[{"date_updated":"2020-05-07T05:33:56Z","author":[{"last_name":"Schemmel","full_name":"Schemmel, Reinhard","id":"28647","first_name":"Reinhard"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"},{"last_name":"Unger","full_name":"Unger, Andreas","first_name":"Andreas"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"}],"date_created":"2019-05-27T10:24:37Z","title":"Effects of different working frequencies on the joint formation in copper wire bonding","quality_controlled":"1","year":"2018","place":"Stuttgart, Germany","citation":{"ama":"Schemmel R, Althoff S, Sextro W, Unger A, Brökelmann M, Hunstig M. Effects of different working frequencies on the joint formation in copper wire bonding. In: <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>. Stuttgart, Germany; 2018:230-235.","chicago":"Schemmel, Reinhard, Simon Althoff, Walter Sextro, Andreas Unger, Michael Brökelmann, and Matthias Hunstig. “Effects of Different Working Frequencies on the Joint Formation in Copper Wire Bonding.” In <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 230–35. Stuttgart, Germany, 2018.","ieee":"R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig, “Effects of different working frequencies on the joint formation in copper wire bonding,” in <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 2018, pp. 230–235.","short":"R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, in: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.","bibtex":"@inproceedings{Schemmel_Althoff_Sextro_Unger_Brökelmann_Hunstig_2018, place={Stuttgart, Germany}, title={Effects of different working frequencies on the joint formation in copper wire bonding}, booktitle={CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)}, author={Schemmel, Reinhard and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={230–235} }","mla":"Schemmel, Reinhard, et al. “Effects of Different Working Frequencies on the Joint Formation in Copper Wire Bonding.” <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 2018, pp. 230–35.","apa":"Schemmel, R., Althoff, S., Sextro, W., Unger, A., Brökelmann, M., &#38; Hunstig, M. (2018). Effects of different working frequencies on the joint formation in copper wire bonding. In <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)</i> (pp. 230–235). Stuttgart, Germany."},"page":"230-235","project":[{"_id":"93","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","grant_number":"MP-1-1-015"}],"_id":"9997","user_id":"210","department":[{"_id":"151"}],"language":[{"iso":"eng"}],"type":"conference","publication":"CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)","abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is used to connect the electrical terminals of semiconductor modules in power electronics. Mul- tiple influencing factors in wedge/wedge bonding are known and extensively investigated. A constructively settable but rarely examined parameter is the bonding frequency. In case of bonding on challenging substrates, e.g. supple substruc- tures, a high influence of the working frequency is observed. The choice of the working frequency is typically based on experimental investigations for a certain component or substrate and needs to be evaluated anew for new applications. A profound understanding of the influence of the working frequency is required to achieve a reliable bond process and a short process development. Here a generalized model for the numerical simulation of the bond formation with respect to the dynamics of the substructure is presented. The simulation results are compared to experiments using 300 µm copper wire at different working frequencies and geometries of the substructure."