--- _id: '62081' article_number: '114969' author: - first_name: Johannes full_name: Gerritzen, Johannes id: '105344' last_name: Gerritzen orcid: 0000-0002-0169-8602 - first_name: Benjamin full_name: Gröger, Benjamin last_name: Gröger - first_name: Matthias full_name: Zscheyge, Matthias last_name: Zscheyge - first_name: Andreas full_name: Hornig, Andreas last_name: Hornig - first_name: Maik full_name: Gude, Maik last_name: Gude citation: ama: Gerritzen J, Gröger B, Zscheyge M, Hornig A, Gude M. 3D viscoelastic plastic model coupled with a continuum damage formulation for fiber reinforced polymers. Materials & Design. 2025;260. doi:10.1016/j.matdes.2025.114969 apa: Gerritzen, J., Gröger, B., Zscheyge, M., Hornig, A., & Gude, M. (2025). 3D viscoelastic plastic model coupled with a continuum damage formulation for fiber reinforced polymers. Materials & Design, 260, Article 114969. https://doi.org/10.1016/j.matdes.2025.114969 bibtex: '@article{Gerritzen_Gröger_Zscheyge_Hornig_Gude_2025, title={3D viscoelastic plastic model coupled with a continuum damage formulation for fiber reinforced polymers}, volume={260}, DOI={10.1016/j.matdes.2025.114969}, number={114969}, journal={Materials & Design}, publisher={Elsevier BV}, author={Gerritzen, Johannes and Gröger, Benjamin and Zscheyge, Matthias and Hornig, Andreas and Gude, Maik}, year={2025} }' chicago: Gerritzen, Johannes, Benjamin Gröger, Matthias Zscheyge, Andreas Hornig, and Maik Gude. “3D Viscoelastic Plastic Model Coupled with a Continuum Damage Formulation for Fiber Reinforced Polymers.” Materials & Design 260 (2025). https://doi.org/10.1016/j.matdes.2025.114969. ieee: 'J. Gerritzen, B. Gröger, M. Zscheyge, A. Hornig, and M. Gude, “3D viscoelastic plastic model coupled with a continuum damage formulation for fiber reinforced polymers,” Materials & Design, vol. 260, Art. no. 114969, 2025, doi: 10.1016/j.matdes.2025.114969.' mla: Gerritzen, Johannes, et al. “3D Viscoelastic Plastic Model Coupled with a Continuum Damage Formulation for Fiber Reinforced Polymers.” Materials & Design, vol. 260, 114969, Elsevier BV, 2025, doi:10.1016/j.matdes.2025.114969. short: J. Gerritzen, B. Gröger, M. Zscheyge, A. Hornig, M. Gude, Materials & Design 260 (2025). date_created: 2025-11-04T12:49:13Z date_updated: 2026-02-27T06:43:55Z doi: 10.1016/j.matdes.2025.114969 intvolume: ' 260' language: - iso: eng project: - _id: '130' name: 'TRR 285: Methodenentwicklung zur mechanischen Fügbarkeit in wandlungsfähigen Prozessketten' - _id: '137' name: TRR 285 - Subproject A03 - _id: '131' name: TRR 285 - Project Area A publication: Materials & Design publication_identifier: issn: - 0264-1275 publication_status: published publisher: Elsevier BV status: public title: 3D viscoelastic plastic model coupled with a continuum damage formulation for fiber reinforced polymers type: journal_article user_id: '105344' volume: 260 year: '2025' ... --- _id: '64800' abstract: - lang: eng text: "Intensive ultrasonic cleaning of surfaces by means of a lead-free ultrasonic transducer with focusing sonotrode\r\nUltrasonic cleaning baths are probably a coincidental development: After underwater sonars had already been successfully used to detect submarines before 1920, it was probably observed in this environment that the ultrasonic oscillators not only showed a self-cleaning effect but also cavitation damage. At the beginning of the 1950s, the first ultrasonic cleaning devices finally came onto the market. Today, the range of applications ranges from household appliances for jewellery and eyewear cleaning to classic cleaning baths for metal parts and systems for cleaning highly sensitive electronic components. There is a certain gap in handheld, mobile cleaning equipment. Although devices for spot cleaning of textiles are known, the cleaning effect is usually low. \r\nDue to the directive 2011/65/EU on the restriction of the use of hazardous substances in electrical and electronic equipment (RoHS) [1] lead should no longer be used in technical devices. As today’s standard ceramics for medium and high-power ultrasonic transducers typically contain lead, there is a need to explore the use of lead-free ceramics in this field. Honda [2] already offers a cleaning transducer based on lead-free piezoelectric ceramics, but it is designed to be used in cleaning baths.\r\nThis article presents the model-based development of a highly innovative ultrasonic cleaner. On the one hand, lead-free piezoelectric ceramics are used, and on the other hand, a special sonotrode has been developed that concentrates the sound in such a way that a strong cavitation and thus cleaning effect is achieved with comparatively low power in a short time. Coupled field finite element method was used to find an appropriate geometry for the focussing sonotrode. The comparison of simulation and measurement results shows that the lead-free piezoceramics used do their job well and can keep up with standard ceramics, but more ceramic volume is needed to achieve same power. An advanced control concept was elaborated to ensure continuous hard cavitation at varying distances between the sonotrode and the part to be cleaned. Cleaning results for different surfaces and contaminations are presented. The concept of the focusing sonotrode shows that a convincing cleaning result can be achieved even with low power and in short time, provided that the oscillation system and control electronics are suitably coordinated.\r\n\r\nReferences\r\n[1] http://data.europa.eu/eli/dir/2011/65/2024-08-01 \r\n[2] https://en.honda-el.co.jp/product/ceramics/lineup/lead_off/lead-off \r\n" author: - first_name: Tobias full_name: Hemsel, Tobias id: '210' last_name: Hemsel - first_name: Claus full_name: Scheidemann, Claus id: '38259' last_name: Scheidemann - first_name: Peter full_name: Bornmann, Peter last_name: Bornmann - first_name: Walter full_name: Littmann, Walter last_name: Littmann - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro citation: ama: 'Hemsel T, Scheidemann C, Bornmann P, Littmann W, Sextro W. Intensive ultrasonic cleaning of surfaces by means of lead-free ultrasonic transducer with focussing sonotrode. In: ; 2025.' apa: Hemsel, T., Scheidemann, C., Bornmann, P., Littmann, W., & Sextro, W. (2025). Intensive ultrasonic cleaning of surfaces by means of lead-free ultrasonic transducer with focussing sonotrode. International Congress on Ultrasonics (ICU), Paderborn, Germany. bibtex: '@inproceedings{Hemsel_Scheidemann_Bornmann_Littmann_Sextro_2025, title={Intensive ultrasonic cleaning of surfaces by means of lead-free ultrasonic transducer with focussing sonotrode}, author={Hemsel, Tobias and Scheidemann, Claus and Bornmann, Peter and Littmann, Walter and Sextro, Walter}, year={2025} }' chicago: Hemsel, Tobias, Claus Scheidemann, Peter Bornmann, Walter Littmann, and Walter Sextro. “Intensive Ultrasonic Cleaning of Surfaces by Means of Lead-Free Ultrasonic Transducer with Focussing Sonotrode,” 2025. ieee: T. Hemsel, C. Scheidemann, P. Bornmann, W. Littmann, and W. Sextro, “Intensive ultrasonic cleaning of surfaces by means of lead-free ultrasonic transducer with focussing sonotrode,” presented at the International Congress on Ultrasonics (ICU), Paderborn, Germany, 2025. mla: Hemsel, Tobias, et al. Intensive Ultrasonic Cleaning of Surfaces by Means of Lead-Free Ultrasonic Transducer with Focussing Sonotrode. 2025. short: 'T. Hemsel, C. Scheidemann, P. Bornmann, W. Littmann, W. Sextro, in: 2025.' conference: end_date: 2025-09-25 location: Paderborn, Germany name: International Congress on Ultrasonics (ICU) start_date: 2025-09-21 date_created: 2026-03-02T10:47:48Z date_updated: 2026-03-02T10:58:37Z ddc: - '620' department: - _id: '151' file: - access_level: open_access content_type: application/pdf creator: hemsel date_created: 2026-03-02T10:46:43Z date_updated: 2026-03-02T10:58:37Z file_id: '64801' file_name: ICU_2025_Hemsel.pdf file_size: 1946202 relation: main_file file_date_updated: 2026-03-02T10:58:37Z has_accepted_license: '1' language: - iso: eng oa: '1' status: public title: Intensive ultrasonic cleaning of surfaces by means of lead-free ultrasonic transducer with focussing sonotrode type: conference user_id: '210' year: '2025' ... --- _id: '57829' abstract: - lang: eng text: 'Artificial intelligence (AI) is driving transformative changes across numerous fields, revolutionizing conventional processes and creating new opportunities for innovation. The development of mechatronic systems is undergoing a similar transformation. Over the past decade, modeling, simulation, and optimization techniques have become integral to the design process, paving the way for the adoption of AI-based methods. In this paper, we examine the potential for integrating AI into the engineering design process, using the V-model from the VDI guideline 2206, considered the state-of-the-art in product design, as a foundation. We identify and classify AI methods based on their suitability for specific stages within the engineering product design workflow. Furthermore, we present a series of application examples where AI-assisted design has