---
_id: '18054'
author:
- first_name: A.-M.
full_name: Kamin, A.-M.
last_name: Kamin
- first_name: Dorothee M.
full_name: Meister, Dorothee M.
id: '346'
last_name: Meister
citation:
ama: 'Kamin A-M, Meister DM. Increasing Educational Opportunities through Digital
Participation. In: Antona M, Stephanidis C, eds. Universal Access in Human-Computer
Interaction: Methods, Techniques, and Best Practices. 10th International Conference,
UAHCI 2016 Held as Part of HCI International 2016 Toronto, Canada, Juli 17- 22,
2016, Proceedings, Part III. ; 2016:82-92.'
apa: 'Kamin, A.-M., & Meister, D. M. (2016). Increasing Educational Opportunities
through Digital Participation. In M. Antona & C. Stephanidis (Eds.), Universal
Access in Human-Computer Interaction: Methods, Techniques, and Best Practices.
10th International Conference, UAHCI 2016 Held as Part of HCI International 2016
Toronto, Canada, Juli 17- 22, 2016, Proceedings, Part III (pp. 82–92).'
bibtex: '@inbook{Kamin_Meister_2016, title={Increasing Educational Opportunities
through Digital Participation}, booktitle={Universal Access in Human-Computer
Interaction: Methods, Techniques, and Best Practices. 10th International Conference,
UAHCI 2016 Held as Part of HCI International 2016 Toronto, Canada, Juli 17- 22,
2016, Proceedings, Part III}, author={Kamin, A.-M. and Meister, Dorothee M.},
editor={Antona, M. and Stephanidis, C.Editors}, year={2016}, pages={82–92} }'
chicago: 'Kamin, A.-M., and Dorothee M. Meister. “Increasing Educational Opportunities
through Digital Participation.” In Universal Access in Human-Computer Interaction:
Methods, Techniques, and Best Practices. 10th International Conference, UAHCI
2016 Held as Part of HCI International 2016 Toronto, Canada, Juli 17- 22, 2016,
Proceedings, Part III, edited by M. Antona and C. Stephanidis, 82–92, 2016.'
ieee: 'A.-M. Kamin and D. M. Meister, “Increasing Educational Opportunities through
Digital Participation,” in Universal Access in Human-Computer Interaction:
Methods, Techniques, and Best Practices. 10th International Conference, UAHCI
2016 Held as Part of HCI International 2016 Toronto, Canada, Juli 17- 22, 2016,
Proceedings, Part III, M. Antona and C. Stephanidis, Eds. 2016, pp. 82–92.'
mla: 'Kamin, A. M., and Dorothee M. Meister. “Increasing Educational Opportunities
through Digital Participation.” Universal Access in Human-Computer Interaction:
Methods, Techniques, and Best Practices. 10th International Conference, UAHCI
2016 Held as Part of HCI International 2016 Toronto, Canada, Juli 17- 22, 2016,
Proceedings, Part III, edited by M. Antona and C. Stephanidis, 2016, pp. 82–92.'
short: 'A.-M. Kamin, D.M. Meister, in: M. Antona, C. Stephanidis (Eds.), Universal
Access in Human-Computer Interaction: Methods, Techniques, and Best Practices.
10th International Conference, UAHCI 2016 Held as Part of HCI International 2016
Toronto, Canada, Juli 17- 22, 2016, Proceedings, Part III, 2016, pp. 82–92.'
date_created: 2020-08-19T13:34:07Z
date_updated: 2022-01-06T06:53:25Z
department:
- _id: '137'
editor:
- first_name: M.
full_name: Antona, M.
last_name: Antona
- first_name: C.
full_name: Stephanidis, C.
last_name: Stephanidis
language:
- iso: eng
page: 82 - 92
publication: 'Universal Access in Human-Computer Interaction: Methods, Techniques,
and Best Practices. 10th International Conference, UAHCI 2016 Held as Part of HCI
International 2016 Toronto, Canada, Juli 17- 22, 2016, Proceedings, Part III'
status: public
title: Increasing Educational Opportunities through Digital Participation
type: book_chapter
user_id: '21240'
year: '2016'
...
---
_id: '1836'
author:
- first_name: Zahra
full_name: Derakhshandeh, Zahra
last_name: Derakhshandeh
- first_name: Robert
full_name: Gmyr, Robert
last_name: Gmyr
- first_name: Alexandra
full_name: Porter, Alexandra
last_name: Porter
- first_name: Andrea
full_name: W. Richa, Andrea
last_name: W. Richa
- first_name: Christian
full_name: Scheideler, Christian
id: '20792'
last_name: Scheideler
- first_name: Thim Frederik
full_name: Strothmann, Thim Frederik
id: '11319'
last_name: Strothmann
citation:
ama: 'Derakhshandeh Z, Gmyr R, Porter A, W. Richa A, Scheideler C, Strothmann TF.
On the Runtime of Universal Coating for Programmable Matter. In: DNA Computing
and Molecular Programming - 22nd International Conference, DNA 22, Munich, Germany,
September 4-8, 2016, Proceedings. Vol 9818. Lecture Notes in Computer Science.
; 2016:148--164. doi:10.1007/978-3-319-43994-5_10'
apa: Derakhshandeh, Z., Gmyr, R., Porter, A., W. Richa, A., Scheideler, C., &
Strothmann, T. F. (2016). On the Runtime of Universal Coating for Programmable
Matter. In DNA Computing and Molecular Programming - 22nd International Conference,
DNA 22, Munich, Germany, September 4-8, 2016, Proceedings (Vol. 9818, pp.
148--164). https://doi.org/10.1007/978-3-319-43994-5_10
bibtex: '@inproceedings{Derakhshandeh_Gmyr_Porter_W. Richa_Scheideler_Strothmann_2016,
series={Lecture Notes in Computer Science}, title={On the Runtime of Universal
Coating for Programmable Matter}, volume={9818}, DOI={10.1007/978-3-319-43994-5_10},
booktitle={DNA Computing and Molecular Programming - 22nd International Conference,
DNA 22, Munich, Germany, September 4-8, 2016, Proceedings}, author={Derakhshandeh,
Zahra and Gmyr, Robert and Porter, Alexandra and W. Richa, Andrea and Scheideler,
Christian and Strothmann, Thim Frederik}, year={2016}, pages={148--164}, collection={Lecture
Notes in Computer Science} }'
chicago: Derakhshandeh, Zahra, Robert Gmyr, Alexandra Porter, Andrea W. Richa, Christian
Scheideler, and Thim Frederik Strothmann. “On the Runtime of Universal Coating
for Programmable Matter.” In DNA Computing and Molecular Programming - 22nd
International Conference, DNA 22, Munich, Germany, September 4-8, 2016, Proceedings,
9818:148--164. Lecture Notes in Computer Science, 2016. https://doi.org/10.1007/978-3-319-43994-5_10.
ieee: Z. Derakhshandeh, R. Gmyr, A. Porter, A. W. Richa, C. Scheideler, and T. F.
Strothmann, “On the Runtime of Universal Coating for Programmable Matter,” in
DNA Computing and Molecular Programming - 22nd International Conference, DNA
22, Munich, Germany, September 4-8, 2016, Proceedings, 2016, vol. 9818, pp.
148--164.
mla: Derakhshandeh, Zahra, et al. “On the Runtime of Universal Coating for Programmable
Matter.” DNA Computing and Molecular Programming - 22nd International Conference,
DNA 22, Munich, Germany, September 4-8, 2016, Proceedings, vol. 9818, 2016,
pp. 148--164, doi:10.1007/978-3-319-43994-5_10.
short: 'Z. Derakhshandeh, R. Gmyr, A. Porter, A. W. Richa, C. Scheideler, T.F. Strothmann,
in: DNA Computing and Molecular Programming - 22nd International Conference, DNA
22, Munich, Germany, September 4-8, 2016, Proceedings, 2016, pp. 148--164.'
date_created: 2018-03-27T12:41:45Z
date_updated: 2022-01-06T06:53:30Z
department:
- _id: '79'
doi: 10.1007/978-3-319-43994-5_10
intvolume: ' 9818'
language:
- iso: eng
page: 148--164
publication: DNA Computing and Molecular Programming - 22nd International Conference,
DNA 22, Munich, Germany, September 4-8, 2016, Proceedings
publication_identifier:
unknown:
- 978-3-319-43993-8
series_title: Lecture Notes in Computer Science
status: public
title: On the Runtime of Universal Coating for Programmable Matter
type: conference
user_id: '15504'
volume: 9818
year: '2016'
...