}],"status":"public"},{"_id":"9998","department":[{"_id":"151"}],"user_id":"55222","language":[{"iso":"eng"}],"publication":"6th European Conference on Computational Mechanics (ECCM 6)","type":"conference","abstract":[{"text":"Ultrasonic wedge/wedge-wire bonding is used to connect electrical terminals of semiconductor modules in power electronics. The wire is clamped with a tool by a normal force and ultrasonic vibration is transmitted through the wire into the interface between wire and substrate. Due to frictional processes contaminations like oxide layers are removed from the contact zone and the surface roughness is reduced, thus the real contact area is increased. In the next step of bond formation, thermomechanical forces create micro-junctions between the wire and substrate and the bond strength increases. The bond parameters like the bond normal force, the ultrasonic vibration amplitude and the geometry of the clamping tool show a high influence on the strength and reliability of the wire bond and need to be investigated in detail. Therefore, in this contribution the dynamical behaviour of the ultrasonic system, the wire and the substrate are modeled in form of substructures, which are connected by the friction contacts between tool and wire and between wire and substrate. Approaches for modelling the time variant contact behaviour, the substrate dynamics, and the model order reduction for a time efficient simulation are described to simulate the full bonding process.","lang":"eng"}],"status":"public","date_updated":"2019-09-23T08:48:04Z","date_created":"2019-05-27T10:24:38Z","author":[{"id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel","first_name":"Reinhard"},{"last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210","first_name":"Tobias"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"}],"title":"Numerical and experimental investigations in ultrasonic heavy wire bonding","place":"Glasgow, UK","year":"2018","page":"1-12","citation":{"chicago":"Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “Numerical and Experimental Investigations in Ultrasonic Heavy Wire Bonding.” In <i>6th European Conference on Computational Mechanics (ECCM 6)</i>, 1–12. Glasgow, UK, 2018.","ieee":"R. Schemmel, T. Hemsel, and W. Sextro, “Numerical and experimental investigations in ultrasonic heavy wire bonding,” in <i>6th European Conference on Computational Mechanics (ECCM 6)</i>, 2018, pp. 1–12.","ama":"Schemmel R, Hemsel T, Sextro W. Numerical and experimental investigations in ultrasonic heavy wire bonding. In: <i>6th European Conference on Computational Mechanics (ECCM 6)</i>. Glasgow, UK; 2018:1-12.","short":"R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.","bibtex":"@inproceedings{Schemmel_Hemsel_Sextro_2018, place={Glasgow, UK}, title={Numerical and experimental investigations in ultrasonic heavy wire bonding}, booktitle={6th European Conference on Computational Mechanics (ECCM 6)}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2018}, pages={1–12} }","mla":"Schemmel, Reinhard, et al. “Numerical and Experimental Investigations in Ultrasonic Heavy Wire Bonding.” <i>6th European Conference on Computational Mechanics (ECCM 6)</i>, 2018, pp. 1–12.","apa":"Schemmel, R., Hemsel, T., &#38; Sextro, W. (2018). Numerical and experimental investigations in ultrasonic heavy wire bonding. In <i>6th European Conference on Computational Mechanics (ECCM 6)</i> (pp. 1–12). Glasgow, UK."