[{"date_created":"2025-11-04T12:49:13Z","type":"journal_article","publication":"Materials &amp; Design","citation":{"apa":"Gerritzen, J., Gröger, B., Zscheyge, M., Hornig, A., &#38; Gude, M. (2025). 3D viscoelastic plastic model coupled with a continuum damage formulation for fiber reinforced polymers. <i>Materials &#38;amp; Design</i>, <i>260</i>, Article 114969. <a href=\"https://doi.org/10.1016/j.matdes.2025.114969\">https://doi.org/10.1016/j.matdes.2025.114969</a>","ieee":"J. Gerritzen, B. Gröger, M. Zscheyge, A. Hornig, and M. Gude, “3D viscoelastic plastic model coupled with a continuum damage formulation for fiber reinforced polymers,” <i>Materials &#38;amp; Design</i>, vol. 260, Art. no. 114969, 2025, doi: <a href=\"https://doi.org/10.1016/j.matdes.2025.114969\">10.1016/j.matdes.2025.114969</a>.","short":"J. Gerritzen, B. Gröger, M. Zscheyge, A. Hornig, M. Gude, Materials &#38;amp; Design 260 (2025).","chicago":"Gerritzen, Johannes, Benjamin Gröger, Matthias Zscheyge, Andreas Hornig, and Maik Gude. “3D Viscoelastic Plastic Model Coupled with a Continuum Damage Formulation for Fiber Reinforced Polymers.” <i>Materials &#38;amp; Design</i> 260 (2025). <a href=\"https://doi.org/10.1016/j.matdes.2025.114969\">https://doi.org/10.1016/j.matdes.2025.114969</a>.","mla":"Gerritzen, Johannes, et al. “3D Viscoelastic Plastic Model Coupled with a Continuum Damage Formulation for Fiber Reinforced Polymers.” <i>Materials &#38;amp; Design</i>, vol. 260, 114969, Elsevier BV, 2025, doi:<a href=\"https://doi.org/10.1016/j.matdes.2025.114969\">10.1016/j.matdes.2025.114969</a>.","ama":"Gerritzen J, Gröger B, Zscheyge M, Hornig A, Gude M. 3D viscoelastic plastic model coupled with a continuum damage formulation for fiber reinforced polymers. <i>Materials &#38;amp; Design</i>. 2025;260. doi:<a href=\"https://doi.org/10.1016/j.matdes.2025.114969\">10.1016/j.matdes.2025.114969</a>","bibtex":"@article{Gerritzen_Gröger_Zscheyge_Hornig_Gude_2025, title={3D viscoelastic plastic model coupled with a continuum damage formulation for fiber reinforced polymers}, volume={260}, DOI={<a href=\"https://doi.org/10.1016/j.matdes.2025.114969\">10.1016/j.matdes.2025.114969</a>}, number={114969}, journal={Materials &#38;amp; Design}, publisher={Elsevier BV}, author={Gerritzen, Johannes and Gröger, Benjamin and Zscheyge, Matthias and Hornig, Andreas and Gude, Maik}, year={2025} }"},"project":[{"name":"TRR 285:  Methodenentwicklung zur mechanischen Fügbarkeit in wandlungsfähigen Prozessketten","_id":"130"},{"_id":"137","name":"TRR 285 - Subproject A03"},{"name":"TRR 285 - Project Area A","_id":"131"}],"article_number":"114969","publisher":"Elsevier BV","_id":"62081","language":[{"iso":"eng"}],"user_id":"105344","doi":"10.1016/j.matdes.2025.114969","volume":260,"year":"2025","status":"public","title":"3D viscoelastic plastic model coupled with a continuum damage formulation for fiber reinforced polymers","author":[{"id":"105344","full_name":"Gerritzen, Johannes","first_name":"Johannes","orcid":"0000-0002-0169-8602","last_name":"Gerritzen"},{"full_name":"Gröger, Benjamin","last_name":"Gröger","first_name":"Benjamin"},{"first_name":"Matthias","last_name":"Zscheyge","full_name":"Zscheyge, Matthias"},{"last_name":"Hornig","first_name":"Andreas","full_name":"Hornig, Andreas"},{"first_name":"Maik","last_name":"Gude","full_name":"Gude, Maik"}],"publication_identifier":{"issn":["0264-1275"]},"publication_status":"published","date_updated":"2026-02-27T06:43:55Z","intvolume":"       260"},{"abstract":[{"lang":"eng","text":"Intensive ultrasonic cleaning of surfaces by means of a lead-free ultrasonic transducer with focusing sonotrode\r\nUltrasonic cleaning baths are probably a coincidental development: After underwater sonars had already been successfully used to detect submarines before 1920, it was probably observed in this environment that the ultrasonic oscillators not only showed a self-cleaning effect but also cavitation damage. At the beginning of the 1950s, the first ultrasonic cleaning devices finally came onto the market. Today, the range of applications ranges from household appliances for jewellery and eyewear cleaning to classic cleaning baths for metal parts and systems for cleaning highly sensitive electronic components. There is a certain gap in handheld, mobile cleaning equipment. Although devices for spot cleaning of textiles are known, the cleaning effect is usually low. \r\nDue to the directive 2011/65/EU on the restriction of the use of hazardous substances in electrical and electronic equipment (RoHS) [1] lead should no longer be used in technical devices. As today’s standard ceramics for medium and high-power ultrasonic transducers typically contain lead, there is a need to explore the use of lead-free ceramics in this field. Honda [2] already offers a cleaning transducer based on lead-free piezoelectric ceramics, but it is designed to be used in cleaning baths.\r\nThis article presents the model-based development of a highly innovative ultrasonic cleaner. On the one hand, lead-free piezoelectric ceramics are used, and on the other hand, a special sonotrode has been developed that concentrates the sound in such a way that a strong cavitation and thus cleaning effect is achieved with comparatively low power in a short time. Coupled field finite element method was used to find an appropriate geometry for the focussing sonotrode. The comparison of simulation and measurement results shows that the lead-free piezoceramics used do their job well and can keep up with standard ceramics, but more ceramic volume is needed to achieve same power. An advanced control concept was elaborated to ensure continuous hard cavitation at varying distances between the sonotrode and the part to be cleaned. Cleaning results for different surfaces and contaminations are presented. The concept of the focusing sonotrode shows that a convincing cleaning result can be achieved even with low power and in short time, provided that the oscillation system and control electronics are suitably coordinated.\r\n\r\nReferences\r\n[1] http://data.europa.eu/eli/dir/2011/65/2024-08-01 \r\n[2] https://en.honda-el.co.jp/product/ceramics/lineup/lead_off/lead-off \r\n"}],"citation":{"mla":"Hemsel, Tobias, et al. <i>Intensive Ultrasonic Cleaning of Surfaces by Means of Lead-Free Ultrasonic Transducer with Focussing Sonotrode</i>. 2025.","apa":"Hemsel, T., Scheidemann, C., Bornmann, P., Littmann, W., &#38; Sextro, W. (2025). <i>Intensive ultrasonic cleaning of surfaces by means of lead-free ultrasonic transducer with focussing sonotrode</i>. International Congress on Ultrasonics (ICU), Paderborn, Germany.","ieee":"T. Hemsel, C. Scheidemann, P. Bornmann, W. Littmann, and W. Sextro, “Intensive ultrasonic cleaning of surfaces by means of lead-free ultrasonic transducer with focussing sonotrode,” presented at the International Congress on Ultrasonics (ICU), Paderborn, Germany, 2025.","chicago":"Hemsel, Tobias, Claus Scheidemann, Peter Bornmann, Walter Littmann, and Walter Sextro. “Intensive Ultrasonic Cleaning of Surfaces by Means of Lead-Free Ultrasonic Transducer with Focussing Sonotrode,” 2025.","short":"T. Hemsel, C. Scheidemann, P. Bornmann, W. Littmann, W. Sextro, in: 2025.","ama":"Hemsel T, Scheidemann C, Bornmann P, Littmann W, Sextro W. Intensive ultrasonic cleaning of surfaces by means of lead-free ultrasonic transducer with focussing sonotrode. In: ; 2025.","bibtex":"@inproceedings{Hemsel_Scheidemann_Bornmann_Littmann_Sextro_2025, title={Intensive ultrasonic cleaning of surfaces by means of lead-free ultrasonic transducer with focussing sonotrode}, author={Hemsel, Tobias and Scheidemann, Claus and Bornmann, Peter and Littmann, Walter and Sextro, Walter}, year={2025} }"},"file_date_updated":"2026-03-02T10:58:37Z","oa":"1","department":[{"_id":"151"}],"type":"conference","date_created":"2026-03-02T10:47:48Z","file":[{"file_id":"64801","content_type":"application/pdf","relation":"main_file","date_updated":"2026-03-02T10:58:37Z","file_name":"ICU_2025_Hemsel.pdf","access_level":"open_access","file_size":1946202,"date_created":"2026-03-02T10:46:43Z","creator":"hemsel"}],"has_accepted_license":"1","date_updated":"2026-03-02T10:58:37Z","conference":{"location":"Paderborn, Germany","start_date":"2025-09-21","name":"International Congress on Ultrasonics (ICU)","end_date":"2025-09-25"},"author":[{"id":"210","full_name":"Hemsel, Tobias","first_name":"Tobias","last_name":"Hemsel"},{"id":"38259","first_name":"Claus","last_name":"Scheidemann","full_name":"Scheidemann, Claus"},{"full_name":"Bornmann, Peter","last_name":"Bornmann","first_name":"Peter"},{"full_name":"Littmann, Walter","last_name":"Littmann","first_name":"Walter"},{"id":"21220","last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter"}],"title":"Intensive ultrasonic cleaning of surfaces by means of lead-free ultrasonic transducer with focussing sonotrode","status":"public","year":"2025","ddc":["620"],"user_id":"210","_id":"64800","language":[{"iso":"eng"}]},{"date_created":"2024-12-18T09:07:41Z","type":"journal_article","citation":{"ieee":"K. M. de Payrebrune <i>et al.