---
_id: '22185'
abstract:
- lang: eng
text: The layered structure of Additive Manufacturing processes results in a stair-
stepping effect of the surface topographies. In general, the impact of this effect
strongly depends on the build angle of a surface, whereas the overall surface
roughness is additionally caused by the resolution of the specific AM process.
The aim of this work is the prediction of the surface quality in dependence of
the building orientation of a part. These results can finally be used to optimize
the orientation to get a desired surface quality. As not all parts of the component
surface are equally important, a preselection of areas can be used to improve
the overall surface quality of relevant areas. The model uses the digital AMF
format of a part. Each triangle is assigned with a roughness value and by testing
different orientations the best one can be found. This approach needs a database
for the surface qualities. This must be done separately for each Additive Manufacturing
process and is shown exemplarily with a surface topography simulation for the
laser sintering process.
author:
- first_name: Patrick
full_name: Delfs, Patrick
last_name: Delfs
- first_name: Marcel
full_name: Tows, Marcel
last_name: Tows
- first_name: Hans-Joachim
full_name: Schmid, Hans-Joachim
id: '464'
last_name: Schmid
citation:
ama: Delfs P, Tows M, Schmid H-J. Optimized build orientation of additive manufactured
parts for improved surface quality and build time. Additive Manufacturing.
2016;2(12, Part B):214-320. doi:10.1016/j.addma.2016.06.003
apa: Delfs, P., Tows, M., & Schmid, H.-J. (2016). Optimized build orientation
of additive manufactured parts for improved surface quality and build time. Additive
Manufacturing, 2(12, Part B), 214–320. https://doi.org/10.1016/j.addma.2016.06.003
bibtex: '@article{Delfs_Tows_Schmid_2016, title={Optimized build orientation of
additive manufactured parts for improved surface quality and build time}, volume={2},
DOI={10.1016/j.addma.2016.06.003},
number={12, Part B}, journal={Additive Manufacturing}, publisher={Elsevier}, author={Delfs,
Patrick and Tows, Marcel and Schmid, Hans-Joachim}, year={2016}, pages={214–320}
}'
chicago: 'Delfs, Patrick, Marcel Tows, and Hans-Joachim Schmid. “Optimized Build
Orientation of Additive Manufactured Parts for Improved Surface Quality and Build
Time.” Additive Manufacturing 2, no. 12, Part B (2016): 214–320. https://doi.org/10.1016/j.addma.2016.06.003.'
ieee: P. Delfs, M. Tows, and H.-J. Schmid, “Optimized build orientation of additive
manufactured parts for improved surface quality and build time,” Additive Manufacturing,
vol. 2, no. 12, Part B, pp. 214–320, 2016.
mla: Delfs, Patrick, et al. “Optimized Build Orientation of Additive Manufactured
Parts for Improved Surface Quality and Build Time.” Additive Manufacturing,
vol. 2, no. 12, Part B, Elsevier, 2016, pp. 214–320, doi:10.1016/j.addma.2016.06.003.
short: P. Delfs, M. Tows, H.-J. Schmid, Additive Manufacturing 2 (2016) 214–320.
date_created: 2021-05-14T07:46:16Z
date_updated: 2022-01-06T06:55:28Z
department:
- _id: '150'
- _id: '624'
- _id: '219'
doi: 10.1016/j.addma.2016.06.003
intvolume: ' 2'
issue: 12, Part B
language:
- iso: eng
page: 214-320
publication: Additive Manufacturing
publication_identifier:
isbn:
- 2214-8604
publisher: Elsevier
status: public
title: Optimized build orientation of additive manufactured parts for improved surface
quality and build time
type: journal_article
user_id: '71545'
volume: 2
year: '2016'
...
---
_id: '22404'
abstract:
- lang: eng
text: Additive Manufacturing (AM), also known as 3D printing, is a relatively new
technology which enables the toolless production of components and entire assemblies
directly from a CAD file. Today, the technology is still not widely used in industrial
production. It is mainly limited to special applications, although it shows great
potential. In this paper, first approaches are shown to apply AM to the production
of rotors for permanent magnet synchronous machines (PMSM). The possibilities
of a lightweight design with a low moment of inertia as well as the influence
on the magnetic anisotropy for an improved sensorless control of PMSM are pointed
out. The results clearly demonstrate the great potential of additive manufacturing
in electrical engineering applications.
author:
- first_name: Stefan
full_name: Lammers, Stefan
id: '13835'
last_name: Lammers
- first_name: Guido
full_name: Adam, Guido
last_name: Adam
- first_name: Hans-Joachim
full_name: Schmid, Hans-Joachim
id: '464'
last_name: Schmid
- first_name: Rafael
full_name: Mrozek, Rafael
last_name: Mrozek
- first_name: Rainer
full_name: Oberacker, Rainer
last_name: Oberacker
- first_name: Michael
full_name: Hoffmann, Michael
last_name: Hoffmann
- first_name: Francesco
full_name: Quattrone, Francesco
last_name: Quattrone
- first_name: Bernd
full_name: Ponick, Bernd
last_name: Ponick
citation:
ama: 'Lammers S, Adam G, Schmid H-J, et al. Additive Manufacturing of a Lightweight
Rotor for a Permanent Magnet Synchronous Machine. In: EDPC 2016. ; 2016.
doi:10.1109/EDPC.2016.7851312'
apa: Lammers, S., Adam, G., Schmid, H.-J., Mrozek, R., Oberacker, R., Hoffmann,
M., … Ponick, B. (2016). Additive Manufacturing of a Lightweight Rotor for a Permanent
Magnet Synchronous Machine. In EDPC 2016. https://doi.org/10.1109/EDPC.2016.7851312
bibtex: '@inproceedings{Lammers_Adam_Schmid_Mrozek_Oberacker_Hoffmann_Quattrone_Ponick_2016,
title={Additive Manufacturing of a Lightweight Rotor for a Permanent Magnet Synchronous
Machine}, DOI={10.1109/EDPC.2016.7851312},
booktitle={EDPC 2016}, author={Lammers, Stefan and Adam, Guido and Schmid, Hans-Joachim
and Mrozek, Rafael and Oberacker, Rainer and Hoffmann, Michael and Quattrone,
Francesco and Ponick, Bernd}, year={2016} }'
chicago: Lammers, Stefan, Guido Adam, Hans-Joachim Schmid, Rafael Mrozek, Rainer
Oberacker, Michael Hoffmann, Francesco Quattrone, and Bernd Ponick. “Additive
Manufacturing of a Lightweight Rotor for a Permanent Magnet Synchronous Machine.”
In EDPC 2016, 2016. https://doi.org/10.1109/EDPC.2016.7851312.
ieee: S. Lammers et al., “Additive Manufacturing of a Lightweight Rotor for
a Permanent Magnet Synchronous Machine,” in EDPC 2016, 2016.
mla: Lammers, Stefan, et al. “Additive Manufacturing of a Lightweight Rotor for
a Permanent Magnet Synchronous Machine.” EDPC 2016, 2016, doi:10.1109/EDPC.2016.7851312.
short: 'S. Lammers, G. Adam, H.-J. Schmid, R. Mrozek, R. Oberacker, M. Hoffmann,
F. Quattrone, B. Ponick, in: EDPC 2016, 2016.'
date_created: 2021-06-15T11:09:32Z
date_updated: 2022-01-06T06:55:32Z
department:
- _id: '9'
- _id: '146'
- _id: '219'
- _id: '624'
doi: 10.1109/EDPC.2016.7851312
language:
- iso: eng
publication: EDPC 2016
publication_identifier:
isbn:
- 978-1-5090-2908-2
status: public
title: Additive Manufacturing of a Lightweight Rotor for a Permanent Magnet Synchronous
Machine
type: conference
user_id: '38077'
year: '2016'
...