}},{"type":"conference","status":"public","citation":{"ama":"Brassat K, Taube A, Kool D, et al. Ti-6Al-4V alloy: 3D printing of lightweight implants and nanopatterning by self-assembly. In: ; 2018.","chicago":"Brassat, Katharina, A. Taube, Daniel Kool, L. Tasche, K.P. Hoyer, Mirko Schaper, and Jörg Lindner. “Ti-6Al-4V Alloy: 3D Printing of Lightweight Implants and Nanopatterning by Self-Assembly,” 2018.","ieee":"K. Brassat <i>et al.</i>, “Ti-6Al-4V alloy: 3D printing of lightweight implants and nanopatterning by self-assembly,” presented at the EMRS-Fall Meeting 2018, Warsaw, Poland, 2018.","apa":"Brassat, K., Taube, A., Kool, D., Tasche, L., Hoyer, K. P., Schaper, M., &#38; Lindner, J. (2018). Ti-6Al-4V alloy: 3D printing of lightweight implants and nanopatterning by self-assembly. Presented at the EMRS-Fall Meeting 2018, Warsaw, Poland.","bibtex":"@inproceedings{Brassat_Taube_Kool_Tasche_Hoyer_Schaper_Lindner_2018, title={Ti-6Al-4V alloy: 3D printing of lightweight implants and nanopatterning by self-assembly}, author={Brassat, Katharina and Taube, A. and Kool, Daniel and Tasche, L. and Hoyer, K.P. and Schaper, Mirko and Lindner, Jörg}, year={2018} }","short":"K. Brassat, A. Taube, D. Kool, L. Tasche, K.P. Hoyer, M. Schaper, J. Lindner, in: 2018.","mla":"Brassat, Katharina, et al. <i>Ti-6Al-4V Alloy: 3D Printing of Lightweight Implants and Nanopatterning by Self-Assembly</i>. 2018."},"year":"2018","department":[{"_id":"286"},{"_id":"15"}],"author":[{"last_name":"Brassat","id":"11305","full_name":"Brassat, Katharina","first_name":"Katharina"},{"last_name":"Taube","full_name":"Taube, A.","first_name":"A."},{"first_name":"Daniel","last_name":"Kool","id":"44586","full_name":"Kool, Daniel"},{"last_name":"Tasche","full_name":"Tasche, L.","first_name":"L."},{"full_name":"Hoyer, K.P.","last_name":"Hoyer","first_name":"K.P."},{"full_name":"Schaper, Mirko","last_name":"Schaper","first_name":"Mirko"},{"first_name":"Jörg","full_name":"Lindner, Jörg","id":"20797","last_name":"Lindner"}],"user_id":"55706","date_created":"2018-08-16T13:18:03Z","_id":"3930","date_updated":"2022-01-06T06:59:56Z","conference":{"start_date":"2018-09-17","name":"EMRS-Fall Meeting 2018","location":"Warsaw, Poland","end_date":"2018-09-20"},"title":"Ti-6Al-4V alloy: 3D printing of lightweight implants and nanopatterning by self-assembly"},{"user_id":"55706","department":[{"_id":"286"},{"_id":"15"}],"_id":"3946","status":"public","type":"conference","conference":{"end_date":"2018-04-06","location":"Phoenix (AZ), USA","name":"MRS Materials Research Society Spring Meeting 2018","start_date":"2018-04-02"},"title":"Simulation of Transport Processes during the Convective Self-Assembly of Colloidal Nanomasks","author":[{"first_name":"Dennis","last_name":"Drude","full_name":"Drude, Dennis"},{"full_name":"Lindner, Jörg","id":"20797","last_name":"Lindner","first_name":"Jörg"}],"date_created":"2018-08-20T12:53:48Z","date_updated":"2022-01-06T06:59:58Z","citation":{"ieee":"D. Drude and J. Lindner, “Simulation of Transport Processes during the Convective Self-Assembly of Colloidal Nanomasks,” presented at the MRS Materials Research Society Spring Meeting 2018, Phoenix (AZ), USA, 2018.","chicago":"Drude, Dennis, and Jörg Lindner. “Simulation of Transport Processes during the Convective Self-Assembly of Colloidal Nanomasks,” 2018.","ama":"Drude D, Lindner J. Simulation of Transport Processes during the Convective Self-Assembly of Colloidal Nanomasks. In: ; 2018.","apa":"Drude, D., &#38; Lindner, J. (2018). Simulation of Transport Processes during the Convective Self-Assembly of Colloidal Nanomasks. Presented at the MRS Materials Research Society Spring Meeting 2018, Phoenix (AZ), USA.","mla":"Drude, Dennis, and Jörg Lindner. <i>Simulation of Transport Processes during the Convective Self-Assembly of Colloidal Nanomasks</i>. 