</i>, “The impact of AI on engineering design procedures for dynamical systems,” <i>Technische Mechanik - European Journal of Engineering Mechanics</i>, vol. 45, no. 1, pp. 1–23, 2025, doi: <a href=\"https://doi.org/10.24352/UB.OVGU-2025-037\">10.24352/UB.OVGU-2025-037</a>.","apa":"de Payrebrune, K. M., Flaßkamp, K., Ströhla, T., Sattel, T., Bestle, D., Röder, B., Eberhard, P., Peitz, S., Stoffel, M., Rutwik, G., Aditya, B., Wohlleben, M. C., Sextro, W., Raff, M., Remy, C. D., Yadav, M., Stender, M., van Delden, J., Lüddecke, T., … Blech, C. (2025). The impact of AI on engineering design procedures for dynamical systems. <i>Technische Mechanik - European Journal of Engineering Mechanics</i>, <i>45</i>(1), 1–23. <a href=\"https://doi.org/10.24352/UB.OVGU-2025-037\">https://doi.org/10.24352/UB.OVGU-2025-037</a>","short":"K.M. de Payrebrune, K. Flaßkamp, T. Ströhla, T. Sattel, D. Bestle, B. Röder, P. Eberhard, S. Peitz, M. Stoffel, G. Rutwik, B. Aditya, M.C. Wohlleben, W. Sextro, M. Raff, C.D. Remy, M. Yadav, M. Stender, J. van Delden, T. Lüddecke, S.C. Langer, J. Schultz, C. Blech, Technische Mechanik - European Journal of Engineering Mechanics 45 (2025) 1–23.","chicago":"Payrebrune, Kristin M. de, Kathrin Flaßkamp, Tom Ströhla, Thomas Sattel, Dieter Bestle, Benedict Röder, Peter Eberhard, et al. “The Impact of AI on Engineering Design Procedures for Dynamical Systems.” <i>Technische Mechanik - European Journal of Engineering Mechanics</i> 45, no. 1 (2025): 1–23. <a href=\"https://doi.org/10.24352/UB.OVGU-2025-037\">https://doi.org/10.24352/UB.OVGU-2025-037</a>.","mla":"de Payrebrune, Kristin M., et al. “The Impact of AI on Engineering Design Procedures for Dynamical Systems.” <i>Technische Mechanik - European Journal of Engineering Mechanics</i>, vol. 45, no. 1, 2025, pp. 1–23, doi:<a href=\"https://doi.org/10.24352/UB.OVGU-2025-037\">10.24352/UB.OVGU-2025-037</a>.","bibtex":"@article{de Payrebrune_Flaßkamp_Ströhla_Sattel_Bestle_Röder_Eberhard_Peitz_Stoffel_Rutwik_et al._2025, title={The impact of AI on engineering design procedures for dynamical systems}, volume={45}, DOI={<a href=\"https://doi.org/10.24352/UB.OVGU-2025-037\">10.24352/UB.OVGU-2025-037</a>}, number={1}, journal={Technische Mechanik - European Journal of Engineering Mechanics}, author={de Payrebrune, Kristin M. and Flaßkamp, Kathrin and Ströhla, Tom and Sattel, Thomas and Bestle, Dieter and Röder, Benedict and Eberhard, Peter and Peitz, Sebastian and Stoffel, Marcus and Rutwik, Gulakala and et al.}, year={2025}, pages={1–23} }","ama":"de Payrebrune KM, Flaßkamp K, Ströhla T, et al. The impact of AI on engineering design procedures for dynamical systems. <i>Technische Mechanik - European Journal of Engineering Mechanics</i>. 2025;45(1):1-23. doi:<a href=\"https://doi.org/10.24352/UB.OVGU-2025-037\">10.24352/UB.OVGU-2025-037</a>"},"publication":"Technische Mechanik - European Journal of Engineering Mechanics","issue":"1","abstract":[{"text":"Artificial intelligence (AI) is driving transformative changes across numerous fields, revolutionizing conventional processes and creating new opportunities for innovation. The development of mechatronic systems is undergoing a similar transformation. Over the past decade, modeling, simulation, and optimization techniques have become integral to the design process, paving the way for the adoption of AI-based methods. In this paper, we examine the potential for integrating AI into the engineering design process, using the V-model from the VDI guideline 2206, considered the state-of-the-art in product design, as a foundation. We identify and classify AI methods based on their suitability for specific stages within the engineering product design workflow. Furthermore, we present a series of application examples where AI-assisted design has been successfully implemented by the authors. These examples, drawn from research projects within the DFG Priority Program \\emph{SPP~2353: Daring More Intelligence - Design Assistants in Mechanics and Dynamics}, showcase a diverse range of applications across mechanics and mechatronics, including areas such as acoustics and robotics.","lang":"eng"}],"quality_controlled":"1","_id":"57829","language":[{"iso":"eng"}],"page":"1-23","volume":45,"user_id":"43991","doi":"10.24352/UB.OVGU-2025-037","author":[{"first_name":"Kristin M.","last_name":"de Payrebrune","full_name":"de Payrebrune, Kristin M."},{"full_name":"Flaßkamp, Kathrin","last_name":"Flaßkamp","first_name":"Kathrin"},{"last_name":"Ströhla","first_name":"Tom","full_name":"Ströhla, Tom"},{"last_name":"Sattel","first_name":"Thomas","full_name":"Sattel, Thomas"},{"full_name":"Bestle, Dieter","last_name":"Bestle","first_name":"Dieter"},{"first_name":"Benedict","last_name":"Röder","full_name":"Röder, Benedict"},{"first_name":"Peter","last_name":"Eberhard","full_name":"Eberhard, Peter"},{"first_name":"Sebastian","last_name":"Peitz","full_name":"Peitz, Sebastian"},{"full_name":"Stoffel, Marcus","first_name":"Marcus","last_name":"Stoffel"},{"last_name":"Rutwik","first_name":"Gulakala","full_name":"Rutwik, Gulakala"},{"last_name":"Aditya","first_name":"Borse","full_name":"Aditya, Borse"},{"full_name":"Wohlleben, Meike Claudia","first_name":"Meike Claudia","orcid":"0009-0009-9767-7168","last_name":"Wohlleben","id":"43991"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"},{"last_name":"Raff","first_name":"Maximilian","full_name":"Raff, Maximilian"},{"full_name":"Remy, C. David","last_name":"Remy","first_name":"C. David"},{"last_name":"Yadav","first_name":"Manish","full_name":"Yadav, Manish"},{"full_name":"Stender, Merten","last_name":"Stender","first_name":"Merten"},{"first_name":"Jan","last_name":"van Delden","full_name":"van Delden, Jan"},{"first_name":"Timo","last_name":"Lüddecke","full_name":"Lüddecke, Timo"},{"last_name":"Langer","first_name":"Sabine C.","full_name":"Langer, Sabine C."},{"last_name":"Schultz","first_name":"Julius","full_name":"Schultz, Julius"},{"full_name":"Blech, Christopher","last_name":"Blech","first_name":"Christopher"}],"title":"The impact of AI on engineering design procedures for dynamical systems","year":"2025","status":"public","intvolume":"        45","date_updated":"2026-03-03T06:31:55Z"},{"author":[{"last_name":"Eckertz","first_name":"Daniel","full_name":"Eckertz, Daniel"},{"full_name":"Sander, Mattes","first_name":"Mattes","last_name":"Sander"},{"first_name":"Omar","last_name":"Masroor","full_name":"Masroor, Omar"},{"full_name":"Dumitrescu, Roman","first_name":"Roman","last_name":"Dumitrescu","id":"16190"}],"title":"Linking Abstract Digital Twin Data to 3D Models: A Configurable Approach for Real-Time Adaptation","status":"public","year":"2025","publication_status":"published","date_updated":"2025-10-24T08:12:23Z","_id":"61963","language":[{"iso":"eng"}],"publisher":"IEEE","user_id":"15782","doi":"10.1109/icict64582.2025.00010","citation":{"ama":"Eckertz D, Sander M, Masroor O, Dumitrescu R. Linking Abstract Digital Twin Data to 3D Models: A Configurable Approach for Real-Time Adaptation. In: <i>2025 8th International Conference on Information and Computer Technologies (ICICT)</i>. IEEE; 2025. doi:<a href=\"https://doi.org/10.1109/icict64582.2025.00010\">10.1109/icict64582.2025.00010</a>","bibtex":"@inproceedings{Eckertz_Sander_Masroor_Dumitrescu_2025, title={Linking Abstract Digital Twin Data to 3D Models: A Configurable Approach for Real-Time Adaptation}, DOI={<a href=\"https://doi.org/10.1109/icict64582.2025.00010\">10.1109/icict64582.2025.00010</a>}, booktitle={2025 8th International Conference on Information and Computer Technologies (ICICT)}, publisher={IEEE}, author={Eckertz, Daniel and Sander, Mattes and Masroor, Omar and Dumitrescu, Roman}, year={2025} }","mla":"Eckertz, Daniel, et al. “Linking Abstract Digital Twin Data to 3D Models: A Configurable Approach for Real-Time Adaptation.” <i>2025 8th International Conference on Information and Computer Technologies (ICICT)</i>, IEEE, 2025, doi:<a href=\"https://doi.org/10.1109/icict64582.2025.00010\">10.1109/icict64582.2025.00010</a>.","chicago":"Eckertz, Daniel, Mattes Sander, Omar Masroor, and Roman Dumitrescu. “Linking Abstract Digital Twin Data to 3D Models: A Configurable Approach for Real-Time Adaptation.” In <i>2025 8th International Conference on Information and Computer Technologies (ICICT)</i>. IEEE, 2025. <a href=\"https://doi.org/10.1109/icict64582.2025.00010\">https://doi.org/10.1109/icict64582.2025.00010</a>.","short":"D. Eckertz, M. Sander, O. Masroor, R. Dumitrescu, in: 2025 8th International Conference on Information and Computer Technologies (ICICT), IEEE, 2025.","apa":"Eckertz, D., Sander, M., Masroor, O., &#38; Dumitrescu, R. (2025). Linking Abstract Digital Twin Data to 3D Models: A Configurable Approach for Real-Time Adaptation. <i>2025 8th International Conference on Information and Computer Technologies (ICICT)</i>. <a href=\"https://doi.org/10.1109/icict64582.2025.00010\">https://doi.org/10.1109/icict64582.2025.00010</a>","ieee":"D. Eckertz, M. Sander, O. Masroor, and R. Dumitrescu, “Linking Abstract Digital Twin Data to 3D Models: A Configurable Approach for Real-Time Adaptation,” 2025, doi: <a href=\"https://doi.org/10.1109/icict64582.2025.00010\">10.1109/icict64582.2025.00010</a>."},"publication":"2025 8th International Conference on Information and Computer Technologies (ICICT)","date_created":"2025-10-24T06:48:13Z","department":[{"_id":"563"}],"type":"conference"},{"editor":[{"last_name":"Herberger","first_name":"David","full_name":"Herberger, David"},{"full_name":"Hübner, Marco","last_name":"Hübner","first_name":"Marco"}],"user_id":"15782","_id":"61998","publisher":"publish-Ing.","language":[{"iso":"eng"}],"page":"640-649","date_updated":"2025-10-24T09:16:50Z","author":[{"full_name":"Disselkamp, Jan-Philipp","last_name":"Disselkamp","first_name":"Jan-Philipp"},{"last_name":"Lick","first_name":"Jonas ","full_name":"Lick, Jonas "},{"full_name":"Azem, Ghayth ","last_name":"Azem","first_name":"Ghayth "},{"full_name":"Grothe, Robin ","first_name":"Robin ","last_name":"Grothe"},{"first_name":"Lukas ","last_name":"Ptock","full_name":"Ptock, Lukas "},{"first_name":"Matthias ","last_name":"Meyer","full_name":"Meyer, Matthias "},{"first_name":"Dominik ","last_name":"Kürpick","full_name":"Kürpick, Dominik "},{"first_name":"Aschot ","last_name":"Hovemann","full_name":"Hovemann, Aschot "},{"full_name":"Dumitrescu, Roman","last_name":"Dumitrescu","first_name":"Roman","id":"16190"}],"status":"public","year":"2025","title":"Generating An Automated Assembly Graph On The Basis Of The 3D-Geometry Of A Product Assembly Group","department":[{"_id":"563"}],"type":"conference","place":"Offenburg","date_created":"2025-10-24T09:16:47Z","citation":{"mla":"Disselkamp, Jan-Philipp, et al. “Generating An Automated Assembly Graph On The Basis Of The 3D-Geometry Of A Product Assembly Group.” <i>Proceedings of the Conference on Production Systems and Logistics: CPSL 2025</i>, edited by David Herberger and Marco Hübner, publish-Ing., 2025, pp. 640–49.","ama":"Disselkamp J-P, Lick J, Azem G, et al. Generating An Automated Assembly Graph On The Basis Of The 3D-Geometry Of A Product Assembly Group. In: Herberger D, Hübner M, eds. <i>Proceedings of the Conference on Production Systems and Logistics: CPSL 2025</i>. publish-Ing.; 2025:640-649.","bibtex":"@inproceedings{Disselkamp_Lick_Azem_Grothe_Ptock_Meyer_Kürpick_Hovemann_Dumitrescu_2025, place={Offenburg}, title={Generating An Automated Assembly Graph On The Basis Of The 3D-Geometry Of A Product Assembly Group}, booktitle={Proceedings of the Conference on Production Systems and Logistics: CPSL 2025}, publisher={publish-Ing.