---
_id: '23044'
author:
- first_name: Jan
full_name: Michael, Jan
last_name: Michael
- first_name: Jens
full_name: Holtkötter, Jens
last_name: Holtkötter
- first_name: Christian
full_name: Henke, Christian
last_name: Henke
- first_name: Ansgar
full_name: Trächtler, Ansgar
id: '552'
last_name: Trächtler
citation:
ama: 'Michael J, Holtkötter J, Henke C, Trächtler A. Modellbildung und Simulation
im Kontext des Systems Engineering. In: ASIM-Treffen STS/GMMS 2016. ; 2016:174-179.'
apa: Michael, J., Holtkötter, J., Henke, C., & Trächtler, A. (2016). Modellbildung
und Simulation im Kontext des Systems Engineering. In ASIM-Treffen STS/GMMS
2016 (pp. 174–179).
bibtex: '@inproceedings{Michael_Holtkötter_Henke_Trächtler_2016, title={Modellbildung
und Simulation im Kontext des Systems Engineering}, booktitle={ASIM-Treffen STS/GMMS
2016}, author={Michael, Jan and Holtkötter, Jens and Henke, Christian and Trächtler,
Ansgar}, year={2016}, pages={174–179} }'
chicago: Michael, Jan, Jens Holtkötter, Christian Henke, and Ansgar Trächtler. “Modellbildung
Und Simulation Im Kontext Des Systems Engineering.” In ASIM-Treffen STS/GMMS
2016, 174–79, 2016.
ieee: J. Michael, J. Holtkötter, C. Henke, and A. Trächtler, “Modellbildung und
Simulation im Kontext des Systems Engineering,” in ASIM-Treffen STS/GMMS 2016,
2016, pp. 174–179.
mla: Michael, Jan, et al. “Modellbildung Und Simulation Im Kontext Des Systems Engineering.”
ASIM-Treffen STS/GMMS 2016, 2016, pp. 174–79.
short: 'J. Michael, J. Holtkötter, C. Henke, A. Trächtler, in: ASIM-Treffen STS/GMMS
2016, 2016, pp. 174–179.'
date_created: 2021-08-09T06:34:30Z
date_updated: 2022-01-06T06:55:45Z
department:
- _id: '153'
- _id: '241'
language:
- iso: eng
page: 174-179
publication: ASIM-Treffen STS/GMMS 2016
status: public
title: Modellbildung und Simulation im Kontext des Systems Engineering
type: conference
user_id: '24876'
year: '2016'
...
---
_id: '21730'
author:
- first_name: K.
full_name: Yanaka, K.
last_name: Yanaka
- first_name: T.
full_name: Yamanouchi, T.
last_name: Yamanouchi
citation:
ama: Yanaka K, Yamanouchi T. 3D Image Display Courses for Information Media Students.
IEEE Computer Graphics and Applications. 2016;36(2):68-73. doi:10.1109/MCG.2016.36
apa: Yanaka, K., & Yamanouchi, T. (2016). 3D Image Display Courses for Information
Media Students. IEEE Computer Graphics and Applications, 36(2),
68–73. https://doi.org/10.1109/MCG.2016.36
bibtex: '@article{Yanaka_Yamanouchi_2016, title={3D Image Display Courses for Information
Media Students}, volume={36}, DOI={10.1109/MCG.2016.36},
number={2}, journal={IEEE Computer Graphics and Applications}, publisher={Editors
G. Domik and G. S. Owen}, author={Yanaka, K. and Yamanouchi, T.}, year={2016},
pages={68–73} }'
chicago: 'Yanaka, K., and T. Yamanouchi. “3D Image Display Courses for Information
Media Students.” IEEE Computer Graphics and Applications 36, no. 2 (2016):
68–73. https://doi.org/10.1109/MCG.2016.36.'
ieee: K. Yanaka and T. Yamanouchi, “3D Image Display Courses for Information Media
Students,” IEEE Computer Graphics and Applications, vol. 36, no. 2, pp.
68–73, 2016.
mla: Yanaka, K., and T. Yamanouchi. “3D Image Display Courses for Information Media
Students.” IEEE Computer Graphics and Applications, vol. 36, no. 2, Editors
G. Domik and G. S. Owen, 2016, pp. 68–73, doi:10.1109/MCG.2016.36.
short: K. Yanaka, T. Yamanouchi, IEEE Computer Graphics and Applications 36 (2016)
68–73.
date_created: 2021-04-25T13:35:37Z
date_updated: 2022-01-06T06:55:12Z
department:
- _id: '65'
doi: 10.1109/MCG.2016.36
intvolume: ' 36'
issue: '2'
language:
- iso: eng
page: 68-73
publication: IEEE Computer Graphics and Applications
publisher: Editors G. Domik and G. S. Owen
status: public
title: 3D Image Display Courses for Information Media Students
type: journal_article
user_id: '90'
volume: 36
year: '2016'
...
---
_id: '7484'
author:
- first_name: Sandro Phil
full_name: Hoffmann, Sandro Phil
last_name: Hoffmann
- first_name: Maximilian
full_name: Albert, Maximilian
last_name: Albert
- first_name: Cedrik
full_name: Meier, Cedrik
id: '20798'
last_name: Meier
orcid: https://orcid.org/0000-0002-3787-3572
citation:
ama: Hoffmann SP, Albert M, Meier C. Fabrication of fully undercut ZnO-based photonic
crystal membranes with 3D optical confinement. Superlattices and Microstructures.
2016;97:397-408. doi:10.1016/j.spmi.2016.07.006
apa: Hoffmann, S. P., Albert, M., & Meier, C. (2016). Fabrication of fully undercut
ZnO-based photonic crystal membranes with 3D optical confinement. Superlattices
and Microstructures, 97, 397–408. https://doi.org/10.1016/j.spmi.2016.07.006
bibtex: '@article{Hoffmann_Albert_Meier_2016, title={Fabrication of fully undercut
ZnO-based photonic crystal membranes with 3D optical confinement}, volume={97},
DOI={10.1016/j.spmi.2016.07.006},
journal={Superlattices and Microstructures}, publisher={Elsevier BV}, author={Hoffmann,
Sandro Phil and Albert, Maximilian and Meier, Cedrik}, year={2016}, pages={397–408}
}'
chicago: 'Hoffmann, Sandro Phil, Maximilian Albert, and Cedrik Meier. “Fabrication
of Fully Undercut ZnO-Based Photonic Crystal Membranes with 3D Optical Confinement.”
Superlattices and Microstructures 97 (2016): 397–408. https://doi.org/10.1016/j.spmi.2016.07.006.'
ieee: S. P. Hoffmann, M. Albert, and C. Meier, “Fabrication of fully undercut ZnO-based
photonic crystal membranes with 3D optical confinement,” Superlattices and
Microstructures, vol. 97, pp. 397–408, 2016.
mla: Hoffmann, Sandro Phil, et al. “Fabrication of Fully Undercut ZnO-Based Photonic
Crystal Membranes with 3D Optical Confinement.” Superlattices and Microstructures,
vol. 97, Elsevier BV, 2016, pp. 397–408, doi:10.1016/j.spmi.2016.07.006.
short: S.P. Hoffmann, M. Albert, C. Meier, Superlattices and Microstructures 97
(2016) 397–408.
date_created: 2019-02-04T13:55:37Z
date_updated: 2022-01-06T07:03:39Z
department:
- _id: '15'
- _id: '230'
- _id: '35'
- _id: '287'
doi: 10.1016/j.spmi.2016.07.006
intvolume: ' 97'
language:
- iso: eng
page: 397-408
project:
- _id: '53'
name: TRR 142
- _id: '55'
name: TRR 142 - Project Area B
- _id: '54'
name: TRR 142 - Project Area A
- _id: '66'
name: TRR 142 - Subproject B1
- _id: '62'
name: TRR 142 - Subproject A5
publication: Superlattices and Microstructures
publication_identifier:
issn:
- 0749-6036
publication_status: published
publisher: Elsevier BV
status: public
title: Fabrication of fully undercut ZnO-based photonic crystal membranes with 3D
optical confinement
type: journal_article
user_id: '20798'
volume: 97
year: '2016'
...
