@inproceedings{9997,
  abstract     = {{Ultrasonic wire bonding is used to connect the electrical terminals of semiconductor modules in power electronics. Mul- tiple inﬂuencing factors in wedge/wedge bonding are known and extensively investigated. A constructively settable but rarely examined parameter is the bonding frequency. In case of bonding on challenging substrates, e.g. supple substruc- tures, a high inﬂuence of the working frequency is observed. The choice of the working frequency is typically based on experimental investigations for a certain component or substrate and needs to be evaluated anew for new applications. A profound understanding of the inﬂuence of the working frequency is required to achieve a reliable bond process and a short process development. Here a generalized model for the numerical simulation of the bond formation with respect to the dynamics of the substructure is presented. The simulation results are compared to experiments using 300 µm copper wire at different working frequencies and geometries of the substructure.}},
  author       = {{Schemmel, Reinhard and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}},
  booktitle    = {{CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)}},
  pages        = {{230--235}},
  title        = {{{Effects of different working frequencies on the joint formation in copper wire bonding}}},
  year         = {{2018}},
}

@inproceedings{9998,
  abstract     = {{Ultrasonic wedge/wedge-wire bonding is used to connect electrical terminals of semiconductor modules in power electronics. The wire is clamped with a tool by a normal force and ultrasonic vibration is transmitted through the wire into the interface between wire and substrate. Due to frictional processes contaminations like oxide layers are removed from the contact zone and the surface roughness is reduced, thus the real contact area is increased. In the next step of bond formation, thermomechanical forces create micro-junctions between the wire and substrate and the bond strength increases. The bond parameters like the bond normal force, the ultrasonic vibration amplitude and the geometry of the clamping tool show a high influence on the strength and reliability of the wire bond and need to be investigated in detail. Therefore, in this contribution the dynamical behaviour of the ultrasonic system, the wire and the substrate are modeled in form of substructures, which are connected by the friction contacts between tool and wire and between wire and substrate. Approaches for modelling the time variant contact behaviour, the substrate dynamics, and the model order reduction for a time efficient simulation are described to simulate the full bonding process.}},
  author       = {{Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}},
  booktitle    = {{6th European Conference on Computational Mechanics (ECCM 6)}},
  pages        = {{1--12}},
  title        = {{{Numerical and experimental investigations in ultrasonic heavy wire bonding}}},
  year         = {{2018}},
}

@inproceedings{3930,
  author       = {{Brassat, Katharina and Taube, A. and Kool, Daniel and Tasche, L. and Hoyer, K.P. and Schaper, Mirko and Lindner, Jörg}},
  location     = {{Warsaw, Poland}},
  title        = {{{Ti-6Al-4V alloy: 3D printing of lightweight implants and nanopatterning by self-assembly}}},
  year         = {{2018}},
}

@inproceedings{3946,
  author       = {{Drude, Dennis and Lindner, Jörg}},
  location     = {{Phoenix (AZ), USA}},
  title        = {{{Simulation of Transport Processes during the Convective Self-Assembly of Colloidal Nanomasks}}},
  year         = {{2018}},
}

@inproceedings{5469,
  abstract     = {{In diesem Beitrag werden simulatorische und messtechnische EMV-Untersuchungen von Gleichspannungswandlern vorgestellt. Der Fokus liegt auf leitungsgeführten Störspannungen, ihre Abhängigkeit vom Schaltungslayout und ihre Unterdrückung durch Filterung. Der Simulationsprozess besteht aus kombinierten Feld- und Netzwerksimulationen. Zur Bewertung der Simulationsresultate werden zwei Prototypen gezeigt, die gute und schlechte EMV-Eigenschaften aufweisen. Bei der Beurteilung der Resultate wird insbesondere Wert auf die Untersuchung gelegt, inwieweit einfache Schaltungssimulationen ausreichen, um leitungsgeführte Störspannungen korrekt vorherzusagen und wann aufwändigere Feldsimulationen notwendig sind.}},
  author       = {{Baumgarten, Tim and Scholz, Peter and Sievers, Denis and Förstner, Jens}},
  booktitle    = {{Elektromagnetische Verträglichkeit - Internationale Fachmesse und Kongress 2018}},
  editor       = {{Garbe, Heyno}},
  isbn         = {{978-3-95735-077-0}},
  location     = {{Düsseldorf}},
  pages        = {{47}},
  title        = {{{Simulation leitungsgeführter Störspannungen von DC-DC-Wandlern}}},
  year         = {{2018}},
}