}, author={Disselkamp, Jan-Philipp and Lick, Jonas  and Azem, Ghayth  and Grothe, Robin  and Ptock, Lukas  and Meyer, Matthias  and Kürpick, Dominik  and Hovemann, Aschot  and Dumitrescu, Roman}, editor={Herberger, David and Hübner, Marco}, year={2025}, pages={640–649} }","apa":"Disselkamp, J.-P., Lick, J., Azem, G., Grothe, R., Ptock, L., Meyer, M., Kürpick, D., Hovemann, A., &#38; Dumitrescu, R. (2025). Generating An Automated Assembly Graph On The Basis Of The 3D-Geometry Of A Product Assembly Group. In D. Herberger &#38; M. Hübner (Eds.), <i>Proceedings of the Conference on Production Systems and Logistics: CPSL 2025</i> (pp. 640–649). publish-Ing.","ieee":"J.-P. Disselkamp <i>et al.</i>, “Generating An Automated Assembly Graph On The Basis Of The 3D-Geometry Of A Product Assembly Group,” in <i>Proceedings of the Conference on Production Systems and Logistics: CPSL 2025</i>, 2025, pp. 640–649.","short":"J.-P. Disselkamp, J. Lick, G. Azem, R. Grothe, L. Ptock, M. Meyer, D. Kürpick, A. Hovemann, R. Dumitrescu, in: D. Herberger, M. Hübner (Eds.), Proceedings of the Conference on Production Systems and Logistics: CPSL 2025, publish-Ing., Offenburg, 2025, pp. 640–649.","chicago":"Disselkamp, Jan-Philipp, Jonas  Lick, Ghayth  Azem, Robin  Grothe, Lukas  Ptock, Matthias  Meyer, Dominik  Kürpick, Aschot  Hovemann, and Roman Dumitrescu. “Generating An Automated Assembly Graph On The Basis Of The 3D-Geometry Of A Product Assembly Group.” In <i>Proceedings of the Conference on Production Systems and Logistics: CPSL 2025</i>, edited by David Herberger and Marco Hübner, 640–49. Offenburg: publish-Ing., 2025."},"publication":"Proceedings of the Conference on Production Systems and Logistics: CPSL 2025"},{"type":"journal_article","department":[{"_id":"79"}],"date_created":"2025-11-03T10:19:53Z","publication":"Theoretical Computer Science","citation":{"mla":"Hinnenthal, Kristian, et al. “Efficient Shape Formation by 3D Hybrid Programmable Matter: An Algorithm for Low Diameter Intermediate Structures.” <i>Theoretical Computer Science</i>, vol. 1057, 115552, Elsevier BV, 2025, doi:<a href=\"https://doi.org/10.1016/j.tcs.2025.115552\">10.1016/j.tcs.2025.115552</a>.","ama":"Hinnenthal K, Liedtke DJ, Scheideler C. Efficient shape formation by 3D hybrid programmable matter: An algorithm for low diameter intermediate structures. <i>Theoretical Computer Science</i>. 2025;1057. doi:<a href=\"https://doi.org/10.1016/j.tcs.2025.115552\">10.1016/j.tcs.2025.115552</a>","bibtex":"@article{Hinnenthal_Liedtke_Scheideler_2025, title={Efficient shape formation by 3D hybrid programmable matter: An algorithm for low diameter intermediate structures}, volume={1057}, DOI={<a href=\"https://doi.org/10.1016/j.tcs.2025.115552\">10.1016/j.tcs.2025.115552</a>}, number={115552}, journal={Theoretical Computer Science}, publisher={Elsevier BV}, author={Hinnenthal, Kristian and Liedtke, David Jan and Scheideler, Christian}, year={2025} }","apa":"Hinnenthal, K., Liedtke, D. J., &#38; Scheideler, C. (2025). Efficient shape formation by 3D hybrid programmable matter: An algorithm for low diameter intermediate structures. <i>Theoretical Computer Science</i>, <i>1057</i>, Article 115552. <a href=\"https://doi.org/10.1016/j.tcs.2025.115552\">https://doi.org/10.1016/j.tcs.2025.115552</a>","ieee":"K. Hinnenthal, D. J. Liedtke, and C. Scheideler, “Efficient shape formation by 3D hybrid programmable matter: An algorithm for low diameter intermediate structures,” <i>Theoretical Computer Science</i>, vol. 1057, Art. no. 115552, 2025, doi: <a href=\"https://doi.org/10.1016/j.tcs.2025.115552\">10.1016/j.tcs.2025.115552</a>.","chicago":"Hinnenthal, Kristian, David Jan Liedtke, and Christian Scheideler. “Efficient Shape Formation by 3D Hybrid Programmable Matter: An Algorithm for Low Diameter Intermediate Structures.” <i>Theoretical Computer Science</i> 1057 (2025). <a href=\"https://doi.org/10.1016/j.tcs.2025.115552\">https://doi.org/10.1016/j.tcs.2025.115552</a>.","short":"K. Hinnenthal, D.J. Liedtke, C. Scheideler, Theoretical Computer Science 1057 (2025)."},"doi":"10.1016/j.tcs.2025.115552","user_id":"55557","volume":1057,"article_number":"115552","publisher":"Elsevier BV","_id":"62051","language":[{"iso":"eng"}],"date_updated":"2025-11-03T10:21:52Z","publication_status":"published","intvolume":"      1057","year":"2025","status":"public","title":"Efficient shape formation by 3D hybrid programmable matter: An algorithm for low diameter intermediate structures","publication_identifier":{"issn":["0304-3975"]},"author":[{"id":"32229","full_name":"Hinnenthal, Kristian","first_name":"Kristian","last_name":"Hinnenthal"},{"last_name":"Liedtke","first_name":"David Jan","full_name":"Liedtke, David Jan","id":"55557"},{"id":"20792","first_name":"Christian","last_name":"Scheideler","full_name":"Scheideler, Christian"}]},{"citation":{"short":"J.D. Reimer, S. Holst, S. Sadeghi-Kohan, H.-J. Wunderlich, S. Hellebrand, in: IEEE International Symposium of Electronics Design Automation (ISEDA’25), May 2025, Hong Kong, China, 2025.","chicago":"Reimer, Jan Dennis, Stefan Holst, Somayeh Sadeghi-Kohan, Hans-Joachim Wunderlich, and Sybille Hellebrand. “ThorSim: Throughput-Oriented Timing Simulation of FinFET Digital Circuits.” In <i>IEEE International Symposium of Electronics Design Automation (ISEDA’25), May 2025</i>. Hong Kong, China, 2025.","apa":"Reimer, J. D., Holst, S., Sadeghi-Kohan, S., Wunderlich, H.-J., &#38; Hellebrand, S. (2025). ThorSim: Throughput-Oriented Timing Simulation of FinFET Digital Circuits. <i>IEEE International Symposium of Electronics Design Automation (ISEDA’25), May 2025</i>.","ieee":"J. D. Reimer, S. Holst, S. Sadeghi-Kohan, H.-J. Wunderlich, and S. Hellebrand, “ThorSim: Throughput-Oriented Timing Simulation of FinFET Digital Circuits,” 2025.","ama":"Reimer JD, Holst S, Sadeghi-Kohan S, Wunderlich H-J, Hellebrand S. ThorSim: Throughput-Oriented Timing Simulation of FinFET Digital Circuits. In: <i>IEEE International Symposium of Electronics Design Automation (ISEDA’25), May 2025</i>. ; 2025.","bibtex":"@inproceedings{Reimer_Holst_Sadeghi-Kohan_Wunderlich_Hellebrand_2025, place={Hong Kong, China}, title={ThorSim: Throughput-Oriented Timing Simulation of FinFET Digital Circuits}, booktitle={IEEE International Symposium of Electronics Design Automation (ISEDA’25), May 2025}, author={Reimer, Jan Dennis and Holst, Stefan and Sadeghi-Kohan, Somayeh and Wunderlich, Hans-Joachim and Hellebrand, Sybille}, year={2025} }","mla":"Reimer, Jan Dennis, et al. “ThorSim: Throughput-Oriented Timing Simulation of FinFET Digital Circuits.” <i>IEEE International Symposium of Electronics Design Automation (ISEDA’25), May 2025</i>, 2025."},"publication":"IEEE International Symposium of Electronics Design Automation (ISEDA'25), May 2025","date_created":"2025-03-31T15:57:21Z","place":"Hong Kong, China","department":[{"_id":"48"}],"type":"conference","author":[{"id":"36703","last_name":"Reimer","first_name":"Jan Dennis","full_name":"Reimer, Jan Dennis"},{"last_name":"Holst","first_name":"Stefan","full_name":"Holst, Stefan"},{"full_name":"Sadeghi-Kohan, Somayeh","last_name":"Sadeghi-Kohan","first_name":"Somayeh"},{"full_name":"Wunderlich, Hans-Joachim","first_name":"Hans-Joachim","last_name":"Wunderlich"},{"full_name":"Hellebrand, Sybille","first_name":"Sybille","last_name":"Hellebrand"}],"status":"public","year":"2025","title":"ThorSim: Throughput-Oriented Timing Simulation of FinFET Digital Circuits","date_updated":"2025-11-03T13:30:51Z","_id":"59218","language":[{"iso":"eng"}],"user_id":"36703"},{"project":[{"_id":"325","name":"Scale4Edge: Skalierbare Infrastruktur für Edge-Computing"}],"citation":{"ama":"Sadiye B, Iftekhar M, Müller W, Scheytt JC. 60-Gb/s 1:4 Demultiplexer in 22-nm FD-SOI Technology Using TSPC Logic: A Circuit-to-System-Level Analysis and Design. <i>IEEE Transactions on Very Large Scale Integration (VLSI) Systems</i>. Published online 2025. doi:<a href=\"https://doi.org/10.1109/TVLSI.2025.3625787\">10.1109/TVLSI.2025.3625787</a>","bibtex":"@article{Sadiye_Iftekhar_Müller_Scheytt_2025, title={60-Gb/s 1:4 Demultiplexer in 22-nm FD-SOI Technology Using TSPC Logic: A Circuit-to-System-Level Analysis and Design}, DOI={<a href=\"https://doi.org/10.1109/TVLSI.2025.3625787\">10.1109/TVLSI.2025.3625787</a>}, journal={IEEE Transactions on Very Large Scale Integration (VLSI) Systems}, publisher={IEEE}, author={Sadiye, Babak and Iftekhar, Mohammed and Müller, Wolfgang and Scheytt, J. Christoph}, year={2025} }","mla":"Sadiye, Babak, et al. “60-Gb/s 1:4 Demultiplexer in 22-Nm FD-SOI Technology Using TSPC Logic: A Circuit-to-System-Level Analysis and Design.” <i>IEEE Transactions on Very Large Scale Integration (VLSI) Systems</i>, IEEE, 2025, doi:<a href=\"https://doi.org/10.1109/TVLSI.2025.3625787\">10.1109/TVLSI.2025.3625787</a>.","chicago":"Sadiye, Babak, Mohammed Iftekhar, Wolfgang Müller, and J. Christoph Scheytt. “60-Gb/s 1:4 Demultiplexer in 22-Nm FD-SOI Technology Using TSPC Logic: A Circuit-to-System-Level Analysis and Design.” <i>IEEE Transactions on Very Large Scale Integration (VLSI) Systems</i>, 2025. <a href=\"https://doi.org/10.1109/TVLSI.2025.3625787\">https://doi.org/10.1109/TVLSI.2025.3625787</a>.","short":"B. Sadiye, M. Iftekhar, W. Müller, J.C. Scheytt, IEEE Transactions on Very Large Scale Integration (VLSI) Systems (2025).","apa":"Sadiye, B., Iftekhar, M., Müller, W., &#38; Scheytt, J. C. (2025). 