been successfully implemented by the authors. These examples, drawn from research projects within the DFG Priority Program \emph{SPP~2353: Daring More Intelligence - Design Assistants in Mechanics and Dynamics}, showcase a diverse range of applications across mechanics and mechatronics, including areas such as acoustics and robotics.' author: - first_name: Kristin M. full_name: de Payrebrune, Kristin M. last_name: de Payrebrune - first_name: Kathrin full_name: Flaßkamp, Kathrin last_name: Flaßkamp - first_name: Tom full_name: Ströhla, Tom last_name: Ströhla - first_name: Thomas full_name: Sattel, Thomas last_name: Sattel - first_name: Dieter full_name: Bestle, Dieter last_name: Bestle - first_name: Benedict full_name: Röder, Benedict last_name: Röder - first_name: Peter full_name: Eberhard, Peter last_name: Eberhard - first_name: Sebastian full_name: Peitz, Sebastian last_name: Peitz - first_name: Marcus full_name: Stoffel, Marcus last_name: Stoffel - first_name: Gulakala full_name: Rutwik, Gulakala last_name: Rutwik - first_name: Borse full_name: Aditya, Borse last_name: Aditya - first_name: Meike Claudia full_name: Wohlleben, Meike Claudia id: '43991' last_name: Wohlleben orcid: 0009-0009-9767-7168 - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro - first_name: Maximilian full_name: Raff, Maximilian last_name: Raff - first_name: C. David full_name: Remy, C. David last_name: Remy - first_name: Manish full_name: Yadav, Manish last_name: Yadav - first_name: Merten full_name: Stender, Merten last_name: Stender - first_name: Jan full_name: van Delden, Jan last_name: van Delden - first_name: Timo full_name: Lüddecke, Timo last_name: Lüddecke - first_name: Sabine C. full_name: Langer, Sabine C. last_name: Langer - first_name: Julius full_name: Schultz, Julius last_name: Schultz - first_name: Christopher full_name: Blech, Christopher last_name: Blech citation: ama: de Payrebrune KM, Flaßkamp K, Ströhla T, et al. The impact of AI on engineering design procedures for dynamical systems. Technische Mechanik - European Journal of Engineering Mechanics. 2025;45(1):1-23. doi:10.24352/UB.OVGU-2025-037 apa: de Payrebrune, K. M., Flaßkamp, K., Ströhla, T., Sattel, T., Bestle, D., Röder, B., Eberhard, P., Peitz, S., Stoffel, M., Rutwik, G., Aditya, B., Wohlleben, M. C., Sextro, W., Raff, M., Remy, C. D., Yadav, M., Stender, M., van Delden, J., Lüddecke, T., … Blech, C. (2025). The impact of AI on engineering design procedures for dynamical systems. Technische Mechanik - European Journal of Engineering Mechanics, 45(1), 1–23. https://doi.org/10.24352/UB.OVGU-2025-037 bibtex: '@article{de Payrebrune_Flaßkamp_Ströhla_Sattel_Bestle_Röder_Eberhard_Peitz_Stoffel_Rutwik_et al._2025, title={The impact of AI on engineering design procedures for dynamical systems}, volume={45}, DOI={10.24352/UB.OVGU-2025-037}, number={1}, journal={Technische Mechanik - European Journal of Engineering Mechanics}, author={de Payrebrune, Kristin M. and Flaßkamp, Kathrin and Ströhla, Tom and Sattel, Thomas and Bestle, Dieter and Röder, Benedict and Eberhard, Peter and Peitz, Sebastian and Stoffel, Marcus and Rutwik, Gulakala and et al.}, year={2025}, pages={1–23} }' chicago: 'Payrebrune, Kristin M. de, Kathrin Flaßkamp, Tom Ströhla, Thomas Sattel, Dieter Bestle, Benedict Röder, Peter Eberhard, et al. “The Impact of AI on Engineering Design Procedures for Dynamical Systems.” Technische Mechanik - European Journal of Engineering Mechanics 45, no. 1 (2025): 1–23. https://doi.org/10.24352/UB.OVGU-2025-037.' ieee: 'K. M. de Payrebrune et al., “The impact of AI on engineering design procedures for dynamical systems,” Technische Mechanik - European Journal of Engineering Mechanics, vol. 45, no. 1, pp. 1–23, 2025, doi: 10.24352/UB.OVGU-2025-037.' mla: de Payrebrune, Kristin M., et al. “The Impact of AI on Engineering Design Procedures for Dynamical Systems.” Technische Mechanik - European Journal of Engineering Mechanics, vol. 45, no. 1, 2025, pp. 1–23, doi:10.24352/UB.OVGU-2025-037. short: K.M. de Payrebrune, K. Flaßkamp, T. Ströhla, T. Sattel, D. Bestle, B. Röder, P. Eberhard, S. Peitz, M. Stoffel, G. Rutwik, B. Aditya, M.C. Wohlleben, W. Sextro, M. Raff, C.D. Remy, M. Yadav, M. Stender, J. van Delden, T. Lüddecke, S.C. Langer, J. Schultz, C. Blech, Technische Mechanik - European Journal of Engineering Mechanics 45 (2025) 1–23. date_created: 2024-12-18T09:07:41Z date_updated: 2026-03-03T06:31:55Z doi: 10.24352/UB.OVGU-2025-037 intvolume: ' 45' issue: '1' language: - iso: eng page: 1-23 publication: Technische Mechanik - European Journal of Engineering Mechanics quality_controlled: '1' status: public title: The impact of AI on engineering design procedures for dynamical systems type: journal_article user_id: '43991' volume: 45 year: '2025' ... --- _id: '61963' author: - first_name: Daniel full_name: Eckertz, Daniel last_name: Eckertz - first_name: Mattes full_name: Sander, Mattes last_name: Sander - first_name: Omar full_name: Masroor, Omar last_name: Masroor - first_name: Roman full_name: Dumitrescu, Roman id: '16190' last_name: Dumitrescu citation: ama: 'Eckertz D, Sander M, Masroor O, Dumitrescu R. Linking Abstract Digital Twin Data to 3D Models: A Configurable Approach for Real-Time Adaptation. In: 2025 8th International Conference on Information and Computer Technologies (ICICT). IEEE; 2025. doi:10.1109/icict64582.2025.00010' apa: 'Eckertz, D., Sander, M., Masroor, O., & Dumitrescu, R. (2025). Linking Abstract Digital Twin Data to 3D Models: A Configurable Approach for Real-Time Adaptation. 2025 8th International Conference on Information and Computer Technologies (ICICT). https://doi.org/10.1109/icict64582.2025.00010' bibtex: '@inproceedings{Eckertz_Sander_Masroor_Dumitrescu_2025, title={Linking Abstract Digital Twin Data to 3D Models: A Configurable Approach for Real-Time Adaptation}, DOI={10.1109/icict64582.2025.00010}, booktitle={2025 8th International Conference on Information and Computer Technologies (ICICT)}, publisher={IEEE}, author={Eckertz, Daniel and Sander, Mattes and Masroor, Omar and Dumitrescu, Roman}, year={2025} }' chicago: 'Eckertz, Daniel, Mattes Sander, Omar Masroor, and Roman Dumitrescu. “Linking Abstract Digital Twin Data to 3D Models: A Configurable Approach for Real-Time Adaptation.” In 2025 8th International Conference on Information and Computer Technologies (ICICT). IEEE, 2025. https://doi.org/10.1109/icict64582.2025.00010.' ieee: 'D. Eckertz, M. Sander, O. Masroor, and R. Dumitrescu, “Linking Abstract Digital Twin Data to 3D Models: A Configurable Approach for Real-Time Adaptation,” 2025, doi: 10.1109/icict64582.2025.00010.' mla: 'Eckertz, Daniel, et al. “Linking Abstract Digital Twin Data to 3D Models: A Configurable Approach for Real-Time Adaptation.” 2025 8th International Conference on Information and Computer Technologies (ICICT), IEEE, 2025, doi:10.1109/icict64582.2025.00010.' short: 'D. Eckertz, M. Sander, O. Masroor, R. Dumitrescu, in: 2025 8th International Conference on Information and Computer Technologies (ICICT), IEEE, 2025.' date_created: 2025-10-24T06:48:13Z date_updated: 2025-10-24T08:12:23Z department: - _id: '563' doi: 10.1109/icict64582.2025.00010 language: - iso: eng publication: 2025 8th International Conference on Information and Computer Technologies (ICICT) publication_status: published publisher: IEEE status: public title: 'Linking Abstract Digital Twin Data to 3D Models: A Configurable Approach for Real-Time Adaptation' type: conference user_id: '15782' year: '2025' ... --- _id: '61998' author: - first_name: Jan-Philipp full_name: Disselkamp, Jan-Philipp last_name: Disselkamp - first_name: 'Jonas ' full_name: 'Lick, Jonas ' last_name: Lick - first_name: 'Ghayth ' full_name: 'Azem, Ghayth ' last_name: Azem - first_name: 'Robin ' full_name: 'Grothe, Robin ' last_name: Grothe - first_name: 'Lukas ' full_name: 'Ptock, Lukas ' last_name: Ptock - first_name: 'Matthias ' full_name: 'Meyer, Matthias ' last_name: Meyer - first_name: 'Dominik ' full_name: 'Kürpick, Dominik ' last_name: Kürpick - first_name: 'Aschot ' full_name: 'Hovemann, Aschot ' last_name: Hovemann - first_name: Roman full_name: Dumitrescu, Roman id: '16190' last_name: Dumitrescu citation: ama: 'Disselkamp J-P, Lick J, Azem G, et al. Generating An Automated Assembly Graph On The Basis Of The 3D-Geometry Of A Product Assembly Group. In: Herberger D, Hübner M, eds. Proceedings of the Conference on Production Systems and Logistics: CPSL 2025. publish-Ing.; 2025:640-649.' apa: 'Disselkamp, J.-P., Lick, J., Azem, G., Grothe, R., Ptock, L., Meyer, M., Kürpick, D., Hovemann, A., & Dumitrescu, R. (2025). Generating An Automated Assembly Graph On The Basis Of The 3D-Geometry Of A Product Assembly Group. In D. Herberger & M. Hübner (Eds.), Proceedings of the Conference on Production Systems and Logistics: CPSL 2025 (pp. 640–649). publish-Ing.' bibtex: '@inproceedings{Disselkamp_Lick_Azem_Grothe_Ptock_Meyer_Kürpick_Hovemann_Dumitrescu_2025, place={Offenburg}, title={Generating An Automated Assembly Graph On The Basis Of The 3D-Geometry Of A Product Assembly Group}, booktitle={Proceedings of the Conference on Production Systems and Logistics: CPSL 2025}, publisher={publish-Ing.