@inproceedings{10598,
  abstract     = {{Approximate computing has become a very popular design
strategy that exploits error resilient computations to achieve higher
performance and energy efﬁciency. Automated synthesis of approximate
circuits is performed via functional approximation, in which various
parts of the target circuit are extensively examined with a library
of approximate components/transformations to trade off the functional
accuracy and computational budget (i.e., power). However, as the number
of possible approximate transformations increases, traditional search
techniques suffer from a combinatorial explosion due to the large
branching factor. In this work, we present a comprehensive framework
for automated synthesis of approximate circuits from either structural
or behavioral descriptions. We adapt the Monte Carlo Tree Search
(MCTS), as a stochastic search technique, to deal with the large design
space exploration, which enables a broader range of potential possible
approximations through lightweight random simulations. The proposed
framework is able to recognize the design Pareto set even with low
computational budgets. Experimental results highlight the capabilities of
the proposed synthesis framework by resulting in up to 61.69% energy
saving while maintaining the predeﬁned quality constraints.}},
  author       = {{Awais, Muhammad and Ghasemzadeh Mohammadi, Hassan and Platzner, Marco}},
  booktitle    = {{26th IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)}},
  keywords     = {{Approximate computing, High-level synthesis, Accuracy, Monte-Carlo tree search, Circuit simulation}},
  pages        = {{219--224}},
  title        = {{{An MCTS-based Framework for Synthesis of Approximate Circuits}}},
  doi          = {{10.1109/VLSI-SoC.2018.8645026}},
  year         = {{2018}},
}

@inproceedings{11986,
  author       = {{Buse, Dominik S. and Schettler, Max and Kothe, Nils and Reinold, Peter and Sommer, Christoph and Dressler, Falko}},
  booktitle    = {{2018 14th Annual Conference on Wireless On-demand Network Systems and Services (WONS)}},
  isbn         = {{9783903176010}},
  title        = {{{Bridging worlds: Integrating hardware-in-the-loop testing with large-scale VANET simulation}}},
  doi          = {{10.23919/wons.2018.8311659}},
  year         = {{2018}},
}

@inproceedings{11987,
  author       = {{Buse, Dominik S. and Sommer, Christoph and Dressler, Falko}},
  booktitle    = {{IEEE INFOCOM 2018 - IEEE Conference on Computer Communications Workshops (INFOCOM WKSHPS)}},
  isbn         = {{9781538659793}},
  title        = {{{Demo abstract: Integrating a driving simulator with city-scale VANET simulation for the development of next generation ADAS systems}}},
  doi          = {{10.1109/infcomw.2018.8406997}},
  year         = {{2018}},
}

@inproceedings{15585,
  author       = {{Bednarik, Roman and Schulte, Carsten and Budde, Lea and Heinemann, Birte and Vrzakova, Hana}},
  booktitle    = {{Proceedings of the 18th Koli Calling International Conference on Computing Education Research, Koli, Finland, November 22-25, 2018}},
  pages        = {{2:1--2:8}},
  title        = {{{Eye-movement Modeling Examples in Source Code Comprehension: A Classroom Study}}},
  doi          = {{10.1145/3279720.3279722}},
  year         = {{2018}},
}

@inbook{14856,
  author       = {{Hallmann, Corinna and Burmeister, Sascha Christian and Wissing, Michaela and Suhl, Leena}},
  booktitle    = {{Communications in Computer and Information Science}},
  isbn         = {{9783319962702}},
  issn         = {{1865-0929}},
  title        = {{{Heuristics and Simulation for Water Tank Optimization}}},
  doi          = {{10.1007/978-3-319-96271-9_5}},
  year         = {{2018}},
}

@article{13057,
  author       = {{Kampmann, Matthias and Hellebrand, Sybille}},
  journal      = {{Microelectronics Reliability}},
  pages        = {{124--133}},
  title        = {{{Design For Small Delay Test - A Simulation Study}}},
  volume       = {{80}},
  year         = {{2018}},
}