60-Gb/s 1:4 Demultiplexer in 22-nm FD-SOI Technology Using TSPC Logic: A Circuit-to-System-Level Analysis and Design. <i>IEEE Transactions on Very Large Scale Integration (VLSI) Systems</i>. <a href=\"https://doi.org/10.1109/TVLSI.2025.3625787\">https://doi.org/10.1109/TVLSI.2025.3625787</a>","ieee":"B. Sadiye, M. Iftekhar, W. Müller, and J. C. Scheytt, “60-Gb/s 1:4 Demultiplexer in 22-nm FD-SOI Technology Using TSPC Logic: A Circuit-to-System-Level Analysis and Design,” <i>IEEE Transactions on Very Large Scale Integration (VLSI) Systems</i>, 2025, doi: <a href=\"https://doi.org/10.1109/TVLSI.2025.3625787\">10.1109/TVLSI.2025.3625787</a>."},"publication":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","department":[{"_id":"58"}],"type":"journal_article","date_created":"2025-11-10T08:31:47Z","date_updated":"2025-11-10T08:38:07Z","publication_status":"published","publication_identifier":{"issn":["1063-8210"]},"author":[{"id":"93634","full_name":"Sadiye, Babak","last_name":"Sadiye","first_name":"Babak"},{"id":"47944","full_name":"Iftekhar, Mohammed","first_name":"Mohammed","last_name":"Iftekhar"},{"id":"16243","last_name":"Müller","first_name":"Wolfgang","full_name":"Müller, Wolfgang"},{"first_name":"J. Christoph","orcid":"0000-0002-5950-6618 ","last_name":"Scheytt","full_name":"Scheytt, J. Christoph","id":"37144"}],"year":"2025","status":"public","title":"60-Gb/s 1:4 Demultiplexer in 22-nm FD-SOI Technology Using TSPC Logic: A Circuit-to-System-Level Analysis and Design","doi":"10.1109/TVLSI.2025.3625787","user_id":"93634","_id":"62148","publisher":"IEEE","language":[{"iso":"eng"}]},{"date_created":"2025-11-12T10:06:39Z","type":"dissertation","department":[{"_id":"59"},{"_id":"61"},{"_id":"485"}],"abstract":[{"lang":"eng","text":"Diese Dissertation befasst sich mit der Entwicklung eines induktiv-basierten Lokalisierungsverfahrens mittels planarer Spulen, das auf magnetischer Kopplung beruht. Grundlage ist die elektromagnetische Induktion, bei der sich die entstehende Spannung proportional zur Gegeninduktivität verhält. Das Verfahren arbeitet im physikalischen Nahfeld und im Frequenzbereich von einigen kHz bis MHz, um eine effiziente Kopplung ohne Ausbreitung elektromagnetischer Wellen zu gewährleisten. Im Vergleich zu etablierten Verfahren wie GPS oder Ultraschall zeigt die induktive Ortung Vorteile bei kurzer Reichweite, insbesondere durch hohe Genauigkeit im Zentimeterbereich und geringe Materialabhängigkeit. Zudem lässt sie sich in bestehende Technologien wie bei der drahtlosen Energieübertragung integrieren und durch Sensorfusion mit anderen Verfahren kombinieren. Zur Modellierung und Optimierung werden physikalische Eigenschaften von planaren Spulen und EM-Feldern analysiert und elektrische Ersatzschaltbilder eingesetzt. Die geometriebasierte Berechnung der Gegeninduktivität ermöglicht die Entwicklung und Bewertung geeigneter Ortungsalgorithmen. Stochastische Filterverfahren verbessern zusätzlich die Robustheit gegenüber Umgebungseinflüssen. Abschließend wird eine modulare Simulationsplattform vorgestellt, die als Grundlage für die Generierung von Trainingsdaten sowie zur Weiterentwicklung von Mess-, Ortungs- und Filtermethoden dient."},{"lang":"eng","text":"This dissertation addresses the development of an inductively based localization method using planar coils, which relies on magnetic coupling. The underlying principle is electromagnetic induction, where the resulting voltage is proportional to the mutual inductance. The method operates in the physical near field and within a frequency range from a few kHz to MHz, ensuring efficient coupling without the propagation of electromagnetic waves. Compared to established methods such as GPS or ultrasound, inductive localization offers advantages at short range—particularly high accuracy in the centimeter range and low dependency on surrounding materials. Additionally, it can be integrated into existing technologies, such as wireless power transfer systems, and combined with other methods through sensor fusion. To support modeling and optimization, the physical properties of planar coils and electromagnetic fields are analyzed, and equivalent electrical circuit models are used. Geometry-based calculations of mutual inductance enable the development and evaluation of suitable localization algorithms. Stochastic filtering methods further enhance robustness against environmental influences. Finally, a modular simulation platform is presented, which serves as a foundation for generating training data as well as for the further development of measurement, localization, and filtering methods."}],"main_file_link":[{"open_access":"1","url":"https://digital.ub.uni-paderborn.de/hs/content/titleinfo/8122147"}],"language":[{"iso":"ger"}],"doi":"10.17619/UNIPB/1-2436","title":"Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme","year":"2025","author":[{"full_name":"Lange, Sven","last_name":"Lange","orcid":"0009-0007-9150-2266 ","first_name":"Sven","id":"38240"}],"date_updated":"2025-11-12T10:15:29Z","publication_status":"published","place":"Paderborn","oa":"1","supervisor":[{"orcid":"0000-0001-7059-9862","last_name":"Förstner","first_name":"Jens","full_name":"Förstner, Jens","id":"158"},{"last_name":"Stiemer","first_name":"Marcus","full_name":"Stiemer, Marcus"}],"citation":{"apa":"Lange, S. (2025). <i>Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>. Universitätsbibliothek Paderborn. <a href=\"https://doi.org/10.17619/UNIPB/1-2436\">https://doi.org/10.17619/UNIPB/1-2436</a>","mla":"Lange, Sven. <i>Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>. Universitätsbibliothek Paderborn, 2025, doi:<a href=\"https://doi.org/10.17619/UNIPB/1-2436\">10.17619/UNIPB/1-2436</a>.","ieee":"S. Lange, <i>Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>. Paderborn: Universitätsbibliothek Paderborn, 2025.","short":"S. Lange, Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme, Universitätsbibliothek Paderborn, Paderborn, 2025.","ama":"Lange S. <i>Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>. Universitätsbibliothek Paderborn; 2025. doi:<a href=\"https://doi.org/10.17619/UNIPB/1-2436\">10.17619/UNIPB/1-2436</a>","chicago":"Lange, Sven. <i>Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme</i>. Paderborn: Universitätsbibliothek Paderborn, 2025. <a href=\"https://doi.org/10.17619/UNIPB/1-2436\">https://doi.org/10.17619/UNIPB/1-2436</a>.","bibtex":"@book{Lange_2025, place={Paderborn}, title={Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme}, DOI={<a href=\"https://doi.org/10.17619/UNIPB/1-2436\">10.17619/UNIPB/1-2436</a>}, publisher={Universitätsbibliothek Paderborn}, author={Lange, Sven}, year={2025} }"},"page":"247","_id":"62167","publisher":"Universitätsbibliothek Paderborn","user_id":"38240","status":"public"},{"language":[{"iso":"eng"}],"doi":"10.1016/j.jmapro.2025.09.059","year":"2025","title":"From simulation to metamodel to experiment: Evaluating the prediction accuracy of polynomial regression models for clinch joint properties","author":[{"full_name":"Einwag, Jonathan-Markus","last_name":"Einwag","first_name":"Jonathan-Markus"},{"first_name":"Christian","last_name":"Steinfelder","full_name":"Steinfelder, Christian"},{"full_name":"Wartzack, Sandro","first_name":"Sandro","last_name":"Wartzack"},{"full_name":"Brosius, Alexander","last_name":"Brosius","first_name":"Alexander"},{"full_name":"Goetz, Stefan","last_name":"Goetz","first_name":"Stefan"}],"publication_identifier":{"issn":["1526-6125"]},"publication_status":"published","date_updated":"2025-11-12T08:35:35Z","intvolume":"       154","date_created":"2025-10-06T07:37:24Z","type":"journal_article","department":[{"_id":"43"},{"_id":"157"}],"publication":"Journal of Manufacturing Processes","page":"179-191","_id":"61524","publisher":"Elsevier BV","user_id":"107109","volume":154,"status":"public","citation":{"mla":"Einwag, Jonathan-Markus, et al. “From Simulation to Metamodel to Experiment: Evaluating the Prediction Accuracy of Polynomial Regression Models for Clinch Joint Properties.” <i>Journal of Manufacturing Processes</i>, vol. 154, Elsevier BV, 2025, pp. 179–91, doi:<a href=\"https://doi.org/10.1016/j.jmapro.2025.09.059\">10.1016/j.jmapro.2025.09.059</a>.","apa":"Einwag, J.-M., Steinfelder, C., Wartzack, S., Brosius, A., &#38; Goetz, S. (2025). From simulation to metamodel to experiment: Evaluating the prediction accuracy of polynomial regression models for clinch joint properties. <i>Journal of Manufacturing Processes</i>, <i>154</i>, 179–191. <a href=\"https://doi.org/10.1016/j.jmapro.2025.09.059\">https://doi.org/10.1016/j.jmapro.2025.09.059</a>","ieee":"J.-M. Einwag, C. Steinfelder, S. Wartzack, A. Brosius, and S. Goetz, “From simulation to metamodel to experiment: Evaluating the prediction accuracy of polynomial regression models for clinch joint properties,” <i>Journal of Manufacturing Processes</i>, vol. 154, pp. 179–191, 2025, doi: <a href=\"https://doi.org/10.1016/j.jmapro.2025.09.059\">10.1016/j.jmapro.2025.09.059</a>.","ama":"Einwag J-M, Steinfelder C, Wartzack S, Brosius A, Goetz S. From simulation to metamodel to experiment: Evaluating the prediction accuracy of polynomial regression models for clinch joint properties. <i>Journal of Manufacturing Processes</i>. 2025;154:179-191. doi:<a href=\"https://doi.org/10.1016/j.jmapro.2025.09.059\">10.1016/j.jmapro.2025.09.059</a>","short":"J.