}, author={Disselkamp, Jan-Philipp and Lick, Jonas and Azem, Ghayth and Grothe, Robin and Ptock, Lukas and Meyer, Matthias and Kürpick, Dominik and Hovemann, Aschot and Dumitrescu, Roman}, editor={Herberger, David and Hübner, Marco}, year={2025}, pages={640–649} }' chicago: 'Disselkamp, Jan-Philipp, Jonas Lick, Ghayth Azem, Robin Grothe, Lukas Ptock, Matthias Meyer, Dominik Kürpick, Aschot Hovemann, and Roman Dumitrescu. “Generating An Automated Assembly Graph On The Basis Of The 3D-Geometry Of A Product Assembly Group.” In Proceedings of the Conference on Production Systems and Logistics: CPSL 2025, edited by David Herberger and Marco Hübner, 640–49. Offenburg: publish-Ing., 2025.' ieee: 'J.-P. Disselkamp et al., “Generating An Automated Assembly Graph On The Basis Of The 3D-Geometry Of A Product Assembly Group,” in Proceedings of the Conference on Production Systems and Logistics: CPSL 2025, 2025, pp. 640–649.' mla: 'Disselkamp, Jan-Philipp, et al. “Generating An Automated Assembly Graph On The Basis Of The 3D-Geometry Of A Product Assembly Group.” Proceedings of the Conference on Production Systems and Logistics: CPSL 2025, edited by David Herberger and Marco Hübner, publish-Ing., 2025, pp. 640–49.' short: 'J.-P. Disselkamp, J. Lick, G. Azem, R. Grothe, L. Ptock, M. Meyer, D. Kürpick, A. Hovemann, R. Dumitrescu, in: D. Herberger, M. Hübner (Eds.), Proceedings of the Conference on Production Systems and Logistics: CPSL 2025, publish-Ing., Offenburg, 2025, pp. 640–649.' date_created: 2025-10-24T09:16:47Z date_updated: 2025-10-24T09:16:50Z department: - _id: '563' editor: - first_name: David full_name: Herberger, David last_name: Herberger - first_name: Marco full_name: Hübner, Marco last_name: Hübner language: - iso: eng page: 640-649 place: Offenburg publication: 'Proceedings of the Conference on Production Systems and Logistics: CPSL 2025' publisher: publish-Ing. status: public title: Generating An Automated Assembly Graph On The Basis Of The 3D-Geometry Of A Product Assembly Group type: conference user_id: '15782' year: '2025' ... --- _id: '62051' article_number: '115552' author: - first_name: Kristian full_name: Hinnenthal, Kristian id: '32229' last_name: Hinnenthal - first_name: David Jan full_name: Liedtke, David Jan id: '55557' last_name: Liedtke - first_name: Christian full_name: Scheideler, Christian id: '20792' last_name: Scheideler citation: ama: 'Hinnenthal K, Liedtke DJ, Scheideler C. Efficient shape formation by 3D hybrid programmable matter: An algorithm for low diameter intermediate structures. Theoretical Computer Science. 2025;1057. doi:10.1016/j.tcs.2025.115552' apa: 'Hinnenthal, K., Liedtke, D. J., & Scheideler, C. (2025). Efficient shape formation by 3D hybrid programmable matter: An algorithm for low diameter intermediate structures. Theoretical Computer Science, 1057, Article 115552. https://doi.org/10.1016/j.tcs.2025.115552' bibtex: '@article{Hinnenthal_Liedtke_Scheideler_2025, title={Efficient shape formation by 3D hybrid programmable matter: An algorithm for low diameter intermediate structures}, volume={1057}, DOI={10.1016/j.tcs.2025.115552}, number={115552}, journal={Theoretical Computer Science}, publisher={Elsevier BV}, author={Hinnenthal, Kristian and Liedtke, David Jan and Scheideler, Christian}, year={2025} }' chicago: 'Hinnenthal, Kristian, David Jan Liedtke, and Christian Scheideler. “Efficient Shape Formation by 3D Hybrid Programmable Matter: An Algorithm for Low Diameter Intermediate Structures.” Theoretical Computer Science 1057 (2025). https://doi.org/10.1016/j.tcs.2025.115552.' ieee: 'K. Hinnenthal, D. J. Liedtke, and C. Scheideler, “Efficient shape formation by 3D hybrid programmable matter: An algorithm for low diameter intermediate structures,” Theoretical Computer Science, vol. 1057, Art. no. 115552, 2025, doi: 10.1016/j.tcs.2025.115552.' mla: 'Hinnenthal, Kristian, et al. “Efficient Shape Formation by 3D Hybrid Programmable Matter: An Algorithm for Low Diameter Intermediate Structures.” Theoretical Computer Science, vol. 1057, 115552, Elsevier BV, 2025, doi:10.1016/j.tcs.2025.115552.' short: K. Hinnenthal, D.J. Liedtke, C. Scheideler, Theoretical Computer Science 1057 (2025). date_created: 2025-11-03T10:19:53Z date_updated: 2025-11-03T10:21:52Z department: - _id: '79' doi: 10.1016/j.tcs.2025.115552 intvolume: ' 1057' language: - iso: eng publication: Theoretical Computer Science publication_identifier: issn: - 0304-3975 publication_status: published publisher: Elsevier BV status: public title: 'Efficient shape formation by 3D hybrid programmable matter: An algorithm for low diameter intermediate structures' type: journal_article user_id: '55557' volume: 1057 year: '2025' ... --- _id: '59218' author: - first_name: Jan Dennis full_name: Reimer, Jan Dennis id: '36703' last_name: Reimer - first_name: Stefan full_name: Holst, Stefan last_name: Holst - first_name: Somayeh full_name: Sadeghi-Kohan, Somayeh last_name: Sadeghi-Kohan - first_name: Hans-Joachim full_name: Wunderlich, Hans-Joachim last_name: Wunderlich - first_name: Sybille full_name: Hellebrand, Sybille last_name: Hellebrand citation: ama: 'Reimer JD, Holst S, Sadeghi-Kohan S, Wunderlich H-J, Hellebrand S. ThorSim: Throughput-Oriented Timing Simulation of FinFET Digital Circuits. In: IEEE International Symposium of Electronics Design Automation (ISEDA’25), May 2025. ; 2025.' apa: 'Reimer, J. D., Holst, S., Sadeghi-Kohan, S., Wunderlich, H.-J., & Hellebrand, S. (2025). ThorSim: Throughput-Oriented Timing Simulation of FinFET Digital Circuits. IEEE International Symposium of Electronics Design Automation (ISEDA’25), May 2025.' bibtex: '@inproceedings{Reimer_Holst_Sadeghi-Kohan_Wunderlich_Hellebrand_2025, place={Hong Kong, China}, title={ThorSim: Throughput-Oriented Timing Simulation of FinFET Digital Circuits}, booktitle={IEEE International Symposium of Electronics Design Automation (ISEDA’25), May 2025}, author={Reimer, Jan Dennis and Holst, Stefan and Sadeghi-Kohan, Somayeh and Wunderlich, Hans-Joachim and Hellebrand, Sybille}, year={2025} }' chicago: 'Reimer, Jan Dennis, Stefan Holst, Somayeh Sadeghi-Kohan, Hans-Joachim Wunderlich, and Sybille Hellebrand. “ThorSim: Throughput-Oriented Timing Simulation of FinFET Digital Circuits.” In IEEE International Symposium of Electronics Design Automation (ISEDA’25), May 2025. Hong Kong, China, 2025.' ieee: 'J. D. Reimer, S. Holst, S. Sadeghi-Kohan, H.-J. Wunderlich, and S. Hellebrand, “ThorSim: Throughput-Oriented Timing Simulation of FinFET Digital Circuits,” 2025.' mla: 'Reimer, Jan Dennis, et al. “ThorSim: Throughput-Oriented Timing Simulation of FinFET Digital Circuits.” IEEE International Symposium of Electronics Design Automation (ISEDA’25), May 2025, 2025.' short: 'J.D. Reimer, S. Holst, S. Sadeghi-Kohan, H.-J. Wunderlich, S. Hellebrand, in: IEEE International Symposium of Electronics Design Automation (ISEDA’25), May 2025, Hong Kong, China, 2025.' date_created: 2025-03-31T15:57:21Z date_updated: 2025-11-03T13:30:51Z department: - _id: '48' language: - iso: eng place: Hong Kong, China publication: IEEE International Symposium of Electronics Design Automation (ISEDA'25), May 2025 status: public title: 'ThorSim: Throughput-Oriented Timing Simulation of FinFET Digital Circuits' type: conference user_id: '36703' year: '2025' ... --- _id: '62148' author: - first_name: Babak full_name: Sadiye, Babak id: '93634' last_name: Sadiye - first_name: Mohammed full_name: Iftekhar, Mohammed id: '47944' last_name: Iftekhar - first_name: Wolfgang full_name: Müller, Wolfgang id: '16243' last_name: Müller - first_name: J. Christoph full_name: Scheytt, J. Christoph id: '37144' last_name: Scheytt orcid: '0000-0002-5950-6618 ' citation: ama: 'Sadiye B, Iftekhar M, Müller W, Scheytt JC. 60-Gb/s 1:4 Demultiplexer in 22-nm FD-SOI Technology Using TSPC Logic: A Circuit-to-System-Level Analysis and Design. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. Published online 2025. doi:10.1109/TVLSI.2025.3625787' apa: 'Sadiye, B., Iftekhar, M., Müller, W., & Scheytt, J. C. (2025). 60-Gb/s 1:4 Demultiplexer in 22-nm FD-SOI Technology Using TSPC Logic: A Circuit-to-System-Level Analysis and Design. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. https://doi.org/10.1109/TVLSI.2025.3625787' bibtex: '@article{Sadiye_Iftekhar_Müller_Scheytt_2025, title={60-Gb/s 1:4 Demultiplexer in 22-nm FD-SOI Technology Using TSPC Logic: A Circuit-to-System-Level Analysis and Design}, DOI={10.1109/TVLSI.2025.3625787}, journal={IEEE Transactions on Very Large Scale Integration (VLSI) Systems}, publisher={IEEE}, author={Sadiye, Babak and Iftekhar, Mohammed and Müller, Wolfgang and Scheytt, J. Christoph}, year={2025} }' chicago: 'Sadiye, Babak, Mohammed Iftekhar, Wolfgang Müller, and J. Christoph Scheytt. “60-Gb/s 1:4 Demultiplexer in 22-Nm FD-SOI Technology Using TSPC Logic: A Circuit-to-System-Level Analysis and Design.” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2025. https://doi.org/10.1109/TVLSI.2025.3625787.' ieee: 'B. Sadiye, M. Iftekhar, W. Müller, and J. C. Scheytt, “60-Gb/s 1:4 Demultiplexer in 22-nm FD-SOI Technology Using TSPC Logic: A Circuit-to-System-Level Analysis and Design,” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2025, doi: 10.1109/TVLSI.2025.3625787.' mla: 'Sadiye, Babak, et al. “60-Gb/s 1:4 Demultiplexer in 22-Nm FD-SOI Technology Using TSPC Logic: A Circuit-to-System-Level Analysis and Design.” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE, 2025, doi:10.1109/TVLSI.2025.3625787.' short: B. Sadiye, M. Iftekhar, W. Müller, J.C. Scheytt, IEEE Transactions on Very Large Scale Integration (VLSI) Systems (2025). date_created: 2025-11-10T08:31:47Z date_updated: 2025-11-10T08:38:07Z department: - _id: '58' doi: 10.1109/TVLSI.2025.3625787 language: - iso: eng project: - _id: '325' name: 'Scale4Edge: Skalierbare Infrastruktur für Edge-Computing' publication: IEEE Transactions on Very Large Scale Integration (VLSI) Systems publication_identifier: issn: - 1063-8210 publication_status: published publisher: IEEE status: public title: '60-Gb/s 1:4 Demultiplexer in 22-nm FD-SOI Technology Using TSPC Logic: A Circuit-to-System-Level Analysis and Design' type: journal_article user_id: '93634' year: '2025' ... --- _id: '62167' abstract: - lang: eng text: Diese Dissertation befasst sich mit der Entwicklung eines induktiv-basierten Lokalisierungsverfahrens mittels planarer Spulen, das auf magnetischer Kopplung beruht. Grundlage ist die elektromagnetische Induktion, bei der sich die entstehende Spannung proportional zur Gegeninduktivität verhält. Das Verfahren arbeitet im physikalischen Nahfeld und im Frequenzbereich von einigen kHz bis MHz, um eine effiziente Kopplung ohne Ausbreitung elektromagnetischer Wellen zu gewährleisten. Im Vergleich zu etablierten Verfahren wie GPS oder Ultraschall zeigt die induktive Ortung Vorteile bei kurzer Reichweite, insbesondere durch hohe Genauigkeit im Zentimeterbereich und geringe Materialabhängigkeit. Zudem lässt sie sich in bestehende Technologien wie bei der drahtlosen Energieübertragung integrieren und durch Sensorfusion mit anderen Verfahren kombinieren. Zur Modellierung und Optimierung werden physikalische Eigenschaften von planaren Spulen und EM-Feldern analysiert und elektrische Ersatzschaltbilder eingesetzt. Die geometriebasierte Berechnung der Gegeninduktivität ermöglicht die Entwicklung und Bewertung geeigneter Ortungsalgorithmen. Stochastische Filterverfahren verbessern zusätzlich die Robustheit gegenüber Umgebungseinflüssen. Abschließend wird eine modulare Simulationsplattform vorgestellt, die als Grundlage für die Generierung von Trainingsdaten sowie zur Weiterentwicklung von Mess-, Ortungs- und Filtermethoden dient. - lang: eng text: This dissertation addresses the development of an inductively based localization method using planar coils, which relies on magnetic coupling. The underlying principle is electromagnetic induction, where the resulting voltage is proportional to the mutual inductance. The method operates in the physical near field and within a frequency range from a few kHz to MHz, ensuring efficient coupling without the propagation of electromagnetic waves. Compared to established methods such as GPS or ultrasound, inductive localization offers advantages at short range—particularly high accuracy in the centimeter range and low dependency on surrounding materials. Additionally, it can be integrated into existing technologies, such as wireless power transfer systems, and combined with other methods through sensor fusion. To support modeling and optimization, the physical properties of planar coils and electromagnetic fields are analyzed, and equivalent electrical circuit models are used. Geometry-based calculations of mutual inductance enable the development and evaluation of suitable localization algorithms. Stochastic filtering methods further enhance robustness against environmental influences. Finally, a modular simulation platform is presented, which serves as a foundation for generating training data as well as for the further development of measurement, localization, and filtering methods. author: - first_name: Sven full_name: Lange, Sven id: '38240' last_name: Lange orcid: '0009-0007-9150-2266 ' citation: ama: Lange S. Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme. Universitätsbibliothek Paderborn; 2025. doi:10.17619/UNIPB/1-2436 apa: Lange, S. (2025). Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme. Universitätsbibliothek Paderborn. https://doi.org/10.17619/UNIPB/1-2436 bibtex: '@book{Lange_2025, place={Paderborn}, title={Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme}, DOI={10.17619/UNIPB/1-2436}, publisher={Universitätsbibliothek Paderborn}, author={Lange, Sven}, year={2025} }' chicago: 'Lange, Sven. Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme. Paderborn: Universitätsbibliothek Paderborn, 2025. https://doi.org/10.17619/UNIPB/1-2436.' ieee: 'S. Lange, Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme. Paderborn: Universitätsbibliothek Paderborn, 2025.' mla: Lange, Sven. Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme. Universitätsbibliothek Paderborn, 2025, doi:10.17619/UNIPB/1-2436. short: S. Lange, Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme, Universitätsbibliothek Paderborn, Paderborn, 2025. date_created: 2025-11-12T10:06:39Z date_updated: 2025-11-12T10:15:29Z department: - _id: '59' - _id: '61' - _id: '485' doi: 10.17619/UNIPB/1-2436 language: - iso: ger main_file_link: - open_access: '1' url: https://digital.ub.uni-paderborn.de/hs/content/titleinfo/8122147 oa: '1' page: '247' place: Paderborn publication_status: published publisher: Universitätsbibliothek Paderborn status: public supervisor: - first_name: Jens full_name: Förstner, Jens id: '158' last_name: Förstner orcid: 0000-0001-7059-9862 - first_name: Marcus full_name: Stiemer, Marcus last_name: Stiemer title: Analyse und Modellierung eines induktiven Ortungsprozesses unter Berücksichtigung der elektromagnetischen Wechselwirkungen planarer Spulensysteme type: dissertation user_id: '38240' year: '2025' ... --- _id: '61524' author: - first_name: Jonathan-Markus full_name: Einwag, Jonathan-Markus last_name: Einwag - first_name: Christian full_name: Steinfelder, Christian last_name: Steinfelder - first_name: Sandro full_name: Wartzack, Sandro last_name: Wartzack - first_name: Alexander full_name: Brosius, Alexander last_name: Brosius - first_name: Stefan full_name: Goetz, Stefan last_name: Goetz citation: ama: 'Einwag J-M, Steinfelder C, Wartzack S, Brosius A, Goetz S. From simulation to metamodel to experiment: Evaluating the prediction accuracy of polynomial regression models for clinch joint properties. Journal of Manufacturing Processes. 2025;154:179-191. doi:10.1016/j.jmapro.2025.09.059' apa: 'Einwag, J.-M., Steinfelder, C., Wartzack, S., Brosius, A., & Goetz, S. (2025). From simulation to metamodel to experiment: Evaluating the prediction accuracy of polynomial regression models for clinch joint properties. Journal of Manufacturing Processes, 154, 179–191. https://doi.org/10.1016/j.jmapro.2025.09.059' bibtex: '@article{Einwag_Steinfelder_Wartzack_Brosius_Goetz_2025, title={From simulation to metamodel to experiment: Evaluating the prediction accuracy of polynomial regression models for clinch joint properties}, volume={154}, DOI={10.1016/j.jmapro.2025.09.059}, journal={Journal of Manufacturing Processes}, publisher={Elsevier BV}, author={Einwag, Jonathan-Markus and Steinfelder, Christian and Wartzack, Sandro and Brosius, Alexander and Goetz, Stefan}, year={2025}, pages={179–191} }' chicago: 'Einwag, Jonathan-Markus, Christian Steinfelder, Sandro Wartzack, Alexander Brosius, and Stefan Goetz. “From Simulation to Metamodel to Experiment: Evaluating the Prediction Accuracy of Polynomial Regression Models for Clinch Joint Properties.” Journal of Manufacturing Processes 154 (2025): 179–91. https://doi.org/10.1016/j.jmapro.2025.09.059.' ieee: 'J.-M. Einwag, C. Steinfelder, S. Wartzack, A. Brosius, and S. Goetz, “From simulation to metamodel to experiment: Evaluating the prediction accuracy of polynomial regression models for clinch joint properties,” Journal of Manufacturing Processes, vol. 154, pp. 179–191, 2025, doi: 10.1016/j.jmapro.2025.09.059.' mla: 'Einwag, Jonathan-Markus, et al. “From Simulation to Metamodel to Experiment: Evaluating the Prediction Accuracy of Polynomial Regression Models for Clinch Joint Properties.” Journal of Manufacturing Processes, vol. 154, Elsevier BV, 2025, pp. 179–91, doi:10.1016/j.jmapro.2025.09.059.' short: J.-M. Einwag, C. Steinfelder, S. Wartzack, A. Brosius, S. Goetz, Journal of Manufacturing Processes 154 (2025) 179–191. date_created: 2025-10-06T07:37:24Z date_updated: 2025-11-12T08:35:35Z department: - _id: '43' - _id: '157' doi: 10.1016/j.jmapro.2025.09.059 intvolume: ' 154' language: - iso: eng page: 179-191 project: - _id: '130' name: 'TRR 285: Methodenentwicklung zur mechanischen Fügbarkeit in wandlungsfähigen Prozessketten' - _id: '132' name: TRR 285 - Project Area B - _id: '140' name: TRR 285 - Subproject B01 - _id: '144' name: TRR 285 - Subproject B05 publication: Journal of Manufacturing Processes publication_identifier: issn: - 1526-6125 publication_status: published publisher: Elsevier BV status: public title: 'From simulation to metamodel to experiment: Evaluating the prediction accuracy of polynomial regression models for clinch joint properties' type: journal_article user_id: '107109' volume: 154 year: '2025' ... --- _id: '62182' abstract: - lang: eng text: '