---
_id: '9955'
abstract:
- lang: eng
text: Wire bonding has been an established packaging technology for decades. When
introducing copper as wire material for high power applications, adaptations to
the bonding process and to machines became necessary. Here, challenges occur due
to the stiffer wire material and changing oxide layers on the contact partners.
To achieve sufficient process stability, a clean bond area is required, which
can only be achieved with high shear stresses in the contact partners surfaces.
These necessitate high normal forces to plastically deform the wire and substrate.
To achieve such high stresses in the contact area, the bonding tool needs to be
able to transmit the needed tangential forces to the top side of the wire. The
wire itself performs a shear movement and transmits the force into the contact
area to clean the contaminant and oxide layers and to level the desired bond surfaces.
The main function of the tool is to transmit these forces. If the bond tool can
only transmit low forces in the direction of excitation, the parameter space for
a stable bond process is severely restricted. Here, a modeling approach to estimate
how well different tool shapes meet the demand of transmitting high tangential
forces is presented. The model depends on wire deformation and thus on the ultrasonic
softening effect.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
citation:
ama: 'Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable
Tangential Force of Wire Bond Tools. In: IEEE 66th Electronic Components and
Technology Conference. ; 2016:2103-2110. doi:10.1109/ECTC.2016.234'
apa: Althoff, S., Meyer, T., Unger, A., Sextro, W., & Eacock, F. (2016). Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools. In IEEE 66th Electronic
Components and Technology Conference (pp. 2103–2110). https://doi.org/10.1109/ECTC.2016.234
bibtex: '@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools}, DOI={10.1109/ECTC.2016.234},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff,
Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian},
year={2016}, pages={2103–2110} }'
chicago: Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian
Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In
IEEE 66th Electronic Components and Technology Conference, 2103–10, 2016.
https://doi.org/10.1109/ECTC.2016.234.
ieee: S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools,” in IEEE 66th Electronic
Components and Technology Conference, 2016, pp. 2103–2110.
mla: Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire
Bond Tools.” IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2103–10, doi:10.1109/ECTC.2016.234.
short: 'S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic
Components and Technology Conference, 2016, pp. 2103–2110.'
date_created: 2019-05-27T08:47:52Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.234
keyword:
- finite element simulation
- wire bonding
- tool geometry
language:
- iso: eng
page: 2103-2110
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9958'
abstract:
- lang: eng
text: The transportation of dry fine powders is an emerging technologic task, as
in biotechnology, pharmaceutical or coatings industry particle sizes of processed
powders are getting smaller and smaller. Fine powders are primarily defined by
the fact that adhesive and cohesive forces outweigh the weight forces. This leads
to mostly unwanted agglomeration (clumping) and adhesion to surfaces, what makes
it more difficult to use conventional conveyor systems (e. g. pneumatic or vibratory
conveyors) for transport. A rather new method for transporting these fine powders
is based on ultrasonic vibrations, which are used to reduce friction and adhesion
between powder and the substrate. One very effective set-up consists of a pipe,
which vibrates harmoniously in axial direction at low frequency combined with
a pulsed radial high frequency vibration. The high frequency vibration accelerates
the particles perpendicular to the surface of the pipe, which in average leads
to lower normal and thereby smaller friction force. With coordinated friction
manipulation the powder acceleration can be varied so that the powder may be greatly
accelerated and only slightly decelerated in each excitation period of the low
frequency axial vibration of the pipe. The amount of powder flow is adjustable
by vibration amplitudes, frequencies, and pulse rate, which makes the device versatile
for comparable high volume and fine dosing using one setup. Within this contribution
an experimental set-up consisting of a pipe, a solenoid actuator for axial vibration
and a piezoelectric actuator for the radial high frequency vibration is described.
An analytical model is shown, that simulates the powder velocity. Finally, simulation
results are validated by experimental data for different driving parameters such
as amplitude of low frequency vibration, pipe material and inclination angle.
author:
- first_name: Paul
full_name: Dunst, Paul
id: '22130'
last_name: Dunst
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Peter
full_name: Bornmann, Peter
last_name: Bornmann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Littmann, Walter
last_name: Littmann
citation:
ama: 'Dunst P, Sextro W, Bornmann P, Hemsel T, Littmann W. Transportation of dry
fine powders by coordinated friction manipulation. In: PAMM Proc. Appl. Math.
Mech. 16. Braunschweig; 2016:635-636. doi:10.1002/pamm.201610306'
apa: Dunst, P., Sextro, W., Bornmann, P., Hemsel, T., & Littmann, W. (2016).
Transportation of dry fine powders by coordinated friction manipulation. In PAMM
Proc. Appl. Math. Mech. 16 (pp. 635–636). Braunschweig. https://doi.org/10.1002/pamm.201610306
bibtex: '@inproceedings{Dunst_Sextro_Bornmann_Hemsel_Littmann_2016, place={Braunschweig},
title={Transportation of dry fine powders by coordinated friction manipulation},
DOI={10.1002/pamm.201610306},
booktitle={PAMM Proc. Appl. Math. Mech. 16}, author={Dunst, Paul and Sextro, Walter
and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter}, year={2016}, pages={635–636}
}'
chicago: Dunst, Paul, Walter Sextro, Peter Bornmann, Tobias Hemsel, and Walter Littmann.
“Transportation of Dry Fine Powders by Coordinated Friction Manipulation.” In
PAMM Proc. Appl. Math. Mech. 16, 635–36. Braunschweig, 2016. https://doi.org/10.1002/pamm.201610306.
ieee: P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, and W. Littmann, “Transportation
of dry fine powders by coordinated friction manipulation,” in PAMM Proc. Appl.
Math. Mech. 16, 2016, pp. 635–636.
mla: Dunst, Paul, et al. “Transportation of Dry Fine Powders by Coordinated Friction
Manipulation.” PAMM Proc. Appl. Math. Mech. 16, 2016, pp. 635–36, doi:10.1002/pamm.201610306.
short: 'P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, W. Littmann, in: PAMM Proc.
Appl. Math. Mech. 16, Braunschweig, 2016, pp. 635–636.'
date_created: 2019-05-27T08:57:25Z
date_updated: 2019-05-27T08:59:25Z
department:
- _id: '151'
doi: 10.1002/pamm.201610306
language:
- iso: eng
page: 635-636
place: Braunschweig
publication: PAMM Proc. Appl. Math. Mech. 16
status: public
title: Transportation of dry fine powders by coordinated friction manipulation
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9960'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a common technology for connecting electrodes of
electronic components like power modules. Nowadays, bond connections are often
made of copper instead of aluminum due to its thermal and mechanical assets. One
of the main cost factors in the wire bonding process is the acquisition cost of
consumables such as bonding tools. For copper wire bonding tool lifetime is much
lower than for aluminium bonding. This paper presents a micro wear model for wedge/wedge
bonding tools that was validated by observing wear patterns with a scanning electron
microscope. The wear coefficient is determined in long-term bonding tests. The
application of Fleischer´s wear approach incorporating frictional power to a finite
element simulation of the bonding processes is used to shift element nodes depending
on the rising frictional power for finite element modeling. The presented simulation
method can be used to take tool wear into consideration for creating tools with
increased lifetime. This enables the production of reliable bond connections using
heavy as well as thin wire of any material. The paper discusses the predominant
influences of wear on the main tool functions and their changes over tool life.
Furthermore, the influence of the tool groove angle on the tool wear was investigated.
One of the main results is that the wear is largest during the last phase of each
bonding process, when the contact area between tool and wire is largest.