-M. Einwag, C. Steinfelder, S. Wartzack, A. Brosius, S. Goetz, Journal of Manufacturing Processes 154 (2025) 179–191.","chicago":"Einwag, Jonathan-Markus, Christian Steinfelder, Sandro Wartzack, Alexander Brosius, and Stefan Goetz. “From Simulation to Metamodel to Experiment: Evaluating the Prediction Accuracy of Polynomial Regression Models for Clinch Joint Properties.” <i>Journal of Manufacturing Processes</i> 154 (2025): 179–91. <a href=\"https://doi.org/10.1016/j.jmapro.2025.09.059\">https://doi.org/10.1016/j.jmapro.2025.09.059</a>.","bibtex":"@article{Einwag_Steinfelder_Wartzack_Brosius_Goetz_2025, title={From simulation to metamodel to experiment: Evaluating the prediction accuracy of polynomial regression models for clinch joint properties}, volume={154}, DOI={<a href=\"https://doi.org/10.1016/j.jmapro.2025.09.059\">10.1016/j.jmapro.2025.09.059</a>}, journal={Journal of Manufacturing Processes}, publisher={Elsevier BV}, author={Einwag, Jonathan-Markus and Steinfelder, Christian and Wartzack, Sandro and Brosius, Alexander and Goetz, Stefan}, year={2025}, pages={179–191} }"},"project":[{"_id":"130","name":"TRR 285:  Methodenentwicklung zur mechanischen Fügbarkeit in wandlungsfähigen Prozessketten"},{"_id":"132","name":"TRR 285 - Project Area B"},{"name":"TRR 285 - Subproject B01","_id":"140"},{"name":"TRR 285 - Subproject B05","_id":"144"}]},{"quality_controlled":"1","abstract":[{"lang":"eng","text":"<p> Executive summary Die vorliegende Zukunftsstudie „Automation 2035“ gibt einen Ausblick auf die Entwicklung der Automatisierungstechnik in den nächsten 10 Jahren. Neben der Beschreibung von Trends wie Kreislaufwirtschaft, Automatisierung der Märkte, Biologisierung, autonome Systeme und Robotik sowie IT-Sicherheit wird die zu erwartende Veränderung in der Bildung beschrieben. Dazu verwenden wir Methoden der Zukunftsforschung und arbeiten mit der Szenarientechnik, um Zukunftsperspektiven der Automation aufzuzeigen. Personas werden eingesetzt, um die zukünftigen Entwicklungen plastisch aus den Augen der Personen im Jahr 2025 und in der Zukunft im Jahr 2035 zu beschreiben. Schlüsselthemen und Trends: ... ... Inhalt Executive summary 1 1 Einführung 3 2 Zukunftsfelder für die Automatisierungstechnik 2035 4 2.1 Kreislaufwirtschaft 4 2.2 Automatisierung der Märkte 7 2.3 Biologisierung 8 2.4 Autonome Systeme und Robotik 10 2.5 Security 12 2.6 Veränderung der Ausbildung 13 3 Szenario der Automation 2035 16 4 Personas 18 4.1 Unternehmer 18 4.2 Ingenieurin 19 4.3 Schüler 20 5 Thesen und Ausblick 22 Methodik 24 Autorenteam 25 Schrifttum 26... </p>"}],"citation":{"ieee":"I. Gräßler <i>et al.</i>, <i>Automation 2035</i>. VDI Verlag, 2025.","apa":"Gräßler, I., Özcan, D., Tusek, A. M., Bilgic, A., Lange, C., Stich, C., Maul, C., Heizmann, M., Weyrich, M., Dessel, S., Miny, T., &#38; Jumar, U. (2025). <i>Automation 2035</i>. VDI Verlag. <a href=\"https://doi.org/10.51202/9783911670180\">https://doi.org/10.51202/9783911670180</a>","mla":"Gräßler, Iris, et al. <i>Automation 2035</i>. VDI Verlag, 2025, doi:<a href=\"https://doi.org/10.51202/9783911670180\">10.51202/9783911670180</a>.","bibtex":"@book{Gräßler_Özcan_Tusek_Bilgic_Lange_Stich_Maul_Heizmann_Weyrich_Dessel,_et al._2025, title={Automation 2035}, DOI={<a href=\"https://doi.org/10.51202/9783911670180\">10.51202/9783911670180</a>}, publisher={VDI Verlag}, author={Gräßler, Iris and Özcan, Deniz and Tusek, Alena Marie and Bilgic, Attila and Lange, Christian and Stich, Christian and Maul, Christine and Heizmann, Michael and Weyrich, Michael and Dessel, Sascha and et al.}, year={2025} }","chicago":"Gräßler, Iris, Deniz Özcan, Alena Marie Tusek, Attila Bilgic, Christian Lange, Christian Stich, Christine Maul, et al. <i>Automation 2035</i>. VDI Verlag, 2025. <a href=\"https://doi.org/10.51202/9783911670180\">https://doi.org/10.51202/9783911670180</a>.","ama":"Gräßler I, Özcan D, Tusek AM, et al. <i>Automation 2035</i>. VDI Verlag; 2025. doi:<a href=\"https://doi.org/10.51202/9783911670180\">10.51202/9783911670180</a>","short":"I. Gräßler, D. Özcan, A.M. Tusek, A. Bilgic, C. Lange, C. Stich, C. Maul, M. Heizmann, M. Weyrich, S. Dessel, T. Miny, U. Jumar, Automation 2035, VDI Verlag, 2025."},"type":"book","department":[{"_id":"43"},{"_id":"9"},{"_id":"26"},{"_id":"152"}],"date_created":"2025-11-13T16:43:05Z","publication_status":"published","date_updated":"2025-11-13T16:48:43Z","title":"Automation 2035","status":"public","year":"2025","author":[{"id":"47565","full_name":"Gräßler, Iris","orcid":"0000-0001-5765-971X","first_name":"Iris","last_name":"Gräßler"},{"id":"58595","first_name":"Deniz","last_name":"Özcan","full_name":"Özcan, Deniz"},{"full_name":"Tusek, Alena Marie","first_name":"Alena Marie","last_name":"Tusek","id":"59370"},{"full_name":"Bilgic, Attila","last_name":"Bilgic","first_name":"Attila"},{"first_name":"Christian","last_name":"Lange","full_name":"Lange, Christian"},{"first_name":"Christian","last_name":"Stich","full_name":"Stich, Christian"},{"full_name":"Maul, Christine","first_name":"Christine","last_name":"Maul"},{"last_name":"Heizmann","first_name":"Michael","full_name":"Heizmann, Michael"},{"full_name":"Weyrich, Michael","first_name":"Michael","last_name":"Weyrich"},{"full_name":"Dessel,, Sascha","first_name":"Sascha","last_name":"Dessel,"},{"last_name":"Miny","first_name":"Torben","full_name":"Miny, Torben"},{"last_name":"Jumar","first_name":"Ulrich","full_name":"Jumar, Ulrich"}],"publication_identifier":{"isbn":["9783911670180"]},"user_id":"58595","doi":"10.51202/9783911670180","alternative_title":["VDI-Studie"],"language":[{"iso":"eng"}],"_id":"62182","publisher":"VDI Verlag"},{"oa":"1","citation":{"ieee":"D. Li <i>et al.</i>, “In vacuum metasurface for optical microtrap array,” <i>Optics Express</i>, vol. 33, no. 24, Art. no. 51085, 2025, doi: <a href=\"https://doi.org/10.1364/oe.580201\">10.1364/oe.580201</a>.","apa":"Li, D., Liao, Q., Xu, B., Zentgraf, T., Narvaez Castaneda, E., Zhou, Y., Qin, K., Xu, Z., Shen, H., &#38; Huang, L. (2025). In vacuum metasurface for optical microtrap array. <i>Optics Express</i>, <i>33</i>(24), Article 51085. <a href=\"https://doi.org/10.1364/oe.580201\">https://doi.org/10.1364/oe.580201</a>","chicago":"Li, Donghao, Qiming Liao, Beining Xu, Thomas Zentgraf, Emmanuel Narvaez Castaneda, Yaoting Zhou, Keyu Qin, Zhongxiao Xu, Heng Shen, and Lingling Huang. “In Vacuum Metasurface for Optical Microtrap Array.” <i>Optics Express</i> 33, no. 24 (2025). <a href=\"https://doi.org/10.1364/oe.580201\">https://doi.org/10.1364/oe.580201</a>.","short":"D. Li, Q. Liao, B. Xu, T. Zentgraf, E. Narvaez Castaneda, Y. Zhou, K. Qin, Z. Xu, H. Shen, L. Huang, Optics Express 33 (2025).","mla":"Li, Donghao, et al. “In Vacuum Metasurface for Optical Microtrap Array.” <i>Optics Express</i>, vol. 33, no. 24, 51085, Optica Publishing Group, 2025, doi:<a href=\"https://doi.org/10.1364/oe.580201\">10.1364/oe.580201</a>.","bibtex":"@article{Li_Liao_Xu_Zentgraf_Narvaez Castaneda_Zhou_Qin_Xu_Shen_Huang_2025, title={In vacuum metasurface for optical microtrap array}, volume={33}, DOI={<a href=\"https://doi.org/10.1364/oe.580201\">10.1364/oe.580201</a>}, number={2451085}, journal={Optics Express}, publisher={Optica Publishing Group}, author={Li, Donghao and Liao, Qiming and Xu, Beining and Zentgraf, Thomas and Narvaez Castaneda, Emmanuel and Zhou, Yaoting and Qin, Keyu and Xu, Zhongxiao and Shen, Heng and Huang, Lingling}, year={2025} }","ama":"Li D, Liao Q, Xu B, et al. In vacuum metasurface for optical microtrap array. <i>Optics Express</i>. 2025;33(24). doi:<a href=\"https://doi.org/10.1364/oe.580201\">10.1364/oe.580201</a>"},"quality_controlled":"1","publisher":"Optica Publishing Group","_id":"62286","volume":33,"user_id":"30525","status":"public","date_created":"2025-11-24T06:31:17Z","department":[{"_id":"15"},{"_id":"230"},{"_id":"289"},{"_id":"623"}],"type":"journal_article","issue":"24","publication":"Optics Express","abstract":[{"text":"Optical tweezer arrays of laser-cooled and individually controlled particles have revolutionized atomic, molecular, and optical physics. They afford exquisite capabilities for applications in quantum simulation of many-body physics, quantum computation, and sensing. Underlying this development is the technical maturity of generating scalable optical beams, enabled by active components and a high numerical aperture objective. However, such a complex combination of bulk optics outside the vacuum chamber is very sensitive to any vibration and drift. Here, we demonstrate the generation of a 3 × 3 static tweezer array with a single chip-scale multifunctional metasurface element in vacuum, replacing the meter-long free space optics. Fluorescence counts on the camera validate the successful trapping of the atomic ensemble array and showcase a promising strategy for integrated photonics with cold atom systems. The introduction of a polarization independent dual-wavelength metasurface significantly enhances fluorescence collection efficiency while reducing experimental complexity. This approach paves the way for scalable neutral atom platforms and offers a compelling route towards the realization of next generation quantum metasurfaces.","lang":"eng"}],"language":[{"iso":"eng"}],"main_file_link":[{"open_access":"1","url":"https://opg.optica.org/oe/fulltext.cfm?uri=oe-33-24-51085"}],"article_number":"51085","doi":"10.1364/oe.580201","author":[{"first_name":"Donghao","last_name":"Li","full_name":"Li, Donghao"},{"full_name":"Liao, Qiming","last_name":"Liao","first_name":"Qiming"},{"full_name":"Xu, Beining","first_name":"Beining","last_name":"Xu"},{"full_name":"Zentgraf, Thomas","first_name":"Thomas","last_name":"Zentgraf","orcid":"0000-0002-8662-1101","id":"30525"},{"first_name":"Emmanuel","last_name":"Narvaez Castaneda","full_name":"Narvaez Castaneda, Emmanuel"},{"full_name":"Zhou, Yaoting","last_name":"Zhou","first_name":"Yaoting"},{"full_name":"Qin, Keyu","first_name":"Keyu","last_name":"Qin"},{"first_name":"Zhongxiao","last_name":"Xu","full_name":"Xu, Zhongxiao"},{"last_name":"Shen","first_name":"Heng","full_name":"Shen, Heng"},{"full_name":"Huang, Lingling","last_name":"Huang","first_name":"Lingling"}],"publication_identifier":{"issn":["1094-4087"]},"title":"In vacuum metasurface for optical microtrap array","year":"2025","intvolume":"        33","article_type":"original","date_updated":"2025-11-24T06:35:19Z","publication_status":"published"},{"editor":[{"full_name":"Farina, Mirko ","last_name":"Farina","first_name":"Mirko "},{"full_name":"Yu, Xiao ","last_name":"Yu","first_name":"Xiao "},{"full_name":"Chen, Jin","first_name":"Jin","last_name":"Chen"}],"doi":"10.4324/9781003567622-22","user_id":"93637","_id":"62305","publisher":"Routledge","language":[{"iso":"eng"}],"date_updated":"2025-11-25T21:25:31Z","publication_status":"published","publication_identifier":{"isbn":["9781003567622"]},"author":[{"id":"102524","full_name":"Reijers, Wessel","last_name":"Reijers","first_name":"Wessel","orcid":"0000-0003-2505-1587"},{"first_name":"Tobias","last_name":"Matzner","full_name":"Matzner, Tobias","id":"65695"},{"first_name":"Suzana","last_name":"Alpsancar","full_name":"Alpsancar, Suzana","id":"93637"}],"year":"2025","status":"public","title":"Explainability and AI