Executive summary Die vorliegende Zukunftsstudie „Automation 2035“ gibt einen Ausblick auf die Entwicklung der Automatisierungstechnik in den nächsten 10 Jahren. Neben der Beschreibung von Trends wie Kreislaufwirtschaft, Automatisierung der Märkte, Biologisierung, autonome Systeme und Robotik sowie IT-Sicherheit wird die zu erwartende Veränderung in der Bildung beschrieben. Dazu verwenden wir Methoden der Zukunftsforschung und arbeiten mit der Szenarientechnik, um Zukunftsperspektiven der Automation aufzuzeigen. Personas werden eingesetzt, um die zukünftigen Entwicklungen plastisch aus den Augen der Personen im Jahr 2025 und in der Zukunft im Jahr 2035 zu beschreiben. Schlüsselthemen und Trends: ... ... Inhalt Executive summary 1 1 Einführung 3 2 Zukunftsfelder für die Automatisierungstechnik 2035 4 2.1 Kreislaufwirtschaft 4 2.2 Automatisierung der Märkte 7 2.3 Biologisierung 8 2.4 Autonome Systeme und Robotik 10 2.5 Security 12 2.6 Veränderung der Ausbildung 13 3 Szenario der Automation 2035 16 4 Personas 18 4.1 Unternehmer 18 4.2 Ingenieurin 19 4.3 Schüler 20 5 Thesen und Ausblick 22 Methodik 24 Autorenteam 25 Schrifttum 26...

' alternative_title: - VDI-Studie author: - first_name: Iris full_name: Gräßler, Iris id: '47565' last_name: Gräßler orcid: 0000-0001-5765-971X - first_name: Deniz full_name: Özcan, Deniz id: '58595' last_name: Özcan - first_name: Alena Marie full_name: Tusek, Alena Marie id: '59370' last_name: Tusek - first_name: Attila full_name: Bilgic, Attila last_name: Bilgic - first_name: Christian full_name: Lange, Christian last_name: Lange - first_name: Christian full_name: Stich, Christian last_name: Stich - first_name: Christine full_name: Maul, Christine last_name: Maul - first_name: Michael full_name: Heizmann, Michael last_name: Heizmann - first_name: Michael full_name: Weyrich, Michael last_name: Weyrich - first_name: Sascha full_name: Dessel,, Sascha last_name: Dessel, - first_name: Torben full_name: Miny, Torben last_name: Miny - first_name: Ulrich full_name: Jumar, Ulrich last_name: Jumar citation: ama: Gräßler I, Özcan D, Tusek AM, et al. Automation 2035. VDI Verlag; 2025. doi:10.51202/9783911670180 apa: Gräßler, I., Özcan, D., Tusek, A. M., Bilgic, A., Lange, C., Stich, C., Maul, C., Heizmann, M., Weyrich, M., Dessel, S., Miny, T., & Jumar, U. (2025). Automation 2035. VDI Verlag. https://doi.org/10.51202/9783911670180 bibtex: '@book{Gräßler_Özcan_Tusek_Bilgic_Lange_Stich_Maul_Heizmann_Weyrich_Dessel,_et al._2025, title={Automation 2035}, DOI={10.51202/9783911670180}, publisher={VDI Verlag}, author={Gräßler, Iris and Özcan, Deniz and Tusek, Alena Marie and Bilgic, Attila and Lange, Christian and Stich, Christian and Maul, Christine and Heizmann, Michael and Weyrich, Michael and Dessel, Sascha and et al.}, year={2025} }' chicago: Gräßler, Iris, Deniz Özcan, Alena Marie Tusek, Attila Bilgic, Christian Lange, Christian Stich, Christine Maul, et al. Automation 2035. VDI Verlag, 2025. https://doi.org/10.51202/9783911670180. ieee: I. Gräßler et al., Automation 2035. VDI Verlag, 2025. mla: Gräßler, Iris, et al. Automation 2035. VDI Verlag, 2025, doi:10.51202/9783911670180. short: I. Gräßler, D. Özcan, A.M. Tusek, A. Bilgic, C. Lange, C. Stich, C. Maul, M. Heizmann, M. Weyrich, S. Dessel, T. Miny, U. Jumar, Automation 2035, VDI Verlag, 2025. date_created: 2025-11-13T16:43:05Z date_updated: 2025-11-13T16:48:43Z department: - _id: '43' - _id: '9' - _id: '26' - _id: '152' doi: 10.51202/9783911670180 language: - iso: eng publication_identifier: isbn: - '9783911670180' publication_status: published publisher: VDI Verlag quality_controlled: '1' status: public title: Automation 2035 type: book user_id: '58595' year: '2025' ... --- _id: '62286' abstract: - lang: eng text: Optical tweezer arrays of laser-cooled and individually controlled particles have revolutionized atomic, molecular, and optical physics. They afford exquisite capabilities for applications in quantum simulation of many-body physics, quantum computation, and sensing. Underlying this development is the technical maturity of generating scalable optical beams, enabled by active components and a high numerical aperture objective. However, such a complex combination of bulk optics outside the vacuum chamber is very sensitive to any vibration and drift. Here, we demonstrate the generation of a 3 × 3 static tweezer array with a single chip-scale multifunctional metasurface element in vacuum, replacing the meter-long free space optics. Fluorescence counts on the camera validate the successful trapping of the atomic ensemble array and showcase a promising strategy for integrated photonics with cold atom systems. The introduction of a polarization independent dual-wavelength metasurface significantly enhances fluorescence collection efficiency while reducing experimental complexity. This approach paves the way for scalable neutral atom platforms and offers a compelling route towards the realization of next generation quantum metasurfaces. article_number: '51085' article_type: original author: - first_name: Donghao full_name: Li, Donghao last_name: Li - first_name: Qiming full_name: Liao, Qiming last_name: Liao - first_name: Beining full_name: Xu, Beining last_name: Xu - first_name: Thomas full_name: Zentgraf, Thomas id: '30525' last_name: Zentgraf orcid: 0000-0002-8662-1101 - first_name: Emmanuel full_name: Narvaez Castaneda, Emmanuel last_name: Narvaez Castaneda - first_name: Yaoting full_name: Zhou, Yaoting last_name: Zhou - first_name: Keyu full_name: Qin, Keyu last_name: Qin - first_name: Zhongxiao full_name: Xu, Zhongxiao last_name: Xu - first_name: Heng full_name: Shen, Heng last_name: Shen - first_name: Lingling full_name: Huang, Lingling last_name: Huang citation: ama: Li D, Liao Q, Xu B, et al. In vacuum metasurface for optical microtrap array. Optics Express. 2025;33(24). doi:10.1364/oe.580201 apa: Li, D., Liao, Q., Xu, B., Zentgraf, T., Narvaez Castaneda, E., Zhou, Y., Qin, K., Xu, Z., Shen, H., & Huang, L. (2025). In vacuum metasurface for optical microtrap array. Optics Express, 33(24), Article 51085. https://doi.org/10.1364/oe.580201 bibtex: '@article{Li_Liao_Xu_Zentgraf_Narvaez Castaneda_Zhou_Qin_Xu_Shen_Huang_2025, title={In vacuum metasurface for optical microtrap array}, volume={33}, DOI={10.1364/oe.580201}, number={2451085}, journal={Optics Express}, publisher={Optica Publishing Group}, author={Li, Donghao and Liao, Qiming and Xu, Beining and Zentgraf, Thomas and Narvaez Castaneda, Emmanuel and Zhou, Yaoting and Qin, Keyu and Xu, Zhongxiao and Shen, Heng and Huang, Lingling}, year={2025} }' chicago: Li, Donghao, Qiming Liao, Beining Xu, Thomas Zentgraf, Emmanuel Narvaez Castaneda, Yaoting Zhou, Keyu Qin, Zhongxiao Xu, Heng Shen, and Lingling Huang. “In Vacuum Metasurface for Optical Microtrap Array.” Optics Express 33, no. 24 (2025). https://doi.org/10.1364/oe.580201. ieee: 'D. Li et al., “In vacuum metasurface for optical microtrap array,” Optics Express, vol. 33, no. 24, Art. no. 51085, 2025, doi: 10.1364/oe.580201.' mla: Li, Donghao, et al. “In Vacuum Metasurface for Optical Microtrap Array.” Optics Express, vol. 33, no. 24, 51085, Optica Publishing Group, 2025, doi:10.1364/oe.580201. short: D. Li, Q. Liao, B. Xu, T. Zentgraf, E. Narvaez Castaneda, Y. Zhou, K. Qin, Z. Xu, H. Shen, L. Huang, Optics Express 33 (2025). date_created: 2025-11-24T06:31:17Z date_updated: 2025-11-24T06:35:19Z department: - _id: '15' - _id: '230' - _id: '289' - _id: '623' doi: 10.1364/oe.580201 intvolume: ' 33' issue: '24' language: - iso: eng main_file_link: - open_access: '1' url: https://opg.optica.org/oe/fulltext.cfm?uri=oe-33-24-51085 oa: '1' publication: Optics Express publication_identifier: issn: - 1094-4087 publication_status: published publisher: Optica Publishing Group quality_controlled: '1' status: public title: In vacuum metasurface for optical microtrap array type: journal_article user_id: '30525' volume: 33 year: '2025' ... --- _id: '62305' author: - first_name: Wessel full_name: Reijers, Wessel id: '102524' last_name: Reijers orcid: 0000-0003-2505-1587 - first_name: Tobias full_name: Matzner, Tobias id: '65695' last_name: Matzner - first_name: Suzana full_name: Alpsancar, Suzana id: '93637' last_name: Alpsancar citation: ama: 'Reijers W, Matzner T, Alpsancar S. Explainability and AI Governance. In: Farina M, Yu X, Chen J, eds. Digital Development. Technology, Ethics and Governance. Routledge; 2025. doi:10.4324/9781003567622-22' apa: Reijers, W., Matzner, T., & Alpsancar, S. (2025). Explainability and AI Governance. In M. Farina, X. Yu, & J. Chen (Eds.), Digital Development. Technology, Ethics and Governance. Routledge. https://doi.org/10.4324/9781003567622-22 bibtex: '@inbook{Reijers_Matzner_Alpsancar_2025, place={New