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
citation:
ama: 'Eichwald P, Unger A, Eacock F, et al. Micro Wear Modeling in Copper Wire Wedge
Bonding. In: IEEE CPMT Symposium Japan, 2016. ; 2016.'
apa: Eichwald, P., Unger, A., Eacock, F., Althoff, S., Sextro, W., Guth, K., &
Brökelmann, M. (2016). Micro Wear Modeling in Copper Wire Wedge Bonding. In IEEE
CPMT Symposium Japan, 2016.
bibtex: '@inproceedings{Eichwald_Unger_Eacock_Althoff_Sextro_Guth_Brökelmann_2016,
title={Micro Wear Modeling in Copper Wire Wedge Bonding}, booktitle={IEEE CPMT
Symposium Japan, 2016}, author={Eichwald, Paul and Unger, Andreas and Eacock,
Florian and Althoff, Simon and Sextro, Walter and Guth, Karsten and Brökelmann,
Michael}, year={2016} }'
chicago: Eichwald, Paul, Andreas Unger, Florian Eacock, Simon Althoff, Walter Sextro,
Karsten Guth, and Michael Brökelmann. “Micro Wear Modeling in Copper Wire Wedge
Bonding.” In IEEE CPMT Symposium Japan, 2016, 2016.
ieee: P. Eichwald et al., “Micro Wear Modeling in Copper Wire Wedge Bonding,”
in IEEE CPMT Symposium Japan, 2016, 2016.
mla: Eichwald, Paul, et al. “Micro Wear Modeling in Copper Wire Wedge Bonding.”
IEEE CPMT Symposium Japan, 2016, 2016.
short: 'P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann,
in: IEEE CPMT Symposium Japan, 2016, 2016.'
date_created: 2019-05-27T09:07:19Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE CPMT Symposium Japan, 2016
quality_controlled: '1'
status: public
title: Micro Wear Modeling in Copper Wire Wedge Bonding
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9963'
abstract:
- lang: eng
text: Tire-wheel assembly is the only connection between road and vehicle. Contacting
directly with road within postcard size of contact area, it is mounted and guided
by the suspension system. Therefore kinematics and compliances of suspension system
greatly influence the frictional coupling of tire tread elements and road surface
asperities by affecting pressure and sliding velocity distribution in the contact
zone. This study emphasizes the development of a numerical methodology for frictional
rolling contact analysis with focus on interaction of suspension system dynamics
and tire-road contact using ADAMS. For this purpose a comprehensive flexible multibody
system of the multi-link rear suspension is established, where both flexible and
rigid bodies are modeled to allow large displacements with included elastic effects.
To meet accuracy requirements for the high frequency applications, such as road
excitations, the amplitude- and frequency-dependency of rubber-metal bushings
is included. Furthermore the proposed flexible viscoelastic suspension model is
enhanced by a Flexible Ring Tire Model (FTire), which describes a 3D tire dynamic
response and covers any road excitations by tread submodel connected to road surface
model. Concerning the verification and validation procedure numerous experiments
are carried out to confirm the validity and the accuracy of both the developed
submodels and the entire model. The devised approach makes it possible to investigate
the influence of suspension system design on dynamical rolling contact and to
evaluate tire tread wear. Therefore it can be a useful tool to predict frictional
power distribution within the contact area under more realistic conditions.
author:
- first_name: Sergej
full_name: Kohl, Sergej
last_name: Kohl
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Sebastian
full_name: Schulze, Sebastian
last_name: Schulze
citation:
ama: 'Kohl S, Sextro W, Schulze S. Aspects of Flexible Viscoelastic Suspension Modeling
for Frictional Rolling Contact Analysis using ADAMS. In: The 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
Malaysia, 2016. Cyberjaya, Malaysia, 2016; 2016:1-12.'
apa: Kohl, S., Sextro, W., & Schulze, S. (2016). Aspects of Flexible Viscoelastic
Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS. In The
2nd International Conference on Automotive Innovation and Green Energy Vehicle
(AiGEV 2016), Cyberjaya, Malaysia, 2016. (pp. 1–12). Cyberjaya, Malaysia,
2016.
bibtex: '@inproceedings{Kohl_Sextro_Schulze_2016, place={Cyberjaya, Malaysia, 2016},
title={Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling
Contact Analysis using ADAMS}, booktitle={The 2nd International Conference on
Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia,
2016.}, author={Kohl, Sergej and Sextro, Walter and Schulze, Sebastian}, year={2016},
pages={1–12} }'
chicago: Kohl, Sergej, Walter Sextro, and Sebastian Schulze. “Aspects of Flexible
Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis Using
ADAMS.” In The 2nd International Conference on Automotive Innovation and Green
Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016., 1–12. Cyberjaya,
Malaysia, 2016, 2016.
ieee: S. Kohl, W. Sextro, and S. Schulze, “Aspects of Flexible Viscoelastic Suspension
Modeling for Frictional Rolling Contact Analysis using ADAMS,” in The 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
Malaysia, 2016., 2016, pp. 1–12.
mla: Kohl, Sergej, et al. “Aspects of Flexible Viscoelastic Suspension Modeling
for Frictional Rolling Contact Analysis Using ADAMS.” The 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
Malaysia, 2016., 2016, pp. 1–12.
short: 'S. Kohl, W. Sextro, S. Schulze, in: The 2nd International Conference on
Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia,
2016., Cyberjaya, Malaysia, 2016, 2016, pp. 1–12.'
date_created: 2019-05-27T09:13:14Z
date_updated: 2019-05-27T09:13:54Z
department:
- _id: '151'
keyword:
- Kinematics and compliances
- flexible viscoelastic suspension model
- frictional rolling contact analysis
- frictional power distribution.
language:
- iso: eng
page: 1-12
place: Cyberjaya, Malaysia, 2016
publication: The 2nd International Conference on Automotive Innovation and Green Energy
Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.
status: public
title: Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling
Contact Analysis using ADAMS
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9966'
abstract:
- lang: eng
text: Usage of copper wire bonds allows to push power boundaries imposed by aluminum
wire bonds. Copper allows higher electrical, thermal and mechanical loads than
aluminum, which currently is the most commonly used material in heavy wire bonding.
This is the main driving factor for increased usage of copper in high power applications
such as wind turbines, locomotives or electric vehicles. At the same time, usage
of copper also increases tool wear and reduces the range of parameter values for
a stable process, making the process more challenging. To overcome these drawbacks,
parameter adaptation at runtime using self-optimization is desired. A self-optimizing
system is based on system objectives that evaluate and quantify system performance.
System parameters can be changed at runtime such that pre-selected objective values
are reached. For adaptation of bond process parameters, model-based self-optimization
is employed. Since it is based on a model of the system, the bond process was
modeled. In addition to static model parameters such as wire and substrate material
properties and vibration characteristics of transducer and tool, variable model
inputs are process parameters. Main simulation result is bonded area in the wiresubstrate
contact. This model is then used to find valid and optimal working points before
operation. The working point is composed of normal force and ultrasonic voltage
trajectories, which are usually determined experimentally. Instead, multiobjective
optimalization is used to compute trajectories that simultaneously optimize bond
quality, process duration, tool wear and probability of tool-substrate contacts.
The values of these objectives are computed using the process model. At runtime,
selection among pre-determined optimal working points is sufficient to prioritize
individual objectives. This way, the computationally expensive process of numerically
solving a multiobjective optimal control problem and the demanding high speed
bonding process are separated. To evaluate to what extent the pre-defined goals
of self-optimization are met, an offthe- shelf heavy wire bonding machine was
modified to allow for parameter adaptation and for transmitting of measurement
data at runtime. This data is received by an external computer system and evaluated
to select a new working point. Then, new process parameters are sent to the modified
bonding machine for use for subsequent bonds. With these components, a full self-optimizing
system has been implemented.
author:
- first_name: Tobias
full_name: Meyer , Tobias
last_name: 'Meyer '
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Meyer T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper
Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components
and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215'
apa: Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M.,
& Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation. In IEEE 66th Electronic Components and Technology
Conference (pp. 622–628). https://doi.org/10.1109/ECTC.2016.215
bibtex: '@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter
Adaptation}, DOI={10.1109/ECTC.2016.215},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer
, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann,
Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628}
}'
chicago: Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann,
Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire
Bonds Using Online Parameter Adaptation.” In IEEE 66th Electronic Components
and Technology Conference, 622–28, 2016. https://doi.org/10.1109/ECTC.2016.215.
ieee: T. Meyer et al., “Reliable Manufacturing of Heavy Copper Wire Bonds
Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and
Technology Conference, 2016, pp. 622–628.
mla: Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology
Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.
short: 'T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K.
Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp.
622–628.'
date_created: 2019-05-27T09:17:26Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.215
keyword:
- Self-optimization
- adaptive system
- bond process
- copper wire
language:
- iso: eng
page: 622-628
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9968'
abstract:
- lang: eng
text: To increase quality and reliability of copper wire bonds, self-optimization
is a promising technique. For the implementation of self-optimization for ultrasonic
heavy copper wire bonding machines, a model of stick-slip motion between tool
and wire and between wire and substrate during the bonding process is essential.
Investigations confirm that both of these contacts do indeed show stick-slip movement
in each period oscillation. In a first step, this paper shows the importance of
modeling the stick-slip effect by determining, monitoring and analyzing amplitudes
and phase angles of tooltip, wire and substrate experimentally during bonding
via laser measurements. In a second step, the paper presents a dynamic model which
has been parameterized using an iterative numerical parameter identification method.
This model includes Archard’s wear approach in order to compute the lost volume
of tool tip due to wear over the entire process time. A validation of the model
by comparing measured and calculated amplitudes of tool tip and wire reveals high
model quality. Then it is then possible to calculate the lifetime of the tool
for different process parameters, i.e. values of normal force and ultrasonic voltage.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic
Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE
CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.'
apa: Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S.,
… Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process.
In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016
(pp. 251–254). IEEE CPMT Symposium Japan.
bibtex: '@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic
Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding.
IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard
and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and
Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten},
year={2016}, pages={251–254} }'
chicago: Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald,
Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten
Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear
Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54.
IEEE CPMT Symposium Japan, 2016.
ieee: A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding
Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium
Japan, 2016, 2016, pp. 251–254.
mla: Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding
Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016, 2016, pp. 251–54.
short: 'A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W.
Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge
Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp.
251–254.'
date_created: 2019-05-27T09:20:10Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
keyword:
- the Ultrasonic Wire Bonding Process
language:
- iso: eng
page: 251-254
place: IEEE CPMT Symposium Japan
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016
quality_controlled: '1'
status: public
title: Validated Simulation of the Ultrasonic Wire Bonding Process
type: conference
user_id: '210'
year: '2016'
...
---
_id: '3934'
abstract:
- lang: eng
text: Typical optical integrated circuits combine elements, like straight and curved
waveguides, or cavities, the simulation and design of which is well established
through numerical eigenproblem-solvers. It remains to predict the interaction
of these modes. We address this task by a ”Hybrid” variant (HCMT) of Coupled Mode
Theory. Using methods from finite-element numerics, the optical properties of
a circuit are approximated by superpositions of eigen-solutions for its constituents,
leading to quantitative, low-dimensional, and interpretable models in the frequency
domain. Spectral scans are complemented by the direct computation of supermode
properties (spectral positions and linewidths, coupling-induced phase shifts).
This contribution outlines the theoretical background, and discusses briefly limitations
and implementational details, with the help of an example of a 2-D coupled-resonator-optical-waveguide
configuration.
author:
- first_name: Manfred
full_name: Hammer, Manfred
id: '48077'
last_name: Hammer
orcid: 0000-0002-6331-9348
citation:
ama: 'Hammer M. Wave interaction in photonic integrated circuits: Hybrid analytical
/ numerical coupled mode modeling. In: Broquin J-E, Nunzi Conti G, eds. Integrated
Optics: Devices, Materials, and Technologies XX. SPIE; 2016:975018-975018-8.
doi:10.1117/12.2214331'
apa: 'Hammer, M. (2016). Wave interaction in photonic integrated circuits: Hybrid
analytical / numerical coupled mode modeling. In J.-E. Broquin & G. Nunzi
Conti (Eds.), Integrated Optics: Devices, Materials, and Technologies XX
(pp. 975018-975018–8). San Francisco, USA: SPIE. https://doi.org/10.1117/12.2214331'
bibtex: '@inproceedings{Hammer_2016, title={Wave interaction in photonic integrated
circuits: Hybrid analytical / numerical coupled mode modeling}, DOI={10.1117/12.2214331},
number={9750}, booktitle={Integrated Optics: Devices, Materials, and Technologies
XX}, publisher={SPIE}, author={Hammer, Manfred}, editor={Broquin, Jean-Emmanuel
and Nunzi Conti, GualtieroEditors}, year={2016}, pages={975018-975018–8} }'
chicago: 'Hammer, Manfred. “Wave Interaction in Photonic Integrated Circuits: Hybrid
Analytical / Numerical Coupled Mode Modeling.” In Integrated Optics: Devices,
Materials, and Technologies XX, edited by Jean-Emmanuel Broquin and Gualtiero
Nunzi Conti, 975018-975018–8. SPIE, 2016. https://doi.org/10.1117/12.2214331.'
ieee: 'M. Hammer, “Wave interaction in photonic integrated circuits: Hybrid analytical
/ numerical coupled mode modeling,” in Integrated Optics: Devices, Materials,
and Technologies XX, San Francisco, USA, 2016, no. 9750, pp. 975018-975018–8.'
mla: 'Hammer, Manfred. “Wave Interaction in Photonic Integrated Circuits: Hybrid
Analytical / Numerical Coupled Mode Modeling.” Integrated Optics: Devices,
Materials, and Technologies XX, edited by Jean-Emmanuel Broquin and Gualtiero
Nunzi Conti, no. 9750, SPIE, 2016, pp. 975018-975018–8, doi:10.1117/12.2214331.'
short: 'M. Hammer, in: J.-E. Broquin, G. Nunzi Conti (Eds.), Integrated Optics:
Devices, Materials, and Technologies XX, SPIE, 2016, pp. 975018-975018–8.'
conference:
location: San Francisco, USA
name: Photonics West 2016/OPTO 2016
date_created: 2018-08-20T09:25:13Z
date_updated: 2022-01-06T06:59:56Z
department:
- _id: '61'
doi: 10.1117/12.2214331
editor:
- first_name: Jean-Emmanuel
full_name: Broquin, Jean-Emmanuel
last_name: Broquin
- first_name: Gualtiero
full_name: Nunzi Conti, Gualtiero
last_name: Nunzi Conti
issue: '9750'
keyword:
- tet_topic_waveguide
- tet_topic_numerics
language:
- iso: eng
page: '975018-975018-8 '
publication: 'Integrated Optics: Devices, Materials, and Technologies XX'
publication_status: published
publisher: SPIE
status: public
title: 'Wave interaction in photonic integrated circuits: Hybrid analytical / numerical
coupled mode modeling'
type: conference
user_id: '55706'
year: '2016'
...
---
_id: '10695'
author:
- first_name: Jens
full_name: Horstmann, Jens
last_name: Horstmann
citation:
ama: Horstmann J. Beschleunigte Simulation Elektrischer Stromnetze Mit GPUs.
Paderborn University; 2016.
apa: Horstmann, J. (2016). Beschleunigte Simulation elektrischer Stromnetze mit
GPUs. Paderborn University.
bibtex: '@book{Horstmann_2016, title={Beschleunigte Simulation elektrischer Stromnetze
mit GPUs}, publisher={Paderborn University}, author={Horstmann, Jens}, year={2016}
}'
chicago: Horstmann, Jens. Beschleunigte Simulation Elektrischer Stromnetze Mit
GPUs. Paderborn University, 2016.
ieee: J. Horstmann, Beschleunigte Simulation elektrischer Stromnetze mit GPUs.
Paderborn University, 2016.
mla: Horstmann, Jens. Beschleunigte Simulation Elektrischer Stromnetze Mit GPUs.
Paderborn University, 2016.
short: J. Horstmann, Beschleunigte Simulation Elektrischer Stromnetze Mit GPUs,
Paderborn University, 2016.
date_created: 2019-07-10T11:30:20Z
date_updated: 2022-01-06T06:50:49Z
department:
- _id: '78'
language:
- iso: eng
publisher: Paderborn University
status: public
supervisor:
- first_name: Paul
full_name: Kaufmann, Paul
last_name: Kaufmann
title: Beschleunigte Simulation elektrischer Stromnetze mit GPUs
type: bachelorsthesis
user_id: '3118'
year: '2016'
...