Governance","department":[{"_id":"26"},{"_id":"756"},{"_id":"660"}],"type":"book_chapter","place":"New York","date_created":"2025-11-25T17:58:04Z","project":[{"_id":"370","name":"TRR 318; TP B06: Ethik und Normativität der erklärbaren KI"}],"citation":{"mla":"Reijers, Wessel, et al. “Explainability and AI Governance.” <i>Digital Development. Technology, Ethics and Governance</i>, edited by Mirko  Farina et al., Routledge, 2025, doi:<a href=\"https://doi.org/10.4324/9781003567622-22\">10.4324/9781003567622-22</a>.","ama":"Reijers W, Matzner T, Alpsancar S. Explainability and AI Governance. In: Farina M, Yu X, Chen J, eds. <i>Digital Development. Technology, Ethics and Governance</i>. Routledge; 2025. doi:<a href=\"https://doi.org/10.4324/9781003567622-22\">10.4324/9781003567622-22</a>","bibtex":"@inbook{Reijers_Matzner_Alpsancar_2025, place={New York}, title={Explainability and AI Governance}, DOI={<a href=\"https://doi.org/10.4324/9781003567622-22\">10.4324/9781003567622-22</a>}, booktitle={Digital Development. Technology, Ethics and Governance}, publisher={Routledge}, author={Reijers, Wessel and Matzner, Tobias and Alpsancar, Suzana}, editor={Farina, Mirko  and Yu, Xiao  and Chen, Jin}, year={2025} }","apa":"Reijers, W., Matzner, T., &#38; Alpsancar, S. (2025). Explainability and AI Governance. In M. Farina, X. Yu, &#38; J. Chen (Eds.), <i>Digital Development. Technology, Ethics and Governance</i>. Routledge. <a href=\"https://doi.org/10.4324/9781003567622-22\">https://doi.org/10.4324/9781003567622-22</a>","ieee":"W. Reijers, T. Matzner, and S. Alpsancar, “Explainability and AI Governance,” in <i>Digital Development. Technology, Ethics and Governance</i>, M. Farina, X. Yu, and J. Chen, Eds. New York: Routledge, 2025.","chicago":"Reijers, Wessel, Tobias Matzner, and Suzana Alpsancar. “Explainability and AI Governance.” In <i>Digital Development. Technology, Ethics and Governance</i>, edited by Mirko  Farina, Xiao  Yu, and Jin Chen. New York: Routledge, 2025. <a href=\"https://doi.org/10.4324/9781003567622-22\">https://doi.org/10.4324/9781003567622-22</a>.","short":"W. Reijers, T. Matzner, S. Alpsancar, in: M. Farina, X. Yu, J. Chen (Eds.), Digital Development. Technology, Ethics and Governance, Routledge, New York, 2025."},"publication":"Digital Development. Technology, Ethics and Governance"},{"date_updated":"2025-11-27T07:16:01Z","intvolume":"        43","status":"public","title":"Forward-Biased Silicon Phase Shifter Modeling for Electronic-Photonic Co-Simulation and Validation in a 250 nm EPIC BiCMOS Technology","year":"2025","author":[{"last_name":"Schwabe","first_name":"Tobias","full_name":"Schwabe, Tobias","id":"39217"},{"id":"13256","orcid":"0000-0002-4403-2237","first_name":"Christian","last_name":"Kress","full_name":"Kress, Christian"},{"full_name":"Kruse, Stephan","last_name":"Kruse","first_name":"Stephan","id":"38254"},{"orcid":"0000-0003-2699-9839","first_name":"Maxim","last_name":"Weizel","full_name":"Weizel, Maxim","id":"44271"},{"last_name":"Rhee","first_name":"Hanjo","full_name":"Rhee, Hanjo"},{"full_name":"Scheytt, J. Christoph","first_name":"J. Christoph","last_name":"Scheytt","orcid":"0000-0002-5950-6618 ","id":"37144"}],"user_id":"38254","doi":"10.1109/JLT.2024.3450949","volume":43,"page":"255-270","language":[{"iso":"eng"}],"_id":"62643","publication":"Journal of Lightwave Technology","issue":"1","citation":{"short":"T. Schwabe, C. Kress, S. Kruse, M. Weizel, H. Rhee, J.C. Scheytt, Journal of Lightwave Technology 43 (2025) 255–270.","ama":"Schwabe T, Kress C, Kruse S, Weizel M, Rhee H, Scheytt JC. Forward-Biased Silicon Phase Shifter Modeling for Electronic-Photonic Co-Simulation and Validation in a 250 nm EPIC BiCMOS Technology. <i>Journal of Lightwave Technology</i>. 2025;43(1):255-270. doi:<a href=\"https://doi.org/10.1109/JLT.2024.3450949\">10.1109/JLT.2024.3450949</a>","chicago":"Schwabe, Tobias, Christian Kress, Stephan Kruse, Maxim Weizel, Hanjo Rhee, and J. Christoph Scheytt. “Forward-Biased Silicon Phase Shifter Modeling for Electronic-Photonic Co-Simulation and Validation in a 250 Nm EPIC BiCMOS Technology.” <i>Journal of Lightwave Technology</i> 43, no. 1 (2025): 255–70. <a href=\"https://doi.org/10.1109/JLT.2024.3450949\">https://doi.org/10.1109/JLT.2024.3450949</a>.","bibtex":"@article{Schwabe_Kress_Kruse_Weizel_Rhee_Scheytt_2025, title={Forward-Biased Silicon Phase Shifter Modeling for Electronic-Photonic Co-Simulation and Validation in a 250 nm EPIC BiCMOS Technology}, volume={43}, DOI={<a href=\"https://doi.org/10.1109/JLT.2024.3450949\">10.1109/JLT.2024.3450949</a>}, number={1}, journal={Journal of Lightwave Technology}, author={Schwabe, Tobias and Kress, Christian and Kruse, Stephan and Weizel, Maxim and Rhee, Hanjo and Scheytt, J. Christoph}, year={2025}, pages={255–270} }","apa":"Schwabe, T., Kress, C., Kruse, S., Weizel, M., Rhee, H., &#38; Scheytt, J. C. (2025). Forward-Biased Silicon Phase Shifter Modeling for Electronic-Photonic Co-Simulation and Validation in a 250 nm EPIC BiCMOS Technology. <i>Journal of Lightwave Technology</i>, <i>43</i>(1), 255–270. <a href=\"https://doi.org/10.1109/JLT.2024.3450949\">https://doi.org/10.1109/JLT.2024.3450949</a>","mla":"Schwabe, Tobias, et al. “Forward-Biased Silicon Phase Shifter Modeling for Electronic-Photonic Co-Simulation and Validation in a 250 Nm EPIC BiCMOS Technology.” <i>Journal of Lightwave Technology</i>, vol. 43, no. 1, 2025, pp. 255–70, doi:<a href=\"https://doi.org/10.1109/JLT.2024.3450949\">10.1109/JLT.2024.3450949</a>.","ieee":"T. Schwabe, C. Kress, S. Kruse, M. Weizel, H. Rhee, and J. C. Scheytt, “Forward-Biased Silicon Phase Shifter Modeling for Electronic-Photonic Co-Simulation and Validation in a 250 nm EPIC BiCMOS Technology,” <i>Journal of Lightwave Technology</i>, vol. 43, no. 1, pp. 255–270, 2025, doi: <a href=\"https://doi.org/10.1109/JLT.2024.3450949\">10.1109/JLT.2024.3450949</a>."},"keyword":["Integrated circuit modeling","Capacitance","Silicon","Modulation","Adaptation models","Semiconductor device modeling","Bandwidth","Data communication","electrooptical transmitter","equalization","free-carrier-plasma dispersion effect","modelling","optical modulator","phase shifter","silicon photonics"],"type":"journal_article","department":[{"_id":"58"}],"date_created":"2025-11-27T07:14:34Z"},{"abstract":[{"text":"<jats:title>ABSTRACT</jats:title>\r\n                  <jats:p>Effective manipulation of photonic spin–orbit coupling (SOC) in microcavities is of fundamental importance within topological photonics and applications. Anisotropic organic single‐crystalline materials can induce abundant SOC phenomenon due to their flexible tunability of molecular geometries, however, the intrinsic relationship between molecular geometries/orientations in 3D space and photonic SOC is lacking. In this study, we design two kinds of 2D organic polymorphs for the construction of organic microcavities to investigate the structure‐performance relationships. In two polymorphic microcavities, two distinctive photonic SOC phenomena are observed regardless of the in‐plane anisotropy of organic polymorphs. Theoretical analysis indicates that the photonic SOC strength is strongly influenced by the synergies between the crystal anisotropy and the tilted collective molecular transition dipole moment. Our results uncover the correlation mechanism between the structure of molecules and photonic SOC and open an avenue to engineer complex photonic SOC by use of organic microstructures towards the development of diverse integrated photonic devices.</jats:p>","lang":"eng"}],"publication":"Laser &amp; Photonics Reviews","citation":{"mla":"Ji, Ying, et al. “Molecular Orientation‐Dependent Photonic Spin–Orbit Coupling in Organic Microcavities Filled with 2D Polymorphic Crystals.” <i>Laser &#38;amp; Photonics Reviews</i>, e01874, Wiley, 2025, doi:<a href=\"https://doi.org/10.1002/lpor.202501874\">10.1002/lpor.202501874</a>.","bibtex":"@article{Ji_Ma_Huang_Deng_Wang_Long_Li_Zhao_Li_An_et al._2025, title={Molecular Orientation‐Dependent Photonic Spin–Orbit Coupling in Organic Microcavities Filled with 2D Polymorphic Crystals}, DOI={<a href=\"https://doi.org/10.1002/lpor.202501874\">10.1002/lpor.202501874</a>}, number={e01874}, journal={Laser &#38;amp; Photonics Reviews}, publisher={Wiley}, author={Ji, Ying and Ma, Xuekai and Huang, Han and Deng, Yibo and Wang, Pingyang and Long, Teng and Li, Yuan and Zhao, Ruiyang and Li, Yunfei and An, Cunbin and et al.}, year={2025} }","ama":"Ji Y, Ma X, Huang H, et al. Molecular Orientation‐Dependent Photonic Spin–Orbit Coupling in Organic Microcavities Filled with 2D Polymorphic Crystals. <i>Laser &#38;amp; Photonics Reviews</i>. Published online 2025. doi:<a href=\"https://doi.org/10.1002/lpor.202501874\">10.1002/lpor.202501874</a>","ieee":"Y. Ji <i>et al.</i>, “Molecular Orientation‐Dependent Photonic Spin–Orbit Coupling in Organic Microcavities Filled with 2D Polymorphic Crystals,” <i>Laser &#38;amp; Photonics Reviews</i>, Art. no. e01874, 2025, doi: <a href=\"https://doi.org/10.1002/lpor.202501874\">10.1002/lpor.202501874</a>.","apa":"Ji, Y., Ma, X., Huang, H., Deng, Y., Wang, P., Long, T., Li, Y., Zhao, R., Li, Y., An, C., Schumacher, S., Gu, C., Liao, B., Fu, H., &#38; Liao, Q. (2025). Molecular Orientation‐Dependent Photonic Spin–Orbit Coupling in Organic Microcavities Filled with 2D Polymorphic Crystals. <i>Laser &#38;amp; Photonics Reviews</i>, Article e01874. <a href=\"https://doi.org/10.1002/lpor.202501874\">https://doi.org/10.1002/lpor.202501874</a>","chicago":"Ji, Ying, Xuekai Ma, Han Huang, Yibo Deng, Pingyang Wang, Teng Long, Yuan Li, et al. “Molecular Orientation‐Dependent Photonic Spin–Orbit Coupling in Organic Microcavities Filled with 2D Polymorphic Crystals.” <i>Laser &#38;amp; Photonics Reviews</i>, 2025. <a href=\"https://doi.org/10.1002/lpor.202501874\">https://doi.org/10.1002/lpor.202501874</a>.","short":"Y. Ji, X. Ma, H. Huang, Y. Deng, P. Wang, T. Long, Y. Li, R. Zhao, Y. Li, C. An, S. Schumacher, C. Gu, B. Liao, H. Fu, Q. Liao, Laser &#38;amp; Photonics Reviews (2025)."