York}, title={Explainability and AI Governance}, DOI={10.4324/9781003567622-22}, booktitle={Digital Development. Technology, Ethics and Governance}, publisher={Routledge}, author={Reijers, Wessel and Matzner, Tobias and Alpsancar, Suzana}, editor={Farina, Mirko and Yu, Xiao and Chen, Jin}, year={2025} }' chicago: 'Reijers, Wessel, Tobias Matzner, and Suzana Alpsancar. “Explainability and AI Governance.” In Digital Development. Technology, Ethics and Governance, edited by Mirko Farina, Xiao Yu, and Jin Chen. New York: Routledge, 2025. https://doi.org/10.4324/9781003567622-22.' ieee: 'W. Reijers, T. Matzner, and S. Alpsancar, “Explainability and AI Governance,” in Digital Development. Technology, Ethics and Governance, M. Farina, X. Yu, and J. Chen, Eds. New York: Routledge, 2025.' mla: Reijers, Wessel, et al. “Explainability and AI Governance.” Digital Development. Technology, Ethics and Governance, edited by Mirko Farina et al., Routledge, 2025, doi:10.4324/9781003567622-22. short: 'W. Reijers, T. Matzner, S. Alpsancar, in: M. Farina, X. Yu, J. Chen (Eds.), Digital Development. Technology, Ethics and Governance, Routledge, New York, 2025.' date_created: 2025-11-25T17:58:04Z date_updated: 2025-11-25T21:25:31Z department: - _id: '26' - _id: '756' - _id: '660' doi: 10.4324/9781003567622-22 editor: - first_name: 'Mirko ' full_name: 'Farina, Mirko ' last_name: Farina - first_name: 'Xiao ' full_name: 'Yu, Xiao ' last_name: Yu - first_name: Jin full_name: Chen, Jin last_name: Chen language: - iso: eng place: New York project: - _id: '370' name: 'TRR 318; TP B06: Ethik und Normativität der erklärbaren KI' publication: Digital Development. Technology, Ethics and Governance publication_identifier: isbn: - '9781003567622' publication_status: published publisher: Routledge status: public title: Explainability and AI Governance type: book_chapter user_id: '93637' year: '2025' ... --- _id: '62643' author: - first_name: Tobias full_name: Schwabe, Tobias id: '39217' last_name: Schwabe - first_name: Christian full_name: Kress, Christian id: '13256' last_name: Kress orcid: 0000-0002-4403-2237 - first_name: Stephan full_name: Kruse, Stephan id: '38254' last_name: Kruse - first_name: Maxim full_name: Weizel, Maxim id: '44271' last_name: Weizel orcid: 0000-0003-2699-9839 - first_name: Hanjo full_name: Rhee, Hanjo last_name: Rhee - first_name: J. Christoph full_name: Scheytt, J. Christoph id: '37144' last_name: Scheytt orcid: '0000-0002-5950-6618 ' citation: ama: Schwabe T, Kress C, Kruse S, Weizel M, Rhee H, Scheytt JC. Forward-Biased Silicon Phase Shifter Modeling for Electronic-Photonic Co-Simulation and Validation in a 250 nm EPIC BiCMOS Technology. Journal of Lightwave Technology. 2025;43(1):255-270. doi:10.1109/JLT.2024.3450949 apa: Schwabe, T., Kress, C., Kruse, S., Weizel, M., Rhee, H., & Scheytt, J. C. (2025). Forward-Biased Silicon Phase Shifter Modeling for Electronic-Photonic Co-Simulation and Validation in a 250 nm EPIC BiCMOS Technology. Journal of Lightwave Technology, 43(1), 255–270. https://doi.org/10.1109/JLT.2024.3450949 bibtex: '@article{Schwabe_Kress_Kruse_Weizel_Rhee_Scheytt_2025, title={Forward-Biased Silicon Phase Shifter Modeling for Electronic-Photonic Co-Simulation and Validation in a 250 nm EPIC BiCMOS Technology}, volume={43}, DOI={10.1109/JLT.2024.3450949}, number={1}, journal={Journal of Lightwave Technology}, author={Schwabe, Tobias and Kress, Christian and Kruse, Stephan and Weizel, Maxim and Rhee, Hanjo and Scheytt, J. Christoph}, year={2025}, pages={255–270} }' chicago: 'Schwabe, Tobias, Christian Kress, Stephan Kruse, Maxim Weizel, Hanjo Rhee, and J. Christoph Scheytt. “Forward-Biased Silicon Phase Shifter Modeling for Electronic-Photonic Co-Simulation and Validation in a 250 Nm EPIC BiCMOS Technology.” Journal of Lightwave Technology 43, no. 1 (2025): 255–70. https://doi.org/10.1109/JLT.2024.3450949.' ieee: 'T. Schwabe, C. Kress, S. Kruse, M. Weizel, H. Rhee, and J. C. Scheytt, “Forward-Biased Silicon Phase Shifter Modeling for Electronic-Photonic Co-Simulation and Validation in a 250 nm EPIC BiCMOS Technology,” Journal of Lightwave Technology, vol. 43, no. 1, pp. 255–270, 2025, doi: 10.1109/JLT.2024.3450949.' mla: Schwabe, Tobias, et al. “Forward-Biased Silicon Phase Shifter Modeling for Electronic-Photonic Co-Simulation and Validation in a 250 Nm EPIC BiCMOS Technology.” Journal of Lightwave Technology, vol. 43, no. 1, 2025, pp. 255–70, doi:10.1109/JLT.2024.3450949. short: T. Schwabe, C. Kress, S. Kruse, M. Weizel, H. Rhee, J.C. Scheytt, Journal of Lightwave Technology 43 (2025) 255–270. date_created: 2025-11-27T07:14:34Z date_updated: 2025-11-27T07:16:01Z department: - _id: '58' doi: 10.1109/JLT.2024.3450949 intvolume: ' 43' issue: '1' keyword: - Integrated circuit modeling - Capacitance - Silicon - Modulation - Adaptation models - Semiconductor device modeling - Bandwidth - Data communication - electrooptical transmitter - equalization - free-carrier-plasma dispersion effect - modelling - optical modulator - phase shifter - silicon photonics language: - iso: eng page: 255-270 publication: Journal of Lightwave Technology status: public title: Forward-Biased Silicon Phase Shifter Modeling for Electronic-Photonic Co-Simulation and Validation in a 250 nm EPIC BiCMOS Technology type: journal_article user_id: '38254' volume: 43 year: '2025' ... --- _id: '62867' abstract: - lang: eng text: "ABSTRACT\r\n Effective manipulation of photonic spin–orbit coupling (SOC) in microcavities is of fundamental importance within topological photonics and applications. Anisotropic organic single‐crystalline materials can induce abundant SOC phenomenon due to their flexible tunability of molecular geometries, however, the intrinsic relationship between molecular geometries/orientations in 3D space and photonic SOC is lacking. In this study, we design two kinds of 2D organic polymorphs for the construction of organic microcavities to investigate the structure‐performance relationships. In two polymorphic microcavities, two distinctive photonic SOC phenomena are observed regardless of the in‐plane anisotropy of organic polymorphs. Theoretical analysis indicates that the photonic SOC strength is strongly influenced by the synergies between the crystal anisotropy and the tilted collective molecular transition dipole moment. Our results uncover the correlation mechanism between the structure of molecules and photonic SOC and open an avenue to engineer complex photonic SOC by use of organic microstructures towards the development of diverse integrated photonic devices." article_number: e01874 author: - first_name: Ying full_name: Ji, Ying last_name: Ji - first_name: Xuekai full_name: Ma, Xuekai id: '59416' last_name: Ma - first_name: Han full_name: Huang, Han last_name: Huang - first_name: Yibo full_name: Deng, Yibo last_name: Deng - first_name: Pingyang full_name: Wang, Pingyang last_name: Wang - first_name: Teng full_name: Long, Teng last_name: Long - first_name: Yuan full_name: Li, Yuan last_name: Li - first_name: Ruiyang full_name: Zhao, Ruiyang last_name: Zhao - first_name: Yunfei full_name: Li, Yunfei last_name: Li - first_name: Cunbin full_name: An, Cunbin last_name: An - first_name: Stefan full_name: Schumacher, Stefan id: '27271' last_name: Schumacher orcid: 0000-0003-4042-4951 - first_name: Chunling full_name: Gu, Chunling last_name: Gu - first_name: Bo full_name: Liao, Bo last_name: Liao - first_name: Hongbing full_name: Fu, Hongbing last_name: Fu - first_name: Qing full_name: Liao, Qing last_name: Liao citation: ama: Ji Y, Ma X, Huang H, et al. Molecular Orientation‐Dependent Photonic Spin–Orbit Coupling in Organic Microcavities Filled with 2D Polymorphic Crystals. Laser & Photonics Reviews. Published online 2025. doi:10.1002/lpor.202501874 apa: Ji, Y., Ma, X., Huang, H., Deng, Y., Wang, P., Long, T., Li, Y., Zhao, R., Li, Y., An, C., Schumacher, S., Gu, C., Liao, B., Fu, H., & Liao, Q. (2025). Molecular Orientation‐Dependent Photonic Spin–Orbit Coupling in Organic Microcavities Filled with 2D Polymorphic Crystals. Laser & Photonics Reviews, Article e01874. https://doi.org/10.1002/lpor.202501874 bibtex: '@article{Ji_Ma_Huang_Deng_Wang_Long_Li_Zhao_Li_An_et al._2025, title={Molecular Orientation‐Dependent Photonic Spin–Orbit Coupling in Organic Microcavities Filled with 2D Polymorphic Crystals}, DOI={10.1002/lpor.202501874}, number={e01874}, journal={Laser & Photonics Reviews}, publisher={Wiley}, author={Ji, Ying and Ma, Xuekai and Huang, Han and Deng, Yibo and Wang, Pingyang and Long, Teng and Li, Yuan and Zhao, Ruiyang and Li, Yunfei and An, Cunbin and et al.