---
_id: '10766'
author:
- first_name: Ines
full_name: Ghribi, Ines
last_name: Ghribi
- first_name: Riadh
full_name: Ben Abdallah, Riadh
last_name: Ben Abdallah
- first_name: Mohamed
full_name: Khalgui, Mohamed
last_name: Khalgui
- first_name: Marco
full_name: Platzner, Marco
id: '398'
last_name: Platzner
citation:
ama: 'Ghribi I, Ben Abdallah R, Khalgui M, Platzner M. RCo-Design: New Visual Environment
for Reconfigurable Embedded Systems. In: Proceedings of the 30th European Simulation
and Modelling Conference (ESM). ; 2016.'
apa: 'Ghribi, I., Ben Abdallah, R., Khalgui, M., & Platzner, M. (2016). RCo-Design:
New Visual Environment for Reconfigurable Embedded Systems. In Proceedings
of the 30th European Simulation and Modelling Conference (ESM).'
bibtex: '@inproceedings{Ghribi_Ben Abdallah_Khalgui_Platzner_2016, title={RCo-Design:
New Visual Environment for Reconfigurable Embedded Systems}, booktitle={Proceedings
of the 30th European Simulation and Modelling Conference (ESM)}, author={Ghribi,
Ines and Ben Abdallah, Riadh and Khalgui, Mohamed and Platzner, Marco}, year={2016}
}'
chicago: 'Ghribi, Ines, Riadh Ben Abdallah, Mohamed Khalgui, and Marco Platzner.
“RCo-Design: New Visual Environment for Reconfigurable Embedded Systems.” In Proceedings
of the 30th European Simulation and Modelling Conference (ESM), 2016.'
ieee: 'I. Ghribi, R. Ben Abdallah, M. Khalgui, and M. Platzner, “RCo-Design: New
Visual Environment for Reconfigurable Embedded Systems,” in Proceedings of
the 30th European Simulation and Modelling Conference (ESM), 2016.'
mla: 'Ghribi, Ines, et al. “RCo-Design: New Visual Environment for Reconfigurable
Embedded Systems.” Proceedings of the 30th European Simulation and Modelling
Conference (ESM), 2016.'
short: 'I. Ghribi, R. Ben Abdallah, M. Khalgui, M. Platzner, in: Proceedings of
the 30th European Simulation and Modelling Conference (ESM), 2016.'
date_created: 2019-07-10T12:07:54Z
date_updated: 2022-01-06T06:50:50Z
department:
- _id: '78'
language:
- iso: eng
publication: Proceedings of the 30th European Simulation and Modelling Conference
(ESM)
status: public
title: 'RCo-Design: New Visual Environment for Reconfigurable Embedded Systems'
type: conference
user_id: '3118'
year: '2016'
...
---
_id: '11829'
abstract:
- lang: eng
text: 'This contribution investigates Direction of Arrival (DoA) estimation using
linearly arranged microphone arrays. We are going to develop a model for the DoA
estimation error in a reverberant scenario and show the existence of a bias, that
is a consequence of the linear arrangement and limited field of view (FoV) bias:
First, the limited FoV leading to a clipping of the measurements, and, second,
the angular distribution of the signal energy of the reflections being non-uniform.
Since both issues are a consequence of the linear arrangement of the sensors,
the bias arises largely independent of the kind of DoA estimator. The experimental
evaluation demonstrates the existence of the bias for a selected number of DoA
estimation methods and proves that the prediction from the developed theoretical
model matches the simulation results.'
author:
- first_name: Florian
full_name: Jacob, Florian
last_name: Jacob
- first_name: Reinhold
full_name: Haeb-Umbach, Reinhold
id: '242'
last_name: Haeb-Umbach
citation:
ama: 'Jacob F, Haeb-Umbach R. On the Bias of Direction of Arrival Estimation Using
Linear Microphone Arrays. In: 12. ITG Fachtagung Sprachkommunikation (ITG 2016).
; 2016.'
apa: Jacob, F., & Haeb-Umbach, R. (2016). On the Bias of Direction of Arrival
Estimation Using Linear Microphone Arrays. In 12. ITG Fachtagung Sprachkommunikation
(ITG 2016).
bibtex: '@inproceedings{Jacob_Haeb-Umbach_2016, title={On the Bias of Direction
of Arrival Estimation Using Linear Microphone Arrays}, booktitle={12. ITG Fachtagung
Sprachkommunikation (ITG 2016)}, author={Jacob, Florian and Haeb-Umbach, Reinhold},
year={2016} }'
chicago: Jacob, Florian, and Reinhold Haeb-Umbach. “On the Bias of Direction of
Arrival Estimation Using Linear Microphone Arrays.” In 12. ITG Fachtagung Sprachkommunikation
(ITG 2016), 2016.
ieee: F. Jacob and R. Haeb-Umbach, “On the Bias of Direction of Arrival Estimation
Using Linear Microphone Arrays,” in 12. ITG Fachtagung Sprachkommunikation
(ITG 2016), 2016.
mla: Jacob, Florian, and Reinhold Haeb-Umbach. “On the Bias of Direction of Arrival
Estimation Using Linear Microphone Arrays.” 12. ITG Fachtagung Sprachkommunikation
(ITG 2016), 2016.
short: 'F. Jacob, R. Haeb-Umbach, in: 12. ITG Fachtagung Sprachkommunikation (ITG
2016), 2016.'
date_created: 2019-07-12T05:29:03Z
date_updated: 2022-01-06T06:51:10Z
department:
- _id: '54'
language:
- iso: eng
main_file_link:
- open_access: '1'
url: https://groups.uni-paderborn.de/nt/pubs/2016/JacobHaeb_ITG2016.pdf
oa: '1'
publication: 12. ITG Fachtagung Sprachkommunikation (ITG 2016)
related_material:
link:
- description: Poster
relation: supplementary_material
url: https://groups.uni-paderborn.de/nt/pubs/2016/JacobHaeb_ITG2016_poster.pdf
status: public
title: On the Bias of Direction of Arrival Estimation Using Linear Microphone Arrays
type: conference
user_id: '44006'
year: '2016'
...
---
_id: '11834'
abstract:
- lang: eng
text: We present a system for the 4th CHiME challenge which significantly increases
the performance for all three tracks with respect to the provided baseline system.
The front-end uses a bi-directional Long Short-Term Memory (BLSTM)-based neural
network to estimate signal statistics. These then steer a Generalized Eigenvalue
beamformer. The back-end consists of a 22 layer deep Wide Residual Network and
two extra BLSTM layers. Working on a whole utterance instead of frames allows
us to refine Batch-Normalization. We also train our own BLSTM-based language model.
Adding a discriminative speaker adaptation leads to further gains. The final system
achieves a word error rate on the six channel real test data of 3.48%. For the
two channel track we achieve 5.96% and for the one channel track 9.34%. This is
the best reported performance on the challenge achieved by a single system, i.e.,
a configuration, which does not combine multiple systems. At the same time, our
system is independent of the microphone configuration. We can thus use the same
components for all three tracks.
author:
- first_name: Jahn
full_name: Heymann, Jahn
id: '9168'
last_name: Heymann
- first_name: Lukas
full_name: Drude, Lukas
id: '11213'
last_name: Drude
- first_name: Reinhold
full_name: Haeb-Umbach, Reinhold
id: '242'
last_name: Haeb-Umbach
citation:
ama: 'Heymann J, Drude L, Haeb-Umbach R. Wide Residual BLSTM Network with Discriminative
Speaker Adaptation for Robust Speech Recognition. In: Computer Speech and Language.
; 2016.'
apa: Heymann, J., Drude, L., & Haeb-Umbach, R. (2016). Wide Residual BLSTM Network
with Discriminative Speaker Adaptation for Robust Speech Recognition. In Computer
Speech and Language.
bibtex: '@inproceedings{Heymann_Drude_Haeb-Umbach_2016, title={Wide Residual BLSTM
Network with Discriminative Speaker Adaptation for Robust Speech Recognition},
booktitle={Computer Speech and Language}, author={Heymann, Jahn and Drude, Lukas
and Haeb-Umbach, Reinhold}, year={2016} }'
chicago: Heymann, Jahn, Lukas Drude, and Reinhold Haeb-Umbach. “Wide Residual BLSTM
Network with Discriminative Speaker Adaptation for Robust Speech Recognition.”