},"type":"journal_article","department":[{"_id":"15"},{"_id":"170"},{"_id":"297"},{"_id":"705"},{"_id":"35"},{"_id":"230"}],"date_created":"2025-12-04T12:33:48Z","date_updated":"2025-12-04T12:34:45Z","publication_status":"published","year":"2025","title":"Molecular Orientation‐Dependent Photonic Spin–Orbit Coupling in Organic Microcavities Filled with 2D Polymorphic Crystals","status":"public","author":[{"last_name":"Ji","first_name":"Ying","full_name":"Ji, Ying"},{"first_name":"Xuekai","last_name":"Ma","full_name":"Ma, Xuekai","id":"59416"},{"last_name":"Huang","first_name":"Han","full_name":"Huang, Han"},{"full_name":"Deng, Yibo","first_name":"Yibo","last_name":"Deng"},{"last_name":"Wang","first_name":"Pingyang","full_name":"Wang, Pingyang"},{"last_name":"Long","first_name":"Teng","full_name":"Long, Teng"},{"first_name":"Yuan","last_name":"Li","full_name":"Li, Yuan"},{"full_name":"Zhao, Ruiyang","last_name":"Zhao","first_name":"Ruiyang"},{"full_name":"Li, Yunfei","last_name":"Li","first_name":"Yunfei"},{"last_name":"An","first_name":"Cunbin","full_name":"An, Cunbin"},{"full_name":"Schumacher, Stefan","last_name":"Schumacher","first_name":"Stefan","orcid":"0000-0003-4042-4951","id":"27271"},{"full_name":"Gu, Chunling","last_name":"Gu","first_name":"Chunling"},{"full_name":"Liao, Bo","last_name":"Liao","first_name":"Bo"},{"first_name":"Hongbing","last_name":"Fu","full_name":"Fu, Hongbing"},{"full_name":"Liao, Qing","first_name":"Qing","last_name":"Liao"}],"publication_identifier":{"issn":["1863-8880","1863-8899"]},"doi":"10.1002/lpor.202501874","user_id":"16199","article_number":"e01874","_id":"62867","language":[{"iso":"eng"}],"publisher":"Wiley"},{"date_created":"2025-12-04T13:54:58Z","type":"conference","publication":"Posterbeitrag im Rahmen der Jahrestagung der DGFE Sekten Sonderpädagogik vom 22-24.09.2025 in Heidelberg ","citation":{"short":"M. Osnabrügge, C. Tenberge, in: Posterbeitrag Im Rahmen Der Jahrestagung Der DGFE Sekten Sonderpädagogik Vom 22-24.09.2025 in Heidelberg , 2025.","chicago":"Osnabrügge, Malin, and Claudia Tenberge. “Anschluss Begleiten: Technisches Lernen Zwischen Primar- Und Sekundarstufe. Fortbildungen Für Einen Digitalen Unterricht Für Alle .” In <i>Posterbeitrag Im Rahmen Der Jahrestagung Der DGFE Sekten Sonderpädagogik Vom 22-24.09.2025 in Heidelberg </i>, 2025.","apa":"Osnabrügge, M., &#38; Tenberge, C. (2025). Anschluss begleiten: Technisches Lernen zwischen Primar- und Sekundarstufe. Fortbildungen für einen digitalen Unterricht für alle . <i>Posterbeitrag Im Rahmen Der Jahrestagung Der DGFE Sekten Sonderpädagogik Vom 22-24.09.2025 in Heidelberg </i>. Jahrestagung der DGFE Sekten Sonderpädagogik, Heidelberg .","ieee":"M. Osnabrügge and C. Tenberge, “Anschluss begleiten: Technisches Lernen zwischen Primar- und Sekundarstufe. Fortbildungen für einen digitalen Unterricht für alle ,” presented at the Jahrestagung der DGFE Sekten Sonderpädagogik, Heidelberg , 2025.","ama":"Osnabrügge M, Tenberge C. Anschluss begleiten: Technisches Lernen zwischen Primar- und Sekundarstufe. Fortbildungen für einen digitalen Unterricht für alle . In: <i>Posterbeitrag Im Rahmen Der Jahrestagung Der DGFE Sekten Sonderpädagogik Vom 22-24.09.2025 in Heidelberg </i>. ; 2025.","bibtex":"@inproceedings{Osnabrügge_Tenberge_2025, title={Anschluss begleiten: Technisches Lernen zwischen Primar- und Sekundarstufe. Fortbildungen für einen digitalen Unterricht für alle }, booktitle={Posterbeitrag im Rahmen der Jahrestagung der DGFE Sekten Sonderpädagogik vom 22-24.09.2025 in Heidelberg }, author={Osnabrügge, Malin and Tenberge, Claudia}, year={2025} }","mla":"Osnabrügge, Malin, and Claudia Tenberge. “Anschluss Begleiten: Technisches Lernen Zwischen Primar- Und Sekundarstufe. Fortbildungen Für Einen Digitalen Unterricht Für Alle .” <i>Posterbeitrag Im Rahmen Der Jahrestagung Der DGFE Sekten Sonderpädagogik Vom 22-24.09.2025 in Heidelberg </i>, 2025."},"_id":"62880","language":[{"iso":"eng"}],"user_id":"79748","status":"public","title":"Anschluss begleiten: Technisches Lernen zwischen Primar- und Sekundarstufe. Fortbildungen für einen digitalen Unterricht für alle ","year":"2025","author":[{"id":"79748","full_name":"Osnabrügge, Malin","first_name":"Malin","last_name":"Osnabrügge"},{"id":"67302","full_name":"Tenberge, Claudia","first_name":"Claudia","last_name":"Tenberge"}],"conference":{"location":"Heidelberg ","start_date":"2025-09-22","name":"Jahrestagung der DGFE Sekten Sonderpädagogik","end_date":"2025-09-24"},"date_updated":"2025-12-04T13:56:06Z"},{"citation":{"chicago":"Schemel, Nele, and Claudia Tenberge. “Transitionen Inklusiv Gestalten. Analoges Und Digitales Technisches Lernen Am Übergang Vom Elementar- Zum Primarbereich.” In <i>Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025</i>, 2025.","short":"N. Schemel, C. Tenberge, in: Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025, 2025.","apa":"Schemel, N., &#38; Tenberge, C. (2025). Transitionen inklusiv gestalten. Analoges und digitales technisches Lernen am Übergang vom Elementar- zum Primarbereich. <i>Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025</i>. Jahrestagung der Deutschen Gesellschaft für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik, Heidelberg.","ieee":"N. Schemel and C. Tenberge, “Transitionen inklusiv gestalten. Analoges und digitales technisches Lernen am Übergang vom Elementar- zum Primarbereich,” presented at the Jahrestagung der Deutschen Gesellschaft für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik, Heidelberg, 2025.","ama":"Schemel N, Tenberge C. Transitionen inklusiv gestalten. Analoges und digitales technisches Lernen am Übergang vom Elementar- zum Primarbereich. In: <i>Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025</i>. ; 2025.","bibtex":"@inproceedings{Schemel_Tenberge_2025, title={Transitionen inklusiv gestalten. Analoges und digitales technisches Lernen am Übergang vom Elementar- zum Primarbereich}, booktitle={Jahrestagung der Deutschen Gesellschaft für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025}, author={Schemel, Nele and Tenberge, Claudia}, year={2025} }","mla":"Schemel, Nele, and Claudia Tenberge. “Transitionen Inklusiv Gestalten. Analoges Und Digitales Technisches Lernen Am Übergang Vom Elementar- Zum Primarbereich.” <i>Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025</i>, 2025."},"publication":"Jahrestagung der Deutschen Gesellschaft für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025","date_created":"2025-12-04T14:11:54Z","type":"conference","author":[{"id":"73438","full_name":"Schemel, Nele","first_name":"Nele","last_name":"Schemel"},{"id":"67302","last_name":"Tenberge","first_name":"Claudia","full_name":"Tenberge, Claudia"}],"conference":{"end_date":"2025–09–24","location":"Heidelberg","name":"Jahrestagung der Deutschen Gesellschaft für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik","start_date":"2025–09–22"},"title":"Transitionen inklusiv gestalten. Analoges und digitales technisches Lernen am Übergang vom Elementar- zum Primarbereich","status":"public","year":"2025","date_updated":"2025-12-04T14:11:59Z","_id":"62888","language":[{"iso":"eng"}],"user_id":"73438"},{"status":"public","year":"2025","title":"Zwischen Universität und Unterrichtspraxis: Technikbezogene(s) Interesse und Selbstwirksamkeit von (angehenden) Lehrkräften im Sachunterricht","author":[{"id":"79913","full_name":"Schneider, Lea","last_name":"Schneider","first_name":"Lea"},{"last_name":"Tenberge","first_name":"Claudia","full_name":"Tenberge, Claudia","id":"67302"}],"conference":{"name":"Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik","start_date":"2025-09-22","location":"Heidelberg","end_date":"2025-09-24"},"date_updated":"2025-12-04T14:22:23Z","_id":"62891","language":[{"iso":"eng"}],"user_id":"79913","publication":"Posterbeitrag im Rahmen der Jahrestagung der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025","citation":{"ieee":"L. Schneider and C. Tenberge, “Zwischen Universität und Unterrichtspraxis: Technikbezogene(s) Interesse und Selbstwirksamkeit von (angehenden) Lehrkräften im Sachunterricht,” presented at the Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik, Heidelberg, 2025.","apa":"Schneider, L., &#38; Tenberge, C. (2025). Zwischen Universität und Unterrichtspraxis: Technikbezogene(s) Interesse und Selbstwirksamkeit von (angehenden) Lehrkräften im Sachunterricht. <i>Posterbeitrag Im Rahmen Der Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025</i>. Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik, Heidelberg.","short":"L. Schneider, C. Tenberge, in: Posterbeitrag Im Rahmen Der Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025, 2025.","chicago":"Schneider, Lea, and Claudia Tenberge. “Zwischen Universität Und Unterrichtspraxis: Technikbezogene(s) Interesse Und Selbstwirksamkeit von (Angehenden) Lehrkräften Im Sachunterricht.” In <i>Posterbeitrag Im Rahmen Der Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025</i>, 2025.","mla":"Schneider, Lea, and Claudia Tenberge. “Zwischen Universität Und Unterrichtspraxis: Technikbezogene(s) Interesse Und Selbstwirksamkeit von (Angehenden) Lehrkräften Im Sachunterricht.” <i>Posterbeitrag Im Rahmen Der Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025</i>, 2025.","bibtex":"@inproceedings{Schneider_Tenberge_2025, title={Zwischen Universität und Unterrichtspraxis: Technikbezogene(s) Interesse und Selbstwirksamkeit von (angehenden) Lehrkräften im Sachunterricht}, booktitle={Posterbeitrag im Rahmen der Jahrestagung der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025}, author={Schneider, Lea and Tenberge, Claudia}, year={2025} }","ama":"Schneider L, Tenberge C. Zwischen Universität und Unterrichtspraxis: Technikbezogene(s) Interesse und Selbstwirksamkeit von (angehenden) Lehrkräften im Sachunterricht. In: <i>Posterbeitrag Im Rahmen Der Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025</i>. ; 2025."