@article{13808,
  author       = {{Düsing, Martin and Mahnken, Rolf}},
  issn         = {{1617-7061}},
  journal      = {{PAMM}},
  title        = {{{"Simulation of upper and lower bainitic transformation with a coupled phase field/diffusion/deformation framework"}}},
  doi          = {{10.1002/pamm.201800180}},
  volume       = {{18}},
  year         = {{2018}},
}

@article{13814,
  author       = {{Düsing, Martin and Mahnken, Rolf}},
  issn         = {{0020-7683}},
  journal      = {{International Journal of Solids and Structures}},
  pages        = {{45--59}},
  title        = {{{A coupled phase field/diffusional/mechanical framework for simulation of upper and lower bainitic transformation}}},
  doi          = {{10.1016/j.ijsolstr.2018.11.027}},
  volume       = {{162}},
  year         = {{2018}},
}

@inproceedings{24665,
  author       = {{Schlosser, Florian and Hechelmann, Ron-Hendrik and Meschede, Henning and Matthias, Philipp and Walmsley, Timothy G.}},
  booktitle    = {{Chemical Engineering Transactions}},
  location     = {{Prague}},
  pages        = {{403--408}},
  title        = {{{Evaluation of a Stratified Tank based Heat Recovery Loop via Dynamic Simulation}}},
  doi          = {{10.3303/CET1870068}},
  volume       = {{70}},
  year         = {{2018}},
}

@article{27027,
  author       = {{Bühlmeier, Judith and Harris, Carla and Koletzko, Sibylle and Lehmann, Irina and Bauer, Carl-Peter and Schikowski, Tamara and von Berg, Andrea and Berdel, Dietrich and Heinrich, Joachim and Hebebrand, Johannes and Föcker, Manuel and Standl, Marie and Libuda, Lars}},
  issn         = {{2072-6643}},
  journal      = {{Nutrients}},
  title        = {{{Dietary Acid Load and Mental Health Outcomes in Children and Adolescents: Results from the GINIplus and LISA Birth Cohort Studies}}},
  doi          = {{10.3390/nu10050582}},
  year         = {{2018}},
}

@inproceedings{35107,
  author       = {{Thielen, S and Foko Foko, F and Magyar, Balázs and Sauer, B}},
  location     = {{Paris}},
  title        = {{{Sealing contact shaft structure design using EHL simulation}}},
  year         = {{2018}},
}

@inproceedings{35108,
  author       = {{Oehler, M and Magyar, Balázs and Sauer, B}},
  isbn         = {{978-1911033424}},
  location     = {{Lyon}},
  pages        = {{145--154}},
  publisher    = {{Chartridge Books: Oxford}},
  title        = {{{Efficiency calculation of worm gear boxes through coupled tribological and thermal simulation}}},
  year         = {{2018}},
}

@inproceedings{35163,
  author       = {{Oehler, M and Magyar, Balázs and Sauer, B}},
  isbn         = {{978-3-943563-33-7}},
  location     = {{Ostfildern}},
  publisher    = {{Technische Akademie Esslingen}},
  title        = {{{Combination of Tribological and Thermal Simulation using the Example of Worm Gear Drives}}},
  year         = {{2018}},
}

@article{35162,
  author       = {{Magyar, Balázs and Thielen, S and Löwenstein, M and Becker, A and Sauer, B}},
  issn         = {{0036-6218}},
  journal      = {{Tribologie und Schmierungstechnik}},
  number       = {{1}},
  pages        = {{40--47}},
  title        = {{{EHD Simulation eines Kettengelenkes}}},
  volume       = {{65}},
  year         = {{2018}},
}

@inproceedings{35184,
  author       = {{Thielen, S and Magyar, Balázs and Foko Foko, F and Sauer, B}},
  isbn         = {{978-3-943563-33-7}},
  location     = {{Ostfildern}},
  publisher    = {{Technische Akademie Esslingen}},
  title        = {{{EHL simulation of the radial shaft sealing system}}},
  year         = {{2018}},
}