}, year={2025} }' chicago: Ji, Ying, Xuekai Ma, Han Huang, Yibo Deng, Pingyang Wang, Teng Long, Yuan Li, et al. “Molecular Orientation‐Dependent Photonic Spin–Orbit Coupling in Organic Microcavities Filled with 2D Polymorphic Crystals.” Laser & Photonics Reviews, 2025. https://doi.org/10.1002/lpor.202501874. ieee: 'Y. Ji et al., “Molecular Orientation‐Dependent Photonic Spin–Orbit Coupling in Organic Microcavities Filled with 2D Polymorphic Crystals,” Laser & Photonics Reviews, Art. no. e01874, 2025, doi: 10.1002/lpor.202501874.' mla: Ji, Ying, et al. “Molecular Orientation‐Dependent Photonic Spin–Orbit Coupling in Organic Microcavities Filled with 2D Polymorphic Crystals.” Laser & Photonics Reviews, e01874, Wiley, 2025, doi:10.1002/lpor.202501874. short: Y. Ji, X. Ma, H. Huang, Y. Deng, P. Wang, T. Long, Y. Li, R. Zhao, Y. Li, C. An, S. Schumacher, C. Gu, B. Liao, H. Fu, Q. Liao, Laser & Photonics Reviews (2025). date_created: 2025-12-04T12:33:48Z date_updated: 2025-12-04T12:34:45Z department: - _id: '15' - _id: '170' - _id: '297' - _id: '705' - _id: '35' - _id: '230' doi: 10.1002/lpor.202501874 language: - iso: eng publication: Laser & Photonics Reviews publication_identifier: issn: - 1863-8880 - 1863-8899 publication_status: published publisher: Wiley status: public title: Molecular Orientation‐Dependent Photonic Spin–Orbit Coupling in Organic Microcavities Filled with 2D Polymorphic Crystals type: journal_article user_id: '16199' year: '2025' ... --- _id: '62880' author: - first_name: Malin full_name: Osnabrügge, Malin id: '79748' last_name: Osnabrügge - first_name: Claudia full_name: Tenberge, Claudia id: '67302' last_name: Tenberge citation: ama: 'Osnabrügge M, Tenberge C. Anschluss begleiten: Technisches Lernen zwischen Primar- und Sekundarstufe. Fortbildungen für einen digitalen Unterricht für alle . In: Posterbeitrag Im Rahmen Der Jahrestagung Der DGFE Sekten Sonderpädagogik Vom 22-24.09.2025 in Heidelberg . ; 2025.' apa: 'Osnabrügge, M., & Tenberge, C. (2025). Anschluss begleiten: Technisches Lernen zwischen Primar- und Sekundarstufe. Fortbildungen für einen digitalen Unterricht für alle . Posterbeitrag Im Rahmen Der Jahrestagung Der DGFE Sekten Sonderpädagogik Vom 22-24.09.2025 in Heidelberg . Jahrestagung der DGFE Sekten Sonderpädagogik, Heidelberg .' bibtex: '@inproceedings{Osnabrügge_Tenberge_2025, title={Anschluss begleiten: Technisches Lernen zwischen Primar- und Sekundarstufe. Fortbildungen für einen digitalen Unterricht für alle }, booktitle={Posterbeitrag im Rahmen der Jahrestagung der DGFE Sekten Sonderpädagogik vom 22-24.09.2025 in Heidelberg }, author={Osnabrügge, Malin and Tenberge, Claudia}, year={2025} }' chicago: 'Osnabrügge, Malin, and Claudia Tenberge. “Anschluss Begleiten: Technisches Lernen Zwischen Primar- Und Sekundarstufe. Fortbildungen Für Einen Digitalen Unterricht Für Alle .” In Posterbeitrag Im Rahmen Der Jahrestagung Der DGFE Sekten Sonderpädagogik Vom 22-24.09.2025 in Heidelberg , 2025.' ieee: 'M. Osnabrügge and C. Tenberge, “Anschluss begleiten: Technisches Lernen zwischen Primar- und Sekundarstufe. Fortbildungen für einen digitalen Unterricht für alle ,” presented at the Jahrestagung der DGFE Sekten Sonderpädagogik, Heidelberg , 2025.' mla: 'Osnabrügge, Malin, and Claudia Tenberge. “Anschluss Begleiten: Technisches Lernen Zwischen Primar- Und Sekundarstufe. Fortbildungen Für Einen Digitalen Unterricht Für Alle .” Posterbeitrag Im Rahmen Der Jahrestagung Der DGFE Sekten Sonderpädagogik Vom 22-24.09.2025 in Heidelberg , 2025.' short: 'M. Osnabrügge, C. Tenberge, in: Posterbeitrag Im Rahmen Der Jahrestagung Der DGFE Sekten Sonderpädagogik Vom 22-24.09.2025 in Heidelberg , 2025.' conference: end_date: 2025-09-24 location: 'Heidelberg ' name: Jahrestagung der DGFE Sekten Sonderpädagogik start_date: 2025-09-22 date_created: 2025-12-04T13:54:58Z date_updated: 2025-12-04T13:56:06Z language: - iso: eng publication: 'Posterbeitrag im Rahmen der Jahrestagung der DGFE Sekten Sonderpädagogik vom 22-24.09.2025 in Heidelberg ' status: public title: 'Anschluss begleiten: Technisches Lernen zwischen Primar- und Sekundarstufe. Fortbildungen für einen digitalen Unterricht für alle ' type: conference user_id: '79748' year: '2025' ... --- _id: '62888' author: - first_name: Nele full_name: Schemel, Nele id: '73438' last_name: Schemel - first_name: Claudia full_name: Tenberge, Claudia id: '67302' last_name: Tenberge citation: ama: 'Schemel N, Tenberge C. Transitionen inklusiv gestalten. Analoges und digitales technisches Lernen am Übergang vom Elementar- zum Primarbereich. In: Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025. ; 2025.' apa: Schemel, N., & Tenberge, C. (2025). Transitionen inklusiv gestalten. Analoges und digitales technisches Lernen am Übergang vom Elementar- zum Primarbereich. Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025. Jahrestagung der Deutschen Gesellschaft für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik, Heidelberg. bibtex: '@inproceedings{Schemel_Tenberge_2025, title={Transitionen inklusiv gestalten. Analoges und digitales technisches Lernen am Übergang vom Elementar- zum Primarbereich}, booktitle={Jahrestagung der Deutschen Gesellschaft für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025}, author={Schemel, Nele and Tenberge, Claudia}, year={2025} }' chicago: Schemel, Nele, and Claudia Tenberge. “Transitionen Inklusiv Gestalten. Analoges Und Digitales Technisches Lernen Am Übergang Vom Elementar- Zum Primarbereich.” In Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025, 2025. ieee: N. Schemel and C. Tenberge, “Transitionen inklusiv gestalten. Analoges und digitales technisches Lernen am Übergang vom Elementar- zum Primarbereich,” presented at the Jahrestagung der Deutschen Gesellschaft für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik, Heidelberg, 2025. mla: Schemel, Nele, and Claudia Tenberge. “Transitionen Inklusiv Gestalten. Analoges Und Digitales Technisches Lernen Am Übergang Vom Elementar- Zum Primarbereich.” Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025, 2025. short: 'N. Schemel, C. Tenberge, in: Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025, 2025.' conference: end_date: 2025–09–24 location: Heidelberg name: Jahrestagung der Deutschen Gesellschaft für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik start_date: 2025–09–22 date_created: 2025-12-04T14:11:54Z date_updated: 2025-12-04T14:11:59Z language: - iso: eng publication: Jahrestagung der Deutschen Gesellschaft für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025 status: public title: Transitionen inklusiv gestalten. Analoges und digitales technisches Lernen am Übergang vom Elementar- zum Primarbereich type: conference user_id: '73438' year: '2025' ... --- _id: '62891' author: - first_name: Lea full_name: Schneider, Lea id: '79913' last_name: Schneider - first_name: Claudia full_name: Tenberge, Claudia id: '67302' last_name: Tenberge citation: ama: 'Schneider L, Tenberge C. Zwischen Universität und Unterrichtspraxis: Technikbezogene(s) Interesse und Selbstwirksamkeit von (angehenden) Lehrkräften im Sachunterricht. In: Posterbeitrag Im Rahmen Der Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025. ; 2025.' apa: 'Schneider, L., & Tenberge, C. (2025). Zwischen Universität und Unterrichtspraxis: Technikbezogene(s) Interesse und Selbstwirksamkeit von (angehenden) Lehrkräften im Sachunterricht. Posterbeitrag Im Rahmen Der Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025. Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik, Heidelberg.' bibtex: '@inproceedings{Schneider_Tenberge_2025, title={Zwischen Universität und Unterrichtspraxis: Technikbezogene(s) Interesse und Selbstwirksamkeit von (angehenden) Lehrkräften im Sachunterricht}, booktitle={Posterbeitrag im Rahmen der Jahrestagung der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025}, author={Schneider, Lea and Tenberge, Claudia}, year={2025} }' chicago: 'Schneider, Lea, and Claudia Tenberge. “Zwischen Universität Und Unterrichtspraxis: Technikbezogene(s) Interesse Und Selbstwirksamkeit von (Angehenden) Lehrkräften Im Sachunterricht.” In Posterbeitrag Im Rahmen Der Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025, 2025.' ieee: 'L. Schneider and C. Tenberge, “Zwischen Universität und Unterrichtspraxis: Technikbezogene(s) Interesse und Selbstwirksamkeit von (angehenden) Lehrkräften im Sachunterricht,” presented at the Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik, Heidelberg, 2025.' mla: 'Schneider, Lea, and Claudia Tenberge. “Zwischen Universität Und Unterrichtspraxis: Technikbezogene(s) Interesse Und Selbstwirksamkeit von (Angehenden) Lehrkräften Im Sachunterricht.” Posterbeitrag Im Rahmen Der Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025, 2025.' short: 'L. Schneider, C. Tenberge, in: Posterbeitrag Im Rahmen Der Jahrestagung Der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025, 2025.' conference: end_date: 2025-09-24 location: Heidelberg name: Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik start_date: 2025-09-22 date_created: 2025-12-04T14:16:14Z date_updated: 2025-12-04T14:22:23Z language: - iso: eng publication: Posterbeitrag im Rahmen der Jahrestagung der Deutschen Gesellschaft Für Erziehungswissenschaften (DGFE) Sektion Sonderpädagogik 22.