},"date_created":"2025-12-04T14:16:14Z","type":"conference"},{"year":"2025","title":"Effectiveness of regular oat β-glucan–enriched bread compared with whole-grain wheat bread on long-term glycemic control in adults at risk of type 2 diabetes: a randomized controlled trial","publication_identifier":{"issn":["0002-9165"]},"author":[{"full_name":"Hjorth, Therese","first_name":"Therese","last_name":"Hjorth"},{"id":"84033","full_name":"Schadow, Alena Marie","first_name":"Alena Marie","last_name":"Schadow"},{"full_name":"Revheim, Ingrid","last_name":"Revheim","first_name":"Ingrid"},{"full_name":"Spielau, Ulrike","last_name":"Spielau","first_name":"Ulrike"},{"first_name":"Klara","last_name":"Meyer","full_name":"Meyer, Klara"},{"last_name":"Rieder","first_name":"Anne","full_name":"Rieder, Anne"},{"last_name":"Varela","first_name":"Paula","full_name":"Varela, Paula"},{"full_name":"Ballance, Simon","last_name":"Ballance","first_name":"Simon"},{"full_name":"Koerner, Antje","last_name":"Koerner","first_name":"Antje"},{"full_name":"Landberg, Rikard","last_name":"Landberg","first_name":"Rikard"},{"full_name":"Buyken, Anette","first_name":"Anette","last_name":"Buyken","id":"65985"},{"full_name":"Dierkes, Jutta","first_name":"Jutta","last_name":"Dierkes"},{"full_name":"Rosendahl-Riise, Hanne","first_name":"Hanne","last_name":"Rosendahl-Riise"}],"date_updated":"2025-12-04T14:33:29Z","publication_status":"published","intvolume":"       122","language":[{"iso":"eng"}],"doi":"10.1016/j.ajcnut.2025.06.018","issue":"3","publication":"The American Journal of Clinical Nutrition","date_created":"2025-12-04T14:32:41Z","type":"journal_article","department":[{"_id":"22"}],"status":"public","page":"724-732","_id":"62900","publisher":"Elsevier BV","user_id":"92491","volume":122,"citation":{"ieee":"T. Hjorth <i>et al.</i>, “Effectiveness of regular oat β-glucan–enriched bread compared with whole-grain wheat bread on long-term glycemic control in adults at risk of type 2 diabetes: a randomized controlled trial,” <i>The American Journal of Clinical Nutrition</i>, vol. 122, no. 3, pp. 724–732, 2025, doi: <a href=\"https://doi.org/10.1016/j.ajcnut.2025.06.018\">10.1016/j.ajcnut.2025.06.018</a>.","apa":"Hjorth, T., Schadow, A. M., Revheim, I., Spielau, U., Meyer, K., Rieder, A., Varela, P., Ballance, S., Koerner, A., Landberg, R., Buyken, A., Dierkes, J., &#38; Rosendahl-Riise, H. (2025). Effectiveness of regular oat β-glucan–enriched bread compared with whole-grain wheat bread on long-term glycemic control in adults at risk of type 2 diabetes: a randomized controlled trial. <i>The American Journal of Clinical Nutrition</i>, <i>122</i>(3), 724–732. <a href=\"https://doi.org/10.1016/j.ajcnut.2025.06.018\">https://doi.org/10.1016/j.ajcnut.2025.06.018</a>","mla":"Hjorth, Therese, et al. “Effectiveness of Regular Oat β-Glucan–Enriched Bread Compared with Whole-Grain Wheat Bread on Long-Term Glycemic Control in Adults at Risk of Type 2 Diabetes: A Randomized Controlled Trial.” <i>The American Journal of Clinical Nutrition</i>, vol. 122, no. 3, Elsevier BV, 2025, pp. 724–32, doi:<a href=\"https://doi.org/10.1016/j.ajcnut.2025.06.018\">10.1016/j.ajcnut.2025.06.018</a>.","bibtex":"@article{Hjorth_Schadow_Revheim_Spielau_Meyer_Rieder_Varela_Ballance_Koerner_Landberg_et al._2025, title={Effectiveness of regular oat β-glucan–enriched bread compared with whole-grain wheat bread on long-term glycemic control in adults at risk of type 2 diabetes: a randomized controlled trial}, volume={122}, DOI={<a href=\"https://doi.org/10.1016/j.ajcnut.2025.06.018\">10.1016/j.ajcnut.2025.06.018</a>}, number={3}, journal={The American Journal of Clinical Nutrition}, publisher={Elsevier BV}, author={Hjorth, Therese and Schadow, Alena Marie and Revheim, Ingrid and Spielau, Ulrike and Meyer, Klara and Rieder, Anne and Varela, Paula and Ballance, Simon and Koerner, Antje and Landberg, Rikard and et al.}, year={2025}, pages={724–732} }","chicago":"Hjorth, Therese, Alena Marie Schadow, Ingrid Revheim, Ulrike Spielau, Klara Meyer, Anne Rieder, Paula Varela, et al. “Effectiveness of Regular Oat β-Glucan–Enriched Bread Compared with Whole-Grain Wheat Bread on Long-Term Glycemic Control in Adults at Risk of Type 2 Diabetes: A Randomized Controlled Trial.” <i>The American Journal of Clinical Nutrition</i> 122, no. 3 (2025): 724–32. <a href=\"https://doi.org/10.1016/j.ajcnut.2025.06.018\">https://doi.org/10.1016/j.ajcnut.2025.06.018</a>.","ama":"Hjorth T, Schadow AM, Revheim I, et al. Effectiveness of regular oat β-glucan–enriched bread compared with whole-grain wheat bread on long-term glycemic control in adults at risk of type 2 diabetes: a randomized controlled trial. <i>The American Journal of Clinical Nutrition</i>. 2025;122(3):724-732. doi:<a href=\"https://doi.org/10.1016/j.ajcnut.2025.06.018\">10.1016/j.ajcnut.2025.06.018</a>","short":"T. Hjorth, A.M. Schadow, I. Revheim, U. Spielau, K. Meyer, A. Rieder, P. Varela, S. Ballance, A. Koerner, R. Landberg, A. Buyken, J. Dierkes, H. Rosendahl-Riise, The American Journal of Clinical Nutrition 122 (2025) 724–732."}},{"publication_status":"published","date_updated":"2025-12-16T15:25:38Z","author":[{"id":"34289","first_name":"Roland","last_name":"Unruh","full_name":"Unruh, Roland"},{"id":"66","last_name":"Böcker","first_name":"Joachim","orcid":"0000-0002-8480-7295","full_name":"Böcker, Joachim"},{"full_name":"Schafmeister, Frank","last_name":"Schafmeister","first_name":"Frank","id":"71291"}],"conference":{"location":"Birmingham, United Kingdom","name":"2025 Energy Conversion Congress & Expo Europe (ECCE Europe)","start_date":"2025-09-01","end_date":"2025-09-04"},"title":"Three-Phase Instantaneous Current Controller for Unbalanced Grid Inductors Without DQ Transform for Cascaded H-Bridge Converters","year":"2025","status":"public","user_id":"34289","doi":"10.1109/ecce-europe62795.2025.11238538","publisher":"IEEE","_id":"63157","language":[{"iso":"eng"}],"main_file_link":[{"url":"https://ieeexplore.ieee.org/document/11238538"}],"abstract":[{"text":"Three-phase cascaded H-bridge converters (CHBs) in star configuration require reliable current controllers to evenly charge the module DC-link capacitors. Conventionally, a current control in dq-coordinates is utilized. At steady state, the resulting calculated reference arm voltages are sinusoidal, have identical amplitudes and show a phase shift of 120 degree to each other. For balanced grid inductors, the resulting grid currents also have the same amplitude. However, own simulations show that unbalanced grid inductors always lead to different grid current amplitudes (4% difference in this case). As a result, the averaged charging module powers differ and the peak DC-link capacitor voltage rises as well. In the first step, an adaptation of an existing zero-sequence voltage injection is proposed. For balanced grid inductors, it converges to the 3rd harmonic voltage injection which can reduce the peak-to-peak DC-link voltage ripple up by to 50% and balances the power between the phases. However, unbalanced grid inductors still lead to the same unbalanced grid currents of 4%. Therefore, a new method with 4 integrators based on linear regression is proposed to achieve sinusoidal grid currents for unbalanced inductors. The proposed method has a similar transient dynamic as the conventional dq control, but balances the grid currents nearly ideally. Simulation results of a 1MW cascaded H bridge and a scaled-down prototype verify the proposed method.","lang":"eng"}],"citation":{"chicago":"Unruh, Roland, Joachim Böcker, and Frank Schafmeister. “Three-Phase Instantaneous Current Controller for Unbalanced Grid Inductors Without DQ Transform for Cascaded H-Bridge Converters.” In <i>2025 Energy Conversion Congress &#38;amp;Amp; Expo Europe (ECCE Europe)</i>. IEEE, 2025. <a href=\"https://doi.org/10.1109/ecce-europe62795.2025.11238538\">https://doi.org/10.1109/ecce-europe62795.2025.11238538</a>.","short":"R. Unruh, J. Böcker, F. Schafmeister, in: 2025 Energy Conversion Congress &#38;amp;Amp; Expo Europe (ECCE Europe), IEEE, 2025.","apa":"Unruh, R., Böcker, J., &#38; Schafmeister, F. (2025). Three-Phase Instantaneous Current Controller for Unbalanced Grid Inductors Without DQ Transform for Cascaded H-Bridge Converters. <i>2025 Energy Conversion Congress &#38;amp;Amp; Expo Europe (ECCE Europe)</i>. 2025 Energy Conversion Congress &#38; Expo Europe (ECCE Europe), Birmingham, United Kingdom. <a href=\"https://doi.org/10.1109/ecce-europe62795.2025.11238538\">https://doi.org/10.1109/ecce-europe62795.2025.11238538</a>","ieee":"R. Unruh, J. Böcker, and F. Schafmeister, “Three-Phase Instantaneous Current Controller for Unbalanced Grid Inductors Without DQ Transform for Cascaded H-Bridge Converters,” presented at the 2025 Energy Conversion Congress &#38; Expo Europe (ECCE Europe), Birmingham, United Kingdom, 2025, doi: <a href=\"https://doi.org/10.1109/ecce-europe62795.2025.11238538\">10.1109/ecce-europe62795.2025.11238538</a>.","ama":"Unruh R, Böcker J, Schafmeister F. Three-Phase Instantaneous Current Controller for Unbalanced Grid Inductors Without DQ Transform for Cascaded H-Bridge Converters. In: <i>2025 Energy Conversion Congress &#38;amp;Amp; Expo Europe (ECCE Europe)</i>. IEEE; 2025. doi:<a href=\"https://doi.org/10.1109/ecce-europe62795.2025.11238538\">10.1109/ecce-europe62795.2025.11238538</a>","bibtex":"@inproceedings{Unruh_Böcker_Schafmeister_2025, title={Three-Phase Instantaneous Current Controller for Unbalanced Grid Inductors Without DQ Transform for Cascaded H-Bridge Converters}, DOI={<a href=\"https://doi.org/10.1109/ecce-europe62795.2025.11238538\">10.1109/ecce-europe62795.2025.11238538</a>}, booktitle={2025 Energy Conversion Congress &#38;amp;amp; Expo Europe (ECCE Europe)}, publisher={IEEE}, author={Unruh, Roland and Böcker, Joachim and Schafmeister, Frank}, year={2025} }","mla":"Unruh, Roland, et al. “Three-Phase Instantaneous Current Controller for Unbalanced Grid Inductors Without DQ Transform for Cascaded H-Bridge Converters.” <i>2025 Energy Conversion Congress &#38;amp;Amp; Expo Europe (ECCE Europe)</i>, IEEE, 2025, doi:<a href=\"https://doi.org/10.1109/ecce-europe62795.2025.11238538\">10.1109/ecce-europe62795.2025.11238538</a>."},"publication":"2025 Energy Conversion Congress &amp;amp; Expo Europe (ECCE Europe)","department":[{"_id":"52"}],"keyword":["Cascaded H-Bridge","Current Control","dq Transformation","Linear Regression","Unbalanced Inductors"],"type":"conference","date_created":"2025-12-16T15:20:55Z"}]