}

@inproceedings{9895,
  abstract     = {{Power semiconductor modules are used to control and switch high electrical currents and voltages. Within the power module package wire bonding is used as an interconnection technology. In recent years, aluminum wire has been used preferably, but an ever-growing market of powerful and efficient power modules requires a material with better mechanical and electrical properties. For this reason, a technology change from aluminum to copper is indispensable. However, the copper wire bonding process reacts more sensitive to parameter changes. This makes manufacturing reliable copper bond connections a challenging task. The aim of the BMBF funded project Itsowl-InCuB is the development of self-optimizing techniques to enable the reliable production of copper bond connections under varying conditions. A model of the process is essential to achieve this aim. This model needs to include the dynamic elasto-plastic deformation, the ultrasonic softening effect and the proceeding adhesion between wire and substrate. This paper focusses on the pre-deformation process. In the touchdown phase, the wire is pressed into the V-groove of the tool and a small initial contact area between wire and substrate arise. The local characteristics of the material change abruptly because of the cold forming. Consequently, the pre-deformation has a strong effect on the joining process. In [1], a pre-cleaning effect during the touchdown process of aluminum wires by cracking of oxide layers was presented. These interactions of the process parameters are still largely unknown for copper. In a first step, this paper validates the importance of modeling the pre-deformation by showing its impact on the wire deformation characteristic experimentally. Creating cross-section views of pre-deformed copper wires has shown a low deformation degree compared to aluminum. By using a digital microscope and a scanning confocal microscope an analysis about the contact areas and penetration depths after touchdown has been made. Additionally, it has to be taken into account that the dynamical touchdown force depends on the touchdown speed and the touchdown force set in the bonding machine. In order to measure the overshoot in the force signals, a strain gauge sensor has been used. Subsequently, the affecting factors have been interpreted independently Furthermore, the material properties of copper wire have been investigated with tensile tests and hardness measurements. In a second step, the paper presents finite element models of the touchdown process for source and destination bonds. These models take the measured overshoot in the touchdown forces into account. A multi-linear, isotropic material model has been selected to map the material properties of the copper. A validation of the model with the experimental determined contact areas, normal pressures and penetration depths reveals the high model quality. Thus, the simulation is able to calculate and visualize the three dimensional pre-deformation with an integrated material parameter of the wire if the touchdown parameters of the bonding machine are known. Based on the calculated deformation degrees of wire and substrate, it is probably possible to investigate the effect of the pre-deformation on the pre-cleaning phase in the copper wire bonding.}},
  author       = {{Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael}},
  booktitle    = {{Proceedings of the 47th International Symposium on Microelectronics (IMAPS)}},
  keywords     = {{pre-deformation, copper wire bonding, finite element model}},
  pages        = {{289--294}},
  title        = {{{Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds}}},
  year         = {{2014}},
}

@inbook{3941,
  author       = {{Declair, Stefan and Förstner, Jens}},
  booktitle    = {{Handbook of Optical Microcavities}},
  editor       = {{Choi, Anthony H.W.}},
  keywords     = {{tet_topic_phc}},
  publisher    = {{Pan Stanford Publishing Pte. Ltd.}},
  title        = {{{Simulation of Planar Photonic Resonators}}},
  volume       = {{Kapitel 2}},
  year         = {{2014}},
}