-24.09.2025 status: public title: 'Zwischen Universität und Unterrichtspraxis: Technikbezogene(s) Interesse und Selbstwirksamkeit von (angehenden) Lehrkräften im Sachunterricht' type: conference user_id: '79913' year: '2025' ... --- _id: '62900' author: - first_name: Therese full_name: Hjorth, Therese last_name: Hjorth - first_name: Alena Marie full_name: Schadow, Alena Marie id: '84033' last_name: Schadow - first_name: Ingrid full_name: Revheim, Ingrid last_name: Revheim - first_name: Ulrike full_name: Spielau, Ulrike last_name: Spielau - first_name: Klara full_name: Meyer, Klara last_name: Meyer - first_name: Anne full_name: Rieder, Anne last_name: Rieder - first_name: Paula full_name: Varela, Paula last_name: Varela - first_name: Simon full_name: Ballance, Simon last_name: Ballance - first_name: Antje full_name: Koerner, Antje last_name: Koerner - first_name: Rikard full_name: Landberg, Rikard last_name: Landberg - first_name: Anette full_name: Buyken, Anette id: '65985' last_name: Buyken - first_name: Jutta full_name: Dierkes, Jutta last_name: Dierkes - first_name: Hanne full_name: Rosendahl-Riise, Hanne last_name: Rosendahl-Riise citation: ama: 'Hjorth T, Schadow AM, Revheim I, et al. Effectiveness of regular oat β-glucan–enriched bread compared with whole-grain wheat bread on long-term glycemic control in adults at risk of type 2 diabetes: a randomized controlled trial. The American Journal of Clinical Nutrition. 2025;122(3):724-732. doi:10.1016/j.ajcnut.2025.06.018' apa: 'Hjorth, T., Schadow, A. M., Revheim, I., Spielau, U., Meyer, K., Rieder, A., Varela, P., Ballance, S., Koerner, A., Landberg, R., Buyken, A., Dierkes, J., & Rosendahl-Riise, H. (2025). Effectiveness of regular oat β-glucan–enriched bread compared with whole-grain wheat bread on long-term glycemic control in adults at risk of type 2 diabetes: a randomized controlled trial. The American Journal of Clinical Nutrition, 122(3), 724–732. https://doi.org/10.1016/j.ajcnut.2025.06.018' bibtex: '@article{Hjorth_Schadow_Revheim_Spielau_Meyer_Rieder_Varela_Ballance_Koerner_Landberg_et al._2025, title={Effectiveness of regular oat β-glucan–enriched bread compared with whole-grain wheat bread on long-term glycemic control in adults at risk of type 2 diabetes: a randomized controlled trial}, volume={122}, DOI={10.1016/j.ajcnut.2025.06.018}, number={3}, journal={The American Journal of Clinical Nutrition}, publisher={Elsevier BV}, author={Hjorth, Therese and Schadow, Alena Marie and Revheim, Ingrid and Spielau, Ulrike and Meyer, Klara and Rieder, Anne and Varela, Paula and Ballance, Simon and Koerner, Antje and Landberg, Rikard and et al.}, year={2025}, pages={724–732} }' chicago: 'Hjorth, Therese, Alena Marie Schadow, Ingrid Revheim, Ulrike Spielau, Klara Meyer, Anne Rieder, Paula Varela, et al. “Effectiveness of Regular Oat β-Glucan–Enriched Bread Compared with Whole-Grain Wheat Bread on Long-Term Glycemic Control in Adults at Risk of Type 2 Diabetes: A Randomized Controlled Trial.” The American Journal of Clinical Nutrition 122, no. 3 (2025): 724–32. https://doi.org/10.1016/j.ajcnut.2025.06.018.' ieee: 'T. Hjorth et al., “Effectiveness of regular oat β-glucan–enriched bread compared with whole-grain wheat bread on long-term glycemic control in adults at risk of type 2 diabetes: a randomized controlled trial,” The American Journal of Clinical Nutrition, vol. 122, no. 3, pp. 724–732, 2025, doi: 10.1016/j.ajcnut.2025.06.018.' mla: 'Hjorth, Therese, et al. “Effectiveness of Regular Oat β-Glucan–Enriched Bread Compared with Whole-Grain Wheat Bread on Long-Term Glycemic Control in Adults at Risk of Type 2 Diabetes: A Randomized Controlled Trial.” The American Journal of Clinical Nutrition, vol. 122, no. 3, Elsevier BV, 2025, pp. 724–32, doi:10.1016/j.ajcnut.2025.06.018.' short: T. Hjorth, A.M. Schadow, I. Revheim, U. Spielau, K. Meyer, A. Rieder, P. Varela, S. Ballance, A. Koerner, R. Landberg, A. Buyken, J. Dierkes, H. Rosendahl-Riise, The American Journal of Clinical Nutrition 122 (2025) 724–732. date_created: 2025-12-04T14:32:41Z date_updated: 2025-12-04T14:33:29Z department: - _id: '22' doi: 10.1016/j.ajcnut.2025.06.018 intvolume: ' 122' issue: '3' language: - iso: eng page: 724-732 publication: The American Journal of Clinical Nutrition publication_identifier: issn: - 0002-9165 publication_status: published publisher: Elsevier BV status: public title: 'Effectiveness of regular oat β-glucan–enriched bread compared with whole-grain wheat bread on long-term glycemic control in adults at risk of type 2 diabetes: a randomized controlled trial' type: journal_article user_id: '92491' volume: 122 year: '2025' ... --- _id: '63157' abstract: - lang: eng text: Three-phase cascaded H-bridge converters (CHBs) in star configuration require reliable current controllers to evenly charge the module DC-link capacitors. Conventionally, a current control in dq-coordinates is utilized. At steady state, the resulting calculated reference arm voltages are sinusoidal, have identical amplitudes and show a phase shift of 120 degree to each other. For balanced grid inductors, the resulting grid currents also have the same amplitude. However, own simulations show that unbalanced grid inductors always lead to different grid current amplitudes (4% difference in this case). As a result, the averaged charging module powers differ and the peak DC-link capacitor voltage rises as well. In the first step, an adaptation of an existing zero-sequence voltage injection is proposed. For balanced grid inductors, it converges to the 3rd harmonic voltage injection which can reduce the peak-to-peak DC-link voltage ripple up by to 50% and balances the power between the phases. However, unbalanced grid inductors still lead to the same unbalanced grid currents of 4%. Therefore, a new method with 4 integrators based on linear regression is proposed to achieve sinusoidal grid currents for unbalanced inductors. The proposed method has a similar transient dynamic as the conventional dq control, but balances the grid currents nearly ideally. Simulation results of a 1MW cascaded H bridge and a scaled-down prototype verify the proposed method. author: - first_name: Roland full_name: Unruh, Roland id: '34289' last_name: Unruh - first_name: Joachim full_name: Böcker, Joachim id: '66' last_name: Böcker orcid: 0000-0002-8480-7295 - first_name: Frank full_name: Schafmeister, Frank id: '71291' last_name: Schafmeister citation: ama: 'Unruh R, Böcker J, Schafmeister F. Three-Phase Instantaneous Current Controller for Unbalanced Grid Inductors Without DQ Transform for Cascaded H-Bridge Converters. In: 2025 Energy Conversion Congress &Amp; Expo Europe (ECCE Europe). IEEE; 2025. doi:10.1109/ecce-europe62795.2025.11238538' apa: Unruh, R., Böcker, J., & Schafmeister, F. (2025). Three-Phase Instantaneous Current Controller for Unbalanced Grid Inductors Without DQ Transform for Cascaded H-Bridge Converters. 2025 Energy Conversion Congress &Amp; Expo Europe (ECCE Europe). 2025 Energy Conversion Congress & Expo Europe (ECCE Europe), Birmingham, United Kingdom. https://doi.org/10.1109/ecce-europe62795.2025.11238538 bibtex: '@inproceedings{Unruh_Böcker_Schafmeister_2025, title={Three-Phase Instantaneous Current Controller for Unbalanced Grid Inductors Without DQ Transform for Cascaded H-Bridge Converters}, DOI={10.1109/ecce-europe62795.2025.11238538}, booktitle={2025 Energy Conversion Congress & Expo Europe (ECCE Europe)}, publisher={IEEE}, author={Unruh, Roland and Böcker, Joachim and Schafmeister, Frank}, year={2025} }' chicago: Unruh, Roland, Joachim Böcker, and Frank Schafmeister. “Three-Phase Instantaneous Current Controller for Unbalanced Grid Inductors Without DQ Transform for Cascaded H-Bridge Converters.” In 2025 Energy Conversion Congress &Amp; Expo Europe (ECCE Europe). IEEE, 2025. https://doi.org/10.1109/ecce-europe62795.2025.11238538. ieee: 'R. Unruh, J. Böcker, and F. Schafmeister, “Three-Phase Instantaneous Current Controller for Unbalanced Grid Inductors Without DQ Transform for Cascaded H-Bridge Converters,” presented at the 2025 Energy Conversion Congress & Expo Europe (ECCE Europe), Birmingham, United Kingdom, 2025, doi: 10.1109/ecce-europe62795.2025.11238538.' mla: Unruh, Roland, et al. “Three-Phase Instantaneous Current Controller for Unbalanced Grid Inductors Without DQ Transform for Cascaded H-Bridge Converters.” 2025 Energy Conversion Congress &Amp; Expo Europe (ECCE Europe), IEEE, 2025, doi:10.1109/ecce-europe62795.2025.11238538. short: 'R. Unruh, J. Böcker, F. Schafmeister, in: 2025 Energy Conversion Congress &Amp; Expo Europe (ECCE Europe), IEEE, 2025.' conference: end_date: 2025-09-04 location: Birmingham, United Kingdom name: 2025 Energy Conversion Congress & Expo Europe (ECCE Europe) start_date: 2025-09-01 date_created: 2025-12-16T15:20:55Z date_updated: 2025-12-16T15:25:38Z department: - _id: '52' doi: 10.1109/ecce-europe62795.2025.11238538 keyword: - Cascaded H-Bridge - Current Control - dq Transformation - Linear Regression - Unbalanced Inductors language: - iso: eng main_file_link: - url: https://ieeexplore.ieee.org/document/11238538 publication: 2025 Energy Conversion Congress & Expo Europe (ECCE Europe) publication_status: published publisher: IEEE status: public title: Three-Phase Instantaneous Current Controller for Unbalanced Grid Inductors Without DQ Transform for Cascaded H-Bridge Converters type: conference user_id: '34289' year: '2025' ...