2018.","bibtex":"@inproceedings{Drude_Lindner_2018, title={Simulation of Transport Processes during the Convective Self-Assembly of Colloidal Nanomasks}, author={Drude, Dennis and Lindner, Jörg}, year={2018} }","short":"D. Drude, J. Lindner, in: 2018."},"year":"2018"},{"_id":"5469","user_id":"158","department":[{"_id":"61"}],"language":[{"iso":"eng"}],"type":"conference","publication":"Elektromagnetische Verträglichkeit - Internationale Fachmesse und Kongress 2018","abstract":[{"text":"In diesem Beitrag werden simulatorische und messtechnische EMV-Untersuchungen von Gleichspannungswandlern vorgestellt. Der Fokus liegt auf leitungsgeführten Störspannungen, ihre Abhängigkeit vom Schaltungslayout und ihre Unterdrückung durch Filterung. Der Simulationsprozess besteht aus kombinierten Feld- und Netzwerksimulationen. Zur Bewertung der Simulationsresultate werden zwei Prototypen gezeigt, die gute und schlechte EMV-Eigenschaften aufweisen. Bei der Beurteilung der Resultate wird insbesondere Wert auf die Untersuchung gelegt, inwieweit einfache Schaltungssimulationen ausreichen, um leitungsgeführte Störspannungen korrekt vorherzusagen und wann aufwändigere Feldsimulationen notwendig sind.","lang":"ger"}],"editor":[{"full_name":"Garbe, Heyno","last_name":"Garbe","first_name":"Heyno"}],"status":"public","date_updated":"2022-01-06T07:01:55Z","date_created":"2018-11-08T23:44:10Z","author":[{"last_name":"Baumgarten","full_name":"Baumgarten, Tim","first_name":"Tim"},{"last_name":"Scholz","full_name":"Scholz, Peter","first_name":"Peter"},{"first_name":"Denis","last_name":"Sievers","full_name":"Sievers, Denis"},{"first_name":"Jens","last_name":"Förstner","orcid":"0000-0001-7059-9862","full_name":"Förstner, Jens","id":"158"}],"title":"Simulation leitungsgeführter Störspannungen von DC-DC-Wandlern","conference":{"name":"emv Internationale Fachmesse und Kongress 2018","location":"Düsseldorf"},"publication_identifier":{"isbn":["978-3-95735-077-0"]},"year":"2018","citation":{"apa":"Baumgarten, T., Scholz, P., Sievers, D., &#38; Förstner, J. (2018). Simulation leitungsgeführter Störspannungen von DC-DC-Wandlern. In H. Garbe (Ed.), <i>Elektromagnetische Verträglichkeit - Internationale Fachmesse und Kongress 2018</i> (p. 47). Düsseldorf.","short":"T. Baumgarten, P. Scholz, D. Sievers, J. Förstner, in: H. Garbe (Ed.), Elektromagnetische Verträglichkeit - Internationale Fachmesse Und Kongress 2018, 2018, p. 47.","mla":"Baumgarten, Tim, et al. “Simulation Leitungsgeführter Störspannungen von DC-DC-Wandlern.” <i>Elektromagnetische Verträglichkeit - Internationale Fachmesse Und Kongress 2018</i>, edited by Heyno Garbe, 2018, p. 47.","bibtex":"@inproceedings{Baumgarten_Scholz_Sievers_Förstner_2018, title={Simulation leitungsgeführter Störspannungen von DC-DC-Wandlern}, booktitle={Elektromagnetische Verträglichkeit - Internationale Fachmesse und Kongress 2018}, author={Baumgarten, Tim and Scholz, Peter and Sievers, Denis and Förstner, Jens}, editor={Garbe, HeynoEditor}, year={2018}, pages={47} }","ama":"Baumgarten T, Scholz P, Sievers D, Förstner J. Simulation leitungsgeführter Störspannungen von DC-DC-Wandlern. In: Garbe H, ed. <i>Elektromagnetische Verträglichkeit - Internationale Fachmesse Und Kongress 2018</i>. ; 2018:47.","ieee":"T. Baumgarten, P. Scholz, D. Sievers, and J. Förstner, “Simulation leitungsgeführter Störspannungen von DC-DC-Wandlern,” in <i>Elektromagnetische Verträglichkeit - Internationale Fachmesse und Kongress 2018</i>, Düsseldorf, 2018, p. 47.","chicago":"Baumgarten, Tim, Peter Scholz, Denis Sievers, and Jens Förstner. “Simulation Leitungsgeführter Störspannungen von DC-DC-Wandlern.” In <i>Elektromagnetische Verträglichkeit - Internationale Fachmesse Und Kongress 2018</i>, edited by Heyno Garbe, 47, 2018."