In Computer Speech and Language, 2016.
ieee: J. Heymann, L. Drude, and R. Haeb-Umbach, “Wide Residual BLSTM Network with
Discriminative Speaker Adaptation for Robust Speech Recognition,” in Computer
Speech and Language, 2016.
mla: Heymann, Jahn, et al. “Wide Residual BLSTM Network with Discriminative Speaker
Adaptation for Robust Speech Recognition.” Computer Speech and Language,
2016.
short: 'J. Heymann, L. Drude, R. Haeb-Umbach, in: Computer Speech and Language,
2016.'
date_created: 2019-07-12T05:29:09Z
date_updated: 2022-01-06T06:51:11Z
department:
- _id: '54'
language:
- iso: eng
main_file_link:
- open_access: '1'
url: https://groups.uni-paderborn.de/nt/pubs/2016/chime4_upbonly_paper.pdf
oa: '1'
publication: Computer Speech and Language
related_material:
link:
- description: Poster
relation: supplementary_material
url: https://groups.uni-paderborn.de/nt/pubs/2016/chime4_upbonly_poster.pdf
status: public
title: Wide Residual BLSTM Network with Discriminative Speaker Adaptation for Robust
Speech Recognition
type: conference
user_id: '44006'
year: '2016'
...
---
_id: '144'
abstract:
- lang: eng
text: 'Following the direction pioneered by Fiat and Papadimitriou in their 2010
paper [12], we study the complexity of deciding the existence of mixed equilibria
for minimization games where players use valuations other than expectation to
evaluate their costs. We consider risk-averse players seeking to minimize the
sum V=E+R of expectationE and a risk valuationR of their costs; R is non-negative
and vanishes exactly when the cost incurred to a player is constant over all choices
of strategies by the other players. In a V-equilibrium, no player could unilaterally
reduce her cost.Say that V has the Weak-Equilibrium-for-Expectation property if
all strategies supported in a player''s best-response mixed strategy incur the
same conditional expectation of her cost. We introduce E-strict concavity and
observe that every E-strictly concave valuation has the Weak-Equilibrium-for-Expectation
property. We focus on a broad class of valuations shown to have the Weak-Equilibrium-for-Expectation
property, which we exploit to prove two main complexity results, the first of
their kind, for the two simplest cases of the problem:• Two strategies: Deciding
the existence of a V-equilibrium is strongly NP-hard for the restricted class
of player-specific scheduling games on two ordered links [22], when choosing R
as (1)Var (variance), or (2)SD (standard deviation), or (3) a concave linear sum
of even moments of small order.• Two players: Deciding the existence of a V-equilibrium
is strongly NP-hard when choosing R as (1)γ⋅Var, or (2)γ⋅SD, where γ>0 is the
risk-coefficient, or choosing V as (3) a convex combination of E+γ⋅Var and the
concave ν-valuationν−1(E(ν(⋅))), where ν(x)=xr, with r≥2. This is a concrete consequence
of a general strong NP-hardness result that only needs the Weak-Equilibrium-for-Expectation
property and a few additional properties for V; its proof involves a reduction
with a single parameter, which can be chosen efficiently so that each valuation
satisfies the additional properties.'
author:
- first_name: Burkhard
full_name: Monien, Burkhard
last_name: Monien
- first_name: Marios
full_name: Mavronicolas, Marios
last_name: Mavronicolas
citation:
ama: Monien B, Mavronicolas M. The complexity of equilibria for risk-modeling valuations.
Theoretical Computer Science. 2016;634:67-96. doi:10.1016/j.tcs.2016.04.013
apa: Monien, B., & Mavronicolas, M. (2016). The complexity of equilibria for
risk-modeling valuations. Theoretical Computer Science, 634, 67–96.
https://doi.org/10.1016/j.tcs.2016.04.013
bibtex: '@article{Monien_Mavronicolas_2016, title={The complexity of equilibria
for risk-modeling valuations}, volume={634}, DOI={10.1016/j.tcs.2016.04.013},
journal={Theoretical Computer Science}, publisher={Elsevier}, author={Monien,
Burkhard and Mavronicolas, Marios}, year={2016}, pages={67–96} }'
chicago: 'Monien, Burkhard, and Marios Mavronicolas. “The Complexity of Equilibria
for Risk-Modeling Valuations.” Theoretical Computer Science 634 (2016):
67–96. https://doi.org/10.1016/j.tcs.2016.04.013.'
ieee: B. Monien and M. Mavronicolas, “The complexity of equilibria for risk-modeling
valuations,” Theoretical Computer Science, vol. 634, pp. 67–96, 2016.
mla: Monien, Burkhard, and Marios Mavronicolas. “The Complexity of Equilibria for
Risk-Modeling Valuations.” Theoretical Computer Science, vol. 634, Elsevier,
2016, pp. 67–96, doi:10.1016/j.tcs.2016.04.013.
short: B. Monien, M. Mavronicolas, Theoretical Computer Science 634 (2016) 67–96.
date_created: 2017-10-17T12:41:20Z
date_updated: 2022-01-06T06:51:59Z
ddc:
- '040'
doi: 10.1016/j.tcs.2016.04.013
file:
- access_level: closed
content_type: application/pdf
creator: florida
date_created: 2018-03-21T12:58:42Z
date_updated: 2018-03-21T12:58:42Z
file_id: '1557'
file_name: 144-Monien_Mavronicolas-TCS2016_01.pdf
file_size: 633599
relation: main_file
success: 1
file_date_updated: 2018-03-21T12:58:42Z
has_accepted_license: '1'
intvolume: ' 634'
language:
- iso: eng
page: 67-96
project:
- _id: '1'
name: SFB 901
- _id: '7'
name: SFB 901 - Subprojekt A3
- _id: '2'
name: SFB 901 - Project Area A
publication: Theoretical Computer Science
publisher: Elsevier
status: public
title: The complexity of equilibria for risk-modeling valuations
type: journal_article
user_id: '42447'
volume: 634
year: '2016'
...
---
_id: '13152'
author:
- first_name: Tobias
full_name: Graf, Tobias
last_name: Graf
- first_name: Marco
full_name: Platzner, Marco
id: '398'
last_name: Platzner
citation:
ama: 'Graf T, Platzner M. Monte-Carlo Simulation Balancing Revisited. In: IEEE
Computational Intelligence and Games. ; 2016.'
apa: Graf, T., & Platzner, M. (2016). Monte-Carlo Simulation Balancing Revisited.
In IEEE Computational Intelligence and Games.
bibtex: '@inproceedings{Graf_Platzner_2016, title={Monte-Carlo Simulation Balancing
Revisited}, booktitle={IEEE Computational Intelligence and Games}, author={Graf,
Tobias and Platzner, Marco}, year={2016} }'
chicago: Graf, Tobias, and Marco Platzner. “Monte-Carlo Simulation Balancing Revisited.”
In IEEE Computational Intelligence and Games, 2016.
ieee: T. Graf and M. Platzner, “Monte-Carlo Simulation Balancing Revisited,” in
IEEE Computational Intelligence and Games, 2016.
mla: Graf, Tobias, and Marco Platzner. “Monte-Carlo Simulation Balancing Revisited.”
IEEE Computational Intelligence and Games, 2016.
short: 'T. Graf, M. Platzner, in: IEEE Computational Intelligence and Games, 2016.'
date_created: 2019-09-09T09:06:39Z
date_updated: 2022-01-06T06:51:29Z
department:
- _id: '78'
language:
- iso: eng
project:
- _id: '52'
name: Computing Resources Provided by the Paderborn Center for Parallel Computing
publication: IEEE Computational Intelligence and Games
status: public
title: Monte-Carlo Simulation Balancing Revisited
type: conference
user_id: '398'
year: '2016'
...