},"page":"47"},{"publication":"26th IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)","type":"conference","status":"public","abstract":[{"text":"Approximate computing has become a very popular design\r\nstrategy that exploits error resilient computations to achieve higher\r\nperformance and energy efficiency. Automated synthesis of approximate\r\ncircuits is performed via functional approximation, in which various\r\nparts of the target circuit are extensively examined with a library\r\nof approximate components/transformations to trade off the functional\r\naccuracy and computational budget (i.e., power). However, as the number\r\nof possible approximate transformations increases, traditional search\r\ntechniques suffer from a combinatorial explosion due to the large\r\nbranching factor. In this work, we present a comprehensive framework\r\nfor automated synthesis of approximate circuits from either structural\r\nor behavioral descriptions. We adapt the Monte Carlo Tree Search\r\n(MCTS), as a stochastic search technique, to deal with the large design\r\nspace exploration, which enables a broader range of potential possible\r\napproximations through lightweight random simulations. The proposed\r\nframework is able to recognize the design Pareto set even with low\r\ncomputational budgets. Experimental results highlight the capabilities of\r\nthe proposed synthesis framework by resulting in up to 61.69% energy\r\nsaving while maintaining the predefined quality constraints.","lang":"eng"}],"department":[{"_id":"78"}],"user_id":"64665","_id":"10598","language":[{"iso":"eng"}],"keyword":["Approximate computing","High-level synthesis","Accuracy","Monte-Carlo tree search","Circuit simulation"],"page":"219-224","citation":{"apa":"Awais, M., Ghasemzadeh Mohammadi, H., &#38; Platzner, M. (2018). An MCTS-based Framework for Synthesis of Approximate Circuits. In <i>26th IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)</i> (pp. 219–224). <a href=\"https://doi.org/10.1109/VLSI-SoC.2018.8645026\">https://doi.org/10.1109/VLSI-SoC.2018.8645026</a>","bibtex":"@inproceedings{Awais_Ghasemzadeh Mohammadi_Platzner_2018, title={An MCTS-based Framework for Synthesis of Approximate Circuits}, DOI={<a href=\"https://doi.org/10.1109/VLSI-SoC.2018.8645026\">10.1109/VLSI-SoC.2018.8645026</a>}, booktitle={26th IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)}, author={Awais, Muhammad and Ghasemzadeh Mohammadi, Hassan and Platzner, Marco}, year={2018}, pages={219–224} }","short":"M. Awais, H. Ghasemzadeh Mohammadi, M. Platzner, in: 26th IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), 2018, pp. 219–224.","mla":"Awais, Muhammad, et al. “An MCTS-Based Framework for Synthesis of Approximate Circuits.” <i>26th IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)</i>, 2018, pp. 219–24, doi:<a href=\"https://doi.org/10.1109/VLSI-SoC.2018.8645026\">10.1109/VLSI-SoC.2018.8645026</a>.","ama":"Awais M, Ghasemzadeh Mohammadi H, Platzner M. An MCTS-based Framework for Synthesis of Approximate Circuits. In: <i>26th IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)</i>. ; 2018:219-224. doi:<a href=\"https://doi.org/10.1109/VLSI-SoC.2018.8645026\">10.1109/VLSI-SoC.2018.8645026</a>","chicago":"Awais, Muhammad, Hassan Ghasemzadeh Mohammadi, and Marco Platzner. “An MCTS-Based Framework for Synthesis of Approximate Circuits.” In <i>26th IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)</i>, 219–24, 2018. <a href=\"https://doi.org/10.1109/VLSI-SoC.2018.8645026\">https://doi.org/10.1109/VLSI-SoC.2018.8645026</a>.","ieee":"M. Awais, H. Ghasemzadeh Mohammadi, and M. Platzner, “An MCTS-based Framework for Synthesis of Approximate Circuits,” in <i>26th IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)</i>, 2018, pp. 219–224."},"year":"2018","author":[{"first_name":"Muhammad","full_name":"Awais, Muhammad","id":"64665","last_name":"Awais","orcid":"https://orcid.org/0000-0003-4148-2969"},{"first_name":"Hassan","last_name":"Ghasemzadeh Mohammadi","full_name":"Ghasemzadeh Mohammadi, Hassan","id":"61186"},{"first_name":"Marco","last_name":"Platzner","full_name":"Platzner, Marco","id":"398"}],"date_created":"2019-07-10T09:21:38Z","date_updated":"2022-01-06T06:50:46Z","doi":"10.1109/VLSI-SoC.2018.8645026","title":"An MCTS-based Framework for Synthesis of Approximate Circuits"},{"language":[{"iso":"eng"}],"_id":"11986","user_id":"49154","department":[{"_id":"589"}],"status":"public","type":"conference","publication":"2018 14th Annual Conference on Wireless On-demand Network Systems and Services (WONS)","title":"Bridging worlds: Integrating hardware-in-the-loop testing with large-scale VANET simulation","doi":"10.23919/wons.2018.8311659","date_updated":"2022-01-06T06:51:15Z","author":[{"last_name":"Buse","full_name":"Buse, Dominik S.","first_name":"Dominik S."},{"full_name":"Schettler, Max","last_name":"Schettler","first_name":"Max"},{"first_name":"Nils","full_name":"Kothe, Nils","last_name":"Kothe"},{"last_name":"Reinold","full_name":"Reinold, Peter","first_name":"Peter"},{"first_name":"Christoph","id":"49154","full_name":"Sommer, Christoph","orcid":"0000-0002-4336-7350","last_name":"Sommer"},{"last_name":"Dressler","full_name":"Dressler, Falko","first_name":"Falko"}],"date_created":"2019-07-18T09:51:52Z","year":"2018","citation":{"chicago":"Buse, Dominik S., Max Schettler, Nils Kothe, Peter Reinold, Christoph Sommer, and Falko Dressler. “Bridging Worlds: Integrating Hardware-in-the-Loop Testing with Large-Scale VANET Simulation.” In <i>2018 14th Annual Conference on Wireless On-Demand Network Systems and Services (WONS)</i>, 2018. <a href=\"https://doi.org/10.23919/wons.2018.8311659\">https://doi.org/10.23919/wons.2018.8311659</a>.","ieee":"D. S. Buse, M. Schettler, N. Kothe, P. Reinold, C. Sommer, and F. Dressler, “Bridging worlds: Integrating hardware-in-the-loop testing with large-scale VANET simulation,” in <i>2018 14th Annual Conference on Wireless On-demand Network Systems and Services (WONS)</i>, 2018.","ama":"Buse DS, Schettler M, Kothe N, Reinold P, Sommer C, Dressler F. Bridging worlds: Integrating hardware-in-the-loop testing with large-scale VANET simulation. In: <i>2018 14th Annual Conference on Wireless On-Demand Network Systems and Services (WONS)</i>. ; 2018. doi:<a href=\"https://doi.org/10.23919/wons.2018.8311659\">10.23919/wons.2018.8311659</a>","mla":"Buse, Dominik S., et al. “Bridging Worlds: Integrating Hardware-in-the-Loop Testing with Large-Scale VANET Simulation.” <i>2018 14th Annual Conference on Wireless On-Demand Network Systems and Services (WONS)</i>, 2018, doi:<a href=\"https://doi.org/10.23919/wons.2018.8311659\">10.23919/wons.2018.8311659</a>.","short":"D.S. Buse, M. Schettler, N. Kothe, P. Reinold, C. Sommer, F. Dressler, in: 2018 14th Annual Conference on Wireless On-Demand Network Systems and Services (WONS), 2018.","bibtex":"@inproceedings{Buse_Schettler_Kothe_Reinold_Sommer_Dressler_2018, title={Bridging worlds: Integrating hardware-in-the-loop testing with large-scale VANET simulation}, DOI={<a href=\"https://doi.org/10.23919/wons.2018.8311659\">10.23919/wons.2018.8311659</a>}, booktitle={2018 14th Annual Conference on Wireless On-demand Network Systems and Services (WONS)}, author={Buse, Dominik S. and Schettler, Max and Kothe, Nils and Reinold, Peter and Sommer, Christoph and Dressler, Falko}, year={2018} }","apa":"Buse, D. S., Schettler, M., Kothe, N., Reinold, P., Sommer, C., &#38; Dressler, F. (2018). Bridging worlds: Integrating hardware-in-the-loop testing with large-scale VANET simulation. In <i>2018 14th Annual Conference on Wireless On-demand Network Systems and Services (WONS)</i>. <a href=\"https://doi.org/10.23919/wons.2018.8311659\">https://doi.org/10.23919/wons.2018.8311659</a>"},"publication_status":"published","publication_identifier":{"isbn":["9783903176010"]}},{"type":"conference","publication":"IEEE INFOCOM 2018 - IEEE Conference on Computer Communications Workshops (INFOCOM WKSHPS)","status":"public","_id":"11987","user_id":"49154","department":[{"_id":"589"}],"language":[{"iso":"eng"}],"publication_status":"published","publication_identifier":{"isbn":["9781538659793"]},"year":"2018","citation":{"ieee":"D. S. Buse, C. Sommer, and F. Dressler, “Demo abstract: Integrating a driving simulator with city-scale VANET simulation for the development of next generation ADAS systems,” in <i>IEEE INFOCOM 2018 - IEEE Conference on Computer Communications Workshops (INFOCOM WKSHPS)</i>, 2018.","chicago":"Buse, Dominik S., Christoph Sommer, and Falko Dressler. “Demo Abstract: Integrating a Driving Simulator with City-Scale VANET Simulation for the Development of next Generation ADAS Systems.” In <i>IEEE INFOCOM 2018 - IEEE Conference on Computer Communications Workshops (INFOCOM WKSHPS)</i>, 2018. <a href=\"https://doi.org/10.1109/infcomw.2018.8406997\">https://doi.org/10.1109/infcomw.2018.8406997</a>.","ama":"Buse DS, Sommer C, Dressler F. Demo abstract: Integrating a driving simulator with city-scale VANET simulation for the development of next generation ADAS systems. In: <i>IEEE INFOCOM 2018 - IEEE Conference on Computer Communications Workshops (INFOCOM WKSHPS)</i>. ; 2018. doi:<a href=\"https://doi.org/10.1109/infcomw.2018.8406997\">10.1109/infcomw.2018.8406997</a>","apa":"Buse, D. S., Sommer, C., &#38; Dressler, F. (2018). Demo abstract: Integrating a driving simulator with city-scale VANET simulation for the development of next generation ADAS systems. In <i>IEEE INFOCOM 2018 - IEEE Conference on Computer Communications Workshops (INFOCOM WKSHPS)</i>. <a href=\"https://doi.org/10.1109/infcomw.2018.8406997\">https://doi.org/10.1109/infcomw.2018.8406997</a>","mla":"Buse, Dominik S., et al. “Demo Abstract: Integrating a Driving Simulator with City-Scale VANET Simulation for the Development of next Generation ADAS Systems.” <i>IEEE INFOCOM 2018 - IEEE Conference on Computer Communications Workshops (INFOCOM WKSHPS)</i>, 2018, doi:<a href=\"https://doi.org/10.1109/infcomw.2018.8406997\">10.1109/infcomw.2018.8406997</a>.","bibtex":"@inproceedings{Buse_Sommer_Dressler_2018, title={Demo abstract: Integrating a driving simulator with city-scale VANET simulation for the development of next generation ADAS systems}, DOI={<a href=\"https://doi.org/10.1109/infcomw.2018.8406997\">10.1109/infcomw.2018.8406997</a>}, booktitle={IEEE INFOCOM 2018 - IEEE Conference on Computer Communications Workshops (INFOCOM WKSHPS)}, author={Buse, Dominik S. and Sommer, Christoph and Dressler, Falko}, year={2018} }","short":"D.S. Buse, C. Sommer, F. 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